Resin composition, cured product, laminate, transparent antenna and manufacturing method thereof, and image display device

Abstract

A resin composition comprising an elastomer, an epoxy compound, and a thermal polymerization initiator. A cured product of the resin composition. A laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, the transparent resin layer comprising the aforementioned resin composition or the aforementioned cured product. A transparent antenna (110) comprising a transparent substrate (110a) and a mesh conductive member (110b) disposed on the transparent substrate (110a), the transparent substrate (110a) comprising the aforementioned cured product. An image display device (100) comprising the transparent antenna (110).

Description

Technical Field

[0001] This disclosure relates to a resin composition, a cured product, a laminate, a transparent antenna and its manufacturing method, an image display device, etc. Prior Technology

[0002] Image display devices are used in various electronic devices such as personal computers, car navigation systems, mobile phones, clocks, and electronic dictionaries. An image display device includes: an image display section for displaying images; and a frame section (border section) located around the image display section. A transparent antenna is disposed on the image display section and connected to the frame section via a circuit. Various components for obtaining the transparent antenna have been studied (for example, see Patent Document 1 below).

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2011-091788

[0004] A transparent antenna comprises a transparent substrate and conductive components disposed on the transparent substrate. Sometimes, the transparent substrate is formed by curing a resin composition. From the viewpoint of achieving good color reproduction in image display devices, a low yellow tint is required for such cured material. Summary of the Invention

[0005] One objective of this disclosure is to provide a resin composition capable of producing a cured product with low yellowness. Another objective of this disclosure is to provide a cured product of the resin composition. Another objective of this disclosure is to provide a laminate using the resin composition or the cured product. Another objective of this disclosure is to provide a transparent antenna using the cured product. Another objective of this disclosure is to provide an image display device using the transparent antenna. Another objective of this disclosure is to provide a method for manufacturing a transparent antenna using the aforementioned laminate.

[0006] One aspect of this disclosure relates to a resin composition containing an elastomer, an epoxy compound, and a thermal polymerization initiator. This resin composition allows for the production of cured products with low yellowness.

[0007] Another aspect of this disclosure relates to a cured product of the aforementioned resin composition. Another aspect of this disclosure relates to a laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, the transparent resin layer comprising the aforementioned resin composition or the aforementioned cured product. Another aspect of this disclosure relates to a transparent antenna comprising a transparent substrate and a conductive member disposed on the transparent substrate, the transparent substrate comprising the aforementioned cured product. Another aspect of this disclosure relates to an image display device equipped with the aforementioned transparent antenna.

[0008] Another aspect of this disclosure relates to a method for manufacturing a transparent antenna by depositing the aforementioned transparent resin layer in a laminate onto a transparent member. This other aspect relates to a method for manufacturing a transparent antenna, wherein the laminate is a laminate in which a conductive member has a first conductive member disposed on the aforementioned transparent resin layer; and a second conductive member disposed on the first conductive member. If the first conductive member and the second conductive member contain copper, the second conductive member is removed while the aforementioned transparent resin layer and the aforementioned conductive member are deposited on the transparent member in the laminate. [Invention Effects]

[0009] According to one aspect of the present invention, a resin composition capable of producing a cured product with low yellowness can be provided. According to another aspect of the present invention, a cured product of the resin composition can be provided. According to another aspect of the present invention, a laminate using the resin composition or the cured product can be provided. According to another aspect of the present invention, a transparent antenna using the cured product can be provided. According to another aspect of the present invention, an image display device using the transparent antenna can be provided. According to another aspect of the present invention, a method for manufacturing a transparent antenna using the aforementioned laminate can be provided. Simple Explanation of the Diagram

[0010] Figure 1 is a schematic cross-sectional view showing an example of a laminate. Figure 2 is a schematic cross-sectional view showing an example of a laminated body. Figure 3 is a schematic cross-sectional view of an example of an image display device. Figure 4 is a schematic cross-sectional view of an example of an image display device. Implementation

[0011] The following provides a detailed description of the embodiments disclosed herein. However, this disclosure is not limited to the following embodiments.

[0012] In this specification, "above A" in a numerical range refers to A and the range exceeding A. "Below A" in a numerical range refers to A and the range less than A. Within the numerical ranges described in stages in this specification, the upper or lower limit of a certain stage's numerical range can be arbitrarily combined with the upper or lower limit of other stages' numerical ranges. Within the numerical ranges described in this specification, the upper or lower limit of the numerical range can be replaced with the values ​​shown in the embodiments. "A or B" can include either A or B, or both. The materials illustrated in this specification are not particularly limited and can be used alone or in combination of two or more. In this specification, regarding the content of each component in the composition, if there are multiple substances conforming to each component in the composition, unless otherwise specified, it refers to the total amount of the multiple substances present in the composition. Regarding the terms "layer" and "film," in addition to the shape and structure formed on the entire surface when viewed in a top view, it also includes the shape and structure formed on a portion of the surface. The term "step" does not only include independent steps. Even if it cannot be clearly distinguished from other steps, it is included in this term as long as the desired effect of the step is achieved.

[0013] The resin composition of this embodiment contains an elastomer, an epoxy compound, and a thermal polymerization initiator. The resin composition of this embodiment is a thermosetting resin composition. The cured product of this embodiment is obtained by curing (thermosetting) the resin composition of this embodiment, and is a cured product (thermosetting product) of the resin composition of this embodiment. For example, in the resin composition of this embodiment, a cured product can be obtained by curing (thermosetting) the resin composition at 140°C for 1 hour. The cured product of this embodiment can be in a semi-cured state or a fully cured state.

[0014] The resin composition according to this embodiment can produce a cured product with low yellowness.

[0015] Image display devices can be used in high-frequency band communication equipment used to achieve high-speed, high-capacity communication. In high-frequency band communication, there is a tendency for high transmission loss. Therefore, components constituting transparent antennas are required to have excellent dielectric properties. According to one sample of the resin composition of this embodiment, a cured product with an excellent relative permittivity (low relative permittivity) can be obtained. Furthermore, according to one sample of the resin composition of this embodiment, a cured product with an excellent dielectric loss tangent (low dielectric loss tangent) can be obtained.

[0016] A sample of the resin composition according to this embodiment can obtain a cured product with excellent transmittance. A sample of the resin composition according to this embodiment can obtain a cured product with excellent haze. A sample of the resin composition according to this embodiment can obtain a cured product with excellent elongation. A sample of the resin composition according to this embodiment can obtain a cured product with an excellent modulus of elasticity (e.g., tensile modulus of elasticity) (with a low modulus of elasticity).

[0017] The resin composition of this embodiment contains an elastomer. Examples of elastomers include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, and silicone-based elastomers. From the viewpoint of easily obtaining cured products with low yellowness and of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, the elastomer may include a styrene-based elastomer.

[0018] Styrene-based elastomers have styrene compounds as monomer units, and can also have monomer units derived from styrene compounds. Examples of styrene compounds include styrene; alkylstyrene such as methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, triethylstyrene, propylstyrene, butylstyrene, hexylstyrene, heptylstyrene, and octylstyrene; halogenated styrene such as fluorostyrene, chlorostyrene, bromostyrene, dibromostyrene, and iodostyrene; nitrostyrene; acetyrene; and methoxystyrene. From the viewpoint of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, styrene-based elastomers can have styrene as a monomer unit.

[0019] Examples of styrene-based elastomers include styrene-butadiene random copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene-styrene block copolymers, styrene-ethylene-butene-styrene block copolymers, styrene-ethylene-propylene-styrene block copolymers, and hydrogenated elastomers of these.

[0020] From the perspective of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, based on the total mass of the elastomer (the total amount of elastomer contained in the resin composition), the content of styrene-based elastomers can be 50% by mass or more, 70% by mass or more, 90% by mass or more, 95% by mass or more, or 99% by mass or more. The elastomers contained in the resin composition can be substantially composed of styrene-based elastomers (based on the total mass of elastomers contained in the resin composition, the content of styrene-based elastomers is substantially 100% by mass).

[0021] From the perspective of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured product, the weight-average molecular weight (Mw) or number-average molecular weight (Mn) of the elastomer can be within the following ranges: The weight-average molecular weight or number-average molecular weight of the elastomer can be 1000 or more, 3000 or more, 4000 or more, 5000 or more, 10000 or more, 30000 or more, 50000 or more, 80000 or more, or 100000 or more. The weight-average molecular weight or number-average molecular weight of the elastomer can be 500000 or less, 300000 or less, 200000 or less, 150000 or less, or 100000 or less. From these perspectives, the weight-average molecular weight or number-average molecular weight of the elastomer can be 1000~500000, 3000~300000, 4000~200000, or 5000~150000. The weight-average molecular weight and number-average molecular weight (Mn) can be measured under the following conditions by gel permeation chromatography (GPC) and obtained by conversion using standard polystyrene measurement lines.

[0022] Pump: L-6200 model [Manufactured by Hitachi High-Technologies Corporation] Detector: L-3300 RI [Manufactured by Hitachi High-Technologies Corporation] Column Oven: L-655A-52 [Manufactured by Hitachi High-Technologies Corporation] Protective tubing and tubing: TSK Guardcolumn HHR-L + TSKgel G4000HHR + TSKgel G2000HHR [all manufactured by TOSOH CORPORATION, product names] Tubing string dimensions: 6.0×40mm (protective tubing string), 7.8×300mm (tubing string) Eluent: Tetrahydrofuran Sample concentration: 30 mg / 5 mL Injection volume: 20μL Flow rate: 1.00 mL / min Temperature measured: 40℃

[0023] From the perspective of easily obtaining cured products with low yellowness and from the perspective of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, based on the total mass of the resin composition (excluding the mass of the organic solvent), or the total amount of elastomer, epoxy compound, and thermal polymerization initiator, the elastomer content can be within the following ranges: The elastomer content can be 50% by mass or more, more than 50% by mass, 60% by mass or more, 65% by mass or more, 70% by mass or more, 75% by mass or more, or 78% by mass or more. The elastomer content can be 95% by mass or less, 90% by mass or less, 85% by mass or less, or 80% by mass or less. From these perspectives, the elastomer content can be 50-95% by mass, 60-90% by mass, or 70-85% by mass.

[0024] From the perspective of easily obtaining cured products with low yellowness and from the perspective of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in cured products, the elastomer content, based on the total amount of elastomer and epoxy compound, can be within the following ranges: The elastomer content can be 50% by mass or more, exceeding 50% by mass, 60% by mass or more, 65% by mass or more, 70% by mass or more, 75% by mass or more, or 80% by mass or more. The elastomer content can be 95% by mass or less, 90% by mass or less, 85% by mass or less, or 80% by mass or less. From these perspectives, the elastomer content can be 50-95% by mass, 60-90% by mass, or 70-85% by mass.

[0025] The resin composition of this embodiment contains an epoxy compound. An epoxy compound is a compound having an epoxy group. The epoxy compound may or may not have a (meth)acrylic group. "(meth)acrylic group" refers to either an acrylonitrile group or its corresponding methacrylic group.

[0026] Epoxy compounds may include at least one selected from the group consisting of monofunctional epoxy compounds and polyfunctional epoxy compounds (difunctional epoxy compounds, trifunctional epoxy compounds, or epoxy compounds with four or more functions). For example, "difunctional epoxy compound" refers to a compound having two epoxy groups in one molecule. From the viewpoint of easily obtaining cured products with low yellowness, epoxy compounds may include at least one selected from the group consisting of monofunctional epoxy compounds, difunctional epoxy compounds, and trifunctional epoxy compounds.

[0027] Examples of monofunctional epoxy compounds include 1,2-epoxyethylene, 1,2-epoxypropane, 1,2-epoxybutane, 1,2-epoxy-2-methylpropane, 1-phenyl-1,2-epoxyethylene, 1,2-epoxyvinylcyclohexane (e.g., 1,2-epoxy-4-vinylcyclohexane), epichlorohydrin, epibromopropane, glycidyl methyl ether, allyl glycidyl ether, and polyepoxyethylene. Glycopropyl ether, glycopropylamide, butyl glycopropyl ether, 2-ethylethyl glycopropyl ether, stearyl glycopropyl ether, lauryl glycopropyl ether, butoxy polyethylene glycol glycopropyl ether, phenolic polyethylene glycol glycopropyl ether, allyl glycopropyl ether, phenyl glycopropyl ether, p-tolyl glycopropyl ether, p-ethylphenyl glycopropyl ether, p-secondary butylphenyl glycopropyl ether, p-tertiary butylphenyl glycopropyl ether, etc.

[0028] As multifunctional epoxy compounds, tris[6-(epoxyethyl-2-yl)hexyl]-1,3,5-triazine-2,4,6-trione, ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylic acid ester, compounds represented by the following formula (A), bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, and brominated bisphenol F diglycidyl ether are mentioned. Bisphenol S diglycidyl ether, epoxy phenolic varnish resin, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylcarboxylic acid ester, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexyl-m-dialkyl, bis(3,4-epoxycyclohexylmethyl) adipate, vinylcyclohexene oxide Compounds, 4-vinylcyclohexane oxide, bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3',4'-epoxy-6'-methylcyclohexylcarboxylate, methyl bis(3,4-epoxycyclohexane), dicyclopentadiene dioxide, ethylene glycol di(3,4-epoxycyclohexylmethyl) ether, ethyl bis(3,4-epoxycyclohexylcarboxylate), dioctyl hexahydrophthalic acid Esters, di-2-ethyl ethyl hexahydrophthalate, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ethers, 1,1,3-tetradecanediene dioxide, limonene dioxide, 1,2,7,8-diepoxyoctane, 1,2,5,6-diepoxycyclooctane, etc.

[0029] [Chemistry 1]

[0030] From the viewpoint of easily obtaining cured products with low yellowness, epoxy compounds may have at least one selected from the group consisting of alicyclic and aromatic rings. From the viewpoint of easily obtaining cured products with low yellowness, epoxy compounds include at least one selected from the group consisting of alicyclic epoxy compounds (epoxy compounds having alicyclic rings) and aromatic epoxy compounds (epoxy compounds having aromatic rings). Examples of alicyclic rings include cyclopentane rings and cyclohexane rings. From the viewpoint of easily obtaining cured products with low yellowness, epoxy compounds may have at least one selected from the group consisting of cyclopentane oxide rings and cyclohexane oxide rings, and may also have cyclohexane oxide rings.

[0031] From the viewpoint of easily obtaining cured products with low yellowness and excellent haze in the cured product, epoxy compounds can have heterocyclic rings or triazine rings. From the viewpoint of easily obtaining cured products with low yellowness and excellent haze and transmittance in the cured product, epoxy compounds can have vinyl groups or vinyl groups bonded to alicyclic rings (e.g., cyclohexane rings). From the viewpoint of easily obtaining cured products with low yellowness and excellent transmittance in the cured product, epoxy compounds can have ester groups or two ester groups.

[0032] From the viewpoint of easily obtaining cured products with low yellowness, the molecular weight of epoxy compounds can be within the following ranges: The molecular weight of epoxy compounds can be 50 or more, 80 or more, 100 or more, 120 or more, 130 or more, 150 or more, 160 or more, 180 or more, 200 or more, 250 or more, 300 or more, 350 or more, 400 or more, or 500 or more. The molecular weight of epoxy compounds can be less than 1000, less than 800, less than 600, less than 550, less than 500, less than 400, less than 350, less than 300, less than 250, less than 200, less than 180, less than 160, or less than 150. From these viewpoints, the molecular weight of epoxy compounds can be 50 to 1000, 100 to 800, or 120 to 600.

[0033] From the viewpoint of easily obtaining cured products with low yellowness, the epoxy equivalent (unit: g / eq) of the epoxy compound can be within the following ranges: The epoxy equivalent of the epoxy compound can be 50 or more, 80 or more, 100 or more, 120 or more, 130 or more, 150 or more, 160 or more, or 180 or more. The epoxy equivalent of the epoxy compound can be less than 1000, less than 800, less than 600, less than 500, less than 450, less than 400, less than 350, less than 300, less than 250, less than 200, less than 180, less than 160, less than 150, or less than 130. From these viewpoints, the epoxy equivalent of the epoxy compound can be 50~1000, 100~500, or 120~200.

[0034] From the viewpoint of easily obtaining cured products with low yellowness, based on the total mass of the resin composition (excluding the mass of the organic solvent) or the total amount of elastomer, epoxy compound, and thermal polymerization initiator, the epoxy compound content can be within the following ranges: The epoxy compound content can be 50% by mass or less, less than 50% by mass, 40% by mass or less, 35% by mass or less, 30% by mass or less, 25% by mass or less, 20% by mass or less, 15% by mass or less, 13% by mass or less, 12% by mass or less, 11% by mass or less, 10% by mass or more, or 9% by mass or less. The epoxy compound content can be 1% by mass or more, 3% by mass or more, 5% by mass or more, 8% by mass or more, 9% by mass or more, 10% by mass or more, 11% by mass or more, 12% by mass or more, or 13% by mass or more. From these viewpoints, the epoxy compound content can be 1 to 50% by mass, 5 to 30% by mass, or 8 to 20% by mass.

[0035] From the viewpoint of easily obtaining cured products with low yellowness, based on the total amount of elastomer and epoxy compound, the epoxy compound content can be within the following ranges: The epoxy compound content can be less than 50% by mass, less than 50% by mass, less than 40% by mass, less than 35% by mass, less than 30% by mass, less than 25% by mass, less than 20% by mass, less than 15% by mass, less than 13% by mass, less than 12% by mass, less than 11% by mass, or less than 10% by mass. The epoxy compound content can be more than 1% by mass, more than 3% by mass, more than 5% by mass, more than 8% by mass, more than 9% by mass, more than 10% by mass, more than 11% by mass, more than 12% by mass, more than 13% by mass, or more than 14% by mass. From these viewpoints, the epoxy compound content can be 1 to 50% by mass, 5 to 30% by mass, or 8 to 20% by mass.

[0036] The resin composition of this embodiment contains a thermal polymerization initiator. The thermal polymerization initiator is a compound that begins polymerization upon heating; it may include thermal cationic polymerization initiators or thermal free radical polymerization initiators.

[0037] Examples of ketone peroxides that can be used as thermal polymerization initiators include methyl ethyl ketone peroxide, cyclohexanone peroxide, and methyl cyclohexanone peroxide; peroxy ketals such as 1,1-bis(tertiary butylperoxy)cyclohexane, 1,1-bis(tertiary butylperoxy)-2-methylcyclohexane, 1,1-bis(tertiary butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tertiary hexylperoxy)cyclohexane, and 1,1-bis(tertiary hexylperoxy)-3,3,5-trimethylcyclohexane; hydrogen peroxide such as p-menthane hydrogen peroxide; and α,α'-bis(tertiary butylperoxy)diisopropylbenzene, diisopropylbenzene peroxide, tertiary butylisopropylbenzene peroxide, and di-tertiary butyl... Dialkyl peroxides, such as peroxides; dialkyl peroxides such as octyl peroxide, lauryl peroxide, stearyl peroxide, and benzoyl peroxide; peroxycarbonates such as bis(4-tert-butylcyclohexyl)peroxydicarbonate, di-2-ethoxyethyl ester peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, and di-3-methoxybutyl peroxycarbonate; tert-butyl peroxypentanate, tert-hexyl peroxypentanate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexylperoxy)hexane, tert-hexyl peroxy-2-ethylhexanoate, and tert-butyl peroxy-2- Ethylhexanoate, tertiary butyl peroxide isobutyrate, tertiary hexyl peroxide isopropyl monocarbonate, tertiary butyl peroxide-3,5,5-trimethylhexanoate, tertiary butyl peroxide lauryl ester, tertiary butyl peroxide isopropyl monocarbonate, tertiary butyl peroxide-2-ethylhexyl monocarbonate, tertiary butyl peroxide benzoate, tertiary hexyl peroxide benzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane, tertiary butyl peroxide acetate and other peroxide esters; phthalic anhydride, maleic anhydride, 1,2,4-benzenetricarboxylic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, glutaric anhydride, dimethylglutaric anhydride, di Anhydrides such as ethyl glutaric anhydride, succinic anhydride, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, 1,2,3,4-cyclobutanetetracarboxylic anhydride, 4,4'-diphthalic anhydride, 4,4'-carbonyldiphthalic anhydride, 4,4'-sulfonyldiphthalic anhydride, 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, 4,4'-oxobisphthalic anhydride, 9,9-bis(3,4-dicarboxyphenyl) dianhydride, and 2,3,6,7-naphthalenetetracarboxylic anhydride; and azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylpentanitrile), and 2,2'-azobis(4-methoxy-2'-dimethylpentanitrile).

[0038] From the viewpoint of easily obtaining cured products with low yellowness, the thermal polymerization initiator may contain anhydride, or may contain at least one selected from the group consisting of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.

[0039] Based on the total mass of the resin composition (excluding the mass of the organic solvent) or the total amount of elastomer, epoxy compound, and thermal polymerization initiator, the content of the thermal polymerization initiator can be within the following ranges. From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining excellent curing properties, the content of the thermal polymerization initiator can be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 3% by mass or more, 5% by mass or more, 6% by mass or more, 7% by mass or more, 8% by mass or more, 9% by mass or more, 10% by mass or more, or 11% by mass or more. From the viewpoint of easily obtaining a cured product with low yellowness, the content of the thermal polymerization initiator can be 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 12% by mass or less, 11% by mass or less, 10% by mass or less, 9% by mass or less, 8% by mass or less, or 7% by mass or less. From these viewpoints, the content of the thermal polymerization initiator can be 0.1 to 50% by mass, 1 to 20% by mass, or 5 to 15% by mass.

[0040] Based on the total amount of elastomer and epoxy compound, the content of the thermal polymerization initiator can be within the following ranges. From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining excellent curability, the content of the thermal polymerization initiator can be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 3% by mass or more, 5% by mass or more, 6% by mass or more, 7% by mass or more, 8% by mass or more, 9% by mass or more, 10% by mass or more, or 11% by mass or more. From the viewpoint of easily obtaining a cured product with low yellowness, the content of the thermal polymerization initiator can be 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 13% by mass or less, 12% by mass or less, 11% by mass or less, 10% by mass or less, 9% by mass or less, 8% by mass or less, or 7% by mass or less. From these viewpoints, the content of the thermal polymerization initiator can be 0.1 to 50% by mass, 1 to 20% by mass, or 5 to 15% by mass.

[0041] The resin composition of this embodiment may contain a curing accelerator. Examples of curing accelerators include phosphorus-based curing accelerators, imidazole compounds, and amine compounds.

[0042] Phosphorus salts can be used as phosphorus-based curing accelerators. Examples of phosphorus salts include tetrabutylphosphonium tetraphenylborate and tetraphenylphosphonium tetraphenylborate. From the viewpoints of easily obtaining cured products with low yellowness and easily obtaining excellent curing properties, curing accelerators can include phosphorus-based curing accelerators, can include phosphorus salts, and can include tetrabutylphosphonium tetraphenylborate.

[0043] Examples of imidazole compounds include 1-(2-cyanoethyl)-2-phenylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-methylimidazolium, 2-ethylimidazolium, 2,4-dimethylimidazolium, 2-undecylimidazolium, 2-heptadecanylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 1-vinyl-2-methylimidazolium, 1-propyl-2-methylimidazolium, 2-isopropylimidazolium, 1-cyanomethyl-2-methyl-imidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, and 1-cyanoethyl-2-phenylimidazolium.

[0044] Examples of amine compounds include triethylamine, dimethylbenzylamine, triethyldiamine, tripropylamine, tributylamine, dimethylethanolamine, triethanolamine, 4-aminopyridine, 2-aminopyridine, N,N-dimethyl-4-aminopyridine, 4-diethylaminopyridine, 2-hydroxypyridine, 2-methoxypyridine, and 4-methoxypyridine.

[0045] Based on the total mass of the resin composition (excluding the mass of the organic solvent) or the total amount of elastomer, epoxy compound, and thermal polymerization initiator, the content of the curing accelerator can be within the following ranges. From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining excellent curing properties, the content of the curing accelerator can be 0.01% by mass or more, 0.015% by mass or more, 0.02% by mass or more, 0.03% by mass or more, 0.05% by mass or more, 0.08% by mass or more, 0.09% by mass or more, or 0.1% by mass or more. From the viewpoint of easily obtaining a cured product with low yellowness, the content of the curing accelerator can be 5% by mass or less, 3% by mass or less, 2% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.5% by mass or less, 0.3% by mass or less, 0.2% by mass or less, or 0.1% by mass or less. From these viewpoints, the content of the curing accelerator can be 0.01 to 5% by mass, 0.015 to 1% by mass, or 0.02 to 0.5% by mass.

[0046] The resin composition of this embodiment may contain additives other than elastomers, epoxy compounds, and thermal polymerization initiators. Examples of such additives include polymerizable compounds (excluding compounds corresponding to epoxy compounds), antioxidants, ultraviolet absorbers, visible light absorbers, colorants, plasticizers, stabilizers, and fillers. Examples of polymerizable compounds include vinyl halides, vinyl ethers, vinyl esters, vinylpyridines, vinylamides, and arylethylenes.

[0047] The resin composition of this embodiment may contain an organic solvent. The resin composition of this embodiment can be used as a resin varnish by diluting it with an organic solvent. Examples of organic solvents include aromatic hydrocarbons such as toluene, xylene, symmetrical trimethylbenzene, cumene, and p-isopropyltoluene; cyclic ethers such as tetrahydrofuran and 1,4-dimethylalkanes; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; carbonates such as ethyl carbonate and propylene carbonate; and amides such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0048] The laminate of this embodiment includes a substrate film (support film) and a transparent resin layer disposed on the substrate film. The transparent resin layer includes the resin composition of this embodiment or the cured product of this embodiment.

[0049] Examples of materials that can be used to construct the substrate film include polyesters (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefins (polyethylene, polypropylene, etc.), polycarbonate, polyamide, polyimide, polyamide-imide, polyether-imide, polyether sulfide, polyether sulfide, polyether ketone, polyphenylene ether, and polyphenylene sulfide. The thickness of the substrate film can be 1~200μm, 10~100μm, or 20~50μm.

[0050] From the perspective of easily achieving excellent transmittance and facilitating the thin-film fabrication of image display devices, the thickness of the transparent resin layer can be less than 1000 μm, less than 800 μm, less than 500 μm, less than 300 μm, less than 250 μm, less than 200 μm, less than 150 μm, or less than 100 μm. From the perspective of reducing transmission loss and easily improving antenna characteristics, the thickness of the transparent resin layer can be more than 1 μm, more than 5 μm, more than 10 μm, more than 20 μm, more than 30 μm, more than 50 μm, more than 80 μm, or more than 100 μm. From these perspectives, the thickness of the transparent resin layer can be 1~1000 μm, 10~500 μm, 20~200 μm, or 50~200 μm.

[0051] The first embodiment of the laminate may include a protective film disposed on a transparent resin layer. The second embodiment of the laminate may include a conductive component disposed on a transparent resin layer.

[0052] The aforementioned materials can be used as constituent materials for the substrate film, serving as the constituent material for the protective film. The protective film can be the same as the substrate film or a different film. The thickness of the protective film can be 1~200μm, 10~100μm, or 20~50μm.

[0053] Conductive components can be solid or have patterned portions (which can be patterned). In conductive components with patterned portions (hereinafter referred to as "patterned conductive components"), part or all of the conductive component can be patterned. Examples of patterns include mesh-like or vortex-like shapes. In the case of using a transparent antenna with a solid conductive component, the conductive component can be patterned (e.g., mesh fabrication). Patterned (e.g., mesh) conductive components can be composed of lines (e.g., metal wires). Examples of materials used to construct conductive components include metallic materials, carbon materials (e.g., graphene), and conductive polymers. Examples of metallic materials include copper, silver, and gold. From the viewpoint of easily obtaining excellent conductivity and easily reducing manufacturing costs, conductive components may contain copper.

[0054] The conductive component can be a single layer or multiple layers. For example, a multiple-layer conductive component may have a first conductive component (e.g., a metal component) disposed on a transparent resin layer, and a second conductive component (e.g., a metal component) disposed on the first conductive component. At least one selected from the group consisting of the first conductive component and the second conductive component can be solid or patterned (e.g., mesh). The second conductive component can serve as a protective layer to suppress contamination, damage, etc., of the first conductive component, thereby improving the operability of the laminate. At least one selected from the group consisting of the first conductive component and the second conductive component may contain copper, and both the first and second conductive components may contain copper.

[0055] The thickness of the conductive component (total thickness when there are multiple conductive components), the thickness of the first conductive component, or the thickness of the second conductive component can be within the following ranges. From the viewpoint that the conductive component is less prone to breakage and that solid conductive components are easy to pattern (e.g., mesh processing), the thickness can be 50 μm or less, 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 15 μm or less, 10 μm or less, 8 μm or less, 5 μm or less, 3 μm or less, 2 μm or less, or 1.5 μm or less. From the viewpoint that excellent elongation can be easily obtained, the thickness can be 0.1 μm or more, 0.3 μm or more, 0.5 μm or more, 0.8 μm or more, 1 μm or more, or 1.2 μm or more. From this perspective, the thickness can be 0.1~50μm, 0.1~30μm, 0.1~20μm, 0.1~10μm, 0.5~5μm or 1~3μm.

[0056] The thickness of the first conductive member can be less than the thickness of the second conductive member. When there are multiple conductive members, the thickness of the conductive members (total thickness) or the thickness of the second conductive member can be 1.5 μm or more, 2 μm or more, 3 μm or more, 5 μm or more, 8 μm or more, 10 μm or more, 15 μm or more, or 20 μm or more.

[0057] Figures 1 and 2 are schematic cross-sectional views showing an example of a laminate. The laminate 10 in Figure 1(a) includes a substrate film 10a, a transparent resin layer 10b disposed on the substrate film 10a, and a protective film 10c disposed on the transparent resin layer 10b. The transparent resin layer 10b is composed of a resin composition of this embodiment or a cured product of this embodiment. The laminate 20 in Figure 1(b) includes a substrate film 20a, a transparent resin layer 20b disposed on the substrate film 20a, and a conductive member 20c disposed on the transparent resin layer 20b. The transparent resin layer 20b is composed of a resin composition of this embodiment or a cured product of this embodiment. The laminate 30 in Figure 2 includes a substrate film 30a, a transparent resin layer 30b disposed on the substrate film 30a, a conductive member 30c disposed on the transparent resin layer 30b, and a conductive member 30d disposed on the conductive member 30c. The transparent resin layer 30b is composed of the resin composition of this embodiment or the cured product of this embodiment.

[0058] The transparent antenna of this embodiment includes a transparent substrate and a conductive member disposed on the transparent substrate. The transparent substrate contains the cured product of this embodiment. The conductive member can be a single layer. As for the configuration of the conductive member, the above-described configuration can be used for the conductive member in the laminate of the second embodiment. For example, the conductive member can contain copper. Furthermore, the conductive member can be solid or patterned (e.g., mesh). As for the thickness of the transparent substrate, the above-described thickness can be used for the transparent resin layer of the laminate of this embodiment.

[0059] The transparent antenna of this embodiment may have a transparent component supporting a transparent substrate, that is, it may have a transparent component, a transparent substrate disposed on the transparent component, and a conductive component disposed on the transparent substrate.

[0060] The shape of the transparent component is not particularly limited and can be film-like (transparent film), substrate-like (transparent substrate), or irregularly shaped. Examples of materials used to construct the transparent component include resin materials and inorganic materials. Examples of resin materials include polyesters (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefins (polyethylene, polypropylene, cyclic olefin polymers, etc.), polycarbonate, polyamide, polyimide, polyamide-imide, polyether-imide, polyether sulfide, polyether sulfide, polyether ketone, polyphenylene ether, polyphenylene sulfide, etc. Examples of inorganic materials include glass. The transparent component can be formed from a material with a total light transmittance of 90% or more. From a low dielectric perspective, the transparent component can include polyolefins.

[0061] The first aspect of the method for manufacturing a transparent antenna according to this embodiment includes a processing step of patterning (e.g., processing into a mesh) a conductive member (solid conductive member) disposed on a transparent substrate containing a cured product of this embodiment. In this processing step, a patterned (e.g., mesh) conductive member is obtained by etching the conductive member while a patterned resist layer is disposed on the conductive member of a laminate containing a transparent substrate and conductive members disposed on the transparent substrate. The resist layer can be removed after etching the conductive member. A patterned resist layer is obtained by irradiating (exposing) a photosensitive layer disposed on the conductive member with active light (e.g., ultraviolet light) and then removing (developing) the unexposed or exposed portions of the resist layer.

[0062] Regarding the laminate having conductive members disposed on a transparent substrate, it can be obtained by forming conductive members on a transparent substrate containing the cured product of this embodiment. For example, it can be obtained by forming conductive members on a transparent resin layer after removing the protective film of the laminate of the first state sample. The laminate having conductive members disposed on a transparent substrate can be the laminate of the second state sample.

[0063] The second aspect of the method for manufacturing a transparent antenna according to this embodiment includes a forming step of forming a patterned (e.g., mesh) metal component while a patterned resist layer is disposed on a transparent substrate containing the cured product of this embodiment. In the forming step, the resist layer can be used as a photomask, and the patterned (e.g., mesh) metal component can be formed by plating or sputtering. The resist layer can be removed after the forming step.

[0064] The third embodiment of the transparent antenna manufacturing method includes a removal step for removing the substrate film in the laminate when the conductive member in the laminate of the second embodiment is patterned (e.g., mesh). If the transparent resin layer of the laminate contains cured material during the removal step, a laminate containing a transparent substrate (transparent resin layer) and patterned (e.g., mesh) conductive member can be obtained as a transparent antenna by performing the removal step. If the transparent resin layer of the laminate is not cured during the removal step, a laminate containing a transparent substrate (transparent resin layer) and patterned (e.g., mesh) conductive member can be obtained as a transparent antenna by curing the transparent resin layer (resin composition of the transparent resin layer) after the removal step.

[0065] The fourth embodiment of the transparent antenna manufacturing method includes a lamination step of depositing a transparent resin layer from the laminate of this embodiment onto a transparent member. The transparent member described above can be used as the transparent member for the transparent antenna. In the lamination step, the transparent resin layer can be deposited onto the transparent member while the substrate film in the laminate of this embodiment has been removed, or the transparent resin layer can be deposited onto the transparent member while the protective film in the laminate of the first embodiment has been removed. The fourth embodiment of the transparent antenna manufacturing method can include a removal step A of removing the substrate film in the laminate of this embodiment, or a removal step B of removing the protective film in the laminate of the first embodiment.

[0066] When using the laminate of the second state sample, in the lamination step, the transparent resin layer and the conductive member can be laminated onto the transparent member while the transparent resin layer is positioned closer to the transparent member than the conductive member, or the transparent resin layer and the conductive member can be laminated onto the transparent member while the transparent resin layer is in contact with the transparent member. In the lamination step, the transparent resin layer and the conductive member can be laminated onto the transparent member while the substrate film in the laminate of the second state sample has been removed.

[0067] In the case of a laminate containing a transparent component and a conductive component disposed on the transparent component, where the transparent component and conductive component are laminated with good adhesion, surface treatment (plasma treatment, corona treatment, etc.) is sometimes applied to the transparent component, which may complicate the manufacturing process of the laminate. For example, when polyolefin is used as the constituent material of the transparent component, the adhesion between the polyolefin and the conductive component (e.g., a metal material such as copper) is low, so surface treatment is sometimes required to obtain sufficient adhesion. On the other hand, according to the manufacturing method of the transparent antenna of the fourth state, sufficient adhesion between the transparent component and the conductive component can be obtained without surface treatment of the transparent component, and a laminate containing a transparent component and a conductive component (a laminate containing a transparent component, a transparent resin layer, and a conductive component) can be obtained as a transparent antenna. For example, sufficient adhesion between a transparent component containing polyolefin and a conductive component containing copper can be obtained, and a transparent antenna can be obtained at the same time. Furthermore, according to the manufacturing method of the transparent antenna of the fourth embodiment, by laminating the bulk layer of this embodiment onto the transparent member, the transparent resin layer and the conductive member can be supplied together onto the transparent member, and a transparent antenna can be obtained in a simple way. In addition, according to the manufacturing method of the transparent antenna of the fourth embodiment, by using a material with excellent dielectric properties (dielectric constant, dielectric loss tangent, etc.) as the constituent material of the transparent resin layer, a transparent antenna with excellent antenna characteristics can be obtained.

[0068] In the manufacturing method of the transparent antenna of the fourth state, the transparent resin layer removed in step A, step B, and the lamination step may be uncured or cured. If the transparent resin layer is uncured, the manufacturing method of the transparent antenna of the fourth state may include a curing step after the lamination step to cure the transparent resin layer (the resin composition of the transparent resin layer).

[0069] In the manufacturing method of the transparent antenna of the fourth state, the conductive components removed in steps A, B, and the stacking step can be solid or patterned (e.g., mesh). When the conductive components are solid, the manufacturing method of the transparent antenna of the fourth state can include a processing step of patterning the conductive components (e.g., processing them into a mesh) after the stacking step.

[0070] In the manufacturing method of the transparent antenna of the fourth state, the conductive members in the removal steps A, B, and the stacking step can be multiple layers, and can include a first conductive member disposed on a transparent resin layer and a second conductive member disposed on the first conductive member. At least one selected from the group consisting of the first conductive member and the second conductive member can be solid or patterned (e.g., mesh). At least one selected from the group consisting of the first conductive member and the second conductive member can contain copper, and both the first and second conductive members can also contain copper. When the conductive members include both the first and second conductive members, in the stacking step, the transparent resin layer and the conductive members can be stacked on the transparent member while the first conductive member is positioned closer to the transparent member than the second conductive member. The manufacturing method of the transparent antenna of the fourth state can include a removal step C that removes the second conductive member after the stacking step. In removal step C, the second conductive member can be peeled off from the first conductive member. The manufacturing method of the transparent antenna of the fourth state can include a processing step of patterning the first conductive member (e.g., processing it into a mesh) after removing step C. In this processing step, for example, the first conductive member can be etched while a patterned resist layer is disposed on it. If the transparent resin layer is not cured, the manufacturing method of the transparent antenna of the fourth state can include a curing step of curing the transparent resin layer (the resin composition of the transparent resin layer) before, after, or before and after removing step C.

[0071] The fifth embodiment of the transparent antenna manufacturing method is a method for manufacturing a transparent antenna using a laminate having the above-mentioned substrate film, the above-mentioned transparent resin layer, and the above-mentioned conductive member having a first conductive member and a second conductive member. The method includes a removal step C in which the second conductive member is removed while the transparent resin layer in the laminate is located closer to the transparent member than the conductive member and the transparent resin layer and the conductive member are laminated on the transparent member.

[0072] The manufacturing method of the transparent antenna of the fifth state can include a curing step of curing a transparent resin layer (a resin composition of the transparent resin layer) while the transparent resin layer and the conductive member are deposited on the transparent member, either before, after, or before and after removing the second conductive member. In the curing step, the transparent resin layer can be cured while the transparent resin layer and the conductive member are deposited on the transparent member and the transparent resin layer is located closer to the transparent member than the conductive member. The manufacturing method of the transparent antenna of the fifth state can also include a processing step of patterning the first conductive member (e.g., processing it into a mesh) after removing the second conductive member (after removal step C). An example of the manufacturing method of the transparent antenna of the fifth state is a manufacturing method using a laminate containing the aforementioned substrate film, the aforementioned transparent resin layer (uncured transparent resin layer), and the aforementioned conductive members having the first and second conductive members. This method includes the aforementioned removal step A (first removal step), lamination step, curing step, and removal step C (second removal step). In the manufacturing method of the transparent antenna of the fifth state, at least one of the first conductive member and the second conductive member may contain copper, and the first conductive member and the second conductive member may also contain copper. Furthermore, the first conductive member in the laminate may be solid or patterned (e.g., mesh).

[0073] In the manufacturing methods of the transparent antennas of the first to fifth states described above, the steps and configurations described above can be combined with each state. For example, in the manufacturing method of the transparent antenna of the fifth state, the manufacturing method of the transparent antenna of the fourth state can utilize the steps and configurations described above.

[0074] The image display device of this embodiment includes a transparent antenna. The image display device may have an image display section for displaying images and a frame section (border section) surrounding the image display section, and the transparent antenna may be disposed on the image display section. The image display device can be used in various electronic devices such as personal computers, car navigation systems, mobile phones, clocks, and electronic dictionaries.

[0075] Figures 3 and 4 are schematic cross-sectional views showing an example of an image display device, and illustrate the image display section of the device. The image display device 100 in Figure 3 includes a transparent antenna 110, a protective layer 120 disposed on the transparent antenna 110, and a transparent covering member 130 disposed on the protective layer 120. The transparent antenna 110 includes a transparent substrate 110a and a mesh conductive member 110b disposed on the transparent substrate 110a. The image display device 200 in Figure 4 includes a transparent antenna 210, a protective layer 220 disposed on the transparent antenna 210, and a transparent covering member 230 disposed on the protective layer 220. The transparent antenna 210 includes a transparent member 210a, a transparent substrate 210b disposed on the transparent member 210a, and a mesh conductive member 210c disposed on the transparent substrate 210b. The transparent substrates 110a and 210b are made of a cured material according to this embodiment. The conductive members 110b and 210c are formed of copper. The transparent component 210a is formed of polyolefin. Protective layers 120 and 220 cover the transparent substrates 110a and 210b and the conductive components 110b and 210c. The protective layers 120 and 220 can be formed from the resin composition or cured product of this embodiment, or from a material having a total light transmittance of 90% or more. The covered components 130 and 230 can be glass plates. [Example]

[0076] The present disclosure will now be described in more detail with reference to embodiments and comparative examples, but the present disclosure is not limited to the following embodiments.

[0077] <Preparation of Resin Varnish> (Examples 1-4) A resin varnish was obtained by mixing 80 parts by weight of an elastomer (styrene-based elastomer, hydrogenated styrene-butadiene rubber, manufactured by JSR Corporation, product name: DYNARON 2324P, weight average molecular weight: 1.0 × 10⁵), epoxy compounds 1-4 (epoxy monomers) from Table 1, a thermal polymerization initiator (an anhydride curing agent, manufactured by New Japan Chemical Co., Ltd., product name: RIKACID MH-700, 4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride = 70 / 30), a curing accelerator (tetrabutyltetraphenylborate, manufactured by NIPPON CHEMICAL INDUSTRIAL CO.,LTD., product name: Hishicolin PX-4PB), and a solvent (toluene) while stirring. The amounts of epoxy compounds, thermal polymerization initiator, and curing accelerator used (in parts by weight) are shown in Table 1. The amount of solvent was adjusted so that the total amount of the resin varnish was 225.1 parts by weight.

[0078] Epoxide 1: Tris[6-(epoxyethyl-2-yl)hexyl]-1,3,5-triazine-2,4,6-trione, manufactured by Nissan Chemical Corporation, product name "TEPIC FL", molecular weight 507.67 Epoxide 2: 1,2-Epoxy-4-vinylcyclohexane, manufactured by Daicel Corporation, product name "CELLOXIDE 2000", molecular weight 124.18 Epoxide 3: ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylic acid ester, manufactured by Daicel Corporation, product name "CELLOXIDE 2081", molecular weight 366.45 Epoxy compound 4: The compound represented by formula (A) above, manufactured by ENEOS Corporation, product name "EPOCHALIC THI-DE", molecular weight 152.

[0079] (Comparative Example 1) A resin varnish was obtained by mixing 80 parts by weight of an elastomer (styrene-based elastomer, hydrogenated styrene-butadiene rubber, manufactured by JSR Corporation, product name: DYNARON 2324P, weight average molecular weight: 1.0 × 10⁵), 20 parts by weight of an acrylic compound (nonanediol diacrylate, manufactured by Showa Denko Materials Co., Ltd., product name: FA-129AS, molecular weight 268), 1.5 parts by weight of a photopolymerization initiator (photoradical generator, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, manufactured by BASF, product name: IRGACURE 819), and a solvent (toluene) while stirring. The amount of solvent was adjusted so that the total amount of the resin varnish was 225.1 parts by weight.

[0080] <Evaluation of Membrane Production> As the substrate film, a surface-release treated PET film (manufactured by Teijin Dupont Film Japan Limited, product name: PUREX A31, thickness: 38μm) was prepared. The aforementioned resin varnish was applied to the release-treated surface of this PET film using a doctor blade coater (manufactured by YASUI SEIKI CO.,LTD., product name: SNC-300). Then, a resin film was formed by drying at 100°C for 20 minutes in a dryer (manufactured by FUTABA KAGAKU IBARAKI co.,ltd., product name: MSO-80TPS). The thickness of the dried resin film was adjusted to 100μm by adjusting the gap of the coater. After preparing a surface-release treated PET film identical to the substrate film as a protective film, the release-treated surface of the protective film was attached to the resin film, thereby obtaining a laminated film.

[0081] By heat-curing the resin film obtained by using the resin varnishes of Examples 1 to 4 in a dryer (manufactured by FUTABA KAGAKU IBARAKI co.,ltd., product name: MSO-80TPS), an evaluation film with cured film was obtained.

[0082] By using an ultraviolet exposure machine (MIKASA CO.,LTD, product name: ML-320FSAT), a laminated film having a resin film obtained using the resin varnish of Comparative Example 1 was photocured by irradiating the film with ultraviolet light (wavelength 365nm) at 2000mJ / cm2, thereby obtaining an evaluation film with a cured film.

[0083] <Characteristic Evaluation> (YI, total light transmittance, and haze) Test pieces were obtained by cutting a 30mm long and 30mm wide laminate from the aforementioned evaluation film, and then removing the substrate film and protective film from the laminate. At 25°C, a spectrophotometer (NIPPON DENSHOKU INDUSTRIES Co., Ltd., product name: SH7000) was used to measure the Yellow Index (YI), total light transmittance, and haze of the test pieces in the examples, and the YI and total light transmittance of the test pieces in the comparative examples. The results are shown in Table 1.

[0084] (Relative permittivity and dielectric loss tangent) From the evaluation film described in the examples, a laminate with a length of 80 mm and a width of 80 mm was cut as a test piece. Using a vector network analyzer (Agilent Technologies Japan, Ltd., product name: E8364B) and a 10 GHz resonator (Kanto Electronics Application and Development, Inc., product name: CP531), at 25°C, the relative permittivity and dielectric loss tangent of the entire test piece were measured using the separated column dielectric resonator method (SPDR method). Furthermore, after fabricating a laminate containing only the aforementioned substrate film and protective film (length: 80 mm, width: 80 mm), the relative permittivity and dielectric loss tangent of the laminate were measured using the same method. By subtracting the measurement results of the laminate from the measurement results of the test piece, the relative permittivity and dielectric loss tangent of the cured film were obtained. The results are shown in Table 1.

[0085] (Elongation and elastic modulus) Test pieces were obtained by cutting a 40mm long and 10mm wide laminate from the aforementioned evaluation film, removing the substrate film and protective film from the laminate. The stress-strain curves of the test pieces were measured using an AUTAGRAPH (manufactured by Shimadzu Corporation, product name: EZ-S) at 25°C, and the elongation and elastic modulus (tensile elastic modulus) were determined from the stress-strain curves. The clamping distance was set to 20mm, and the tensile speed was set to 50mm / min. The elongation at break was measured as the elongation. The elastic modulus was measured under loads ranging from 0.5N to 1.0N. The results are shown in Table 1.

[0086] [Table 1] unit Example Comparative example 1 2 3 4 1 composition elastomer Quality 80 80 80 80 80 Epoxy compound 1 10 Epoxy Compound 2 8.6 Epoxy Compound 3 11 Epoxy Compound 4 13.4 acrylic compounds 20 Thermal polymerization initiator 10 11.4 9.0 6.6 Curing accelerator 0.02 0.1 0.1 0.1 Photopolymerization initiator 1.5 Feature Evaluation YI - 0.29 0.41 0.44 0.40 0.75 Total light transmittance % 91.75 92.16 92.01 91.93 92.02 Haze % 1.85 1.98 2.77 2.54 - Relative permittivity - 2.47 2.42 2.40 2.41 - Dielectric loss tangent - 0.0072 0.0076 0.0075 0.0080 - elongation % 638 852 731 689 800 Elasticity coefficient MPa 0.6 0.7 0.6 0.8 1.7

[0087] 10, 20, 30: Laminated bodies 10a, 20a, 30a: Substrate film 10b, 20b, 30b: Transparent resin layer 10c: Protective film 20C, 30C, 30D, 110B, 210C: Conductive components 100, 200: Image display device 110, 210: Transparent Antenna 110a, 210b: Transparent substrate 120, 220: Protective layer 130, 230: Covered components 210a: Transparent component

Claims

1. A resin composition comprising an elastomer, an epoxy compound, and a thermal polymerization initiator, wherein the epoxy compound has at least one selected from the group consisting of a triazine ring and an epoxide cyclohexane ring, and the thermal polymerization initiator comprises an acid anhydride.

2. The resin composition as claimed in claim 1, wherein the aforementioned thermal polymerization initiator comprises at least one selected from the group consisting of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.

3. The resin composition as described in claim 1 or claim 2, wherein the aforementioned elastomer comprises a styrene-based elastomer.

4. A cured resin composition, which is a cured resin composition according to any one of claims 1 to 3.

5. A laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, wherein the transparent resin layer comprises a resin composition as described in any one of claims 1 to 3 or a cured product as described in claim 4.

6. The laminate as described in claim 5, further comprising a conductive member disposed on the aforementioned transparent resin layer.

7. The laminate as described in claim 6, wherein the aforementioned conductive member contains copper.

8. The laminate as described in claim 6 or claim 7, wherein the thickness of the aforementioned conductive member is 2 μm or less.

9. The laminate as claimed in claim 6, wherein the aforementioned conductive member has a first conductive member disposed on the aforementioned transparent resin layer and a second conductive member disposed on the first conductive member, the aforementioned first conductive member and the aforementioned second conductive member containing copper.

10. A transparent antenna having a transparent substrate and a conductive member disposed on the transparent substrate, wherein the transparent substrate comprises the cured material described in claim 4.

11. A transparent antenna comprising a transparent substrate and a conductive member disposed on the transparent substrate, wherein the transparent substrate comprises a cured resin composition, the resin composition comprising an elastomer, an epoxy compound and a thermal polymerization initiator.

12. The transparent antenna as described in claim 10 or claim 11, wherein the aforementioned conductive member is a mesh.

13. The transparent antenna as described in claim 10 or claim 11, wherein the aforementioned conductive component contains copper.

14. An image display device comprising a transparent antenna as described in any one of claims 10 to 13.

15. A method for manufacturing a transparent antenna, wherein the aforementioned transparent resin layer in any one of claims 5 to 9 is deposited on a transparent member.

16. A method for manufacturing a transparent antenna, wherein the transparent resin layer is deposited on a transparent member in a laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, the transparent resin layer comprising a resin composition or a cured thereof, the resin composition comprising an elastomer, an epoxy compound and a thermal polymerization initiator.

17. A method for manufacturing a transparent antenna, wherein, in the laminated body of claim 9, the aforementioned transparent resin layer is located on the transparent member side closer to the transparent member than the aforementioned conductive member, and the aforementioned transparent resin layer and the aforementioned conductive member are laminated on the aforementioned transparent member, the aforementioned second conductive member is removed.

18. A method for manufacturing a transparent antenna, comprising a laminate comprising a substrate film, a transparent resin layer disposed on the substrate film, and a conductive member disposed on the transparent resin layer, wherein the conductive member comprises a first conductive member disposed on the transparent resin layer and a second conductive member disposed on the first conductive member, wherein the transparent resin layer is located closer to the transparent member than the conductive member in the laminate, and the transparent resin layer and the conductive member are laminated on the transparent member, and the second conductive member is removed, wherein the transparent resin layer comprises a resin composition or a cured form thereof, the resin composition comprises an elastomer, an epoxy compound and a thermal polymerization initiator, and the first conductive member and the second conductive member comprise copper.

19. A method for manufacturing a transparent antenna as claimed in claim 18, wherein the transparent resin layer is cured while the transparent resin layer and the conductive member are deposited on the transparent member before the second conductive member is removed.

20. A method for manufacturing a transparent antenna as described in any one of claims 17 to 19, wherein the first conductive member is processed into a mesh after the second conductive member is removed.

Images