Communication device and communication system having the same

Abstract

A communication device includes a substrate, a first transceiver module, a second transceiver module, and a first circulator, a second circulator, a first antenna module, a second antenna module, and a shielding frame disposed on the surface of the substrate. The first transceiver module and the second transceiver module are disposed on opposite sides of the substrate surface. The first circulator and the second circulator are electrically or communicatively connected to the first transceiver module and the second transceiver module respectively through the substrate. The first antenna module and the second antenna module are electrically or communicatively connected to the first circulator and the second circulator respectively through the substrate. The shielding frame defines a plurality of closed isolation regions, such that the first and second transceiver modules are distributed in these isolation regions, or the first transceiver module, the second transceiver module, the first circulator, and the second circulator are distributed in these isolation regions.

Description

Technical Field

[0001] This disclosure relates to a communication device and a communication system having the same, and more particularly to a communication device and a communication system having the same that can enhance the isolation of a multiple-input multiple-output (MIMO) antenna system. Prior Technology

[0002] With the increasing prevalence of wireless communication devices, professionals in related fields face challenges from various radio waves originating from multiple sources. These electromagnetic waves can radiate across the same spectrum, causing electromagnetic interference (EMI). Therefore, radio frequency transceiver components must be effectively isolated to limit electromagnetic interference to nearby areas and prevent performance degradation. Consequently, effectively enhancing the isolation of antenna systems is a key area of ​​focus for professionals in this field. Summary of the Invention

[0003] In view of prior art, this invention discloses a novel communication device that enhances the isolation of a multiple-input multiple-output antenna system and achieves low error vector magnitude (EVM) by designing a shielding frame that defines multiple closed isolation regions within it, and distributing a first transceiver module, a second transceiver module, a first circulator, and a second circulator in these isolation regions. This improves the quality of the communication signal.

[0004] In detail, according to a first aspect of this disclosure, a communication device is provided, comprising a substrate, a first transceiver module, a second transceiver module, a first circulator, a second circulator, a first antenna module, a second antenna module, and a shielding frame. The first transceiver module is disposed on one side of the surface of the substrate. The second transceiver module is disposed on the surface of the substrate, located on the other side opposite to the first transceiver module. The first circulator, the second circulator, the first antenna module, the second antenna module, and the shielding frame are disposed on the surface of the substrate. The first circulator is electrically or communicatively connected to the first transceiver module through the substrate to separate the transmission path and the reception path of the first transceiver module. The second circulator is electrically or communicatively connected to the second transceiver module through the substrate to separate the transmission path and the reception path of the second transceiver module. The first antenna module is electrically or communicatively connected to the first circulator through the substrate to receive or transmit signals. The second antenna module is electrically or communicatively connected to the second circulator through the substrate to receive or transmit signals. Multiple closed isolation zones are defined inside the shielding frame, so that the first transceiver module and the second transceiver module are distributed in these isolation zones, or the first transceiver module, the second transceiver module, the first circulator and the second circulator are distributed in these isolation zones.

[0005] Furthermore, according to a second aspect of this disclosure, a communication system is proposed, comprising two communication devices as described in the first aspect of this disclosure, a processing unit, and a frequency synthesizer. The substrates of the two communication devices are the same substrate. The substrate has corresponding first and second sides, with one of the two communication devices adjacent to the first side and the other adjacent to the second side. The processing unit and the frequency synthesizer are disposed on the substrate. The processing unit is located below the other of the two communication devices. The frequency synthesizer is located below the other of the two communication devices. The distance between the frequency synthesizer and the first side of the substrate is equal to the distance between the frequency synthesizer and the processing unit.

[0006] The above description is not intended to represent all embodiments or aspects of this disclosure. Rather, the foregoing description is merely an example illustrating some novel aspects and features of this disclosure. Preferred embodiments are provided to make the above embodiments and other objects, features, and advantages of this disclosure more apparent and understandable, and are described in detail with reference to the accompanying drawings. After a detailed description of various embodiments with reference to the accompanying drawings, those skilled in the art will more readily understand other aspects of this disclosure. A brief description of the drawings is provided below. Simple Explanation of the Diagram

[0007] Figure 1 illustrates the architecture configuration of the communication device according to the first embodiment of this disclosure from a top view. Figure 2 illustrates the architecture configuration of the communication device according to the second embodiment of this disclosure from a top view. Figure 3 illustrates the architecture configuration of the communication system of the third embodiment disclosed herein from a top-down perspective. Figure 4 illustrates the architecture configuration of the communication system of the fourth embodiment disclosed herein from a top-down perspective. Implementation

[0008] The embodiments of this disclosure will be described in detail below, with accompanying drawings as examples. In addition to these detailed descriptions, this disclosure can be widely implemented in other embodiments, and any easy substitutions, modifications, or equivalent changes to the described embodiments are included within the scope of this disclosure and are subject to the claims in the following applications. In the description of the specification, many specific details are provided to give the reader a more complete understanding of this disclosure; however, this disclosure may still be implemented even if some or all of these specific details are omitted. Furthermore, well-known common steps or elements are not described in detail to avoid creating unnecessary limitations to this disclosure. Identical or similar elements in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustrative purposes only and do not represent the actual size or quantity of elements unless specifically stated otherwise.

[0009] Please refer to Figure 1, which is a top-view diagram of the architecture configuration of the communication device 100 of the first embodiment of this disclosure.

[0010] The communication device 100 disclosed herein can be applied, for example, to small cells using 4G or 5G mobile communication technology. As shown in FIG1, the communication device 100 may include a substrate 110, a modulator 120, a demodulator 130, a circulator 140, an antenna module 150, a power amplifier (PA) 160, a receiver switch module 170, a clock buffer 180, and a shielding frame 190. The modulator 120, demodulator 130, circulator 140, antenna module 150, power amplifier 160, receiver switch module 170, clock buffer 180, and shielding frame 190 can all be disposed on the surface of the substrate 110. The substrate 110 is, for example, a printed circuit board (PCB).

[0011] Modulator 120 is used at the transmitting end to convert digital data into a transmittable radio frequency (RF) signal. Demodulator 130 is used at the receiving end to restore the original digital data of the signal. Circulator 140 is used to separate the transmit path (TX path) and receive path (RX path) to ensure that signal transmission and reception do not interfere with each other. Antenna module 150 includes an antenna mount (as shown in Figure 1) and an antenna (not shown) connected to the antenna mount, and is used to receive or transmit signals, thereby entering the receive path or transmit path. Power amplifier 160 is used to amplify the signal to a level that the antenna can transmit. Receiver switch module 170 can be a receiver front end (RXFE) and is used to switch whether to receive signals. Clock buffer 180 is electrically / communicationally connected to modulator 120 and demodulator 130 through board 110 to provide an operating frequency and ensure the synchronous operation of the overall transmit and receive paths and the consistency of signal timing.

[0012] In this embodiment, the number of modulators 120, demodulators 130, circulators 140, antenna modules 150, and power amplifiers 160 can be configured to be multiple (e.g., each of these components can be configured to have two). Specifically, two modulators 120 can be provided, for example: a first modulator 121 and a second modulator 122; two demodulators 130 can be provided, for example: a first demodulator 131 and a second demodulator 132; two circulators 140 can be provided, for example: a first circulator 141 and a second circulator 142; two antenna modules 150 can be provided, for example: a first antenna module 151 and a second antenna module 152; and two power amplifiers 160 can be provided, for example: a first power amplifier 161 and a second power amplifier 162. The first antenna module 151 and the second antenna module 152 are respectively equipped with a first circulator 141 and a second circulator 142, so that the first antenna module 151 and the second antenna module 152 can each have independent transmit and receive channels, so that the communication device 100 can be used as a 2T2R MIMO antenna system. The first antenna module 151 can be electrically or communicatively connected to the first circulator 141 through the substrate 110 to receive or transmit signals; while the second antenna module 152 can be electrically or communicatively connected to the second circulator 142 through the substrate 110 to receive or transmit signals. As shown in Figure 1, the architecture of the communication device 100 is two sets of left-right symmetrical transmit and receive paths. The central first circulator 141 and second circulator 142 provide the signal receive path and transmit path, and are respectively matched with the first antenna module 151 and the second antenna module 152.

[0013] The communication device 100 may further include a low-noise amplifier (LNA) 101. The LNA 101 is disposed on the substrate 110 and can be used for primary amplification of weak signals. The number of LNAs 101 can be configured to be two, for example: a first LNA 1011 and a second LNA 1012. The first LNA 1011, the first demodulator 131, and the receiver switch module 170 can constitute a first receiver unit RX1. The second LNA 1012, the second demodulator 132, and the receiver switch module 170 can constitute a second receiver unit RX2. That is, the first receiver unit RX1 and the second receiver unit RX2 can share the same receiver switch module 170. The communication device 100 may further include a digital step attenuator (DSA) 102. The digital step attenuator 102 is disposed on the substrate 110 and can be used to control the output power of the radio frequency signal through step attenuation. The number of digital step attenuators 102 can be configured to be two, for example: a first digital step attenuator 1021 and a second digital step attenuator 1022. Furthermore, the communication device 100 may further include an intermediate frequency amplifier (IF AMP) 103. The IF amplifier 103 is disposed on the substrate 110 and can be used to perform power compensation and linear amplification on the frequency-converted IF signal. The number of IF amplifiers 103 can be configured to be two, for example: a first IF amplifier 1031 and a second IF amplifier 1032. The first digital step attenuator 1021, the first IF amplifier 1031, the first modulator 121, and the first power amplifier 161 can constitute a first transmitting unit TX1 to provide a transmission path for the signal of the first antenna module 151. The second digital step attenuator 1022, the second intermediate frequency amplifier 1032, the second modulator 122, and the second power amplifier 162 can constitute the second transmitting unit TX2 to provide a transmission path for the signal of the second antenna module 152.

[0014] The first transmitting unit TX1 and the first receiving unit RX1 can constitute a first transceiver module TR1, or in other words, the first transceiver module TR1 includes the first transmitting unit TX1 and the first receiving unit RX1. The second transmitting unit TX2 and the second receiving unit RX2 can constitute a second transceiver module TR2, or in other words, the second transceiver module TR2 includes the second transmitting unit TX2 and the second receiving unit RX2. The first transceiver module TR1 is disposed on one side of the surface of the substrate 110, and the second transceiver module TR2 is disposed on the surface of the substrate 110 and located on the other side opposite to the first transceiver module TR1. The first circulator 141 can be electrically or communicatively connected to the first transceiver module TR1 through the substrate 110 to separate the transmission path and the reception path of the first transceiver module TR1. The second circulator 142 can be electrically or communicatively connected to the second transceiver module TR2 through the substrate 110 to separate the transmission path and the reception path of the second transceiver module TR2. A clock buffer 180 may be located between the first transceiver module TR1 and the second transceiver module TR2, and may be electrically or communicatively connected to the first transceiver module TR1 and the second transceiver module TR2 through the substrate 110 to provide the operating frequency to the first transceiver module TR1 and the second transceiver module TR2. The first transmitting unit TX1 and the first receiving unit RX1 of the first transceiver module TR1 are electrically or communicatively connected to the first circulator 141, respectively. The second transmitting unit TX2 and the second receiving unit RX2 of the second transceiver module TR2 are electrically or communicatively connected to the second circulator 142, respectively.

[0015] The shielding frame 190 can define multiple enclosed isolation regions SA within it, allowing the first transceiver module TR1 and the second transceiver module TR2 to be distributed within these isolation regions SA. Specifically, the modulator 120, demodulator 130, power amplifier 160, receiver switch module 170, clock buffer 180, low-noise amplifier 101, digital step attenuator 102, and intermediate frequency amplifier 103 can be distributed within these isolation regions SA. The first transmitting unit TX1 and the first receiving unit RX1 of the first transceiver module TR1 are distributed within these isolation regions SA to isolate the first transmitting unit TX1 and the first receiving unit RX1. The second transmitting unit TX2 and the second receiving unit RX2 of the second transceiver module TR2 are distributed within these isolation regions SA to isolate the second transmitting unit TX2 and the second receiving unit RX2. As shown in Figure 1, the first power amplifier 161 and the first modulator 121 are located in one of the same isolation regions SA, and the second power amplifier 162 and the second modulator 122 are located in another of the same isolation regions SA. Furthermore, the first digital step attenuator 1021 and the first intermediate frequency amplifier 1031 may be located in the same isolation region SA as the first power amplifier 161 and the first modulator 121, while the second digital step attenuator 1022 and the second intermediate frequency amplifier 1032 may be located in the same isolation region SA as the second power amplifier 162 and the second modulator 122. The receiver switch module 170 is located independently in a single isolation region SA. The clock buffer 180 is also located independently in a single isolation region SA. The first demodulator 131 and the first low-noise amplifier 1011 are located in one of the same isolation regions SA, and the second demodulator 132 and the second low-noise amplifier 1012 are located in another of the same isolation regions SA. In summary, the first modulator 121 and the second modulator 122, the first demodulator 131 and the second demodulator 132, the first power amplifier 161 and the second power amplifier 162, the receiver switch module 170 and the clock buffer 180 are distributed in six different isolation regions SA, while the circulator 140 and the antenna module 150 are located outside the shielding frame 190, that is, not in any isolation region SA defined inside the shielding frame 190.

[0016] In this embodiment, as shown in FIG1, the shielding frame 190 is a one-piece molded component, specifically made of metal. The shielding frame 190 can be used to suppress the entry of external electromagnetic interference and prevent internal signal leakage, thereby improving the electromagnetic compatibility and signal integrity of the system. In addition, the shielding frame 190 included in the communication device 100 disclosed herein is a single one-piece molded component, which has the technical advantages of low mold opening cost and simple assembly.

[0017] Please refer to Figure 2, which is a top-view architectural configuration diagram of the second embodiment of the communication device 200 disclosed herein.

[0018] The communication device 200 disclosed herein can be applied, for example, to small base stations using 4G or 5G communication technologies. As shown in FIG2, the communication device 200 may include a substrate 210, a modulator 220, a demodulator 230, a circulator 240, an antenna module 250, a power amplifier 260, a receiver switch module 270, a clock buffer 280, and a shielding frame 290. The modulator 220, demodulator 230, circulator 240, antenna module 250, power amplifier 260, receiver switch module 270, clock buffer 280, and shielding frame 290 may all be disposed on the surface of the substrate 210. The substrate 210 may be, for example, a printed circuit board.

[0019] Modulator 220 is used at the transmitting end to convert digital data into a transmittable radio frequency signal. Demodulator 230 is used at the receiving end to restore the original digital data of the signal. Circulator 240 is used to separate the transmitting and receiving paths to ensure that the transmission and reception of signals do not interfere with each other. Antenna module 250 includes an antenna mount (as shown in Figure 2) and an antenna (not shown) connected to the antenna mount, and is used to receive or transmit signals, thereby entering the receiving or transmitting path. Power amplifier 260 is used to amplify the signal to a level that the antenna can transmit. Receive switch module 270 can be a receiver preamplifier and is used to switch whether to receive signals. Clock buffer 280 is electrically / communicationally connected to modulator 220 and demodulator 230 through board 210 to provide an operating frequency and ensure the synchronous operation of the overall transmitting and receiving paths and the consistency of signal timing.

[0020] In this embodiment, the number of modulators 220, demodulators 230, circulators 240, antenna modules 250, and power amplifiers 260 can be configured to be multiple (e.g., each of these components can be configured to have two). Specifically, two modulators 220 can be provided, for example: a first modulator 221 and a second modulator 222; two demodulators 230 can be provided, for example: a first demodulator 231 and a second demodulator 232; two circulators 240 can be provided, for example: a first circulator 241 and a second circulator 242; two antenna modules 250 can be provided, for example: a first antenna module 251 and a second antenna module 252; and two power amplifiers 260 can be provided, for example: a first power amplifier 261 and a second power amplifier 262. The first antenna module 251 and the second antenna module 252 are respectively equipped with a first circulator 241 and a second circulator 242, so that the first antenna module 251 and the second antenna module 252 can each have independent transmit and receive channels, so that the communication device 200 can be used as a 2T2R MIMO antenna system. The first antenna module 251 can be electrically or communicatively connected to the first circulator 241 through the substrate 210 to receive or transmit signals; while the second antenna module 252 can be electrically or communicatively connected to the second circulator 242 through the substrate 110 to receive or transmit signals. As shown in Figure 2, the architecture of the communication device 200 is two sets of left-right symmetrical transmit and receive paths. The central first circulator 241 and second circulator 242 provide the signal receive path and transmit path, and are respectively matched with the first antenna module 251 and the second antenna module 252.

[0021] The communication device 200 may further include a low-noise amplifier 201. The low-noise amplifier 201 is disposed on the substrate 210 and can be used for primary amplification of weak signals. The number of low-noise amplifiers 201 can be configured to be two, for example: a first low-noise amplifier 2011 and a second low-noise amplifier 2012. The first low-noise amplifier 2011, the first demodulator 231, and the receiver switch module 270 can constitute a first receiver unit RX1. The second low-noise amplifier 2012, the second demodulator 232, and the receiver switch module 270 can constitute a second receiver unit RX2. That is, the first receiver unit RX1 and the second receiver unit RX2 can share the same receiver switch module 270. The communication device 200 may further include a digital step attenuator 202. The digital step attenuator 202 is disposed on the substrate 210 and can be used to control the output power of the radio frequency signal through a step attenuation method. The number of digital step attenuators 202 can be configured to be two, for example: a first digital step attenuator 2021 and a second digital step attenuator 2022. Furthermore, the communication device 200 may further include an intermediate frequency (IF) amplifier 203. The IF amplifier 203 is disposed on the substrate 210 and can be used to perform power compensation and linear amplification on the frequency-converted IF signal. The number of IF amplifiers 203 can be configured to be two, for example: a first IF amplifier 2031 and a second IF amplifier 2032. The first digital step attenuator 2021, the first IF amplifier 2031, the first modulator 221, and the first power amplifier 261 can constitute a first transmitting unit TX1 to provide a transmission path for the signal of the first antenna module 251. The second digital step attenuator 2022, the second IF amplifier 2032, the second modulator 222, and the second power amplifier 262 can constitute a second transmitting unit TX2 to provide a transmission path for the signal of the second antenna module 252.

[0022] The first transmitting unit TX1 and the first receiving unit RX1 can constitute a first transceiver module TR1, or in other words, the first transceiver module TR1 includes the first transmitting unit TX1 and the first receiving unit RX1. The second transmitting unit TX2 and the second receiving unit RX2 can constitute a second transceiver module TR2, or in other words, the second transceiver module TR2 includes the second transmitting unit TX2 and the second receiving unit RX2. The first transceiver module TR1 is disposed on one side of the surface of the substrate 210, and the second transceiver module TR2 is disposed on the surface of the substrate 210 and located on the other side opposite to the first transceiver module TR1. The first circulator 241 can be electrically or communicatively connected to the first transceiver module TR1 through the substrate 210 to separate the transmission path and the reception path of the first transceiver module TR1. The second circulator 242 can be electrically or communicatively connected to the second transceiver module TR2 through the substrate 110 to separate the transmission path and the reception path of the second transceiver module TR2. A clock buffer 280 may be located between the first transceiver module TR1 and the second transceiver module TR2, and may be electrically or communicatively connected to the first transceiver module TR1 and the second transceiver module TR2 through the substrate 210 to provide the operating frequency to the first transceiver module TR1 and the second transceiver module TR2. The first transmitting unit TX1 and the first receiving unit RX1 of the first transceiver module TR1 are electrically or communicatively connected to the first circulator 241, respectively. The second transmitting unit TX2 and the second receiving unit RX2 of the second transceiver module TR2 are electrically or communicatively connected to the second circulator 242, respectively.

[0023] The shielding frame 290 can define multiple enclosed isolation regions SA within it, so that the first transceiver module TR1, the second transceiver module TR2, and the first circulator 241 and the second circulator 242 of the circulator 240 are distributed in these isolation regions SA. Specifically, the modulator 220, demodulator 230, circulator 240, power amplifier 260, receiver switch module 270, clock buffer 280, low noise amplifier 201, digital step attenuator 202, and intermediate frequency amplifier 203 can be distributed in these isolation regions SA. The difference from the first embodiment is that, in this embodiment, the shielding frame 290 includes a plurality of separately arranged shielding members 291-296, each defining at least one isolation region SA. Shielding members 291 and 292 are symmetrically arranged, each defining two isolation regions SA within its interior; shielding members 293 and 294 are symmetrically arranged, each defining a single isolation region SA within its interior; shielding members 295 and 296 are disposed between shielding members 291 and 292, with shielding member 295 defining a single isolation region SA within its interior, and shielding member 296 defining three isolation regions SA within its interior. Specifically, the shielding members 291-296 of the shielding frame 290 may be made of metal.

[0024] As shown in Figure 2, the first power amplifier 261 and the first modulator 221 are located in two different isolation regions SA defined by the shield 291, while the second power amplifier 262 and the second modulator 222 are located in two different isolation regions SA defined by the shield 292. The difference from the first embodiment lies in this: the power amplifiers and modulators are isolated from each other through the shielding frame. The first circulator 241 and the second circulator 242 are located in shields 293 and 294 respectively, meaning the first circulator 241 and the second circulator 242 are located in two different locations within the separately arranged shields 291-296. The difference from the first embodiment lies in this: the circulators are isolated through the shielding frame. The first demodulator 231 and the second demodulator 232, along with the clock buffer 280, are located in three distinct isolation regions SA defined by the shield 296. The clock buffer 280 is located alone in one isolation region SA, the first demodulator 231 and the first low-noise amplifier 2011 are located in another isolation region SA, and the second demodulator 232 and the second low-noise amplifier 2012 are located in yet another isolation region SA. Furthermore, the first digital step attenuator 2021 and the first intermediate frequency amplifier 2031 may be located in the same isolation region SA as the first modulator 221, while the second digital step attenuator 2022 and the second intermediate frequency amplifier 2032 may be located in the same isolation region SA as the second modulator 222. The receive switch module 270 is located alone in a single isolation region SA of the shield 295. In summary, the first modulator 221 and the second modulator 222, the first demodulator 231 and the second demodulator 232, the first circulator 241 and the second circulator 242, the first power amplifier 261 and the second power amplifier 262, the receiver switch module 270 and the clock buffer 280 are distributed in different isolation areas SA defined by the shields 291 to 296, while the antenna module 250 is located outside the shielding frame 290, that is, not located in any isolation area SA defined inside the shielding frame 290.

[0025] The shielding frame 290 can be used to suppress the entry of external electromagnetic interference and prevent internal signal leakage, thereby improving the electromagnetic compatibility and signal integrity of the system. Furthermore, the shielding frame 290 included in the second embodiment of the communication device 200 disclosed herein comprises a plurality of independently formed shielding members 291-296. By separating the shielding members 291-296 from each other and further isolating and shielding the circulator 240, the communication device 200 can further reduce the error vector amplitude compared to the communication device 100 of the first embodiment, resulting in better communication signal quality. In addition, since the shielding frame 290 is divided into shielding members 291-296, the individual area is reduced, avoiding the problem of tilting caused by the large individual area of ​​the shielding frame 290 in the first embodiment, and improving the difficulty of gripping the shielding frame during component mounting on the substrate.

[0026] Please refer to Figure 3, which is a top-view diagram of the architecture configuration of the communication system 10 of the third embodiment of this disclosure.

[0027] As shown in Figure 3, the communication system 10 may include two communication devices 100 as described in the first embodiment, a processing unit 11, a connection port 12, a frequency synthesizer 13, a converter 14, and a voltage regulator 15. All these components are disposed on a substrate 110 and located outside the two shielding frames 190 of the two communication devices 100. The substrate 110 is the same substrate, meaning the two communication devices 100 can share the same substrate, and the components can be interconnected or electrically connected as needed through the substrate 110. Furthermore, the substrate 110 has two opposing first sides 110a and 110b, and two opposing third sides 110c and 110d. Specifically, one of the two communication devices 100 is adjacent to the first side 110a of the substrate 110; the other of the two communication devices 100 is adjacent to the second side 110b of the substrate 110; the connection port 12 and the frequency synthesizer 13 are disposed below the one of the two communication devices 100, and the connection port 12 is adjacent to the fourth side 110d of the substrate 110; the processing unit 11 and the converter 14 are disposed below the one of the two communication devices 100; and the voltage regulator 15 is disposed between the two communication devices 100.

[0028] In this embodiment, the processing unit 11 can be a central processing unit (CPU), which is electrically / communicationally connected to two communication devices 100 to control the two communication devices 100 to receive or transmit signals respectively. The connection port 12 is used to connect to an external power supply. The frequency synthesizer 13 is electrically / communicationally connected to two clock buffers 180 of the two communication devices 100 to uniformly provide the operating frequency to these two clock buffers 180, minimizing problems caused by small or delayed signals from a single clock source by utilizing limited space. The converter 14 can be a power converter, which is electrically connected to the connection port 12 to receive external power (such as DC power) from the connection port 12 and step down the external power to meet the operating voltage requirements of the various components of the communication system 10. The voltage regulator 15 can be a low-dropout regulator (LDO), which is electrically connected to the converter 14 to receive the operating voltage from the converter 14 for voltage regulation, thereby providing a stable DC voltage power supply.

[0029] In one embodiment, the distance D1 between the first side 110a of the substrate 110 and the frequency synthesizer 13 is equal to the distance D2 between the frequency synthesizer 13 and the processing unit 11. This ensures that the frequency synthesizer 13 and the processing unit 11 maintain a certain distance, preventing the heat generated by the processing unit 11 from affecting the operation of the frequency synthesizer 13. Furthermore, the frequency synthesizer 13 is not too far from the other of the two communication devices 100 (the communication device 100 adjacent to the second side 110b of the substrate 110), thus preventing the frequency synthesizer 13 from being unable to effectively transmit its operating frequency to the other of the two communication devices 100 (the communication device 100 adjacent to the second side 110b of the substrate 110). In another embodiment, the distance D3 between one of the two communication devices 100 (the communication device 100 adjacent to the first side 110a of the substrate 110) and the frequency synthesizer 13 is less than the distance D4 between the frequency synthesizer 13 and the connection port 12. This also prevents the heat generated by the connection port 12 from affecting the operation of the frequency synthesizer 13. In detail, distance D3 can be defined as the distance between the shielding frame 190 of the communication device 100 adjacent to the first side 110a of the substrate 110 and the frequency synthesizer 13.

[0030] Therefore, in this embodiment, through two communication devices 100, the communication system 10 can function as a 4T4R MIMO antenna system. When the communication system 10 of this 4T4R MIMO antenna system is operating, the processing unit 11 typically generates higher heat, while the connection port 12 typically generates lower heat. If the frequency synthesizer 13 is too close to the processing unit 11, it may cause noise in the system. Therefore, in this embodiment, the layout of the frequency synthesizer 13 is designed such that the distance D1 between the frequency synthesizer 13 and the first side 110a of the substrate 110 is equal to the distance D2 between the frequency synthesizer 13 and the processing unit 11, and / or the distance D3 between the frequency synthesizer 13 and its adjacent communication device 100 is less than the distance D4 between the frequency synthesizer 13 and the connection port 12, thus avoiding interference noise.

[0031] Please refer to Figure 4, which is a top-view diagram of the architecture configuration of the communication system 20 according to the fourth embodiment of this disclosure.

[0032] As shown in Figure 4, the communication system 20 may include two communication devices 200 as described in the second embodiment, a processing unit 21, a connection port 22, a frequency synthesizer 23, a converter 24, and a voltage regulator 25. All these components are disposed on a substrate 210 and are located outside the two shielding frames 290 of the two communication devices 200, i.e., outside the isolation area SA defined by the shielding members 291-296 of the shielding frames 290. Furthermore, the substrate 210 is a single substrate, meaning the two communication devices 200 can share the same substrate, and the components can be interconnected or electrically connected as needed through the substrate 210. Additionally, the substrate 210 has two opposing first sides 210a and 210b, and two opposing third sides 210c and 210d. Specifically, one of the two communication devices 200 is adjacent to the first side 210a of the substrate 210; the other of the two communication devices 200 is adjacent to the second side 210b of the substrate 210; the connection port 22 and the frequency synthesizer 23 are disposed below the one of the two communication devices 200, and the connection port 22 is adjacent to the fourth side 210d of the substrate 210; the processing unit 21 and the converter 24 are disposed below the one of the two communication devices 200; and the voltage regulator 25 is disposed between the two communication devices 200.

[0033] In this embodiment, the processing unit 21 can be a central processing unit, electrically / communicationally connected to two communication devices 200, for controlling the two communication devices 200 to receive or transmit signals respectively. The connection port 22 is used to connect to an external power supply. The frequency synthesizer 23 is electrically / communicationally connected to two clock buffers 280 of the two communication devices 200 to uniformly provide the operating frequency to these two clock buffers 280, minimizing problems caused by small or delayed signals from a single clock source by utilizing limited space. The converter 24 can be a power converter, electrically connected to the connection port 22, for receiving external power (such as DC power) from the connection port 22 and stepping down the external power to meet the operating voltage requirements of the various components of the communication system 20. The voltage regulator 25 can be a low-dropout regulator, electrically connected to the converter 24, for receiving the operating voltage from the converter 24 for voltage regulation, thereby providing a stable DC voltage power supply.

[0034] In one embodiment, the distance D1 between the first side 210a of the substrate 210 and the frequency synthesizer 23 is equal to the distance D2 between the frequency synthesizer 23 and the processing unit 21. This ensures that the frequency synthesizer 23 and the processing unit 21 maintain a certain distance, preventing the heat generated by the processing unit 21 from affecting the operation of the frequency synthesizer 23. Furthermore, the frequency synthesizer 23 is not too far from the other of the two communication devices 200 (the communication device 200 adjacent to the second side 210b of the substrate 210), thus preventing the frequency synthesizer 23 from being unable to effectively transmit its operating frequency to the other of the two communication devices 200 (the communication device 200 adjacent to the second side 210b of the substrate 210). In another embodiment, the distance D3 between one of the two communication devices 200 (the communication device 200 adjacent to the first side 210a of the substrate 210) and the frequency synthesizer 23 is less than the distance D4 between the frequency synthesizer 23 and the connection port 22. This also prevents the heat generated by the connection port 22 from affecting the operation of the frequency synthesizer 23. In detail, distance D3 can be defined as the distance between the shielding frame 290 of the communication device 200 adjacent to the first side 210a of the substrate 210 and the frequency synthesizer 23.

[0035] Therefore, in this embodiment, through two communication devices 200, the communication system 20 can function as a 4T4R MIMO antenna system. When the communication system 20 of this 4T4R MIMO antenna system is operating, the processing unit 21 typically generates higher heat, while the connection port 22 typically generates lower heat. If the frequency synthesizer 23 is too close to the processing unit 21, it may cause noise in the system. Therefore, in this embodiment, the placement of the frequency synthesizer 23 is designed such that the distance D1 between the frequency synthesizer 23 and the first side 210a of the substrate 210 is equal to the distance D2 between the frequency synthesizer 23 and the processing unit 21, and / or the distance D3 between the frequency synthesizer 23 and its adjacent communication device 200 is less than the distance D4 between the frequency synthesizer 23 and the connection port 22, thus avoiding interference noise. Furthermore, since the communication system 20 of this embodiment is equipped with a communication device 200, through the design of its shielding frame 290 with separated shielding members 291-296, it can better ensure the isolation of noise interference and has a lower error vector amplitude compared to the communication system 10 of the third embodiment.

[0036] Based on the above description, this disclosure proposes a novel communication device and a communication system having the same. By designing a shielding frame that can define multiple closed isolation areas within it, and distributing the first transceiver module, the second transceiver module, the first circulator, and the second circulator in these isolation areas, the isolation of the multiple-input multiple-output antenna system is enhanced, and a low error vector amplitude is achieved, thereby improving the quality of the communication signal.

[0037] In summary, although this disclosure has been presented above with examples, it is not intended to limit the scope of this disclosure. Those skilled in the art to which this disclosure pertains can make various modifications and refinements without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims.

[0038] 10,20: Communication System 11,21: Processing Unit 12,22: Connection Port 13,23: Frequency Synthesizer 14,24: Converters 15, 25: Voltage regulator 100, 200: Communication devices 101,201: Low-noise amplifiers 1011, 2011: First Low Noise Amplifier 1012,2012: Second Low Noise Amplifier 102, 202: Digital step attenuator 1021,2021: First Digital Step Attenuator 1022,2022: Second digital step attenuator 103, 203: Intermediate Frequency Amplifier 1031, 2031: First intermediate frequency amplifier 1032, 2032: Second intermediate frequency amplifier 110,210:Substrate 110a, 210a: First side 110b, 210b: Second side 110c, 210c: Third side 110d, 210d: Fourth side 120, 220: Modulator 121,221: First modulator 122,222: Second modulator 130, 230: Demodulator 131,231: First demodulator 132,232: Second demodulator 140,240: Circulator 141,241: First Circulator 142,242: Second Circulator 150, 250: Antenna modules 151,251: First antenna module 152,252: Second day's antenna module 160, 260: Power Amplifier 161,261: First power amplifier 162,262: Second power amplifier 170, 270: Receiver switch module 180, 280: Clock buffer 190, 290: Shielding frame 291, 292, 293, 294, 295, 296: Shielding components D1, D2, D3, D4: Distance RX1: First Receiving Unit RX2: Second Receiving Unit SA: Isolation Area TX1: First Launch Unit TX2: Second Launch Unit TR1: First transceiver module TR2: Second transceiver module

Claims

1. A communication device, comprising: One substrate; A first transceiver module is disposed on one side of the surface of the substrate; A second transceiver module is disposed on the surface of the substrate and located on the opposite side of the first transceiver module; a first circulator is disposed on the surface of the substrate and electrically or communicatively connected to the first transceiver module through the substrate to separate the transmission path and reception path of the first transceiver module; a second circulator is disposed on the surface of the substrate and electrically or communicatively connected to the second transceiver module through the substrate to separate the transmission path and reception path of the second transceiver module; a first antenna module is disposed on the surface of the substrate and electrically or communicatively connected to the first circulator through the substrate to receive or transmit signals; a second antenna module is disposed on the surface of the substrate and electrically or communicatively connected to the second circulator through the substrate to receive or transmit signals. And a shielding frame is disposed on the surface of the substrate, and a plurality of closed isolation areas are defined therein, so that the first transceiver module and the second transceiver module are distributed in the isolation areas, or the first transceiver module, the second transceiver module, the first circulator and the second circulator are distributed in the isolation areas.

2. The communication device as described in claim 1, further comprising: A clock buffer is disposed on the surface of the substrate and one of the plurality of isolation areas of the shielding frame, and is located between the first transceiver module and the second transceiver module. It is electrically or communicatively connected to the first transceiver module and the second transceiver module through the substrate to provide an operating frequency to the first transceiver module and the second transceiver module.

3. The communication device as claimed in claim 1, wherein the first transceiver module includes a first transmitting unit and a first receiving unit, and the first transmitting unit and the first receiving unit are electrically connected or communicatively connected to the first circulator, and the first transmitting unit and the first receiving unit are distributed in the plurality of isolation regions to isolate the first transmitting unit and the first receiving unit.

4. The communication device as claimed in claim 1, wherein the second transceiver module includes a second transmitting unit and a second receiving unit, and the second transmitting unit and the second receiving unit are electrically or communicatively connected to the second circulator, and the second transmitting unit and the second receiving unit are distributed in the plurality of isolation regions to isolate the second transmitting unit and the second receiving unit.

5. The communication device as described in claim 1, wherein the shielding frame is an integrally formed shielding component.

6. The communication device as claimed in claim 1, wherein the shielding frame comprises a plurality of separately arranged shielding members, and each shielding member defines at least one of the isolation areas.

7. The communication device as claimed in claim 6, wherein the first circulator and the second circulator are located in different locations within the plurality of shields.

8. The communication device as claimed in claim 1, wherein the first transceiver module includes a first receiving unit, the second transceiver module includes a second receiving unit, the first receiving unit and the second receiving unit include a common receiving switch module, the receiving switch module is disposed on the surface of the substrate and electrically or communicatively connected to the first circulator and the second circulator through the substrate.

9. A communication system, comprising: The two communication devices as described in any one of claims 1 to 8, wherein the substrates of the two communication devices are the same substrate, and the substrate has a first side and a second side corresponding to each other, and one of the two communication devices is adjacent to the first side and the other of the two communication devices is adjacent to the second side; a processing unit is disposed on the substrate and located below the other of the two communication devices; and a frequency synthesizer is disposed on the substrate and located below the other of the two communication devices, wherein the distance between the frequency synthesizer and the first side of the substrate is equal to the distance between the frequency synthesizer and the processing unit.

10. The communication system as described in claim 9, further comprising: A connection port is disposed on the substrate and located below the frequency synthesizer, wherein the distance between the frequency synthesizer and one of the two communication devices is less than the distance between the frequency synthesizer and the connection port.

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