Mixed reality (MR) headset, method for control of semiconductor manufacturing equipment in mixed reality environments and mixed-reality (MR) control system using the same

Abstract

The various embodiments described herein relate to a mixed reality (MR) control platform for operating semiconductor manufacturing tools in an MR environment and displaying data related to the semiconductor manufacturing tools. In some embodiments, the MR control platform includes an MR control system and an MR headset. The MR control system acquires sensor data representing sensor outputs from the semiconductor manufacturing tool. The MR control system determines operational information related to the semiconductor manufacturing tool based on the sensor data. The MR control system transmits the operational information to the MR headset. The MR headset receives the operational information related to the semiconductor manufacturing tool from the MR control system. The MR headset can image content related to the operational information and one or more control features in the MR environment.

Description

Technical Field

[0001] This invention relates to the control of semiconductor manufacturing in a mixed reality environment. Prior Technology

[0002] Semiconductor manufacturing equipment can be very complex and large, and / or may contain opaque walls, making it difficult to determine the equipment's status visually. Status information related to the operation of semiconductor manufacturing equipment (such as current operating status, current sensor values, etc.) can be largely displayed on a display screen, such as the one attached to the semiconductor manufacturing equipment.

[0003] The background information provided herein is intended to provide a general overview of the invention. References to the inventor's work in this background section, and descriptions that are not considered prior art at the time of application, are not intended to represent, expressly or implicitly, any prior art as opposed to the present invention by the inventor. Summary of the Invention

[0004] The document discloses systems, methods, and media for operating semiconductor manufacturing tools in mixed reality (MR) environments and for displaying data related to semiconductor manufacturing tools in MR environments.

[0005] According to some embodiments, an MR control platform is provided for operating semiconductor manufacturing tools in an MR environment and displaying data related to the semiconductor manufacturing tools. In some embodiments, the MR control platform includes an MR control system, which includes one or more processors and a plurality of instructions stored in one or more memories of the MR control system. When executed, the plurality of instructions cause the one or more processors of the MR control system to: obtain sensor data representing the output of a sensor from one of the semiconductor manufacturing tools; determine operational information related to the semiconductor manufacturing tool based at least in part on the sensor data; and respond by establishing a wireless communication channel with the MR headset, thereby transmitting the operational information related to the semiconductor manufacturing tool to the MR headset via the wireless communication channel. The MR headset includes one or more processors and a plurality of instructions stored in one or more memories of the MR headset. When executed, the plurality of instructions cause the one or more processors of the headset to: establish the wireless communication channel with the MR control system; obtain the operational information related to the semiconductor manufacturing tool from the MR control system; and image content related to the operational information and one or more control features into the MR environment.

[0006] In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR headset further cause one or more processors of the MR headset to establish the wireless communication channel in the following manner: identifying a wireless access point associated with the MR control system and a password associated with the wireless access point; and connecting to the wireless access point using the password.

[0007] In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR headset further cause one or more processors of the MR headset to identify the wireless access point in the following manner: acquire image data via a camera associated with the MR headset; identify machine-readable code in the image data; decode the machine-readable code to retrieve encrypted information; and decrypt the encrypted information using key information stored in the memory of the MR headset, wherein the decrypted information includes an identifier of the wireless access point and the password.

[0008] In some embodiments, the imaged content includes a user interface element that indicates a sensor value included in the sensor data obtained by the MR control system.

[0009] In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR headset further cause the one or more processors of the MR headset to: receive a user input instructing the user interface element to be fixed at a spatial coordinate relative to the semiconductor manufacturing tool; identify a set of spatial coordinates in a coordinate system fixed relative to the semiconductor manufacturing tool, wherein the set of spatial coordinates indicates a plurality of boundaries of the user interface element relative to the fixed spatial coordinates; identify a physical position and an orientation of the MR headset relative to the coordinate system; and modify the presentation of the user interface element based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates.

[0010] In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR headset further cause one or more processors of the MR headset to identify a physical location and an orientation of the MR headset, wherein the content is imaged based on the physical location and orientation of the MR headset. In some embodiments, the physical location and orientation of the MR headset are identified relative to the semiconductor manufacturing tool.

[0011] In some embodiments, the operational information includes a plurality of locations of one or more internal components of the semiconductor manufacturing tool, wherein the imaged content includes a plurality of three-dimensional representations of the plurality of locations of the one or more internal components of the semiconductor manufacturing tool over time, wherein the plurality of three-dimensional representations of the plurality of locations of the one or more internal components of the semiconductor manufacturing tool are imaged based on the physical location and orientation of the MR head-mounted device relative to the semiconductor manufacturing tool.

[0012] In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR control system further cause one or more processors of the MR control system to transmit three-dimensional model information related to the semiconductor manufacturing tool to the MR headset; and when executed, the plurality of instructions stored in one or more memories of the MR headset further cause one or more processors of the MR headset to receive and image the three-dimensional model information, wherein the plurality of three-dimensional representations of the plurality of locations of the one or more internal elements are imaged relative to the three-dimensional model information of the semiconductor manufacturing tool. In some embodiments, the one or more internal elements include at least one of the following: a wafer support, a spray head, one or more lifting pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, a turntable, or any combination of two or more thereof.

[0013] In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR headset further cause one or more processors of the MR headset to: receive one or more input signals related to an operation instruction of the semiconductor manufacturing tool; and respond to receiving the one or more input signals by transmitting the operation instruction to the MR control system; wherein when executed, the plurality of instructions stored in one or more memories of the MR control system further cause one or more processors of the MR control system to: receive the operation instruction from the MR headset; and cause a command to be transmitted via a communication interface for communicatively connecting with the semiconductor manufacturing tool, the command being used to change the state of the semiconductor manufacturing tool or representing the state of a digital clone of the semiconductor manufacturing tool.

[0014] In some embodiments, the sensor data includes virtual sensor data generated by the digital clone, wherein the plurality of instructions stored in the memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital clone. In some embodiments, when executed, the plurality of instructions stored in the one or more memories of the MR control system further cause one or more processors of the MR control system to transmit the 3D model information related to the semiconductor manufacturing tool to the MR headset; and when executed, the plurality of instructions stored in the one or more memories of the MR headset further cause one or more processors of the MR headset to image content based on an orientation of the MR headset and based on the 3D model information, wherein the imaged content includes content indicating the state of the digital clone. In some embodiments, when executed, the plurality of instructions stored in one or more memories of the MR headset further cause one or more processors of the MR headset to: identify an updated orientation of the MR headset; and update the imaged content based on the updated orientation of the MR headset.

[0015] In some embodiments, when executing the plurality of instructions stored in one or more memories of the MR headset, the one or more processors of the MR headset further cause the processors to: receive an input indicating second operation information related to the semiconductor manufacturing tool, wherein the second operation information is at least partially different from the operation information; transmit a request for the second operation information to the MR control system; and, in response to receiving the second operation information from the MR control system, image second content related to the second operation information; and, when executing the plurality of instructions stored in one or more memories of the MR control system, further cause the one or more processors of the MR control system to: receive the request for the second operation information; and, in response to receiving the request, transmit the second operation information to the MR headset.

[0016] According to some embodiments, an MR head-mounted device is provided for controlling semiconductor manufacturing tools in an MR environment. In some embodiments, the MR head-mounted device includes: one or more processors; a display coupled to the one or more processors; one or more cameras; and one or more memories storing a plurality of computer-executable instructions, which, when executed, cause the one or more processors to: establish a wireless communication channel with an MR control system of the semiconductor manufacturing tool; receive operational information related to the semiconductor manufacturing tool from the MR control system; and image content related to the operational information and one or more control features in the MR environment.

[0017] In some embodiments, when executed, the plurality of instructions further cause the one or more processors to begin establishing the wireless communication channel by: identifying a wireless access point associated with the MR control system and a password associated with the wireless access point; and connecting to the wireless access point using the password. In some embodiments, when executed, the plurality of instructions further cause the one or more processors to identify the wireless access point by: acquiring image data via one of one or more cameras; identifying a machine-readable code in the image data; decoding the machine-readable code to retrieve encrypted information; and decrypting the encrypted information using key information stored in the memory, wherein the decrypted information includes an identifier of the wireless access point and the password.

[0018] In some embodiments, when executed, the plurality of instructions further cause one or more processors to identify a physical location and orientation of the MR headset based on data from one or more sensors of the MR headset, wherein content is imaged from a viewpoint based on the identified physical location and orientation of the MR headset.

[0019] In some embodiments, when executed, the plurality of instructions further cause the one or more processors to: receive an input indicating second operational information related to the semiconductor manufacturing tool, wherein the second operational information is at least partially different from the operational information; and cause a request for the second operational information to be transmitted to the MR control system; receive the second operational information from the MR control system; and cause second content related to the second operational information to be imaged. In some embodiments, the input indicating the second operational information indicates a selection of a selectable input included in a menu imaged by the MR headset. In some embodiments, the input indicating the second operational information is based on an image capture that identifies a machine-readable code of the second operational information. In some embodiments, the imaged content includes a user interface element that presents sensor data from one or more sensors of the semiconductor manufacturing tool, wherein the sensor data corresponds to the requested second operational information. In some embodiments, when executed, the plurality of instructions further cause the one or more processors to: receive a second input indicating that the user interface element is fixed at a spatial coordinate relative to the semiconductor manufacturing tool; identify a set of spatial coordinates in a coordinate system fixed relative to the semiconductor manufacturing tool, wherein the set of spatial coordinates indicates a plurality of boundaries of the user interface element relative to the fixed spatial coordinates; identify a physical position and an orientation of the MR headset relative to the coordinate system; and modify the presentation of the user interface element based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates.

[0020] In some embodiments, when executed, the plurality of instructions further cause the one or more processors to: receive three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information; identify a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool; and image a three-dimensional representation of one or more elements of the semiconductor manufacturing tool based on: 1) the three-dimensional model information; and 2) the physical position and orientation of the MR headset relative to the semiconductor manufacturing tool as part of the imaged content associated with the operational information in the MR environment. In some embodiments, the operational information includes a plurality of positions of the one or more internal elements of the semiconductor manufacturing tool over time, wherein the imaged content includes a representation of the one or more internal elements of the semiconductor manufacturing tool relative to the plurality of positions of the semiconductor manufacturing tool over time. In some embodiments, the one or more internal elements include at least one of the following: a wafer support, a spray head, one or more lifting pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a turntable. In some embodiments, when executed, the plurality of instructions further cause the one or more processors to image the content in the following manner: generate one or more three-dimensional images representing the one or more internal components using the three-dimensional model information; and image the one or more three-dimensional images by the MR head-mounted device based on the plurality of positions of the one or more internal components relative to the semiconductor manufacturing tool.

[0021] In some embodiments, when executed, the plurality of instructions further cause the one or more processors to: receive the three-dimensional model information associated with the semiconductor manufacturing tool as part of the operation information; and image the content based on the three-dimensional model information, wherein the imaged content includes content indicating the state of a digital replica of a part represented by the three-dimensional model information, wherein the digital replica represents the semiconductor manufacturing tool.

[0022] According to some embodiments, an MR control system is provided. In some embodiments, the MR control system includes: one or more processors; and a memory device storing one or more computer-executable instructions, which, when executed, cause the one or more processors to: establish a wireless communication channel with an MR headset; obtain sensor data representing sensor output from a semiconductor manufacturing tool; determine operating information of the semiconductor manufacturing tool based on the sensor data; and transmit the operating information to the MR headset via the communication channel.

[0023] In some embodiments, the MR control system communicates with a digital clone, wherein the sensor data includes virtual sensor data obtained from the digital clone. In some embodiments, the operational information includes an indication of a state of the digital clone. In some embodiments, the plurality of instructions further causes one or more processors to transmit three-dimensional model information associated with at least a portion of the semiconductor manufacturing tool to the MR headset, wherein the MR headset images the content indicating the state of the digital clone based on the three-dimensional model information.

[0024] In some embodiments, the MR control system communicates with the semiconductor manufacturing tool, wherein the sensor data includes sensor data obtained from one or more physical sensors of the semiconductor manufacturing tool. In some embodiments, the operational information includes a state of the semiconductor manufacturing tool.

[0025] In some embodiments, when executed, the complex instructions further cause the one or more processors to determine the complex positions of one or more internal components of the semiconductor manufacturing tool over time, wherein the operational information includes information indicating the complex positions of the one or more internal components of the semiconductor manufacturing tool relative to the semiconductor manufacturing tool over time. In some embodiments, when executed, the complex instructions further cause the one or more processors to transmit three-dimensional model information associated with at least a portion of the semiconductor manufacturing tool, the at least portion of the semiconductor manufacturing tool including at least one of the one or more internal components, wherein the MR head-mounted device uses the three-dimensional model information to image a complex representation of the one or more internal components based on the three-dimensional model information.

[0026] In some embodiments, when executed, the plurality of instructions further cause the one or more processors to: receive from the MR headset a request for second operational information that is at least partially different from the operational information; and transmit the requested second operational information to the MR headset.

[0027] According to some embodiments, a method for controlling a semiconductor manufacturing tool via MR dialogue is provided. The method includes: establishing a wireless communication channel with an MR control system via an MR headset; obtaining sensor data representing sensor outputs from the semiconductor manufacturing tool via the MR control system; determining operational information related to the semiconductor manufacturing tool via the MR control system, at least in part based on the sensor data; establishing the wireless communication channel with the MR headset via the MR control system and in response, transmitting the operational information related to the semiconductor manufacturing tool to the MR headset via the communication channel; receiving the operational information related to the semiconductor manufacturing tool from the MR control system via the MR headset; and imaging content related to the operational information and one or more control features in an MR environment via the MR headset.

[0028] In some embodiments, the method further includes: identifying a wireless access point associated with the MR control system and a password associated with the wireless access point via the MR headset; and connecting to the wireless access point using the password. In some embodiments, the method further includes: acquiring image data via a camera associated with the MR headset; identifying a machine-readable code in the image data; decoding the machine-readable code to retrieve encrypted information; and decrypting the encrypted information using key information stored in a memory of the MR headset, wherein the decrypted information includes an identifier of the wireless access point and the password.

[0029] In some embodiments, the imaged content includes a user interface element that indicates a sensor value included in sensor data acquired by the MR control system. In some embodiments, the method further includes: receiving a user input via the MR headset, the user input instructing the user interface element to be fixed at a spatial coordinate relative to the semiconductor manufacturing tool; identifying a set of spatial coordinates in a coordinate system fixed relative to the semiconductor manufacturing tool, wherein the set of spatial coordinates indicates multiple boundaries of the user interface element relative to the fixed spatial coordinates; identifying a physical position and an orientation of the MR headset relative to the coordinate system; and modifying the presentation of the user interface element based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates.

[0030] In some embodiments, the method further includes identifying a physical location and an orientation of the MR headset, wherein this information is imaged based on the physical location and orientation of the MR headset. In some embodiments, the physical location and orientation of the MR headset are identified relative to the semiconductor manufacturing tool.

[0031] In some embodiments, the operational information includes a plurality of positions of one or more internal components of the semiconductor manufacturing tool, wherein the imaged content includes a plurality of three-dimensional representations of the plurality of positions of the one or more internal components of the semiconductor manufacturing tool over time, wherein the plurality of three-dimensional representations of the plurality of positions of the one or more internal components of the semiconductor manufacturing tool are imaged based on the physical position and orientation of the MR headset relative to the semiconductor manufacturing tool. In some embodiments, the method further includes: transmitting three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information via the MR control system; and receiving the three-dimensional model information via the MR headset, wherein the plurality of three-dimensional representations of the plurality of positions of the one or more internal components are imaged based on the three-dimensional model information relative to the semiconductor manufacturing tool. In some embodiments, the one or more internal components include at least one of the following: a wafer support, a spray head, one or more lifting pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a turntable.

[0032] In some embodiments, the method further includes: receiving one or more input signals associated with an operation command of one of the semiconductor manufacturing tools via the MR headset; responding to the receipt of the one or more input signals, causing the operation command to be transmitted to the MR control system; receiving the operation command from the MR headset via the MR control system; and transmitting a command via the MR control system through a communication interface for communicatively connecting with the semiconductor manufacturing tool, the command being used to change the state of the semiconductor manufacturing tool or representing the state of a digital clone of the semiconductor manufacturing tool.

[0033] In some embodiments, the sensor data includes virtual sensor data generated by the digital clone, wherein the plurality of instructions stored in the memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital clone. In some embodiments, the method further includes: transmitting 3D model information related to the semiconductor manufacturing tool to the MR headset via the MR control system; and causing the content to be imaged by the MR headset based on an orientation of the MR headset and based on the 3D model information, wherein the imaged content includes content indicating the state of the digital clone. In some embodiments, the method further includes: identifying an updated orientation of the MR headset; and updating the imaged content based on the updated orientation of the MR headset.

[0034] In some embodiments, the method further includes: receiving, via the MR headset, an input indicating second operational information related to the semiconductor manufacturing tool, wherein the second operational information is at least partially different from the operational information; transmitting, via the MR headset, a request for one of the second operational information to the MR control system; receiving, via the MR control system, the request for the second operational information; responding to receiving the request by transmitting the second operational information to the MR headset via the MR control system; and responding to receiving the second operational information from the MR control system by imaging, via the MR headset, second content related to the second operational information.

[0035] According to some embodiments, a non-transient computer-readable medium comprising one or more of a plurality of instructions is provided, which, when executed by one or more processors, cause the one or more processors to perform a method of controlling a semiconductor manufacturing tool via an MR dialogue. In some embodiments, the method includes: establishing a wireless communication channel with an MR control system via an MR headset; obtaining sensor data representing sensor output from the semiconductor manufacturing tool via the MR control system; determining operational information related to the semiconductor manufacturing tool via the MR control system, at least in part based on the sensor data; transmitting the operational information related to the semiconductor manufacturing tool to the MR headset via the communication channel in response to establishing the wireless communication channel with the MR headset; receiving the operational information related to the semiconductor manufacturing tool from the MR control system via the MR headset; and imaging content related to the operational information and one or more control features in an MR environment via the MR headset.

[0036] In some embodiments, the method further includes: identifying a wireless access point associated with the MR control system and a password associated with the wireless access point via the MR headset; and connecting to the wireless access point using the password. In some embodiments, the method further includes: acquiring image data via a camera associated with the MR headset; identifying a machine-readable code in the image data; decoding the machine-readable code to retrieve encrypted information; and decrypting the encrypted information using key information stored in a memory of the MR headset, wherein the decrypted information includes an identifier of the wireless access point and the password.

[0037] In some embodiments, the imaged content includes a user interface element that indicates a sensor value included in sensor data acquired by the MR control system. In some embodiments, the method further includes: receiving a user input via the MR headset, the user input instructing the user interface element to be fixed at a spatial coordinate relative to the semiconductor manufacturing tool; identifying a set of spatial coordinates in a coordinate system fixed relative to the semiconductor manufacturing tool, wherein the set of spatial coordinates indicates multiple boundaries of the user interface element relative to the fixed spatial coordinates; identifying a physical position and an orientation of the MR headset relative to the coordinate system; and modifying the presentation of the user interface element based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates.

[0038] In some embodiments, the method further includes: identifying a physical location and an orientation of the MR headset, wherein the information is imaged based on the physical location and orientation of the MR headset. In some embodiments, the physical location and orientation of the MR headset are identified relative to the semiconductor manufacturing tool.

[0039] In some embodiments, the operational information includes a plurality of positions of one or more internal components of the semiconductor manufacturing tool, wherein the imaged content includes a plurality of three-dimensional representations of the plurality of positions of the one or more internal components of the semiconductor manufacturing tool over time, wherein the plurality of three-dimensional representations of the plurality of positions of the one or more internal components of the semiconductor manufacturing tool are imaged based on the physical position and orientation of the MR headset relative to the semiconductor manufacturing tool. In some embodiments, the method further includes: transmitting three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information via the MR control system; and receiving the three-dimensional model information via the MR headset, wherein the plurality of three-dimensional representations of the plurality of positions of the one or more internal components are imaged based on the three-dimensional model information relative to the semiconductor manufacturing tool. In some embodiments, the one or more internal components include at least one of the following: a wafer support, a spray head, one or more lifting pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a turntable.

[0040] In some embodiments, the method further includes: receiving one or more input signals associated with an operation command of one of the semiconductor manufacturing tools via the MR headset; responding to the receipt of the one or more input signals, causing the operation command to be transmitted to the MR control system; receiving the operation command from the MR headset via the MR control system; and transmitting a command via the MR control system through a communication interface for communicatively connecting with the semiconductor manufacturing tool, the command being used to change the state of the semiconductor manufacturing tool or representing the state of a digital clone of the semiconductor manufacturing tool.

[0041] In some embodiments, the sensor data includes virtual sensor data generated by the digital clone, wherein the plurality of instructions stored in the memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital clone. In some embodiments, the method further includes: transmitting 3D model information related to the semiconductor manufacturing tool to the MR headset via the MR control system; and causing the content to be imaged by the MR headset based on an orientation of the MR headset and based on the 3D model information, wherein the imaged content includes content indicating the state of the digital clone. In some embodiments, the method further includes: identifying an updated orientation of the MR headset; and updating the imaged content based on the updated orientation of the MR headset.

[0042] In some embodiments, the method further includes: receiving, via the MR headset, an input indicating second operational information related to the semiconductor manufacturing tool, wherein the second operational information is at least partially different from the operational information; transmitting, via the MR headset, a request for one of the second operational information to the MR control system; receiving, via the MR control system, the request for the second operational information; responding to receiving the request by transmitting the second operational information to the MR headset via the MR control system; and responding to receiving the second operational information from the MR control system by imaging, via the MR headset, second content related to the second operational information. Simple Explanation of the Diagram

[0043] Figures 1A and 1B show top and perspective views of parts of a semiconductor manufacturing tool according to certain embodiments.

[0044] Figure 2 shows an exemplary schematic diagram of an MR control platform that uses an MR imaging device, such as an MR head-mounted device, to control semiconductor manufacturing tools according to certain embodiments.

[0045] The flowcharts shown in Figures 3A and 3B illustrate a routine process for establishing a communication channel between the MR headset and the MR control system.

[0046] Figure 4 shows a diagram of the information flow controlling a semiconductor manufacturing tool according to certain embodiments.

[0047] Figures 5A and 5B show flowcharts according to certain embodiments, illustrating exemplary processing of a user interface element via an MR head-mounted device, the user interface element indicating operational information of a semiconductor manufacturing tool.

[0048] Figures 6A-6E show exemplary views of one of the MR head-mounted devices according to certain embodiments, relating to one or more steps of the processes shown in Figures 5A and 5B.

[0049] Figure 7 shows an example of a configuration interface for configuring information to be imaged by an MR head-mounted device, according to certain embodiments.

[0050] Figures 8A and 8B show flowcharts according to certain embodiments, illustrating exemplary processing of the representation of internal components / parts of a semiconductor manufacturing tool via an MR head-mounted imaging device.

[0051] Figure 9A shows an exemplary view of the processing chamber according to some embodiments.

[0052] Figure 9B shows an exemplary view of a 3D image of an internal component / part in an AR, VR, or MR environment, according to certain embodiments.

[0053] Figure 10 shows a schematic diagram of an exemplary system for digitally imaging semiconductor manufacturing tool operation information from a semiconductor manufacturing tool, according to certain embodiments.

[0054] Figures 11A and 11B show flowcharts according to certain embodiments, illustrating exemplary processing for imaging content related to digital clones of semiconductor manufacturing tools.

[0055] Figure 12 shows an exemplary computer system that can be used to implement some of the embodiments described herein. Implementation

[0056] Overview

[0057] Systems, methods, and non-transient computer-readable media are provided for controlling semiconductor manufacturing tools in an MR environment.

[0058] Semiconductor manufacturing equipment is extremely complex and can be very large, including / or contain opaque walls, making it difficult to assess its status visually. Status information related to the operation of semiconductor manufacturing equipment (such as current operating status and current sensor values) can be largely displayed on a screen, such as one attached to the equipment. However, due to the size of semiconductor manufacturing equipment, operators (such as manufacturing engineers and maintenance personnel) cannot simultaneously view / access such a screen while also observing or interacting with various parts of the equipment that are not near the screen. For example, in cases where the screen is mounted at the front of the equipment, the operator cannot see it when moving to the back for maintenance.

[0059] According to certain embodiments of the present invention, mixed reality (MR) imaging devices, such as MR headsets, can be used to image information related to semiconductor manufacturing tools and enable operators to control such tools. Semiconductor manufacturing tools may be large in size and may contain a plurality of components. The plurality of portions of a semiconductor manufacturing tool may have opaque walls. For example, a semiconductor manufacturing tool may contain one or more chambers in which wafers are processed. Therefore, it may be difficult to determine operational information related to the semiconductor manufacturing tool, such as the multiple locations of various internal components of the semiconductor manufacturing tool, current sensor data related to the sensor outputs of the semiconductor manufacturing tool, etc. By imaging such operational information and device control user interfaces in an MR environment, MR headsets allow operators (such as process engineers, technicians, or other users) to easily view operational information and control semiconductor manufacturing tools.

[0060] For example, in some embodiments, operational information such as current sensor values ​​can be displayed in the MR environment, allowing an operator wearing an MR headset to simultaneously view current sensor values, interact with the control system of semiconductor manufacturing tools, and inspect the semiconductor manufacturing tools from different sides. As another example, in some embodiments, the MR headset can image a three-dimensional representation of the internal components of the semiconductor manufacturing tool based on the position or orientation of the MR headset relative to the semiconductor manufacturing tool, thereby allowing the operator to see the interior of the semiconductor manufacturing tool. By imaging operational information in an MR environment, the systems, methods, and computer products described herein can improve the operation of semiconductor manufacturing tools by reducing repair time, reducing tool downtime, and improving access to sensor data.

[0061] Displaying device information and enabling system control in portable MR environments offers technological advantages and solutions unattainable by traditional semiconductor control platforms. Traditional semiconductor manufacturing tool control platforms are typically linked to a single tool, displayed on a single monitor attached to the tool, or in some cases, transmitted to a remote display such as a service tablet. The amount of information and control available at any given time is usually limited by screen size and resolution. This means that when an operator accesses the tool via a traditional control platform, they can only access a subset of information and control functions on each screen. This limitation makes global tool diagnostics extremely difficult and inefficient. Operators inspecting multiple components in a tool need to constantly enter and exit multiple function tables while simultaneously memorizing data from each. Furthermore, even when information is transmitted to a remote display, it is not location-specific. For example, an operator standing behind the tool will still be viewing the control panel for the entire system, not just the control panel for the components in front of them. Additionally, the graphical user interface (GUI) of traditional control platforms is not programmed to allow for situational user customization. In other words, operators typically cannot display information and controls on the screen that are only relevant to one set of sub-components. Furthermore, even if some customization is allowed, such features are limited by the display interface. That is, only one set of GUI elements can be changed at a specific screen location. Additionally, traditional control platforms lack the ability to visualize and animate internal components in 3D graphics. The ability to visualize and animate internal components in 3D graphics helps operators visualize system problems in a global manner by considering the activity of adjacent components and information related to the components of interest.

[0062] Embodiments of the present invention improve the control platform of semiconductor manufacturing tools by providing an unrestricted display and control environment and introducing a fully customizable control mechanism, enabling operators to create situation-based control GUIs. Furthermore, embodiments of the present invention allow a device (such as an MR headset) to simultaneously view and control multiple sub-components of a tool. Embodiments of the present invention also allow operators to access component-specific information and controls from different sides of the tool. For example, when a user is looking at a processing chamber, embodiments of the present invention can display all tool information and controls associated with that processing chamber. These are merely a few examples. Further advantages and technical improvements will be further illustrated in various embodiments of the present invention.

[0063] Figure 1A shows a schematic top view of the components of an exemplary semiconductor manufacturing tool 100 according to some embodiments.

[0064] Semiconductor manufacturing tool 100 includes a loading interface 104. The loading interface 104 is a platform or receiving device capable of receiving a front-opening unified container (FOUP), such as FOUP 102. The FOUP can hold wafers (e.g., 20 wafers, 25 wafers, 30 wafers, etc.). Wafers can be stacked in the FOUP. In some embodiments, each wafer in the FOUP can be seated on a separate shelf extending inward from the wall of the FOUP. The FOUP can be a plastic container (e.g., an injection-molded plastic container).

[0065] Each FOUP may have a door or other opening located adjacent to the Equipment Front End Module (EFEM) 106. The EFEM 106 may have a corresponding door to allow wafers to pass through the FOUP into the EFEM 106. The FOUP may dock to the EFEM 106 via a loading interface 104. The EFEM 106 may contain one or more wafer handling robots. In some embodiments, the EFEM 106 may be a hermetically sealed volume, so that the internal components of the EFEM 106 (such as one or more wafer handling robots) are not visible from the outside of the EFEM 106.

[0066] Semiconductor manufacturing tool 100 includes a loading lock 108 (such as a gas lock) for transferring wafers into and out of a vacuum transfer module (VTM) 110. The vacuum transfer module 110 may be a large chamber connected to one or more chambers (such as a processing chamber 112). The vacuum transfer module 110 may also be connected to the loading lock 108 and a buffer station 114. The vacuum transfer module 110 can be maintained at sub-atmospheric pressure, such as a vacuum, and therefore the processing chamber 112 can also be maintained at sub-atmospheric pressure, allowing wafers to pass through the vacuum transfer module without increasing or decreasing the pressure in the processing chamber 112.

[0067] As shown in Figure 1, a semiconductor manufacturing tool 100 includes ten processing chambers in a plurality of processing chambers. The processing chambers 112 are arranged along a rectangle. However, it should be noted that the number and arrangement of the processing chambers in Figure 1 are merely illustrative examples; the semiconductor manufacturing tool 100 may include more or fewer processing chambers, and the processing chambers may be arranged in various configurations (e.g., square, hexagonal, etc.). In some embodiments, the processing chambers 112 may include inductively coupled plasma (ICP) chambers or conductively coupled plasma (CCP) chambers. The processing chambers 112 may, for example, perform conductive etching or dielectric etching processes.

[0068] Although not shown in Figure 1, various parts or components may be located below or near each processing chamber. These parts include, for example, pumps, vacuum lines, exhaust lines, and vertical lifting actuators used to move the platform inside the processing chamber up and down.

[0069] Buffer station 114 is a temporary storage space for wafers within vacuum transfer module 110. For example, wafers can be stored in buffer station 114 when they are transferred between different processing chambers of multiple processing chambers 112. In some embodiments, buffer station 114 may have heating and / or cooling capabilities.

[0070] In some embodiments, the semiconductor manufacturing tool 100 includes a control station 116 for controlling the state of the semiconductor manufacturing tool 100, initiating or changing processes performed by the semiconductor manufacturing tool 100, etc. The control station 116 may include a controller 130, a hardware interface 132, a user interface 134, and / or memory 136. In some embodiments, the controller 130 may transmit commands to the semiconductor manufacturing tool 100 via the hardware interface 132. In some embodiments, the controller 130 may receive commands via the user interface 134. In some embodiments, the controller 130 is a general-purpose computer / processor. In some embodiments, the controller 130 is a specific-purpose computer / processor for interacting with or commanding a specific set of sensors and programs within the semiconductor manufacturing tool 100. In some embodiments, the control station 116 may interface with an MR control system in the manner described herein.

[0071] Figure 1B shows a perspective view of a component of a semiconductor manufacturing tool 100 according to certain embodiments.

[0072] As shown, the semiconductor manufacturing tool 100 includes a gas chamber 152. The gas chamber 152 may include various components such as valves, lines, mass flow controllers, etc., for delivering process gases to the processing chamber 112. The gas chamber 152 may additionally include a radio frequency generator and / or a remote plasma generator.

[0073] Semiconductor manufacturing tool 100 includes a lifting box 154. The lifting box 154 can be used to lift and / or lower a gas box 152, for example, to move the gas box 152 closer to and / or to a remote processing chamber 112.

[0074] Various sensors associated with semiconductor manufacturing tools (such as temperature sensors, pressure sensors, position sensors, motion sensors, etc.) can be used to collect sensor data 156 related to the semiconductor manufacturing tool. Sensor data 156 may include time-series data collected at any suitable frequency. Sensor data 156 may include a collection of data from sensors and sensors of multiple types located at multiple locations or positions on the semiconductor manufacturing tool 100.

[0075] Figure 2 shows an exemplary schematic diagram of an MR control platform that uses an MR imaging device, such as an MR head-mounted device, to control a semiconductor manufacturing tool according to certain embodiments.

[0076] As shown, the MR control system 202 communicates with the semiconductor manufacturing tool 204. Communication between the MR control system 202 and the semiconductor manufacturing tool 204 can use protocols such as Transmission Control Protocol (TCP) or Internet Protocol (IP). Communication can be wired or wireless. In some embodiments, the MR control system communicates directly with the controller 130 of the semiconductor manufacturing tool's control system, as shown in FIG1A. In some embodiments, the MR control system communicates directly with various components within the semiconductor manufacturing tool via a hardware interface, as shown in the hardware interface 132 of FIG1A.

[0077] The MR control system 202 can be used to execute control software for semiconductor tools. This control software can provide instructions to the semiconductor manufacturing tool 204, enabling the tool to perform various operations. For example, referring to FIG1A, the MR control system 202 can transmit instructions to the controller 130 of the semiconductor manufacturing tool 100. These operations may include initiating specific manufacturing processes or operations, setting or modifying various setpoints, moving specific movable parts (such as robotic arms, spray heads, indexers, turntables, platforms, etc.), moving wafers, etc. In some embodiments, the MR control system 202 can receive operational information from the semiconductor manufacturing tool 204. For example, the MR control system 202 can receive information indicating sensor values ​​of one or more sensors associated with the semiconductor manufacturing tool 204, status information or position information related to various parts of the semiconductor manufacturing tool 204, etc.

[0078] The MR control system 202 communicates with the MR head-mounted device 206. In some embodiments, the MR control system 202 is used to transmit operation information to the MR head-mounted device 206 via an established wireless communication channel.

[0079] In some embodiments, the MR headset 206 can transmit messages / commands to the MR control system 202. For example, in some embodiments, the MR headset 206 can transmit messages containing operating instructions to be transmitted via the MR control system 202 to the semiconductor manufacturing tool 204. The structure of the MR headset 206 is not limited to a headset. The MR headset 206 can be MR projection glasses that can project / project images onto the surface of a display at a specific distance from the operator, or a wearable MR projection device.

[0080] In some embodiments, one or more three-dimensional (3D) models 208 of the semiconductor manufacturing tool 204 are used to image content that can then be displayed using an MR head-mounted device 206. In some embodiments, the 3D model 208 may contain 3D modeling information of various parts or internal components of the semiconductor manufacturing tool 204. The 3D modeling information may include, but is not limited to, spatial coordinates, spatial relationships, object modeling geometry (i.e., polygons and their vertices), shading, object-specific imaging algorithms, clipping, and material filtering. Exemplary parts or internal components may include robotic arms (including their sub-components), lifting pins, slit valves, spray heads, wafer supports (such as platforms, chucks, etc.), indexers, turntables, and the outer walls of the processing chamber. In addition, the 3D model 208 may contain 3D modeling information related to the wafer being processed, such as a model of the wafer. In some embodiments, the 3D model 208 may be formatted based on computer-aided design (CAD) information (such as OBJ format files, FBX format files, etc.) and / or other similar formats.

[0081] In some embodiments, the three-dimensional model (complex model) 208 may be stored in the memory of the MR headset 206 and / or the memory of the MR control system 202. Alternatively, in some embodiments, the three-dimensional model (complex model) 208 may be stored on a server 210, which is used to image one or more of the three-dimensional models (complex models) 208 to the MR headset 206 and / or the MR control system 202 in response to requests. In some cases, it is desirable to have 3D model information of a specific tool stored in the MR control system 202 so that any MR headset can directly obtain 3D modeling information when connected to the MR control system 202. In some embodiments, depending on the object type, the 3D model 208 may image two-dimensional (2D) or 3D objects. For example, the 3D model 208 may image graphical user interface (GUI) elements and 2D numerical data, while simultaneously imaging the physical features of internal parts in 3D form. Both 2D and 3D images can be displayed on a single screen.

[0082] Semiconductor manufacturing tool operation information imaged in an MR environment can be used in a variety of applications.

[0083] For example, as shown in Figures 5A, 5B, 6A-6E and described below, user interface elements indicating sensor data, operating status, etc., of a physical semiconductor manufacturing tool can be imaged in an MR environment so that the physical environment (which may include at least a portion of the physical semiconductor manufacturing tool) is visible during the display of the user interface elements. This type of imaging is sometimes referred to as augmented reality imaging or AR, where the visually imaged object can be graphically overlaid on or annotated with a projection of the physical environment. In some embodiments, the visibility of the graphical user interface (GUI) elements can be configured or modified. For example, the user interface elements can be configured to remain visible in the MR environment even when the wearer of the MR headset moves near the physical environment. Alternatively, the user interface elements can be configured so that their position relative to the physical environment is fixed so that the user interface elements, or a portion thereof, become invisible when the field of view (FOV) changes. For example, an operator can "attach" a GUI element in the MR environment to a part behind a tool. When the operator moves away from the back of the tool (e.g., to the front), this GUI element will disappear from the operator's field of view (FOV). However, when the operator moves back to the back, the operator will see the attached GUI element again.

[0084] For example, as shown in Figures 8A, 8B, 9A, and 9B and described below, 3D images representing the internal components of a semiconductor manufacturing tool can be imaged in an MR environment. Therefore, an MR headset can image a view overlaid with 3D images of these components, so that the 3D representation of these components appears at the same real-world location as the corresponding physical counterpart—even if the physical counterpart is invisible due to being within a sealed chamber. This image presentation allows the wearer of the MR headset to effectively see the interior of the semiconductor manufacturing tool without actually opening it. Because the data is no longer isolated, the ability to image objects in semiconductor manufacturing processes, such as the position of a robotic arm within the tool, the position of a wafer undergoing manufacturing within the tool, and the position of spray nozzles within the processing chamber, helps engineers perform more holistic diagnostics. More precisely, objects are displayed as a whole, including interactions with related components. MR environment

[0085] Mixed reality (MR) environments can broadly refer to a visualization space in which digital objects and / or digital vision are presented or imaged. It should be understood that the term MR environment as used in the text broadly encompasses both augmented reality (AR) environments and virtual reality (VR) environments. Digital objects and / or digital vision can be presented in the AR environment so that they overlap with projections or views of the actual physical environment. In contrast, in a VR environment digital objects and / or digital vision can be presented within a completely virtual environment.

[0086] In certain embodiments, an MR environment is implemented by using an MR head-mounted device. Examples of commercially available MR head-mounted devices include, but are not limited to, MICROSOFT HOLOLENS, SAMSUNG HMD ODYSSEY, MAGIC LEAP ONE, OCULUS RIFT, HTC VIVE, and VALVE INDEX. However it should be understood that embodiments of the present invention may be implemented on any suitable MR imaging device capable of interacting and / or communicating with a semiconductor manufacturing tool.

[0087] The MR head-mounted device may have various cameras and / or sensors for providing information for imaging the MR environment. For example, images with different angles or fields of view (FOV) can be obtained using various cameras, which can be used to determine the orientation of the wearer of the head-mounted device with respect to other objects in the physical space. For further example, various sensors (such as accelerometers, gyroscopes, proximity sensors, etc.) may be used to determine the position of the wearer's head of the head-mounted device, the location of the wearer relative to another object or fixed reference frame, and the current movement of the wearer of the head-mounted device. It should be understood that any suitable conventional techniques for identifying location and / or orientation information may be used in association with the techniques described in the text. Also, a suitable application programmatic interface (API) based on the position and / or bit orientation of the MR head-mounted device that changes the position of the digital object imaged by the MR head-mounted device can be used for the techniques described herein. For example, certain head-mounted device-specific APIs for resolving the location of the head-mounted device (such as the Place Solver API), APIs for determining the head-mounted device's direction of movement (such as the directional solver API), and APIs for capturing the surrounding objects of the head-mounted device (such as the Spatial Perception Mesh API) can be integrated.

[0088] MR headsets can selectively display the user interface elements or other content described herein. When user interface elements or other content are imaged in an MR environment, such graphical user interface (GUI) elements or content can be selected by the user pointing, tapping, or moving virtual objects within the MR environment that display selectable elements or content. In some embodiments, the user can interact with the GUI elements via a handheld controller associated with the MR headset, eye-tracking functionality (e.g., one or more cameras that track the user's gaze, and the MR headset can determine that the user has selected the user interface element if the user's gaze is fixed on the location of the user interface element for a predetermined duration), or voice commands.

[0089] Referring back to Figure 2, from a macro perspective, after the MR headset 206 establishes a connection with the semiconductor manufacturing tool 204 via the MR control system 202, the MR headset 206 will image a GUI for controlling the semiconductor tool 204 and displaying information related to the semiconductor tool 204. During operation, the operator can view various information related to the semiconductor manufacturing tool and issue commands to control various internal components such as robotic arms or gas tanks via the MR headset 206. In some embodiments, location-specific information can be automatically displayed, and the operator can modify and configure the GUI, which is not limited to a single screen. In some embodiments, the MR control system 202 is integrated into the semiconductor manufacturing tool 204, functioning as one of the tool controllers. In some embodiments, the MR control system 202 is located outside the tool controller and communicates with the tool controller via a wired or wireless connection. The MR headset 206 can be connected to the MR control system 202 (or directly to the tool controller) via a wired or wireless connection. Establish a communication channel between the MR head-mounted device and the MR control system.

[0090] Before an MR headset can receive operational information from a semiconductor manufacturing tool or image operational commands onto the tool, it must first establish a communication channel with the tool. Such a communication channel can be established in many ways, and this invention is not limited to any particular such technology.

[0091] According to some embodiments, once a communication channel is established, messages / commands can be transmitted between the MR headset and the MR control system via the communication channel. For example, such messages may contain operational information transmitted from the MR control system to the MR headset. As another example, such messages may contain information transmitted from the MR headset to the MR control system, corresponding to operational instructions to be transmitted from the MR control system to the physical semiconductor manufacturing tool or digital clone. Generally, the digital clone described herein is a virtual copy of a physical semiconductor manufacturing tool with similar controls and programs.

[0092] In some embodiments, the MR control system may have a wireless communication interface (such as WiFi, BLUETOOTH, etc.). In some embodiments, for operation related to the MR control system, the MR headset may need to connect to a wireless access point used by the MR control system to access the wireless network provided by the MR control system. In some embodiments, the MR control system does not broadcast access point information to, for example, prevent devices receiving broadcast access point information from attempting to connect to the access point. In some embodiments, the MR control system encrypts the access point information, and then the MR headset retrieves the encrypted access point information, decrypts it, and then uses the decrypted access point information to connect to the access point.

[0093] For example, in some embodiments, encrypted access point information may be encoded within machine-readable code. The MR headset can decode the machine-readable code and decrypt the encrypted information to obtain the access point information. In other words, in some embodiments, the MR headset can store a decryption key used to decrypt the encrypted information embedded in the machine-readable code. By decrypting the access point information in the machine-readable code and storing the decryption key in the MR headset, verification attempts on access points of devices other than the MR headset that scan the machine-readable code can be avoided.

[0094] Machine-readable codes can be presented statically or dynamically. Examples of machine-readable codes include, but are not limited to, Quick Response (QR) codes, MaxICODE codes, Data MATRIX codes, Code 128 codes, etc.

[0095] Figure 3A shows an example of a process 300 used to establish a communication channel between an MR headset and an MR control system. In some embodiments, the MR headset may execute blocks of process 300. It should be noted that in some embodiments, the blocks of process 300 shown in Figure 3A may be implemented in various sequences, and in some cases, two or more blocks may be implemented simultaneously. Furthermore, in some embodiments, one or more blocks of process 300 may be omitted.

[0096] At point 302, the MR headset receives a command to initiate communication with the MR control system. The command can be received in any suitable manner. For example, the command may correspond to selecting or interacting with a user interface element, detecting a specific voice command (such as "connect") via the microphone of the MR headset, detecting a specific gesture of the wearer of the MR headset, or image scanning via the camera of the MR headset. The user interface element may be, for example, a "connect" button control or menu item imaged by the MR headset. Alternatively, in some embodiments, the command may correspond to the capture of a specific machine-readable code. In some embodiments, the specific machine-readable code may be attached to a semiconductor manufacturing tool or a device communicating with the MR control system, or displayed by the semiconductor manufacturing tool or a device communicating with the MR control system. In yet another example, the command may correspond to physical input received via a button, switch, toggle, or other physical input device communicatively connected to the MR headset, or a portion of the MR headset.

[0097] At point 304, the MR headset uses its camera to acquire image data. For example, the camera of the MR headset can be used to capture image data in response to a received instruction to do so. This can be in response to receiving specific user input and / or in response to the MR headset determining that a machine-readable code falls within the camera's field of view and transmitting such instructions.

[0098] At 306, the MR headset identifies a machine-readable code in the image data acquired at 304. For example, the MR headset can process the image data to identify one or more regions of the image containing the machine-readable code. As another example, the MR headset can identify a portion of the image data with reference or reference marking functions (such as an aiming pattern or alignment pattern within the image data) to facilitate the determination and decoding of the machine-readable code's orientation, position, and / or distance relative to the MR headset's camera. In some embodiments, location information of a specific machine-readable tag (a printed or imaged machine-readable code such as a QR code) is embedded within the machine-readable code. That is, when scanning the machine-readable code, the scanning device (such as an MR headset) will be able to determine its location and orientation relative to the semiconductor manufacturing tool. In some embodiments, the MR headset uses the tag's location information to determine its approximate location near the semiconductor manufacturing tool and uses its camera to adjust the orientation of its field of view.

[0099] At 308, the MR headset decodes the machine-readable code to retrieve encrypted communication information. For example, the MR headset can determine the encoding format associated with the machine-readable code by recognizing a portion of image data indicating the encoding format (e.g., by recognizing a pattern indicator indicating the data type in the machine-readable code). Continuing with this example, the MR headset can then decode the machine-readable code based on the encoding format. The encoding format may indicate whether the information encoded in the machine-readable code contains alphanumeric characters, numeric characters, Kanji, etc. In some embodiments, the MR headset can retrieve the encrypted communication information by generating a string of characters corresponding to the encrypted communication information based on the encoding format. For example, in the case where the encoding format indicates that the data type contains alphanumeric characters, the string of characters may contain a string of alphanumeric characters.

[0100] At point 310, the MR headset decrypts the encrypted communication information to obtain the decrypted communication information. The decrypted communication information may include access point information. For example, access point information may include wireless (such as WiFi, BLUETOOH, etc.) network information such as Service Set Identifier (SSID), wireless network password, etc.

[0101] In some embodiments, the MR headset can decrypt encrypted communication information using a decryption key stored in the MR headset's memory. In some embodiments, such a decryption key can be stored in the MR headset's memory during configuration. For example, a set of decryption keys can be downloaded or activated when an operator logs into an verified account via the MR headset.

[0102] In some embodiments, the algorithms used to encrypt and decrypt communication information may be symmetric algorithms such as the Data Encryption Standard (DES) algorithm, the Triple Data Encryption Standard (3DES) algorithm, or the Advanced Encryption Standard (AES) algorithm. In some embodiments, the algorithms used to encrypt and decrypt communication information may be asymmetric algorithms such as public-key cryptography algorithms, the Rivest-Shamir-Adleman (RSA) cryptographic algorithm, etc. In some embodiments, different communications or messages may use one or more different encryption / decryption algorithms.

[0103] At point 312, the MR headset connects to the access point using decrypted communication information. For example, the MR headset can transmit a password associated with a network identifier to be authenticated to the access point. After connecting to the access point, the MR headset can communicate with the MR control system.

[0104] In some embodiments, at point 314, the MR headset receives user authentication information, such as username and password, corresponding to a user account. In some embodiments, point 314 occurs before other steps in the processing of point 300. In some embodiments, the user account may be a user account associated with the wearer of the MR headset for interacting with the MR control system. For example, in some embodiments, the user account may be associated with one or more access permission levels; the permission level may govern whether the user is allowed to perform various actions to interact with the MR control system or semiconductor manufacturing tools. In some embodiments, such actions may include transmitting various operational instructions to the physical semiconductor manufacturing tools. In some embodiments, such operational instructions may include changing the position of parts of the physical semiconductor manufacturing tools, initiating an operation, changing the setpoint, or changing the value of other parameters. In some embodiments, the MR control system may use the permission level associated with the user account to block the execution of operational instructions that are not permitted based on the user account's permission level.

[0105] In some embodiments, permissions can be stored based on user roles associated with user accounts within the organization. Examples of such roles include "Process Engineer" and "Technician." For instance, all users with the "Process Engineer" role assigned to their user accounts may be granted permission to interact with the MR control system, allowing them to adjust various parameters related to how a specific semiconductor manufacturing process is performed. However, such users may not be permitted to interact with the MR control system to initiate maintenance procedures, such as opening maintenance access doors or starting calibration routines. Conversely, users with the "Maintenance Technician" role may be granted permission to perform maintenance-related tasks involving semiconductor manufacturing tools, but may not be permitted to modify parameters related to how the tools are used for a specific semiconductor process.

[0106] In some embodiments, user authentication information may include a user name and / or user identification information (such as a password, PIN, biometric information, etc.), which can identify or verify the identity of a user associated with a user account.

[0107] In some embodiments, the instruction for a user name can be received via the MR headset. For example, in some embodiments, the MR headset can be used to provide a stored list of user names (as in a drop-down menu). The operator wearing the MR headset can then select a user name from the stored list of user names. In some embodiments, the MR control system can send a stored list of user names associated with a specific semiconductor manufacturing tool to the MR headset.

[0108] In some embodiments, user identification information can be received using explicit user input via the MR headset. For example, a password or PIN can be received via a user interface imaged by the MR headset. Alternatively, in some embodiments, user identification information can be automatically captured by the MR headset. For example, in some embodiments, biometric data such as retinal image data can be automatically captured by the camera of the MR headset.

[0109] It should be noted that in some embodiments, both the user's name and user identification information can be used to verify the user's account. Alternatively, in some embodiments, such as when biometric data is used as user identification information, the user identification information is used to identify both the user's name and the user. For example, a retinal image that functions similarly to a fingerprint can uniquely identify a user; therefore, a retinal image can have the dual function of indicating both the user's name and user identification information that can be used to verify the individual to be verified.

[0110] In some embodiments, at 316, the MR headset verifies the user's account using user authentication information. In some embodiments, 316 is performed after 314 but before one or more steps in process 300. For example, the MR headset verifies the user of the MR headset using user authentication information and / or user identification information. The user credentials can then be transmitted to the MR control system. As another example, in some embodiments, the MR headset transmits user authentication information to the MR control system, which then verifies the user by comparing the received user authentication information with user authentication information stored in the MR control system.

[0111] After verifying the user's account, the user is then authorized via the MR headset to perform actions and / or view content as permitted by the user account. In some embodiments, the user can control and view the status of multiple different semiconductor manufacturing tools through their user account. In some embodiments, the multiple different semiconductor manufacturing tools are of different types, such as different etching and deposition tools.

[0112] In some embodiments, blocks 314 and 316 may be omitted. For example, in some embodiments, a communication channel may be established between the MR headset and the MR control system without verifying the specific user account of the user of the MR headset.

[0113] Figure 3B shows an example of a process 350 used to establish a communication channel between the MR headset and the MR control system. The MR control system can execute blocks of process 350. It should be noted that in some embodiments, the blocks of process 350 shown in Figure 3B can be executed in various sequences, and in some cases, some blocks are executed simultaneously. Furthermore, in some embodiments, one or more blocks of process 350 may be omitted.

[0114] At 352, the MR control system receives a request to image a machine-readable code. This request can be received from the MR headset. For example, in some embodiments, the MR headset can respond to a selectable button or input selected on the MR headset as described above with reference to block 302 of FIG3A, transmitting a request for a machine-readable code.

[0115] At point 354, the MR control system displays a machine-readable code on, for example, a display screen associated with the MR control system. As described above with reference to Figure 3A, the machine-readable code may contain information related to an access point used by the MR control system to provide access to the wireless network provided by the MR control system. For example, the information may include encrypted communication information, such as an access point identifier, a password associated with the access point, etc.

[0116] In some embodiments, at point 356, the MR control system determines that the MR headset has been connected to the access point. For example, in some embodiments, the MR control system may determine that the MR headset has been authenticated by the access point using a password contained in information encoded in machine-readable code. In some embodiments, block 356 may be omitted.

[0117] In some embodiments, at point 358, the MR control system receives an indication from the MR headset indicating that the user of the MR headset has been verified using a user account. In some embodiments, as described above with reference to blocks 314 and 316 of FIG. 3A, the user account may be associated with various permissions or access restrictions. In some embodiments, the MR control system may receive an indication for a specific user account. In some embodiments, the MR control system may determine the permissions or access restrictions associated with the user account. Using a mixed reality (MR) head-mounted device with an MR control system

[0118] After establishing a communication channel between the MR headset and the MR control system of a specific semiconductor manufacturing tool, the MR headset can interact with the MR control system of the semiconductor processing tool, such as imaging or displaying the user interface and / or operating data of the semiconductor processing tool.

[0119] Figure 4 shows an example of an information flowchart 400 for controlling a semiconductor tool in an MR environment according to certain embodiments. As shown, the blocks of the information flowchart 400 are executed by the MR headset and the MR control system. It should be noted that in some embodiments, the blocks of the information flowchart 400 shown in Figure 4 can be executed in various sequences, and in some cases, some blocks are executed simultaneously. Furthermore, in some embodiments, one or more blocks of the information flowchart 400 may be omitted.

[0120] At point 402, a communication channel is established between the MR headset and the MR control system used to operate the semiconductor manufacturing tool. As described above with reference to Figure 2, the MR control system can communicate with the physical semiconductor manufacturing tool. Alternatively, as described below with reference to Figure 10, the MR control system can communicate with a digital replica of the physical semiconductor manufacturing tool.

[0121] The communication channel enables the MR headset to transmit and receive messages from the MR control system. Exemplary protocols that can be used for the communication channel include Telemetry Transport (MQTT) and Hypertext Transfer Protocol (HTTP). Note that more detailed technical aspects of establishing such a communication channel can be understood by referring to the illustrations and explanations in Figures 3A and 3B.

[0122] In some embodiments, the MR headset determines its physical position and / or orientation at point 404. It should be noted that block 404 may be omitted in some embodiments.

[0123] The physical position and / or orientation of the MR head-mounted device can be based on information obtained by the head-mounted device from the cameras of one or more MR head-mounted devices and / or one or more sensors of the MR head-mounted device (such as accelerometers, gyroscopes, proximity sensors, etc.).

[0124] In some embodiments, physical location and / or orientation may include location and / or orientation relative to a reference frame, which may be located at a fixed position relative to the physical environment. In some embodiments, the reference frame may be determined based on various references or reference markers detected in the physical environment by one or more cameras or sensors of the MR headset. Such references or reference markers may correspond to various physical landmarks in the physical environment. Examples of physical landmarks include a portion or feature of a physical semiconductor manufacturing tool, machine-readable code attached to a portion of a physical semiconductor manufacturing tool, etc. In some such embodiments, the location and / or orientation relative to a physical landmark may be determined based on image data captured by a camera of the MR headset that includes at least a portion of the physical landmark.

[0125] In some embodiments, at 406, the MR headset requests operational information related to semiconductor manufacturing tools from the MR control system. In some embodiments, the MR headset may request operational information based on user input received via the MR headset. In some embodiments, the MR headset may share its physical / orientation location determined at 404 with the MR control system. For example, as shown and described with reference to Figures 5A and 6A-6E below, user input may correspond to the selection of one or more user interface elements imaged by the MR headset. As another example, as shown and described with reference to Figures 5A and 7 below, user input may correspond to captured (e.g., via a camera of the MR headset) machine-readable code-associated image data, which has been pre-associated with a specific set of operational information.

[0126] It should be noted that in some embodiments, block 406 may be omitted. For example, block 406 may be omitted in cases where the MR control system automatically transmits specific operational information (such as in response to requests from the MR headset).

[0127] At point 408, the MR control system acquires sensor data representing sensor outputs from the semiconductor manufacturing tool. The sensor data may include data from temperature sensors, pressure sensors, position sensors (such as encoders), motion sensors (such as accelerometers), or any other type of sensor associated with the semiconductor manufacturing tool. The sensor data may include multiple sensor values ​​acquired at a series of time points. The sensor data may include sensor outputs from multiple sensors, which may be of different types and / or associated with different parts or components of the semiconductor manufacturing tool.

[0128] At point 410, the MR control system will transmit the operational information obtained at point 408 to the MR headset.

[0129] In some embodiments, the operational information may be at least partially based on sensor data representing sensor output from a semiconductor manufacturing tool. For example, in some embodiments, the operational information may be sensor data obtained at block 408 or a portion of sensor data obtained at block 408. As another example, in some embodiments, the operational information may include the status of one or more components of the semiconductor manufacturing tool determined based on the sensor data. For example, the operational information may include indications of the status of specific components (such as whether a valve is open or closed, the current position of the robotic arm, the current speed of the robotic arm's movement, the current gas flow rate, the current pressure within the module, temperature information, etc.). Even further, in some embodiments, the operational information may include the status of one or more wafers being manufactured, such as whether the wafer is in a specific processing chamber, whether the wafer is held by an electrostatic chuck, or not.

[0130] In some embodiments, the operational information may include an indication of the current state of the semiconductor manufacturing tool, or an indication of the current state of one or more components of the semiconductor manufacturing tool. For example, the operational information may indicate an ongoing processing or formulation step. As another example, the operational information may indicate an error state of a specific component. In some embodiments, the error state may be determined based on sensor data obtained at block 408. For example, the error state may be determined based on whether the value received by a specific sensor exceeds the normal operating range. In some embodiments, the error state may be determined based on the operational state of the sensors. For example, an alarm may be generated when one or more sensors send information at irregular frequencies or send information indicating that the tool has a contradictory or highly improbable operational state (e.g., indicating extremely high pressure but also indicating that the airlock is open).

[0131] At 412, the MR headset receives operational information related to semiconductor manufacturing tools from the MR control system. As described in block 402, the operational information can be received via a communication channel established between the MR headset and the MR control system.

[0132] At 414, the MR headset images content related to a semiconductor manufacturing tool and / or one or more control features. The content may be based on operational information received at block 412. For example, as shown and described with reference to Figures 5A and 6A-6E below, the content may include one or more user interface elements, such as display windows, with certain control tags for specific parts within the physical semiconductor manufacturing tool. The content may further include operational information (such as sensor values, current operating status, etc.) related to one or more parts within the physical semiconductor manufacturing tool. As another example, as shown and described with reference to Figures 8A, 9A, and 9B below, the content may include an image of one or more internal components of the physical semiconductor manufacturing tool that overlaps with the visible portion of the physical semiconductor manufacturing tool in presentation. Even more, as another example, as shown and described with reference to Figure 11A below, the content may include a three-dimensional image of a digitally replicated part or element imaged by the MR headset in the MR environment.

[0133] In some embodiments, the content may include one or more control features. The control features may be selective user interface elements that, when selected, allow operation commands to be transmitted from the MR headset to the MR control system. The MR control system then allows commands to be transmitted to a semiconductor manufacturing tool, causing the tool to change its state based on the operation commands. Examples of operation commands may include initiating a specific process or simulating a specific process, setting or modifying specific parameters or setpoints, etc.

[0134] It should be noted that the transmission of operation commands may depend on permissions associated with the user account related to the MR headset and tool control product. In some embodiments, such permissions may be stored in a manner associated with the user account. For example, in some embodiments, operation commands (such as causing a semiconductor manufacturing tool operated by the MR control system to perform an operation) may be prohibited or blocked in response to the determination that the user associated with the user account is not authorized to perform the corresponding operation. In some embodiments, the MR control system may prohibit the execution of unauthorized operation commands based on permissions associated with the user account. Furthermore, or alternatively, in some embodiments, the MR headset may prohibit the transmission of unauthorized operation commands to the MR control system based on permissions. Imaging user interface elements that display operational information for semiconductor manufacturing tools in an MR environment.

[0135] After establishing a communication channel between the MR headset and the MR control system, the MR headset and MR control system can be used to image a representation of a user interface element. This representation indicates operational information of the semiconductor manufacturing tools in the MR environment and / or corresponds to control features associated with those tools. The user interface element can be imaged in the MR environment or, in some cases, in the AR environment, making the physical semiconductor manufacturing tools visible behind or near the virtual user interface element. This interface representation allows the wearer of the MR headset to access current operational information and / or control features related to the semiconductor manufacturing tools, while simultaneously moving around the physical environment where the tools are located and viewing various parts of the semiconductor manufacturing tools.

[0136] The MR headset receives operational information from the MR control system, such as sensor values ​​and status information of various components. The MR control system receives sensor values ​​and status information from semiconductor manufacturing tools. The MR headset then images the user interface element, which indicates the received operational information, within the MR environment. For example, the user interface element can be imaged so that the physical environment is visible behind and near it. Furthermore, the MR headset can image the user interface element so that the wearer can redefine its size and / or position. For example, the user can virtually grasp or pinch the user interface element to redefine its size or position.

[0137] Furthermore, user interface elements, such as display panels, can be configured to be fixed in position relative to a specific reference frame. For example, a wearer of an MR headset can configure a user interface element to be positioned at a specific location relative to other user interfaces. That is, if the first interface element moves, the second interface element will also move to maintain its position relative to the first interface element. As another example, a particular user interface element may include one or more position elements selectable by the wearer of the MR headset, indicating the reference frame to which the particular user interface element is to be fixed.

[0138] For example, user interface elements can be positioned at a specific fixed location relative to the projection of the physical / real environment. For instance, when a user interface element (such as an information display panel) is positioned at a specific fixed location relative to the physical environment, the MR headset can determine whether a set of spatial coordinates defining the boundary of the user interface element falls within the field of view (FOV) of the MR headset. Continuing this example, in response to the determination that the set of spatial coordinates does not fall within the current FOV of the MR headset, the user interface element will not be visible from the current FOV. Specifically, when a user interface (UI) element is fixed at a position 30 degrees to the left of a reference mark in the physical environment (such as the edge or corner of a physical manufacturing tool, the edge or corner of a specific machine-readable code fixed to the external part of the physical manufacturing tool, etc.), the MR headset can identify the spatial coordinates defining the boundary of the user interface element relative to the physical environment. Continuing this example, if the MR headset rotates 180 degrees so that it no longer sees the reference mark 30 degrees to the left of the physical environment (and therefore no longer faces the user interface elements which are configured in a fixed position), the MR headset can determine that the spatial coordinates defining the boundaries of the user interface elements no longer fall within the current field of view of the MR headset (after it has rotated 180 degrees), and therefore will not display the user interface elements in the current field of view. In this particular example, if the MR headset only partially rotates away from the reference mark (e.g., 90 degrees to the left), the UI elements will still be in the new field of view, but their position relative to the new field of view will change (e.g., move from the left side of the screen to the right side of the screen).

[0139] For example, user interface (UI) elements can be configured to be positioned at a specific, fixed location relative to the field of view of the MR headset. For instance, when the wearer of the MR headset moves near the physical environment or changes orientation within the MR environment, such UI elements can "follow" the wearer. For example, if the UI element is configured to be positioned 30 degrees to the left of the center of the field of view, the UI element can remain at that position regardless of the position and / or orientation of the MR headset relative to the physical environment.

[0140] Figures 5A, 5B, 6A-6E, and 7 relate to UI elements for imaging instruction operation information and / or control features in an MR environment. Figure 5A shows an example of a process 500 that can be implemented by an MR headset. Figure 5B shows an example of a process 550 that can be implemented by an MR control system. Figures 6A-6E show illustrative views from the perspective of a wearer of an MR headset related to one or more steps shown in Figures 5A and 5B. Figure 7 shows an illustrative configuration interface for configuring information to be imaged by the MR headset.

[0141] Returning to Figure 5A, an exemplary process 500 for imaging a user interface element and receiving operation commands is shown according to certain embodiments. The user interface element indicates operation information of a semiconductor manufacturing tool, and the operation commands are executed by the semiconductor manufacturing tool. The MR headset can perform blocks of process 500. One or more steps of process 500 will be described below using the exemplary areas shown in Figures 6A-6E. It should be noted that the blocks of process 500 may be performed in a sequence other than that shown in Figure 5A. Furthermore, or alternatively, in some embodiments, one or more blocks of process 500 may be omitted.

[0142] At point 502, the MR headset establishes a communication channel with the MR control system used to operate the semiconductor manufacturing tools. In some embodiments, point 502 is described using the relevant illustration in Figure 3A.

[0143] After a communication channel is established between the MR headset and the MR control system, the user interface is imaged in an AR environment according to certain embodiments of the present invention. Figure 6A shows an exemplary view 600 from the perspective of an operator wearing the MR headset after the communication channel has been established.

[0144] As shown, view 600 may include one or more UI elements, such as menu panel 602 and operation information selection input 604, imaged in an AR environment according to certain embodiments of the present invention. In some embodiments, selecting elements within menu panel 602 allows the user to adjust one or more settings, such as the appearance of the UI elements presented by the MR headset, the volume level of the sound presented by the MR headset, etc. In some embodiments, selecting operation information selection input 604 allows the content of various operation information groups to be presented via the MR headset. It should be noted that the virtual UI elements are presented in a manner that overlays a projection of the physical environment so that the physical environment is visible in view 600. Although view 600 shows that the UI elements are overlaid on a projection of the physical environment, in some embodiments, the UI elements may be presented in the same plane as one or more background projections. That is, the UI elements may appear adjacent to one or more projected background parts. In some embodiments, one or more UI elements may be presented and associated with different parts projected in the field of view. For example, one or more sub-components in the background of view 600 may have menu panels displayed adjacent to them, enabling part-specific views and / or controls via a main toggle or automatic method. In some embodiments, the UI element is opaque, thus completely blocking background details that overlap with it. In some embodiments, one or more UI elements may have different degrees of transparency, ranging from opaque to nearly completely transparent. Using UI elements with different degrees of transparency makes the user interface more immersive, thereby improving the operational efficiency of semiconductor tools. When the sub-component is located within an internal component (or the internal component surrounds the target component), the operator no longer needs to search for it because such information and control panels can be presented graphically in a single view.

[0145] In some embodiments, selecting UI element 605 can fix the control panel 601 (and thus UI elements 602 and 604) relative to the position of the semiconductor manufacturing tool in the physical environment.

[0146] Referring back to process 500 in Figure 5, in some embodiments, at 504, the MR headset identifies the physical location and / or orientation of the MR headset. In some embodiments, the physical location and / or orientation may be relative to a physical semiconductor manufacturing tool or a portion thereof. For example, the physical location and / or orientation of the MR headset may be determined relative to machine-readable codes fixed to a portion of the physical semiconductor manufacturing tool, relative to physical landmarks, or reference marks of the physical semiconductor manufacturing tool (such as specific screws, specific edges), etc.

[0147] The physical position and / or orientation of an MR headset can be determined using one or more cameras and / or one or more sensors (such as accelerometers, gyroscopes, etc.). In some embodiments, the physical position and / or orientation of the MR headset can be determined by updating the previously determined physical position and / or orientation based on the direction and speed of motion indicated by one or more cameras and / or one or more sensors.

[0148] It should be noted that in some embodiments, block 504 may be omitted. For example, in cases where the user interface elements are not presented relative to the field of view of the MR headset, the MR headset may not use physical position and / or orientation information. Therefore, in some embodiments, block 504 may be omitted.

[0149] In some embodiments, at point 506, the MR headset receives a first input requesting the display of certain operational information related to the semiconductor manufacturing tool. It should be noted that in some embodiments, the operational information may be grouped into various / multiple sets of operational information. One set of operational information may contain data related to similar parts or components (such as sensor data). For example, a set of operational information may contain sensor outputs from pressure sensors associated with various gas locks of the semiconductor manufacturing tool. In another example, a set of operational information may contain multiple sensor outputs from a single processing chamber of the semiconductor manufacturing tool. In yet another example, a set of operational information may contain multiple sensor outputs from similar sensors or sensors in multiple processing chambers of the semiconductor manufacturing tool (such as the same platform temperature sensor present in each processing chamber of the semiconductor manufacturing tool).

[0150] In some embodiments, one or more inputs may include the capture of image data (via a camera of an MR headset), the captured image data including a machine-readable code associated with a set of operating parameters, such as a QR code affixed to a processing chamber or displayed on a display screen of a semiconductor manufacturing tool. In some such embodiments, the machine-readable code may be affixed to an external portion of the semiconductor manufacturing tool and / or may be presented via a display of a device executing the MR control system. In cases where the input includes the capture of image data containing a machine-readable code, the MR headset may decode the machine-readable code to obtain an identifier embedded within the machine-readable code. In some embodiments, the identifier is uniquely associated with a specific set of operating parameters for at least one or more components of the semiconductor manufacturing tool communicating with the MR control system.

[0151] Additionally or, in some embodiments, the input may include selecting one or more selectable inputs (such as command tabs displayed in a virtual control panel) of the user interface elements imaged by the MR headset.

[0152] For example, referring to Figure 6A, responding to the operation information selection input 604, a virtual panel of available operation information groups can be displayed via MR head-mounted imaging.

[0153] Figure 6B shows an illustrative view 620 of an I / O card list 606 (which may be referred to as menu 606) containing groups of available operational information. It should be noted that each of the "I / O cards" shown in Figure 6B (listed in the rectangular panel below the I / O card list 606) corresponds to a set of operational information. It should be understood that these I / O cards are presented as examples and may refer to different functions or features within a semiconductor manufacturing tool using different names. As shown, the I / O card list 606 indicates available control groups corresponding to the following: "Pneumatic Lock Analog Input," "Platform Status," "Door Can Close Safely," and "Platform Pressure." Note that the groups of available operational information shown in the I / O card list 606 are merely illustrative; other groups of operational information may be presented in the menu in addition to those shown in Figure 6B, or other groups of operational information may be presented in the menu instead of those shown in Figure 6B. Furthermore, the I / O card list 606 can be updated based on the selections of one or more users. For example, I / O card list 606 can correspond to a multi-level menu structure, so when the multi-level menu structure is traversed, the controls presented in relation to I / O card list 606 change. As a more specific example, I / O card list 606 may initially present various controls corresponding to "parent level" options. Continuing with this more specific example, in response to the selection of a specific control from a "parent level" option, I / O card list 606 can expand to display sub-level controls or information corresponding to "child level" options nested under the selected "parent level" option.

[0154] The I / O card list 606 additionally includes a "Follow Me" input 607. In some embodiments, selecting the "Follow Me" input 607 keeps the I / O card list 606 fixed at a specific viewing position within the operator's field of vision, regardless of changes in the position and orientation of the MR headset. For example, if the I / O card list 606 is initially presented at a position 30 degrees to the left of the center of the MR headset's field of vision and the "Follow Me" input 607 has been selected, the I / O card list 606 will remain presented at 30 degrees to the left of the center of the field of vision even if the position / orientation of the MR headset changes. In some embodiments, the viewing size and resolution of the UI element (such as the I / O card list 606) remain the same as the operator moves closer to or away from the target object in the background. In some embodiments, when the UI element is instructed not to follow or is fixed in a space relative to the projected background, the viewing size and resolution of the UI can change depending on the distance between the operator and the target object in the background. For example, the viewing size of a UI element (such as I / O card list 606) can be reduced when the operator moves away from the target object. Conversely, the viewing size of the UI element can be increased up to a predetermined size limit when the operator moves closer to the target object. It should be noted that any user interface element (such as a display panel) imaged by an MR headset may include such a "follow me" function.

[0155] As shown, exemplary view 620 includes a connection panel 622. In some embodiments, connection to the MR control system can be facilitated by, for example, accessing an Internet Protocol (IP) address or computer name of a particular control system. In some embodiments, an MR headset can connect to multiple MR control systems in a single session via connection panel 622. As described above with reference to FIG2, the connection can be MQTT, HTTP, Extensible Messaging and Presentation Protocol (XMPP), Restricted Application Protocol (CoAP), or other protocols.

[0156] Referring to the processing 500 in the reference section, in some embodiments, at 508 the MR headset can request a set of operational information from the semiconductor manufacturing tool from the MR control system. In the case where the input received at block 506 is the selection of one or more selected user interface elements, the MR headset can request the indicated set of operational information by transmitting the selected user interface element to the MR control system. For example, if the selected user interface element corresponds to "Platform Pressure" from the menu of available operational information sets shown in FIG. 6B, the MR headset can transmit a command to the MR control system to select the "Platform Pressure" element from the menu.

[0157] In the case where the input received at block 506 is image data containing machine-readable codes such as QR code scans, the MR headset can transmit the decoded identifier retrieved from the machine-readable code to the MR control system. In some embodiments, upon receiving a command from the MR headset, the MR control system can then identify a set of operational information associated with the identifier.

[0158] At point 510, the MR headset receives operational information from the MR control system.

[0159] It should be noted that in some embodiments, blocks 506 and 508 may be omitted. For example, in some embodiments, the MR headset may receive an operation information stream at block 510, and the MR control system may transmit the operation information stream to the MR headset without requiring a request from the MR headset. Such operation information streams may contain information related to the operational status of semiconductor manufacturing tools that is considered important: the operational status-related content can be presented by the MR headset regardless of whether the wearer of the MR headset explicitly requests it. Such operational status information may include information indicating the error status of one or more components, hazardous conditions, connectivity or signal strength / error information, information related to user permission, location-specific operating instructions (such as rules related to a specific factory), etc.

[0160] After receiving the operation information at point 510, the MR headset displays the received operation information at point 512 and presents it to the user. In some embodiments, the MR headset may display UI elements, which may include one or more text windows, virtual grids, virtual tables, virtual indicators (such as virtual indicator lights, checkboxes, option buttons, etc.), or other elements that can reflect the data or information received at point 510. It should be noted that the data or information presented in the user interface elements may be substantially real-time data or information. For example, the data or information may correspond to the current or most recent sensor values ​​of sensors associated with semiconductor manufacturing tools, such as data that is immediately presented to the user as soon as the MR headset becomes available (there may be some time lag between the time when the numerical or complex value is obtained and the time when the value is finally received by the MR headset due to transmission delay).

[0161] In some embodiments, the MR headset can format the received operational information set in any suitable manner. For example, a UI notification indicating an error or abnormal state may be presented visually (e.g., in red, flashing, or glowing to draw attention to an error state). Alternatively, a UI notification indicating that a component's sensor value or state is currently active or available may be presented visually (e.g., in green, associated with an inspection mark).

[0162] Figure 6C shows an exemplary view of how operational information is displayed via an MR headset. In Figure 6C, view 630 shows an I / O card 608, which displays received operational information related to pressures associated with various components of the semiconductor manufacturing tool (such as pressures in one or more chambers, pressures in one or more gas locks, etc.). The I / O card 608 is a pop-up panel linked to the "Platform Pressure" control shown in the parent I / O card list 606. In some embodiments, the I / O card 608 is displayed in response to selection of one or more controls (such as check boxes in the "Platform Pressure" control) on the parent I / O card list 606. As shown, the I / O card 608 contains descriptions of various components in the semiconductor manufacturing tool and their associated pressure gauges 610, which indicate the pressure detected for each component. In some embodiments, the unit of measurement can be changed, and this change subsequently alters the value displayed on the pressure gauge 610. In some embodiments, the UI panel (e.g., I / O card 608) may have one or more nested sub-components, so that clicking on a displayed component expands the list and opens the description and associated sensor values ​​of that sub-component. In some embodiments, components (e.g., I / O card 608 or I / O card list 606) are pre-configured and fixed to be displayed in the UI window. In some embodiments, the components displayed in the UI window are dynamic. That is, in some embodiments, the MR headset or MR control system may use certain conditions or rules to determine which components should be displayed closer to the top of the list (i.e., dynamically arranging the display order), or which components should be hidden if the list is extremely long, or which components should be placed on the first or second page of display. Such conditions or rules may include, but are not limited to, the following considerations: the location of the MR headset, the physical proximity of the MR headset to one or more areas of the tool, the usage rate of one or more components or sub-components, the probability of failure, or the criticality to certain processes. For example, when the operator looks directly into the processing room, the UI window can first list the pressure information of the parts that are physically closer to the operator and then list the pressure information of the parts that are physically farther away from the operator.

[0163] Figure 6D shows an exemplary view 640 including I / O card 612, which displays the current status of multiple components in individual status blocks 614. For example, Figure 6D shows that the gas lock 1 system is in the "pumped" state and the AtmArm (atmospheric arm) system is in the "standby" state. Similar to the function described with reference to Figure 6C, the order of the components can be pre-configured or dynamic. Furthermore, the status blocks 614 can be updated frequently (e.g., in real-time status confirmation updates at set intervals) or based on the occurrence of events.

[0164] Referring to the processing 500 in Figure 5A, at point 514, the MR headset can selectively update UI elements based on the position or orientation of the MR headset, or based on the presentation settings of certain UI elements.

[0165] In some embodiments, the presentation of UI elements can be updated based on user input received via the MR headset. In some embodiments, the size of UI elements can be modified based on user input that resizes the UI elements. For example, the size of a UI element can be enlarged in response to receiving certain user input (such as pinching or pulling the UI element). In another more specific instance, the position or orientation of certain UI elements can be modified based on received user input. In a particular embodiment, in some embodiments, a user can move a UI element by grasping it and placing it at different locations within the MR environment. In some embodiments, a user can also change the orientation of one or more UI elements relative to the user's field of view within the MR environment. For example, in some embodiments, a user can tilt a UI window by pushing one side away from the user's viewpoint, such as a door with a hinge on one side, causing the UI window to swing away (or move away from) the user's viewpoint. Although some objects in the UI window shown in FIG6C are imaged in two-dimensional (2D), embodiments of the present invention can move these objects into three-dimensional (3D) space as shown in the examples above. This capability increases the customization options for the GUI of semiconductor manufacturing tools, allowing operators to create scene-based UIs in a short time. In some embodiments, UI windows and panels are imaged in 3D.

[0166] For example, the position or orientation of UI elements can be updated based on changes in the position or orientation of the MR headset. For instance, when UI elements are set to be fixed in position relative to the physical environment, the user interface elements can be imaged at different positions or angles relative to the user's viewpoint based on the position or orientation of the MR headset.

[0167] In some embodiments, the presentation of operational information can be updated based on updated information received from the MR control system. For example, the sensor readings shown in FIG6C can be updated to indicate more recently received sensor data.

[0168] In some embodiments, the representation of user interface elements may be updated based on a combination of user input (multiple inputs), changes in the position or orientation of the MR headset, and / or updated operational information.

[0169] Returning to Figure 6E, illustrative view 650 shows block 614 updating the status of I / O card 612 previously shown in Figure 6D in response to a command issued to the semiconductor tool. As shown, the state of gas lock 1 is changed in block 615, indicating that the state of gas lock 1 has changed from "pumped" (as shown in Figure 6D) to "ventilated" (as shown in Figure 6E). In some embodiments, the command is issued from the MR headset. In some embodiments, the command is issued from a system independent of the MR headset and MR control (such as on-board control from the semiconductor manufacturing tool).

[0170] Referring back to the processing 500 in Figure 5A, in some embodiments, block 514 may be omitted. For example, in cases where no user input is received that changes the position, size, or orientation of the user interface element, no updated operation information is received, and the position or orientation of the MR headset remains unchanged, the representation of the user interface element can remain unchanged. Therefore, block 514 may be omitted in such instances.

[0171] In some embodiments, the MR headset returns to block 504 and identifies the updated physical location and / or orientation of the MR headset. The MR headset then continues to receive operational information and displays user interface elements indicating the operational information.

[0172] After step 512 or 514, process 500 may selectively move to block 516, where the MR head-mounted device may receive a second input corresponding to an operation instruction or command for the semiconductor manufacturing tool. Examples of operation instructions / commands include, but are not limited to, starting or stopping a specific process or process step, changing the state of a specific component (such as initiating ventilation of a specific airlock, closing a specific door, etc.).

[0173] In some embodiments, the MR headset may receive a second input as a selection of one of the control features imaged by the MR headset. For example, the control feature may correspond to pressing a button to initiate an operation command (such as pressing a button labeled "Start Ventilation"). In some embodiments, the second input may be an operation command given via voice command. In some embodiments, the imaged control feature may be based on the process / part being accessed. For example, when a user is viewing a specific processing chamber and clicking on the platform pressure, the MR headset may generate "pumping" and "ventilation" controls based on the status and / or pressure value associated with the specific process.

[0174] At point 518, the MR headset transmits the received commands or operating instructions to the MR control system. The MR control system then enables the semiconductor manufacturing tool to perform the activities received from the operating instructions.

[0175] Figure 5B illustrates an exemplary process 550 for controlling a semiconductor manufacturing tool in an MR environment, which can be executed by the MR control system of the present invention according to certain embodiments. The steps of process 550 can be performed by the MR control system. It should be noted that one or more steps of process 550 may not be performed in the order shown in Figure 5B. Furthermore, or alternatively, in some embodiments, steps of process 550 may be omitted.

[0176] At point 552, the MR control system acquires sensor data representing sensor outputs from the semiconductor manufacturing tool. The sensor data can be sensor outputs from any sensor within the semiconductor manufacturing tool, such as a temperature sensor, pressure sensor, optical sensor, position sensor, motion sensor (e.g., accelerometer, gyroscope, etc.), or a combination thereof. Sensor data can be acquired from multiple sensors, where the multiple sensors are different types of sensors and / or associated with different parts of the semiconductor manufacturing tool.

[0177] At point 554, the MR control system can receive requests for operational information from the MR headset or other control platforms (such as on-board control systems of semiconductor manufacturing tools). As described above with reference to blocks 506 and 508 of FIG5A, such requests can be received via selecting a user interface element imaged on the MR headset, capturing machine-readable codes via the MR headset, or via voice commands from the operator of the MR headset. In some embodiments, block 554 may be omitted. For example, in cases where the MR control system continuously or periodically transmits a stream of operational information regardless of whether the MR headset explicitly requests operational information, block 554 may be omitted.

[0178] At point 556, the MR control system transmits operational information to the MR headset, at least in part, based on the sensor data obtained at step 552. In some embodiments, the MR control system may identify the operational information based on a request received at step 554. For example, the MR control system may identify a set of operational information associated with machine-readable codes captured by the MR headset.

[0179] At point 558, the MR control system can receive commands or operational instructions from the MR headset or other control platform that are to be executed by the semiconductor manufacturing tools. As described above with reference to block 516 of Figure 5A, the operational instructions can correspond to starting or stopping a specific process or process step, changing the state of a specific component, etc.

[0180] At 560, in some embodiments, the MR control system transmits tool commands to the semiconductor manufacturing tool to change the state of the tool, wherein the commands are based on the commands or operating instructions received at step 558. In some embodiments, the MR control system transmits tool commands via a wired connection. In some embodiments, the MR control system transmits tool commands wirelessly.

[0181] In some embodiments, a set of operational information can be configured via a user interface. Such a user interface is presented by the MR control system to configure a set of operational information presented by an MR headset communicating with the MR control system. In some embodiments, the set of operational information can be configured by selecting one or more variables included in the set of operational information. Each parameter may represent an operating state of a physical semiconductor manufacturing tool or a sensor output, wherein the value of the parameter can be transmitted to the MR headset communicating with the MR control system.

[0182] Figure 7 shows an exemplary configuration interface 700 according to certain embodiments. The configuration interface 700 can be used to configure information and UI elements for imaging in an MR headset. Referring back to Figure 2, in some embodiments, the configuration interface 700 can be accessed via an MR control system 202, an MR headset 206, a server 210, or an on-board control system of a semiconductor tool.

[0183] As shown, the configuration interface 700 may include a group identifier 702 that indicates the functionality or characteristics of a specific group of tools. In the example shown, the group identifier 702 displays "Platform Stress," which corresponds to "Platform Stress" shown in the I / O card list 606 in Figure 6B.

[0184] The configuration interface 700 further includes a panel 704 indicating the available variables included in the set of tool functions or features. For example, panel 704 includes a parameter 706 referred to as "airlock1 / airlock1-slot1out / disableevents". Furthermore, panel 704 may include an alias for each parameter. For example, the alias 708 for parameter 706 is "airlock1-slot1out / disableevents".

[0185] In some embodiments, each parameter included in panel 704 may be associated with variable update parameter 710. In some embodiments, variable update parameter may be set as "state parameter" or "controllable parameter". "State parameter" generally refers to a variable or value that is a measured value or a measured state and cannot be modified by the user. In contrast, "controllable parameter" generally refers to a variable or value that can be set by the user.

[0186] Configuration interface 700 includes an add button 712. In response to selecting add button 712, the variable selected in panel 704 can be included in selected variable panel 714. Selected variable panel 714 indicates that a variable has been selected as associated with the group of identifiers 702.

[0187] In some embodiments, a selected set of variables in variable panel 714 may be associated with a machine-readable code, such as a QR code as shown in FIG7. In some embodiments, a machine-readable code may be selected or generated in configuration interface 700. QR code 716 is an example of a machine-readable code that has been programmed and associated with that set of variables in variable panel 714. For example, a unique identifier (such as 702) may be assigned to each set of variables selected using configuration interface 700, and then that identifier may be encoded in a machine-readable code. In operation, the MR headset may scan the machine-readable code generated by configuration interface 700 to open a list of functions or features linked to the variables below, as recognized by the MR control system. In this way, the MR headset may request data related to that set of functions or features associated with the identifier from the MR control system.

[0188] In some embodiments, the machine-readable code may be associated with multiple different types of display functions and capabilities, such as the display I / O cards or I / O card lists shown in Figures 6A-6E, or activation-related information (such as program manuals, maintenance log information, etc.) related to the functions of interest. In some embodiments, the machine-readable code may store hyperlinks associated with each menu option, which are activated when the option is selected. In some embodiments, the machine-readable code may link to multiple menu options pointing to different instruction records in the MR control system. For example, in the case where the machine-readable code is related to "platform pressure," when the machine-readable code is scanned, the MR headset may open a GUI displaying the options or open other related documents. The options can be used to display variables related to the identifier "platform pressure" (such as I / O cards with airlocks 1 and 2, I / O card 608 as shown in Figure 6C), and other related documents may be program manuals related to one or more airlocks, maintenance information related to one or more airlocks, etc. Files can be in any suitable format, such as markup languages ​​(e.g., HTML, XML), portable file formats (PDF), etc. Imaging the state of internal components using an MR head-mounted device

[0189] In some embodiments, an MR headset can be used to image, within an MR environment, the state or a representation of the state over time of internal components (such as robotic arms, lifting pins, slit valves, wafer supports, indexers, turntables, spray nozzles, wafers being manufactured, etc.) of a semiconductor manufacturing tool. As a result, such a representation appears to allow the wearer of the MR headset to "see into" the enclosed semiconductor manufacturing tool, seeing internal components of interest that would be inaccessible from the tool's outer wall without disassembling the tool.

[0190] For example, the representation of internal components can correspond to the position and / or movement of internal components. The representation may include 3D images, a series of 3D images, or animations displaying one or more internal components. A 3D image or a series of 3D images may be imaged at a size and / or orientation, which is at least partially based on one or more of the position, orientation, and distance of the MR headset relative to the internal components or specific reference marks on the semiconductor manufacturing tool. The position, orientation, and distance of the MR headset relative to the component of interest or reference mark may be determined in part by one or more position sensors in the MR headset. Position, orientation, and / or distance. In some embodiments, the estimated or near-real-time actual position of the component of interest (such as a robotic arm used to move a wafer) is imaged based on position data received from one or more sensors in the semiconductor manufacturing tool.

[0191] Figure 8A shows an exemplary process 800 of imaging the representation of internal components / parts of a semiconductor manufacturing tool using an MR head-mounted device according to certain embodiments. Figure 8B shows an exemplary process 850 of providing and obtaining information for imaging the representation of internal components / parts of a semiconductor tool using an MR control system according to certain embodiments. Figures 9A and 9B show exemplary diagrams of a 3D representation of a processing chamber according to certain embodiments.

[0192] Referring to Figure 8A, in some embodiments, the processing block 800 can be performed by the MR headset. It should be noted that in some embodiments, the processing block 800 shown in Figure 8A can be performed in various sequences, and in some cases, one or more blocks are performed simultaneously. Furthermore, in some embodiments, one or more processing blocks 800 can be omitted. In some embodiments, processing 800 can be performed after a communication channel is established between the MR headset and the MR control system.

[0193] At point 802, the MR headset acquires 3D model information related to at least a portion of the semiconductor manufacturing tool. As described above with reference to Figure 2, the 3D model information may be stored in the MR headset, the MR control system, or a system communicating with the MR headset or the MR control system, such as an external server. The 3D model information may include, but is not limited to, 3D images of parts, related geometric features (such as polygons and their vertices), related color and material information, related coordinate information, lighting information (such as indicating the position and / or location of shadows), etc.

[0194] In some embodiments, 3D model information may be stored in one or more computer-readable storage media (such as memory) of the MR headset. In such embodiments, the MR headset can retrieve the 3D model information from one or more of these computer-readable storage media. In some embodiments, 3D model information may be stored in one or more computer-readable storage media (such as memory) of the MR control system. In such embodiments, the MR control system can provide relevant 3D model information to the MR headset as needed for imaging 3D content. In some embodiments, 3D modeling information may be stored in multiple devices. For example, coordinate information may be stored in the MR control system, but geometric information is stored in the MR headset.

[0195] At 804, according to certain embodiments, the MR headset identifies its position and orientation relative to one or more reference marks of the semiconductor manufacturing tool. One or more physical features of the semiconductor manufacturing tool may function as reference marks. The MR headset may utilize one or more on-board cameras or one or more on-board sensors to determine its relative position to the semiconductor manufacturing tool. For example, image data acquired by one or more cameras may be used to identify the position of reference marks (such as physical landmarks) of the semiconductor manufacturing tool. In some embodiments, the MR headset may use the position of machine-readable code attached to an external portion of the semiconductor manufacturing tool to determine its relative position and orientation. In some embodiments, the relative position may be identified relative to a reference or reference mark present in the physical environment, wherein the reference or reference mark is an external physical landmark of the semiconductor manufacturing tool (such as a specific screw, a specific wall, etc.) or a machine-readable code attached to an external portion of the semiconductor manufacturing tool.

[0196] One or more reference markers used to obtain the relative position of semiconductor manufacturing tools with respect to the MR headset can correspond to known locations or positions within the 3D model information. Therefore, reference markers can be used to place, adjust the orientation, and / or scale the 3D representation of parts within the field of view (FOV) of the MR headset, such that the 3D representation overlaps with the physical parts falling within the FOV, and the 3D representation is displayed in the MR headset's FOV at a scale that conforms to the scale of the real-world counterpart visible from the MR headset's perspective.

[0197] At point 806, the MR headset receives operational information from the MR control system indicating the position or location of one or more internal components / parts of the semiconductor manufacturing tool over time. For example, the operational information may indicate the position of the component / part relative to a reference frame (such as the position of a robotic arm, indexer or turntable, lifting pin, spray head, etc.), which is associated with the physical semiconductor manufacturing tool. Alternatively, the operational information may indicate the movement information (such as speed and direction) of the component relative to the reference frame, which is also associated with the physical semiconductor manufacturing tool.

[0198] In some embodiments, operational information may include sensor data of components, such as pressure data, temperature data, etc. In some such embodiments, the operational information may additionally indicate an abnormal or erroneous state identified based on the sensor data. For example, the operational information may indicate that the MR control system has determined that specific sensor data is out of the normal range and therefore abnormal, or that a specific component is in an erroneous state. In some embodiments, position or rotary encoder information may be used to determine position and / or movement information of one or more internal components / parts. For example, the position of the robotic arm may be determined based on one or more rotary encoders and the known length of each arm link, with the rotary encoders indicating the amount of rotation of each joint of the robotic arm.

[0199] In some embodiments, the operational information may indicate information about accepting one or more wafers for manufacturing. For example, the operational information may indicate the position of the wafer in a particular processing chamber, whether a particular wafer is currently being clamped or declamped to a chuck, etc.

[0200] In some embodiments, the MR headset can determine the location or position of internal components / parts over time based on sensor data transmitted by the MR control system. In some embodiments, the MR headset can receive location or position over time from the MR control system. In some embodiments, the MR headset can receive initial position information from the MR control system and use a script to determine the subsequent position over time based on the initial position information.

[0201] At point 808, the MR headset images one or more internal components / parts in an MR, AR, or VR environment. The location or position of one or more internal components / parts over time can be imaged based on 3D model information and the relative position of the MR headset to the semiconductor manufacturing tool. An example of a view imaged by the MR headset, including a representation of one or more internal components, is shown and illustrated below with reference to Figure 9B.

[0202] In some embodiments, one or more 3D images may be generated using 3D model information. In some embodiments, each image corresponds to an internal element or a portion of an internal element to be imaged. In some embodiments, each of the one or more 3D images may be generated such that the orientation, position, and / or size of the 3D model in the image corresponds to the viewing angle of the MR headset relative to the semiconductor manufacturing tool, wherein the viewing angle is determined based on the relative position of the MR headset relative to the semiconductor manufacturing tool.

[0203] In some embodiments, when generating two or more 3D images, the two or more 3D images can be imaged sequentially. Therefore, the sequentially imaged two or more 3D images can appear as an animation.

[0204] In some embodiments, one or more 3D images can be generated and imaged based on a script that generates the positions of various elements represented by the 3D images. For example, in the case where one or more 3D images represent a robotic arm, the script can be used to identify one or more positions of the robotic arm. In another example, when the robotic arm is in a moving state, the script can be used to identify a series of positions of the robotic arm at a series of time points. The script can generate the positions of various elements based on known ways in which elements move. For example, the positions of the robotic arm can be generated based on known ways in which various links of the robotic arm rotate about one or more joints.

[0205] In some embodiments, the state of a corresponding internal component is indicated by presenting one or more internal elements / parts in a way that represents their location or position over time. For example, visual methods (such as red, flashing, etc.) that indicate such a state can be used to image components that are determined to be related to abnormal sensor readings or are in an erroneous state.

[0206] Furthermore, in some embodiments, status information can be conveyed non-visually via the MR headset. For example, in some embodiments, audible alarms (such as beeps, tones, etc.) or audio messages can be presented via the speakers of the MR headset. Such alarms or messages can be presented in response to judgments that a component is in an error or abnormal state, or that a specific component is operating or about to operate.

[0207] In some embodiments, how the MR headset presents information related to the location or position of internal components of a semiconductor manufacturing tool over time can be configured by the user. For example, such user configuration can be received via one or more user interfaces for setting and modifying settings associated with the MR headset. In some embodiments, the user can activate or deactivate the function for imaging 3D images of parts / components using the various command / input mechanisms disclosed in this invention via the MR headset.

[0208] Figure 8B illustrates an exemplary process 850 according to certain embodiments, in which information is provided and acquired by an MR control system to image a representation of the internal components / parts of a semiconductor manufacturing tool. In some embodiments, the blocks of process 850 shown in Figure 8B may be performed in various sequences, and in some cases, certain blocks are performed simultaneously. In some embodiments, one or more blocks of process 850 may be omitted. In some embodiments, process 850 is performed after a communication channel is established between the MR headset and the MR control system.

[0209] At point 852, the MR control system acquires 3D model information related to the semiconductor manufacturing tool. In some embodiments, the 3D model information may be stored in memory associated with the MR control system. In some embodiments, the MR control system may retrieve the 3D model information from the server.

[0210] At point 854, the MR control system transmits at least a portion of 3D model information representing a part of a semiconductor manufacturing tool to the MR headset. In some embodiments, the MR control system may identify the portion of the 3D model information to be transmitted based on indications of that part of the semiconductor manufacturing tool falling within the field of view of the MR headset.

[0211] At point 856, the MR control system determines the position or location of one or more internal components of the semiconductor manufacturing tool over time. This position or location over time can be based on sensor data received from the semiconductor manufacturing tool. For example, the position of a robotic arm can be determined based on encoder values. In some embodiments, the position or location over time can be based on a known model of how the robotic arm's links move.

[0212] In some embodiments, the MR control system can transmit sensor data to the MR headset without determining position information (e.g., at block 858). In some such embodiments, block 856 may be omitted. In some embodiments, the MR control system can determine the initial position of one or more components / parts based on sensor data received from semiconductor manufacturing tools. In some such embodiments, the MR headset can determine the position of one or more components over time based on the initial position (multiple positions).

[0213] At point 858, the MR control system transmits location information indicating the position of one or more internal components / parts of the semiconductor manufacturing tool to the MR headset. In some embodiments, the location information may include the position / location of one or more internal components / parts determined at point 856 over time. In some embodiments, the location information may include sensor data (such as from an encoder), from which the MR headset determines the location information.

[0214] Figure 9A shows a processing chamber 901 in an exemplary view 900. As shown, view 900 includes a processing chamber 901 with opaque sidewalls 902 and a top wall 904. The processing chamber 901 also includes sensors, such as a sensor 906 that can be located on the upper part of the processing chamber 901. The processing chamber 901 also includes a front-side wafer loading slot 908. Furthermore, view 900 includes a view of the physical environment (e.g., space) in which the processing chamber 901 is located. View 900 is visible in the field of view of an MR headset when no virtual content is overlaid on the user's field of view.

[0215] Figure 9B shows an exemplary view 950 illustrating how to image 3D models of internal components / parts in an AR, VR, or MR environment. As shown, the walls of the virtual processing chamber 951 are imaged as transparent walls 952 and 954 in view 950. The virtual processing chamber 951 is a virtual representation of the processing chamber 901 shown in Figure 9A. Furthermore, representations of internal equipment parts or components are imaged within transparent walls 952 and 954. For example, view 950 shows a virtual platform 956, a virtual wafer loading slot 958, and a virtual wafer handling robot end effector 960 representing actual physical parts within a semiconductor tool. Additionally, view 950 shows a virtual wafer 962 positioned above the virtual wafer handling robot end effector 960. The position and orientation of the virtual wafer 962 and the virtual wafer handling robot end effector 960 reflect the near real-time actual position and orientation of the individual parts within the semiconductor manufacturing tool. As shown, components (e.g., spaces) of the physical environment in which the virtual processing chamber 951 is imaged are still visible in the imaging environment (e.g., an AR imaging environment). In some embodiments, virtual 3D imaging of various internal components / parts is overlaid on actual projections of actual physical objects. In some embodiments, programmed imaged objects are virtually replaced by their actual projected counterparts in the imaging environment. For example, the virtual processing chamber 951 in FIG9B virtually replaces the projected actual processing chamber 901 in FIG9A. In some embodiments, features of real objects are selectively imaged so that uninterested parts / components are not imaged. For example, the virtual processing chamber 951 in FIG9B does not show the sensors 906 on the top wall and front wafer loading slot 908 of the actual processing chamber 901 shown in FIG9A. Interacting with a digital clone using an MR headset

[0216] In some embodiments, an MR headset can be used to image virtual reality (VR) content associated with a digital avatar of a physical semiconductor manufacturing tool. According to some embodiments, the digital avatar is a virtual representation or simulation of the physical semiconductor manufacturing tool. In some embodiments, by imaging VR content associated with the digital avatar representing the physical semiconductor manufacturing tool, the MR headset allows the wearer to interact with the virtual representation of the physical semiconductor manufacturing tool. For example, the wearer can initiate or begin various processes on the digital avatar, observe and analyze sensor outputs as results of various inputs and system changes, observe instructions or parameter values ​​that lead to specific error conditions, etc. In some embodiments, new users can benefit from interacting with and training with the digital avatar via the MR headset before operating on the physical semiconductor manufacturing tool.

[0217] In some embodiments, the digital clone communicates with the MR control system, which issues commands to the digital clone to simulate the operation of a specific semiconductor manufacturing tool and receives from the digital clone outputs reflecting the simulated values ​​and states of the semiconductor manufacturing tool provided by the digital clone. As mentioned above, it should be noted that the MR control system communicating with the digital clone can communicate with the physical semiconductor manufacturing tool in a mountable and / or operable manner. In some embodiments, the digital clone communicates directly with the MR headset without requiring an MR control system.

[0218] In some embodiments, the MR headset can receive from the MR control system status information, such as that of various components of the digital clone, and operational information related to simulated sensor values ​​associated with the simulated sensors of the digital clone. In some embodiments, the MR headset can receive the same or similar operational information directly from the digital clone. In some embodiments, the MR headset is used to image content representing the received operational information in the MR environment.

[0219] Figure 10 is an exemplary schematic diagram of a system for imaging semiconductor manufacturing tool operation information from a digital clone of a semiconductor manufacturing tool using an MR head-mounted device, according to certain embodiments.

[0220] As shown, the MR control system 202 communicates with the device executing the digital clone 1002. In some embodiments, the MR control system 202 is integrated into the digital clone 1002. In some embodiments, communication between the MR control system 202 and the digital clone 1002 can use TCP-based protocols, IP-based protocols, etc. Communication can be wired or wireless. In some embodiments, tool control product software running on the MR control system 202 provides instructions to the digital clone 1002, causing the digital clone 1002 to simulate the operation of various semiconductor manufacturing tools. In some embodiments, the MR control system 202 can receive information from the device executing the digital clone 1002. For example, the MR control system 202 can receive information indicating simulated sensor values, simulated status information, etc.

[0221] The digital clone 1002 may contain various algorithms simulating various parts or states of a semiconductor manufacturing tool. For example, the digital clone 1002 may contain digital or computational models of elements used to simulate multiple parts within a semiconductor manufacturing tool, including, but not limited to, an electrostatic chuck platform, a spray head in a processing chamber, and a robotic arm that moves a wafer from a first processing chamber to a second processing chamber. In some embodiments, the parts of the digital clone 1002 may be coupled or linked within the digital clone to allow the parts to interact with each other. For example, a digital part simulating a spray head may interact with a digital part simulating a wafer to change the characteristics or parameters controlled by the wafer simulation based on the simulation of the spray head.

[0222] In some embodiments, the MR control system 202 can interact with the digital clone 1002 to initiate and / or control the simulation of one or more manufacturing operations. For example, the MR control system 202 can be used to set or adjust the setpoint of the digital clone 1002, initiate specific simulated actions (such as initiating simulated vacuum operations, initiating simulated temperature change operations, initiating simulated airflow operations, etc.), obtain or retrieve parameter values ​​of the digital clone 1002 (such as the current simulated temperature, the current simulated pressure level, the current simulated gas flow rate, etc.), etc.

[0223] Similar to that shown and described above with reference to Figure 2, one or more three-dimensional models 208 of the physical semiconductor manufacturing tool represented by the digital clone 1002 can be stored in the memory of the MR headset 206 and / or in the memory of the MR control system 202. Alternatively, the three-dimensional models 208 can be stored on a server 210, which provides one or more of the three-dimensional models 208 to the MR headset 206 and / or the MR control system 202 in response to requests.

[0224] Figure 11A illustrates an exemplary process 1100 for providing content related to a digital clone of a semiconductor manufacturing tool, according to certain embodiments. In some embodiments, the blocks of process 1100 may be performed by an MR headset communicating with an MR control system, which communicates with the digital clone, and the MR headset communicates directly with the digital clone. It should be noted that in some embodiments, the blocks of process 1100 shown in Figure 11A may be performed in various sequences and in some cases, some blocks may be performed simultaneously. Furthermore, in some embodiments, one or more blocks of process 1100 may be omitted. In some embodiments, process 1100 may be performed after a communication channel is established between the MR headset and the MR control system, or between the MR headset and the digital clone. In some embodiments, the MR headset provides all content related to the digital clone (such as operating information, processing simulation, and control panel) within the complete VR environment imaging.

[0225] In some embodiments, at 1102, the MR headset acquires 3D model information relating to at least a portion of the semiconductor manufacturing tool represented by the digital avatar. The 3D model information may include 3D model information of any suitable part or component of the semiconductor manufacturing tool. In some embodiments, the retrieved 3D model information may be part of 3D model information relating to a specific part or component of the semiconductor manufacturing tool. For example, 3D model information for a specific robotic arm, a specific platform, a specific spray head, etc., may be acquired.

[0226] In some embodiments, 1102 may be omitted. For example, in some embodiments, one or more control panels (such as UI elements that present virtual sensor values ​​and other data) may be imaged in 2D rather than in 3D representation of the parts of a semiconductor manufacturing tool represented by the digital avatar.

[0227] 3D model information can be retrieved from the memory of the MR headset. Alternatively, 3D model information can be received from the memory or digital clone associated with the MR control system via a corresponding communication channel at the MR headset.

[0228] In some embodiments, the physical location and / or orientation of the MR headset is identified at location 1104. The physical location and / or orientation of the MR headset can be identified based on one or more cameras of the MR headset and / or based on one or more sensors of the MR headset (such as accelerometers, gyroscopes, etc.). The physical location and / or orientation of the MR headset can be identified relative to the actual physical environment in which the MR headset is located. For example, the physical location and / or orientation can be determined relative to physical landmarks in the physical environment.

[0229] In some embodiments, 1104 may be omitted. For example, in some embodiments, target objects imaged by the MR headset may be imaged and / or updated based on user interaction and / or navigation in virtual space. For example, zooming in or out may be based on explicit user input (such as pinching or pulling on the imaged user interface element). In some embodiments, the operator's viewpoint may be changed by virtually moving the FOV using directional commands. Since the FOV is less restricted in virtual space, more viewpoints can be achieved in some embodiments. For example, the operator can view the tool from below, which is extremely difficult to do in some of the aforementioned AR and MR environments. In some embodiments, certain operational / status data are displayed next to some or all of the parts shown on a screen. In these embodiments, the operator can simultaneously observe the effects of input commands from multiple parts.

[0230] At point 1106, the MR headset receives operational information from the MR control system or the digital clone, indicating the status of the digital clone. For example, the operational information may include one or more analog sensor values ​​related to the analog sensors of the digital clone. As another example, the operational information may include one or more analog positions of various analog parts or internal components of the semiconductor manufacturing tool represented by the digital clone.

[0231] At point 1108, the MR headset determines the current state of the digital clone based on operational information. For example, in some embodiments, the current state may be an error or abnormal state identified based on simulated sensor values ​​that are outside the normal range. In some embodiments, the state determination is completed at the MR control system or the digital clone, so the MR headset only images / presents the received state information. In some embodiments, the simulated sensor values ​​may correspond to simulated temperature values, simulated airflow values, simulated pressure values, etc.

[0232] In some embodiments, the current state may indicate the position or motion information of one or more simulated parts of a semiconductor manufacturing tool represented by the digital avatar. For example, the position information may indicate the position of the simulated component relative to a reference frame associated with the semiconductor manufacturing tool. In another instance, the motion information may directly or indirectly indicate the direction and / or speed of movement, or rotation of the simulated part relative to one or more other simulated parts of the semiconductor manufacturing tool, or relative to a reference frame that is fixed relative to the simulated semiconductor manufacturing tool.

[0233] In some embodiments, the current state may include the operational state of one or more simulated components of a semiconductor manufacturing tool represented by a digital avatar. For example, the operational state of a gas lock may indicate whether the gas lock is being pumped. As another example, the operational state of a door may indicate whether the door can be safely closed, whether the door is currently closed, etc. In another instance, the operational state of a gas line may indicate whether gas is currently flowing through the gas line.

[0234] In some embodiments, the MR headset can receive information indicating the current state of the digital clone from the MR control system. That is, in some embodiments, the MR control system can determine that the current state is an error state or an abnormal state, and then the MR control system transmits information indicating the error state or abnormal state to the MR headset. Then, for example, at block 1110 of processing 1100, the MR headset can image the content indicating the error state or abnormal state.

[0235] At 1110, the MR headset images content indicating the current state of the digital clone. In some embodiments, the content may be imaged based on 3D model information. For example, a 3D image of one or more parts or components of a semiconductor manufacturing tool represented by the digital clone may be imaged.

[0236] In some embodiments, one or more 3D images representing a specific part can be generated and / or imaged to adjust the size, position, and / or orientation of the one or more 3D images in a manner consistent with 3D images of other parts or components of a semiconductor manufacturing tool represented by a digital avatar. For example, in the case where one or more 3D images correspond to a moving robotic arm (moving the robotic arm because it has started moving), a script can be used to identify the position of the robotic arm at a series of time points. In a more specific instance, the position of the robotic arm can be determined based on known methods, in which the various links of the robotic arm rotate around joints, etc. Continuing with this example, one or more 3D images can correspond to a representation of the robotic arm at each of a series of time points. Still continuing with this example, one or more 3D images can then be sequentially imaged so that one or more 3D images appear to display an animated representation of a simulated robotic arm.

[0237] In some embodiments, the MR head-mounted device can be used to continuously update the imaging of 3D images over time.

[0238] In some embodiments, the imaged content can be presented in 2D. For example, in some embodiments, one or more panels can be presented in 2D to display virtual sensor information, status information related to the digital clone, etc.

[0239] In some embodiments, the MR headset can be used to present error states (if an error state is detected based on operational information) or operational states of one or more simulated components representing a semiconductor manufacturing tool represented by a digital avatar. For example, the MR headset can image a 3D image representing a component based on its operational state or based on detected error states. Visual characteristics that can be used to indicate detected error states or operational states may include color, flickering, etc.

[0240] In some embodiments, the MR headset can be used to provide audible alarms or messages. For example, audible alarms (such as tones, beeps, etc.) or messages can be provided to indicate a detected error state or a specific operational state. In more specific instances, audible messages can be provided to indicate changes in operational state, such as a specific pneumatic system being pumped out or a specific door being closed.

[0241] In some embodiments, after block 1112, the MR headset can return to block 1104 and the updated position and / or orientation of the MR headset can be identified. The imaged content can then be updated based on the updated position and / or orientation of the MR headset. In some embodiments, the imaged content can be updated without identifying the updated position and / or orientation of the MR headset. For example, in some embodiments, the imaged content can be updated based on user interaction with the imaged content, such as zooming in or out by pinching or pulling it.

[0242] In some embodiments, at block 1112, the MR headset receives input corresponding to an operation command to be performed by the digital clone. Examples of operation commands may include, but are not limited to, starting or initiating a process or procedure, changing the state of a part or component of the digital clone (such as changing a specific gas lock to switch to a ventilated state, closing a specific door, etc.).

[0243] Input can be received via a user interface element selected through an MR headset. For example, the user interface element can be displayed in a menu of available operating commands that may be executed.

[0244] At block 1114, the MR headset transmits a message indicating the operation command generated from the input received at block 1112 to the MR control system. Then, as described below with reference to block 1160 of FIG11B, the MR control system enables the digital clone to execute the operation command. In some embodiments, the MR headset transmits the message directly to the digital clone.

[0245] Figure 11B illustrates an exemplary process 1150 in which the MR control system provides operational information related to the digital clone of the semiconductor manufacturing tool and executes operational commands from the digital clone. It should be noted that in some embodiments, the blocks of process 1150 shown in Figure 11B can be executed in various sequences, and in some cases, certain blocks are executed simultaneously. Furthermore, in some embodiments, one or more blocks of process 1150 may be omitted. In some embodiments, process 1150 can be performed after a communication channel is established between the MR headset and the MR control system. In some embodiments, the MR control system is integrated into the digital clone.

[0246] In some embodiments, at point 1152, the MR control system obtains 3D model information related to semiconductor manufacturing tools represented by the digital clone. In some embodiments, the 3D model information may be stored in memory associated with the MR control system. Alternatively, in some embodiments, the MR control system may retrieve the 3D model information from a server.

[0247] In some embodiments, 1152 may be omitted. For example, in cases where an MR headset images one or more 2D control panels but not a 3D representation of the parts of a semiconductor manufacturing tool represented by a digital clone, the MR control system may not obtain 3D model information.

[0248] In some embodiments, at point 1154, the MR control system transmits at least a portion of 3D model information representing a part of a semiconductor manufacturing tool to the MR headset. In some embodiments, the MR control system may identify that portion of the 3D model information based on an indication of a portion of a virtual representation of the semiconductor manufacturing tool falling within the field of view of the MR headset.

[0249] In some embodiments, 1154 may be omitted. For example, in the case where an MR headset images 2D content, the MR control system may not transmit 3D model information to the MR headset.

[0250] At point 1156, the MR control system transmits operational information indicating the status of the digital clone. For example, the operational information may include one or more analog sensor values ​​related to the analog sensors of the digital clone. As another example, the operational information may include the positions of one or more analog parts or internal components of the semiconductor manufacturing tool represented by the digital clone.

[0251] At point 1158, the MR control system's MR head-mounted device receives messages instructing the digital clone to perform certain operations. Examples of these operations include starting or initiating processing or processing steps, changing the state of parts or components of the digital clone (such as changing a specific airlock to switch to a ventilated state, closing a specific door, etc.).

[0252] At 1160, the MR control system transmits commands to the digital clone, wherein the commands change the state of the digital clone and are based on operating instructions. For example, in some embodiments, the commands may be transmitted via TCP messages. The context of the disclosed computational embodiments

[0253] Some of the embodiments described herein relate to computing systems that work together to image control and status information related to semiconductor manufacturing tools in MR, VR, AR, or combinations thereof. Such systems can also be used to receive data and instructions, such as code representing physical processes performed during semiconductor manufacturing operations, sensor data, etc.

[0254] The disclosed system can be any type of computing system with various computer architectures, used to implement machine learning models and generate and / or optimize such models. For example, the system may contain software components that execute on one or more general-purpose processors, or specially designed processors such as Application-Specific Integrated Circuits (ASICs) or programmable logic devices (such as Field-Programmable Gate Arrays (FPGAs)). Furthermore, the system may be implemented on a single device or distributed across multiple devices. The functionality of computing elements may be combined or further divided into multiple sub-modules.

[0255] In some embodiments, the software element may be embodied in the form of program code executed during communication with various devices and / or the imaging of various contents on a properly programmed system. The software element may be stored in a non-volatile storage medium (such as an optical disc, flash memory device, portable hard disk, etc.) and includes a plurality of instructions constituting a computer device (such as a personal computer, server, network device, etc.).

[0256] In a standard context, software components execute a set of commands prepared by a programmer / developer. However, hardware-executable module software is executable code written into memory using "machine code," which is selected from a specific set of machine language instructions or "native instructions" designed into the hardware processor. Hardware processors (complex processors) are known to be essentially built upon a set of machine language instructions or native instructions. This is the "language" by which system and application software communicate with the hardware processor. Each native instruction is a discrete code recognized by the processing architecture, which can specify a specific register for arithmetic, addressing, or control functions; a specific memory location or offset; and an addressing mode used to interpret a specific operand. By combining these simple native instructions to create more complex operations, native instructions are executed sequentially or directed by control flow instructions.

[0257] The relationship between executable software instructions and the hardware processor is structured. In other words, an instruction itself is a series of symbols or values. It does not inherently convey any information. The processor is designed to interpret these symbols / values, giving meaning to the instructions.

[0258] The processing and methods described herein can be executed on a single machine at a single location, on multiple machines at a single location, or on multiple machines at multiple locations. When multiple machines are used, individual machines can be customized for their specific tasks. For example, operations requiring large blocks of code and / or significant processing power can be performed on large and / or fixed machines.

[0259] Furthermore, some embodiments relate to tangible and / or non-transient computer-readable media or computer program products containing program instructions and / or data (including data structures) for performing various computer-performed operations. Examples of computer-readable media include, but are not limited to, semiconductor memory devices, phase-change devices, magnetic media such as magnetic disks and magnetic tapes, optical media such as CDs, magneto-optical media, and hardware devices specifically used for storing and executing program instructions, such as read-only memory (ROM) and random access memory (RAM). Computer-readable media may be directly controlled by an end user or may be indirectly controlled by an end user. Examples of media subject to direct control include media located at the user's facility and / or media not shared with other entities. Examples of media subject to indirect control include media that can be indirectly accessed by the user via an external network and / or via a server that provides shared resources such as the "cloud." Examples of program instructions include machine code, such as machine code generated by a compiler, and files containing high-level program code that a computer can execute using a decoder.

[0260] In various embodiments, data or information used in the disclosed methods and apparatus is provided in electronic format. Such data or information may include sensor data, parameter values, etc. The data or other information provided electronically as used herein may be stored on a machine and transferred between machines. Traditionally, data in electronic format is provided digitally, and the data may be stored in various data structures, lists, databases, etc., in the form of bits and / or bytes. Data may be represented electronically, optically, or in other ways.

[0261] In some embodiments, the various configurations described herein may be implemented in system software. System software typically intersects with computer hardware and associated memory. In some embodiments, system software includes operating system software and / or firmware, as well as middleware and drivers installed in the system. System software provides basic, non-task-specific functionality to the computer. In contrast, modules and other application software are used to perform specific tasks. Each native instruction used by a module is stored in memory and represented by a numerical value.

[0262] Figure 12 shows an exemplary computer system 1200. As shown, the computer system 1100 includes an input / output subsystem 1202 with an applicable interface, which, depending on the application, is used to interact with a user and / or other computer systems. Embodiments of the present invention can be implemented in the code on the system 1200 having the I / O subsystem 1202, which is used to receive input program elements and / or data from a human user (e.g., via a GUI or keyboard) and display the input program elements and / or data to the user. The I / O subsystem 1202 may include, for example, a keyboard, mouse, graphical user interface, touch screen, virtual command pad, or other input interface, and, for example, an LED or other flat panel display, or other output interface.

[0263] The communication interface 1207 may include any suitable components or circuits for communicating using any suitable communication network (such as the Internet, intranet, wide area network (WAN), local area network (LAN), wireless network, virtual private network (VPN), and / or any other suitable type of communication network). For example, the communication interface 1207 may include network interface card circuitry, wireless communication circuitry, etc.

[0264] The code may be stored in a non-transient medium such as secondary memory 1210, or memory 1208, or both. In some embodiments, secondary memory 1210 may be permanent storage. One or more processors 1204 read the code from one or more non-transient media and execute the code to enable the computer system to perform the methods described in the embodiments herein. Those skilled in the art will understand that a processor may receive source code such as descriptions of performing training and / or modeling operations and translate or compile the source code into machine code that is understandable to the processor's hardware gate level. Bus 1205 couples I / O subsystem 1202, processor 1204, peripheral device 1206, communication interface 1207, memory 1208, and secondary memory 1210. The apparatus, system, and platform described herein (such as an MR imaging apparatus (MR head-mounted device) and MR control system) may embody one or more of the above elements.

[0265] It can be argued that various computing elements, including processors, memory, instructions, operating systems, models, or other components, can be "used" to perform one or more tasks. In this context, the term "used" refers to a structure (such as stored instructions, circuits, etc.) that performs one or more tasks during operation. Therefore, even when a particular component is not currently operational (e.g., not in an active or powered-on state), it can still be said that a unit / circuit / component is used to perform a task.

[0266] The term "for" can refer to hardware—for example, circuitry, or memory storing executable program instructions for operation. Furthermore, "for" can refer to a general-purpose structure (such as a general-purpose circuit) controlled by software and / or firmware (such as an FPGA or a general-purpose processor executing software), which operates in a manner capable of performing the tasks (multiple tasks). Additionally, "for" can refer to one or more memories or memory elements storing computer-executable instructions for performing the tasks (multiple tasks). Such memory elements may include on-chip memory with processing logic. In some contexts, "for" can also encompass adapting manufacturing processes (such as semiconductor manufacturing facilities) to manufacture apparatus (such as volumetric circuits), which is adapted to perform one or more tasks.

[0267] Numerous specific details are set forth in the description to provide a complete understanding of embodiments of the invention. Embodiments of the invention may be practiced without some or all of these details. In other instances, well-known processing operations are not described in detail so as not to unnecessarily obscure the embodiments of the invention. Although the invention has been described with reference to specific embodiments, it should be understood that these specific embodiments are not intended to limit the invention.

[0268] Unless otherwise stated, the methods, operations and apparatus features disclosed herein involve techniques and equipment commonly used in the fields of measurement, semiconductor device manufacturing, software design and programming, and statistics, and all fall within the ordinary skill of the art.

[0269] Unless otherwise defined herein, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Various scientific dictionaries containing the terms used herein are well known and available in the art. While any methods and materials similar to or equivalent to those used herein may be useful in the practice or testing of the embodiments disclosed herein, only certain methods and materials are described.

[0270] Numerical ranges encompass the defined range of numbers. Each maximum numerical limit provided in this specification is intended to include each smaller numerical limit, as if such smaller numerical limits were explicitly stated herein. Each minimum numerical limit provided in this specification includes each larger numerical limit, as if such larger numerical limits were explicitly stated herein. Each numerical range provided in this specification includes each narrower numerical range falling within such a wider numerical range, as if such narrower numerical ranges were explicitly stated herein.

[0271] It should be understood that the phrase "each of one or more items" as used in the text includes both groups of single items and groups of multiple items. That is, using "for each of..." refers to each item within a group of any number of items. For example, if the group of items being referred to is a single item, then "each" refers only to that single item (although dictionaries often define "each" as "each of two or more items"), and does not imply that the group must have at least two items. Similarly, the terms "group" or "subgroup" should not be considered as necessarily containing plural items—it should be understood that a group or subgroup can contain only a single member or multiple members (unless otherwise indicated in the text).

[0272] The titles provided herein are not intended to limit the scope of this invention.

[0273] Unless the context explicitly states otherwise, the singular articles “a” and “the” used in the text have a plural meaning. Unless the context explicitly states otherwise, the word “or” used in the text refers to non-exclusivity.

[0274] 100: Semiconductor Manufacturing Tools 102: Forward Opening Unified Container (FOUP) 104: Loading Interface 106: Equipment Front-End Module (EFEM) 108: Loading Lock 110: Vacuum Transfer Module (VTM) 112: Processing Room 114: Buffer Station 116: Control Station 130: Controller 132: Hardware Interface 134: User Interface 136: Memory 152: Gas Box 154: Lifting box 156: Sensor Data 202: MR Control System 204: Semiconductor Manufacturing Tools 206: MR Headset 208: 3D Model 210: Server 300: Processing 302, 304, 306, 308, 310, 312, 314, 316: Squares 350: Processing 352, 354, 356, 358: Square 400: Information Flowchart 402, 404, 406, 408, 410, 412, 414: Squares 500: Processing 502, 504, 506, 508, 510, 512, 514, 516, 518: Square 550: Processing 552, 554, 556, 558, 560: Square 600: View 610: Control Panel 602: Menu Panel / UI Components 604: Operation Information Selection Input / UI Component 605: UI Components 606: I / O Card List 607: "Follow me" input 608:I / O card 610: Pressure gauge 612:I / O card 614: Status Block 615: Square 620: View 622: Connection Panel 630: View 640: View 650: View 700: Configuration Interface 702: Group identifier 704: Panel 706: Parameters 708: Alias 710: Parameters 712: Button 714: Variable Panel 716: QR code 800: Processing 802, 804, 806, 808: Square 850: Processing 852, 854, 856, 858: Square 900: View 901: Processing Room 902: Sidewall 904: Top Wall 906: Sensor 908: Wafer loading slots on the top wall and front side 950: View 951: Virtual Processing Room 952, 954: Transparent Wall 956: Virtual Platform 958: Virtual wafer loading slot 960: End effector for virtual wafer handling robot 962: Virtual Wafer 1002: Digital Doppelganger 1100: Processing 1002, 1004, 1006, 1008, 1110, 1112, 1114: Squares 1150: Processing 1152, 1154, 1156, 1158, 1160: Squares 1200: Computer System 1202: Input / Output Subsystem 1204: Processor 1205: Busbar 1206: Peripheral Devices 1207: Communication Interface 1207: Communication Interface 1208: Memory 1210: Secondary Memory

Claims

1. A mixed reality (MR) head-mounted device for controlling a semiconductor manufacturing tool in an MR environment, the MR head-mounted device comprising: one or more processors; a display coupled to the one or more processors; one or more cameras; and one or more memories storing a plurality of computer-executable instructions, which, when executed, cause the one or more processors to: establish a wireless communication channel with an MR control system of the semiconductor manufacturing tool; receive operational information related to the semiconductor manufacturing tool from the MR control system via the wireless communication channel, wherein the operational information includes sensor data obtained from one or more sensors of the semiconductor manufacturing tool; and image content related to the sensor data and one or more control features in the MR environment.

2. The MR headset of claim 1, wherein, when executed, the plurality of instructions further cause the one or more processors to begin establishing the wireless communication channel in the following manner: identifying a wireless access point associated with the MR control system and a password associated with the wireless access point; and connecting to the wireless access point using the password.

3. The MR headset of claim 2, wherein, when executed, the plurality of instructions further cause the one or more processors to identify the wireless access point in the following manner: acquiring image data via one of the one or more cameras; identifying a machine-readable code in the image data; decoding the machine-readable code to retrieve encrypted information; and decrypting the encrypted information using key information stored in the memory, wherein the decrypted information includes an identifier of the wireless access point and the password.

4. An MR head-mounted device as claimed in any of claims 1-2, wherein, when executed, the plurality of instructions further cause one or more processors to identify a physical location and an orientation of the MR head-mounted device based on data from one or more sensors of the MR head-mounted device, wherein the content is imaged from a viewpoint based on the identified physical location and orientation of the MR head-mounted device.

5. An MR head-mounted device as claimed in any of claims 1-2, wherein, when executed, the plurality of instructions further cause the one or more processors to: receive an input indicating second operational information relating to the semiconductor manufacturing tool, wherein the second operational information is at least partially different from the operational information; and cause a request for the second operational information to be transmitted to the MR control system; receive the second operational information from the MR control system; and cause second content relating to the second operational information to be imaged.

6. The MR head-mounted device of claim 5, wherein the input indicating the second operation information indicates at least one of the following: a selection included in a selectable input in a menu imaged by the MR head-mounted device; or the second operation information is generated based on an image capture that identifies a machine-readable code of the second operation information.

7. The MR head-mounted device of claim 5, wherein the imaged content includes a user interface element that displays second sensor data from one or more sensors of the semiconductor manufacturing tool, and wherein the second sensor data corresponds to the requested second operational information.

8. The MR headset of claim 7, wherein, when executed, the plurality of instructions further cause the one or more processors to: receive a second input indicating that the user interface element is fixed at a spatial coordinate relative to the semiconductor manufacturing tool; identify a set of spatial coordinates in a coordinate system fixed relative to the semiconductor manufacturing tool, wherein the set of spatial coordinates indicates a plurality of boundaries of the user interface element relative to a fixed spatial coordinate; identify a physical position and an orientation of the MR headset relative to the coordinate system; and modify the presentation of the user interface element based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinate.

9. An MR head-mounted device as claimed in any of claims 1-3, wherein, when executed, the plurality of instructions further cause the one or more processors to: receive three-dimensional model information relating to the semiconductor manufacturing tool as part of the operational information; identify a physical position and orientation of the MR head-mounted device relative to the semiconductor manufacturing tool; and image a three-dimensional representation of one or more elements of the semiconductor manufacturing tool based on: 1) the three-dimensional model information; and 2) the physical position and orientation of the MR head-mounted device relative to the semiconductor manufacturing tool as part of the imaged content relating to the operational information in the MR environment.

10. The MR head-mounted device of claim 9, wherein the operational information includes multiple positions of the one or more internal components of the semiconductor manufacturing tool over time, and wherein the imaged content includes a representation of the one or more internal components of the semiconductor manufacturing tool relative to the multiple positions of the semiconductor manufacturing tool over time.

11. The MR head-mounted device of claim 10, wherein, when executed, the plurality of instructions further cause the one or more processors to image the content in the following manner: generating one or more three-dimensional images representing the one or more internal components using the three-dimensional model information; and causing the one or more three-dimensional images to be imaged by the MR head-mounted device based on the plurality of positions of the one or more internal components relative to the semiconductor manufacturing tool.

12. An MR head-mounted device as claimed in any of claims 1-3, wherein, when executed, the plurality of instructions further cause the one or more processors to: receive the three-dimensional model information relating to the semiconductor manufacturing tool as part of the operation information; and image the content based on the three-dimensional model information, wherein the imaged content includes content indicating the state of a digital clone of a component represented by the three-dimensional model information, wherein the digital clone represents the semiconductor manufacturing tool.

13. A mixed reality (MR) control system, comprising: one or more processors; one or more memory devices storing a plurality of computer-executable instructions, which, when executed, cause the one or more processors to: establish a wireless communication channel with an MR head-mounted device; acquire sensor data representing sensor output from a semiconductor manufacturing tool; determine operational information of the semiconductor manufacturing tool based on the sensor data; and transmit the operational information including the sensor data to the MR head-mounted device via the communication channel, wherein the MR head-mounted device is configured to image content related to the sensor data in an MR environment.

14. The MR control system of claim 13, wherein the MR control system communicates with a digital clone, and wherein the sensor data includes virtual sensor data obtained from the digital clone.

15. An MR control system as described in either request 13 or 14, wherein the operation information includes an indication of the status of one of the digital clones.

16. The MR control system of claim 14, wherein the plurality of instructions further causes one or more processors to transmit three-dimensional model information relating to at least a portion of the semiconductor manufacturing tool to the MR headset, wherein the MR headset images the contents indicating the state of the digital clone based on the three-dimensional model information.

17. The MR control system of claim 13, wherein the MR control system communicates with the semiconductor manufacturing tool, and wherein the sensor data includes sensor data obtained from one or more physical sensors of the semiconductor manufacturing tool.

18. An MR control system as described in either claim 13 or 17, wherein the operation information includes a status of the semiconductor manufacturing tool.

19. An MR control system as claimed in claim 13 or 17, wherein, when executed, the plurality of instructions further cause the one or more processors to determine the plurality of positions of one or more internal components of the semiconductor manufacturing tool over time, wherein the operational information includes information indicating the plurality of positions of the one or more internal components of the semiconductor manufacturing tool relative to the semiconductor manufacturing tool over time.

20. The MR control system of claim 19, wherein, when executed, the plurality of instructions further cause one or more processors to transmit three-dimensional model information relating to at least a portion of the semiconductor manufacturing tool, the at least a portion of the semiconductor manufacturing tool including at least one of the one or more internal components, wherein the MR head-mounted device uses the three-dimensional model information to image a plurality of representations of the one or more internal components based on the three-dimensional model information.

21. An MR control system as requested in any of claims 13-14, 16-17 and 20, wherein, when executed, the plurality of instructions further cause the one or more processors to: receive from the MR headset a request for second operational information that is at least partially different from the operational information; and cause the requested second operational information to be transmitted to the MR headset.

22. A method for controlling a semiconductor manufacturing tool via MR dialogue, the method comprising: establishing a wireless communication channel with an MR control system via an MR headset; obtaining sensor data representing sensor outputs from the semiconductor manufacturing tool via the MR control system; determining operational information related to the semiconductor manufacturing tool via the MR control system, at least in part based on the sensor data; establishing the wireless communication channel with the MR headset via the MR control system and in response, transmitting the operational information related to the semiconductor manufacturing tool to the MR headset via the wireless communication channel; receiving the operational information related to the semiconductor manufacturing tool from the MR control system via the wireless communication channel, wherein the operational information includes sensor data obtained from one or more sensors of the semiconductor manufacturing tool; and imaging content related to the sensor data and one or more control features in an MR environment via the MR headset.

23. The method of controlling a semiconductor manufacturing tool via MR dialogue as claimed in claim 22 further includes: identifying a wireless access point associated with the MR control system and a password associated with the wireless access point by means of the MR headset; and connecting to the wireless access point using the password.

24. A method of controlling a semiconductor manufacturing tool via MR dialogue, as claimed in any of claims 22-23, wherein the imaged content includes a user interface element that indicates a sensor value included in sensor data acquired by the MR control system.

25. The method of controlling a semiconductor manufacturing tool via MR dialogue as claimed in claim 24, further comprising: receiving a user input via the MR headset, the user input instructing the user interface element to be fixed at a spatial coordinate relative to the semiconductor manufacturing tool; identifying a set of spatial coordinates in a coordinate system fixed relative to the semiconductor manufacturing tool, wherein the set of spatial coordinates indicates a plurality of boundaries of the user interface element relative to a fixed spatial coordinate; identifying a physical position and an orientation of the MR headset relative to the coordinate system; and modifying the presentation of the user interface element based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinate.

26. A method for controlling a semiconductor manufacturing tool via MR dialogue, as claimed in any of claims 22-23, wherein the operation information includes a plurality of positions of one or more internal components of the semiconductor manufacturing tool, wherein the imaged content includes a plurality of three-dimensional representations of the plurality of positions of the one or more internal components of the semiconductor manufacturing tool over time, and wherein the plurality of three-dimensional representations of the plurality of positions of the one or more internal components of the semiconductor manufacturing tool are imaged based on a physical position and orientation of the MR head-mounted device relative to the semiconductor manufacturing tool.

27. The method of controlling a semiconductor manufacturing tool via MR dialogue as claimed in claim 26 further comprises: transmitting three-dimensional model information related to the semiconductor manufacturing tool as part of the operation information via the MR control system; and receiving the three-dimensional model information via the MR head-mounted device, wherein the plurality of three-dimensional representations of the plurality of positions of the one or more internal components are imaged based on the three-dimensional model information relative to the semiconductor manufacturing tool.

28. The method of controlling a semiconductor manufacturing tool via MR dialogue as described in any of claims 22-23 further comprises: receiving one or more input signals associated with an operation command of the semiconductor manufacturing tool via the MR headset; responding to the receipt of the one or more input signals, causing the operation command to be transmitted to the MR control system; receiving the operation command from the MR headset via the MR control system; and transmitting a command via the MR control system through a communication interface communicatively connected to the semiconductor manufacturing tool to change the state of the semiconductor manufacturing tool or the state representing a digital clone of the semiconductor manufacturing tool.

29. A method of controlling a semiconductor manufacturing tool via MR dialogue, as claimed in any of claims 22-23, wherein the sensor data includes virtual sensor data generated by the digital clone, wherein the plurality of instructions stored in the memory of the MR control system causes one or more processors of the MR control system to receive the virtual sensor data from the digital clone.

30. The method of controlling a semiconductor manufacturing tool via MR dialogue as claimed in claim 22 further comprises: receiving, via the MR headset, an input indicating second operational information related to the semiconductor manufacturing tool, wherein the second operational information is at least partially different from the operational information; transmitting, via the MR headset, a request for the second operational information to the MR control system; receiving, via the MR control system, the request for the second operational information; responding to receiving the request by transmitting the second operational information to the MR headset via the MR control system; and responding to receiving the second operational information from the MR control system by imaging second content related to the second operational information via the MR headset.

Images