Insert module for test handler and test tray comprising the same

Abstract

This invention provides an insertion module for a test tray. The insertion module includes: a spacing adjuster configured to mount electronic components thereon, comprising a first side electrically connected to connection pins of the electronic components and a second side provided with electrical contact devices, the second spacing of which is wider than the first spacing of the connection pins; and a retainer configured to hold the mounted electronic components. According to the invention, the insertion module for the test tray and the test tray including the insertion module can achieve accurate contact corresponding to the fine spacing of the electronic components and maintain precise contact during testing, thereby improving the accuracy of the test.

Description

[Technical Field]

[0001] The present invention relates to an insertion module for a test tray and a test tray containing the insertion module, and more specifically, to an insertion module capable of testing electronic components with fine pitch and a test tray containing the insertion module. [Previous Technology]

[0002] As one of the major modern technologies, high bandwidth memory (HBM) originates from the increased memory bandwidth required for high-performance applications of computers and graphics processing units.

[0003] Conventional graphics double data rate (GDDR) memory technology is widely used in high-performance graphics cards and systems, but it has reached its limits due to the need for increased bandwidth. Therefore, memory manufacturers need to provide new technologies that offer higher bandwidth and more efficient data processing.

[0004] To meet this demand, HBM employs an innovative design that forms a stack of memory chips. HBM uses vertically stacked memory chips to achieve high bandwidth and provides the advantages of reduced power consumption while occupying less space. Due to these characteristics, HBM has gained attention as memory bandwidth and power efficiency become increasingly important in high-performance computing and graphics processing systems.

[0005] HBM needs to be tested in its die state before packaging. Compared to conventional memory, HBM dies have more contacts, and many of these contacts are set with fine pitch within a limited area. However, the problem with conventional test handlers is that it is difficult to test HBM through these fine-pitch contacts.

[0006] Prior Art Documents Patent Document 1: Korean Patent Publication No. 10-2021-0148743 [Summary of the Invention]

[0007] One aspect of the present invention provides an insertion module for a test tray and a test tray containing the insertion module, which can quickly and accurately test conventional semiconductors with fine pitch.

[0008] According to the present invention, an insertion module is provided for testing a tray. The insertion module includes: a spacing adjuster configured to place at least one electronic component thereon, and including a first side electrically connected to a connection pin of the electronic component and a second side provided with electrical contact devices, the second spacing of the electrical contact devices being wider than the first spacing of the connection pins; and a retainer configured to retain the placed electronic component.

[0009] Here, the electronic component can be a high-bandwidth memory.

[0010] In addition, the pitch adjuster can be configured to be electrically connected to the connection pin at multiple locations.

[0011] In addition, the first spacing can be less than 0.5 mm.

[0012] In addition, the second spacing can be 2 to 10 times the first spacing.

[0013] In addition, the pitch adjuster may include: a plurality of first pins arranged at a first pitch; and a plurality of second pins arranged at a second pitch.

[0014] In addition, the width of the first pin can be less than 0.2 mm.

[0015] In addition, the diameter of the second pin can be from 0.3 mm to 3 mm.

[0016] In addition, the pitch adjuster may also include a pitch adjustment block disposed between the first pin and the second pin, and the pitch adjustment block may include a plurality of connectors electrically connected to the first pin and the second pin respectively.

[0017] In addition, the spacing adjustment block may include a plurality of conductors, at least a portion of which may be set at a certain angle.

[0018] In addition, the holder may include: an upper block having a hole formed in its center to allow electronic components to pass through the upper block; and a lower block having a pitch adjuster disposed in its center.

[0019] In addition, the retainer may also include a latching connector having a first side rotatably connected to the upper block and a second side rotatably connected to the lower block.

[0020] In addition, the latching connector can be configured to pivot upward as the upper block moves closer to the lower block.

[0021] In addition, the latch connector may also include a latch unit, and the latch unit may have a first side rotatably connected to the upper block and a second side including a push block configured to press the upper part of the electronic component.

[0022] In addition, the insertion module may also include at least one elastic unit, which is disposed between the upper block and the lower block and provides a restoring force to return the upper block to its initial position.

[0023] In addition, the push block may also include a thermal pad disposed at its end for contact with electronic components.

[0024] According to an embodiment of the present invention, a test tray is provided for electronic components, comprising: a board including a lower portion configured to be electrically connected to a tester; an insertion module configured to hold an electronic component loaded therein during testing; and a base frame configured to arrange a plurality of insertion modules thereon, the insertion modules including a spacing adjuster and a retainer, the spacing adjuster being configured to place an electronic component thereon and including a first side electrically connected to a connection pin of the electronic component and a second side provided with electrical contact devices, the second spacing of the electrical contact devices being wider than the first spacing of the connection pins, the spacing adjuster being configured to hold the placed electronic component.

[0025] Here, a plurality of sub-trays may be arranged on the plate.

[0026] In addition, the sub-tray can be detachably configured in the plate.

Implementation Method

[0028] The insertion module for a test tray according to an embodiment of the present invention and the test tray including the insertion module will now be described in detail with reference to the accompanying drawings. In the following description, the names of the components used may be referred to by other names in the art. However, in alternative embodiments, if these components are functionally similar or identical to each other, these components may be considered equivalent components. Furthermore, component symbols are given only for ease of description. However, the components represented by component symbols in the drawings are not limited to the component symbols shown in the drawings. Similarly, if components are functionally similar or identical to each other, these components may be considered equivalent components even if they are partially modified in the drawings according to alternative embodiments. Furthermore, components that are considered to be included by those skilled in the art will not be described. Additionally, descriptions of components will be omitted if inclusion is obvious to those skilled in the art.

[0029] The test tray including the insertion module for testing a sorting machine according to an embodiment of the present invention will be described below with reference to Figures 1 and 2.

[0030] FIG1 is a perspective view of a test tray for electronic components according to an embodiment of the present invention; FIG2 is an exploded perspective view of a sub-tray according to an embodiment of the present invention.

[0031] Referring to Figures 1 and 2, according to an embodiment of the present invention, a test sorting machine for electronic components is configured to be transported together with a plurality of electronic components loaded into an insertion module 100. Furthermore, the test sorting machine is configured to perform tests while the electronic components are loaded into the insertion module 100. The tests can be performed by a device called a "sorting machine," which tests the performance of the electronic components under specific temperature conditions and classifies the electronic components based on their performance.

[0032] According to an embodiment of the present invention, the test tray 1 for electronic components may include an insertion module 100 and a board 13.

[0033] The insertion module 100 can be configured to be arranged on the plate 13. The insertion module can be attached to the plate at a location given by the frame. The plate is configured for electrical connection between the insertion module and the external tester head. The plate may include predetermined circuitry. For example, when the test tray is transported to the test site and operated to connect with the tester, the underside of the plate can make electrical contact with the interposer of the external tester head.

[0034] For example, the insertion module may be disposed in a plurality of sub-trays 10, and the plurality of sub-trays 10 may be disposed on the test tray 1. The plurality of sub-trays 10 may be detachably disposed in the tray.

[0035] In this configuration, the sub-trays can be detachably mounted on the upper side of the board. In other words, one or more sub-trays 10 can be tested while attached to the board, as needed. Furthermore, the test tray 1 can remain in a separate position, and only the sub-trays 10 can be moved to the location for loading or unloading electronic components. The sub-trays 10 can be attached to the board after loading the electronic components to be tested, or they can be detached from the board and transported separately to unload the tested electronic components. In this case, well-known optional fastening elements can be used to attach and detach the sub-trays 10 from the board.

[0036] The sub-tray 10 may include a first base frame 11 and a second base frame 12, which form a space with a predetermined pattern. The first base frame 11 and the second base frame 12 are joined in the vertical direction and configured to engage with a predetermined number of insertion modules. Each insertion module 100 may be loaded with electronic components. The loaded electronic components may be in electrical contact with the insertion module 100. Each insertion module 100 may be electrically connected to the board 13. Finally, the electronic components may be electrically connected to the tester through the insertion module 100 and the board 13.

[0037] However, the aforementioned configuration of the sub-tray can be applied optionally. For example, the sub-tray can be omitted, and the shapes of the first base frame and the second base frame can be changed so that a plurality of insertion modules can directly contact the plate.

[0038] In addition, the sub-tray itself can change shape to serve as a test tray.

[0039] In this case, the fastening elements used for joining and separating the sub-tray 10 from the plate can also be omitted. In other words, the test tray may include an insertion module, a frame, and a plate.

[0040] The insertion module 100 is configured to reliably fix the position of the electronic components when the test tray 1 is transported or tested. In this case, when the electronic components are fixed to the insertion module 100, the contact terminals of the electronic components can be connected to the electrical contact devices of the insertion module 100 respectively.

[0041] Furthermore, the contact terminals of the "electronic component" according to the present invention can be precisely arranged, that is, arranged with "fine pitch". According to the present invention, the electronic component can be a memory semiconductor. In particular, the electronic component according to the present invention can be a high-bandwidth memory whose contact terminals have fine pitch.

[0042] The insertion module 100 and its operation according to an alternative embodiment of the present invention will be described below with reference to Figures 3 to 8H.

[0043] FIG3 is a perspective view of an insertion module 100 for an electronic component 100 according to an alternative embodiment of the present invention; FIG4 is an exploded perspective view of an insertion module 100 for an electronic component according to an alternative embodiment of the present invention.

[0044] Referring to Figures 3 and 4, according to an alternative embodiment of the present invention, an insertion module 100 for electronic components can be configured to load and selectively hold electronic components therein.

[0045] When in contact with the tester, the finely arranged contact terminals of the electronic components may place an unnecessary burden on alignment. Furthermore, the sorter simultaneously tests the effective operation of the electronic components. In this situation, accurately aligning multiple electronic components and simultaneously connecting them to the tester would take a significant amount of time and increase the complexity of the equipment.

[0046] According to the present invention, the insertion module 100 may include contact devices whose spacing is expanded to be greater than the spacing of the contact terminals of the loaded electronic components. According to the present invention, the insertion module 100 is arranged to be wider than the electronic components fixed thereto and includes strong contact devices to facilitate connection with a tester.

[0047] According to the present invention, the insertion module 100 may include a retainer 300 and a spacing adjuster 200.

[0048] The retainer 300 and the pitch adjuster 200 are configured to engage with each other in the vertical direction. The retainer 300 and the pitch adjuster 200 can engage with each other to form a slot. The slot can hold an electronic component. The retainer 300 may include a hole formed at its center in the vertical direction, through which the electronic component can be loaded or unloaded. Furthermore, the pitch adjuster 200 may be disposed below the hole.

[0049] The retainer 300 may include an upper block 310, a lower block 320, a latching connector 330, and an elastic unit 340. The upper block 310 and the lower block 320 may be combined to reciprocate a predetermined length in the vertical direction.

[0050] The latch connector 330 may be configured to have a pivot angle that is adjustable according to the distance between the upper block 310 and the lower block 320. The latch connector 330 is configured to have bilateral symmetry and includes an end that presses against the top of an electronic component loaded into a slot.

[0051] The latching connector 330 may include a latching unit 331 and a connector 335. The latching unit 331 may include a connecting portion 332 and a pusher block 333. The connecting portion 332 is configured to engage with the upper block 310 via a first connecting pin 336 on a first side of the latching connector 330. The pusher block 333 is configured to press the top of the electronic component on a second side of the latching connector 330. The pusher block 333 may include a thermal pad 334 to minimize the effect of heat when pressing against the upper end of the electronic component. In this case, when the electronic component is tested, for example, thermal conditions from -100 degrees Celsius to 200 degrees Celsius may be applied. However, in some cases, tests may be performed under other temperature conditions, not limited to the aforementioned temperature range.

[0052] The first side of the connector 335 can be connected to the lower block 320 via a connecting pin. The second side of the connector 335 can be rotatably connected to the middle part of the latch connector 330 via a second connecting pin 337.

[0053] In addition, the operation of the latch connector 330 can be predetermined geometrically. According to the invention, the push block 333 of the latch unit 331 is configured to pivot more than 90 degrees in the upward direction when the upper block 310 moves downward to the position closest to the lower block 320.

[0054] On the other hand, when the external force is removed and the upper block 310 returns to a position away from the lower block 320, the latch connector 330 adjusts to an angle of 90 degrees in the direction opposite to the upward direction and presses the top of the electronic component.

[0055] Furthermore, the push blocks 333 provided in the pair of latch connectors 330 can be formed with recessed structures facing each other in the closed position. The recessed structure of the push blocks 333 is to avoid interfering with the PNP device when the slot is closed, in a state where the electronic components of the PNP device are precisely aligned in the slot. The size of the recessed structure can be determined so that it does not contact the PNP device even when the latch unit 331 pivots.

[0056] The elastic element 340 can be configured to provide a restoring force to the latching connector. The elastic element 340 is disposed at a plurality of points between the upper block 310 and the lower block 320, and provides an upward restoring force to the upper block 310.

[0057] The pitch adjuster 200 is configured to expand the electrical contact position while the electronic components are fixed.

[0058] The pitch adjuster 200 may include a first pin 210, a pitch adjusting block, and a second pin fixing block 230. The pitch widening block may include a conductor 221, and the second pin fixing block 230 may include a second pin 231. The first pin 210, conductor 221, and second pin 231 may be electrically connected. When the second pin 231 is electrically connected to an external tester, the electronic components loaded into the slot may also be electrically connected to the tester. In addition, the configuration of the first pin 210, conductor 221, and second pin 231 of the pitch adjuster 200 may be changed when the position and arrangement of the contact terminals of the electronic components are changed.

[0059] The first pin 210 can be arranged to have a contact profile area suitable for the fine pitch of electronic components. For example, the first pin 210 can be formed as a plate. However, this is only an example, and the shape of the first pin 210 can be changed to have various configurations suitable for fine pitch.

[0060] Although the foregoing example shows the pitch adjuster configured as a block, the pitch adjuster can be implemented with a thin structure in which the minimum spacing between electrical contacts that contact the tester is increased. For example, the pitch adjuster can be configured with a thin structure, such as multilayer circuitry and a glass substrate. The thinness of the pitch adjuster means that the length of the electrical connection between the HBM memory and the tester can be physically shortened. When the length of the electrical connection is physically shortened, the actual response time can be shortened. This trend may increase as operating frequencies become higher.

[0061] FIG5 is a cross-sectional view of a pitch adjuster 200 in an insertion module 100 for electronic components according to an alternative embodiment of the present invention; FIG6A is an enlarged view of part "I" in FIG5; FIG6B is an enlarged view of part "II" in FIG5.

[0062] Referring to Figures 5, 6A, and 6B, the first pins 210 can be arranged on a plane to contact the contact terminals of the electronic components, respectively. In this case, the number of first pins 210 can correspond to the number of contact terminals of the electronic components. Furthermore, the first pins 210 can be arranged in the same manner as the contact terminals arranged in the electronic components. That is, the spacing of the first pins 210 can be the same as the spacing of the electronic components. In other words, the upper ends of the contact terminals of the electronic components and the first pins can be formed with the same pattern. Although the arrangement of the first pins 210 with a first spacing P1 has been described, this description is only an example. When the contact terminals of the electronic components are connected with various spacings, the first pins 210 can be arranged with various spacings corresponding to the contact terminals.

[0063] Furthermore, according to the present invention, the first pitch P1 between the first pins 210 may be 0.5 mm or less. In some cases, the first pitch may be 0.2 mm or less. Additionally, the thickness of the first pins 210 may be 0.2 mm or less. Furthermore, the width of the electrical contact portion of the first pins may be 0.05 mm or less. For example, the first pitch between the first pins may be selected in the range of 0.09 mm to 0.165 mm, corresponding to the pitch of mass-produced HBM dies.

[0064] The second pin fixing block 230 may include a plurality of second pins 231. The plurality of second pins 231 may be arranged with a second spacing P2 wider than the first spacing P1. The second pins 231 are configured to be electrically connected to the electrical contact device of the board. The second pins 231 may be arranged to penetrate the second pin fixing block 230 in the vertical direction. The second pins 231 may be configured to minimize damage and ensure reliable electrical contact even when repeatedly contacting the external board. In addition, the second spacing P2 may be in the range of 0.3 mm to 3 mm. In this case, the thickness of the second pins 231 may be 0.1 mm to 3 mm.

[0065] Furthermore, the second spacing P2 can be increased more than the first spacing P1. For example, the second spacing can be increased from 1.1 times to 20 times the first spacing.

[0066] For example, the second pin 231 can be configured as a pogo pin. The pogo pin can be configured with a pair of hollow pins that are open on one side and joined together in the longitudinal direction. The pogo pin can have an elastomer inside, and its length decreases when pressed in the vertical direction. In other words, the length of the pogo pin changes according to the external force, and the electrical connection is maintained even with the change in length. Therefore, even when the insertion module 100 is in general contact with the board, the pogo pin can minimize impact and maintain stable contact. Furthermore, even with repeated use, wear and tear are prevented, thus providing optimal performance over a long period.

[0067] A pitch adjustment block 220 is disposed between the first pin 210 and the second pin fixing block 230 and configured to adjust the pitch. The pitch adjustment block 220 may include a plurality of conductors 221. At least a portion of the conductors 221 may be arranged along an inclined path within the pitch adjustment block 220. The conductors 221 may have an upper end exposed at the top of the pitch adjustment block 220 and a lower end exposed at the bottom of the pitch adjustment block 220. The upper end of the conductors 221 may be in electrical contact with the first pin 210. Furthermore, the lower end of the conductors 221 may be in electrical contact with the second pin 231 of the second pin fixing block 230.

[0068] The conductor 221 can be arranged in three dimensions within the spacing adjustment block 220. Typically, the conductor 221 can be arranged downwards with a wider spacing within the spacing adjustment block 220.

[0069] Furthermore, although the foregoing embodiments show an example of first pins arranged with a first pitch, the minimum pitch between adjacent first pins can be the first pitch. Moreover, the first pins can be arranged with various pitches wider than the first pitch as needed. In this case, the minimum pitch between adjacent second pins can be the second pitch, and even in this case, the second pitch can be wider than the first pitch.

[0070] Figure 7 shows the spacing of the first pin 210 and the spacing of the second pin 231 in an insertion module 100 for electronic components according to an alternative embodiment of the present invention.

[0071] Referring to Figure 7, the second pin 231 can be arranged with a wider spacing than the first pin 210. Therefore, high-precision electrical contacts are not required after the electronic components are accurately loaded into the insertion module 100. This configuration increases the margin of error for alignment of the insertion module 100 on the base frame, thereby enabling a faster bonding process.

[0072] According to the present invention, the insertion module 100 holds and transports electronic components in their unpackaged, bare die state, thereby preventing damage to the electronic components during transport of the test tray 1 or during pressing for testing. Furthermore, once the spacing adjuster and the contact terminals of the electronic components are pre-connected electrically, the electrical connection is maintained until unloading. Therefore, repeated connection is not required, thereby preventing deformation or damage to the contact terminals of the electronic components.

[0073] The operation of the insertion module 100 for electronic components and the test tray 1 according to an embodiment of the present invention will be described below with reference to FIGS. 8A to 8H. In FIGS. 8A to 8H, other components, such as the first base frame and the second base frame of the test tray and the tester, are omitted for ease of description.

[0074] For ease of description, the operation of loading electronic component 1000 into insertion module 100 will be described. However, these operations are merely examples and can be reversed during unloading. Furthermore, only a cross-section of insertion module 100 is shown, but this is only an example. Alternatively, a hand can simultaneously pick up multiple electronic components and load them into insertion module 100. Similarly, multiple electronic components can be unloaded simultaneously.

[0075] Figures 8A, 8B, 8C, 8D, 8E, 8F, 8G and 8H show the usage state of the insertion module 100 for electronic components according to an embodiment of the present invention.

[0076] Referring to FIG8A, the test tray 1 is transported to the loading position and temporarily secured. In this case, the pickup (or hand) 2000 picks up the electronic component 1000 from the user tray (not shown) and transports the electronic component to a position above the test tray 1. The pickup 2000 may include a suction unit 2200 for the electronic component 1000 and a pickup pusher 2100. The suction unit 2200 may be configured to move up and down independently of the pickup pusher 2100.

[0077] Referring to Figure 8B, the pickup pusher 2100 moves downward to contact the upper block 310 of the insertion module.

[0078] Referring to Figure 8C, the pickup pusher 2100 moves downward and pushes the upper block 310. In this case, the force is transmitted to the latch connector 330, so the pusher block 333 pivots upward.

[0079] Referring to FIG8D, the pickup pusher 2100 further pushes the upper block 310, and the latch connector 330 is fully opened. Additionally, the pickup 2000 may include a vision system. Through the vision system, the pickup 2000 can detect the relative position between the slot and the electronic component 1000, and perform precise alignment for the horizontal position of the electronic component 1000.

[0080] Referring to Figure 8E, when the position of the electronic component 1000 is horizontally aligned with the position of the first pin 210, the suction unit 2200 moves downward and places the electronic component 1000 on the top surface of the first pin 210.

[0081] Referring to Figure 8F, with the electronic component 1000 placed on the top surface of the first pin 210 (position of the suction unit 2200 fixed), the pickup pusher 2100 moves upward. As the pickup pusher 2100 moves upward, the latching connector 330 gradually closes.

[0082] Referring to Figure 8G, when the pickup pusher 2100 moves upward and separates from the pusher block 333, the latch connector 330 is fully closed, thereby pushing against the top of the electronic component 1000. In this case, even if the latch connector 330 pivots from the open position to the closed position, the latch connector 330 will not interfere with the suction unit 2200 due to its recessed structure.

[0083] Referring to FIG8H, the position of the electronic component 1000 is fixed in the slot through the latch connector 330, and the suction unit 2200 and the pickup pusher 2100 move upward, thereby completing the loading operation of the electronic component 1000.

[0084] As described above, the electronic components loaded into the insertion module are transported to the tester in a state where their positions are aligned and their connection pins are electrically connected to the test tray. Furthermore, while maintaining the electrical connection between the electronic components and the test tray, the test tray is electrically connected to the tester.

[0085] When the test tray is electrically connected to the tester, the electrical contact device of the test tray makes electrical contact with the tester, thereby achieving contact quickly and rapidly without requiring excessive precision.

[0086] As described above, the insertion module for the test tray according to the present invention and the test tray containing the insertion module enable accurate contact corresponding to the fine pitch of the electronic components, and the test is performed using pins with an expanded pitch. Therefore, damage to unpackaged electronic components is minimized. Furthermore, since no additional alignment of the electronic components is required immediately before testing, the test is performed quickly.

[0087] According to the present invention, the insertion module for the test tray and the test tray containing the insertion module are able to make accurate contact corresponding to the fine pitch of the electronic components and maintain precise contact during the test, thereby improving the accuracy of the test.

[0088] In addition, to prevent unpackaged bare dies from being damaged during testing.

[0089] Furthermore, no additional alignment of electronic components is required immediately before testing, thus allowing for rapid testing and classification of electronic components. [Simplified Explanation of the Diagram]

[0027] FIG1 is a perspective view of a test tray for electronic components according to an embodiment of the present invention; FIG2 is an exploded perspective view of a sub-tray according to an embodiment of the present invention; FIG3 is a perspective view of an insertion module for a test tray according to another embodiment of the present invention; FIG4 is an exploded perspective view of an insertion module for a test tray according to another embodiment of the present invention; FIG5 is a cross-sectional view of a spacing adjuster in an insertion module for a test tray according to another embodiment of the present invention; FIG6A is an enlarged view of part "I" in FIG5; FIG6B is an enlarged view of part "II" in FIG5; FIG7 shows the spacing between the first pins and the spacing between the second pins in the insertion module for a test tray according to another embodiment of the present invention; and FIG8A, FIG8B, FIG8C, FIG8D, FIG8E, FIG8F, FIG8G and FIG8H show the usage state of the insertion module for a test tray according to an embodiment of the present invention.

Claims

1. An insertion module for testing a sorting machine, the insertion module comprising: A pitch adjuster is configured to mount at least one electronic component thereon and includes a first side and a second side, the first side being electrically connected to a connection pin of the electronic component, and the second side being provided with electrical contact devices, the second pitch of which is wider than the first pitch of the connection pin; as well as A retainer configured to hold the placed electronic component, the retainer further comprising: an upper block having a hole formed in its center to allow the electronic component to pass through the upper block; a lower block having the spacing adjuster disposed in its center; and a latching connector having a first side rotatably connected to the upper block and a second side rotatably connected to the lower block, the latching connector being configured to pivot upward as the upper block moves closer to the lower block.

2. The insertion module according to claim 1, wherein, The electronic components include high-bandwidth memory.

3. The insertion module according to claim 2, wherein, The pitch adjuster is configured to be electrically connected to the connection pin at a plurality of locations.

4. The insertion module according to claim 3, wherein, The first spacing is less than 0.5 mm.

5. The insertion module according to claim 4, wherein, The second spacing is 2 to 10 times the first spacing.

6. The insertion module according to claim 3, wherein, The pitch adjuster includes: a plurality of first pins arranged at the first pitch; and a plurality of second pins arranged at the second pitch.

7. The insertion module according to claim 6, wherein, The width of the first pin is less than 0.2 mm.

8. The insertion module according to claim 6, wherein, The diameter of the second pin is 0.3 mm to 3 mm.

9. The insertion module according to claim 6, wherein, The pitch adjuster further includes a pitch adjustment block disposed between the first pin and the second pin, the pitch adjustment block including a plurality of connectors electrically connected to the first pin and the second pin respectively.

10. The insertion module according to claim 9, wherein, The spacing adjustment block also includes a plurality of conductors, at least a portion of which are set at a certain angle.

11. The insertion module according to claim 1, wherein, The latch connector further includes a latch unit, one side of which is rotatably connected to the upper block, and the other side of which is provided with a push block configured to press the upper part of the electronic component.

12. The insertion module according to claim 11 further includes at least one elastic element disposed between the upper block and the lower block and providing a restoring force to return the upper block to its initial position.

13. The insertion module according to claim 1, wherein, The pusher also includes a thermal pad disposed at its end for contact with the electronic component.

14. A test tray for electronic components, the test tray comprising: The plate includes a lower portion configured for electrical connection with the tester; An insertion module is configured to hold the electronic components loaded therein during testing; and a base frame configured to arrange a plurality of said insertion modules thereon, wherein said insertion modules include: a spacing adjuster configured to mount said electronic components thereon, and including a first side and a second side, the first side being electrically connected to the connection pins of said electronic components, the second side being provided with electrical contact devices, the second spacing of said electrical contact devices being wider than the first spacing of said connection pins; and a retainer configured to retain the mounted electronic components, said retainer further including: an upper block having a hole formed in its center to allow said electronic components to pass through said upper block; a lower block having said spacing adjuster in its center; and a latching connector having a first side rotatably connected to said upper block and a second side rotatably connected to said lower block, said latching connector being configured to pivot upward as said upper block moves toward said lower block.

15. The test tray according to claim 14, further comprising: The sub-tray includes a lower portion configured to be electrically connected to the board and configured to arrange a plurality of the insertion modules thereon.

16. The test tray according to claim 15, wherein, The sub-tray is detachably disposed within the plate.

17. The test tray according to claim 14, wherein, The electronic components include high-bandwidth memory (HBM).

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