Test probes, probe cards, and test probe manufacturing methods

Abstract

This invention relates to the field of wafer inspection technology, specifically to test probes, probe cards, and a method for manufacturing test probes. The test probe includes a probe body with an outer plating layer containing at least two elements. The content of these two elements varies linearly along the thickness of the plating layer, ensuring that the conductivity and deformation resistance of the plating layer also vary linearly along its thickness. In this invention, all elements affecting the conductivity and deformation resistance are present in the same plating layer, forming a unified whole. Compared to the two stacked alloy plating layers in the prior art, the plating layer of this invention is more robust, and repeated bending deformation of the test probe will not cause the plating layer to separate, thus avoiding a decrease in the overall performance of the test probe.

Claims

1. A test probe, characterized in that it comprises a probe body (1), wherein the probe body (1) is provided with a plating layer (2) on its exterior, the plating layer (2) comprising at least two elements; wherein, In the thickness direction of the coating layer (2), the contents of at least two elements in the coating layer (2) vary continuously and linearly, so that the conductivity coefficient and the deformation resistance coefficient of the coating layer (2) vary continuously and linearly in the thickness direction of the coating layer (2). In a straight direction from the inner surface to the outer surface of the coating layer (2), the contents of the first element in the coating layer (2) increase continuously and linearly, and the contents of the second element in the coating layer (2) decrease continuously and linearly, so that one of the conductivity coefficient and the deformation resistance coefficient of the coating layer (2) increases continuously and linearly in this direction, and the other of the conductivity coefficient and the deformation resistance coefficient of the coating layer (2) decreases continuously and linearly in this direction.

2. The test probe as described in claim 1, wherein, The coating layer (2) contains two elements; wherein, in the thickness direction of the coating layer (2), the content of the two elements in the coating layer (2) is continuously linearly varied, so that the conductivity coefficient and the deformation resistance coefficient of the coating layer (2) are continuously linearly varied in the thickness direction of the coating layer (2).

3. The test probe as described in claim 1, wherein, The coating layer (2) contains three elements; wherein, in the thickness direction of the coating layer (2), the content of at least two elements in the coating layer (2) is continuously linearly varied, so that the conductivity coefficient and the deformation resistance coefficient of the coating layer (2) are continuously linearly varied in the thickness direction of the coating layer (2).

4. The test probe as described in claim 1, wherein, Each element contained in the coating layer (2) has a different effect on the conductivity and / or deformation resistance coefficient.

5. The test probe as described in claim 1, wherein, The coating layer (2) is attached to the outer surface of the probe body (1).

6. A probe card, characterized in that it comprises a substrate and a plurality of test probes as described in any one of claims 1-5, wherein the plurality of test probes are spaced apart and mounted on the bottom of the substrate.

7. A method for manufacturing a test probe, characterized in that it comprises: An electroplating step is performed on the probe body (1), and the electroplating conditions are dynamically adjusted in the electroplating step to form a plating layer (2) on the outside of the probe body (1); and in the thickness direction of the plating layer (2), the content of at least two elements in the plating layer (2) changes continuously and linearly, so that the conductivity coefficient and the deformation resistance coefficient of the plating layer (2) change continuously and linearly in the thickness direction of the plating layer (2), wherein, in the straight direction from the inner surface to the outer surface of the plating layer (2), the content of the first element in the plating layer (2) increases continuously and linearly, and the content of the second element in the plating layer (2) decreases continuously and linearly, so that one of the conductivity coefficient and the deformation resistance coefficient of the plating layer (2) increases continuously and linearly in this direction, and the other of the conductivity coefficient and the deformation resistance coefficient of the plating layer (2) decreases continuously and linearly in this direction.

8. The method for manufacturing a test probe as described in claim 7, wherein, The dynamically adjusted electroplating conditions include at least one of the following adjustment items: (I) dynamically adjusting the current density of electroplating over time; (II) Dynamically adjust the concentration of the misalignment agent in the electroplating solution over time; (III) Dynamically adjust the temperature of the electroplating solution over time; (IV) Dynamically adjust the pH value of the electroplating solution over time.

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