Method of forming a conductive structure and apparatus thereof

Abstract

This invention discloses a method and apparatus for forming a conductive structure. The conductive structure forming method includes the following steps: supporting at least one substrate with at least one through hole using a carrier module; supplying a conductive material to be solidified into the at least one through hole using a feeding module; and supplying a laser beam into the at least one through hole using a laser module to solidify the conductive material. Therefore, the conductive structure forming method and apparatus of this invention not only improve the connection yield between the conductive post and the inner wall of the hole, but also have a simple and environmentally friendly process.

Claims

1. A method for forming a conductive structure, comprising the following steps: supporting at least one substrate by a carrier module, wherein, The at least one substrate has at least one through hole; a conductive material to be solidified is provided into the at least one through hole using a feeding module; and a laser beam is provided into the at least one through hole by a laser module to solidify the conductive material to be solidified; wherein, in the step of providing the conductive material to be solidified into the at least one through hole, the feeding module provides the conductive material to be solidified into the at least one through hole continuously or intermittently to gradually fill the at least one through hole; and the laser module projects the laser beam into the conductive material to be solidified continuously or intermittently to gradually solidify the conductive material to be solidified filling the at least one through hole to form a conductive element.

2. The conductive structure forming method as described in claim 1, wherein, The conductive component is a single component with a multi-layer structure.

3. The conductive structure forming method as described in claim 2, wherein, The at least one substrate has an inner wall surface corresponding to one of the at least one perforation; wherein, during the gradual solidification of the conductive material to be solidified, the conductive material to be solidified contacts the inner wall surface and is tightly connected to the inner wall surface.

4. The conductive structure forming method as described in claim 3 further includes the following steps: using a monitoring module to monitor in real time the bonding between the conductive material to be solidified and the inner wall surface.

5. The conductive structure forming method as described in claim 1 further includes the following steps: monitoring the forming status of the conductive element in the at least one perforation using a monitoring module; wherein, The monitoring module captures an image of the at least one perforation to obtain a shaped image; wherein, when the monitoring module determines that the shaped image conforms to a preset finished product image, the monitoring module determines that the at least one perforation is a defect-free perforation; wherein, when the monitoring module determines that the shaped image does not conform to the preset finished product image, the monitoring module determines that the at least one perforation is a defective perforation.

6. A conductive structure forming apparatus, comprising: A carrier module configured to carry at least one substrate, wherein the at least one substrate has at least one through hole; a feeding module configured to supply a conductive material to be solidified into the at least one through hole; and a laser module configured to supply a laser beam into the at least one through hole to solidify the conductive material to be solidified.

7. The conductive structure forming apparatus as described in claim 6, wherein, The feeding module is configured to continuously or intermittently supply the conductive material to be solidified into the at least one perforation to gradually fill the at least one perforation; wherein the laser module is configured to continuously or intermittently project the laser beam onto the conductive material to be solidified so that the conductive material to be solidified filling the at least one perforation gradually solidifies to form a conductive element, the conductive element being a single component and having a multi-layer structure.

8. The conductive structure forming apparatus as described in claim 7, wherein, The at least one substrate has an inner wall surface corresponding to one of the at least one perforation; wherein, as the conductive material to be solidified gradually solidifies, the conductive material to be solidified contacts the inner wall surface and is tightly connected to the inner wall surface.

9. The conductive structure forming apparatus as described in claim 8, further comprising: A control module that connects the load-bearing module, the feeding module, and the laser module; And a monitoring module connected to the control module, the monitoring module being configured to monitor the connection between the conductive material to be solidified and the inner wall surface, the monitoring module using multiple laser detection beams with different delay times to detect the morphological parameters of the at least one substrate, so as to monitor the bonding state between the inner wall surface of the at least one substrate and the conductive material to be solidified in real time.

10. The conductive structure forming apparatus as described in claim 8, further comprising: A control module that connects the load-bearing module, the feeding module, and the laser module; The system also includes a monitoring module connected to the control module. The monitoring module is configured to capture an image of the at least one perforation to obtain a shaped image. When the monitoring module determines that the shaped image conforms to a preset finished product image, the monitoring module determines that the at least one perforation is a defect-free perforation. When the monitoring module determines that the shaped image does not conform to the preset finished product image, the monitoring module determines that the at least one perforation is a defective perforation.

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