Solid state light source device, projection apparatus and assembling method for solid state light source device
Patent Information
- Application Number
- TW113151282
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-08-11
- Estimated Expiration
- 2044-12-26
Smart Images

Figure TWG2TB001905536_001 
Figure TWG2TB001905536_002 
Figure TWG2TB001905536_003
Abstract
Claims
1. A solid-state light source device, comprising: A liquid cooler includes: a chamber having an opening on its top surface; a liquid inlet located on one side wall of the chamber; a liquid outlet located on the other side wall of the chamber; a groove adjacent to the opening and recessed downwards along the outer periphery of the opening; and a light source module disposed on the top surface of the liquid cooler and covering the opening, the light source module including: a light source assembly; an elastic member disposed at the bottom of the light source assembly, a portion of the elastic member contacting a portion of the bottom surface of the light source assembly; a plate located on the top surface of the liquid cooler and the elastic member, configured to expose a portion of the light source assembly; and a circuit board located on the top surface of the liquid cooler and the plate, configured to expose a portion of the plate and a portion of the light source assembly.
2. The solid-state light source device as described in claim 1, wherein, Part of the bottom surface of the light source module is located on this groove.
3. The solid-state light source device as described in claim 1, wherein, The light source assembly includes: a plurality of light-emitting elements; a heat-conducting plate body, wherein the plurality of light-emitting elements are disposed within the heat-conducting plate body, and the heat-conducting plate body includes: a first connecting member extending outward from the front sidewall of the heat-conducting plate body and near the bottom surface of the heat-conducting plate body; and a second connecting member extending outward from the rear sidewall of the heat-conducting plate body and near the bottom surface of the heat-conducting plate body; and a plurality of electrical connecting wires respectively connecting the plurality of light-emitting elements and passing through the heat-conducting plate body.
4. The solid-state light source device as described in claim 3, wherein, The elastic member includes: a first top surface facing and contacting the first connector and the second connector respectively; a side surface surrounding the light source assembly; a first bottom surface connected to the side surface; and an extension surface extending outward from the outside of the side surface, wherein the extension surface and the first bottom surface are stepped.
5. The solid-state light source device as described in claim 4, wherein, The first top surface is positioned above the first connector and the second connector.
6. The solid-state light source device as described in claim 5, wherein, The first bottom surface is located above the groove, and the bottom surface of the extension surface is located on a portion of the top surface of the liquid cooler.
7. The solid-state light source device as described in claim 6, wherein, The elastic element further includes: a first rib extending downward from the bottom surface of the first bottom surface, and the first rib being annular; and a second rib extending downward from the bottom surface of the extension surface, and the second rib being annular.
8. The solid-state light source device as described in claim 7, wherein, The plate surrounds the light source assembly and has a first through-hole. The plate also includes a notch formed by flaring outward from the first through-hole.
9. The solid-state light source device as described in claim 8, wherein, The circuit board surrounds the light source assembly and has two protrusions; the two protrusions have multiple side grooves, which are spaced apart.
10. A projection device, comprising: The solid-state light source device as claimed in claim 1; an optomechanical module configured to receive a light beam emitted by the light source module and convert it into an image beam; and a projection lens configured in the transmission path of the image beam to project the image beam.
11. A method for assembling a solid-state light source device, comprising the following steps: providing a light source assembly and an elastic member; fitting the elastic member onto the bottom of the light source assembly; providing a liquid cooler, wherein, The liquid cooler includes a chamber, a liquid inlet, and a liquid outlet. The top surface of the chamber has an opening, and the liquid inlet and the liquid outlet are located on two side walls of the chamber. The bottom surface of the light source assembly with the elastic member attached is covered by the opening. A plate is provided. The plate is placed on the light source assembly with the elastic member attached and the liquid cooler, with a portion of the light source assembly exposed on the plate. A circuit board is provided. The circuit board is placed on the plate and the liquid cooler, with a portion of the light source assembly with the elastic member attached and a portion of the plate exposed on the circuit board. The circuit board is then moved to a soldering position.
12. The assembly method of the solid-state light source device as described in claim 11, wherein, After the aforementioned steps are performed, such as placing the plate on the light source assembly and the liquid cooler with the elastic member already fitted on, and with a portion of the light source assembly exposed above the plate, the assembly method includes the following steps: The plate is secured to the liquid cooler by multiple screws, and the plate and the light source assembly with the elastic element already fitted are secured to the liquid cooler by multiple screws.
13. The assembly method of the solid-state light source device as described in claim 11, wherein, After the aforementioned steps have been performed to the point where the circuit board is moved to a soldering position, the assembly method includes the following sub-steps: securing the circuit board to the liquid cooler using multiple screws.
Citation Information
Patent Citations
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