Package apparatus

Abstract

A packaging device includes a substrate structure and a wiring structure. The wiring structure is disposed on the substrate structure. At least a portion of the wiring structure is sandwiched within the substrate structure.

Claims

1. A packaging device, comprising: A substrate structure includes: a first substrate layer having an upper surface; a second substrate layer disposed below the first substrate layer and having a recessed region and a lower surface; and a wiring structure disposed on the substrate structure and at least a portion inserted into the substrate structure, and including: a main wiring layer disposed on the upper surface; an intermediate wiring layer sandwiched between the first substrate layer and the second substrate layer and extending into the recessed region of the second substrate layer to form an extended wiring layer; and a via structure disposed in the first substrate layer and electrically connecting the main wiring layer and the intermediate wiring layer.

2. The packaging device as claimed in claim 1, wherein the wiring structure further includes a metal layer disposed on the lower surface of the second substrate layer, and the extended wiring layer is separated from the metal layer.

3. The packaging device as claimed in claim 2, wherein the second substrate layer has a chamfer located between the extended wiring layer and the metal layer.

4. The packaging device as claimed in claim 1, wherein the extended wiring layer further extends to the lower surface of the second substrate layer, and the substrate structure further includes a third substrate layer disposed below the second substrate layer and covering the second substrate layer.

5. The packaging apparatus as described in claim 4, wherein, The substrate structure further includes a first adhesive layer located between the second substrate layer and the third substrate layer.

6. The encapsulation device as claimed in claim 5, wherein the material of the first adhesive layer is selected from a combination of epoxy resin, acrylic resin, BT resin and glass fiber.

7. A packaging device, comprising: A substrate structure includes: a first substrate layer having a recessed region; a second substrate layer disposed below the first substrate layer; and a wiring structure disposed on the substrate structure and at least a portion thereof inserted into the substrate structure, and includes: a main wiring layer disposed on the upper surface; an intermediate wiring layer sandwiched between the first substrate layer and the second substrate layer and connected to an extension wiring layer, the extension wiring layer extending along the sidewall of the first substrate layer into the recessed region and connected to a bend; and a via structure disposed in the first substrate layer and electrically connecting the main wiring layer and the intermediate wiring layer.

8. The packaging device as claimed in claim 7, wherein the second substrate layer completely covers the intermediate wiring layer.

9. The packaging device as claimed in claim 7, wherein the second substrate layer partially covers the intermediate wiring layer.

10. The packaging device as claimed in claim 7, wherein the second substrate layer extends horizontally beyond the intermediate wiring layer.

11. The packaging device as claimed in claim 7, wherein the second substrate layer completely covers the intermediate wiring layer and extends toward the bend portion of the extended wiring layer.

12. The packaging device as claimed in claim 7, wherein a second adhesive layer is provided between the first substrate layer and the second substrate layer.

13. The encapsulation device as claimed in claim 12, wherein the material of the second adhesive layer is selected from a combination of epoxy resin, acrylic resin, BT resin and glass fiber.

14. The packaging device as claimed in claim 7 further includes a cup-shaped component disposed on the substrate structure and housing a first light-emitting element.

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