Wafer packaging leveling fixture structure

Abstract

A wafer packaging leveling fixture structure includes a baking clamp base with a clamping top surface on its top surface, and a guide post on each side of the baking clamp base. A baking clamp upper seat includes an upper seat base plate and a pressure plate, with a clamping bottom surface on the bottom surface of the pressure plate. The upper seat base plate and the pressure plate are connected by several screws through which compression springs pass. A through hole is provided on each side of the upper seat base plate, and a reverse locking device is provided in each through hole group. The through holes on the two reverse locking devices are respectively slidably disposed at the two guide posts. In this way, after wafer packaging and leveling operations are performed on the clamping top surface and clamping bottom surface, the baking clamp upper seat is pressed down to the required pressure in conjunction with the oven clamp pressure fixture. At the same time as it is released, the reverse locking device acts simultaneously to lock to the guide post, so as to achieve the effects of rapid pressure setting and instant reverse locking.

Claims

1. A wafer packaging leveling fixture structure, comprising: A baking clamp base, the top surface of which has a clamping top surface, and a guide post erected on each side of the baking clamp base; a baking clamp upper seat, the upper seat upper seat including an upper seat base plate and a pressure plate, the pressure plate being disposed below the upper seat base plate, the bottom surface of the pressure plate having a clamping bottom surface, the upper seat base plate and the pressure plate being connected by a number of screws, a compression spring being fitted at each screw between the upper seat base plate and the pressure plate to maintain the downward pressure of the pressure plate, and a through hole on each side of the upper seat base plate; and two reverse locking devices, each through hole group having one reverse locking device, the reverse locking device including an unlocking ring with a number of arc-shaped concave holes around its circumference to accommodate a number of ball bearings, the unlocking ring being fitted with an outer ring around its outer circumference, the... The outer ring has a tapered section inside that contacts all the balls. A limiting plate is installed inside one side of the outer ring to limit one end of a spring. The other end of the spring pushes against one end of the unlocking ring, which has a through hole. Two reverse locking devices each have a through hole and are slidably mounted on the two guide posts to form an oven baking fixture. After wafer packaging and leveling operations are performed on the top and bottom surfaces of the clamp, an oven clamp pressure fixture is used to press the upper seat of the baking clamp down to the required pressure. At the same time as it is released, the reverse locking device works simultaneously to lock it to the guide post, which can quickly pressurize and lock instantly.

2. The wafer packaging leveling fixture structure as described in claim 1, wherein a handle is pivotally provided on the top surface of the upper substrate of the baking clamp upper seat.

3. The wafer packaging leveling fixture structure as described in claim 2, wherein the guide post is erected on the baking clamp base by providing a stepped hole in the baking clamp base, a threaded hole on the bottom surface of the guide post, inserting the guide post into the stepped hole, and then locking the threaded hole of the guide post by passing through the stepped hole with a threaded component.

4. The wafer packaging leveling fixture structure as described in claim 3, wherein a pressure scale may be provided on the front and rear sides or the front and rear sides of the upper substrate.

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