Resin composition, light-shielding film, manufacturing method of light-shielding film, substrate with partition wall, and display device.

Abstract

This invention provides a relatively inexpensive resin composition that can form a gray partition wall with both high reflectivity and high light-blocking properties, even under low-temperature heating conditions of around 100°C to 120°C. The resin composition comprises a resin, a photosensitizer, a white pigment, a yellow precursor compound, and a light-blocking pigment, characterized in that the light-blocking pigment contains both blue and purple pigments.

Description

Technical Field

[0001] The present invention relates to a resin composition, a light-shielding film formed from the resin composition, a method for manufacturing the light-shielding film, a substrate with partitions having patterned partitions, and a display device. Prior Technology

[0002] In recent years, as a color display device with improved light utilization efficiency, color display devices have been proposed that include a wavelength conversion unit comprising a phosphor for wavelength conversion, a polarization separation mechanism, and a polarization conversion mechanism (see, for example, Patent Document 1). For example, a color display device has been proposed that includes: a blue light source, a liquid crystal element, and a wavelength conversion unit, wherein the wavelength conversion unit has a phosphor that emits red fluorescence when excited by blue light, a phosphor that emits green fluorescence when excited by blue light, and a light scattering layer that scatters blue light (see, for example, Patent Document 2). However, color filters containing color-changing phosphors as described in Patent Documents 1 and 2 produce fluorescence in all directions, resulting in low light extraction efficiency and insufficient brightness. In particular, in high-resolution display devices known as 4K and 8K, the pixel size becomes smaller, making brightness a significant issue and thus requiring higher brightness. [Existing technical documents] [Patent Literature]

[0003] Patent Document 1: Japanese Patent Application Publication No. 2000-131683 Patent Document 2: Japanese Patent Application Publication No. 2009-244383 Patent Document 3: Japanese Patent Application Publication No. 2000-347394 Patent Document 4: Japanese Patent Application Publication No. 2006-259421 Patent Document 5: International Publication No. 2020 / 008969 Patent Document 6: International Publication No. 2021 / 200357 Summary of the Invention

[0004] [The problem that the invention aims to solve] Generally, to improve the brightness of such a display device, it is effective to increase the reflectivity of the partition separating the color-changing phosphors. Furthermore, to prevent color mixing between adjacent pixels, the light-shielding properties of the partition need to be improved. Based on the above, a partition material that combines high reflectivity and light-shielding properties is required.

[0005] To create a partition that combines high reflectivity and high light-blocking properties, the inventors first investigated a method using a material made by adding black pigment to a white partition material containing titanium dioxide white pigment, which exhibits high reflectivity. However, in this method, the exposure light is entirely absorbed by the white and black pigments, preventing the exposure light from reaching the bottom of the film, thus highlighting the problem of poor pattern processability.

[0006] Therefore, the inventors designed a method to increase the light-blocking properties of the film by heating it at a temperature between 120°C and 250°C using exposure light during the pattern exposure step after film formation. This design was achieved by using a resin composition containing: resin; an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium; a photopolymerization initiator or a quinone diazide compound; and a solvent (see Patent Document 5). In particular, it was found that when using an organopalladium compound, the film efficiently blackens upon heating due to the formation of palladium oxide particles, increasing the light-blocking properties of visible light. Furthermore, it was found that when using an organopalsilium compound, the film yellows upon heating due to the formation of silver nanoparticles, increasing the light-blocking properties of blue light.

[0007] Furthermore, the inventors discovered that by using a resin composition containing resin, photopolymerization initiator or quinone diazide compound, white pigment and / or opaque pigment, organic silver compound and reducing agent, the reducing agent promotes the generation of silver nanoparticles, and even under low-temperature heating conditions of around 100°C to 120°C, it is possible to form a partition with excellent weather resistance and both high opacity for blue light and high overall reflectivity for visible light (see Patent Document 6).

[0008] However, this technology has the following drawbacks: while the generation of yellow silver nanoparticles improves the opacity for blue light, it does not improve the opacity for green to red light (wavelength region 500 nm to 630 nm). Furthermore, the previously described technique using organopalladium compounds suffers from the high cost of these compounds and the inability to generate palladium oxide particles at low heating temperatures of around 100°C to 120°C, thus failing to improve opacity.

[0009] Therefore, the object of the present invention is to provide, relatively inexpensively, a resin composition that can form a gray partition wall with both high reflectivity and high light-blocking properties for visible light even under low-temperature heating conditions of around 100°C to 120°C. [Methods for solving problems]

[0010] Through diligent research, the inventors of this application discovered that a gray partition wall with both high reflectivity and high light-blocking properties can be formed, thus achieving the present invention.

[0011] That is, the invention of this application is as described below. (1) A resin composition comprising a resin, a photosensitizer, a white pigment, a yellow precursor compound and a light-shielding pigment, wherein the light-shielding pigment comprises a blue pigment and a purple pigment. (2) The resin composition as described in (1), wherein the white pigment is treated with at least one selected from the group consisting of SiO2 and Al2O3 and ZrO2. (3) The resin composition as described in (1), wherein the white pigment is treated with ZrO2, Al2O3 and SiO2. (4) The resin composition as described in (1), wherein the weight ratio of the blue pigment to the purple pigment is 20 / 80 to 80 / 20. (5) A resin composition comprising a photosensitizer, a white pigment, and a yellow precursor compound, wherein the white pigment is treated by at least one selected from the group consisting of SiO2 and Al2O3 and ZrO2. (6) The resin composition as described in (5), wherein the white pigment is treated with ZrO2, Al2O3 and SiO2. (7) The resin composition as described in (5) further contains light-shielding pigments. (8) The resin composition as described in (1) or (5), wherein the yellow precursor compound is an organosilver compound. (9) The resin composition as described in (1) or (5) contains a reducing agent. (10) The resin composition as described in (1) or (5) contains phosphate polyester. (11) A light-shielding film is formed by hardening a resin composition as described in (1) or (5). (12) A method for manufacturing a light-shielding film, comprising: a film-forming step, coating a resin composition as described in (1) or (5) onto a substrate and drying it to obtain a dried film; an exposure step, subjecting the obtained dried film to pattern exposure; a development step, dissolving and removing the portion of the exposed dried film that is soluble in the developer; and a heating step, hardening the developed dried film by heating it, wherein in the heating step, the developed dried film is heated at a temperature of 100°C or higher and 250°C or lower, such that the b* value of each 10 μm film thickness measured by specular component included (SCI) increases by 10 or more. (13) A substrate with partitions having (A-1) patterned partitions on a substrate by means of a resin composition as described in (1) or (5), wherein the substrate with partitions has a reflectance of 20% to 50% per 10 μm thickness in the wavelength region of 430 nm to 630 nm, and an optical density (OD) value of 1.5 to 3.0 per 10 μm thickness in the wavelength region of 430 nm to 630 nm. (14) A substrate with partitions having (A-1) patterned partitions on a substrate by means of a resin composition as described in (1) or (5), wherein the substrate with partitions has an L* value of 50 to 70, an a* value of -5.0 to 5.0, and a b* value of -5.0 to 5.0 per 10 μm film thickness as determined by SCI method. (15) A substrate with partitions having (A-1) patterned partitions on a base substrate, wherein the patterned partitions contain resin, white pigment, blue pigment and purple pigment, silver oxide and / or silver particles. (16) The substrate with partitions as described in (13) has (A-1) patterned partitions on a base substrate, wherein the patterned partitions contain resin, white pigment, blue pigment and purple pigment, silver oxide and / or silver particles. (17) The substrate with partitions as described in (14) has (A-1) patterned partitions on a base substrate, wherein the patterned partitions contain resin, white pigment, blue pigment and purple pigment, silver oxide and / or silver particles. (18) The substrate with partitions as described in (13) further has a (B) pixel layer containing color-changing light-emitting material arranged by the partitions formed by the pattern of (A-1). (19) The partitioned substrate as described in (18), wherein a color filter with a thickness of 1 μm to 5 μm is further provided between the substrate and the pixel layer containing color-changing luminescent material in (B). (20) A display device comprising: a substrate with partitions as described in (13); and a light source selected from liquid crystal cells, organic electroluminescent cells, mini light-emitting diode cells and micro light-emitting diode cells. [The effects of the invention]

[0012] The resin composition of the present invention contains resin, photosensitizer, white pigment, yellow precursor compound, blue pigment and purple pigment. When the pattern exposure step is performed after film formation, exposure light is transmitted. If the exposed film is heated at a temperature of 100°C or higher and 250°C or lower, yellow particles are generated in the film, which can form a fine thick film gray partition pattern with high reflectivity and high light-blocking properties for visible light. Simple Explanation of the Diagram

[0013] Figure 1 is a cross-sectional view showing a sample of the partitioned substrate of the present invention having patterned partitions. Figure 2 is a cross-sectional view of a substrate of the present invention having patterned partitions and pixels containing color-changing luminescent material. Figure 3 is a cross-sectional view of a substrate of the present invention having patterned partitions, a color-changing luminescent material, and a light-shielding partition. Figure 4 is a cross-sectional view of a substrate with partitions according to the present invention, having patterned partitions, a color-changing luminescent material, and a color filter. Figure 5 is a cross-sectional view of a substrate with partitions according to the present invention, having patterned partitions, a color-changing luminescent material, a light-shielding partition, and a color filter. Figure 6 is a cross-sectional view of a substrate with partitions according to the present invention having pixels containing patterned partitions and light-emitting light sources selected from organic EL units, mini LED units, and micro LED units. Figure 7 is a cross-sectional view of a substrate with partitions according to the present invention having pixels containing patterned partitions, color-changing light-emitting materials, and light-emitting light sources selected from organic EL units, mini LED units, and micro LED units. Figure 8 is a cross-sectional view showing the structure of the display device used for color mixing evaluation in the embodiment. Implementation

[0014] The following describes in detail the preferred embodiments of the resin composition of the present invention, the light-shielding film formed from the resin composition, the method for manufacturing the light-shielding film, and the substrate with partitions. However, the present invention is not limited to the following embodiments and can be implemented with various modifications depending on the purpose or use.

[0015] The resin composition of the present invention is preferably used as a material for forming partitions separating color-changing phosphors or light sources selected from organic EL units, mini LED units, micro LED units, etc. The resin composition of the present invention is a resin composition containing resin, photosensitizer, white pigment, yellow precursor compound, and light-shielding pigment, and the light-shielding pigment is a resin composition containing blue and purple pigments.

[0016] Furthermore, the resin composition of the present invention is a resin composition containing a photosensitizer, a white pigment, and a yellow precursor compound, and the white pigment is a resin composition treated with at least one selected from the group consisting of SiO2 and Al2O3 and ZrO2. Preferably, the resin composition further contains a light-shielding pigment.

[0017] resin The resin has the function of improving the crack resistance and lightfastness of the partition wall. From the viewpoint of improving the crack resistance of the partition wall during heat treatment, the resin content in the solid component of the resin composition is preferably 10% by weight or more, more preferably 20% by weight or more. On the other hand, from the viewpoint of improving lightfastness, the resin content in the solid component of the resin composition is preferably 60% by weight or less, more preferably 50% by weight or less. Here, the term "solid component" refers to all components contained in the resin composition after removing volatile components such as solvents. The amount of solid component can be determined by measuring the remaining component after heating the resin composition to evaporate the volatile components. Examples of resins include polysiloxanes, polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, and (meth)acrylic acid polymers. Here, (meth)acrylic acid polymers refer to polymers of methacrylates and / or acrylates. Two or more of these compounds may also be contained. Among these, polysiloxanes are preferred in terms of excellent heat resistance and lightfastness.

[0018] Polysiloxanes are hydrolyzed and dehydrated condensates of organosilicones. When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably contains at least the repeating unit represented by the following general formula (1). It may also contain other repeating units. By containing repeating units derived from difunctional alkoxysilane compounds represented by general formula (1), excessive thermal polymerization (condensation) of the polysiloxane caused by heating can be suppressed, and the crack resistance of the partition wall can be improved. Of all the repeating units in the polysiloxane, it is preferable to contain 10 mol% to 80 mol% of the repeating units represented by general formula (1). By containing more than 10 mol% of the repeating units represented by general formula (1), crack resistance can be further improved. The content of the repeating units represented by general formula (1) is more preferably 12.5 mol% or more, and even more preferably 15 mol% or more. On the other hand, by using repeating units represented by general formula (1) containing 80 mol% or less, the molecular weight of polysiloxane can be sufficiently increased during polymerization, thereby improving coatability. The content of repeating units represented by general formula (1) is preferably 70 mol% or less.

[0019] [Chemistry 1]

[0020] In the general formula (1), R1 and R2 may be the same or different, representing a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization, R1 and R2 are preferably selected from alkyl groups having 1 to 6 carbon atoms and aryl groups having 6 to 12 carbon atoms. At least a portion of the hydrogen atoms in the alkyl and aryl groups may be replaced by a free radical polymerizable group. In this case, the free radical polymerizable group can undergo free radical polymerization in the cured form of the negative photosensitive resin composition.

[0021] The polysiloxane preferably contains repeating units represented by the following general formula (2). By containing repeating units derived from trifunctional alkoxysilane compounds represented by general formula (2), the crosslinking density of the polysiloxane increases after film formation, thereby improving the hardness and chemical resistance of the film. Of all the repeating units in the polysiloxane, it is preferable to contain 10 mol% to 80 mol% of repeating units represented by general formula (2). The content of repeating units represented by general formula (2) is more preferably 15 mol% or more, and more preferably 20 mol% or more. On the other hand, by containing less than 80 mol% of repeating units represented by general formula (2), excessive thermal polymerization (condensation) of the polysiloxane caused by heating can be suppressed, thereby improving the crack resistance of the partition wall. The content of repeating units represented by general formula (2) is more preferably 70 mol% or less.

[0022] [Chemistry 2]

[0023] In the general formula (2), R3 represents a monovalent organic group having 1 to 20 carbon atoms. The polysiloxane may contain two or more repeating units represented by general formula (2) with different R3 values. From the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization, R3 is preferably a group containing alkyl groups having 1 to 6 carbon atoms and aryl groups having 6 to 12 carbon atoms. At least a portion of the hydrogen atoms of the alkyl and aryl groups may be replaced by a free radical polymerizable group. In this case, the free radical polymerizable group can undergo free radical polymerization in the cured form of the negative photosensitive resin composition.

[0024] The repeating units represented by general formulas (1) and (2) are derived from alkoxysilane compounds represented by general formulas (3) and (4) respectively. That is, polysiloxanes containing repeating units represented by general formulas (1) and (2) can be obtained by hydrolysis and polycondensation of alkoxysilane compounds containing alkoxysilane compounds represented by general formulas (3) and (4). Other alkoxysilane compounds may also be used. Furthermore, in general formulas (3) and (4), the notation "-(OR 4) 2" and "-(OR 4) 3" indicates that there are two and three "-(OR 4)" bonds respectively on the Si atom.

[0025] [Chemistry 3]

[0026] In general formula (3), R1 to R2 represent the same groups as R1 to R2 in general formula (1). In general formula (4), R3 represents the same group as R3 in general formula (2). In general formulas (3) and (4), R4 may be the same or different, representing a monovalent organic group or hydrogen with 1 to 20 carbon atoms, preferably an alkyl group with 1 to 6 carbon atoms.

[0027] Examples of alkoxysilane compounds represented by general formula (3) include: dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, diphenylsilanediol, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacrylpropylmethyldimethoxysilane, γ-methacrylpropylmethyldiethoxysilane, γ-acrylpropylmethyldimethoxysilane, γ-acrylpropylmethyldimethoxysilane, γ-acrylpropylmethyldiethoxysilane, 3-glycidoxypropylmethyl Dimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3-dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic anhydride, etc. Two or more of these compounds may also be used.

[0028] Examples of alkoxysilane compounds represented by general formula (4) include: methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane. 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane Silane, Tolyltrimethoxysilane, Tolyltriethoxysilane, Styreltrimethoxysilane, Styreltriethoxysilane, Vinyltrimethoxysilane, Vinyltriethoxysilane, Allyltrimethoxysilane, Allyltriethoxysilane, γ-Acrylpropyltrimethoxysilane, γ-Acrylpropyltriethoxysilane, γ-Methacrylpropyltrimethoxysilane, γ-Methacrylpropyltriethoxysilane, 3-Trimethoxysilylpropionic acid, 3-Triethoxysilylpropionic acid, 4 - Trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-trimethoxysilylpropylphthalic anhydride, 3-triethoxysilylpropylphthalic anhydride, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, etc. Two or more of these compounds may also be used.

[0029] When the resin composition of the present invention has negative photosensitivity, the alkoxysilane compound represented by general formula (3) and / or general formula (4) is preferably an alkoxysilane compound containing at least one free radical polymerizable group. By containing an alkoxysilane compound containing a free radical polymerizable group, the cross-linking reaction can be carried out using free radicals generated in the exposed portion, thereby improving the curing degree of the exposed portion. In addition, when the resin composition of the present invention has negative photosensitivity, the alkoxysilane compound represented by general formula (3) and / or general formula (4) is preferably an alkoxysilane compound containing at least one carboxyl group. By containing an alkoxysilane compound containing a carboxyl group, the solubility of the unexposed portion is improved, thereby improving the resolution during pattern processing.

[0030] Furthermore, other alkoxysilane compounds may also be included as raw materials for polysiloxanes. Examples of other alkoxysilane compounds include tetramethoxysilane, tetraethoxysilane, silicate 51 (tetramethoxysilane oligomer), and other tetrafunctional alkoxysilane compounds. Two or more of these compounds may also be used.

[0031] From the viewpoint that the content of the repeating units represented by general formula (1) in all repeating units of the polysiloxane is within the aforementioned range, the content of the alkoxysilane compound represented by general formula (3) in the alkoxysilane compound used as a raw material for the polysiloxane is preferably 10 mol% or more, more preferably 12.5 mol% or more, and even more preferably 15 mol% or more. On the other hand, from the same viewpoint, the content of the alkoxysilane compound represented by general formula (4) is preferably 80 mol% or less, more preferably 70 mol% or less.

[0032] The polysiloxane in the resin composition of the present invention preferably has a styrene group. By having a styrene group, curing can be sufficiently promoted even under low-temperature curing conditions of 85°C to 120°C.

[0033] From the viewpoint of coatability, the weight-average molecular weight (Mw) of the polysiloxane is preferably 1,000 or more, and more preferably 2,000 or more. On the other hand, from the viewpoint of developability, the Mw of the polysiloxane is preferably 500,000 or less, and more preferably 300,000 or less. Here, the Mw of the polysiloxane in this invention refers to the polystyrene equivalent value determined using gel permeation chromatography (GPC). The determination method is as described in the examples described later.

[0034] Polysiloxanes can be obtained by hydrolyzing the organosilane compound and then subjecting the hydrolysate to a dehydration condensation reaction in the presence or absence of a solvent.

[0035] Photosensitive agent When used for patterning the partitions (A-1) described later, the resin composition of the present invention preferably has negative or positive photosensitivity. To impart photosensitivity, the resin composition of the present invention preferably contains a photosensitizer. When imparting negative photosensitivity, it is preferable to contain a photopolymerization initiator as a photosensitizer, which allows for the formation of partitions with highly fine patterned shapes. The negative photosensitivity resin composition preferably further contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable to contain a quinone diazide compound as a photosensitizer.

[0036] Photopolymerization initiators can be any type of photopolymerization initiator, as long as they decompose and / or react to generate free radicals through irradiation with light (including ultraviolet light and electron beams). Examples include: α-aminophenyl ketone compounds such as 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholino-4-yl-phenyl)-butane-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; and 2,4,6-trimethylbenzoic acid. Phosphine oxides such as phenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)-phosphine oxide; 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl) oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyl oxime)], 1 Oxime esters such as phenyl-1,2-butanone-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, and acetone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyloxime); α-hydroxy ketones such as 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)one, and 1-hydroxycyclohexyl-phenyl ketone; and acetophenone compounds such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-tertiary butyldichloroacetophenone, benzenemethylacetophenone, and 4-azidobenzenemethylacetophenone. It may also contain two or more of these compounds.

[0037] From the viewpoint of effectively performing free radical curing, the content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, and more preferably 1% by weight or more in the solid components. On the other hand, from the viewpoint of suppressing the dissolution of residual photopolymerization initiator, the content of the photopolymerization initiator in the solid components is preferably 20% by weight or less, and more preferably 10% by weight or less.

[0038] The photopolymerizable compound in this invention refers to a compound having two or more vinyl unsaturated double bonds in its molecule. Considering the ease of free radical polymerization, the photopolymerizable compound is preferably one having (meth)acrylate groups.

[0039] Examples of photopolymerizable compounds include: pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, and dipentaerythritol hexaacrylate. Two or more of these compounds may also be present.

[0040] From the viewpoint of effectively carrying out free radical curing, the content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more in the solid component. On the other hand, from the viewpoint of suppressing excessive free radical reaction and improving resolution, the content of the photopolymerizable compound is preferably 50% by weight or less in the solid component.

[0041] As a quinone diazide compound, it is preferably a compound in which the sulfonic acid of naphthoquinone diazide is bonded to a compound having a phenolic hydroxyl group via an ester. Examples of compounds having a phenolic hydroxyl group used herein include: Bis-Z, TekP-4HBPA (tetra-P-DO-BPA), TrisP-HAP, TrisP-PA, BisRS-2P, BisRS-3P (trade names, manufactured by Honshu Chemical Industry Co., Ltd.); BIR-PC, BIR-PTBP, BIR-BIPC-F (trade names, manufactured by Asahi Organic Materials Co., Ltd.); 4,4'-sulfadiphenol, BPFL (trade name, manufactured by JFE Chemical Co., Ltd.), etc. As quinone diazide compounds, it is preferable to introduce 4-naphthoquinone diazidesulfonic acid or 5-naphthoquinone diazidesulfonic acid into these compounds having phenolic hydroxyl groups via ester bonds, such as THP-17, TDF-517 (trade name, manufactured by Toyo Gosei Kogyo Co., Ltd.), SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.), etc.

[0042] From the viewpoint of improving sensitivity, the content of the quinone diazide compound in the resin composition of the present invention is preferably 0.5% by weight or more, more preferably 1% by weight or more in the solid component. On the other hand, from the viewpoint of improving resolution, the content of the quinone diazide compound in the solid component is preferably 25% by weight or less, more preferably 20% by weight or less.

[0043] White pigment The resin composition of the present invention preferably contains more white pigment. The white pigment has the function of further improving the reflectivity of the partition.

[0044] Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds thereof. Two or more of these compounds may also be included. Among these, titanium dioxide, which has high reflectivity and is readily available for industrial use, is preferred.

[0045] Titanium dioxide has three crystal structures: anatase, rutile, and brookite. Among these, rutile titanium dioxide is preferred in terms of its low photocatalytic activity.

[0046] Surface treatment can also be applied to the white pigment. Preferably, surface treatment is performed using a metal selected from Al, Si, and Zr, which can improve the lightfastness and heat resistance of the formed partitions. More preferably, the white pigment is treated with at least one selected from the group consisting of SiO2 and Al2O3 and ZrO2, and even more preferably, the white pigment is surface treated with ZrO2, Al2O3, and SiO2. From the viewpoint of lightfastness and reflectivity, the white pigment is further preferably titanium dioxide surface-treated with ZrO2, Al2O3, and SiO2.

[0047] From the viewpoint of further improving the reflectivity of the partition, the particle size D50 of the white pigment, which is based on the scattering light, is preferably 100 nm to 500 nm, and more preferably 150 nm to 350 nm. Here, the particle size D50 of the white pigment can be measured using a particle size distribution measuring device (SZ-100; manufactured by Horiba Corporation).

[0048] Furthermore, from the viewpoint of further improving the reflectivity of the partition, the average primary particle size of the white pigment is preferably 100 nm to 500 nm, and more preferably 150 nm to 350 nm. Here, the average primary particle size of the white pigment can be measured by laser diffraction using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman-Coulter, Inc.).

[0049] Examples of titanium dioxide pigments that are well-suited for use as white pigments include: R960, manufactured by DuPont (rutile type, SiO2 / Al2O3 treated, average primary particle size 210 nm); R996, manufactured by Lomon Billions (rutile type, ZrO2 / Al2O3 treated, average primary particle size 230 nm); CR-97, manufactured by Ishihara Sangyo (rutile type, Al2O3 / ZrO2 treated, average primary particle size 250 nm); PFC105, manufactured by Ishihara Sangyo (rutile type, SiO2 / Al2O3 / ZrO2 treated, average primary particle size 280 nm); JR-301, manufactured by Tayca (rutile type, Al2O3 treated, average primary particle size 300 nm). JR-405, manufactured by Tayca (stock) (rutile type, Al₂O₃ treated, average primary particle size 210 nm); JR-600A, manufactured by Tayca (stock) (rutile type, Al₂O₃ treated, average primary particle size 250 nm); JR-603, manufactured by Tayca (stock) (rutile type, Al₂O₃ / ZrO₂ treated, average primary particle size 280 nm), etc. It may also contain two or more of these compounds.

[0050] From the viewpoint of further improving reflectivity, the content of white pigment in the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more, of the solid components. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of white pigment is preferably 60% by weight or less, more preferably 55% by weight or less, of the solid components.

[0051] Yellow precursor compounds The resin composition of the present invention preferably contains a yellow precursor compound. The yellow precursor compound refers to a compound that exhibits a yellow hue due to increased light absorption in the wavelength range of 380 nm to 500 nm caused by reactions, decompositions, structural changes, etc., induced by heat and / or light energy. In particular, it is preferable that the absorption at a wavelength of 450 nm is increased.

[0052] By including a yellow precursor compound in the resin composition, the blue light blocking properties of the septum can be improved. If the resin composition contains a yellow component from the beginning, during the formation of the septum (A-1) pattern described later, the exposure light is greatly absorbed in the exposure step, and the exposure light does not reach the bottom and curing does not occur. However, due to the presence of the yellow precursor compound, the exposure light is allowed to pass through to the bottom during the exposure step and curing occurs, thus enabling the formation of a fine, thick film septum pattern with high blue light blocking properties. Therefore, it is preferable that the light absorption in the wavelength region of 380 nm to 500 nm does not change during the exposure step, but increases in the wavelength region of 380 nm to 500 nm during the subsequent heating step.

[0053] Examples of yellow precursor compounds include phenolic compounds, organic polymer resins, and organometallic compounds. From the viewpoint of the lightfastness of the resulting yellow component, organometallic compounds are preferred.

[0054] Phenolic compounds are oxidized by heat and / or light energy to form quinone compounds. Preferably, the resulting quinone compounds are yellow phenolic compounds. Examples of phenolic compounds include: 1,4-dihydroxynaphthalene, 1,4-dihydroxyanthraquinone, quinizarin, 1,4-dihydroxy-2-sulfoanthraquinone, etc. Two or more of these compounds may also be present.

[0055] There are no particular limitations on the type of organic polymer resin that turns yellow due to heat and / or light energy. Examples of organic polymer resins include: polyolefins such as polyethylene or polypropylene, or polyvinyl chloride, polycarbonate, and acrylonitrile-butadiene-styrene (ABS) resin. It may also contain two or more of these compounds. Polyolefins turn yellow by removing hydrogen from their structure through heat or light and forming polyenes through an oxidation reaction. Polyvinyl chloride turns yellow by undergoing a dehydrochlorination reaction through heat or light and increasing the number of conjugated double bonds such as polyenes. Polycarbonate turns yellow through a light reaction known as the Fries rearrangement, forming a phenyl salicylate structure, which in turn forms a dihydroxybenzophenone structure. ABS resin is known to turn yellow due to free radicals generated by oxidation caused by heat or light.

[0056] There are no particular limitations on whether organometallic compounds can generate yellow particles with absorption at 380 nm to 500 nm using heat and / or light energy. Examples of yellow particles with absorption at 380 nm to 500 nm include: iron oxide particles, copper oxide particles, iridium oxide particles, bismuth oxide, tungsten oxide, gold oxide particles, nano-gold particles, silver oxide and / or silver particles, silver nanoparticles, etc. Examples of organometallic compounds include: organoiron compounds, organocopper compounds, organoiridium compounds, organobismuth compounds, organotungsten compounds, organogold compounds, organosilver compounds, etc. Two or more of these compounds may also be contained. Among these, the compounds are stable in air, and in addition, during the exposure and / or heating steps, yellow particles (silver oxide and / or silver particles, silver nanoparticles) can be efficiently generated through decomposition and condensation, thereby improving the film's opacity. From this perspective, organosilver compounds are preferred as yellow precursor compounds.

[0057] Examples of organoferric compounds include: ferric tris(2,4-pentanedione), ferrocene, ferric cyanide, ferric carbonate, ferric pentacarbonyl, ferric oxalate, ferric nonacarbonyl, ferric acetate, ferric formate, and ferric hexacyanate. Examples of organocopper compounds include: copper bis(2,4-pentanedione), copper neodecanoate, copper acetate, copper formate, copper formate hydrate, copper oxalate, and copper oxalate hydrate. Examples of organiridium compounds include: iridium tris(2,4-pentanedione), tetrairidium dodecylcarbonyl, iridium bis(triphenylphosphine)carbonyl chloride, and iridium diacene (IrCp₂). Examples of organobismubyl compounds include: bismuth subcarbonate, bismuth oxycarbonate, and bismuth subgallate. Examples of organotungsten compounds include: tungsten hexacarbonyl and hexamethyltungsten. Examples of organogold compounds include: triphenylphosphine chloride, gold resinate MR7901-P, and tetrachloroaurate tetrahydrate.

[0058] Examples of organosilver compounds include: paragraphs

[0048] to

[0049] of Japanese Patent Application Publication No. 10-62899; lines 24 to 37 of page 18 of European Patent Application Publication No. 803,764A1; European Patent Application Publication No. 962,812A1; Japanese Patent Application Publication No. 11-349591; Japanese Patent Application Publication No. 2000-7683; Japanese Patent Application Publication No. 2000-72711; Japanese Patent Application Publication No. 2002-23301; Japanese Patent Application Publication No. 2002-23303; and Japanese Patent Application Publication No. 2002. Organic silver compounds or silver salts of aliphatic carboxylic acids as described in Japanese Patent Application Publication No. 49119, European Patent Application Publication No. 1246001A1, European Patent Application Publication No. 1258775A1, Japanese Patent Application Publication No. 2003-140290, Japanese Patent Application Publication No. 2003-195445, Japanese Patent Application Publication No. 2003-295378, Japanese Patent Application Publication No. 2003-295379, Japanese Patent Application Publication No. 2003-295380, Japanese Patent Application Publication No. 2003-295381, and Japanese Patent Application Publication No. 2003-270755, etc.

[0059] Of these, from the viewpoint of being more yellow, compounds represented by the following general formula (5) and / or polymer compounds having the structure represented by the following general formula (6) are preferred.

[0060] [Chemistry 4]

[0061] In general formula (5), R 5 represents hydrogen or an organogroup having 1 to 30 carbon atoms. Here, "organogroup having 1 to 30 carbon atoms" is preferably an alkyl group (including straight-chain and branched alkyl groups) having 1 to 30 carbon atoms and / or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferred examples of these include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-heptyl, isoheptyl, n-octyl, isooctyl, n-nonyl, isononyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecanyl, octadecyl, nonadecanyl, eicosyl, phenyl, benzyl, tolyl, biphenyl, and naphthyl.

[0062] [Chemistry 5]

[0063] In general formula (6), R6 and R7 independently represent hydrogen or an organogroup having 1 to 30 carbon atoms. Here, "organogroup having 1 to 30 carbon atoms" is preferably an alkyl group (including straight-chain and branched alkyl groups) having 1 to 30 carbon atoms and / or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferred examples of these include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-heptyl, isoheptyl, n-octyl, isooctyl, n-nonyl, isonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecanyl, octadecyl, nonadecanyl, eicosyl, phenyl, benzyl, tolyl, biphenyl, and naphthyl. In addition, a is an integer greater than or equal to 1, preferably 1 to 10,000, and more preferably 5 to 1,000.

[0064] Examples of organosilver compounds represented by general formula (5) include: silver acetate, silver propionate, silver butyrate, silver valerate, silver hexanoate, silver heptanoate, silver octanoate, silver nonanoate, silver decanoate, silver neodecanoate, silver salicylate, silver carbonate, silver p-toluenesulfonate, silver trifluoroacetate, silver 2-ethylhexanoate, silver diethyldithiocarbamate, silver benzoate, silver pyridine-2-carboxylic acid, silver benzanoate, silver arachidate, silver stearate, silver oleate, silver laurate, silver hexanoate, silver myristate, silver palmitate, etc. Two or more of these compounds may also be contained. Of these, silver neodecanoate, silver octanoate, silver salicylate, and silver benzoate are preferred from the viewpoint of further solubility and yellowing in organic solvents.

[0065] The organosilver compound represented by general formula (6) has the following structure, namely, the carboxyl group in the (meth)acrylic acid polymer having a carboxyl group becomes a silver salt structure. The organosilver compound represented by general formula (6) is obtained, for example, by stirring a (meth)acrylic acid polymer having a carboxyl group and silver nitrate in an organic solvent in the presence of an amine catalyst, as shown in the preparation example described later.

[0066] The (meth)acrylic acid polymer containing a carboxyl group is obtained by polymerizing an unsaturated carboxylic acid. Examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinylacetic acid, or acid anhydrides. These can be used alone or in combination with other copolymerizable vinyl unsaturated compounds. Specifically, copolymerizable vinyl unsaturated compounds include: methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, dibutyl acrylate, dibutyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tributyl acrylate, tributyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate, etc., alkyl esters of unsaturated carboxylic acids; styrene, p-methylphenidate, etc. Aromatic vinyl compounds such as alkenes, o-methylstyrene, m-methylstyrene, and α-methylstyrene; unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate; unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate; vinyl carboxylic acid esters such as vinyl acetate and vinyl propionate; cyanide vinyl compounds such as acrylonitrile, methacrylonitrile, and α-chloroacrylonitrile; aliphatic conjugated dienes such as 1,3-butadiene and isoprene; and macromonomers such as polystyrene, polymethyl acrylate, polymethyl methacrylate, polybutyl acrylate, polybutyl methacrylate, and polysilicon, etc., with acrylonitrile or methacrylonitrile groups at the ends, but not limited to these. There are no particular limitations regarding (meth)acrylic acid polymers.

[0067] The (meth)acrylic acid polymer containing carboxyl groups can also be a commercially available product. Commercially available (meth)acrylic acid polymers containing carboxyl groups include, for example: AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, AX3-BX-TR-107, AX3-BX-TR-108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-RD-TR-503, AX3-RD-TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade name, manufactured by Nippon Shokubai Co., Ltd.); SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, SPCR-215X (trade name, manufactured by Showa Denko Co., Ltd.); X-4007 (trade name, manufactured by Nippon Yu Co., Ltd.), etc. Of these, SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, and SPCR-215X are preferred. Two or more of these compounds may also be used.

[0068] Furthermore, there are no particular limitations on the weight-average molecular weight (Mw) of the polymer compound represented by general formula (6), but it is preferable to have a value of 5,000 to 50,000, more preferably 8,000 to 35,000, based on polystyrene measured by GPC. If Mw is less than 5,000, pattern sagging will occur during thermosetting, resulting in reduced resolution. On the other hand, if Mw is greater than 50,000, it will be difficult to reduce and form yellow particles.

[0069] The yellow precursor compound preferably accounts for 0.1% by weight or more, and more preferably 0.4% by weight or more, of the solid component of the resin composition. By setting the content of the yellow precursor compound to 0.4% by weight or more, the obtained partition wall can be made more yellow, and the light-blocking property of the partition wall to blue light can be improved. On the other hand, if the content of the yellow precursor compound is too high, an excess reaction will occur due to the free radicals partially generated by the decomposition of the yellow precursor compound, making it difficult to form a pattern. Therefore, the content of the yellow precursor compound in the solid component of the resin composition is preferably 10% by weight or less, and more preferably 5.0% by weight or less.

[0070] Opaque pigments The resin composition of the present invention preferably contains more light-shielding pigments. These pigments further enhance the light-shielding properties of specific wavelengths of light within the partition.

[0071] Blue and purple pigments The preferred light-shielding pigments are those containing both blue and purple pigments. By including blue and purple pigments, the light-shielding properties of the film in the wavelength range of 500 nm to 630 nm (green light to red light) can be improved.

[0072] Blue and purple pigments are selected from inorganic pigments, organic pigments, and their mixtures, and there are no particular restrictions on their composition.

[0073] Examples of blue pigments include: Pigment Blue (hereinafter referred to as PB) 1, PB9, PB18, PB25, PB28, PB29, PB36, PB15, PB15:1, PB15:2, PB15:3, PB15:4, PB15:6, PB17:1, PB60, PB66, PB75, and PB79. They may also contain two or more of these compounds. From the viewpoint of excellent lightfastness, PB15, PB15:1, PB15:2, PB15:3, PB15:4, and PB15:6, and more preferably PB15:6, which are phthalocyanine pigments.

[0074] Examples of purple pigments include: pigment violet (hereinafter referred to as PV)1, PV3, PV3:3, PV19, PV23, PV29, PV37, PV38, PV39, PV50, etc. Among these, PV19, PV23, PV29, PV37, and PV38, which are condensed polycyclic pigments, are preferred from the viewpoint of excellent heat resistance, and PV23, PV29, and PV37 are more preferred from the viewpoint of excellent light-blocking properties in the wavelength range of 500 nm to 550 nm. The total content of blue and purple pigments in the solid components of the resin composition is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and even more preferably 0.10% by weight or more. By setting the total content of blue and purple pigments to 0.10% by weight or more, the light-blocking properties of the obtained septum in the wavelength region of 500 nm to 630 nm (green light to red light) can be further improved. The total content of blue and purple pigments in the solid components of the resin composition is preferably 3.0% by weight or less, more preferably 1.0% by weight or less, and even more preferably 0.75% by weight or less. By setting the total content of blue and purple pigments to 0.75% by weight or less, sufficient light can pass through, forming fine septum patterns.

[0075] The optimal weight ratio of blue to purple pigment is 20 / 80 to 80 / 20. By setting this ratio, both good pigment dispersibility and light-blocking properties in the 500 nm to 630 nm wavelength range (green to red light) can be achieved. A more suitable ratio is 30 / 70 to 70 / 30, and even better, 50 / 50 to 65 / 35.

[0076] Furthermore, it is preferable that the weight of the yellow precursor compound in the solid component of the resin composition of the present invention is 0.2 to 20% relative to 100% of the weight of the white pigment, and the combined weight of the blue and purple pigments in the solid component is 0.05 to 10% relative to 100% of the weight of the white pigment. By setting this ratio, a gray partition pattern with excellent overall visible light shielding and high reflectivity (wavelength region 430 nm to 630 nm) can be obtained. More preferably, the weight of the yellow precursor compound in the solid component of the resin composition of the present invention is 0.5 to 10% relative to 100% of the weight of the white pigment, and the combined weight of the blue and purple pigments in the solid component is 0.01 to 5% relative to 100% of the weight of the white pigment.

[0077] The resin composition of the present invention may also contain other opaque pigments besides blue and purple pigments as opaque pigments. Examples of other opaque pigments include red pigments, black pigments, green pigments, and yellow pigments.

[0078] Examples of red pigments include: Pigment Red (hereinafter referred to as PR) 9, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, etc. It may also contain two or more of these compounds.

[0079] Examples of black pigments include black organic pigments and black inorganic pigments.

[0080] Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone pigments. These can also be coated with resins. Examples of black inorganic pigments include: graphite; microparticles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zirconium, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal complex oxides; metal sulfides; metal nitrides; metal oxynitrides; and metal carbides. They may also contain two or more of these compounds.

[0081] Examples of green pigments include: CI pigment green (PG) 7, PG36, PG58, PG37, PG59, etc. They may also contain two or more of these compounds.

[0082] Examples of yellow pigments include: Pigment Yellow (hereinafter referred to as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, etc. It may also contain two or more of these compounds.

[0083] The resin composition of the present invention preferably contains a reducing agent. The reducing agent promotes the reduction of yellow precursor compounds (especially organosilver compounds), thereby generating yellow particles more efficiently and improving the film's opacity even under low-temperature heating conditions of around 100°C to 120°C. Therefore, this technology can be applied, for example, even in applications where heat resistance is a concern, such as those involving organic EL materials in the substrate, and where low-temperature heating conditions are required. Furthermore, if unreacted organosilver compounds remain in the heated film, they will decompose due to light or heat, causing a change in film color and resulting in a film with poor weather resistance. However, by containing a reducing agent, the amount of residual organosilver compounds in the cured film is reduced, improving weather resistance.

[0084] The reducing agent can be any compound that promotes the reduction of organosilver compounds, but from the viewpoint of more efficiently reducing organosilver compounds, it is preferred to be a compound containing two or more phenolic hydroxyl groups or a compound containing an enediol group. Regarding compounds containing two or more phenolic hydroxyl groups within their molecules, when reduced by organosilver compounds, they are oxidized to form quinone compounds, but it is preferable that they do not form colored quinone compounds as the aforementioned yellow precursor compounds. Examples of compounds containing two or more phenolic hydroxyl groups within their molecules include: diphenolic compounds such as catechol compounds, hydroquinone compounds, resorcinol compounds, and anthraquinone compounds; or polyphenolic compounds containing three or more phenolic hydroxyl groups. Among these, from the viewpoint of reducing properties, hydroquinone compounds represented by the following general formula (7) are more preferred.

[0085] [Chemistry 6]

[0086] In general formula (7), R8, R9, R10, and R11 each independently represent hydrogen, hydroxyl, or an organogroup having 1 to 30 carbon atoms. Here, "organogroup having 1 to 30 carbon atoms" is preferably an alkyl group (including straight-chain and branched alkyl groups) having 1 to 30 carbon atoms and / or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferred examples of these include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-heptyl, isoheptyl, n-octyl, isooctyl, n-nonyl, isonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecanyl, octadecyl, nonadecanyl, eicosyl, phenyl, benzyl, tolyl, biphenyl, and naphthyl.

[0087] Examples of hydroquinone compounds represented by the following general formula (7) include: hydroquinone, methyl hydroquinone, ethyl hydroquinone, propyl hydroquinone, butyl hydroquinone, tributyl hydroquinone, 2,3-dimethyl hydroquinone, 2,3-diethyl hydroquinone, 2,3-dipropyl hydroquinone, 2,3-dibutyl hydroquinone, 2,3-ditributyl hydroquinone, 2,5-dimethyl hydroquinone, 2,5-diethyl hydroquinone, 2,5-dipropyl hydroquinone, 2,5-dibutyl hydroquinone, 2,5-dibutyl hydroquinone, 2,5-dimethyl hydroquinone, 2,5-dipropyl hydroquinone, 2,5-dibutyl hydroquinone, 2,5-dibutyl hydroquinone, 2,5-dimethyl hydroquinone, 2,5-diethyl hydroquinone, 2,5-dipropyl hydroquinone, 2,5-dibutyl hydroquinone, 2 ,5-Di-tert-butylhydroquinone, hydroquinone dimethyl ether, hydroquinone diethyl ether, 1,2,4-benzenetriol, 2,5-dihydroxyacetophenone, 2,5-dihydroxybenzoic acid, phenylhydroquinone, 2,6-dimethylhydroquinone, 2,6-diethylhydroquinone, 2,6-dipropylhydroquinone, 2,6-dibutylhydroquinone, 2,6-di-tert-butylhydroquinone, 2,6-dihydroxyacetophenone, 2,6-dihydroxybenzoic acid, phenylhydroquinone, phenylhydroquinone, 2,5-tert-pentylhydroquinone, etc. Of these, from the viewpoints of reducing properties, solubility in organic solvents, and storage stability, the preferred choices are tert-butylhydroquinone, 2,3-dimethylhydroquinone, 2,6-dimethylhydroquinone, 2,5-tert-pentylhydroquinone, 2,3-dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-ditert-butylhydroquinone, 2,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, and 2,5-ditert-butylhydroquinone.

[0088] Examples of compounds containing an enediol group include: ascorbic acid, α-pyridoin, fructose, xylose, glucose, dioxyacetone, glycolaldehyde, benzoin, monooxyacetone, and benzoylmethanol. Of these, glycolaldehyde is preferred from the viewpoint of reducing properties and solubility in organic solvents.

[0089] The reducing agent preferably accounts for 0.01% by weight or more, and more preferably 0.1% by weight or more, of the solid components of the resin composition. By setting the reducing agent content to 0.1% by weight or more, the organosilver compounds can be reduced more effectively, resulting in a more yellowish septum and improved septum opacity to blue light. In addition, the amount of residual organosilver compounds in the cured film is reduced, thus improving weather resistance.

[0090] On the other hand, when the resin composition is a negative photosensitive resin composition, if the content of the reducing agent is too high, the reducing agent will capture free radicals generated by the decomposition of the photopolymerization initiator during exposure, thereby reducing the exposure sensitivity. Therefore, the content of the reducing agent in the solid component of the resin composition is preferably 3.0% by weight or less, and more preferably 1.5% by weight or less.

[0091] The resin composition of the present invention preferably contains phosphate polyester. There is no particular limitation as to whether the phosphate polyester is a polymer containing phosphate ester groups, polyphosphate ester groups, or phosphate groups. Phosphate polyester has the function of improving the stability of white pigments and organosilver compounds. Phosphate polyester is preferably used as a dispersant for dispersing pigments.

[0092] Examples of phosphate polyesters include: Phosphano (registered trademark) RA-600, ML-200, ML-220, RS-610, RB-410, RD-720N (manufactured by Toho Chemical Co., Ltd.); Solesperse (registered trademark) Solesperse 26000, Solesperse 36000, Solesperse 41000 (manufactured by ZENECA); Disperbyk (registered trademark) - 110, 111, 142, 145, 180; and BYK (registered trademark) - 110, 111, W969, W9010 (manufactured by BYK-Chemie Japan). (manufactured by Japan Co., Ltd.), Plysurf (registered trademark) A-208B, A-208F, A-208N, A-219B, DB-01, M208F (all manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.), Disparlon (registered trademark) PW-36, DA-375 (manufactured by Kusumoto Chemical Co., Ltd.), etc. It may also contain two or more of these compounds. From the viewpoint of improving the stability of white pigments and organosilver compounds, PHOSPHANOL ML-220, DISPERBYK-110, DISPERBYK-111, and Plysurf A-208B are preferred.

[0093] The content of phosphate polyester in the solid components of the resin composition is preferably 0.50% by weight or more, and more preferably 1.0% by weight or more. By setting the content of phosphate polyester to 0.50% by weight or more, the white pigment and organosilver compound are further stabilized.

[0094] On the other hand, when the resin composition contains polysiloxane as the resin, if the content of phosphate polyester is too high, the viscosity will increase over time due to the condensation reaction between polysiloxanes via the acidic groups of the phosphate polyester. Therefore, the content of phosphate polyester in the solid component of the resin composition is preferably 15% by weight or less, and more preferably 10% by weight or less.

[0095] The resin composition of the present invention preferably contains a liquid-repellent compound. A liquid-repellent compound is a compound that imparts a water- or organic solvent-repellent property (liquid-repellent performance) to the resin composition. There is no particular limitation on the type of compound possessing this property; specifically, compounds containing fluoroalkyl groups are preferred. By containing a liquid-repellent compound, the top of the partition wall (A-1) described later can be endowed with liquid-repellent properties. Therefore, for example, when forming the pixels containing color-changing luminescent materials (B) described later, different color-changing luminescent materials can be easily coated separately onto each pixel.

[0096] The liquid-repellent compound is preferably a liquid-repellent compound with photoradical polymerizable groups. By having photoradical polymerizable groups, it can form a strong bond with the resin, thus making it easier to impart liquid-repellent properties to the top of the partition wall.

[0097] Examples of photopolymerizable compounds include Megafac (registered trademark) RS-72-A, RS-75-A, RS-76-E, RS-56, RS-72-K, RS-75, RS-76-E, RS-76-NS, RS-76, and RS-90 (trade names, manufactured by DIC Corporation). Furthermore, in this case, the photopolymerizable groups can undergo photopolymerization within the partition (A-1) of the photocurable compound containing a negatively photosensitive resin composition.

[0098] From the viewpoint of improving the liquid-repellent properties of the separator and improving inkjet coating properties, the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, of the solid components. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less, more preferably 5% by weight or less, of the solid components.

[0099] The resin composition of the present invention may also contain organometallic compounds other than the yellow precursor compound. Preferably, the organometallic compound other than the yellow precursor compound is an organoplatinum compound or an organopalladium compound. During the exposure and / or heating steps, the organoplatinum compound or organopalladium compound decomposes and condenses into black particles, thus further improving the light-blocking properties of the film without deteriorating the pattern processability.

[0100] Examples of organoplatinum compounds include bis(acetophenone)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzylnitrile)platinum. Examples of organopalladium compounds include bis(acetophenone)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzylnitrile)palladium, tetra(triphenylphosphine)palladium, and dibenzylacetonepalladium. The compound may also contain two or more of these compounds.

[0101] In the resin composition of the present invention, the content of organometallic compounds other than the yellow precursor compound in the solid component is preferably 0.2% to 5% by weight. By setting it to 0.2% by weight or more, the light-shielding properties of the obtained film can be further improved. More preferably, it is 0.5% by weight or more. On the other hand, by setting the content of organometallic compounds other than the yellow precursor compound to 5% by weight or less, the reflectivity can be further improved. More preferably, it is 3% by weight or less.

[0102] In addition, the resin composition of the present invention may contain polymerization inhibitors, surfactants, adhesion modifiers, etc., as needed.

[0103] Because the resin composition of the present invention contains a surfactant, its flowability during coating can be improved. Examples of surfactants include: fluorinated surfactants such as Megafac (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (trade names, manufactured by Dai Nippon Ink Chemical Co., Ltd.), NBX-15, and FTX-218 (trade names, manufactured by Neos Co., Ltd.); silicone surfactants such as BYK (registered trademark) -333, 301, 331, 345, and 307 (trade names, manufactured by BYK-Chemie Japan Co., Ltd.); polyoxyalkylene surfactants; and poly(meth)acrylate surfactants. Two or more of these compounds may also be included.

[0104] Because the resin composition of the present invention contains an adhesion modifier, the adhesion to the substrate is improved, resulting in a highly reliable partition wall. Examples of adhesion modifiers include alicyclic epoxy compounds and silane coupling agents. Among these, alicyclic epoxy compounds are preferred from the viewpoint of heat resistance.

[0105] Examples of alicyclic epoxide compounds include: 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, 1,2-epoxy-4-(2-oxacyclopropyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl-3',4'-epoxycyclohexane carboxylate, 1,2-epoxy-4-vinylcyclohexane, tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone, and 3,4-epoxycyclohexylmethyl methacrylate, etc. Two or more of these compounds may also be present.

[0106] From the viewpoint of further improving adhesion to the substrate, the content of the adhesion modifier in the resin composition of the present invention is preferably 0.1% by weight or more, more preferably 1% by weight or more, of the solid components. On the other hand, from the viewpoint of pattern processability, the content of the adhesion modifier is preferably 20% by weight or less, more preferably 10% by weight or less, of the solid components.

[0107] The resin composition of the present invention preferably contains a solvent. The solvent has the function of adjusting the viscosity of the resin composition to a suitable range for coating and improving the uniformity of the partition wall. As a solvent, it is preferably a combination of a solvent with a boiling point of more than 150°C and less than 250°C at atmospheric pressure and a solvent with a boiling point of less than 150°C.

[0108] Examples of solvents include: alcohols such as isopropanol and diacetone alcohol; diols such as ethylene glycol and propylene glycol; ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, and diethylene glycol ethyl methyl ether; ketones such as methyl ethyl ketone, acetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclopentanone; and dimethylformamide, dimethyl... Acetamides such as acetylamine; acetates such as ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate, etc.; aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane, and cyclohexane; γ-butyrolactone, N-methyl-2-pyrrolidone, dimethyl sulfoxide, etc. Two or more of these compounds may also be contained. From the viewpoint of coatability, a combination of diacetone alcohol or diethylene glycol ethyl methyl ether as a solvent with a boiling point exceeding 150°C and below 250°C at atmospheric pressure, and propylene glycol monomethyl ether as a solvent with a boiling point below 150°C is preferred.

[0109] The solvent content can be set arbitrarily depending on the coating method, etc. For example, when the film is formed by spin coating, the solvent content is generally set to be 50% by weight or more and 95% by weight or less in the resin composition.

[0110] The resin composition of the present invention can be manufactured, for example, by mixing the resin, photosensitizer, yellow precursor compound, opaque pigment and other components as needed.

[0111] Next, the light-shielding film of the present invention will be described.

[0112] The light-shielding film of the present invention is obtained by curing the resin composition of the present invention. In addition to the partition (A-1) described later, the light-shielding film of the present invention can also be preferably used as a light-shielding pattern in a One Glass Solution (OGS) type touch panel, such as a decorative pattern for covering a substrate. The film thickness of the light-shielding film is preferably 5 μm or more, and more preferably 10 μm or more.

[0113] Next, an example of the manufacturing method of the light-shielding film of the present invention will be provided. The preferred manufacturing method of the light-shielding film of the present invention includes, in sequence: a film-forming step, coating a substrate with the resin composition of the present invention and drying it to obtain a dried film; an exposure step, subjecting the obtained dried film to pattern exposure; a developing step, dissolving and removing the portion of the exposed dried film soluble in the developing solution; and a heating step, hardening the developed dried film by heating it, wherein in the heating step, the developed dried film is heated at a temperature of 100°C or higher and 250°C or lower, causing the b* value per 10 μm film thickness measured by SCI method to increase by 10 or more.

[0114] The method for manufacturing the light-shielding film of the present invention is characterized in that, in the heating step, the developed and dried film is heated at a temperature of 100°C or higher and 250°C or lower, thereby increasing the b* value per 10 μm film thickness, as measured by SCI, by 10 or more. From the viewpoint of further improving the b* value, the heating temperature during the heating step is preferably 150°C or higher, and more preferably 180°C or higher.

[0115] From the perspective of suppressing crack formation in the film to be heated, the heating temperature during the heating step is preferably below 250°C, and more preferably below 240°C. The heating time is preferably 15 minutes to 2 hours.

[0116] The light-shielding film formed from the resin composition of the present invention has high transmittance of exposed light (wavelength region 365 nm to 436 nm) during exposure, and the b* value and OD value in the wavelength region 400 nm to 500 nm increase after pattern formation. Therefore, it can be sufficiently photocured to the bottom during the exposure step, resulting in a partition wall with a better cone angle as described later. Furthermore, before the heating step, due to the high light-shielding properties of the blue and purple pigments in the wavelength region 500 nm to 630 nm (green light to red light), the light-shielding properties in the wavelength region 400 nm to 500 nm (blue light) are further improved after the heating step. Therefore, a gray partition wall with both high light-shielding properties and reflectivity in the visible light region can be obtained.

[0117] Methods for coating the resin composition in the film-forming step include, for example, slot coating and spin coating. Drying apparatus includes, for example, a hot air oven or a heating plate. The drying temperature is preferably 80°C to 120°C, and the drying time is preferably 1 minute to 60 minutes. Since the permeability of the film changes under heating conditions above 100°C, the drying temperature is more preferably 80°C to 100°C.

[0118] The exposure step is a process of photocuring necessary portions of the dried film or photodegrading unwanted portions of the dried film through exposure, making any portion of the dried film soluble in the developer. In the exposure step, exposure can be performed through a photomask with a defined opening, or an arbitrary pattern can be directly drawn using a laser or similar device without using a photomask.

[0119] Exposure apparatus, for example, can be a proximity exposure machine. Active light irradiated during the exposure process can be, for example, near-infrared light, visible light, or ultraviolet light, with ultraviolet light being preferred. Furthermore, light sources can be, for example, low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, halogen lamps, and germicidal lamps, but high-pressure mercury lamps and ultra-high-pressure mercury lamps are preferred.

[0120] Exposure conditions can be selected appropriately based on the thickness of the dry film to be exposed. Generally speaking, it is preferable to use an ultra-high pressure mercury lamp with an output of 1 mW / cm² to 100 mW / cm² and an exposure dose of 1 mJ / cm² to 10,000 mJ / cm².

[0121] The developing step involves using a developer to dissolve and remove the portion of the dried film that is soluble in the developer after exposure, resulting in a dried film with only the insoluble portion remaining, which has been patterned into an arbitrary shape (hereinafter referred to as the pre-heating pattern). Examples of pattern shapes include grid patterns, stripes, and perforations.

[0122] Examples of developing methods include immersion, spraying, and brushing.

[0123] As the developer, a solvent capable of dissolving unwanted portions of the dried film after exposure can be appropriately selected, preferably an aqueous solution with water as the main component. For example, if the resin composition contains a polymer with carboxyl groups, an alkaline aqueous solution is preferred as the developer. Examples of alkaline aqueous solutions include inorganic alkaline solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, and calcium hydroxide; and organic alkaline solutions such as tetramethylammonium hydroxide and trimethylbenzylammonium hydroxide. Among these, from the viewpoint of improving resolution, an aqueous solution of potassium hydroxide or tetramethylammonium hydroxide is preferred. From the viewpoint of improving developability, the concentration of the alkaline aqueous solution is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of suppressing the peeling or corrosion of the pattern before heating, the concentration of the alkaline aqueous solution is preferably 5% by weight or less, more preferably 1% by weight or less. In addition, from the viewpoint of improving resolution, the developer may also contain a surfactant. For ease of process management, the developing temperature is preferably 20°C to 50°C.

[0124] The heating step is a step of heat-curing the pattern formed in the developing step before heating. Examples of heating devices include heating plates and ovens. The environment of the heating device is not particularly limited; examples include nitrogen atmosphere and air atmosphere. Preferred heating temperatures and heating times are as described above.

[0125] Next, the substrate with partitions of the present invention will be described.

[0126] The partitioned substrate of the present invention is a partitioned substrate having partitions (A-1) patterned on a substrate by means of the resin composition of the present invention. Preferably, the reflectance per 10 μm thickness in the wavelength region of 430 nm to 630 nm is in the range of 20% to 50%, and the OD value per 10 μm thickness in the wavelength region of 430 nm to 630 nm is in the range of 1.5 to 3.0.

[0127] The partitioned substrate of the present invention has a partition (A-1) patterned on a substrate (hereinafter sometimes referred to as "partition (A-1)"). The substrate functions as a support in the partitioned substrate.

[0128] The partitioned substrate of the present invention is preferably further comprising a pixel layer (B) containing color-changing luminescent material arranged by partitions (A-1) formed by patterning.

[0129] In the case of a pixel containing a color-changing luminescent material described later, the partition wall has the function of suppressing light mixing between adjacent pixels.

[0130] In the substrate with partitions of the present invention, the partition (A-1) preferably has a reflectivity of 20% to 50% per 10 μm thickness in the wavelength region of 430 nm to 630 nm, and an OD value of 1.5 to 3.0 per 10 μm thickness in the wavelength region of 430 nm to 630 nm. By setting the reflectivity of each 10 μm thickness in the wavelength region of 430 nm to 630 nm to 20% or more and the OD value to 3.0 or less, the brightness of the display device can be improved by utilizing the reflection from the side of the partition (A-1). By setting the reflectivity of each 10 μm thickness in the wavelength region of 430 nm to 630 nm to 50% or less and the OD value to 1.5 or more, light transmitted through the partition (A-1) can be suppressed, thereby suppressing color mixing of light between adjacent pixels.

[0131] Furthermore, the partitioned substrate of the present invention has partitions (A-1) patterned on a substrate using the resin composition of the present invention. Preferably, the L* value per 10 μm film thickness is 50~70, the a* value is -5.0~5.0, and the b* value is -5.0~5.0, as measured by SCI method. By having L*, a*, and b* values ​​within this range, a neutral gray partition with low wavelength dependence of reflectivity and OD value can be imparted to the partitions (A-1) in the entire visible light spectrum (wavelength region 430 nm~630 nm), thereby improving the color characteristics of the display.

[0132] Figure 1 shows a cross-sectional view of a sample of the partitioned substrate of the present invention having patterned partitions. Patterned partitions 2 are provided on the substrate 1.

[0133] In addition, the partitioned substrate of the present invention is a partitioned substrate having a partition formed by patterning (A-1) on a base substrate, preferably the patterned partition containing resin, white pigment, blue pigment, purple pigment, silver oxide and / or silver particles.

[0134] Resins, white pigments, blue pigments, purple pigments, silver oxide, and silver particles can be used as described above.

[0135] <Substrate> Examples of substrates include glass plates, resin plates, resin films, thin-film transistors (TFTs), and driving substrates such as printed circuit boards (PCBs). For the glass plate, alkali-free glass is preferred. For the resin plate and resin film, polyester, (meth)acrylic acid polymers, transparent polyimide, and polyether ether are preferred. The thickness of the glass plate and resin plate is preferably 1 mm or less, more preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

[0136] Furthermore, when using a driving substrate such as a TFT or PCB as the base substrate, it is preferable to have a light source selected from organic EL units, mini LED units and micro LED units described later on the base substrate.

[0137] <Next door (A-1)> The thickness of the partition (A-1) refers to the height and / or width of the partition (A-1). The height of the partition (A-1) refers to its length in the direction perpendicular to the substrate (height direction). In the case of the partitioned substrate shown in Figure 1, the height of the partition 2 is represented by the symbol H. Furthermore, the width of the partition (A-1) refers to its length in the direction horizontal to the substrate. In the case of the partitioned substrate shown in Figure 1, the width of the partition 2 is represented by the symbol L. Moreover, in this specification, "height" is sometimes also referred to as "thickness".

[0138] In this invention, it is believed that the reflectivity of the partition wall side contributes to improving the brightness of the display device, and the light-blocking property helps to suppress color mixing. On the other hand, it is believed that the reflectivity and OD value per unit thickness are the same regardless of the height or width direction; therefore, in this invention, the focus is on the reflectivity and OD value per unit thickness of the partition wall. Furthermore, as described later, the thickness of the partition wall (A-1) is preferably 0.5 μm to 100 μm, and the width is preferably 1 μm to 100 μm. Therefore, in this invention, 10 μm is selected as a representative value for the thickness of the partition wall (A-1), focusing on the reflectivity and OD value per 10 μm thickness.

[0139] If the reflectivity per 10 μm thickness in the wavelength region of 430 nm to 630 nm is less than 20%, the reflection from the side of the partition wall becomes small, and the brightness of the display device becomes insufficient. The reflectivity per 10 μm thickness in the wavelength region of 430 nm to 630 nm is preferably 20% or more, more preferably 25% or more, and even more preferably 30% or more. The higher the reflectivity per 10 μm thickness in the wavelength region of 430 nm to 630 nm, the greater the reflection of visible light from the side of the partition wall. Therefore, when the partition wall contains pixels containing color-changing luminescent materials (as described later in (B)), the color-changing efficiency is improved, and the brightness of the display device can be increased.

[0140] If the OD value of each 10 μm thickness in the wavelength region of 430 nm to 630 nm is less than 1.5, light mixing is likely to occur because visible light leaks to adjacent pixels. The OD value of each 10 μm thickness in the wavelength region of 430 nm to 630 nm is preferably 1.5 or higher, more preferably 1.7 or higher, and even more preferably 2.0 or higher. The higher the OD value of each 10 μm thickness in the wavelength region of 430 nm to 630 nm, the greater the light-blocking ability of visible light on the side of the partition. Therefore, when pixels containing color-changing luminescent materials (as described later in (B)) are present between partitions, light emitted from within the pixels can be effectively blocked to prevent color mixing and improve the contrast of the display device.

[0141] Furthermore, the partition (A-1) is characterized by an L* value of 50~70, an a* value of -5.0~5.0, and a b* value of -5.0~5.0 per 10 μm film thickness, measured using the SCI method. If the L* value per 10 μm film thickness measured using the SCI method is less than 50, the reflection from the side of the partition decreases, resulting in insufficient brightness of the display device. If the a* value per 10 μm film thickness measured using the SCI method is less than -5.0, the partition appears green; if the a* value exceeds 5.0, the partition appears red, thus deteriorating the color characteristics of the display. Additionally, if the b* value per 10 μm film thickness measured using the SCI method is less than -5.0, the partition appears blue; if the b* value exceeds 5.0, the partition appears yellow, further contributing to the deterioration of the display's color characteristics. That is, by setting the L* value of each 10 μm film thickness measured by SCI to 50~70, the a* value to -5.0~5.0, and the b* value to -5.0~5.0, a neutral gray partition with low wavelength dependence of reflectivity and OD value is given to the partition (A-1) in the entire visible light spectrum (wavelength region 430 nm~630 nm), thereby improving the color characteristics of the display.

[0142] Regarding the reflectance per 10 μm thickness of the partition wall (A-1) in the wavelength region of 430 nm to 630 nm, as well as the L*, a*, and b* values ​​per 10 μm film thickness, measurements can be performed on a 10 μm thick partition wall (A-1) from the top surface using a spectrophotometer (e.g., a Konica Minolta CM-2600d) in Specular Component Included (SCI) mode. In cases where sufficient area for measurement is not available, or where a 10 μm thick sample cannot be obtained, and the composition of the partition wall (A-1) is known, a 10 μm thick monolithic film with the same composition as the partition wall (A-1) can be fabricated and its reflectance measured in the same manner, thereby determining the reflectance per 10 μm thickness. For example, the material that forms the partition (A-1) can also be used, with a thickness of 10 μm. The integral film can be made using the same processing conditions as the partition (A-1) except that no patterning is performed. The reflectance of the obtained integral film is measured from the top surface in the same way.

[0143] Regarding the OD value of the 10 μm thickness of the septum (A-1) in the wavelength region of 430 nm to 630 nm, the transmittance of the 10 μm thick septum (A-1) can be measured from the top surface using an optical concentration meter / spectrophotometer (e.g., Hitachi High-Tech Science U-4100) and calculated using the following formula (1). Where a sufficient area for measurement cannot be ensured, or a 10 μm thick sample cannot be taken, if the composition of the septum (A-1) is known, a 10 μm thick monolithic film with the same composition as the septum (A-1) can be prepared in the same manner as the reflectance measurement, and the OD value of the monolithic film can be measured in the same way as the septum (A-1), thereby obtaining the OD value per 10 μm thickness. OD value = -log10(T / 100) ···(1) T: Transmittance.

[0144] Furthermore, as a method for making the reflectivity, OD value, L* value, a* value and b* value within the range described above, for example, setting the partition (A-1) as a preferred composition described later can be listed.

[0145] The cone angle of the partition (A-1) is preferably 45° to 110°. The cone angle of the partition (A-1) refers to the angle formed by the side and bottom edges of the partition cross-section. In the case of the partitioned substrate shown in Figure 1, the cone angle of the partition 2 is represented by the symbol θ. By setting the cone angle to 45° or more, the difference in width between the upper and lower parts of the partition (A-1) becomes smaller, making it easier to form the width of the partition (A-1) within the preferred range described later. The cone angle is more preferably 80° or more. On the other hand, by setting the cone angle to 110° or less, when forming the pixels containing the color-changing luminescent material (B) described later by inkjet coating, ink runoff can be suppressed, and inkjet coating performance can be improved. Here, ink runoff refers to the phenomenon where ink crosses the partition and mixes into the adjacent pixel portion. The cone angle is more preferably 95° or less. The cone angle of the partition (A-1) can be determined by using an optical microscope (FE-SEM, for example, Hitachi S-4800 manufactured by Hitachi, Ltd.) to observe any cross-section of the partition (A-1) at an accelerating voltage of 3.0 kV and a magnification of 2,500, and measuring the angle between the side and bottom edges of the cross-section of the partition (A-1).

[0146] Furthermore, as a method for making the cone angle of the partition (A-1) within the aforementioned range, examples include setting the partition (A-1) to the preferred composition described later, forming it using the resin composition of the present invention, etc.

[0147] Regarding the thickness of the partition (A-1), when the substrate with the partition has pixels containing color-changing luminescent material (described later in (B)), it is preferably greater than the thickness of the pixel. Specifically, the thickness of the partition (A-1) is preferably 0.5 μm or more, more preferably 5.0 μm or more, and even more preferably 10 μm or more. On the other hand, from the viewpoint of more efficiently extracting the light emission from the bottom of the pixel, the thickness of the partition (A-1) is preferably 100 μm or less, more preferably 50 μm or less. Furthermore, the width of the partition (A-1) is preferably sufficient to further improve brightness by utilizing light reflection from the side of the partition and to further suppress light mixing of adjacent pixels caused by light leakage. Specifically, the width of the partition is preferably 1 μm or more, more preferably 5 μm or more. On the other hand, from the viewpoint of further improving brightness by ensuring a larger luminescent area for the pixel, the width of the partition (A-1) is preferably 100 μm or less, more preferably 50 μm or less.

[0148] The partition (A-1) has a repeating pattern with a specified number of pixels corresponding to the screen size of the image display device. For example, the number of pixels for the image display device could be 4000 horizontally and 2000 vertically. The number of pixels affects the resolution (resolution) of the displayed image. Therefore, it is necessary to form a number of pixels corresponding to the required image resolution and the screen size of the image display device; preferably, the pattern forming size of the partition should be determined in conjunction with this.

[0149] The spacer (A-1) preferably contains resin, white pigment, blue pigment, and purple pigment, as well as silver oxide and / or silver particles. The resin improves the crack resistance and lightfastness of the spacer. The white pigment further improves the reflectivity of the spacer. The blue and purple pigments further improve the light-blocking properties of the spacer in the wavelength range of 500 nm to 630 nm (green to red light). Silver oxide and / or silver particles further improve the light-blocking properties of the spacer in the wavelength range of 380 nm to 500 nm (blue light).

[0150] Resin, white pigment, blue pigment and purple pigment are as described above as materials constituting the resin composition.

[0151] From the viewpoint of improving the crack resistance of the partition wall during heat treatment, the resin content in the partition wall (A-1) is preferably 10% by weight or more, and more preferably 20% by weight or more. On the other hand, from the viewpoint of improving lightfastness, the resin content in the partition wall (A-1) is preferably 60% by weight or less, and more preferably 50% by weight or less.

[0152] From the viewpoint of further improving reflectivity, the content of white pigment in the partition (A-1) is preferably 10% by weight or more, and more preferably 15% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition, the content of white pigment in the partition (A-1) is preferably 60% by weight or less, and more preferably 55% by weight or less.

[0153] From the viewpoint of improving the light-blocking properties of a specific wavelength of light, the content of blue and purple pigments in the partition (A-1) is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and even more preferably 0.10% by weight or more. On the other hand, from the viewpoint of not impairing the reflectivity of the partition, it is preferably 3.0% by weight or less, more preferably 1.0% by weight or less, and even more preferably 0.75% by weight or less.

[0154] The weight ratio of blue and purple pigments in the adjacent container (A-1) is preferably 20 / 80 to 80 / 20. By setting the weight ratio of blue and purple pigments to 20 / 80 to 80 / 20, both good pigment dispersibility and light-blocking properties in the wavelength range of 500 nm to 630 nm (green light to red light) can be achieved. A more preferable weight ratio of blue and purple pigments is 30 / 70 to 70 / 30, and even more preferably 50 / 50 to 65 / 35.

[0155] The term "silver oxide and / or silver particles" refers to yellow particles or a mixture of yellow and black particles produced by the decomposition and aggregation of organic silver compounds in the resin composition during the exposure and / or heating steps. From the viewpoint of further suppressing light mixing in adjacent pixels by adjusting reflectance and OD to the aforementioned range, the content of silver oxide and / or silver particles in the partition (A-1) is preferably 0.1% by weight or more, more preferably 0.4% by weight or more. On the other hand, from the viewpoint of adjusting reflectance and OD to the aforementioned range, the content of silver oxide and / or silver particles in the partition (A-1) is preferably 10% by weight or less, more preferably 3.0% by weight or less.

[0156] Furthermore, it is preferable that the weight of silver oxide and / or silver particles in the partition (A-1) is 0.2 to 20% of the weight of white pigment per 100%, and the total weight of blue and purple pigments in the solid composition is 0.05 to 10% of the weight of white pigment per 100%. By setting this ratio, a gray partition pattern with excellent overall visible light shielding and high reflectivity (wavelength region 430 nm to 630 nm) can be obtained. More preferably, the weight of silver oxide and / or silver particles in the partition (A-1) is 0.5 to 10% of the weight of white pigment per 100%, and the total weight of blue and purple pigments in the solid composition is 0.1 to 5% of the weight of white pigment per 100%.

[0157] The partition wall (A-1) preferably contains a liquid-repellent compound. By containing the liquid-repellent compound, the partition wall (A-1) can be endowed with liquid-repellent properties. For example, when forming the pixels containing the color-changing luminescent material described later (B), it is easy to separately coat each pixel to form different color-changing luminescent materials. The liquid-repellent compound is used as a material constituting the resin composition as described above.

[0158] From the viewpoint of improving the liquid-repellent properties of the partition wall and improving inkjet coating properties, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 0.01% by weight or more, and more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 10% by weight or less, and more preferably 5% by weight or less.

[0159] From the viewpoint of improving inkjet coating properties and facilitating the separate coating of color-changing luminescent materials, the surface contact angle of the partition wall (A-1) relative to propylene glycol monomethyl ether acetate is preferably 10° or more, more preferably 20° or more, and even more preferably 40° or more. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the substrate, the surface contact angle of the partition wall (A-1) is preferably 70° or less, more preferably 60° or less. Here, the surface contact angle of the partition wall (A-1) can be measured on the upper part of the partition wall according to the wettability test method for the substrate glass surface specified in Japanese Industrial Standards (JIS) R3257 (issued on April 20, 1999). Furthermore, as a method to achieve a surface contact angle of the partition wall (A-1) within the aforementioned range, methods such as using the aforementioned liquid-repellent compound can be cited.

[0160] As a method for patterning a partition (A-1) on a substrate, a photosensitive paste method is preferred in terms of ease of pattern shape adjustment. A preferred method for patterning a partition using the photosensitive paste method includes, for example, a coating step of coating the resin composition onto the substrate and drying it to obtain a dried film; an exposure step of exposing the obtained dried film to a desired pattern shape; a developing step of dissolving and removing the portion of the dried film soluble in the developer solution after exposure; and a heating step of hardening the developed partition. The resin composition preferably has negative or positive photosensitivity. Pattern exposure can be performed through a photomask with a defined opening, or an arbitrary pattern can be directly drawn using laser light or the like without a photomask. Furthermore, when the substrate with partitions has a color filter and / or a light-shielding partition (A-2) described later, the partition (A-1) can also be patterned on the color filter and / or the light-shielding partition (A-2). The steps are as described above as the manufacturing method for the light-blocking film.

[0161] The substrate with partitions of the present invention is preferably further provided with (B) pixels containing color-changing light-emitting material arranged by said partitions (A-1).

[0162] The pixel (B) has the function of performing color display by changing at least a portion of the wavelength region of the incident light and emitting outgoing light of a wavelength region different from that of the incident light.

[0163] Figure 2 shows a cross-sectional view of a substrate with partitions (A-1) and pixels (B) of the present invention. The substrate 1 has patterned partitions 2, and pixels 3 are arranged in areas separated by the partitions 2.

[0164] The color-changing material preferably contains a phosphor selected from inorganic and organic phosphors.

[0165] The partitioned substrate of the present invention can, for example, combine a backlight emitting blue light with liquid crystal and pixels (B) formed on a TFT for use as a display device. In this case, the region corresponding to the red pixel preferably contains a red phosphor that emits red light when excited by blue excitation light. Similarly, the region corresponding to the green pixel preferably contains a green phosphor that emits green light when excited by blue excitation light. The region corresponding to the blue pixel preferably does not contain a phosphor.

[0166] As an inorganic phosphor, it is preferable to be a phosphor that emits various colors such as green or red when excited by blue excitation light, that is, a phosphor whose emission spectrum has a peak in the region of 500 nm to 700 nm when excited by excitation light with a wavelength of 400 nm to 500 nm. Examples of such inorganic phosphors include: yttrium aluminum garnet (YAG) phosphors, terbium aluminum garnet (TAG) phosphors, sialon phosphors, Mn4+ active fluoride complex phosphors, and inorganic semiconductors called quantum dots. Two or more of these compounds may also be used. Among these, quantum dots are preferred. Compared with other phosphors, quantum dots have a smaller average particle size, which can smooth the surface of (B) pixels, suppress surface light scattering, and thus further improve the light extraction efficiency and brightness.

[0167] Materials used as quantum dots include, for example, semiconductors from groups II-IV, III-V, IV-VI, and IV. Inorganic semiconductors include, for example, Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, Si₃N₄, Ge₃N₄, Al₂O₃, etc. Two or more of these compounds can also be used.

[0168] As an organic phosphor, it is preferable to be a phosphor that emits various colors such as green or red upon blue excitation light. Examples of phosphors emitting red fluorescence include pyrrole methylene derivatives having the basic skeleton represented by the following structural formula (8), and examples of phosphors emitting green fluorescence include pyrrole methylene derivatives having the basic skeleton represented by the following structural formula (9). In addition, perylene derivatives, porphyrin derivatives, oxazine derivatives, and pyrazine derivatives that emit red or green fluorescence by selection of substituents can be included. Two or more of these compounds may also be contained. Among these, pyrrole methylene derivatives are preferred in terms of high quantum yield. Pyrrole methylene derivatives can be obtained, for example, by the method described in Japanese Patent Application Publication No. 2011-241160.

[0169] [Chemistry 7]

[0170] From the viewpoint of improving color characteristics, the thickness of the pixel (B) is preferably 0.5 μm or more, and more preferably 1 μm or more. On the other hand, from the viewpoint of making the display device thinner or more flexible in forming curved surfaces, the thickness of the pixel (B) is preferably 30 μm or less, and more preferably 20 μm or less.

[0171] Pixels (B) are preferably arranged separated by partitions (A-1). By placing partitions between pixels, the diffusion or mixing of emitted light can be further suppressed.

[0172] As a method for forming a pixel (B), one example is to fill the space separated by the partition (A-1) with a coating liquid containing a color-changing luminescent material (hereinafter, color-changing luminescent material coating liquid). The color-changing luminescent material coating liquid may also contain resin or solvent.

[0173] Methods for filling color-changing luminescent material coatings include photolithography and inkjet printing, but from the viewpoint of easily coating different types of color-changing luminescent materials separately onto each pixel, inkjet printing is preferred.

[0174] <Light-blocking partition (A-2)> The substrate with partitions of the present invention preferably has a patterned partition (A-2) with an OD value of 0.5 or more per 1.0 μm thickness between the substrate and the patterned partition (A-1). This partition (A-2) is sometimes referred to as a "light-shielding partition (A-2)". By having the light-shielding partition (A-2), light-shielding performance can be improved, backlight leakage can be suppressed, and a high-contrast and vivid image can be obtained.

[0175] Figure 3 shows a cross-sectional view of a substrate with light-shielding partitions according to the present invention. A patterned partition 2 and a light-shielding partition 4 are provided on the substrate 1, and pixels 3 are arranged in the area separated by the partition 2 and the light-shielding partition 4.

[0176] The OD value of the light-shielding partition (A-2) is 0.5 or higher per 1.0 μm thickness. Here, the thickness of the light-shielding partition (A-2) is as described later, preferably 0.5 μm to 10 μm. In this invention, 1.0 μm is selected as a representative value for the thickness of the light-shielding partition (A-2), focusing on the OD value per 1.0 μm thickness. By setting the OD value per 1.0 μm thickness to 0.5 or higher, the light-shielding performance can be further improved, resulting in a higher contrast and brighter image. On the other hand, it is preferable that the OD value per 1.0 μm thickness is 4.0 or lower, which improves pattern processing flexibility. The OD value of the light-shielding partition (A-2) can be measured in the same manner as the OD value of the partition (A-1).

[0177] From the viewpoint of improving light-shielding performance, the thickness of the light-shielding partition (A-2) is preferably 0.5 μm or more. On the other hand, from the viewpoint of improving flatness, the thickness of the light-shielding partition (A-2) is preferably 10 μm or less. In addition, the width of the light-shielding partition (A-2) is preferably the same as that of the partition (A-1).

[0178] The light-shielding partition (A-2) is preferably composed of resin and black pigment. The resin improves the partition's crack resistance and lightfastness. The black pigment absorbs incident light and reduces emitted light.

[0179] Examples of resins included in the above-mentioned resin composition include (meth)acrylic acid polymers and polyimide, which have excellent heat resistance and solvent resistance.

[0180] Examples of black pigments used in the resin composition include pigments such as palladium oxide, platinum oxide, gold oxide, and silver oxide. For high opacity, titanium nitride, zirconium nitride, and carbon black are preferred.

[0181] As a method for forming a light-shielding partition (A-2) on a substrate, it is preferred to use the photosensitive material described in Japanese Patent Application Publication No. 2015-1654, and form the partition (A-1) by means of a photosensitive paste method.

[0182] Furthermore, the substrate with partitions of the present invention preferably has a color filter layer (hereinafter, sometimes referred to as "color filter") with a thickness of 1 μm to 5 μm between the substrate and the pixel layer containing the color-changing light-emitting material (B). The color filter has the function of allowing visible light in a specific wavelength region to pass through and setting the transmitted light to a desired hue. By having a color filter, the color purity of the display device can be improved. By setting the thickness of the color filter to 1 μm or more, the color purity can be further improved. On the other hand, by setting the thickness of the color filter to 5 μm or less, the brightness can be further improved.

[0183] Figure 4 shows a cross-sectional view of a partitioned substrate of the present invention having a color filter. A patterned partition 2 and a color filter 5 are provided on the substrate 1, and pixels 3 are provided on the color filter 5.

[0184] Examples of color filters include: color filters used in flat panel displays such as liquid crystal displays, which employ pigment-dispersed materials in which pigments are dispersed in photoresist. More specifically, examples include: blue color filters that selectively transmit wavelengths of 400 nm to 550 nm, green color filters that selectively transmit wavelengths of 500 nm to 600 nm, yellow color filters that selectively transmit wavelengths of 500 nm and above, and red color filters that selectively transmit wavelengths of 600 nm and above.

[0185] In addition, color filters can be laminated separately from pixels (B) containing color-changing light-emitting materials, or they can be laminated as an integral unit.

[0186] The substrate with partitions of the present invention preferably has a color filter with a thickness of 1 μm to 5 μm separated by light-shielding partitions between the substrate and the pixel (B).

[0187] Figure 5 shows a cross-sectional view of a substrate of the present invention with color filters separated by light-shielding partitions. A color filter 5 separated by patterned light-shielding partitions 4 is provided on a substrate 1, and partitions 2 and pixels 3 are provided thereon.

[0188] The partitioned substrate of the present invention preferably has a low refractive index layer (hereinafter sometimes referred to as "low refractive index layer (C)") with a refractive index of 1.20 to 1.35 at a wavelength of 550 nm on the upper or lower part of the pixel (B). By having a low refractive index layer (C), the light extraction efficiency can be further improved, and the brightness of the display device can be further improved.

[0189] In a display device, from the viewpoint of appropriately suppressing backlight reflection and efficiently allowing light to be incident on the pixel (B), the refractive index of the low-refractive-index layer (C) is preferably 1.20 or higher. On the other hand, from the viewpoint of improving brightness, the refractive index of the low-refractive-index layer (C) is preferably 1.35 or lower. Here, the refractive index of the low-refractive-index layer (C) can be measured using a prism coupler, under atmospheric pressure and at 20°C, by irradiating light with a wavelength of 550 nm from a direction perpendicular to the surface of the hardened film.

[0190] The substrate with partitions of the present invention preferably has an inorganic protective layer I with a thickness of 50 nm to 1,000 nm on the low refractive index layer (C). By having the inorganic protective layer I, moisture in the atmosphere is difficult to reach the low refractive index layer (C), thus suppressing the refractive index variation of the low refractive index layer (C) and suppressing brightness degradation.

[0191] The partitioned substrate of the present invention preferably has a low refractive index layer (C) between the pixel (B) and the color filter, and more preferably has an inorganic protective layer (I) with a thickness of 50 nm to 1,000 nm on the low refractive index layer (C). By having the low refractive index layer (C) between the pixel (B) and the color filter, the light extraction effect of the emitted light is improved, and the brightness of the display is increased.

[0192] The partitioned substrate of the present invention preferably has an inorganic protective layer (II) with a thickness of 50 nm to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer (II), the raw materials for forming the pixel (B) are less likely to migrate from the pixel (B) to the low refractive index layer, thereby suppressing the refractive index variation of the low refractive index layer (C) and suppressing brightness degradation.

[0193] The partitioned substrate of the present invention preferably has an inorganic protective layer (III) and / or a yellow organic protective layer with a thickness of 50 nm to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer (III), the raw materials for forming the color filter are less likely to reach the pixel (B) containing the color-changing luminescent material from the color filter, thus suppressing brightness degradation of the pixel (B) containing the color-changing luminescent material. Furthermore, by having the yellow organic protective layer, blue leakage light that has not been completely converted by the pixel (B) containing the color-changing luminescent material can be blocked, improving color reproducibility. The yellow organic protective layer may also not be formed in the pixel corresponding to the blue pixel.

[0194] The substrate with partitions of the present invention preferably has an inorganic protective layer (IV) and / or a yellow organic protective layer with a thickness of 50 nm to 1,000 nm on the substrate. The inorganic protective layer (IV) and / or the yellow organic protective layer function as a refractive index adjustment layer, which can more efficiently extract the light emitted from the pixel (B) and further improve the brightness of the display device. In addition, the yellow organic protective layer blocks the blue leakage light that has not been completely converted by the pixel (B) containing the color-changing luminescent material, which can improve color reproduction. The inorganic protective layer (IV) and / or the yellow organic protective layer are more preferably disposed between the substrate and the partition (A) and the pixel (B).

[0195] Materials constituting the inorganic protective layers (I) to (IV) may include, for example, metal oxides such as silicon oxide, indium tin oxide, and zinc gallium oxide; metal nitrides such as silicon nitride; and fluorides such as magnesium fluoride. Two or more of these compounds may also be contained. Among these, silicon nitride or silicon oxide are preferred in terms of low or high water vapor permeability.

[0196] From the viewpoint of sufficiently suppressing the permeation of substances such as water vapor, the thickness of the inorganic protective layer (I) to the inorganic protective layer (IV) is preferably 50 nm or more. On the other hand, from the viewpoint of suppressing the reduction of transmittance, the thickness of the inorganic protective layer (I) to the inorganic protective layer (IV) is preferably 800 nm or less.

[0197] The thickness of inorganic protective layers (I) to inorganic protective layers (IV) can be measured by using a polishing device such as a cross-section polisher to expose a cross section perpendicular to the substrate, and then magnifying and observing the cross section using a scanning electron microscope or a transmission electron microscope.

[0198] Methods for forming inorganic protective layers (I) to (IV) include, for example, sputtering. The inorganic protective layers are preferably colorless and transparent or yellow and transparent.

[0199] A yellow organic protective layer is obtained, for example, by patterning a resin composition containing a yellow precursor compound and / or a yellow pigment. The yellow precursor compound and the yellow pigment are materials constituting the resin composition as described above.

[0200] As a method for forming the yellow organic protective layer, it is preferable to form the pattern using a photosensitive paste method, similar to the method used for the partition (A-1). When forming the yellow organic protective layer on a color filter, the yellow organic protective layer can also function as an outer coating that planarizes the pixels of the color filter.

[0201] From the viewpoint of sufficiently blocking blue leakage light, the thickness of the yellow organic protective layer is preferably 100 nm or more. On the other hand, from the viewpoint of suppressing the reduction in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less.

[0202] The partitioned substrate of the present invention can also be used in display devices using mini-LEDs or micro-LEDs, wherein a plurality of LEDs corresponding to individual pixels separated by partitions formed on a substrate are arranged. The ON / OFF switching of each pixel can be achieved by the ON / OFF switching of the mini-LEDs or micro-LEDs, without the need for liquid crystal. That is, the partitioned substrate of the present invention can be used not only in partitions separating individual pixels, but also in partitions separating mini-LEDs or micro-LEDs in backlights, etc.

[0203] The substrate with partitions of the present invention preferably has a light source selected from organic EL units, mini LED units, and micro LED units on the substrate. By using partitions to separate the light sources selected from organic EL units, mini LED units, and micro LED units, color mixing between pixels can be prevented, thereby improving the color purity of the display.

[0204] Figure 6 shows a cross-sectional view of a partitioned substrate of the present invention having a light source selected from organic EL units, mini LED units, and micro LED units. A light source 6 selected from organic EL units, mini LED units, and micro LED units is provided on the substrate 1 and between the patterned partitions 2.

[0205] The partitioned substrate of the present invention preferably has more pixels (B) on the light source selected from organic EL units, mini LED units and micro LED units.

[0206] Figure 7 shows a cross-sectional view of a partitioned substrate of the present invention having a light source and pixels selected from organic EL units, mini LED units, and micro LED units. A light source 6 selected from organic EL units, mini LED units, and micro LED units is provided on the substrate 1 and between the patterned partitions 2, and pixels 3 are provided thereon.

[0207] Next, the display device of the present invention will be described.

[0208] The display device of the present invention includes the aforementioned partitioned substrate and a light-emitting source. Preferably, the display device of the present invention includes the partitioned substrate of the present invention and a light-emitting source selected from liquid crystal cells, organic EL cells, mini-LED cells, and micro-LED cells. As the light-emitting source, it is preferably selected from liquid crystal cells, organic EL cells, mini-LED cells, and micro-LED cells. In terms of superior light-emitting characteristics, organic EL cells are more preferably used as the light-emitting source. A mini-LED cell refers to a cell containing a plurality of LEDs with a length of approximately 100 μm to 1 mm. A micro-LED cell refers to a cell containing a plurality of LEDs with a length of less than 100 μm.

[0209] Regarding the manufacturing method of the display device of the present invention, an example of a display device having the partitioned substrate and organic EL unit of the present invention will be described. A photosensitive polyimide resin is coated on a glass substrate, and an insulating film with openings is formed using photolithography. After sputtering aluminum onto the substrate, the aluminum is patterned using photolithography, and a back electrode layer containing aluminum is formed in the openings without an insulating film. Next, as an electron transport layer, tris(8-hydroxyquinoline)aluminum (hereinafter referred to as Alq3) is formed by vacuum evaporation, followed by a white light-emitting layer formed by doping Alq3 with dicyanomethylenepyran, quinacridone, and 4,4'-bis(2,2-diphenylvinyl)biphenyl. Next, as a hole transport layer, N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-diamine is formed by vacuum evaporation. Finally, as a transparent electrode, indium tin oxide (ITO) is sputtered to form a film, thus creating an organic EL cell with a white light-emitting layer. By bonding the organic EL cell obtained in this manner to the spacer-bound substrate and using a sealant, a display device can be fabricated. [Example]

[0210] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these scopes. Furthermore, compounds used in this study that are referred to by abbreviations will be named below. PGMEA: Propylene Glycol Monomethyl Ether Acetate EDM: Diethylene glycol ethyl methyl ether DAA: Diacetone alcohol BHT: Butylated hydroxytoluene.

[0211] The solid content concentration of the polysiloxane solutions in Synthetic Examples 1 to 3 was determined by the following method: 1.5 g of polysiloxane solution was weighed into an aluminum cup, and heated at 250°C for 30 minutes using a heating plate to evaporate the liquid components. The weight of the solid components remaining in the aluminum cup after heating was weighed, and the solid content concentration was determined based on the ratio of the solid components to their weight before heating.

[0212] The weight-average molecular weight of the polysiloxanes in Synthetic Examples 1 to 3 was determined by measuring the weight-average molecular weight converted from polystyrene using the following method. Apparatus: GPC measuring apparatus with RI detector manufactured by Waters (2695) Column: PLgel MIXED-C column (manufactured by Polymer Laboratories, 300 mm) × two (connected in series) Measurement temperature: 40℃ Flow rate: 1 mL / min Solvent: 0.5% (w / w) tetrahydrofuran (THF) solution Standard material: polystyrene Detection mode: RI.

[0213] The content ratio of each repeating unit in the polysiloxanes of Synthetic Examples 1 to 3 was determined by the following method. A polysiloxane solution was injected into a 10 mm diameter nuclear magnetic resonance (NMR) sample tube made of Teflon (registered trademark), and 29Si-NMR measurements were performed. The content ratio of each repeating unit was calculated based on the ratio of the integral value of Si derived from a specific organosilane to the total integral value of Si derived from the organosilane. The 29Si-NMR measurement conditions are shown below. Equipment: Nuclear Magnetic Resonance Imaging System (JNM-GX270; manufactured by Nippon Electron Ltd.) Measurement method: gated decoupling method Nuclear frequency measured: 53.6693 MHz (29Si nucleus) Spectral width: 20000 Hz Pulse width: 12 μs (45° pulse) Pulse repetition time: 30.0 seconds Solvent: Acetone-D6 Standard substance: Tetramethylsilane Measurement temperature: 23℃ Sample rotation speed: 0.0 Hz.

[0214] Synthesis Example 1: Polysiloxane (PSL-1) Solution In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 78.52 g (0.35 mol) of styryltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 113.22 g (0.83 mol) of methyltrimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.080 g of BHT and 234.92 g of PGMEA were added. While stirring at 40 °C for 30 minutes, an aqueous solution of phosphoric acid containing 3.304 g of dissolved phosphoric acid (1.0 wt% relative to the monomers) was added to 92.14 g of water. Subsequently, the flask was immersed in an oil bath at 70°C and stirred for 60 minutes, followed by a 30-minute heating process to 115°C. One hour after the start of heating, the solution temperature (internal temperature) reached 100°C, and this was continued for 2 hours with heating and stirring (internal temperature 100°C~110°C) to obtain a polysiloxane solution. Furthermore, during heating and stirring, a mixture of 95% nitrogen and 5% oxygen was passed through at a rate of 0.05 L / min. A total of 209 g of methanol and water, as byproducts, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution at a solids concentration of 40% by weight to obtain a polysiloxane (PSL-1) solution. The obtained polysiloxane (PSL-1) had a weight-average molecular weight of 12,000. In addition, in polysiloxane (PSL-1), the molar ratios of each repeating unit derived from 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride are 17.5 mol%, 20 mol%, 5 mol%, 47.5 mol%, and 10 mol%, respectively.

[0215] Synthesis Example 2: Polysiloxane (PSL-2) Solution In a 1000 ml three-necked flask, 203.13 g (0.831 mol) of diphenyldimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.475 g of BHT and 308.45 g of PGMEA were added. While stirring at 40 °C for 30 minutes, an aqueous solution of phosphoric acid containing 3.887 g of dissolved phosphoric acid (1.0 wt% relative to the monomers) was added to 76.39 g of water. Subsequently, the flask was immersed in an oil bath at 70°C and stirred for 60 minutes, followed by a 30-minute heating process to 115°C. One hour after the start of heating, the solution temperature (internal temperature) reached 100°C, and this was continued for 2 hours with heating and stirring (internal temperature 100°C~110°C) to obtain a polysiloxane solution. Furthermore, during heating and stirring, a mixture of 95% nitrogen and 5% oxygen was passed through at a rate of 0.05 L / min. A total of 173.99 g of methanol and water, as byproducts, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution at a solids concentration of 40% by weight to obtain a polysiloxane (PSL-2) solution. The obtained polysiloxane (PSL-2) had a weight-average molecular weight of 6,000. In addition, in polysiloxane (PSL-2), the molar ratios of each repeating unit derived from diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride are 47.5 mol%, 17.5 mol%, 5 mol%, 20 mol%, and 10 mol%, respectively.

[0216] Synthesis Example 3: Polysiloxane (PSL-5) Solution In a 1000 ml three-necked flask, 213.82 g (0.875 mol) of diphenyldimethoxysilane, 43.12 g (0.175 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 68.86 g (0.263 mol) of tetraethoxysilane, 59.59 g (0.438 mol) of methyltrimethoxysilane, 1.413 g of BHT, and 298.06 g of PGMEA were added. While stirring at 40°C for 30 minutes, an aqueous solution of phosphoric acid containing 3.854 g (1.0 wt% relative to the monomers) dissolved in 83.48 g of water was added. The flask was then immersed in an oil bath at 70°C and stirred for 60 minutes, after which the oil bath temperature was increased to 115°C over a 30-minute period. One hour after the start of heating, the solution temperature (internal temperature) reached 100°C, and heating and stirring were carried out for 2 hours (internal temperature 100°C~110°C) to obtain a polysiloxane solution. Furthermore, during heating and stirring, a mixture of 95% nitrogen and 5% oxygen was passed through at a rate of 0.05 L / min. A total of 282.58 g of methanol and water, as byproducts, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution at a solids concentration of 40% by weight to obtain a polysiloxane (PSL-3) solution. Furthermore, the obtained polysiloxane (PSL-3) had a weight-average molecular weight of 5,500. In addition, in polysiloxane (PSL-3), the molar ratios of each repeating unit derived from diphenyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, tetraethoxysilane, and methyltrimethoxysilane are 50 mol%, 10 mol%, 15 mol%, and 25 mol%, respectively. The composition of Synthetic Examples 1 to 3 is summarized in Table 1.

[0217] [Table 1] [Table 1] Raw materials (mol%) Alkoxysilanes constituting general formula (1) Alkoxysilanes constituting general formula (2) Other alkoxysilanes Synthesis example 1 Polysiloxane (PSL-1) solution 3-Methylpropenyloxypropylmethyldimethoxysilane (17.5) Styrene trimethoxysilane (20) 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane (5) Methyltrimethoxysilane (47.5) 3-Trimethoxysilylpropylsuccinic anhydride (10) - Synthesis example 2 Polysiloxane (PSL-2) solution Diphenyldimethoxysilane (47.5) dimethyldimethoxysilane (20) 3-Methylpropenoxypropyltrimethoxysilane (17.5) 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane (5) 3-Trimethoxysilylpropylsuccinic anhydride (10) - Synthesis example 3 Polysiloxane (PSL-3) solution Diphenyldimethoxysilane (50) Methyltrimethoxysilane (25) 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane (10) Tetraethoxysilane (15)

[0218] Synthesis Example 4: Green Organic Fluorescent Particles 3,5-Dibromobenzaldehyde (3.0 g), 4-tert-butylphenylboronic acid (5.3 g), tetrakis(triphenylphosphine)palladium (0) (0.4 g), and potassium carbonate (2.0 g) were placed in a flask and purged with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added, and the mixture was refluxed for 4 hours. The reaction solution was cooled to room temperature, and after separation, the organic layer was washed with saturated brine. The organic layer was dried with magnesium sulfate, filtered, and the solvent was removed by distillation. The obtained reaction product was purified by silicone column chromatography to obtain a white solid of 3,5-bis(4-tert-butylphenyl)benzaldehyde (3.5 g). Next, 1.5 g of 3,5-bis(4-tert-butylphenyl)benzaldehyde and 0.7 g of 2,4-dimethylpyrrole were placed in a flask, and 200 mL of dehydrated dichloromethane and 1 drop of trifluoroacetic acid were added. The mixture was stirred under nitrogen for 4 hours. A solution of 0.85 g of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone in dehydrated dichloromethane was added to the reaction mixture, and the mixture was stirred for 1 hour. After the reaction was complete, 7.0 mL of boron trifluoride diethyl ether complex and 7.0 mL of diisopropylethylamine were added, and the mixture was stirred for 4 hours. Then, 100 mL of water was added and stirred, and the organic layer was separated. The organic layer was dried with magnesium sulfate, filtered, and the solvent was removed by distillation. The obtained reaction product was purified by silicone column chromatography to obtain 0.4 g of green powder (yield 17%). The 1H-NMR analysis results of the obtained green powder are as follows, thus confirming that the green powder obtained above is represented by the following structural formula [G-1].

[0219] 1H-NMR (CDCl 3(d=ppm)): 7.95(s, 1H), 7.63-7.48(m, 10H), 6.00(s, 2H), 2.58(s, 6H), 1.50(s, 6H), 1.37(s, 18H).

[0220] [Chemistry 8]

[0221] Synthesis Example 5: Red Organic Fluorescent Particle A mixed solution of 300 mg of 4-(4-tert-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoxyl chloride, and 10 ml of toluene was heated at 120 °C for 6 hours under a nitrogen stream. After cooling to room temperature, the solvent was evaporated. The residue was washed with 20 ml of ethanol and dried under vacuum to obtain 260 mg of 2-(2-methoxybenzoxyl)-3-(4-tert-butylphenyl)-5-(4-methoxyphenyl)pyrrole. Next, under a nitrogen stream, a mixture of 260 mg of 2-(2-methoxybenzoyl)-3-(4-tert-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 180 mg of 4-(4-tert-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride, and 10 ml of degassed toluene was heated at 125°C for 7 hours. After cooling the reaction mixture to room temperature, 20 ml of water was added, and extraction was performed using 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, evaporated, and then vacuum dried to obtain the pyrrole methylene body as a residue. Next, under a nitrogen stream, 305 mg of diisopropylethylamine and 670 mg of a boron trifluoride diethyl ether complex were added to the obtained pyrrole methylene body and 10 ml of toluene, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was added to the reaction mixture, and extraction was performed using 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried with magnesium sulfate, and then evaporated. Purification was performed by silicone column chromatography, followed by vacuum drying to obtain 0.27 g of a purplish-red powder (70% yield). The 1H-NMR analysis results of the obtained purplish-red powder are shown below, confirming that the obtained purplish-red powder is represented by the following structural formula [R-1].

[0222] 1H-NMR (CDCl 3(d=ppm)): 1.19(s, 18H), 3.42(s, 3H), 3.85(s, 6H), 5.72(d, 1H), 6.20(t, 1H), 6.42-6.97(m, 16H), 7.89(d, 4H).

[0223] [Chemistry 9]

[0224] Example 1: Resin composition for partition walls (P-1) 5.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd. (hereinafter "CR-97")) as white pigment, 0.03 g of blue pigment (Pigment Blue 15:6N (hereinafter "PB15:6N")) as opaque pigment, 0.02 g of purple pigment (Pigment Violet 23 (hereinafter "PV23")) as purple pigment, 1.00 g of phosphate polyester ("DISPERBYK" (registered trademark)-111; manufactured by BYK-Chemie Japan (hereinafter "DISPERBYK)-111") as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a grinding disperser filled with zirconia beads to obtain a pigment dispersion (MW-1). In addition, 0.20 g of an organosilver compound (silver neodecanoate), which is a yellow precursor compound, was dissolved in 1.80 g of EDM to obtain a yellow precursor compound solution (YZ-1).

[0225] Next, 9.41 g of the polysiloxane (PSL-1) solution obtained by Synthesis Example 1, 6.03 g of the pigment dispersion (MW-1), 1.00 g of the yellow precursor compound solution (YZ-1), 0.025 g of tert-butylhydroquinone as a reducing agent, and 0.200 g of acetone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyloxime) ("Irgacure" (registered trademark) OXE-02, manufactured by BASF Japan (hereinafter "OXE-2")) were prepared as a photopolymerization initiator. g, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Irgacure" 819, manufactured by BASF Japan (hereinafter "Irgacure-819")) 0.200 g, dipentaerythritol hexaacrylate as a photopolymerizable compound ("KAYARAD" (registered trademark) DPHA, manufactured by Shin Nippon Pharmaceutical Co., Ltd. (hereinafter "DPHA")) 2.00 g, and a photopolymerizable fluorinated compound as a repellent compound ("Megafac" (registered trademark) RS-72A, 20% by weight PGMEA diluted solution, manufactured by DIC (hereinafter "RS-72A")) 0.25 g. 0.020 g of PGMEA 10% by weight diluted solution (equivalent to a concentration of 500 ppm) of an acrylic surfactant ("BYK" 352, manufactured by BYK-Chemie Japan) was dissolved in 0.76 g of solvent PGMEA and stirred. The mixture was then filtered through a 5.0 μm filter to obtain a septum resin composition (P-1).

[0226] Example 2: Resin composition for partition walls (P-2) 5.00 g of CR-97 as white pigment, 0.015 g of PB15:6N as opaque pigment, 0.035 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-2). The pigment dispersion (MW-2) was used instead of the pigment dispersion (MW-1), and the septum resin composition (P-2) was obtained in the same manner as in Example 1.

[0227] Example 3: Resin composition for partition walls (P-3) 5.00 g of CR-97 as white pigment, 0.035 g of PB15:6N as opaque pigment, 0.015 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain pigment dispersion (MW-3). Pigment dispersion (MW-3) was used instead of pigment dispersion (MW-1), and the septum resin composition (P-3) was obtained in the same manner as in Example 1.

[0228] Example 4: Resin composition for partition walls (P-4) 5.00 g of CR-97 as white pigment, 0.008 g of PB15:6N as opaque pigment, 0.043 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-4). The pigment dispersion (MW-4) was used instead of the pigment dispersion (MW-1), and the septum resin composition (P-4) was obtained in the same manner as in Example 1.

[0229] Example 5: Resin composition for partition walls (P-5) 5.00 g of CR-97 as white pigment, 0.043 g of PB15:6N as opaque pigment, 0.008 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-5). The pigment dispersion (MW-5) was used instead of the pigment dispersion (MW-1), and the septum resin composition (P-5) was obtained in the same manner as in Example 1.

[0230] Example 6: Resin composition for partition walls (P-6) 5.00 g of CR-97 as white pigment, 0.060 g of PB15:6N as opaque pigment, 0.040 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-6). 6.06 g of pigment dispersion (MW-6) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.34 g, and the amount of PGMEA added was set to 0.81 g. Otherwise, a septum resin composition (P-6) was obtained in the same manner as in Example 1.

[0231] Example 7: Resin composition for partition walls (P-7) 5.00 g of CR-97 as white pigment, 0.10 g of PB15:6N as opaque pigment, 0.067 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-7). 6.10 g of pigment dispersion (MW-7) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.24 g, and the amount of PGMEA added was set to 0.87 g. Otherwise, a septum resin composition (P-7) was obtained in the same manner as in Example 1.

[0232] Example 8: Resin composition for partition walls (P-8) 5.00 g of CR-97 as white pigment, 0.36 g of PB15:6N as opaque pigment, 0.24 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-8). 6.36 g of pigment dispersion (MW-8) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 8.59 g, and the amount of PGMEA added was set to 1.26 g. Otherwise, a septum resin composition (P-8) was obtained in the same manner as in Example 1.

[0233] Example 9: Resin composition for partition walls (P-9) 5.00 g of CR-97 as white pigment, 0.020 g of PB15:6N as opaque pigment, 0.013 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-9). 6.02 g of pigment dispersion (MW-9) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.44 g, and the amount of PGMEA added was set to 0.75 g. Otherwise, a diaphragm resin composition (P-9) was obtained in the same manner as in Example 1.

[0234] Example 10: Resin composition for partition walls (P-10) 5.00 g of CR-97 as white pigment, 0.010 g of PB15:6N as opaque pigment, 0.0067 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-10). 6.01 g of pigment dispersion (MW-10) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.46 g, and the amount of PGMEA added was set to 0.73 g. Otherwise, a resin composition for the partition wall (P-10) was obtained in the same manner as in Example 1.

[0235] Example 11 Resin composition for partition walls (P-11) 5.00 g of CR-97 as white pigment, 0.00050 g of PB15:6N as opaque pigment, 0.00033 g of PV23 as purple pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-11). 6.00 g of pigment dispersion (MW-11) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.49 g, and the amount of PGMEA added was set to 0.72 g. Otherwise, a resin composition for the partition wall (P-11) was obtained in the same manner as in Example 1.

[0236] Example 12 Resin composition for partition walls (P-12) As the yellow precursor compound, a 10% PGMEA solution of the organosilver compound (APAG-01) obtained in Preparation Example 8 (described later) was used instead of the yellow precursor compound solution (YZ-1). The amount of PGMEA added was set to 0.063 g, and 0.70 g of EDM was added. Otherwise, the resin composition for the partition wall (P-12) was obtained in the same manner as in Example 1.

[0237] Example 13 Resin composition for partition walls (P-13) 0.20 g of an organocopper compound (copper neodecanoate), serving as a yellow precursor compound, was dissolved in 1.80 g of EDM to obtain a yellow precursor compound solution (YZ-2). The yellow precursor compound solution (YZ-2) was used instead of the yellow precursor compound solution (YZ-1), and otherwise, the septum resin composition (P-13) was obtained in the same manner as in Example 1.

[0238] Example 14 Resin composition for partition walls (P-14) 0.20 g of a phenolic compound (1,4-dihydroxyanthraquinone), serving as a yellow precursor compound, was dissolved in 1.80 g of EDM to obtain a yellow precursor compound solution (YZ-3). 7.13 g of a polysiloxane (PSL-1) solution, 4.82 g of MW-1, 2.40 g of the aforementioned yellow precursor compound solution (YZ-3), 0.020 g of tributylhydroquinone, 0.160 g of OXE-02, 0.160 g of Omnirad-819, 1.60 g of DPHA, 0.20 g of RS-72A, 0.016 g of Celloxide 2021P, and 0.10 g of a 10% by weight diluted solution of BYK-352 in PGMEA were dissolved in 3.40 g of solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain the septum resin composition (P-14).

[0239] Example 15 Resin composition for partition walls (P-15) As a yellow precursor compound, 1.60 g of a yellow precursor compound solution (YZ-1) was added instead of the yellow precursor compound solution (YZ-3), the amount of polysiloxane (PSL-1) solution added was set to 7.33 g, and the amount of PGMEA added was set to 4.00 g. Otherwise, the resin composition for the partition wall (P-15) was obtained in the same manner as in Example 14.

[0240] Example 16 Resin composition for partition walls (P-16) The amount of yellow precursor compound solution (YZ-1) added was set to 4.80 g, the amount of polysiloxane (PSL-1) solution added was set to 6.53 g, and the amount of PGMEA added was set to 1.60 g. Otherwise, the resin composition for the partition wall (P-16) was obtained in the same manner as in Example 15.

[0241] Example 17 Resin composition for partition walls (P-17) The amount of yellow precursor compound solution (YZ-1) added was set to 0.50 g, the amount of polysiloxane (PSL-1) solution added was set to 9.54 g, and the amount of PGMEA added was set to 1.14 g. Otherwise, the resin composition for the partition wall (P-17) was obtained in the same manner as in Example 1.

[0242] Example 18 Resin composition for partition walls (P-18) The amount of yellow precursor compound solution (YZ-1) added was set to 0.080 g, the amount of polysiloxane (PSL-1) solution added was set to 9.64 g, and the amount of PGMEA added was set to 1.45 g. Otherwise, the resin composition for the partition wall (P-18) was obtained in the same manner as in Example 1.

[0243] Example 19 Resin composition for partition walls (P-19) The resin composition for the partition wall (P-19) was obtained in the same manner as in Example 1, except that ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate] ("IRGANOX" (registered trademark) 1010, manufactured by BASF Japan (hereinafter "IRGANOX" (registered trademark) 1010"), which is a polymerization inhibitor, was added to replace the reducing agent tributylhydroquinone.

[0244] Example 20: Resin composition for partition walls (P-20) 5.00 g of CR-97 as white pigment, 0.030 g of PB15:6N as opaque pigment, 0.020 g of PV23 as purple pigment, 1.00 g of DISPERBYK-109 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a grinding disperser filled with zirconia beads to obtain pigment dispersion (MW-12). Pigment dispersion (MW-12) was added to replace pigment dispersion (MW-1), otherwise, a septum resin composition (P-20) was obtained in the same manner as in Example 1.

[0245] Example 21 Resin composition for partition walls (P-21) As the resin, a polysiloxane (PSL-2) solution was added instead of a polysiloxane (PSL-1) solution, otherwise the resin composition for the partition wall (P-21) was obtained in the same manner as in Example 1.

[0246] Example 22 Resin composition for partition walls (P-22) 5.00 g of CR-97 as white pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGEMA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-13). 6.00 g of pigment dispersion (MW-13) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.49 g, and the amount of PGEMA added was set to 0.72 g. Otherwise, a diaphragm resin composition (P-22) was obtained in the same manner as in Example 1.

[0247] Example 23 Resin composition for partition walls (P-23) 5.00 g of CR-97 as white pigment, 0.050 g of PV23 as opaque pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-14). Pigment dispersion (MW-14) was added to replace the pigment dispersion (MW-1), otherwise, a septum resin composition (P-23) was obtained in the same manner as in Example 1.

[0248] Example 24 Resin composition for partition walls (P-24) 5.00 g of CR-97 as white pigment, 0.050 g of PB15:6N as opaque pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-15). Pigment dispersion (MW-15) was added to replace the pigment dispersion (MW-1), otherwise, a septum resin composition (P-24) was obtained in the same manner as in Example 1.

[0249] Example 25 Resin composition for partition walls (P-25) 5.00 g of titanium dioxide pigment (PFC105; manufactured by Ishihara Sangyo Co., Ltd. (hereinafter "PFC105")) as white pigment, 0.030 g of blue pigment PB15:6N as opaque pigment, 0.020 g of purple pigment PV23, 1.00 g of dispersant DISPERBYK-111, and 4.00 g of solvent PGMEA were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-16). Pigment dispersion (MW-16) was added to replace the pigment dispersion (MW-1), otherwise, a septum resin composition (P-25) was obtained in the same manner as in Example 1.

[0250] Example 26 Resin composition for partition walls (P-26) 5.00 g of titanium dioxide pigment (R960; manufactured by Ishihara Sangyo Co., Ltd. (hereinafter "R960")) as white pigment, 0.030 g of blue pigment PB15:6N as opaque pigment, 0.020 g of purple pigment PV23, 1.00 g of dispersant DISPERBYK-111, and 4.00 g of solvent PGMEA were mixed and dispersed using a grinding disperser filled with zirconia beads to obtain a pigment dispersion (MW-17). Pigment dispersion (MW-17) was added to replace the pigment dispersion (MW-1), otherwise, a septum resin composition (P-26) was obtained in the same manner as in Example 1.

[0251] Example 27 Resin composition for partition walls (P-27) A 10.4 g solution of polysiloxane (PSL-3), 6.03 g of MW-1, 1.00 g of a yellow precursor compound solution (YZ-1), 0.025 g of tributylhydroquinone, 2.00 g of THP-17 (trade name, manufactured by Toyo Gosei Kogyo Co., Ltd.) as a quinone diazide compound, 0.25 g of RS-72A, 0.020 g of Celloxide 2021P, and 0.10 g of BYK-352 in a 10% by weight diluted PGMEA solution was dissolved in 0.16 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a septum resin composition (P-27).

[0252] Comparative Example 1: Resin composition for partition walls (P-28) 0.030 g of blue pigment PB15:6N as an opaque pigment, 0.020 g of purple pigment PV23, 1.00 g of dispersant DISPERBYK-111, and 4.00 g of solvent PGMEA were mixed and dispersed using a grinding disperser filled with zirconia beads to obtain a pigment dispersion (MW-18). 13.4 g of polysiloxane (PSL-1) solution, 2.42 g of MW-18, 0.80 g of yellow precursor compound solution (YZ-1), 0.16 g of OXE-02, 0.16 g of Omnirad-819, 0.020 g of tributylhydroquinone, 1.60 g of DPHA, 0.20 g of RS-72A, 0.016 g of Celloxide 2021P, and 0.10 g of a 10% by weight diluted solution of BYK-352 PGMEA were dissolved in 1.00 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain the septum resin composition (P-28).

[0253] Comparative Example 2: Resin composition for partition walls (P-29) Without adding the yellow precursor compound solution (YZ-1), the amount of polysiloxane (PSL-1) solution added was set to 9.66 g, and the amount of PGMEA added was set to 1.51 g. Otherwise, the resin composition for the partition wall (P-29) was obtained in the same manner as in Example 1.

[0254] Comparative Example 3: Resin composition for partition walls (P-30) 5.00 g of CR-97 as white pigment, 0.033 g of titanium nitride as opaque pigment, 1.00 g of DISPERBYK-111 as dispersant, and 4.00 g of PGMEA as solvent were mixed and dispersed using a milling disperser filled with zirconia beads to obtain a pigment dispersion (MW-19). 6.02 g of pigment dispersion (MW-19) was added instead of the pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution added was set to 9.42 g, and the amount of PGMEA added was set to 0.75 g. Otherwise, a resin composition for the partition wall (P-30) was obtained in the same manner as in Example 1. The composition of Examples 1 to 27 and Comparative Examples 1 to 3 is summarized in Table 2.

[0255] [Table 2-1] [Table 2-1] Partition resin composition resin (weight%) Photosensitive agent (weight%) White pigment Yellow precursor compounds (weight%) Opaque pigments reducing agent (weight%) Phosphate Polyester (weight%) Dissolving compound (weight%) Photopolymer compounds (weight%) solvent (weight%) Other additives (by weight %) pigment (weight%) Surface treatment Blue pigment (weight%) Purple pigment (weight%) The weight ratio of blue pigment to purple pigment Other opaque pigments (weight%) Polymer inhibitors Adhesion modifier surfactants Example 1 P-1 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 2 P-2 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.05) PV23(0.11) 30 / 70 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 3 P-3 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.11) PV23(0.05) 70 / 30 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 4 P-4 PSL-1(18.8) OXE-02 (1.0) Ominilad (Omnirad)-819(1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.02) PV23(0.13) 15 / 85 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 5 P-5 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.13) PV23(0.02) 85 / 15 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 6 P-6 PSL-1(18.7) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.18) PV23(0.12) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 7 P-7 PSL-1(18.5) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.30) PV23(0.20) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 8 P-8 PSL-1(17.2) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(1.08) PV23(0.72) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 9 P-9 PSL-1(18.9) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.06) PV23(0.04) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 10 P-10 PSL-1(18.9) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.03) PV23(0.02) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 11 P-11 PSL-1(19.0) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.002) PV23(0.001) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm)

[0256] [Table 2-2] [Table 2-2] Partition resin composition resin (weight%) Photosensitive agent (weight%) White pigment Yellow precursor compounds (weight%) Opaque pigments reducing agent (weight%) Phosphate Polyester (weight%) Dissolving compound (weight%) Photopolymerizable compounds (wt%) solvent (weight%) Other additives (by weight %) pigment (weight%) Surface treatment Blue pigment (by weight) Purple pigment (by weight %) The weight ratio of blue pigment to purple pigment Other opaque pigments (weight%) Polymer inhibitors Adhesion modifier surfactants Example 12 P-12 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ APAG-1 (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (45) EDM (5) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 13 P-13 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Copper neodecanoate (0.5g) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 14 P-14 PSL-1(17.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ 1,4-Dihydroxyanthraquinone (1.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (49) EDM (11) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 15 P-15 PSL-1(18.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (1.0) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (53) EDM (7) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 16 P-16 PSL-1(16.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (3.0) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (38) EDM (twenty two) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 17 P-17 PSL-1(19.1) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.25) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (48) EDM (2) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 18 P-18 PSL-1(19.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.04) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (49.6) EDM (0.4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 19 P-19 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - - Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) IRGANOX 1010 (0.13) Celloxide 2021P (0.10) BYK-352 (500 ppm)

[0257] [Table 2-3] [Table 2-3] Partition resin composition Resin (by weight %) Photosensitive agent (weight %) White pigment Yellow precursor compounds (wt%) Opaque pigments Reducing agent (weight %) Phosphate polyester (weight %) Dissolving compound (by weight %) Photopolymerizable compounds (wt%) Solvent (weight%) Other additives (by weight %) Pigment (by weight %) Surface treatment Blue pigment (by weight) Purple pigment (by weight %) The weight ratio of blue pigment to purple pigment Other opaque pigments (by weight %) Polymer inhibitors Adhesion modifier surfactants Example 20 P-20 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-109 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 21 P-21 PSL-2(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 22 P-22 PSL-1(19.0) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) - - - - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 23 P-23 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) - PV23(0.15) 0 / 100 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 24 P-24 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.15) - 100 / 0 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 25 P-25 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) PFC105 (15.0) Al₂O₃ / ZrO₂ / SiO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 26 P-26 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) R960(15.0) Al₂O₃ / SiO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 27 P-27 PSL-3(20.8) THP-17(10) CR-97 (15.0) Al₂O₃ / ZrO₂ Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) - PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Comparative Example 1 P-28 PSL-1(33.8) OXE-02 (1.0) Omnirad-819 (1.0) - - Silver neodecanoate (0.5) PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Comparative Example 2 P-29 PSL-1(19.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ - PB15:6N(0.09) PV23(0.06) 60 / 40 - Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA(50) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Comparative Example 3 P-30 PSL-1(18.9) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al₂O₃ / ZrO₂ - - - - TiN (0.10%) Tertiary butylhydroquinone (0.13) Disperbyk-111 (3.0) RS-72A(0.25) DPHA(10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm)

[0258] Preparation Example 1: Color-changing luminescent material composition (CL-1) A mixture of 20 parts by weight of a 0.5% toluene solution of green quantum dot material (Lumidot 640 CdSe / ZnS, average particle size 6.3 nm: manufactured by Aldrich), 45 parts by weight of DPHA, 5 parts by weight of Irgacure 907 (manufactured by BASF Japan), 166 parts by weight of a 30% PGMEA solution of acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko), and 97 parts by weight of toluene was stirred until uniformly dissolved. The resulting mixture was filtered through a 0.45 μm syringe filter to prepare the color-changing luminescent material composition (CL-1).

[0259] Preparation Example 2: Color-changing luminescent material composition (CL-2) The green quantum dot material was replaced with 0.4 parts by weight of the green phosphor G-1 obtained by synthesis example 4, and the amount of toluene added was changed to 117 parts by weight. Otherwise, the color-changing luminescent material composition (CL-2) was prepared in the same manner as in preparation example 1.

[0260] Preparation Example 3: Color-changing luminescent material composition (CL-3) The green quantum dot material was replaced with 0.4 parts by weight of the red phosphor R-1 obtained by synthesis example 5, and the amount of toluene added was changed to 117 parts by weight. Otherwise, the color-changing luminescent material composition (CL-3) was prepared in the same manner as in preparation example 1.

[0261] Preparation Example 4: Color Filter Forming Material (CF-1) A slurry was prepared by mixing 90 g of CI Pigment Green 59, 60 g of CI Pigment Yellow 150 g of polymeric dispersant ("BYK-6919", a registered trademark manufactured by BYK-Chemie, Inc., hereinafter "BYK-6919"), 100 g of binder resin ("ADEKA ARKLS", a registered trademark manufactured by ADEKA), and 675 g of PGMEA. A beaker containing the slurry was connected to a Dyno-Mill mill via a tube, and dispersion was carried out at a circumferential speed of 14 m / s for 8 hours using 0.5 mm diameter zirconia beads as the medium to prepare Pigment Green 59 dispersion (GD-1).

[0262] The following ingredients were used: 56.54 g of Pigment Green 59 dispersion (GD-1), 3.14 g of acrylic resin ("Cyclomer" (registered trademark) P(ACA)Z250 (trade name) Daicel-Allnex (stock) (hereinafter "P(ACA)Z250")), 2.64 g of DPHA, 0.330 g of photopolymerization initiator ("Optomer" (registered trademark) NCI-831 (trade name) ADEKA (stock) (hereinafter "NCI-831")), 0.04 g of surfactant ("BYK" (registered trademark) -333 (trade name) BYK-Chemie (stock) (hereinafter "BYK-333")), 0.01 g of BHT as a polymerization inhibitor, and 37.30 g of PGMEA as a solvent. Mix and produce color filter forming material (CF-1).

[0263] Preparation Example 5: Resin Composition for Light-Shielding Partitions A slurry was prepared by mixing 150 g of carbon black (MA100, manufactured by Mitsubishi Chemical Co., Ltd.), 75 g of polymeric dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA. A beaker containing the slurry was connected to a Dieno mill via a tube, and dispersion was carried out for 8 hours at a circumferential speed of 14 m / s using 0.5 mm diameter zirconia beads as the dispersion medium to produce a pigment dispersion (MB-1).

[0264] A resin composition for light-shielding partitions was prepared by mixing 56.54 g of pigment dispersion (MB-1), 3.14 g of P(ACA)Z250, 2.64 g of DPHA, 0.330 g of NCI-831, 0.04 g of BYK-333, 0.01 g of tert-butylcatechol as a polymerization inhibitor, and 37.30 g of PGMEA.

[0265] Preparation Example 6: Organosilver Compound (APAG-1) 5.0 g of a 30% PGMEA solution of SPCR-10P (trade name, manufactured by Showa Denko Co., Ltd.), which is a (meth)acrylic acid polymer solution, was dissolved in 5.0 g of acetone. 0.0555 g of diethanolamine (1.5 molar equivalents relative to the (meth)acrylic acid polymer) was added dropwise, and the mixture was stirred at room temperature for 1 hour to generate an amine salt of the (meth)acrylic acid polymer solution. Next, 0.0287 g of silver nitrate (I) was added to this solution, and the mixture was stirred at room temperature for 1 hour, resulting in precipitation. After filtration through a 5.0 μm filter, PGMEA was added at a solids content of 10% to obtain an organosilver compound (APAG-1).

[0266] Examples 28-54, Comparative Examples 4-6 A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass, 0.7 mm thick; hereinafter the same) was used as the substrate. The septum resin composition shown in Tables 2-4 was spin-coated onto the substrate, and the substrate was dried at 80°C for 3 minutes using a heated plate (trade name SCW-636, manufactured by Dai Nippon Screen Manufacturing, hereinafter the same) to create a dried film. The dried film was then exposed using a parallel light mask aligned with an exposure machine (trade name PLA-501F, manufactured by Canon, hereinafter the same), with an ultra-high pressure mercury lamp as the light source, a septum, and an exposure dose of 300 mJ / cm² (gamma rays, h-rays, i-rays). Subsequently, an automatic developing apparatus (AD-2000, manufactured by Takizawa Sangyo, hereinafter the same) was used for 100 seconds of spray development with a 0.045% by weight potassium hydroxide aqueous solution, followed by a 30-second rinse with water. Then, using an oven (trade name IHPS-222, manufactured by Espec (stock); the same applies below), heating in air at 230°C for 30 minutes, a grid pattern of partitions with a height of 10 μm and a width of 20 μm is formed on the glass substrate.

[0267] In the region separated by the partitions of the obtained partitioned substrate, the color-changing luminescent material composition shown in Tables 3 and 4 is coated by inkjet printing under nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm, thus obtaining the partitioned substrate with the structure shown in Figure 2.

[0268] Example 55 A 10 cm square alkali-free glass substrate was used as the base substrate. A spacer resin composition (P-27) was spin-coated onto the substrate, and the film was dried at 80°C for 3 minutes using a heated plate to create a dried film. The dried film was then exposed to an exposure machine using a parallel light mask aligned with the exposure unit, with an ultra-high pressure mercury lamp as the light source, through a photomask, at an exposure dose of 300 mJ / cm² (gamma rays, h- rays, i- rays). Subsequently, an automatic developing apparatus was used, with a 90-second spray development using a 2.38 wt% tetramethylammonium hydroxide aqueous solution, followed by a 30-second rinse with water. Afterwards, similarly, without a photomask, the film was exposed to an exposure dose of 500 mJ / cm² (gamma rays, h- rays, i- rays) and then bleached. Then, using an oven, the glass substrate is heated at 230°C for 30 minutes to form a grid pattern of partitions with a height of 10 μm and a width of 20 μm, with a short side spacing of 80 μm and a long side spacing of 280 μm.

[0269] In the region separated by the partitions of the obtained partitioned substrate, a color-changing luminescent material composition (CL-2) was coated by inkjet printing under a nitrogen atmosphere and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm, thus obtaining the partitioned substrate with the structure shown in Figure 2.

[0270] Example 56 A 10 cm square alkali-free glass substrate was used as the base substrate. The light-shielding partition material obtained in Preparation Example 5 was spin-coated onto the substrate, and dried at 90°C for 2 minutes using a heated plate to create a dried film. The dried film was then exposed to light using a parallel light mask aligned with an exposure machine, with an ultra-high pressure mercury lamp as the light source, and a photomask as the medium, at an exposure dose of 40 mJ / cm² (gamma rays, h-rays, i-rays). Subsequently, an automatic developing apparatus was used to develop the film with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, followed by a 30-second rinse with water. Finally, the film was heated in an oven at 230°C for 30 minutes to obtain a substrate with light-shielding partitions. The partitions, 2.0 μm high, 20 μm wide, and with an OD value of 2.0 per 1.0 μm thickness, were formed on the glass substrate in a grid pattern with a short side spacing of 40 μm and a long side spacing of 280 μm.

[0271] Subsequently, using the same method as in Example 29, a substrate with partitions was obtained, wherein partitions with a height of 10 μm and a width of 20 μm were formed in a grid pattern similar to the light-shielding partitions with a short side spacing of 40 μm and a long side spacing of 280 μm. In the area separated by the partitions of the obtained substrate with partitions, the color-changing luminescent material composition (CL-2) obtained by Preparation Example 2 was coated by inkjet printing under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm, thereby obtaining a substrate with partitions as shown in FIG3.

[0272] Example 57 The color filter forming material (CF-1) obtained in Preparation Example 4 was coated onto the area separated by the partitions of the partitioned substrate before pixel formation, obtained by the same method as in Example 29, with a hardened film thickness of 2.5 μm, and then vacuum dried. A photomask designed to expose the area of ​​the opening of the partitioned substrate was exposed at an exposure dose of 40 mJ / cm² (gamma rays, h- rays, i- rays). After development with a 0.3% wt% tetramethylammonium aqueous solution for 50 seconds, it was heat-cured at 230°C for 30 minutes to form a color filter layer with a height of 2.5 μm, a short side of 40 μm, and a long side of 280 μm in the area separated by the partitions. Subsequently, the color-changing luminescent material composition (CL-2) obtained by Preparation Example 2 was coated onto the color filter under a nitrogen atmosphere using an inkjet method, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm, thus obtaining a partitioned substrate with the structure shown in FIG4. The structures of each embodiment and comparative example are shown in Tables 3 and 4.

[0273] [Table 3] [Table 3] Partition resin composition next door pixel Blackout partition Color filter layer Resin content (weight%) White pigment content (weight%) Total content of blue and purple pigments (weight%) Theoretical content of silver oxide and / or silver particles (weight%) Other opaque pigment content (weight%) Color-changing luminescent material composition Pixel height (μm) Height of the light-shielding partition (μm) Color filter height (μm) Example 28 P-1 37.7 30 0.3 1.0 - CL-1 5.0 - - Example 29 P-1 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 30 P-2 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 31 P-3 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 32 P-4 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 33 P-5 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 34 P-6 37.4 30 0.6 1.0 - CL-2 5.0 - - Example 35 P-7 37.0 30 1.0 1.0 - CL-2 5.0 - - Example 36 P-8 34.4 30 3.6 1.0 - CL-2 5.0 - - Example 37 P-9 37.8 30 0.2 1.0 - CL-2 5.0 - - Example 38 P-10 37.9 30 0.1 1.0 - CL-2 5.0 - - Example 39 P-11 37.9 30 0.005 1.0 - CL-2 5.0 - - Example 40 P-12 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 41 P-13 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 42 P-14 35.6 30 0.3 3.0 - CL-2 5.0 - - Example 43 P-15 36.6 30 0.3 2.0 - CL-2 5.0 - -

[0274] [Table 4] [Table 4] Partition resin composition next door pixel Blackout partition Color filter layer Resin content (weight%) White pigment content (weight%) Total content of blue and purple pigments (weight%) Theoretical content of silver oxide and / or silver particles (weight%) Other opaque pigment content (weight%) Color-changing luminescent material composition Pixel height (μm) Height of the blackout partition (μm) Color filter height (μm) Example 44 P-16 32.6 30 0.3 6.0 - CL-2 5.0 - - Example 45 P-17 38.2 30 0.3 0.5 - CL-2 5.0 - - Example 46 P-18 38.6 30 0.3 0.1 - CL-2 5.0 - - Example 47 P-19 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 48 P-20 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 49 P-21 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 50 P-22 38.0 30 - 1.0 - CL-2 5.0 - - Example 51 P-23 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 52 P-24 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 53 P-25 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 54 P-26 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 55 P-27 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 56 P-1 37.7 30 0.3 1.0 - CL-2 5.0 2.0 - Example 57 P-1 37.7 30 0.3 1.0 - CL-2 5.0 - 2.5 Comparative Example 4 P-28 67.6 - 0.3 1.0 - CL-2 5.0 - - Comparative Example 5 P-29 38.7 30 0.3 - - CL-2 5.0 - - Comparative Example 6 P-30 37.8 30 - 1.0 0.2 CL-2 5.0 - -

[0275] The following describes the evaluation methods for each embodiment and comparative example.

[0276] <Height> Regarding each layer of the partitioned substrate obtained by the various embodiments and comparative examples, the film thickness before and after the formation of each layer was measured using a SURFCOM stylus film thickness measuring device, and the difference was calculated to determine the height.

[0277] Crack resistance The spacer-forming resin compositions used in the various embodiments and comparative examples were spin-coated to achieve film thicknesses of 10 μm, 15 μm, 20 μm, and 25 μm, respectively. Following the steps of the spacer-forming resin compositions used in Examples 28-54, Examples 56-57, and Comparative Examples 4-6, the entire film was exposed without a photomask during exposure; otherwise, processing was performed under the same conditions as in the embodiments and comparative examples to form an integral film on a glass substrate. Following the steps of the spacer-forming resin composition used in Example 55, the entire film was developed without exposure and then bleached; otherwise, processing was performed under the same conditions to form an integral film on a glass substrate. The obtained integral film was used as a model of the spacer of the spacer-bearing substrate obtained by the embodiments and comparative examples. The glass substrate with the integral film was visually observed to evaluate the presence of cracks in the integral film. Even if only one crack was found, it was determined that the film thickness lacked crack resistance. For example, if there are no cracks at a film thickness of 15 μm but cracks at a film thickness of 20 μm, the crack-resistant film thickness is defined as "≥15 μm". In addition, the crack-resistant film thickness that has no cracks even at 25 μm is defined as "≥25 μm", and the crack-resistant film thickness that has cracks even at 10 μm is defined as "<10 μm", and these are used as crack resistance.

[0278] <resolution> The septum resin composition used in the various embodiments and comparative examples was spin-coated onto a 10 cm square alkali-free glass substrate to achieve a film thickness of 10 μm after heating. The film was then dried at 100°C for 3 minutes using a heating plate to produce a 10 μm thick dried film. For the prepared dried film, a parallel light mask was aligned with an exposure machine, and an ultra-high pressure mercury lamp was used as the light source. The mask, containing lines and spatial patterns of widths of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm, and 20 μm, was exposed at an exposure dose of 150 mJ / cm² (gamma rays, h- rays, i- rays) with a 100 μm gap. Subsequently, an automatic developing apparatus was used, employing a 0.045 wt% potassium hydroxide aqueous solution for 100 seconds of spray development, followed by a 30-second rinse with water.

[0279] <Reflectivity> For the partition-forming resin compositions used in Examples 28 to 54, Examples 56 to 57, and Comparative Examples 4 to 6, the entire area was exposed without using a photomask during exposure, and other than this, processing was performed under the same conditions as in each of the Examples and Comparative Examples, and an integral film with a height of 10 μm was formed on a glass substrate. Regarding the partition-forming resin composition used in Example 55, development was performed without exposure and then bleaching was performed, and other than this, processing was performed under the same conditions, and an integral film with a height of 10 μm was formed on a glass substrate.

[0280] Regarding the obtained glass substrate with an integral film, a spectrophotometer (trade name CM-2600d, manufactured by Konica Minolta Co., Ltd.) was used, and the reflectance in the wavelength range of 360 nm to 740 nm was measured from the integral film side using the SCI mode. The minimum and maximum reflectance values within the wavelength range of 430 nm to 630 nm were respectively designated as the "minimum reflectance" and the "maximum reflectance".

[0281] <OD value> As a model of the partition of the partitioned substrate obtained by each of the Examples and Comparative Examples, an integral film with a height of 10 μm was formed on a glass substrate in the same manner as in the evaluation of the reflectance. Regarding the obtained glass substrate with an integral film, a spectrophotometer (U-4100 manufactured by Hitachi High-Technologies Corporation) was used to measure the transmittance in the wavelength range of 360 nm to 740 nm, and the OD value in the wavelength range of 360 nm to 740 nm was calculated using the formula (1) described above. The minimum and maximum OD values within the wavelength range of 430 nm to 630 nm were respectively designated as the "minimum OD value" and the "maximum OD value".

[0282] In addition, regarding Example 56, as a model of the light-shielding partition (A-2), an integral film was similarly formed on a glass substrate. Regarding the obtained glass substrate with an integral film, a spectrophotometer (U-4100 manufactured by Hitachi High-Technologies Corporation) was used to measure the transmittance in the wavelength range of 360 nm to 740 nm, and the OD value at a wavelength of 550 nm was calculated using the formula (1) described above.

[0283] <Chromaticity> As a model of the partition of the partitioned substrate obtained by the various embodiments and comparative examples, a monolithic film with a height of 10 μm was fabricated on a glass substrate in the same manner as for the evaluation of reflectivity. Regarding the obtained glass substrate with the monolithic film, colorimetry (L*, a*, and b* values) was measured from the monolithic film side using SCI mode using a spectrophotometer (trade name CM-2600d, manufactured by Konica Minolta, Inc.). Furthermore, regarding the b* value, the b* value of the monolithic film before and after the heating step was measured separately, and the difference (Δb*) was recorded as "Δb* before and after the heating step" in Tables 5 and 6.

[0284] <Δb* before and after low-temperature heating> Using the septum-forming resin composition used in the various embodiments and comparative examples, the final heating conditions were changed to air, 100°C, for 60 minutes. Otherwise, a monolithic film with a height of 10 μm was fabricated on a glass substrate in the same manner as the evaluation of reflectivity. Regarding the obtained monolithic film, the b* value was calculated in the same way as the evaluation of chromaticity. The b* values ​​of the monolithic film before and after the heating step were measured separately, and the difference (Δb*) was calculated. The change in OD value during low-temperature heating was evaluated using the following criteria. A:Δb*>15 B:10≦Δb*≦15 C:Δb*<10.

[0285] <Lightfastness> The septum resin composition used in the various embodiments and comparative examples was spin-coated onto a 10 cm square alkali-free glass substrate. The substrate was dried at 90°C for 3 minutes using a heating plate to produce a 10 μm thick dried film. The transmittance at 436 nm was measured using a spectrophotometer (Hitachi High Technology U-4100) on the glass substrate with the obtained dried film. The dried film was then exposed to an exposure machine using a parallel light shield and an ultra-high pressure mercury lamp as the light source, without a light shield, at an exposure dose of 1000 mJ / cm² (gamma rays, h-rays, i-rays). The transmittance at 436 nm was measured again on the glass substrate with the exposed film. The lightfastness was evaluated according to the following criteria by calculating the transmittance difference (ΔT 436 nm) of the film before and after exposure. A: ΔT 436 nm < 3% B: 3% ≤ ΔT 436 nm ≤ 5% C:5%<ΔT 436 nm.

[0286] Low-temperature hardening properties Using the resin composition for forming the partitions used in the various embodiments and comparative examples, the final heating conditions were changed to air, 100°C, for 60 minutes; otherwise, the partitions were formed in the same manner. For the obtained partitioned substrate, inkjet coating was performed using 1,6-hexanediol diacrylate as ink on the pixel portion surrounded by the grid-like partitions, employing an inkjet coating apparatus (manufactured by InkjetLabo, Cluster Technology, Inc.). Subsequently, observations were made within the pixels after 1 hour and 3 hours, and the low-temperature curing properties of the partitions were evaluated using the following criteria: The less exudation into adjacent pixels, the better the low-temperature curing properties of the partitions. A: Three hours after inkjet coating, no ink seepage into adjacent pixels was observed. B: No ink leaching into adjacent pixels was observed 1 hour after inkjet coating, but leaching was observed after 3 hours. C: Immediately after inkjet coating, ink can be seen seeping into adjacent pixels.

[0287] <cone angle> In each embodiment and comparative example, an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) was used to observe an arbitrary cross-section of the partitioned substrate before pixel formation at an accelerating voltage of 3.0 kV, and the cone angle was measured.

[0288] <Maintaining Stability> Regarding the septum-forming resin composition used in each embodiment and comparative example, it was evaluated by spin-coating onto a glass substrate after being stored at 25°C for 7 days and 30 days from the time of preparation. The storage stability was evaluated according to the following criteria based on the state of the coating. A: In evaluations conducted after 7 days and 30 days of storage at 25°C, no agglomerates were generated after spin coating. B: In the evaluation conducted after 7 days of storage at 25°C, no agglomerates were formed after spin coating. However, in the evaluation conducted after 30 days of storage at 25°C, agglomerates were formed after spin coating. C: In the evaluation conducted after storage at 25°C for 7 days, agglomerates were observed after spin coating. Brightness A planar light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as the light source. A partitioned substrate, obtained through the various embodiments and comparative examples, was installed with the pixel portion as the light source side. A current of 30 mA was passed through the planar light-emitting device to illuminate the LED element. The luminance (unit: cd / cm²) based on the CIE 1931 standard was measured using a spectroradiometer (CS-1000, manufactured by Konica Minolta) as the initial luminance. The luminance was evaluated by using the initial luminance of Comparative Example 7 as a relative value to Standard 100. In addition, at room temperature (23°C), the brightness was measured similarly after the LED device was lit for 48 hours to evaluate the change in brightness over time. The brightness was evaluated by using the initial brightness of Comparative Example 4 as a relative value to Standard 100.

[0289] <Color Characteristics> A partitioned substrate, obtained through various embodiments and comparative examples, was set on a commercially available white reflective plate with pixels arranged on the side of the white reflective plate. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measuring diameter ψ8 mm), light was irradiated onto the substrate side of the partitioned substrate, and the spectrum including positively reflected light was measured.

[0290] The BT.2020 color standard, which almost perfectly reproduces the colors of nature, defines the color gamut as red, green, and blue on the spectral locus shown in the chromaticity diagram as the three primary colors, with wavelengths of red, green, and blue corresponding to 630 nm, 532 nm, and 467 nm, respectively. Based on the reflectance (R) at the three wavelengths of the obtained reflectance spectrum at 470 nm, 530 nm, and 630 nm, the following criteria are used to evaluate the luminous color of pixels. A:R 530 / (R 630+R 530+R 470)≧0.60 B:0.55≦R 530 / (R 630+R 530+R 470)<0.60 C:R 530 / (R 630+R 530+R 470)<0.55.

[0291] <Display Features> The display characteristics of the display device fabricated by combining a partitioned substrate and organic EL elements obtained through various embodiments and comparative examples are evaluated based on the following criteria. A: The green color is very vibrant, making it a display device with excellent contrast and sharpness. B: Although the colors look slightly unnatural, it is a display device without any problems.

[0292] <Mixed Colors> In the partitioned substrate obtained by the various embodiments and comparative examples before pixel formation, a color-changing luminescent material composition (CL-2) was applied to a portion of the pixel portion surrounded by grid-like partitions using inkjet printing, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. Subsequently, in the pixel portion surrounded by grid-like partitions, a color-changing luminescent material composition (CL-3) was applied to an adjacent area of ​​the area where the color-changing luminescent material composition (CL-2) was applied using inkjet printing, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm.

[0293] On the other hand, a blue organic EL unit with the same width as the pixel portion surrounded by grid-like partitions is fabricated, and the partitioned substrate and the blue organic EL unit are faced each other and bonded together by a sealant to obtain the display device with the structure shown in FIG8.

[0294] In the blue organic EL unit 7 in Figure 8, with only the blue organic EL unit attached directly below pixel 3 (CL-2) formed by the color-changing luminescent material composition (CL-2) illuminated, the absorbance intensity A (630 nm) at a wavelength of 630 nm was measured for the portion of pixel 3 (CL-3) formed by the color-changing luminescent material composition (CL-3) using a microspectrophotometer LVmicro-V (manufactured by Lambda Vision). A smaller absorbance intensity A (630 nm) indicates a lower likelihood of color mixing. Color mixing was determined using the following criteria. A:A(630 nm)<0.01 B: 0.01 ≤ A (630 nm) ≤ 0.5 C:0.5 <A(630 nm)。

[0295] The evaluation results of each embodiment and comparative example are shown in Tables 5 and 6.

[0296] [Table 5] [Table 5] Crack resistance Resolution (μm) Reflectance (%) OD value Color after heating step Δb* before and after the heating step Δb* before and after low-temperature heating Lightfastness Low temperature hardening properties Cone angle (°) Preservation stability Brightness (relative value) Color characteristics Display Features Mixed colors Minimum reflectivity Maximum reflectivity Minimum OD value Maximum OD value L* a* b* initial 48 hours later Example 28 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 165 162 B B A Example 29 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 159 155 B B A Example 30 ≥20 μm 30 27 35 1.6 2.4 63 -1.0 0.5 15.0 A B A 90 A 159 155 B B A Example 31 ≥20 μm 30 30 38 1.6 2.4 63 -3.9 -1.0 15.0 A B A 85 A 159 155 B B A Example 32 ≥20 μm 30 27 34 1.6 2.4 63 -0.5 0.4 15.0 A B A 92 B 155 151 B B A Actual example 33 ≥20 μm 30 31 38 1.5 2.4 63 -2.0 -3.2 15.0 A B A 79 A 160 157 B B A Actual example 34 ≥20 μm 30 twenty five 34 1.7 2.4 60 -3.7 -4.2 15.0 A B A 92 A 152 148 B B A Actual example 35 ≥20 μm 30 twenty one 29 1.8 2.4 57 -4.9 -4.9 15.0 A B A 95 A 149 146 B B A Actual example 36 ≥20 μm 30 15 twenty five 2.3 2.4 48 -7.0 -8.2 15.0 A B A 111 A 134 129 C B A Actual example 37 ≥20 μm 30 31 38 1.6 2.4 65 -2.7 -0.1 15.0 A B A 88 A 161 159 B B A Example 38 ≥20 μm 30 32 42 1.5 2.4 68 -2.1 2.0 15.0 A B A 89 A 164 162 B B A Example 39 ≥20 μm 30 32 50 1.3 2.4 72 -0.8 12.0 15.0 A B A 89 A 167 164 C B A Example 40 ≥20 μm 30 35 37 1.6 2.4 67 -4.5 -3.0 12.5 B B A 87 A 161 158 B B A Example 41 ≥20 μm 30 27 29 1.8 2.8 55 -6.0 -7.5 8.0 C B A 111 A 134 129 C B A Example 42 ≥20 μm 50 35 37 1.6 2.4 67 -4.5 -5.0 10.5 C B A 105 A 161 158 B B A Example 43 ≥20 μm 30 28 36 1.6 3.0 59 -3.3 4.5 20.0 A B A 91 A 155 152 B B A

[0297] [Table 6] [Table 6] Crack resistance Resolution (μm) Reflectance (%) OD value Color after heating step Δb* before and after the heating step Δb* before and after low-temperature heating Lightfastness Low temperature hardening properties cone angle (°) Preservation stability Brightness (relative value) Color characteristics Display Features Mixed colors Minimum reflectivity Maximum reflectivity Minimum OD value Maximum OD value L* a* b* initial 48 hours later Example 44 ≥20 μm 30 25 36 1.6 3.5 55 -3.3 14.5 30.0 A B A 92 B 154 151 C B A Example 45 ≥20 μm 30 33 37 1.6 2.2 67 -3.0 -3.0 12.5 A B A 87 A 160 156 B B A Example 46 ≥20 μm 30 34 44 1.6 1.7 68 -3.0 -10.5 5.0 A B A 89 A 161 157 C B A Example 47 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -3.5 12.0 C B A 87 A 159 155 B B A Example 48 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 C 159 155 B B A Example 49 ≥25 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B C 87 A 159 155 B B A Example 50 ≥20 μm 30 29 59 0.8 2.4 79 -1.5 20.0 15.00 A B A 86 A 165 157 C B B Example 51 ≥20 μm 30 25 42 1.4 2.4 66 -5.0 5.0 15.00 A B A 105 C 159 155 B B B Example 52 ≥20 μm 30 25 42 1.4 2.4 66 -15.0 4.5 15.00 A B A 90 A 159 155 C B A Actual example 53 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A A A 87 A 159 155 B B A Actual example 54 ≥20 μm 30 29 37 1.7 2.5 61 -3.0 1.0 15.0 A C A 95 A 159 155 B B A Actual example 55 ≥20 μm 20 30 37 1.6 2.4 63 -3.3 -0.5 15.0 A B C 106 B 159 155 B B A Actual example 56 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 148 146 B A A Actual example 57 ≥20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 148 146 A B A Comparative Example 4 ≥15 μm 20 4 7 1.5 1.6 25 3.0 3.0 10.0 B B A 90 A 100 90 B B C Comparative Example 5 ≥20 μm 30 29 50 1.4 1.5 72 -3.3 -15.0 0.50 C B A 88 A 161 157 C B B Comparative Example 6 ≥20 μm 50 35 45 1.5 2.0 67 3.5 -2.5 0.20 C B A 120 A 150 145 B B A

[0298] 1: Substrate 2: Next door 3: Pixel 3(CL-2): Pixels formed by color-changing luminescent materials (CL-2). 3(CL-3): Pixels formed by a color-changing luminescent material (CL-3). 4: Blackout partition 5: Color Filter 6: Light source selected from organic EL units, mini LED units, and micro LED units. 7: Blue Organic EL Unit H: Thickness of the partition L: Width of the adjacent wall θ: cone angle

Claims

1. A resin composition comprising a resin, a photosensitizer, a white pigment, a yellow precursor compound, and a light-shielding pigment, wherein the light-shielding pigment comprises a blue pigment and a purple pigment, the combined content of the blue pigment and the purple pigment in the solid component of the resin composition being 0.01% by weight or more and 3.0% by weight or less, wherein, based on the solid component of the resin composition, the content of the resin is 10% by weight or more and 60% by weight or less, the content of the photosensitizer is 0.01% by weight or more and 20% by weight or less, the content of the white pigment is 10% by weight or more and 60% by weight or less, and the content of the yellow precursor compound is 0.1% by weight or more and 10% by weight or less.

2. The resin composition as claimed in claim 1, wherein, The white pigment is treated with at least one selected from the group consisting of SiO2 and Al2O3, and ZrO2.

3. The resin composition as claimed in claim 1, wherein, The white pigment is treated with ZrO2, Al2O3 and SiO2.

4. The resin composition as claimed in claim 1, wherein, The weight ratio of the blue pigment to the purple pigment is 20 / 80 to 80 / 20.

5. The resin composition as claimed in claim 1, wherein, The yellow precursor compound is an organosilver compound.

6. The resin composition as described in claim 1, containing a reducing agent.

7. The resin composition as claimed in claim 1, comprising phosphate polyester.

8. The resin composition as claimed in claim 1, wherein, The yellow precursor compound accounts for 0.2 to 20% of the weight of the white pigment in the solid component of the resin composition, and the combined weight of the blue and purple pigments in the solid component accounts for 0.05 to 10% of the weight of the white pigment, respectively.

9. A light-shielding film formed by curing a resin composition as described in claim 1.

10. A method for manufacturing a light-shielding film, comprising the following steps: The film-forming step involves coating a resin composition as described in claim 1 onto a substrate and drying it to obtain a dry film. The exposure step involves pattern exposure of the obtained dry film; the development step involves dissolving and removing the portion of the exposed dry film that is soluble in the developing solution. The method for manufacturing the light-shielding film includes a heating step, in which the developed dried film is hardened by heating it. In the heating step, the developed dried film is heated at a temperature of 100°C or higher and 250°C or lower, so that the b* value of each 10 μm film thickness measured by specular reflection increases by more than 10.

11. A partitioned substrate having (A-1) patterned partitions on a substrate by means of a resin composition as described in claim 1, wherein the partitioned substrate has a reflectance of 20% to 50% per 10 μm thickness in the wavelength region of 430 nm to 630 nm, and an optical density value of 1.5 to 3.0 per 10 μm thickness in the wavelength region of 430 nm to 630 nm.

12. A substrate with partitions, having (A-1) patterned partitions on a substrate by means of a resin composition as described in claim 1, wherein the substrate with partitions has an L* value of 50 to 70, an a* value of -5.0 to 5.0, and a b* value of -5.0 to 5.0 per 10 μm film thickness, measured by specular reflection.

13. The partitioned substrate as claimed in claim 11, having a patterned partition (A-1) on a substrate, wherein the patterned partition contains resin, white pigment, blue pigment, purple pigment, silver oxide and / or silver particles.

14. The partitioned substrate as claimed in claim 12, having (A-1) patterned partitions on a substrate, wherein the patterned partitions contain resin, white pigment, blue pigment, purple pigment, silver oxide and / or silver particles.

15. The partitioned substrate as claimed in claim 11, further comprising a pixel layer (B) containing a color-changing luminescent material arranged apart by the patterned partitions of (A-1).

16. The partitioned substrate as claimed in claim 15, wherein a color filter with a thickness of 1 μm to 5 μm is further provided between the substrate and the pixel layer containing the color-changing luminescent material (B).

17. A display device, comprising: The partitioned substrate as described in claim 11; And light sources selected from liquid crystal units, organic electroluminescent units, mini light-emitting diode units and micro light-emitting diode units.

Images