A wafer pulling structure

Abstract

This invention discloses a wafer pulling structure, including at least one pulling arm, an arc-shaped notch formed by the pulling arm, and an open end. The inner diameter of the arc-shaped notch is adapted to the outer diameter of the wafer, and the width of the open end is smaller than the outer diameter of the wafer. It also includes a through channel extending along the central axis of the arc-shaped notch, and a wafer positioning detection unit. The wafer positioning detection unit is movably disposed in the through channel and at least partially extends through the pulling arm into the arc-shaped notch along a second direction to abut against the wafer. The through channel has a limiting conduit, and a portion of the wafer positioning detection unit is located within this limiting conduit to form a limiting fit between the two in a first direction. The first and second directions are perpendicular or tend to be perpendicular. The wafer positioning detection unit is movably disposed in the through channel, enabling it to not only detect the presence or absence of the wafer but also, in conjunction with the pulling arm, securely clamp the wafer, achieving a two-in-one function of secure wafer clamping and wafer detection.

Claims

1. A wafer pulling structure, comprising at least one pulling arm (1), an arc-shaped notch (2) formed by the pulling arm (1), and an opening end (3), wherein the inner diameter of the arc-shaped notch (2) is adapted to the outer diameter of a wafer (4), the width of the opening end (3) is smaller than the outer diameter of the wafer (4), and the wafer (4) is hung on the opening end (3), characterized in that: it further comprises a through channel (8) extending along the central axis of the arc-shaped notch (2), and a wafer positioning detection unit (9), wherein the through channel (8) extends along the central axis of the arc-shaped notch (2), and the wafer positioning detection unit (9) extends along the central axis of the arc-shaped notch (2). The through channel (8) is located inside the lifting arm (1), and the wafer positioning detection unit (9) is movably located in the through channel (8), and at least part of it can pass through the lifting arm (1) along the second direction and extend into the arc-shaped notch (2) to abut against the wafer (4). The through channel (8) has a limiting channel (81), and part of the wafer positioning detection unit (9) is located in the limiting channel (81) to form a limiting fit between the two in the first direction. The first direction and the second direction are perpendicular or tend to be perpendicular. The wafer positioning detection unit (9) includes a flat pole (5) movably disposed in the through channel (8) and a sensor (6) connected to the flat pole (5). The flat pole (5) can pass through the lifting arm (1) and extend into the arc-shaped notch (2) to abut against the wafer (4). The sensor (6) is used to sense whether the lifting arm (1) is holding the wafer (4). The lifting arm (1) has a first mounting groove (12). One end of the flat pole (5) is located in the first mounting groove (12), and the other end passes through the through channel (8) of the lifting arm (1) and extends into the arc-shaped notch (2). Part of the wafer positioning detection unit (9) is located in the first mounting groove (12). The flat pole (5) and the positioning pipe (81) form a third-direction positioning fit so that the flat pole (5) is located in the plane of the arc-shaped notch (2), so that the flat pole (5) plays the role of a flat pole that carries objects at both ends and limits the middle.

2. The wafer pulling structure as claimed in claim 1, characterized in that: the sensing element (6) is disposed at the end of the flat member (5) for sensing whether the flat member (5) is in contact with the wafer (4).

3. The wafer pulling structure as claimed in claim 1, characterized in that: the sensing element (6) is disposed on the side of the flat member (5) for sensing the distance of relative movement of the flat member (5) relative to the lifting arm (1), and the through channel (8) has an enlarged diameter area (82) for accommodating the sensing element (6).

4. The wafer pulling structure as claimed in claim 1, characterized in that: the end of the flat member (5) is connected to a contact end (51), which has a receiving groove (52), the opposite side walls of the receiving groove (52) being flared cones.

5. The wafer pulling structure as claimed in claim 4, characterized in that: a second mounting groove (11) for receiving a contact end (51) is provided between the pulling arms (1).

6. The wafer pulling structure as claimed in claim 1, characterized in that: the moving path of the flat member (5) coincides with or tends to coincide with the center line of the arc-shaped notch (2); the limiting channel (81) and part of the wafer limiting detection unit (9) form a third-direction limiting fit, so that the flat member (5) is located in the plane of the arc-shaped notch (2).

7. The wafer lifting structure as claimed in claim 6, characterized in that: the flat member (5) has at least a first stroke and a second stroke, when the flat member (5) travels the first stroke, it abuts against the outer wall of the wafer (4) to cooperate with the lifting arm (1) to clamp the wafer (4), and the second stroke is greater than the first stroke.

8. The wafer pulling structure as claimed in claim 1, characterized in that: it further includes a base (7), the pulling arm (1) is connected to the base (7); the base (7) is connected to a limiting member (71), and the flat member (5) is movably connected to the limiting member (71) in a concentric and coaxial manner.

9. The wafer pulling structure as claimed in claim 8, characterized in that: the pulling arm (1) has a first mounting groove (12), and the limiting member (71) is located in the first mounting groove (12).

10. The wafer pulling structure as claimed in claim 8, characterized in that: the flat member (5) and the limiting member (71) are parts of a cylinder.

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