Low mass substrate support and the processing chamber
Patent Information
- Application Number
- TW111116565
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-05-12
- Filing Date
- 2022-05-02
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2042-05-01
AI Technical Summary
Existing substrate supports have high thermal mass, leading to increased process energy consumption, longer response times, and reduced process uniformity.
A substrate support design featuring a dish-shaped body with a ring and front/backside pockets, lift pin openings, and slots, which reduces thermal mass and weight, allowing for faster thermal cycling and improved substrate handling.
The reduced mass design enhances thermal cycle times and facilitates easier substrate transport, while maintaining compatibility with existing systems.
Smart Images

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Abstract
Description
Technical Field
[0001] The embodiments disclosed herein generally relate to substrate processing tools, and more specifically to substrate supports for substrate processing tools. Prior Technology
[0002] Traditionally, existing substrate supports can have high thermal mass, which can increase processing energy and response time, and reduce processing uniformity.
[0003] Systems and devices are needed to overcome the shortcomings of previous methods. Summary of the Invention
[0004] The disclosed embodiment relates to a substrate support member, comprising: a disc-shaped body having a thickness at its outer edge and a center located at an axial centerline of the disc-shaped body; a ring coupled to and surrounding the disc-shaped body; and a front pocket portion defined by a first radially inward edge extending beyond the front surface of the disc-shaped body and the ring. The substrate support member further comprises: a back pocket portion defined by a second radially inward edge extending beyond the back side of the disc-shaped body and the ring; a plurality of lifting pin openings extending through the disc-shaped body and positioned at a first radial distance from the center of the disc-shaped body; and a plurality of slots positioned on the back side at a second radial distance from the center of the disc-shaped body, the second radial distance being greater than the first radial distance.
[0005] A substrate support member is disclosed, comprising: a disc-shaped body, including: a first surface having a first raised circular ring disposed around the circumference and defining a first side pocket portion, the first raised circular ring having a first radial width; and a second surface on the disc-shaped body relative to the first surface, the second surface having a second raised circular ring disposed around the circumference and defining a second side pocket portion, the second raised circular ring having a second radial width. The substrate support member further includes: a plurality of lifting pin openings formed through the disc-shaped body and positioned at a first distance from the center of the disc-shaped body; and a plurality of slots placed on the second surface, the slots being radially aligned with the lifting pin openings and positioned at a second distance from the disc-shaped body, the second distance being less than the circumference and greater than the first distance.
[0006] A processing chamber is disclosed, comprising: an upper window portion and a lower window portion defining a processing volume; and a substrate support member disposed within the processing volume. According to some embodiments, the substrate support member includes: a disc-shaped body having a thickness at its outer edge and a center located at an axial centerline of the disc-shaped body; a ring coupled to and surrounding the disc-shaped body; and a front pocket portion defined by a first radially inward edge extending beyond the front surface of the disc-shaped body from the front surface of the disc-shaped body and the ring. The substrate support further includes: a back pocket portion defined by a second radially inward edge extending beyond the back side of the disc-shaped body and the ring; a plurality of lifting pin openings extending through the disc-shaped body and positioned at a first radial distance from the center of the disc-shaped body; and a plurality of slots positioned on the back side at a second radial distance from the center of the disc-shaped body, the second radial distance being greater than the first radial distance. Simple Explanation of the Diagram
[0007] To gain a more detailed understanding of the features described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be obtained by referring to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate exemplary embodiments only and should not be considered as limiting the scope, as other equivalent embodiments are permissible in this disclosure.
[0008] Figure 1 is a schematic cross-sectional view of a deposition chamber according to an embodiment, which is also disclosed herein as a processing chamber.
[0009] Figure 2 is a back (i.e., bottom) view of a substrate support according to some embodiments.
[0010] Figures 3A to 3D are partial cross-sectional views of the substrate support depicted in Figure 2 according to certain embodiments.
[0011] Figure 4 is a back view of a substrate support according to some embodiments.
[0012] Figures 5A to 5D are partial cross-sectional views of the substrate support depicted in Figure 4 according to certain embodiments.
[0013] Figure 6 is a top plan view of a substrate support according to some embodiments.
[0014] For ease of understanding, the same reference numerals are used to denote common elements in the drawings, where possible. Elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. Implementation
[0015] In the following text, reference is made to embodiments of this disclosure. However, it should be understood that this disclosure is not limited to the specific embodiments described. Rather, any combination of the following features and elements, whether or not related to different embodiments, is considered in practice and implementation of this disclosure. Furthermore, while embodiments of this disclosure may achieve advantages over other possible solutions and / or prior art, whether a given embodiment achieves a particular advantage does not limit this disclosure. Therefore, the following appearances, features, embodiments, and advantages are merely illustrative and should not be considered elements or limitations of the appended claims unless expressly stated in the claims. Similarly, reference to "this disclosure" should not be construed as a generalization of any inventive subject matter disclosed herein and should not be considered elements or limitations of the appended claims unless expressly stated in the claims.
[0016] According to certain embodiments, systems and apparatus for reducing the weight of substrate supports are disclosed. A front pocket portion is provided for supporting the substrate, while a back pocket portion is also provided to reduce the weight of the substrate support. By providing the back pocket portion, the overall weight of the substrate support is reduced, providing a faster thermal cycling time for the substrate support and reducing the weight of the substrate support for transport. According to the disclosed embodiments, the lifting pin system is compatible with existing base systems by providing hollow extensions from each lifting pin hole or from the bottom of the back pocket portion to provide support for lifting pin insertion and operation.
[0017] Referring to Figure 1, a schematic diagram of a deposition chamber 100, also disclosed herein as a processing chamber, is illustrated according to an embodiment of this disclosure. The deposition chamber 100 is an epitaxial deposition chamber and can be used within a cluster tool (not shown). The deposition chamber 100 is used to grow an epitaxial film on a substrate (e.g., substrate 102). The deposition chamber 100 generates cross-flow of precursors across the top surface 150 of the substrate 102.
[0018] The deposition chamber 100 includes an upper body 156, a lower body 148 disposed below the upper body 156, and a chamber body assembly 105 disposed between the upper body 156 and the lower body 148. The upper body 156, the chamber body assembly 105, and the lower body 148 form a chamber 101. Disposed within the chamber 101 are a substrate support 106, an upper window 108, a lower window 109, a plurality of upper lamps 141, and a plurality of lower lamps 143. As illustrated, a controller 120 communicates with the deposition chamber 100 and controls processing, such as the processing described herein. The controller 120 includes a central processing unit (CPU) 152, a memory device 135, and support circuitry 158. The substrate support 106 may be a dish-shaped body and is disposed between the upper window (e.g., a dome) 108 and the lower window (e.g., a dome) 109. A plurality of upper lamps 141 are disposed between the upper window portion 108 and the cover 154. The cover 154 includes a plurality of sensors 153 disposed therein for measuring the temperature of the substrate 102. A plurality of lower lamps 143 (one of which is marked) are disposed between the lower windows 109 within the lampshade 151. The plurality of lower lamps 143 form a lower lamp assembly 145.
[0019] A processing volume 136 is formed between an upper window portion 108 and a lower window portion 109. The processing volume 136 has a substrate support 106 disposed therein. The substrate support 106 includes a top surface on which a substrate 102 is disposed. The substrate support 106 is attached to a shaft 114. The shaft 114 is connected to a motion assembly 121. The motion assembly 121 includes one or more actuators and / or adjustment devices to provide movement and / or adjustment of the shaft 114 and / or the substrate support 106 within the processing volume 136. The motion assembly 121 includes a rotation actuator 122 to rotate the shaft 114 and / or the substrate support 106 about the longitudinal axis A (e.g., the central vertical axis) of the deposition chamber 100. The motion assembly 121 further includes a vertical actuator 124 to raise and lower the substrate support 106 in the z-direction. The motion assembly 121 includes a tilt adjustment device 126 and a lateral adjustment device 128. The tilt adjustment device 126 is used to adjust the planar orientation of the substrate support 106, and the lateral adjustment device 128 is used to adjust the left and right positions of the shaft 114 and the substrate support 106 within the processing volume 136.
[0020] The substrate support 106 may include a lifting pin hole 107, also referred to as a lifting pin opening, therein. The lifting pin hole 107 is sized to accommodate a lifting pin 132 for lifting the substrate 102 from the substrate support 106 before or after the deposition process. When the substrate support 106 is lowered from the processing position to the transport position, the lifting pin 132 may be positioned on the lifting pin stop 134.
[0021] As illustrated herein, the chamber body assembly 105 is a segmented chamber body assembly. The chamber body assembly 105 includes a base plate and an injection ring. The base plate includes a base body 117, a substrate transport passage 116, and one or more exhaust passages 118 disposed therethrough. The substrate transport passage 116 is sized to allow a substrate and a robotic arm to pass through it. In some embodiments, the width of the substrate transport passage 116 is greater than 206 mm, for example, greater than 300 mm. One or more exhaust passages 118 are fluidly coupled to a processing volume 136 and an exhaust pump 119. The injection ring is disposed on top of and coupled to the base plate. The injection ring includes an injection body 113 and a plurality of gas injection passages 111. The plurality of gas injection passages 111 are vertically disposed above the substrate transport passage 116 and opposite the one or more exhaust passages 118. The gas injection passages 111 are fluidly connected to a processing gas source 112. A plurality of gas injection passages 111 are vertically offset from one or more exhaust passages 118 because the plurality of gas injection passages 111 are formed through an injection ring disposed on the top of the base plate. Therefore, the plurality of gas injection passages 111 are vertically disposed above one or more exhaust passages 118.
[0022] One or both of the substrate and the injection ring may further include a plurality of purge gas inlets (not shown). The plurality of purge gas inlets may be disposed below the plurality of gas injection passages 111, such that the plurality of purge gas inlets are positioned between the plurality of gas injection passages 111 and the substrate transport passage 116. Alternatively, the plurality of purge gas inlets may be vertically aligned with the plurality of gas injection passages 111, such that the plurality of purge gas inlets can also be represented by the plurality of gas injection passages 111. The gas injection passages 111 and purge gas inlets are positioned such that gas flow is parallel to the top surface 150 of the substrate 102 disposed within the processing volume 136.
[0023] One or more gaskets 195, 197 are disposed on the inner surface of the chamber body assembly 105 and protect the chamber body assembly 105 from the reactive gases used during the deposition process. In some embodiments, a single gasket is used, and one or more gaskets 195, 197 are combined to form a single unit.
[0024] Referring to FIG2, the back side 200 of a substrate support 206 is illustrated according to certain embodiments. The back side 200 of the substrate support 206, which can be used to replace the substrate support 106, directly supports the substrate 102 during operation of the chamber 101 containing the substrate support 206 relative to the front side 600 (illustrated in FIG6, discussed below). According to certain embodiments, the substrate support 206 includes a dish-shaped body 208 and a ring 205. The back side 200 of the substrate support 206 according to the disclosed embodiment has a back pocket portion 220. The back pocket portion 220 reduces the thermal mass of the substrate support 206 to achieve rapid thermal cycling and reduce the weight of the substrate support 206. The ring 205 of the back side 200 of the substrate support 206 extends radially from its outer edge 210 toward the center 215 of the substrate support 206. According to certain embodiments, the radial width 207, which is the difference between the outer diameter and the inner diameter of the ring 205, is between 1 mm and 187 mm. In one embodiment, the radial width 207 may be approximately 30 mm and 40 mm. The back pocket portion 220 extends from the center 215 to a radius R1 of approximately 153 mm + / - 2 mm.
[0025] One or more lifting pin holes 225 may be radially arranged at a radius R2 approximately 110 mm and 120 mm away from the center 215. In the illustrated embodiment, the three lifting pin holes 225 are shown with equal angular spacing. One or more slots 240 may be radially arranged at a radius R3 approximately 180 mm + / - 3.0 mm away from the center 215. In the illustrated embodiment, the three slots 240 are shown with equal angular spacing. The lifting pin holes 225 and slots 240 will be discussed in more detail below.
[0026] Referring to Figures 3A through 3D, a cross-section of the substrate support 206 is illustrated according to certain embodiments. In Figure 3A, the ring 205 includes one or more slots 240, which, according to certain embodiments, are elliptical recesses in the ring 205 to engage with one or more substrate support shafts (not shown in Figure 1) of the processing chamber to support and align the substrate support 206. The height H1 of the ring 205 may extend from the surface of the back pocket portion 220 of the substrate support 206 by about 1.00 mm to about 1.85 mm, for example, about 1.78 mm + / - 0.02 mm. Referring to Figures 3A through 3C, the slot 240 includes a cylindrical base portion 306 having a flared upper portion 307 to facilitate alignment of the substrate support 206 within the chamber 100. The flared upper portion 307 has a chamfer of about 0.5 mm × 0.5 mm to about 1.1 mm × 1.1 mm. According to some embodiments, the slot 240 has a depth D2 of about 1.00 mm to about 1.85 mm, for example about 1.78 mm + / - 0.02 mm, a length L1 of about 9 mm to 13 mm, and a width W1 of about 4 mm to about 7 mm.
[0027] Referring to Figures 3A to 3D, a hollow extension 327 extends from the back pocket portion 220 of the substrate support 206 and surrounds each corresponding lift pin hole 225. According to some embodiments, the hollow extension 327 may extend from the back pocket portion 220 of the substrate support 206 by a height H2 of approximately 1.78 mm + / - 0.02 mm. According to some embodiments, a portion of the lift pin hole 225 in the front pocket portion 620 of the substrate support 206 may have a diameter D3 of approximately 5 mm to approximately 6 mm. A portion of the lift pin hole 225 in the back pocket portion 220 may have a diameter D4 of approximately 3.5 mm to approximately 4.0 mm defined by the hollow extension 327. Within the hollow extension 327, the lift pin hole 225 has a transition cone 340 of approximately 89 degrees to approximately 91 degrees, configured to retain the head of the lift pin 132 within the lift pin hole 225.
[0028] Referring to FIG4, the back side 400 of a substrate support 406 according to some embodiments is shown. The back side 400 of the substrate support 406, which can be used to replace the substrate support 106, is relative to the front side 600 (discussed below), which directly supports the substrate 102 during operation of the chamber 101 containing the substrate support 406. The substrate support 406 according to some embodiments includes a disc-shaped body 408 and a ring 405. According to the disclosed embodiments, the back side 400 of the substrate support 406 has a back pocket portion 420. The back pocket portion 420 reduces the thermal mass of the substrate support 406 to achieve rapid thermal cycling and reduces the weight of the substrate support 406. The ring 405 of the back side 400 of the substrate support 406 extends radially from its outer edge 410 toward the center 415 of the substrate support 406. According to some embodiments, the radial width 407 of the ring 405 is between 1 mm and 187 mm. In one embodiment, the radial width 407 may be from about 2 mm to about 5 mm. The back pocket 420 has a radius R4 of approximately 153 mm + / - 2 mm.
[0029] One or more lifting pin holes 425 may be radially arranged at a radius R5 approximately 110 mm to 120 mm from the center 415. In the illustrated embodiment, the three lifting pin holes 425 are shown with equal angular spacing. One or more slots 440 may be radially arranged at a radius R6 approximately 180 mm + / - 3.0 mm from the center 415. In the illustrated embodiment, the three slots 440 are shown with equal angular spacing. According to some embodiments, one or more slots 440 are placed adjacent to the ring 405 and separated by gaps 445.
[0030] Referring to Figures 5A to 5D, a cross-section of the substrate support 406 is illustrated according to certain embodiments. A ring 405 is adjacent to one or more slots 440, separated from the slots 440 by a gap 445. According to certain embodiments, the one or more slots 440 are elliptical structures in the back pocket 420 to engage with one or more substrate support shafts (not shown in Figure 1) of the processing chamber to support and align the substrate support. The height H3 of the ring 405 may extend from the surface of the back pocket 420 of the substrate support 406 by about 1.00 mm to about 1.85 mm, for example, about 1.78 mm + / - 0.02 mm. Referring to Figures 5A to 5C, the slot 440 includes a cylindrical base portion 506 having a flared upper portion 507 to facilitate alignment of the substrate support 406 within the chamber 100 (as illustrated in Figure 1). The upper flared portion 507 has a chamfer of about 0.5 mm × 0.5 mm to about 1.1 mm × 1.1 mm. According to some embodiments, the slot 440 has a depth D5 of about 1.00 mm to about 1.85 mm, for example about 1.78 mm + / - 0.02 mm, a length L2 of about 9 mm to 13 mm, and a width W2 of about 4 mm to about 7 mm.
[0031] Referring to Figures 5A to 5D, a hollow extension 527 extends from the back pocket portion 420 of the substrate support 406 and surrounds each corresponding lift pin hole 425. According to some embodiments, the hollow extension 527 may extend from the back pocket portion 420 of the substrate support 406 by a height H4 of approximately 1.78 mm + / - 0.02 mm. According to some embodiments, a portion of the lift pin hole 425 in the front pocket portion 620 of the substrate support 206 may have a diameter D6 of approximately 5 mm to approximately 6 mm. A portion of the lift pin hole 515 in the back pocket portion 420 may have a diameter D7 of approximately 3.5 mm to approximately 4.0 mm, defined by the hollow extension 527. Within the hollow extension 527, the lift pin hole has a transition cone 540 of approximately 89 degrees to approximately 91 degrees, configured to retain the head of the lift pin 132 within the lift pin hole 225.
[0032] Referring to FIG6, the front side 600 of the substrate support 606 is illustrated according to certain embodiments. The substrate support 606 can be used instead of the substrate support 106 of FIG1. The back side (not shown) of the substrate support 606 can be the back side 200 of the substrate support 206 of FIG2 or the back side 400 of the substrate support 406 of FIG4.
[0033] The front side 600 of the substrate support 606 includes a ring 605 extending radially inward from edge 610 toward center 615. The surface 608 of the front side 600 and the radially inward edge 604 of the ring 605 define a front pocket portion 620. Although the various substrate supports disclosed herein are described as having a disc-shaped body (i.e., a ring on its front side 600 and a ring on the back side 200 of FIG. 2 or 400 of FIG. 4), it should be understood that these components typically form a single body. In other words, the various substrate supports of this application can alternatively be described as a disc-shaped body having a ring integrally formed therewith on each of the front and back sides, extending from the respective front and back sides. In these embodiments, the resulting substrate support has an edge thickness t (illustrated in FIG. 3A and 5A) that is a combination of ring 605 and one of ring 205 or ring 405, the combined substrate support thickness t being approximately 3.7 mm + / - 0.2 mm.
[0034] The front pocket 620 may have a radius R7 of approximately 153 mm ± 2 mm, defined by a radially inward edge 604. As illustrated in Figures 3A and 5A, the depth D1 of the front pocket 620 may be approximately 1.08 mm ± 0.2 mm. In some embodiments, the depth at the center 615 of the front pocket 620 may be approximately 1.08 mm ± 0.2 mm, while the depth of the front pocket 620 adjacent to the ring 605 may be approximately 0.48 mm ± 0.02 mm, forming a slope from the center 615 to the ring 605. In one example, the thickness at the center of the formed substrate support 606 may be approximately 0.83 mm ± 0.02 mm. In another embodiment, the thickness at the center of the formed substrate support 606 may be from approximately 0.5 mm to approximately 12.6 mm. According to some embodiments, one or more grooves 635 serving as exhaust lines may extend radially from the ring 605 toward the center 615. Each groove 635 has a depth of approximately 0.9 mm + / - 0.5 mm below the surface 608 of the front pocket portion 620.
[0035] The disc-shaped body of the substrate support 606 includes one or more lifting pin holes 625 formed therein. The lifting pin holes 625 are formed at a radius R8 away from the center, corresponding to the lifting pin hole 225 associated with the back side 200 in FIG. 2, and the lifting pin hole 425 associated with the back side 400 in FIG. 2.
[0036] By providing a back pocket according to the disclosed embodiment, the mass of the disclosed substrate support can be less than that of conventional methods, thereby reducing the time required for thermal cycling of the substrate support. In addition, it also reduces the overall weight of the substrate support for easy transport, or a substrate support having a substrate placed in a front pocket.
[0037] Although the foregoing describes embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from its basic scope, the scope of which is determined by the following claims.
[0038] 100: Deposition chamber 101: Chamber 102:Substrate 105: Chamber main body assembly 106: Substrate support 107: Lifting pin hole 108: Upper window section 109: Lower window section 111: Gas Injection Pathway 112: Processing gas sources 113: Injection of the main body 114: Shaft 116: Substrate transport path 117: Base Body 118: Exhaust passage 119: Exhaust pump 120: Controller 121: Motion Components 122: Rotary Actuator 124: Vertical Actuator 126: Tilting adjustment device 128: Lateral adjustment device 132: Lifting pin 134: Lifting pin stop 135: Memory Device 136: Processing volume 141: Lighting 143: Lowering the Light 145: Downlight assembly 148: Lower Main Body 150: Top surface 151: Lampshade 152: CPU 153: Sensor 154: Cover 156: Upper Main Body 158: Support Circuit 195: Padding 197: Padding 200: Dorsal side 205: Ring 206: Substrate support 207: Radial width 208: Disc-shaped main body 210: Outer edge 215: Center 220: Back pocket 225: Lifting pin hole 240: Slot 306: Cylindrical base portion 307: Upper part of the trumpet shape 327: Hollow Extension 340: Transition Cone 400: Dorsal side 405: Ring 406: Substrate support 407: Radial width 408: Disc-shaped body 410: Outer edge 415: Center 420: Back pocket 425: Lifting pin hole 440: Slot 445: Gap 506: Cylindrical base portion 507: Upper part of the trumpet shape 527: Hollow Extension 540: Transition Cone 600: Front 604: Radial inward edge 605: Ring 606: Substrate support 608: Surface 610: Edge 615: Center 620: Front pocket 625: Lifting pin hole 635: Trench
[0039] Domestic storage information (please note in order of storage institution, date, and number) none Overseas storage information (please note in the order of storage country, institution, date, and number) none
Claims
1. A substrate support member, comprising: A disc-shaped body having a thickness at an outer edge and a center located at an axial centerline of the disc-shaped body; a ring coupled to and surrounding the disc-shaped body; a front pocket defined by a front surface of the disc-shaped body and a first radially inward edge extending beyond the front surface of the disc-shaped body by the ring, the front pocket including one or more grooves extending radially from the ring toward the center of the disc-shaped body; a back pocket defined by a back side of the disc-shaped body and a second radially inward edge extending beyond the back side of the disc-shaped body by the ring; a plurality of lifting pin openings extending through the disc-shaped body and positioned at a first radial distance from the center of the disc-shaped body; and a plurality of slots positioned on the back side at a second radial distance from the center of the disc-shaped body, the second radial distance being greater than the first radial distance.
2. The substrate support as claimed in claim 1, wherein the front pocket portion has a radius of about 151 mm to about 155 mm and a depth of about 1.06 mm to about 1.10 mm at a center of the front pocket portion.
3. The substrate support as claimed in claim 2, wherein the front pocket portion has a depth of about 0.28 mm to about 0.68 mm at one edge of the front pocket portion adjacent to the ring.
4. The substrate support as claimed in claim 2, wherein the back pocket portion has a radius of about 1 mm to about 153 mm.
5. The substrate support as claimed in claim 4, wherein the depth of the back pocket portion is from about 0.1 mm to about 1.80 mm.
6. The substrate support as claimed in claim 5, wherein the height of a hollow extension extending from each of the plurality of lifting pin openings is about 1.76 mm to about 1.80 mm.
7. The substrate support as claimed in claim 1, wherein the thickness of the disc-shaped body at a center of the disc-shaped body is about 0.5 mm to about 12.6 mm.
8. A substrate support member, comprising: A disc-shaped body includes: a first surface having a first raised circular ring disposed around a circumference and defining a first side pocket portion, the first side pocket portion including one or more grooves extending radially from the first raised circular ring toward a center of the disc-shaped body, the first raised circular ring having a first radial width; a second surface on the disc-shaped body relative to the first surface, the second surface having a second raised circular ring disposed around the circumference and defining a second side pocket portion, the second raised circular ring having a second radial width; a plurality of lifting pin openings formed through the disc-shaped body and positioned at a first distance from a center of the disc-shaped body; and a plurality of slots disposed on the second surface, the plurality of slots being radially aligned with the lifting pin openings and positioned at a second distance from the disc-shaped body, the second distance being less than the circumference and greater than the first distance.
9. The substrate support as claimed in claim 8, wherein the first side pocket has a radius of about 151 mm to about 155 mm and a depth of about 1.06 mm to about 1.10 mm.
10. The substrate support as claimed in claim 9, wherein the first side pocket has a depth of about 0.28 mm to about 0.68 mm at one edge of the first side pocket adjacent to the first raised circular ring.
11. The substrate support as claimed in claim 9, wherein the second side pocket has a radius of about 1 mm to about 153 mm.
12. The substrate support as claimed in claim 11, wherein the depth of the second side pocket is about 1.76 mm to about 1.80 mm.
13. The substrate support as claimed in claim 12, wherein the height of a hollow extension extending from each of the plurality of lifting pin openings is about 0.1 mm to about 1.80 mm.
14. The substrate support as claimed in claim 8, wherein a thickness about 0.83 mm is found around a center line of the disc-shaped body.
15. A processing chamber, comprising: An upper window and a lower window define a processing volume; The system also includes a substrate support disposed within the processing volume, the substrate support comprising: a disc-shaped body having a thickness at an outer edge of the disc-shaped body and a center located at an axial centerline of the disc-shaped body; a ring coupled to and surrounding the disc-shaped body; a front pocket portion defined by a front surface of the disc-shaped body and a first radially inward edge extending beyond the front surface of the disc-shaped body by the ring, the front pocket portion including one or more grooves extending radially from the ring toward the center of the disc-shaped body; and a back pocket portion defined by a back side of the disc-shaped body and a second radially inward edge extending beyond the back side of the disc-shaped body by the ring. A plurality of lifting pin openings extending through the disc-shaped body and positioned at a first radial distance from the center of the disc-shaped body; and a plurality of slots positioned on the back side at a second radial distance from the center of the disc-shaped body, the second radial distance being greater than the first radial distance.
16. The processing chamber as claimed in claim 15, wherein the front pocket portion has a radius of about 151 mm to about 155 mm and a depth of about 1.06 mm to about 1.10 mm at a center of the front pocket portion.
17. The processing chamber as claimed in claim 16, wherein the front pocket of the substrate support has a depth of about 0.28 mm to about 0.68 mm at one edge of the front pocket adjacent to the ring.
18. The processing chamber as claimed in claim 16, wherein the back pocket portion of the substrate support has a radius of about 1 mm to about 153 mm.
19. The processing chamber as claimed in claim 18, wherein each of the plurality of lifting pin openings of the substrate support has a diameter of about 3.5 mm to about 3.9 mm.
20. The processing chamber as claimed in claim 19, wherein a hollow extension extending from each of the plurality of lifting pin openings of the substrate support has a height of about 1.76 mm to about 1.80 mm.
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