Sandwich-structured heat-dissipation liquid-cooling apparatus for chip packaging

Abstract

This application discloses a wafer packaging liquid cooling device with a sandwich structure, including a heat dissipation base and a wafer bonding station located on the heat dissipation base; the wafer bonding station is a sandwich structure composite plate with copper layers on both the upper and lower surfaces, and the heat dissipation base is a diamond metal composite plate with a sandwich structure; the wafer bonding station is welded to the heat dissipation base. This application uses a sandwich structure with high thermal conductivity and an adjustable coefficient of thermal expansion to replace the traditional heat dissipation copper base plate with low thermal conductivity, which can effectively improve the heat transfer and system heat dissipation capacity of the liquid cooling device without increasing the size of the cold plate, and is also a low-cost solution.

Claims

1. A wafer packaging heat dissipation liquid cooling device with a sandwich structure, comprising a heat dissipation base and a wafer bonding station located on the heat dissipation base, wherein the wafer bonding station is a sandwich structure composite plate with copper layers on both the upper and lower surfaces, and the heat dissipation base is a diamond metal composite plate with a sandwich structure; the wafer bonding station is welded to the heat dissipation base; the diamond metal composite plate is a composite plate formed by sintering a hexahedral metal shell and at least one diamond-metal composite layer placed in the metal shell; the diamond-metal composite layer comprises a metal mesh and diamond particles with a coating on their surface, the diamond particles being arranged in the mesh of the metal mesh, and the gaps between the mesh and the diamond particles being filled with metal powder; metal atoms in the metal mesh diffuse through the coating to the surface of the diamond particles, forming a mixing transition zone.

2. The wafer package heat dissipation liquid cooling device with sandwich structure as described in claim 1, wherein the coating is a coating formed of one material selected from Ti, Cr, W, V, and Zr or a composite coating formed of two or more materials; the thickness of the coating is 0.1~0.5μm.

3. The wafer package heat dissipation liquid cooling device with a sandwich structure as described in claim 1, wherein the metal shell, the metal mesh and the metal powder are made of the same metal material, and the metal material is copper or aluminum.

4. The wafer package heat dissipation liquid cooling device with a sandwich structure as described in claim 1, wherein the diamond metal composite plate is a composite plate with a copper layer-diamond sheet-copper layer sandwich structure, consisting of a diamond sheet located in the middle layer and copper layers located on the upper and lower surfaces of the diamond sheet.

5. The wafer packaging heat dissipation liquid cooling device with a sandwich structure as claimed in claim 1, wherein the wafer bonding station is a composite plate formed by sintering a reinforcing material layer located in the middle layer and the copper layer covering the surface of the reinforcing material layer.

6. The wafer package heat dissipation liquid cooling device with a sandwich structure as described in claim 5, wherein the reinforcing material layer is one of diamond sheet, alumina ceramic, zirconia-reinforced alumina ceramic, aluminum nitride ceramic, and silicon nitride ceramic.

7. The wafer package heat dissipation liquid cooling device with a sandwich structure as described in claim 6, wherein the upper and lower surfaces of the reinforcing material layer are respectively covered by the copper layer, or all six sides of the reinforcing material layer are covered by the copper layer.

8. The wafer packaging heat dissipation liquid cooling device with sandwich structure as described in claim 1, wherein the thickness of the copper layer on both the upper and lower surfaces of the sandwich structure composite plate is 0.1~2mm; the thickness of the metal layer on the upper surface of the diamond metal composite plate is 0.1~2mm, and the thickness of the metal layer on the lower surface is 0.2~3mm.

9. The wafer package heat dissipation liquid cooling device with sandwich structure as described in any one of claims 1 to 8, further comprising a liquid cooling box located at the bottom of the heat dissipation base, wherein the bottom of the heat dissipation base is provided with a microchannel structure; and the liquid cooling box is provided with a cavity for accommodating the microchannel structure.

10. The wafer package heat dissipation liquid cooling device with a sandwich structure as claimed in claim 9, wherein the microchannel structure is a plurality of fins 3D printed on the bottom of the heat sink base, and pure copper powder with a particle size of 10~50μm is used as the material for the 3D printing.

11. The wafer package heat dissipation liquid cooling device with a sandwich structure as described in claim 10, wherein the height of the fins is 2 to 5 mm; the relationship between the thickness δ of the fins and the spacing S between adjacent fins is S / δ, with a value of 1.5 to 2, and the thickness δ of the fins is 0.1 to 0.2 mm.

12. The wafer packaging heat dissipation liquid cooling device with a sandwich structure as described in claim 1, wherein the wafer bonding station and the heat dissipation base are bonded by soldering, and the solder used for soldering is one of gold-tin solder, nano silver paste, micron silver paste, nano copper paste, and micron copper paste.

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