Grinding method for grinding pad and workpiece
Patent Information
- Application Number
- TW114142808
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-11-05
- Filing Date
- 2025-11-04
- Publication Date
- 2026-08-11
- Estimated Expiration
- 2045-11-03
Smart Images

Figure TWG2TB001905958_001 
Figure TWG2TB001905958_002 
Figure TWG2TB001905958_003
Abstract
Claims
1. An abrasive pad comprising an abrasive layer containing a hydrolyzable resin and abrasive particles, wherein after being immersed in ion-exchange water at 80°C for 3 hours, the pencil hardness of the aforementioned abrasive layer at 25°C and 60%RH is lower than the pencil hardness of the aforementioned abrasive layer at 25°C and 60%RH before immersion, and the difference in pencil hardness of the aforementioned abrasive layer at 25°C and 60%RH before and after immersion is 3 levels or more.
2. The abrasive pad as requested in claim 1, wherein the abrasive layer prior to impregnation has a pencil hardness of 2H or higher at 25°C and 60%RH.
3. As in claim 2, the abrasive pad, wherein the scratches produced during a pencil hardness test using a pencil with a higher hardness than that of the aforementioned abrasive layer after immersion in ion-exchange water at 80°C for 3 hours are cohesive damage.
4. The abrasive pad as requested in item 1, wherein the median particle size of the aforementioned abrasive grains is less than 30 μm.
5. The abrasive pad of claim 1, wherein the content of the aforementioned abrasive grains in the aforementioned abrasive layer is more than 1% by mass and less than 55% by mass relative to the total mass of the aforementioned abrasive layer.
6. The abrasive pad of claim 1, wherein the content of the aforementioned hydrolyzable resin in the aforementioned abrasive layer is more than 20% by mass and less than 98.5% by mass relative to the total mass of the aforementioned abrasive layer.
7. The abrasive pad as claimed in claim 1, wherein the aforementioned hydrolyzable resin is mainly composed of glycolic acid polymer.
8. The abrasive pad of claim 1, wherein the aforementioned abrasive layer further contains a hydrolysis accelerator.
9. The abrasive pad of claim 8, wherein the aforementioned hydrolysis accelerator comprises at least one selected from the group consisting of carboxylic anhydrides, phosphorus compounds, cyclic esters and basic metal oxides.
10. The abrasive pad of claim 1, wherein the thickness of the aforementioned abrasive layer is more than 0.1 mm and less than 30 mm.
11. The abrasive pad of claim 1, wherein the density of the aforementioned abrasive layer is more than 1.57 g / cm3 and less than 3.00 g / cm3.
12. A grinding method for a workpiece, comprising the following steps: while supplying an abrasive liquid containing water to the surface of the abrasive layer of an abrasive pad as claimed in any of claims 1 to 11, the abrasive pad is slid relative to the workpiece to grind the workpiece.
Citation Information
Patent Citations
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Polishing pad, method for manufacturing the same, and method for manufacturing polished article
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Urethane resin composition for polishing pad, polishing pad and manufacturing method thereof
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