Circuit board with hybrid wiring

Abstract

This invention provides a circuit board with hybrid circuitry, comprising: a substrate, a low-impedance circuit group, and a printed circuit group. The low-impedance circuit group includes a first low-impedance conductive line formed on a first surface of the substrate and a second low-impedance conductive line disposed in the substrate; the printed circuit group includes printed conductive lines formed on the first surface of the substrate, the printed conductive lines being electrically connected to any two of the first low-impedance conductive lines. The resistance value of the printed circuit group is higher than the resistance value of the low-impedance circuit group.

Claims

1. A circuit board with hybrid circuitry, comprising: a substrate having a first surface and a second surface opposite to each other; at least one low-impedance circuit group having a first resistance value, including: at least one first low-impedance conductive line formed on the first surface; and at least one printed circuit group having a second resistance value formed on the first surface, including: at least one printed conductive line electrically connected to the at least one first low-impedance conductive line; wherein, The second resistance value is higher than the first resistance value; wherein the at least one printed conductive line has a current-limiting resistor.

2. The circuit board with mixed circuitry as described in claim 1, wherein the at least one printed circuit group is printed using a conductive ink, the material of which may be: silver paste, copper paste, copper-silver mixed paste, or carbon material.

3. The circuit board with mixed circuitry as described in claim 1, further comprising a connector for electrical connection to either of the first low-impedance conductive lines.

4. A circuit board with mixed circuitry as described in claim 3, wherein the connector may be: a pad, a via, a connecting copper foil, or a connecting terminal.

5. The circuit board with hybrid circuitry as described in claim 1, further comprising at least one light-emitting module disposed on the first surface, and the at least one printed circuit group being electrically connected to the at least one light-emitting module in series or in parallel.

6. The circuit board with hybrid circuitry as described in claim 1, wherein the substrate material may be: glass fiber epoxy resin, paper phenolic resin, glass fiber composite epoxy resin or ceramic, polyimide or polyethylene terephthalate.

7. A circuit board with hybrid circuitry as described in claim 1, wherein the ratio of the resistivity of the low-impedance circuitry group to the resistivity of the printed circuitry group is less than or equal to 0.

3.

8. The circuit board with mixed circuitry as described in claim 1, further comprising at least one electronic component disposed on the first surface, the at least one printed circuit group electrically connected to the at least one electronic component, the at least one electronic component being: a resistor, a capacitor, an inductor, a transistor, an integrated circuit, an optocoupler, a connector, or a relay.

9. The circuit board with mixed circuitry as claimed in claim 1, further comprising at least one second low-impedance conductive line formed in the substrate and extending toward the second surface, and electrically connected to the at least one first low-impedance conductive line.

10. The circuit board with mixed circuitry as described in claim 1, further comprising at least one third conductive line formed in the substrate and extending toward the second surface and electrically connected to the at least one first low-impedance conductive line, the at least one third conductive line having a third resistance value that may be higher or lower than the first resistance value.

11. A circuit board with hybrid circuitry, comprising: a substrate having a first surface and a second surface opposite to each other; at least one low-impedance circuit group having a first resistance value, comprising: at least one first low-impedance conductive line formed on the first surface; and at least one second low-impedance conductive line formed in the substrate and extending toward the second surface, and electrically connected to the at least one first low-impedance conductive line; and at least one printed circuit group having a second resistance value formed on the first surface, comprising: at least one printed conductive line electrically connected to the at least one first low-impedance conductive line; wherein, The second resistance value is higher than the first resistance value.

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