Heat-transferring valve flexure and methods

Abstract

In some instances, a valve flexure for a flow control valve is provided. An exemplary valve flexure includes a first diaphragm; a second diaphragm directly or indirectly connected to the first diaphragm around a peripheral portion of the valve flexure, the connected first and second diaphragms surrounding the internal volume of the valve flexure; and a heat transfer medium disposed within the internal volume of the valve flexure.

Description

[Technical Field]

[0001] This disclosure relates to substrate processing systems, and more particularly to valve flexures for vapor control valves used in substrate processing systems. [Priority Claim]

[0002] This application claims priority to U.S. Patent Application No. 63 / 078,705, filed on September 15, 2020, which is incorporated herein by reference in its entirety. [Previous Technology]

[0003] A substrate processing system can be used to deposit films on substrates such as semiconductor wafers. Exemplary processes that can be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), plasma-enhanced CVD (PECVD), and plasma-enhanced ALD (PEALD). The substrate can be disposed on a substrate support, such as a base or an electrostatic chuck (ESC), within the processing chamber of the substrate processing system. During processing, a gas mixture is introduced into the processing chamber, and plasma can be used to enhance the chemical reactions within the processing chamber.

[0004] Ultra-high purity (UHP) valves exist in the semiconductor industry to transport gases and vapors with near-pristine performance and low metal contamination. These valves typically include some form of mechanical flexure or diaphragm that moves to open or close the valve. The flexure typically flexes against a metal or polymer sealing surface surrounding the orifice. While the use of such valves for controlling gas flow is generally understood, their use in vapor flow control applications is clearly more complex.

[0005] For example, in such applications, condensation is a primary consideration. Conventional attempts to address this consideration have included providing a vapor flow control valve with a large amount of heat and its associated supply and discharge lines to prevent vapor condensation on cold surfaces and the formation of undesirable particles. The high molecular weight of typical vapor flowing through a UHP valve can make effective heating of the valve diaphragm more challenging. As vapor flows through and exits the restrictive orifice of the valve seal-flexure gap, it undergoes significant adiabatic expansion, resulting in intense cooling of the surfaces of surrounding components. While the relatively high thermal mass of the surrounding components experiences a negligible temperature drop due to this cooling phenomenon, the extremely thin valve diaphragm, with its much lower thermal mass, may experience significant cooling, potentially leading to performance degradation.

[0006] In modern semiconductor manufacturing, vapor flow is constantly increasing to achieve faster deposition rates. For example, the emerging atomic layer deposition (ALD) process leads to faster valve opening times, which exacerbates the cooling phenomenon of flexural components. Heat transfer from the valve body through the diaphragm has a fixed time constant, and as manufacturing processes become faster, it becomes, if not impossible, difficult to supply sufficient heat to the insulating diaphragm to prevent its failure.

[0007] The background description provided herein is intended to provide a general overview of the context of this disclosure. For the purposes of this Prior Art section, the work of the inventors currently listed, and descriptions not otherwise identified as prior art at the time of the application, are not explicitly or implicitly included as prior art relative to this disclosure. [Summary of the Invention]

[0008] In some instances, a valve flexure for a flow control valve is provided. An exemplary valve flexure includes a first diaphragm; a second diaphragm directly or indirectly connected to the first diaphragm around a peripheral portion of the valve flexure, the connected first and second diaphragms surrounding the internal volume of the valve flexure; and a heat transfer medium disposed within the internal volume of the valve flexure.

[0009] In some instances, the configuration of the first and second diaphragms and the heat transfer medium is selected to provide a specific dynamic response to the valve flexure or valve.

[0010] In some instances, the configuration of the first and second diaphragms and the heat transfer medium is selected to provide specific heat transfer characteristics for the valve flexure.

[0011] In some instances, the valve opening or closing movement of the first diaphragm causes the valve opening or closing movement of the second diaphragm simultaneously or accordingly.

[0012] In some instances, the heat transfer medium is incompressible.

[0013] In some instances, the valve flexure does not have sidewalls.

[0014] In some instances, the first diaphragm is connected to the second diaphragm via a sidewall. In some instances, the sidewall is defined as a cylindrical sidewall extending around the circumference of the valve flexure. In some instances, the sidewall includes a bellows.

[0015] In some instances, the valve flexure includes an asymmetry relating to the first and second diaphragms. In some instances, the degree of asymmetry is selected to provide a specific dynamic response of the flexure.

[0016] In some instances, the first or second diaphragm comprises one or more of the following materials: SPRN 510, SPRN 100, and ELGILOY.

[0017] In some instances, the heat transfer medium has a dynamic viscosity of 1e-4 to 2e-2 Pa-s. In some instances, the heat transfer medium has a thermal conductivity of 0.1 to 0.7 W / m°K. In some instances, the heat transfer medium comprises an alcohol.

[0018] In some instances, the heat transfer medium includes a two-phase medium. In some instances, the two-phase medium transfers or circulates between compressible and incompressible forms based on valve flow control characteristics, valve states, or operating conditions.

[0019] In some instances, the flow control valve includes a valve flexure that includes any one or more of the valve flexure elements outlined above.

[0020] In some instances, the flow control valve includes an inlet that allows gas or vapor to enter the valve; an outlet that discharges gas or vapor from the valve; a valve flexure for opening or closing the valve, the valve flexure being movable to seat on and disengage from a valve seal located between the inlet and outlet of the valve; a periphery of the valve flexure connected to one or more valve components, the connection defining or separating the atmospheric side of the flow control valve; and a gap-filling fluid located above the valve flexure, the gap-filling fluid occupying at least some of the gap spaces adjacent to one or more valve components or between one or more valve components on the atmospheric side of the valve.

[0021] In some instances, the flow control valve further includes a gap-filling fluid column or reservoir. In some instances, the gap-filling fluid system fills to a depth ranging from 1 to 30 mm above the valve flexure or within the valve. In some instances, the gap-filling fluid has a dynamic viscosity of 1e-4 to 2e-2 Pa-s. In some instances, the gap-filling fluid has a thermal conductivity of 0.1 to 0.7 W / m°K. In some instances, the gap-filling fluid comprises an alcohol. In some instances, the gap-filling fluid comprises a two-phase medium.

[0022] In some examples, the substrate processing system includes a processing chamber; a gas or vapor distribution device; and a flow control valve connected to the gas or vapor distribution device, the flow control valve including a valve flexure, the valve flexure including any one or more of the valve flexure elements outlined above. In some examples, the flow control valve further includes any one or more of the flow control valve elements outlined above.

[0023] In some instances, the substrate processing system includes a processing chamber; a gas or vapor distribution device; and a flow control valve connected to the gas or vapor distribution device, the flow control valve including any one or more of the flow control valve elements outlined above.

[0024] Further applicability of this disclosure will become apparent from the embodiments, the claims, and the drawings. The embodiments and specific examples are for illustrative purposes only and are not intended to limit the scope of this disclosure.

Implementation Method

[0032] The following description includes systems, methods, techniques, instruction sequences, and computer program products that embody illustrative embodiments of the subject matter of the present invention. In the following description, numerous specific details are summarized for illustrative purposes to provide a thorough understanding of the exemplary embodiments. However, it will be apparent to those skilled in the art that the embodiments herein may be practiced without these specific details.

[0033] Referring now to FIG1, an exemplary substrate processing system 100 for performing deposition is shown. Examples of this disclosure can be used in processing system 100. Although a PECVD substrate processing system is shown, a PEALD substrate processing system or other substrate processing systems can be used. The substrate processing system 100 includes a processing chamber 102 that surrounds other components of a substrate processing chamber 102 and contains plasma. The substrate processing chamber 102 includes a gas distribution device 104 and a substrate support 106, such as an electrostatic chuck (ESC). During operation, a substrate 108 is disposed on the substrate support 106.

[0034] In some embodiments, the gas distribution device 104 may include a powered spray head 109 that distributes process gas over the substrate 108 and induces ion bombardment. The spray head 109 may include a rod portion having one end connected to the top surface of the processing chamber 102. The base is generally cylindrical and extends radially outward from the opposite end of the rod portion at a location spaced apart from the top surface of the processing chamber 102. The base of the spray head 109 facing the substrate surface or panel includes a plurality of dispersed holes through which the process gas flows. The gas distribution device 104 may be made of a metallic material and may function as an upper electrode. Alternatively, the gas distribution device 104 may be made of a non-metallic material and may include an embedded electrode. In other embodiments, the upper electrode may include a conductive plate and may introduce the process gas in another manner. The substrate support 106 includes a conductive base plate 110 that functions as a lower electrode. The base plate 110 supports a heating plate 112, which may correspond to a ceramic multi-zone heating plate. A thermal resistance layer 114 may be disposed between the heating plate 112 and the base plate 110. The base plate 110 may include one or more coolant channels 116 for allowing coolant to flow through the base plate 110.

[0035] The RF generation system 120 generates an RF voltage and outputs the RF voltage to one of an upper electrode (e.g., a gas distribution device 104) and a lower electrode (e.g., a substrate 110 of a substrate support 106). The other of the upper and lower electrodes may be DC grounded, AC grounded, or floating. In some embodiments, the RF generation system 120 may supply dual-frequency power and includes an HF generator 121 and an LF generator 122 that generate high-frequency (HF) and low-frequency (LF) power (at predetermined frequencies and power levels, respectively), which are fed to the upper or lower electrode (or spray head 109) by a matching and distribution network 124.

[0036] The gas delivery system 130 includes one or more gas sources 132-1, 132-2, ..., 132-N (collectively referred to as gas sources 132), where N is an integer greater than zero. Gas sources 132 supply one or more process gas mixtures, dopants, carrier gases, annealing gases, and / or purge gases. Annealing gases may include H2 and / or O2, or mixtures thereof. In some instances, the gas delivery system 130 delivers TEOS gas, gases including oxygen species and argon (Ar) during deposition, and mixtures of dopants including triethyl phosphate (TEPO) and / or triethyl borate (TEB). In some instances, dopant diffusion occurs from the gas phase. For example, a carrier gas (e.g., nitrogen, argon, or others) enriched with the desired dopant (also in gaseous form, such as triethyl phosphate (TEPO) and / or triethyl borate (TEB)) is directed to the silicon wafer, where concentration equilibrium may occur. In subsequent processes, the wafer can be placed in a quartz tube heated to a specific temperature.

[0037] In other examples, dopant diffusion occurs using a liquid source. Triethyl phosphate (TEPO) and / or triethyl borate (TEB) can be used as the dopant liquid source. A carrier gas is directed through these liquids and transports the desired dopant in a gaseous state. If it is not necessary to dope the entire wafer, certain areas can be masked with silicon dioxide. The dopant does not penetrate the oxide, and therefore doping does not occur at these locations. To avoid wafer tension or even fragmentation, a quartz tube containing one or more wafers is gradually heated (e.g., +10°C per minute) to 900°C. The dopant is then directed to the wafer inside the quartz tube. To initiate the diffusion process, the temperature is then increased to 1200°C.

[0038] Referring back to Figure 1, gas source 132 is connected to mixing manifold 140 via valves 134-1, 134-2, ... and 134-N (collectively referred to as valves 134) and mass flow controllers 136-1, 136-2, ... and 136-N (collectively referred to as mass flow controllers 136). Gas is supplied to mixing manifold 140 and mixed therein. The output of mixing manifold 140 is fed to processing chamber 102. In some embodiments, the output of mixing manifold 140 is fed to spray head 109. In some embodiments, annealing gas is fed to processing chamber 102 for in-situ annealing. Second purge gas 170 may be supplied to processing chamber 102 via valve 172 and MFC 174, for example, downstream of spray head 109. In some embodiments, valve 134 includes a vapor flow control valve.

[0039] Temperature controller 142 may be connected to a plurality of thermal control elements (TCEs) 143 and 144 disposed in the heating plate 112. For example, TCEs 143 and 144 may include, but are not limited to, individual large TCEs corresponding to each region in the multi-zone heating plate, and / or a miniature TCE array disposed across a plurality of regions of the multi-zone heating plate. Temperature controller 142 may be used to control the plurality of TCEs 143 and 144 to control the temperature of substrate support 106 and substrate 108. Temperature controller 142 may be in communication with coolant assembly 146 to control the flow of coolant through channel 116. For example, coolant assembly 146 may include a coolant pump and a reservoir. Temperature controller 142 operates coolant assembly 146 to selectively allow coolant to flow through channel 116 to cool substrate support 106. Valve 150 and pump 152 may be used to control pressure and discharge reactants from processing chamber 102. The system controller 160 can be used to control components of the board processing system 100. Although shown as a separate controller, the temperature controller 142 can be implemented within the system controller 160.

[0040] Figure 2 is a cross-sectional view of an exemplary UHP valve 202 in which the present disclosure may be employed. The valve 202 operates to control the flow of steam from a steam inlet 206 to a steam outlet 208. The UHP valve 202 includes a diaphragm or flexure 204. The flexure 204 is a flexible thin body that is in thermal communication with the valve 202 only around its circumference 210. In the figure, the flexure 204 can be flexed downwards or upwards to engage with or disengage from an annular seal 212. The engagement or disengagement of the flexure 204 opens or closes the UHP valve 202 to allow or deny steam flow from the inlet 206 to the outlet 208. For example, the intermediate position of the flexure 204 corresponding to the degree of opening or closing of the valve 202 regulates the steam flow.

[0041] In some instances, the movement of the flexure 204 is controlled by a plunger assembly 214. The plunger assembly 214 is connected by various means to a spring-loaded assembly, generally shown at 216. The spring-loaded assembly 216 includes a spring 228. The spring-loaded assembly 216 provides a continuous downward seating force that seats the flexure 204 when the valve 202 is not actuated. In this configuration description, the valve 202 may be referred to as "pre-closed". The valve 202 is actuated to allow steam flow.

[0042] Valve 202 is actuated by introducing pressurized control gas into the upper port 218. When actuated, the control gas pressure abuts against a series of upwardly movable components located inside the valve, as described below. The gas pressure acting on the surfaces of these components overcomes the downward sitting force generated by the spring-loaded assembly 216 and enables valve 202 to open. In some exemplary configurations of the upwardly movable components, the gas pressure acts on the lower surfaces 220 and 224 of the respective actuators 222 and 226 to move actuators 222 and 226 upward under gas pressure. The upward movement of actuators 222 and 226 causes the connected plunger component 214 to move upward, allowing the flexure 204 to disengage from the seal 212 and open valve 202.

[0043] As mentioned above, avoiding potential condensation of vapor can pose significant challenges in vapor flow control applications. For example, vapor flow control valves and their associated supply and control lines may require substantial heat to prevent vapor condensation on cold surfaces and the formation of undesirable particles. Effective heating of the valve diaphragm is inherently challenging because the typical vapor flowing through the valve is usually of high molecular weight. As vapor flows through the confined opening between the valve seat and the flexible element, it typically undergoes adiabatic expansion and cools the surrounding surfaces. The relatively high thermal mass of the valve body may experience a negligible temperature drop due to this phenomenon, but the typically very thin valve diaphragm, therefore having a much lower thermal mass, will experience significant cooling.

[0044] In other cases, current semiconductor manufacturing applications are continuously increasing vapor flow to achieve faster deposition rates. For example, the emerging atomic layer deposition (ALD) process leads to faster valve opening times, which may exacerbate the aforementioned flexural cooling phenomenon. Heat transfer across the diaphragm from the valve body has a fixed time constant and becomes faster with the manufacturing process, making it difficult, if not impossible, to provide sufficient heat to the interior of the diaphragm, which is located far from the valve body. Thermally isolated valve diaphragms become prone to failure.

[0045] In this regard, reference is now made to Figures 3-4, which are attached to the accompanying drawings. Figure 3 includes an enlarged cross-sectional view of a portion of the valve 202 of Figure 2. As described above, the illustrated valve 202 includes a flexible flexure (or diaphragm) 204 that is movable or flexible to seat onto or detach from the valve seal 212. As previously stated, the flexible flexure 204 interacts with the plunger component 214 to open or close the valve 202. In a first aspect of this disclosure, as shown, a gap-filling fluid 302 fills or at least partially fills existing cavities or gaps located above and between the components surrounding the flexure 204. The gap-filling fluid 302 serves as a thermal connection between the flexure 204 and the surrounding components of the valve 202, and seeks to mitigate the aforementioned thermal isolation problem.

[0046] Generally, the interstitial fluid 302 provides good heat transfer characteristics while allowing the flexible element 204 to move in an unrestricted manner. In other words, despite the presence of the interstitial fluid 302, the dynamic response of the flexible element 204 is substantially preserved (which is often particularly important, for example, in UPC valves). In some instances, the interstitial fluid 302 is filled to a depth ranging from 1 to 30 mm above the flexible element 204 or within the valve 202, in millimeter (mm) increments. In some instances, the interstitial fluid 302 has a dynamic viscosity of 1e-4 to 2e-2 Pa-s and a thermal conductivity of 0.1 to 0.7 W / m°K. In some instances, the interstitial fluid 302 comprises an alcohol.

[0047] In some instances, a gap-filling fluid column or reservoir is provided as shown in 304. In some instances, the reservoir 304 includes a small drain volume 306 at its upper end. The gap-filling fluid 302 can be introduced into the reservoir 304 by means of a syringe or otherwise. In some instances, one or more components surrounding the flexure 204 include one or more constructions as a dam or restraint for holding the gap-filling fluid 302 in place when the flexure 204 moves up and down during operation of the valve 202.

[0048] In some instances, the interstitial liquid 302 is incompressible. In some instances, the interstitial liquid 302 is provided not only as a "liquid" itself, but also as a fluid or in a two-phase form. In some instances, the fluid 302 can move from an incompressible liquid phase to a compressible gas phase, or vice versa. Phase change can occur during certain operations of valve 202, or under certain operating conditions. In some instances, the fluid 302 continuously circulates between these two phases during certain operations of valve 202, or under certain conditions.

[0049] FIG4 includes an enlarged cross-sectional view of a portion of valve 202 of FIG2. In the second embodiment of this disclosure, the illustrated valve 202 in this case includes a "double" or "pillow" type flexible flexure or diaphragm 402 (hereinafter referred to as double flexure 402), which can be seated on or detached from valve seal 212. For illustrative purposes, double flexure 402 is shown in a slightly enlarged or simplified view compared to a configuration available in real life. As discussed above in the discussion of flexure 204, double flexure 402 interacts with plunger component 214 to open or close valve 202. Double flexure 402 may have a uniform structure or a composite or hollow form. Double flexure 402 may include internal volumes as described in more detail below.

[0050] In some instances, the double flexure 402 includes a composite structure comprising a pair of opposing diaphragms 404 and 406, wherein a liquid heat transfer medium 408 is sandwiched or contained between the diaphragms 404 and 406. Some instances of the double flexure 402 typically include a first diaphragm; a second diaphragm connected to the first diaphragm around the periphery of the flexure, the connected first and second diaphragms surrounding the internal volume of the flexure; and a heat transfer medium located within the internal volume.

[0051] In some instances, the liquid heat transfer medium 408 provides good heat transfer characteristics while allowing the double flexure 402 to move in an unrestricted manner.

[0052] In some instances, the liquid heat transfer medium 408 does not inhibit the dynamic response of the double flexure 402, but rather allows heat to spread more rapidly to substantially reach all areas of the double flexure 402, and alleviates at least some of the aforementioned thermal isolation problems. In some instances, the dynamic response (i.e., the ability to open and close the valve in terms of speed) of the double flexure 402 is substantially the same as that of a conventional flexure 204. In some instances, the valve opening or closing movement of the upper diaphragm 404 is replicated by, or causes by, the simultaneous or corresponding movement of the lower diaphragm 406 of the double flexure 402. In some instances, the heat transfer medium 408 is incompressible, and in some instances, this incompressibility is generated by a vacuum or causes a corresponding movement of one diaphragm of the double flexure 402 as the other diaphragm of the double flexure 402 moves.

[0053] Some examples of the flexure 402 include a flexible pillow-shaped cylindrical bag or housing 410, such as shown in FIG. 4. The housing 410 includes or defines an internal volume 409. The upper and lower walls or layers of the housing 410 may include an upper diaphragm 404 and a lower diaphragm 406. These layers may be the inner or outer layers of the double flexure 402. The housing 410 may or may not include sidewalls 412 and 414. In some examples, sidewalls 412 and 414 form part of the same wall, such as a single cylindrical sidewall extending around the circumference of the flexure 402. A portion of the flexure 402 may include a bellows. For example, a bellows structure may be included in the sidewalls 412 or 414 of the flexure 402, or in its upper or lower wall. In some examples, the flexure 402 includes an inner layer. This inner layer may or may not surround or interact with the heat transfer medium 408. In some instances, the flexure 402 includes a short cylindrical shell to surround the heat transfer medium 408. In some instances, the flexure 402 includes a mechanical housing 410 comprising compressible or incompressible elements to transfer heat from the valve 202 to the flexure 402. Some examples of dual flexures 402 include asymmetry between opposing diaphragms 404 and 406, or between sidewalls 412 and 414. The degree of asymmetry can be selected to provide a desired dynamic response to the flexure 402, for example, to allow the valve 202 to open faster than it closes, or vice versa, for steam control purposes.

[0054] In some instances, the flexure 402 or housing 410 is pre-filled with a heat transfer medium 408. In some cases, the flexure 402 or housing 410 may be injected with the heat transfer medium 408. The flexure 402 or housing 410 may comprise a flexible material, such as SPRN 510, SPRN 100, or ELGILOY. The upper and lower walls of the flexure (e.g., diaphragms 404 and 406), or one or more sidewalls of the housing 410, may be wholly or partially constructed of such a material. Generally, the heat transfer medium 408 is selected to provide good heat transfer characteristics while allowing the flexure 402 to move in an unrestricted manner. In some instances, the interstitial fluid 302 and the heat transfer medium 408 are the same. In some instances, the heat transfer medium 408 has a dynamic viscosity of 1e-4 to 2e-2 Pa-s and a thermal conductivity of 0.1 to 0.7 W / m°K. An example of a suitable heat transfer medium 408 is Dynalene HC-10, a non-toxic, non-flammable potassium formate product manufactured by Dynalene, Inc. of Whitehall, PA, which has the following characteristics: Temperature (°C) Dynamic viscosity (Pa-s) Thermal conductivity (W / m°K) 20 1.79E-03 5.24E-01 100 6.63E-04 6.04E-01 150 4.31E-04 6.54E-01

[0055] In some instances, the heat transfer medium 408 is provided as a low-viscosity fluid, a low-viscosity dilute gel, or in a two-phase form. In other words, the flexural element 402 or the housing 410 may not always be incompressible during operation. In some instances, under certain operating conditions of the valve 202, the heat transfer medium 408 changes from an incompressible liquid form to a compressible gas form, or vice versa. In some instances, the heat transfer medium 408 circulates between these two phases during certain operating conditions of the valve 202. Variations in the form of the heat transfer medium 408 may be based on desired vapor flow control characteristics, valve status, or operating conditions.

[0056] The first (interstitial liquid) and second (reinforced diaphragm) versions of this disclosure can be deployed independently or in combination to address the problems discussed herein. Conventional thin diaphragms have almost no thermal mass to store heat and compensate for any heat loss. Furthermore, thin diaphragm structures have poor heat conduction from the valve body, and heat replenishment from there is slow. In addressing these problems, both versions of this disclosure seek to include a high-density, low-viscosity liquid on the atmospheric (non-vapor) side of the diaphragm to increase both the effective thermal mass of the diaphragm and its ability to collect heat from the valve body and related components. In liquid form, the interstitial liquid or heat transfer medium is inherently flexible and therefore has minimal restriction on the diaphragm's range of motion. Furthermore, providing appropriately low viscosity mitigates the negative impact of the liquid or medium on the valve actuation speed.

[0057] Some of the embodiments disclosed herein include methods. Referring to FIG5, an operation in method 500 of implementing a substrate processing system includes: in operation 502, installing a flow control valve in the processing system, the flow control valve including an inlet for allowing gas or vapor to enter the flow control valve; an outlet for discharging gas or vapor from the flow control valve; a valve flexure for opening or closing the flow control valve, the valve flexure being movable to seat on and disengage from a valve seal located between the inlet and outlet of the flow control valve; and a periphery of the valve flexure connected to one or more valve components, the connection defining or separating the atmospheric side of the flow control valve; method 500 further includes: in operation 504 providing a gap-filling liquid located above the valve flexure, the gap-filling liquid occupying at least some gap spaces on the atmospheric side of the valve adjacent to one or more valve components or between the one or more valve components.

[0058] In some instances, method 500 further includes: providing a valve flexure for a flow control valve in operation 506, the valve flexure including: a first diaphragm; a second diaphragm directly or indirectly connected to the first diaphragm around a peripheral portion of the valve flexure, the connected first and second diaphragms surrounding the internal volume of the valve flexure; and a heat transfer medium disposed within the internal volume of the valve flexure.

[0059] In some instances, method 500 further includes: in operation 508, allowing gas or vapor to pass through a flow control valve.

[0060] In some instances, the method of implementing a substrate processing system includes installing a flow control valve in the processing system, the flow control valve including a first diaphragm; a second diaphragm directly or indirectly connected to the first diaphragm around a peripheral portion of a valve flexure, the connected first and second diaphragms surrounding the internal volume of the valve flexure; and a heat transfer medium disposed within the internal volume of the valve flexure.

[0061] Figure 6 is a block diagram showing an example of a machine, such as the system controller 160 of Figure 1, by which one or more exemplary process embodiments described herein can be controlled. In alternative embodiments, the system controller 600 may operate as a standalone device or may be connected (e.g., via a network connection) to other machines. In a network-connected deployment, the system controller 600 may operate as a server machine, a client machine, or both in a server-client network environment. In one instance, the system controller 600 may act as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment. Furthermore, although only a single machine (i.e., system controller 600) is shown, the term "machine" should also be considered to include any collection of machines that, for example, execute a set (or more) of instructions individually or jointly to perform any one or more of the methods discussed herein via cloud computing, Software as a Service (SaaS), or other computer cluster configurations.

[0062] As described herein, examples may include the logic or operability of multiple components or mechanisms. A circuit system is a collection of circuits implemented in a tangible entity including hardware (e.g., simple circuits, gates, logic, etc.). The composition of a circuit system may be flexible over time and with potential hardware variability. A circuit system includes elements that can perform a specified operation individually or in combination during operation. In one example, the hardware of the circuit system may be designed in an immutable manner to perform a specific operation (e.g., wired). In one example, the hardware of the circuit system may include physical components (e.g., execution units, transistors, simple circuits, etc.) connected in a variable manner, including computer-readable media that encodes instructions for a specific operation through physical modifications (e.g., magnetism, electrical properties, movable arrangement of particles with invariant mass, etc.). In terms of connecting the physical components, the basic electrical properties of the hardware components change (e.g., from an insulator to a conductor, or vice versa). The instructions enable embedded hardware (e.g., execution units or loading mechanisms) to generate elements of a circuit system within the hardware via variable connections to perform a specific operation during operation. Therefore, when the device is operating, computer-readable media can be coupled to other components of the circuit system. In one example, any physical component can be used in more than one element of more than one circuit system. For instance, in operation, an execution unit can be used at one point in time in a first circuit of a first circuit system and reused at different times by a second circuit of the first circuit system or by a third circuit of the second circuit system.

[0063] The system controller (e.g., a computer system) 600 may include a hardware processor 602 (e.g., a central processing unit (CPU), a hardware processor core, or any combination thereof), a graphics processing unit (GPU) 603, main memory 604, and static memory 606, some or all of which may communicate with each other via interconnect (e.g., a bus) 608. The system controller 600 may further include a display device 610, an alphanumeric input device 612 (e.g., a keyboard), and a user interface (UI) navigation device 614 (e.g., a mouse). In one example, the display device 610, the alphanumeric input device 612, and the UI navigation device 614 may be a touch screen display. The system controller 600 may additionally include a mass storage device (e.g., a drive unit) 616, a signal generating device 618 (e.g., a speaker), a network interface device 620, and one or more sensors 621, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensors. The system controller 600 may include an output controller 628, which may be connected in series (e.g., Universal Serial Bus (USB)), in parallel, or otherwise wired or wireless (e.g., Infrared (IR), Near Field Communication (NFC) etc.) to communicate with or control one or more peripheral devices (e.g., printers, card readers, etc.).

[0064] Mass storage device 616 may include machine-readable medium 622 on which one or more sets of data structures or instructions 624 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein are stored. While the instructions 624 are being executed by system controller 600, the instructions 624 may also reside wholly or at least partially in main memory 604, static memory 606, hardware processor 602, or GPU 603. In one instance, one or any combination of hardware processor 602, GPU 603, main memory 604, static memory 606, or mass storage device 616 may constitute machine-readable medium 622.

[0065] Although the machine-readable medium 622 is shown as a single medium, the term "machine-readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) configured to store one or more instructions 624.

[0066] The term "machine-readable medium" may include any medium capable of storing, encoding, or carrying instructions 624 executed by system controller 600 and causing system controller 600 to perform any one or more of the techniques disclosed herein, or any medium capable of storing, encoding, or carrying data structures used by or associated with such instructions 624. Non-limiting examples of machine-readable media may include solid-state memory and optical and magnetic media. In one example, a collective machine-readable medium includes a plurality of machine-readable media 622 having a plurality of particles with invariant (e.g., rest) masses. Therefore, a collective machine-readable medium is not a transiently propagating signal. Specific examples of a collective machine-readable medium may include non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)), and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROMs and DVD-ROMs. Instruction 624 can be further transmitted or received on communication network 626 via network interface device 620 using transmission media.

[0067] Although embodiments have been described with reference to specific exemplary embodiments, it will be apparent that many modifications and changes can be made to these embodiments without departing from the broader scope of the subject matter of the invention. Therefore, the specification and drawings should be considered in an illustrative rather than restrictive manner. The accompanying drawings, which form a part of this document, illustrate specific embodiments in which the subject matter may be practiced by way of illustration and non-limitation. The illustrated embodiments are described in sufficient detail to enable those skilled in the art to implement the teachings disclosed herein. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes can be made without departing from the scope of this disclosure. Therefore, this section on embodiments should not be viewed in a restrictive manner, and the scope of the various embodiments is defined only by the full scope of the appended claims and their equivalents.

[0068] For convenience only, and not intended to voluntarily limit the scope of this application to any single invention or inventive concept (if more than one is disclosed), such embodiments of the subject matter may be referred to herein individually and / or collectively by the term "invention." Therefore, although specific embodiments have been shown and described herein, it should be understood that any configuration intended to achieve the same purpose may replace the specific embodiments shown. This disclosure is intended to cover all modifications or variations of the numerous embodiments. Combinations of the above embodiments and other embodiments not specifically described herein will become apparent to those skilled in the art upon review of the foregoing description. [Simplified Explanation of the Diagram]

[0025] Some embodiments are shown in the views accompanying the drawings by way of example and without limitation:

[0026] Figure 1 is a functional block diagram of an example of a substrate processing system for annealing an exemplary film, according to the present disclosure.

[0027] Figure 2 is a cross-sectional side view of a valve according to an exemplary embodiment, in which an example of the present disclosure may be deployed.

[0028] Figure 3 is an enlarged cross-sectional side view of a portion of Figure 2, showing a deployment example of the contents of this disclosure.

[0029] Figure 4 is an enlarged cross-sectional side view of a portion of Figure 2, showing another deployment example of the contents of this disclosure.

[0030] Figure 5 is a flowchart of an exemplary operation in a method according to an exemplary embodiment.

[0031] Figure 6 is a block diagram showing an example of a system controller. One or more exemplary embodiments may be implemented on the system controller, or one or more exemplary embodiments may be controlled by the system controller.

Claims

1. A valve flexure for a flow control valve, the valve flexure comprising: a first diaphragm; a second diaphragm directly or indirectly connected to the first diaphragm around a peripheral portion of the valve flexure, the connected first diaphragm and the second diaphragm surrounding an internal volume of the valve flexure; and a heat transfer medium disposed within the internal volume of the valve flexure, wherein the heat transfer medium comprises an alcohol.

2. The valve flexure of claim 1, wherein the configuration of the first and second diaphragms and the heat transfer medium is selected to provide a specific dynamic response of the valve flexure or the flow control valve.

3. The valve flexure of claim 1, wherein the configuration of the first and second diaphragms and the heat transfer medium is selected to provide specific heat transfer characteristics of the valve flexure.

4. The valve flexure of claim 1, wherein the valve opening or closing movement of the first diaphragm causes the valve opening or closing movement of the second diaphragm simultaneously or correspondingly.

5. The valve flexure as claimed in claim 1, wherein the heat transfer medium is incompressible.

6. The valve flexure of claim 1, wherein the valve flexure does not have a sidewall.

7. The valve flexure of claim 1, wherein the first diaphragm is connected to the second diaphragm via a side wall.

8. The valve flexure of claim 7, wherein the sidewall is defined as a cylindrical sidewall extending around the circumference of the valve flexure.

9. The valve flexure of claim 7, wherein the sidewall includes a bellows.

10. The valve flexure of claim 1, wherein the valve flexure includes an asymmetry relating to the first diaphragm and the second diaphragm.

11. The valve flexure of claim 10, wherein the degree of asymmetry is selected to provide a specified dynamic response of the valve flexure.

12. The valve flexure of claim 1, wherein the first diaphragm or the second diaphragm comprises one or more of the following materials: SPRN 510, SPRN 100, and ELGILOY.

13. The valve flexure of claim 1, wherein the heat transfer medium has a dynamic viscosity of 1e-4 to 2e-2 Pa-s.

14. The valve flexure of claim 1, wherein the heat transfer medium has a thermal conductivity of 0.1 to 0.7 W / m°K.

15. The valve flexure of claim 1, wherein the heat transfer medium comprises a two-phase medium.

16. The valve flexure of claim 15, wherein the two-phase medium shifts or circulates between compressible and incompressible forms based on a valve flow control characteristic, valve state, or operating conditions.

17. A flow control valve including a valve flexure, the valve flexure comprising any one of the valve flexures claimed in claims 1-16.

18. A flow control valve comprising: an inlet for allowing a gas or vapor to enter the flow control valve; an outlet for discharging the gas or vapor from the flow control valve; a valve flexure for opening or closing the flow control valve, the valve flexure being movable to seat on and disengage from a valve seal located between the inlet and the outlet of the valve, the valve flexure including any of the valve flexures of claims 1-16; a peripheral portion of the valve flexure connected to one or more valve components, the connection defining or separating an atmospheric side of the flow control valve; and a gap-filling liquid located above the valve flexure, the gap-filling liquid occupying at least some of the gap space adjacent to or between the one or more valve components on the atmospheric side of the flow control valve.

19. The flow control valve of claim 18 further includes a gap-filling fluid column or reservoir.

20. The flow control valve of claim 18, wherein the gap-filling fluid system fills to a depth of 1-30 mm above the valve flexure or within the flow control valve.

21. The flow control valve of claim 18, wherein the gap-filling fluid has a dynamic viscosity of 1e-4 to 2e-2 Pa-s.

22. The flow control valve of claim 18, wherein the interstitial fluid has a thermal conductivity of 0.1 to 0.7 W / m°K.

23. The flow control valve of claim 18, wherein the gap-filling liquid comprises alcohol.

24. The flow control valve of claim 18, wherein the gap-filling fluid comprises a two-phase medium.

25. A substrate processing system comprising: a processing chamber; a gas or vapor distribution device; and a flow control valve connected to the gas or vapor distribution device, the flow control valve including a valve flexure, the valve flexure including any of the valve flexures of claims 1-16.

26. A substrate processing system comprising: a processing chamber; a gas or vapor distribution device; and a flow control valve connected to the gas or vapor distribution device, the flow control valve including any of the flow control valves of claims 18-24.

27. A method of implementing a substrate processing system, the method comprising: installing a flow control valve in the substrate processing system, the flow control valve comprising: An inlet is provided to allow a gas or vapor to enter the flow control valve; The method comprises: an outlet for discharging the gas or vapor from the flow control valve; a valve flexure for opening or closing the flow control valve, the valve flexure being movable to seat on and disengage from a valve seal located between the inlet and the outlet of the flow control valve, the valve flexure including any of the valve flexures as claimed in claims 1-16; and a peripheral portion of the valve flexure connected to one or more valve components, the connection defining or separating an atmospheric side of the flow control valve; the method further comprising: providing a gap-filling liquid located above the valve flexure, the gap-filling liquid occupying at least some gap spaces adjacent to or between the one or more valve components of the flow control valve on the atmospheric side of the flow control valve.

28. The method of implementing the substrate processing system as claimed in claim 27 further includes passing the gas or vapor through the flow control valve.

29. A method of implementing a substrate processing system, the method comprising: installing a flow control valve in the substrate processing system, the flow control valve comprising: First diaphragm; A second diaphragm, which is directly or indirectly connected to the first diaphragm around a peripheral portion of the valve flexure, the connected first and second diaphragms surrounding an internal volume of the valve flexure; and a heat transfer medium disposed within the internal volume of the valve flexure, wherein the heat transfer medium includes alcohol.

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