Substrate pressing apparatus and substrate planarization method

Abstract

A substrate pressing apparatus is provided for pressing multiple substrates. The substrate pressing apparatus includes a fixed frame and a pressing module. The fixed frame includes multiple vertically spaced fixed plates suitable for placing the substrates. The pressing module includes a movable frame movable relative to the fixed frame and multiple elastic pressing units. The movable frame includes multiple vertically spaced movable plates, and the elastic pressing units are respectively disposed on the movable plates. The fixed plates and the movable plates are staggered, and the movable plates can move towards the fixed plates, so that the elastic pressing units and the fixed plates jointly clamp and flatten the substrates.

Claims

1. A substrate pressing apparatus suitable for pressing multiple substrates, the substrate pressing apparatus comprising: a fixed frame including a plurality of fixed plates spaced vertically for placing the substrates; and a pressing module including a movable frame movable relative to the fixed frame and a plurality of elastic pressing units, the movable frame including a plurality of movable plates spaced vertically, the elastic pressing units being respectively disposed on the movable plates, the fixed plates and the movable plates being staggered, the movable plates being movable toward the fixed plates, such that the elastic pressing units and the fixed plates jointly press and flatten the substrates; wherein... The pressing module also includes multiple pressing plates respectively disposed on the movable plate. Each elastic pressing unit has a pressing member that can move up and down relative to the pressing plate, multiple adsorption members that adsorb the movable plate, and an elastic member disposed between the pressing plate and the pressing member.

2. The substrate pressing apparatus as described in claim 1, wherein, These elastic pressing units are detachably mounted on these movable plates.

3. A substrate planarization method, applicable to pressing multiple substrates, comprising the following steps: placing multiple substrates respectively on multiple fixed plates of a fixed frame located in an oven; and moving multiple movable plates of a pressing module toward the fixed plates, such that multiple elastic pressing units disposed on the movable plates and the fixed plates jointly press and planarize the substrates; wherein, When the substrates are placed in the oven for a first predetermined time, the movable plates move toward the fixed plates to jointly press and flatten the substrates. When the substrates are placed in the oven for a second predetermined time, the movable plates move away from the fixed plates to release the substrates.

4. The substrate planarization method as described in claim 3, wherein, As the movable plates move toward the fixed plates to jointly press and flatten the substrates, the temperature inside the oven rises.

5. The substrate planarization method as described in claim 3, wherein, As the temperature inside the oven rises, the movable plates move toward the fixed plates to jointly press and flatten the substrates.

6. The substrate planarization method as described in claim 3, wherein, The temperature inside the oven is between 50°C and 450°C.

7. The substrate planarization method as described in claim 3, wherein, The downward pressure of these elastic compression units ranges from 0.1 kgw to 100 kgw.

8. A substrate planarization method, applicable to pressing multiple substrates, the substrate planarization method comprising the following steps: placing multiple substrates respectively on multiple fixed plates of a fixed frame located in an oven; and moving multiple movable plates of a pressing module toward the fixed plates respectively, so that multiple elastic pressing units disposed on the movable plates and the fixed plates jointly press and planarize the substrates; wherein, When the temperature inside the oven reaches a first preset temperature, the movable plates move toward the fixed plates to jointly press and flatten the substrates. When the temperature inside the oven reaches a second preset temperature, the movable plates move away from the fixed plates to release the substrates.

9. The substrate planarization method as described in claim 8, wherein, As the temperature inside the oven rises, the movable plates move toward the fixed plates to jointly press and flatten the substrates.

10. The substrate planarization method as described in claim 8, wherein, The temperature inside the oven is between 50°C and 450°C.

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