Lead frame and assembly structure

Abstract

This invention discloses a lead frame including a die holder, a first lead, a second lead, an extension portion, and at least one support portion. The first lead includes a first main portion and a first I / O portion opposite to the first main portion. The second lead includes a second main portion and a second I / O portion opposite to the second main portion. The first lead and the second lead surround the die holder. The extension portion extends from the first main portion of the first lead. The support portion is connected to the extension portion.

Description

[Technical Field]

[0001] The present invention relates to a lead frame and an assembly structure, and to a lead frame including a plurality of leads surrounding a die holder and an assembly structure including the lead frame. [Previous Technology]

[0002] For semiconductor packages such as quad flat non-leaded packages (QFN), the length of each of the leads surrounding the die mount is limited and cannot be further lengthened because the structural strength of the leads weakens after manufacturing. Therefore, leads may deform, bend, or break during the molding process, and connections attached to the leads may break or come into contact with each other, causing a short circuit. However, when attaching smaller semiconductor dies to the die mount, it may be necessary to lengthen the leads to ensure that the leads remain close to the smaller semiconductor die and to prevent connections from exceeding their optimal length. [Summary of the Invention]

[0003] In some embodiments, a lead frame includes a die holder, a first lead, a second lead, an extension, and at least one support portion. The first lead includes a first main portion and a first I / O portion opposite to the first main portion. The second lead includes a second main portion and a second I / O portion opposite to the second main portion. The first lead and the second lead surround the die holder. The extension extends from the first main portion of the first lead. The support portion is connected to the extension.

[0004] In some embodiments, a lead frame includes a die holder, a plurality of leads, an extension, and at least one support portion. The leads surround the die holder. The leads include a first lead and a third lead. The first lead includes a first main portion and a first I / O portion opposite to the first main portion. The third lead includes a third main portion and a third I / O portion opposite to the third main portion. The extension portion connects the first main portion of the first lead and the third main portion of the third lead. The support portion protrudes from the extension portion.

[0005] In some embodiments, an assembly structure includes a substrate and a package structure. The substrate has a top surface and a bottom surface opposite to the top surface. The package structure is disposed adjacent to the top surface of the substrate. The package structure includes a die holder, a semiconductor die, a first lead, a second lead, an extension, at least one support portion, a plurality of wirings, and a package body. The semiconductor die is disposed on the die holder. The first lead includes a first main portion and a first I / O portion opposite to the first main portion. The second lead includes a second main portion and a second I / O portion opposite to the second main portion. The first lead and the second lead surround the die holder. The extension extends from the first main portion of the first lead. The support portion is connected to the extension. The wirings are used to electrically connect the semiconductor die to the first lead and the second lead. The package covers the semiconductor die, the die holder, the first lead, the second lead, the extension portion, the at least one support portion, and the wiring. The bottom surfaces of the first I / O portion and the second I / O portion are bonded to the substrate via a bonding material.

Implementation Method

[0006] Common reference numerals are used throughout the drawings and embodiments to indicate the same or similar components. Embodiments of the invention will be readily understood from the following description of the accompanying drawings.

[0007] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and configurations are described below to illustrate certain aspects of the invention. Of course, these examples are merely illustrative and not intended to be limiting. For example, in the following embodiments, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features such that the first and second features do not need to be in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the invention. This repetition is for simplicity and clarity and does not in itself define the relationship between the various embodiments and / or configurations discussed.

[0008] FIG1 illustrates a bottom view of a lead frame 9 according to some embodiments of the present invention. FIG2 illustrates a partial enlarged view of FIG1. ​​FIG3 illustrates a perspective view of FIG2. FIG4 illustrates an enlarged view of region "B" in FIG3. FIG5 illustrates a top perspective view of FIG3. FIG6 illustrates a top view of FIG5. Referring to FIG1, the lead frame 9 may include a plurality of lead frame units 1 arranged in an array. In some embodiments, the lead frame 9 may be a silver-plated lead frame or a pre-plated lead frame (PPF). Referring to FIGS. 2 to 6, the lead frame unit 1 includes a die paddle 10, a plurality of leads 20 (or pins), at least four corner leads 20', at least one extension 24, and at least one support portion 25. In some embodiments, the lead frame unit 1 may also be referred to as a "lead frame". The die holder 10 has a top surface 11, a bottom surface 12 opposite to the top surface 11 (FIG. 7), and a side surface extending between the top surface 11 and the bottom surface 12. In some embodiments, the side surface may include an upper side surface 13 corresponding to the upper portion of the die holder 10 and a lower side surface 14 corresponding to the lower portion of the die holder 10.

[0009] Figure 7 illustrates a cross-sectional view along line 7-7 of Figure 6. Figure 8 illustrates a partially enlarged view of region "C" in Figure 7. Referring to Figures 2 through 8, leads 20 surround die holder 10. Each of the leads 20 may include a main portion 21 and an input / output (I / O) portion 22 opposite to the main portion 21. In some embodiments, the I / O portion 22 may be exposed from the surface of the package for external electrical connection. For example, leads 20 may include a first lead 20a, a second lead 20b, and a third lead 20c. The first lead 20a may include a first main portion 21a and a first I / O portion 22a opposite to the first main portion 21a. The first main portion 21a may have a top surface 211a and a bottom surface 212a opposite to the top surface 211a. The first I / O portion 22a may have a top surface 221a and a bottom surface 222a opposite to the top surface 221a. In some embodiments, the first main portion 21a and the first I / O portion 22a can be integrally formed as a monolithic structure. The top surface 211a of the first main portion 21a and the top surface 221a of the first I / O portion 22a can be on the same surface and at the same height. As shown in FIG8, the thickness t2 of the first I / O portion 22a can be greater than the thickness t1 of the first main portion 21a. Therefore, the bottom surface 212a of the first main portion 21a can be recessed from the bottom surface 222a of the first I / O portion 22a.

[0010] In some embodiments, the support portion 25 is connected to the extension portion 24. For example, the first lead 20a, the extension portion 24, and the support portion 25 may be integrally formed as a single structure. The extension portion 24 may extend downward from the support portion 25. Therefore, the top surface 211a of the first main portion 21a may be substantially coplanar with the top surface 241 of the extension portion 24 and the top surface 11 of the die holder 10. The bottom surface 222a of the first I / O portion 22a may be substantially coplanar with the bottom surface 252 of the support portion 25 and the bottom surface 12 of the die holder 10. In addition, the thickness t2 of the first I / O portion 22a may be substantially equal to the sum of the thickness t6 of the extension portion 24 and the thickness t7 of the support portion 25, which is thickness t5. The thickness t1 of the first main portion 21a may be substantially equal to the thickness t6 of the extension portion 24.

[0011] Figure 9 illustrates a cross-sectional view along line 9-9 of Figure 6. Figure 10 illustrates a partially enlarged view of region "D" in Figure 9. Referring to Figures 2 to 6 and Figures 9 to 10, the second lead 20b may include a second main portion 21b and a second I / O portion 22b opposite to the second main portion 21b. The second main portion 21b may have a top surface 211b and a bottom surface 212b opposite to the top surface 211b. The second I / O portion 22b may have a top surface 221b and a bottom surface 222b opposite to the top surface 221b. In some embodiments, the second main portion 21b and the second I / O portion 22b may be integrally formed as a single structure. The top surface 211b of the second main portion 21b and the top surface 221b of the second I / O portion 22b may be on the same surface and at the same height. As shown in Figure 10, the thickness t9 of the second I / O portion 22b may be greater than the thickness t8 of the second main portion 21b. Therefore, the bottom surface 212b of the second main portion 21b may be recessed from the bottom surface 222b of the second I / O portion 22b. As shown in Figures 2 to 4, the second main portion 21b of the second lead 20b may include a bonding portion 23b (e.g., a bonding end) opposite to the second I / O portion 22b. The bonding portion 23b (e.g., the bonding end) may be used for bonding wire connection or connection. The bonding portion 23b (e.g., the bonding end) may have a terminal side surface 233b opposite to the second I / O portion 22b and extending between the top surface 211b and the bottom surface 212b of the second main portion 21b. The terminal side surface 233b of the second lead 20b faces the extension portion 24.

[0012] In some embodiments, as shown in Figures 9 and 10, the top surface 211b of the second main portion 21b may be substantially coplanar with the top surface 241 of the extension portion 24 and the top surface 11 of the die holder 10. The bottom surface 222b of the second I / O portion 22b may be substantially coplanar with the bottom surface 12 of the die holder 10. In addition, the thickness t8 of the second main portion 21b may be substantially equal to the thickness t6 of the extension portion 24.

[0013] As shown in FIG2, the extension direction 26 of the bonding portion 23b (e.g., the bonding end) of the second lead 20b can extend across the extension portion 24. Furthermore, the first main portion 21a of the first lead 20a is adjacent to and spaced apart from the die holder 10, and the bonding portion 23b of the second main portion 21b of the second lead 20b is adjacent to and spaced apart from the die holder 10. The extension portion 24 extends from the first main portion 21a of the first lead 20a, and a portion of the extension portion 24 can be disposed between the die holder 10 and the bonding portion 23b of the second main portion 21b of the second lead 20b.

[0014] As shown in FIG. 2, the extension 24 may be substantially parallel to the side surface (e.g., the upper side surface 13) of the die holder 10. Furthermore, the length L of the extension 24 may be greater than or equal to 5 mm. Additionally, at least one support portion 25 may include a plurality of support portions 25, and the gap S1 between two adjacent support portions 25 may be greater than or equal to 0.2 mm and less than or equal to 10 mm. The gap S2 between the upper side surface 13 of the die holder 10 and the support portion 25 may be greater than or equal to 0.2 mm and less than or equal to 10 mm. The gap S4 between the side surface of the die holder 10 (e.g., the lower side surface 14 of the lower portion of the die holder 10) and the support portion 25 may be greater than or equal to 0.2 mm and less than or equal to 10 mm. The gap S3 between the support portion 25 and the I / O portion 22 may be greater than or equal to 0.2 mm and less than or equal to 10 mm. As shown in Figure 3, the support portion 25 can be in the shape of a pillar or a bump, and the cross-section of the support portion 25 can be circular, square, elliptical, or any polygonal shape.

[0015] As shown in Figures 2 and 3, lead 20 may further include a third lead 20c. The third lead 20c may include a third main portion 21c and a third I / O portion 22c opposite to the third main portion 21c. A second lead 20b is disposed between the first lead 20a and the third lead 20c. An extension 24 is connected to the third main portion 21c of the third lead 20c. That is, the extension 24 may connect the first main portion 21a of the first lead 20a and the third main portion 21c of the third lead 20c. The extension 24 may serve as a bridge between the first lead 20a and the third lead 20c.

[0016] In some embodiments, the first lead 20a, the third lead 20c, the extension portion 24, and the support portion 25 are integrally formed into a single structure. The potential of the first lead 20a may be equal to the potential of the third lead 20c. Furthermore, the second lead 20b may be separate from the extension portion 24. Therefore, the potential of the second lead 20b may differ from the potentials of the first lead 20a and the third lead 20c. Additionally, the length of the first main portion 21a of the first lead 20a or the length of the third main portion 21c of the third lead 20c may be greater than the length of the second main portion 21b of the second lead 20b. As shown in FIG2, a plurality of second leads 20b may be present between the first lead 20a and the third lead 20c.

[0017] As shown in Figures 2 and 3, the lead frame unit 1 may further include at least one extension portion 24d and at least one support portion 25d. The lead 20 may further include a first lead 20d and a second lead 20e. The first lead 20d may include a first main portion 21d and a first I / O portion 22d opposite to the first main portion 21d. In some embodiments, the first main portion 21d and the first I / O portion 22d may be integrally formed as a single structure. Furthermore, the second lead 20e may include a second main portion 21e and a second I / O portion 22e opposite to the second main portion 21e. In some embodiments, the second main portion 21e and the second I / O portion 22e may be integrally formed as a single structure. The second main portion 21e of the second lead 20e may include a joining portion 23e (e.g., a joining end) opposite to the second I / O portion 22e. The joining portion 23e (e.g., a joining end) may be used for wiring connection or joining. The engagement portion 23e (e.g., the engagement end) may have an end-side surface 233e opposite to the second I / O portion 22e. The end-side surface 233e of the second lead 20e faces the extension portion 24d.

[0018] In some embodiments, the support portion 25d is connected to the extension portion 24d. For example, the first lead 20d, the extension portion 24d, and the support portion 25d may be integrally formed as a single structure. The extension portion 24d may extend downward from the support portion 25d. The extension direction 26e of the joining portion 23e (e.g., the joining end) of the second lead 20e may extend across the extension portion 24d. In addition, the first main portion 21d of the first lead 20d is adjacent to and spaced apart from the die holder 10, and the joining portion 23e of the second main portion 21e of the second lead 20e is adjacent to and spaced apart from the die holder 10. The extension portion 24d extends from the first main portion 21d of the first lead 20d, and a portion of the extension portion 24d may be disposed between the die holder 10 and the joining portion 23e of the second main portion 21e of the second lead 20e. As shown in Figure 2, the extension 24d can be substantially parallel to the upper side surface 13 of the grain foot 10.

[0019] FIG11 shows an enlarged view of region "A" in FIG2. As shown in FIG2, FIG3 and FIG11, the lead frame unit 1 may further include at least one extension portion 24f and at least one support portion 25f. The lead 20 may further include a first lead 20f and a second lead 20g. The first lead 20f may include a first main portion 21f and a first I / O portion 22f opposite to the first main portion 21f. In some embodiments, the first main portion 21f and the first I / O portion 22f may be integrally formed as a single structure. In addition, the second lead 20g may include a second main portion 21g and a second I / O portion 22g opposite to the second main portion 21g. In some embodiments, the second main portion 21g and the second I / O portion 22g may be integrally formed as a single structure. The second main portion 21g of the second lead 20g may include a joining portion 23g (e.g., a joining end) opposite to the second I / O portion 22g. The engagement portion 23g (e.g., engagement end) can be used for wiring connection or engagement. The engagement portion 23g (e.g., engagement end) may have a terminal side surface 233g opposite to the second I / O portion 22g. The terminal side surface 233g of the second lead 20g faces the extension portion 24f.

[0020] In some embodiments, the support portion 25f is connected to the extension portion 24f. For example, the first lead 20f, the extension portion 24f, and the support portion 25f may be integrally formed as a single structure. The extension portion 24f may extend downward from the support portion 25f. The extension direction 26g of the joining portion 23g (e.g., the joining end) of the second lead 20g may extend across the extension portion 24f. In addition, the first main portion 21f of the first lead 20f is adjacent to and spaced apart from the die holder 10, and the joining portion 23g of the second main portion 21g of the second lead 20g is adjacent to and spaced apart from the die holder 10. The extension portion 24f extends from the first main portion 21f of the first lead 20f, and a portion of the extension portion 24f may be disposed between the die holder 10 and the joining portion 23g of the second main portion 21g of the second lead 20g. As shown in Figure 11, there is an angle θ between the extension 24f and the imaginary plane 27. The imaginary plane 27 may be substantially parallel to the upper side surface 13 of the grain base 10. The angle θ may be within the range of ±60 degrees.

[0021] As shown in Figures 2 and 3, at least four corner leads 20' correspond to the four corners of the die holder 10. In some embodiments, the corner leads 20' can be connected to the four corners of the die holder 10 to support the die holder 10. The corner leads 20' can replace the four tie bars used in the prior art lead frame to increase the number of leads 20 in the lead frame unit 1 of the lead frame 9. In some embodiments, the corner leads 20' and the die holder 10 can be integrally formed into a single structure.

[0022] In the embodiments illustrated in Figures 1 to 11, the support portions 25, 25d, and 25f can support the extension portions 24, 24d, and 24f during the wire bonding process and molding process to prevent deformation, bending, or breakage of the extension portions 24, 24d, and 24f. Therefore, when the first lead (e.g., first leads 20a, 20d, and 20f), the extension portions (e.g., extension portions 24, 24d, and 24f), and the third lead 20c may deform during the molding process, the bonding wires bonded to the extension portions 24, 24d, and 24f may not break or come into contact with each other to cause a short circuit. Therefore, the length L of the extension portions 24, 24d, and 24f can be extended to greater than about 5 mm, about 8 mm, or about 10 mm. Furthermore, in the package structure 3 (Figures 12 and 13), the support portions 25, 25d, and 25f are exposed from the package body 70 for heat dissipation. That is, each of the support portions 25, 25d, and 25f can be part of a heat dissipation path. Additionally, the exposed support portions 25, 25d, and 25f can serve as location markers. In some embodiments, the number, arrangement, or shape of the support portions 25, 25d, and 25f on the four sides of the lead frame unit 1 can differ from each other; therefore, the orientation of the package structure 3 (Figures 12 and 13) can be identified or recognized from the exposed support portions 25, 25d, and 25f. Furthermore, each of the support portions 25, 25d, and 25f can be an electrostatic discharge (ESD) path.

[0023] FIG12 illustrates a bottom perspective view of a package structure 3 according to some embodiments of the present invention. FIG13 illustrates a cross-sectional view of the package structure 3 of FIG12. The package structure 3 includes a lead frame unit 1, a semiconductor die 50, a plurality of terminals 60 (or wires), and a package body 70. The lead frame unit 1 of FIG12 and FIG13 may be the same as the lead frame unit 1 of FIG2 to FIG11. The semiconductor die 50 is disposed on a die holder 10. For example, the back side of the semiconductor die 50 may be attached to the top surface 11 of the die holder 10. In addition, the terminals 60 are used to electrically connect the semiconductor die 50 to the leads 20 (e.g., the first lead 20a, the second lead 20b, and the third lead 20c). For example, the terminals 60 may include a first wire bonded to an extension portion 24, and a second wire bonded to a bonding portion 23b of a second main portion 21b of the second lead 20b. In some embodiments, at least two of the wiring 60 are connected to the extension portion 24.

[0024] The package 70 (e.g., molding compound) covers the semiconductor die 50, die holder 10, leads 20 (e.g., first lead 20a, second lead 20b, and third lead 20c), extensions 24, 24d, 24f, at least one support portion 25, 25d, 25f, and wiring 60. In some embodiments, the bottom surface 72 of the package 70 may be substantially coplanar with the bottom surface of the I / O portion 22 of the leads 20, the bottom surfaces of the support portions 25, 25d, 25f, and the bottom surface 12 of the die holder 10. For example, the bottom surface 222a of the first I / O portion 22a, the bottom surface 222b of the second I / O portion 22b, the bottom surface of the third I / O portion 22c, the bottom surface 252 of the support portion 25, and the bottom surface 12 of the die holder 10 may be substantially coplanar with the bottom surface 72 of the package 70 and may be exposed from the bottom surface 72 of the package 70.

[0025] In some embodiments, a bonding layer may be formed or disposed on the exposed bottom surface of the I / O portion 22 of the lead 20, the exposed bottom surfaces of the support portions 25, 25d, 25f, and the exposed bottom surface 12 of the die holder 10. The bonding layer may include at least one metal layer, and the material of the at least one metal layer may be nickel (Ni), palladium (Pd), gold (Au), silver (Ag), and / or solder.

[0026] In some embodiments, the support portions 25, 25d, and 25f are embedded in the package 70 to improve the connection between the lead frame 9 (or lead frame unit 1) and the package 70. That is, the support portions 25, 25d, and 25f may have a locking function.

[0027] FIG14 illustrates a cross-sectional view of an assembly structure 90 according to some embodiments of the present invention. The assembly structure 90 may include a substrate 8 and a package structure 3. The substrate 8 has a top surface 81 and a bottom surface 82 opposite to the top surface 81. The substrate 8 may include a main dielectric structure 80, a topmost circuit layer 83 and a topmost protective layer 84. The topmost circuit layer 83 may be disposed on the main dielectric structure 80 and may include at least one trace and at least one pad. The topmost protective layer 84 may be disposed on the topmost circuit layer 83 to cover the topmost circuit layer 83 and may define a plurality of openings 841 to expose portions of the topmost circuit layer 83.

[0028] The package structure 3 in FIG14 can be the same as the package structure 3 in FIG12 and FIG13. The package structure 3 can be adjacent to and bonded to the top surface 81 of the substrate 8. As shown in FIG14, the bottom surface of the I / O portion 22 of the lead 20 can be electrically connected to the top circuit layer 83 of the substrate 8 via bonding material 92. For example, the bottom surface 222a of the first I / O portion 22a, the bottom surface 222b of the second I / O portion 22b, and the bottom surface of the third I / O portion 22c are bonded to the top circuit layer 83 of the substrate 8 via bonding material 92. In addition, a portion of the bonding material 92 can be disposed in the opening 841. Therefore, the position of the opening 841 can correspond to the I / O portion 22 of the lead 20 (e.g., the first I / O portion 22a, the second I / O portion 22b, and the third I / O portion 22c). In some embodiments, there may be no bonding material between the bottom surfaces of the support portions 25, 25d, 25f and the top surface 81 of the substrate 8. Therefore, the space 94 between the bottom surfaces of the support portions 25, 25d, 25f and the top surface 81 of the substrate 8 may be empty. Additionally, the topmost protective layer 84 of the substrate 8 may not define an opening below the support portions 25, 25d, 25f. Therefore, the portion of the topmost protective layer 84 of the substrate 8 below the support portions 25, 25d, 25f has no opening. Each of the support portions 25, 25d, 25f may not be part of an electrical transmission path.

[0029] Unless otherwise specified, spatial descriptions such as "above," "below," "upward," "left," "right," "downward," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper," "above," "below," etc., are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein can be spatially configured in any orientation or manner, provided that the advantages of the embodiments of the invention are not deviated from by such configurations.

[0030] As used herein, the terms “approximately,” “substantially,” “substantially,” and “about” are used to describe and indicate small variations. When used in conjunction with an event or situation, the terms may refer to instances where the event or situation has actually occurred, and instances where the event or situation is very close to occurring. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the first value is within ±10% of the second value, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%, then the first value can be considered to be "substantially" the same as or equal to the second value.

[0031] If the displacement between two surfaces is no greater than 5 µm, no greater than 2 µm, no greater than 1 µm, or no greater than 0.5 µm, then the two surfaces may be considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is no greater than 5 µm, no greater than 2 µm, no greater than 1 µm, or no greater than 0.5 µm, then the surface may be considered substantially flat.

[0032] As used herein, unless the context clearly requires otherwise, the singular terms “a” and “the” may include a plural indicator.

[0033] As used herein, the terms "conductive / electrically conductive" and "electrical conductivity" refer to the ability to conduct electric current. Conductive materials generally indicate materials that exhibit minimal or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, conductive materials are those with a conductivity greater than about 10⁴ S / m, such as at least 10⁵ S / m or at least 10⁶ S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0034] In addition, quantities, ratios and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and simplicity, and should be flexibly interpreted to include not only the values ​​that are explicitly specified as the limits of the range, but also all individual values ​​or subranges covered by that range, just as if each value and subrange were explicitly specified.

[0035] Although the invention has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting. Those skilled in the art will understand that various changes and alternatives may be made without departing from the true spirit and scope of the invention as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the invention and actual equipment. Other embodiments of the invention may exist that are not specifically described. The description and drawings should be considered illustrative rather than limiting. Modifications may be made to adapt particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention. [Simplified Explanation of the Diagram]

[0037] Some embodiments of the present invention will be readily understood from the following description when read in conjunction with the accompanying drawings. It should be noted that various structures may not be drawn to scale, and the dimensions of various structures may be arbitrarily increased or decreased for clarity of explanation.

[0038] Figure 1 shows a bottom view of a lead frame according to some embodiments of the present invention.

[0039] Figure 2 shows a partial enlarged view of Figure 1.

[0040] Figure 3 shows a three-dimensional view of Figure 2.

[0041] Figure 4 shows an enlarged view of region "B" in Figure 3.

[0042] Figure 5 shows a top-view perspective of Figure 3.

[0043] Figure 6 shows the top view of Figure 5.

[0044] Figure 7 shows a cross-sectional view along line 7-7 of Figure 6.

[0045] Figure 8 shows a partial enlarged view of region "C" in Figure 7.

[0046] Figure 9 shows a cross-sectional view along line 9-9 of Figure 6.

[0047] Figure 10 shows a partial enlarged view of region "D" in Figure 9.

[0048] Figure 11 shows an enlarged view of region "A" in Figure 2.

[0049] FIG12 illustrates a bottom perspective view of an encapsulation structure according to some embodiments of the present invention.

[0050] Figure 13 shows a cross-sectional view of the packaging structure of Figure 12.

[0051] FIG14 illustrates a cross-sectional view of an assembly structure according to some embodiments of the present invention.

Claims

1. A lead frame comprising: a die holder; a first lead including a first main portion and a first input / output (I / O) portion opposite the first main portion; a second lead including a second main portion and a second I / O portion opposite the second main portion, wherein the first lead and the second lead surround the die holder; an extension extending from the first main portion of the first lead, wherein the extension has an angle with an imaginary plane substantially parallel to an upper side surface of the die holder, the angle being within ±60 degrees; and at least one support portion connected to the extension.

2. The lead frame of claim 1, wherein the second lead has an end-side surface opposite to the second I / O portion, and the end-side surface of the second lead faces the extension portion.

3. The lead frame of claim 2, wherein the end side surface of the second lead is parallel to the imaginary plane and not parallel to the side surface of the extension.

4. The lead frame of claim 1, wherein the second main portion of the second lead includes a joining portion opposite to the second I / O portion, and one of the joining portions extends in an extension direction across the extension portion.

5. The lead frame of claim 1, wherein the first major portion is adjacent to and spaced apart from the die holder, the second major portion is adjacent to and spaced apart from the die holder, and a portion of the extension is disposed between the die holder and the second major portion of the second lead.

6. The lead frame of claim 1, wherein the at least one support portion is located at the junction of the extension portion and the first main portion of the first lead.

7. The lead frame as claimed in claim 6, wherein one end of the extension is a free end.

8. A lead frame comprising: a die holder; a plurality of leads surrounding the die holder, wherein the leads include: A first lead; a third lead; a first corner lead connected to a first corner of the die holder; and a second corner lead connected to a second corner of the die holder, wherein the first corner lead, a side of the die holder, and the second corner lead together define a receiving space; an extension connecting the first lead and the third lead to form a U-shaped structure, wherein the U-shaped structure is located in the receiving space; and at least one support portion protruding from the extension portion.

9. The lead frame of claim 8, wherein the first lead includes a first main portion and a first I / O portion opposite to the first main portion, the third lead includes a third main portion and a third I / O portion opposite to the third main portion, the first main portion being parallel to the first corner lead, and the third main portion being parallel to the second corner lead.

10. The lead frame of claim 8, wherein the leads further include a second lead disposed between the first lead and the third lead and separate from the extension.

11. The lead frame of claim 10, wherein the length of the first lead is greater than the length of the second lead.

12. The lead frame of claim 8, wherein the length of the extension is less than the length of the side of the die holder.

13. The lead frame of claim 8, wherein the at least one support portion includes a first support portion and a second support portion, the first support portion being located at the connection between the extension portion and the first lead, and the second support portion being located at the connection between the extension portion and the third lead.

14. The lead frame of claim 8, wherein the leads further include a fourth lead, and the lead frame further includes a second extension connected to the fourth lead, wherein the central axis of the second extension is substantially the same as the central axis of the extension.

15. The lead frame of claim 14, wherein both opposite ends of the second extension are free ends.

16. The lead frame of claim 14, wherein the leads further include a fifth lead located between the second extension and the extension.

17. The lead frame of claim 16, wherein one end side surface of the fifth lead is coplanar with one axial side surface of the second extension and one axial side surface of the extension.

18. The lead frame of claim 14, wherein the length of the second extension is less than the length of the extension.

19. The lead frame of claim 14, wherein the leads further include a sixth lead, the lead frame further including a third extension extending from the main portion of the sixth lead, wherein the third extension has an angle with an imaginary plane substantially parallel to one of the upper side surfaces of the die holder, the angle being within ±60 degrees.

20. The lead frame of claim 19, wherein the at least one support portion includes a third support portion located at the junction of the third extension portion and the sixth lead.

Images