Substrate processing module and substrate processing apparatus equipped with the module

Abstract

The substrate processing module 14 of the substrate processing apparatus 10 includes: a first groove and second grooves 32 and 30, arranged along a first direction and for placing substrates; first transport units 34 and 36 for moving substrates W into the second groove 30 and the first groove 32; and a second transport unit 20 for transporting substrates W along a second direction intersecting the first direction, and for delivering substrates W to the first transport units 34 and 36. The second transport unit 20 includes a clamp 26 that holds substrates W as they pass above the first groove 32, and an actuator 25 that moves the clamp 26 along the second direction. The actuator 25 of the second transport unit 20 is disposed in the substrate processing module 14 on the side of the first groove 32 in the first direction.

Description

Technical Field

[0001] The present invention relates to a substrate processing module for processing a substrate and a substrate processing apparatus including the module. Prior Art

[0002] Patent Document 1 discloses a substrate processing apparatus in which a plurality of pairs of chemical solution tanks and cleaning tanks are arranged in the longitudinal direction of the apparatus, and which includes a main transfer mechanism and a sub-transfer mechanism. The main transfer mechanism moves a plurality of substrates from one end side of the apparatus to the other end side in the longitudinal direction. The sub-transfer mechanism moves a plurality of substrates within the range of a pair of chemical solution tanks and cleaning tanks in the longitudinal direction and in the vertical direction. [Prior Art Document] [Patent Document]

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2018-56158 Summary of the Invention Problems to be Solved by the Invention

[0004] In the case of the substrate processing apparatus described in Patent Document 1, a plurality of processing tanks such as chemical solution tanks or cleaning tanks are arranged in the main transfer direction of the substrates in the main transfer mechanism. Therefore, as the number of processing tanks increases, the size of the substrate processing apparatus in the main transfer direction of the substrates increases.

[0005] Therefore, an object of the present invention is to suppress the enlargement of the substrate processing apparatus due to an increase in the number of processing tanks. Means for Solving the Problems

[0006] To solve the above problems, according to an aspect of the present invention, there is provided a substrate processing module for processing a substrate, the substrate processing module including: a first tank and a second tank arranged along a first direction and configured to hold a substrate; a first transfer unit configured to transfer the substrate to the first tank and the second tank; and a second transfer unit configured to transfer the substrate along a second direction intersecting the first direction and configured to deliver the substrate to the first transfer unit; the second transfer unit including a clamp configured to hold the substrate and pass above the first tank and an actuator configured to move the clamp along the second direction; The actuator of the second transfer unit is disposed on the first tank side in the first direction in the substrate processing module.

[0007] According to another aspect of the present invention, there is provided a substrate processing apparatus including: the substrate processing module; and another module connected to the substrate processing module along a second direction. Advantageous Effects of Invention

[0008] According to the present invention, it is possible to suppress the enlargement of the substrate processing apparatus due to an increase in the number of processing tanks. Brief Description of Drawings

[0009] FIG. 1 is a perspective view of a substrate processing apparatus according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of a chemical module in the substrate processing apparatus. FIG. 3A is a perspective view showing a state where a first clamp of one first transfer unit and a second clamp of the other first transfer unit are respectively above a first tank and a second tank. FIG. 3B is a perspective view showing a state where a first clamp of one first transfer unit and a second clamp of the other first transfer unit are respectively inside a first tank and a second tank. FIG. 3C is a perspective view showing a state where both a first clamp of one first transfer unit and a second clamp of the other first transfer unit are above the first tank. FIG. 4A is a side view showing a state where a first clamp of one first transfer unit and a second clamp of the other first transfer unit are respectively above a first tank and a second tank. FIG. 4B is a side view showing a state where a first clamp of one first transfer unit and a second clamp of the other first transfer unit are respectively inside a first tank and a second tank. FIG. 4C is a side view showing a state where both a first clamp of one first transfer unit and a second clamp of the other first transfer unit are above the first tank. FIG. 5 is a top view showing a state where both a first clamp of one first transfer unit and a second clamp of the other first transfer unit are above the first tank. FIG. 6 is a view showing the delivery of a substrate between a first clamp and a second clamp. FIG. 7 is a perspective view of a second transfer unit in a state of holding a substrate in the substrate processing apparatus according to Embodiment 1. FIG. 8 is a perspective view showing a clamp in the second transfer unit of the substrate processing apparatus according to Embodiment 1. Figure 9 shows the holding and releasing of the substrate of the clamp. Figure 10 shows the substrate being delivered from the fixture of the second transport section to the second fixture of the first transport section on the other side. Figure 11 shows the substrate being delivered from the first fixture of the first transport section to the fixture of the second transport section. Figure 12A is a diagram of one of the actions performed by a substrate processing device in substrate processing. Figure 12B is a diagram showing the action that follows the action shown in Figure 12A. Figure 12C shows a sequence of actions that follow the action shown in Figure 12B. Figure 12D shows the action that follows the action shown in Figure 12C. Figure 12E shows a diagram of the action that follows the action shown in Figure 12D. Figure 12F is a diagram showing the action that follows the action shown in Figure 12E. Figure 12G shows a diagram of the action that follows the action shown in Figure 12F. Figure 12H shows the action that follows the action shown in Figure 12G. Figure 12I is a diagram showing the action that follows the action shown in Figure 12H. Figure 12J shows a sequence of actions that follow the action shown in Figure 12I. Figure 13 is a side view of the chemical module in the substrate processing apparatus of Embodiment 2. Figure 14 is a side view of the chemical module in the substrate processing apparatus of Embodiment 3. Figure 15 is a perspective view of the second transport unit that holds the substrate in the substrate processing apparatus of Embodiment 3. Figure 16 is a perspective view of the fixture in the second transport section of the substrate processing apparatus of Embodiment 3. Figure 17 is a perspective view of a plurality of first transport units in a modified embodiment 3. Figure 18 is a side view of the chemical module in the substrate processing apparatus of Embodiment 4. Figure 19 is a perspective view of the second transport unit that holds the substrate in the substrate processing apparatus of Embodiment 4. Figure 20 is a perspective view of the fixture in the second transport section of the substrate processing apparatus of Embodiment 4. Figure 21 is a side view of the chemical module in the substrate processing apparatus of Embodiment 5. Implementation

[0010] The substrate processing module of the present invention processes substrates and includes: a first groove and a second groove arranged along a first direction and for placing substrates; a first transport unit for transporting the substrates to the first groove and the second groove; and a second transport unit for transporting the substrates along a second direction intersecting the first direction and delivering the substrates to the first transport unit; the second transport unit includes a clamp holding the substrates above the first groove and an actuator for moving the clamp along the second direction; the actuator of the second transport unit is disposed in the substrate processing module on the side of the first groove along the first direction.

[0011] Based on this pattern, the large-scale development of substrate processing equipment caused by the increase in the number of processing tanks can be suppressed.

[0012] For example, the actuator of the second transport unit can be disposed above or below the first groove.

[0013] For example, the actuator of the second transport unit can be disposed above the first groove.

[0014] For example, the actuator of the second transport unit can be configured in a drive space isolated from the processing space where the first slot and the second slot are configured.

[0015] A top plate is provided above the aforementioned processing space, and the aforementioned driving space may be located above the aforementioned top plate.

[0016] For example, the aforementioned second transport unit may have an arm that extends in the height direction to connect the aforementioned actuator and the aforementioned clamp, and the aforementioned arm is preferably located further forward than the aforementioned first groove.

[0017] For example, the substrate processing module may have a vertical plate that separates the space above the aforementioned first groove from the aforementioned arm.

[0018] For example, the aforementioned first transport unit may have two parts. In this case, one of the aforementioned first transport units is equipped with a first clamp to keep the aforementioned substrate in a state that allows it to move into the aforementioned first groove, and the other of the aforementioned first transport unit is equipped with a second clamp to keep the aforementioned substrate in a state that allows it to move into the aforementioned second groove and to move above the aforementioned first groove. The aforementioned first clamp and the aforementioned second clamp are configured to deliver the substrate between the two.

[0019] Another embodiment of the substrate processing apparatus of the present invention comprises: the aforementioned substrate processing module; and another module connected to the aforementioned substrate processing module along the aforementioned second direction.

[0020] Based on this pattern, the large-scale development of substrate processing equipment caused by the increase in the number of processing tanks can be suppressed.

[0021] The embodiments of the present invention will be described below with reference to the drawings.

[0022] (Implementation Type 1) Figure 1 is a perspective view of the substrate processing apparatus according to Embodiment 1 of the present invention. Furthermore, the XYZ orthogonal coordinate system shown in the figure is for ease of understanding of the invention and is not intended to limit the inventor. The X-axis direction is the front-back direction (first direction) of the substrate processing apparatus, the Y-axis direction is the left-right direction (second direction), and the Z-axis direction is the height direction (third direction).

[0023] As shown in Figure 1, the substrate processing apparatus 10 of this embodiment 1 is an apparatus for processing substrate W, which is constructed by connecting a plurality of modules, each having different functions, along the Y-axis direction (second direction). Substrate W is a circular thin plate, such as a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disc, a MEMS (Micro Electronic Mechanical System) sensor substrate, a solar cell panel, etc.

[0024] In this embodiment 1, the substrate processing apparatus 10 includes: a loading module 12, a chemical module (substrate processing module) 14, a drying module 16, and a unloading module 18. These modules 12, 14, 16, and 18 are connected in the Y-axis direction (second direction). Furthermore, the substrate W is loaded from the outside into the loading module 12, and the substrate W loaded into the loading module 12 undergoes chemical treatment in the chemical module 14. In the drying module 16, the substrate W that has been treated in the chemical module 14 is dried. The substrate W, after being dried in the drying module 16, is unloaded from the unloading module 18 to the outside. Additionally, the configuration of the modules can be changed depending on the type of substrate W or the processing content. For example, the substrate processing apparatus 10 may include a plurality of chemical modules 14 that perform different treatments on the substrate W.

[0025] Furthermore, the substrate processing apparatus 10 includes a second transport unit 20, which transports the substrate W between a plurality of modules along the Y-axis direction (second direction). The second transport unit 20 includes an actuator 25 and a clamp 26, the clamp 26 being moved along the Y-axis direction by the actuator 25. The actuator 25 is, for example, composed of a track 22 and a moving head 24 (moving body). The track 22 is provided and connected to each of the plurality of modules 12 to 18, and the moving head 24 moves along the track 22. The clamp 26 is supported by the moving head 24 to hold the substrate W. By moving the moving head 24 along the track 22 along the Y-axis direction of the plurality of modules 12 to 18, the clamp 26 moves through each of the plurality of modules 12 to 18. Further details regarding the second transport unit 20 will be described later. In this way, multiple substrates W are transported along the second direction.

[0026] Figure 2 is a schematic perspective view of the chemical module in the substrate processing device.

[0027] In the chemical module 14 shown in Figure 2, various chemical solutions are used for cleaning, etching, or resist stripping, such as APM (ammonium hydroxide-hydrogen peroxide mixture), SPM (sulfuric acid-hydrogen peroxide mixture), HPM (hydrochloric acid-hydrogen peroxide mixture), and DHF (diluted hydrofluoric acid), to treat the substrate W. These chemical treatments can be arbitrarily combined depending on the type of chemical treatment applied to the substrate W.

[0028] The chemical module 14 of the substrate processing apparatus 10 has a first tank 32 and a second tank 30 as processing tanks for processing the substrate W. The first tank 32 and the second tank 30 are arranged along the X-axis direction (first direction) and can accommodate the substrate W. The second tank 30 is located on the rear side of the substrate processing apparatus 10, and the first tank 32 is located on the front side of the substrate processing apparatus 10. In addition, in the case of this embodiment 1, the second tank 30 is a chemical solution tank for storing the chemical solution to be immersed in the substrate W, and the first tank 32 is a cleaning tank for storing a cleaning solution such as pure water to be immersed in the substrate W after chemical treatment.

[0029] Furthermore, the chemical module 14 of the substrate processing apparatus 10 has a plurality of first transport units 34, 36 that move the substrate W up and down along the Z-axis direction (third direction).

[0030] Figure 3A is a perspective view showing the first clamp of one first transport unit and the second clamp of the other first transport unit positioned above the first and second slots, respectively. Furthermore, Figure 3B is a perspective view showing the first clamp of one first transport unit and the second clamp of the other first transport unit positioned inside the first and second slots, respectively. Finally, Figure 3C is a perspective view showing both the first clamp of one first transport unit and the second clamp of the other first transport unit positioned above the first slot.

[0031] Furthermore, Figure 4A is a side view showing the first clamp of one first transport unit and the second clamp of the other first transport unit positioned above the first groove and the second groove, respectively. Furthermore, Figure 4B is a side view showing the first clamp of one first transport unit and the second clamp of the other first transport unit positioned inside the first groove and the second groove, respectively. Furthermore, Figure 4C is a side view showing the first clamp of one first transport unit and the second clamp of the other first transport unit both positioned above the first groove. Additionally, Figures 3A and 4A correspond to each other, Figures 3B and 4B correspond to each other, and Figures 3C and 4C correspond to each other.

[0032] As shown in Figures 3A to 3C and Figures 4A to 4C, in the case of Embodiment 1, the other first transport unit 34 includes: a second clamp 34a that holds a plurality of substrates W, an arm 34b that supports the second clamp 34a, an actuator 34c that moves the arm 34b up and down along the Z-axis direction (third direction), and an actuator 34d that moves the actuator 34c along the X-axis direction (first direction).

[0033] The second clamp 34a can be raised and lowered by the actuator 34c. Thus, as shown in Figures 3B and 4B, the second clamp 34a can be positioned within the second slot 30. Furthermore, as shown in Figures 3A, 3C, 4A, and 4C, the second clamp 34a can be moved between a position above the second slot 30 and a position above the first slot 32 by the actuator 34d.

[0034] In the case of this embodiment 1, the first transport unit 36 ​​of one party includes: a first clamp 36a for holding a plurality of substrates W, an arm 36b for supporting the first clamp 36a, and an actuator 36c for raising and lowering the arm 36b along the Z-axis direction (third direction).

[0035] The first clamp 36a can be raised and lowered by the actuator 36c. Thus, as shown in Figures 3B and 4B, the first clamp 36a can be disposed in the first slot 32. In addition, in the case of this embodiment 1, the first clamp 36a is different from the second clamp 34a and does not move along the X-axis direction (first direction).

[0036] Furthermore, as shown in FIG3A, the actuators 34c and 34d of the first transport unit 34 are disposed on one side of the second groove 30 in the Y-axis direction (second direction) (the right side in this embodiment 1). The actuator 36c of the first transport unit 36 ​​is disposed on one side of the first groove 32 in the X-axis direction (first direction), that is, in front of the first groove 32 (disposed on the opposite side of the second groove 30 across the first groove 32).

[0037] As shown in FIG3A, in the case of this embodiment 1, the second clamp 34a of the first transport unit 34 and the first clamp 36a of the first transport unit 36 ​​can deliver the substrate W to each other and have corresponding shapes.

[0038] For example, in the case of this embodiment 1, the second clamp 34a and the first clamp 36a are comb-shaped clamps when viewed from above (viewed in the Z-axis direction).

[0039] Specifically, the second clamp 34a includes: a body portion 34e connected to the arm 34b; and a plurality of support rods 34f extending forward from the body portion 34e in the X-axis direction (first direction) for holding a plurality of substrates W. Similarly, the first clamp 36a includes: a body portion 36d connected to the arm 36b; and a plurality of support rods 36e extending rearward from the body portion 36d in the X-axis direction for holding a plurality of substrates W. A plurality of grooves (not shown) are formed in each of the support rods 34f and 36e, which engage with the outer peripheral ends of each of the plurality of substrates W to hold the plurality of substrates W at a predetermined interval. In this way, the plurality of substrates W are held in the first and second clamps 36a and 34a in a state of overlapping and spaced apart in the X-axis direction. Furthermore, in the case of Embodiment 1, the second clamp 34a and the first clamp 36a are respectively equipped with four support rods 34f and 36e. The number of support rods for placing the substrate W can be three or more, and the number of support rods between the second clamp 34a and the first clamp 36a can also be different.

[0040] Furthermore, in the case of this embodiment 1, the second clamp 34a and the first clamp 36a are configured such that each of them has a plurality of support rods 34f and 36e that can pass relative to each other in the Z-axis direction (third direction).

[0041] Figure 5 is a top view showing the first clamp of one first transport unit and the second clamp of the other first transport unit both positioned above the first groove. Figure 6 shows the delivery of the substrate between the first and second clamps.

[0042] As shown in Figure 5, in this embodiment 1, the delivery of the plurality of substrates W between the second clamp 34a and the first clamp 36a is performed above the first slot 32. During the delivery of the substrates W, the plurality of support rods 34f of the second clamp 34a and the plurality of support rods 36e of the first clamp 36a are located between the body portion 34e of the second clamp 34a and the body portion 36d of the first clamp 36a. Therefore, as shown in Figure 6, the plurality of support rods 34f of the second clamp 34a and the plurality of support rods 36e of the first clamp 36a can simultaneously contact the plurality of substrates W.

[0043] Furthermore, as shown in Figures 5 and 6, during the delivery of substrate W, the support rods 34f of the second clamp 34a and the plurality of support rods 36e of the first clamp 36a do not overlap in the Z-axis direction (third direction) of the first and second clamps 36a and 34a. Therefore, their support rods do not contact each other, and the first and second clamps 36a and 34a can pass relative to each other in the Z-axis direction. For example, when the second clamp 34a descends from the state shown in Figure 6, the plurality of substrates W remain on the plurality of support rods 36e of the first clamp 36a, and the plurality of substrates W are delivered to the first clamp 36a.

[0044] In this embodiment 1, a plurality of substrates W are supplied from the loading module 12 to the second clamp 34a of the first loading module 34 via the second transport unit 20, and then delivered from the second clamp 34a to the first clamp 36a of the first loading module 36. Furthermore, the plurality of substrates W on the first clamp 36a are retrieved by the second transport unit 20 and transported to the drying module 16. In this embodiment 1, the supply of substrates W to the second clamp 34a of the first loading module 34 and the retrieval of substrates W from the first clamp 36a of the first loading module 36 are performed by a common second transport unit 20.

[0045] Figure 7 is a perspective view of the second transport unit that holds the substrate in the substrate processing apparatus of Embodiment 1. Furthermore, Figure 8 shows a perspective view of the clamp in the second transport unit. Moreover, Figure 9 shows the holding and releasing of the substrate by the clamp.

[0046] As shown in Figure 1, in this embodiment 1, the moving head 24 of the actuator 25 of the second transport unit 20 is disposed at the upper front part of the substrate processing apparatus 10 (i.e., each module 12 to 18) and moves on the track 22 extending in the Y-axis direction (second direction). As shown in Figures 4A to 4C, in the chemical module 14, the actuator 25 is disposed on the side of the first groove 32 in the X-axis direction (first direction). Furthermore, in this embodiment 1, the actuator 25 is located above the first groove 32. Therefore, the moving head 24 of the actuator 25 moves above the first groove 32 in the Y-axis direction.

[0047] In the case of Embodiment 1, as shown in Figures 4A to 4C, in the chemical module 14, the actuator 25 of the second transport unit 20 is disposed within a drive space S2 that is isolated from the processing space S1, which is provided with the first groove 32 and the second groove 30. The drive space S2 is located above the processing space S1. The actuator 25 is mounted on the inner top plate 14a of the chemical module 14, which separates the processing space S1 from the drive space S2. That is, there is an inner top plate 14a between the first groove 32 and the moving head 24 that moves on the track 22 of the actuator 25. This inner top plate 14a prevents foreign matter generated by the moving head 24 moving on the track 22 from falling into the first groove 32.

[0048] Furthermore, in the case of Embodiment 1, the chemical module 14 has an inner top plate portion 14a and an outer top plate portion 14b disposed above the inner top plate portion 14a. The actuator 25 is disposed in the drive space S2 formed between the inner top plate portion 14a and the outer top plate portion 14b.

[0049] As shown in Figure 8, in the case of Embodiment 1, the clamp 26 in the second transport unit 20 is equipped with a pair of grippers 26a, which rotate around a rotation center line C1 extending along the X-axis direction (first direction) of the substrate processing apparatus 10. Each of the grippers 26a is arranged facing each other in the Y-axis direction (second direction) of the substrate processing apparatus 10.

[0050] As shown in Figure 9, the gripper 26a of the clamp 26 is non-circular when viewed in the direction extending from the rotation center line C1 (i.e., when viewed in the X-axis direction (first direction)). In the case of Embodiment 1, it is an elongated ellipse. In the case of Embodiment 1, the rotation center line C1 passes through the center of the gripper 26a when viewed in the first direction. Furthermore, if the gripper 26a can hold a plurality of substrates W, the rotation center line C1 can also be offset from the center of the shape. Moreover, the shape of the gripper 26a is not particularly limited as long as it does not impair the function of the clamp 26; for example, it can be elliptical, rectangular, triangular, etc. Each gripper 26a has a first support surface 26b and a second support surface 26c supporting the outer periphery of the plurality of substrates W.

[0051] As shown in Figure 9, the clamp 26 holds or releases the substrate W by rotating each of the pair of grippers 26a. Specifically, each of the pair of grippers 26a adopts a holding posture (shown by solid lines) where the shortest distance D1 between the grippers 26a is smaller than the dimension w1 of the substrate W in the Y-axis direction (second direction) of the substrate processing apparatus 10, thereby holding the substrate W. Furthermore, each of the grippers 26a adopts a release posture (shown by dashed lines) where the shortest distance D1 is larger than the dimension w1 of the substrate W in the Y-axis direction, thereby releasing the substrate W. That is, when the pair of grippers 26a adopts a release posture, the substrate W can pass between the pair of grippers 26a along the Z-axis direction (third direction) of the substrate processing apparatus 10. In addition, a plurality of grooves (not shown) are formed in the first and second support surfaces 26b and 26c of each of the pair of grippers 26a. These grooves engage with the outer peripheral ends of the plurality of substrates W to maintain the plurality of substrates W at a predetermined interval.

[0052] As shown in Figures 4A to 4C, the clamp 26 is positioned above the first slot 32. By moving the moving head 24 of the actuator 25 in the Y-axis direction (second direction), the clamp 26 passes above the first slot 32 along the Y-axis direction. Therefore, the second transport unit 20 is equipped with an arm 28 connecting the moving head 24 and the clamp 26.

[0053] In the case of Embodiment 1, as shown in Figures 4A to 4C, the moving head 24 is positioned above the clamp 26. Therefore, the arm 28 connecting the moving head 24 and the clamp 26 extends along the height direction (Z-axis direction) of the substrate processing apparatus 10 and supports the clamp 26 at its lower end. In this way, the arm 28 extending along the height direction is more flexible than an arm extending along the X-axis direction (first direction).

[0054] Specifically, if the moving head 24 is not present above the clamp 26, the arm 28 will have at least a portion extending along the X-axis direction (first direction). As a result, the portion of the arm 28 extending along the first direction is prone to significant deflection due to its own weight and the weight of the clamp 26. Especially when the moving head 24 stops, the arm 28 is prone to significant deflection due to the inertia of the clamp 26.

[0055] Furthermore, as shown in Figures 4A to 4C, arm 28 extends at a position offset above the first slot 32. Specifically, as shown in Figure 4B, arm 28 does not extend within the space S3 above the first slot 32 in the processing space S1. As a result, arm 28 does not pass above the first slot 32. This suppresses the possibility of foreign objects attached to arm 28 falling into the first slot 32.

[0056] Furthermore, in the case of Embodiment 1, as shown in FIG4B, the chemical module 14, when viewed in the Y-axis direction (second direction), has a vertical plate 14c that separates the space S3 above the first groove 32 from the arm 28. The vertical plate 14c extends from the inner top plate portion 14a along the Z-axis direction (third direction). By means of the vertical plate 14c, the movement of foreign objects attached to the arm 28 toward the first groove 32 is suppressed.

[0057] Furthermore, in the case of Embodiment 1, the chemical module 14 has a vertical plate 14c and an outer wall portion 14d disposed outside the vertical plate 14c. The arm 28 moves between the vertical plate 14c and the outer wall portion 14d.

[0058] As described above, the clamp 26 of the second transport unit 20 passes over the first groove 32 along the Y-axis direction (second direction). Therefore, the substrate W is delivered from the clamp 26 to the second clamp 34a of the first transport unit 34 (i.e., the supply of the substrate W) above the first groove 32.

[0059] Figure 10 shows the substrate being delivered from the fixture of the second transport section to the second fixture of the first transport section on the other side.

[0060] First, the clamp 26 of the second transport section 20, which receives a plurality of substrates W in the loading module 12, arrives above the first groove 32 of the chemical module 14. Before or after its arrival, a plurality of support rods 34f of the second clamp 34a of the first transport section 34 are arranged below the clamp 26. Next, the second clamp 34a rises, and its plurality of support rods 34f contact the outer peripheral ends of the plurality of substrates W held by the clamp 26. When the plurality of support rods 34f contact the plurality of substrates W, one pair of jaws 26a of the clamp 26 rotates, releasing the plurality of substrates W. In this way, the delivery of the substrates W from the clamp 26 to the second clamp 34a is completed. The second clamp 34a, which receives the substrates W, moves upward in the X-axis direction (first direction) towards the second groove 30, and then moves into the second groove 30. When the second clamp 34a has moved to the second groove 30, the clamp 26 can move along the Y-axis (second direction).

[0061] The delivery of substrate W from the first clamp 36a of the first transport section 36 to clamp 26 (i.e., the recycling of substrate W) also takes place above the first groove 32.

[0062] Figure 11 shows the substrate being delivered from the first fixture of the first transport section to the fixture of the second transport section.

[0063] First, the clamp 26 of the second transport unit 20 reaches above the first groove 32 of the chemical module 14. Then, one pair of grippers 26a of the clamp 26 assumes a release posture, allowing the substrate W to pass through it along the Z-axis (third direction). Next, the first clamp 36a of the first transport unit 36 ​​moves upward from within the first groove 32 while holding a plurality of substrates W. When a portion of the plurality of substrates W passes between the pair of grippers 26a, the pair of grippers 26a rotates and changes from a release posture to a holding posture. This completes the delivery of the substrate W to the pair of grippers 26a. Upon completion of delivery, the first clamp 36a descends and moves into the first groove 32. Once this movement is complete, the clamp 26 can move along the Y-axis (second direction).

[0064] To further clarify, when delivering the substrate W from the first clamp 36a of the first transport unit 36 ​​to the clamp 26, as shown in FIG4A, the arm 36b of the first transport unit 36 ​​and the jaws 26a of the clamp 26 overlap when viewed in the Y-axis direction (second direction). That is, the arm 36b is located between a pair of jaws 26a when viewed from above (viewed in the Z-axis direction). In this state, the clamp 26 cannot move along the Y-axis direction, so the first clamp 36a, after delivering multiple substrates W to the clamp 26, retracts into the first groove 32. Thus, as shown in FIG4B, the clamp 26 is not obstructed by the arm 36b and can move along the Y-axis direction.

[0065] Furthermore, in the case of Embodiment 1, as described above, the clamp 26 of the second transport unit 20 transports the substrate W from the transport module 12 to the second clamp 34a of the first transport unit 34 of the chemical module 14, and transports the substrate W from the first clamp 36a of the first transport unit 36 ​​to the drying module 16. That is, the clamp 26 transports the substrate W in its dried state before processing, and transports the substrate W in the first tank 32 after it has been wetted with the cleaning solution. For this purpose, as shown in FIG9, the pair of grippers 26a of the clamp 26 have a first support surface 26b for supporting the dried substrate W and a second support surface 26c for supporting the wetted substrate W. This prevents the dried substrate W from being supported by the wetted support surface. Furthermore, to prevent the cleaning fluid on the second support surface 26c from transferring to the first support surface 26b, a groove 26d extending in the X-axis direction (first direction) along the rotation center line C1 of the gripper 26a is formed between the first support surface 26b and the second support surface 26c. Additionally, a nozzle (not shown) can be provided on the gripper 26a to suction and recover the cleaning fluid accumulated in the groove 26d.

[0066] The configuration of the substrate processing apparatus 10 has now been explained. Next, the operation of the chemical module 14 of the substrate processing apparatus 10, namely the operation of the first transport units 34, 36 and the second transport unit 20, will be explained.

[0067] Figures 12A to 12J illustrate multiple actions performed by the substrate processing apparatus in one example of substrate processing. Additionally, Figures 12A to 12J show a side view (left) and a front view (right) of the chemical module.

[0068] As shown in Figure 12A, firstly, the second clamp 34a of the first transport unit 34 is positioned above the first groove 32 at a reference height H0 (initial position). Furthermore, the first clamp 36a of the first transport unit 36 ​​is positioned within the first groove 32. In this state, the clamp 26 of the second transport unit 20 transports the plurality of substrates W (preliminary substrates W1) to be processed to a position above the first groove 32 at a higher level than the reference height H0.

[0069] Next, as shown in FIG12B, the second clamp 34a of the first transport unit 34 rises, thereby placing the plurality of substrates W (preliminary substrates W1) held by the first support surface 26b onto the plurality of support rods 34f of the second clamp 34a. At this time, the plurality of support rods 34f contact the outer periphery of the substrates W (preliminary substrates W1) located between the jaws 26a of the clamp 26. When the plurality of substrates W (preliminary substrates W1) are placed on the plurality of support rods 34f of the second clamp 34a, the clamp 26 of the second transport unit 20 releases the plurality of substrates W.

[0070] Next, as shown in FIG12C, the second clamp 34a of the first transport unit 34, which carries a plurality of substrates W (preliminary substrates W1), moves upward toward the second groove 30 along the X-axis direction (first direction), and then descends into the second groove 30. This allows the plurality of substrates W (preliminary substrates W1) to be immersed in the chemical solution in the second groove 30 and processed by the chemical solution. When the descent of the second clamp 34a into the second groove 30 is complete, the second transport unit 20 moves to the loading module 12 to receive the substrate to be processed next (subsequent substrate).

[0071] Next, as shown in FIG12D, when the treatment of the substrate W (preliminary substrate W1) with the solution is completed, the second clamp 34a rises upward toward the second groove 30, and after rising, moves upward toward the first groove 32 along the X-axis direction (first direction). Thus, above the first clamp 36a of the first transport unit 36, a second clamp 34a of the first transport unit 34 is disposed to hold the plurality of substrates W (preliminary substrates W1) after the solution treatment.

[0072] Next, as shown in FIG12E, the first clamp 36a of the first transport unit 36 ​​rises, thereby placing the plurality of substrates W (preliminary substrates W1) which are placed on the plurality of support rods 34f of the second clamp 34a onto the plurality of support rods 36e of the first clamp 36a. Then, when the second clamp 34a descends to the initial position of the reference height H0, the delivery of the substrates W (preliminary substrates W1) from the second clamp 34a to the first clamp 36a is completed.

[0073] Next, as shown in Figure 12F, when the delivery of the substrate W (preliminary substrate W1) from the second clamp 34a to the first clamp 36a is completed, the second clamp 34a moves upward toward the second groove 30. In this way, the first clamp 36a, holding the plurality of substrates W (preliminary substrates W1), can descend into the first groove 32. As the first clamp 36a descends into the first groove 32, the plurality of substrates W (preliminary substrates W1) are immersed in the cleaning solution within the first groove 32 and thus cleaned.

[0074] Next, as shown in Figure 12G, the second clamp 34a moves upward toward the first slot 32. Above the second clamp 34a, a clamp 26 of the second transport section 20 is arranged to hold the plurality of substrates W (subsequent substrates W2 following the preceding substrate W1) newly received by the transport module 12 through the first support surface 26b.

[0075] Next, as shown in Figure 12H, the second clamp 34a rises, and the clamp 26 of the second transport unit 20 places the plurality of substrates W (subsequent substrates W2) held by the first support surface 26b onto the plurality of support rods 34f of the second clamp 34a. When the plurality of substrates W (subsequent substrates W2) are placed on the plurality of support rods 34f of the second clamp 34a, the clamp 26 of the second transport unit 20 releases the plurality of substrates W.

[0076] Next, as shown in FIG12I, the second clamp 34a of the first transport unit 34, which holds a plurality of substrates W (subsequent substrates W2), moves upward toward the second tank 30 along the X-axis direction (first direction), and then descends into the second tank 30 after the movement. Thereby, the plurality of substrates W (subsequent substrates W2) are immersed in the chemical solution in the second tank 30 and treated by the chemical solution. As a result, the chemical module 14 of the substrate processing apparatus 10 will be in the state after the plurality of substrates W (preliminary substrates W1) have been washed in the first tank 32 and the plurality of substrates W (subsequent substrates W2) have been treated with the chemical solution in the second tank 30.

[0077] When the cleaning of the plurality of substrates W (preliminary substrates W1) in the first tank 32 is completed, as shown in FIG12J, the first clamp 36a rises. The clamp 26 of the second transport unit 20 holds the plurality of substrates W (preliminary substrates W1) placed on the plurality of support rods 36e of the raised first clamp 36a through the second support surface 26c. By holding the plurality of substrates W (preliminary substrates W1) wetted by the cleaning liquid through the second support surface 26c, the first support surface 26b will not be wetted. Afterwards, the first clamp 36a retracts into the first tank 32, and the second transport unit 20 transports the substrates W (preliminary substrates W1) to the drying module 16. When the clamp 26 of the second transport unit 20 withdraws from the chemical module 14, the chemical module 14 returns to the state shown in FIG12C. Then, by repeatedly performing the actions shown in FIG12C to FIG12J, the substrate processing apparatus 10 continuously processes the plurality of substrates W.

[0078] Based on the above-described embodiment 1, the increase in the size of the substrate processing apparatus due to the increase in the number of processing slots can be suppressed. Specifically, the first slot and the second slot are arranged in a direction (X-axis direction (first direction)) that intersects the transport direction (Y-axis direction (second direction)) of the substrate W of the second transport section. Therefore, even if the number of processing slots increases, the increase in the size of the main transport direction of the substrate processing apparatus is suppressed.

[0079] Furthermore, in the second transport section, since the clamp that holds the substrate moving along the second direction is supported on the moving body of the actuator positioned above the first groove, the distance between the clamp and the moving body is shorter (compared to, for example, the case where the substrate moves across the second groove to the opposite side of the first groove when viewed from above). Therefore, it is no longer necessary to connect the clamp and the moving body via a long, flexible, and easily vibrating horizontal arm. As a result, the size of the substrate processing apparatus in the first direction is reduced, and the substrate processing apparatus is miniaturized.

[0080] (Implementation Type 2) This embodiment 2 is an improved version of embodiment 1 described above. Therefore, this embodiment 2 will be described with emphasis on the differences from embodiment 1. In addition, constituent elements that are substantially the same as those in embodiment 1 described above will be marked with the same symbols.

[0081] Figure 13 is a side view of the chemical module in the substrate processing apparatus of Embodiment 2.

[0082] As shown in Figure 13, the chemical module 114 in the substrate processing apparatus of Embodiment 2 is different from the chemical module 14 in the substrate processing apparatus 10 of Embodiment 1, and does not have a first transport unit 36. Therefore, the substrate W is immersed in the first tank 32 by the first transport unit 34. That is, the first transport unit 34 receives the substrate W from the clamp 26 of the second transport unit 20 and immerses the received substrate W in the second tank 30. Then, the first transport unit 34 transports the substrate W from the second tank 30 to the first tank 32. After that, the first transport unit 34 delivers the substrate W, which has been processed in the first tank 32, to the clamp 26 of the second transport unit 20.

[0083] In the case of this embodiment 2, as shown in FIG13, since there is no first transport part 36 in front of the first groove 32, the size of the chemical module 14 in the X-axis direction (first direction) can be smaller than that of the chemical module 14 in the above embodiment 1.

[0084] Based on the above embodiment 2, similarly to the above embodiment 1, the increase in the size of the substrate processing apparatus due to the increase in the number of processing tanks can be suppressed.

[0085] (Implementation Type 3) The difference between this embodiment 3 and embodiment 1 described above lies in the fixture of the second transport unit. Therefore, this embodiment 3 will be described with emphasis on the differences from embodiment 1. In addition, constituent elements that are substantially the same as those in embodiment 1 described above will be marked with the same symbols.

[0086] Figure 14 is a side view of the chemical module in the substrate processing apparatus of Embodiment 3. Figure 15 is a perspective view of the second transport unit that holds the substrate in the substrate processing apparatus of Embodiment 3. Furthermore, Figure 16 is a perspective view showing the fixture in the second transport unit.

[0087] As shown in Figures 14 to 16, the clamp 226 of the second transport unit 220 is composed of two rotating shafts 226a, two support bars 226b, and a plurality of connecting rods 226c. The two rotating shafts 226a extend rearward along the X-axis direction (first direction) of the substrate processing device (chemical module 214) and extend parallel to each other. The two support bars 226b extend along the X-axis direction and are used to support a plurality of substrates W. The plurality of connecting rods 226c connect the rotating shafts 226a and the support bars 226b. Specifically, each support bar 226b is suspended and supported on its corresponding rotating shaft 226a by two connecting rods 226c. Furthermore, each rotating shaft 226a rotates around a rotation centerline C2 extending along the Y-direction (second direction) by a motor (not shown) in a manner that changes the distance D2 between the two support bars 226b. By changing the distance D2, the clamp 226 can hold or release the substrate W. In addition, a plurality of grooves (not shown) are formed in the support bar 226b, which engage with the outer peripheral ends of each of the plurality of substrates W to maintain the plurality of substrates W at a predetermined interval.

[0088] Based on the above embodiment 3, similarly to the above embodiment 1, the increase in the size of the substrate processing apparatus due to the increase in the number of processing tanks can be suppressed.

[0089] In addition, the second transport unit 220 of this embodiment 3 can be replaced by the second transport unit 20 of the chemical module 114 of the above embodiment 2.

[0090] Furthermore, the first transport unit can be modified to correspond to the second transport unit 220 of this embodiment 3.

[0091] Figure 17 is a perspective view of a plurality of first transport units in a modified embodiment 3.

[0092] As shown in Figure 17, the first transport unit 236 of the modified embodiment 3 is different from the first transport unit 36 ​​of the above embodiment 1.

[0093] Specifically, in this variation of Embodiment 3, the first clamp 36a of the first transport unit 236 is substantially the same as the first clamp 36a of Embodiment 1. However, the positions of the arm 236b supporting the first clamp 36a of the first transport unit 236 and the actuator 236c that raises and lowers the arm 236b are different. In this variation of Embodiment 3, the arm 236b and actuator 236c are arranged relative to the first groove 32 on one side of the substrate processing apparatus in the Y-axis direction (second direction), similar to the arm 34b and actuator 34c of the first transport unit 34, rather than in front of the first groove 32. As a result, the size of the substrate processing apparatus in the X-axis direction (first direction) is reduced, allowing for miniaturization of the substrate processing apparatus.

[0094] (Implementation Type 4) The difference between Embodiment 4 and Embodiment 1 described above is that there is only one first transport unit and the clamp for the second transport unit is different. Therefore, Embodiment 4 will be described with emphasis on the differences from Embodiment 1. In addition, the same symbols are used to denote the constituent elements that are substantially the same as those in Embodiment 1 described above.

[0095] Figure 18 is a side view of the chemical module in the substrate processing apparatus of Embodiment 4. Figure 19 is a perspective view of the second transport unit that holds the substrate in the substrate processing apparatus of Embodiment 4. Furthermore, Figure 20 is a perspective view showing the fixture in the second transport unit.

[0096] As shown in Figures 18 to 20, the clamp 326 of the second transport unit 320 has a plurality of support rods 326a. These support rods 326a extend rearward along the X-axis direction (first direction) of the substrate processing apparatus (chemical module 314) and extend in a parallel manner to each other, and are used to hold a plurality of substrates W. In addition, a plurality of grooves (not shown) are formed in the support rods 326a. These grooves engage with the outer peripheral ends of each of the plurality of substrates W to maintain the plurality of substrates W at a predetermined interval.

[0097] When such a fixture 326 is used, the first transport section 36 of Embodiment 1 described above cannot be used. Because the fixture 326 and the first transport section 36 interfere with each other, the substrate W cannot be delivered from the first transport section 36 to the fixture 326. Therefore, in the case of this Embodiment 4, similar to Embodiment 2 described above, the substrate W is delivered to the fixture 326 by the first transport section 34.

[0098] Based on the above embodiment 4, similarly to the above embodiment 1, the increase in the size of the substrate processing apparatus due to the increase in the number of processing tanks can be suppressed.

[0099] (Implementation Type 5) In the case of Embodiment 1, as shown in Figures 4A to 4C, the actuator 25 of the second transport unit 20 is disposed above the first slot 32. In Embodiment 5, the actuator of the second transport unit is disposed in a different location. Therefore, Embodiment 5 will be described with emphasis on the differences from Embodiment 1. In addition, components that are substantially the same as those in Embodiment 1 are marked with the same symbols.

[0100] Figure 21 is a side view of the chemical module in the substrate processing apparatus of Embodiment 5.

[0101] As shown in Figure 21, in the substrate processing apparatus of Embodiment 5, the actuator 425 of the second transport unit 420 is disposed in the chemical module 414 on the side of the first slot 32 in the X-axis direction (first direction). Furthermore, the actuator 425 is disposed below the first slot 32. The moving head 426 of the actuator 425 and the clamp 26 are connected by an arm 428 extending in the Z-axis direction (third direction). Moreover, the actuator 425 is isolated from the processing space S1, which contains the first slot 32 and the second slot 30, and is disposed in a drive space S2 located below the processing space S1.

[0102] In the case of this embodiment 5, compared with the above embodiment 1 in which the moving head 24 of the actuator 25 of the second transport section 20 moves above the first groove 32, the size of the substrate processing device (chemical module 414) in the Z-axis direction (height direction) can be made smaller.

[0103] Based on the above embodiment 5, similarly to the above embodiment 1, the increase in the size of the substrate processing apparatus due to the increase in the number of processing tanks can be suppressed.

[0104] The foregoing has listed several embodiments illustrating the implementation of the present invention. However, the implementation of the present invention is not limited thereto.

[0105] For example, in the case of Embodiment 1 described above, the second tank 30 located behind the substrate processing apparatus 10 is a medicine tank, and the first tank 32 located in front of the substrate processing apparatus 10 is a cleaning tank. However, the embodiments of the present invention are not limited to this. For example, the second tank 30 may also be used as a cleaning tank, and the first tank 32 may be used as a medicine tank. In this case, since the second clamp 34a and the first clamp 36a of Embodiment 1 described above are configured to deliver substrates W to each other, a plurality of substrates W are delivered from the first clamp 36a of the first transport section 36 to the second clamp 34a of the first transport section 34.

[0106] That is, in a broad sense, the substrate processing module of one embodiment of the present invention is a substrate processing module for processing substrates. The substrate processing module has: a first groove and a second groove arranged along a first direction and for placing substrates; a first transport unit for moving the substrates to the first grooves and the second grooves; and a second transport unit for transporting the substrates along a second direction intersecting the first direction and delivering the substrates to the first transport unit; the second transport unit includes a clamp holding the substrates above the first grooves and an actuator for moving the clamps along the second direction; the actuator of the second transport unit is disposed in the substrate processing module on the side of the first grooves along the first direction.

[0107] Furthermore, another embodiment of the substrate processing apparatus of the present invention includes: the aforementioned substrate processing module; and another module connected to the aforementioned substrate processing module along the aforementioned second direction.

[0108] In summary, the above-described embodiments have been presented as examples of the technology of this invention. To this end, drawings and detailed descriptions have been provided. Therefore, the constituent elements described in the drawings and detailed descriptions include not only those necessary to solve the problem, but also those not essential to solving the problem, which may be included for the purpose of illustrating the above-described technology. Therefore, one should not directly assume that such non-essential constituent elements are essential simply because they are described in the drawings or detailed descriptions.

[0109] Furthermore, the above embodiments are used to illustrate the technology in this invention, and various changes, substitutions, additions, omissions, etc., can be made within the scope of the patent application or its equivalent. [Potential for Industrial Applications]

[0110] This invention can be applied to a substrate processing apparatus that processes substrates using a plurality of slots.

[0111] 10: Substrate processing apparatus 12: Moving in the module 14, 114, 214, 314, 414: Substrate processing module (chemical module) 14a: Inner top plate section 14b: Outer top plate portion 14c: Vertical plate 14d: Lateral wall portion 16: Drying Module 18: Move out the module 20,220,420: Second Transport Department 22: Track 24,426: Moving head 25, 34c, 34d, 36c, 236c, 425: Actuators 26,226,326: Fixtures 26a: Gripper 26b: First support surface 26c: Second support surface 28,34b,36b,236b,428: Arm 30: Second slot 32: First slot 34, 36, 236: First Transport Department 34a: Second clamp 34e, 36d: Body section 34f, 36e, 326a: Support rod 36a: First clamp 226a: Rotation shaft 226b: Support bar 226c: Linkage 320: Second Transport Department C1, C2: Center lines of rotation D1: Shortest distance D2: Distance H0: Reference height S1: Processing Space S2: Drive Space S3: Space W: substrate w1: Size W1: advance substrate W2: Subsequent substrate

Claims

1. A substrate processing module for processing substrates, the substrate processing module comprising: a first groove and a second groove arranged in a front-rear direction, i.e., a first direction, and for arranging substrates; a first transport unit for transporting the substrates to the first groove and the second groove; and a second transport unit for transporting the substrates in a second direction intersecting the first direction, and delivering the substrates to the first transport unit; wherein the first groove is located on the front side and the second groove is located on the rear side in the substrate processing module, the second transport unit comprising a clamp holding the substrates above the first groove and an actuator for moving the clamp in the second direction; the actuator of the second transport unit comprising: a movable body supporting the clamp and moving in the second direction, the actuator of the second transport unit being disposed in the substrate processing module on the side of the first groove in the first direction such that the movable body overlaps with the first groove when viewed from above.

2. The substrate processing module as described in claim 1, wherein, The aforementioned actuator of the second transport unit is disposed in a drive space isolated from the processing space in which the first slot and the second slot are disposed.

3. The substrate processing module as described in claim 2, wherein, A top plate is provided above the aforementioned processing space, and the aforementioned driving space is located above the aforementioned top plate.

4. The substrate processing module as described in any one of claims 1 to 3, wherein, The aforementioned second transport unit has an arm that extends in the height direction to connect the aforementioned movable body of the aforementioned actuator to the aforementioned clamp, and the aforementioned arm is located further forward than the aforementioned first groove.

5. The substrate processing module as described in claim 4, having a vertical plate separating the space above the aforementioned first groove from the aforementioned arm.

6. The substrate processing module as described in any one of claims 1 to 3, wherein, The aforementioned first transport unit has two parts. One part of the first transport unit is equipped with a first clamp to keep the aforementioned substrate in a state that can be moved into the aforementioned first groove. The other part of the first transport unit is equipped with a second clamp to keep the aforementioned substrate in a state that can be moved into the aforementioned second groove and can be moved above the aforementioned first groove. The aforementioned first clamp and the aforementioned second clamp are configured to deliver the aforementioned substrate between the two.

7. The substrate processing module as described in any one of claims 1 to 3, wherein, The aforementioned first tank is a washing tank, and the aforementioned second tank is a medicine solution tank.

8. A substrate processing apparatus comprising: a substrate processing module as described in claim 1; and another module connected to the substrate processing module along the aforementioned second direction.

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