Grinding apparatus and grinding method

Abstract

[The technical problem to be solved] One purpose is to provide a grinding apparatus and grinding method that can reduce the time required for grinding and stabilize the quality of the sealing surface, and another purpose is to provide mechanical parts with stabilized sealing surface quality. Technical means to solve the problem A grinding apparatus of a related embodiment includes: a support for a grinding tool, a worktable for supporting a grinding object, a first drive unit for moving the support and the worktable relative to each other along the shape of the grinding surface, and a second drive unit for rotating the support and the first drive unit synchronously with one end of the grinding component mounted on the grinding tool facing the direction of movement.

Description

Grinding Device, Grinding Method, and Machine Parts One embodiment of the present disclosure relates to a grinding device, a grinding method, and machine parts. In the manufacturing processes of various electronic parts such as semiconductor devices and display panels for display devices, processing in a vacuum can be performed. For the portions where the parts constituting a vacuum container used in such vacuum processing are in contact with each other, in order to ensure the sealing performance inside the container, grooves are provided in one or both of the contacting parts, and sealing members such as O-rings are provided in the grooves. Patent Document 1 discloses a cutting method of cutting a workpiece using a U-shaped turning tool cutting tool. Patent Document: Patent Document 1: Japanese Patent Laid-Open No. H06-126520 The grooves provided in the sealing member are usually formed by cutting the sealing surface using a rotary cutting tool such as an end mill. After cutting the grooves with the desired shape, the sealing surface may sometimes slightly remain uneven or have cutting chips, and grinding is required to eliminate these. The grinding of the sealing surface is mostly performed manually by an operator, but it takes a long time to complete the grinding, and the surface roughness of the ground surface varies depending on the experience or skill of the operator, resulting in a problem of unstable quality of the sealing surface. In view of the above problems, one object of one embodiment of the present disclosure is to provide a grinding device and a grinding method that can shorten the time required for grinding and stabilize the quality of the sealing surface. Moreover, one object of one embodiment of the present disclosure is to provide machine parts with stabilized quality of the sealing surface. According to a grinding device of one embodiment of the present disclosure, it includes: a support part for supporting a grinding tool, a workbench for supporting an object to be ground, a first driving part for relatively moving the support part and the workbench along the shape of the grinding surface, and a second driving part for synchronously rotating the support part and the first driving part in such a manner that one end of a grinding member installed on the grinding tool faces the moving direction. According to a grinding method of one embodiment of the present disclosure, which is a grinding method for grinding a grinding surface on anodized aluminum, it includes: a first stage of grinding the grinding surface with a first pressing strength through a first grinding member, and a second stage of grinding the grinding surface with a second pressing strength through a second grinding member after the first stage, wherein the first pressing strength is lower than the second pressing strength. According to a machine part of one embodiment of the present disclosure, it has an anodized aluminum surface, and a part of the anodized aluminum surface has a grinding surface, the waviness of the grinding surface is 0.2 μm or less, and the surface roughness of the grinding surface is 0.4 μm or less. According to an embodiment of the present disclosure, by automating the grinding process mechanically, the time required for grinding can be shortened, and the quality of the sealing surface can be stabilized. Embodiments of the present disclosure will be described below with reference to the drawings and the like. However, the present invention can be implemented in various different aspects and is not limited to the description of the embodiments given below. The drawings are for the purpose of making the description clearer, and in comparison with the actual aspect, there are cases where the width, thickness, shape, etc. of each part are schematically shown, but it is only an example after all and does not limit the interpretation of the present disclosure. The drawings are for the purpose of making the description clearer, and in comparison with the actual aspect, there are cases where the width, thickness, shape, etc. of each part are schematically shown, but it is only an example after all and does not limit the interpretation of the present invention. Also, in this specification and the drawings, there are cases where elements having the same function as those already described in the existing drawings are labeled with the same reference signs, and the repeated description is omitted. Also, in this specification and the drawings, there are cases where the same part or parts having the same function are labeled with the same reference signs or similar reference signs (symbols such as A, B, etc. are only labeled after the numbers), and the repeated description thereof is omitted. In this specification, when a certain component or region is defined as being "above (or below)" another component or region, unless otherwise specifically limited, it includes not only the case of being directly above (or directly below) another component or region, but also the case of being above (or below) another component or region, that is, it also includes the case where there is another component between them above (or below) another component or region. Also, in this specification, expressions such as "α includes A, B, or C", "α includes any one of A, B, and C", "α includes one selected from the group consisting of A, B, and C", etc., unless otherwise specifically stated, do not exclude the case where α includes various combinations of A to C. Furthermore, these expressions do not exclude the case where α includes other components. The grinding device 10 related to an embodiment of the present disclosure will be described below with reference to the drawings. FIG. 1 is a diagram for explaining an example of the structure of the grinding device 10 related to an embodiment of the present disclosure. As shown in FIG. 1, the grinding device 10 includes: a support portion 101, a workbench 103, a first drive portion 105, and a second drive portion 107. The support portion 101 supports the grinding tool 201. The grinding tool 201 will be described later. The support portion 101 is installed on the first drive portion 105. The workbench 103 supports the object to be polished 203. The object to be polished 203 is a part of a mechanical component. The object to be polished 203 is not particularly limited, but for example, it can also be a component that constitutes a vacuum instrument used in a vacuum device. In this case, the object to be polished 203 has a sealing surface of a vacuum container. The sealing surface can also be subjected to, for example, hard anodizing treatment. The polishing tool 201 can polish the hard anodized film of the object to be polished 203. In this embodiment, the film formed on the object to be polished 203 is not limited to hard anodizing. For example, the surface hardness of the object to be polished 203 is about Hv350 - 450. The first drive unit 105 moves the support unit 101 and the workbench 103 relative to the shape of the polishing surface of the object to be polished 203. In other words, the first drive unit 105 has a mechanism that moves the position of one or both of the support unit 101 and the workbench 103 in such a way that the polishing tool 201 can move along the shape of the polishing surface. The first drive unit 105 includes: a first moving unit 109, a first guiding unit 111, a second guiding unit 113, a second moving unit 115, and a third guiding unit 117. The first moving unit 109 moves the support unit 101 along the z - direction. The first guiding unit 111 is disposed on the main body 119 of the polishing device 10 so as to extend along the z - direction. The first guiding unit 111 guides the first moving unit 109 to move in the z - direction. For example, the first guiding unit 111 can also be a track extending along the z - direction, and the first moving unit 109 can slide along the first guiding unit 111 in the z - direction. The first moving unit 109 and the first guiding unit 111 constitute the first moving mechanism 112 for moving the support unit 101. The second guiding unit 113 guides the workbench 103 to move in the x - direction. The second guiding unit 113 can also be a rectangular plate body having a pair of sides along the x - direction and a pair of sides along the y - direction. The workbench 103 is supported by the second guiding unit 113 in such a way that it can slide in the x - direction. For example, the workbench 103 can also be arranged to clamp the edges of a pair of sides along the x - direction of the second guiding unit 113 and slide along the edges of a pair of sides along the x - direction of the second guiding unit 113. The second moving unit 115 moves the second guiding unit 113 that supports the workbench 103 along the y - direction. The third guiding unit 117 is disposed on the main body 119 of the polishing device 10 so as to extend along the y - direction. The third guiding unit 117 guides the second guiding unit 113 to move in the y - direction. For example, the third guiding unit 117 can also be a track extending along the y - direction, and the second guiding unit 113 can slide along the third guiding unit 117 in the y - direction. The second guiding unit 113, the second moving unit 115, and the third guiding unit 117 can also constitute the second moving mechanism 118 for moving the workbench 103. Although an example of the structure of the first drive unit 105 has been described, in the present embodiment, the structure of the first drive unit 105 is not limited to the above. For example, the first drive unit 105 may further include a moving mechanism for moving the support unit 101 in the x direction and / or the y direction. Further, the first drive unit 105 may further include a moving mechanism for moving the workbench 103 in the z direction. The second drive unit 107 rotates the support unit 101 that supports the abrasive tool 201. Further, the second drive unit 107 can rotate the support unit 101 synchronously with the first drive unit 105 in such a manner that one end of the abrasive member of the abrasive tool 201 is always oriented in the moving direction of the abrasive tool 201, and the moving direction of the abrasive tool 201 is along the grinding surface of the grinding object 203. Although not shown in the drawings, the grinding device 10 includes a plurality of electric motors. Through these electric motors, the first drive unit 105 and the second drive unit 107 move and rotate the support unit 101 and the workbench 103. FIG. 2 is an example of a functional block diagram of the grinding device 10. As shown in FIG. 2, the grinding device 10 includes an input operation unit 121 and a control unit 122. The input operation unit 121 is a device such as an operation panel, operation buttons, a touch panel, etc., and outputs a signal corresponding to the input operation to the control unit 122. An operator engaged in the grinding operation can control the operations of the first drive unit 105 and the second drive unit 107 of the grinding device 10 through the input operation unit 121. For example, the operator can, through the input operation unit 121, set or change the start and stop of the grinding process executed by the grinding device 10, the rotation speed of the support unit 101, and the moving speed and moving direction of the support unit 101 and the workbench 103. The control unit 122 includes an arithmetic processing circuit such as a CPU and a memory unit. The control unit 122 executes a control program stored in the memory unit through the CPU, controls the operations of the first drive unit 105 and the second drive unit 107, and realizes the grinding function through the grinding device 10. FIGS. 3, 4, and 5 are schematic diagrams showing an example of the abrasive tool 201 supported by the support unit 101 of the grinding device 10 according to the present embodiment. The grinding process of the grinding object 203 executed by the grinding device 10 according to the present embodiment includes: a first stage of grinding the grinding surface with a first pressing strength by the first grinding member, and a second stage of grinding the grinding surface with a second pressing strength by the second grinding member after the first stage. The first grinding member and the second grinding member are grinding members made of different materials. Further, the first pressing strength and the second pressing strength are different from each other. Here, the so-called pressing strength means the load applied to the grinding jig when the grinding member is in contact with the grinding surface of the grinding object 203 during the grinding process. FIG. 3 is a schematic view showing an example of the abrasive tool 201A used in the first stage of the grinding process. The abrasive tool 201A includes: a jig 303 and a first abrasive member 305A in which an intermediate abrasive member support portion 307 is installed on the jig 303. The first abrasive member 305A may also be a brush formed of, for example, ceramic fiber, nylon, etc. In other words, the first stage of the grinding process is a grinding process using a brush. FIG. 6 is an example of a schematic exploded view of the jig 303. As shown in FIGS. 3 and 6, the jig 303 includes: an abrasive member support portion 307, a fixing portion 309, a bracket 311, and a cover member 313. The fixing portion 309 is fixed to the support portion 101 of the grinding device 10. The bracket 311 is joined to the fixing portion 309. A hollow storage portion 312 is provided inside the bracket 311, and a helical spring 315 is inserted into the storage portion 312. The spring constant of the helical spring 315 of the abrasive tool 201A used in the first stage is 1 N / mm or more and 5 N / mm or less. A floating mechanism is formed by the helical spring 315 inserted into the jig 303. The abrasive member support portion 307 is inserted into the storage portion 312 of the fixing portion 309 and fixed. The abrasive member support portion 307 is inserted into the storage portion 312 in such a manner that the helical spring 315 is compressed by an intermediate washer 316. At this time, the abrasive member support portion 307 compresses the helical spring 315 without completely closing it. A hollow portion 308 is provided in the abrasive member support portion 307. The first abrasive member 305A is detachably installed in the hollow portion 308. A pair of holes 317 are provided in the bracket 311. Steel balls 319 are respectively inserted into the holes 317. The cover member 313 is disposed on the holes 317 so as to block the holes 317 into which the steel balls 319 are inserted, and the cover member 313 is fixed by two snap rings 321 so as not to deviate. FIG. 4 is a schematic view showing an example of the abrasive tool 201B used in the second stage of the grinding process. The abrasive tool 201B has a structure slightly the same as that of the abrasive tool 201A shown in FIGS. 3 and 6, except that the material of the second abrasive member 305B installed on the jig 303 is different from the material of the first abrasive member 305A, and the helical spring 315 inside the jig 303 has a spring constant different from that of the helical spring 315 inserted into the jig 303 of the abrasive tool 201A shown in FIGS. 3 and 6. In the abrasive tool 201B shown in FIG. 4, the second abrasive member 305B is a sponge abrasive coated with abrasive grains such as alumina, titanium oxide, and zirconia. In other words, the second stage of the grinding process is a grinding process using a sponge. The shape of the abrasive member 305 may also be, for example, cylindrical. The spring constant of the helical spring 315 of the jig 303 inserted into the grinding tool 201B is different from the spring constant of the helical spring 315 of the jig 303 inserted into the grinding tool 201A used in the first stage. The spring constant of the helical spring 315 inserted into the interior of the jig 303 of the grinding tool 201B exceeds 1 N / mm and is 10 N / mm or less. The spring constant of the helical spring 315 inserted into the interior of the jig 303 of the grinding tool 201B is higher than the spring constant of the helical spring 315 inserted into the interior of the jig 303 of the grinding tool 201A. After the end of the first stage in which the grinding tool 201A is used, an operator engaged in the grinding process performed by the grinding device 10 can also remove the grinding tool 201A from the support portion 101 of the grinding device 10 and install the grinding tool 201B on the support portion 101. Further, the operator can also disassemble the jig 303 of the grinding tool 201A, take out the helical spring 315 having a spring constant of 1 N / mm or more and 5 N / mm or less from the grinding tool 201A used in the first stage, and replace it with the helical spring 315 having a spring constant exceeding 1 N / mm and being 10 N / mm or less used in the second stage, thereby manufacturing the grinding tool 201B. In this case, the operator can also remove the first grinding member 305A installed on the grinding tool 201A and install the second grinding member 305B in a detachable manner while replacing the helical spring 315 of the jig 303. FIG. 5 is a schematic view showing another example of the grinding tool 201C used in the second stage of the grinding process. The second grinding member 305C of the jig 303 installed in the grinding tool 201C is another example of a second grinding member different from the second grinding member 305B shown in FIG. 4. The grinding tool 201C has a structure slightly the same as that of the grinding tool 201B shown in FIG. 4 except that the shape of the second grinding member 305C installed in the jig 303 is different from the shape of the second grinding member 305B. The material of the second grinding member 305C of the grinding tool 201C is the same as the material of the second grinding member 305B of the grinding tool 201B. On the other hand, the shape of the second grinding member 305C is different from the shape of the second grinding member 305B and may be, for example, a hemispherical shape. After the operator engaged in the grinding process performed by the grinding device 10 finishes the first stage using the grinding tool 201A, the operator can also remove the grinding tool 201A from the support portion 101 of the grinding device 10 and install the grinding tool 201C on the support portion 101. Further, the operator can disassemble the jig 303 of the grinding tool 201A, take out the helical spring 315 having a spring constant of 1 N / mm or more and 5 N / mm or less from the grinding tool 201A used in the first stage, replace it with the helical spring 315 having a spring constant of more than 1 N / mm and 10 N / mm or less used in the second stage, and at the same time remove the first grinding member 305A installed on the grinding tool 201A and install the second grinding member 305C in a detachable manner, thereby manufacturing the grinding tool 201C. Both the grinding tool 201B shown in FIG. 4 and the grinding tool 201C shown in FIG. 5 can be used in the second stage of the grinding process performed by the grinding device 10. The grinding tool 201B shown in FIG. 4 is preferably used when the grinding surface of the object to be ground 203 is circular. On the other hand, the grinding tool 201C is preferably used when the grinding surface of the object to be ground 203 is non-circular. FIG. 7 is a plan view of an example of the object to be ground 203 viewed from above. The object to be ground 203 is, for example, a part constituting a vacuum container and is formed of an aluminum alloy, stainless steel, or the like. The object to be ground 203 has a sealing surface 701. The sealing surface 701 is subjected to hard anodizing treatment, and the film thickness of the hard anodized film can also be about 30 μm to about 100 μm. The sealing surface 701 includes a plurality of grinding surfaces. Here, the so-called grinding surface means the surface on the sealing surface 701 that is ground by the grinding tool 201. The grinding surfaces include circular grinding surfaces 703a to 703j and non-circular grinding surfaces 705a to 705c. When grinding the circular grinding surfaces 703a to 703j, it is preferable to use the grinding tool 201B shown in FIG. 4 in the second stage. In the second stage, the second drive unit 107 of the grinding device 10 rotates the support portion 101 that supports the grinding tool 201B at a specified rotational speed. In other words, the second grinding member 305B of the grinding tool 201B grinds the circular grinding surfaces 703a to 703j while rotating at a specified rotational speed. When grinding the non-circular grinding surfaces 705a to 705c, it is preferable to use the grinding tool 201C shown in FIG. 5 in the second stage. The second drive unit 107 of the grinding device 10 rotates the support portion 101 along the shape of the non-circular grinding surfaces 705a to 705c in such a manner that one specified end of the second grinding member 305C installed on the grinding tool 201C always faces the direction in which the grinding tool 201C moves. For example, one specified end of the second grinding member 305C is a part of the outer surface (spherical crown) of the hemispherical second grinding member 305C. FIG. 8 is a schematic diagram for explaining the movement path of the second polishing member 305C mounted on the polishing tool 201C when polishing a non-circular polishing surface. In FIG. 8, the non-circular polishing surface 705b shown in FIG. 7 is depicted as the non-circular polishing surface. Also, in FIG. 8, the moving direction of the polishing tool 201C is indicated by a dashed arrow. As shown in FIG. 8, in the second stage, the second driving unit 107 rotates the support unit 101 along the shape of the polishing surface 705b such that one specified end 801a of the second polishing member 305C always faces the moving direction of the polishing tool 201C. Regarding the surface roughness of the polishing surface of the polishing object 203 that has undergone the polishing process including the first stage and the second stage performed by the polishing device 10, it is preferably that the waviness is 0.2 μm or less, the standard deviation of the waviness is 0.2 μm or less, the surface roughness is 0.4 μm or less, and the standard deviation of the surface roughness is 0.3 μm or less. The surface roughness of the polishing surface of the polishing object 203 is more preferably 0.2 μm or less. Here, among the different undulations in the intervals of the polishing surface, the larger undulations are referred to as "waviness". The distinction between "waviness" and the smaller "roughness" can be made using the reference length (cut-off value) defined by JIS B0633. In the present embodiment, in the polishing process performed by the polishing device 10, it includes: a first stage of polishing the polishing surface with the first polishing member 305A at the first pressing strength, and a second stage after the first stage of polishing the polishing surface with the second polishing member 305B or the second polishing member 305C at the second pressing strength. Since the spring constants of the coil springs 315 inserted into the jigs 303 of the polishing tools 201A equipped with the first polishing member 305A and the coil springs 315 inserted into the jigs 303 of the polishing tools 201B and 201C equipped with the second polishing members 305B and 305C are different from each other, it is possible to change the pressing strengths applied to the polishing tool 201A and the polishing tools 201B and 201C in the first stage which is a polishing process using a brush and the second stage which is a polishing process using a sponge containing abrasive grains. Specifically, the second pressing strength can be made higher than the first pressing strength. Thereby, the polishing process can be automated mechanically, while shortening the time required for polishing, and stabilizing the quality of the sealing surface. Also, the waviness and surface roughness of the polishing surface can be made smaller than those of the polishing surface polished manually by an operator, and the airtightness of the sealing surface can be improved. Also, by rotating the support unit 101 by the second driving unit 107 such that one specified end of the second polishing member 305C always faces the moving direction of the polishing tool 201C, even when the polishing surface is non-circular, the polishing process can be automated mechanically. 'Examples' <Example 1> [Polishing Device and Object to be Polished] As the object to be polished, an aluminum alloy A6061 with dimensions of diameter 360 mm × t40 mm was prepared. Hard anodized treatment was performed on the surface to form a hard anodized film with a thickness of 80 μm. The aluminum alloy A6061 with a hard anodized film formed on its surface was used as the object to be polished, and the surface with the hard anodized film was polished through the polishing device related to this embodiment. The polished surface of the object to be polished was made the same as the polished surface of the object to be polished 203 shown in Fig. 7. As the polishing device, a ROBODRILL manufactured by Fanuc Corporation was used, and a floating jig (FH-ST12-SL10) manufactured by XEBEC Corporation was used as the jig for the polishing tool. [Polishing Tool] In the first stage of the polishing process performed by the polishing device, a polishing tool (hereinafter referred to as the first polishing tool) was made by inserting a helical spring (WL10-35, spring constant: 1 N / mm) manufactured by MISUMI Corporation into the jig and installing a brush tool (A11-EB06M) manufactured by XEBEC Corporation with the brush tool length adjusted to 12 mm on the jig. And, when polishing the circular polished surface in the second stage of the polishing process performed by the polishing device, a polishing tool (hereinafter referred to as the second polishing tool A) was made by inserting a helical spring (WT10-35, spring constant: 2 N / mm) manufactured by MISUMI Corporation into the jig, cutting a sponge abrasive (ultrafine) manufactured by 3M Corporation into a cylindrical shape with a diameter of 21 mm and a thickness of 5 mm, and installing it on the jig. And, when polishing the non-circular polished surface in the second stage of the polishing process performed by the polishing device, a polishing tool (hereinafter referred to as the second polishing tool B) was made by inserting a helical spring (WT10-35, spring constant: 2 N / mm) manufactured by MISUMI Corporation into the jig, cutting a sponge abrasive (ultrafine) manufactured by 3M Corporation into a shape with a width of 6 mm, a length of 40 mm, and a hemispherical shape with a diameter of 5 mm at the end, and installing it on the jig. [Polishing Process for Circular Polished Surface] (First Stage) In the first stage of the grinding process, for the ten circular grinding surfaces 10 of the object to be ground (refer to the circular grinding surfaces 703a to 703j shown in Fig. 7), the rotation speed of the first grinding tool is 5000 rpm and the feed speed is 2000 mm / min. At a position with a radius of 7.5 mm, it is spirally moved from Z: 2.0 mm to Z: -1.0 mm. After grinding 5 circles with an arc of radius 7.5 mm, it is offset by 1.75 mm and ground 5 circles along a spiral path. Then, for the ten circular grinding surfaces 10 of the object to be ground, the rotation speed of the first grinding tool is changed to 8000 rpm, and the feed speed is 2000 mm / min. At a position with a radius of 7.5 mm, it is spirally moved from Z: 2.0 to Z: -1.0. After grinding 5 circles with an arc of radius 7.5 mm, it is offset by 1.75 mm and ground 5 circles along a spiral path. (Second stage) In the second stage of the grinding process, for the ten circular grinding surfaces 10 of the object to be ground, the second grinding tool A is spirally lowered to Z: -3.0 mm at a rotation speed of 30 rpm. The grinding is stopped for 10 seconds, and the above is defined as one set and implemented in two sets. [Grinding process for non-circular grinding surfaces] (First stage) In the first stage of the grinding process, for the three non-circular grinding surfaces of the object to be ground (refer to the grinding surfaces 705a to 705c shown in Fig. 7), the rotation speed of the first grinding tool is set to 5000 rpm and the feed speed is 2000 mm / min. The first grinding tool is spirally lowered to Z: -1.0 mm. The grinding surfaces 705a and 705b are each ground for 10 circles, and the grinding surface 705c is ground for 5 circles. The above is defined as one set, and two sets are implemented for the grinding surfaces 705a, 705b, and 705c respectively. Then, the rotation speed of the first grinding tool is changed to 8000 rpm, and the first grinding tool is spirally lowered to Z: -0.5 mm. The grinding surfaces 705a and 705b are each ground for 20 circles, and the grinding surface 705c is ground for 10 circles. The above is defined as one set, and two sets are implemented for the grinding surfaces 705a, 705b, and 705c respectively. (Second stage) In the second stage of the grinding process, for the three non-circular grinding surfaces 3 of the object to be ground (refer to the grinding surfaces 705a to 705c shown in Fig. 7), the feed rate is set to 2000 / min in the radius (R) part of the second grinding tool B and 4000 / min in the linear part. The second grinding tool B is spirally lowered to Z: -1.0 mm, and the grinding surfaces 705a and 705b are each ground for 20 revolutions, and the grinding surface 705c is ground for 10 revolutions. The above is defined as one set and six sets are implemented. <Comparative Example 1> As Comparative Example 1, manual work by an operator is used to grind the circular grinding surfaces 703a to 703j and the non-circular grinding surfaces 705a to 705c of the object to be ground, which is the same as the object to be ground used in Example 1 above. The grinding process using manual work is as follows. First, the same object to be ground as in Example 1 above is used as the object to be ground. By analogy with Example 1, the grinding surface of the object to be ground is made the same as the grinding surface of the object to be ground 203 shown in Fig. 7. Secondly, masking patches exposing 10 circular grinding surfaces (refer to the grinding surfaces 703a to 703j shown in Fig. 7) and 3 non-circular grinding surfaces (refer to the grinding surfaces 705a to 705c shown in Fig. 7) of the object to be ground are attached to the sealing surface 701 of the object to be ground. A template for reinforcement is further attached to the masking patch. After that, SULCLUT (manufactured by Kyodo Yushi Co., Ltd.) is applied to each of the grinding surfaces 703a to 703j, 705a to 705c, and then the sponge abrasive (fine) manufactured by 3M Company is used to manually grind each of the grinding surfaces 703a to 703j, 705a to 705c for 1.5 hours. Secondly, the sponge abrasive (ultra-fine) manufactured by 3M Company is used to manually grind each of the grinding surfaces 703a to 703j, 705a to 705c for 1.5 hours. After that, each of the grinding surfaces 703a to 703j, 705a to 705c is wiped with a cleaning cloth coated with NEICLEAN 2, and the masking patch is peeled off from the grinding surface 701. The surface roughness (Ra) and operation time of the grinding surface after implementing the grinding process described in Example 1 above are shown in Table 1 below. And the surface roughness (Ra) and operation time of the grinding surface after implementing the grinding process of Comparative Example 1 are shown in Table 2 below. 'Table 1' 'Table 2' Comparing Example 1 above with Comparative Example 1, it can be seen that the grinding by the grinding device according to this embodiment type significantly shortens the time consumed in the grinding process compared to the grinding by manual work, and at the same time, better results or slightly equivalent results can be obtained compared to the grinding by manual work. Also, it can be seen that the difference in surface roughness related to the grinding position in Example 1 is smaller than that in Comparative Example 1, and the quality of the sealing surface can be stabilized. <Example 2> Through a grinding process slightly the same as that in Example 1, the circular grinding surfaces 703a, 703e, 703j and the non-circular grinding surfaces 705a to 705c in the same grinding object as the grinding object used in Example 1 above are ground. However, different from Example 1 above, in the second stage of using the second grinding tool A or the second grinding tool B, the second stage described in Example 1 above is defined as one cycle, and the sponge is replaced at the end of each cycle, and three cycles are carried out respectively. Table 3 shown below reveals the waviness and surface roughness of the circular grinding surfaces 703a, 703e, 703j through the grinding process of Example 2, and Table 4 reveals the waviness and surface roughness of the non-circular grinding surfaces 705a to 705c through the grinding process of Example 2. In addition, the cut-off value for distinguishing waviness from surface roughness is set to 200 μm. 'Table 3' 'Table 4' As shown in Table 3 and Table 4, by implementing the grinding process through the grinding device according to this embodiment type, in both the circular grinding surface and the non-circular grinding surface, the waviness of the grinding surface becomes 0.2 μm or less, and the standard deviation of the waviness becomes 0.2 μm or less. Also, in both the circular grinding surface and the non-circular grinding surface, the surface roughness of the grinding surface becomes 0.2 μm or less, and the standard deviation of the surface roughness becomes 0.3 μm or less. In particular, in both the circular grinding surface and the non-circular grinding surface, the surface roughness of the grinding surface becomes 0.2 μm or less. Furthermore, in the circular grinding surface, the waviness can be made 0.1 μm or less. <Comparative Example 2> As Comparative Example 2, the circular grinding surfaces 703a, 703e, 703j and the non-circular grinding surfaces 705a to 705c in the same grinding object as the grinding object used in Example 1 above are ground by manual work by an operator. The grinding is carried out according to the procedure described below. First, masking patches for masking the circular grinding surfaces 703a, 703e, 703j of the grinding object to be exposed and the non-circular grinding surfaces 705a to 705c are attached to the sealing surface 701 of the grinding object. A template member for reinforcement is further attached to the masking patches. After that, SULCLUT (manufactured by Kyodo Yushi Co., Ltd.) is applied to each of the grinding surfaces 703a, 703e, 703j, 705a to 705c, and then the sponge abrasive (fine) manufactured by 3M Company is used for manual operation to grind each of the grinding surfaces 703a, 703e, 703j, 705a to 705c for 1.5 hours. Secondly, the sponge abrasive (ultra-fine) manufactured by 3M Company is used for manual operation to grind each of the grinding surfaces 703a, 703e, 703j, 705a to 705c for 1.5 hours. After that, each of the grinding surfaces 703a, 703e, 703j, 705a to 705c is wiped with a cleaning cloth coated with NEICLEAN 2, and the masking patches are peeled off from the grinding surface 701. Table 5 shown below discloses the waviness and surface roughness of the circular grinding surfaces 703a, 703e, 703j that have undergone the grinding process of the above-described manual operation, and Table 6 discloses the waviness and surface roughness of the non-circular grinding surfaces 705a to 705c that have undergone the grinding process of the above-described manual operation. In addition, the cut-off value for distinguishing waviness and surface roughness is set to 200 μm. 'Table 5' 'Table 6' As shown in Table 5 and Table 6, in both the circular grinding surface and the non-circular grinding surface in Comparative Example 2, the waviness of the grinding surface becomes larger than that in Example 2 above. Also, the surface roughness and the standard deviation of the surface roughness of the non-circular grinding surface in Comparative Example 2 become larger than those in Example 2 above. Although the surface roughness and the standard deviation of the surface roughness of the circular grinding surface in Comparative Example 2 become slightly smaller than those in Example 2 above, the difference in the surface roughness and the standard deviation of the surface roughness at each grinding position becomes larger than the difference in the surface roughness and the standard deviation of the surface roughness at each grinding position of the circular grinding surface in Example 2 above. Comparing Example 2 and Comparative Example 2 above, it can be seen that the grinding by the grinding device according to this embodiment can obtain better results or slightly equivalent results than the grinding by manual operation. [Modification Example] Although an example of the embodiment of the present disclosure has been described above, the embodiment of the present disclosure is not limited to the above-described embodiment. The following describes a modification example of the grinding process performed by the grinding device of the present disclosure. The grinding process in the first stage using a brush as a grinding component may also include a pretreatment for rough machining and a post-treatment for final machining. In this case, it is preferable to insert springs with different spring constants into the jig of the grinding tool in the pretreatment and the post-treatment, and change the pressing strength applied to the grinding tool used in the pretreatment and the pressing strength applied to the grinding tool used in the post-treatment. More specifically, it is preferable that the pressing strength applied to the grinding tool used in the pretreatment is higher than the pressing strength applied to the grinding tool used in the post-treatment. In other words, the spring constant of the spring inserted into the jig of the grinding tool used in the pretreatment is higher than the spring constant of the spring inserted into the jig of the grinding tool used in the post-treatment. In the above-described embodiments and variations as one embodiment of the present disclosure, as long as they do not contradict each other, they can be appropriately combined and implemented. And, based on the structure shown in the embodiment, those with ordinary knowledge in the technical field to which the present invention pertains who make appropriate additions, deletions, or design changes to the components, or make additions, omissions, or condition changes to the processes, as long as they possess the gist of the present disclosure, they are included in the scope of the present invention. Even for other effects different from the effects brought about by the aspects of the above-described embodiments, those that are obvious from the description in this specification or can be easily predicted by those with ordinary knowledge in the technical field to which the present invention pertains should be understood to be brought about by the present invention. 10: Grinding device 101: Support part 103: Workbench 105: First drive part 107: Second drive part 109: First moving part 111: First guiding part 112: First moving mechanism 113: Second guiding part 115: Second moving part 117: Third guiding part 118: Second moving mechanism 119: Body 121: Input operation part 122: Control part 201 (201A~201C): Grinding tool 203: Grinding object 303: Jig 305 (305A~305C): Grinding component 307: Grinding component support part 308: Hollow part 309: Fixing part 311: Bracket 312: Storage part 313: Cover 315: Helical spring 316: Washer 317: Hole 319: Steel ball 321: Retaining ring 701: Sealing surface 703a~703j: Circular grinding surface 705a~705c: Non-circular grinding surface 801a: One end 〈FIG. 1〉 is a diagram for explaining an example of the structure of a grinding device related to one embodiment of the present disclosure. 〈FIG. 2〉 is a functional block diagram of a grinding device related to one embodiment. 〈FIG. 3〉 is a schematic diagram showing an example of a grinding tool used in a grinding device related to one embodiment. 〈Figure 4〉is a schematic diagram showing an example of an abrasive tool used in a grinding device related to an embodiment. 〈Figure 5〉is a schematic diagram showing an example of an abrasive tool used in a grinding device related to an embodiment. 〈Figure 6〉is a schematic exploded view of a jig of an abrasive tool used in a grinding device related to an embodiment. 〈Figure 7〉is a top view of an example of an object to be ground as viewed from above. 〈Figure 8〉is a schematic diagram for explaining the movement path of a second grinding member when grinding a non-circular grinding surface of an object to be ground. 10: Grinding device 101: Support part 103: Workbench 105: First drive part 107: Second drive part 109: First moving part 111: First guiding part 112: First moving mechanism 113: Second guiding part 115: Second moving part 117: Third guiding part 118: Second moving mechanism 119: Body 201: Abrasive tool 203: Object to be ground

Claims

1. A method for grinding a surface of hard-coated aluminum, comprising: a first stage of grinding the grinding surface with a first pressing intensity through a first grinding member, and a second stage of grinding the grinding surface with a second pressing intensity through a second grinding member after the first stage, wherein the first pressing intensity is lower than the second pressing intensity, the first grinding member and the second grinding member are supported by a fixture, the fixture comprising a receiving portion and a grinding member support portion, wherein a first spring for pressing the first grinding member is inserted into the receiving portion in the first stage, and a second spring for pressing the second grinding member is inserted into the receiving portion in the second stage, and the grinding member support portion is inserted into the receiving portion by compressing the first spring or the second spring through a washer, wherein the spring constant of the second spring is higher than the spring constant of the first spring, and the first pressing intensity and the second pressing intensity are controlled by the spring constant of the first spring and the spring constant of the second spring.

2. The grinding method for a hard oxide-coated aluminum surface as described in claim 1, wherein the second stage comprises: pressing the second grinding member against the grinding surface and moving the second grinding member relative to the grinding surface, controlled such that one end of the second grinding member is oriented toward the direction of movement.

3. The grinding method for the hard oxide-coated aluminum surface as described in claim 1 or 2, wherein the first grinding component is a brush and the second grinding component is a sponge.

4. The grinding method for the hard oxide-coated aluminum surface as described in claim 3, further comprising: after the first stage and before the second stage, replacing the first spring contained in the aforementioned fixture used in the first stage with the second spring used in the second stage.

5. A grinding apparatus for grinding the surface of hard-coated aluminum, comprising: a first grinding member for a first grinding step of grinding a grinding surface on the hard-coated aluminum surface with a first pressing intensity; a second grinding member for a second grinding step of grinding the grinding surface with a second pressing intensity higher than the first pressing intensity after the first grinding step; and a fixture supporting the first grinding member and the second grinding member, wherein the fixture includes a receiving portion and a grinding member support portion, wherein a first spring for pressing the first grinding member or a second spring for pressing the second grinding member is inserted into the receiving portion, and the grinding member support portion is inserted into the receiving portion in such a way that the first spring or the second spring is compressed through a washer, wherein the spring constant of the second spring is higher than the spring constant of the first spring, and the first pressing intensity and the second pressing intensity are controlled by the spring constant of the first spring and the spring constant of the second spring.

6. The grinding apparatus as claimed in claim 5, wherein the first grinding component is a brush and the second grinding component is a sponge.

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