Methods for forming molded articles in compression molding
Patent Information
- Application Number
- TW113125159
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-08-30
- Filing Date
- 2024-07-04
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2044-07-03
Smart Images
Figure 00000000_0000_ABST
Abstract
Description
Sealing resin used in compression molding, method for forming the same, and forming apparatus The present invention relates to a sealing resin used in compression molding, a method for forming the same, and a forming apparatus therefor. As an example of a resin sealing apparatus and a resin sealing method for processing a workpiece having electronic components into a molded product by sealing with a sealing resin, a compression molding method is known. The compression molding method is a technique in which a predetermined amount of sealing resin is supplied to a sealing region (cavity) provided in a sealing mold including an upper mold and a lower mold, and a workpiece is disposed in the sealing region, and resin sealing is performed by an operation of clamping with the upper mold and the lower mold. As an example, a technique is known in which, when using a sealing mold having a cavity provided in the upper mold, the sealing resin is supplied to the center position on the workpiece at the same time for forming. On the other hand, a technique is known in which, when using a sealing mold having a cavity provided in the lower mold, a release film (hereinafter, sometimes simply referred to as "film") covering the mold surface including the cavity and the sealing resin are supplied for forming (see Patent Document 1: Japanese Patent Laid-Open No. 2019-145550). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Laid-Open No. 2019-145550 [Problems to be Solved by the Invention] Conventionally, it has also been considered advantageous in terms of preventing deformation of the workpiece caused by the flow of the sealing resin or contact based on the flow of the wire, and a so-called compression molding method in which the workpiece is held by the upper mold, a cavity is provided in the lower mold, and the sealing resin (as an example, granular resin) is supplied into the cavity has been widely adopted. However, in a structure in which the workpiece is held by the upper mold and a cavity is provided in the lower mold, in the case of a thin or large workpiece, there is a problem that it is difficult to hold the workpiece by the upper mold and it is easy to drop. In addition, when using granular resin as the sealing resin, there are not only problems such as generation of dust during molding due to friction between resin particles or the like or difficulty in handling, but also problems such as difficulty in uniformly supplying (scattering) the sealing resin to the entire region in the cavity provided in the lower mold, and easy occurrence of uneven scattering. In addition, there is a problem that air contained in the gaps between the particles and gas components generated by defoaming from the sealing resin during melting cannot be discharged and remain in the molded product as voids or the like, resulting in a problem of poor molding. On the other hand, regardless of the configuration of the mold cavity, when using a solid resin with a certain shape such as a granular resin or a liquid resin as the sealing resin, the following problems become clear. Specifically, when forming a molded product with a resin thickness after resin sealing (specifically, the thickness of the resin portion at the upper or lower position of the workpiece after resin sealing) as thin as 0.4 mm or less, the thickness of the sealing resin (solid resin) before resin sealing has to be thinned. However, since the sealing resin (solid resin) before resin sealing is, of course, in a state before formal hardening, it has low rigidity (brittleness) and weak strength, so the problem of being extremely prone to breakage during handling (especially during conveyance) becomes clear. In view of the above situation, the present invention aims to provide a sealing resin, a forming method and a forming device thereof, which can realize a compression molding device and a compression molding method that can prevent the occurrence of molding defects caused by uneven scattering, residual gas, and generation of dust during molding, and can form a molded product with a thin resin portion thickness, and can facilitate the handling before resin sealing and prevent the occurrence of breakage during handling. [Means for Solving the Problem] The present invention solves the above problems by means of the following-described solution as an embodiment. A forming method of a sealing resin according to an embodiment forms a sealing resin used in the compression molding of a workpiece. The essential condition of the forming method of the sealing resin is that it includes a forming step that forms a solid resin, that is, the sealing resin, in which a carrier is fixed to one side of a base resin in an exposed state. By performing compression molding using the sealing resin formed by the above embodiment, the occurrence of molding defects caused by uneven scattering of the sealing resin, residual gas, and generation of dust during molding can be prevented. In addition, the handling of the sealing resin can be facilitated, and particularly, even when forming a molded product with a resin portion thickness as thin as 0.4 mm or less, breakage during handling can be prevented. In addition, by applying it to a structure in which a mold cavity is provided on the upper mold and a workpiece is held on the lower mold, problems such as workpiece dropping can be solved. In addition, it is preferably to use a powder resin as the base resin, and the forming step has a step of compressing the powder resin to form a solid resin having a predetermined shape in which the carrier is fixed, that is, the sealing resin. In addition, it is preferably that the predetermined shape is such that when viewed from above, the carrier is arranged at the central portion, and the base resin is arranged at the peripheral portion so as to cover the outer periphery of the carrier. In addition, preferably, the forming step has the following steps, that is, for the carrier peeled from the formed product after compression molding, it is returned to the device for forming the sealing resin and reused when forming the sealing resin. In addition, a sealing resin forming device according to an embodiment forms a sealing resin used in compression molding of a workpiece. The essential condition of the sealing resin forming device is that it includes a tablet pressing die, and the tablet pressing die forms a solid resin having a specified shape with the carrier fixed thereto, that is, the sealing resin, by holding and pressing a base resin and a carrier. In addition, a sealing resin according to an embodiment is used in compression molding of a workpiece. The essential condition of the sealing resin is that it is a solid resin in which a carrier is fixed to one side of a base resin in an exposed state. [Effects of the Invention] By the forming device and forming method of the present invention, a sealing resin capable of obtaining the following effects can be formed. That is, if the sealing resin of the present invention is used, it is possible to realize a compression molding device and a compression molding method that can prevent the occurrence of molding defects caused by uneven scattering, residual gas, and generation of dust during molding, and can form a molded product with a thin resin portion. In addition, the treatment before resin sealing can be facilitated. In addition, the occurrence of breakage during treatment can be prevented. (Sealing Resin Forming Device) A sealing resin R according to an embodiment of the present invention is a resin used in compression molding of a workpiece (to-be-formed product) W. First, a forming device 1 for the sealing resin R (hereinafter sometimes simply referred to as "forming device") will be described. This forming device 1 can be provided either inside or outside the compression molding device 2. Here, FIG. 1 is a plan view (schematic view) showing an example of the forming device 1. Furthermore, for ease of explanation, the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the device are indicated by arrows in the figure. In addition, in all the drawings for explaining each embodiment, the same reference numerals are given to components having the same functions, and repeated explanations thereof may be omitted. The workpiece W to be formed includes electronic components. Examples of the electronic components include: coil sheets, semiconductor wafers, micro electro mechanical system (MEMS) wafers, passive components, heat sinks, conductive members, gaskets, etc. The workpiece W can be configured to include only electronic components, or can also be configured to be mounted on a substrate (wire bonding package, flip chip package, etc.). Furthermore, examples of the substrate include rectangular or circular plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. In addition, the number of electronic components constituting the workpiece W is not particularly limited and is set to one or more. In this embodiment, as the sealing resin R, a base resin Rm in a state where the carrier C is fixed is used (details of the forming device and the forming method will be described later). As an example, the carrier C is formed of a metal material (such as copper, copper alloy, etc.) into a plate-like member having a thickness dimension of about 0.1 mm to 0.5 mm, but is not limited thereto. In this embodiment, as the base resin Rm and the sealing resin R, a thermosetting resin (such as an epoxy resin containing a filler, etc., but not limited thereto) is used. Furthermore, a powder resin (powdered resin) as a thermosetting resin (property) is preferably used in the base resin Rm (details will be described later). However, it is not limited thereto, and a structure using a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin formed by combining a plurality of these may also be adopted. In addition, as an example of the film F, a film material excellent in heat resistance, easy peelability, flexibility, and stretchability can be preferably used, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. Furthermore, the film F can also be used when forming the sealing resin R in the resin forming unit 50 described later. As shown in FIG. 1, the forming device 1 includes the following parts as main structures: a base resin supply unit 10D that supplies the base resin Rm, the carrier C, etc., and a resin forming unit 10E that forms the sealing resin R using the base resin Rm, the carrier C, etc. As an example, along the X direction in FIG. 1, the base resin supply unit 10D and the resin forming unit 10E are arranged in sequence. However, it is not limited to the above structure, and the equipment structure within the unit, the number of units, the arrangement order of the units, etc. can be changed. In addition, it can also be configured to include units other than the above (not shown). In addition, in the forming device 1, the guide rail 20 is linearly provided across the units, and a transfer device (first loader) 21 for transferring the base resin Rm, the carrier C is provided so as to be movable between the units along the guide rail 20. However, it is not limited to the above structure, and the transfer device can be configured to include a robot arm or the like instead of a loader. In addition, in the forming device 1, a control unit 80 that controls the operation of each mechanism in each unit is arranged in the base resin supply unit 10D (it can be configured to be arranged in other units). Next, the base resin supply unit 10D included in the forming device 1 will be described in detail. The base resin supply unit 10D includes: a carrier supply unit 30 that supplies the carrier C, and a base resin supply unit 40 that supplies the base resin Rm. As an example, the carrier supply unit 30 includes a storage unit (such as a hopper, etc.) that stores a plurality of carriers C (a picker or a stage, etc. may also be appropriately provided). In addition, the base resin supply unit 40 includes a dispenser that supplies the base resin Rm, a transfer device, and the like. Furthermore, when the carrier C and the base resin Rm are transferred from the base resin supply unit 10D to the resin forming unit 10E, the transfer device can use the first loader 21, or other transfer devices (not shown) (for the base resin Rm, direct spraying from the dispenser, etc. may also be adopted). Next, the resin forming unit 10E included in the forming device 1 will be described in detail. The resin forming unit 10E includes a resin forming section 50 as a device for forming the sealing resin R using the base resin Rm and the carrier C. In the present embodiment, two (three or more or one may also be provided) of such resin forming units 10E are included, and each resin forming unit 10E includes one (two or more may also be provided) resin forming section 50 (refer to FIG. 1). However, it is not limited to this structure. The resin forming section 50 includes a tablet press die (first die) 102, and the tablet press die (first die) 102 has a pair of dies for mold opening and closing (for example, a die assembled from a plurality of die blocks, die plates, die columns, etc. containing alloy tool steel or other components). In addition, it includes a pressing device (first pressing device) 150 that drives the opening and closing of the first die 102. As an example, a structure including two first pressing devices 150 is provided, a structure including one may also be provided, or a structure including multiple (three or more) may also be provided (not shown). The side view (schematic view) of the first pressing device 150 is shown in FIG. 2, and the front sectional view (schematic view) of the first die 102 is shown in FIG. 3. Here, as shown in FIG. 2, the first pressing device 150 includes a pair of platens 154 and 156, a plurality of tie rods 152 supporting the pair of platens 154 and 156, and a driving device for moving (lifting and lowering) the platen 156, etc. Specifically, the driving device includes a driving source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle mechanism) 162, etc. (however, it is not limited thereto). In the present embodiment, the platen 154 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie rod 152), and the platen 156 on the lower side is set as a movable platen (a platen that can be slidably held on the tie rod 152 and lifted and lowered). However, it is not limited thereto, and it may be reversed up and down, that is, the upper side is set as the movable platen and the lower side is set as the fixed platen, or both the upper side and the lower side may be set as movable platens (not shown in the drawings). On the other hand, as shown in FIG. 3, the first mold 102 includes a first upper mold 104 on the upper side in the vertical direction and a first lower mold 106 on the lower side as a pair of molds disposed between the pair of platens 154 and 156 in the first pressing device 150. The first upper mold 104 is assembled to the upper-side platen (the fixed platen 154 in the present embodiment), and the first lower mold 106 is assembled to the lower-side platen (the movable platen 156 in the present embodiment). The mold is closed / opened by the first upper mold 104 and the first lower mold 106 approaching / separating from each other (the vertical direction (up and down direction) is the mold opening / closing direction). In the first mold 102 of the present embodiment, the first upper mold 104 constitutes a so-called "pestle type", and the first lower mold 106 constitutes a so-called "mortar type". Next, the first lower mold 106 of the first mold 102 will be described in detail. As shown in FIG. 3, the first lower mold 106 includes a lower mold groove (first lower mold groove) 110, a cavity mold member (first cavity mold member) 126 held therein, a holder (first holder) 128, etc. The first lower mold groove 110 is fixed to the upper surface of a support plate (first support plate) 114 via a support column (first support column) 112. A cavity (first cavity) 108 is provided on the upper surface (the surface on the side of the first upper mold 104) of the first lower mold 106. A carrier C and a prescribed amount of base resin Rm are accommodated in the first cavity 108. The first holder 128 is configured in an annular shape so as to surround the first cavity module 126, and is assembled (however, not limited to this assembly structure) in such a manner that it can move up and down separably (float) with respect to the upper surface of the first support plate 114 via a push pin (first push pin) 122 and a clamping spring (first clamping spring) 124 (for example, a biasing member exemplified by a coil spring). The first cavity module 126 constitutes the inside (bottom) of the first cavity 108, and the first holder 128 constitutes the side of the first cavity 108. As an example, the upper surface (the surface on the side of the first upper die 104) of the first cavity module 126 is formed in a planar shape. Furthermore, the shape or number of the first cavities 108 provided in one first lower die 106 is appropriately set (one or more). Here, a lower die film supply unit (first lower die film supply unit) 111 is provided in the first pressing device 150, and the lower die film supply unit (first lower die film supply unit) 111 supplies a film F for covering the die surface 106a (prescribed area) of the inner surface of the first lower die 106 including the first cavity 108. Furthermore, as an example, the film F is in a roll shape, but may also be in a strip shape. In addition, the first lower die 106 is provided with a suction path (hole, groove, etc.) (not shown) communicating with a suction device at the boundary portion between the first holder 128 or the first cavity module 126. Thereby, the film F supplied from the first lower die film supply unit 111 can be adsorbed and held on the die surface 106a of the inner surface including the first cavity 108. In addition, in the present embodiment, a first lower die heating mechanism (not shown) for heating the first lower die 106 to a prescribed temperature is provided. The first lower die heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power supply, etc., and heating is controlled by the control unit 80. As an example, the heater is structured to be built into the first lower die groove 110 and apply heat to the entire first lower die 106, the carrier C housed in the first cavity 108, and the base resin Rm. At this time, the first lower die 106 is heated to a prescribed temperature (for example, 50°C to 80°C) at which it is difficult for the base resin Rm to undergo thermal hardening (formal hardening). Next, the first upper die 104 of the first mold 102 will be described in detail. As shown in FIG. 3, the first upper die 104 includes a pressing plate (first plate) 142 held (fixed) in an upper die groove (first upper die groove) 140. The pressing plate (first plate) 142 functions to press (press the sheet) the carrier C and a prescribed amount of the base resin Rm housed in the first cavity 108 of the first lower die 106, and becomes a sealed resin R having a prescribed shape with the carrier C fixed thereto (the details of the forming method will be described later). As an example, the lower surface (the surface on the side of the first lower die 106) of the first plate 142 is formed in a planar shape. Here, an upper mold film supply unit (first upper mold film supply unit) 113 is provided in the first pressing device 150, and the upper mold film supply unit (first upper mold film supply unit) 113 supplies a film F for covering the mold surface 104a (specified area) of the first upper mold 104. Furthermore, as an example, the film F is in a roll shape, but it can also be in a long strip shape. In addition, the first upper mold 104 is provided with a suction path (hole or groove, etc.) (not shown) communicating with the suction device in the first plate 142 or the like. Thereby, the film F supplied from the first upper mold film supply unit 113 can be adsorbed and held on the mold surface 104a. In addition, in the present embodiment, a first upper mold heating mechanism (not shown) for heating the first upper mold 104 to a specified temperature is provided. The first upper mold heating mechanism includes a heater (such as a heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 80. As an example, the heater is configured to be built into the first upper mold groove 140 and apply heat to the entire first upper mold 104. At this time, the first upper mold 104 is heated to a specified temperature (for example, 50°C to 80°C) at which it is difficult for the base resin Rm to be thermally hardened (formally hardened) when held (accommodated) in the first lower mold 106. Furthermore, as an example, the first mold 102 has a structure with a movable holder (first holder 128), and as another example, as shown in FIG. 4, it can also have a structure without a movable holder. (Method for forming the sealing resin) Next, a method for forming the sealing resin R of the present embodiment (hereinafter sometimes simply referred to as the "forming method") will be described. As an example, this forming method can be implemented using the forming device 1. Here, FIGS. 5 to 8 are explanatory diagrams of the main steps. First, a first preparation step is implemented. The first preparation step has the following steps. A heating step (first lower mold heating step) of adjusting the first lower mold 106 to a specified temperature (a temperature at which the base resin Rm and the sealing resin R do not formally harden, for example, 50°C to 80°C) and heating it by the first lower mold heating mechanism is implemented. In addition, a heating step (first upper mold heating step) of adjusting the first upper mold 104 to a specified temperature (a temperature at which the base resin Rm and the sealing resin R do not formally harden, for example, 50°C to 80°C) and heating it by the first upper mold heating mechanism is implemented. In addition, a lower mold film supply step (first lower mold film supply step) of operating the first lower mold film supply unit 111 to supply a new film F and adsorbing it in a manner covering the specified area of the mold surface 106a of the inner surface of the first lower mold 106 including the first mold cavity 108 is implemented. In addition, an upper mold film supply step (first upper mold film supply step) of operating the first upper mold film supply unit 113 to supply a new film F and adsorbing it in a manner covering the specified area of the mold surface 104a of the first upper mold 104 is implemented. Before, after, or in parallel with the first preparation step, a forming step is carried out, in which a base resin Rm in a state where the carrier C is fixed is formed as the sealing resin R. As an example of the forming step, the carrier C is supplied in the carrier supply unit 30. In addition, in the base resin supply unit 40, a predetermined amount of the base resin Rm is supplied by a dispenser (not shown) or the like. Next, a pressing step is carried out as follows: in the resin forming unit 50, the sealing resin R in a solid state having a predetermined shape in which the carrier C is fixed is formed by pressing the carrier C and the base resin Rm. Furthermore, the so-called "solid" includes a substance in a state of being melted to the so-called B-stage or a state immediately before melting because pressing is carried out while heating to a temperature at which it does not fully harden. As an example, the carrier C may be placed in the lower mold 106 before supplying the base resin Rm, or the carrier C may be attached to the lower side of the film F of the upper mold 104. Specifically, in the pressing step, the carrier C supplied from the carrier supply unit 30 is transported by a transport device (e.g., the first loader 21, etc.) and housed in a predetermined position (e.g., the central position) in the first mold cavity 108 of the first lower mold 106. Next, a predetermined amount of the base resin Rm supplied from the base resin supply unit 40 is transported by a transport device (e.g., the first loader 21, etc.) or directly scattered from a dispenser or the like and housed in the first mold cavity 108 of the first lower mold 106. As an example, in the first mold cavity 108, a state is formed in which the base resin Rm is placed on the previously housed carrier C (see FIG. 5). Next, the first pressing device 150 is operated to close the first mold 102 heated to the predetermined temperature (see FIG. 6). At this time, the first mold cavity module 126 rises relatively in the first mold cavity 108, and the carrier C and the base resin Rm are pressed (clamped and pressurized) by the first mold cavity module 126 and the first plate 142. Thereby, the sealing resin R in a solid state having a predetermined shape in which the carrier C is fixed and not thermally hardened (fully hardened) is formed. As an example, as shown in FIG. 7A (plan view of the exposed surface of carrier C as the upper surface) and FIG. 7B (cross-sectional view taken along line A-A in FIG. 7A), the "prescribed shape" is as follows: in a top view, carrier C is disposed at the center, and a base resin Rm (in a solid state after pressing) is disposed at the peripheral portion so as to cover the outer periphery Ca of carrier C (furthermore, since the workpiece W is clamped from above and below, a positioning step (not shown) of the workpiece W may be provided on the resin surface). Thereby, the fixing property between carrier C and base resin Rm can be improved, and thus unexpected mutual peeling can be prevented. Furthermore, regarding the end portions, it is not necessarily required that the end portions of base resin Rm reach the outside. As shown in FIG. 7C (cross-sectional view similar to FIG. 7B), carrier C and base resin Rm can be substantially the same. In addition, a base resin Rm formed with a recess may be prepared, and carrier C may be attached to the recess. In addition, a flat carrier C may be attached to a simple flat plate-shaped base resin Rm without a recess. The fixing includes attachment. What is important in the pressing step is to perform it at a temperature at which it is difficult to thermally cure (formally cure) the base resin Rm (by heating the first lower mold 106 and the first upper mold 104 to a temperature at which it is difficult to thermally cure (formally cure)) so that the formed sealing resin R can be thermally cured (formally cured) in the subsequent resin sealing step. As described above, the "temperature at which it is difficult to thermally cure" also depends on the material of the base resin Rm, but as a specific example, it is about 50°C to 80°C (about 70°C in this embodiment). In addition, as the base resin Rm, it is preferable to use a powder resin. Accordingly, the resin amount can be adjusted and supplied extremely accurately as compared with the case of using a granular resin or a crushed resin. However, it is not limited to a powder resin. After the pressing step, a mold opening step (first mold opening step) of opening the first mold 102 and separating and taking out the sealing resin R (in a state where carrier C is fixed to the lower surface side) from the used film F is performed (refer to FIG. 8). In this embodiment, since the film F is disposed on both the mold surface 106a of the first lower mold 106 and the mold surface 104a of the first upper mold 104 by including the lower mold film supply step and the upper mold film supply step, the demolding of the sealing resin R formed by pressing becomes easy, and thus defects caused by resin adhesion to the mold can be prevented. In addition, after the first mold opening step, or in parallel, the following film supply steps (first lower mold film supply step, first upper mold film supply step) are performed, that is, the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to send out the used film F from the first mold 102, and a new film F is sent into and installed in the first mold 102. The above are the main steps of the method for forming the sealing resin R of the present embodiment. However, the order of the steps is an example, and the order can be changed or the steps can be carried out in parallel as long as there is no obstacle. As described above, when forming a molded product Wp in which the resin thickness after resin sealing (compression molding) (specifically, as shown in FIG. 15C, the thickness Da of the resin portion at the upper position of the workpiece W after resin sealing or the thickness Db of the resin portion at the lower position) is as thin as 0.4 mm or less, the thickness of the sealing resin (solid resin) before resin sealing also has to be thinned. However, since the sealing resin (solid resin) before resin sealing is of course in a state before formal hardening, it has low rigidity (brittleness) and weak strength, and thus there is a problem that it is extremely likely to be damaged during processing (especially during transportation). In particular, it has been confirmed that this is more significant in the case of a sealing resin (solid resin) formed by tableting. In contrast, by using the sealing resin R of the present embodiment for resin sealing (compression molding), this problem can be solved, that is, breakage of the sealing resin R during processing (especially during transportation) can be prevented, and a molded product Wp with a thin resin portion can be formed. Furthermore, through the experiments of the present inventor, it has been verified that a shape with Da = Db = 0.1 mm can also be achieved. In addition, by using the sealing resin R having the above structure for resin sealing (compression molding), it is possible to solve or reduce problems such as uneven scattering caused by granular resin, residual gas, generation of dust during molding, or difficult handling as in the past. (Compression molding device and compression molding method) Next, an overview of the compression molding device 2 and the compression molding method for resin-sealing (compression molding) the workpiece W using the sealing resin R of the present embodiment will be described. Here, FIG. 9 is a plan view (schematic diagram) showing an example of the compression molding device 2. As shown in FIG. 9, the compression molding device 2 includes, as main structures, a supply unit 10A for supplying the workpiece W and the like, a pressing unit 10B for resin-sealing the workpiece W and performing processing into the molded product Wp and the like, and a storage unit 10C for storing the molded product Wp and the like. As an example, along the X direction in FIG. 9, the supply unit 10A, the pressing unit 10B, and the storage unit 10C are arranged in sequence. However, it is not limited to the above structure, and the equipment structure, the number of units, or the arrangement order of the units within the unit can be changed. For example, the supply unit 10A and the storage unit 10C can be arranged in opposite directions in the X direction, or can also be arranged to be concentrated at the position of any one of them (not shown). In addition, it can also be configured to include units other than the above (not shown). In addition, in the compression molding device 2, the guide rails 22 are linearly arranged across the respective units, and a transfer device (second loader) 23 for transferring the workpiece W and the sealing resin R (which can also be used for transfer other than the workpiece W and the sealing resin R) and a transfer device (third loader) 24 for transferring the molded product Wp (which can also be used for transfer other than the molded product Wp) are arranged to be movable along the guide rails 22 between the specified units. However, it is not limited to the above structure, and it can also be configured to include a shared (one) transfer device (loader) (not shown) for transferring the workpiece W, the sealing resin R, the molded product Wp, etc. In addition, the transfer device can also be configured to include a robotic arm or the like instead of a loader. In addition, in the compression molding device 2, a control unit 90 for controlling the operation of each mechanism in each unit is arranged in the supply unit 10A (which can also be configured to be arranged in other units). The pressing unit 10B includes a resin sealing portion 70, and the resin sealing portion 70 performs resin sealing on the workpiece W and processes it into the molded product Wp. In the present embodiment, two (it can also be set to three or more or one) pressing units 10B including the resin sealing portion 70 are included, and each pressing unit 10B includes one (it can also be set to two or more) resin sealing portion 70 (refer to FIG. 9). However, it is not limited to the above structure. The resin sealing portion 70 includes a pair of sealing molds that are opened and closed by a pressing device (for example, a mold assembled from a plurality of mold blocks, a mold plate, a mold column, etc. including alloy tool steel or other components). Here, as an example, with reference to FIGS. 12 to 14, the steps of a compression molding method implemented using the compression molding device 2 including the second pressing device 250 (refer to FIG. 10) and the second mold 202 (refer to FIG. 11) will be described. First, a second preparation step is implemented. Specifically, a heating step (second upper mold heating step) of adjusting the second upper mold 204 to a specified temperature (for example, 100°C to 300°C) and heating it by the second upper mold heating mechanism is implemented. In addition, a heating step (second lower mold heating step) of adjusting the second lower mold 206 to a specified temperature (for example, 100°C to 300°C) and heating it by the second lower mold heating mechanism is implemented. In addition, a lower mold film supply step (second lower mold film supply step) is implemented. In the lower mold film supply step (second lower mold film supply step), the second lower mold film supply unit 211 is operated to supply a new film F and adsorb it in a manner covering a specified area of the mold surface 206a of the second lower mold 206. In addition, an upper mold film supply step (second upper mold film supply step) is implemented. In the upper mold film supply step (second upper mold film supply step), the second upper mold film supply unit 213 is operated to supply a new film F and adsorb it in a manner covering a specified area of the mold surface 204a of the second upper mold 204 including the inner surface of the second mold cavity 208. Before, after, or in parallel with the second preparation step, a resin preparation step of preparing a base resin Rm in a state where the carrier C is fixed as the sealing resin R is carried out. Specifically, the sealing resin R formed by the forming device 1 is prepared. After the second preparation step, an installation step of installing the sealing resin R and the workpiece W in the sealing die (second die 202) is carried out. As shown in FIG. 12, the workpiece W is held (including placed) on the holding portion 205 in a state where the workpiece W is sandwiched between two sealing resins R arranged with the respective carriers C on the outside. As an example of the installation step, for one sealing resin R (referred to as the "first sealing resin R" for convenience of explanation) prepared in the resin preparation step, it is conveyed by a conveying device (for example, the second loader 23, etc.), and placed on the holding portion 205 with the surface where the carrier C is exposed on the lower side. Next, for the workpiece W supplied from the supply cassette 12, it is conveyed by a conveying device (for example, the second loader 23, etc.), and placed on the first sealing resin R. Next, for the other sealing resin R (referred to as the "second sealing resin R" for convenience of explanation) prepared in the resin preparation step, it is conveyed by a conveying device (for example, the second loader 23, etc.), and placed on the workpiece W with the surface where the carrier C is exposed on the upper side. Alternatively, as another example of the installation step, the first sealing resin R and the second sealing resin R prepared in the resin preparation step, and the workpiece W supplied from the supply cassette 12 are laminated in such a manner that the workpiece W is sandwiched between two (first and second) sealing resins R arranged with the respective carriers C on the outside (that is, the first sealing resin R is prepared with the surface where the carrier C is exposed on the lower side, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the surface where the carrier C is exposed on the upper side). Next, the first sealing resin R, the workpiece W, and the second sealing resin R in this laminated state are conveyed by a conveying device (for example, the second loader 23, etc.), and placed on the holding portion 205. In this case, there are the following advantages: Instead of separately conveying the workpiece W and the two sealing resins R to the second die 202, it can be carried out at one time. In addition, there are the following advantages: Since the first sealing resin R and the second sealing resin R can be supplied to the heated sealing die (second die 202) simultaneously, the thermal history remains unchanged. After all of the above steps are implemented, a resin sealing step is implemented in which the workpiece W is sealed by the sealing resin R (in this embodiment, in a state of being clamped by two sealing resins R) to be processed into a formed product Wp. Specifically, a mold closing step (second mold closing step) of closing the second mold 202 and heating and pressing the sealing resin R against the workpiece W is implemented (refer to FIG. 13). At this time, the second holder 228 abuts against the lower plate 242 (mold surface 206a) via the film F, and the second cavity module 226 descends relatively within the second cavity 208. By this mold closing step, the sealing resin R undergoes thermosetting and resin sealing (compression molding) is completed, forming a formed product Wp having the shape shown in FIG. 15A. Further, in this embodiment, as shown in FIG. 12, the workpiece W is clamped from above and below by the sealing resin R of the carrier tape C, and thus compression molding is performed vertically. However, as another example, as shown in FIG. 21, the sealing resin R of the carrier tape C may be only one of the upper and lower ones, and the other may be a sealing resin R without the carrier tape C. After the second mold closing step, a mold opening step (second mold opening step) of opening the second mold 202 and separating the formed product Wp from the used film F and taking out the formed product Wp is implemented (refer to FIG. 14). Next, a formed product unloading step is implemented in which the formed product Wp (as an example, in a state of being held by the holding portion 205 of the lower plate 242) is unloaded from the second mold 202 by a transfer device (for example, the third loader 24, etc.) and transferred to the storage unit 10C. After the formed product unloading step, or in parallel, a film supply step (second lower mold film supply step, second upper mold film supply step) is implemented in which the second lower mold film supply unit 211 and the second upper mold film supply unit 213 are operated to send out the used film F from the second mold 202, and a new film F is sent into the second mold 202 and installed. In addition, after the formed product unloading step, a carrier peeling step of peeling the carrier C from the formed product Wp using the carrier peeling device 16 is implemented. Thereby, a formed product Wp having the shape shown in FIG. 15B is formed. Further, in this step, the formed product Wp can be reversed midway, and the carrier C on the upper surface and the lower surface can be peeled off sequentially by one peeling mechanism, or the formed product Wp may not be reversed, and the carrier C on the upper surface and the lower surface can be peeled off by two peeling mechanisms respectively. After the carrier peeling step, a step of transferring the carrier C peeled from the formed product Wp from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a transfer device (for example, the third loader 24, etc.) is implemented (as long as the carrier C is finally returned to the resin forming section 50). Further, when the carrier C is used for a heat sink plate or the like in the final product, it is not necessarily required to peel the carrier C. With the above structure, the carrier C can be peeled off from the formed product Wp, and the carrier C can be reused in the forming step of forming the sealing resin R (i.e., the base resin Rm in the state where the carrier C is fixed) in the forming device 1. Therefore, the manufacturing cost can be reduced by reducing the number of parts (the total number of necessary carriers C). In addition, since it is not necessary to prepare a plurality of carriers C in advance, in particular, the size or installation space of the storage part of the carrier C (such as a feeder, etc.) can be used as the main factor to miniaturize the device. In addition, after the carrier peeling step, a cutting step of cutting a specified position (the dotted line position shown in FIG. 15B) of the formed product Wp is performed. Specifically, using the cutting device 18, cutting is performed in the thickness direction within the region of the formed product Wp from which the carrier C has been peeled to cut off the outer edge portion. Thereby, a formed product Wp (the final target shape) having the shape shown in FIG. 15C, that is, a thin resin thickness (the resin thickness of the upper or lower part of the workpiece W) can be formed. After the cutting step, a storage step of storing the formed product Wp (in this embodiment, in the state where the carrier C has been peeled and the specified position has been cut) in the storage cassette 14 is performed. Furthermore, the carrier peeling device 16 and the cutting device 18 may not be provided in the compression forming device 2 but may be provided separately. In such a case, it can be configured to store the formed product Wp in a state where peeling or cutting has not been performed. The above are the main steps of the compression forming method using the compression forming device 2 (including the case of the second mold 202). However, the above order of steps is an example, and the order can be changed or they can be performed in parallel as long as there is no obstacle. Next, as another example, with reference to FIGS. 18 to 20, the steps of the compression forming method performed using the compression forming device 2 including the third pressing device 350 (refer to FIG. 16) and the third mold 302 (refer to FIG. 17) will be described. First, perform the third preparation step. Specifically, perform a heating step (the third upper mold heating step) of adjusting the third upper mold 304 to a specified temperature (for example, 100°C to 300°C) and heating it by the third upper mold heating mechanism. In addition, perform a heating step (the third lower mold heating step) of adjusting the third lower mold 306 to a specified temperature (for example, 100°C to 300°C) and heating it by the third lower mold heating mechanism. In addition, perform a lower mold film supply step (the third lower mold film supply step), in which the third lower mold film supply unit 311 is operated to supply a new film F, and it is adsorbed in such a way as to cover a specified area of the mold surface 306a of the inner surface of the third lower mold 306 including the third mold cavity 308. In addition, perform an upper mold film supply step (the third upper mold film supply step), in which the third upper mold film supply unit 313 is operated to supply a new film F, and it is adsorbed in such a way as to cover a specified area of the mold surface 304a of the third upper mold 304. Before, after, or in parallel with the third preparation step, perform a resin preparation step of preparing the base resin Rm in a state where the carrier C is fixed as the sealing resin R. Specifically, prepare the sealing resin R formed by the forming device 1. After the third preparation step, perform an installation step of installing the sealing resin R and the workpiece W in the sealing mold (the third mold 302). As shown in FIG. 18, it is held (including placed) in the third mold cavity 308 (on the third mold cavity module 326) in a state where the workpiece W is sandwiched between two sealing resins R arranged with each carrier C on the outside. As an example of the installation step, for one sealing resin R (referred to as "the first sealing resin R" for ease of explanation) prepared in the resin preparation step, it is transported by a transport device (for example, the second loader 23, etc.) and placed in the third mold cavity 308 (on the third mold cavity module 326) with the surface where the carrier C is exposed on the lower side. Next, for the workpiece W supplied from the supply cassette 12, it is transported by a transport device (for example, the second loader 23, etc.) and placed on the first sealing resin R. Next, for the other sealing resin R (referred to as "the second sealing resin R" for ease of explanation) prepared in the resin preparation step, it is transported by a transport device (for example, the second loader 23, etc.) and placed on the workpiece W with the surface where the carrier C is exposed on the upper side. Alternatively, as another example of the installation steps, the first sealing resin R and the second sealing resin R prepared in the resin preparation step, and the workpiece W supplied from the supply cassette 12 are laminated in such a manner that the workpiece W is sandwiched between two (first and second) sealing resins R arranged with each carrier C on the outside (i.e., the first sealing resin R is prepared with the surface where the carrier C is exposed on the lower side, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the surface where the carrier C is exposed on the upper side). Next, the first sealing resin R, the workpiece W, and the second sealing resin R in this laminated state are transported by a transport device (e.g., the second loader 23, etc.) and placed in the third cavity 308 (on the third cavity module 326). In this case, there are the following advantages: Instead of separately transporting the workpiece W and the two sealing resins R to the third mold 302, it can be done in one go. Additionally, there is the following advantage: Since the first sealing resin R and the second sealing resin R can be supplied to the heated sealing mold (the third mold 302) simultaneously, the thermal history remains unchanged. After all of the above steps are implemented, a resin sealing step is implemented in which the workpiece W is sealed with the sealing resin R (in this embodiment, in a state of being clamped by two sealing resins R) to be processed into a molded product Wp. Specifically, a mold closing step (the third mold closing step) is implemented in which the third mold 302 is closed and the sealing resin R for the workpiece W is heated and pressed (refer to FIG. 19). At this time, the third clamp 328 abuts against the upper plate 342 (the mold surface 304a) via the film F, and the third cavity module 326 rises relatively within the third cavity 308. By this mold closing step, the sealing resin R undergoes thermosetting to complete resin sealing (compression molding), and a molded product Wp having the shape shown in FIG. 15A (i.e., the same shape as in the case of using the second mold 202) is formed. Furthermore, in this embodiment, as shown in FIG. 18, the workpiece W is clamped from above and below by the sealing resin R with the carrier C, and thus compression molding is performed from above and below. However, as another example, as shown in FIG. 22, only one of the upper and lower sealing resins R with the carrier C may be used, and the other may be a sealing resin R without the carrier C. After the third mold closing step, a mold opening step (the third mold opening step) is implemented in which the third mold 302 is opened, and the molded product Wp is separated from the used film F and the molded product Wp is taken out (refer to FIG. 20). Next, a molded product搬出 step is implemented in which the molded product Wp (as an example, in a state of being held by the holding portion 305 of the upper plate 342) is carried out of the third mold 302 by a transport device (e.g., the third loader 24, etc.) and transported to the storage unit 10C. After the step of removing the formed product, or in parallel therewith, a film supply step (a third lower die film supply step and a third upper die film supply step) is performed in which the third lower die film supply unit 311 and the third upper die film supply unit 313 are operated to send out the used film F from the third mold 302, and a new film F is sent into the third mold 302 and installed. In addition, after the step of removing the formed product, a carrier peeling step is performed in which the carrier C is peeled from the formed product Wp using the carrier peeling device 16. Thereby, a formed product Wp having the shape shown in FIG. 15B is formed. Furthermore, in this step, the formed product Wp can be reversed midway, and the carrier C on the upper surface and the lower surface can be sequentially peeled by one peeling mechanism, or the formed product Wp may not be reversed, and the carrier C on the upper surface and the lower surface can be peeled by two peeling mechanisms, respectively. After the carrier peeling step, a step of conveying the carrier C peeled from the formed product Wp from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a conveying device (such as the third loader 24, etc.) is performed (as long as the carrier C is finally returned to the resin forming unit 50). Furthermore, when the carrier C is used for a heat sink or the like in the final product, it is not necessarily required to peel the carrier C. With the above structure, the carrier C can be peeled from the formed product Wp, and the carrier C can be reused in the step of forming the sealing resin R (that is, the base resin Rm in the state where the carrier C is fixed) in the forming device 1. Therefore, the manufacturing cost can be reduced by reducing the number of parts (the total number of necessary carriers C). In addition, since it is not necessary to prepare a plurality of carriers C in advance, in particular, the size or installation space of the storage part of the carrier C (such as a feeder, etc.) can be used as the main factor to miniaturize the device. In addition, after the carrier peeling step, a cutting step of cutting a specified position (the dotted line position shown in FIG. 15B) of the formed product Wp is performed. Specifically, using the cutting device 18, the outer edge part is cut off by cutting in the thickness direction within the area of the formed product Wp where the carrier C has been peeled off. Thereby, a formed product Wp having the shape shown in FIG. 15C, that is, a formed product Wp (the final target shape) with a thin resin thickness (the resin thickness of the upper or lower part of the workpiece W) can be formed. After the cutting step, a storage step of storing the formed product Wp (in this embodiment, in the state where the carrier C has been peeled off and the specified position has been cut) in the storage cassette 14 is performed. Furthermore, it can also be set as a step of storing the formed product Wp (that is, storing the formed product Wp in the state where peeling or cutting has not been performed) without performing the carrier peeling step or the cutting step. Furthermore, the carrier peeling device 16 and the cutting device 18 may not be provided in the compression molding device 2 but separately provided, and in this case, it can be configured to store the formed product Wp in the state where peeling or cutting has not been performed. The above are the main steps of the compression molding method using the compression molding device 2 (including the case of the third mold 302). However, the order of the steps is an example, and the order can be changed or implemented in parallel as long as there is no obstacle. As described above, by the forming device and forming method of the present invention, a sealing resin capable of obtaining the following effects can be formed. That is, when the sealing resin of the present invention is used, a compression molding device and a compression molding method capable of preventing the occurrence of molding defects caused by uneven scattering, residual gas, and generation of dust during molding, and capable of forming a molded product with a thin resin portion can be realized. In addition, the treatment before resin sealing can be facilitated. In addition, the occurrence of breakage during treatment can be prevented. Furthermore, by the forming method of the present invention, since the carrier can be peeled off from the molded product and the carrier can be reused in the forming step of forming the sealing resin, a reduction in manufacturing cost based on the reduction of the number of parts and miniaturization of the device mainly including the carrier storage portion can be realized. Moreover, the present invention is not limited to the above-described embodiments, and various changes can be made without departing from the scope of the present invention. 1: Forming device 2: Compression molding device 10A: Supply unit 10B: Pressing unit 10C: Storage unit 10D: Base resin supply unit 10E: Resin forming unit 12: Supply cassette 14: Storage cassette 16: Carrier peeling device 18: Cutting device 20: Guide rail 21: Conveying device (first loader) 22: Guide rail 23: Conveying device (second loader) 24: Conveying device (third loader) 30: Carrier supply section 40: Base resin supply section 50: Resin forming section 70: Resin sealing section 80, 90: Control section 102: Tablet pressing die (first die) 104: First upper die 104a, 106a, 204a, 206a, 304a, 306a: Die surface 106: First lower die 108: Mold cavity (first mold cavity) 110: Lower die groove (first lower die groove) 111: Lower die film supply section (first lower die film supply section) 112: Support column (first support column) 113: Upper die film supply section (first upper die film supply section) 114: Support plate (first support plate) 122: Pushing pin (first pushing pin) 124: Clamping spring (first clamping spring) 126: Mold cavity module (first mold cavity module) 128: Clamp (first clamp) 140: Upper die groove (first upper die groove) 142: Tablet pressing plate (first plate) 150: Pressing device (first pressing device) 152, 252, 352: Tie rod 154, 254, 354: Pressure plate (fixed pressure plate) 156, 256, 356: Pressure plate (movable pressure plate) 160, 260, 360: Drive source (electric motor) 162, 262, 362: Drive transmission mechanism (ball screw, toggle mechanism) 202: Sealing die (second die) 204: Second upper die (upper die) 205, 305: Holding section 206: Second lower die (lower die) 208: Mold cavity (second mold cavity) 210: Upper die groove (second upper die groove) 211: Film supply section (second upper die film supply section) 212: Support column (second support column) 213: Film supply section (second upper die film supply section) 214: Support plate (second support plate) 222: Pushing pin (second pushing pin) 224: Clamping spring (second clamping spring) 226: Mold cavity module (second mold cavity module) 228: Clamp (second clamp) 240: Lower die groove (second lower die groove) 242: Lower plate (second plate) 250: Pressing device (second pressing device) 302: Sealing die (third die) 304: Third upper die 306: Third lower die 308: Mold cavity (third mold cavity) 310: Lower die groove (third lower die groove) 311: Film supply section (third lower die film supply section) 312: Support column (third support column) 313: Third upper die film supply section 314: Support plate (third support plate) 322: Pushing pin (third pushing pin)324: Clamping spring (third clamping spring) 326: Cavity mold (third cavity mold) 328: Clamp (third clamp) 340: Upper die groove (third upper die groove) 342: Upper plate (third plate) 350: Pressing device (third pressing device) C: Carrier Ca: Outer circumference Da, Db: Thickness F: Film R: Sealing resin Rm: Base resin W: Workpiece Wp: Formed product X, Y, Z: Directions FIG. 1 is a plan view showing an example of a sealing resin forming apparatus according to an embodiment of the present invention. FIG. 2 is a side view showing an example of a first pressing device of the forming apparatus shown in FIG. 1. FIG. 3 is a front sectional view showing an example of a first mold of the forming apparatus shown in FIG. 1. FIG. 4 is a front sectional view showing another example of the first mold of the forming apparatus shown in FIG. 1. FIG. 5 is an explanatory view showing an example of a method for forming a sealing resin according to an embodiment of the present invention. FIG. 6 is a continuation explanatory view of FIG. 5. FIG. 7A is a plan view showing an example of a sealing resin according to an embodiment of the present invention. FIG. 7B is a sectional view taken along line A-A in FIG. 7A. FIG. 7C is a sectional view showing another example of the sealing resin. FIG. 8 is a continuation explanatory view of FIG. 6. FIG. 9 is a plan view showing an example of a compression molding apparatus using a sealing resin according to an embodiment of the present invention. FIG. 10 is a side view showing an example of a second pressing device of the compression molding apparatus shown in FIG. 9. FIG. 11 is a front sectional view showing an example of a second mold of the compression molding apparatus shown in FIG. 9. FIG. 12 is an explanatory view showing an example of a compression molding method using a sealing resin according to an embodiment of the present invention. FIG. 13 is a continuation explanatory view of FIG. 12. FIG. 14 is a continuation explanatory view of FIG. 13. FIGS. 15A to 15C are front sectional views showing examples of formed products formed in a compression molding apparatus and a compression molding method using a sealing resin according to an embodiment of the present invention. FIG. 15A shows the state before the carrier peeling step is performed, FIG. 15B shows the state after the carrier peeling step is performed, and FIG. 15C shows the state after the cutting step is performed. FIG. 16 is a side view showing an example of a third pressing device of the compression molding apparatus shown in FIG. 9. FIG. 17 is a front sectional view showing an example of a third mold of the compression molding apparatus shown in FIG. 9. FIG. 18 is an explanatory view showing another example of a compression molding method using a sealing resin according to an embodiment of the present invention. FIG. 19 is a continuation explanatory view of FIG. 18. FIG. 20 is a continuation explanatory view of FIG. 19. FIG. 21 is an explanatory view showing another example of a compression molding method using a sealing resin according to an embodiment of the present invention. FIG. 22 is an explanatory view showing another example of a compression molding method using a sealing resin according to an embodiment of the present invention. 102: Pressing die (first die) 104: First upper die 106: First lower die 104a, 106a: Die surface 108: Mold cavity (first mold cavity) 110: Lower mold groove (first lower mold groove) 112: Support post (first support post) 114: Support plate (first support plate) 122: Pushing pin (first pushing pin) 124: Clamping spring (first clamping spring) 126: Mold cavity module (first mold cavity module) 128: Clamp (first clamp) 140: Upper mold groove (first upper mold groove) 142: Pressing plate (first plate) C: Carrier F: Film R: Sealing resin X, Y, Z: Directions
Claims
1. A method for forming a molded article, comprising: a carrier placement step, wherein the carrier, being a plate-shaped member, is placed in contact with the bottom surface of a mold cavity; a resin placement step, wherein, after the carrier placement step, resin is placed in the mold cavity; a sealing resin forming step, wherein the carrier placed in the carrier placement step is sealed with the resin placed in the resin placement step to form a solid sealing resin in a state before formal hardening, the sealing resin having a first surface exposed to the carrier and a second surface opposite to the first surface and having the resin formed thereon; and a molded article forming step, wherein, with a workpiece having electronic components in contact with the sealing resin, the molded article forming step comprises: placing a first sealing resin formed in the sealing resin forming step on a stage; placing the workpiece on the first sealing resin; placing a second sealing resin formed in the sealing resin forming step on the workpiece; clamping the workpiece with the second surfaces of the first sealing resin and the second sealing resin facing each other and heating or pressurizing to form the molded article.
2. A method for forming a molded article as claimed in claim 1, comprising: a carrier peeling step of peeling the carrier from the molded article; and a step of sealing the carrier peeled off by the carrier peeling step with the resin to form the sealing resin.
Citation Information
Patent Citations
Method for producing circuit sheet, method for producing circuit board, circuit sheet, and circuit board
TW201934298A