Boiling enhancement component and immersion cooling system having the same

Abstract

A boiling enhancement component and an immersion cooling system incorporating the enhancement component are provided. The boiling enhancement component includes a heat-conducting portion and a boiling-forming portion. The heat-conducting portion has a first surface and a second surface, the first surface contacting a heat source; the boiling-forming portion is located on the second surface and includes a plurality of bubble agitation zones. When a fluid medium boils and generates bubbles in the boiling-forming portion, the bubble agitation zones can alter the upward path of at least some of the bubbles, thereby promoting bubble aggregation and accelerating bubble detachment from the boiling enhancement component. Another embodiment provides an immersion cooling system comprising a tank and the aforementioned boiling enhancement component, the tank having a receiving space for containing a fluid medium, the boiling enhancement component being disposed within this receiving space and immersed in the fluid medium.

Description

Boiling enhancement element and immersion cooling system having the same A boiling enhancement component and an immersion cooling system having the same, in particular to an immersion cooling system suitable for cooling electronic equipment. Immersion cooling systems are highly efficient heat dissipation methods widely used in high-power electronic devices. The boiler is a crucial heat exchange component in these systems. Traditionally, the boiler is made of a metal material with excellent thermal conductivity. Its entire surface performs heat exchange, transferring heat energy generated by the electronic components to the coolant. During system operation, the heat transfer from the boiler surface causes the coolant to boil and evaporate, generating a large number of bubbles that remove heat from the electronic components. However, initially formed small bubbles lack buoyancy and cannot immediately escape the surface of the boiling aid. They must grow larger or coalesce into larger bubbles before they gain sufficient buoyancy to rise and remove heat energy. During this period, as bubbles adhere to the surface of the boiling aid, they form a film that blocks direct contact between the liquid and the heat dissipation surface, creating a barrier to heat exchange, also known as the bubble film effect. This film creates considerable thermal resistance, compromising the heat exchange efficiency of the boiling aid, and ultimately reducing the overall system's heat dissipation performance, becoming a major bottleneck in improving the efficiency of immersion cooling systems. In view of the above, the present invention provides a boiling enhancement element and an immersion cooling system equipped with the enhancement element, which can solve the above problems. One embodiment of the present invention provides a boiling enhancement component comprising a heat-conducting portion and a boiling-inducing portion. The heat-conducting portion comprises a first surface and a second surface, wherein the first surface is adapted to contact a heat source. The boiling-inducing portion is located on the second surface of the heat-conducting portion and includes a plurality of bubble disturbance zones. In response to a fluid medium boiling in the boiling-inducing portion and generating a plurality of bubbles, the bubble disturbance zones are adapted to alter a floating path of at least a portion of the bubbles. One embodiment of the present invention provides a boiling enhancement component comprising a heat conducting portion and a plurality of protrusions. The heat conducting portion comprises a first surface and a second surface, the first surface being adapted to contact a heat source. The plurality of protrusions are located on the second surface of the heat conducting portion and extend along a gravity direction, forming a plurality of bubble diversion channels between the protrusions. The surfaces of the protrusions forming the bubble diversion channels include at least one of a plurality of recessed portions and a plurality of raised portions, thereby altering a floating path of the plurality of bubbles. One embodiment of the present invention provides an immersion cooling system comprising a tank body and a boiling enhancement member. The tank body has a storage space suitable for accommodating a fluid medium. The boiling enhancement member is disposed within the storage space of the tank body and immersed in the fluid medium. The boiling enhancement member comprises a heat conducting portion and a boiling inducing portion. The heat conducting portion comprises a first surface and a second surface, wherein the first surface is suitable for contacting a heat source. The boiling inducing portion is located on the second surface of the heat conducting portion and includes a plurality of bubble disturbance zones. In response to a fluid medium boiling in the boiling inducing portion and generating a plurality of bubbles, the bubble disturbance zones are adapted to alter a floating path of at least a portion of the bubbles. In summary, the boiling enhancement component and the immersion cooling system equipped with the same according to some embodiments can promote bubble aggregation, allowing the bubbles to quickly escape from the boiling enhancement component, thereby improving the cooling efficiency of the immersion cooling system. Various embodiments are described below in detail. These embodiments are intended for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, some components are omitted from the drawings to clearly illustrate the technical features of the present invention. Furthermore, the same reference numerals will be used throughout the drawings to represent the same or similar components. The drawings of the present invention are for schematic illustration only and are not necessarily drawn to scale. Not all details may be shown in the drawings. Please refer to Figures 1A and 1B. Figure 1A shows a front view of an embodiment of a boiling enhancement member 1 of the present invention, and Figure 1B shows a three-dimensional view of an embodiment of a boiling enhancement member 1 of the present invention. As shown in the figure, the boiling enhancement member 1 includes a heat-conducting portion 2 and a boiling-forming portion 3. The heat-conducting portion 2 has a first surface 21 and a second surface 22. The first surface 21 is suitable for contacting a heat source Hs (see Figure 4A). The boiling-forming portion 3 is located on the second surface 22 of the heat-conducting portion 2 and includes a plurality of bubble disturbance zones 31. When the fluid medium boils and generates bubbles in the boiling-forming portion 3, these bubble disturbance zones 31 can change the floating path of at least part of the bubbles to promote bubble aggregation. In some embodiments, the first surface 21 and the second surface 22 are corresponding surfaces, such as an upper surface and a lower surface. In other embodiments, the first surface 21 and the second surface 22 may be adjacent surfaces, such as surfaces perpendicular to each other. Furthermore, the heat source Hs (see FIG. 4A ) is typically a chip or other high-power electronic device, such as a CPU, GPU, TPU, FPGA, ASIC, XPU, NPU, DPU, or other semiconductor integrated circuits with high thermal design power (TDP). In some embodiments, the boiling forming portion 3 includes a plurality of protrusions 32. These protrusions 32 are in the shape of long strips, arranged parallel to each other, and extend along the direction of gravity Dg. There is a specific spacing G between adjacent protrusions 32, forming a bubble diversion channel 30. The bubble diversion channel 30 is substantially parallel to the direction of gravity Dg. In addition, each protrusion 32 has a plurality of recessed portions 321, each recessed portion 321 is provided with an opening 322, and the opening 322 faces the bubble diversion channel 30. In other words, each recessed portion 321 is connected to its adjacent bubble diversion channel 30. The bubble diversion channel 30 and the recesses 321 together form a bubble disturbance zone 31. Located within the bubble diversion channel 30, the bubble disturbance zone 31 is adapted to guide at least some bubbles in a specific direction D1, thereby changing their upward path, increasing the disturbance of the bubbles and the fluid medium, and promoting bubble aggregation. The specific direction D1 forms an angle θ with respect to the direction of gravity Dg, and this angle θ ranges from 90 to 180 degrees. In the embodiment shown in Figures 1A and 1B , the opening 322 of the recessed portion 321 is substantially perpendicular to the bubble guide channel 30, so that the angle θ of the specific direction D1 relative to the direction of gravity Dg is 90 degrees. Furthermore, these recessed portions 321 are disposed on opposite sides of the protrusion 32 and are interconnected. The recessed portions 321 are semicircular grooves extending along the thickness of the protrusion 32. In other embodiments, the recessed portions 321 may also be elliptical grooves, rounded rectangular grooves, stadium-shaped grooves, or other geometric polygonal grooves. When the system is operating, the fluid medium is heated and boiled in the boiling forming portion 3, generating a plurality of bubbles. Since the bubbles are mainly formed on the surface of the boiling forming portion 3, especially near the two side walls of the protrusion 32, a large number of bubbles are generated there. These bubbles float upward along the bubble guide channel 30. However, the upward floating process of the bubbles is affected by various factors, resulting in irregular bubble movement trajectories. For example, the bubbles may be affected by the interaction between bubbles, the interference of fluid dynamic effects, the local movement of the fluid medium, and small disturbances. In addition, changes in the density and viscosity of the fluid medium will also have a comprehensive impact on the movement of the bubbles. Furthermore, during the irregular upward movement of the bubbles, the presence of the bubble disturbance zone 31 further enhances the mutual disturbance between the fluid medium and the bubbles. This disturbance not only facilitates the bubbles' escape from the boiling formation portion 3 but also increases the chances of collision and aggregation. When the bubbles aggregate, they form larger bubbles, which changes their dynamic characteristics and further improves boiling efficiency. When bubbles collide, their surface tension deforms the bubble membranes, eventually causing them to rupture and allowing the two bubbles to merge into a single, larger bubble. This merging process is driven by surface tension, which seeks to minimize the bubbles' total surface area. Therefore, when two bubbles approach each other, surface tension forces them to fuse together. When small bubbles coalesce into a larger bubble, its ascent speed increases significantly. This is because the buoyancy of a bubble is proportional to its volume. Larger bubbles have greater volume and surface area, displacing more liquid and reducing the resistance they encounter during ascent. Simultaneously, their buoyancy increases significantly, allowing the large bubble to ascend at a higher speed. Furthermore, in certain embodiments, the provision of bubble guide channels 30 and multiple recesses 321 within the boiling portion 3 significantly increases the heat exchange surface area between the boiling portion 3 and the fluid medium. This increased heat exchange surface area enhances the boiling effect of the fluid medium, generating more bubbles. This not only significantly improves overall heat dissipation efficiency but also increases the probability of collision and aggregation between bubbles, further enhancing heat dissipation performance. Please refer to Figures 2A to 2D, which respectively show the front views of an embodiment of the boiling enhancement member 1 of the present invention. Further explanation, the embodiments shown in Figures 2A to 2D mainly differ in the size and configuration of the recessed portions 2321A, 2321B, 2321C, 2321D and the bubble disturbance zones 231A, 231B, 231C, 231D. In the embodiment of Figure 2A, the recessed portions 2321A provided on the two side walls of the bubble diversion channel 30 are arranged in a staggered manner. In the embodiment of Figure 2B, the recessed portions 2321B provided on the two side walls of the bubble diversion channel 30 correspond to each other side by side, but the recessed portions 321 on the two opposite sides of the protrusion 32 are not connected. In the embodiment of FIG2C , the recessed portion 2321C is provided only on one sidewall of the bubble guide channel 30; the recessed portion 2321C has a relatively large diameter and extends through the thickness of the protrusion 32. In the embodiment of FIG2D , the recessed portion 2321D is provided at the center of the protrusion 32 and has an opening 2322D facing each side of the bubble guide channel 30. These embodiments demonstrate that the shape, size, and placement of the recessed portions 2321A, 2321B, 2321C, and 2321D can be flexibly adjusted according to actual needs. Please refer to Figures 3A to 3D, which respectively show the front views of an embodiment of the boiling enhancement member 1 of the present invention. Further explanation is given, in the embodiments shown in Figures 3A to 3D, the main differences lie in the form of the protrusions 32A, 32B, 32C, and 32D and the form and configuration of the recesses 3321A, 3321B, 3321C, and 3321D. In the embodiment of Figure 3A, the protrusion 32A is a sawtooth-shaped protrusion, while the recess 3321A is a V-shaped groove. The recesses 3321A on the two side surfaces of the bubble guide channel 30 are arranged in a staggered manner, so that the bubble guide channel 30 presents a sawtooth-shaped channel. In this embodiment, the angle θ of the specific direction D1 that guides the upward movement of the bubbles relative to the gravity direction Dg is an obtuse angle. In the embodiment of FIG3B , the protrusion 32B is also a sawtooth-shaped protrusion, and the recessed portion 3321B is also a V-shaped groove. However, the recessed portions 3321B on the two sidewalls of the bubble diversion channel 30 are arranged in a corresponding manner. In the embodiment of FIG3C , one side of the protrusion 32C has a recessed portion 3321C, which is a semi-elliptical groove, and the other side of the protrusion 32C has a corresponding raised portion 324C, thereby forming a circuitous channel for the bubble diversion channel 30. In the embodiment of FIG3D , one side of the protrusion 32D has a recessed portion 3321D, which is also a semi-elliptical groove, and the other side of the protrusion 32C has a corresponding raised portion 324D. In addition, the recessed portions 3321D provided on the two sidewalls of the bubble diversion channel 30 are arranged in a corresponding manner. As can be seen from the above embodiments, the shape, size, orientation, and position of the protrusions 32 and recesses 321 of the present invention can be flexibly designed based on actual needs. Furthermore, the boiling enhancement member 1 can be made of a metal material with high thermal conductivity, such as copper or aluminum. The boiling-forming portion 3 can be manufactured using a variety of processing techniques, such as machining, photolithography, electroforming, micro-embroidery, powder metallurgy, or additive manufacturing. Please refer to Figures 4A and 4B simultaneously. Figure 4A shows a bottom view of an embodiment of a boiling enhancement member 41 of the present invention disposed on a circuit board B, while Figure 4B shows a front view of an embodiment of the boiling enhancement member 41 of the present invention. As shown in Figure 4A , a wafer holder S is mounted on the circuit board B, on which a wafer, i.e., a heat source Hs, is mounted. A boiling enhancement member 41 is positioned above the heat source Hs. The boiling enhancement member 41 includes a boiling-generating portion 43, which includes a bubble generation zone Zb (see Figure 4B ), corresponding to the area on the first surface 21 of the heat conducting portion 2 that contacts the heat source Hs. Specifically, the bubble generation zone Zb is located in the orthographic projection direction of the heat source Hs. Consequently, the majority of the heat generated by the heat source Hs is directly transferred through the heat conducting portion 2 via the shortest path (the path with the least thermal resistance) to the bubble generation zone Zb of the boiling-generating portion 43. The fluid medium (not shown) then boils in the bubble generation zone Zb, generating a large number of bubbles. It is particularly noted that in the embodiment shown in FIG. 4A , the gravity direction Dg is the direction passing through the paper surface in the page of FIG. 4A . As shown in Figure 4B , multiple bubble disturbance zones 431 are provided within the bubble generation zone Zb. Each bubble disturbance zone 431 is a cylindrical space with a diameter of 3 mm, and the spacing between adjacent bubble disturbance zones 431 is 8 mm. Furthermore, the boiling enhancement member 41 has dimensions of 172.75 mm in length, 59.4 mm in width, and 4.3 mm in height, while the heat conduction portion 2 has a thickness of 1.5 mm. The bumps 432 have a length of 49.4 mm, a width of 0.2 mm, and a height of 2.8 mm, with the spacing between adjacent bumps 432 being 0.2 mm. Please also refer to Figure 5; Figure 5 shows the relationship between temperature and power during actual operation of an embodiment of the boiling enhancement element 41 of the present invention. Experimental results based on the embodiment and parameters shown in Figures 4A and 4B are presented in Figure 5. When the thermal design power (TDP) of the heat source Hs is 200W, the wafer temperature using a conventional boiling aid (without the bubble disturbance zone 431) is T1, while the wafer temperature using the boiling enhancement element 41 with the bubble disturbance zone 431 is T1'. When the TDP is 500W, the wafer temperature using the conventional boiling aid is T2, while the wafer temperature using the boiling enhancement element 41 with the bubble disturbance zone 431 is T2'. As shown in Figure 5 , the use of the boiling enhancement member 41 with the bubble disturbance zone 431 can reduce wafer temperature by at least approximately 2.4% to 4.7% compared to conventional boiling aids. Furthermore, actual measurements and calculations show that the use of the boiling enhancement member 41 with the bubble disturbance zone 431 can reduce thermal resistance by at least approximately 16% to 18% compared to conventional boiling aids. Please refer to Figures 6A and 6B. Figure 6A shows a front view of an embodiment of a boiling enhancement member 61 of the present invention, and Figure 6B shows a three-dimensional view of an embodiment of a boiling enhancement member 61 of the present invention. The main difference between this embodiment and the embodiment shown in Figures 1A and 1B is that the recessed portion 321 in Figures 1A and 1B is replaced by a protrusion 323 in this embodiment. In other words, the protrusion 632 includes a plurality of protrusions 323, and these protrusions 323 protrude toward the bubble diversion channel 630. In some embodiments, a spacing recess 62 is formed between two adjacent protrusions 323, and the bubble diversion channel 630 and these spacing recesses 62 together constitute a bubble disturbance zone 631. As can be seen from the above, the formation method of the bubble disturbance zone 631 in the present invention is not limited. Whether the protrusion 632 is protruding outward or recessed inward, as long as the geometric shape of the bubble guide channel 630 is changed, thereby adjusting the bubble's floating path and affecting the bubble aggregation behavior, such structural changes fall within the scope of the present invention. Please refer to Figure 7, which is a schematic diagram illustrating an embodiment of an immersion cooling system 6 according to the present invention. As shown in Figure 7, in some embodiments, the immersion cooling system 6 primarily comprises a tank 4, an information processing device 5, and a boiling enhancement member 71. The tank 4 has a receiving space 40 suitable for accommodating a fluid medium L. The fluid medium L can be a non-conductive, low-boiling-point, two-phase coolant, typically a fluorinated carbon compound (such as 3M™ Novec™ Electronic Fluid). The information processing device 5 can be a server device, and the boiling enhancement member 71 can be any of the boiling enhancement members 71 described in the aforementioned embodiments. In other embodiments, the system may be equipped with a vapor recovery system, such as a condenser line (not shown), which may be located above tank 4. The vapor recovery system recovers vapor generated by the boiling fluid L, condenses it into liquid, and then flows it back to tank 4, achieving closed-loop cooling. In other embodiments, a condenser located within tank 4 may also be used to achieve closed-loop cooling. Specifically, some embodiments of the present invention have at least the following advantages: Improved heat transfer and heat exchange efficiency: In some embodiments, the bubble disturbance zone 31 promotes rapid bubble detachment, reducing the gas barrier formed between the heated surface and the fluid medium L. This allows the fluid medium L to re-engage the heated surface more quickly, thereby improving heat transfer efficiency. After the bubbles detach, "cavity nuclei" or "microcavities" are left on the surface. These nucleation sites promote the formation of new bubbles, further increasing the frequency of bubble formation and enhancing the boiling heat transfer effect. Avoiding localized overheating and ensuring uniform cooling: When bubbles cling to the surface of the boiling enhancement element 1 for extended periods, heat cannot be released promptly, potentially leading to localized overheating. Promoting bubble detachment distributes the heat load, preventing the formation of high-temperature areas, and thus improving system stability and lifespan. Furthermore, the detachment of bubbles allows the fluid medium L to continuously refresh the surface of the boiling enhancement element 1, reducing surface temperature unevenness, achieving uniform cooling, and lowering material stress caused by uneven thermal expansion, minimizing the risk of damage to electronic components. Preventing bubble aggregation and flow channel blockage: If bubbles cannot rise quickly, they may aggregate into large bubbles, or even form gas slugs, which can block the fluid channel. In some embodiments, the bubble disturbance zone 31 prevents bubble aggregation, accelerates the disturbance of the fluid medium L and the rise of bubbles, ensuring smooth flow of the fluid medium L and avoiding flow obstruction, thereby enhancing the cooling effect of the system. This promotes fluid circulation and system stability. When bubbles rise rapidly, localized negative pressure is generated behind them, attracting new fluid, promoting internal circulation of the fluid medium L and improving the overall flow performance of the cooling system. Furthermore, bubble detachment quickly releases heat within the system, avoiding the "boiling hysteresis" effect caused by localized high temperatures. This ensures system stability and reduces the risk of thermal runaway. Reduce thermal fatigue and extend the life of electronic components. When the rate of bubble generation and detachment is unstable, it can cause thermal stress fluctuations in the system. Especially in high-power operating environments, these stress fluctuations can accelerate component fatigue damage. Promoting bubble detachment and buoyancy can reduce surface temperature fluctuations of the boiling enhancement element 1, mitigate thermal fatigue effects, and thus extend the life of electronic components (heat source Hs). Supporting higher power density; by promoting the detachment and buoyancy of bubbles, the system's heat dissipation capacity is significantly improved, allowing the same cooling structure to handle higher thermal power loads. This enables high-power electronic devices such as high-performance computing (HPC) servers, data centers, and GPUs to support higher power densities, avoid overheating, and improve equipment reliability. Overall, in some embodiments of the present invention, the boiling enhancement element 1 can accelerate the detachment and floating of bubbles, significantly improving heat dissipation efficiency and preventing gas accumulation and flow blockage. The boiling enhancement element 1 also promotes the flow and circulation of the fluid medium L, reducing thermal runaway and thermal fatigue effects in the system. These advantages enable the immersion cooling system 6 to support higher power densities, reduce system costs, and improve system stability and reliability. This is crucial for thermal management in high-performance computing (HPC) servers, data centers, and high-power electronic devices. Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Anyone with ordinary skill in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent applications. 1,41,61,71: boiling enhancement member 2: heat conduction portion 3,43: boiling formation portion 4: tank 5: information processing device 6: immersion cooling system 21: first surface 22: second surface 30,630: bubble guide channel 31,431,231A,231B,231C,231D,631: bubble disturbance zone 32,32A,32B,32C,32D,432,632: bump 40: accommodation space 62: spacing recess Part 321, 2321A, 2321B, 2321C, 2321D, 3321A, 3321B, 3321C, 3321D: Recessed part 322, 2322D: Opening 323: Raised part 324C, 324D: Raised part B: Circuit board Dg: Gravity direction D1: Specific direction G: Specific spacing Hs: Heat source L: Fluid medium S: Wafer holder T1, T1', T2, T2': Temperature Zb: Bubble generation area θ: Angle FIG1A is a front view showing an embodiment of a boiling enhancement component of the present invention. FIG1B is a perspective view showing an embodiment of a boiling enhancement component of the present invention. FIG2A to FIG2D and FIG3A to FIG3D are front views showing an embodiment of a boiling enhancement component of the present invention, respectively. FIG4A is a bottom view showing an embodiment of a boiling enhancement component of the present invention disposed on a circuit board. FIG4B is a front view showing an embodiment of a boiling enhancement component of the present invention. FIG5 is a temperature and power relationship diagram showing an embodiment of a boiling enhancement component of the present invention after actual operation. FIG6A is a front view showing an embodiment of a boiling enhancement component of the present invention. FIG6B is a perspective view showing an embodiment of a boiling enhancement component of the present invention. FIG7 is a schematic diagram showing an embodiment of an immersion cooling system of the present invention. 1: Boiling enhancement 2: Heat conduction part 3: Boiling formation part 22: Second surface 30: Bubble diversion channel 31: Bubble disturbance zone 32: Bump 321: Depression 322: Opening Dg: direction of gravity D1: Specific direction G: Specific spacing θ: angle

Claims

1. A boiling enhancement component, comprising: A heat-conducting part includes a first surface and a second surface, the first surface being adapted to contact a heat source; And a boiling forming section located on the second surface of the heat-conducting section; the boiling forming section includes a plurality of bubble disturbance zones; wherein, in response to a fluid medium boiling in the boiling forming section and generating a plurality of bubbles, the bubble disturbance zones are adapted to change the upward path of at least a portion of the bubbles.

2. The boiling enhancement component as described in claim 1, wherein, The boiling formation section includes at least one bubble guide channel adapted to guide the bubbles to float; the bubble disturbance zone is located on the at least one bubble guide channel.

3. The boiling enhancement component as described in claim 2, wherein, The at least one bubble guide channel is substantially parallel to a direction of gravity.

4. The boiling enhancement component as described in claim 3, wherein, These bubble disturbance zones are adapted to guide at least a portion of the bubbles to move in a specific direction, which has an angle relative to the direction of gravity, the angle being between 90 and 180 degrees.

5. The boiling enhancement component as described in claim 3, wherein, The boiling forming section includes multiple bumps extending along the direction of gravity; at least one bubble guiding channel is formed between these bumps.

6. The boiling enhancement component as described in claim 5, wherein, The bumps include multiple recesses, each recess having an opening facing the at least one bubble flow channel, and the at least one bubble flow channel and the recesses forming the bubble disturbance zone.

7. The boiling enhancement component as described in claim 6, wherein, These recesses are respectively located on two corresponding sides of the protrusions and are connected to each other.

8. The boiling enhancement component as described in claim 5, wherein, The bumps include multiple protrusions that extend toward the at least one bubble flow channel; a spaced recess is formed between every two adjacent protrusions, and the at least one bubble flow channel and the spaced recesses form the bubble disturbance zone.

9. The boiling enhancement component as described in claim 1, wherein, The boiling forming section includes a bubble generating region corresponding to the area on the first surface of the heat-conducting section that contacts the heat source; the bubble disturbance regions are located within the bubble generating region.

10. A boiling enhancement component, comprising: A heat-conducting part includes a first surface and a second surface, the first surface being adapted to contact a heat source; And a plurality of bumps located on the second surface of the heat-conducting part and extending along a gravity direction, wherein a plurality of bubble guiding channels are formed between the bumps; wherein the surface of the bumps forming the bubble guiding channels includes at least one of a plurality of spaced-apart recesses and a plurality of protrusions to change the rising path of one of the plurality of bubbles.

11. The boiling enhancement component as described in claim 10, wherein, The recesses and protrusions are adapted to guide at least a portion of the bubbles to move in a specific direction, which has an angle relative to the direction of gravity, the angle being between 90 and 180 degrees.

12. The boiling enhancement component as described in claim 10, wherein, Each of the recesses has an opening facing the bubble flow channels, and the bubble flow channels and the recesses form multiple bubble disturbance zones.

13. The boiling enhancement component as described in claim 12, wherein, The bumps include a bubble-generating region corresponding to the area on the first surface of the heat-conducting part that contacts the heat source; the bubble disturbance region is located within the bubble-generating region.

14. The boiling enhancement component as described in claim 10, wherein, These recesses are respectively located on two corresponding sides of the protrusions and are connected to each other.

15. The boiling enhancement component as described in claim 10, wherein, A recessed portion is formed between every two adjacent protrusions, and the at least one bubble guide channel and the recessed portions form multiple bubble disturbance zones.

16. An immersion cooling system, comprising: A tank having a containment space suitable for containing a fluid medium; And a boiling enhancement component, disposed within the receiving space of the tank and immersed in the fluid medium; The boiling enhancement component includes: a heat-conducting portion including a first surface and a second surface, the first surface being adapted to contact a heat source; and a boiling forming portion located on the second surface of the heat-conducting portion; the boiling forming portion including a plurality of bubble disturbance regions; wherein, in response to the fluid medium boiling in the boiling forming portion and generating a plurality of bubbles, the bubble disturbance regions are adapted to change the upward path of at least a portion of the bubbles.

17. The immersion cooling system as described in claim 16, wherein, The boiling formation section includes multiple bubble guide channels adapted to guide the bubbles to float upwards; the bubble disturbance zone is located on the bubble guide channels, which are substantially parallel to a gravitational direction.

18. The immersion cooling system as described in claim 17, wherein, These bubble disturbance zones are adapted to guide at least a portion of the bubbles to move in a specific direction, which has an angle relative to the direction of gravity, the angle being between 90 and 180 degrees.

19. The immersion cooling system as described in claim 17, wherein, The boiling forming section includes a plurality of protrusions extending along the direction of gravity, and bubble guiding channels are formed between the protrusions; the surface of the protrusions forming the bubble guiding channels includes at least one of a plurality of recesses and a plurality of protrusions.

20. The immersion cooling system as described in claim 19, wherein, Each of the recesses has an opening facing the at least one bubble flow channel, and the bubble flow channel and the recesses form the bubble disturbance zone.

21. The immersion cooling system as claimed in claim 16 further includes an information processing device configured to be disposed within the containment space of the tank, wherein the heat source is disposed within the information processing device.

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