Electronic package and manufacturing method thereof

Abstract

An electronic package and its manufacturing method are disclosed, wherein an electrical bridging element with a wiring portion is disposed on one side of a circuit structure, and a plurality of electronic components are disposed on the other side. The wiring portion includes at least one magnetic layer and a coil-type inductor formed on the magnetic layer, so that the electrical bridging element is integrated into the electronic package as a power management chip, thereby shortening the distance from the power supply to the electronic components and effectively improving the performance of the electronic package.

Claims

1. An electronic package, comprising: Line structure; An electrical bridging element having a wiring section is attached to one side of the circuit structure and electrically connected to the circuit structure. The wiring section includes a magnetic layer and a coil inductor formed on the magnetic layer. The coil inductor has a first inductor segment and a second inductor segment respectively disposed on opposite sides of the magnetic layer. The first inductor segment and the second inductor segment are interconnected by a plurality of inductor pillars to form the coil inductor around the magnetic layer. A plurality of electronic components are attached to the other side of the circuit structure and electrically connected to the circuit structure. The plurality of electronic components are electrically connected to the electrical bridging element through the circuit structure.

2. The electronic package as described in claim 1, wherein, An intermediary element is provided on one side of the circuit structure, so that the plurality of electronic components are electrically connected to the intermediary element through the circuit structure.

3. The electronic package as described in claim 2, wherein, The intermediate element has multiple through-holes.

4. The electronic package as described in claim 1, wherein, This electrical bridging element is used as a power management chip or integrated voltage regulator.

5. The electronic package as described in claim 1, wherein, The electrical bridging element further includes a semiconductor substrate having a plurality of conductive vias, such that the wiring portion is formed on the semiconductor substrate and electrically connected to the plurality of conductive vias.

6. A method for manufacturing an electronic package, comprising: An electrical bridging element with a wiring portion is provided, wherein the wiring portion includes a magnetic layer and a coil inductor formed on the magnetic layer, and the coil inductor has a first inductor segment and a second inductor segment respectively disposed on opposite sides of the magnetic layer, such that the first inductor segment and the second inductor segment are interconnected by a plurality of inductor pillars to form the coil inductor around the magnetic layer; the electrical bridging element is combined to one side of a circuit structure and electrically connected to the circuit structure; and a plurality of electronic components are combined to the other side of the circuit structure and electrically connected to the circuit structure, such that the plurality of electronic components are electrically connected to the electrical bridging element through the circuit structure.

7. The method for manufacturing an electronic package as described in claim 6, wherein, An intermediary element is provided on one side of the circuit structure, so that the plurality of electronic components are electrically connected to the intermediary element through the circuit structure.

8. The method for manufacturing an electronic package as described in claim 7, wherein, The intermediate element has multiple through-holes.

9. The method for manufacturing an electronic package as described in claim 6, wherein, This electrical bridging element is used as a power management chip or integrated voltage regulator.

10. The method for manufacturing an electronic package as described in claim 6, wherein, The electrical bridging element further includes a semiconductor substrate having a plurality of conductive vias, such that the wiring portion is formed on the semiconductor substrate and electrically connected to the plurality of conductive vias.

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