Wafer frame detection device and measurement method thereof

Abstract

This invention provides a wafer frame inspection device, including an image capturing module, a detection module, a calculation module, and a judgment module. The image capturing module captures an image. The detection module sets a rectangular frame for detection. The calculation module calculates the thickness of the wafer frame within the rectangular frame and the distance between adjacent wafer frames within the rectangular frame. The judgment module receives the thickness and compares the difference between the thickness and a preset thickness with an error value; it also receives the distance and compares the difference between the distance and a preset distance with another error value, obtaining a judgment result and displaying it on a display device. Through the above, combined with the measurement method provided by this invention, it detects whether the wafer frame is deformed, avoiding problems such as wafer placement or extraction failures, and avoiding abnormal wafer carrier capping.

Claims

1. A wafer frame inspection device connected to a multilayer storage and handling carrier (MCLP), the wafer frame inspection device comprising: an image capturing module for capturing an image within a wafer carrier, the image having a plurality of rows of wafer frames arranged in a first direction; a detection module electrically connected to the image capturing module, the detection module performing detection on at least three rectangular frames symmetrically arranged in a second direction based on the center point of the image, wherein the center points of two adjacent rectangular frames are separated by a distance; and a calculation module electrically connected to the detection module, the calculation module including a first calculation unit and a second calculation unit, the first calculation unit calculating a thickness of each wafer frame within the rectangular frame, and the second calculation unit calculating a distance between two adjacent wafer frames within the rectangular frame. A judgment module is electrically connected to the detection module and the calculation module. The judgment module has a preset thickness, a preset distance, and an error value. The error value includes a stacking error value, a tilt error value, and a warping error value. The judgment module receives the thickness and compares the difference between the thickness and the preset thickness with the error value, and receives the distance and compares the difference between the distance and the preset distance with the error value, to obtain a judgment result and display it on a display device.

2. The wafer frame inspection apparatus as described in claim 1, wherein, If the difference between the thickness of the wafer frame with the same number of rows and the preset thickness in three consecutive rectangular frames is greater than the stacking error value, the judgment result is that the wafer frame is a stack.

3. The wafer frame inspection apparatus as described in claim 1, wherein, If, within three consecutive rectangular frames, the difference between the distance between the wafer frames in the same row and the preset distance is less than the tilt error value and the difference decreases, and the difference between the distance between the wafer frames in adjacent rows and the preset distance is greater than the tilt error value and the difference increases, the determination result is that the wafer frame is tilted.

4. The wafer frame inspection apparatus as described in claim 1, wherein, If, within three consecutive rectangular frames, the difference between the distance between the wafer frames in the same row and the preset distance is greater than the tilt error value and the difference increases, and the difference between the distance between the wafer frames in adjacent rows and the preset distance is less than the tilt error value and the difference decreases, the determination result is that the wafer frame is tilted.

5. The wafer frame inspection apparatus as described in claim 1, wherein, If, within three consecutive rectangular frames, the difference between the distance of the wafer frames in the same row and the preset distance is less than the warping error value and the difference is symmetrical, and the difference between the distance of the wafer frames in adjacent rows and the preset distance is greater than the warping error value and the difference is symmetrical, the determination result is that the wafer frame is warped.

6. The wafer frame inspection apparatus as claimed in claim 1, wherein, If, within three consecutive rectangular frames, the difference between the distance of the wafer frames in the same row and the preset distance is greater than the warping error value and the difference is symmetrical, and the difference between the distance of the wafer frames in adjacent rows and the preset distance is less than the warping error value and the difference is symmetrical, the determination result is that the wafer frame is warped.

7. The wafer frame inspection apparatus as claimed in claim 1, wherein, The first direction is perpendicular to the second direction.

8. The wafer frame inspection apparatus as claimed in claim 1, wherein, The wafer frame inspection device also includes a setting module, which is electrically connected to the image capturing module, the detection module, the calculation module and the judgment module. The setting module sets a focal length, a spacing, a preset thickness, a preset distance and an error value for the image capturing module.

9. The wafer frame inspection apparatus as described in claim 8, wherein, The wafer frame inspection device further includes a supplementary lighting module, which is electrically connected to the image capturing module. The supplementary lighting module includes a plurality of directional light sources, which cause light to converge on the wafer frame.

10. The wafer frame sensing device as claimed in claim 1, wherein, The display device is electrically connected to the image capturing module, the detection module, the calculation module, and the judgment module. The display device also displays the image, the rectangle, the thickness, and the distance.

11. A wafer frame measurement method, comprising the following steps: a. providing a wafer frame inspection device, comprising an image capturing module, an inspection module, a calculation module, and a judgment module, wherein the image capturing module is electrically connected to the inspection module, the calculation module is electrically connected to the inspection module, and the judgment module is electrically connected to both the inspection module and the calculation module; the inspection module has a preset thickness, a preset distance, and an error value, the error value including a stacking error value, a tilting error value, and a warpage error value; b. the image capturing module captures an image of the interior of a wafer carrier, the image having a plurality of rows of wafer frames; c. the inspection module performs inspection by setting three rectangular frames from the center of the image, wherein the center points of two adjacent rectangular frames are spaced apart by a distance; d. The computing module provides a first computing unit and a second computing unit. The first computing unit calculates the thickness of each wafer frame within the rectangular frame, and the second computing unit calculates the distance between two adjacent wafer frames within the rectangular frame; e. The judgment module receives the thickness and the distance; f. It determines whether the difference between the thickness of the wafer frames in the same row within the three rectangular frames and the preset thickness is greater than the stacking error value; if yes, the judgment module obtains a judgment result, which indicates that the wafer frames are a stack, and displays it on a display device; if no, it executes step g; g. The system determines whether the difference between the distance of the wafer frames in the same row within the three rectangular frames and the preset distance is less than the tilt error value and the difference is decreasing, and whether the difference between the distance of adjacent wafer frames in the same row and the preset distance is greater than the tilt error value and the other difference is increasing; if yes, the determination module obtains a determination result indicating that the wafer frame is tilted, and this result is displayed on the display device; if no, proceed to step h; h. Determine whether the difference between the distance of the wafer frames in the same row within the three rectangular frames and the preset distance is greater than the tilt error value and the difference is increasing, and whether the difference between the distance of adjacent wafer frames in the same row and the preset distance is less than the tilt error value and the other difference is decreasing; if yes, the determination module obtains a determination result indicating that the wafer frame is tilted, and this result is displayed on the display device; if no, proceed to step i; i. The system determines whether the difference between the distance between the wafer frames in the same row within the three rectangular frames and the preset distance is greater than the warpage error value and the difference is symmetrical, and whether the difference between the distance between the wafer frames in adjacent rows and the preset distance is less than the warpage error value and the other difference is symmetrical; if yes, the determination module obtains a determination result indicating that the wafer frame is warped, and this result is displayed on the display device; if no, step j is executed.The system determines whether the difference between the distance between the wafer frames in the same row within the three rectangular frames and the preset distance is less than the warpage error value and the difference is symmetrical; and whether the difference between the distance between the wafer frames in adjacent rows and the preset distance is greater than the warpage error value and the other difference is symmetrical. If yes, the determination module obtains a determination result indicating that the wafer frame is warped, and this result is displayed on the display device. If no, step k is executed; k. Step b is re-executed.

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