Reactor system, and substrate processing method

Abstract

A reactor system may include a plurality of reaction chambers; a plurality of transfer chambers; and / or at least two gate valves, etc., coupled to each of the plurality of reaction chambers. One of the at least two gate valves, a first gate valve, may fluidly couple one of the plurality of reaction chambers, a first separate reaction chamber, to one of the plurality of transfer chambers, a first transfer chamber, and one of the at least two gate valves, a second gate valve, may fluidly couple one of the first separate reaction chambers to one of the plurality of transfer chambers, a second transfer chamber. In various embodiments, each of the plurality of transfer chambers may include a transfer tool, wherein each transfer tool may be configured to transfer a substrate into and / or out of the plurality of reaction chambers.

Description

Reactor system with multi-directional reaction chambers This disclosure generally relates to reactor systems, specifically to reactor systems comprising one or more multi-directional reaction chambers. For example, a reactor system may include various configurations of reaction chambers, substrate transfer chambers (TCs), load lock chambers (LLCs), and / or similar chambers or modules for processing substrates. Referring to the reaction chamber configuration 90 shown in Figure 2, some reaction chambers 60 may be arranged around and / or coupled to a substrate transfer chamber 80, which includes a transfer tool 85 for transferring substrates between the reaction chambers 60. In another embodiment of the reactor system 91 shown in Figure 3, some reaction chambers 61 may surround and / or be coupled to one or more substrate transfer chambers (e.g., substrate transfer chambers 81 and 82). Each substrate transfer chamber may include one or more transfer tools (e.g., transfer tool 86 included in substrate transfer chamber 81 and transfer tool 87 included in substrate transfer chamber 82). Such embodiments of the reactor system may include a reaction chamber having a gate configured to allow a transfer substrate to enter and exit individual reaction chambers (e.g., a gate that fluidly couples an individual reaction chamber to a substrate transfer chamber and / or a load-locking chamber (such as load-locking chamber 70 or 71)). Transfer tools in a reactor system can be configured to transfer substrates between chambers (e.g., between reaction chambers) to initiate or during a processing method. For example, substrates may be transferred between different reaction chambers in a reactor system for different steps within a substrate processing method (e.g., to manufacture a semiconductor). However, if the transfer tool is required to complete the transfer of two or three (or more) substrates between reaction chambers within a limited timeframe required by the substrate processing method, the transfer tool may be unable to keep up with the required substrate transfers within the specified time. In other words, if too many substrate transfers are required between reaction chambers in the reactor system during the processing method, substrate "traffic jams" may occur, causing delays in the substrate transfers between reaction chambers relative to the desired timing of such transfers and subsequent processing steps. Therefore, substrates in one reaction chamber of a reactor system (such as reactor system 90 or 91) may need to remain in that reaction chamber after the processing steps in that chamber have been completed before being transferred to another reaction chamber. Such waiting can reduce the efficiency of the reactor system in producing finished products (e.g., semiconductors) and / or reduce the quality of the finished products. This disclosure is provided to introduce a series of concepts in a simplified form. These concepts are further elaborated in the detailed description of illustrative examples in the following disclosure. This disclosure is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. In various embodiments, a reactor system is provided. The reactor system disclosed herein may include a plurality of reaction chambers; a plurality of transfer chambers; and / or at least two gate valves, etc., coupled to each of the plurality of reaction chambers. One of the at least two gate valves, a first gate valve, may fluidly couple one of the plurality of reaction chambers, a first separate reaction chamber, to one of the plurality of transfer chambers, a first transfer chamber, and one of the at least two gate valves, a second gate valve, may fluidly couple the first separate reaction chamber to one of the plurality of transfer chambers, a second transfer chamber. In various embodiments, each of the plurality of transfer chambers may include a transfer tool, wherein each transfer tool may be configured to transfer a substrate into and / or out of a plurality of the plurality of reaction chambers (e.g., at least two or at most two). In various embodiments, a reactor system may include a first reaction chamber; a first reaction chamber first gate valve coupled to the first reaction chamber and configured to allow the transfer of a substrate into and / or out of the first reaction chamber; a first transfer chamber, wherein the first transfer chamber is in fluid communication with the first reaction chamber via the first reaction chamber first gate valve in response to the opening of the first reaction chamber first gate valve, wherein the reactor system is configured to allow the transfer of a substrate between the first reaction chamber and the first transfer chamber through the first reaction chamber first gate valve; a first reaction chamber second gate valve coupled to the first reaction chamber and configured to allow the transfer of a substrate into and / or out of the first reaction chamber; and / or a second transfer chamber, in fluid communication with the first reaction chamber via the first reaction chamber second gate valve in response to the opening of the first reaction chamber second gate valve, wherein the reactor system is configured to allow the transfer of a substrate between the first reaction chamber and the second transfer chamber through the first reaction chamber second gate valve. In various embodiments, the first transfer chamber and the second transfer chamber may be located on opposite sides of the first reaction chamber. In various embodiments, the first transfer chamber and the second transfer chamber may be configured to be less than 180 degrees apart from each other relative to the first reaction chamber. In various embodiments, a reactor system may further include a second reaction chamber; and a first gate valve for the second reaction chamber coupled to the second reaction chamber and configured to allow a transfer substrate to enter and / or exit the second reaction chamber. The second reaction chamber may be in fluid communication with a second transfer chamber via the first gate valve in response to opening of the second reaction chamber first gate valve. In various embodiments, a reactor system may further include a second gate valve for the second reaction chamber coupled to the second reaction chamber. The second reaction chamber may be in fluid communication with a first transfer chamber via the second gate valve in response to opening of the second reaction chamber second gate valve. In various embodiments, a reactor system may further include a third transfer chamber; and / or a second gate valve for a second reaction chamber coupled to the second reaction chamber. The second reaction chamber may be in fluid communication with the third transfer chamber via the second gate valve in response to the opening of the second gate valve for the second reaction chamber. In various embodiments, a reactor system may further include a third reaction chamber; and / or a third reaction chamber first gate valve coupled to the third reaction chamber and configured to allow a transfer substrate to enter and / or exit the third reaction chamber. The third reaction chamber may be in fluid communication with the third transfer chamber via the third reaction chamber first gate valve in response to opening of the third reaction chamber first gate valve. In various embodiments, a reactor system may further include a second gate valve for a third reaction chamber coupled to the third reaction chamber. The third reaction chamber may be in fluid communication with at least one of a first or second transfer chamber via the second gate valve in response to opening of the third reaction chamber second gate valve. In various embodiments, a reactor system may further include a fourth transfer chamber; and / or a third gate valve for a third reaction chamber coupled to the third reaction chamber. The third reaction chamber may be in fluid communication with the fourth transfer chamber via the third gate valve in response to opening of the third reaction chamber third gate valve. In various embodiments, a reactor system may further include a fourth transfer chamber; and / or a second gate valve for a third reaction chamber coupled to the third reaction chamber. The third reaction chamber may be in fluid communication with the fourth transfer chamber via the second gate valve in response to the opening of the second gate valve. In various embodiments, a reactor system may further include a third gate valve for a first reaction chamber coupled to the first reaction chamber. The fourth transfer chamber may be in fluid communication with the first reaction chamber via the third gate valve in response to the opening of the third gate valve. In various embodiments, a reactor system may further include a fourth reaction chamber; and / or a first gate valve for the fourth reaction chamber, coupled to the fourth reaction chamber and configured to allow a transfer substrate to enter and / or exit the fourth reaction chamber. The fourth reaction chamber may be in fluid communication with a fourth transfer chamber via the first gate valve in response to opening of the first gate valve. In various embodiments, a reactor system may further include a second gate valve for the fourth reaction chamber, coupled to the fourth reaction chamber. The fourth reaction chamber may be in fluid communication with a first transfer chamber via the second gate valve in response to opening of the second gate valve. In various embodiments, a method may include transferring a first substrate to a first reaction chamber via a first transfer tool included in a first transfer chamber through a first gate valve of a first reaction chamber coupled to a first reaction chamber, wherein the first reaction chamber and the first transfer chamber are in fluid communication in response to the opening of the first gate valve of the first reaction chamber; transferring the first substrate from the first reaction chamber via a second transfer tool included in a second transfer chamber through a second gate valve of a first reaction chamber coupled to a first reaction chamber, wherein the second transfer chamber is in fluid communication with the first reaction chamber in response to the opening of the second gate valve of the first reaction chamber; transferring a substrate to a second reaction chamber via a second transfer tool through a first gate valve of a second reaction chamber coupled to a second reaction chamber, wherein the second reaction chamber is in fluid communication with the second transfer chamber in response to the opening of the first gate valve of the second reaction chamber; and / or transferring a substrate from the second reaction chamber. In various embodiments, transferring the substrate from the second reaction chamber may be accomplished via a first transfer tool through a second gate valve of a second reaction chamber coupled to a second reaction chamber, wherein the second reaction chamber and the first transfer chamber are in fluid communication in response to the opening of the second gate valve of the second reaction chamber. In various embodiments, this method may further include applying a first material to the substrate in the first reaction chamber for a first duration before transferring the substrate from the first reaction chamber; and / or applying a second material to the substrate in the second reaction chamber for a second duration before transferring the substrate from the second reaction chamber. The first duration and the second duration may be the same. In various embodiments, the transfer of the substrate from the second reaction chamber may be accomplished via a third transfer tool included in a third transfer chamber and through a second gate valve of the second reaction chamber coupled to the second reaction chamber, wherein the second reaction chamber and the third transfer chamber are in fluid communication in response to the opening of the second gate valve of the second reaction chamber. In various embodiments, this method may further include: applying a first material to the substrate in the first reaction chamber for a first duration prior to transferring the substrate from the first reaction chamber; applying a second material to the substrate in the second reaction chamber for a second duration prior to transferring the substrate from the second reaction chamber; transferring the substrate to the third reaction chamber via the third transfer tool through a first gate valve of the third reaction chamber coupled to the third reaction chamber, wherein the third reaction chamber is in fluid communication with the third transfer chamber in response to the opening of the first gate valve of the third reaction chamber; and / or applying a third material to the substrate in the third reaction chamber for a third duration. In various embodiments, the second material and the third material may be the same, and the first duration, the second duration, and the third duration may be the same. For the purpose of summarizing this disclosure and the advantages achieved over the prior art, certain objectives and advantages of this disclosure have been described above. It should be understood, of course, that not all such objectives or advantages need to be achieved according to any specific embodiment of this disclosure. Therefore, for example, those skilled in the art will recognize that one or a set of advantages as taught or suggested herein can be achieved or optimized in a manner that does not necessarily achieve other objectives or advantages that may be taught or suggested herein. All of these embodiments are intended to fall within the scope of this disclosure. Those skilled in the art will readily understand these and other embodiments from certain embodiments described in detail below with reference to the accompanying drawings. This disclosure is not limited to any specific embodiments discussed. While certain embodiments and examples are disclosed below, those skilled in the art will understand that this disclosure extends beyond the specific embodiments and / or uses disclosed herein, as well as their obvious modifications and equivalents. Therefore, it is intended that the scope of this disclosure should not be limited to the specific embodiments described herein. The drawings presented herein are not intended to represent actual views of any specific material, device, structure, or apparatus, but are merely representations used to describe embodiments of this disclosure. As used herein, the term "substrate" may refer to any underlying material on which devices, circuits, or films may be used or formed. As used herein, the term "atomic layer deposition (ALD)" can refer to a vapor deposition process in which deposition cycles (preferably multiple successive deposition cycles) are performed in a process chamber. During each cycle, a precursor may be chemisorbed onto the deposition surface (e.g., a substrate surface or an underlying surface previously deposited, such as material from a previous ALD cycle), forming a monolayer or sub-monolayer that is not readily reactive with additional precursors (i.e., a self-limiting reaction). Subsequently, if necessary, reactants (e.g., another precursor or a reactive gas) may be introduced into the process chamber to convert the chemisorbed precursor into the desired material on the deposition surface. This reactant may be able to further react with the precursor. Furthermore, a purging step may be used during each cycle to remove excess precursor from the process chamber, and / or after the conversion of the chemisorbed precursor, to remove excess reactants and / or reaction byproducts from the process chamber. Furthermore, when performed using alternating pulses of precursor components, reactive gases, and purging (e.g., inert carrier) gases, the term "atomic layer deposition" as used herein also refers to processes specified by related terms, such as chemical vapor atomic layer deposition, atomic layer epitaxy (ALE), molecular beam epitaxy (MBE), gas source molecular beam epitaxy (MBE), or organometallic molecular beam epitaxy (MBE), and chemical beam epitaxy. As used herein, the term "chemical vapor deposition (CVD)" can refer to any process in which a substrate is exposed to one or more volatile precursors, which react and / or decompose on the substrate surface to create the desired deposition. As used herein, the terms "film" and "thin film" can refer to any continuous or discontinuous structure and material deposited by the methods disclosed herein. For example, "film" and "thin film" can include two-dimensional (2D) materials, nanorods, nanotubes, or nanoparticles, or even partial or complete molecular layers, or partial or complete atomic layers, or atomic and / or molecular clusters. "Film" and "thin film" can contain materials or layers that have pinholes but are still at least partially continuous. As used herein, the term "contaminant" may refer to any undesirable material disposed within a reaction chamber that can affect the purity of a substrate or layer disposed within the reaction chamber, or any undesirable material in any component of the reactor system. The term "contaminant" may refer to, but is not limited to, undesirable deposits, metallic and non-metallic particles, impurities, and waste products disposed within the reaction chamber or other components of the reactor system. As used herein, the term "gas" may include vaporized solids and / or liquids and may consist of a single gas or a mixture of gases. Reactor systems for atomic layer deposition, chemical vapor deposition, and / or the like can be used in a variety of applications, including depositing and etching materials on substrate surfaces. In various embodiments, referring to Figure 1, reactor system 50 may include a reaction chamber 4; a base 6 for holding substrate 30 during processing; a gas distribution system 8 (e.g., a spray nozzle) for distributing one or more reactants to the surface of substrate 30; one or more reactant sources 10, 12 and / or carriers and / or purge gas sources 14, all fluidly coupled to reaction chamber 4 via lines 16 to 20; and valves or controllers 22 to 26. Reactant gases or other materials from reactant sources 10, 12 may be applied to substrate 30 within reaction chamber 4. Purge gas from purge gas source 14 may flow through and through reaction chamber 4 to remove any excess reactant or other unwanted material from reaction chamber 4. System 50 may also include a vacuum source 28 fluidly coupled to reaction chamber 4, which may be configured to extract reactants, purge gases, and / or other materials from reaction chamber 4. In various embodiments, a substrate processing method may include multiple steps, which may be performed in multiple reaction chambers. For example, a first precursor may be applied to the substrate in one reaction chamber for a determined duration, the substrate may be transferred to another reaction chamber, and a second precursor may then be applied to the substrate. Alternatively or additionally, a first layer may be deposited in the first reaction chamber, and additional reaction chambers may be used for etching, cleaning, and / or for additional deposition processes. Timely transfer of the substrate between reaction chambers can facilitate more efficient substrate processing in the reactor system and / or better finished products (e.g., particularly for finished products produced by processing methods involving time-sensitive steps and / or unstable compounds that may degrade or otherwise react if the processing is not carried out within the desired timeframe and / or without exposure to the surrounding environment). In various embodiments, the reactor system may include a plurality of reaction chambers (e.g., each within a separate reactor). Each reactor and / or reaction chamber may have a peripheral wall. The peripheral wall may enclose the reaction chamber space in which a substrate may be disposed for processing. In various embodiments, the reactor system may include at least two gate valves, etc., coupled to each reaction chamber (e.g., coupled to the peripheral wall of each reaction chamber), wherein each gate valve may be configured to selectively allow access to a separate reaction chamber. That is, each gate valve may open to allow transfer of a substrate into and out of a separate reaction chamber (fluidly coupling the separate reaction chamber to another chamber of the reactor system (such as a transfer chamber)) and close to at least partially seal the reaction chamber to prevent contact with the surrounding environment. For example, the gate valve for obtaining access to a separate reaction chamber may close during substrate processing in the separate reaction chamber. Since at least two gate valves may be coupled to each reaction chamber, and each gate valve may allow transfer of a substrate into and out of each reaction chamber to different locations within the reactor system (e.g., other chambers), such reaction chambers may be multidirectional reaction chambers. The reactor system may further include a plurality of transfer chambers. Each transfer chamber may include a peripheral wall and a transfer tool (e.g., a transfer arm) disposed therein. The transfer tool may be configured to transfer substrates into and out of one or more reaction chambers and / or into and out of individual transfer chambers. In various embodiments, transfer chambers may be coupled to at least two gate valves, which allow fluid communication between other chambers in the reactor system (e.g., allow substrate transfer between them). In various embodiments, each reaction chamber in the reactor system may be coupled to and / or adjacent to at least two transfer chambers. Similarly, each transfer chamber may be coupled to and / or adjacent to at least two reaction chambers. For example, a first of at least two gate valves coupled to a reaction chamber may fluidly couple the reaction chamber to a first transfer chamber of a plurality of transfer chambers, such that substrates can be transferred between the first transfer chamber and the reaction chamber in response to the opening of individual gate valves. The second of at least two gate valves coupled to the reaction chamber can couple the reaction chamber fluid to a second transfer chamber of a plurality of transfer chambers, such that the substrate can be transferred between the second transfer chamber and the reaction chamber in response to the opening of individual gate valves. In various embodiments, the reaction chamber can be coupled to any suitable number of gate valves, each of which can couple the reaction chamber to a transfer chamber. The configuration of the reaction chambers and transfer chambers in the reactor system can be any suitable arrangement such that each reaction chamber can be coupled to at least two gate valves, each gate valve fluidly coupling the reaction chamber to the transfer chamber (thus the reaction chamber is fluidly coupled to at least two transfer chambers, each gate valve corresponding to one transfer chamber), and each transfer chamber is coupled to two or more chambers and / or adjacent to two or more chambers (e.g., two or three chambers, which may include a reaction chamber, a load-locking chamber, a buffer chamber, and / or any other space in which a transfer plate can be moved in and out via a transfer tool in the transfer chamber). Examples of such reactor system reaction chamber and transfer chamber configurations are illustrated in Figures 4A to 4C, 5A, and 5B, which are further discussed herein. The configuration of reaction chambers and transfer chambers in such reactor systems can result in a reduced number of substrate transfers for each transfer chamber, thereby reducing or minimizing any substrate transfer delays between reaction chambers. In other words, each transfer chamber can have a reduced number of possible substrate transfers (e.g., two or three), so that substrate "clogging" is minimized or prevented (rather than transfer chambers with six or more possible substrate transfers, such as those in the reactor systems depicted in Figures 2 and 3). In various embodiments, to achieve this benefit, each transfer chamber in the reactor system can be adjacent to and / or coupled to up to two or three chambers (e.g., reaction chambers, load-locking chambers, buffer chambers, and / or the like). Thus, in such embodiments, each transfer chamber and / or the transfer apparatus contained therein can have up to two or three possible substrate transfers to be performed between chambers. Referring to Figure 4A, a reactor system (e.g., reactor system 400A) may include a first reaction chamber (e.g., first reaction chamber 110). The first reaction chamber 110 may include a first peripheral wall 112. The peripheral wall of the reaction chamber may have any suitable design or shape. For example, the peripheral wall of the reaction chamber may include several peripheral wall sides (e.g., three, four, six, or eight sides), wherein one or more of the peripheral wall sides are coupled to a gate valve. The gate valve may be configured to open and close, respectively exposing or at least partially sealing the reaction chamber space of the first reaction chamber 110. In response to the gate valve opening, the reaction chamber coupled to the gate valve may be in fluid communication with another chamber in the reactor system. In response to the gate valve closing, the reaction chamber coupled to the gate valve may be at least partially sealed to prevent contact with another chamber (e.g., an adjacent chamber) in the reactor system. As depicted in Figure 4A, the first reaction chamber 110 may be coupled to a first reaction chamber first gate valve 114. The first reaction chamber first gate valve 114 may allow a transfer substrate to enter and exit the first reaction chamber 110. In various embodiments, reactor system 400A may include a first transfer chamber 210 having a first transfer chamber peripheral wall 212. The first transfer chamber 210 may be configured adjacent to, and / or coupled to, the first reaction chamber 110 and / or the first reaction chamber first gate valve 114. The first reaction chamber first gate valve 114 may (e.g., in response to opening of the first reaction chamber first gate valve 114) cause fluid communication between the first reaction chamber 110 and the first transfer chamber 210. Therefore, a first transfer tool 213 included in the first transfer chamber 210 may be able to transfer one or more substrates into and out of the first reaction chamber 110 through the first reaction chamber first gate valve 114. Another chamber of the reactor system (e.g., reactor system 400A) may be adjacent to and / or coupled to the first transfer chamber 210. A first transfer tool 213 may receive a substrate to be transferred to the first reaction chamber 110 from the other chamber and / or the first transfer tool 213 may transfer a substrate from the first reaction chamber 110 and / or another chamber in reactor system 400A to another chamber. In various embodiments, a load-locking chamber (LLC) 105 may be coupled to and / or adjacent to the first transfer chamber 210. The load-locking chamber 105 may be configured to hold substrates awaiting processing and / or already processed substrates. Thus, the first transfer chamber 210 may transfer substrates awaiting processing from the load-locking chamber 105 to the first reaction chamber 110, and / or transfer finished products (e.g., processed substrates) from the final reaction chamber used in the process to the load-locking chamber 105. The final reaction chamber in the reactor system may be the final reaction chamber used in the process, or the substrate may be loaded into the reaction chamber of the load-locking chamber from its place of processing via the transfer chamber. In the embodiments disclosed herein, the first transfer chamber in the reactor system may be a transfer chamber configured to pick up and / or transport a substrate to and from the load-locking chamber. The first transfer chamber and the load-locking chamber may be coupled to a load-locking chamber gate valve (e.g., load-locking chamber gate valve 107), through which the substrate may be transferred between the first transfer chamber and the load-locking chamber. In various embodiments, reactor system 400A may include a second transfer chamber 220A having a second transfer chamber peripheral wall 222A. The second transfer chamber 220A may be coupled to and / or adjacent to the first reaction chamber 110. Reactor system 400A may further include a first reaction chamber second gate valve 116A coupled to the first reaction chamber 110 and / or the second transfer chamber 220A. The second transfer chamber 220A may be coupled to and / or adjacent to the first reaction chamber 110 and / or the first reaction chamber second gate valve 116A. The first reaction chamber second gate valve 116A may (e.g., in response to opening of the first reaction chamber second gate valve 116A) cause fluid communication between the first reaction chamber 110 and the second transfer chamber 220A. Therefore, the second transfer tool 223A included in the second transfer chamber 220A may be able to transfer one or more substrates into and out of the first reaction chamber 110 through the second gate valve 116A of the first reaction chamber. The first transfer chamber 210 and the second transfer chamber 220A may be coupled to the first reaction chamber 110 in any suitable configuration relative to each other. In various embodiments, the first transfer chamber 210 and the second transfer chamber 220A may be disposed on opposite sides of the first reaction chamber 110. In various embodiments, the first transfer chamber 210 and the second transfer chamber 220A may be configured to be 180 degrees apart from each other, together with the first reaction chamber 110 therebetween. In various embodiments, the first transfer chamber 210 and the second transfer chamber 220A may be configured to be less than 180 degrees apart from each other (e.g., about 90 degrees, about 120 degrees, or about 60 degrees apart). In this context, "about" means ±20 or 30 degrees. As depicted in reactor system 400A, the first transfer chamber 210 and the second transfer chamber 220A may be configured to be 90 degrees apart from each other. In various embodiments, the reactor system (e.g., reactor system 400A) may include a second reaction chamber (e.g., second reaction chamber 120A). The second reaction chamber 120A may include a second peripheral wall 122A. The second reaction chamber 120A may be adjacent to and / or coupled to the second transfer chamber 220A. The reactor system 400A may include a first gate valve 124A for a second reaction chamber, which is coupled to a second reaction chamber 120A and / or a second transfer chamber 220A. In response to the opening of the first gate valve 124A, it fluidly couples the second transfer chamber 220A to the second reaction chamber 120A, allowing the transfer of a substrate into and out of the second reaction chamber 120A to occur via the first gate valve 124A. This substrate transfer can be accomplished using a second transfer tool 223A. In various embodiments, reactor system 400A may further include a second reaction chamber second gate valve 126A. The second reaction chamber second gate valve 126A may be coupled to a second reaction chamber 120A and / or a first transfer chamber 210. In response to the opening of the second reaction chamber second gate valve 126A, it may fluidly couple the second reaction chamber 120A and the first transfer chamber 210, allowing the transfer of a substrate into and out of the second reaction chamber 120A to occur via the second reaction chamber second gate valve 126A. Such substrate transfer may be accomplished by a first transfer tool 213. The second reaction chamber 120A and the first transfer chamber 210 may be adjacent and / or coupled. In the chamber configuration shown in reactor system 400A, the second reaction chamber 120A may be the final reaction chamber from which the substrate is transferred to the load-locking chamber 105 after processing. Therefore, in various embodiments, the reactor system (e.g., reactor system 400A) may include two reaction chambers and two transfer chambers, equally arranged in two rows, each row containing two chambers (i.e., a two-by-two configuration), wherein the load-locking chamber is coupled to at least one of the transfer chambers (e.g., the first transfer chamber). The load-locking chamber may be coupled to the transfer chamber in any suitable location. For example, the load-locking chamber may be positioned closer to one of the reaction chambers in the reactor system than the other reaction chamber. Referring to reactor system 400A, load locking chamber 105 is positioned on the side of first transfer chamber 210 opposite to first reaction chamber 110 (and therefore closer to second reaction chamber 120A), but in various embodiments, for example, load locking chamber 105 may be positioned on the side of first transfer chamber 210 opposite to second reaction chamber 120A (and therefore closer to first reaction chamber 110). Each reaction chamber in reactor system 400A has at least two gate valves coupled to it, and is therefore a multidirectional reaction chamber because there is more than one inlet / outlet for the substrate to be passed into and out of each reaction chamber. To process a substrate in reactor system 400A, the substrate can be transferred from load-locking chamber 105 to first reaction chamber 110 via first transfer tool 213 through first transfer chamber 210. First transfer tool 213 can (in response to opening of load-locking chamber gate valve 107) obtain the substrate from load-locking chamber 105 through load-locking chamber gate valve 107 and transfer the substrate to first transfer chamber 210. After the substrate enters from load-locking chamber 105 and / or passes through first transfer chamber 210, load-locking chamber gate valve 107 can close and / or first reaction chamber gate valve 114 can open. First transfer tool 213 can (in response to opening of first reaction chamber gate valve 114) transport the substrate to first reaction chamber 110 through first reaction chamber gate valve 114. After the substrate enters and / or is disposed in the first reaction chamber 110, the first gate valve 114 of the first reaction chamber can be closed to at least partially seal the first reaction chamber 110, so that one or more processing steps can occur (e.g., applying one or more gases (such as reactant gases and / or purge gases) to the substrate in the first reaction chamber 110). During the processing of the substrate in the first reaction chamber 110, the second gate valve 116A of the first reaction chamber can also be closed to at least partially seal the first reaction chamber 110. After the substrate processing in the first reaction chamber 110 is completed, the second gate valve 116A of the first reaction chamber can be opened, and the second transfer tool 223A can obtain the substrate from the first reaction chamber 110 and transfer the substrate to the second transfer chamber 220A. After the substrate enters from the first reaction chamber 110 and / or passes through the second transfer chamber 220A, the second gate valve 116A of the first reaction chamber can be closed, and / or the first gate valve 124A of the second reaction chamber can be opened. The second transfer tool 223A can (in response to the opening of the first gate valve 124A of the second reaction chamber) transport the substrate to the second reaction chamber 120A through the first gate valve 124A of the second reaction chamber. After the substrate enters and / or passes through the second reaction chamber 120A, the first gate valve 124A of the second reaction chamber can be closed to at least partially seal the second reaction chamber 120A, so that one or more processing steps can occur to the substrate in the second reaction chamber 120A. During substrate processing in the second reaction chamber 120A, the second gate valve 126A of the second reaction chamber can also be closed to at least partially seal the second reaction chamber 120A. After the substrate processing in the second reaction chamber 120A is completed, the second gate valve 126A of the second reaction chamber can be opened, and the first transfer tool 213 can obtain the substrate from the second reaction chamber 120A and transfer the substrate to the first transfer chamber 210 (or back to the first reaction chamber 110 for further processing). A load-locking chamber can be coupled to another gate valve (e.g., gate valve 108), which can be configured to allow the substrate to be loaded into the load-locking chamber for processing (e.g., by an operator of the reactor system) or unloaded from the load-locking chamber after processing. The processes occurring in the first reaction chamber 110 and / or the second reaction chamber 120A may include the same or different substrate processes. That is, for any suitable duration and using any suitable number of steps, the first process may occur in the first reaction chamber 110, and the second process may occur in the second reaction chamber 120A. For example, the process may include two steps (e.g., applying a first material to the substrate, and then applying a second material to the substrate), one step performed in the first reaction chamber 110 and the other in the second reaction chamber 120A. As another example, the process may include a single step that may include a processing duration. The entire processing duration may be performed in either the first reaction chamber 110 or the second reaction chamber 120A, or a process lasting half the duration may occur in the first reaction chamber 110, and a process lasting the other half the duration may occur in the second reaction chamber 120A. It should be noted that the substrate may travel between the chambers in the reactor system in any suitable order (e.g., the reverse order described herein). Referring to Figure 4B, reactor system 400B may include a load-locking chamber 105, a load-locking chamber gate valve 107, a first transfer chamber 210, a first reaction chamber 110, and a first reaction chamber gate valve 114, and any of its components, similar to reactor system 400A of Figure 4A discussed herein. In various embodiments, reactor system 400B may include a second transfer chamber 220B coupled to and / or adjacent to the first reaction chamber 110. Unlike the second transfer chamber 220A in reactor system 400A, the second transfer chamber 220B may be located on the side of the first reaction chamber 110 opposite to the first transfer chamber 210. Reactor system 400B may include a first reaction chamber second gate valve 116B coupled to the first reaction chamber 110 and / or the second transfer chamber 220B. The first reaction chamber second gate valve 116B may (e.g., in response to opening of the first reaction chamber second gate valve 116B) cause fluid communication between the first reaction chamber 110 and the second transfer chamber 220B. Therefore, the second transfer tool 223B included in the second transfer chamber 220B can transfer one or more substrates into and out of the first reaction chamber 110 through the second gate valve 116B of the first reaction chamber. In various embodiments, the reactor system (e.g., reactor system 400B) may include a second reaction chamber (e.g., second reaction chamber 120B). The second reaction chamber 120B may include a second peripheral wall 122B. The second reaction chamber 120B may be adjacent to and / or coupled to the second transfer chamber 220A. The reactor system 400B may include a first gate valve 124B for a second reaction chamber, which is coupled to a second reaction chamber 120B and / or a second transfer chamber 220B. In response to the opening of the first gate valve 124B, it fluidly couples the second transfer chamber 220B to the second reaction chamber 120B, allowing the transfer of a substrate into and out of the second reaction chamber 120B to occur via the first gate valve 124B. This substrate transfer can be accomplished using a second transfer tool 223B. In various embodiments, reactor system 400B may include a third transfer chamber (e.g., third transfer chamber 230B). Third transfer chamber 230B may include a third peripheral wall 232B. Third transfer chamber 230B may be adjacent to and / or coupled to the second reaction chamber 120B. Third transfer chamber 230B may include a third transfer tool 233B configured to transfer a substrate into and out of the third transfer chamber 230B. In various embodiments, reactor system 400B may further include a second gate valve 126B for a second reaction chamber. The second gate valve 126B may be coupled to a second reaction chamber 120B and / or a third transfer chamber 230B. In response to the opening of the second gate valve 126B, it may fluidly couple the second reaction chamber 120B to the third transfer chamber 230B, allowing the transfer of substrates into and out of the second reaction chamber 120B to occur via the second gate valve 126B. Such substrate transfer may be accomplished by a third transfer tool 233B. In various embodiments, the reactor system (e.g., reactor system 400B) may include a third reaction chamber (e.g., third reaction chamber 130B). The third reaction chamber 130B may include a third peripheral wall 132B. The third reaction chamber 130B may be adjacent to and / or coupled to the third transfer chamber 230B. The reactor system 400B may include a first gate valve 134B for a third reaction chamber, which is coupled to a third reaction chamber 130B and / or a third transfer chamber 230B. In response to the opening of the first gate valve 134B, it fluidly couples the third transfer chamber 230B to the third reaction chamber 130B, allowing the transfer of substrates into and out of the third reaction chamber 130B to occur via the first gate valve 134B. This substrate transfer can be accomplished by a third transfer tool 233B. In various embodiments, reactor system 400B may further include a third reaction chamber second gate valve 136B. The third reaction chamber second gate valve 136B may be coupled to a third reaction chamber 130B and / or a first transfer chamber 210. In response to the opening of the third reaction chamber second gate valve 136B, it may fluidly couple the third reaction chamber 130B and the first transfer chamber 210, allowing the transfer of substrates into and out of the third reaction chamber 130B to occur via the third reaction chamber second gate valve 136B. Such substrate transfer may be accomplished by a first transfer tool 213. The third reaction chamber 130B and the first transfer chamber 210 may be adjacent and / or coupled. In the chamber configuration shown in reactor system 400B, the third reaction chamber 130B may be the final reaction chamber from which the substrate is transferred to the load-locking chamber 105 after processing. Therefore, in various embodiments, the reactor system (e.g., reactor system 400B) may include three reaction chambers and three transfer chambers, arranged in two rows of three chambers each (i.e., a 2x3 configuration), or in two columns of three chambers each (i.e., a 3x2 configuration), wherein the load-locking chamber is coupled to at least one of the transfer chambers (e.g., the first transfer chamber). The load-locking chamber may be coupled to the transfer chamber in any suitable location. For example, the load-locking chamber may be positioned closer to one of the reaction chambers in the reactor system than another reaction chamber. Referring to reactor system 400B, load locking chamber 105 is positioned on the side of first transfer chamber 210 opposite to first reaction chamber 110 (and therefore closer to third reaction chamber 130B), but in various embodiments, for example, load locking chamber 105 may be positioned on the side of first transfer chamber 210 opposite to third reaction chamber 130B (and therefore closer to first reaction chamber 110). Each reaction chamber in reactor system 400B has at least two gate valves coupled to it, and is therefore a multidirectional reaction chamber because there is more than one inlet / outlet for the substrate to be passed into and out of each reaction chamber. To process a substrate in reactor system 400B, the substrate can be transferred from load-locking chamber 105 to first reaction chamber 110 via first transfer chamber 210 and first transfer tool 213. First transfer tool 213 can (in response to opening of load-locking chamber gate valve 107) obtain the substrate from load-locking chamber 105 through load-locking chamber gate valve 107 and transfer the substrate to first transfer chamber 210. After the substrate enters from the load-locking chamber and / or is disposed in first transfer chamber 210, load-locking chamber gate valve 107 can be closed and / or first reaction chamber gate valve 114 can be opened. First transfer tool 213 can (in response to opening of first reaction chamber gate valve 114) transport the substrate to first reaction chamber 110 through first reaction chamber gate valve 114. After the substrate enters and / or is disposed in the first reaction chamber 110, the first gate valve 114 of the first reaction chamber can be closed to at least partially seal the first reaction chamber 110, so that one or more processing steps can occur (e.g., applying one or more gases (such as reactant gases and / or purge gases) to the substrate in the first reaction chamber 110). During the processing of the substrate in the first reaction chamber 110, the second gate valve 116B of the first reaction chamber can also be closed to at least partially seal the first reaction chamber 110. After the substrate processing in the first reaction chamber 110 is completed, the second gate valve 116B of the first reaction chamber can be opened, and the second transfer tool 223B can obtain the substrate from the first reaction chamber 110 and transfer the substrate to the second transfer chamber 220B. After the substrate enters from the first reaction chamber 110 and / or is disposed in the second transfer chamber 220B, the second gate valve 116B of the first reaction chamber can be closed, and / or the first gate valve 124B of the second reaction chamber can be opened. The second transfer tool 223B can (in response to the opening of the first gate valve 124B of the second reaction chamber) transport the substrate to the second reaction chamber 120B through the first gate valve 124B of the second reaction chamber. After the substrate enters and / or is disposed in the second reaction chamber 120B, the first gate valve 124B of the second reaction chamber can be closed to at least partially seal the second reaction chamber 120B, so that one or more processing steps can occur to the substrate in the second reaction chamber 120B. During the processing of the substrate in the second reaction chamber 120B, the second gate valve 126B of the second reaction chamber may also be closed to at least partially seal the second reaction chamber 120B. After the substrate processing in the second reaction chamber 120B is completed, the second gate valve 126B of the second reaction chamber can be opened, and the third transfer tool 233B can obtain the substrate from the second reaction chamber 120B and transfer the substrate to the third transfer chamber 230B. After the substrate enters from the second reaction chamber 120B and / or passes through the third transfer chamber 230B, the second gate valve 126B of the second reaction chamber can be closed, and / or the first gate valve 134B of the third reaction chamber can be opened. The third transfer tool 233B can (in response to the opening of the first gate valve 134B of the third reaction chamber) transport the substrate to the third reaction chamber 130B through the first gate valve 134B of the third reaction chamber. After the substrate enters from and / or passes through the third reaction chamber 130B, the first gate valve 134B of the third reaction chamber can be closed to at least partially seal the third reaction chamber 130B, so that one or more processing steps can occur to the substrate in the third reaction chamber 130B. During the processing of the substrate in the third reaction chamber 130B, the second gate valve 136B of the third reaction chamber may also be closed to at least partially seal the third reaction chamber 130B. After the substrate processing in the third reaction chamber 130B is completed, the second gate valve 136B of the third reaction chamber can be opened, and the first transfer tool 213 can obtain the substrate from the third reaction chamber 130B and transfer the substrate to the first transfer chamber 210 (or back to the first reaction chamber 110 for further processing). The processes occurring in the first reaction chamber 110, the second reaction chamber 120B, and / or the third reaction chamber 130B may include the same or different substrate processes. That is, for any suitable duration and using any suitable number of steps, a first process may occur in the first reaction chamber 110, a second process may occur in the second reaction chamber 120B, and / or a third process may occur in the third reaction chamber 130B. For example, a process may include three steps, one of which is performed in the first reaction chamber 110, one step is performed in the second reaction chamber 120B, and a final step is performed in the third reaction chamber 130B (e.g., where each step has an equal or different duration). As another example, processing the substrate may include a step (e.g., applying a first material to the substrate for a first duration) and a second step (e.g., applying a second material to the substrate for a second duration). However, the second duration may be longer (e.g., twice the length of the first duration). Therefore, the first step can be performed in the first reaction chamber 110, and the second step can be divided between the second reaction chamber 120B and the third reaction chamber 130B (for example, applying the second material to the substrate for half the duration of the second time in the second reaction chamber 120B (which may be equal to the first duration), and applying the third material to the substrate for the other half of the duration of the second time in the third reaction chamber 130B (which may be the same as the second material to complete the second step of the process)). In this example, the process steps can be distributed between the reaction chambers, allowing the substrate to continuously advance through the chambers of the reactor system, thereby minimizing or preventing substrate transfer delays between chambers (i.e., substrates that have completed process steps in a reaction chamber waiting in a reaction chamber or the next transfer chamber to enter a subsequent reaction chamber). As another example, the process may include a single step, which may include a processing duration. The entire processing duration can be performed in any of the first reaction chamber 110, the second reaction chamber 120B, and / or the third reaction chamber 130B, or a processing duration of one-third may occur in the first reaction chamber 110, a processing duration of the second-third may occur in the second reaction chamber 120B, and a processing duration of the final third may occur in the third reaction chamber 130B (or any other division of processing and / or processing duration among at least some of the reaction chambers). It should be noted that the substrate can travel between the chambers in the reactor system in any suitable order (e.g., the reverse order described herein). Referring to Figure 4C, reactor system 400C may include a load-locking chamber 105, a load-locking chamber gate valve 107, a first transfer chamber 210, a first reaction chamber 110, and a first reaction chamber gate valve 114, and any components thereof, similar to reactor systems 400A and 400B discussed herein. Additionally, reactor system 400C may include a first reaction chamber second gate valve 116B and a second transfer chamber 220B, and any components thereof, similar to reactor system 400B. In various embodiments, reactor system 400C may include a second transfer chamber 220B coupled to and / or adjacent to the first reaction chamber 110. Reactor system 400C may include a first reaction chamber second gate valve 116B coupled to and / or the second transfer chamber 220B. The second gate valve 116B of the first reaction chamber can (e.g., in response to the opening of the second gate valve 116B of the first reaction chamber) cause fluid communication between the first reaction chamber 110 and the second transfer chamber 220B. Therefore, the second transfer tool 223B included in the second transfer chamber 220B can transfer one or more substrates into and out of the first reaction chamber 110 through the second gate valve 116B of the first reaction chamber. In various embodiments, the reactor system (e.g., reactor system 400C) may include a second reaction chamber (e.g., second reaction chamber 120C). The second reaction chamber 120C may include a second peripheral wall 122C. The second reaction chamber 120C may be coupled to a second transfer chamber 220B. The second reaction chamber 120C may be positioned opposite 110, with the second transfer chamber 220B between them. As discussed herein, the chambers can be positioned in any suitable configuration, so that the second reaction chamber 120C can be positioned relative to the first reaction chamber 110, with the second transfer chamber 220B between them in any suitable manner. The reactor system 400C may include a first gate valve 124C for a second reaction chamber, which is coupled to a second reaction chamber 120C and / or a second transfer chamber 220B. In response to the opening of the first gate valve 124C, it fluidly couples the second transfer chamber 220B to the second reaction chamber 120C, allowing the transfer of a substrate into and out of the second reaction chamber 120C to occur via the first gate valve 124C. This substrate transfer can be accomplished by a second transfer tool 223B. In various embodiments, reactor system 400C may include a third transfer chamber (e.g., third transfer chamber 230C). Third transfer chamber 230C may include a third peripheral wall 232C. Third transfer chamber 230C may be adjacent to and / or coupled to the second reaction chamber 120C. Third transfer chamber 230C may include a third transfer tool 233C configured to transfer a substrate into and out of the second reaction chamber 120C. In various embodiments, 400C may further include a second gate valve 126C for a second reaction chamber. The second gate valve 126C may be coupled to a second reaction chamber 120C and / or a third transfer chamber 230C. In response to the opening of the second gate valve 126C, it may fluidly couple the second reaction chamber 120C to the third transfer chamber 230C, allowing the transfer of a substrate into and out of the second reaction chamber 120C to occur via the second gate valve 126C. Such substrate transfer may be accomplished by a third transfer tool 233C. In various embodiments, the reactor system (e.g., reactor system 400C) may include a third reaction chamber (e.g., third reaction chamber 130C). The third reaction chamber 130C may include a third peripheral wall 132C. The third reaction chamber 130C may be adjacent to and / or coupled to the third transfer chamber 230C. In various embodiments, the third reaction chamber 130C may be adjacent to and / or coupled to the second transfer chamber 230B. The reactor system 400C may include a first gate valve 134C for a third reaction chamber, which may be coupled to a third reaction chamber 130C and / or a third transfer chamber 230C. In response to the opening of the first gate valve 134C, it may fluidly couple the third transfer chamber 230C to the third reaction chamber 130C, allowing the transfer of substrates into and out of the third reaction chamber 130C to occur via the first gate valve 134C. This substrate transfer may be accomplished by a third transfer tool 233C. In various embodiments, reactor system 400C may include a fourth transfer chamber (e.g., fourth transfer chamber 240C). Fourth transfer chamber 240C may include a fourth peripheral wall 242C. Fourth transfer chamber 240C may be adjacent to and / or coupled to a third reaction chamber 130C. In various embodiments, fourth transfer chamber 240C may be adjacent to and / or coupled to a first reaction chamber 110. Fourth transfer chamber 240C may include a fourth transfer tool 243C configured to transfer a substrate into and out of the third reaction chamber 130C. In various embodiments, 400C may further include a third reaction chamber second gate valve 136C. The third reaction chamber second gate valve 136C may be coupled to a third reaction chamber 130C and / or a fourth transfer chamber 240C. In response to the opening of the third reaction chamber second gate valve 136C, it may fluidly couple the third reaction chamber 130C and the fourth transfer chamber 240C, allowing the transfer of a substrate into and out of the third reaction chamber 130C to occur via the third reaction chamber second gate valve 136C. Such substrate transfer may be accomplished by a fourth transfer tool 243C. In various embodiments, the reactor system (e.g., reactor system 400C) may include a fourth reaction chamber (e.g., fourth reaction chamber 140C). The fourth reaction chamber 140C may include a third peripheral wall 142C. The fourth reaction chamber 140C may be adjacent to and / or coupled to a fourth transfer chamber 240C. In various embodiments, the fourth reaction chamber 140C may be adjacent to and / or coupled to a first transfer chamber 210. In various embodiments, reactor system 400C may include a first gate valve 144C for a fourth reaction chamber, which may be coupled to a fourth reaction chamber 140C and / or a fourth transfer chamber 240C. In response to the opening of the first gate valve 144C, which fluidly couples the fourth reaction chamber 140C to the fourth transfer chamber 240C, the transfer of substrates into and out of the fourth reaction chamber 140C may occur via the first gate valve 144C. Such substrate transfer may be accomplished by a fourth transfer tool 243C. In various embodiments, reactor system 400C may further include a fourth reaction chamber second gate valve 146C. The fourth reaction chamber second gate valve 146C may be coupled to a fourth reaction chamber 140C and / or a first transfer chamber 210. In response to the opening of the fourth reaction chamber second gate valve 146C, it may fluidly couple the fourth reaction chamber 140C to the first transfer chamber 210, allowing the transfer of substrates into and out of the fourth reaction chamber 140C to occur via the fourth reaction chamber second gate valve 146C. Such substrate transfer may be accomplished by a first transfer tool 213. The fourth reaction chamber 140C and the first transfer chamber 210 may be adjacent and / or coupled. In the chamber configuration shown in reactor system 400C, the fourth reaction chamber 140C may be the final reaction chamber from which the substrate is transferred to the load-locking chamber 105 after processing. Therefore, in various embodiments, the reactor system (e.g., reactor system 400C) may include four reaction chambers and four transfer chambers, arranged in two rows of four chambers each (i.e., a two-by-four configuration), or in two columns of four chambers each (i.e., a four-by-two configuration), wherein the load-locking chamber is coupled to at least one of the transfer chambers (e.g., the first transfer chamber). The load-locking chamber may be coupled to the transfer chamber in any suitable location. For example, the load-locking chamber may be positioned closer to one of the reaction chambers in the reactor system than another reaction chamber. Referring to reactor system 400C, load locking chamber 105 is positioned on the side of first transfer chamber 210 opposite to first reaction chamber 110 (and therefore closer to fourth reaction chamber 140C), but in various embodiments, for example, load locking chamber 105 may be positioned on the side of first transfer chamber 210 opposite to fourth reaction chamber 140C (and therefore closer to first reaction chamber 110), similar to the chamber configuration in reactor system 500B of Figure 5B. Each reaction chamber in reactor system 400C has at least two gate valves coupled to it, and is therefore a multidirectional reaction chamber because there is more than one inlet / outlet for the substrate to be passed into and out of each reaction chamber. To process a substrate in reactor system 400C, the substrate can be transferred from load-locking chamber 105 to first reaction chamber 110 via first transfer chamber 210 and first transfer tool 213. First transfer tool 213 can (in response to opening of load-locking chamber gate valve 107) obtain the substrate from load-locking chamber 105 through load-locking chamber gate valve 107 and transfer the substrate to first transfer chamber 210. After the substrate enters from load-locking chamber 105 and / or is disposed in first transfer chamber 210, load-locking chamber gate valve 107 can be closed and / or first reaction chamber gate valve 114 can be opened. First transfer tool 213 can (in response to opening of first reaction chamber gate valve 114) transport the substrate to first reaction chamber 110 through first reaction chamber gate valve 114. After the substrate enters and / or is disposed in the first reaction chamber 110, the first gate valve 114 of the first reaction chamber can be closed to at least partially seal the first reaction chamber 110, so that one or more processing steps can occur (e.g., applying one or more gases (such as reactant gases and / or purge gases) to the substrate in the first reaction chamber 110). During the processing of the substrate in the first reaction chamber 110, the second gate valve 116B of the first reaction chamber can also be closed to at least partially seal the first reaction chamber 110. After the substrate processing in the first reaction chamber 110 is completed, the second gate valve 116B of the first reaction chamber can be opened, and the second transfer tool 223B can obtain the substrate from the first reaction chamber 110 and transfer the substrate to the second transfer chamber 220B. After the substrate enters from the first reaction chamber 110 and / or is disposed in the second transfer chamber 220B, the second gate valve 116B of the first reaction chamber can be closed, and / or the first gate valve 124C of the second reaction chamber can be opened. The second transfer tool 223B can (in response to the opening of the first gate valve 124C of the second reaction chamber) transport the substrate to the second reaction chamber 120C through the first gate valve 124C of the second reaction chamber. After the substrate enters and / or is disposed in the second reaction chamber 120C, the first gate valve 124C of the second reaction chamber can be closed to at least partially seal the second reaction chamber 120C, so that one or more processing steps can occur to the substrate in the second reaction chamber 120C. During the processing of the substrate in the second reaction chamber 120C, the second gate valve 126C of the second reaction chamber may also be closed to at least partially seal the second reaction chamber 120C. After the substrate processing in the second reaction chamber 120C is completed, the second gate valve 126C of the second reaction chamber can be opened, and the third transfer tool 233C can obtain the substrate from the second reaction chamber 120C and transfer the substrate to the third transfer chamber 230C. After the substrate enters from the second reaction chamber 120C and / or is disposed in the third transfer chamber 230C, the second gate valve 126C of the second reaction chamber can be closed, and / or the first gate valve 134C of the third reaction chamber can be opened. The third transfer tool 233C can (in response to the opening of the first gate valve 134C of the third reaction chamber) transport the substrate to the third reaction chamber 130C through the first gate valve 134C of the third reaction chamber. After the substrate enters from and / or is disposed in the third reaction chamber 130C, the first gate valve 134C of the third reaction chamber can be closed to at least partially seal the third reaction chamber 130C, so that one or more processing steps can occur to the substrate in the third reaction chamber 130C. During the processing of the substrate in the third reaction chamber 130C, the second gate valve 136C of the third reaction chamber may also be closed to at least partially seal the third reaction chamber 130C. After the substrate processing in the third reaction chamber 130C is completed, the fourth transfer tool 243C can obtain the substrate from the third reaction chamber 130C and transfer the substrate to the fourth transfer chamber 240C. After the substrate enters from the third reaction chamber 130C and / or is disposed in the fourth transfer chamber 240C, the second gate valve 136C of the third reaction chamber can be closed and / or the first gate valve 144C of the fourth reaction chamber can be opened. The fourth transfer tool 243C can (in response to the opening of the first gate valve 144C of the fourth reaction chamber) transport the substrate to the fourth reaction chamber 140C through the first gate valve 144C of the fourth reaction chamber. After the substrate enters from and / or is disposed in the fourth reaction chamber 140C, the first gate valve 144C of the fourth reaction chamber can be closed to at least partially seal the fourth reaction chamber 140C, so that one or more processing steps can occur to the substrate in the fourth reaction chamber 140C. During the processing of the substrate in the fourth reaction chamber 140C, the second gate valve 146C of the fourth reaction chamber may also be closed to at least partially seal the fourth reaction chamber 140C. After the substrate processing in the fourth reaction chamber 140C is completed, the second gate valve 146C of the fourth reaction chamber can be opened, and the first transfer tool 213 can obtain the substrate from the fourth reaction chamber 140C and transfer the substrate to the first transfer chamber 210 (or back to the first reaction chamber 110 for further processing). The processes occurring in the first reaction chamber 110, the second reaction chamber 120C, the third reaction chamber 130C, and / or the fourth reaction chamber 140C may include the same or different substrate processes. That is, for any suitable duration and using any suitable number of steps, the first process may occur in the first reaction chamber 110, the second process may occur in the second reaction chamber 120C, the third process may occur in the third reaction chamber 130C, and / or the fourth process may occur in the fourth reaction chamber 140C. For example, the process may include four steps, one step performed in the first reaction chamber 110, one step performed in the second reaction chamber 120C, another step performed in the third reaction chamber 130C, and a final step performed in the fourth reaction chamber 140C (e.g., where each step has equal or different durations). As another example, processing the substrate may include a step (e.g., applying a first material to the substrate for a first duration) and a second step (e.g., applying a second material to the substrate for a second duration). However, the second duration may be longer (e.g., three times the length of the first duration). Therefore, the first step can be performed in the first reaction chamber 110, and the second step can be divided between the second reaction chamber 120C, the third reaction chamber 130C, and the fourth reaction chamber 140C (for example, in the second reaction chamber 120C, a second material is applied to the substrate for one-third of a second duration (one-third of the second duration may be equal to the first duration); in the third reaction chamber 130C, a third material is applied to the substrate for another one-third of the second duration; and in the fourth reaction chamber 140C, a fourth material is applied to the substrate for the final one-third of the second duration (the first, second, and third materials may all be the same material to complete the second step of the process)). In this example, the process steps can be distributed between the reaction chambers, allowing the substrate to continuously advance through the chambers of the reactor system, thereby reducing or preventing substrate transfer delays between chambers (i.e., substrates that have completed process steps in a reaction chamber wait in a reaction chamber or the next transfer chamber to enter a subsequent reaction chamber). As another example, the process may include a single step that may include a processing duration. The entire processing duration may be performed in any of the first reaction chamber 110, the second reaction chamber 120C, the third reaction chamber 130C, and / or the fourth reaction chamber 140C, or a quarter-duration processing may occur in each of the first reaction chamber 110, the second reaction chamber 120C, the third reaction chamber 130C, and / or the fourth reaction chamber 140C (or processing and / or any other division of processing duration among at least some of the reaction chambers). As another example, the process may include two steps: a first step having a first duration and a second step having a second duration.The first step is performed in the first reaction chamber 110 for half the duration of the first step, and in the second reaction chamber 120C for the second half the duration of the first step, and the second step is performed in the third reaction chamber 130C for half the duration of the second step, and in the fourth reaction chamber 140C for the second half the duration of the second step. It should be noted that the arrows depicted in Figures 4A to 4C, as well as Figures 5A and 5B, are for illustrative purposes only, and the substrates can be transferred between chambers in the reaction chamber in any suitable manner or order. Similarly, the designations of chambers, gate valves, etc., within the reactor system, such as "first," "second," and "third," do not necessarily indicate the order in which the substrates can be transferred, or the order or configuration of the chambers or gate valves (i.e., chambers and / or gate valves may be close to or adjacent to each other). In various embodiments, unlike those discussed for reactor systems 400A, 400B, and 400C, the reactor system may include additional gate valves coupled between the chambers. For example, reactor system 400B, referring to Figure 4B, may have gate valves (which may be third gate valves of the first reaction chamber) coupled to the first reaction chamber 110 and / or the third transfer chamber 230B, such that the third transfer tool 233B can transfer a substrate into and out of the first reaction chamber 110 (e.g., to bypass the second reaction chamber 120B or the third reaction chamber 130B). As another example, referring to the reactor system 400C of Figure 4C, there may be a gate valve (which may be a third gate valve of the first reaction chamber) coupled to the first reaction chamber 110 and the fourth transfer chamber 240C (and / or the first reaction chamber 110 and the fourth transfer chamber 240C may be coupled), such that the fourth transfer tool 243C can transfer a substrate into and out of the first reaction chamber 110 (e.g., transferring the substrate between the first reaction chamber 110 and the fourth transfer chamber 240C (e.g., to bypass the second reaction chamber 120C and / or the third reaction chamber 130C), and / or transferring the substrate between the first reaction chamber 110 and the third reaction chamber 130C (e.g., to bypass the second reaction chamber 120C and / or the fourth reaction chamber 140C)). A gate valve (which may be a third gate valve for the second reaction chamber) may be coupled to the second transfer chamber 220B and the third reaction chamber 130C (and / or the second transfer chamber 220B and the third reaction chamber 130C may be coupled), such that the second transfer tool 223B can transfer a substrate into and out of the third reaction chamber 130C (e.g., transferring a substrate between the first reaction chamber 110 and the third reaction chamber 130C (e.g., bypassing the second reaction chamber 120C)). Therefore, in various embodiments, a chamber in the reactor system may have three gate valves coupled to it to provide additional substrate path options through the chambers of the reactor system (e.g., to use less than all of the chambers in the reactor system for the process). In various embodiments, gate valves may be coupled to a reaction chamber and / or transfer chamber within a reactor system, and / or coupled to the peripheral wall of a reaction chamber and / or transfer chamber (or any other chamber in the reactor system). In various embodiments, gate valves may be a separation component of the reactor system, or gate valves may be contained within the peripheral wall of a reaction chamber and / or transfer chamber (or any other chamber in the reactor system) and / or the like. In various embodiments, each reaction chamber may be contained within a reactor (e.g., a first reaction chamber may be contained within a first reactor, a second reaction chamber may be contained within a second reactor, etc.). In such embodiments, each reactor may further include at least two gate valves coupled to a reaction chamber, and / or at least two gate valves coupled to the reactor, the gate valves being configured to selectively allow access to the reaction chamber. In various embodiments, gate valves coupled to a chamber or its peripheral wall may be positioned about a chamber at any suitable angle relative to other gate valves (such as those discussed herein with respect to chambers being positioned relative to each other). In various embodiments, the chambers in the reactor system can be configured in any suitable configuration and / or shape. For example, the reaction chamber and transfer chamber of reactor system 400A can be configured such that there is space between the chambers. Similarly, for example, the reaction chamber and transfer chamber of reactor system 400B can be configured such that there is space between the chambers (e.g., this can be achieved by positioning the reaction chamber at an angle between 90 and 180 degrees relative to other reaction chambers, and by positioning the transfer chamber at an angle from 90 to 180 degrees relative to other transfer chambers). In various embodiments, the reaction chambers can be positioned relative to any suitable angle (such as about 90 degrees, about 120 degrees, or about 60 degrees apart from each other) of the preceding or following reaction chambers in the reactor system (where a transfer chamber is located between them). Similarly, in various embodiments, the transfer chambers can be positioned relative to any suitable angle (such as about 90 degrees, about 120 degrees, or about 60 degrees apart from each other) of the preceding or following transfer chambers in the reactor system (where a reaction chamber is located between them). In this context, "about" means ±20 or 30 degrees. As another example, a reactor system with eight chambers and a load-locked chamber can be configured as shown in Figure 4C, or can be configured to have space between one or more chambers (such as the chamber configuration in reactor system 500A shown in Figure 5A). Reactor system 500A may include a transfer chamber, a reaction chamber, and gate valves, similar to those discussed for reactor system 400C shown in Figure 4C. The process disclosed herein also includes setting, coupling, and / or reconfiguring the chambers and / or gate valves of the reactor system in any suitable configuration or arrangement, and / or coupling chambers to each other and / or individual gate valves to achieve a desired configuration. For example, additional reaction chambers and / or transfer chambers can be coupled to a reactor system similar to 400A to create a reactor system similar to 400B. As a further example, additional reaction chambers and / or transfer chambers can be coupled to a reactor system similar to 400B to create a reactor system similar to 400C. In various embodiments, chambers and / or gate valves can be added, removed, and / or reconfigured within any existing reactor system to change the configuration or shape of the reactor system. Benefits and other advantages have been described herein with reference to specific embodiments. Furthermore, the connecting lines shown in the various figures contained herein are intended to represent illustrative functional relationships and / or physical couplings between different elements. It should be noted that many alternative or additional functional relationships or physical connections may exist in a real system. However, no benefit, advantage, solution to a problem, or element that may cause any benefit, advantage, or solution to occur or become more apparent should be construed as a critical, necessary, or essential feature or element of this disclosure. The scope of this disclosure is therefore limited only by the additional claims scope, wherein, unless expressly stated otherwise, reference to an element in the singular form is not intended to mean "one and only one," but rather "one or more." Furthermore, the use of phrases such as "at least one of A, B, or C" in the scope of the patent application is intended to mean that A may exist alone in one embodiment, B may exist alone in one embodiment, C may exist alone in one embodiment, or any combination of elements A, B, and C may exist in a single embodiment; for example, A and B, A and C, B and C, or A and B and C. This document provides systems, methods, and apparatus. In the embodiments described herein, references to "one embodiment," "an embodiment," "an example embodiment," etc., indicate that the said embodiment may include a specific feature, structure, or characteristic, but each embodiment may not necessarily include this specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Further, when a specific feature, structure, or characteristic is described in conjunction with an embodiment, it is generally understood that those skilled in the art will be able to use such feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not. After reading this specification, those skilled in the art will understand how to implement this disclosure in alternative embodiments. Furthermore, no element, component, or method step in this disclosure is intended to be made available to the public, whether or not it is expressly referred to in the claims. Elements claimed herein should not be construed under 35 USC 112(f) unless the element is expressly referred to using the phrase “...means for.” As used herein, two or more “coupled” elements may mean physical, mechanical, fluid, and / or electrical coupling, as may be specified by the individual context. As used herein, the terms “comprises / comprising” or any other variation thereof are intended to cover non-exclusive inclusion / comprising, such that a process, method, article, or apparatus that includes / comprising a list of elements includes not only those elements but may include / comprising other elements not expressly listed or inherent to such process, method, article, or apparatus. 4: Reaction Chamber; 6: Base; 8: Gas Distribution System; 10: Reactant Source; 12: Reactant Source; 14: Wash Gas Source; 16: Pipeline; 18: Pipeline; 20: Pipeline; 22: Valve, Controller; 24: Valve, Controller; 26: Valve, Controller; 28: Vacuum Source; 30: Substrate; 50: Reactor System; 60: Reaction Chamber; 61: Reaction Chamber; 70: Load Locking Chamber; 71: Load Locking Chamber; 80: Substrate Transfer Chamber; 81: Substrate Transfer Chamber; 82: Substrate Transfer Chamber; 85: Transfer Tool; 86: Transfer Tool; 87: Transfer Tool; 90: Reaction Chamber Configuration; 91 Reactor system 105: Load locking chamber 107: Load locking chamber gate valve 108: Gate valve 110: First reaction chamber 112: First peripheral wall 114: First gate valve 116A: Second gate valve 116B: Second gate valve 120A: Second reaction chamber 120B: Second reaction chamber 120C: Second reaction chamber 122A: Second peripheral wall 122B: Second peripheral wall 122C: Second peripheral wall 124A: First gate valve 124B: First gate valve 124C: First gate valve 126A: Second gate valve 126B: Second gate valve Gate valve 126C: Second gate valve 130B: Third reaction chamber 130C: Third reaction chamber 132B: Third peripheral wall 132C: Third peripheral wall 134B: First gate valve 134C: First gate valve 136B: Second gate valve 136C: Second gate valve 140C: Fourth reaction chamber 142C: Third peripheral wall 144C: ​​First gate valve 146C: Second gate valve 210: First transfer chamber 212: First transfer chamber peripheral wall 213: First transfer tool 220A: Second transfer chamber 220B: Second transfer chamber 2 22A: Second transfer chamber peripheral wall; 223A: Second transfer tool; 223B: Second transfer tool; 230B: Third transfer chamber; 230C: Third transfer chamber; 232B: Third peripheral wall; 232C: Third peripheral wall; 233B: Third transfer tool; 233C: Third transfer tool; 240C: Fourth transfer chamber; 242C: Fourth peripheral wall; 243C: Fourth transfer tool; 400A: Reactor system; 400B: Reactor system; 500A: Reactor system; 500B: Reactor system The subject matter of this disclosure is specifically pointed out and explicitly claimed in the conclusion section of this specification. However, a more complete understanding of this disclosure can be best obtained by referring to the embodiments and the claims while taking into account the drawings, wherein similar numbers denote similar elements. Figure 1 illustrates a schematic diagram of a reactor system according to various embodiments. Figure 2 illustrates a schematic diagram of a reactor system. Figure 3 illustrates another schematic diagram of a reactor system. Figures 4A to 4C illustrate schematic diagrams of a reactor system including a multi-directional reaction chamber according to various embodiments. Figures 5A and 5B illustrate schematic diagrams of other reactor systems including a multi-directional reaction chamber according to various embodiments. 105: Load Locking Chamber 107: Load-locking chamber gate valve 108: Gate valve 110: First Reaction Chamber 112: First perimeter wall 114: First gate valve 116A: Second gate valve 120A: Second Reaction Chamber 122A: Second peripheral wall 124A: First gate valve 126A: Second gate valve 210: First Passing Room 212: Peripheral walls of the first transfer chamber 213: First transmission tool 220A: Second Transfer Chamber 222A: Peripheral wall of the second transfer chamber 223A: Second delivery tool 400A: Reactor System

Claims

1. A reactor system, comprising: First reaction chamber; A first reaction chamber, with a first gate valve coupled to and configured to allow the transfer of a substrate into the first reaction chamber; a first transfer chamber, wherein the first transfer chamber is in fluid communication with the first reaction chamber via the first gate valve in response to the opening of the first reaction chamber first gate valve, wherein the reactor system is configured to allow the transfer of the substrate between the first reaction chamber and the first transfer chamber through the opened first reaction chamber first gate valve; a first reaction chamber, with a second gate valve coupled to and configured to allow the transfer of the substrate out of the first reaction chamber; a second transfer chamber, in fluid communication with the first reaction chamber via the first reaction chamber second gate valve in response to the opening of the first reaction chamber second gate valve, wherein the reactor system is configured to allow the transfer of the substrate between the first reaction chamber and the second transfer chamber through the opened first reaction chamber second gate valve; a second reaction chamber; a second reaction chamber, with a first gate valve coupled to and configured to allow the transfer of the substrate into and out of one or more of the second reaction chambers. The second reaction chamber is in fluid communication with the second transfer chamber via the first gate valve of the second reaction chamber in response to the opening of the first gate valve of the second reaction chamber; a third transfer chamber; a second gate valve of the second reaction chamber coupled to the second reaction chamber, wherein the second reaction chamber is in fluid communication with the third transfer chamber via the second gate valve of the second reaction chamber in response to the opening of the second gate valve of the second reaction chamber; a third reaction chamber; a first gate valve of the third reaction chamber coupled to the third reaction chamber and configured to allow the transfer of the substrate into and out of one or more of the third reaction chambers, wherein the third reaction chamber is in fluid communication with the third transfer chamber via the first gate valve of the third reaction chamber in response to the opening of the first gate valve of the third reaction chamber; a third gate valve of the first reaction chamber coupled to the first reaction chamber, wherein the first reaction chamber is in fluid communication with the third transfer chamber via the third gate valve of the first reaction chamber in response to the opening of the third gate valve of the first reaction chamber. The reactor system is adaptable to transfer a substrate from the first reaction chamber to the third reaction chamber via the third transfer chamber, bypassing the second reaction chamber; a load-locking chamber is configured adjacent to the first transfer chamber to transfer a pre-processed substrate from the load-locking chamber to the first reaction chamber, and the first transfer chamber is further configured to transfer a post-processed substrate from the third reaction chamber to the load-locking chamber; a load-locking chamber gate valve is coupled to the load-locking chamber and configured to open to transfer the pre-processed substrate out of the load-locking chamber, and the load-locking chamber gate valve is further configured to open to transfer the post-processed substrate into the load-locking chamber;A first reactor system includes the first reaction chamber, a first reactant source including a first reactant disposed therein, a first dispensing system configured to dispense the first reactant into the first reaction chamber, and a first controller configured to supply the first reactant to the substrate in the first reaction chamber via the first dispensing system for a first duration before transferring the substrate from the first reaction chamber. A second reactor system, including the second reaction chamber, a second reactant source including a second reactant disposed therein, a second dispensing system configured to dispense the second reactant into the second reaction chamber, and a second controller configured to supply the second reactant to the substrate in the second reaction chamber via the second dispensing system for a second duration before transferring the substrate from the second reaction chamber; and a third reactor system, including a third reaction chamber, a third reactant source including a third reactant disposed therein, a third dispensing system configured to dispense the third reactant into the third reaction chamber, and a third controller configured to supply the third reactant from the third reactant source to the substrate in the third reaction chamber via the third dispensing system for a third duration before transferring the substrate from the third reaction chamber, wherein the first reactant is different from the second reactant and the third reactant, wherein the second reactant and the third reactant are the same, and wherein the first duration, the second duration, and the third duration are the same.

2. The reactor system of claim 1, wherein the first transfer chamber and the second transfer chamber are located on opposite sides of the first reaction chamber.

3. The reactor system of claim 1 further includes a third reaction chamber second gate valve coupled to the third reaction chamber, wherein the third reaction chamber responds to the opening of the third reaction chamber second gate valve and is in fluid communication with one of the first transfer chamber and the second transfer chamber via the third reaction chamber second gate valve.

4. The reactor system as described in claim 3 further includes: Fourth Transfer Room; And a third gate valve for a third reaction chamber, coupled to the third reaction chamber, wherein the third reaction chamber responds to the opening of the third gate valve for the third reaction chamber and is in fluid communication with the fourth transfer chamber via the third gate valve for the third reaction chamber.

5. A reactor system, comprising: A plurality of reaction chambers, each of which includes a local controller and a reactant source, the reactant source including a reactant disposed therein, wherein the local controller is configured to supply the reactant source continuously for a predetermined duration, wherein the predetermined duration is the same duration for each of the reaction chambers, wherein the reactant in the reactant source disposed in a first separate reaction chamber of the reaction chambers is different from the reactant in the reactant sources disposed in a second separate reaction chamber and a third separate reaction chamber of the reaction chambers, and wherein the reactant in the reactant source disposed in the second separate reaction chamber of the reaction chambers is the same as the reactant in the reactant source disposed in the third separate reaction chamber of the reaction chambers; A plurality of transfer chambers; and at least two gate valves, which are coupled to each of the reaction chambers, wherein when a first gate valve of one of the at least two gate valves is opened, it fluidly couples the fluid of the first separate reaction chamber of the reaction chambers to a first transfer chamber of the transfer chambers, and wherein when a second gate valve of one of the at least two gate valves is opened, it fluidly couples the fluid of the first separate reaction chamber to a second transfer chamber of the transfer chambers, and wherein when a third gate valve of the at least two gate valves for the first separate reaction chamber is opened, it fluidly couples the fluid of the first separate reaction chamber to a third transfer chamber of the transfer chambers; A load-locking chamber is configured adjacent to the first transfer chamber of the transfer chambers, the first transfer chamber of the transfer chambers being configured to transfer a pre-processed substrate from the load-locking chamber to the first respective reaction chamber of the reaction chambers, the first transfer chamber being further configured to transfer a post-processed substrate from a final reaction chamber of the reaction chambers to the load-locking chamber; and a load-locking chamber gate valve is coupled to the load-locking chamber, the load-locking chamber gate valve being configured to open to transfer the pre-processed substrate out of the load-locking chamber, the load-locking chamber gate valve being further configured to open to transfer the post-processed substrate into the load-locking chamber.

6. The reactor system of claim 5, wherein each of the transfer chambers includes a transfer tool, wherein each transfer tool is configured to transfer the substrate into and out of one or more of the reaction chambers from at most two of the reaction chambers.

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