Electronic component and its manufacturing method

Abstract

This invention provides an electronic component that can improve the insulation between the two ends of a coil. The electronic component 100 of the present invention comprises: a substrate 110 having a mounting surface 111; a coil C1 embedded in the substrate 110; a terminal electrode E1 connected to one end of the coil C1, having a surface S1 exposed from the mounting surface 111 and a surface S3 covered by the substrate 110; a terminal electrode E2 connected to the other end of the coil C1, having a surface S2 exposed from the mounting surface 111 and a surface S4 covered by the substrate 110; and an insulating film 122 comprising a first portion 1221, a second portion 1222, and a third portion 1223, wherein the first portion 1221 is disposed between the surface S3 of the terminal electrode E1 and the substrate 110, the second portion 1222 is disposed between the surface S4 of the terminal electrode E2 and the substrate, and the third portion 1223 is disposed on the mounting surface 111 and located between the terminal electrodes E1 and E2. The insulating film 122 is a continuous film in which there is no interface between the first part 1221 and the third part 1223, and in which there is no interface between the second part 1222 and the third part 1223.

Description

Technical Field

[0001] This invention relates to an electronic component and its manufacturing method. Prior Technology

[0002] Patent Document 1 discloses a coil component having a structure in which a coil pattern is embedded in a magnetic resin layer. In Patent Document 1, the mounting surface of the magnetic resin layer is covered by a resin film. [Previous Technical Documents] [Patent Literature]

[0003] Patent Document 1: Japanese Patent Application Publication No. 2017-123406 Summary of the Invention

[0004] (The problem the invention aims to solve) In the coil component disclosed in Patent Document 1, the internal electrode system is in contact with the magnetic resin layer.

[0005] This invention describes an electronic component and its manufacturing method, which can improve the insulation between the two ends of a coil. (Technical means to solve the problem)

[0006] An electronic component of the same type as the present invention comprises: a substrate having a mounting surface; a coil embedded in the substrate; a first terminal electrode electrically connected to one end of the coil, having a first surface exposed from the mounting surface and a third surface covered by the substrate; a second terminal electrode electrically connected to the other end of the coil, having a second surface exposed from the mounting surface and a fourth surface covered by the substrate; and an insulating film comprising a first portion, a second portion, and a third portion, the first portion being disposed between the third surface of the first terminal electrode and the substrate, the second portion being disposed between the fourth surface of the second terminal electrode and the substrate, and the third portion being disposed on the mounting surface and located between the first terminal electrode and the second terminal electrode; the insulating film is a continuous film having no interface between the first portion and the third portion, and no interface between the second portion and the third portion.

[0007] The present invention discloses a method for manufacturing an electronic component of the same type, comprising the following steps: a first step, forming a first insulating film on a support; a second step, forming a first terminal electrode and a second terminal electrode on the first insulating film, wherein the first terminal electrode has a first surface covered by the first insulating film and a third surface exposed from the first insulating film, and the second terminal electrode has a second surface covered by the first insulating film and a fourth surface exposed from the first insulating film; a third step, forming a second insulating film, wherein the second insulating film covers the first insulating film, the third surface of the first terminal electrode, and the fourth surface of the second terminal electrode. Step 4, which forms a coil with one end connected to the first terminal electrode and the other end connected to the second terminal electrode; Step 5, which embeds the coil into the substrate such that the third surface of the first terminal electrode is covered by the second insulating film and the fourth surface of the second terminal electrode is covered by the second insulating film and the substrate; Step 6, which exposes the first insulating film by peeling off the support; and Step 7, which exposes the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the second insulating film located between the first terminal electrode and the second terminal electrode by removing the first insulating film. (Compared to the effectiveness of previous technologies)

[0008] According to the present invention, an electronic component and its manufacturing method are provided, which can improve the insulation between the two ends of a coil. Simple Explanation of the Diagram

[0009] Figure 1 is a simplified perspective view showing the appearance of an electronic component (coil component) 100 according to one embodiment of the present invention. Figure 2 is a simplified perspective top view of coil component 100. Figure 3 is a simplified cross-sectional view of the coil component 100 along the virtual line L1 shown in Figure 2. Figure 4 is a simplified bottom view of the coil component 100. Figure 5(a) is an enlarged sectional view for illustrating the structure of the connecting part V1 in more detail. Figure 5(b) is an enlarged sectional view for illustrating the structure of the connecting part V4 in more detail. Figure 6(a) is an enlarged sectional view illustrating the structure of the connecting part V2 in more detail. Figure 6(b) is an enlarged sectional view illustrating the structure of the connecting part V3 in more detail. Figure 7 is a simplified exploded perspective view of the circuit module 200 including the coil component 100. Figures 8(a) to 8(c) are flowcharts illustrating one example of a manufacturing method for the coil component 100. Figures 9(a) to 9(c) are flowcharts illustrating one example of a method for manufacturing the coil component 100. Figure 10 is a flowchart illustrating one example of a method for manufacturing the coil component 100. Figures 11(a) to 11(c) are flowcharts illustrating another example of a method for manufacturing the coil component 100. Implementation

[0010] Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail.

[0011] Figure 1 is a simplified perspective view showing the appearance of an electronic component (coil component) 100 according to one embodiment of the present invention. Furthermore, Figure 2 is a simplified perspective top view of the coil component 100, Figure 3 is a simplified cross-sectional view of the coil component 100 along the virtual line L1 shown in Figure 2, and Figure 4 is a simplified bottom view of the coil component 100.

[0012] As shown in Figures 1 to 4, the coil assembly 100 of this embodiment includes a substrate 110, four coils C1 to C4 embedded in the substrate 110, and terminal electrodes E1 to E8 exposed on the surface of the substrate 110. The substrate 110 may also be made of a composite magnetic material, which is formed by curing magnetic particles made of high-permeability materials such as ferrite or permalloy using a resin binder. As shown in Figure 3, the substrate 110 forms an XY plane and has a mounting surface 111 and a top surface 112 located on opposite sides. Eight terminal electrodes E1 to E8 are exposed from the mounting surface 111. The mounting surface 111 is covered by an insulating film 122 made of resin or the like. The surfaces of the terminal electrodes E1 to E8 exposed from the mounting surface 111 may also be on the same plane as the insulating film 122 covering the mounting surface 111.

[0013] Terminal electrode E1 has a surface S1 exposed from the mounting surface 111 and a surface S3 covered by the substrate 110 through an insulating film 122. Terminal electrode E2 has a surface S2 exposed from the mounting surface 111 and a surface S4 covered by the substrate 110 through an insulating film 122. Surface S1 forms the lower surface of terminal electrode E1, i.e., the XY plane. Surface S2 forms the lower surface of terminal electrode E2, i.e., the XY plane. In contrast, surface S3 includes an upper surface located opposite to surface S1 and a side surface connecting the upper and lower surfaces. Similarly, surface S4 includes an upper surface located opposite to surface S2 and a side surface connecting the upper and lower surfaces. The other terminal electrodes E3 to E8 have the same configuration as described above.

[0014] In the cross-section shown in Figure 3, the insulating film 122 includes a first portion 1221 disposed between the surface S3 of the terminal electrode E1 and the substrate 110, a second portion 1222 disposed between the surface S4 of the terminal electrode E2 and the substrate 110, and a third portion 1223 disposed on the mounting surface 111 and located between the terminal electrode E1 and the terminal electrode E2. The first portion 1221 of the insulating film 122 mainly serves to prevent the terminal electrode E1 from contacting the substrate 110. The second portion 1222 of the insulating film 122 mainly serves to prevent the terminal electrode E2 from contacting the substrate 110. The third portion 1223 of the insulating film 122 mainly serves to improve the withstand voltage between the terminal electrode E1 and the terminal electrode E2.

[0015] The surfaces S1 of terminal electrode E1, S2 of terminal electrode E2, and the surface of the third portion 1223 of the insulating film 122 disposed on the mounting surface 111 can also form the same plane. This configuration reduces the thickness of the coil assembly 100 in the Z direction. The surfaces S1 of terminal electrode E1 and S2 of terminal electrode E2 can also be covered by conductive surface treatment layers 131 and 132, respectively. Surface treatment layers 131 and 132 can also be composed of Ni / Sn laminated films, Ni / Pt / Au laminated films, Ni / Au laminated films, etc. Providing such surface treatment layers 131 and 132 improves solder wettability during mounting. The surfaces of other terminal electrodes E3 to E8 exposed from the mounting surface 111 can also be covered by surface treatment layers.

[0016] In the example shown in Figure 3, four conductor layers 71 to 74 are embedded in the substrate 110. Terminal electrodes E1 to E8 are all located in conductor layer 71. Each of the conductor layers 72 to 74 has an insulating film 90 made of resin or the like disposed between it and the substrate 110 without contacting the substrate. The insulating film 90 can also be divided into an insulating film covering conductor layer 72, an insulating film covering conductor layer 73, and an insulating film covering conductor layer 74. Furthermore, the insulating film 90 can also be formed of the same material as the insulating film 122.

[0017] Furthermore, in the following description, the direction from terminal electrode E1 to terminal electrode E2 is sometimes referred to as the X direction (or +X direction), and the opposite direction is sometimes referred to as the -X direction. Similarly, the direction from terminal electrode E1 to terminal electrode E7 is sometimes referred to as the Y direction (or +Y direction), and the opposite direction is sometimes referred to as the -Y direction. Similarly, the direction from mounting surface 111 to the upper surface 112 is sometimes referred to as the Z direction (or +Z direction), and the opposite direction is sometimes referred to as the -Z direction. In the specific examples shown in Figures 1 to 4, the X, Y, and Z directions are orthogonal. Furthermore, the present invention also includes cases where the angle formed by the X, Y, and Z directions differs from a right angle due to manufacturing errors of the coil component 100 (for example, a difference of about 5° from a right angle).

[0018] As shown in Figure 4, not only are terminal electrodes E1 to E8 exposed on the mounting surface 111, but conductor patterns 11, 24, 37, and 40 are also exposed. Terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are located on the same conductive layer 71. The surfaces of conductor patterns 11, 24, 37, and 40 exposed from the substrate 110 can also form the same plane with the surface of the third portion 1223 of the insulating film 122 covering the mounting surface 111 of the substrate 110. As shown in Figure 4, terminal electrodes E1 and E2 are arranged along the X direction, and conductor pattern 11 extending along the X direction is located between them. Terminal electrodes E3 and E4 are arranged along the X direction, and conductor pattern 24 extending along the X direction is located between them. Terminal electrodes E5 and E6 are arranged along the X direction, and conductor pattern 37 extending along the X direction is located between them. Terminal electrodes E7 and E8 are arranged along the X direction, and a conductor pattern 40 extending along the X direction is located between them.

[0019] As shown in Figure 3, the conductor pattern 11 has a surface S5 exposed from the mounting surface 111 and a surface S6 covered by the substrate 110 through an insulating film 122. Surface S5 constitutes the lower surface of the conductor pattern 11, i.e., the XY plane. Surface S6 includes an upper surface located opposite to surface S5 and a side surface connecting the upper and lower surfaces. Surface S6 of the conductor pattern 11 is covered by the substrate 110 through the insulating film 122.

[0020] In the cross-section shown in Figure 3, the insulating film 122 further includes a fourth portion 1224 disposed between the surface S6 of the conductor pattern 11 and the substrate 110. The fourth portion 1224 of the insulating film 122 mainly serves to prevent the conductor pattern 11 from contacting the substrate 110.

[0021] The insulating film 122 is a continuous film. That is, the aforementioned portions 1221 to 1224 are integrally formed, and there are no interfaces between them. For example, the first portion 1221 of the insulating film 122 covering the surface S3 of the terminal electrode E1 and the third portion 1223 of the insulating film 122 covering the mounting surface 111 of the substrate 110 are continuous, and there are no interfaces between them. That is, at the position where the side surface of the surface S3 contacts the surface S1, the first portion 1221 and the third portion 1223 of the insulating film 122 are formed continuously without interfaces. The top surface and side surface of the surface S3 of the terminal electrode E1 are also continuously covered by the first portion 1221 of the insulating film 122 without interfaces. Similarly, the second portion 1222 of the surface S4 covering the terminal electrode E2 in the insulating film 122 is continuous with the third portion 1223 of the mounting surface 111 covering the substrate 110 in the insulating film 122, and there is no interface between them. That is, at the position where the side surface of the surface S4 contacts the surface S2, the second portion 1222 and the third portion 1223 of the insulating film 122 are formed continuously without an interface. The top surface and side surface of the surface S4 of the terminal electrode E2 are also continuously covered by the second portion 1222 of the insulating film 122 without an interface. The fourth portion 1224 of the surface S6 covering the conductor pattern 11 in the insulating film 122 is continuous with the third portion 1223 of the mounting surface 111 covering the substrate 110 in the insulating film 122, and there is no interface between them.

[0022] The surface S5 of the conductor pattern 11 and the surface of the third portion 1223 of the insulating film 122 disposed on the mounting surface 111 can also be configured to be on the same plane. The surface S5 of the conductor pattern 11 can be covered by the same conductive material as the surface treatment layers 131 and 132, or it can be directly exposed. The other conductor patterns 24, 37, and 40 exposed from the substrate 110 are configured in the same way as described above.

[0023] In the examples shown in Figures 1 to 4, terminal electrodes E1, E3, E5, and E7 are arranged along the Y direction, and terminal electrodes E2, E4, E6, and E8 are arranged along the Y direction. This allows for miniaturization of the substrate 110 in the X direction.

[0024] In the examples of Figures 1 to 4, the X-direction positions of conductor pattern 11 and conductor pattern 37 can be identical, and the X-direction positions of conductor pattern 24 and conductor pattern 40 can be identical. In contrast, the X-direction positions of conductor patterns 11 and 37 are different from those of conductor patterns 24 and 40. In the example of Figure 4, the X-direction positions of conductor patterns 11 and 37 do not overlap with those of conductor patterns 24 and 40. The upper edges of conductor patterns 11 and 37 in the -X direction (on the side forming terminal electrodes E1, E3, E5, and E7 in Figure 4) and the upper edges of conductor patterns 24 and 40 in the +X direction (on the side forming terminal electrodes E2, E4, E6, and E8 in Figure 4) can also be substantially the same. Furthermore, not limited to this, the X-direction positions of conductor patterns 11 and 37 and those of conductor patterns 24 and 40 can also partially overlap in the X-direction.

[0025] Coil C1 is connected between terminal electrode E1 and terminal electrode E2. One end of coil C1 is electrically connected to terminal electrode E1, and the other end of coil C1 is electrically connected to terminal electrode E2. Coil C1 includes: conductor pattern 11 located in conductor layer 71, conductor patterns 12 and 13 located in conductor layer 74, and conductor patterns 81 to 88 located in conductor layers 72 or 73. Conductor patterns 12 and 13 located in conductor layer 74 are embedded in substrate 110 without being exposed from either mounting surface 111 or top surface 112. Viewed from the Z direction in top view, the overlapping conductor patterns are connected to each other via through-hole conductors. Viewed from the Z direction, relative to conductor pattern 11 which extends linearly in the X direction, conductor patterns 12 and 13 extend in the X direction while meandering in the Y direction.

[0026] In the example of Figure 3, conductor layer 72 includes conductor patterns 81-84, and conductor layer 73 includes conductor patterns 85-88. Furthermore, conductor patterns 81 and 85 constitute connection V1, conductor patterns 82 and 86 constitute connection V2, conductor patterns 83 and 87 constitute connection V3, and conductor patterns 84 and 88 constitute connection V4. Connections V1-V4 can also be arranged sequentially along the X direction.

[0027] Furthermore, in the cross-section along the virtual line L2 shown in Figure 2, connecting portions V5 to V8 are formed by conductor patterns located in conductive layers 72 and 73. Connecting portions V5 to V8 can also be arranged sequentially along the X direction. In the cross-section along the virtual line L3 shown in Figure 2, connecting portions V9 to V12 are formed by conductor patterns located in conductive layers 72 and 73. Connecting portions V9 to V12 can also be arranged sequentially along the X direction. In the cross-section along the virtual line L4 shown in Figure 2, connecting portions V13 to V16 are formed by conductor patterns located in conductive layers 72 and 73. Connecting portions V13 to V16 can also be arranged sequentially along the X direction.

[0028] In the illustrated case shown in Figure 2, viewed from the Z direction in a top view, the conductor pattern 12 has a first straight portion 51, which is linearly formed along the X direction, and its -X direction end is connected to the connecting portion V1. The conductor pattern 12 further has a second straight portion 52, which extends linearly along the X direction, and its -X direction end is connected to the +X direction end of the first straight portion 51 via a first curved portion 61. The +X direction end is connected to the connecting portion V3 via the second curved portion 62. The first curved portion 61 illustrated in Figure 2 can also be curved from the connecting portion V1 toward the connecting portion V3, including a curve from the +X direction toward the -Y direction and a curve from the -Y direction toward the +X direction. The second curved portion 62 illustrated in Figure 2 can also be curved from the connecting portion V1 toward the connecting portion V3, including a curve from the +X direction toward the +Y direction. Furthermore, in the case of the pattern illustrated in FIG2, the conductor pattern 13 has a third straight portion 53, which extends linearly along the X direction, and the end in the -X direction is connected to the connecting portion V2 via the third curved portion 63, and the end in the +X direction is connected to the connecting portion V4 via the fourth curved portion 64.

[0029] Furthermore, one end of conductor pattern 12 in the -X direction is connected to terminal electrode E1 via connector V1. One end of conductor pattern 13 in the +X direction is connected to terminal electrode E2 via connector V4. One end of conductor pattern 11 located on the terminal electrode E1 side (-X direction side) is connected to the other end of conductor pattern 13 via connector V2. The other end of conductor pattern 11 located on the terminal electrode E2 side (+X direction side) is connected to the other end of conductor pattern 12 via connector V3.

[0030] In this way, the current input from the outside to the terminal electrode E1 flows to the terminal electrode E2 via the connection part V1, conductor pattern 12, connection part V3, conductor pattern 11, connection part V2, conductor pattern 13, and connection part V4. Here, the current flows mainly in the +X direction in conductor patterns 12 and 13, and in the -X direction in conductor pattern 11. Furthermore, the current flows in the -Z direction in connection part V3, and in the +Z direction in connection part V2. As a result, conductor pattern 12, connection part V3, conductor pattern 11, connection part V2, and conductor pattern 13 form a loop with the Y direction as the axial direction. In the region surrounded by the above loop when viewed from the Y direction, a portion of the substrate 110 is embedded. The portion surrounded by this loop becomes the region where magnetic flux is generated when current flows through the coil C1 (the magnetic core of the inductor). Furthermore, when viewed from the Z direction from above, the area surrounded by conductor patterns 12 and 13 overlaps with a portion of conductor pattern 11.

[0031] Coil C2 is arranged adjacent to coils C1 and C3 in a manner that it is clamped from the Y direction, and is connected between terminal electrode E3 and terminal electrode E4. One end of coil C2 is electrically connected to terminal electrode E3, and the other end of coil C2 is electrically connected to terminal electrode E4. Coil C2 has a conductor pattern 24 located in conductor layer 71, conductor patterns 25 and 26 located in conductor layer 74, and connecting portions V5 to V8 located in conductor layer 72 or conductor layer 73. Connecting portions V5 to V8 can also be arranged sequentially along the X direction. In the case where conductor pattern 24 extends linearly along the X direction, conductor patterns 25 and 26 extend in the X direction while meandering along the Y direction.

[0032] In the configuration illustrated in Figure 2, viewed from the Z direction in a top view, the conductor pattern 26 has a fourth straight section 54, which is linearly formed along the X direction, and its +X direction end is connected to the connecting portion V8. The conductor pattern 26 further has a fifth straight section 55, which extends linearly along the X direction, and its +X direction end is connected to the -X direction end of the fourth straight section 54 via a fifth curved section 65. The -X direction end is connected to the connecting portion V6 via a sixth curved section 66. The fifth curved section 65 illustrated in Figure 2 can also be curved from the connecting portion V8 toward the connecting portion V6, including a curve from the -X direction toward the -Y direction and a curve from the -Y direction toward the -X direction. The sixth curved section 66 illustrated in Figure 2 can also be curved from the connecting portion V8 toward the connecting portion V6, including a curve from the -X direction toward the +Y direction. Furthermore, in the case of the pattern illustrated in FIG2, the conductor pattern 25 has a sixth straight portion 56, which extends linearly along the X direction, and the end in the +X direction is connected to the connecting portion V7 via the seventh bending portion 67, and the end in the -X direction is connected to the connecting portion V5 via the eighth bending portion 68.

[0033] Furthermore, one end of conductor pattern 25 in the -X direction is connected to terminal electrode E3 via connector V5. One end of conductor pattern 26 in the +X direction is connected to terminal electrode E4 via connector V8. One end of conductor pattern 24 on the terminal electrode E3 side (-X direction side) is connected to the other end of conductor pattern 26 via connector V6. The other end of conductor pattern 24 on the terminal electrode E4 side (+X direction side) is connected to the other end of conductor pattern 25 via connector V7.

[0034] In this way, the current input from the outside to the terminal electrode E3 flows to the terminal electrode E4 via the connection part V5, conductor pattern 25, connection part V7, conductor pattern 24, connection part V6, conductor pattern 26, and connection part V8. Here, the current flows mainly in the +X direction in conductor patterns 25 and 26, and in the -X direction in conductor pattern 24. In addition, the current flows in the -Z direction in connection part V7, and in the +Z direction in connection part V6. As a result, conductor pattern 25, connection part V7, conductor pattern 24, connection part V6, and conductor pattern 26 are formed into a loop with the Y direction as the axial direction. The part surrounded by this loop becomes the region where magnetic flux is generated when the current flows through coil C2 (the magnetic core of the inductor). Viewed from the Y direction, a portion of the substrate 110 is embedded in the region surrounded by the above loop. Furthermore, when viewed from above in the Z direction, the area surrounded by conductor patterns 25 and 26 overlaps with a portion of conductor pattern 24.

[0035] Coil C3 is arranged adjacent to coils C2 and C4, which are clamped together in the Y direction, and connected between terminal electrodes E5 and E6. One end of coil C3 is electrically connected to terminal electrode E5, and the other end of coil C3 is electrically connected to terminal electrode E6. Coil C3 has a conductor pattern 37 located in conductor layer 71, conductor patterns 38 and 39 located in conductor layer 74, and connecting portions V9 to V12 located in conductor layer 72 or conductor layer 73. Connecting portions V9 to V12 can also be arranged sequentially in the X direction. Relative to conductor pattern 37, which extends linearly in the X direction, conductor patterns 38 and 39 extend in the X direction while meandering in the Y direction.

[0036] Similar to conductor pattern 12, conductor pattern 38 has two straight portions and two curved portions. Similar to conductor pattern 13, conductor pattern 39 has one straight portion and two curved portions. Furthermore, one end of conductor pattern 38 in the -X direction is connected to terminal electrode E5 via connecting portion V9. One end of conductor pattern 39 in the +X direction is connected to terminal electrode E6 via connecting portion V12. One end of conductor pattern 37 on the terminal electrode E5 side (-X direction side) is connected to the other end of conductor pattern 39 via connecting portion V10. The other end of conductor pattern 37 on the terminal electrode E6 side (+X direction side) is connected to the other end of conductor pattern 38 via connecting portion V11.

[0037] In this way, the current input from the outside to the terminal electrode E5 flows to the terminal electrode E6 via the connection V9, conductor pattern 38, connection V11, conductor pattern 37, connection V10, conductor pattern 39, and connection V12. Here, the current flows mainly in the +X direction in conductor patterns 38 and 39, and in the -X direction in conductor pattern 37. Furthermore, the current flows in the -Z direction in connection V11, and in the +Z direction in connection V10. As a result, conductor pattern 38, connection V11, conductor pattern 37, connection V10, and conductor pattern 39 form a loop with the Y direction as the axial direction. The portion surrounded by this loop becomes the region where magnetic flux is generated when current flows through coil C3 (the magnetic core of the inductor). Viewed from the Y direction, a portion of the substrate 110 is embedded in the region surrounded by the aforementioned loop. Furthermore, when viewed from above in the Z direction, the area surrounded by conductor patterns 38 and 39 overlaps with a portion of conductor pattern 37.

[0038] Coil C4 is disposed adjacent to coil C3 in the Y direction and is connected between terminal electrode E7 and terminal electrode E8. One end of coil C4 is electrically connected to terminal electrode E7, and the other end of coil C4 is electrically connected to terminal electrode E8. Coil C4 includes: a conductor pattern 40 located in conductor layer 71, conductor patterns 41 and 42 located in conductor layer 74, and connecting portions V13 to V16 located in conductor layer 72 or conductor layer 73. Connecting portions V13 to V16 may also be arranged sequentially along the X direction. Relative to conductor pattern 40, which extends linearly along the X direction, conductor patterns 41 and 42 extend serpentinely along the Y direction and towards the X direction.

[0039] Similar to conductor pattern 25, conductor pattern 41 has one straight portion and two curved portions. Similar to conductor pattern 26, conductor pattern 42 has two straight portions and two curved portions. Furthermore, one end of conductor pattern 41 in the -X direction is connected to terminal electrode E7 via connecting portion V13. One end of conductor pattern 42 in the +X direction is connected to terminal electrode E8 via connecting portion V16. One end of conductor pattern 40 located on the terminal electrode E7 side (-X direction side) is connected to the other end of conductor pattern 42 via connecting portion V14. The other end of conductor pattern 40 located on the terminal electrode E8 side (+X direction side) is connected to the other end of conductor pattern 41 via connecting portion V15.

[0040] In this way, the current input from the outside to the terminal electrode E7 flows to the terminal electrode E8 via the connection V13, conductor pattern 41, connection V15, conductor pattern 40, connection V14, conductor pattern 42, and connection V16. Here, the current flows mainly in the +X direction in conductor patterns 41 and 42, and in the -X direction in conductor pattern 40. Furthermore, the current flows in the -Z direction in connection V15, and in the +Z direction in connection V14. As a result, conductor pattern 41, connection V15, conductor pattern 40, connection V14, and conductor pattern 42 form a loop with the Y direction as the axial direction. The portion surrounded by this loop becomes the region where magnetic flux is generated when current flows through coil C4 (the magnetic core of the inductor). Viewed from the Y direction, a portion of the substrate 110 is embedded in the region surrounded by the aforementioned loop. Furthermore, when viewed from above in the Z direction, the area surrounded by conductor patterns 41 and 42 overlaps with a portion of conductor pattern 40.

[0041] Figure 5(a) is an enlarged sectional view for illustrating the structure of the connecting part V1 in more detail.

[0042] As shown in Figure 5(a), the conductor pattern 81 located in conductor layer 72 is connected to the terminal electrode E1 located in conductor layer 71 via a via conductor 81V formed by a portion of conductor pattern 81. The via conductor 81V is configured to penetrate the insulating film 122 and has a shape whose diameter decreases towards the terminal electrode E1. The conductor pattern 85 located in conductor layer 73 is connected to the conductor pattern 81 located in conductor layer 72 via a via conductor 85V formed by a portion of conductor pattern 85. The via conductor 85V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases towards conductor pattern 81. The conductor pattern 12 located in conductor layer 74 is connected to the conductor pattern 85 located in conductor layer 73 via a via conductor 12V formed by a portion of conductor pattern 12. The via conductor 12V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases towards conductor pattern 85. The insulating film 90 and the first portion 1221 of the insulating film 122 are connected without gaps.

[0043] Therefore, when stress in the +Z direction is applied to terminal electrode E1 from the outside, the stress applied to conductor pattern 81 is dispersed because the diameter of via conductor 81V increases in the direction of stress transmission. The stress applied to conductor pattern 81 is transmitted to conductor pattern 85 via via conductor 85V; however, because the diameter of via conductor 85V increases in the direction of stress transmission, the stress applied to conductor pattern 85 is dispersed. Furthermore, the stress applied to conductor pattern 85 is transmitted to conductor pattern 12 via via conductor 12V; however, because the diameter of via conductor 12V increases in the direction of stress transmission, the stress applied to conductor pattern 12 is dispersed. With this mechanism, the stress applied to terminal electrode E1 from the outside is dispersed internally, thereby improving product reliability.

[0044] Figure 5(b) is an enlarged sectional view for more detailed explanation of the structure of the connecting part V4.

[0045] As shown in Figure 5(b), the conductor pattern 84 located in conductor layer 72 is connected to the terminal electrode E2 located in conductor layer 71 via a via conductor 84V formed by a portion of conductor pattern 84. The via conductor 84V is configured to penetrate the insulating film 122 and has a shape whose diameter decreases towards the terminal electrode E2. The conductor pattern 88 located in conductor layer 73 is connected to the conductor pattern 84 located in conductor layer 72 via a via conductor 88V formed by a portion of conductor pattern 88. The via conductor 88V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases towards the conductor pattern 84. The conductor pattern 13 located in conductor layer 74 is connected to the conductor pattern 88 located in conductor layer 73 via a via conductor 13V formed by a portion of conductor pattern 13. The via conductor 13V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases towards the conductor pattern 88. The insulating film 90 and the second portion 1222 of the insulating film 122 are connected without gaps.

[0046] Therefore, when stress in the +Z direction is applied to terminal electrode E2 from the outside, the stress applied to conductor pattern 84 is dispersed because the diameter of via conductor 84V increases in the direction of stress transmission. The stress applied to conductor pattern 84 is transmitted to conductor pattern 88 via via conductor 88V; however, because the diameter of via conductor 88V increases in the direction of stress transmission, the stress applied to conductor pattern 88 is dispersed. Furthermore, the stress applied to conductor pattern 88 is transmitted to conductor pattern 13 via via conductor 13V; however, because the diameter of via conductor 13V increases in the direction of stress transmission, the stress applied to conductor pattern 13 is dispersed. With this mechanism, the stress applied to terminal electrode E2 from the outside is dispersed internally, thus improving product reliability.

[0047] Although not illustrated, according to the same mechanism, the stress applied to the other terminal electrodes E3 to E8 is also dispersed internally. That is, the through-hole conductors included in the connecting portions V5, V8, V9, V12, V13, and V16 also have a shape in which the diameter increases as it moves toward the +Z direction (the diameter decreases in the -Z direction), so that even when stress in the +Z direction is applied to the terminal electrodes E3 to E8, the stress is dispersed internally.

[0048] Figure 6(a) is an enlarged sectional view for more detailed explanation of the structure of the connecting part V2.

[0049] As shown in Figure 6(a), conductor pattern 82 located in conductor layer 72 is connected to conductor pattern 11 located in conductor layer 71 via a via conductor 82V formed by a portion of conductor pattern 82. The via conductor 82V is configured to penetrate the insulating film 122 and has a shape whose diameter decreases towards conductor pattern 11. Conductor pattern 86 located in conductor layer 73 is connected to conductor pattern 82 located in conductor layer 72 via a via conductor 86V formed by a portion of conductor pattern 86. The via conductor 86V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases towards conductor pattern 82. Conductor pattern 13 located in conductor layer 74 is connected to conductor pattern 86 located in conductor layer 73 via a via conductor 13V formed by a portion of conductor pattern 13. The via conductor 13V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases towards conductor pattern 86.

[0050] Therefore, assuming that the stress in the +Z direction is applied to conductor pattern 11 from the outside, the diameter of the via conductor 82V increases in the direction of stress transmission, thus dispersing the stress applied to conductor pattern 82. The stress applied to conductor pattern 82 is transmitted to conductor pattern 86 via via conductor 86V; however, since the diameter of via conductor 86V increases in the direction of stress transmission, the stress applied to conductor pattern 86 is dispersed. Furthermore, the stress applied to conductor pattern 86 is transmitted to conductor pattern 13 via via conductor 13V; however, since the diameter of via conductor 13V increases in the direction of stress transmission, the stress applied to conductor pattern 13 is dispersed. With this mechanism, the stress applied to conductor pattern 11 from the outside is dispersed internally, thus improving product reliability.

[0051] Figure 6(b) is an enlarged sectional view for more detailed explanation of the structure of the connecting part V3.

[0052] As shown in Figure 6(b), the conductor pattern 83 located in conductor layer 72 is connected to the conductor pattern 11 located in conductor layer 71 via a via conductor 83V formed by a portion of conductor pattern 83. The via conductor 83V is configured to penetrate the insulating film 122 and has a shape whose diameter decreases as it approaches conductor pattern 11. The conductor pattern 87 located in conductor layer 73 is connected to the conductor pattern 83 located in conductor layer 72 via a via conductor 87V formed by a portion of conductor pattern 87. The via conductor 87V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases as it approaches conductor pattern 83. The conductor pattern 12 located in conductor layer 74 is connected to the conductor pattern 87 located in conductor layer 73 via a via conductor 12V formed by a portion of conductor pattern 12. The via conductor 12V is configured to penetrate the insulating film 90 and has a shape whose diameter decreases as it approaches conductor pattern 87.

[0053] Therefore, assuming that stress in the +Z direction is applied externally to conductor pattern 11, the diameter of the via conductor 83V increases in the direction of stress transmission, thus dispersing the stress applied to conductor pattern 83. The stress applied to conductor pattern 83 is transmitted to conductor pattern 87 via via conductor 87V; however, since the diameter of via conductor 87V increases in the direction of stress transmission, the stress applied to conductor pattern 87 is dispersed. Furthermore, the stress applied to conductor pattern 87 is transmitted to conductor pattern 12 via via conductor 12V; however, since the diameter of via conductor 12V increases in the direction of stress transmission, the stress applied to conductor pattern 12 is dispersed. Through this mechanism, the stress applied externally to conductor pattern 11 is dispersed internally, thus improving product reliability.

[0054] Although not shown in the figure, the through-hole conductors included in the connection portions V6, V7, V10, V11, V14, and V15 connected to the other conductor patterns 24, 37, and 40 located in the conductor layer 71 also have a shape in which the diameter increases as it moves toward the +Z direction (the diameter decreases in the -Z direction), and even when stress in the +Z direction is applied to the conductor patterns 24, 37, and 40, the stress is dispersed internally.

[0055] Based on the above configuration, the coil component 100 of this embodiment is configured as an 8-terminal coil array with four built-in coils. The coil component 100 can form a circuit module 200 by mounting area 100A on the substrate 130 shown in FIG. 7. Connection disk patterns P1 to P8 are provided on the surface of the substrate 130, and the coil component 100 is mounted on the substrate 130 by connecting the terminal electrodes E1 to E8 to the connection disk patterns P1 to P8 respectively.

[0056] Furthermore, since the coil assembly 100 of this embodiment arranges coils C1 to C4 along the Y direction and each has a loop with the Y direction as the axial direction, the size of the substrate 110 in the Y direction can be miniaturized. In particular, in two adjacent coils along the Y direction, since the conductor patterns provided on the mounting surface 111 are positioned differently in the X direction, the overlapping areas of the conductor patterns provided on the conductive layer 74 in the Y direction in each coil can be misaligned in the X direction in adjacent coils. For example, the overlapping areas of conductor patterns 12 and 13 constituting coil C1 in the Y direction and the overlapping areas of conductor patterns 25 and 26 constituting coil C2 in the Y direction can be misaligned in the X direction. In this way, multiple coils can be built into the substrate 110 with a higher density.

[0057] Furthermore, since the stacking direction of the conductor pattern inside the substrate 110 is the Z direction, even if the number of coils built into the substrate 110 increases, the number of conductor pattern stacks will not increase, thus reducing manufacturing costs.

[0058] Here, as shown in Figure 2, when a virtual line L0 is defined, passing through the center of coils C1 to C4 in the X direction and extending along the Y direction, the conductor patterns 12 and 13 constituting coil C1 and the conductor patterns 25 and 26 constituting coil C2 have shapes that are linearly symmetrical about the virtual line L0 as an axis of symmetry. Similarly, the conductor patterns 38 and 39 constituting coil C3 and the conductor patterns 41 and 42 constituting coil C4 have shapes that are linearly symmetrical about the virtual line L0 as an axis of symmetry. That is, if the conductor patterns 12 and 13 constituting coil C1 are reversed about the virtual line L0 as an axis of symmetry, they become the same shape as the conductor patterns 25 and 26 constituting coil C2. If the conductor patterns 38 and 39 constituting coil C3 are reversed about the virtual line L0 as an axis of symmetry, they become the same shape as the conductor patterns 41 and 42 constituting coil C4.

[0059] Furthermore, when defining virtual lines L1 to L4 that pass through the center of coils C1 to C4 in the Y direction and extend along the X direction, the conductor patterns 12 and 13 constituting coil C1 and the conductor patterns 38 and 39 constituting coil C3 have shapes that are linearly symmetrical about each other with virtual lines L1 and L3 as axes of symmetry, respectively. Similarly, the conductor patterns 25 and 26 constituting coil C2 and the conductor patterns 41 and 42 constituting coil C4 have shapes that are linearly symmetrical about virtual lines L2 and L4 as axes of symmetry, respectively. That is, if the conductor patterns 12 and 13 constituting coil C1 are reversed with virtual line L1 as the axis of symmetry, they become the same shape as the conductor patterns 38 and 39 constituting coil C3. Conversely, if the conductor patterns 38 and 39 constituting coil C3 are reversed with virtual line L3 as the axis of symmetry, they become the same shape as the conductor patterns 12 and 13 constituting coil C1. Similarly, if the conductor patterns 25 and 26 constituting coil C2 are reversed with the virtual line L2 as the axis of symmetry, they become the same shape as the conductor patterns 41 and 42 constituting coil C4. Conversely, if the conductor patterns 41 and 42 constituting coil C4 are reversed with the virtual line L4 as the axis of symmetry, they become the same shape as the conductor patterns 25 and 26 constituting coil C2. In other words, the conductor patterns 38 and 39 constituting coil C3 can also be formed with the same straight and curved portions as the conductor patterns 12 and 13 constituting coil C1, and the conductor patterns 41 and 42 constituting C4 can also be formed with the same straight and curved portions as the conductor patterns 25 and 26 constituting coil C2.

[0060] Furthermore, when the intersection points of virtual line L0 and virtual lines L1 to L4 are set to Q1 to Q4 respectively, coils C1 and C4 have shapes that are point-symmetric about each other with intersection points Q1 and Q4 as the center points, and coils C2 and C3 have shapes that are point-symmetric about each other with intersection points Q2 and Q3 as the center points. That is, if coil C1 is rotated 180° with intersection point Q1 as the center point, it becomes the same shape as coil C4, and if coil C4 is rotated 180° with intersection point Q4 as the center point, it becomes the same shape as coil C1. Similarly, if coil C2 is rotated 180° with intersection point Q2 as the center point, it becomes the same shape as coil C3, and if coil C3 is rotated 180° with intersection point Q3 as the center point, it becomes the same shape as coil C2.

[0061] As described above, since coils C1 to C4 have the above-mentioned shape, coils C1 to C4 with the same inductance can be arranged in a high density, and the pattern design of conductor patterns can be easily carried out.

[0062] Furthermore, in this embodiment, the coil component 100 has an insulating film 122 covering the mounting surface 111 of the substrate 110, which improves the insulation between the terminal electrodes E1 to E8. Moreover, since the insulating film 122 is integrally formed and is a continuous film without interfaces, it is not easy for peeling to occur at the interface, thus achieving high reliability.

[0063] Figures 8(a) to 8(c), 9(a) to 9(c) and 10 are flowcharts illustrating the manufacturing method of the coil component 100 of this embodiment. The cross-sections shown in Figures 8(a) to 8(c), 9(a) to 9(c) and 10 correspond to the cross-section shown in Figure 3.

[0064] First, as shown in FIG8(a), a support body S is prepared. Next, as shown in FIG8(b), an insulating film 121 made of resin or the like is formed on the support body S, and then terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are formed on the insulating film 121. The cross-section shown in FIG8(b) shows terminal electrodes E1, E2, and conductor pattern 11. Terminal electrodes E1, E2, and conductor pattern 11 are formed by covering surfaces S1, S2, and S5 with the insulating film 121, and surfaces S3, S4, and S6 are formed exposed from the insulating film 121. Next, as shown in FIG8(c), an insulating film 122 is used to cover the entire surface. Herein, the exposed surface of the insulating film 121, surface S3 of terminal electrode E1, surface S4 of terminal electrode E2, and surface S6 of conductor pattern 11 are covered by the insulating film 122.

[0065] Next, as shown in Figure 9(a), conductor layers 71 to 74 are formed sequentially. Conductor layer 71 contains a sacrificial pattern 91. Focusing on coil C1, conductor layer 72 contains conductor patterns 81 to 84. Furthermore, conductor layer 72 also contains a sacrificial pattern 92. Conductor patterns 81 to 84 and sacrificial pattern 92 are separated from each other by an insulating film 90. The sacrificial pattern 92 located in conductor layer 72 is connected to the sacrificial pattern 91 located in conductor layer 71.

[0066] Focusing on coil C1, conductor layer 73 includes conductor patterns 85-88. Furthermore, conductor layer 73 also includes a sacrificial pattern 93. Conductor patterns 85-88 and sacrificial pattern 93 are separated from each other by insulating film 90. Sacrificial pattern 93 located in conductor layer 73 is connected to sacrificial pattern 92 located in conductor layer 72. Focusing on coil C1, conductor layer 74 includes conductor patterns 12 and 13. Furthermore, conductor layer 74 also includes a sacrificial pattern 94. Conductor patterns 12 and 13 and sacrificial pattern 94 are separated from each other by insulating film 90. Sacrificial pattern 94 located in conductor layer 74 is connected to sacrificial pattern 93 located in conductor layer 73.

[0067] Next, as shown in Figure 9(b), the sacrificial patterns 91-94 are removed using acid or the like. This creates a space between the conductor patterns 12 and 13 located in the conductor layer 74 and the support S. Specifically, conductor pattern 12 is supported at both ends by connecting portions V1 and V3, and the portion between the two ends is suspended. Similarly, conductor pattern 13 is supported at both ends by connecting portions V2 and V4, and the portion between the two ends is suspended.

[0068] Next, as shown in FIG9(c), a substrate 110 made of magnetic material is formed in the area where the sacrificial patterns 91-94 have been removed and on top of it, thereby embedding the conductor layers 71-74 into the substrate 110. During the formation of the substrate 110, after the conductor layers 71-74 are embedded in the uncured substrate 110, the substrate 110 is hardened by applying pressure toward the support S. By adjusting the pressure conditions on the substrate 110, as illustrated in FIG3, FIG9(c), and FIG10, the conductor patterns 12 and 13 can be formed into a straight line. Furthermore, by appropriately adjusting the pressure conditions and heating conditions on the substrate 110, the conductor patterns 12 and 13 can also be formed into a curved shape toward the support S.

[0069] Next, as shown in FIG10, the support S is peeled off. This exposes the insulating film 121. Then, by removing the insulating film 121 through a desmearing process, the terminal electrodes E1-E8 and conductor patterns 11, 24, 37, 40 located on the conductor layer 71 are exposed. The coil component 100 of this embodiment is then completed. A conductive surface treatment layer can also be formed on the surface of the terminal electrodes E1-E8.

[0070] As described above, according to the manufacturing method of the coil component 100 of this embodiment, since conductor layers 71 to 74 are formed sequentially from the conductor layer 71 where the terminal electrodes E1 to E8 are located, the step of forming the substrate 110 can be completed in one step compared to the method of forming conductor layers 74 to 71 sequentially from the conductor layer 74. That is, in the method of forming conductor layers 74 to 71 sequentially from the conductor layer 74, after the conductor layers 74 to 71 are formed on the support S in this order, a substrate 110 is formed to embed the conductor layers 74 to 71. After the support S is peeled off, other parts of the substrate 110 need to be formed from the conductor layer 74, so the step of forming the substrate 110 requires two steps. Furthermore, if the substrate 110 is formed in two steps, the interface formed on the substrate 110 will reduce the magnetic properties of that part. In contrast, in the manufacturing method of the coil component 100 of this embodiment, since the step of forming the substrate 110 is completed in one step, the manufacturing cost can be reduced, and since no interface is formed inside the substrate 110, high magnetic properties can be ensured.

[0071] Furthermore, according to the manufacturing method described above, since the insulating film 122 is retained as a continuous film, there is no need for additional processing to cover the mounting surface 111 of the substrate 110 with an insulating film, thus reducing the number of steps. In addition, according to the manufacturing method described above, the surfaces of the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, 40, and the third surface 1223 of the insulating film 122 covering the mounting surface 111 of the substrate 110 form substantially the same plane. Therefore, the size of the coil component 100 in the Z direction can be reduced.

[0072] Figures 11(a) to 11(c) are flowcharts illustrating another example of the manufacturing method of the coil component 100 of this embodiment. The cross-sections shown in Figures 11(a) to 11(c) correspond to the cross-sections shown in Figure 3.

[0073] First, as shown in FIG11(a), after an insulating film 121 made of resin or the like is formed on the support S, as shown in FIG11(b), a plurality of recesses are formed on the insulating film 121. The cross-section shown in FIG11(b) shows recesses 1211 to 1213. Next, as shown in FIG11(c), terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are formed in the recesses formed on the insulating film 121. The cross-section shown in FIG11(c) shows the terminal electrode E1 formed in recess 1211, the terminal electrode E2 formed in recess 1212, and the conductor pattern 11 formed in recess 1213.

[0074] The subsequent steps are as described using Figures 8(c), 9(a) to 9(c) and 10. Thus, if a plurality of recesses are formed in the insulating film 121, and terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, 40 are formed in the recesses, then even if the insulating film 121 is removed by grinding, the terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, 40 protruding from the surface of the insulating film 122 can be ground, thus ensuring sufficient remaining thickness of the insulating film 122.

[0075] The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments. Various modifications can be made without exceeding the scope of the subject matter, and these modifications are naturally included within the scope of the present invention.

[0076] For example, although the configurations illustrated in Figures 1 to 4 show a coil component containing four coils C1 to C4, the number of coils contained in the electronic component (coil component) is not limited in the technology of the present invention.

[0077] Furthermore, although four conductor layers 71 to 74 are embedded in the substrate 110 in the embodiments illustrated in Figures 1 to 4, there is no particular limitation on the number of conductor layers embedded in the substrate in the present invention.

[0078] Furthermore, there are no particular restrictions on the shape and size of the terminal electrodes E1 to E8. For example, the terminal electrodes E1 to E8 can also be made of cylindrical conductor pillars.

[0079] The technology of this invention includes, but is not limited to, the following configurations.

[0080] An electronic component of the same type as the present invention comprises: a substrate having a mounting surface; a coil embedded in the substrate; a first terminal electrode electrically connected to one end of the coil, having a first surface exposed from the mounting surface and a third surface covered by the substrate; a second terminal electrode electrically connected to the other end of the coil, having a second surface exposed from the mounting surface and a fourth surface covered by the substrate; and an insulating film comprising a first portion, a second portion, and a third portion, wherein the first portion is disposed between the third surface of the first terminal electrode and the substrate, the second portion is disposed between the fourth surface of the second terminal electrode and the substrate, and the third portion is disposed on the mounting surface and located between the first terminal electrode and the second terminal electrode; the insulating film is a continuous film in which there is no interface between the first portion and the third portion, and no interface between the second portion and the third portion. This improves the withstand voltage between the first terminal electrode and the second terminal electrode and suppresses peeling of the insulating film.

[0081] In the aforementioned electronic components, the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the surface of the third portion of the insulating film can also form the same plane. This allows for the thinning of the electronic components.

[0082] In the aforementioned electronic components, the first surface of the first terminal electrode and the second surface of the second terminal electrode can also be covered by a conductive surface treatment layer. This improves the wettability of the solder during installation.

[0083] The aforementioned electronic component may further include: a first through-hole conductor electrically connecting one end of the coil to a first terminal electrode; and a second through-hole conductor electrically connecting the other end of the coil to a second terminal electrode; at least a portion of the first through-hole conductor has a shape that decreases in diameter towards the first terminal electrode, and at least a portion of the second through-hole conductor has a shape that decreases in diameter towards the second terminal electrode. This allows for the internal dispersion of stress applied to the first and second terminal electrodes from the outside.

[0084] In the aforementioned electronic components, the third surface may also have: a top surface facing the first surface in the thickness direction of the first terminal electrode, and a side surface connecting the top surface and the first surface; the fourth surface has: a top surface facing the second surface in the thickness direction of the second terminal electrode, and a side surface connecting the top surface and the second surface; the top surface and the side surface of the third surface are continuously covered by a first portion of the insulating film in a non-interface manner, and at the contact position between the side surface of the third surface and the first surface, the first portion and the third portion are continuously formed in a non-interface manner; the top surface and the side surface of the fourth surface are continuously covered by a second portion of the insulating film in a non-interface manner, and at the contact position between the side surface of the fourth surface and the second surface, the second portion and the third portion are continuously formed in a non-interface manner. Therefore, since peeling at the interface is less likely to occur, high reliability can be obtained.

[0085] The aforementioned electronic component may further include: a first conductor pattern forming one end of a coil, electrically connected to the upper surface of the third surface of the first terminal electrode via a first through-hole conductor configured to penetrate a first portion of the insulating film; a second conductor pattern forming the other end of the coil, electrically connected to the upper surface of the fourth surface of the second terminal electrode via a second through-hole conductor configured to penetrate a second portion of the insulating film; and other insulating films covering the first and second conductor patterns; the first portion of the insulating film is seamlessly connected to other insulating films, and the second portion of the insulating film is seamlessly connected to other insulating films. This improves the reliability of the through-hole conductor.

[0086] The present invention discloses a method for manufacturing an electronic component of the same type, comprising the following steps: a first step, forming a first insulating film on a support; a second step, forming a first terminal electrode and a second terminal electrode on the first insulating film, wherein the first terminal electrode has a first surface covered by the first insulating film and a third surface exposed from the first insulating film, and the second terminal electrode has a second surface covered by the first insulating film and a fourth surface exposed from the first insulating film; a third step, forming a second insulating film, wherein the second insulating film covers the first insulating film, the third surface of the first terminal electrode, and the fourth surface of the second terminal electrode. The process involves several steps: Step 4, forming a coil with one end connected to the first terminal electrode and the other end connected to the second terminal electrode; Step 5, embedding the coil into the substrate such that the third surface of the first terminal electrode is covered by the second insulating film and the fourth surface of the second terminal electrode is covered by the second insulating film; Step 6, exposing the first insulating film by peeling off the support; and Step 7, exposing the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the second insulating film located between the first and second terminal electrodes by removing the first insulating film. This allows the second insulating film to be retained as a continuous film.

[0087] The manufacturing method of the aforementioned electronic component may further include a step of forming a conductive surface treatment layer on the first surface of the first terminal electrode and the second surface of the second terminal electrode after performing step 7. This improves the wettability of the solder during assembly.

[0088] The aforementioned method for manufacturing electronic components may further include: forming a first recess and a second recess on a first insulating film after the first step and before the second step; and in the second step, forming a first terminal electrode in the first recess and a second terminal electrode in the second recess. This ensures that even when the first insulating film is removed by grinding, the remaining thickness of the second insulating film is adequately maintained.

[0089] 11-13, 24-26, 37-44, 81-88: Conductor patterns 12V, 13V, 81V~88V: Through-hole conductor 51-56: Straight sections 61-68: Bending section 71-74: Conductor layer 90: Insulating film 91-94: Sacrifice Pattern 95: Coating 100-103: Coil components (electronic components) 100A: Mounting Area 110: Matrix 111: Mounting surface 112: Above 121, 122: Insulating film 1211~1213 concave part 1221: Part 1 1222: Part 2 1223: Part 3 1224: Part 4 130:Substrate 131, 132: Surface treatment layer 200: Circuit Module C1~C4: Coils E1~E8: Terminal electrodes L0~L4: Virtual lines P1~P8: Connecting disc patterns Q1~Q4: Intersection points S: Support body S1~S6: Surface V1~V16: Connecting parts

Claims

1. An electronic component comprising: a substrate having a mounting surface; a coil embedded in the substrate; a first terminal electrode electrically connected to one end of the coil, having a first surface exposed from the mounting surface and a third surface covered by the substrate; a second terminal electrode electrically connected to the other end of the coil, having a second surface exposed from the mounting surface and a fourth surface covered by the substrate; and an insulating film comprising a first portion, a second portion, and a third portion, the first portion being disposed between the third surface of the first terminal electrode and the substrate, the second portion being disposed between the fourth surface of the second terminal electrode and the substrate, and the third portion being disposed on the mounting surface and located between the first terminal electrode and the second terminal electrode; the insulating film being a continuous film having no interface between the first portion and the third portion, and having no interface between the second portion and the third portion.

2. As in request item 1, the electronic component, wherein, The first surface of the first terminal electrode, the second surface of the second terminal electrode, and the surface of the third portion of the insulating film are all in the same plane.

3. As in request item 1, the electronic components, wherein, The first surface of the first terminal electrode and the second surface of the second terminal electrode are covered by a conductive surface treatment layer.

4. The electronic component according to any one of claims 1 to 3, further comprising: a first through-hole conductor electrically connected to one end of the coil and the first terminal electrode; and a second through-hole conductor electrically connected to the other end of the coil and the second terminal electrode; at least a portion of the first through-hole conductor having a shape that decreases in diameter toward the first terminal electrode, and at least a portion of the second through-hole conductor having a shape that decreases in diameter toward the second terminal electrode.

5. The electronic components as described in claim 2, wherein, The third surface has: an upper surface facing the first surface in the thickness direction of the first terminal electrode, and a side surface connecting the upper surface and the first surface; the fourth surface has: an upper surface facing the second surface in the thickness direction of the second terminal electrode, and a side surface connecting the upper surface and the second surface; the upper surface and the side surface of the third surface are continuously covered by the first portion of the insulating film in a manner without interface, and at the position where the side surface of the third surface contacts the first surface, the first portion and the third portion are continuously formed in a manner without interface; the upper surface and the side surface of the fourth surface are continuously covered by the second portion of the insulating film in a manner without interface, and at the position where the side surface of the fourth surface contacts the second surface, the second portion and the third portion are continuously formed in a manner without interface.

6. The electronic component of claim 5 further comprises: a first conductor pattern constituting one end of the coil and electrically connected to the upper surface of the third surface of the first terminal electrode via a first through-hole conductor configured to penetrate the first portion of the insulating film; a second conductor pattern constituting the other end of the coil and electrically connected to the upper surface of the fourth surface of the second terminal electrode via a second through-hole conductor configured to penetrate the second portion of the insulating film; and other insulating films covering the first conductor pattern and the second conductor pattern; the first portion of the insulating film is connected to the other insulating films without gaps, and the second portion of the insulating film is connected to the other insulating films without gaps.

7. A method for manufacturing an electronic component, comprising the following steps: Step 1, forming a first insulating film on a support; Step 2, forming a first terminal electrode and a second terminal electrode on the first insulating film, wherein the first terminal electrode has a first surface covered by the first insulating film and a third surface exposed from the first insulating film, and the second terminal electrode has a second surface covered by the first insulating film and a fourth surface exposed from the first insulating film; Step 3, forming a second insulating film that covers the first insulating film, the third surface of the first terminal electrode, and the fourth surface of the second terminal electrode; Step 4, forming a coil with one end connected to the first terminal electrode and the other end connected to the second terminal electrode. Step 5 involves embedding the coil into the substrate such that the third surface of the first terminal electrode is covered by the second insulating film and the fourth surface of the second terminal electrode is covered by the second insulating film; Step 6 involves exposing the first insulating film by peeling off the support; and Step 7 involves exposing the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the second insulating film located between the first terminal electrode and the second terminal electrode by removing the first insulating film.

8. The method for manufacturing an electronic component as claimed in claim 7, further comprising: after performing the above-mentioned step 7, forming a conductive surface treatment layer on the first surface of the first terminal electrode and the second surface of the second terminal electrode.

9. The method for manufacturing an electronic component as claimed in claim 7 or 8, further comprising: forming a first recess and a second recess in the first insulating film after performing the first step and before performing the second step; in the second step, forming a first terminal electrode in the first recess and forming a second terminal electrode in the second recess.

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