Low refractive thermosetting composition, optical material and display device formed therefrom

Abstract

This invention relates to a thermosetting composition, an optical component and a display device made using the thermosetting composition, comprising a thermosetting resin, gas particles, and a monomer or polymer having two or more thermosetting functional groups, and having optical effects such as a low refractive index of less than 1.40, high light transmittance and low haze for light with a wavelength of 450 nm.

Description

[Technical Field]

[0001] This invention relates to a low-refractive-index thermosetting composition, an optical component made using the low-refractive-index thermosetting composition, and a display device. [Previous Technology]

[0002] The demand for technologies to improve luminous efficiency in organic light-emitting diodes (OLEDs), quantum dot organic light-emitting diodes (QD-OLEDs), quantum dot nano-emitting diodes (QNEDs), micro-LEDs, and image sensors is continuously increasing. Technologies for improving luminous efficiency are essential for reducing display reflectivity, improving OLED performance, and enhancing battery efficiency, and related research and development activities are currently underway.

[0003] To improve the luminous efficiency, a technique is needed to reduce the refractive index of light at the boundary of the medium. It is currently known that the theoretical lower limit of the adjustable refractive index range when using organic compounds as the medium is approximately 1.40 to 1.45. Therefore, using conventional organic compounds is insufficient to improve luminous efficiency. Thus, to achieve optical components with a refractive index below 1.40 at the boundary of the medium, a hybrid technique is needed that includes not only organic compounds but also materials such as hollow silicon dioxide.

[0004] However, the use of mixed hollow silicon dioxide can lead to a decrease in refractive index and a decrease in compatibility with organic compounds, which in turn can cause problems such as a decrease in light transmittance, haze and adhesion between the upper and lower films, thus subjecting the technology to many constraints.

[0005] Due to the many problems existing in the prior art as described above, there is still a need to develop a technology that can form an optical film that exhibits low refractive index characteristics while suppressing the decrease in light transmittance and the increase in haze, and exhibits excellent adhesion and heat resistance. [Summary of the Invention]

[0006] The purpose of this invention is to provide a thermosetting composition that has a low refractive index and excellent light transmittance, and can suppress the increase of haze while having excellent adhesion and heat resistance.

[0007] Another object of the present invention is to provide an optical component comprising a cured film cured in a state containing the thermosetting composition.

[0008] Another object of the present invention is to provide a display device including the optical components.

[0009] In order to achieve the above-described objective, a thermosetting composition according to one embodiment of the present invention comprises: a thermosetting resin; gas particles; and a monomer or oligomer having two or more thermosetting functional groups.

[0010] In order to achieve the above-described objective, an optical component according to another embodiment of the present invention includes: a substrate; and a cured film, which is cured in a state containing the thermosetting composition.

[0011] In order to achieve the above-described objective, a display device according to another embodiment of the present invention includes: the optical component.

[0012] When a cured film is formed by curing the thermosetting composition of the present invention, it is possible to achieve the following effects: a low refractive index of less than 1.40 for light with a wavelength of 450 nm, excellent light transmittance, low haze optical properties, excellent adhesion to the surface of the cured film, and excellent heat resistance of the cured film itself.

[0013] A display device according to one embodiment of the present invention includes an optical component utilizing the thermosetting composition, thereby achieving an effective improvement in luminous efficiency.

Implementation Method

[0015] The terms or words used in this specification and the scope of the invention application should not be limited to their general or dictionary meanings, but should be interpreted in accordance with the principle that the inventor can make appropriate definitions of the terms in order to best describe his invention, so as to conform to the meaning and concept of the technical idea of ​​the invention.

[0016] Therefore, the configuration illustrated in the embodiments and manufacturing examples described in this specification is only the most preferred embodiment of the present invention and does not represent all the technical ideas of the present invention. Therefore, it should be understood that there may be many equivalents and variations that can be substituted at the time of filing this application.

[0017] A thermosetting composition according to one embodiment of the present invention comprises a thermosetting resin, gas-containing particles, and a monomer or oligomer having thermosetting functional groups, wherein the monomer or oligomer has two or more thermosetting functional groups.

[0018] By having two or more monomers or oligomers as the thermosetting functional groups, the thermosetting degree between the resin and the gas-containing particles can be improved, thereby achieving the effect of further improving the thermosetting properties of the composition.

[0019] Specifically, as the thermosetting resin, a resin containing at least one or more of epoxy groups, oxobutyl groups or hydroxyl groups (OH) can be used to achieve thermosetting, for example, a thermosetting resin containing epoxy groups.

[0020] Specifically, the weight average molecular weight of the thermosetting resin can be from 1,000 to 200,000. If the weight average molecular weight of the thermosetting resin is less than 1,000, problems may occur regarding the adhesion of the low-refractive-index thermosetting layer to the upper and lower parts, inkjet engineering properties, and slit coating properties. Conversely, if it exceeds 200,000, problems may occur due to excessively high viscosity, leading to issues with inkjet ejection properties.

[0021] The gas-containing particle refers to a particle that has an internal space (void) isolated from the outside and that is filled with gas inside a solid particle. Furthermore, the particle size of the gas-containing particle refers to its diameter relative to the outer surface of the gas-containing particle.

[0022] The gas-containing particles can significantly reduce the refractive index of the composition through the internal space (void). However, because the compatibility of the gas-containing particles with organic compounds decreases, an appropriate content range is particularly important. Therefore, according to one embodiment of the present invention, the thermosetting composition may contain 30 to 80% by weight of the gas-containing particles relative to the total weight, thereby achieving a thermosetting composition with a refractive index of 1.40 or less for light at a wavelength of 450 nm. When the content of the gas-containing particles relative to the total weight of the composition is less than 30% by weight, it may be difficult to achieve a refractive index of 1.40 or less, while when the content exceeds 80%, problems may occur due to decreased compatibility with other organic compounds in the composition, resulting in decreased light transmittance, haze, and adhesion after curing.

[0023] More specifically, when the total weight of the thermosetting composition includes 50 to 80% by weight of the gas-containing particles, a thermosetting composition with a lower refractive index of less than 1.25 for light with a wavelength of 450 nm can be achieved.

[0024] The gas-containing particles may be hollow organic or inorganic particles, such as pore-forming agents or hollow silicon dioxide. As an embodiment of the present invention, hollow silicon dioxide may be used.

[0025] The gas-containing particles can be prevented from agglomerating through a surface treatment process, thereby improving particle dispersibility. When agglomeration occurs between the gas-containing particles, problems such as decreased light transmittance, haze, and reduced adhesion after curing may occur due to decreased compatibility with other organic compounds in the composition.

[0026] Specifically, the gas-containing particles can be surface-treated using one or more functional groups selected from the group consisting of alkyl, acrylic, methacrylic, epoxy and vinyl groups.

[0027] During the surface treatment of the gas-containing particles, if the surface treatment thickness is less than 3 nm, the surface treatment effect may decrease, leading to agglomeration between the gas-containing particles and an increase in haze. Conversely, if the surface treatment thickness is greater than 50 nm, the refractive index of the composition may deteriorate. Therefore, the gas-containing particles are preferably surface-treated with a thickness of 3 to 50 nm, and a thickness of 3 to 50 nm can be used to achieve a lower refractive index.

[0028] The D50 particle size of the gas-containing particles is preferably 30 to 150 nm. Specifically, when using the D50 measured using a DLS Litesizer 500 (Anton Parr) as a reference, it is preferably 30 to 150 nm. If the D50 particle size is less than 30 nm, it may lead to a decrease in refractive index. If it exceeds 150 nm, it may lead to a decrease in transmittance and haze due to a decrease in dispersion margin. Furthermore, it may lead to a decrease in adhesion to the upper and lower films due to insufficient crosslinking with the resin.

[0029] When the composition contains gaseous particles, the degree of curing of the composition is not sufficient by thermosetting resin alone. Therefore, the degree of curing and thus the adhesion to the upper and lower films of the low refractive index layer can be improved by adding monomers and / or oligomers containing thermosetting functional groups. Specifically, the monomers or oligomers having thermosetting functional groups contain highly reactive alicyclic epoxy structures, thereby ensuring thermosetting properties.

[0030] As a specific example of the monomer or oligomer having a thermosetting functional group, it may have any one of the chemical structures represented by the following chemical formulas 1 to 24. [Chemical Formula 1][Chemical Formula 2][Chemical Formula 3][Chemical Formula 4][Chemical Formula 5][Chemical Formula 6][Chemical Formula 7][Chemical Formula 8][Chemical Formula 9][Chemical Formula 10][Chemical Formula 11][Chemical Formula 12][Chemical Formula 13][Chemical Formula 14][Chemical Formula 15][Chemical Formula 16][Chemical Formula 17][Chemical Formula 18][Chemical Formula 19][Chemical Formula 20][Chemical Formula 21][Chemical Formula 22][Chemical Formula 23][Chemical Formula 24]

[0031] In the chemical formulas 4 and 6, R is each independently a hydrocarbon group with 1 to 10 carbon atoms. In the chemical formula 6, R is any one of alkyl, alkenyl, and alkoxy groups. In the chemical formulas 2 to 4, 11 to 13, and 20 to 21, l, m, n, and o are each independently an integer from 1 to 30.

[0032] At this time, instead of 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol used as a precursor in Chemical Formula 19, compounds having a chemical structure selected from Chemical Formulas 25 to 32 below can be used. [Chemical Formula 25][Chemical Formula 26][Chemical Formula 27][Chemical Formula 28][Chemical Formula 29][Chemical Formula 30][Chemical Formula 31][Chemical Formula 32]

[0033] In order to form a cured film with excellent adhesion between the upper and lower parts of the thermosetting composition and to achieve excellent optical properties, the specific composition ratio is preferably 1 to 69% by weight of thermosetting resin, 30 to 80% by weight of gas particles, and 1 to 60% by weight of monomers or oligomers having thermosetting functional groups.

[0034] The curing film with excellent adhesion to the upper and lower parts of the thermosetting composition and excellent optical properties are related to the total weight ratio of the thermosetting resin and the monomer or oligomer having thermosetting functional groups. Specifically, the total weight of the thermosetting resin and the monomer or oligomer having thermosetting functional groups may be 20 to 70% by weight relative to the whole composition.

[0035] To further improve the adhesion between the upper and lower parts of the low refractive layer, the thermosetting composition may also include one or more additives selected from the group consisting of silane coupling agents, adhesives with alkoxy groups as crosslinking points (Sites), and surfactants.

[0036] Specifically, the silane crosslinking agent may contain 0.1 to 30 parts by weight relative to 100 parts by weight of the thermosetting resin. If it is less than 0.1 parts by weight, it may cause a decrease in the adhesion margin, while if it is more than 30 parts by weight, it may cause problems with storage stability.

[0037] The silane coupling agent may, for example, comprise silanes derived from (3-epoxypropoxypropyl)trimethoxysilane, (3-epoxypropoxypropyl)triethoxysilane, (3-epoxypropoxypropyl)methyldimethoxysilane, (3-epoxypropoxypropyl)methyldiethoxysilane, (3-epoxypropoxypropyl)dimethylethoxysilane, 3,4-epoxybutyltrimethoxysilane, 3,4-epoxybutyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, aminopropyltrimethoxysilane, aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-epoxypropoxypropyl)methoxysilane. It may be selected from any one or more of the group consisting of dimethyl-butylene)propylamine, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, and (3-isocyanate propyl)triethoxysilane, but is not limited to the examples described above.

[0038] In addition, specifically, the adhesive with alkoxy groups as crosslinking sites may contain 0.1 to 30 parts by weight relative to 100 parts by weight of the thermosetting resin. If it is less than 0.1 parts by weight, it may cause a decrease in the adhesion margin, while if it is more than 30 parts by weight, it may cause problems with storage stability.

[0039] Specifically, the surfactant may contain 0.0001 to 5 parts by weight relative to 100 parts by weight of the thermosetting resin. If the amount is less than 0.0001 parts by weight, problems with coatability may occur, while if the amount is more than 5 parts by weight, problems with coating bubbles may occur.

[0040] To improve dispersibility, the thermosetting composition may further include one or more dispersants selected from the group consisting of acrylic dispersants, epoxy dispersants and organosilicone dispersants.

[0041] In addition, in order to promote curing, the thermosetting composition may also contain one or more crosslinking accelerators selected from the group consisting of hot acid generating agents and hot alkali generating agents.

[0042] The thermosetting composition may contain a solvent, but it may also be a solvent-free thermosetting composition. When a solvent is included, it can improve the compatibility of the thermosetting resin with gas-containing particles and its coatability by 0.0001. In this case, to ensure the coatability of the thermosetting composition, the solvent may contain components from diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol methyl ether ethyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, propylene glycol butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, butanediol methyl ether, butanediol ethyl ... Solvents selected from the group consisting of diethanolmethyl ether, dibutyl glycol dimethyl ether, dibutyl glycol diethyl ether, diethylene glycol butyl methyl ether, diethylene glycol butyl ethyl ether, triethylene glycol dimethyl ether, triethylene glycol butyl methyl ether, diethylene glycol tert-butyl ether, tetraethylene glycol dimethyl ether, diethylene glycol ethylhexyl ether, diethylene glycol methylhexyl ether, dipropylene glycol butyl methyl ether, dipropylene glycol ethylene glycol ethylhexyl ether, and dipropylene glycol methylhexyl ether.

[0043] The viscosity of the thermosetting composition can be adjusted by adjusting the content of the solvent, and specifically, the viscosity can be 3 to 30 cP in order to achieve both engineering performance and excellent optical properties.

[0044] An optical component according to one embodiment of the present invention includes a substrate and a cured film, the cured film being cured in a state containing the thermosetting composition according to one embodiment of the present invention.

[0045] The optical component can achieve excellent optical properties with a refractive index of less than 1.40 and a haze of less than 3% based on light with a wavelength of 450nm.

[0046] The optical component may be, for example, a light extraction layer or a refractive index adjustment layer, but is not limited to the examples described above.

[0047] A display device according to one embodiment of the present invention includes the optical component, such as an organic light-emitting diode (OLED), quantum dot light-emitting diode (QLED), or micro-LED display device with excellent brightness, but is not limited to the examples described above.

[0048] Next, in order to facilitate easy implementation of the present invention by those skilled in the art, embodiments of the present invention will be described in detail. However, the present invention can be implemented in many different forms and is not limited to the manufacturing examples and embodiments described herein.

[0049] Manufacturing Example 1: Synthesis of Thermosetting Resin

[0050] As an example of the thermosetting resin of the thermosetting composition according to one aspect of the present invention, a resin containing epoxy groups, oxetyl groups, and hydroxyl groups was used. The synthesis of the thermosetting resin contained in the thermosetting composition is shown in examples 1 to 10 below, and the synthesis of the thermosetting resin used for comparing the effect difference with the synthesis examples is shown in reference synthesis examples 1 to 3 below.

[0051] Synthesis example 1

[0052] In a beaker equipped with a cooling tube and a stirrer, 500 parts by weight of tetrahydrofuran and 100 parts by weight of glycidyl methylphenylpropionate were added relative to 10 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile), and the mixture was slowly stirred after nitrogen purging. The reaction solution was heated to 60°C and maintained at that temperature for 24 hours to produce a polymer solution containing an acrylic copolymer.

[0053] The polymer solution containing the acrylic copolymer is precipitated with 100 parts by weight of n-hexane. Next, after removing the waste liquid by a filtration process using a mesh, it is vacuum dried at a temperature below 30°C to produce a thermosetting resin containing epoxy groups with a weight average molecular weight of 10,000.

[0054] At this time, the weight average molecular weight was determined by standard analytical method of gel permeation chromatography (GPC) using Waters' e2695 Alliance Separation Module.

[0055] The weight-average molecular weight is the converted average molecular weight of polystyrene determined using gel permeation chromatography (GPC).

[0056] Synthesis Example 2

[0057] In addition to replacing 100 parts by weight of glycidyl methacrylate with 80 parts by weight of meso-glycidyl methacrylate and 20 parts by weight of styrene in the same manner as in Synthesis Example 1, a thermosetting resin containing epoxy groups was manufactured in the same manner as in Synthesis Example 1.

[0058] The thermosetting resin containing epoxy groups synthesized according to the above synthesis example 2 has a weight average molecular weight of 8,000.

[0059] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0060] Synthesis Example 3

[0061] In addition to replacing 100 parts by weight of glycidyl methyl 3-ethyl-3-oxetane methacrylate and 40 parts by weight of ethoxyethoxy ethyl acrylate with 60 parts by weight of 3-ethyl-3-oxetane methacrylate in the basis of Synthesis Example 1, a thermosetting resin containing oxetane was manufactured in the same manner as in Synthesis Example 1.

[0062] The thermosetting resin containing oxetane synthesized according to the synthesis example 3 has a weight average molecular weight of 5,000.

[0063] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight is determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0064] Synthesis Example 4

[0065] Except that, in addition to using 1.1 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) as an initiator instead of 10 parts by weight and heating the reaction solution to 60°C and maintaining the temperature for 20 hours, a thermosetting resin containing epoxy groups was manufactured in the same manner as in Synthesis Example 1.

[0066] The thermosetting resin containing epoxy groups synthesized according to the above synthesis example 4 has a weight average molecular weight of 200,000.

[0067] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0068] Synthesis example 5

[0069] Except that 29 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) was used as an initiator instead of 10 parts by weight in the same manner as in Synthesis Example 1, and the reaction solution was heated to 60°C and then maintained at the temperature for 6 hours, a thermosetting resin containing epoxy groups was produced in the same manner as in Synthesis Example 1.

[0070] The thermosetting resin containing epoxy groups synthesized according to the above synthesis example 5 has a weight average molecular weight of 1,000.

[0071] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0072] Synthesis Example 6

[0073] In addition to replacing 100 parts by weight of glycidyl methylphenylpropionate with 60 parts by weight of hydroxyethyl 2-acrylate and 40 parts by weight of perfluorooctyl ethyl acrylate in the manner described in Synthesis Example 1, using 5 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) instead of 10 parts by weight as the initiator, and heating the reaction solution to 60°C and maintaining the temperature for 24 hours, a thermosetting resin containing hydroxyl groups was manufactured in the same manner as in Synthesis Example 1.

[0074] The thermosetting resin containing hydroxyl groups synthesized according to the above synthesis example 6 has a weight average molecular weight of 52,000.

[0075] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0076] Synthesis Example 7

[0077] In addition to replacing 100 parts by weight of glycidyl methacrylate with 60 parts by weight of 3,4-epoxycyclohexyl methacrylate and 40 parts by weight of lauryl methacrylate in Synthesis Example 1, using 3 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) instead of 10 parts by weight as the initiator, and heating the reaction solution to 60°C and maintaining the temperature for 24 hours, a thermosetting resin containing epoxy groups was manufactured in the same manner as in Synthesis Example 1.

[0078] The thermosetting resin containing epoxy groups synthesized according to the above synthesis example 7 has a weight average molecular weight of 106,000.

[0079] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0080] Synthesis example 8

[0081] In a beaker equipped with a cooling tube and a stirrer, 80 parts by weight of 3-epoxypropoxypropyltrimethoxysilane and 20 parts by weight of tetraethoxysilane were added as reactive silanes, and the mixture was slowly stirred after nitrogen purging. 50 parts by weight of ultrapure water and 4 parts by weight of oxalic acid as a catalyst were added to the reaction solution, and the mixture was stirred slowly again. After 1 hour, the reaction solution was heated to 60°C and maintained at that temperature for 10 hours for polymerization. The reaction was then terminated by cooling to room temperature. Water and alcohol components generated during the reaction were removed by vacuum drying at below 30°C, thereby producing a thermosetting resin containing epoxy and hydroxyl groups with a weight average molecular weight of 3,000.

[0082] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0083] Synthesis example 9

[0084] In addition to replacing 80 parts by weight of 3-epoxypropoxypropyltrimethoxysilane and 20 parts by weight of tetraethoxysilane with 40 parts by weight of 3-epoxypropoxypropyltrimethoxysilane and 60 parts by weight of tetraethoxysilane in the basis of Synthesis Example 8, a thermosetting resin containing epoxy groups and hydroxyl groups was produced by the same method as in Synthesis Example 1.

[0085] The thermosetting resin containing epoxy groups and hydroxyl groups synthesized according to the above synthesis example 9 has a weight average molecular weight of 15,000.

[0086] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight is determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0087] Synthesis Example 10

[0088] In addition to replacing 80 parts by weight of 3-epoxypropoxypropyltrimethoxysilane and 20 parts by weight of tetramethoxysilane with 20 parts by weight of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 80 parts by weight of tetramethoxysilane in the basis of Synthesis Example 8, a thermosetting resin containing epoxy groups and hydroxyl groups was produced by the same method as in Synthesis Example 1.

[0089] The thermosetting resin containing epoxy groups and hydroxyl groups synthesized according to Synthesis Example 10 has a weight average molecular weight of 46,000.

[0090] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0091] Reference Synthesis Example 1

[0092] Except that 30 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) was used as an initiator instead of 10 parts by weight in the same manner as in Synthesis Example 1, and the reaction solution was heated to 60°C and then maintained at the temperature for 6 hours, a thermosetting resin containing epoxy groups was produced in the same manner as in Synthesis Example 1.

[0093] The thermosetting resin containing epoxy groups synthesized according to the reference synthesis example 1 has a weight average molecular weight of 900.

[0094] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Seperation Module.

[0095] Reference Synthesis Example 2

[0096] Except that, in addition to using 1 part by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) as an initiator instead of 10 parts by weight and heating the reaction solution to 60°C and maintaining the temperature for 24 hours, a thermosetting resin containing epoxy groups was manufactured in the same manner as in Synthesis Example 1.

[0097] The thermosetting resin containing epoxy groups synthesized according to the reference synthesis example 2 has a weight average molecular weight of 201,000.

[0098] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0099] Reference Synthesis Example 3

[0100] Except that, in addition to using 30 parts by weight of 3-epoxypropoxypropyltrimethoxysilane and 70 parts by weight of tetraethoxysilane as reactive silanes instead of 80 parts by weight of 3-epoxypropoxypropyltrimethoxysilane and 20 parts by weight of tetraethoxysilane, a thermosetting resin containing epoxy groups and hydroxyl groups was manufactured in the same manner as in Synthesis Example 7.

[0101] The thermosetting resin containing epoxy groups and hydroxyl groups synthesized according to the reference synthesis example 3 has a weight average molecular weight of 250,000.

[0102] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Separation Module.

[0103] Comparative Synthesis Example 1

[0104] Except that 100 parts by weight of lauryl methacrylate was used instead of 100 parts by weight of glycidyl methylphenylpropionate in the basis of Synthesis Example 1, a resin with a weight average molecular weight of 9,000 and not containing thermosetting groups was produced by the same method as in Synthesis Example 1.

[0105] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Seperation Module.

[0106] Comparative Synthesis Example 2

[0107] Except that, based on Synthesis Example 1, 50 parts by weight of lauryl methacrylate and 50 parts by weight of styrene were used instead of 100 parts by weight of glycidyl methacrylate, and 1.5 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) was used instead of 10 parts by weight as an initiator, a resin without thermosetting groups with a weight average molecular weight of 135,000 was produced by the same method as in Synthesis Example 1.

[0108] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Seperation Module.

[0109] Comparative Synthesis Example 3

[0110] Except that, based on Synthesis Example 1, 50 parts by weight of lauryl methacrylate and 50 parts by weight of ethyl methacrylate were used instead of 100 parts by weight of glycidyl methylphenylpropionate, and 5 parts by weight of 2,2'-azobis(2,4-dimethylpentanonitrile) was used instead of 10 parts by weight as an initiator, a resin with a weight average molecular weight of 25,000 and not containing thermosetting groups was produced by the same method as in Synthesis Example 1.

[0111] At this point, the weight-average molecular weight is the converted average molecular weight of polystyrene determined by gel permeation chromatography (GPC). The weight-average molecular weight was determined by the standard analytical method of gel permeation chromatography (GPC) using the Waters e2695 Alliance Seperation Module.

[0112] Manufacturing Example 2: Manufacturing of Low Refractive Index Thermosetting Composition and Optical Film

[0113] Using the resins synthesized through the aforementioned synthesis examples, reference synthesis examples, and comparative synthesis examples, thermosetting compositions of Examples 1 to 64, Comparative Examples 1 to 6, and Reference Examples 1 to 15 were manufactured according to the compositions shown in Tables 1 to 3 below. Hollow silicon dioxide was used as the gas-containing particles, and an epoxy monomer was used as the monomer having thermosetting functional groups.

[0114] At this time, after feeding the composition containing epoxy resin, epoxy monomer or oligomer and hollow silicon dioxide into the inkjet device and the slit coater device, it is coated onto the SiOx film, and then a single film with a thickness of 2.5 μm is formed by performing prebake.

[0115] Next, a cured film of the low-refractive thermosetting composition was produced by heat treatment at 180°C for 30 min in a convection oven. At this time, the thickness of the cured film was maintained at 2 μm.

[0116] Table 1 resin Epoxy monomers Hollow silicon dioxide solvent solid state Element distinguish structure content structure content Surface treatment type Processing thickness Particle size (nm) content type Example 1 Synthesis example 1 60% Chemical Formula 1 10% acrylic 3 30 30% Skip 100% Example 2 Synthesis example 2 50% Chemical formula 2 15% acrylic 10 50 35% Skip 100% Example 3 Synthesis example 3 40% Chemical formula 5 20% acrylic 20 70 40% Skip 100% Example 4 Synthesis example 4 30% Chemical Formula 7 25% acrylic 30 100 45% Skip 100% Example 5 Synthesis example 5 20% Chemical formula 9 31% acrylic 40 150 49% Skip 100% Example 6 Synthesis example 6 10% Chemical Formula 14 60% acrylic 50 30 30% Skip 100% Example 7 Synthesis Example 7 5% Chemical Formula 17 60% vinyl 3 50 35% Skip 100% Example 8 Synthesis example 8 2% Chemical formula 22 58% vinyl 10 70 40% Skip 100% Example 9 Synthesis example 9 53% Chemical formula 23 2% vinyl 20 100 45% Skip 100% Example 10 Synthesis example 10 46% Chemical formula 24 5% vinyl 30 150 49% Skip 100% Example 11 Synthesis example 1 60% Chemical Formula 1 10% vinyl 40 30 30% Skip 100% Example 12 Synthesis example 2 45% Chemical formula 2 20% vinyl 50 50 35% Skip 100% Example 13 Synthesis example 3 30% Chemical formula 5 30% Ethyl 3 70 40% Skip 100% Example 14 Synthesis example 4 15% Chemical Formula 7 40% methyl 10 100 45% Skip 100% Example 15 Synthesis example 5 twenty one% Chemical formula 9 30% Ethyl 20 150 49% Skip 100% Example 16 Synthesis example 6 50% Chemical Formula 14 20% Ethyl 30 30 30% Skip 100% Example 17 Synthesis Example 7 50% Chemical Formula 17 15% Ethyl 40 50 35% Skip 100% Example 18 Synthesis example 8 50% Chemical formula 22 10% Ethyl 50 70 40% Skip 100% Example 19 Synthesis example 9 25% Chemical formula 23 30% Epoxy 3 100 45% Skip 100% Example 20 Synthesis example 10 40% Chemical formula 24 11% Epoxy 10 150 49% Skip 100% Example 21 Synthesis example 1 40% Chemical Formula 1 10% Epoxy 20 30 50% Skip 100% Example 22 Synthesis example 2 35% Chemical formula 2 10% Epoxy 30 50 55% Skip 100% Example 23 Synthesis example 3 30% Chemical formula 5 10% Epoxy 40 70 60% Skip 100% Example 24 Synthesis example 4 20% Chemical Formula 7 10% Epoxy 50 100 70% Skip 100% Example 25 Synthesis example 5 10% Chemical formula 9 10% acrylic 3 150 80% Skip 100% Example 26 Synthesis example 6 10% Chemical Formula 14 40% acrylic 10 30 50% Propylene glycol methyl ether acetate (PGMEA) 10% Example 27 Synthesis Example 7 10% Chemical Formula 17 35% acrylic 20 50 55% Methyl 3-methoxypropionate (MMP) 10% Example 28 Synthesis example 8 10% Chemical formula 22 30% acrylic 30 70 60% Ethyl 3-ethoxypropionate (EEP) 10% Example 29 Synthesis example 9 10% Chemical formula 23 20% acrylic 40 100 70% Diethylene glycol methyl ethyl ether (MEDG) 10% Example 30 Synthesis example 10 10% Chemical formula 24 10% acrylic 50 150 80% Diethylene glycol diethyl ether (DEDG) 10% Example 31 Synthesis example 1 60% Chemical Formula 1 10% vinyl 3 30 30% Propylene glycol methyl ether acetate (PGMEA) 20% Example 32 Synthesis example 2 50% Chemical formula 2 15% vinyl 10 50 35% Methyl 3-methoxypropionate (MMP) 20% Example 33 Synthesis example 3 40% Chemical formula 5 20% vinyl 20 70 40% Ethyl 3-ethoxypropionate (EEP) 20% Example 34 Synthesis example 4 30% Chemical Formula 7 25% vinyl 30 100 45% Diethylene glycol methyl ethyl ether (MEDG) 20% Example 35 Synthesis example 5 20% Chemical formula 9 50% vinyl 40 150 30% Diethylene glycol diethyl ether (DEDG) 20% Example 36 Synthesis example 6 10% Chemical Formula 14 55% vinyl 50 30 35% Propylene glycol methyl ether acetate (PGMEA) 30% Example 37 Synthesis Example 7 5% Chemical Formula 17 55% Ethyl 3 50 40% Methyl 3-methoxypropionate (MMP) 30% Example 38 Synthesis example 8 2% Chemical formula 22 53% Ethyl 10 70 45% Ethyl 3-ethoxypropionate (EEP) 30% Example 39 Synthesis example 9 10% Chemical formula 23 60% Ethyl 20 100 30% Diethylene glycol methyl ethyl ether (MEDG) 30% Example 40 Synthesis example 10 15% Chemical formula 24 50% Ethyl 30 150 35% Diethylene glycol diethyl ether (DEDG) 30%

[0117] Table 2 resin Epoxy monomers Hollow silicon dioxide solvent solid state Element distinguish structure content structure content Surface treatment type deal with thickness Particle size (nm) content type Example 41 Synthesis example 1 20% Chemical Formula 1 40% Ethyl 40 30 40% Propylene glycol methyl ether acetate (PGMEA) 40% Example 42 Synthesis example 2 25% Chemical formula 2 30% Ethyl 50 50 45% Methyl 3-methoxypropionate (MMP) 40% Example 43 Synthesis example 3 50% Chemical formula 5 20% Epoxy 3 70 30% Ethyl 3-ethoxypropionate (EEP) 40% Example 44 Synthesis example 4 55% Chemical Formula 7 10% Epoxy 10 100 35% Diethylene glycol methyl ethyl ether (MEDG) 40% Example 45 Synthesis example 5 55% Chemical formula 9 5% Epoxy 20 150 40% Diethylene glycol diethyl ether (DEDG) 40% Example 46 Synthesis example 6 53% Chemical Formula 14 2% Epoxy 30 30 45% Propylene glycol methyl ether acetate (PGMEA) 50% Example 47 Synthesis Example 7 20% Chemical Formula 17 50% Epoxy 40 50 30% Methyl 3-methoxypropionate (MMP) 50% Example 48 Synthesis example 8 30% Chemical formula 22 35% Epoxy 50 70 35% Ethyl 3-ethoxypropionate (EEP) 50% Example 49 Synthesis example 9 40% Chemical formula 23 20% dimethyl 3 100 40% Diethylene glycol methyl ethyl ether (MEDG) 50% Example 50 Synthesis example 10 45% Chemical formula 24 10% dimethyl 10 150 45% Diethylene glycol diethyl ether (DEDG) 50% Example 51 Synthesis example 11 69% Chemical Formula 1 1% acrylic 20 30 30% Diethylene glycol methyl ethyl ether (MEDG) 10% Example 52 Synthesis example 12 60% Chemical formula 2 5% acrylic 30 50 35% Diethylene glycol diethyl ether (DEDG) 20% Example 53 Synthesis example 13 50% Chemical formula 5 10% methacrylate 40 70 40% Diethylene glycol methyl ethyl ether (MEDG) 30% Example 54 Synthesis example 14 35% Chemical Formula 7 20% methacrylate 50 100 45% Diethylene glycol diethyl ether (DEDG) 40% Example 55 Synthesis Example 15 50% Chemical formula 9 1% methacrylate 3 150 49% Skip 100% Example 56 Synthesis example 16 50% Chemical Formula 14 20% methacrylate 10 30 30% Skip 100% Example 57 Synthesis Example 17 50% Chemical Formula 17 15% methacrylate 20 50 35% Skip 100% Example 58 Synthesis example 11 50% Chemical formula 22 10% methacrylate 30 70 40% Skip 100% Example 59 Synthesis example 12 50% Chemical formula 23 5% Epoxy 40 100 45% Skip 100% Example 60 Synthesis example 13 1% Chemical formula 24 50% vinyl 50 150 49% Skip 100% Example 61 Synthesis example 14 20% Chemical Formula 7 50% Epoxy 20 30 30% Skip 100% Example 62 Synthesis Example 15 15% Chemical formula 9 50% vinyl 30 50 35% Skip 100% Example 63 Synthesis example 16 10% Chemical Formula 14 50% Epoxy 40 70 40% Skip 100% Example 64 Synthesis Example 17 5% Chemical Formula 17 50% vinyl 50 100 45% Skip 100%

[0118] Table 3 resin Epoxy monomers Hollow silicon dioxide solvent distinguish structure content structure content Surface treatment type Processing thickness Particle size (nm) content type solid state Element Comparative Example 1 Comparative Synthesis Example 1 60% Chemical formula 22 10% acrylic 3 30 30% Skip 100% Comparative Example 2 Comparative Synthesis Example 2 50% Chemical formula 23 15% methacrylate 10 50 35% Skip 100% Comparative Example 3 Comparative Synthesis Example 3 40% Chemical formula 24 20% Epoxy 20 70 40% Skip 100% Comparative Example 4 Comparative Synthesis Example 1 30% Chemical Formula 1 25% vinyl 30 100 45% Propylene glycol methyl ether acetate (PGMEA) 10% Comparative Example 5 Comparative Synthesis Example 2 20% Chemical formula 2 31% Diethyl 40 150 49% Propylene glycol methyl ether acetate (PGMEA) 20% Comparative Example 6 Comparative Synthesis Example 3 10% Chemical formula 5 60% acrylic 50 30 30% Propylene glycol methyl ether acetate (PGMEA) 30% Reference Example 1 Synthesis example 1 50% Chemical Formula 1 20% acrylic 2 30 30% Skip 100% See Example 2 Synthesis example 2 25% Chemical formula 2 30% acrylic 51 70 45% Skip 100% See Example 3 Synthesis example 3 51% Chemical formula 5 20% acrylic 10 100 29% Skip 100% See Example 4 Synthesis example 4 50% Chemical Formula 7 30% acrylic 15 150 20% Skip 100% See Example 5 Synthesis example 5 9% Chemical formula 9 10% acrylic 20 30 81% Skip 100% See Example 6 Synthesis example 6 10% Chemical Formula 14 5% acrylic 30 100 85% Propylene glycol methyl ether acetate (PGMEA) 10% See Example 7 Synthesis Example 7 50% Chemical Formula 17 20% vinyl 3 151 30% Propylene glycol methyl ether acetate (PGMEA) 20% See Example 8 Synthesis example 8 25% Chemical formula 22 30% vinyl 5 200 45% Propylene glycol methyl ether acetate (PGMEA) 30% See Example 9 Synthesis example 9 50% Chemical formula 23 20% vinyl 10 29 30% Propylene glycol methyl ether acetate (PGMEA) 40% See Example 10 Synthesis example 10 25% Chemical formula 24 30% vinyl 15 25 45% Propylene glycol methyl ether acetate (PGMEA) 50% See Example 11 - Skip Chemical Formula 1 70% vinyl 20 30 30% Diethylene glycol methyl ethyl ether (MEDG) 10% See Example 12 Reference Synthesis Example 1 45% Chemical formula 2 10% vinyl 30 70 45% Diethylene glycol methyl ethyl ether (MEDG) 20% See Example 13 Reference Synthesis Example 2 20% Chemical formula 5 50% Epoxy 3 100 30% Diethylene glycol methyl ethyl ether (MEDG) 30% See Example 14 Refer to Example 3 of Synthesis 25% Chemical Formula 7 30% Epoxy 5 150 45% Diethylene glycol methyl ethyl ether (MEDG) 40% See Example 15 Synthesis example 1 55% - Skip Epoxy 10 30 45% Diethylene glycol methyl ethyl ether (MEDG) 50%

[0119] The structures of the epoxy monomers in Tables 1 to 3 are as follows. [Chemical Formula 1][Chemical Formula 2] (In the embodiments of the present invention, the detailed structure of Chemical Formula 2 is a structure where n equals 2) [Chemical Formula 5][Chemical Formula 7][Chemical Formula 9][Chemical Formula 14][Chemical Formula 17][Chemical Formula 22][Chemical Formula 23][Chemical Formula 24]

[0120] Experimental Example: Determination of Physical Properties of Optical Films

[0121] The optical films of the reference examples and embodiments manufactured by manufacturing example 2 were measured according to the following method, and their physical properties such as refractive index, haze and viscosity were measured. The results are shown in Tables 5 to 7.

[0122] Experimental Example 1: Measurement of the refractive index of optical films

[0123] The refractive index (average 450±20 nm) of the optical film was measured using an ellipsometry, and the corresponding symbols are marked in Tables 5 to 7 below according to the standards described below. ◎: When the measured refractive index of the optical film is below 1.25 ○: When the measured refractive index of the optical film is between 1.26 and 1.40 △: When the measured refractive index of the optical film is between 1.41 and 1.45 ×: When the measured refractive index of the optical film exceeds 1.45

[0124] Experiment 2: Measurement of light transmittance of optical film

[0125] For the optical film, the average transmittance at 450±20 nm was measured using a UV-VIS spectrophotometer (Cary4000, Agilent), and the corresponding symbols are marked in Tables 5 to 7 below according to the standards described below. ○: When the average transmittance value is 90% or more △: When the average transmittance value is more than 80% but less than 90% ×: When the average transmittance is less than 80%

[0126] Experiment 3: Haze Measurement of Optical Films

[0127] The haze was measured using a NIPPON DENSHOKU COH 400 haze meter, and the corresponding symbols are marked in Tables 5 to 7 below according to the standards described below. ○: When the haze measurement value is below 3.0 △: When the haze measurement value is above 3.0 but below 4.0 ×: When the haze measurement value is above 4.0

[0128] Experiment 4: Determination of the viscosity (absolute viscosity) of the composition

[0129] For the reference examples and embodiments described above, the absolute viscosity was measured using a viscometer (trade name: Brook Field viscometer) at a temperature of 25°C, and the corresponding symbols are marked in Tables 5 to 7 below according to the standards described below. ◎: When the absolute viscosity value is 5 to 20 cP or less ○: When the absolute viscosity value is more than 20 to 30 cP or less △: When the absolute viscosity value is more than 30 to 40 cP or less ×: When the absolute viscosity exceeds the range described above

[0130] Experiment 5: Inkjet Engineering Evaluation

[0131] While changing the nozzle temperature of the inkjet unit, the feasibility of forming a surface was confirmed, and the corresponding symbols were marked in Tables 5 to 7 below according to the standards described below. Surface formed at nozzle temperature of 25–45°C = ○ Surface formed at nozzle temperature exceeding 45–50°C = △ Surface cannot be formed at nozzle temperature of 25–50°C (Uncoating) = ×

[0132] Experiment 6: Slit Coating Performance Evaluation

[0133] Coating properties were confirmed using a slit coater apparatus, and thickness dispersion was marked with corresponding symbols in Tables 5 to 7 below according to the criteria described below. Thickness dispersion within 5% = ○ Thickness dispersion within 10% = △ Thickness dispersion exceeding 10% = ×

[0134] Example 7: Evaluation of the adhesion of the lower part of the optical film

[0135] 100 units were cross-cut at intervals of 1 mm2 on the cured film formed above the lower SiOx film, and the adhesion between the unit and the lower SiOx film was compared using adhesive tape.

[0136] The lower adhesion of the optical film is marked with 0B to 5B in Tables 5 to 7 below, according to the adhesion test results classification criteria shown in Table 4 below.

[0137] Table 4 Adhesion test result classification standard Classification Percentage of peeled area The percentage of the surface area of ​​the cross-cut area that peeled off after six parallel cuts, compared to the area of ​​adhesion. 5B 0% free of peeling 4B Less than 5% 3B 5-15% 2B 15-35% 1B 35-65% 0B Greater than 65%

[0138] Example 8: Evaluation of the upper adhesion of optical films

[0139] For the optical film, a 0.2 mm SiOx film was deposited by additionally performing a chemical vapor deposition (CVD) process. 100 units were cross-cut at 1 mm intervals above the upper SiOx, and the adhesion between the unit and the lower low-refractive optical film was compared using adhesive tape.

[0140] The lower adhesion of the optical film is marked with 0B to 5B in Tables 5 to 7 below, according to the adhesion test results classification standard shown in Table 3 above.

[0141] Example 9: Evaluation of the heat resistance of optical films

[0142] Heat resistance was measured using a TGA (device name: Discovery TGA-55, TA KOREA) device. For sensitivity testing, after sampling the formed pattern film, the temperature was measured simultaneously using a thermogravimetric analysis (TGA) device at a rate of 10°C per minute, increasing from room temperature to 900°C. The corresponding symbols are marked in Tables 5 to 7 below according to the standards described below. ○: When the temperature at which the TGA result shows a 5 wt% weight loss is 300°C or higher. △: When the temperature at which the TGA result shows a 5 wt% weight loss is 270°C or higher but less than 300°C. ×: When the temperature at which the TGA result shows a 5 wt% weight loss is less than 270°C.

[0143] Table 5 distinguish Refractive index Light transmittance Haze viscosity Inkjet Engineering Slit Coating Lower adhesion Upper adhesion Heat resistance Example 1 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 2 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 3 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 4 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 5 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 6 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 7 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 8 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 9 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 10 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 11 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 12 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 13 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 14 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 15 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 16 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 17 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 18 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 19 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 20 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 21 ◎ ○ ○ ○ ○ ○ 5B 5B ○ Example 22 ◎ ○ ○ ○ ○ ○ 5B 5B ○ Example 23 ◎ ○ ○ ○ ○ ○ 5B 5B ○ Example 24 ◎ ○ ○ ○ ○ ○ 5B 5B ○ Example 25 ◎ ○ ○ ○ ○ ○ 5B 5B ○ Example 26 ◎ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 27 ◎ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 28 ◎ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 29 ◎ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 30 ◎ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 31 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 32 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 33 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 34 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 35 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 36 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 37 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 38 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 39 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 40 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○

[0144] Table 6 distinguish Refractive index Light transmittance Haze viscosity Inkjet Engineering Slit Coating Lower adhesion Upper adhesion Heat resistance Example 41 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 42 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 43 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 44 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 45 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 46 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 47 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 48 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 49 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 50 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 51 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 52 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 53 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 54 ○ ○ ○ ◎ ◎ ◎ 5B 5B ○ Example 55 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 56 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 57 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 58 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 59 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 60 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 61 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 62 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 63 ○ ○ ○ ○ ○ ○ 5B 5B ○ Example 64 ○ ○ ○ ○ ○ ○ 5B 5B ○

[0145] Table 7 distinguish Refractive index Light transmittance Haze viscosity Inkjet Engineering Slit Coating Lower adhesion Upper adhesion Heat resistance Comparative Example 1 ○ × × ○ ○ ○ 0B 0B × Comparative Example 2 ○ × × ○ ○ ○ 0B 0B × Comparative Example 3 ○ × × ○ ○ ○ 0B 0B × Comparative Example 4 ○ × × ○ ○ ○ 0B 0B × Comparative Example 5 ○ × × ○ ○ ○ 0B 0B × Comparative Example 6 ○ × × ○ ○ ○ 0B 0B × Reference Example 1 ○ △ △ △ △ △ 0B 0B △ See Example 2 △ △ △ △ △ △ 5B 5B △ See Example 3 △ ○ ○ ○ ○ ○ 5B 5B ○ See Example 4 △ ○ ○ ○ ○ ○ 5B 5B ○ See Example 5 ○ △ △ △ △ △ 0B 0B △ See Example 6 ○ △ △ △ △ △ 0B 0B △ See Example 7 ○ △ △ △ △ △ 0B 0B △ See Example 8 ○ △ △ △ △ △ 0B 0B △ See Example 9 △ ○ ○ ○ ○ ○ 5B 5B ○ See Example 10 △ ○ ○ ○ ○ ○ 5B 5B ○ See Example 11 ○ △ △ ○ △ △ 0B 0B △ See Example 12 ○ △ △ ○ △ △ 0B 0B △ See Example 13 ○ △ △ △ △ △ 0B 0B ○ See Example 14 ○ △ △ △ △ △ 0B 0B ○ See Example 15 ○ △ △ △ △ △ 0B 0B ○

[0146] The results of Test Examples 1 to 9 shown in Tables 5 to 7 above confirm that the optical film according to the present invention has a very low refractive index, a very high average transmittance, a low haze value, a high viscosity of composition, can be formed at a nozzle temperature of 25 to 50°C using a spray film device, can also be formed using a slit coating device, has excellent adhesion to the upper and lower parts of the optical film, and the optical film itself has excellent heat resistance.

[0147] The descriptions above are merely illustrative of the invention. Those skilled in the art should understand that the invention can be implemented in modified forms without departing from its essential characteristics. Therefore, the disclosed embodiments are not limiting but illustrative. The scope of the invention should be defined according to the claims of the invention application rather than the foregoing description, and all differences within the equivalent scope should be interpreted as being included within the scope of the invention. [Simplified Explanation of the Diagram]

[0014] None.

Claims

1. A thermosetting composition comprising: Thermosetting resins; Contains gas particles; And monomers or oligomers having thermosetting functional groups, wherein the monomers or oligomers have two or more thermosetting functional groups; The gas-containing particles are surface-treated to a thickness of 3 to 50 nm.

2. The thermosetting composition as claimed in claim 1, wherein the thermosetting resin comprises at least one or more of an epoxy group, an oxetyl group, or a hydroxyl group (OH).

3. The thermosetting composition as claimed in claim 1, wherein the thermosetting resin has a weight average molecular weight of 1,000 to 200,000.

4. The thermosetting composition as claimed in claim 1, wherein the gas-containing particles comprise 30 to 80% by weight relative to the total weight of the thermosetting composition.

5. The thermosetting composition as claimed in claim 1, wherein the gas-containing particles comprise 50 to 80% by weight relative to the total weight of the thermosetting composition.

6. The thermosetting composition as claimed in claim 1, wherein the gas-containing particles are a pore-forming agent or hollow silicon dioxide.

7. The thermosetting composition as claimed in claim 1, wherein the gas-containing particles are surface-treated with one or more functional groups selected from the group consisting of alkyl, acrylic, methacrylic, epoxy and vinyl groups.

8. The thermosetting composition as claimed in claim 1, wherein the D50 particle size of the gas-containing particles is 30 to 150 nm.

9. The thermosetting composition as claimed in claim 1, wherein the monomer or oligomer having a thermosetting functional group comprises an aliphatic epoxy structure.

10. The thermosetting composition as claimed in claim 1, wherein the monomer or oligomer having a thermosetting functional group comprises a compound having a chemical structure selected from the group consisting of: [Formula 1] [Formula 2] [Formula 3] [Formula 4] [Formula 5] [Formula 6] [Formula 7] [Formula 8] [Formula 9] [Formula 10] [Formula 11] [Formula 12] [Formula 13] [Formula 14] [Formula 15] [Formula 16] [Formula 17] [Formula 18] [Formula 19] [Formula 20] [Formula 21] [Formula 22] [Formula 23] [Formula 24] In chemical formulas 4 and 6, R is each independently a hydrocarbon group with 1 to 10 carbon atoms. In chemical formula 6, R is any one of alkyl, alkenyl, and alkoxy groups. In chemical formulas 2 to 4, 11 to 13, and 20 to 21, l, m, n, and o are each independently an integer from 1 to 30.

11. The thermosetting composition as claimed in claim 1, comprising: 1 to 69 wt% of the thermosetting resin; 30 to 80 wt% of the gas-containing particles; and 1 to 60 wt% of the monomer or oligomer having thermosetting functional groups.

12. The thermosetting composition as claimed in claim 1, wherein the total weight of the thermosetting resin and the monomer or oligomer having thermosetting functional groups is 20 to 70 by weight relative to the total weight of the thermosetting composition.

13. The thermosetting composition as claimed in claim 1, further comprising: any one or more additives selected from the group consisting of silane coupling agents, adhesives with alkoxy groups as crosslinking sites, and surfactants.

14. The thermosetting composition as claimed in claim 1, further comprising: any one or more dispersants selected from the group consisting of acrylic dispersants, epoxy dispersants and organosilicone dispersants.

15. The thermosetting composition as claimed in claim 1, further comprising: any one or more crosslinking accelerators selected from the group consisting of hot acid generating agents and hot alkali generating agents.

16. The thermosetting composition as claimed in claim 1, comprising: Solvents selected from the group consisting of diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol methyl ether ethyl ether, propylene glycol ethyl ether, propylene glycol butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, butanediol methyl ether, butanediol methyl ether ethyl ether, dibutyl glycol dimethyl ether, dibutyl glycol diethyl ether, diethylene glycol ethylene glycol butyl methyl ether, diethylene glycol butyl ethyl ether, triethylene glycol dimethyl ether, triethylene glycol butyl methyl ether, diethylene glycol tert-butyl ether, tetraethylene glycol dimethyl ether, diethylene glycol ethylhexyl ether, diethylene glycol methylhexyl ether, dipropylene glycol butyl methyl ether, dipropylene glycol ethylene glycol ethylhexyl ether, and dipropylene glycol methylhexyl ether.

17. The thermosetting composition as claimed in claim 1, wherein the thermosetting composition is a solvent-free thermosetting composition that does not contain a solvent.

18. The thermosetting composition as claimed in claim 1, wherein the viscosity of the thermosetting composition is 3 to 30 cP.

19. An optical component, comprising: One substrate; And a cured film obtained by curing a thermosetting composition comprising any one of claims 1 to 18.

20. The optical component as claimed in claim 19, wherein the cured film has a haze of less than 3% relative to light at a wavelength of 450 nm.

21. A display device, comprising: Optical components as described in claim 19.