Multi-nozzle nozzle, droplet ejection device and droplet ejection method

Abstract

A multi-nozzle nozzle includes: a plate extending along a first direction and disposed flat; a first droplet ejection nozzle group including a first electrostatic ejection type droplet ejection nozzle and a second electrostatic ejection type droplet ejection nozzle disposed at designated positions on the lower side of the aforementioned plate; a second droplet ejection nozzle group disposed separately from the aforementioned first droplet ejection nozzle group in the aforementioned plate along the aforementioned first direction, and including a third electrostatic ejection type droplet ejection nozzle disposed at a position corresponding to the aforementioned first electrostatic ejection type droplet ejection nozzle and a fourth electrostatic ejection type droplet ejection nozzle disposed at a position corresponding to the aforementioned second electrostatic ejection type droplet ejection nozzle; and a partition wall disposed between the aforementioned first droplet ejection nozzle group and the aforementioned second droplet ejection nozzle group.

Description

Technical Field

[0001] This invention relates to a multi-nozzle nozzle, a droplet ejection device, and a droplet ejection method. Prior Technology

[0002] In recent years, inkjet printing technology has been applied to industrial processes. For example, the manufacturing process of color filters for liquid crystal displays is one such application. While piezoelectric printheads, which eject droplets through mechanical pressure or vibration, have been commonly used in inkjet printing, electrostatic inkjet printheads capable of ejecting even finer droplets have attracted considerable attention. Patent Document 1 discloses an electrostatic inkjet recording apparatus.

[0003] Patent Documents Patent Document 1: Japanese Patent Publication No. H10-34967 Summary of the Invention

[0004] Recently, from the perspective of improving productivity, multi-nozzle printheads have been developed for use in electrostatic inkjet printheads. When a multi-nozzle printhead is configured as a plate, the plate portion is very thin, only tens of micrometers thick. Therefore, sometimes the flatness and strength of the multi-nozzle printhead become insufficient, and the shape of the multi-nozzle printhead becomes unstable. Furthermore, if the multi-nozzle printhead is connected to a mounting part (or attachment) in this state, there is a risk of uneven droplet ejection.

[0005] Therefore, one object of the present invention is to stabilize the shape of a multi-nozzle nozzle. Furthermore, one object of the present invention is to uniformly spray droplets. And, one object of the present invention is to improve productivity while reducing pattern formation costs.

[0006] According to one embodiment of the present invention, a multi-nozzle nozzle is provided, comprising: a plate extending along a first direction and disposed flat; a first droplet ejection nozzle group including a first electrostatic ejection type droplet ejection nozzle and a second electrostatic ejection type droplet ejection nozzle disposed at designated positions on the lower side of the aforementioned plate; a second droplet ejection nozzle group disposed separately from the aforementioned first droplet ejection nozzle group in the aforementioned plate along the aforementioned first direction, and including a third electrostatic ejection type droplet ejection nozzle disposed at a position corresponding to the aforementioned first electrostatic ejection type droplet ejection nozzle and a fourth electrostatic ejection type droplet ejection nozzle disposed at a position corresponding to the aforementioned second electrostatic ejection type droplet ejection nozzle; and a partition wall disposed between the aforementioned first droplet ejection nozzle group and the aforementioned second droplet ejection nozzle group.

[0007] In the aforementioned multi-nozzle nozzle, the aforementioned partition wall can also be set on the upper side of the aforementioned plate.

[0008] In the aforementioned multi-nozzle nozzle, the aforementioned partition wall can also extend along a second direction that intersects with the aforementioned first direction.

[0009] In the aforementioned multi-nozzle nozzle, the aforementioned partition wall may also contain resin material.

[0010] In the aforementioned multi-nozzle nozzle, the aforementioned partition wall can also be set on the lower side of the aforementioned plate, and the height of the aforementioned partition wall can also be greater than the height of the aforementioned first electrostatic ejection type droplet ejection nozzle.

[0011] According to one embodiment of the present invention, a droplet ejection device is provided, comprising: a droplet ejection section having the above-described multi-nozzle nozzle.

[0012] The aforementioned droplet ejection device may also include: a mounting portion connected to the aforementioned multi-nozzle nozzle and having an opening, wherein the upper side of the aforementioned plate portion is connected to the bottom of the aforementioned opening, and the two sides of the aforementioned partition wall are connected to the sides of the aforementioned opening.

[0013] According to one embodiment of the present invention, a droplet ejection method is provided, which uses the above-described multi-nozzle nozzle to eject droplets toward a target object.

[0014] In the above-mentioned droplet ejection method, the viscosity of the droplets can also be above 0.1 cps and below 10,000 cps.

[0015] In the above-described droplet ejection method, the droplets may also contain organic materials.

[0016] In the above-described droplet ejection method, the droplets may also contain polyimide resin.

[0017] In the above droplet ejection method, the target object can also be a substrate with a pattern, and the droplets can also be ejected onto the pattern.

[0018] By using one embodiment of the present invention, the shape of a multi-nozzle nozzle can be stabilized. Furthermore, by using one embodiment of the present invention, droplets can be sprayed uniformly. Moreover, by using one embodiment of the present invention, productivity can be improved while reducing pattern formation costs. Simple Explanation of the Diagram

[0019] Figure 1 is a schematic diagram of a droplet ejection device according to one embodiment of the present invention.

[0020] Figure 2A is a top view of a multi-nozzle nozzle according to one embodiment of the present invention.

[0021] Figure 2B is a cross-sectional view of a multi-nozzle nozzle according to one embodiment of the present invention.

[0022] Figure 3 is a perspective view of a droplet ejection nozzle according to one embodiment of the present invention.

[0023] Figure 4A is a top view of a droplet ejection nozzle according to one embodiment of the present invention.

[0024] Figure 4B is a cross-sectional view of a droplet ejection nozzle according to one embodiment of the present invention.

[0025] Figure 5A is a cross-sectional view illustrating a method for manufacturing a multi-nozzle nozzle according to one embodiment of the present invention.

[0026] Figure 5B is a cross-sectional view illustrating a method for manufacturing a multi-nozzle nozzle according to one embodiment of the present invention.

[0027] Figure 5C is a cross-sectional view illustrating a method for manufacturing a multi-nozzle nozzle according to one embodiment of the present invention.

[0028] Figure 6A is a cross-sectional view illustrating a method for manufacturing a multi-nozzle nozzle according to one embodiment of the present invention.

[0029] Figure 6B is a cross-sectional view illustrating a method for manufacturing a multi-nozzle nozzle according to one embodiment of the present invention.

[0030] Figure 6C is a cross-sectional view illustrating a method for manufacturing a multi-nozzle nozzle according to one embodiment of the present invention.

[0031] Figure 7 is a perspective view of a multi-nozzle head related to one embodiment of the present invention connected to the mounting part.

[0032] Figure 8A is a top view of a multi-nozzle head related to one embodiment of the present invention connected to the mounting part.

[0033] Figure 8B is a cross-sectional view of a multi-nozzle head related to one embodiment of the present invention connected to the mounting part.

[0034] Figure 9 is a flowchart of a droplet ejection method according to one embodiment of the present invention.

[0035] Figure 10A is a cross-sectional view of a droplet ejection method according to one embodiment of the present invention.

[0036] Figure 10B is a cross-sectional view of a droplet ejection method according to one embodiment of the present invention.

[0037] Figure 11A is a top view of a multi-nozzle nozzle according to one embodiment of the present invention.

[0038] Figure 11B is a cross-sectional view of a multi-nozzle nozzle according to one embodiment of the present invention.

[0039] Figure 12 is a top view of a multi-nozzle nozzle according to one embodiment of the present invention.

[0040] Figure 13 is a schematic diagram of a droplet ejection device according to one embodiment of the present invention.

[0041] Figure 14 is a flowchart of a droplet ejection method according to one embodiment of the present invention.

[0042] Figure 15 is a cross-sectional view of a multi-nozzle nozzle according to one embodiment of the present invention. Implementation

[0043] The following description, with reference to the accompanying drawings, illustrates various embodiments of the invention disclosed in this application. However, the invention may be implemented in various forms without departing from its spirit and is not limited to the description of the embodiments exemplified below.

[0044] Furthermore, in the drawings referenced in this embodiment, the same or similar symbols are used to mark the same parts or parts with the same function (only symbols such as A, B, or -1, -2, etc. are marked after the numbers), and repeated descriptions are sometimes omitted. Also, the size ratios in the drawings may sometimes differ from the actual ratios or omit parts of the structure from the drawings for ease of explanation.

[0045] Furthermore, in the detailed description of this invention, when specifying the positional relationship between a structure and other structures, the terms "above" and "below" do not only include the case where it is located directly above or below a certain structure. Unless otherwise specified, they are considered to include the case where there are other structures in between.

[0046] <First Embodiment>

[0047] (1-1. Structure of the droplet ejection device 100)

[0048] Figure 1 is a schematic diagram of a droplet ejection device 100 according to one embodiment of the present invention.

[0049] The droplet ejection device 100 includes: a control unit 110, a memory unit 115, a power supply unit 120, a drive unit 130, a droplet ejection unit 140, a camera unit 180, and a target support unit 190.

[0050] The control unit 110 is a computer that includes a CPU (Central Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array), or other arithmetic processing circuits. The control unit 110 uses a pre-set droplet ejection program to control the ejection process of the droplet ejection unit 140.

[0051] The memory unit 115 functions as a database for storing the droplet ejection program and various information used in the droplet ejection program. Memory unit 115 can use memory, SSD (Solid State Drive), or other memory-enabled components.

[0052] The power supply unit 120 is connected to the control unit 110, the drive unit 130, and the droplet ejection unit 140. The power supply unit 120 applies voltage to the droplet ejection unit 140 according to the signal input from the control unit 110. In this example, the power supply unit 120 applies a pulsed voltage (1000 V in this example) to the droplet ejection unit 140. In addition, a fixed voltage can be continuously applied without being limited to the pulsed voltage. By means of the voltage applied from the power supply unit 120 to the multi-nozzle printhead 150, the liquid stored in the ink tank 145 is ejected from the multi-nozzle printhead 150 in the form of droplets from the end portion 153a of the droplet ejection nozzle 153 (see Figure 4B) towards the target object 200 in the direction (third direction D3).

[0053] The drive unit 130 is composed of drive components such as an electric motor, belt, and gears. Based on the instructions from the control unit 110, the drive unit 130 moves the droplet ejection section 140 (more specifically, the multi-nozzle head 150 described later) relative to the target support section 190 in one direction (in this example, the second direction D2). Furthermore, the drive unit 130 can also fix the droplet ejection section 140 while moving the target object. The drive unit 130 can also be used in conjunction with a goniometer to finely adjust the position of the multi-nozzle head 150. Moreover, the drive unit 130 can move the multi-nozzle head 150 in multiple directions, not just one.

[0054] The droplet ejection section 140 includes an ink reservoir 145 and a multi-nozzle printhead 150. An electrostatic inkjet nozzle can be used in the multi-nozzle printhead 150. The multi-nozzle printhead 150 is attached to the mounting section 160 and further attached to an attachment (not shown) for use, as described later. Details of the multi-nozzle printhead 150 are described later.

[0055] A CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor can also be used in the imaging unit 180. The imaging unit 180 pre-captures the droplet ejection position. If the droplet ejection position deviates, the position of the multi-nozzle head 150 can be corrected via the drive unit 130. The imaging unit 180 can be mounted on the attachment and moves with the multi-nozzle head 150.

[0056] The target support portion 190 functions to support the target object 200. In this example, a platform can be used for the target support portion 190. The mechanism by which the target support portion 190 supports the target object 200 is not particularly limited, and a general support mechanism can be used. In this example, the target object 200 is vacuum-adsorbed onto the target support portion 190. Furthermore, not limited to this, the target support portion 190 can also use a fixing tool to support the target object 200.

[0057] (1-2. Structure of the multi-nozzle nozzle 150)

[0058] The following details the construction of the multi-nozzle nozzle 150.

[0059] Figure 2A is a top view of the multi-nozzle nozzle 150. Figure 2B is a cross-sectional view of the multi-nozzle nozzle 150 between A1 and A2. Figure 3 is a perspective view of the droplet ejection nozzle 153. Figure 4A is a top view of the droplet ejection nozzle 153. Figure 4B is a cross-sectional view of the droplet ejection nozzle 153 between B1 and B2.

[0060] As shown in Figures 2A and 2B, the multi-nozzle head 150 includes: a plate portion 151, a group of multiple droplet ejection nozzles 152, and a partition wall 159.

[0061] The plate portion 151 has a plate shape and is provided flat. The plate portion 151 extends along a first direction D1. A metallic material such as nickel can be used in the plate portion 151. The thickness of the plate portion 151 can be appropriately set. In this example, the thickness of the plate portion is 10 μm or more and 100 μm or less.

[0062] As shown in Figures 3, 4A, and 4B, multiple droplet ejection nozzle groups 152 protrude from one side (in this example, the lower side) of the plate portion 151. In this example, there are three droplet ejection nozzle groups 152 (152-1, 152-2, and 152-3). The droplet ejection nozzle groups 152 are arranged side by side along the first direction D1. Furthermore, the number of droplet ejection nozzle groups 152 is not particularly limited. The distance between adjacent droplet ejection nozzle groups 152 is fixed.

[0063] Each droplet ejection nozzle group 152 includes multiple droplet ejection nozzles 153. In the droplet ejection nozzle group 152, each droplet ejection nozzle 153 is disposed at a designated position. In this example, the droplet ejection nozzle group 152-1 (also referred to as the "first droplet ejection nozzle group") in the droplet ejection nozzle group 152 includes: droplet ejection nozzle 153-1-1 (also referred to as the "first droplet ejection nozzle"), droplet ejection nozzle 153-1-2 (also referred to as the "second droplet ejection nozzle"), and droplet ejection nozzles 153-1-3 to 5. The droplet ejection nozzle group 152, specifically droplet ejection nozzle group 152-2 (also referred to as the "second droplet ejection nozzle group"), includes: droplet ejection nozzle 153-2-1 (also referred to as the "third droplet ejection nozzle"), droplet ejection nozzle 153-2-2 (also referred to as the "fourth droplet ejection nozzle"), and droplet ejection nozzles 153-2-3 to 5. The droplet ejection nozzle group 152, specifically droplet ejection nozzle group 152-3, includes droplet ejection nozzles 153-3-1 to 5.

[0064] In this embodiment, droplet ejection nozzle 153-1-1 in the first droplet ejection nozzle group 152-1 and droplet ejection nozzle 153-2-1 in the second droplet ejection nozzle group 152-2 are positioned at corresponding locations. Similarly, droplet ejection nozzle 153-1-2 in the first droplet ejection nozzle group 152-1 and droplet ejection nozzle 153-2-2 in the second droplet ejection nozzle group 152-2 are positioned at corresponding locations. In short, each droplet ejection nozzle of one droplet ejection nozzle group is positioned at a position corresponding to each droplet ejection nozzle of another droplet ejection nozzle group. This allows for the formation of a pattern conforming to the element on the target object, similar to a photolithography process.

[0065] In a group of droplet ejection nozzles 152, the distances between adjacent droplet ejection nozzles 153 may be the same or different. The number of droplet ejection nozzles can also be appropriately set. Where it is not necessary to distinguish between droplet ejection nozzles 153-1-1, 153-1-2, ..., 153-1-5, the description will focus on droplet ejection nozzle 153. The droplet ejection nozzle 153 may be made of a metallic material such as nickel. The droplet ejection nozzle 153 has a tapered shape at its tip.

[0066] As shown in Figures 4A and 4B, the plate portion 151 has a through hole 151o in the portion (overlapping portion) corresponding to the droplet ejection nozzle 153. The through hole 151o has an inner diameter r151o larger than the inner diameter r153a of the outlet of the droplet ejection nozzle 153 (the opening 153ao of the end portion 153a of the droplet ejection nozzle 153). The inner diameter of the through hole 151o of the plate portion 151 can be 1 μm or more and 100 μm or less. The inner diameter r153a of the end portion 153a of the droplet ejection nozzle 153 can also be several hundred nm or more and 50 μm or less, preferably 1 μm or more and 30 μm or less, and more preferably 5 μm or more and 20 μm or less. In this embodiment, voltage can also be applied to the droplet ejection nozzle 153, voltage can also be applied to the plate portion 151 (or ink tank 145), or voltage can also be applied to the liquid (ink). Electrodes can also be provided when voltage is applied to the plate portion 151 and the droplet ejection nozzle 153. The electrodes can also be made of tungsten, nickel, molybdenum, titanium, gold, silver, copper, platinum, etc. In this case, multiple electrodes can be provided to apply voltage uniformly to the entire plate portion 151. Furthermore, although this embodiment discloses an example of applying voltage to the droplet ejection nozzle 153, the plate portion 151, or the ink, voltage can also be applied to the fixture (e.g., the mounting portion 160) supporting the multi-nozzle printhead 150.

[0067] A partition wall (rib) 159 is disposed between adjacent droplet ejection nozzle groups 152. The area where the partition wall 159 is disposed corresponds to the area where droplets will not be ejected onto the target object 200. Therefore, the partition wall 159 is disposed on the side of the plate portion 151 opposite to the side where the droplet ejection nozzles 153 are disposed (the upper side in this example). The partition wall 159 extends in a direction intersecting the direction where the droplet ejection nozzle group 152 is disposed (the first direction D1 in this example) (the second direction D2 in this example). Furthermore, since the mounting portion 160 is connected to the multi-nozzle nozzle 150, it is desirable that the partition wall 159 is not disposed at the edge of the plate portion 151.

[0068] The height H159 of partition wall 159 can also be set appropriately. In this example, the height H159 of partition wall 159 is more than 10 μm and less than 1 mm.

[0069] The partition 159 may be formed of the same material as the plate 151 and the droplet ejection nozzle 153, or it may be formed of other materials. In this example, the partition 159 is formed of a resin material to be elastic.

[0070] (1-3. Manufacturing method of multi-nozzle nozzle 150)

[0071] The manufacturing method of the multi-nozzle nozzle 150 is illustrated in the figures. Figures 5A-5C and 6A-6C are cross-sectional views illustrating one example of the manufacturing process of the multi-nozzle nozzle 150. However, the multi-nozzle nozzle 150 may be manufactured in ways not limited to this method.

[0072] First, as shown in FIG5B, a master plate 2000 for forming the droplet ejection nozzle 153 is prepared. In this embodiment, the concave master plate 2000 has a first surface 2000A and a second surface 2000B opposite to the first surface 2000A. The master plate 2000 includes a first master plate 2001 and a second master plate 2005. Furthermore, a group of recesses 2006 having a plurality of recesses 2007 for forming the droplet ejection nozzle is provided on the first surface 2000A side.

[0073] The master plate 2000 can be formed by film deposition, photolithography, and etching. Specifically, a first master plate 2001 is prepared to be plate-shaped. The first master plate 2001 can be a metal substrate or a substrate on which a conductive film is formed on the side. As shown in FIG5A, an insulating layer 2003 is formed on the upper side of the first master plate 2001 where a droplet ejection nozzle 153 is formed. Next, as shown in FIG5B, a second master plate 2005 made of metal material is formed on the first master plate 2001 (insulating layer 2003). The second master plate 2005 can also be formed by photolithography and etching after the metal layer is deposited. At this time, the first master plate 2001 (insulating layer 2003) is exposed at the bottom 2007b of the recess 2007.

[0074] Master 2005 can also be combined with Master 12001.

[0075] Secondly, as shown in Figure 5C, multiple structures 1531 are formed in the recess 2007 by electrolytic casting (electroplating), and a planar structure 1511 is formed in the first surface 2000A. Structures 1531 and 1511 are formed at the same time. Structure 1511 is formed around the periphery of structure 1531.

[0076] At this time, as shown in Figure 5B, the insulating layer 2003 is exposed at the bottom 2007b of the recess 2007. Therefore, electrolytic casting is not performed at the end of the structure 1531 because of the presence of the insulating layer 2003. Therefore, an opening is formed at the end 1531a of the structure 1531. Herein, a droplet ejection nozzle 153 with an opening 153ao is formed at the end 153a.

[0077] Next, a photoresist mask 2011 is formed on the portion corresponding to the end portion 153a of the droplet ejection nozzle 153. At this time, as shown in FIG6A, the exposed portion of the structure 1511 is formed into a structure 1513 by electrolytic casting. After the structure 1513 is formed, the photoresist mask 2011 is removed (FIG. 6B).

[0078] Next, a structure 1590, which serves as a partition wall 159, is formed on the structure 1513. The structure 1590 can be formed by a photolithography process after the resin film is formed. The thickness of the structure 1590 is 10 μm or more and 1 mm or less. Thin film materials can also be used when the thickness is within the above range.

[0079] Finally, structures 1511 and 1531 are removed from the master mold 2000 (insulating layer 2003) (release molding). Etching can also be performed at this time. This forms the plate portion 151 from structures 1511 and 1513. A droplet ejection nozzle 153 is formed from structure 1531. Through the above, a multi-nozzle nozzle 150 can be manufactured.

[0080] When electroforming is used to form the droplet ejection nozzle 153, the multi-nozzle nozzle 150 may deform due to stress. However, by forming the partition wall 159 as in this embodiment, the multi-nozzle nozzle 150 can be reinforced, thereby stabilizing the shape of the multi-nozzle nozzle 150.

[0081] (1-4. Connection between the mounting section and the multi-nozzle head)

[0082] Figure 7 is a perspective view of the mounting portion 160 connected to the multi-nozzle nozzle 150. Figure 8A is a top view of the mounting portion 160 connected to the multi-nozzle nozzle 150. Figure 8B is a cross-sectional view between C1 and C2 of the mounting portion 160 connected to the multi-nozzle nozzle 150. The mounting portion 160 has an opening 161 (or groove) corresponding to the droplet ejection nozzle 153, which can temporarily store ink supplied from the ink tank 145. As shown in Figures 8A and 8B, the multi-nozzle nozzle 150 (the lower side 151a of the plate portion 151) is connected to the bottom 161b of the opening 161 of the mounting portion 160. In this example, the multi-nozzle nozzle 150 and the bottom 161b of the opening 161 of the mounting portion 160 are connected using an adhesive. However, the connection is not limited to using an adhesive; the mounting portion 160 and the multi-nozzle nozzle 150 can also be connected by welding. The mounting part 160 is connected to the attachment of the droplet ejection device 100.

[0083] Furthermore, as shown in FIG8A, in this embodiment, the side 161s of the opening 161 of the mounting portion 160 can contact the side 159s of both sides of the partition wall 159 of the multi-nozzle nozzle 150. In this way, the connection between the multi-nozzle nozzle 150 and the mounting portion 160 can be strengthened, and the position and shape of the multi-nozzle nozzle 150 can be stabilized.

[0084] (1-5. Droplet ejection methods)

[0085] Next, a droplet ejection method according to one embodiment of the present invention will be described. Figure 9 is a flowchart illustrating the droplet ejection method. Figures 10A and 10B are cross-sectional views illustrating the droplet ejection method.

[0086] As shown in Figure 9, the control unit 110 of the droplet ejection device 100 acquires the ejection position information pre-stored in the memory unit 115 (step S110). Next, the control unit 110 drives the drive unit 130 to move the multi-nozzle nozzle 150 to the ejection position (step S110). At this time, the control unit 110 performs alignment of the ejection position via the drive unit 130 based on the information captured by the imaging unit 180 (step S120). In this embodiment, a substrate with a pre-formed pattern 210 is used on the target object 200 from which the droplets are ejected. At this time, alignment can be performed according to the pattern on the target object 200 (e.g., the substrate). Next, the control unit 110 applies voltage to the power supply unit 120, causing the droplets 157 to be ejected from the multi-nozzle nozzle 150 (step S130, Figure 10A). The viscosity of the droplet (liquid) 157 is 0.1 cps or more and 10,000 cps or less, preferably 0.5 cps or more and 1,000 cps or less. In this example, an organic material (more specifically, polyimide resin (polyimide varnish), solder resist, photosensitive resin, etc.) is dropped in the form of droplets 157. As a result, droplets 157 are dropped onto the target object 200 (pattern 210), forming a new pattern 220 on the target object 200 (Fig. 10B). The control unit 110 determines whether there is a next droplet ejection (step S170). If there is a next droplet ejection (step S170; Yes), the process returns to step S110. If there is no next droplet ejection (step S170; No), the process ends.

[0087] By using the droplet ejection method of this embodiment, a pattern can be formed at a designated location via multiple droplet ejection nozzles. In this case, compared to coating the entire surface of the target object 200 with material and forming a pattern through a photolithography process, the number of processes and material costs can be significantly reduced. Furthermore, compared to screen printing, this embodiment can form high-resolution patterns non-contactly. Also, unlike piezoelectric inkjet printing which uses mechanical energy to eject ink, this embodiment uses electrostatic ejection where the ejection force acts on the ink itself, thus allowing for the dropleting of high-viscosity materials.

[0088] <Second Embodiment>

[0089] In this embodiment, a multi-nozzle nozzle 150A having a pseudo-nozzle 155 is described.

[0090] Figure 11A is a top view of the multi-nozzle nozzle 150A. Figure 11B is a cross-sectional view of the multi-nozzle nozzle 150A. As shown in Figures 11A and 11B, in addition to the plate portion 151, the multiple droplet ejection nozzle group 152, and the partition wall 159, the multi-nozzle nozzle 150A also includes a pseudo-nozzle 155.

[0091] The dummy nozzle 155 protrudes from the side (lower side) of the plate portion 151 on the same surface as the droplet ejection nozzle 153. The dummy nozzle 155 is disposed around (outer side) the droplet ejection nozzle 153.

[0092] As shown in Figures 11A and 11B, the end portion 155a of the dummy nozzle 155 is closed and does not have an opening. Therefore, the dummy nozzle 155 does not eject droplets. In this example, although the dummy nozzle 155 is filled to the same height as the upper part of the plate portion 151, it is not particularly limited. The same material as the droplet ejection nozzle 153 can be used for the dummy nozzle 155. The dummy nozzle 155 can also have the same shape as the droplet ejection nozzle 153. In this case, the height H155 of the dummy nozzle 155 (specifically, the height from the lower side 151a of the plate portion 151 to the end portion 155a of the dummy nozzle 155) can also be the same as the height H153 of the droplet ejection nozzle 153 (specifically, the height from the lower side 151a of the plate portion 151 to the end portion 153a of the droplet ejection nozzle 153), or it can be lower.

[0093] When using a multi-nozzle nozzle containing multiple droplet ejection nozzles to eject droplets via electrostatic ejection, the electric field may sometimes be larger in the peripheral region of the plate compared to the center. In the case of the multi-nozzle nozzle 150 of this embodiment, dummy nozzles 155 are arranged around the group of droplet ejection nozzles. In short, multiple dummy nozzles 155 are arranged in the region where the electric field is larger. Since the ends 155a of the multiple dummy nozzles 155 are blocked, droplets are not ejected. On the other hand, the electric field in the region where the droplet ejection nozzles 153 are arranged becomes uniform. This makes the size of the droplets ejected by each droplet ejection nozzle 153 more uniform.

[0094] <Third Embodiment>

[0095] In the first embodiment of the present invention, although an example of the droplet ejection nozzle group 152 being arranged in one direction is disclosed, the present invention is not limited thereto. In this embodiment, a multi-nozzle nozzle different from the first embodiment is described. FIG12 is a top view schematic diagram of the multi-nozzle nozzle 150B. As shown in FIG12, the partition wall 159B can also be arranged in the same direction as the direction in which the droplet ejection nozzle group 152 is arranged (first direction D1) and in a cross direction (second direction D2). In this case, the partition wall 159B has a grid shape. This can further improve the strength of the multi-nozzle nozzle 150B.

[0096] <Fourth Embodiment>

[0097] In this embodiment, a droplet ejection device that differs from the first embodiment will be described. Specifically, an example having a second droplet ejection section and an inspection section will be described.

[0098] Figure 13 is a schematic diagram of the droplet ejection device 100C. As shown in Figure 13, in addition to the control unit 110, memory unit 115, power supply unit 120, drive unit 130, droplet ejection unit 140 (also referred to as "first droplet ejection unit"), imaging unit 180 and target support unit 190, the droplet ejection device 100C also has a second droplet ejection unit 170 and an inspection unit 185.

[0099] A single-point electrostatic inkjet nozzle can be used in the second droplet ejection section 170. The second droplet ejection section 170 includes a droplet ejection nozzle 171 and an electrode 175. The droplet ejection nozzle 171 has a glass tube, and the electrode 175 is disposed inside the glass tube. In this example, a thin tungsten wire can be used for the electrode 175. In addition, the electrode 175 is not limited to tungsten, and can also be made of nickel, molybdenum, titanium, gold, silver, copper, platinum, etc. The second droplet ejection section 170 ejects droplets 177 through the droplet ejection nozzle 171.

[0100] The inspection unit 185 inspects the ejection result of the droplets onto the target object 200. Image analysis can also be used as an inspection method. In addition, the inspection unit 185 can also be integrated with the photography unit 180. The second droplet ejection unit 170 ejects droplets onto the area of ​​poor ejection in case of poor ejection.

[0101] Next, a droplet ejection method according to one embodiment of the present invention will be described. Figure 14 is a flowchart illustrating the droplet ejection method.

[0102] As shown in Figure 14, the control unit 110 of the droplet ejection device 100 acquires the ejection position information pre-stored in the memory unit 115 (step S110). Next, the control unit 110 drives the drive unit 130 to move the multi-nozzle nozzle 150 to the ejection position (step S120). At this time, the control unit 110 aligns the ejection position via the drive unit 130 based on the information captured by the imaging unit 180. Next, the control unit 110 applies voltage to the power supply unit 120, causing the droplets 157 to be ejected from the multi-nozzle nozzle 150 (step S130). In this example, resin material (more specifically, polyimide resin) is dripped in the form of droplets. As a result, droplets 157 are dripped onto the target object 200, forming a new pattern on the target object 200.

[0103] Next, the control unit 110 instructs the inspection unit 185 to perform an inspection (step S140). In this case, the inspection unit 185 can also make a judgment based on the results captured by the imaging unit 180. Next, the control unit 110 determines whether there is a spraying defect based on the inspection results (step S150). If a spraying defect is determined (step S150; Yes), the control unit 110 instructs the control unit to spray droplets 177 from the second droplet ejection unit 170 to the area with the spraying defect (step S160). If there is no spraying defect (step S150; No), proceed to step S170.

[0104] The control unit 110 determines whether there is a next droplet ejection (step S170). If there is a next droplet ejection (step S170; Yes), the process returns to step S110. If there is no next droplet ejection (step S170; No), the process ends.

[0105] By using the droplet ejection method of this embodiment, a pattern can be formed at a designated position through multiple droplet ejection nozzles, and droplets can be ejected from areas with poor ejection.

[0106] Furthermore, in this embodiment, the inspection process can also be performed simultaneously with the time point when the first droplet is ejected for the next droplet ejection (returning to the time point of step S110). This allows for the dynamic execution of the next droplet ejection process and the inspection process, enabling rapid droplet ejection processing.

[0107] <Fifth Embodiment>

[0108] In the first embodiment of the present invention, an example is disclosed where the partition wall 159 is disposed on the side opposite to the side where the droplet ejection nozzle 153 is disposed (in this example, the upper side). However, the present invention is not limited thereto. In this embodiment, a multi-nozzle nozzle 150D, which differs from the first embodiment, will be described. FIG15 is a schematic cross-sectional view of the multi-nozzle nozzle 150D. As shown in FIG15, in the multi-nozzle nozzle 150D, the partition wall 159D can also be disposed on the same side of the plate portion 151 as the side where the droplet ejection nozzle 153 is disposed (the lower side of the plate portion 151). In this case, the vertical distance (height) H159D of the partition wall 159D relative to the object 200 is greater than the vertical distance (height) H153 of the droplet ejection nozzle 153 relative to the object 200. By having the partition wall 159D, the distance between the object 200 and the multi-nozzle nozzle 150D can be stabilized. Therefore, by using this embodiment, it becomes easy to spray droplets evenly.

[0109] Furthermore, in one embodiment of the present invention, the partition wall 159D may also be provided on the same side as the side where the droplet ejection nozzle 153 is provided and the opposite side of the plate portion 151.

[0110] (Modified Example)

[0111] Within the scope of this invention, any modifications and alterations that are conceived by those skilled in the art are also considered within the scope of this invention. For example, regarding the foregoing embodiments, any appropriate additions, deletions, combinations, or design changes to the constituent elements, or additions, omissions, or changes to the processing, by those skilled in the art, are also included within the scope of this invention, provided they capture the essence of the invention.

[0112] Furthermore, although the multi-nozzle nozzle 150 and the mounting portion 160 are described separately in the first embodiment of the present invention, the multi-nozzle nozzle 150 and the mounting portion 160 may also be combined as a multi-nozzle nozzle.

[0113] Furthermore, in one embodiment of the present invention, the partition wall 159 may also be formed of a metal material other than resin material. In this case, even without forming a pseudo-nozzle 155, the voltage around the perimeter can be controlled, and droplets can be sprayed out uniformly.

[0114] 100: Droplet ejection device 100C: Droplet ejection device 110: Control Department 115: Memory Department 120: Power Supply Department 130: Drive Unit 140: Droplet ejection section 145: Inkwell 150: Multi-nozzle spray head 150A~D: Multi-nozzle spray head 151: Plate section 151a: Lower side 151o: Through hole 152: Droplet ejection nozzle group 152-1~3: Droplet ejection nozzle group 153: Droplet ejection nozzle 153-1-1~5: Droplet ejection nozzle 153-2-1~5: Droplet ejection nozzle 153-3-1~5: Droplet ejection nozzle 153a: End portion 153ao: Opening 155: Pseudo-nozzle 155a: End portion 157: Droplets 159: Partition wall (rib) 159B: Partition wall 159D: Partition wall 159s: Side View 160: Installation Department 161: Opening 161b: Bottom 161s: Side view 170: Second droplet ejection section 171: Droplet ejection nozzle 175: Electrode 177: Droplets 180: Photography Department 185: Inspection Department 190: Target support section 200: Target 210: Pattern 220: Pattern 1511: Structure 1513: Structure 1531: Structure 1531a: End portion 1590: Structure 2000: Master 2000A: Page 1 2000B: Page 2 2001: Master 1 2003: Insulation layer 2005: Second Master Edition 2006: Concave Group 2007: concavity 2007b: Bottom 2011: Photoresist Mask D1: Direction 1 D2: Second Direction D3: 3rd direction H153: Height H155: Height H159: Altitude H159D: Height r151o:inner diameter r153a:inner diameter

Claims

1. A multi-nozzle nozzle, comprising: a plate extending along a first direction and disposed flat; a first droplet ejection nozzle group including a first electrostatic ejection type droplet ejection nozzle and a second electrostatic ejection type droplet ejection nozzle disposed at designated positions on the lower side of the plate; and a second droplet ejection nozzle group disposed separately from the first droplet ejection nozzle group in the plate along the first direction, and including a third electrostatic ejection type droplet ejection nozzle disposed at a position corresponding to the first electrostatic ejection type droplet ejection nozzle and a second droplet ejection nozzle disposed at a position corresponding to the first electrostatic ejection type droplet ejection nozzle. The fourth electrostatic ejection type droplet ejection nozzle is located at the position of the aforementioned second electrostatic ejection type droplet ejection nozzle; and a partition wall is disposed between the aforementioned first droplet ejection nozzle group and the aforementioned second droplet ejection nozzle group; wherein the aforementioned first droplet ejection nozzle group and the second droplet ejection nozzle group are arranged side by side along the aforementioned first direction, the distance between adjacent droplet ejection nozzle groups is fixed, the aforementioned partition wall is disposed on the upper side of the aforementioned plate portion, and is formed as a portion that protrudes further in the thickness direction than the aforementioned plate portion, and is disposed along a second direction that intersects the aforementioned first direction.

2. The multi-nozzle nozzle as described in claim 1, wherein the aforementioned partition wall comprises a resin material.

3. A droplet ejection device comprising: a droplet ejection section having a plurality of nozzles as described in claim 1 or 2.

4. The droplet ejection device as claimed in claim 3, comprising: a mounting portion connected to the aforementioned multi-nozzle head and having an opening, wherein the upper side of the aforementioned plate portion is connected to the bottom of the aforementioned opening, and the two sides of the aforementioned partition wall are connected to the sides of the aforementioned opening.

5. A method for ejecting droplets, wherein droplets are ejected toward a target object using a multi-nozzle nozzle as described in claim 1 or 2.

6. The droplet ejection method as described in claim 5, wherein the viscosity of the aforementioned droplets is 0.1 cps or more and 10,000 cps or less.

7. The droplet ejection method as described in claim 5, wherein the droplets comprise organic material.

8. The droplet ejection method as described in claim 5, wherein the droplets comprise a polyimide resin.

9. The droplet ejection method as described in claim 5, wherein the target object is a patterned substrate, and the droplets are ejected onto the pattern.

Images