Quantum dot patch and method for fabricating the same
Patent Information
- Application Number
- TW114123709
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-06-24
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2045-06-23
Smart Images

Figure TWG2TB001908903_001 
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Figure TWG2TB001908903_003
Abstract
Claims
1. A quantum dot patch, comprising: An anodized aluminum substrate includes a plurality of mounting holes, a first surface and a second surface, wherein the first surface and the second surface are opposite to each other, and the mounting holes include a first opening located on the first surface; and a quantum dot adhesive disposed in the mounting holes of the anodized aluminum substrate, wherein the quantum dot adhesive includes a plurality of quantum dots, a polymer and a plurality of nanoparticles.
2. The quantum dot patch as claimed in claim 1, wherein the setting hole is a blind hole and includes a bottom, and the area of the first opening is larger than the bottom.
3. The quantum dot patch as claimed in claim 1, wherein the setting hole is a through hole and includes a second opening on the second surface, and the area of the first opening is larger than the area of the second opening.
4. The quantum dot patch as claimed in claim 1, wherein the nanoparticle is a nano-inorganic oxide particle or a nano-metal particle.
5. The quantum dot patch as claimed in claim 1, comprising a first waterproof layer and a second waterproof layer, the first waterproof layer being disposed on the first surface of the anodized aluminum substrate, and the second waterproof layer being disposed on the second surface of the anodized aluminum substrate.
6. The quantum dot patch as claimed in claim 1, comprising at least one light-emitting diode and a carrier unit, the carrier unit comprising a receiving groove and a connecting sidewall, the connecting sidewall being disposed around the receiving groove, wherein the light-emitting diode is located within the receiving groove of the carrier unit, and the connecting sidewall is used to connect to the anodized aluminum substrate, such that a light generated by the light-emitting diode is projected onto the quantum dot adhesive on the anodized aluminum substrate.
7. A method for fabricating a quantum dot patch, comprising: An aluminum substrate is pretreated; the aluminum substrate is anodized to become an anodized aluminum substrate, wherein a plurality of mounting holes are formed on a first surface of the anodized aluminum substrate; a quantum dot adhesive is coated on the first surface of the anodized aluminum substrate, wherein the quantum dot adhesive includes a plurality of quantum dots, a polymer and a plurality of nanoparticles; the anodized aluminum substrate is placed in a vacuum environment and subjected to rotational centrifugation to allow the quantum dot adhesive to enter the mounting holes; and the quantum dot adhesive is baked or dried to harden the quantum dot adhesive in the mounting holes.
8. A method for fabricating a quantum dot patch as described in claim 7, wherein the preprocessing includes: Use an alkaline solution or an organic solvent to remove contaminants from the surface of the aluminum substrate; The aluminum substrate was then immersed in an acidic solution.
9. A method for manufacturing a quantum dot patch as described in claim 7, comprising: The anodized aluminum substrate is removed from the vacuum environment, wherein the disposed hole of the anodized aluminum substrate contains the hardened quantum dot adhesive; the quantum dot adhesive is applied to the first surface of the anodized aluminum substrate; and the anodized aluminum substrate is placed in the vacuum environment and subjected to a rotational centrifugation process, so that the quantum dot adhesive enters the disposed hole and comes into contact with the hardened quantum dot adhesive in the disposed hole.
10. A method for manufacturing a quantum dot patch as claimed in claim 7, wherein during the anodizing process of the aluminum substrate, the voltage of the anodizing process is gradually reduced to form the setting hole with a wider outer surface and a narrower inner surface on the first surface of the anodized aluminum substrate.
Citation Information
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