Electronic device and speaker device

Abstract

This disclosure provides an electronic device and a loudspeaker device. The electronic device includes a substrate; and a coil structure disposed on the substrate. The coil structure includes: a first conductor layer including a connecting wire; a second conductor layer including a plurality of line segments separated from each other; and a first insulating layer disposed between the first conductor layer and the second conductor layer. The first insulating layer includes a plurality of first openings; wherein two adjacent lines are electrically connected to the connecting wire through the plurality of first openings.

Description

Electronic devices and speaker devices This disclosure relates to an electronic device and a loudspeaker device, and more particularly to an electronic device and a loudspeaker device having a coil structure. With technological advancements and to meet user demands, all electronic devices are trending towards thinner, lighter, and miniaturized designs. Most speakers on the market today are dynamic speakers, whose main components include a magnetic element, a coil, and a diaphragm. When the coil is energized, it generates a magnetic field. This magnetic field interacts with the magnetic element, causing the diaphragm to vibrate. The diaphragm then pushes air to produce sound. Similarly, in the camera lens module of a mobile phone, the voice coil motor responsible for dynamic focusing also uses a coil, utilizing changes in magnetic force to guide the lens's subtle and precise movements. Traditionally, the number of turns in the coils of moving loudspeakers and voice coil motors is not adjustable, and their overall size is relatively large, making them difficult to apply in miniaturized electronic devices. Therefore, there is an urgent need to provide a new design in order to achieve the goals of thinness, lightweighting, or miniaturization. This disclosure provides an electronic device comprising: a substrate; and a coil structure disposed on the substrate, the coil structure comprising: a first conductor layer including a connecting wire; a second conductor layer including a plurality of wire segments separated from each other; and a first insulating layer disposed between the first conductor layer and the second conductor layer, wherein the first insulating layer includes a plurality of first openings; wherein two adjacent wire segments are electrically connected to the connecting wire through the plurality of first openings. This disclosure also provides a loudspeaker device, comprising: a substrate; a plurality of scan lines disposed on the substrate; a plurality of data lines disposed on the substrate, wherein the plurality of data lines intersect with the plurality of scan lines; a plurality of active elements disposed on the substrate, wherein each of the plurality of active elements is electrically connected to one of the plurality of scan lines and one of the plurality of data lines; and a plurality of coil structures disposed on the substrate, wherein the plurality of coil structures are electrically connected to the plurality of active elements. The following specific embodiments illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. This disclosure can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified and changed according to different viewpoints and applications without departing from the spirit of this invention. It should be noted that, unless otherwise specified, the term "a" element is not limited to having a single element, but may include one or more of the elements. Furthermore, the use of ordinal numbers such as "first" and "second" in the specification and claims to modify elements within the claims does not inherently imply or represent any prior ordinal number for the claimed element, nor does it represent the order of one claimed element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely for the purpose of clearly distinguishing one claimed element with a given name from another claimed element with the same name. Throughout this disclosure and in the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following description and claims, words such as “comprising,” “containing,” and “having” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprising,” “containing,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein. Furthermore, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one element to another in the diagram. It is understood that if the device in the diagram is flipped upside down, an element depicted on the "below" side will become an element on the "above" side. When a corresponding component (e.g., a membrane or region) is referred to as "on another component," it can be directly on the other component, or there may be other components between them. On the other hand, when a component is referred to as "directly on another component," there are no components between them. Additionally, when a component is referred to as "on another component," there is a vertical relationship between them in the top view, and this component can be above or below the other component, depending on the orientation of the device. It should be noted that the technical solutions provided in the different embodiments below can be substituted for, combined or mixed with each other to constitute another embodiment without violating the spirit of this disclosure. Figure 1A is a top view of an electronic device according to one embodiment of the present disclosure. Figure 1B is a cross-sectional view of line segment A-A' in Figure 1A. In one embodiment of this disclosure, as shown in Figures 1A and 1B, the electronic device may include: a substrate 100; and a coil structure 1 disposed on the substrate 100. The coil structure 1 may include: a first conductor layer 11 including a connecting line 111; a second conductor layer 13 including a plurality of line segments LS, the plurality of line segments LS being separated from each other; and a first insulating layer 12 disposed between the first conductor layer 11 and the second conductor layer 13, wherein the first insulating layer 12 includes a plurality of first openings 121; wherein two adjacent plurality of line segments LS are electrically connected to the connecting line 111 through the plurality of first openings 121. More specifically, as shown in Figure 1A, the coil structure 1 may include multiple concentric circular segments LS that are separated from each other, such as a first segment L1, a second segment L2, a third segment L3, and a fourth segment L4. The length of the first segment L1 may be greater than the length of the second segment L2, and the first segment L1 may be arranged around the second segment L2. The length of the second segment L2 may be greater than the length of the third segment L3, and the second segment L2 may be arranged around the third segment L3. The length of the third segment L3 may be greater than the length of the fourth segment L4, and the third segment L3 may be arranged around the fourth segment L4. Furthermore, as shown in Figure 1B, in the cross-sectional view of segment A-A', a first insulating layer 12 may be disposed on a first conductor layer 11, and a second conductor layer 13 may be disposed on a first insulating layer 12. The first segment L1 and the second segment L2 may be electrically connected to the connecting wire 111 through a first opening 121 in the first insulating layer 12, thereby electrically connecting the first segment L1 and the second segment L2 to each other. Similarly, in other cross-sectional views, the second segment L2 and the third segment L3 can be electrically connected to another connecting line 111 through another first opening 121 of the first insulating layer 12, thereby electrically connecting the second segment L2 and the third segment L3 to each other; the third segment L3 and the fourth segment L4 can be electrically connected to another connecting line 111 through another first opening 121 of the first insulating layer 12, thereby electrically connecting the third segment L3 and the fourth segment L4 to each other. Therefore, in this disclosure, multiple segments LS can be electrically connected to each other in series to form an induction coil. In this embodiment, as shown in FIG1A, the coil structure 1 is a plurality of concentric circular segments LS that are separated from each other. However, in other embodiments of this disclosure, the coil structure 1 may also be a plurality of concentric rectangular segments or concentric elliptical segments that are separated from each other, but this disclosure is not limited thereto. Furthermore, the coil structure 1 in FIG1A includes four segments LS that are separated from each other. However, in other embodiments of this disclosure, the coil structure 1 may include two, three, five, or more segments LS that are separated from each other, but this disclosure is not limited thereto. Additionally, in this embodiment, as shown in FIG1B, the second conductor layer 13 is disposed on the first conductor layer 11. However, in other embodiments of this disclosure, although not shown in the figures, the first conductor layer 11 may also be disposed on the second conductor layer 13, and electrically connected to each other through the first opening 121 of the first insulating layer 12. In this disclosure, the substrate 100 may be made of glass, quartz, sapphire, ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), other suitable substrate materials, or combinations thereof, but this disclosure is not limited thereto. In this disclosure, the first conductor layer 11 and the second conductor layer 13 may be prepared using the same or different materials. The first conductor layer 11 and the second conductor layer 13 may contain metals, metal oxides, alloys thereof, or combinations thereof, such as gold, silver, copper, aluminum, chromium, platinum, indium zinc oxide (IZO), indium tin oxide (ITO), indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), or aluminum zinc oxide (AZO), but this disclosure is not limited thereto. In this disclosure, the first insulating layer 12 may be a single-layer or multi-layer structure, and the material of the first insulating layer 12 may include silicon oxide, silicon nitride, silicon oxynitride, or a combination thereof, but this disclosure is not limited thereto. In one embodiment of this disclosure, the first insulating layer 12 may further include an opening 122, wherein a plurality of line segments LS may be disposed around the opening 122. More specifically, as shown in FIG1A, the first line segment L1, the second line segment L2, the third line segment L3, and the fourth line segment L4 may be disposed around the opening 122 respectively. The opening 122 may be used to accommodate other components, such as magnetic components, but this disclosure is not limited thereto. In one embodiment of this disclosure, as shown in FIG1A, the electronic device may further include a first electrode 21 and a second electrode 22, respectively disposed on the substrate 100, wherein the first electrode 21, the first line segment L1, the second line segment L2, the third line segment L3, the fourth line segment L4, and the second electrode 22 may be electrically connected in series. An external voltage / current source may provide voltage / current to the coil structure 1 through the first electrode 21 and / or the second electrode 22. In this disclosure, the first electrode 21 and the second electrode 22 may be fabricated using the same or different materials. The materials of the first electrode 21 and the second electrode 22 may be as described in the first conductor layer 11 or the second conductor layer 13, and will not be repeated here. Furthermore, in one embodiment of this disclosure, the first electrode 21 and the second electrode 22 may be formed in the first conductor layer 11 or the second conductor layer 13 respectively to simplify the manufacturing process. However, in another embodiment of this disclosure, the first electrode 21 and the second electrode 22 may also be formed in other conductor layers respectively. In one embodiment of this disclosure, as shown in FIG1B, the coil structure 1 may further include a first protective layer 14 disposed on the second conductor layer 13. The first protective layer 14 can be used to protect the second conductor layer 13. In this disclosure, the material of the first protective layer 14 may be as described in the first insulating layer 12, and will not be repeated here. Figures 2A and 2B are top views of an electronic device according to one embodiment of the present disclosure. The electronic device in Figures 2A and 2B is similar to the electronic device in Figure 1A, except for the following differences. In one embodiment of this disclosure, as shown in Figures 2A and 2B, the multiple segments of the coil structure 1 may include a floating segment FL1, which is electrically insulated from the first segment L1 or the second segment L2. More specifically, as shown in Figure 2A, the coil structure 1 may include multiple concentric circular segments LS that are separated from each other, such as the first segment L1, the second segment L2, the third segment L3, and the floating segment FL1. The length of the first segment L1 may be greater than the length of the second segment L2, the length of the second segment L2 may be greater than the length of the third segment L3, and the length of the third segment L3 may be greater than the length of the floating segment FL1. The first segment L1, the second segment L2, and the third segment L3 may be arranged around the floating segment FL1. Among them, the first line segment L1, the second line segment L2 and the third line segment L3 are electrically insulated from the floating line segment FL1. Therefore, the first electrode 21, the first line segment L1, the second line segment L2, the third line segment L3 and the second electrode 22 can be electrically connected in series to form an induction coil. In this disclosure, the coil structure 1 of FIG2A includes a floating segment FL1. In other embodiments of this disclosure, the coil structure 1 may include multiple floating segments FL1 and FL2, as shown in FIG2B. The coil structure 1 may include multiple concentric circular segments LS that are separated from each other, such as a first segment L1, a second segment L2, and floating segments FL1 and FL2. The length of the first segment L1 may be greater than the length of the second segment L2, the length of the second segment L2 may be greater than the length of the floating segment FL1, and the length of the floating segment FL1 may be greater than the length of the floating segment FL2. The first segment L1 and the second segment L2 may be arranged around the floating segments FL1 and FL2. The first segment L1 and the second segment L2 are electrically insulated from the floating segments FL1 and FL2. Therefore, the first electrode 21, the first segment L1, the second segment L2, and the second electrode 22 can be electrically connected in series to form an induction coil. Figure 3A is a top view of an electronic device according to one embodiment of the present disclosure. Figure 3B is a cross-sectional view along line segment B-B' of Figure 3A. The electronic device of Figure 3A is similar to that of Figure 1A, except for the following differences. In one embodiment of this disclosure, as shown in Figures 3A and 3B, the coil structure 1 may further include: a third conductor layer 16 including a plurality of auxiliary line segments ALS, the plurality of auxiliary line segments ALS being separated from each other; and a second insulating layer 15 disposed between the second conductor layer 13 and the third conductor layer 16, wherein the second insulating layer 15 includes a plurality of second openings 151; wherein the plurality of auxiliary line segments ALS of the third conductor layer 16 are electrically connected to the plurality of line segments LS of the second conductor layer 13 through the plurality of second openings 151 of the second insulating layer 15. More specifically, as shown in Figure 3A, the coil structure 1 may include multiple concentric auxiliary line segments ALS that are separated from each other, such as a first auxiliary line segment AL1, a second auxiliary line segment AL2, a third auxiliary line segment AL3, and a fourth auxiliary line segment AL4. The length of the first auxiliary line segment AL1 may be greater than the length of the second auxiliary line segment AL2, and the first auxiliary line segment AL1 may be arranged around the second auxiliary line segment AL2; the length of the second auxiliary line segment AL2 may be greater than the length of the third auxiliary line segment AL3, and the second auxiliary line segment AL2 may be arranged around the third auxiliary line segment AL3; the length of the third auxiliary line segment AL3 may be greater than the length of the fourth auxiliary line segment AL4, and the third auxiliary line segment AL3 may be arranged around the fourth auxiliary line segment AL4. Furthermore, as shown in Figure 3B, in the cross-sectional view of line segment B-B', the second insulating layer 15 can be disposed on the second conductor layer 13, and the third conductor layer 16 can be disposed on the second insulating layer 15. The first auxiliary line segment AL1 can be electrically connected to the corresponding first line segment L1 through the second opening 151 of the second insulating layer 15, and the second auxiliary line segment AL2 can be electrically connected to the corresponding second line segment L2 through the second opening 151 of the second insulating layer 15. Therefore, the first auxiliary line segment AL1 and the second auxiliary line segment AL2 can be electrically connected to each other through the first line segment L1, the connecting line 111, and the second line segment L2. Similarly, in other cross-sectional views, the third auxiliary line segment AL3 can be electrically connected to the corresponding third line segment L3 through the second opening 151 of the second insulating layer 15, and the fourth auxiliary line segment AL4 can be electrically connected to the corresponding fourth line segment L4 through the second opening 151 of the second insulating layer 15. This allows multiple auxiliary line segments ALS to be electrically connected to multiple line segments LS, forming a stacked induction coil structure. Therefore, in this disclosure, the first electrode 21, the plurality of auxiliary line segments ALS, the plurality of line segments LS and the second electrode 22 can be electrically connected to each other in series. In one embodiment of this disclosure, as shown in FIG3A, in the normal direction Z of the substrate 100, a plurality of auxiliary line segments ALS of the third conductor layer 16 and a plurality of line segments LS of the second conductor layer 13 may at least partially overlap. For example, the plurality of auxiliary line segments ALS of the third conductor layer 16 may substantially overlap with the plurality of line segments LS of the second conductor layer 13, but this disclosure is not limited thereto. In this embodiment, as shown in FIG3A, the multiple auxiliary line segments ALS are similar to line segment LS (as shown in FIG1A) and can be multiple concentric circles that are separated from each other. However, in other embodiments of this disclosure, the multiple auxiliary line segments ALS can also be multiple concentric rectangular auxiliary line segments or concentric elliptical auxiliary line segments that are separated from each other, but this disclosure is not limited thereto. Similarly, in other embodiments of this disclosure, the multiple auxiliary line segments ALS can include two, three, four, five or more auxiliary line segments ALS that are separated from each other, but this disclosure is not limited thereto. In this disclosure, the material of the third conductor layer 16 is as described in the first conductor layer 11 or the second conductor layer 13, and the second insulating layer 15 can be a single-layer or multi-layer structure, and the material of the second insulating layer 15 is as described in the first insulating layer 12, which will not be repeated here. Furthermore, although not shown in the figures, in one embodiment of this disclosure, the coil structure 1 may further include a second protective layer disposed on the third conductor layer 16. The second protective layer can be used to protect the third conductor layer 16. In this disclosure, the material of the second protective layer may be as described in the first protective layer 14, and will not be repeated here. Moreover, although not shown in the figures, in one embodiment of this disclosure, the first protective layer 14 and the second insulating layer 15 may be combined into a single layer to simplify the manufacturing process; for example, the second insulating layer 15 may be omitted, and the plurality of auxiliary lines ALS of the third conductor layer 16 may be electrically connected to the plurality of lines LS of the second conductor layer 13 through the openings of the first protective layer 14. Figures 4A and 4B are top views of an electronic device according to one embodiment of the present disclosure. The electronic device in Figures 4A and 4B is similar to that in Figure 1A, except for the following differences. In one embodiment of this disclosure, as shown in FIG4A, the electronic device may further include a first electrode 21, a second electrode 22, a third electrode 23, and a fourth electrode 24, respectively disposed on the substrate 100; the plurality of line segments LS include a first line segment L1, a second line segment L2, a third line segment L3, and a fourth line segment L4, wherein the first line segment L1, the second line segment L2, and the third line segment L3 can be electrically connected through corresponding connecting lines 111. The first electrode 21, the first line segment L1, the second line segment L2, the third line segment L3, and the second electrode 22 can form a first series path, and the third electrode 23, the fourth line segment L4, and the fourth electrode 24 can form a second series path, wherein the first series path and the second series path are electrically insulated from each other. Therefore, different voltages can be provided to the first series path and the second series path respectively. In one embodiment of this disclosure, as shown in FIG4B, the electronic device may further include a first electrode 21, a second electrode 22, a third electrode 23, and a fourth electrode 24, respectively disposed on the substrate 100; the plurality of line segments LS include a first line segment L1, a second line segment L2, a third line segment L3, and a fourth line segment L4, wherein the first line segment L1 and the second line segment L2 can be electrically connected through a connecting line 111, and the third line segment L3 and the fourth line segment L4 can be electrically connected through another connecting line 111. The first electrode 21, the first line segment L1, the second line segment L2, and the second electrode 22 can form a first series path, and the third electrode 23, the third line segment L3, the fourth line segment L4, and the fourth electrode 24 can form a second series path, wherein the first series path and the second series path are electrically insulated from each other. Therefore, different voltages can be provided to the first series path and the second series path respectively. In this disclosure, the third electrode 23 and the fourth electrode 24 can be fabricated using the same or different materials. The materials of the third electrode 23 and the fourth electrode 24 can be as described for the first electrode 21 or the second electrode 22, and will not be repeated here. In addition, in one embodiment of this disclosure, the first electrode 21, the second electrode 22, the third electrode 23 and the fourth electrode 24 can be formed in the first conductor layer 11 or the second conductor layer 13, respectively, to simplify the manufacturing process. However, in another embodiment of this disclosure, the first electrode 21, the second electrode 22, the third electrode 23 and the fourth electrode 24 can also be formed in other conductor layers. Figures 5A and 5B are top views of an electronic device according to one embodiment of the present disclosure. In one embodiment of this disclosure, as shown in FIG5A, the electronic device may include an active element 3 disposed on the substrate 100, wherein the active element 3 may be electrically connected to the coil structure 1, which is as shown in FIG1A and will not be described again here. Therefore, the electronic device of this disclosure can control the magnitude of the voltage supplied to the coil structure 1 through the active element 3. In this disclosure, the electronic device may be an electronic device with an array coil structure. More specifically, as shown in FIG5A, the electronic device may include: a substrate 100; a plurality of scan lines 4 disposed on the substrate 100; a plurality of data lines 5 disposed on the substrate 100, wherein the plurality of data lines 5 are respectively interleaved with the plurality of scan lines 4; a plurality of active elements 3 disposed on the substrate 100, wherein each of the plurality of active elements 3 is electrically connected to one of the plurality of scan lines 4 and one of the plurality of data lines 5; and a plurality of coil structures 1 disposed on the substrate 100, wherein the plurality of coil structures 1 are respectively electrically connected to the plurality of active elements 3. Signal sources S1 and S2 can provide scan signals and data signals to the active elements 3 through the scan lines 4 and data lines 5, respectively, and the voltage supplied to the coil structures 1 can be controlled by the active elements 3. The active elements 3 may be, for example, thin-film transistors. In one embodiment of this disclosure, multiple coil structures 1 may have the same design as each other, as shown in FIG5A. The coil structure 1 may include a first coil structure 1-1 and a second coil structure 1-2, wherein the first coil structure 1-1 and the second coil structure 1-2 may be as shown in the coil structure 1 of FIG1A, and will not be described again here. Therefore, the total coil length of the first coil structure 1-1 and the total coil length of the second coil structure 1-2 may be the same. In other embodiments of this disclosure, the multiple coil structures may be as shown in any of the coil structures 1 of FIG1A to FIG3A, and the coil structures will not be described again here. In one embodiment of this disclosure, the plurality of coil structures 1 may have different designs from each other, as shown in FIG5B. The plurality of coil structures 1 may include a first coil structure 1-1 and a second coil structure 1-2, wherein the total coil length of the first coil structure 1-1 may be different from the total coil length of the second coil structure 1-2, but this disclosure is not limited to the illustration in FIG5B. In other embodiments of this disclosure, the plurality of coil structures 1 may be as shown in FIG1A to FIG3A, and the coil structures 1 will not be described in detail here. Figure 6A is a top view of an electronic device according to one embodiment of the present disclosure. Figure 6B is a cross-sectional view of line segment C-C' in Figure 6A. In one embodiment of this disclosure, as shown in Figures 6A and 6B, the electronic device may include: a substrate 100; a coil structure 1, a first electrode 21, and a switching element 6, respectively disposed on the substrate 100; wherein the first electrode 21 and the switching element 6 are electrically connected to the coil structure 1. The coil structure 1 may include: a first conductor layer 11; a second conductor layer 13 including a plurality of line segments LS, the plurality of line segments LS being separated from each other; and a first insulating layer 12 disposed between the first conductor layer 11 and the second conductor layer 13, wherein the first insulating layer 12 includes a plurality of first openings 121; wherein the plurality of line segments LS are electrically connected to the first conductor layer 11 through the plurality of first openings 121. More specifically, as shown in Figure 6A, the coil structure 1 may include multiple concentric circular segments LS that are separated from each other, such as the first segment L1, the second segment L2, the third segment L3, and the fourth segment L4. The end of each segment is electrically connected to the first conductor layer 11 through the first opening 121 of the first insulating layer 12. The first conductor layer 11 is electrically connected to the switching element 6. Therefore, the two ends of the first segment L1 are electrically connected to the first electrode 21 and the switching element 6, respectively; the two ends of the second segment L2 are electrically connected to the switching element 6, respectively; the two ends of the third segment L3 are electrically connected to the switching element 6, respectively; and the two ends of the fourth segment L4 are electrically connected to the switching element 6, respectively. As shown in Figure 6B, in the cross-sectional view of segment C-C', the fourth segment L4 can be electrically connected to the first conductor layer 11 through the first opening 121 of the first insulating layer 12. The first conductor layer 11 can be electrically connected to the switching element 6. Therefore, the multiple segments LS of the coil structure 1 can be electrically connected to each other through the switching element 6, so that the first electrode 21, the switching element 6, and the coil structure 1 form a series path. In this disclosure, the switching element 6 can be a thin-film transistor circuit fabricated on the substrate 100 using a thin-film process, such as a demultiplexer circuit, or an integrated circuit fabricated using an integrated circuit process, but this disclosure is not limited thereto. Furthermore, in one embodiment of this disclosure, as shown in FIG6B, the coil structure 1 may further include a first protective layer 14 disposed on the second conductor layer 13. The first protective layer 14 can be used to protect the second conductor layer 13. In this embodiment, the materials of the substrate 100, the first electrode 21, the first conductor layer 11, the second conductor layer 13, the first insulating layer 12, and the first protective layer 14 may be as described above, and will not be repeated here. Figure 7 is a schematic diagram of an electronic device according to one embodiment of the present disclosure. In one embodiment of this disclosure, the coil structure 1 can be integrated with the display panel 7. Therefore, the electronic device of this disclosure can be a display device. As shown in FIG7, the electronic device includes a substrate 100; a display panel 7 disposed on the substrate 100; and a plurality of coil structures 1 disposed on the substrate 100 and adjacent to the display panel 7. In this disclosure, the display panel 7 can be any suitable display panel, which may include liquid crystal, light-emitting diodes (LEDs), and such LEDs may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, quantum dot LEDs, fluorescent LEDs, or phosphorescent LEDs, but this disclosure is not limited thereto. The coil structure 1 can be as described above and will not be repeated here. Figure 8 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure. The electronic device in Figure 8 is similar to that in Figures 1A and 1B, except for the following differences. In one embodiment of this disclosure, as shown in FIG8, the electronic device may further include: a magnetically conductive element 81 disposed on a substrate 100 and located in an opening 122; a support member 82 disposed on the substrate 100 and surrounding the coil structure 1; and a diaphragm 83 disposed on the support member 82 and corresponding to the magnetically conductive element 81. When the coil structure 1 is energized, it generates a magnetic field, which interacts with the magnetically conductive element 81 to cause the diaphragm 83 to vibrate. The diaphragm 83 pushes the surrounding air to produce sound. Therefore, in one embodiment of this disclosure, the electronic device may be a loudspeaker device. In this embodiment, the coil structure 1 shown in Figures 1A and 1B is used as an example. In other embodiments of this disclosure, the coil structure 1 may be any of the coil structures 1 shown in Figures 1A to 4B, and will not be described in detail here. In this disclosure, the material of the magnetically conductive element 81 may include iron, low-carbon steel, nickel-iron alloys, iron-silicon alloys, iron-cobalt alloys, microcrystalline soft iron alloys, combinations thereof, or other suitable magnetically conductive materials, but this disclosure is not limited thereto. In this disclosure, the diaphragm 83 may be a magnetic diaphragm, which may include a substrate and a magnetically conductive material coated on the substrate. The magnetically conductive material may be as described for the magnetically conductive element, and will not be repeated here. Here, the substrate may be a flexible substrate, such as a plastic film, metal film, paper, fabric, or other suitable material, but this disclosure is not limited thereto. Figure 9 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure. The electronic device in Figure 9 is similar to that in Figure 8, except for the following differences. In one embodiment of this disclosure, the electronic device may have an array coil structure (as shown in FIG5A or FIG5B). Therefore, when the electronic device is a speaker device, as shown in FIG9, the electronic device may further include: a plurality of magnetically conductive elements 81 disposed on the substrate 100 and respectively located in one of a plurality of openings 122; a plurality of support members 82 disposed on the substrate 100 and respectively surrounding one of a plurality of coil structures 1; and a diaphragm 83 disposed on the support member 82 and corresponding to the plurality of magnetically conductive elements 81. In one embodiment of this disclosure, as shown in FIG9, multiple magnetically conductive elements 81 may share the same diaphragm 83. Therefore, in the normal direction Z of the substrate 100, the diaphragm 83 may overlap with multiple magnetically conductive elements 81 simultaneously, but this disclosure is not limited thereto. In another embodiment of this disclosure, although not shown in the figures, the electronic device may include multiple diaphragms 83 disposed on the support member 82 and respectively corresponding to one of the multiple magnetically conductive elements 81. Therefore, in the normal direction Z of the substrate 100, one of the diaphragms 83 may overlap with one of the magnetically conductive elements 81. The multiple diaphragms 83 can vibrate independently without being linked by adjacent diaphragms 83. Furthermore, in one embodiment of this disclosure, as shown in FIG9, adjacent coil structures 1 may share one sidewall 821 of the support member 82, but this disclosure is not limited thereto. The specific embodiments described above should be interpreted as merely illustrative and not as limiting the remainder of this disclosure in any way. Features of different embodiments may be combined and used in combination as long as they do not conflict with each other. 100: Substrate 1: Coil Structure 11: First Conductor Layer 111: Connecting Line 12: First Insulating Layer 121: First Opening 122: Opening 13: Second Conductor Layer 14: First Protective Layer 15: Second Insulating Layer 151: Second Opening 16: Third Conductor Layer 21: First Electrode 22: Second Electrode 23: Third Electrode 24: Fourth Electrode 3: Active Element 4: Scan Line 5: Data Line 6: Switching Element 7: Display Panel 81: Magnetic Conductor Element 82: Support Element 821: Side Wall 83: Diaphragm LS: Line Segment L1: First Line Segment L2: Second Line Segment L3: Third Line Segment L4: Fourth Line Segment FL1, FL2: Floating Line Segment ALS: Auxiliary Line Segment AL1: First Auxiliary Line Segment AL2: Second Auxiliary Line Segment AL3: Third Auxiliary Line Segment AL4: Fourth Auxiliary Line Segment Z: Normal Direction Figure 1A is a top view of an electronic device according to an embodiment of the present disclosure. Figure 1B is a cross-sectional view of line segment A-A' in Figure 1A. Figures 2A and 2B are top views of an electronic device according to an embodiment of the present disclosure. Figure 3A is a top view of an electronic device according to an embodiment of the present disclosure. Figure 3B is a cross-sectional view of line segment B-B' in Figure 3A. Figures 4A and 4B are top views of an electronic device according to an embodiment of the present disclosure. Figures 5A and 5B are top views of an electronic device according to an embodiment of the present disclosure. Figure 6A is a top view of an electronic device according to an embodiment of the present disclosure. Figure 6B is a cross-sectional view of line segment C-C' in Figure 6A. Figure 7 is a schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 8 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. Figure 9 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. none 100:Substrate 1: Coil Structure 11: First conductor layer 111: Connecting cable 12: First insulating layer 121: First Opening 122: Opening 13: Second conductor layer 14: First protective layer LS: line segment L1: First line segment L2: Second line segment L3: Third line segment L4: Fourth segment Z: Normal direction

Claims

1. An electronic device comprising: a substrate; and a coil structure disposed on the substrate, the coil structure comprising: a first conductor layer including a connecting wire; a second conductor layer including a plurality of line segments separated from each other; and a first insulating layer disposed between the first conductor layer and the second conductor layer, wherein... The first insulating layer includes a plurality of first openings; a third conductor layer includes a plurality of auxiliary lines, the plurality of auxiliary lines being separated from each other; and a second insulating layer disposed between the second conductor layer and the third conductor layer, the second insulating layer including a plurality of second openings; wherein two adjacent plurality of lines are electrically connected to the connecting line through the plurality of first openings; wherein the plurality of auxiliary lines of the third conductor layer are electrically connected to the plurality of lines of the second conductor layer through the plurality of second openings of the second insulating layer.

2. The electronic device as described in claim 1, wherein, The second conductor layer is disposed on the first conductor layer.

3. The electronic device as described in claim 1, wherein, The plurality of line segments includes a first line segment and a second line segment, the first line segment and the second line segment being electrically connected to the connecting line through the plurality of first openings, and the first line segment surrounding the second line segment.

4. The electronic device as described in claim 3, wherein, The length of the first line segment is greater than the length of the second line segment.

5. The electronic device as claimed in claim 3 further includes a first electrode and a second electrode, respectively disposed on the substrate, wherein, The first electrode, the first line segment, the second line segment, and the second electrode are electrically connected in series.

6. The electronic device as described in claim 3, wherein, The plurality of segments includes a floating segment that is electrically insulated from the first segment or the second segment.

7. The electronic device as described in claim 6, wherein, The first segment or the second segment surrounds the floating segment.

8. The electronic device as claimed in claim 1, wherein, In the normal direction of the substrate, the plurality of auxiliary line segments of the third conductor layer at least partially overlap with the plurality of line segments of the second conductor layer.

9. The electronic device as claimed in claim 1, further comprising a first electrode, a second electrode, a third electrode, and a fourth electrode, respectively disposed on the substrate; the plurality of line segments comprising a first line segment, a second line segment, and a third line segment, wherein, The first electrode, the first line segment, the second line segment, and the second electrode form a first series path, and the third electrode, the third line segment, and the fourth electrode form a second series path.

10. The electronic device as claimed in claim 1 further includes an active element disposed on the substrate, wherein, The active element is electrically connected to the coil structure.

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