Composition for encapsulation

Abstract

This invention provides an encapsulation composition comprising: 12-22 parts by weight of a first component, wherein the first component comprises resin A having at least four reactive functional groups and resin B having at most four reactive functional groups, wherein the weight ratio of resin A to resin B is 3.5:1 to 0.5:1; 78-88 parts by weight of a second component, wherein the second component is an unmodified inorganic powder or a modified inorganic powder, and the total weight of the first component and the second component is 100 parts by weight; and a third component, which is an initiator, and the weight ratio of the third component to the first component is 1:100 to 5:100. The encapsulation composition described above can reduce the dielectric loss of the encapsulation material.

Claims

1. An encapsulation composition comprising: 12-22 parts by weight of a first component, wherein the first component comprises a resin A having at least four reactive functional groups and a resin B having at most four reactive functional groups, wherein the weight ratio of resin A to resin B is 3.5:1 to 0.5:1; 78-88 parts by weight of a second component, wherein the second component is an unmodified inorganic powder or a modified inorganic powder, and the total weight of the first component and the second component is 100 parts by weight; and a third component, which is an initiator, and the weight ratio of the third component to the first component is 1:100 to 5:100; wherein, The resin A comprises a bisphenol A polyfunctional derivative resin having the structure of the following formula (I): Formula (I); wherein R3 and R4 are selected from the group consisting of 4-vinylphenyl, propenyl and alkyl groups, and at least one of R3 and R4 is a 4-vinylphenyl group; R1 and R2 are selected from the group consisting of propenyl and hydrogen atoms, and at least one of R1 and R2 is a propenyl group; wherein the resin B is selected from the group consisting of divinylbenzene, 4-p-tert-butylstyrene, 4-tert-butoxystyrene, triallyl isocyanurate and triallyl cyanurate; wherein the initiator is selected from the group consisting of tert-butyl peroxide-3,5,5-trimethylhexanoate, tert-amyl peroxide (2-ethylhexyl)carbonate, 1,1-di-tert-butyl peroxide cyclohexane, 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane and 2,2-bis(tert-butyl peroxide)butane; It also includes dispersants and inorganic powders selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide and zirconium oxide, with an average particle size of 1 to 30 µm.

2. The packaging composition as described in claim 1, wherein, The bisphenol A polyfunctional derivative resin comprises a bisphenol A six-arm derivative resin having the structure of the following formula (II): Formula (II).

3. The packaging composition as described in claim 1, wherein, The resin A comprises a bisphenol A four-arm derivative resin having the structure of the following formula (III): Formula (III); wherein R3 and R4 are selected from the group consisting of 4-vinylphenyl, propenyl and alkyl groups, and at least one of R3 and R4 is 4-vinylphenyl.

4. The packaging composition as described in claim 3, wherein, The bisphenol A four-arm derivative resin has the structure of the following formula (IV): Formula (IV).

5. The packaging composition as described in claim 1, wherein, Resin A contains methacrylate-terminated liquid polybutadiene.