Electronic components

Abstract

The electronic component S100 includes a first electronic component 10 and an adapter 30 having a receiving portion 35 for receiving the first electronic component 10. The adapter 30 has: an adapter body 31 having a first surface 31a and a second surface 31b opposite to the first surface 31a in the thickness direction of the adapter 30; and a conductive post 38 that extends through the adapter body 31 from the first surface 31a to the second surface 31b, with the receiving portion 35 on the first surface 31a being formed as a recess, and a mounting portion P1 for mounting the second electronic component 20 being formed on the second surface 31b.

Description

[Technical Field]

[0001] This invention relates to an electronic component. [Previous Technology]

[0002] Previously, it was known that multiple electronic components were molded and encapsulated from resin (see, for example, Japanese Patent Application Publication No. 2018-018867). The molded electronic components are electrically connected to the circuit pattern of the substrate on which the electronic components are mounted via external terminals formed on the bottom surface of the electronic components. [Summary of the Invention]

[0003] [Problem to be Solved by the Invention] In the previous structure, since the molded electronic components are connected to the external circuit pattern through the external terminals of the electronic components, it is necessary to design the circuit structure inside the package or conduct performance evaluation each time the electronic components are developed, which is the reason for the long development period. On the other hand, in recent years there has been a demand for an electrical component that can handle high current and high voltage.

[0004] Therefore, the present invention has been made in view of these aspects, and its object is to provide an electrical component that can shorten the development period and cope with high current and high voltage. [Means for Solving the Problem]

[0005] An electronic component according to one aspect of the present invention for solving the aforementioned problem includes: a first electronic component; and an adapter having a receiving portion for receiving the first electronic component, the adapter having: an adapter body having a first surface and a second surface opposite to the first surface in the thickness direction of the adapter; and a conductive post penetrating the adapter body from the first surface to the second surface, wherein the receiving portion is formed as a recess on the first surface and a mounting portion for mounting a second electronic component is formed on the second surface.

[0006] The conductive post may include: a first conductive post; and a second conductive post disposed on the opposite side of the first conductive post across the receiving portion, wherein the second electronic component mounted on the mounting portion is electrically connected to the first conductive post and the second conductive post.

[0007] The conductive post may have: a first conductive post; and a second conductive post disposed on the opposite side of the first conductive post, separated by the receiving portion. The adapter body is divided into a plurality of constituent members, each of which has: a first member disposed of the first conductive post; and a second member disposed of the second conductive post. The first member has a first thick-walled portion serving as a location for the first conductive post and a first protruding portion extending from the first thick-walled portion toward the second member. The second member has a second thick-walled portion serving as a location for the second conductive post and a second protruding portion extending from the second thick-walled portion toward the first member. The first protruding portion and the second protruding portion extend to cover the first electronic component. In the assembled state of the electronic component, a gap is formed between the first protruding portion and the second protruding portion.

[0008] The gap may extend from one end face of the adapter body to the other end face, forming a heat dissipation passage that allows air to flow.

[0009] The heat dissipation passage may face a portion of the outer surface of the second electronic component.

[0010] The heat dissipation passage may be formed between the first protrusion and the second protrusion.

[0011] The adapter may further have at least one of a first protruding electrode portion and a second protruding electrode portion, wherein the first protruding electrode portion is formed protruding from the side of the first conductive post toward the second conductive post and is exposed on the second surface in the mounting portion, and the second protruding electrode portion is formed protruding from the side of the second conductive post toward the first conductive post and is exposed on the second surface in the mounting portion.

[0012] The adapter may have another mounting portion on the second side for mounting a third electronic component, the third electronic component having electrode portions at both ends, wherein the distance between the electrode portions is shorter than the distance between the electrode portions of the second electronic component.

[0013] Alternatively, it may further include a connecting electrode portion, which extends from the conductive post toward a side end face of the adapter body and is exposed on the side end face. [Effects of the Invention]

[0014] The present invention achieves the following effect: it can provide an electrical component that can shorten the development period and can cope with high current and high voltage.

Implementation Method

[0016] <First Embodiment> Figures 1(a) and 1(b) are diagrams showing the electronic components of the first embodiment. Figure 1(a) is a side view, and Figure 1(b) is a cross-sectional view at line AA of Figure 2(a). Figures 2(a) and 2(b) are diagrams showing the electronic components of Figures 1(a) and 1(b). Figure 2(a) is a plan view, and Figure 2(b) is a bottom view.

[0017] In the following description, terms indicating up, down, left, right, front, and back directions are used according to the orientation of the objects depicted in the drawings, but these terms are not intended to limit the invention. The up and down directions correspond to the thickness direction of the electronic components and adapters.

[0018] Electronic component S100 is a packaged component including a first electronic component 10, a second electronic component 20 and an adapter 30.

[0019] The first electronic component 10 is any electronic component; for example, in this embodiment, it is a dual-flat no-leads (DFN) type component. The first electronic component 10 is a structure formed by molding a semiconductor wafer with resin. For example, the first electronic component 10 is cuboid in shape, as shown in FIG2(b), having a quadrilateral outline shape when viewed from above. The first electronic component 10 is not limited to a specific thickness, but for example, it is 1 mm or less, specifically, for example, 0.7 mm or less. A plurality of terminals 11 are formed on the lower surface of the first electronic component 10.

[0020] Terminal 11 is formed of a conductive component and is electrically connected to the internal semiconductor wafer. Terminal 11 is exposed on the lower surface and side surface of the first electronic component 10. Terminal 11 is soldered to a predetermined printed circuit board, for example. Furthermore, in this embodiment, since the first electronic component 10 forms part of the shape of the electronic element S100, it can also be said that terminal 11 is exposed on the lower surface and side surface of the electronic element S100.

[0021] A second electronic component 20 is disposed on the upper surface of the adapter 30. The second electronic component 20 can be any electronic component such as an inductor, capacitor, resistor, or semiconductor element. In this embodiment, as an example, the second electronic component 20 is a coil (chip inductor). The second electronic component 20 has a main body 21 and a pair of electrodes 22. The application of the electronic component S100 is not particularly limited. By incorporating a semiconductor chip containing a transistor that switches current into the structure of the electronic component S100, a small DC-DC (Direct Current to Direct Current) converter can be constructed by mounting such a chip inductor.

[0022] The adapter 30 is a component used to fix the first electronic component 10 and the second electronic component 20. As an example, the adapter 30 has a cuboid or substantially cuboid shape. The adapter 30 has an adapter body 31 and conductive posts 38.

[0023] As shown in Figures 1(a), 1(b) and 2(a), 2(b), the adapter body 31 has a first surface 31a as the lower surface, a second surface 31b as the upper surface, a front surface 31c, a back surface 31d, a first side surface 31e, and a second side surface 31f. The second surface 31b is the surface opposite to the first surface 31a in the thickness direction of the adapter 30.

[0024] A receiving portion 35 is formed on the first surface 31a of the adapter 30. The receiving portion 35 is a portion that receives the first electronic component 10. Specifically, as shown in FIG1(b) and FIG2(b), the receiving portion 35 is a recess with a quadrilateral cross-sectional shape in the thickness direction of the electronic component S100 and extends in a straight line from the front surface 31c to the back surface 31d. As an example, the receiving portion 35 is formed to a depth such that the bottom surface of the first electronic component 10 does not protrude from the first surface 31a when the first electronic component 10 is disposed inside the recess.

[0025] The housing section 35 can be formed by any processing step. For example, it can be formed by cutting a slit on the first surface 31a of the adapter body 31 using a slicer.

[0026] In this embodiment, the receiving portion 35 is a recess connecting the front side 31c and the back side 31d. However, the receiving portion 35 may not be exposed on the side of the adapter 30. The receiving portion 35 may also be a recess that is engraved from the first surface 31a along the thickness direction of the adapter 30 and is not exposed on any of the front side 31c, back side 31d, first side side 31e, and second side side 31f of the adapter body 31. The method of forming such a recess is arbitrary, but for example, the recess may be formed by a mold or by machining such as an end mill.

[0027] As shown in FIG1(b), a mounting portion P1 for mounting the second electronic component 20 is formed on the second surface 31b. The mounting portion P1 includes the area where the second electronic component 20 is placed and the upper surface of the two conductive pillars 38.

[0028] The conductive post 38 is a conductive component that passes through the adapter body 31. The conductive post 38 is, for example, made of copper. In this embodiment, a first conductive post 38-1 and a second conductive post 38-2 are provided as the conductive post 38. The first conductive post 38-1 is located on the left side of Figures 1(a) and 1(b), and the second conductive post 38-2 is located on the right side of Figures 1(a) and 1(b), that is, on the opposite side of the first conductive post 38-1, separated by the receiving portion 35. Since the first conductive post 38-1 and the second conductive post 38-2 have the same structure, they will not be distinguished below, and will only be described as conductive posts 38.

[0029] The conductive post 38 is formed to pass through the first surface 31a to the second surface 31b of the adapter body 31. The upper surface of the conductive post 38 is exposed on the second surface 31b, and the lower surface of the conductive post 38 is exposed on the first surface 31a. The upper surface of the conductive post 38 functions as a connecting plate for mounting the second electronic component 20. The lower surface of the conductive post 38 is electrically connected to the circuit pattern of a predetermined substrate.

[0030] In this embodiment, each electrode 22 of the second electronic component 20 is electrically connected to each conductive post 38. The electrical connection between the electrode 22 and the conductive post 38 can be made by any means, but in this embodiment, it is for example, solder.

[0031] The horizontal cross-sectional shape (cross-sectional shape) of the conductive column 38 can be any shape such as quadrilateral, polygon, or circle, but in this example it is a quadrilateral.

[0032] As can be understood from Figures 2(a) and 2(b), the conductive post 38 is embedded inside the adapter body 31. The conductive post 38 is not exposed on any of the front side 31c, back side 31d, first side side 31e, and second side side 31f. By not exposing the conductive post 38 on the side of the electronic component S100, the signal flowing in the conductive post 38 is unlikely to appear on the side of the electronic component S100. Therefore, even if other electronic components are arranged near the electronic component S100, the impact of the current flowing in the conductive post 38 on the other electronic components S100 is reduced. According to this structure, there is an advantage that the device in which the electronic component S100 is installed can be miniaturized.

[0033] The cross-sectional area of ​​the conductive post 38 in the horizontal direction, that is, in the direction parallel to the first surface 31a or the second surface 31b (for example, see Figure 2(b)), is relatively large. Furthermore, as an example, the cross-sectional area of ​​the conductive post 38 in the horizontal direction is at least 5% of the area of ​​the adapter body 31 in a top view, preferably at least 10%. The front-rear dimension of the conductive post 38 is, for example, at least 1 / 4 of the front-rear dimension of the adapter body 31, preferably at least 1 / 3. The left-right dimension (width direction) of the conductive post 38 is, for example, at least 1 / 10 of the left-right dimension (width) of the adapter body 31. With this structure, because the cross-sectional area of ​​the conductive post 38 is large, the current capacity of the conductive post 38 is large, thus enabling the installation of a second electronic component 20 carrying a large current on the adapter 30. In addition, because the thermal conductivity of the conductive post 38 is higher than that of the resin material, the conductive post 38 functions as a heat dissipation component, effectively dissipating heat from the electronic component S100. In this embodiment, with the electronic component S100 assembled, the upper surface of the conductive post 38 is partially exposed on the upper surface of the adapter 30, thus effectively dissipating heat. Furthermore, the heat from the conductive post 38 can also be released to the outside of the component via the pattern of the substrate on which the electronic component S100 is mounted.

[0034] From the viewpoint that a large current can flow through the conductive post 38, it is preferable that the area of ​​the conductive post 38 in the horizontal direction is formed to be large as described above, but the present invention is not limited thereto, and the cross-sectional area of ​​the conductive post 38 in the horizontal direction may also be smaller than the range described above.

[0035] (Function of electronic component S100) In the electronic component S100 configured as described above, the lower surface of the conductive post 38 and the plurality of terminals 11 function as external terminals of the electronic component S100. That is, the electronic component S100 is mounted on the specified substrate by electrically connecting the lower surface of the conductive post 38 and the plurality of terminals 11 to the circuit pattern of the specified substrate.

[0036] (Effects of Electronic Component S100) According to the electronic component S100 of this embodiment, the terminals 11 of the first electronic component 10 housed in the housing portion 35 of the adapter body 31 can be directly used as external terminals of the electronic component S100. Therefore, it is not necessary to manufacture a connection circuit for connecting the first electronic component 10 and the external terminals of the electronic component S100 as in the previous structure with molded electronic components. Therefore, for example, existing first electronic component 10 can be used directly, thus shortening the development period of the electronic component S100.

[0037] Furthermore, according to the structure of this embodiment, since the cross-sectional area (referred to as the cross-sectional area in the horizontal direction) of the conductive post 38 is large, the structure in which the second electronic component 20 is electrically connected to the first conductive post 38-1 and the second conductive post 38-2 can accommodate the second electronic component 20 with high current and high withstand voltage. In addition, the thermal conductivity of the conductive post 38 is higher than that of the resin material. In particular, in this embodiment, the upper surface of the conductive post 38 is exposed on the second surface 31b of the adapter 30, so the heat of the electronic component S100 can be effectively dissipated.

[0038] Furthermore, in the structure of this embodiment, the receiving portion 35 is formed to extend from the front side 31c to the back side 31d. According to this structure, there is an advantage that the receiving portion 35, which is a recess, can be easily formed by processing with a slicing machine or the like.

[0039] Furthermore, in the description, a structure in which multiple terminals 11 are exposed on the lower surface of the first electronic component 10 is illustrated, but the terminals of the first electronic component 10 do not necessarily need to be exposed on the lower surface.

[0040] <Second Embodiment> The structure of the first embodiment requires that the width of the housing 35 be appropriately changed according to the size of the first electronic component 10 housed in the housing 35 (specifically, it is necessary to design a housing component with a corresponding shape for the size of each mounted electronic component). Therefore, the electronic component of one embodiment of the present invention can be configured as follows so as to correspond to the size of various first electronic components 10.

[0041] Figure 3 is a diagram showing the electronic component of the second embodiment. Figure 4 is a diagram showing the state after disassembling the electronic component of Figure 3.

[0042] Electronic component S101 includes a first electronic component 10, a second electronic component 20, and an adapter 130. The adapter 130 has a different structure from the adapter 30 of the first embodiment. Otherwise, electronic component S101 has the same structure as electronic component S100 of the first embodiment.

[0043] The adapter 130 includes a first adapter body 131-1, a first conductive post 38-1, a second adapter body 131-2, and a second conductive post 38-2. The adapter 130 is divided into multiple constituent components. Since the first adapter body 131-1 and the second adapter body 131-2 are symmetrical in shape, the following description will take the first adapter body 131-1 as an example.

[0044] The first adapter body 131-1 is the first component constituting the adapter body 131, having a first thick-walled portion 132-1 and a first protruding portion 133-1.

[0045] The first thick-walled portion 132-1 is the part where the first conductive post 38-1 is provided. In the adapter body 31 of the first embodiment, the first thick-walled portion 132-1 corresponds to the part of the adapter body 31 that is adjacent to the side of the receiving portion 35.

[0046] In the adapter body 31 of the first embodiment, the first protrusion 133-1 corresponds to a portion above the receiving portion 35 in the adapter body 31. The first protrusion 133-1 extends horizontally from the upper end of the first thick-walled portion 132-1 toward the second adapter body 131-2. The first protrusion 133-1 partially covers the upper surface of the first electronic component 10.

[0047] The second adapter body 131-2 is also constructed in the same way as the first adapter body 131-1. The second adapter body 131-2 is a second component constituting the adapter body 131, and has a second thick-walled portion 132-2 and a second protrusion portion 133-2.

[0048] Although it is the same as the first adapter body 131-1, the second thick-walled portion 132-2 is the part for the second conductive post 38-2 to be installed. The second protrusion 133-2 extends from the second thick-walled portion 132-2 toward the first adapter body 131-1.

[0049] As can be understood from FIG3, the first protrusion 133-1 and the second protrusion 133-2 extend in a manner that covers the first electronic component 10, and a gap Sa is formed between the first protrusion 133-1 and the second protrusion 133-2 in the assembled state of the electronic component S101. That is, the front end of the first protrusion 133-1 and the front end of the second protrusion 133-2 do not contact each other, and a gap Sa is formed between them.

[0050] As an example, the upper surface of the first electronic component 10 is fixed to the first protrusion 133-1 and the second protrusion 133-2. For fixing, an adhesive can be used.

[0051] The gap Sa extends from one end face (front face 31c of the adapter body 31) to the other end face (back face 31d of the adapter body 31). That is, the gap Sa forms a heat dissipation path through which air can flow from one end face of the adapter body 131 to the other end face. The gap Sa extends toward a portion of the outer surface (upper surface) of the first electronic component 10. The gap Sa also extends toward a portion of the outer surface (lower surface) of the second electronic component 20. In this embodiment, the gap Sa is provided in such a way that a heat dissipation path is formed to allow heat from the first electronic component 10 and / or the second electronic component 20 to be released, thus allowing for good heat dissipation when the electronic component 101 is in operation.

[0052] Referring to FIG4, the manufacturing of electronic component S101 will be briefly described. The first adapter body 131-1 and the second adapter body 131-2 can be manufactured, for example, by cutting off the thin-walled portion (the portion above the receiving portion 35) of the adapter body 31 in the first embodiment. As shown in FIG4, the first adapter body 131-1 and the second adapter body 131-2 are arranged such that the first electronic component 10 is sandwiched between the two sides. With the first electronic component 10 fixed to the inside of the first adapter body 131-1 and the second adapter body 131-2, the second electronic component 20 is disposed on the upper surface of the first adapter body 131-1 and the second adapter body 131-2. Then, electronic component S101 is manufactured by electrically connecting each electrode 22 of the second electronic component 20 to each conductive post 38.

[0053] In the second embodiment, since the first electronic component 10 is fixed to each component by being sandwiched between the first adapter body 131-1 and the second adapter body 131-2, the first electronic component 10 of various sizes can be well installed in the adapter 130. Therefore, it is not necessary to prepare multiple adapters 130 with different shapes of receiving parts 35.

[0054] According to the structure of this embodiment, in the assembled state of the electronic component S100, a gap Sa is formed between the first protrusion 133-1 and the second protrusion 133-2. Since the gap Sa functions as a heat dissipation passage, the heat generated during the operation of the electronic component S101 can be effectively released. When the gap Sa is formed in such a way that it extends from the front to the back of the adapter 130, that is, when the end of the heat dissipation passage is exposed on both the front and back of the adapter 130, heat dissipation can be particularly effective through the end of the heat dissipation passage. Heat dissipation can be efficiently achieved by allowing air to flow in the gap Sa.

[0055] In addition, since air is present in the gap Sa, compared with a structure in which the thin-walled portion of the adapter member, which is made of resin, is adjacent to each other, the structure also has the effect of suppressing the transfer of heat from one of the first electronic component 10 and the second electronic component 20 to the other.

[0056] Furthermore, the effect of the gap Sa has been explained above, but in the second embodiment, its main feature is that the first electronic component 10 is sandwiched between a pair of adapter bodies 131, and the gap Sa is not necessarily a void. For example, the gap Sa can be filled with adhesive or other materials.

[0057] <Third Embodiment> In the adapter of the electronic component of the present invention, second electronic components 20 of various sizes can be installed. As described above, the cross-sectional area of ​​the conductive post 38 in the horizontal direction is relatively large, and the width dimension (the dimension in the left-right direction of FIG. 1(a) and FIG. 1(b)) is also long. Therefore, even with the structure of the first embodiment and the second embodiment, second electronic components 20 of a certain size can be installed. However, the electronic component can be configured as follows so that more second electronic components 20 of various sizes can be installed.

[0058] Figures 5(a) and 5(b) are diagrams showing the electronic component of the third embodiment. Figure 5(a) is a cross-sectional view, and Figure 5(b) is a plan view showing the state in which the second electronic component 20 is omitted. The electronic component S102 has a similar basic structure to the electronic component S100 of the first embodiment, but differs in that it has a protruding electrode portion 39.

[0059] In this example, a first protruding electrode 39-1 and a second protruding electrode 39-2 are provided as the protruding electrode portion 39. The first protruding electrode 39-1 is formed such that it protrudes from the first conductive post 38-1 toward the second conductive post 38-2. Specifically, the first protruding electrode 39-1 is formed such that it extends to the area above the first electronic component 10. The first protruding electrode 39-1 is exposed on the second surface 31b of the adapter in the mounting portion for mounting the second electronic component 20. Similarly, the second protruding electrode 39-2 also protrudes from the second conductive post 38-2 toward the first conductive post 38-1, and its upper surface is exposed on the second surface 31b.

[0060] According to this structure, by forming the protruding electrode portion 39, not only the upper surface of the conductive post 38, but also the upper surface of the protruding electrode portion 39 becomes a connecting plate that can be used to connect the electrodes of the second electronic component. Therefore, the area of ​​the connecting plate is increased, and the effect of being able to install second electronic components of various sizes can be obtained.

[0061] In addition, the protruding electrode portion 39, which is made of conductive material, can also function as a shielding member relative to the first electronic component 10. Therefore, according to this structure, it is also expected that the effect of reducing the mutual influence between electronic components caused by electromagnetic wave leakage can be reduced.

[0062] Furthermore, in the above description, a structure having both a first protruding electrode 39-1 and a second protruding electrode 39-2 is shown, but either one may also be formed.

[0063] Figure 6 is a diagram showing a modified example of the third embodiment. As shown in Figure 6, the structure can be applied to the same structure as the second embodiment in which the void Sa is formed.

[0064] <Fourth Embodiment> In the electronic component of the present invention, in addition to mounting the first electronic component 10 and the second electronic component 20, one or more third electronic components may also be mounted. Figures 7(a) and 7(b) are diagrams showing the electronic component of the fourth embodiment. Figure 8 is a cross-sectional view at line BB of Figure 7(a).

[0065] Electronic component S103 includes a first electronic component 10, a second electronic component 20, a third electronic component 50, and an adapter 230. Except for the aspect where the third electronic component 50 is provided, and the aspect where the structure electrically connected to the third electronic component 50 is provided in the adapter 230, the basic structure is the same as in the first embodiment, therefore repeated descriptions are omitted. Furthermore, an example with a basic structure common to the first embodiment is described here, but the structure where the third electronic component 50 is provided can also be combined with the structure of the second embodiment, for example.

[0066] In this example, two third electronic components 50 are provided: third electronic component 50-1 and third electronic component 50-2. Since third electronic component 50-1 and third electronic component 50-2 have the same structure, third electronic component 50-1 will be described below. As an example, the third electronic component 50 is a smaller electronic component (meaning smaller in size or smaller in top view) than the first electronic component 10 and the second electronic component 20. The third electronic component 50 can be any electronic component, such as a chip capacitor. Electrode portions are provided at both ends of the third electronic component 50. The distance between the electrode portions of the third electronic component 50 is shorter than the distance between the electrode portions of the second electronic component 20.

[0067] As shown in FIG7(a), the adapter 230 has a mounting portion P2 for mounting the third electronic component 50. The mounting portion P2 is provided on the upper surface (second surface) of the adapter 230. In the structures of FIG7(a) and FIG7(b), one mounting portion P2 is provided on the front side and one on the back side of the adapter 230, but the present invention is not limited thereto.

[0068] Furthermore, as shown in FIG7(a), FIG7(b) and FIG8, a conductive member 240 connected to the third electronic component 50 is formed in the adapter 230. Specifically, a first conductive member 240-1 and a second conductive member 240-2 are provided as the conductive member 240. Since the first conductive member 240-1 and the second conductive member 240-2 have the same structure, the following description will take the first conductive member 240-1 as an example.

[0069] As shown in FIG8, the first conductive member 240-1 has a through electrode portion 245 and a protruding electrode portion 246. The material of the first conductive member 240-1 is, for example, copper.

[0070] The through electrode portion 245 is formed in the same manner as the conductive post 38, penetrating the adapter 230 along its thickness direction. The upper surface of the through electrode portion 245 is exposed on the upper surface of the adapter 230, and the lower surface of the through electrode portion 245 is exposed on the lower surface of the adapter 230.

[0071] The protruding electrode portion 246 is an electrode that extends from the upper end of the through electrode portion 245 toward the second conductive member 240-2. The upper surface of the protruding electrode portion 246 is exposed on the upper surface of the adapter 230. The protruding electrode portion 246 of the second conductive member 240-2 is also constructed in the same manner. A third electronic component 50 is mounted on the pair of protruding electrode portions 246 thus formed. The electrode portions at the ends of the third electronic component 50 are electrically connected to the protruding electrode portions 246 respectively.

[0072] As described above, based on the modular structure of the first electronic component 10, the second electronic component 20 and the third electronic component 50, the electronic component S100 can be further enhanced in functionality.

[0073] Figures 9(a) and 9(b) are diagrams showing electronic components of modified examples of the present invention. The electrical components [electronic components] in Figures 9(a) and 9(b) are examples in which electrodes are provided near the conductive pillars 38 of the electronic component S100 in Figures 1(a) and 1(b). As shown in Figure 9(a), an electronic component of one embodiment of the present invention may have a connecting electrode portion 41.

[0074] The connecting electrode part 41 is an electrode part provided inside the adapter 30. In the examples of FIG9(a) and FIG9(b), the connecting electrode part 41 is provided with a first connecting electrode part 41-1 and a second connecting electrode part 41-2, but since they have the same structure, the first connecting electrode part 41-1 will be used as an example for the following description.

[0075] The first connecting electrode portion 41-1 is disposed on the lower side of the conductive post 38 and extends from the first conductive post 38-1 toward the side end face (first side face 31e) of the adapter body 31. The end face of the first connecting electrode portion 41-1 is exposed on the first side face 31e.

[0076] Similarly, the second connecting electrode portion 41-2 extends from the second conductive post 38-2 toward the second side surface 31f. The end face of the second connecting electrode portion 41-2 is exposed on the second side surface 31f.

[0077] According to this structure, since the connecting electrode part 41 can be used as an external connection terminal of the electronic component, it is easy to electrically connect the electronic component to other components or circuit patterns.

[0078] The connecting electrode portion 41 may also be provided in a position similar to that in FIG9(b) instead of that in FIG9(a). Specifically, in the electronic component of FIG9(b), the connecting electrode portion 41 is provided at the middle position in the height direction of the conductive pillar 38. The connecting electrode portion 41 is exposed on the first side 31e, but not on either the first side 31a or the second side 31b. That is, it is in a state where the resin component of the adapter 30 is present above and below the connecting electrode portion 41.

[0079] According to this structure, the following effect can be achieved. That is, in the structure shown in FIG9(a), when manufacturing electronic components (specifically, when cutting the adapter 30 from the specified component), burrs may be generated on the component of the connecting electrode portion 41. Specifically, when the adapter 30 is to be cut from the upper surface to the lower surface, for example, using a slicer, the connecting electrode portion 41, which is made of copper or the like, cannot be cleanly removed, and burrs may be generated at the lower end of the connecting electrode portion 41.

[0080] In contrast, as shown in FIG9(b), the structure in FIG9(a) is advantageous in that the connecting electrode portion 41 is located at the middle position in the height direction of the conductive pillar 38, and the upper and lower parts of the connecting electrode portion 41 are sandwiched by the molding material, which is less likely to produce burrs compared to the structure in FIG9(b). In addition, for example, it is less likely to produce a state where burrs protrude downward from the lower surface of the component, and it is also less likely to produce a problem where the component floats off the mounting surface when the component is mounted.

[0081] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the embodiments, and various modifications and alterations can be made within its scope. For example, all or part of the device can be configured by functionally or physically dispersing or integrating any unit. In addition, new embodiments generated by any combination of multiple embodiments are also included in the embodiments of the present invention. The effects of the new embodiments generated by the combination also have the effects of the original embodiments. [Simplified Explanation of the Diagram]

[0015] Figures 1(a) and 1(b) are diagrams showing the electronic component of the first embodiment. Figures 2(a) and 2(b) are diagrams showing the electronic component of Figures 1(a) and 1(b). Figure 3 is a diagram showing the electronic component of the second embodiment. Figure 4 is a diagram showing the exploded state of the electronic component of Figure 3. Figures 5(a) and 5(b) are diagrams showing the electronic component of the third embodiment. Figure 6 is a diagram showing a modified example of the third embodiment. Figures 7(a) and 7(b) are diagrams showing the electronic component of the fourth embodiment. Figure 8 is a cross-sectional view at line BB in Figure 7(a). Figures 9(a) and 9(b) are diagrams showing the electronic component of a modified example of the present invention.

Claims

1. An electronic component, comprising: First electronic components; The adapter includes an adapter body having a receiving portion for housing the first electronic component. The adapter comprises: an adapter body having a first surface and a second surface opposite to the first surface in the thickness direction of the adapter; and a conductive post penetrating the adapter body from the first surface to the second surface. The receiving portion on the first surface is formed as a recess, and the second surface has a mounting portion for mounting the second electronic component. The conductive post comprises: a first conductive post through which current flows; and a second conductive post disposed opposite to the first conductive post across the receiving portion, through which current flows. The second electronic component mounted on the mounting portion is electrically connected to both the first and second conductive posts. The adapter further comprises: A first protruding electrode portion is formed protruding from the side of the first conductive post toward the second conductive post and exposed on the second surface in the mounting portion, which can be connected to one of the electrodes of the pair of electrodes of the second electronic component; and a second protruding electrode portion is formed protruding from the side of the second conductive post toward the first conductive post and exposed on the second surface in the mounting portion, which can be connected to the other electrode of the pair of electrodes of the second electronic component.

2. The electronic component as claimed in claim 1, wherein, The first protruding electrode portion or the second protruding electrode portion is formed in such a way that it extends to the area above the first electronic component.

3. The electronic component as claimed in claim 1 or 2, wherein, When the electronic component is viewed in planar view, if the side with the first conductive post is designated as left, the side with the second conductive post is designated as right, and the direction intersecting the left and right directions is designated as the front-back direction, the length of the first protruding electrode portion in the front-back direction is the same as the length of the first conductive post in the front-back direction, or the length of the second protruding electrode portion in the front-back direction is the same as the length of the second conductive post in the front-back direction.

4. The electronic component as claimed in claim 1 or 2, wherein, The adapter body is divided into multiple constituent members, each having: a first conductive post; and a second conductive post disposed on the opposite side of the first conductive post, separated by the receiving portion. Each constituent member has: a first member having the first conductive post; and a second member having the second conductive post. The first member has a first thick-walled portion serving as a location for the first conductive post, and a first protruding portion extending from the first thick-walled portion toward the second member. The second member has a second thick-walled portion serving as a location for the second conductive post, and a second protruding portion extending from the second thick-walled portion toward the first member. The first and second protruding portions extend to cover the first electronic component, and a gap is formed between the first and second protruding portions in the assembled state of the electronic component.

5. The electronic component as claimed in claim 3, wherein, The gap extends from one end face of the adapter body to the other end face, forming a heat dissipation path that allows airflow.

6. The electronic component as claimed in claim 5, wherein, The heat dissipation path faces a portion of the outer surface of the second electronic component.

7. The electronic component as claimed in claim 4, wherein, The heat dissipation passage is formed between the first protrusion and the second protrusion.

8. The electronic component as claimed in claim 1 or 2, wherein, The adapter has another mounting portion on its second side for mounting a third electronic component, which has electrode portions at both ends, wherein the distance between the electrode portions is shorter than the distance between the electrode portions of the second electronic component.

9. The electronic component as claimed in claim 1 or 2, further comprising a connection electrode portion extending from the conductive post toward a side end face of the adapter body and exposed on the side end face.

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