Substrate heating device and apparatus for processing substrate having the same

Abstract

A substrate heating apparatus and a substrate processing apparatus having the same are provided, particularly a substrate heating apparatus for heating a substrate and a substrate processing apparatus having the same. The substrate heating apparatus includes a substrate support for mounting a substrate thereon and a plurality of heaters provided below the substrate support. Each heater includes a connection terminal provided at one end of the respective heater and a heat-generating body extending from the connection terminal along a direction. These heaters are alternately arranged such that portions including these ends overlap each other in a direction intersecting the direction.

Description

Technical Field

[0001] The present invention relates to a substrate heating device capable of minimizing a non-heat generating area and a substrate processing apparatus having the substrate heating device. Prior Art

[0002] Generally speaking, semiconductor devices or display devices are manufactured by depositing various materials into thin film shapes on a substrate and patterning the deposited thin films. To achieve this, several stages of different processes are performed, such as deposition, etching, cleaning, and drying.

[0003] Here, a deposition process is performed to form a thin film on a substrate with the properties required for a semiconductor device or display device. To form the thin film on the substrate during the deposition process, the substrate may be sufficiently heated before the deposition process, thereby reducing deposition time and improving deposition efficiency.

[0004] In the case of large-area substrates, due to their slow heating rate, they are preheated in a preheating chamber or loadlock chamber before the main process. If an unpreheated substrate is introduced into the process chamber used for the main process, additional process time is required to heat the substrate in the process chamber.

[0005] In the related art, a heating device is used to heat a substrate during a deposition process or to preheat or heat a large-area substrate. In this heating device, a linear heater extending in one direction is arranged in multiple sections along the direction of extension. However, due to the connection terminals provided at the multiple ends of the linear heater, non-heating areas (without heating elements) inevitably occur between adjacent sections, making it difficult to uniformly heat the substrate. [Prior Art Documents] [Patent Documents]

[0006] (Patent Document 1) KR 10-2012-0040124 A Summary of the Invention

[0007] The present invention provides a substrate heating device capable of minimizing a non-heat generating area and a substrate processing equipment having the substrate heating device.

[0008] According to an exemplary embodiment, a substrate heating device includes: a substrate support portion for positioning a substrate thereon; and a plurality of heaters provided below the substrate support portion and each including a connection terminal provided at one end of each heater and a heat-generating body extending from the connection terminal in one direction, wherein the heaters are alternately arranged such that partial regions including the ends overlap with each other in another direction intersecting the aforementioned direction.

[0009] The heaters may include alternately arranged first heaters and second heaters, wherein the first heaters and the second heaters may be arranged so that the connection terminals do not overlap with each other and the heat-generating bodies do not overlap with each other.

[0010] The substrate heating device may further include: an electrode connected to a power source; and a cover having a through hole and provided on the electrode, wherein the connection terminal can be electrically connected to the electrode through the through hole.

[0011] The substrate heating device may further include a connector passing through the through hole to connect the connection terminal to the electrode.

[0012] The substrate heating device may further include a bolt inserted into the through hole to couple the connecting member to the electrode.

[0013] The cover may be made of insulating material.

[0014] The substrate heating apparatus may further include a reflection plate provided below the heaters.

[0015] All of these heaters may be disposed on a reflective plate, and edges of the reflective plate may be bent to surround the heaters.

[0016] According to another exemplary embodiment, a substrate processing apparatus includes: a chamber for providing a process space; and any one of the above-mentioned substrate heating devices installed in the process space. Simple diagram description

[0017] The exemplary embodiments can be understood in more detail through the following description in conjunction with the accompanying drawings, in which: FIG1 is a diagram illustrating a state where multiple heaters are arranged according to an exemplary embodiment. FIG2 is a diagram illustrating a state where connection terminals and electrodes are connected to each other according to an exemplary embodiment. FIG3 is a diagram illustrating a state where a substrate heating device is installed in a process chamber according to an exemplary embodiment. FIG4 is a diagram illustrating a state where a substrate heating device is installed in a loading chamber according to an exemplary embodiment. Implementation Method

[0018] Exemplary embodiments will be described in detail below with reference to the accompanying drawings. However, the present invention may be embodied in various forms and should not be construed as limited to the exemplary embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art. In the drawings, the dimensions of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0019] FIG. 1 is a diagram illustrating a state in which a plurality of heaters are arranged according to an exemplary embodiment, and FIG. 2 is a diagram illustrating a state in which connection terminals and electrodes are connected to each other according to an exemplary embodiment.

[0020] According to an exemplary embodiment, a substrate heating apparatus includes a substrate supporting portion 200 (see FIG3 and FIG4 ) for placing a substrate thereon and a substrate heating portion 100 provided below the substrate supporting portion to heat the substrate. The substrate supporting portion is used to support the substrate and will be described with reference to FIG3 and FIG4 .

[0021] Referring to Figures 1 and 2, a substrate heating unit 100 according to an exemplary embodiment includes connection terminals 114a and 114b provided at multiple ends of the substrate heating unit 100, and multiple heaters 110a and 110b extending from the connection terminals 114a and 114b in a direction. The heaters 110a and 110b are alternately arranged so that multiple partial regions including the ends overlap with each other in a direction intersecting the one direction. Furthermore, the heaters 110a and 110b can be arranged so that the connection terminals 114a and 114b do not overlap with the heat-generating bodies 112a and 112b, respectively.

[0022] The heaters 110a and 110b may include a plurality of first heaters 110a extending in a direction and alternately arranged along the direction, and a plurality of second heaters 110b extending in a direction and alternately arranged along the direction. For example, the first heaters 110a may extend in the X-axis direction and be spaced apart from each other in the Y-axis direction perpendicular to the X-axis direction, and the second heaters 110b may extend in the X-axis direction and be spaced apart from each other in the Y-axis direction perpendicular to the X-axis direction.

[0023] Each first heater 110a may include a first heat-generating body 112a extending in a single direction (i.e., the X-axis direction) and a first connection terminal 114a provided at one end of the first heat-generating body 112a. Here, the first connection terminal 114a may be provided at one end of the first heat-generating body 112a, at an end opposite to the one end, or at both ends (i.e., both ends). Similar to these first heaters, each second heater may include a second heat-generating body 112b extending in a single direction (i.e., the X-axis direction) and a second connection terminal 114b provided at one end, the other end, or both ends of the second heat-generating body 112b.

[0024] Each of the first and second heaters 110a, 110b may comprise a lamp heater extending in a single direction. Specifically, each of the first and second heaters 110a, 110b, for example, the heat-generating bodies 112a, 112b, may comprise a transparent tube made of a material such as quartz or a filament made of a material such as tungsten (W). Specifically, the first and second heaters 110a, 110b may be lamp heaters in which connection terminals 114a, 114b for connecting to an external power source to heat the filament are provided at respective ends of the heat-generating bodies 112a, 112b, which include the transparent tube and the filament. Each lamp heater can be configured by allowing the transparent tube to extend in a single direction (i.e., in a straight line). When the lamp heater extends in a straight line, the area occupied by the lamp heater can be reduced compared to a case where the lamp heater extends in a U-shape. Therefore, when the lamp-type heater is installed in the cavity, the redundant area caused by the installation of the lamp-type heater can be minimized to minimize the process space of the cavity.

[0025] In the related art, to heat a substrate during a deposition process or to preheat or heat a large-area substrate during a deposition process, a heating device can be used to heat the substrate. In this heating device, first heaters 110a extending along the X-axis and arranged along the Y-axis, and second heaters 110b extending along the X-axis and arranged along the Y-axis, are arranged in sections spaced apart from each other along the X-axis. However, in this case, since no heat is generated in the area between the first heater 110a and the second heater 110b, a non-heating region is created that does not heat the substrate. Furthermore, even when the first heater 110a and the second heater 110b are arranged very close to each other, the first connection terminal 114a provided at the end of the first heater 110a and the second connection terminal 114b provided at the end of the second heater 110b facing the first connection terminal do not release sufficient heat to heat the substrate. Therefore, the non-heating region caused by the facing connection terminals 114a and 114b may inevitably occur, making it difficult to uniformly heat the substrate.

[0026] Therefore, in the substrate heating portion 100 according to an exemplary embodiment, the heaters 110a and 110b extending along the one direction may be alternately arranged so that a plurality of partial regions including a plurality of ends overlap with each other along a direction intersecting the one direction to minimize a non-heat generating area.

[0027] For example, as shown in Figure 1, the first heaters 110a may extend along the X-axis and be spaced apart from each other along the Y-axis. Furthermore, the second heaters 110b may be positioned to one side of the first heater 110a along the X-axis. Here, the second heaters 110b may also extend along the X-axis and be spaced apart from each other along the Y-axis. In the second heater 110b, the region extending between the first heaters 110a and including the connection terminal 114a provided at the right end of the first heater (i.e., to the right of the first heater 110a) and the region including the connection terminal 114b provided at the left end of the second heater 110b (i.e., to the left of the second heater 110b) are positioned so as to overlap along the Y-axis. This minimizes the non-heat-generating region formed by the connection terminals 114a and 114b along the X-axis.

[0028] As shown in Figure 1, the heaters 110a and 110b can be arranged so that the connection terminals 114a and 114b do not overlap with the heat-generating bodies 112a and 112b. Specifically, the first connection terminal 114a of the first heater 110a can be positioned to overlap the left end of the second heat-generating body 112b of the second heater 110b, and the second connection terminal 114b of the second heater 110b can be positioned to overlap the right end of the first heat-generating body 112a of the first heater 110a. Thus, the first connection terminal 114a of the first heater 110a and the second connection terminal 114b of the second heater 110b can be positioned to not overlap, and the first heat-generating body 112a of the first heater 110a and the second heat-generating body 112b of the second heater 110b can be positioned to not overlap. Consequently, a specific amount of heat can be released in the X-axis direction by the first and second heat-generating bodies 112a and 112b over the entire area, allowing the substrate to be heated uniformly.

[0029] Although in FIG1 and FIG2 , the two first heaters 110 a are arranged along the Y-axis direction, and the two second heaters 110 b are arranged along the Y-axis direction on one side of the first heater 110 a along the X-axis direction, the number of the first heaters 110 a and the second heaters 110 b and the arrangement directions of the first heaters 110 a and the second heaters 110 b may be varied according to the size of the substrate and the amount of heat generated.

[0030] In addition to the heaters 110a and 110b, the substrate heating portion 100 according to an exemplary embodiment may further include an electrode 130 connected to an external power source to supply power to the heaters 110a and 110b, and a cover 140 having a through hole (not shown) and provided on the electrode 130.

[0031] Here, the substrate heating unit 100 can be installed in various locations. For example, the substrate heating unit 100 can be installed on the bottom surface of a chamber providing a process space, or a plate-shaped body having a predetermined thickness can be provided separately to mount the substrate heating unit 100 on the body.

[0032] Electrode 130 can be configured to connect an external power source to the heaters 110a and 110b. Electrode 130 can be provided, for example, on the bottom surface of the chamber or the top surface of the main body. As described above, electrode 130 can have a busbar shape to simultaneously supply power to the heaters. For example, electrode 130 can extend along the Y-axis direction to electrically connect to the first connection terminals 114a of the first heaters 110a arranged along the Y-axis, and can also extend along the Y-axis direction to electrically connect to the second connection terminals 114b of the second heaters 110b. However, the shape of electrode 130 is not limited to this and can be varied in various ways.

[0033] The first connection terminals 114a provided on the first heaters 110a and the second connection terminals 114b provided on the second heaters 110b can be connected to the electrodes 130. The substrate heating unit 100 according to an exemplary embodiment may further include a cover 140 made of an insulating material to prevent arcing between the first connection terminals 114a and the electrodes 130. For example, the cover 140 may be made of ceramic or quartz.

[0034] A cover 140 may be provided on the electrode 130, and through-holes may be defined in the cover 140 to allow the connection terminals 114a and 114b to pass therethrough and connect to the electrode 130. For example, a plurality of through-holes may be provided, allowing the connection terminals 114a and 114b to be connected to the electrode 130 disposed below the cover 140 through the through-holes. As shown in the figure, although the cover 140 extends along the Y-axis direction on the electrode 130, the cover 140 may have various shapes, such as entirely covering the electrode 130.

[0035] According to an exemplary embodiment, the substrate heating portion 100 may further include a connector 150 for connecting the connection terminals to the electrodes via through-holes. For example, the connector 150 may include conductive wiring to easily connect the connection terminals 114a and 114b to the electrodes 130 extending downward through the through-holes. Specifically, the connection terminals 114a and 114b may extend from the top or side of the through-holes on the electrodes 130 in the X-axis direction, while the electrodes 130 may extend from the bottom of the through-holes in the Y-axis direction. In this manner, the connection terminals 114a and 114b disposed on the electrodes 130 and the electrodes 130 disposed below the through-holes may be connected to each other via the connector 150. The connector 150 may be securely coupled to the electrodes 130 using bolts inserted into the through-holes.

[0036] Furthermore, the substrate heating unit 100 according to an exemplary embodiment may further include a reflective plate 160 provided below the heaters 110a and 110b. Although FIG2 illustrates the reflective plate 160 provided below the electrode 130, the reflective plate 160 may be provided above the electrode 130 to expose the electrode 130. In this case, all heaters 110a and 110b may be placed on the reflective plate 160, and the edges of the reflective plate 160 may be bent to surround the heaters 110a and 110b, thereby directing heat released from the bottom and side surfaces of the heaters 110a and 110b toward the top of the reflective plate 160. Specifically, the reflective plate may be bent upward from the edge of the main body 12 and provided as a metal plate that reflects heat released from the bottom and side surfaces of the heaters 110a and 110b, or may be made of a metal material such as a metal coating.

[0037] FIG. 3 is a diagram illustrating a state in which a substrate heating device is installed in a reaction chamber according to an exemplary embodiment.

[0038] Referring to FIG. 3 , a substrate processing apparatus according to an exemplary embodiment may be an apparatus for depositing thin films, and includes a reaction chamber 10 providing a process space for deposition, a substrate heating device provided in the reaction chamber 10 and including a substrate support portion 200 and a substrate heating portion 100, and a gas injection portion provided in the reaction chamber 10 to face the substrate support portion 200 and inject a process gas toward the substrate support portion 200. Furthermore, the substrate processing apparatus may further include a radio frequency (RF) power source (not shown) that applies power to generate plasma in the chamber 10, and a controller (not shown) that controls the RF power source.

[0039] The reaction chamber 10 provides a predetermined process space and is maintained sealed. The reaction chamber 10 may include a main body 12 having a substantially circular or square planar surface and sidewalls extending upward from the planar surface and having a predetermined space, and a lid 14 having a substantially circular or square planar surface and disposed on the main body 12 to seal the reaction chamber 10. However, the reaction chamber 10 is not limited thereto and may be manufactured in various shapes corresponding to the shape of the substrate S.

[0040] The substrate S provided to the chamber 10 may be placed on the substrate support 200. The substrate support 200 may include an electrostatic chuck to attract and hold the substrate S using electrostatic force, thereby positioning and supporting the substrate S. Alternatively, the substrate support 200 may support the substrate S through vacuum suction or mechanical force.

[0041] The substrate support portion 200 can be provided in a shape corresponding to the shape of the substrate S, such as a circle or rectangle. The substrate support portion 200 can include a substrate support member for placing the substrate S and an elevator disposed below the substrate support member to raise and lower the substrate support member. In this case, the substrate support member can be made larger than the substrate S, and the elevator can be provided to support at least a region of the substrate support member, such as the center portion. When the substrate S is placed on the substrate support member, the substrate support member can be moved closer to the gas injection unit 20.

[0042] The gas injection portion 20 may include a gas injector 24 installed inside the chamber 10 and a gas supplier 22 connected to the gas injector 24, so that at least a portion of the gas supplier 22 extends to the outside of the chamber 10.

[0043] The gas supply 22 supplies process gas to a gas injector 24, which is positioned on the top side of the reaction chamber 10 to inject the process gas toward the substrate S. The gas injector 24 may have a predetermined space. Furthermore, the gas injector 24 may have a top portion connected to the gas supply 22 and a bottom portion defining a plurality of injection holes (not shown) for injecting the process gas onto the substrate S. The gas injector 24 may have a shape corresponding to the shape of the substrate 10, such as a substantially circular or square shape. The gas injector 24 may be positioned at a predetermined distance from the sidewalls of the reaction chamber 10 and the lid 14. Furthermore, when plasma deposition is used for thin film deposition, the gas injector 24 may serve as a top electrode receiving power from an RF power source.

[0044] In order to deposit a thin film, the substrate needs to be heated to a predetermined temperature. Therefore, in a substrate processing apparatus according to an exemplary embodiment, the substrate heating portion 100 is installed below a substrate support portion 200, such as a substrate support member. As described above, the substrate heating portion 100 may include a plurality of heaters 110a, 110b having a plurality of ends provided with connection terminals 114a, 114b and extending from these ends in one direction, and these heaters 110a, 110b may be arranged so that portions of the areas including these ends overlap with each other. In addition, the substrate heating portion 100 may further include an electrode 130 connected to a power source, and a cover 140 having a through hole and provided on the electrode 130, and may further include a reflective plate 160 provided below these heaters 110a, 110b.

[0045] FIG. 4 is a diagram illustrating a state where a substrate heating device is installed in a loading chamber according to an exemplary embodiment.

[0046] 4 , the substrate processing apparatus may be an apparatus for transferring a substrate S to a reaction chamber while repeating a vacuum state and an atmospheric state, and may include a loading chamber 60 having a process space for accommodating and heating the substrate S, and a substrate heating device provided in the process space of the loading chamber 60 and including a substrate supporting portion 200 and a substrate heating portion 100.

[0047] Although not shown, the loading chamber 60 may include multiple slots, each providing a plurality of process spaces. Furthermore, multiple gates may be provided in the loading chamber 60. These gates may allow communication between the transfer chamber and the loading chamber 60, and may open and close the transfer chamber and the loading chamber 60. One gate or multiple gates may be provided in the loading chamber 60. A gate valve (not shown) may be provided in the loading chamber 60 to open and close the gates.

[0048] Furthermore, a pumping unit and a venting unit may be provided in the loading chamber 60. The pumping unit can be used to create a vacuum state within the loading chamber 60. Here, the pumping unit can be provided, for example, as a vacuum pump. The venting unit can be used to create an atmospheric state within the loading chamber 60. The venting unit can inject a purge gas into the loading chamber 60, thereby converting the vacuum state within the loading chamber 60 to an atmospheric state. Here, an inert gas such as nitrogen can be used as the purge gas. Furthermore, the purge gas injected from the venting unit can be used to remove foreign matter adhering to the substrate S positioned on the substrate support.

[0049] The substrate S placed in the loading chamber 60 can be preheated to a predetermined temperature for subsequent processing. Therefore, in a substrate processing apparatus according to an exemplary embodiment, the substrate heating unit 100 is installed below the substrate support unit 200. As described above, the substrate heating unit 100 may include a plurality of heaters 110a, 110b having multiple ends provided with connection terminals 114a, 114b and extending in a direction from these ends. The heaters 110a, 110b may be arranged so that portions of the areas including these ends overlap. Furthermore, the substrate heating unit 100 may further include an electrode 130 connected to an external power source, a cover 140 having a through hole and provided on the electrode 130, and a reflective plate 160 provided below the heaters 110a, 110b.

[0050] According to an exemplary embodiment, the heaters may be disposed such that partial areas of the connection terminals overlap with each other to minimize a non-heat generating area where no heat is generated, thereby uniformly heating the substrate.

[0051] In addition, an insulating cover can be provided between connection terminals provided in each heater and electrodes for applying power to the connection terminals to prevent arcing, and heat released from the heater can be concentrated into the substrate through the reflective plate to improve heating efficiency.

[0052] Although specific embodiments are described and illustrated using specific terms, these terms are merely examples for clarifying the exemplary embodiments. Therefore, it is obvious to those skilled in the art that the exemplary embodiments and technical terms can be implemented in other specific forms and variations without changing the technical concepts or important features. Therefore, it should be understood that simple modifications of the exemplary embodiments according to the present invention can fall within the technical spirit of the present invention.

[0053] S:Substrate 10: (Reaction) cavity 12: Subject 14: Cover 20: Gas injection unit 22: Gas supply 24: Gas Injector 60: Loading chamber 100: substrate heating unit 110a: first heater 110b: Second heater 112a: First heat-producing entity 112b: Second heat-producing body 114a: first connection terminal 114b: Second connection terminal 130: Electrode 140: Cover 150: Connector 160:Reflector 200: substrate support part

Claims

1. A substrate heating device, comprising: a substrate support for mounting a substrate thereon; and a plurality of heaters provided below the substrate support and each heater including a connection terminal provided at one end of each heater and a heat-generating body extending from the connection terminal along a direction, wherein the heaters are alternately arranged such that a plurality of partial regions including the ends overlap each other along another direction intersecting the direction, wherein the heaters include an alternately arranged first heater and a second heater, wherein the first heater and the second heater are arranged such that the connection terminals do not overlap each other and the heat-generating bodies do not overlap each other.

2. The substrate heating device as claimed in claim 1 further comprises: an electrode connected to a power source; and a cover having a through hole and provided on the electrode, wherein the connection terminal is electrically connected to the electrode through the through hole.

3. The substrate heating device as claimed in claim 2 further includes a connector for connecting the connection terminal to the electrode through the through hole.

4. The substrate heating device as described in claim 3 further includes a bolt inserted into the through hole to couple the connector to the electrode.

5. The substrate heating device as claimed in claim 2, wherein the cover is made of an insulating material.

6. The substrate heating device as claimed in claim 1 further includes a reflector plate provided below the heaters.

7. The substrate heating apparatus as claimed in claim 6, wherein all of the heaters are disposed on the reflector, and one edge of the reflector is bent to surround the heaters.

8. A substrate processing apparatus comprising: a cavity for providing a process space; and a substrate heating device as described in any one of claims 1 to 7, installed in the process space.

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