Planarization apparatus, planarization method, and product manufacturing method

Abstract

Whether planarization processing is performed is determined by highlighting the pressure member while the planarization member held by the member holding unit is not in contact with the components on the substrate held by the substrate holding unit. Determining whether planarization processing is performed in this way facilitates the stable separation of the planarization member used to planarize the components on the substrate.

Description

Planarization Equipment, Planarization Method, and Product Manufacturing Method This disclosure relates to planarization equipment, a planarization method, and a product manufacturing method. As the demand for semiconductor device miniaturization increases, in addition to traditional photolithography, microfabrication techniques that use a member (also referred to as a mold) to mold and cure an uncured curable composition on a substrate to pattern the composition on the substrate have attracted much attention. This technique is called imprint technology, and fine patterns of about several nanometers can be formed on the substrate. In recent years, techniques for planarizing a substrate using imprint technology have been discussed (Japanese Patent Application Laid-Open No. 2011-529626 [PCT Application Translation]). The technique discussed in Japanese Patent Application Laid-Open No. 2011-529626 [PCT Application Translation] is to cure the curable composition by dropping the curable composition and bringing a planarization member (also referred to as a super straight member) having a flat surface into contact with the dropped curable composition according to the substrate level difference, so as to mold a planarization surface on the substrate. This planarization technique typically uses a member of the same size as the substrate and applies a relatively large force to separate the planarization member from the substrate. In response to this, a technique for assisting separation after curing by pushing a push pin (also referred to as a pressing member) from a substrate stage through a cut (notch or orientation plane) in the substrate toward the planarization member during separation has been discussed (Japanese Patent Application Laid-Open No. 2022-544891 [PCT Application Translation]). According to one aspect of the present disclosure, a planarization equipment for planarizing a composition on a substrate using a planarization member includes: a substrate holding unit configured to hold the substrate; a member holding unit configured to hold the planarization member; a pressing member configured to protrude in a direction from the substrate toward the planarization member; and a control unit configured to determine whether to perform a planarization process by protruding the pressing member while the planarization member is not in contact with the composition, the planarization process including bringing the substrate into contact with the planarization member through the composition. Other features of various embodiments will be understood from the following description of exemplary embodiments in conjunction with the accompanying drawings. According to the planarization technique discussed in Japanese Patent Application Laid-Open No. 2022-544891 (translation of PCT application), the cut of the substrate and the push pin are intended to be positioned at the same position on the substrate holding unit. If their positions are different, the push pin may fail to contact the planarization member and assist in separation. Similarly, if the planarization member fails to overlap with the position of the push pin, the push pin may not be able to assist in separation. More specifically, if the substrate and the planarization member are laminated with either one offset from the push pin, the substrate and the planarization member are inseparable and the laminated sheet of the planarization member and the substrate finally becomes a defective product. Furthermore, it may be difficult to automatically carry out the laminated sheet of the planarization member and the substrate. At this time, the operator is expected to stop the planarization equipment and manually carry out the laminated sheet, which reduces the productivity of the planarization equipment. The exemplary embodiments will be described below with reference to the accompanying drawings. In the drawings, like components will be denoted by the same reference numerals, and redundant descriptions thereof will also be omitted. FIGS. 1A to 1C illustrate schematic diagrams of the configuration of a planarization apparatus 100 (molding apparatus). FIG. 1A is a view of the planarization apparatus 100 from the Y-axis side. FIG. 1B is a view of the planarization apparatus 100 from the X-axis side. FIG. 1C illustrates a diagram of the substrate holding unit 2 and the substrate stage 4 of the second processing unit 102 to be described below. The planarization apparatus 100 is configured to perform a molding process for molding a curable composition on a substrate 1. Specifically, the planarization apparatus 100 includes a first processing unit 101, a second processing unit 102, a substrate transfer processing unit 220, and a member transfer processing unit 320. The first processing unit 101 performs an application step of applying a curable composition to the substrate 1. The second processing unit 102 performs a contact step of bringing the curable composition on the substrate 1 into contact with the planarization member 11; a curing step of curing the curable composition in contact with the planarization member 11; and a separation step of separating the cured curable composition from the planarization member 11. In the planarization layer molding process, the foregoing steps are performed in sequence. Although this exemplary embodiment will be described with an example of using the first processing unit 101 and the second processing unit 102 in combination, the planarization apparatus 100 may include a single processing unit for performing the foregoing steps. In this specification and the accompanying drawings, directions are represented in the XYZ coordinate system, with the direction parallel to the surface of the substrate 1 being the XY plane. The directions parallel to the X-, Y-, and Z-axes of the XYZ coordinate system will be referred to as the X, Y, and Z directions, respectively. Rotations about the X-axis, about the Y-axis, and about the Z-axis are represented by θX, θY, and θZ, respectively. Control or drive with respect to the X-, Y-, and Z-axes is referred to as control or drive parallel to the X-axis direction, parallel to the Y-axis direction, and parallel to the Z-axis direction, respectively. Control or drive with respect to the θX-, θY-, and θZ-axes is referred to as control or drive with respect to rotation about an axis parallel to the X-axis, rotation about an axis parallel to the Y-axis, and rotation about an axis parallel to the Z-axis, respectively. Position is information that can be identified based on coordinates on the X-, Y-, and Z-axes. Orientation is information that can be identified by values on the θX-, θY-, and θZ-axes. Alignment represents position and / or orientation control. In this exemplary embodiment, positioning may include control for correcting or changing the shape of at least one of the substrate 1 and the planarizing member 11. The curable composition is one that cures when curing energy is applied (also referred to as uncured resin). Examples of curing energy include electromagnetic waves and heat. Examples of electromagnetic waves include light having a wavelength selected from a range of 10 nm or more to 1 mm or less, such as infrared rays, visible light, and ultraviolet rays. The curable composition is a composition that can be cured by light irradiation or heat. The photocurable composition that cures when exposed to light includes at least one of a polymerizable compound and a photoinitiator, and may include a non-polymerizable compound or a solvent when appropriate. The non-polymerizable component is at least one type of compound selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer compound. The curable composition is applied onto the substrate 1 in the form of a film by a spin coater or a slit coater. Alternatively, the curable compound can be applied onto the substrate 1 by a liquid nozzle in the form of droplets, islands formed by connecting droplets, or a film. The curable composition has a viscosity of, for example, 1 mPa·s or more and 100 mPa·s or less (viscosity at 25°C). The planarizing device 100 can use a planarizing member (also referred to as a mold or a superflat member) 11 having a plane 11a to mold a planarizing film (planarizing layer) of the curable composition on the substrate 1. In this case, the curable composition cures while in contact with the curable material on the plane 11a. This planarizing device 100 preferably simultaneously molds a planarizing film formed by another imprinting device on a plurality of irradiation regions of the substrate, where the planarizing member has substantially the same size as the substrate. A representative example of the base material of the substrate 1 is a silicon wafer. However, this is not restrictive. The substrate 1 can be freely selected from known semiconductor device substrates made of aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. The substrate 1 can be a substrate on which a surface treatment such as a silane coupling treatment, a silicon nitride treatment, and an organic film deposition is performed to improve the adhesion to the curable composition, and an adhesion layer is formed. The substrate 1 typically has, but is not limited to, a circular shape with a diameter of 300 mm. If light is used as the curing energy, the planarization member 11 is made of a material that allows the curing light to pass through. For example, the planarization member 11 is made of at least one of the following: glass, quartz, a light-transmitting resin (such as polymethyl methacrylate (PMMA) and polycarbonate resin), a transparent metal deposition film, polydimethylsiloxane or other elastic films, a photocurable film, and a metal film. The planarization member 11 can have a circular shape with a diameter of 300 mm, which is substantially the same size as the substrate 1. However, this is not restrictive, and the planarization member 11 can be slightly larger than the substrate 1 or have a rectangular shape. The thickness of the planarization member 11 can be, for example, 0.25 mm or more and less than 2 mm. However, the thickness is not limited to this, as long as the planarization member 11 has rigidity so that when placed on the substrate 1, it follows the surface shape of the substrate 1. Furthermore, the planarization member 11 has a plane to contact the curable composition on the substrate 1 and follow the surface shape of the substrate 1. This plane has the same size as the substrate 1 or has a size larger than the substrate 1. Furthermore, the structures of the first processing unit 101 and the second processing unit 102 will be described with reference to FIGS. 1A to 1C. The following description is provided by taking the use of ultraviolet (UV) as the curing energy as an example. Examples of the curable composition usable herein include monomers such as acrylate and methacrylate. As shown in FIGS. 1A to 1C, each of the first processing unit 101 and the second processing unit 102 includes a substrate holding unit 2 (substrate chuck), a stage driving unit 31, a base plate 5, a column 6, and a top plate 7. The first processing unit 101 further includes a substrate stage 3, a dispenser 20 (droplet supply unit), and a detection unit 300. The second processing unit 102 further includes a substrate stage 4, a guide bar plate 8, a guide bar 9, a head driving unit 10, a planarization member holding unit 12, and a head 13. The second processing unit 102 also includes an exposure unit 23 (curing unit) and a light source 24. In the second processing unit 102, the substrate stage 4 is equipped with a push pin 41 (pressing member). The planarization device 100 further includes a substrate transfer processing unit 220, a substrate transfer unit 25, a member transfer processing unit 320, and a control unit 200. Each substrate holding unit 2 includes chucks, such as a vacuum chuck and an electrostatic chuck, and holds the substrate 1 with the chuck. Substrate tables 3 and 4 are supported by the base plate 5 and support the substrate holding unit 2. The substrate tables 3 and 4 are driven in the X- and Y-axis directions to position the substrate 1 held by the substrate holding unit 2 at a predetermined position. The stage driving unit 31 includes, for example, a linear motor or a cylinder, and drives the substrate tables 3 and 4 at least in the X- and Y-axis directions. The stage driving unit 31 may have a function of driving the substrate tables 3 and 4 in two or more axial directions (e.g., six axial directions). The stage driving unit 31 includes a rotation mechanism and drives the substrate holding unit 2 or the substrate tables 3 and 4 around the θZ-axis. The planarization member holding unit 12 includes chucks, such as a vacuum chuck and an electrostatic chuck, and holds the planarization member 11 with the chuck. The head 13 holds the planarization member holding unit 12 (member holding unit). The head driving unit 10 drives the head 13 and thereby drives the planarization member holding unit 12 and the planarization member 11. The head driving unit 10 may be configured to drive the planarization member 11 on a plurality of axes. The columns 6 for supporting the top plate 7 are disposed on the base plate 5. The guide bars 9 of the second processing unit 102 are positioned through the top plate 7. One end of each guide bar 9 is fixed to the guide bar plate 8 and the other end is fixed to the head 13. The head driving unit 10 drives the guide bar 9 to drive the head 13 in the Z-axis direction. In this way, the planarization member 11 held by the planarization member holding unit 12 can contact the curable composition on the substrate 1, and the planarization member 11 can be separated from the curable composition on the substrate 1. The head driving unit 10 may include a mechanism for driving the head 13 on axes other than the Z-axis. The head driving unit 10 may include a mechanism for driving the head 13 on a plurality of axes (e.g., three axes, such as θX-, θY-, and Z-axes, or six axes, such as X, Y, Z, θX-, θY-, and θZ-axes). The substrate transfer processing unit 220 includes a substrate transfer unit 25 including a transfer head, and a substrate storage rack (not shown), where substrates loaded from outside the planarization device 100 and substrates processed by the processing unit can be temporarily stored. The substrate transfer unit 25 is configured to be able to transfer substrates among the substrate storage rack, the first processing unit 101, and the second processing unit 102. The planarization member 11 may be loaded into the planarization device 100 from outside by a planarization member transfer unit 32 including a transfer arm. The planarization member 11 may be transferred and positioned on the planarization member holding unit 12 through the member transfer processing unit 320 and held by the planarization member holding unit 12. The member transfer processing unit 320 may include a storage rack that can store the planarization member 11. A transportable planarization member storage unit may be provided in place of the storage rack. The dispenser 20 (supply unit) included in the first processing unit 101 disposes or supplies an uncured (liquid) curable composition onto the substrate 1. The dispenser 20 may include a discharge port (nozzle) for discharging, for example, the curable composition. The dispenser 20 supplies, for example, a small volume (e.g., 10 -12 μL) droplets of the curable composition onto the substrate 1 using a method such as the piezoelectric injection method or the micro solenoid method. The number of discharge ports in the dispenser 20 is not particularly limited and may be one or more. For example, the dispenser 20 has 100 or more discharge ports. These plural discharge ports are arranged, for example, in one or more rows. As shown in FIG. 1C, the substrate stage 4 of the second processing unit 102 is equipped with a push pin (pressing member) 41 that protrudes from the substrate holding unit 2 toward the substrate 1. The push pin 41 acts as an aid to separate the planarizing member 11 from the curable composition on the substrate 1. Specifically, when separating the planarizing member 11, the push pin 41 protrudes through the gap region of the cutout in the substrate 1, for example, the notch and the orientation plane, toward the planarizing member 11. The push pin 41 is protruded to press against the planarizing member 11 with a force that generates a direction to pull the planarizing member 11 away from the substrate 1 using the substrate 1 held by the substrate holding unit 2, so that the step of separating the planarizing member 11 can be assisted. The second processing unit 102 further includes a push pin contact detection unit 43 that detects the contact state of the push pin 41 with an object such as the substrate 1 and the planarizing member 11. The detection unit 300 of the first processing unit 101 can detect the position of a cutout such as a notch or an orientation plane in the substrate 1 held on the substrate holding unit 2. Specifically, the detection unit 300 may include an optical sensor that can detect the outer contour of the substrate 1, or a small camera that can directly observe the shape of the substrate 1. The exposure unit 23 has a window for allowing the curing energy (e.g., light of UV rays) provided by the light source 24 to pass through. The curable composition can be cured by light irradiation in a state (curing position) where the substrate stage 4 holding the substrate 1 in contact with the planarizing member 11 through the curable composition faces the exposure unit 23. The control unit 200 includes a processing unit and a storage unit such as a memory, and controls the entire planarizing apparatus 100. For example, the control unit 200 is composed of a field programmable gate array (FPGA) or other programmable logic devices (PLD), an application specific integrated circuit (ASIC), a general-purpose or special-purpose computer with a built-in program, or a combination of all or part of these. The control unit 200 acts as a processing unit that comprehensively controls the components of the planarizing apparatus 100 and executes the planarizing process. The planarization process is an example of a molding process for molding a curable composition on a substrate 1 and forms a cured curable composition film having a planarized surface. More specifically, in the planarization process, the planar 11a of the planarization member 11 is brought into contact with the curable composition on the substrate 1, so that the planar 11a follows the surface shape of the substrate 1, and the curable composition is planarized. The planarization process is typically performed in a batch manner, in other words, on a plurality of substrates included in the same batch. Furthermore, the outline of the entire procedure of the planarization process according to the present exemplary embodiment will be described with reference to FIGS. 2A to 2C. Herein, a process for dropping a composition onto the entire surface of the substrate 1 and bringing the composition into contact with the planarization member 11 to planarize the composition will be described. However, the composition on a partial area of the substrate 1 may be brought into contact with the planarization member 11 to planarize the composition. Initially, as shown in FIG. 2A, the dispenser 20 of the first processing unit 101 supplies or disposes the curable composition IM onto the substrate 1 having the underlying pattern 1a. FIG. 2A illustrates a state in which the curable composition IM is supplied to the substrate 1, but the planarization member 11 (planar 11a) is not brought into contact with the curable composition IM. The substrate 1 is then transported by the substrate transport unit 25 from the first processing unit 101 to the second processing unit 102. Furthermore, as shown in FIG. 2B, the head drive unit 10 adjusts the distance between the substrate 1 and the planarization member 11 so that the curable composition IM on the substrate 1 and the planarization member 11 (planar 11a) are in contact with each other (contact step). FIG. 2B illustrates a state in which the planarization member 11 is released by the planarization member holding unit 12, the planar 11a of the planarization member 11 is completely in contact with the curable composition IM on the substrate 1, and the planar 11a of the planarization member 11 follows the surface shape of the substrate 1. In the state illustrated in FIG. 2B, the substrate stage 4 is then driven to the position of the exposure unit 23. The light source 24 irradiates the curable composition IM on the substrate 1 with curing energy through the planarization member 11, so that the curable composition IM is cured (curing step). Furthermore, the substrate stage 4 is driven to the position of the head drive unit 10. The head drive unit 10 adjusts the distance between the substrate 1 and the planarization member 11 so that the planarization member 11 is separated from the curable composition IM on the substrate 1. The planarization member 11 is held by the planarization member holding unit 12. In this state, the substrate 1 and the planarization member 11 are separated in the Z-axis direction to separate the planarization member 11 from the curable composition IM on the substrate 1 (separation step). Herein, the push pin 41 assists in this separation. Therefore, a layer (planarization layer) of the curable composition IM having a uniform thickness can be molded over the entire substrate 1. FIG. 2C illustrates a state in which the planarization layer of the curable composition IM is molded on the substrate 1. In other words, a planarization layer (planarization film) having a locally planarized surface can be molded as a cured curable composition IM by using the planarization member 11. This planarization method can mold the planarization layer over the entire substrate 1 in a single process by using the planarization member 11 having an area covering all the plurality of irradiation regions on the substrate 1. Furthermore, a separation step of separating the planarization member 11 from the cured curable composition IM on the substrate 1 by using the push pin 41 will be described in detail with reference to FIGS. 5 and 6A to 6C in the foregoing planarization process. As described above, separation may sometimes take a large amount of force because the curable composition IM is cured under the entire surface of the planarization member 11 in contact with the substrate 1. In a state where the substrate 1 and the planarization member 11 are laminated and cured, a technique of assisting separation by providing the substrate stage 4 with the push pin 41 to apply a force to the planarization member 11 through the cutout in the substrate 1 is thus effective. FIG. 5 is a diagram illustrating the positional relationship between the substrate 1 and the push pin 41. In this example, the cutout 42 in the substrate 1 is a notch. If properly aligned, the cutout 42 in the substrate 1 comes to the position of the push pin 41. In the separation processing timing of the lamination of the planarization member 11 and the substrate 1, the planarization member 11 overlaps the position of the push pin 41. FIGS. 6A to 6C are process diagrams for describing the separation process using the push pin 41. FIG. 6A is a diagram illustrating a state before the start of separation, in which the plane 11a of the planarization member 11 contacts and follows the surface shape of the substrate 1, and the curable composition IM on the substrate 1 has been cured. FIG. 6B is a diagram illustrating an operation during separation. The head driving unit 10 raises the planarization member 11 to separate the planarization member 11 from the cured curable composition IM on the substrate 1. Here, the push pin 41 in the substrate stage 4 projects through the cutout 42 in the substrate 1 and pushes against the planarization member 11 to assist separation. FIG. 6C illustrates a separated state. In this state, the planarization member 11 is entirely separated from the cured curable composition IM on the substrate 1. If the substrate 1 and the planarization member 11 have substantially the same dimensions, then, for the purpose of raising the planarization member 11 from the substrate 1, the push pin 41 is desirably positioned at the same position as the cutout 42 in the substrate 1 held on the substrate holding unit 2. Conversely, if the planarization member 11 is shaped to be slightly larger than the substrate 1, then the cutout 42 in the substrate 1 and the push pin 41 do not necessarily need to be positioned at the same position. However, note that the push pin 41 is still desirably positioned at a predetermined position, where the push pin 41 does not interfere with the substrate 1 and can push up the planarization member 11 when raising the planarization member 11 from the substrate 1. FIGS. 7A and 7B are illustrations showing examples when the push pin 41 fails to assist in separation. In FIGS. 7A and 7B, the curable composition IM on the substrate 1 is omitted. According to the method of using the push pin 41 to assist in separation, if the substrate 1 is placed on the substrate holding unit 2 while the cutout 42 in the substrate 1 is not aligned with the push pin 41, then as shown in FIG. 7A, the push pin 41 may interfere with the substrate 1 and cannot assist in separation. If, as shown in FIG. 7B, the planarization member 11 does not overlap the position where the push pin 41 pushes the planarization member 11 (the planarization member 11 is misaligned relative to the substrate 1), then the separation assistance also fails. Due to the misalignment, the planarization member 11 sometimes fails to be held at this desired position, and in this state, it may not be possible to use the push pin 41 to provide separation assistance. If the separation assistance provided by the push pin 41 cannot be used and the planarization member 11 and the substrate 1 cannot be separated, then the laminate of the substrate 1 and the planarization member 11 becomes a defective product. The laminate of the planarization member 11 and the substrate 1 is even difficult to automatically carry out of the planarization apparatus 100. In this case, the operator is expected to stop the planarization apparatus 100 and manually remove the laminate, resulting in a decrease in the productivity of the planarization apparatus 100 because the planarization apparatus 100 is not normally available. Furthermore, the discarded laminate of the substrate 1 and the planarization member 11 is desirably processed for recycling. As will be described in detail below, in the present exemplary embodiment, therefore, the push pin 41 is driven to check in advance whether the holding position of the substrate 1 and the holding position of the planarization member 11 are correct before laminating the substrate 1 and the planarization member 11. In other words, by checking in advance the positional relationship between the substrate 1 and / or the planarization member 11 and the push pin 41 such that separation assistance is feasible, the planarization member 11 can be stably separated from the curable composition IM on the substrate 1 using the push pin 41. The first exemplary embodiment of the present disclosure will be described as follows. The procedure of the planarization process according to the present exemplary embodiment will be described with reference to the flowcharts of FIGS. 3 and 4. The processes illustrated in the flowcharts of FIGS. 3 and 4 are implemented by a control unit 200 that comprehensively controls the components of the planarization apparatus 100. The following description starts from the state where the planarization member 11 is held by the planarization member holding unit 12 of the second processing unit 102. In step S101 of FIG. 3, the control unit 200 loads the substrate 1 into the planarization device 100 and places the substrate 1 on the substrate holding unit 2 of the first processing unit 100 using the substrate transfer unit 25. The control unit 200 measures the rotation of the substrate 1 about the Z-axis using the detection unit 300, and adjusts the rotation of the substrate 1 about the Z-axis according to the measurement. In step S102, the control unit 200 drops droplets of the curable composition IM onto the substrate 1 placed on the substrate holding unit 2 using the dispenser 20 to apply the curable composition IM to the substrate 1 (application step). Here, the control unit 200 can supply the curable composition IM while adjusting the amount applied according to the level difference information of the pattern already formed on the substrate 1. In step S103, the control unit 200 transports the substrate 1 from the first processing unit 101 to the second processing unit 102, places the substrate 1 on the substrate holding unit 2 of the second processing unit 102, and causes the substrate holding unit 2 to hold the substrate 1. In step S104, the control unit 200 checks the holding position of the substrate 1 on the substrate holding unit 2 and the position of the planarization member 11 relative to the substrate 1. Details of the processing will be described below with reference to FIG. 4. In step S105, the control unit 200 performs a contact process (contact step) to bring the planarization member 11 held by the planarization member holding unit 12 into contact with the curable composition IM on the substrate 1. Specifically, the control unit 200 lowers the head 13 to lower the planarization member 11 attracted and held by the planarization member holding unit 12 so that the curable composition IM on the substrate 1 starts to contact the planarization member 11. Here, the control unit 200 gradually releases the attraction of the planarization member holding unit 12 for the planarization member 11 so that there are no air bubbles between the planarization member 11 and the substrate 1. The control unit 200 finally places the planarization member 11 on the curable composition IM by completely releasing the planarization member 11 from the planarization member holding unit 12. The curable composition IM on the substrate 1 is in complete contact with the planarization member 11, and the plane 11a of the planarization member 11 follows the surface shape of the substrate 1. In step S106, the control unit 200 drives the substrate stage 4 to move the substrate 1 under the exposure unit 23. Further, the control unit 200 irradiates the curable composition IM with curing light (UV rays) from the light source 24 through the planarization member 11 to cure the curable composition IM (exposure step). Although, in this exemplary embodiment, the light source 24 acts as the curing unit, units other than the light source can also be used as the curing unit. In step S107, the control unit 200 drives the substrate stage 4 to move the substrate 1 again under the planarization member holding unit 12, and causes the planarization member holding unit 12 to attract and hold the planarization member 11 again. At the same time, the position of the planarization member holding unit 12 in the Z direction is controlled. The control unit 200 then separates the planarization member 11 from the cured curable composition IM on the substrate 1 (separation step). Here, if the head 13 is simply lifted in the vertical direction (Z-axis direction), a force of up to several hundred newtons (N) is required to separate the planarization member 11 from the curable composition IM. The application of this large force to the planarization member 11 or the substrate 1 may damage the pattern of the substrate 1, peel off the curable composition IM, or damage the planarization member 11. For this reason, the separation step is performed using the push pin 41 as described above. In step S108, as the planarization process for a single substrate 1 is completed by the planarization apparatus 100, the control unit 200 takes out the substrate 1 held by the substrate holding unit 2 from the planarization apparatus 100 and returns the substrate 1 to the substrate transport container using the substrate transport unit 25. In step S109, the control unit 200 determines whether there is still a substrate 1 to be processed. If there is still a substrate 1 to be processed (Yes in step S109), the process returns to step S101. The planarization process described with reference to the foregoing flowchart is also just an example. Although the planarization process is described using an example in which the curable composition IM is applied inside the planarization apparatus 100, the planarization process can also be performed using a substrate 1 on which the curable composition IM is applied outside the planarization apparatus 100. Furthermore, the process of checking the positions of the substrate 1 and the planarization member 11 in step S104 will be described with reference to the flowchart of FIG. 4. The operations illustrated in steps S201 to S204 are performed to check the positions of the substrate 1 and the push pin 41 and thereby check the position where the substrate 1 is held by the substrate holding unit 2. Before the operations in step S105 and subsequent steps, the planarization process can be performed at an appropriate substrate position by performing at least the operations in steps S201 to S204. The operations illustrated in steps S205 to S208 are performed to check the positions of the planarization member 11 and the push pin 41 and thereby check the position of the planarization member 11 relative to the substrate 1. In other words, by performing the process of checking the holding position of the substrate 1 and the process of checking the position of the planarization member 11, the control unit 200 can prevent the operations in step S105 and subsequent steps from being performed in a state where separation cannot be assisted. In step S201, the control unit 200 starts to raise the pusher pin 41 provided on the substrate stage 4 in the Z-axis direction. The target raising position of the pusher pin 41 in the Z-axis direction is higher than the position where the planarizing member 11 in step S105 of FIG. 3 starts to contact the curable composition IM on the substrate 1. FIGS. 8A to 8D are side views of the pusher pin 41, the substrate 1, and the planarizing member 11 during this process. Again, the curable composition IM is omitted in FIGS. 8A to 8D. FIG. 8A illustrates the state after the substrate 1 is placed on the substrate stage 4 and before the pusher pin 41 is raised. In step S202, the control unit 200 determines whether the end of the pusher pin 41 contacts the bottom of the substrate 1 before the pusher pin 41 reaches the target position. Specifically, the control unit 200 protrudes the pusher pin 41 under the condition that the planarizing member 11 does not contact the curable composition IM on the substrate 1, and checks whether the end of the pusher pin 41 contacts the bottom of the substrate 1. If it is determined that the end of the pusher pin 41 contacts the bottom of the substrate 1, the control unit 200 immediately stops raising the pusher pin 41 because the substrate 1 may not be aligned, as shown in FIG. 7A. Specifically, the contact with the substrate 1 can be detected by the pusher contact detection unit 43. In step S202, if it is determined that the pusher pin 41 contacts the substrate 1 (Yes in step S202), the control unit 200 stops raising the pusher pin 41 because the substrate 1 is held at an incorrect holding position on the substrate stage 4, and the process proceeds to step S203. In step S203, the control unit 200 lowers the pusher pin 41 to retract the pusher pin 41 into the substrate stage 4. In step S204, the control unit 200 uses the substrate transfer unit 25 to re-place the substrate 1 on the substrate stage 4 to correct the misalignment of the substrate 1. Then, the process returns to step S201, and the pusher pin 41 is raised again. The operations in steps S201 to S204 are repeatedly performed in sequence until the pusher pin 41 reaches the target position and does not contact the substrate 1. Therefore, the substrate 1 held in place by the substrate holding unit 2 is subjected to the operations in step S105 and subsequent steps. If in step S202, it is determined that the end of the pusher pin 41 contacts the bottom of the substrate 1 before the pusher pin 41 reaches the target position, the control unit 200 may display information on a display unit (not illustrated) indicating that misalignment has occurred to notify the operator. An external notification unit (not illustrated) may also notify an external device connected to the external notification unit of this information. These two notifications can also be issued. Not only the occurrence of misalignment but also the non-occurrence of misalignment can be notified as the determination result of the process executed in step S202. If the substrate 1 is still not properly placed even after the operations in steps S201 to S204 are repeated a predetermined number of times, the control unit 200 may abort the process due to an error. In step S202, if the push pin 41 is determined to be raised to the target position as shown in FIG. 8B without contacting the substrate 1 (No in step S202), the process proceeds to step S205. In step S205, the push pin 41 stops at the target position, and the control unit 200 lowers the head 13 in the Z-axis direction to lower the planarization member 11 attracted and held by the planarization member holding unit 12 toward the substrate 1. In order to determine whether the push pin 41 is raised to a specific target position, for example, a sensor of an encoder for detecting the position of the push pin 41 in the Z direction is configured to use the sensor to find the predetermined position of the push pin 41. In step S206, during the process of lowering the head 13, the control unit 200 determines whether the planarization member 11 contacts the push pin 41 before the Z-axis position of the surface of the planarization member 11 successfully reaches the Z-axis position of the end of the push pin 41. Even if the head 13 is lowered to the Z-axis position of the end of the push pin 41, the planarization member 11 does not contact the curable composition IM on the substrate 1. Assuming that the end of the push pin 41 has successfully contacted the surface of the planarization member 11 before the head 13 reaches the predetermined position in the Z-axis direction, the planarization member 11 is detected as contacting the push pin 41. In this case (Yes in step S206), the process proceeds to step S209 because if the planarization process is started, the separation process can be appropriately performed. In other words, the planarization member 11 is in the appropriate position. On the other hand, if the head 13 reaches the predetermined position and the planarization member 11 does not contact the push pin 41 (No in step S206), the control unit 200 stops lowering the head 13 and the process proceeds to step S207. In this case, the push pin 41 and the planarization member 11 may not be aligned, as shown in FIG. 7B. In step S207, the head 13 stops lowering, and the control unit 200 raises the head 13 to the position before starting to lower. In step S208, the control unit 200 aligns the planarization member 11 with respect to the substrate 1 in the X- and Y-axes. Specifically, the control unit 200 drives the head driving unit 10 to adjust the X- and Y-axes of the head 13 to align the planarization member 11 with respect to the position of the substrate 1. The process then returns to step S205 to lower the planarization member 11 again. The operations in steps S205 to S208 are repeatedly performed in sequence until the planarization member 11 contacts the push pin 41. If in step S206, the control unit 200 determines that the planarization member 11 does not contact the push pin 41, the control unit 200 can display information on a display unit (not shown) to notify the operator. An external notification unit (not shown) can notify an external device of the information. These two notifications can be issued. In step S209, the control unit 200 temporarily stops the lowering head 13, and lowers the push pin 41 to the position before the start of raising, so that the push pin 41 is retracted into the substrate stage 4, as shown in FIG. 8D. The process then proceeds to step S105 to start the planarization process. As described above, before performing the planarization process by driving the push pin 41 to contact the planarization member 11 with the substrate 1, it is checked in advance whether the substrate 1 and the planarization member 11 exhibit a position relationship that facilitates separation. In other words, by driving the push pin 41 without the planarization member 11 contacting the curable composition IM, it is at least checked in advance whether the substrate 1 is in a position relationship that facilitates separation, and based on the detection result of the previous check, it is determined whether to perform the planarization process. This enables the push pin 41 to stably separate the planarization member 11 from the curable composition IM on the substrate 1. Up to this point, an exemplary embodiment of the present disclosure has been described. However, some embodiments are not limited to the exemplary embodiment, and various modifications and variations can be made without departing from its essence. For example, in the present exemplary embodiment, the positions of the substrate 1 and the planarization member 11 are described as being checked by using sensors such as a push pin contact detection unit 43 and an encoder, and the encoder is used to detect the position of the push pin 41 in the Z direction. Alternatively, the force used to drive the push pin 41 can be detected by the current value of the motor that drives the push pin 41, and the contact state of the push pin 41 can also be detected by the driving force and the amount of change in the position of the push pin 41. Furthermore, the contact between the push pin 41 and the planarization member 11 can be detected according to the state of the head 13 (head position and head driving force) and the state of the fitting unit of the push pin 41. The positions of the substrate 1 and the planarization member 11 can be checked by appropriately combining these units and techniques. Although in the present exemplary embodiment, the position of the planarization member 11 is checked by lowering the planarization member 11, the position can also be detected by further raising the push pin 41. Specifically, the distance between the end of the push pin 41 and the planarization member 11 can be shortened by raising the push pin 41 or lowering the planarization member 11, as long as the contact between the planarization member 11 and the push pin 41 can also be detected by the push pin contact detection unit 43. A second exemplary embodiment of the present disclosure will be described below. In the first exemplary embodiment, the position of the flattening member 11 is described as always being inspected after the holding position of the substrate 1 on the substrate holding unit 2 is inspected. The holding position of the substrate 1 on the substrate holding unit 2 changes each time the substrate 1 is loaded into the substrate holding unit 2. The operations in steps S201 to S204 are performed each time the substrate 1 is loaded. In contrast, the same flattening member 11 is typically used for a plurality of substrates 1. Since the position of the flattening member 11 relative to the flattening member holding unit 12 generally only changes when the flattening member 11 is replaced, the operations in steps S205 to S208 do not need to be performed each time. However, the position of the flattening member 11 on the flattening member holding unit 12 may sometimes shift because the operation of separating the flattening member 11 from the substrate 1 exerts a considerable force on the flattening member 11. In this exemplary embodiment, whether to inspect the position of the flattening member 11 is determined under the same flattening member 11 used for the next process. If the position of the flattening member 11 is determined to be inspected, the process of inspecting the position of the flattening member 11 relative to the substrate 1 is performed by inspecting the positions of the flattening member 11 and the push pin 41. The procedure of the flattening process according to this exemplary embodiment will be described with reference to the flowchart of FIG. 9. The process illustrated in the flowchart of FIG. 9 is executed by a control unit 200 that controls the components of the flattening device 100 in an integrated manner. The processing steps S201 to S209 in FIG. 9 are similar to those in FIG. 4, and thus their descriptions are omitted. In the operations of steps S201 to S204 in FIG. 9, the control unit 200 inspects the positions of the substrate 1 and the push pin 41 and thereby inspects the holding position of the substrate 1 held by the substrate holding unit 2. In step S301, the control unit 200 then determines whether to inspect the position of the flattening member 11 relative to the substrate 1. Specifically, the control unit 200 determines whether to inspect the position of the flattening member 11 in processing the substrate 1 immediately after the flattening member 11 is attracted and held by the flattening member holding unit 12, or after the flattening process is performed on a predetermined number of substrates 1. If, during the separation process of the planarization member 11 and the substrate 1 in the previous planarization process, any force (separation force) in the X, Y, and Z directions acting on the planarization member 11 is greater than or equal to a predetermined magnitude, the control unit 200 can also determine to check the position of the planarization member 11 in step S301. An example of the unit for measuring the magnitude of the separation force can be a force sensor (separation force acquisition unit not shown) included in the planarization member holding unit 12. Specifically, if, in the process of the previous planarization process, the separation force for separating the planarization member 11 from the substrate 1 is greater than a predetermined value, the position of the planarization member 11 is determined to be checked before the next planarization process. In step S301, if the position is determined to be checked (Yes in step S301), the process proceeds to step S205. In steps S205 to S209, the control unit 200 checks the position of the planarization member 11. If, in step S301, the control unit 200 determines that the position will not be checked (No in step S301), the process proceeds to step S209. In step S209, the control unit 200 lowers the push pin 41 to the position before the push pin 41 starts to rise, so that the push pin 41 is retracted to the substrate stage 4. The process then proceeds to step S105 to start the planarization process. As described above, in the present exemplary embodiment, the operations in steps S205 to S209 are only performed when the position of the planarization member 11 is determined to be checked. This can prevent unnecessary position checks of the planarization member 11 and improve the productivity of the planarization apparatus 100. In the process of checking the holding position of the substrate 1, the substrate 1 can be transported to the first processing unit 101 and repositioned using the detection unit 300, instead of using the technique of re - placing the substrate 1 on the substrate stage 4 using the substrate transport unit 25 as described in step S204. At the same time, the substrate 1 can be carried out of the second processing unit 102 or the planarization apparatus 100 for position adjustment. The curable composition IM on the substrate 1 may not produce a desired curing result (e.g., volatilization) in subsequent curing processes due to temporal changes, and finally becomes a defective product. If the substrate 1 is carried out of the second processing unit 102 or the planarization apparatus 100, the applied curable composition IM thus needs to be removed (re - processed), and the process is repeated by applying step S102. Even if the position of the substrate 1 is determined to be correct in step S202, the control unit 200 can determine whether to carry out the substrate 1 based on the time elapsed from the application of the curable composition IM to the substrate 1. In the process of checking the position of the planarization member 11, the planarization member 11 can be carried out of the second processing unit 102 or the planarization device 100 for adjustment, rather than adjusting the techniques of the X- and Y-axes of the head 13 as described in step S208. Specifically, the planarization member 11 may be held by the planarization member conveying unit 32 and then placed again on the planarization member holding unit 12 to adjust the holding position of the planarization member 11 on the planarization member holding unit 12. Thereby, the relative position between the planarization member holding unit 12 and the planarization member 11 can be corrected to complete the alignment relative to the substrate 1. When checking the holding position of the substrate 1 and the position of the planarization member 11 in FIGS. 4 and 9, when it is determined that the substrate 1 or the planarization member 11 is misaligned, there may be a step of checking whether the inspection push pin 41 is properly driven (push pin drive check). FIGS. 10A and 10B are diagrams illustrating the push pin drive check steps. FIG. 10A illustrates an example of the inspection process to be performed after the substrate 1 is determined to be misaligned during the inspection of the holding position of the substrate 1. When the substrate 1 is carried out for position adjustment, the operation of the push pin 41 is checked. Specifically, after the push pin 41 is raised as in step S201, as in step S206, the planarization member 11 is lowered to check the contact between the push pin 41 and the planarization member 11 as in step S206. If the contact between the push pin 41 and the planarization member 11 is detected by the push pin contact detection unit 43, the push pin 41 can be determined to be properly operated. FIG. 10B illustrates an example of the inspection process to be performed after the planarization member 11 is determined to be misaligned during the detection of the position of the planarization member 11. The planarization member 11 is moved parallel to the surface of the substrate 1 such that the planarization member 11 always overlaps the position of the push pin 41, and then, as in step S206, it is checked whether the push pin 41 and the planarization member 11 are in contact with each other. Thereby, it can be determined that the push pin 41 is properly operated. Specifically, when the planarization member 11 is moved parallel to the surface of the substrate 1, the push pin 41 is raised as in step S201 (if properly operated, the push pin 41 is raised). The planarization member 11 is then lowered in step S205, and it is checked whether the push pin 41 and the planarization member 11 are in contact as in step S203. If the push pin 41 and the planarization member 11 are determined to be in contact with each other, the push pin 41 can be determined to be properly operated. According to the above-described exemplary embodiment, before the substrate 1 and the planarization member 11 are laminated, the push pin 41 can be driven in advance to check whether the holding position of the substrate 1 and the position of the planarization member 11 are correct. In other words, by checking in advance whether the substrate 1 and the planarization member 11 are in a position relationship that facilitates separation before the planarization process, the planarization member 11 can be stably separated from the curable composition IM on the substrate 1. This is expected to prevent a decrease in the productivity of the planarization device 100. (Product manufacturing method) Furthermore, a method of manufacturing a product (e.g., a semiconductor integrated circuit [IC] device, a liquid crystal display device, a color filter, and a microelectromechanical system [MEMS]) using the aforementioned planarization device or planarization method will be described. This manufacturing method includes the steps of: bringing a composition disposed on a substrate (e.g., a wafer and a glass substrate) into contact with a planarization member for planarization, curing the composition, and separating the composition from the planarization member. The product is manufactured by using a lithography device to pattern a substrate having the planarization composition and applying other known processing steps to the patterned substrate. Examples of other known processing steps include: etching, resist stripping, dicing, bonding, and packaging. According to this manufacturing method, a product of higher quality than before can be manufactured. Although the exemplary embodiments have been described above, it will be understood that some embodiments are not limited to these exemplary embodiments, and various modifications and changes can be made without departing from their essence. Although the present disclosure has described exemplary embodiments, it should be understood that these embodiments do not limit the disclosed exemplary embodiments. The scope of the following claims therefore includes all such modifications and equivalent structures and functions. 1: Substrate 1a: Lower layer pattern 2: Substrate holding unit 3: Substrate stage 4: Substrate stage 5: Base plate 6: Column 7: Top plate 8: Guide bar plate 9: Guide bar 10: Head driving unit 11: Flattening member 11a: Plane 12: Flattening member holding unit 13: Head 20: Dispenser 23: Exposure unit 24: Light source 25: Substrate transfer unit 31: Stage driving unit 32: Flattening member transfer unit 41: Pushing pin 42: Notch 43: Pushing pin contact detection unit 100: Flattening equipment 101: First processing unit 102: Second processing unit 200: Control unit 220: Substrate transfer processing unit 300: Detection unit 320: Member transfer processing unit IM: Curable composition S101: Step S102: Step S103: Step S104: Step S105: Step S106: Step S107: Step S108: Step S109: Step S201: Step S202: Step S203: Step S204: Step S205: Step S206: Step S207: Step S208: Step S209: Step S301: Step [Figs. 1A to 1C] are schematic diagrams illustrating the configuration of the flattening equipment. [Figs. 2A to 2C] are illustrations depicting the flattening process performed by the flattening equipment. [Fig. 3] is a flowchart illustrating the flattening process. [Fig. 4] is a flowchart illustrating the process for checking the positions of the substrate and the flattening member during the flattening process. [Fig. 5] is an illustration showing the positional relationship among the flattening member, the substrate, the notch, and the pressing member. [Figs. 6A to 6C] are illustrations depicting the separation step. [Figs. 7A and 7B] are illustrations showing examples where the pressing member fails to assist in separation. [Figs. 8A to 8D] are illustrations showing the process for checking the positions of the substrate and the flattening member during the flattening process. [Fig. 9] is a flowchart illustrating the process for checking the positions of the substrate and the flattening member during the flattening process. [Figs. 10A and 10B] are illustrations showing how to check the operation of the pressing member. 1: Substrate 2: Substrate holding unit 11: Flattening member 12: Flattening member holding unit 41: Pushing pin 42: Notch

Claims

1. A planarization apparatus for planarizing a composition on a substrate using a planarization member, the planarization apparatus comprising: a substrate holding unit configured to hold the substrate; A component holding unit is configured to hold the planarization component; a pressure member is configured to protrude from the substrate toward the planarization component. The control unit is configured to determine whether to perform a planarization process by protruding the pressure member without the planarization member contacting the composition. The planarization process includes making the substrate and the planarization member contact each other through the composition.

2. The planarization apparatus as claimed in claim 1, wherein the control unit is configured to determine whether the holding position of the substrate held by the substrate holding unit is correct by protruding the pressure member without the planarization member contacting the component, and to determine whether to perform the planarization process based on the determination.

3. The planarization apparatus as claimed in claim 2 further includes a contact detection unit configured to detect contact between the pressure member and the object, wherein the control unit is configured to determine that the holding position of the substrate held by the substrate holding unit is incorrect when the pressure member protrudes from the planarization member without contacting the component and the contact detection unit detects contact with the substrate.

4. The planarization apparatus as claimed in claim 2, wherein the control unit is configured to control the adjustment of the holding position of the substrate held by the substrate holding unit when the holding position of the substrate is determined to be incorrect.

5. The planarization apparatus as claimed in claim 2, wherein the control unit is configured to determine whether the position of the planarization member held by the member holding unit is correct by protruding the pressure member without the planarization member contacting the component when the holding position of the substrate is determined to be correct.

6. The planarization apparatus as claimed in claim 5 further includes a force sensor configured to acquire a separation force separating the planarization member from the substrate during the planarization process, wherein the control unit is configured to control the determination of whether the position of the planarization member held by the member holding unit is correct when the separation force acquired by the force sensor in the previous planarization process is greater than a predetermined value.

7. The planarization apparatus as claimed in claim 5 further includes a contact detection unit configured to detect contact between the pressurizing member and the object, wherein the control unit is configured to determine that the position of the planarization member held by the member holding unit is correct when the contact detection unit detects a shortened contact between the pressurizing member and the planarization member.

8. The planarization apparatus as claimed in claim 1, wherein the pressure member is used to assist in the separation of the substrate in contact with the composition from the planarization member.

9. The planarization device as claimed in claim 1, wherein the control unit is configured to notify the display unit and at least one of the external devices connected to the planarization device regarding a determination of whether to perform the planarization process.

10. A planarization apparatus for planarizing a composition on a substrate using a planarization member, the planarization apparatus comprising: a substrate holding unit configured to hold the substrate; A component holding unit is configured to hold the planarization component; a pressure member is configured to protrude from the substrate toward the planarization component. A contact detection unit is configured to detect contact between the pressure member and an object; and a control unit is configured to protrude the pressure member when the planarization member is not in contact with the component, and to control at least one of the pressure member, the substrate holding unit, and the member holding unit based on the detection result made by the contact detection unit.

11. A planarization method for planarizing an assembly on a substrate using a planarization member, the planarization method comprising: protruding a pressure member as a first protrusion in a direction from the substrate held by a substrate holding unit toward the planarization member held by a member holding unit, without the planarization member contacting the assembly on the substrate; The detection method checks whether the pressure member protruding through the first protrusion is in contact with the substrate; And based on the results of the test, determine whether the holding position of the substrate held by the substrate holding unit is correct.

12. The planarization method as described in claim 11 further includes: adjusting the holding position of the substrate when the holding position of the substrate is determined to be incorrect.

13. The planarization method as claimed in claim 11 further comprises: when the holding position of the substrate is determined to be correct, protruding the pressure member from the substrate toward the planarization member as a second protrusion without the planarization member contacting the component; detecting whether the pressure member protruding through the second protrusion contacts the planarization member as a second detection; and determining, based on the result of the second detection, whether the planarization process can be performed by the planarization member held by the member holding unit as a second determination.

14. The planarization method as claimed in claim 11 further comprises, after the determination: contacting the planarization member with the composition; curing the composition while the planarization member is in contact with the composition; and separating the planarization member from the cured composition, wherein the pressure member is configured to assist separation by pushing the planarization member upward from the substrate toward the planarization member during the separation.

15. The planarization method as claimed in claim 11, wherein when it is determined that the holding position of the substrate is incorrect, the planarization process that brings the substrate into contact with the planarization member via the composition is not performed.

16. A product manufacturing method comprising: planarizing a composition on a substrate using a planarization apparatus as described in claim 1; processing the substrate having the planarized composition; and manufacturing a product from the processed substrate.

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