Modified polyphenylene ether resin foam sheet
Patent Information
- Application Number
- TW115115840
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-03-15
- Filing Date
- 2024-02-23
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2044-02-22
Abstract
Claims
1. A modified polyphenylene ether resin foamed sheet, characterized in that: it is made by foaming a modified polyphenylene ether resin containing both a halogen-based flame retardant and a phosphorus-based flame retardant with a weight average molecular weight of 1,000 to 1,000,000 as flame retardants, and the average bubble diameter of the bubbles in the modified polyphenylene ether resin foamed sheet is 1 to 30 μm, and the bubble number density is 1.8×10⁴ to 9×10⁸ bubbles / mm³.
2. The modified polyphenylene ether resin foamed sheet as claimed in claim 1, wherein the average bubble diameter of the bubbles in the modified polyphenylene ether resin foamed sheet is 1 to 22 μm and the bubble number density is 2.0×104 to 8×108 bubbles / mm3.
3. The modified polyphenylene ether resin foamed sheet as claimed in claim 1, wherein the average thickness of the modified polyphenylene ether resin foamed sheet is 0.05 mm to 2.0 mm.
4. The modified polyphenylene ether resin foamed sheet as requested in item 1, wherein the modified polyphenylene ether resin foamed sheet is used, and the flame retardancy is evaluated according to the UL-94 vertical method (20 mm vertical burning test) of the US UL standard, and the test results meet the V-0 or V-1 standard.
5. The modified polyphenylene ether resin foamed sheet as claimed in claim 1, wherein the modified polyphenylene ether resin foamed sheet is used for housings of electrical and electronic components, electrical insulation materials, sealing materials, protective materials, high-frequency substrates, or substrates for electromagnetic wave control components.
6. A housing, electrical insulation material, sealing material, protective material, high-frequency substrate, or electromagnetic wave control component substrate for electrical and electronic parts, which is obtained by using a modified polyphenylene ether resin foam sheet as claimed in any one of claims 1 to 5.
Citation Information
Patent Citations
Polyolefin resin foamed particle and polyolefin resin foamed formed body thereof
CN114075354A
Flame retardant, and flame-retardant resin composition containing same
TW201629192A
Polyamide resin composition for foam molding and foam molded body
TW202108696A