Composition, film and display device

Abstract

This invention provides a composition, a film formed from the composition, and a display device including the film. The composition comprises semiconductor particles and can form a film with good luminous intensity. Specifically, it provides a composition comprising semiconductor particles (A) and resin (B), wherein the content of semiconductor particles (A) exceeds 30% by mass relative to the total amount of solid components in the composition.

Description

Composition, film and display device The present invention relates to a composition and a film formed therefrom, and a display device including the film. Patent Document 1 discloses a curable resin composition and a wavelength conversion film formed using the curable resin composition, wherein the curable resin composition comprises quantum dots and polymers having specific structural units. [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2016-065178 [The problem that the invention aims to solve] As display devices become thinner, the optical components used in them also require thinner designs. However, existing wavelength conversion films formed from quantum dot compositions tend to have reduced optical properties when made thinner. One object of the present invention is to provide a composition comprising semiconductor particles, which can be formed into a film with good luminous intensity. Another object of the present invention is to provide a film formed from the aforementioned composition, and a display device including the film. [Means for Solving the Problems] The present invention provides the following composition, film, and display device. [1] A composition comprising semiconductor particles (A) and resin (B), wherein the content of said semiconductor particles (A) is more than 30% by mass relative to the total amount of solid components of said composition. [2] The composition of [1] further comprises a solvent (I) of 60 parts by mass or more relative to 100 parts by mass of said solid components. [3] The composition of [1] or [2] wherein the ratio of the content of said semiconductor particles (A) to the content of said resin (B) is 4.0 or less. [4] The composition of any one of [1] to [3] further comprises a compound (H) containing a thiol group. [5] The composition of [4] wherein the number of thiol groups contained in 100 g of said solid components is less than 20.0 mmol. [6] The composition of any one of [1] to [5] further comprises a polymerizable compound (C). [7] A film formed from the composition of any one of [1] to [6]. [8] A display device comprising the film as described in [7]. [Effects of the Invention] A composition, a film formed from the composition, and a display device including the film may be provided, wherein the composition is a composition containing semiconductor particles and can be formed into a film with good luminous intensity. <Composition> The composition of the present invention (hereinafter also simply referred to as the "composition") comprises semiconductor particles (A) and resin (B), and the content of semiconductor particles (A) exceeds 30% by mass relative to the total amount of solid components of the composition. According to the composition, even when the film thickness is relatively small, a film with good luminescence intensity can be formed. The components contained in or possibly contained in the composition are described below. Furthermore, unless otherwise specified, the compounds exemplified in this specification as components contained in or possibly contained in the composition may be used alone or in combination. [1] Semiconductor particle (A) The semiconductor particle (A) emits light with a wavelength different from that of the primary light, preferably by converting the wavelength of the blue light, which is the primary light, into a wavelength of light with a different color. The semiconductor particle (A) preferably emits green or red light, and more preferably by absorbing blue light and emitting green or red light. The semiconductor particle (A) may be, for example, a red luminescent semiconductor particle emitting light with a peak emission wavelength in the wavelength region of 605 nm to 665 nm, a green luminescent semiconductor particle emitting light with a peak emission wavelength in the wavelength region of 500 nm to 560 nm, or a blue luminescent semiconductor particle emitting light with a peak emission wavelength in the wavelength region of 420 nm to 480 nm. The semiconductor particle (A) is preferably a red luminescent semiconductor particle and / or a green luminescent semiconductor particle. The peak emission wavelength of the semiconductor particle (A) can be confirmed, for example, in a emission spectrum measured using a UV-Vis spectrophotometer. The full width at half maximum (FWHM) of the emission spectrum of the semiconductor particle (A) is preferably below 60 nm, more preferably below 55 nm, further preferably below 50 nm, and most preferably below 45 nm. This allows for the emission of light with higher color purity. The lower limit of the FWHM of the emission spectrum of the semiconductor particle (A) is not particularly limited and can be above 5 nm or above 15 nm. Semiconductor particle (A) is a particle containing semiconductor crystals, preferably a nanoparticle containing semiconductor crystals. Examples of semiconductor particle (A) include semiconductor quantum dots (hereinafter also referred to as "quantum dots") and particles of compounds having a perovskite-type crystal structure (hereinafter also referred to as "perovskite compounds"), more preferably quantum dots. The average particle size of the quantum dots is, for example, 0.5 nm or more and 20 nm or less, preferably 1 nm or more and 15 nm or less (e.g., 2 nm or more and 15 nm or less). The energy state of the quantum dots depends on their size, thus the emission wavelength can be freely selected by changing the particle size. For example, in the case of quantum dots composed only of CdSe, the peak wavelengths of the emission spectra for particle sizes of 2.3 nm, 3.0 nm, 3.8 nm, and 4.6 nm are 528 nm, 570 nm, 592 nm, and 637 nm, respectively. The average particle size of the semiconductor particles (A) can be determined using a scanning transmission electron microscope. Quantum dots can be made of semiconductor materials, for example, semiconductor materials containing one or more elements selected from the group consisting of elements from Group 2, Group 11, Group 12, Group 13, Group 14, Group 15 and Group 16 of the periodic table. Specific examples of semiconductor materials that can form quantum dots include: SnS 2. Compounds of Group 14 and Group 16 elements, such as SnS, SnSe, SnTe, PbS, PbSe, and PbTe; compounds of Group 13 and Group 15 elements, such as GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, InGaN, and InGaP; Ga 2O 3. Ga 2S 3. Ga 2Se 3. Ga 2Te 3. In 2O 3. In 2S 3. In 2Se 3. In 2Te Compounds of Group 13 and Group 16 elements, including ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, HgO, HgS, HgSe, HgTe, ZnSTe, ZnSeS, ZnSeTe, CdSTe, CdSeTe, HgSTe, HgSeS, and HgSeTe; As 2O 3. As 2S 3. As 2Se 3. As 2Te 3. Sb 2O 3. Sb 2S 3. Sb 2Se 3. Sb 2Te 3. Bi 2O 3. Bi 2S 3. Bi 2Se 3. Bi 2Te Compounds of Group 15 and Group 16 elements, etc.; Compounds of Group 2 and Group 16 elements, such as MgS, MgSe, MgTe, CaS, CaSe, CaTe, SrS, SrSe, SrTe, BaS, BaSe, BaTe; Elemental forms of Group 14, Group 15 or Group 16 elements, such as Si and Ge. Quantum dots can be monolayer structures containing a single semiconductor material, or core-shell structures where the surface of a nucleus (core) containing a single semiconductor material is covered by a coating layer (shell) containing one or more different semiconductor materials. In the latter case, the semiconductor material constituting the shell is typically a material with a higher band gap energy than the semiconductor material constituting the core. Quantum dots can have two or more shells. The shape of quantum dots is not particularly limited; for example, they can be spherical or approximately spherical, rod-shaped, disk-shaped, etc. Perovskite compounds are compounds with a perovskite-type crystalline structure, consisting of components A, B, and X. A represents the components located at the vertices of the hexahedron centered on B in the perovskite-type crystalline structure, and is a monovalent cation. X represents the components located at the vertices of the octahedron centered on B in the perovskite-type crystalline structure, and is at least one ion selected from the group consisting of halide ions and thiocyanate ions. B represents the components located at the center of the hexahedron where A is located at a vertex and the octahedron where X is located at a vertex in the perovskite-type crystalline structure, and is a metal ion. From the viewpoint of maintaining a good crystalline structure, the average particle size of semiconductor particles containing perovskite compounds is preferably 3 nm or more, more preferably 4 nm or more, and even more preferably 5 nm or more, and usually less than 50 nm. As a perovskite compound with components A, B, and X, there are no particular limitations; it can be a compound with any of the following structures: three-dimensional, two-dimensional, or quasi-two-dimensional. In the case of a three-dimensional structure, the perovskite compound consists of ABX. (3+δ) In the case of a two-dimensional structure, perovskite compounds are represented by A. 2BX (4+δ) Indicated. Here, δ is a number that can be appropriately changed according to the charge balance of B, and is greater than -0.7 and less than 0.7. It is a perovskite compound and is composed of ABX (3+δ) Preferred specific examples of compounds with a three-dimensional perovskite-type crystalline structure can be listed as follows: CH 3NH 3PbBr 3. CH 3NH 3PbCl 3. CH 3NH 3PbI 3. CH 3NH 3PbBr (3-y) I y (0 < y < 3), CH 3NH 3PbBr (3-y) Cl y (0 < y < 3), (H) 2N=CH-NH 2)PbBr 3. (H) 2N=CH-NH 2) PbCl 3. (H) 2N=CH-NH 2) PbI 3. CH 3NH 3Pb (1-a) Ca a Br 3 (0 < a ≦ 0.7), CH 3NH 3Pb (1-a) Sr a Br 3(0<a≤0.7)、CH 3NH 3Pb (1-a) La a Br (3+δ) (0<a≦0.7,0<δ≦0.7)、CH 3NH 3Pb (1-a) Ba a Br 3(0<a≤0.7)、CH 3NH 3Pb (1-a) Dy a Br (3+δ) (0<a≦0.7,0<δ≦0.7)、CH 3NH 3Pb (1-a) Na a Br (3+δ) (0<a≦0.7,-0.7≦δ<0)、CH 3NH 3Pb (1-a) Li a Br (3+δ) (0<a≦0.7,-0.7≦δ<0)、CsPb (1-a) Na a Br (3+δ) (0<a≦0.7,-0.7≦δ<0)、CsPb (1-a) Li a Br (3+δ) (0<a≦0.7,-0.7≦δ<0)、CH 3NH 3Pb (1-a) Na a Br (3+δ-y) I y (0<a≦0.7,-0.7≦δ<0,0<y<3)、CH 3NH 3Pb (1-a) Li a Br (3+δ-y) I y (0<a≦0.7,-0.7≦δ<0,0<y<3)、CH 3NH 3Pb (1-a) Na a Br (3+δ-y) Cl y (0<a≦0.7,-0.7≦δ<0,0<y<3)、CH 3NH 3Pb (1-a) Li a Br (3+δ-y) Cl y (0<a≦0.7,-0.7≦δ<0,0<y<3)、(H 2N=CH-NH 2)Pb (1-a) Na a Br (3+δ) (0<a≦0.7,-0.7≦δ<0)、(H 2N=CH-NH 2)Pb (1-a) Li a Br (3+δ) (0<a≦0.7,-0.7≦δ<0)、(H 2N=CH-NH 2)Pb (1-a) Na a Br (3+δ-y) I y (0<a≦0.7,-0.7≦δ<0,0<y<3)、(H 2N=CH-NH 2)Pb (1-a) Na a Br (3+δ-y) Cl y (0<a≦0.7,-0.7≦δ<0,0<y<3)、CsPbBr 3. CsPbCl 3. CsPbI 3. CsPbBr (3-y) I y (0<y<3)、CsPbBr (3-y) Cl y (0<y<3)、CH 3NH 3PbBr (3-y) Cl y (0<y<3)、 CH 3NH 3Pb (1-a) Zn a Br 3(0<a≤0.7)、CH 3NH 3Pb (1-a) Al a Br (3+δ) (0<a≦0.7,0≦δ≦0.7)、CH 3NH 3Pb (1-a) Co a Br 3(0<a≦0.7)、CH 3NH 3Pb (1-a) Mn a Br 3(0<a≦0.7)、CH 3NH 3Pb (1-a) Mg a Br 3(0<a≦0.7)、 CsPb (1-a) Zn a Br 3(0<a≦0.7)、CsPb (1-a) Al a Br (3+δ) (0<a≦0.7,0<δ≦0.7)、CsPb (1-a) Co a Br 3(0<a≦0.7)、CsPb (1-a) Mn a Br 3(0<a≦0.7)、CsPb (1-a) Mg a Br 3(0<a≦0.7)、 CH 3NH 3Pb (1-a) Zn a Br (3-y)I y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Al a Br (3+δ-y) I y (0<a≦0.7,0<δ≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Co a Br (3-y) I y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Mn a Br (3-y) I y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Mg a Br (3-y) I y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Zn a Br (3-y) Cl y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Al a Br (3+δ-y) Cl y (0<a≦0.7,0<δ≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Co a Br (3+δ-y) Cl y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Mn a Br (3-y) Cl y (0<a≦0.7,0<y<3)、CH 3NH 3Pb (1-a) Mg a Br (3-y) Cl y (0<a≦0.7,0<y<3)、 (H 2N=CH-NH 2)Zn a Br 3(0<a≦0.7)、(H 2N=CH-NH 2)Mg a Br 3(0<a≦0.7)、(H 2N=CH-NH 2)Pb (1-a) Zn a Br (3-y) I y (0<a≦0.7,0<y<3)、(H 2N=CH-NH 2) Pb (1-a) Zn a Br (3-y) Cl y (0 < a ≦ 0.7, 0 < y < 3), etc. It is a perovskite compound and is composed of A 2BX (4+δ) Preferred specific examples of compounds with a two-dimensional perovskite-type crystalline structure can be listed as follows: (C 4H 9NH 3) 2PbBr 4. (C) 4H 9NH 3) 2PbCl 4. (C) 4H 9NH 3) 2PbI 4. (C) 7H 15 NH 3) 2PbBr 4. (C) 7H 15 NH 3) 2PbCl 4. (C) 7H 15 NH 3) 2PbI 4. (C) 4H 9NH 3) 2Pb (1-a) Li a Br (4+δ) (0<a≦0.7,-0.7≦δ<0)、(C 4H 9NH 3) 2Pb (1-a) Na a Br (4+δ) (0<a≦0.7,-0.7≦δ<0)、(C 4H 9NH 3) 2Pb (1-a) Rb a Br (4+δ) (0<a≦0.7,-0.7≦δ<0)、 (C 7H 15 NH 3) 2Pb (1-a) Na a Br (4+δ) (0<a≦0.7,-0.7≦δ<0)、(C 7H 15 NH 3) 2Pb (1-a) Li a Br (4+δ) (0<a≦0.7,-0.7≦δ<0)、(C 7H 15 NH 3) 2Pb (1-a) RbaBr (4+δ) (0<a≦0.7,-0.7≦δ<0)、 (C 4H 9NH 3) 2Pb (1-a) Na a Br (4+δ-y) I y (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Li a Br (4+δ-y) I y (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Rb a Br (4+δ-y) I y (0<a≦0.7,-0.7≦δ<0,0<y<4)、 (C 4H 9NH 3) 2Pb (1-a) Na a Br (4+δ-y) Cl y (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Li a Br (4+δ-y) Cl y(0<a≦0.7,-0.7≦δ<0,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Rb a Br (4+δ-y) Cl y (0<a≦0.7,-0.7≦δ<0,0<y<4)、 (C 4H 9NH 3) 2PbBr 4、(C 7H 15 NH 3) 2PbBr 4、 (C 4H 9NH 3) 2PbBr (4-y) Cl y (0<y<4)、(C 4H 9NH 3) 2PbBr (4-y) I y (0<y<4)、 (C 4H 9NH 3) 2Pb (1-a) Zn a Br 4(0<a≦0.7)、(C 4H 9NH 3) 2Pb (1-a) Mg a Br 4(0<a≦0.7)、(C 4H 9NH 3) 2Pb (1-a) Co a Br 4(0<a≦0.7)、(C 4H 9NH 3) 2Pb (1-a) Mn a Br 4(0<a≦0.7)、 (C 7H 15 NH 3) 2Pb (1-a) Zn a Br 4(0<a≦0.7)、(C 7H 15 NH 3) 2Pb (1-a) Mg a Br 4(0<a≦0.7)、(C 7H 15 NH 3) 2Pb (1-a) Co a Br 4(0<a≦0.7)、(C 7H 15 NH 3) 2Pb (1-a) Mn a Br 4(0<a≦0.7)、 (C 4H 9NH 3) 2Pb (1-a) Zn a Br (4-y) I y (0<a≦0.7,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Mg a Br (4-y) I y (0<a≦0.7,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Co a Br (4-y) I y (0<a≦0.7,0<y<4)、(C 4H 9NH 3) 2Pb (1-a) Mn a Br (4-y) I y (0<a≦0.7,0<y<4)、 (C 4H 9NH 3) 2Pb (1-a) Zn a Br (4-y) Cl y (0<a≦0.7, 0<y<4), (C 4H 9NH 3) 2Pb (1-a) Mg a Br (4-y) Cl y (0<a≦0.7, 0<y<4), (C 4H 9NH 3) 2Pb (1-a) Co a Br (4-y) Cl y (0<a≦0.7, 0<y<4), (C 4H 9NH 3) 2Pb (1-a) Mn a Br (4-y) Cl y (0 < a ≦ 0.7, 0 < y < 4), etc. The semiconductor particle (A) may also be a ligand-containing semiconductor particle containing an organic ligand (G) coordinated to the semiconductor particle. The organic ligand (G) may, for example, be an organic compound having a polar group that exhibits coordination ability to the semiconductor particle. The organic ligand (G) may, for example, be coordinated to the surface of the semiconductor particle. The organic ligand (G) can be one ligand or two or more ligands. When the organic ligand (G) is an organic compound with a polar group, the organic ligand (G) is typically coordinated to the semiconductor particle via this polar group. The coordination of the organic ligand (G) is confirmed based on the uniform dispersion of the semiconductor particle (A) in a suitable dispersion medium for the organic ligand (G). From the viewpoint of improving the stability and dispersibility of the semiconductor particle (A) and its luminescence intensity, using semiconductor particles containing ligands as semiconductor particles (A) becomes advantageous. The polar group of the organic ligand (G) is preferably selected from carboxyl (-COOH) and amino (-NH) groups. 2) At least one group from the group consisting of the compounds. Polarity selected from this group can be advantageous in terms of improving coordination with semiconductor particles. Among these, a carboxyl group is more preferred from the viewpoint of improving luminescence intensity. The organic ligand (G) may have one or more polar groups. Furthermore, compounds having the aforementioned polar groups and also having a thiol group belong to the thiol-containing compounds (H) described later. Organic ligands (G) can be, for example, organic compounds represented by the following formula (x). X A -R X (x) In the formula, X A R is the polar group. X It is a monovalent hydrocarbon group that may contain heteroatoms (N, O, S, halogen atoms, etc.). This hydrocarbon group may have one or more unsaturated bonds, such as carbon-carbon double bonds. The hydrocarbon group may have a straight-chain, branched-chain, or cyclic structure. The number of carbon atoms in the hydrocarbon group may be, for example, 1 or more and 40 or less, or 1 or more and 30 or less. The methylene group contained in this hydrocarbon group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. Base R X It may also contain polar groups. For a specific example of such a polar group, refer to polar group X. A The description stated above. As X has a carboxyl group as a polar group ASpecific examples of organic ligands include formic acid, acetic acid, propionic acid, and other saturated or unsaturated fatty acids. Specific examples of saturated or unsaturated fatty acids include: saturated fatty acids such as butyric acid, valeric acid, hexanoic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, docosahexaenoic acid, and lignoceric acid; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, icosenoic acid, erucic acid, and nervonic acid; and linolenic acid, α-linolenic acid, γ-linolenic acid, stearidonic acid, dihomeno-γ-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, and adrenaline. Polyunsaturated fatty acids such as docosatraenoic acid (docosatetraenoic acid). X has an amino group as a polar group A Specific examples of organic ligands include those with a carboxyl group as a polar group, as illustrated above. A Organic ligands are formed by replacing the carboxyl group of an organic ligand with an amino group. In addition to those described above, compounds (G-1) and (G-2) can be listed as organic ligands represented by formula (x). Compound (G-1) is a polycarboxylic acid compound. The semiconductor particle (A) may contain only one compound (G-1) or may contain two or more compounds. As compounds (G-1), the following compounds can be listed for example: succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, heptadecanedioic acid, octadecanoic acid, nonadecanedioic acid, dodecanoic acid, 3-ethyl-3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenic acid, sebacic acid, hexafluorosecanedioic acid, acetylenic acid dicarboxylic acid, trans-torsinolic acid, 1,3-adamantane dicarboxylic acid, bicyclo[2.2.2]octane-1,4-dicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, 1,1-cyclopropane dicarboxylic acid, 1,1-cyclobutane dicarboxylic acid, cis-1,3-cyclohexane dicarboxylic acid or trans-1,3-cyclohexane dicarboxylic acid, cis-1 4-Cyclohexanedicarboxylic acid or trans-1,4-cyclohexanedicarboxylic acid, 1,1-cyclopentanediacetic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid, 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, tetrafluoroisophthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethylterephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1'-ferrocenedicarboxylic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 2,5-furandicarboxylic acid, diphenylcarboxylic acid Ketone-2,4'-dicarboxylic acid monohydrate, benzophenone-4,4'-dicarboxylic acid, 2,3-pyrazine dicarboxylic acid, 2,3-pyridine dicarboxylic acid, 2,4-pyridine dicarboxylic acid, 3,5-pyridine dicarboxylic acid, 2,5-pyridine dicarboxylic acid, 2,6-pyridine dicarboxylic acid, 3,4-pyridine dicarboxylic acid, pyrazole-3,5-dicarboxylic acid monohydrate, 4,4'-stilbene dicarboxylic acid, anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, chelidonic acid monohydrate, azobenzene-4,4'-dicarboxylic acid, azobenzene-3,3'-dicarboxylic acid, chlorobridged acid, 1H-imidazolium-4,5-dicarboxylic acid, 2,2-bis(4-carboxyphenyl)hexafluoropropane 1,10-bis(4-carboxyphenoxy)decane, dipropylmalonic acid, dithiodiethanolic acid, 3,3'-dithiodipropionic acid, 4,4'-dithiodibutyric acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl ether, ethylene glycol bis(4-carboxyphenyl) ether, 3,4-ethyldioxythiophene-2,5-dicarboxylic acid, 4,4'-isopropylidene diphenoxyacetic acid, 1,3-propanone dicarboxylic acid, methylene disalicylic acid, 5,5'-thiodisalicylic acid, tris(2-carboxyethyl)isocyanurate, tetrafluorosuccinic acid, α,α,α',α'-tetramethyl-1,3-phenylenediamine, 1,3,5-benzenetricarboxylic acid, etc. From the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, the molecular weight of compound (G-1) is preferably 3000 or less, more preferably 2500 or less, even more preferably 2000 or less, even more preferably 1000 or less, particularly preferably 800 or less, and most preferably 500 or less. The molecular weight of compound (G-1) is typically 100 or more. The molecular weight can be either the number average molecular weight or the weight average molecular weight. In this case, the number average molecular weight and the weight average molecular weight are the converted number average molecular weight and weight average molecular weight of standard polystyrene, respectively, determined by gel permeation chromatography (GPC). When the semiconductor particles containing ligands include compound (G-1), the content ratio of compound (G-1) to semiconductor particles, by mass ratio, is preferably 0.001 or more and 1 or less, more preferably 0.01 or more and 0.5 or less, and even more preferably 0.02 or more and 0.45 or less. If this content ratio is within this range, it becomes advantageous from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity. Compound (G-2) is different from compound (G-1), and is a compound containing a polyalkylene glycol structure and having a polar group at the molecule's end. The molecule's end is preferably the end of the longest carbon chain in compound (G-2) (the carbon atoms in the carbon chain can be replaced by other atoms such as oxygen atoms). Semiconductor particle (A) may contain only one compound (G-2) or more than two compounds. Semiconductor particle (A) may contain compound (G-1) or compound (G-2), or it may contain both compound (G-1) and compound (G-2). Furthermore, polycarboxylic acid compounds containing a polyalkylene glycol structure belong to compound (G-1). The polyalkylene glycol structure refers to the structure represented by the following formula (n is an integer greater than or equal to 2). [Chemistry 1] In the formula, R C It is an alkyl group, such as alkyl ethyl, alkyl propyl, etc. As a specific example of compound (G-2), polyalkylene glycol compounds represented by the following formula (G-2a) can be listed. [Chemistry 2] In formula (G-2a), X is a polar group, Y is a monovalent group, and Z is a polar group. C It is a divalent or trivalent basis. n is an integer greater than or equal to 2. m is 1 or 2. R C It is an alkyl group. The polar group X is preferably selected from carboxyl (-COOH) and amino (-NH) groups. 2) At least one group from the group consisting of the two groups. Polarity selected from the group can be advantageous in terms of improving coordination with semiconductor particles. Among them, from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the intensity of luminescence, polar group X is preferably a carboxyl group. The group Y is a monovalent group. There are no particular restrictions on the group Y; any monovalent hydrocarbon group that can have substituents (N, O, S, halogen atoms, etc.) can be listed. The -CH group contained in this hydrocarbon group... 2- can be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. The hydrocarbon group has, for example, 1 or more and 12 or less carbon atoms. The hydrocarbon group may also have unsaturated bonds. Examples of the radical Y include: alkyl groups having a straight-chain, branched-chain, or cyclic structure with 1 to 12 carbon atoms; and alkoxy groups having a straight-chain, branched-chain, or cyclic structure with 1 to 12 carbon atoms. Preferably, the alkyl or alkoxy group has 1 to 8 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 4 carbon atoms. The -CH group contained in the alkyl or alkoxy group... 2- can be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. Among them, the Y group is preferably a straight-chain or branched alkoxy group with 1 or more and 4 or fewer carbon atoms, and more preferably a straight-chain alkoxy group with 1 or more and 4 or fewer carbon atoms. The radical Y may contain a polar group. Examples of such polar groups include carboxyl groups (-COOH) and amino groups (-NH). 2) At least one group from the group consisting of the compounds. Wherein, as described above, the polycarboxylic acid compound containing the polyalkylene glycol structure belongs to compound (G-1). The polar group is preferably disposed at the end of group Y. Base Z C It is a divalent or trivalent base. Base Z C There are no particular restrictions; examples include divalent or trivalent hydrocarbon groups that may contain heteroatoms (N, O, S, halogen atoms, etc.). The hydrocarbon group may have, for example, 1 or more carbon atoms and 24 or fewer. The hydrocarbon group may also have unsaturated bonds. The base Z is a divalent base CExamples include: alkyl groups having a straight-chain, branched-chain, or cyclic structure with 1 to 24 carbon atoms; and alkenyl groups having a straight-chain, branched-chain, or cyclic structure with 1 to 24 carbon atoms. Preferably, the alkyl and alkenyl groups have 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, and even more preferably 1 to 4 carbon atoms. The -CH group contained in the alkyl and alkenyl groups... 2- can be substituted by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. It is a trivalent group. C Examples can be cited from the base Z, which is described as a divalent base. C A radical formed by removing one hydrogen atom from a group. Base Z C It can have a branching structure. A base Z with a branching structure... C Alternatively, a polyalkylene glycol structure different from the polyalkylene glycol structure represented by formula (G-2a) may be found in a branch chain that is different from the branch chain containing the polyalkylene glycol structure represented by formula (G-2a). Among them, base Z C Preferably, it is a straight-chain or branched alkyl group having 1 or more and 6 or fewer carbon atoms, and more preferably, it is a straight-chain alkyl group having 1 or more and 4 or fewer carbon atoms. R C The alkyl group is preferably a straight-chain or branched alkyl group having 1 or more and 6 or fewer carbon atoms, and more preferably a straight-chain alkyl group having 1 or more and 4 or fewer carbon atoms. In equation (G-2a), n is an integer greater than or equal to 2, preferably greater than or equal to 2 and less than 540, more preferably greater than or equal to 2 and less than 120, and even more preferably greater than or equal to 2 and less than 60. The molecular weight of compound (G-2) can be, for example, 150 or more and about 10,000 or less. From the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, it is preferably 150 or more and about 5,000 or less, and more preferably 150 or more and about 4,000 or less. This molecular weight can be either the number average molecular weight or the weight average molecular weight. In this case, the number average molecular weight and the weight average molecular weight are respectively the number average molecular weight and weight average molecular weight converted from standard polystyrene as determined by GPC. When the semiconductor particles containing ligands include compound (G-2), the content ratio of compound (G-2) to semiconductor particles, by mass ratio, is preferably 0.001 or more and 2 or less, more preferably 0.01 or more and 1.5 or less, and even more preferably 0.1 or more and 1 or less. If this content ratio is within this range, it becomes advantageous from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity. When the semiconductor particle (A) is a semiconductor particle containing ligands, the content ratio of the organic ligands to the semiconductor particles, by mass ratio, is preferably 0.001 or more and 1 or less, more preferably 0.01 or more and 0.8 or less, and even more preferably 0.02 or more and 0.5 or less. If this content ratio is within this range, it becomes advantageous from the viewpoint of improving the stability and dispersibility of the semiconductor particle (A) and the luminescence intensity. The content of the organic ligands mentioned here refers to the total content of all organic ligands. The content of semiconductor particles (A) in the composition (excluding the organic ligand (G) in the case of semiconductor particles containing ligands) exceeds 30% by mass relative to the total amount of solid components in the composition. This allows for the formation of a film with good luminescence intensity. From the viewpoint of improving luminescence intensity, the content of said solid components relative to the total amount of solid components is preferably 32% by mass or more, more preferably 35% by mass or more, further preferably 38% by mass or more, further preferably 40% by mass or more, and may also be 45% by mass or more or 50% by mass or more. Furthermore, from the viewpoint of improving the film residue rate (solvent resistance), the content of said solid components relative to the total amount of solid components is preferably 70% by mass or less, more preferably 65% ​​by mass or less, further preferably 60% by mass or less, and further preferably 55% by mass or less. In this specification, the total amount of solid components refers to the sum of the components contained in the composition after removing the solvent (I). The content of solid components in the composition can be determined by known analytical methods such as liquid chromatography or gas chromatography. The content of each component in the solid components of the composition can also be calculated based on the formulation during the preparation of the composition. [2] Resin (B) Resin (B) may contain one or more resins. Examples of resin (B) include resins [K1] to resin [K4]. Resin [K1]: a copolymer selected from the group consisting of at least one (a) (hereinafter also referred to as "(a)") and a monomer (c) (which is different from (a)) (hereinafter also referred to as "(c)") capable of copolymerizing with (a); Resin [K2]: a resin having a structure derived from (a) and (c) and (b) obtained by reacting a monomer (b) (hereinafter also referred to as "(b)") having a cyclic ether structure having 2 to 4 carbon atoms with an ethylene unsaturated bond and a copolymer of (a) and (c); Resin [K3]: a resin having a structure derived from (b) and (c) and (a) obtained by reacting a copolymer of (a) and (b) and (c); Resin [K4]: a resin having a structure derived from (b) and (c) and (a), obtained by reacting a copolymer of (a) and (b) and (c) and then reacting it with a carboxylic anhydride. As (a), examples include: unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, o-vinylbenzoic acid, m-vinylbenzoic acid, and p-vinylbenzoic acid; and unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, succinic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, and 1,4-cyclohexene dicarboxylic acid. Methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, and other bicyclic unsaturated compounds containing carboxyl groups; Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic acid bicyclo[2.2.1]hept-2-ene anhydride, and other unsaturated dicarboxylic acid anhydrides; unsaturated mono[(meth)acrylic acid alkyl] esters of di- or higher polycarboxylic acids, such as succinate mono[2-(meth)acrylic acid oxyethyl] ester and phthalate mono[2-(meth)acrylic acid oxyethyl] ester; unsaturated (meth)acrylates containing both hydroxyl and carboxyl groups in the same molecule, such as (meth)acrylate α-(hydroxymethyl) ester. Among these, (meth)acrylate and maleic anhydride are preferred from the viewpoint of copolymerization reactivity. In this specification, (meth)acrylic acid refers to acrylic acid and / or methacrylic acid. The same applies to "(meth)acrylyl", "(meth)acrylate", etc. (b) For example, a monolith having a cyclic ether structure having 2 to 4 carbon atoms (e.g., selected from at least one of the group consisting of an oxecyclopropane ring, an oxecyclobutane ring, and a tetrahydrofuran ring) and an ethylene unsaturated bond. (b) Preferably, a monolith having a cyclic ether structure having 2 to 4 carbon atoms and a (meth)acrylic acid oxy group. For example, as in (b): glycidyl (meth)acrylate, β-methyl glycidyl (meth)acrylate, β-ethyl glycidyl (meth)acrylate, glycidyl vinyl ether, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, α-methyl-o-vinyl benzyl glycidyl ether, α-methyl-m-vinyl benzyl glycidyl ether, α-methyl-p-vinyl benzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene, 2,4-bis(glycidyl... Monomers of 2,5-bis(glycidoxymethyl)styrene, 2,6-bis(glycidoxymethyl)styrene, 2,3,4-tris(glycidoxymethyl)styrene, 2,3,5-tris(glycidoxymethyl)styrene, 2,3,6-tris(glycidoxymethyl)styrene, 3,4,5-tris(glycidoxymethyl)styrene, 2,4,6-tris(glycidoxymethyl)styrene, etc., containing oxocyclic propane rings and vinyl unsaturated bonds; Monomers of 3-methyl-3-methylpropenyloxymethyloxetane, 3-methyl-3-propenyloxymethyloxetane, 3-ethyl-3-methylpropenyloxymethyloxetane, 3-ethyl-3-propenyloxymethyloxetane, 3-methyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, etc., having an oxetane ring and an ethylene-like unsaturated bond; Monomers of tetrahydrofurfuryl acrylate (e.g., Biscoat V#150, manufactured by Osaka Organic Chemicals Co., Ltd.), tetrahydrofurfuryl methacrylate, etc., having a tetrahydrofuran ring and an ethylene-like unsaturated bond, etc. Regarding the aspect that the reactivity of resins [K2] to [K4] is high and unreacted residues are not easily left during the manufacture of (b), as (b), it is preferable to be a monolithic form having an oxopropane ring and an ethylene unsaturated bond. As for (c), examples include: methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, dibutyl methacrylate, tributyl methacrylate, 2-ethylhexyl methacrylate, dodecyl methacrylate, lauryl methacrylate, stearyl methacrylate, cyclopentyl methacrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo[5.2.1.0] 2,6 ] Decane-8-yl ester (commonly known in this art as "(meth)acrylate dicyclopentyl ester"; also sometimes referred to as "(meth)acrylate tricyclodecyl ester"), (meth)acrylate tricyclo[5.2.1.0 2,6Decen-8-yl ester (commonly known in this art as "(meth)acrylate dicyclopentenyl ester"), dicyclopentyloxyethyl ester (meth)acrylate, isobornyl ester (meth)acrylate, adamantyl ester (meth)acrylate, allyl ester (meth)acrylate, propargyl ester (meth)acrylate, phenyl ester (meth)acrylate, naphthyl ester (meth)acrylate, benzyl ester (meth)acrylate, and other (meth)acrylates; hydroxyl-containing (meth)acrylates such as 2-hydroxyethyl ester (meth)acrylate and 2-hydroxypropyl ester (meth)acrylate; dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, and diethyl itaconic acid. Bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo [2.2.1]Hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene, etc., are bicyclic unsaturated compounds. N-Phenylacetinimide, N-Cyclohexylmaleimide, N-Benzylmaleimide, N-Succinimido-3-maleimide benzoate, N-Succinimido-4-maleimide butyrate, N-Succinimido-6-maleimide hexanoate, N-Succinimido-3-maleimide propionate, N-(9-acridyl)maleimide and other dicarbonyl nimidide derivatives; styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, etc.Among these, styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, and bicyclo[2.2.1]hept-2-ene are preferred in terms of copolymerization reactivity and heat resistance of resin (B). Of all the constituent units constituting resin [K1], the preferred ratio of constituent units originating from each of them in resin [K1] is: constituent units originating from (a): 2 mol% or more and 60 mol% or less; constituent units originating from (c): 40 mol% or more and 98 mol% or less; more preferably: constituent units originating from (a): 10 mol% or more and 50 mol% or less; constituent units originating from (c): 50 mol% or more and 90 mol% or less. If the ratio of the constituent units of resin [K1] is within the aforementioned range, there is a tendency for the composition to have excellent storage stability and the film to have excellent solvent resistance. Furthermore, when resin (B) contains constituent units originating from (a), it may contain two or more constituent units originating from (a). In this case, the ratio of constituent units originating from (a) (content rate on a mol basis) is the sum of the ratios of each constituent unit. The same applies to constituent units originating from other monomers such as (b) and (c). The resin [K1] can be manufactured, for example, by referring to the method described in the literature "Experimental Method for Polymer Synthesis" (written by Takayuki Otsu, Chemical Publishers Co., Ltd., 1st Edition, 1st Printing, March 1, 1972) and the references described in that literature. Specifically, the following method can be used: A specified amount of (a) and (c), the polymerization initiator, and the solvent are placed into a reaction vessel. For example, nitrogen is used to replace the oxygen, thereby creating a deoxygenated environment. The mixture is then stirred while being heated and kept at a constant temperature. There are no particular limitations on the polymerization initiator and solvent used; those commonly used in this field can be used. For example, azo compounds (2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylpentanonitrile) etc.) or organic peroxides (benzoyl peroxide, etc.) can be used as polymerization initiators. As for the solvent, any solvent capable of dissolving the monomers is acceptable; solvents that can be included in the composition (I) and described later can be used as examples. The obtained copolymer can be used directly from the reaction solution, or from a concentrated or diluted solution, or it can be extracted in solid (powder) form using methods such as reprecipitation. If the solvent (I) described later is used as the solvent during polymerization, the reaction solution can be used directly in the preparation of the composition, thus simplifying the manufacturing process. Resin [K2] can be manufactured by adding a cyclic ether of carbons 2 to 4 in (b) to a carboxylic acid and / or carboxylic anhydride in (a) to the copolymer of (a) and (c) in the same manner as described in the method for manufacturing resin [K1]. In this case, the ratio of the constituent units derived from each is preferably the same as the ratio described for resin [K1]. Next, the cyclic ether having 2 to 4 carbon atoms in (b) is reacted with a portion of the carboxylic acid and / or carboxylic anhydride derived from (a) in the copolymer. After producing the copolymer of (a) and (c), the environment inside the flask is replaced with air from nitrogen, and the reaction is carried out in the presence of (b), a reaction catalyst for the carboxylic acid or carboxylic anhydride and the cyclic ether (e.g., organophosphorus compounds, metal complexes, amine compounds, etc.) and a polymerization inhibitor (e.g., hydroquinone, etc.), for example, at a temperature above 60°C and below 130°C for 1 to 10 hours, thereby producing resin [K2]. Compared to (a) 100 mol, the amount used in (b) is preferably 5 mol or more and 80 mol or less, and more preferably 10 mol or more and 75 mol or less. By setting it within this range, there is a tendency for the preservation stability of the composition, as well as the balance between the solvent resistance, heat resistance and mechanical strength of the membrane, to become better. Organophosphorus compounds that can serve as reaction catalysts include, for example, triphenylphosphine. Amine compounds that can serve as reaction catalysts include, for example, aliphatic tertiary amine compounds or aliphatic quaternary ammonium salt compounds; specific examples include, for instance, tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, and tetrabutylammonium chloride. From the viewpoint of the luminescence intensity of the membrane, organophosphorus compounds are preferred as reaction catalysts. The amount of the reaction catalyst used is preferably 0.001 parts by mass or more and 5 parts by mass or less, relative to the total amount of 100 parts by mass of (a), (b), and (c). The amount of the polymerization inhibitor used is preferably 0.001 parts by mass or more and 5 parts by mass or less, relative to the total amount of 100 parts by mass of (a), (b), and (c). The charging method, reaction temperature, and time, among other reaction conditions, can be appropriately adjusted taking into account factors such as the heat generated by the manufacturing equipment or polymerization. Furthermore, similarly to polymerization conditions, the charging method or reaction temperature can be appropriately adjusted taking into account factors such as the heat generated by the manufacturing equipment or polymerization. Regarding resin [K3], as a first stage, copolymers of (b) and (c) are obtained in the same manner as resin [K1]. Similarly, the obtained copolymer can be used directly from the reaction solution, or from a concentrated or diluted solution, or extracted in solid (powder) form using methods such as reprecipitation. The ratios of constituent units derived from (b) and (c) are preferably as follows, relative to the total number of moles of all constituent units constituting the copolymer: 5 mol% or more and 95 mol% or less, and 5 mol% or more and 95 mol% or less, respectively. More preferably, the ratios are as follows: 10 mol% or more and 90 mol% or less, and 10 mol% or more and 90 mol% or less, respectively. Resin [K3] can be obtained by reacting the carboxylic acid or carboxylic anhydride contained in (a) with the cyclic ether derived from (b) in the copolymer of (b) and (c) under the same conditions as those for manufacturing resin [K2]. The amount of (a) used in reaction with the copolymer is preferably 5 mol or more and 80 mol or less relative to 100 mol of (b). Resin [K4] is a resin obtained by further reacting a carboxylic anhydride with resin [K3]. The carboxylic anhydride is reacted with a hydroxyl group generated by the reaction of a cyclic ether with a carboxylic acid or a carboxylic anhydride. Examples of carboxylic anhydrides include: maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinyl phthalic anhydride, 4-vinyl phthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic bicyclic [2.2.1]hept-2-ene anhydride, etc. The amount of carboxylic anhydride used is preferably 0.5 mol or more and 1 mol or less, relative to the amount used in (a) of 1 mol. Examples of resins [K1], [K2], [K3], and [K4] include: (meth)acrylate benzyl acrylate / (meth)acrylate copolymer, styrene / (meth)acrylate copolymer, etc. [K1]; resins obtained by adding glycidyl methacrylate to (meth)acrylate / (meth)acrylate copolymer, resins obtained by adding glycidyl methacrylate to (meth)acrylate tricyclodecyl acrylate / styrene / (meth)acrylate copolymer, resins obtained by adding glycidyl methacrylate to (meth)acrylate tricyclodecyl acrylate / (meth)acrylate benzyl acrylate / (meth)acrylate copolymer, etc. [K2]; resins obtained by reacting (meth)acrylate with a copolymer of (meth)acrylate tricyclodecyl acrylate / (meth)acrylate glycidyl acrylate, resins obtained by reacting (meth)acrylate with a copolymer of (meth)acrylate tricyclodecyl acrylate / (meth)acrylate glycidyl acrylate, etc. [K3]; Resins such as [K4] are obtained by reacting (meth)acrylic acid with a copolymer of tricyclodecyl (meth)acrylic acid / glycidyl (meth)acrylic acid to obtain a resin, and further reacting the obtained resin with tetrahydrophthalic anhydride. As a further example of resin (B), the resin described in Japanese Patent Application Publication No. 2018-123274 can be cited. Such resin can be exemplified as a polymer having double bonds in its side chains and containing, in its main chain, a constitutive unit (α) represented by formula (I) and a constitutive unit (β) represented by formula (II), and further containing an acid group (hereinafter also referred to as "resin (Ba)"). The acid group can be introduced into the resin (Ba) by, for example, by the resin (Ba) containing a constitutive unit (γ) derived from an monomer containing an acid group (e.g., (meth)acrylic acid). Preferably, the resin (Ba) contains constitutive units (α), (β), and (γ) in its main chain backbone. [Chemistry 3] [In the formula, R] A and R B "Same or different" indicates a hydrogen atom or a hydrocarbon group with 1 to 25 carbon atoms; "n" indicates the average number of repeating units in the constituent unit represented by formula (I), and is a number greater than or equal to 1. [Chemistry 4] [In the formula, R] C Same or different indicates hydrogen atom or methyl group; R D Same or different, representing straight-chain or branched-chain hydrocarbon groups with 4 to 20 carbon atoms; m represents the average number of repeating units of the constituent unit represented by formula (II), and is a number greater than 1. In the resin (Ba), from the viewpoint of the heat resistance or storage stability of the resin (Ba), the content of the constituent unit (α) is, for example, 0.5% by mass or more and 50% by mass or less, preferably 1% by mass or more and 40% by mass or less, and more preferably 5% by mass or more and 30% by mass or less, relative to the total amount of all monolithic units providing the main chain backbone of the resin (Ba). In Formula (I), n represents the average number of repeating units of the constituent unit (α) in the resin (Ba), and n can be set such that the content of the constituent unit (α) falls within the aforementioned range. From the viewpoint of solvent resistance of the membrane, the content of the constituent unit (β) relative to 100% by mass of all monolithic units providing the main chain backbone of the resin (Ba) is, for example, 10% by mass or more and 90% by mass or less, preferably 20% by mass or more and 80% by mass or less, and more preferably 30% by mass or more and 75% by mass or less. In Formula (II), m represents the average number of repeating units of the constituent unit (β) in the resin (Ba), and m can be set such that the content of the constituent unit (β) falls within the aforementioned range. From the viewpoint of the solubility of resin (Ba) relative to solvent (I), the content of constituent unit (γ) is, for example, 0.5% by mass or more and 50% by mass or less, preferably 2% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 45% by mass or less, relative to the total amount of all monolithic units providing the main chain skeleton of resin (Ba). As a further example of resin (B), polyalkylene glycol compounds can be cited. Examples of polyalkylene glycol compounds include polyethylene glycol and polypropylene glycol. The weight-average molecular weight (Mw) of resin (B) as determined by gel permeation chromatography (GPC) based on standard polystyrene is preferably 9000 or less. Resin (B) possessing this Mw tends to readily increase the luminescence intensity of the membrane. For example, the Mw of resin (B) based on standard polystyrene is 1000 or more and 9000 or less; from the viewpoint of membrane strength, it is preferably 2000 or more and 8500 or less, more preferably 3000 or more and 8500 or less. To achieve the Mw of resin (B) within the aforementioned range, reaction conditions such as the selection of raw materials, loading method, reaction temperature, and reaction time can be appropriately combined and adjusted. The molecular weight distribution of resin (B) [weight average molecular weight (Mw) / number average molecular weight (Mn)] determined by GPC is, for example, 1.0 or more and 6.0 or less, and from the viewpoint of improving the luminescence intensity of the film, it is preferably 1.2 or more and 4.0 or less. From the viewpoint of improving the luminescence intensity and solvent resistance of the membrane, the acid value of resin (B) is preferably 90 mgKOH / g or higher and 150 mgKOH / g or lower, more preferably 95 mgKOH / g or higher and 140 mgKOH / g or lower, and even more preferably 100 mgKOH / g or higher and 130 mgKOH / g or lower. The acid value is a value determined as the amount (mg) of potassium hydroxide required to neutralize 1 g of resin (B), and can be determined, for example, by titration using an aqueous solution of potassium hydroxide. From the viewpoint of improving the luminescence intensity of the film, resin (B) is preferably a resin containing a double bond equivalent of 300 g / eq or more and 2000 g / eq or less, and more preferably a resin containing a double bond equivalent of 500 g / eq or more and 1500 g / eq or less. Examples of resins having a double bond equivalent of 300 g / eq or more and 2000 g / eq or less include (meth)acrylic resins. Resin (B) is preferably a (meth)acrylic resin. The ratio (semiconductor particle (A) / resin (B)) of the content (mass%) of semiconductor particles (A) to the content (mass%) of resin (B) in the composition is, for example, 6.0 or less, preferably 5.5 or less, more preferably 5.0 or less, further preferably 4.0 or less, and further preferably 3.0 or less. From the viewpoint of improving the residual film yield (solvent resistance), this ratio is preferably less than 2.5, more preferably 2.2 or less, further preferably 2.0 or less, and further preferably 1.8 or less. Furthermore, from the viewpoint of improving the luminous intensity, this ratio is preferably greater than 0.7, more preferably 0.8 or more, further preferably 1.0 or more, further preferably 1.2 or more, and particularly preferably 1.4 or more. The content of resin (B) in the composition, relative to the total amount of solid components, is, for example, 5% by mass or more and 80% by mass or less, preferably 10% by mass or more and 70% by mass or less, more preferably 15% by mass or more and 60% by mass or less, and even more preferably 15% by mass or more and 50% by mass or less. If the content of resin (B) is within the range described above, there is a tendency for the semiconductor particles (A) to be easily dispersed and for the luminescence intensity of the film to be easily increased. In addition, it is easy to satisfy the ratio of the content of semiconductor particles (A) to the content of resin (B). [3] Polymerizable compound (C) The composition may include a polymerizable compound (C). The polymerizable compound (C) is a compound that can be polymerized by active free radicals, acids, etc. generated from the polymerization initiator (D) described later. The composition may also include two or more polymerizable compounds (C). Examples of polymerizable compounds (C) include photopolymerizable compounds that harden upon exposure to light and thermopolymerizable compounds that harden upon exposure to heat. Examples of photopolymerizable compounds include photofree radical polymerizable compounds that harden upon exposure to light and via a free radical polymerization reaction, and photocationic polymerizable compounds that harden upon exposure to light and via a cationic polymerization reaction. Photopolymerizable compounds are preferably photofree radical polymerizable compounds. The weight average molecular weight of the photopolymerizable compound is, for example, 150 or more and 3000 or less, preferably 150 or more and 2900 or less, and more preferably 250 or more and 1500 or less. Examples of photoradical polymerizable compounds include polymerizable compounds with vinyl unsaturated bonds, among which (meth)acrylate compounds are preferred. Examples of (meth)acrylate compounds include: monofunctional (meth)acrylate monomers having one (meth)acryloxy group in the molecule (hereinafter also referred to as "compound (C-1)"), difunctional (meth)acrylate monomers having two (meth)acryloxy groups in the molecule (hereinafter also referred to as "compound (C-2)"), and polyfunctional (meth)acrylate monomers having three or more (meth)acryloxy groups in the molecule (hereinafter also referred to as "compound (C-3)"). Examples of compounds (C-1) include: methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, pentyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate, nonyl methacrylate, dodecyl methacrylate (lauryl methacrylate), hexadecyl methacrylate, octadecyl methacrylate, cyclohexyl methacrylate, methoxyethyl methacrylate, butoxyethyl methacrylate, phenoxyethyl methacrylate, nonylphenoxyethyl methacrylate, glycidyl methacrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, propyl methacrylate... Isoborneol acrylate, dicyclopentyl acrylate, dicyclopentenyl acrylate, dicyclopentenoxyethyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, tetrahydrofurfuryl acrylate, 2-hydroxyethyl acrylate, benzyl acrylate, phenyl acrylate, mono(2-acryloyloxyethyl) succinate, N-[2-(acryloyloxy)ethyl]phthalimide, N-[2-(acryloyloxy)ethyl]tetrahydrophthalimide, 2-(2-ethyleneoxyethoxy)ethyl acrylate, ω-carboxy-polycaprolactone monoacrylate, ethyl carbitol (meth)acrylate ((meth)acrylate ethoxyethoxyethyl acrylate), 3,3,5-trimethylcyclohexyl acrylate, etc. As compounds (C-2), examples include: 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,5-pentanediol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecanediethanol di(meth)acrylate, ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, etc. Methacrylates, propylene glycol dimethacrylates, dipropylene glycol dimethacrylates, tripropylene glycol dimethacrylates, polypropylene glycol dimethacrylates, neopentyl glycol hydroxytrimethylacetate dimethacrylates, tri(2-hydroxyethyl)isocyanurate dimethacrylates with two hydroxyl groups substituted by (meth)acryloxy groups, dimethacrylates of a diol obtained by adding 1 mole of neopentyl glycol to 4 moles or more of ethylene oxide or propylene oxide with two hydroxyl groups substituted by (meth)acryloxy groups, and bisphenol A. Diols obtained by adding 1 mole to 2 moles of ethylene oxide or propylene oxide, wherein the two hydroxyl groups are substituted with (meth)acryloxy groups, and di(meth)acrylates are obtained by adding 1 mole to 3 or more moles of ethylene oxide or propylene oxide, wherein the two hydroxyl groups are substituted with (meth)acryloxy groups, and di(meth)acrylates are obtained by adding 1 mole to 4 or more moles of ethylene oxide or propylene oxide, wherein the two hydroxyl groups are substituted with (meth)acryloxy groups, etc. Examples of compounds (C-3) include: glyceryl tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, and tri(2-(meth)acryloxyethyl) isocyanurate. Esters, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, pentaerythritol triacrylate succinate monoester, dipentaerythritol pentaacrylate succinate monoester, pentaerythritol triacrylate maleate monoester, dipentaerythritol pentaacrylate maleate monoester, etc. Examples of photocationically polymerizable compounds include: compounds having at least one oxetane ring (four-membered cyclic ether) in the molecule (hereinafter also referred to as "oxetane compounds"), compounds having at least one oxetane ring (three-membered cyclic ether) in the molecule (hereinafter also referred to as "epoxide compounds"), and vinyl ether compounds, etc. Examples of oxetane compounds include: 3-ethyl-3-hydroxymethyloxetane, 1,4-bis[(3-ethyl-3-oxetane-butyl)methoxymethyl]benzene, 3-ethyl-3-(phenoxymethyl)oxetane, di[(3-ethyl-3-oxetane-butyl)methyl] ether, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, and phenolic varnish oxetane, etc. These oxetane compounds are readily available commercially, and examples of commercially available products sold by Toa Synthetic (Co., Ltd.) include: "Aron Oxetane (registered trademark) OXT-101", "Aron Oxetane (registered trademark) OXT-121", "Aron Oxetane (registered trademark) OXT-211", "Aron Oxetane (registered trademark) OXT-221", and "Aron Oxetane (registered trademark) OXT-212", etc. Examples of epoxy compounds include: aromatic epoxy compounds, glycidyl ethers of polyols with alicyclic rings, aliphatic epoxy compounds, and alicyclic epoxy compounds. Examples of aromatic epoxy compounds include: bisphenol-type epoxy resins such as bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and bisphenol S diglycidyl ether; phenolic varnish-type epoxy resins such as phenolic varnish epoxy resin, cresol phenolic varnish epoxy resin, and hydroxybenzaldehyde phenolic varnish epoxy resin; and multifunctional epoxy resins such as tetrahydroxyphenylmethane glycidyl ether, tetrahydroxybenzophenone glycidyl ether, and epoxidized polyvinylphenol. Glycidyl ethers of polyols having alicyclic rings can be exemplified by the glycidyl etherification of nucleohydrogenated polyhydroxy compounds, wherein the nucleohydrogenated polyhydroxy compounds are obtained by selectively hydrogenating aromatic polyols under pressure in the presence of a catalyst. Examples of aromatic polyols include: bisphenol-type compounds such as bisphenol A, bisphenol F, and bisphenol S; phenolic varnish-type resins such as phenol-formaldehyde resin, cresol-formaldehyde resin, and hydroxybenzaldehyde-formaldehyde resin; and multifunctional compounds such as tetrahydroxydiphenylmethane, tetrahydroxybenzophenone, and polyvinylphenol. Glycidyl ethers can be prepared by reacting epichlorohydrin with alicyclic polyols obtained by hydrogenating the aromatic rings of these aromatic polyols. A preferred example of such glycidyl ethers of polyols having alicyclic rings is the diglycidyl ether of hydrogenated bisphenol A. Examples of aliphatic epoxy compounds include polyglycidyl ethers of aliphatic polyols or their alkylene oxide adducts. Specifically, examples include: diglycidyl ether of 1,4-butanediol; diglycidyl ether of 1,6-hexanediol; triglycidyl ether of glycerol; trimethylolpropane triglycidyl ether; diglycidyl ether of polyethylene glycol; diglycidyl ether of propylene glycol; diglycidyl ether of neopentyl glycol; and polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides (ethylene oxide or propylene oxide) to aliphatic polyols such as ethylene glycol, propylene glycol, or glycerol. Alicyclic epoxy compounds are compounds with at least one oxocyclic propane ring formed together with a carbon atom of an alicyclic ring. They can be made from the Celloxide series, Cyclomer (both manufactured by Daicel Inc.), Cyracure UVR series (manufactured by Dow Chemical Company), etc. Examples of vinyl ether compounds include: 2-hydroxyethyl vinyl ether, triethylene glycol vinyl monoether, tetraethylene glycol divinyl ether, and trimethylolpropane trivinyl ether. The photopolymerizable compound is preferably a polyfunctional (meth)acrylate monomer (compound (C-3)) containing three or more (meth)acryloxy groups within the molecule. Including compound (C-3) in the composition improves the film's heat resistance and mechanical strength, thus also enhancing luminescence intensity. Furthermore, including compound (C-3) in the composition improves the curability of the composition. Examples of compounds (C-3) include: compounds (C-3a) having three or more (meth)acryloxy groups and possessing an acidic functional group; and compounds (C-3b) having three or more (meth)acryloxy groups and lacking an acidic functional group. The photopolymerizable compound is preferably one containing at least one of compounds (C-3a) and (C-3b), or may contain two or more compounds (C-3a), two or more compounds (C-3b), or at least one of compound (C-3a) and at least one of compound (C-3b). Examples of the acidic functional group include, for example, a carboxyl group, a sulfonic acid group, and a phosphate group. Preferably, the acidic functional group c is a carboxyl group. The number of (meth)acryloxy groups in a molecule of compound (C-3) is, for example, 3 or more and 6 or less, preferably 3 or more and 5 or less, and more preferably 3. The number of acidic functional groups in a molecule of compound (C-3a) is 1 or more, preferably 1. When two or more acidic functional groups are present, the acidic functional groups may be different or the same, but it is preferable to have at least one carboxyl group. As compound (D-3a), examples include compounds having three or more (meth)acryloxy and hydroxyl groups, such as pentaerythritol tri(meth)acrylate or dipentaerythritol penta(meth)acrylate, obtained by esterification with dicarboxylic acids. Examples of such compounds include: compounds obtained by monoesterification of pentaerythritol tri(meth)acrylate with succinic acid; compounds obtained by monoesterification of dipentaerythritol penta(meth)acrylate with succinic acid; compounds obtained by monoesterification of pentaerythritol tri(meth)acrylate with maleic acid; and compounds obtained by monoesterification of dipentaerythritol penta(meth)acrylate with maleic acid. Among these, compounds obtained by monoesterification of pentaerythritol tri(meth)acrylate with succinic acid are preferred. Commercially available products containing compound (C-3a) include, for example, "Aronix M-510" manufactured by Toa Synthetic Co., Ltd., whose main component is a dicarboxylic acid anhydride adduct of pentaerythritol tri(meth)acrylate, and "Aronix M-520D" manufactured by Toa Synthetic Co., Ltd., whose main component is a dicarboxylic acid anhydride adduct of dipentaerythritol penta(meth)acrylate. These commercially available products have a carboxyl group as an acidic functional group. When the photopolymerizable compound includes compound (C-3), from the viewpoint of improving the curability of the composition, the heat resistance of the film, and the luminescence intensity, the content of compound (C-3) relative to the total amount of the photopolymerizable compound is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass or more, and may also be 30% by mass or more, 50% by mass or more, 70% by mass or more, 90% by mass or more, or 100% by mass. When the photopolymerizable compound contains compound (C-3), from the viewpoint of improving the curability of the composition, the heat resistance of the film, and the luminescence intensity, the content of compound (C-3) relative to the total amount of solid components of the composition is preferably 1% by mass or more and 50% by mass or less, more preferably 2% by mass or more and 40% by mass or less, more preferably 5% by mass or more and 30% by mass or less, and more preferably 8% by mass or more and 20% by mass or less. Photopolymerizable compounds may also contain a (meth)acrylate monomer (hereinafter also referred to as "compound (C-4)") having a vinyl ether group and a (meth)acrylyl group (preferably (meth)acryloxy) within the same molecule. Including compound (C-4) in the composition is sometimes advantageous in terms of increasing the luminescence intensity of the film. Compound (C-4) may be a compound belonging to any of compounds (C-1) to (C-3). The compound (C-4) preferably has 1 or more and 4 or less vinyl ether groups, more preferably 1 or more and 2 or less, and most preferably 1. The compound (C-4) preferably has 1 or more and 4 or less (meth)acrylic groups, more preferably 1 or more and 2 or less, and most preferably 1. As compounds (C-4), examples include: 2-ethoxyethyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 2-ethoxypropyl (meth)acrylate, 1-ethoxypropyl (meth)acrylate, 1-methyl-2-ethoxyethyl (meth)acrylate, 4-ethoxybutyl (meth)acrylate, 3-ethoxybutyl (meth)acrylate, 2-ethoxybutyl (meth)acrylate, 1-methyl-3-ethoxypropyl (meth)acrylate, 2-methyl-3-ethoxypropyl (meth)acrylate, 1-methyl-2-ethoxypropyl (meth)acrylate, 1,1-Dimethyl-2-ethyleneoxyethyl ester, 6-ethyleneoxyhexyl (meth)acrylate, 4-ethyleneoxycyclohexyl (meth)acrylate, (4-ethyleneoxymethylcyclohexyl)methyl (meth)acrylate, (3-ethyleneoxymethylcyclohexyl)methyl (meth)acrylate, (2-ethyleneoxymethylcyclohexyl)methyl (meth)acrylate, (4-ethyleneoxymethylphenyl)methyl (meth)acrylate, (3-ethyleneoxymethylphenyl)methyl (meth)acrylate, 2-ethyleneoxymethylphenyl (meth)acrylate, 2-(2-ethyleneoxy)methyl acrylate 2-(2-Ethyloxyethoxy)ethyl acrylate, 2-(2-Ethyloxyethoxy)propyl acrylate, 2-(2-Ethyloxyisopropoxy)propyl acrylate, 2-(2-Ethyloxyethoxy)isopropyl acrylate, 2-(2-Ethyloxyisopropoxy)isopropyl acrylate, 2-{2-(2-Ethyloxyethoxy)ethoxy}ethyl acrylate, 2-{2-(2-Ethyloxyisopropoxy)ethoxy}ethyl acrylate, 2- 2-(2-Ethyleneoxyisopropoxy)isopropoxy}ethyl ester, 2-{2-(2-Ethyleneoxyethoxy)ethoxy}propyl ester, 2-{2-(2-Ethyleneoxyethoxy)isopropoxy}propyl ester, 2-{2-(2-Ethyleneoxyisopropoxy)ethoxy}propyl ester, 2-{2-(2-Ethyleneoxyisopropoxy)isopropoxy}propyl ester, 2-{2-(2-Ethyleneoxyethoxy)ethoxy}isopropyl ester, 2-{2-(2-Ethyleneoxy)isopropoxy}propyl ester, 2-{2-(2-Ethyleneoxy)isopropoxy}isopropyl ester, 2-{2-(2-Ethyleneoxy)isopropoxy}propyl ester Ethoxy(2-(2-ethyleneoxyisopropoxy)ethoxy)isopropyl ester, 2-{2-(2-ethyleneoxyisopropoxy)ethoxy}isopropyl ester, 2-[2-{2-(2-ethyleneoxyethoxy)ethoxy}ethoxy]ethyl ester, 2-[2-{2-(2-ethyleneoxyisopropoxy)ethoxy}ethoxy]ethyl ester, 2-(2-[2-{2-{2-(2-ethyleneoxyethoxy)ethoxy}ethoxy]ethoxy)ethyl ester, etc. As a compound (C-4), it is preferably (meth)acrylate vinyloxy C. 1-6 Alkyl esters or (meth)acrylic acid (ethoxy C 1-4 Alkoxy)C 1-4 Alkyl ester, more preferably (meth)acrylic acid (ethoxylated C) 1-4 Alkoxy)C 1-4 Alkyl ester, preferably 2-(2-ethoxyethoxy)ethyl (meth)acrylate. When the photopolymerizable compound includes compound (C-4), from the viewpoint of improving the luminescence intensity of the film, the content of compound (C-4) relative to the total amount of the photopolymerizable compound is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 25% by mass or more, and preferably 85% by mass or less, even more preferably 75% by mass or less, even more preferably 65% ​​by mass or less, even more preferably 60% by mass or less, and particularly preferably 55% by mass or less. When the photopolymerizable compound contains compound (C-4), from the viewpoint of improving the luminescence intensity of the film, the content of compound (C-4) relative to the total amount of solid components of the composition is preferably 3% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 45% by mass or less, even more preferably 10% by mass or more and 40% by mass or less, and even more preferably 15% by mass or more and 35% by mass or less. When the photopolymerizable compound includes compound (C-1), the content of compound (C-1) relative to the total amount of the photopolymerizable compound is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, even more preferably 20% by mass or more, particularly preferably 25% by mass or more, and preferably 75% by mass or less, even more preferably 65% ​​by mass or less, even more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less. When the photopolymerizable compound contains compound (C-1), the content of compound (C-1) is preferably 5% by mass or more and 50% by mass or less, more preferably 8% by mass or more and 45% by mass or less, more preferably 10% by mass or more and 40% by mass or less, and more preferably 15% by mass or more and 35% by mass or less, relative to the total amount of solid components of the composition. When the composition contains a polymeric compound (C), from the viewpoint of improving the curability of the composition, the heat resistance of the film, and the luminescence intensity, the content of the polymeric compound (C) in the composition is preferably 1% by mass or more and 50% by mass or less, more preferably 2% by mass or more and 40% by mass or less, more preferably 5% by mass or more and 30% by mass or less, and more preferably 8% by mass or more and 20% by mass or less, when the composition contains a polymeric compound (C). [4] Polymerization Initiator (D) Where the composition contains a polymerizable compound (C), it is preferable to further include a polymerization initiator (D). The polymerization initiator (D) is a compound that can generate active free radicals, acids, etc., through the action of light or heat, thereby initiating the polymerization of the polymerizable compound (C). The composition may contain one or more polymerization initiators (D). Examples of polymerization initiators (D) include: photopolymerization initiators such as oxime compounds, benzyl ketone compounds, biimidazole compounds, triazine compounds, and acetyphosphine compounds; and thermal polymerization initiators such as azo compounds or organic peroxides. An example of an oxime compound is an oxime compound having the first molecular structure represented by the following formula (1). Hereinafter, the oxime compound will also be referred to as "oxime compound (1)". [Chemistry 5] From the viewpoint of improving the luminescence intensity of the film, the inclusion of oxime compound (1) as a polymerization initiator (D) can become advantageous. One reason speculated for this effect is that, due to the unique molecular structure of oxime compound (1), the absorption wavelength of oxime compound (1) changes significantly before and after the cracking (decomposition) of oxime compound (1), which is necessary for the initiation of photopolymerization, thus oxime compound (1) has a high photoradical polymerization initiation ability. In equation (1), R 1 R represents 11 OR 11 COR 11 SR 11 CONR 12 R 13 Or CN. R 11 R 12 and R 13 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. R 11 R 12 Or R 13 The hydrogen atom of the represented base can be converted via OR 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atom, or COOR 21 Replace. R 21 R 22 and R 23 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. R 21 R 22 Or R 23 The hydrogen atom of the radical can be substituted with CN, a halogen atom, a hydroxyl group, or a carboxyl group. (Regarding R) 11 R 12 R 13 R 21 R 22 Or R 23 When the indicated group has an alkyl group, the alkyl group may be composed of -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times. 24 This indicates a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. (R) 11 R 12 R 13 R 21 R 22 Or R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 12 With R 13 and R 22 With R 23 They can each form a ring together. * indicates a bond with other molecular structures besides the first molecular structure of the oxime compound (1), i.e., the second molecular structure. As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 Alkyl groups representing 1 to 20 carbon atoms can be exemplified by: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc. As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 The aryl groups represented by carbon numbers from 6 to 30 include, for example: phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracene, phenanthrene, phenyl substituted with one or more of the aforementioned alkyl groups, biphenyl, naphthyl, anthracene, etc. As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 Aryl groups representing 7 to 30 carbon atoms can be exemplified by: benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc. As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 The heterocyclic group represented by carbons of 2 to 20 can be exemplified by, for example: pyridinyl, pyrimidinyl, furanyl, thiopheneyl, tetrahydrofuranyl, dioxazolyl, benzoxazol-2-yl, tetrahydropyranyl, pyrrolidinyl, imidazolidyl, pyrazolidyl, tetrahydrothiazolyl, isotetrahydrothiazolyl, oxazolidyl, isoxazolidyl, piperidinyl, piperazinyl, morpholinyl, etc., preferably 5-membered to 7-membered heterocyclic groups. R in equation (1) 12 With R 13 and R 22 With R 23 The fact that they can form a ring together refers to R 12 With R 13 and R 22 With R 23 Each can form a ring together with the nitrogen, carbon, or oxygen atom it is attached to. Ra in formula (1) 12 With Ra 13 and Ra 22 With Ra 23 Rings that can be formed together include, for example, cyclopentane rings, cyclohexane rings, cyclopentene rings, benzene rings, piperidine rings, morpholine rings, lactone rings, lactamine rings, etc., preferably 5-membered to 7-membered rings. As R in equation (1) 11 R 12 R 13 R 21 R 22 and R 23 Halogen atoms that can be present in the form of substituents include: fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms. R in equation (1) 1 R is preferred 11 More preferably, it is an alkyl group having 1 to 20 carbon atoms, even more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms. An example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (2) below. The second molecular structure refers to the molecular structure portion of the oxime compound (1) other than the first molecular structure. The bond represented by "*" in formula (2) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (2), the benzene ring with "-*" in formula (2) is directly bonded to the carbonyl group with "-*" in formula (1). [Chemistry 6] In equation (2), R 2 and R 3 Represent R independently 11 OR 11 SR 11 COR 11 CONR 12 R 13 NR 12 COR 11 OCOR 11 COOR 11 SCOR 11 OCSR 11 COSR 11 CSOR 11 CN or halogen atoms. The presence of multiple R atoms... 2 At that time, these can be the same or different. When there are multiple R... 3 At that time, these can be the same or different. 11 R 12 and R 13 This indicates the same meaning as described above. s and t independently represent integers from 0 to 4. L represents a sulfur atom, CR... 31 R 32 CO or NR 33 R 31 R 32 and R 33 Each of these can independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an aralkyl group with 7 to 30 carbon atoms. (In R) 31 R 32 Or R 33 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. 31 R 32 and R 33 Each can independently form a ring with an adjacent benzene ring. R 4 It represents a hydroxyl group, a carboxyl group, or a group represented by the following formula (2-1). [Chemistry 7] (In equation (2-1), L) 1 Indicates -O-, -S-, -NR 22 -、-NR 22 CO-, -SO 2-, -CS-, -OCO-, or -COO-; R 22 Indicates the same meaning as described above; L 2 This indicates a group formed by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group formed by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, a group formed by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, or a group formed by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms; (in L) 2 When the indicated group has an alkyl group, the alkyl group may be composed of -O-, -S-, -COO-, -OCO-, or -NR. 22 -、-NR 22 COO-、-OCONR 22 -, -SCO-, -COS-, -OCS-, or -CSO- are interrupted 1 to 5 times; the alkyl moiety can be branched or cyclic. 4a OR 41 SR 41 CONR 42 R 43 NR 42 COR 43 OCOR 41 COOR 41 SCOR 41 OCSR 41 COSR 41 CSOR 41 CN or halogen atoms; where multiple R atoms exist 4a At that time, these can be the same or different; R 41 R 42 and R 43 Each of the following independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms, and is indicated by R. 41 R 42 and R 43 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. 42 With R 43 They can form a ring together; v represents an integer from 1 to 3) * represents a bond with the first molecular structure of the oxime compound (1). R in equation (2) 11 R 12 R 13 R 21 R 22 R 23 R 24 R 31 R 32 and R 33 and R in equation (2-1) 22 R 41 R 42 and R 43 The examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, and aralkyl groups having 7 to 30 carbon atoms are the same as those for R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same. R in equation (2) 11 R 12 R 13 R 21 R 22 R 23 R 24 and R in equation (2-1) 22 The examples of heterocyclic groups with 2 to 20 carbon atoms are related to R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same. R in equation (2) 31 R 32 and R 33The ability to independently form a ring with an adjacent benzene ring refers to R. 31 R 32 and R 33 Each of the three elements can independently form a ring with a specific adjacent benzene ring and the nitrogen atom to which it is attached. R in equation (2) 31 R 32 and R 33 Examples of rings that can be formed together with an adjacent benzene ring and Ra in formula (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together. L in equation (2-1) 2 It refers to a group formed by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. Examples of alkyl groups formed by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, for example when v is 1, include: methylene, ethyl, propyl, methyl ethyl, butyl, 1-methyl propyl, 2-methyl propyl, 1,2-dimethyl propyl, 1,3-dimethyl propyl, 1-methyl butyl, 2-methyl butyl, 3-methyl butyl, 4-methyl butyl, 2,4-dimethyl butyl, 1,3-dimethyl butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, dodecyl, tridecyl, tetradecyl, decadecyl, ethane-1,1-diyl, propane-2,2-diyl, etc. As a group formed by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, for example, when v is 1, examples include: 1,2-epenylphenyl, 1,3-epenylphenyl, 1,4-epenylphenyl, 2,6-epenylnaphthyl, 1,4-epenylnaphthyl, 2,5-dimethyl-1,4-epenylphenyl, diphenylmethane-4,4'-diyl, 2,2-diphenylpropane-4,4'-diyl, diphenyl sulfide-4,4'-diyl, diphenyl arbutin-4,4'-diyl, etc. As a group formed by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, for example, when v is 1, the group represented by formula (a) and the group represented by formula (b) below can be listed. [Chemistry 8] In equations (a) and (b), L 3 and L 5 L represents an alkyl group having 1 to 10 carbon atoms. 4 and L 6 [Indicates a single bond or an alkyl group having 1 to 10 carbon atoms] Examples of alkyl groups having 1 to 10 carbon atoms include: methylene, ethyl, propyl, methylethyl, butyl, 1-methylpropyl, 2-methylpropyl, 1,2-dimethylpropyl, 1,3-dimethylpropyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 4-methylbutyl, 2,4-dimethylbutyl, 1,3-dimethylbutyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, etc. As a group formed by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms, examples include, for example, 2,5-pyridinidyl, 2,6-pyridinidyl, 2,5-pyrimidineidyl, 2,5-thiopheneidyl, 3,4-tetrahydrofuranidyl, 2,5-tetrahydrofuranidyl, 2,5-furanidyl, 3,4-thiazolyl, 2,5-benzofuranidyl, 2,5-benzothiapheneidyl, N-methylindole-2,5-diyl, 2,5-benzothiazolyl, 2,5-benzoxazoleidyl, etc., which are divalent heterocyclic groups. As R in equation (2) 2 and R 3 and R in equation (2-1) 4a Examples of halogen atoms that can be represented include fluorine, chlorine, bromine, and iodine atoms. From the viewpoint of solubility in solvent (I) and developability of the composition, a preferred example of the structure represented by formula (2) is the structure represented by formula (2a) below. [Chemistry 9] In formula (2a), L' represents a sulfur atom or NR. 50 R 50 R represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms. 2 R 3 R 4, s and t represent the same meaning as described above. For the same viewpoint described above, another preferred example of the structure represented by equation (2) is the structure represented by equation (2b) below. [Chemistry 10] In equation (2b), R 44 It represents a hydroxyl group, a carboxyl group, or a group represented by the following formula (2-2); [Chemistry 11] (In equation (2-2), L) 11 It represents -O- or *-OCO-, where * indicates the same as L. 12 The bond, L 12 R represents an alkyl group having 1 to 20 carbon atoms, which can be interrupted by 1 to 3 -O- groups. 44a OR 55 or COOR 55 R 55 [Represents hydrogen atoms or alkyl groups having 1 to 6 carbon atoms] R 44 The base represented by formula (2-2) is preferred. In this case, it is advantageous in terms of the solubility of the oxime compound (1) in solvent (I) and the developability of the composition. L 12 The alkyl group represented preferably has 1 to 10 carbon atoms, more preferably 1 to 4. R 44a Preferably, it is a hydroxyl or carboxyl group, and more preferably a hydroxyl group. There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (2). For example, it can be manufactured by the method described in Japanese Patent Application Publication No. 2011-132215. Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (3) below. The bond represented by "*" in formula (3) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (3), the benzene ring with "-*" in formula (3) is directly bonded to the carbonyl group with "-*" in formula (1). [Chemistry 12] In equation (3), R 5This indicates a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. (R) 5 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. R 5 The hydrogen atom of the radical represented can be obtained via R 21 OR 21 COR 21 SR 21 NR 22 R 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 CSOR 21 hydroxyl group, nitro group, CN, halogen atom, or COOR 21 Replace. R 21 R 22 and R 23 This indicates the same meaning as described above. R 21 R 22 Or R 23 The hydrogen atom of the radical can be substituted with CN, a halogen atom, a hydroxyl group, or a carboxyl group. (Regarding R) 21 R 22 and R 23 When the indicated group has an alkyl group, the alkyl group may be composed of -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times. 24 This indicates the same meaning as described above. (Regarding R) 21 R 22 and R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 22 With R 23 They can form a ring together. R 6 R 7 R 8 and R 9 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 hydroxyl, nitro, CN, or halogen atom. R 61 R 62 R 63 R 64 and R 65 Each of the following can independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 R 62 R 63 R 64 Or R 65 The hydrogen atom of the represented base can be converted via OR 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atom, or COOR 21 Replace. R 6 With R 7 R 7 With R 8 and R 8 With R 9 They can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1). R in equation (3) 5 R 21 R 22 R 23 R 24 R 61 R 62 R 63 R 64 and R 65 The examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those for R in formula (1). 11 R 12 R 13 R 21 R 22 R 23and R 24 The examples are the same. R in equation (3) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 It can form a ring together with the nitrogen, carbon, or oxygen atom it is attached to. R in equation (3) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together. As R in equation (3) 6 R 7 R 8 and R 9 The halogen atom represented, and the substituted R 5 R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms with hydrogen atoms include: fluorine, chlorine, bromine, and iodine. From the viewpoint of solubility in solvent (I) and developability of the composition, in a preferred form, R 5 It is the basis represented by the following equation (3-1). [Chemistry 13] In formula (3-1), Z represents a group formed by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group formed by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, a group formed by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms, or a group formed by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms. When the group represented by Z has an alkyl extension moiety, the alkyl extension moiety may be -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- are interrupted 1 to 5 times; the alkyl moiety can be branched or cyclic. 21 R 22 and R 24 [Indicates the same meaning as described above] For the same purpose as described above, Z in formula (3-1) is preferably methylene, ethyl, or phenyl. For the same purpose as described above, R in formula (3-1) is preferably methylene, ethyl, or phenyl. 21 and R 22 Preferably, it is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, more preferably methyl, ethyl, or phenyl. In the same viewpoint described above, in another preferred embodiment, R... 7 It is a nitro group. There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (3). For example, it can be manufactured by the methods described in Japanese Patent Application Publication No. 2000-80068 and Japanese Patent Application Publication No. 2011-178776. Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (4) below. The bond represented by "*" in formula (4) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (4), the benzene ring with "-*" in formula (4) is directly bonded to the carbonyl group with "-*" in formula (1). [Chemistry 14] In equation (4), R 71This indicates a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. (R) 71 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. R 71 The hydrogen atom of the radical represented can be obtained via R 21 OR 21 COR 21 SR 21 NR 22 R 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 CSOR 21 hydroxyl group, nitro group, CN, halogen atom, or COOR 21 Replace. R 21 R 22 and R 23 This indicates the same meaning as described above. R 21 R 22 Or R 23 The hydrogen atom of the radical can be substituted with CN, a halogen atom, a hydroxyl group, or a carboxyl group. (Regarding R) 21 R 22 and R 23 When the indicated group has an alkyl group, the alkyl group may be composed of -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times. 24 This indicates the same meaning as described above. (Regarding R) 21 R 22 and R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 22 With R 23 They can form a ring together. R 72 R 73 and three Rs 74 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 hydroxyl, nitro, CN, or halogen atom. R 61 R 62 R 63 R 64 and R 65 Each of the following can independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 R 62 R 63 R 64 Or R 65 The hydrogen atom of the represented base can be converted via OR 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atom, or COOR 21 Replace. R 72 With R 73 And two Rs 74 They can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1). R in equation (4) 71 R 21 R 22 R 23 R 24 R 61 R 62 R 63 R 64 and R 65 The examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those for R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same. R in equation (4) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 It can form a ring together with the nitrogen, carbon, or oxygen atom it is attached to. R in equation (4) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together. As R in equation (4) 72 R 73 and R 74 The halogen atom represented, and the substituted R 71 R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms with hydrogen atoms include: fluorine, chlorine, bromine, and iodine. There are no particular limitations on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (4), for example, it can be manufactured by the methods described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601. Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (5) below. The bond represented by "*" in formula (5) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (5), the pyrrole ring with "-*" in formula (5) is directly bonded to the carbonyl group with "-*" in formula (1). [Chemistry 15] In equation (5), R 81 This indicates a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms. (R) 81 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. R 81 The hydrogen atom of the radical represented can be obtained via R 21 OR 21 COR 21 SR 21 NR 22 R 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 CSOR 21 hydroxyl group, nitro group, CN, halogen atom, or COOR 21 Replace. R 21 R 22 and R 23 This indicates the same meaning as described above. R 21 R 22 Or R 23 The hydrogen atom of the radical can be substituted with CN, a halogen atom, a hydroxyl group, or a carboxyl group. (Regarding R) 21 R 22 and R 23 When the indicated group has an alkyl group, the alkyl group may be composed of -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times. 24 This indicates the same meaning as described above. (Regarding R) 21 R 22 and R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 22 With R 23 They can form a ring together. R 82 R 83 R 84 R 85 and R 86 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 hydroxyl, nitro, CN, or halogen atom. R 61 R 62 R 63 R 64 and R 65 Each of the following can independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 R 62 R 63 R 64 Or R 65 The hydrogen atom of the represented base can be converted via OR 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atom, or COOR 21 Replace. R 83 With R 84 R 84 With R 85 and R 85 With R 86 They can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1). R in equation (5) 81 R 21 R 22 R 23 R 24 R 61 R 62 R 63 R 64 and R 65 The examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those for R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same. R in equation (5) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 It can form a ring together with the nitrogen, carbon, or oxygen atom it is attached to. R in equation (5) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together. As R in equation (5) 82 R 83 R 84 R 85 and R 86 The halogen atom represented, and the substituted R 81 R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms with hydrogen atoms include: fluorine, chlorine, bromine, and iodine. There are no particular limitations on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (5), for example, it can be manufactured by the methods described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601. Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (6) below. The bond represented by "*" in formula (6) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (6), the benzene ring with "-*" in formula (6) is directly bonded to the carbonyl group with "-*" in formula (1). [Chemistry 16] In equation (6), the four R 91 R 92 R 93 R 94 R 95 R 96 and R 97 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 hydroxyl, nitro, CN, or halogen atom. R 61 R 62 R 63 R 64 and R 65 Each of the following can independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. R 61 R 62 R 63 R 64 Or R 65 The hydrogen atom of the represented base can be converted via OR 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atom, or COOR 21 Replace. R 21 R 22 and R 23 This indicates the same meaning as described above. R 92 With R 93 R 94 With R 95 R 95 With R 96 and R 96 With R 97 They can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1). R in equation (6) 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 The examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those for R in formula (1). 11 R 12 R 13 R 21 R 22 and R 23 The examples are the same. R in equation (6) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 It can form a ring together with the nitrogen, carbon, or oxygen atom it is attached to. R in equation (6) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together. As R in equation (6) 91 R 92 R 93 R 94 R 95 R 96 and R 97 The halogen atom represented, and the substituted R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms with hydrogen atoms include: fluorine, chlorine, bromine, and iodine. There are no particular limitations on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (6), for example, it can be manufactured using the methods described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601. Other examples of photopolymerization initiators are photopolymerization initiators other than oxime compounds (1). Examples of other photopolymerization initiators include: oxime compounds other than oxime compounds (1), benzyl ketone compounds, biimidazole compounds, triazine compounds, and acetylsine compounds. Other than oxime compounds (1), examples of oxime compounds having a partial structure represented by the following formula (d1) can be listed. * indicates a bond. [Chemistry 17] Examples of oxime compounds having the partial structure represented by formula (d1) include: N-benzoyloxy-1-(4-phenylthiophenyl)butane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropane-1-one-2-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethane-1-imine, N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxane-3-dioxane-3-yl]ethane-1-imine, and N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxane-3-yl]ethane-1-imine, etc. Compounds such as pentylmethyloxy(benzoyl)-9H-carbazole-3-yl]ethane-1-imine, N-acetyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-3-cyclopentylpropane-1-imine, N-benzoyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-3-cyclopentylpropane-1-one-2-imine; compounds described in Japanese Patent Application Publication No. 2011-132215, International Publication No. 2008 / 78678, International Publication No. 2008 / 78686, and International Publication No. 2012 / 132558. Also usable are: Irgacure (registered trademark) OXE01, Irgacure OXE02, Irgacure OXE03 (all manufactured by BASF); N-1919, NCI-930, NCI-831 (all manufactured by ADEKA) and other commercially available products. The oxime compound having the partial structure represented by formula (d1) is preferably selected from at least one of the group consisting of N-benzoyloxy-1-(4-phenylthiophenyl)butane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine and N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropane-1-one-2-imine, more preferably N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine. Benzyl ketone compounds are compounds having a partial structure represented by formula (d2) or a partial structure represented by formula (d3). In these partial structures, the benzene ring may have substituents. [Chemistry 18] Examples of compounds having the structure represented by formula (d2) include: 2-methyl-2-morpholino-1-(4-methylthiophenyl)propane-1-one, 2-dimethylamino-1-(4-morpholinophenyl)-2-benzylbutane-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholino)phenyl]butane-1-one, etc. Commercially available products such as OMNIRAD (registered trademark) 369, OMNIRAD 907, and OMNIRAD 379 (all manufactured by IGM Resins) can also be used. Examples of compounds having the structure represented by formula (d3) include: 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propane-1-one, 1-hydroxycyclohexylphenyl ketone, oligomers of 2-hydroxy-2-methyl-1-(4-isopropenylphenyl)propane-1-one, α,α-diethoxyacetophenone, benzyl dimethyl ketal, etc. In terms of sensitivity, as a benzyl ketone compound, it is preferred to be a compound having the structure represented by formula (d2). As biimidazole compounds, for example, compounds represented by formula (d5) can be listed. [Chemistry 19] In formula (d5), R E ~R J [This indicates an aryl group with 6 to 10 carbon atoms that may have substituents] Examples of aryl groups having 6 to 10 carbon atoms include phenyl, toluene, xylyl, ethylphenyl, and naphthyl, with phenyl being preferred. Examples of substituents include halogen atoms and alkoxy groups having 1 to 4 carbon atoms. Examples of halogen atoms include fluorine, chlorine, bromine, and iodine, with chlorine being preferred. Examples of alkoxy groups having 1 to 4 carbon atoms include methoxy, ethoxy, propoxy, and butoxy, with methoxy being preferred. Examples of biimidazole compounds include: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (e.g., see Japanese Patent Application Publication No. 06-75372, Japanese Patent Application Publication No. 06-75373, etc.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole, and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole. Imidazoles, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(dialkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole (e.g., see Japanese Patent Publication No. 48-38403, Japanese Patent Publication No. 62-174204, etc.), and imidazole compounds in which the phenyl group at the 4,4',5,5'-position is substituted with a carboalkoxy group (e.g., see Japanese Patent Publication No. 7-10913, etc.). Among these, compounds represented by the following formulas or mixtures thereof are preferred. [Chemistry 20] Examples of triazine compounds include: 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[ [2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine, etc. Among these, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine is preferred. Examples of phosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide. Commercially available products such as OMNIRAD (registered trademark) 819 (manufactured by IGM Resins) can also be used. Other examples of photopolymerization initiators besides oxime compounds (1) include: benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as methyl benzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, and 4,4'-bis(diethylamino)benzophenone; quinone compounds such as 9,10-phenanthroquinone, 2-ethylanthraquinone, and camphorquinone; and 10-butyl-2-chloroacridone, benzoin, methyl phenylglyoxylate, and titanium decene compounds. When the composition contains a polymerization initiator (D), the content of the polymerization initiator (D) in the composition is, for example, 0.01% by mass or more and 20% by mass or less relative to the total amount of solid components in the composition. From the viewpoint of improving the sensitivity of the composition and improving the luminescence intensity and heat resistance of the film, it is more preferably 0.1% by mass or more and 15% by mass or less, more preferably 0.15% by mass or more and 10% by mass or less, and even more preferably 0.2% by mass or more and 8% by mass or less, or it may be 5% by mass or less or 3% by mass or less. [5] Light scattering agent (E) The composition may contain a light scattering agent (E). The film formed from this composition may exhibit light scattering properties. In a film containing a light scattering agent (E) in addition to semiconductor particles (A), the light scattering agent (E) scatters light emitted from semiconductor particles (A), thereby enhancing the luminescence intensity. The composition may contain two or more light scattering agents (E). Examples of light scattering agents (E) include: inorganic particles such as metal or metal oxide particles and glass particles. Examples of metal oxides include TiO₂. 2. SiO 2. BaTiO 3. While ZnO and other materials can efficiently scatter light, TiO2 is preferred. The light scattering agent (E) has an average particle size (D50) of, for example, 0.03 μm or more and about 20 μm or less, preferably 0.05 μm or more and 1 μm or less, and more preferably 0.05 μm or more and 0.5 μm or less. The average particle size of the light scattering agent (E) can be determined using a centrifugal sedimentation dispersion stability particle size distribution device and is expressed as the median diameter (D50) on a volume basis. As a light scattering agent (E), a substance in which the light scattering agent is pre-dispersed in part or all of the solvent (I) using a dispersant can also be used. Commercially available dispersants can be used. Examples of commercially available dispersants include: DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000, and 2001 manufactured by BYK-Chemie Japan. 2020, 2025, 2050, 2070, 2095, 2150, 2155; ANTI-TERRA-U, U100, 203, 204, 250; BYK-P104, P104S, P105, 220S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS; Bykumen, etc. The SOLSPERSE series manufactured by Lubrizol Corporation of Japan includes models such as 3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, and 76500. BASF manufactures EFKA series products including 46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, and 1503; Ajinomoto Precision Technology... Fine-Techno manufactures Ajisper PA111, PB711, PB821, PB822, PB824, etc. The content of light scattering agent (E) in the composition is, for example, 0.001% by mass or more and 50% by mass or less, relative to the total amount of solid components in the composition. From the viewpoint of improving the light scattering ability and luminescence intensity of the film, it is preferably 1% by mass or more and 30% by mass or less, and more preferably 2% by mass or more and 10% by mass or less. [6] Antioxidant (F) The composition may include antioxidant (F). As an antioxidant (F), there are no particular limitations on the antioxidant commonly used in industry, such as phenolic antioxidants, phosphorus antioxidants, phosphorus / phenolic complex antioxidants and sulfur antioxidants. Two or more antioxidants (F) may also be used together. Phosphorus / phenol complex antioxidants can be compounds with one or more phosphorus atoms and phenol atoms in their molecules. From the viewpoint of membrane luminescence intensity, antioxidants (F) are preferably phosphorus / phenol complex antioxidants. Examples of phenolic antioxidants include: Irganox 1010 (a registered trademark: pentaerythritol tetratetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF), Irganox 1076 (octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF), Irganox 1330 (3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(trimethylbenzene-2,4,6-triyl)tri-p-cresol, manufactured by BASF), and Irganox 3114 (Irganox...). 3114: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF (s.). Irganox 3790: 1,3,5-tris((4-tert-butyl-3-hydroxy-2,6-dimethyl)methyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF (s.). Irganox 1035: thiodiethyl bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF (s.). Irganox 1135: Irganox 1035. 1135: 3,5-bis(1,1-dimethylethyl)-4-hydroxy-C7-C9 alkyl ester of phenylpropionic acid, manufactured by BASF (s.). Irganox 1520L (4,6-bis(octylthiomethyl)-o-cresol, manufactured by BASF (s.). Irganox 3125 (Irganox 3125, manufactured by BASF (s.). Irganox 565 (2,4-bis(n-octylthio)-6-(4-hydroxy-3',5'-di-tertiary butylaniline)-1,3,5-triazine, manufactured by BASF (s.). Adekastab (registered trademark) AO-80. AO-80: 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid)-1,1-dimethylethyl)-2,4,8,10-tetraoxazolo(5,5) Undecane, manufactured by ADEKA (stock), Sumilizer (registered trademark) BHT, Sumilizer GA-80, Sumilizer GS (all manufactured by Sumitomo Chemical (stock), Cyanox 1790 (registered trademark, manufactured by Cytec (stock), Vitamin E (manufactured by Eisai (stock), etc.) Examples of phosphorus-based antioxidants include: Irgafos 168 (a registered trademark: tris(2,4-di-tert-butylphenyl)phosphite, manufactured by BASF), Irgafos 12 (tris[2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxane-6-yl]oxy]ethyl]amine, manufactured by BASF), and Irgafos 38 (…). 38: Bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl)ethyl phosphite (manufactured by BASF), Adekastab (registered trademark) 329K, Adekastab PEP36, Adekastab PEP-8 (and above, manufactured by ADEKA), Sandstab P-EPQ (manufactured by Clariant), Weston (registered trademark) 618, Weston 619G (and above, manufactured by GE), Ultranox 626 (manufactured by GE), etc. Examples of phosphorus / phenol complex antioxidants include: Sumilizer (registered trademark) GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1.3.2]dioxaphosphaheptan) (manufactured by Sumitomo Chemical Co., Ltd.), etc. Examples of sulfur-based antioxidants include: dialkyl thiodipropionate compounds such as dilauryl thiodipropionate, dimyristyl thiodipropionate, or distearate thiodipropionate, as well as β-alkyl mercaptopropionate compounds of polyols such as tetra[methylene(3-dodecylthio)propionate]methane. When the composition contains an antioxidant (F), the content of the antioxidant (F) in the composition is, for example, 0.05% by mass or more and 20% by mass or less relative to the total amount of solid components of the composition, preferably 0.1% by mass or more and 15% by mass or less, more preferably 0.2% by mass or more and 10% by mass or less, and even more preferably 0.5% by mass or more and 5% by mass or less. [7] Compounds containing thiol groups (H) The composition may include compounds containing thiol groups (H). By including compounds containing thiol groups (H), the luminescence efficiency of the film can be improved. The compounds containing thiol groups (H) may be compounds having one thiol group in the molecule, or compounds having two or more thiol groups. The composition may also include two or more compounds containing thiol groups (H). Examples of compounds containing a thiol group (H) include: alkane thiols such as 1-butanethiol, 1-octanethiol, 1-decanethiol, 1-dodecanethiol, 1-hexadecanethiol, and 1-octadecanethiol; aromatic thiols such as thiophenol; and thiols containing a carboxyl group and their salts such as mercaptoacetic acid, 3-mercaptopropionic acid, mercaptosuccinic acid, and 2-mercaptoethanesulfonate. Thiol-containing carboxylic acid esters include methyl mercaptoacetate, ethyl mercaptoacetate, 2-ethylhexyl mercaptoacetate, methyl 3-mercaptopropionate, methoxybutyl 3-mercaptopropionate, hexyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, octyl 3-mercaptopropionate, dodecyl 3-mercaptopropionate, octadecyl 3-mercaptopropionate, cyclohexyl 3-mercaptopropionate, tridecyl 3-mercaptopropionate, trimethylolpropane tris(3-mercaptopropionate), tri-[(3-mercaptopropoxy)-ethyl]-isocyanurate, pentaerythritol tetra(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), and dipentaerythritol hexa(3-mercaptopropionate); thiols containing hydroxyl groups include 2-mercaptoethanol and 3-mercapto-1,2-propanediol. 1,3,4,6-Tetra(2-mercaptoethyl)-3a,4,6,6a-tetrahydroimidazo[4,5-d]imidazo-2,5(1H,3H)-dione, 1,3,4,6-Tetra(3-mercaptopropyl)-3a,4,6,6a-tetrahydroimidazo[4,5-d]imidazo-2,5(1H,3H)-dione, and other thiol-containing glycourea derivatives, etc. From the viewpoint of improving the luminescence efficiency of the membrane, the compound (H) containing a thiol group is preferably a thiol containing a carboxyl group or a salt thereof. Furthermore, from the viewpoint of improving the luminescence efficiency of the membrane, the compound (H) containing a thiol group is preferably a compound having one thiol group within its molecule. When the number of thiol units contained in 100 g of the solid component of the composition is set as α (mmol), from the viewpoint of improving the luminescence efficiency of the film, α is preferably greater than zero, more preferably 0.4 or more, and even more preferably 0.6 or more, and even more preferably 0.8 or more. Furthermore, α is preferably less than 20.0, more preferably 18 or less, and even more preferably 16 or less. By keeping α less than 20.0, the time-related thickening of the composition can be suppressed. α can also be calculated based on the formulation during the preparation of the composition. Alternatively, α can be determined by quantifying the thiol groups contained in the composition. Examples of quantitative methods include titration using oxidizing agents such as iodine solution, titration using silver or mercury salts, and absorbance determination using Ellman's reagent. When the composition contains a compound (H) containing a thiol group, from the viewpoint of improving luminous efficiency and suppressing time-related thickening, the content of the compound (H) containing a thiol group in the composition is preferably 0.01% by mass or more and 2.2% by mass or less, more preferably 0.05% by mass or more and 2% by mass or less, and even more preferably 0.1% by mass or more and 1.8% by mass or less, relative to the total amount of solid components in the composition. [8] Solvent (I) The composition may include solvent (I). Examples of solvent (I) include: ester solvent (a solvent containing -COO- but not -O- in the molecule), ether solvent (a solvent containing -O- but not -COO- in the molecule), ether ester solvent (a solvent containing -COO- and -O- in the molecule), ketone solvent (a solvent containing -CO- but not -COO- in the molecule), alcohol solvent (a solvent containing OH but not -O-, -CO- and COO- in the molecule), aromatic hydrocarbon solvent, amide solvent, dimethyl sulfoxide, etc. Solvent (I) may also be used in combination with two or more. Examples of ester solvents include: methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, isopropyl butyrate, ethyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate, and γ-butyrolactone, etc. Examples of ether solvents include: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenethyl ether, and methyl anisole, etc. Examples of ether ester solvents include: methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, and diethylene glycol monobutyl ether acetate, etc. Examples of ketone solvents include: 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, and isophorone. Examples of alcohol solvents include: methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerol. Examples of aromatic hydrocarbon solvents include: benzene, toluene, xylene, and mesitylene. Examples of acetylamine solvents include: N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone. As solvent (I), it is preferably propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone or toluene, or a mixture of two or more of these. The content of solvent (I) in the composition is the ratio of the total mass of all solvents contained in the composition to the total amount of the composition, and is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, more preferably 100 parts by mass or more, more preferably 120 parts by mass or more, and preferably less than 1000 parts by mass, more preferably less than 500 parts by mass, more preferably less than 300 parts by mass, and more preferably less than 200 parts by mass. If the content of solvent (I) is within the above range, there is a tendency for the flatness of the composition layer during coating to become better, and for a film of appropriate thickness to be formed more easily. The concentration of solid components in the composition is preferably 5% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 50% by mass or less, and even more preferably 20% by mass or more and 45% by mass or less. If the concentration of solid components in the composition is low, it is easier to form a thin film. [9] Other components may also include polymerization inhibitors, fillers, other polymers, adhesion promoters, light stabilizers, polymerization initiators, leveling agents and other additives known in the art, as needed. <Method for Manufacturing the Composition> The composition can be manufactured by a method including the step of mixing the specified components and other components as needed. The method for manufacturing the composition may further include the step of preparing resin (B). The preferred method for manufacturing the composition includes: a first step of preparing a dispersion of semiconductor particles (A) containing ligands; and a second step of mixing the dispersion with other specified components (and other components as needed). The thiol-containing compound (H) is typically mixed with the dispersion containing the semiconductor particles containing ligands in the second step. The viscosity of the composition at 25°C (the viscosity at the time of composition preparation) is, for example, 1 cP or more and 3000 cP or less. From the viewpoint of ensuring good coatability of the composition and the appearance of the formed film, it is preferably 2 cP or more and 2000 cP or less, more preferably 5 cP or more and 1000 cP or less, even more preferably 10 cP or more and 500 cP or less, and even more preferably 10 cP or more and 100 cP or less. The viscosity of the composition can be measured using a Brookfield rotational viscometer. <Membrane and Manufacturing Method Thereof> The membrane of the present invention is a membrane formed from the components of the present invention. The manufacturing method of the membrane includes, for example, the following steps: forming a composition layer by coating the composition onto a substrate or spraying the composition onto a region defined by a dam in a substrate having a dam; and heat-treating the composition layer. The membrane may be formed on the entire surface of the substrate, or (for example, in a patterned manner) on a portion of the substrate surface. The method for manufacturing the film may include steps other than those described above. Examples of other steps include, for instance, an exposure step that irradiates the constituent layer with light, and a development step that is performed on the constituent layer after the exposure step. In the step of forming the composition layer, methods for coating the composition onto the substrate include spin coating, slot coating, and a combination of slot and spin coating. The step of forming the composition layer by ejecting the composition can be, for example, using inkjet printing to selectively eject the composition to areas defined by the embankment and allow it to adhere. Patterned composition layers can also be formed using stencil printing, screen printing, or printing application using a coating applicator. Examples of substrates include: quartz glass, borosilicate glass, alumina silicate glass, soda-lime glass with silica coating on the surface, etc.; or resin plates such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, etc.; silicon; and those on which aluminum, silver, silver / copper / palladium alloy films are formed. Patterned films can be formed on a substrate, for example, by first coating the substrate with a composition medium mask or spraying it onto the area defined by the dike, thereby forming a patterned composition layer. Next, the constituent layer is heat-treated to obtain a film. This heat treatment may include a drying step of the constituent layer (a step to remove volatile components such as solvents). Examples of drying methods include heat drying, vacuum drying, or combinations thereof. The temperature for heat drying is preferably 30°C or higher and 120°C or lower, more preferably 50°C or higher and 110°C or lower. The heating time is preferably 10 seconds or higher and 60 minutes or lower, more preferably 30 seconds or higher and 30 minutes or lower. In the case of vacuum drying, it is preferably carried out at a pressure of 50 Pa or higher and 150 Pa or lower. Regarding the drying of the constituent layer, multiple drying steps at different temperatures can be performed in multiple stages. The heat treatment step of the constituent layer may include the drying step (pre-baking) and a subsequent post-baking step. The heating temperature in the baking step is preferably above 150°C and below 250°C, more preferably above 160°C and below 235°C. The heating time is preferably above 1 minute and below 120 minutes, more preferably above 10 minutes and below 60 minutes. When the composition is curable (containing a polymeric compound (C) and preferably a polymerization initiator (D)), the film manufacturing method preferably includes the exposure step described above. Regarding a patterned curable film formed from a photocurable composition, taking the photolithography method as an example, it can be formed on a substrate in the following manner: First, a composition layer is formed on the substrate, followed by a drying step of heating and drying (pre-baking) and / or vacuum drying. The same methods as described above can be used as methods for forming and drying the composition layer. Next, the photomask used to form the target pattern shape is exposed to the constituent layers. Preferably, the light source used in the exposure is one that produces light with wavelengths of 250 nm or higher and 450 nm or lower. For example, depending on the absorption wavelength of the photopolymerization initiator, a bandpass filter can be used to selectively extract light near 436 nm, 408 nm, or 365 nm from that wavelength. Examples of suitable light sources include mercury lamps, light-emitting diodes (LEDs), metal halide lamps, and halogen lamps. To ensure uniform illumination of the exposed surface with parallel light, or to accurately align the photomask with the substrate to which the constituent layer is formed, it is preferable to use an exposure apparatus such as a mask aligner and a stepper. The exposed constituent layer hardens through polymerization by photopolymerizable compounds contained within it. The development step is performed by contacting the exposed substrate layer with a developing solution, whereby the unexposed portions of the substrate layer dissolve in the developing solution and are removed, thereby obtaining a patterned hardened film. Examples of developing solutions include aqueous solutions or organic solvents of alkaline compounds such as potassium hydroxide, sodium bicarbonate, sodium carbonate, and tetramethylammonium hydroxide. The concentration of the alkaline compound in the aqueous solution is preferably 0.01% by mass or more and 10% by mass or less, more preferably 0.03% by mass or more and 5% by mass or less. Examples of organic solvents are those similar to the solvent (H). The developing solution may also contain a surfactant. The developing method can be any of the following: immersion method, dipping method, or spray method. Furthermore, during development, the substrate can be tilted at any angle. Preferably, the patterned film obtained by development is further heated (post-baked). The heating temperature is preferably 150°C or higher and 250°C or lower, more preferably 160°C or higher and 235°C or lower. The heating time is preferably 1 minute or higher and 120 minutes or lower, more preferably 10 minutes or higher and 60 minutes or lower. By heating after development, unreacted photopolymerizable compounds contained in the film can be polymerized, thus obtaining a cured film with superior chemical resistance. Even without development, it is preferable to further heat (post-bake) the exposed constituent layer. On the other hand, as a method for forming a film on the entire surface of a substrate, the following methods can be listed: forming a composition layer on the substrate, drying it as needed, heating the composition layer and / or exposing the entire surface of the composition layer. The film thickness is not particularly limited, and can be appropriately selected according to the purpose. For example, it can be 1 μm or more and 30 μm or less, preferably 3 μm or more and 25 μm or less, more preferably 5 μm or more and 25 μm or less, and even more preferably 5 μm or more and 20 μm or less. The shape and size of the patterned resin film are not particularly limited. For example, the patterned resin film may have a square shape when viewed from above. According to the present invention, even when the film thickness is relatively small, a film with good luminous intensity can be provided. The membrane exhibits good luminescence intensity. The luminescence intensity of the membrane, measured according to the measurement method in the Example section described later, is preferably 900 μW or more, more preferably 1000 μW or more, even more preferably 1100 μW or more, and even more preferably 1200 μW or more. <Display Device> The display device of the present invention includes at least a light source and the film. Examples of display devices include liquid crystal display devices, organic electroluminescence (EL) display devices, and inorganic EL display devices. Specifically, display devices described in Japanese Patent Application Publication Nos. 2006-309219, 2006-310303, 2013-15812, 2009-251129, and 2014-2363 are examples. One embodiment of the display device includes a backlight serving as a blue light source and multiple patterns disposed on the viewing side of the backlight. The multiple patterns may be red, green, or white (transparent, achromatic) patterns, and at least one of the red and green patterns may be the film of the present invention. The colored patterns, including the red or green patterns containing the first particle (A-1), have the function of converting and emitting the wavelength of incident light. [Example] The present invention will now be described in more detail through examples. Unless otherwise specified, "%" and "parts" in the examples refer to mass percentage and mass parts, respectively. <Determination and Evaluation> (1) Weight-average molecular weight Mw and number-average molecular weight Mn of resin (B) The weight-average molecular weight Mw and number-average molecular weight Mn of resin (B) were determined by GPC under the following conditions. Apparatus: K2479 (manufactured by Shimadzu Corporation) Column: Shimadzu Shim-pack GPC-80M Column temperature: 40℃ Solvent: Tetrahydrofuran Flow rate: 1.0 mL / min Detector: Refractive index (RI) Calibration standard materials: TSK Standard Polystyrene F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation) (2) The acid value of resin (B) is accurately measured by weighing 3 g of resin (B) solution and dissolving it in a mixed solvent of 90 g of acetone and 10 g of water. A KOH aqueous solution of 0.1 is used as the titrant. The acid value of the resin (B) solution is determined by using an automatic titration device (com-555 manufactured by Hiranuma Sangyo Co., Ltd.). The acid value Av [mgKOH / g] of each 1 g of solid component is calculated based on the acid value of the solution and the solid component of the solution. (3) Solid composition of resin (B) solution: Measure about 1 g of resin (B) solution in an aluminum cup, dry it at 180°C for 1 hour, and then determine its mass. Calculate the solid composition of resin (B) solution [mass %] based on the amount of mass reduction. (4) Evaluation of the film's luminescence intensity: Preparation includes a light-emitting diode (LED) lamp with a luminescence wavelength of 444 nm and a narrow-pointing-angle sensing backlight (OPF series; manufactured by OPTEX FA) for the scratch-resistant cover as the backlight. The scratch-resistant cover is placed facing upwards with the backlight mounted, and an optical fiber for detecting the luminescence is installed at a height of 4 cm from the surface of the scratch-resistant cover, connected to the spectrometer described below. A glass substrate (eagle 2000; manufactured by Corning) is placed on the surface of the scratch-resistant cover of the backlight as a reference. In this state, the backlight is turned on, and the amount of light from the backlight is adjusted so that the total radiant flux (μW) of the backlight is 5000 μW across the glass substrate (eagle 2000; manufactured by Corning). Next, a substrate having a hardened film made of the composition is disposed on the surface of the glass substrate. In this state, a backlight is turned on, and the luminous intensity (μW) of the light emitted from the hardened film is measured in the form of cumulative radiant flux in the range of wavelengths from 485 nm to 780 nm. The luminous intensity is measured using a spectrometer (manufactured by Ocean Optics). The luminescence intensity values ​​shown in Table 1 are converted to values ​​when the thickness of the hardened film is 4 μm. This conversion is based on the following formula: Luminescence intensity (converted to 4 μm thickness) [μW] = (Measured luminescence intensity [μW]) × 4 [μm] / (Thickness of hardened film [μm]). The thickness of the hardened film is determined by measuring the step difference of scratches on the surface of the hardened film using a stylus step meter (Dektak XT, manufactured by Bluker). The substrate with the hardened film was fabricated as follows: On a 5 cm square glass substrate (Eagle 2000; manufactured by Corning), the composition was spin-coated to a thickness of 10 μm, and then pre-baked at 100°C for 3 minutes to form the composition layer. The substrate with the composition layer was then exposed to atmospheric conditions at 80 mJ / cm² using an exposure machine (TME-150RSK; manufactured by Topcon). 2 The substrate is irradiated with light at an exposure level (365 nm reference), developed, and then baked at 180°C for 60 minutes to obtain a substrate with a hardened film. (5) Evaluation of the luminous efficiency of the film The luminous efficiency of the film was measured using a PL quantum yield measuring device (automatic control electric monochromatic light source type, C9920-02G; manufactured by Hamamatsu Photonics). The measuring unit used an integrating sphere unit. A sample of the hardened film cut into 1 cm squares was placed inside the integrating sphere, and the reflected light obtained by irradiating the sample with excitation light from directly above was measured to obtain the luminous efficiency. A xenon lamp was used as the light source, and light with a wavelength of 450 nm was used as the excitation light. The sample of the hardened film was made by cutting a substrate with a hardened film, which was prepared by the same method as described in (4), into 1 cm squares. The values ​​shown in the "luminous efficiency" column of Table 1 are relative values ​​[%] when the luminous efficiency of Example 10 is set to 100%. (6) Evaluation of Residual Film Rate After Development: As a solvent resistance test, the following test was conducted to determine the residual film rate and evaluate the solvent resistance. On a 5 cm square glass substrate (Eagle 2000; manufactured by Corning), the composition was coated with a 10 μm film thickness using spin coating, and then pre-baked at 100°C for 3 minutes to form the composition layer. On the substrate with the composition layer formed, an exposure machine (TME-150RSK; manufactured by Topcon) was used to expose the substrate at 80 mJ / cm² under atmospheric conditions. 2 The substrate is irradiated with light at an exposure level (365 nm reference), developed, and then baked at 180°C for 60 minutes to obtain a substrate with a hardened film. Next, a test was conducted in which the substrate with the hardened film was immersed in acetone at 25°C for 5 minutes, and the residual film rate was determined according to the following formula. The thickness of the hardened film was measured by using a stylus-type step gauge (Dektak XT, manufactured by Bluker) to measure the step difference of the scratches generated on the surface of the hardened film. Residual film rate (%) = 100 × (thickness of the hardened film after the test) / (thickness of the hardened film before the test) (7) Determination of viscosity μ (25°C) and evaluation of viscosity enhancement of the composition: The viscosity [cP] of the compositions prepared in the Examples and Comparative Examples was measured using a Brookfield rotational viscometer at a constant temperature of 25°C and a rotation speed of 3 rpm. The viscosity of the composition immediately after preparation and the viscosity of the composition after standing for 10 days were measured, and the rate of change of viscosity (absolute value) was calculated according to the following formula: Rate of change of viscosity [%] = 100 × |Viscosity of composition after standing for 10 days - Viscosity of composition immediately after preparation| / (Viscosity of composition immediately after preparation) <Manufacturing Example 1: Preparation of a Dispersion of Semiconductor Particles (A1)> A toluene dispersion of InP / ZnSeS quantum dots coordinated with oleic acid as an organic ligand (G1) was prepared. The dispersion was subjected to vacuum distillation to remove toluene. 70 parts of cyclohexyl acetate were added relative to 30 parts of solids to obtain a dispersion of semiconductor particles (A1) (30% solids). <Example 2: Preparation of a dispersion of light scattering agent (E1)> 3 parts of DISPERBYK 21116 (manufactured by BYK-Chemie Japan) based on solid content were added to 70 parts of titanium dioxide nanoparticles, and propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA") was added in a total amount of 100 parts. The mixture was then stirred using a coating shaker until it was fully dispersed to obtain a dispersion of light scattering agent (E1) (73% solid content). <Manufacturing Example 3: Preparation of Resin (B1) Solution> In a flask including a stirrer, a reflux condenser with a thermometer, a dropping funnel, and a nitrogen inlet tube, 110 parts of PGMEA were added, and the mixture was stirred while being purged with nitrogen, and the temperature was raised to 80°C. A solution was obtained by dissolving 25 parts of dicyclopentyl methacrylate, 26 parts of methyl methacrylate, 16 parts of methacrylic acid, and 11 parts of 2,2'-azobis(2,4-dimethylpentanilide) in 110 parts of PGMEA. This solution was added dropwise to the flask using a dropping funnel, and the mixture was stirred at 80°C for 3 hours. Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and 0.8 parts of triphenylphosphine were added to the flask, and the temperature was raised to 110°C and stirred for 8 hours. This allowed the carboxylic acid and epoxy groups in the polymer to react, thereby introducing polymerizable unsaturated bonds. Subsequently, 17 parts of 1,2,3,6-tetrahydrophthalic anhydride were added and the reaction continued for 3 hours to introduce carboxylic acid groups into the side chains. The reaction solution was cooled to room temperature to obtain a resin (B1) solution. Regarding resin (B1), the weight-average molecular weight (Mw) converted from standard polystyrene is 7600, the molecular weight distribution is 2.1, the acid value is 100 mgKOH / g, and the solid content in the resin (B1) solution is 40% by mass. <Examples 1 to 12, Comparative Example 1> (1) Preparation of the composition The dispersion of semiconductor particles (A1) obtained in Manufacturing Example 1, the dispersion of light scattering agent (E1), the resin (B1) solution obtained in Manufacturing Example 3, and other components shown in Table 1 were mixed in a specified amount to prepare the composition. The contents of each component in the composition, determined based on the amount added, are shown in Table 1. In Table 1, components other than solvent (I) are contents converted from solid components (unit: parts by mass). The content of solvent (I) is in parts by mass. For example, semiconductor particles (A1) are formulated in the form of a dispersion of semiconductor particles (A1) in the preparation of the composition, but the contents shown in Table 1 are the amount of semiconductor particles (A1) contained in the dispersion itself. Solvent (I) in Table 1 includes the solvent contained in the dispersion or solution used in the preparation of the composition. The content of light scattering agent (E1) in Table 1 includes the dispersant. "(A) / (B)" in Table 1 indicates the ratio of the content of semiconductor particles (A) (mass%) to the content of resin (B) (mass%). The content of organic ligand (G1) in the composition shown in Table 1 was determined by measuring the concentration of organic ligand (G1) in the dispersion of semiconductor particles (A1) obtained in Manufacturing Example 1, and calculated accordingly. Specifically, after vacuum drying the dispersion of semiconductor particles (A1) at 150°C to remove the solvent, the weight change of the remaining solid components was measured using a thermogravimetric analyzer "TGDTA6200" at a heating rate of 5°C / min from 50°C to 550°C. The weight change from 50°C to 500°C was taken as the weight of the organic ligand (G1), and the concentration of organic ligand (G1) in the dispersion of semiconductor particles (A1) was calculated. Based on the formulation composition, the number of thiol groups α [mmol] contained in 100 g of the solid component of the composition was determined. The results are shown in Table 1. (2) The membrane is prepared according to (4) to (6) of the <Measurement and Evaluation> and then evaluated. The evaluation results of (4) to (7) of the aforementioned <Measurement and Evaluation> are shown in Table 1. [Table 1] The details of the abbreviations of the components shown in Table 1 are as follows. [1] Organic ligand (G1): Oleic acid [2] Polymerizable compound (C1): Aronix M-510 (photopolymerizable compound, carboxyl-containing polyfunctional (meth)acrylate, manufactured by Toa Synthetic Co., Ltd., 100% solids) [3] Polymerizable compound (C2): A-9550 (photopolymerizable compound, dipentaerythritol polyacrylate, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., 100% solids) [4] Polymerization initiator (D1): Photopolymerization initiator represented by the following formula. Manufactured by the method described in Japanese Patent Application Publication No. 2011-132215 (100% solids). [Chemical 21] [5] Antioxidant (F1): Sumilizer GP (phosphorus / phenolic complex antioxidant, manufactured by Sumitomo Chemical Co., Ltd., 100% solid content) [6] Thiol-containing compound (H1): BMPA (3-mercaptopropionic acid, manufactured by SC Organic Chemical Co., Ltd., 100% solid content) [7] Thiol-containing compound (H2): TMMP (trimethylolpropane tris(3-mercaptopropionic acid), manufactured by SC Organic Chemical Co., Ltd., 100% solid content) [8] Leveling agent (J1): F-554 (fluorinated leveling agent, manufactured by DIC Co., Ltd., 100% solid content) [9] Solvent (I1): A mixture of PGMEA and cyclohexyl acetate none none

Claims

1. A composition comprising semiconductor particles (A) and resin (B), wherein the content of semiconductor particles (A) is more than 30% by mass relative to the total amount of solid components of the composition, the resin (B) is a (meth)acrylic resin comprising a double bond equivalent of 300 g / eq or more and 2000 g / eq or less, and the ratio of the content of semiconductor particles (A) to the content of resin (B) is 4.0 or less.

2. The composition as claimed in claim 1 further comprises a solvent (I) of 60 parts by mass or more relative to 100 parts by mass of the solid component.

3. The composition as claimed in claim 1 further comprises a compound (H) containing a thiol group.

4. The composition as claimed in claim 3, wherein the number of thiol groups contained in 100 g of the solid component is less than 20.0 mmol.

5. The composition of any one of claims 1 to 4 further comprises a polymeric compound (C).

6. A composition comprising semiconductor particles (A), resin (B), and a compound (H) containing thiol groups, wherein the content of semiconductor particles (A) is more than 30% by mass relative to the total solid content of the composition, the resin (B) is a (meth)acrylic resin, the ratio of the content of semiconductor particles (A) to the content of resin (B) is 4.0 or less, and the number of thiol groups contained in 100 g of the solid content is less than 20.0 mmol.

7. A membrane formed from any one of claims 1 to 6.

8. A display device comprising the film as described in claim 7.