Water treatment system including UV reactor and method for treating water

Abstract

A UV reactor for disinfecting water, comprising a UV source printed circuit board assembly, transfers heat to a radiator having the form of a surface-to-water thermal coupler. The UV source printed circuit board assembly may include a metal-clad printed circuit board having a thermal contact area in thermal communication with the radiator.

Description

Technical Field

[0001] This disclosure relates to a water treatment system, and more particularly to a point-of-use water treatment system for residential or commercial applications. Prior Technology

[0002] Conventional water treatment systems are commonly used to treat drinking water. These systems can be configured to remove pathogens, chemical contaminants, and turbidity from the water. Many conventional treatment methods can be broadly categorized as solids separation using physical and / or chemical processes, or sterilization using heat, radiation, or chemical additives. For example, common water treatment systems often include carbon filtration, non-carbon filtration, distillation, ozone treatment, reverse osmosis, ion exchange modules, chlorination modules, aeration modules, advanced oxidation process modules, coagulation modules, sedimentation modules, or ultraviolet radiation modules.

[0003] Conventional point-of-use water treatment systems are designed for use at a single outlet, such as a sink or water dispenser. These systems are connected to a pressurized water supply to treat water as it is dispensed. In some applications, the water treatment system is located on a sink countertop. In countertop applications, the water treatment system is often connected to the end of the faucet, allowing water from the faucet to pass through the treatment system before being dispensed.

[0004] In some conventional point-of-use water treatment systems, ultraviolet (UV) energy is used to effectively disinfect fluids. Exposure to UV light is believed to adversely alter the genetic material (DNA) in cells, thereby reducing the total number of potentially pathogenic microorganisms (such as bacteria, viruses, fungi, algae, etc.). Typically, water flows through UV lamps in a UV disinfection system, exposing the microorganisms in the water to a sufficient dose of UV energy to render them ineffective. Typical water disinfection systems and devices emit UV light of approximately 254 nm, which is believed to penetrate the outer cell membrane of microorganisms, pass through the cell body, reach the DNA, and alter the genetic material of the microorganisms.

[0005] In some cases, the UV light-emitting diodes (UV-LEDs) in a UV sterilization system generate heat during operation. This heat can sometimes negatively impact the lifespan of the UV-LEDs. To dissipate this heat, conventional UV sterilization systems utilize convection cooling combined with ambient air. Metal heat sinks can be installed to facilitate heat transfer to the surrounding air. However, such cooling systems may not be effective, especially in enclosed spaces with very low airflow, such as when the system is installed in a cabinet under a sink.

[0006] UV reactors used in water treatment systems typically rely on inefficient heat transfer configurations. For example, conventional UV reactors utilize a traditional FR4 printed circuit board assembly with a heat sink mounted in one of two ways: 1) The heat sink may be mounted directly onto the component to be cooled. This sometimes involves mechanical support connections to a board or base plate, as well as thermal connections to the component, both of which increase costs. 2) If the component itself does not allow for direct heat sink mounting, additional solder pads can be placed near the component, where the heat sink can be soldered to the outer layer of the printed circuit board. Summary of the Invention

[0007] A UV reactor for disinfecting water is provided. Generally, one inventive embodiment of the subject matter described herein can be embodied in a UV reactor that irradiates a water flow using ultraviolet (UV) radiation. The UV reactor may include a treatment assembly comprising a water inlet and a water outlet, wherein the treatment assembly can be used to direct water received via the water inlet to a point of use downstream of the water outlet. The UV reactor may include a printed circuit board (PCB) comprising a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate. The first substrate includes a first surface having circuit regions.

[0008] In one embodiment, the UV reactor may include a UV light-emitting diode (UV-LED) operatively connected to a PCB, wherein the UV-LED may be oriented to direct UV energy into the processing assembly.

[0009] The thermal contact area of ​​the thermally conductive substrate can be exposed, so that there is no dielectric and the first substrate in the thermal contact area, wherein the thermal contact area is in thermal communication with the water flowing through the UV reactor.

[0010] The above and other embodiments may optionally include one or more of the following features, individually or in combination. In particular, one embodiment includes a combination of all features.

[0011] In some embodiments, the UV reactor may include a thermally conductive material having a fluid contact surface arranged to define at least a portion of the fluid path of water flowing through the UV reactor. The thermally conductive material may be thermally coupled to a thermal contact area of ​​a thermally conductive substrate to facilitate thermal communication between the water flowing through the UV reactor and the thermal contact area.

[0012] In some embodiments, the thermal contact area may be thermally coupled to the water flowing through the UV reactor via a thermally conductive material.

[0013] In some embodiments, a thermally conductive medium may be disposed between the thermal contact area and the thermally conductive material to promote thermal connectivity between the water flowing through the UV reactor and the thermal contact area.

[0014] In some embodiments, the fluid contact surface of the thermally conductive material may be located downstream of the processing assembly.

[0015] In some embodiments, the treatment assembly may include a water treatment chamber having a first end and a second end, wherein a longitudinal axis extends between the two ends. The water treatment chamber may include a chamber inlet in fluid communication with a water inlet to receive water to be treated, and includes a plurality of chamber outlets operable to guide water in a manner substantially non-parallel to the longitudinal axis of the water treatment chamber.

[0016] UV-LEDs can be configured to provide UV energy to the water treatment chamber, wherein the UV energy can be directed substantially parallel to the longitudinal axis of the water treatment chamber.

[0017] A cooling chamber may be in fluid communication with multiple outlets of the water treatment chamber. The cooling chamber may be in thermal communication with the UV-LED to facilitate heat transfer from the UV-LED to the water in fluid communication with the water outlets. The cooling chamber may be used to guide water to the water outlets.

[0018] In some embodiments, the fluid contact surface defines at least a portion of the fluid path of the cooling chamber.

[0019] In some embodiments, the UV reactor may include a reactor body having a reactor body inlet opening and a reactor body outlet opening. The UV reactor may include a top cover disposed on the reactor body outlet opening and including a cooling chamber and a UV-LED.

[0020] The top cover may include a UV transmission window configured to facilitate the formation of a watertight seal between the UV-LED and the water treatment chamber. The UV transmission window may include a water chamber side and a UV source side, and may be positioned to facilitate the transmission of UV light from the UV-LED to the water treatment chamber.

[0021] The top cover may include an inner support surface, which can be used to support the water chamber side of the UV transmission window in a position relative to the UV-LED.

[0022] The top cover may include a plurality of outlet channels, each channel forming at least a portion of each of the plurality of chamber outlets.

[0023] The cooling chamber can be configured to be in direct fluid communication with each of the plurality of chamber outlets. The cooling chamber can be defined at least by an outlet collection tank, a UV transmission window, and a thermally conductive material.

[0024] In some embodiments, the cooling chamber may at least partially surround the reactor body outlet opening.

[0025] In some embodiments, the PCB may be a metal-clad printed circuit board.

[0026] In some embodiments, a UV-LED may be placed on a first surface of a first substrate.

[0027] In some embodiments, the solder resist layer may be placed on the first surface of the first substrate.

[0028] In some embodiments, the upper and lower surfaces of the thermally conductive substrate are completely free of solder resist.

[0029] In some embodiments, the thermally conductive substrate may include an upper surface that defines a thermal contact area.

[0030] In some embodiments, the extension of the thermally conductive substrate may extend from a main surface of the thermally conductive substrate on which a dielectric material is disposed. The extension includes the upper surface. A plane of the first substrate may intersect the extension.

[0031] In some embodiments, a first substrate and a dielectric material may define a first edge. A thermally conductive substrate may be disposed adjacent to the first edge and extend from both sides of the first edge, such that a thermal contact area is located near one side of the first edge, and the thermally conductive substrate is bonded to a dielectric material near the other side of the first edge.

[0032] Generally, one inventive aspect of the subject matter described herein can be embodied in a water treatment system for treating water. This water treatment system may include a treatment assembly inlet and a treatment assembly outlet, wherein the treatment assembly inlet is used to receive water, and the treatment assembly outlet is used to discharge water from the water treatment system.

[0033] The water treatment system may include a printed circuit board (PCB) comprising a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate. The first substrate may include a first surface having circuit regions. Thermal contact regions of the thermally conductive substrate may be exposed, such that the thermal contact regions are free of the dielectric material and the first substrate. A UV source may be operatively connected to the circuit regions of the printed circuit board, wherein the UV source may be configured to provide UV energy for disinfecting the water.

[0034] The water treatment system may include a UV reactor configured to promote water disinfection by applying UV energy to water flowing through the UV reactor. The UV reactor may include a water inlet operatively coupled to the inlet of the treatment assembly to receive water, and a water outlet for discharging water from the UV reactor. The UV reactor may include a water treatment chamber having a first end and a second end and a longitudinal axis extending between the two ends, wherein the water treatment chamber may include a chamber inlet having fluid communication with the water inlet to receive water to be treated. The water treatment chamber may include a plurality of chamber outlets that can be used to guide water in a manner substantially non-parallel to the longitudinal axis of the water treatment chamber, wherein the UV source is arranged to provide UV energy to the water treatment chamber in a manner substantially parallel to the longitudinal axis. The UV reactor may include a cooling chamber fluidly communication with the plurality of water outlets of the water treatment chamber, wherein the cooling chamber may be thermally communication with the thermal contact area of ​​the thermally conductive substrate to promote heat energy transfer from the UV source to the water fluidly communication with the water outlets. The cooling chamber can be used to guide water to the water outlets.

[0035] The above and other embodiments may optionally include one or more of the following features, individually or in combination. In particular, one embodiment includes a combination of all features.

[0036] In some embodiments, the water treatment system may include a thermally conductive material having a fluid contact surface arranged to define at least a portion of the fluid path of water flowing through the water treatment system. The thermally conductive material may be thermally coupled to a thermal contact area of ​​a thermally conductive substrate to facilitate thermal communication between the water treatment system and the thermal contact area.

[0037] In some embodiments, the thermal contact area may be thermally coupled to the water flowing through the water treatment system via a thermally conductive material.

[0038] In some embodiments, a thermally conductive medium may be disposed between the thermal contact area and the thermally conductive material to promote thermal connectivity between the water flowing through the UV reactor and the thermal contact area.

[0039] In some embodiments, the fluid contact surface of the thermally conductive material may be located downstream of the water treatment chamber.

[0040] In some embodiments, the water treatment system includes a reactor body having a reactor body inlet opening and a reactor body outlet opening. The water treatment system may include a top cover disposed on the reactor body outlet opening and including a cooling chamber and a UV source.

[0041] The top cover may include a UV transmission window configured to facilitate the formation of a watertight seal between the UV source and the water treatment chamber. The UV transmission window may include a water chamber side and a UV source side. The UV transmission window may be positioned to facilitate the transmission of UV light from the UV source to the water treatment chamber. The top cover may include an inner support surface that can be used to support the water chamber side of the UV transmission window relative to the UV source. The top cover may include a plurality of outlet channels, each channel forming at least a portion of one of a plurality of chamber outlets.

[0042] The cooling chamber can be configured to be in direct fluid communication with each of the plurality of chamber outlets, wherein the cooling chamber can be defined at least by an outlet collection tank, a UV transmission window, and a thermally conductive material.

[0043] In some embodiments, the cooling chamber may at least partially surround the reactor body outlet opening.

[0044] In some embodiments, a PCB may be a metal-clad printed circuit board.

[0045] In some embodiments, the UV source may be placed on the first surface of the first substrate.

[0046] In some embodiments, the solder resist layer may be placed on the first surface of the first substrate.

[0047] In some embodiments, the upper and lower surfaces of the thermally conductive substrate are completely free of solder resist.

[0048] In some embodiments, the thermally conductive substrate may include an upper surface that defines a thermal contact area.

[0049] In some embodiments, the thermally conductive substrate may include a lower surface defining a thermal contact area. This thermal contact area may be thermally coupled to a heat sink, such as the heat sink described herein or an alternative configuration of a heat sink, such as a heat sink including a geometry different from one or more heat sinks shown in the illustrated embodiments (e.g., where a stainless steel heat sink contacts the lower surface of the thermally conductive substrate or both the upper and lower surfaces of the thermally conductive substrate).

[0050] In some embodiments, an extension of the thermally conductive substrate extends from a main surface of the thermally conductive substrate on which the dielectric is disposed. The extension includes the upper surface. A plane of the first substrate intersects the extension.

[0051] In some embodiments, a first substrate and a dielectric material may define a first edge, wherein a thermally conductive substrate may be disposed adjacent to the first edge and extend from both sides of the first edge, such that a thermal contact area is located near one side of the first edge, and the thermally conductive substrate is bonded to a dielectric material near the other side of the first edge.

[0052] Generally, one inventive aspect of the subject matter described herein can be embodied in a method for disinfecting water. This method may include providing a treatment assembly comprising a water inlet and a water outlet, and directing water from the water inlet through the treatment assembly to the water outlet to a point of use downstream of the water outlet. This method may include providing a UV source connected to a circuit area of ​​a printed circuit board (PCB), wherein the PCB includes a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate, and wherein the first substrate includes a first surface having the circuit area. A thermal contact area of ​​the thermally conductive substrate may be exposed such that the thermal contact area is free of the dielectric material and the first substrate. This method may include conducting heat from the UV source to the thermal contact area of ​​the PCB; and conducting heat from the thermal contact area of ​​the PCB to water flowing to the water outlet.

[0053] The above and other embodiments may optionally include one or more of the following features, individually or in combination. In particular, one embodiment includes a combination of all features.

[0054] In some embodiments, the PCB may be a metal-clad printed circuit board.

[0055] In some embodiments, this method may include supplying UV energy from a UV source to water flowing through the treatment assembly.

[0056] Before explaining the embodiments of the present invention in detail, it should be understood that the present invention is not limited to the operational or structural details and arrangements of the components set forth in the following description or shown in the accompanying drawings. The present invention may be implemented in various other embodiments and may be practiced or performed in alternative ways not explicitly disclosed herein. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of "comprising" and "including" and variations thereof is intended to cover items listed thereafter and their equivalents, as well as additional items and their equivalents. In addition, enumeration may be used in the description of various embodiments. Unless otherwise expressly stated, the use of enumeration should not be construed as limiting the present invention to any particular order or number of components. The use of enumeration should also not be construed as excluding from the scope of the present invention any additional steps or components that may be combined with or incorporated into the enumerated steps or components. Simple Explanation of the Diagram

[0057] [Figure 1] shows a printed circuit board assembly and a heat sink according to an embodiment.

[0058] [Figure 2] shows a printed circuit board assembly and a heat sink according to another embodiment.

[0059] [Figure 3] shows a printed circuit board assembly and a heat sink according to yet another embodiment.

[0060] [Figure 4] shows a perspective view of a water treatment system according to an embodiment.

[0061] [Figure 5] shows an exploded view of the water treatment system in Figure 1.

[0062] [Figure 6] shows an exploded view of the water treatment system in Figure 1.

[0063] [Figure 7] shows a perspective view of a UV reactor according to an embodiment.

[0064] [Figure 8] shows a side view of the UV reactor in Figure 1.

[0065] [Figure 9] shows another side view of the UV reactor in Figure 1.

[0066] [Figure 10] shows an exploded view of the UV reactor in Figure 1.

[0067] [Figure 11] shows a cross-sectional view of the UV reactor in Figure 1.

[0068] [Figure 12] shows a cross-sectional view of the UV reactor in Figure 1.

[0069] [Figure 13] shows a cross-sectional view of the UV reactor in Figure 1.

[0070] [Figure 14] shows a cross-sectional view of the UV reactor in Figure 1.

[0071] [Figure 15] shows an enlarged view of the cross-sectional view of Figure 14.

[0072] [Figure 16] shows a printed circuit board assembly according to one embodiment of the present disclosure. Implementation

[0073] A UV reactor for disinfecting water is provided and includes a UV source printed circuit board assembly configured to transfer heat to a heat sink in the form of a water-facing thermal coupler. The UV source printed circuit board assembly may include a metal-clad printed circuit board having a thermal contact area in thermal communication with the heat sink.

[0074] In one embodiment, a connection may be provided between a metal-clad PCB (or a similar board with a thermally conductive inner layer) and components mounted on the metal-clad PCB. These components may generate heat, which can be conducted by the metal-clad PCB through one or more intermediate materials or layers into a heat removal material (such as air or water).

[0075] In a typical FR4 PCB, the core is made of glass fiber, which is neither conductive nor a good thermal conductor. Therefore, most of the heat transfer is provided by the outer (thin) (numerous) copper layers. For this reason, to remove heat from an FR4 PCB, the heat sink is often thermally coupled to the outer copper layers of the board.

[0076] Compared to conventional FR4 PCBs, one embodiment of this disclosure may include a metal-clad PCB comprising three conductive layers: top and bottom copper layers and a core layer (such as a copper or aluminum core). For a metal-clad PCB, a core may be provided because the core offers significantly greater thermal conductivity than the top and bottom layers; in one embodiment, it is large enough to allow thermal pads for components (such as LEDs) to be directly soldered to the core layer instead of the top or bottom layers. To improve heat transfer to a heatsink mounted on the board, this heatsink may also be directly coupled to the core.

[0077] In one embodiment, the component may be soldered to an outer layer (such as the top or bottom layer) of the metal-clad PCB. This configuration may provide one or more additional insulating layers between the heat sink and the main heat carrier. Compared to embodiments where the component is soldered directly to the core layer, this configuration of soldering the component to the top or bottom layer of the metal-clad PCB may have lower thermal transfer efficiency; however, in either case, the thermal conductivity is significantly greater than that of the conventional FR4 PCB configuration.

[0078] According to one embodiment, a metal-clad PCB may include a board with a core layer without a solder mask, wherein a portion of a core layer is exposed according to one or more embodiments described herein. An outer conductive layer may or may not include a solder mask. The outer conductive layer may be thermally coupled to the core layer via a dielectric layer having high thermal conductivity. The core layer may be the primary heat carrier, such that additional layers (such as the outer conductive layer and dielectric layer), as well as the solder mask, may be considered more insulating rather than promoting heat conduction.

[0079] In one embodiment, the metal-clad PCB may be structured to remove (or, depending on the manufacturing process, not to lay out) additional layers that would otherwise be located between the heat sink and the core layer (such as a copper core layer).

[0080] In one embodiment, the core layer of the metal-clad PCB may be assigned to an electrical net shared by all electronic components, which are arranged for active cooling via a heatsink. This may be a ground net; however, the core layer may be assigned to some other net or a non-electrically connected floating net. Heatsinks that arrange heat transfer can then be directly soldered to the core material. The heatsink may be connected to the same core material via mechanical contacts, thermal compounds, soldering, or other methods.

[0081] In one embodiment, the LED serving as a UV source may include a thermal pad that can be attached to the core layer. The heat sink may be mechanically (metal-to-metal contact) or attached to the core layer using a thermal compound.

[0082] In an alternative embodiment, the LED may not have a thermal pad, but instead uses a specific pin, pad, or mesh as a heat transfer connection to the die. In this case, the core layer may be attached to that specific pin, pad, or mesh.

[0083] In one embodiment, if the heat sink is not connected to a mesh used as a thermal link for the relevant components, the dielectric layer of the metal cladding plate can be left in place, and heat flux can flow from the mesh to the outer conductor layer and through the dielectric layer to the core layer.

[0084] In one embodiment, the component to be cooled and the heat sink connection can be located on the same side of the metal-clad PCB. Alternatively, the component and heat sink can be located on opposite sides of a double-layer PCB, wherein the PCB stack includes two dielectric layers, two copper layers, and a silkscreen layer between the component thermal pad and the heat sink. In one embodiment, by eliminating all layers except the core layer between the component and the heat sink, mounting the heat sink on the component side or opposite side of the core layer does not result in additional heat flux loss. I. [Water Treatment System Overview]

[0085] A water treatment system 100 according to an embodiment of the present disclosure is shown in Figures 4 to 6 and is generally designated as 100. In the illustrated embodiment, the water treatment system 100 includes a treatment assembly 130 and a base assembly 110. The water treatment system 100 may include a removable cover (not shown) configured to interface with the base assembly 110 to conceal one or more or all aspects of the treatment assembly 130. In one embodiment, the removable cover conceals the treatment assembly 130 to enhance the aesthetics of the water treatment system 100, allowing it to be placed on a countertop or visible during everyday use.

[0086] Removable covers provide a separate, aesthetically pleasing housing structure, which allows for updates or changes to the form, material, or color of the water treatment system 100. For example, a removable cover in one application can be replaced by another removable cover with one or more different appearances in form, material, color, or combinations thereof.

[0087] In one embodiment, the water treatment system 100 may include UV disinfection capability. The water treatment system 100 may include a UV disinfection assembly or a UV reactor 200 providing such UV disinfection capability as described herein. In one embodiment, the UV reactor 200 may include a long-lasting / permanent LED reactor assembly mounted within a substrate assembly 110.

[0088] In the embodiments shown in Figures 4 to 6, the processing assembly 130 can be removed from the base assembly 110 in a manner that facilitates the storage or placement of the water treatment system 100 for operation within a space that restricts access to one or more sides or portions of the water treatment system 100 (such as the upper 102, rear 103, side 104, or bottom 105, or combinations thereof). For example, the space between the upper 102 and another object (such as an upper cabinet) may be small enough to limit access to the upper 102 or vertical displacement of one or more components of the water treatment system 100 (such as the processing assembly 130). In one embodiment, the water treatment system 100 can be viewed as incorporating a "flat" profile that preserves usable workspace in countertop applications and significantly reduces storage space requirements when placed under the countertop.

[0089] An exemplary water treatment system is described in more detail in U.S. Patent Application No. 62 / 839,145 entitled "Water Treatment System" filed by Lautzenheiser et al., April 26, 2019, and U.S. Patent Application No. 16 / 857,253 entitled "Water Treatment System" filed by Lautzenheiser et al., April 24, 2020—the entire contents of which are incorporated herein by reference.

[0090] In one embodiment, the removable cover may engage or disengage from the base assembly 110 in a direction substantially parallel to the surface on which the base assembly 110 is placed. In this way, the removable cover can facilitate access to the treatment assembly 130 while the water treatment system 100 is in a space-constrained location, which may limit access to the water treatment system 100 along one or more sides or portions of the water treatment system 100.

[0091] The water treatment system 100 is operable to receive untreated water from a source (such as a chilled water service line configured for pressurized supply) via a water inlet pipe 112. The water treatment system 100 can also be used to treat the untreated water received from the source and deliver treated water to a water outlet pipe 114, which can be coupled to a faucet to deliver the treated water to a point of use. In one embodiment, the water connections for the inlet and outlet pipes or conduits are disposed or located in a space below the unit accessible to installers. Connectors provide rotatability to align system components during installation.

[0092] The treatment assembly 130 may include a water inlet operable to receive water from the water inlet pipe 112 via a base assembly inlet passage. The water inlet of the treatment assembly 130 may include a one-way valve or check valve coupled thereto (e.g., configured to dock with the water inlet of the treatment container 134) to substantially prevent resident water in the treatment assembly 130 from leaking out during transport to a maintenance location (e.g., a collection container or more commonly a kitchen sink).

[0093] The processing assembly 130 may include a closing assembly 132 having a handle assembly 136 operable to secure the processing assembly 130 in a recessed space provided by the base assembly 110. Operation of the handle assembly 136 from a disengaged position to an engaged position can form a watertight connection between the base assembly 110 and the processing assembly 130, thus resisting the tendency for water to adhere.

[0094] In the illustrated embodiment, the preliminary filter of the treatment assembly 130, also referred to as the pre-filter, provides filtration of particles present in the untreated water received via the treatment assembly inlet. Water flowing through the preliminary filter can be conveyed to downstream filters, such as a filter assembly, which is operable to further treat the water that has passed through the preliminary filter. In one embodiment, the preliminary filter may be configured to provide filtration of particles that, if not removed upstream of the filter assembly, could significantly reduce the lifespan of the filter assembly. For example, the filter assembly may be configured to filter particles at a target flow rate considered fine or small, while the preliminary filter may be configured to filter particles at that target flow rate considered larger (e.g., 30 to 500 micrometers). Without a preliminary filter, these larger particles could clog or reduce the effective filtration of the filter assembly and its effective lifespan.

[0095] The filter media of the filter assembly may include a carbon block filter, which is operable to absorb or filter (or absorb and filter) particles and contaminants contained in water, such that the water discharged from the filter media can be considered filtered and ready for downstream disinfection by the UV reactor 200.

[0096] According to one embodiment, a base assembly 110 includes an upper portion 102, a rear portion 103, a side portion 104, and a bottom portion 105 as described herein. The base assembly 110 is operatively and removably coupled to a processing assembly 130, for example, by facilitating the formation of a watertight seal between a water supply connector and a processing assembly coupling, and between a processing assembly outlet and a processing assembly connector of the base assembly 110. In one embodiment, the base assembly 110 may include a body providing a detachable structure to retain and connect the processing assembly 130.

[0097] The base assembly 110 in the illustrated embodiment includes a cover 310 removable from the housing assembly 313 to expose internal components 312, including, for example, sensor units 316 (such as fluid sensors) and a control system 318. The housing assembly 313 provides the structural core of the water treatment system 100, offering a platform for positioning an assembly that can be modularized and facilitates one or more aspects of drinking water treatment. This configuration allows for the continuous evolution of the water treatment system 100 (e.g., changes to components such as displays or control units) while maintaining substantially the same form factor. Accordingly, the water treatment system 100 can be updated to remain up-to-date in the future.

[0098] The base assembly 110 may include a display unit 314 having a display 315, which can provide visual feedback to the user regarding the operation of the water treatment system 100. In the illustrated embodiment, the cover 310 conceals the display 315 and the display unit 314. Alternatively, the display 315 and the cover 310 may be configured such that the display 315 is partially or completely concealed by the cover 310.

[0099] Lens 311 can be optically coupled between display 315 and an external area of ​​water treatment system 100 to allow optical communication between display 315 and the external area.

[0100] The base assembly 110 may include a base or base 105 operable to stabilize the base assembly 110 on a horizontal surface, such as a countertop or cabinet. The base 105 may be configured with a peripheral edge that contacts the horizontal surface while supporting the housing assembly 313 at a distance relative to the horizontal surface, such that water or other components can be presented on the horizontal surface. The base 105 may include one or more access points operable to receive a water inlet pipe 112 and a water outlet pipe 114, respectively, for connection to a water supply inlet and a treated water outlet.

[0101] The control system 318 in the illustrated embodiment may include circuitry configured to guide the operation of the water treatment system 100, including guiding the display unit 314 to provide visual feedback to the user, and receiving sensor information obtained from the sensor unit 316. As described herein, the control system 318 may also be operable to guide the operation of the UV reactor 200 to disinfect water discharged from the treatment assembly 130 and discharge treated water to a treated water outlet 360, which is in fluid communication with the water outlet pipe 114.

[0102] In the illustrated embodiment, internal components of the base assembly 110 mounted on the housing assembly 313, such as the wet and electrical unit assembly, may be covered by a rear cover assembly (such as cover 310) that provides aesthetics and potential protection for internal components and accommodates a light guide structure that provides system health indication as an extension of the display unit 314.

[0103] The bottom 105 (such as the base base) can be fixed to the unit assembly to provide aesthetic, piping system management, and stability, structural, or protective housing space to assist in the required positioning means.

[0104] The internal components of the base assembly 110 may include, as described herein, a display unit 314, a control system 318, a sensor unit 316, and a UV reactor 200. In the illustrated embodiment, the UV reactor 200 includes a UV reactor inlet 232 configured to be in fluid communication with a treated water outlet 360 to receive water discharged from the treatment assembly 130. The UV reactor 200 can be used to supply UV energy to the water received via the UV reactor inlet 232 to disinfect the water. The disinfected water may be discharged or output via the UV reactor outlet 230, which may be in fluid communication with a water inlet 385 of the sensor unit 316.

[0105] In the illustrated embodiment, the component includes an RFID communicator or wireless communication circuit 390, which may be capable of wirelessly communicating with one or more components external to the base assembly 110. For example, the wireless communication circuit 390 may communicate with an RFID component (such as an RFID tag) disposed in the filter assembly.

[0106] In one embodiment, the wireless communication circuit 390 may include an RFID antenna attached to the housing assembly 313 near the processing assembly 130 in the mounting location, and may be connected to the control system 318 (or main electronic components) via a detachable tether.

[0107] The electrical and control systems are not limited to the systems described in the embodiments shown in conjunction with the water treatment system 100; it should be understood that the electrical and control systems may be updated, replaced, or replaced with other technical systems as appropriate, independently of other system components.

[0108] The water path components of the base assembly 110 (such as sensor unit 316 and UV reactor 200) can be arranged and fixed to the housing assembly 313. Sensor unit 316 can monitor and measure water flow. Additionally, or alternatively, sensor unit 316 can measure water temperature.

[0109] In one embodiment, after establishing a connection between the wireless communication circuit 390, display unit 314, and any sensors (such as sensor unit 316) and the control system 318, the control system 318 can be directly inserted into or connected to the UV reactor 200. The connection to the UV reactor 200 can be formed via a connection panel on the bottom surface of the control system 318. The connection panel can also be a connector for the wireless communication circuits 390, 314, and any sensors. Positioning the connection panel on the bottom surface of the control system 318 helps prevent the connection from being easily visible, improving the overall aesthetics of the assembly and substantially shielding the electrical connections from any accidental water splashes. II. [UV reactor]

[0110] A UV reactor according to an embodiment of the present disclosure is shown in Figures 7 to 15 and is generally designated as 200. The UV reactor 200 in the illustrated embodiment includes a UV reactor inlet 232 and a UV reactor outlet 230. The UV reactor 200 may include one or more of the following components: ●Reactor body 201; ● End cap 202, having at least one outlet in fluid communication with UV reactor outlet 230; ●UV transmission window 205; ●Surface hydrothermal coupler 406; ● A first seal 210 is disposed between the surface hydrothermal coupler 406 and the end cap 202 to substantially prevent leakage across the sealing interface between the surface hydrothermal coupler 406 and the end cap 202; ● A second seal 203 is disposed between the surface hydrothermal coupler 406 and the UV transmission window 205 to substantially prevent leakage across the sealing interface between the second seal 203 and the UV transmission window 205; ●UV source assembly 400, which has one or more UV sources 402 as described herein; ● Support cover 209, which is provided and configured to interface with end cover 202 and can be used to fix UV source assembly 400, first and second seals 210, 203, UV transmission window 205, and surface hydrothermal coupler 406 in place; ● Reactor body support 211, which can be used to fix the reactor body 201 to facilitate the formation of the water treatment chamber 245; ● Fluid element 216, which can be disposed within water treatment chamber 245 to influence water flow according to application (e.g., to generate laminar flow); and ● Fastener 214, which can be used to interface with support cover 209, end cover 202 and reactor body support 211 to maintain a watertight seal from UV reactor inlet 232 to UV reactor outlet 230 in water treatment chamber 245.

[0111] In the illustrated embodiment, the reactor body support 211 and end cap 202 are connected together in a substantially permanent, leaktight manner. For example, the reactor body support 211 and end cap 202 may be screw-welded together to form a seal 204. This connection of the reactor body support 211 and end cap 202 provides a leak-proof connection without the need for a removable seal—although such a removable seal may be incorporated into an alternative embodiment of the UV reactor 200.

[0112] The UV reactor 200 can be configured to allow water to enter the UV reactor inlet 232, which is partially defined by the reactor body support 211. The UV reactor inlet 232 may include a hose barb connector 233 coupled to the reactor body support 211 (e.g., via spin welding) to define at least a portion of the UV reactor inlet 232, facilitating water entry into the UV reactor 200 and flow through the water treatment chamber 245. Water can be discharged from the UV reactor 200 via the UV reactor outlet 230, which may include a hose barb connector 237 coupled to an end cap 202 (e.g., via spin welding) to define at least a portion of the UV reactor outlet 230.

[0113] In the illustrated embodiment, the UV reactor inlet 232 and UV reactor outlet 230 can be configured to guide water in a direction transverse to the longitudinal axis 240 of the UV reactor 200. This configuration can reduce the vertical profile of the UV reactor 200.

[0114] The water treatment chamber 245 may include an inner surface 290 of the reactor body 201, which extends substantially from a first end 291 to a second end 292 and a longitudinal axis 240 extending between the two ends. The inner surface 290 of the water treatment chamber 245 may not define the entire inner surface of the water treatment chamber. For example, the end cap 202, the reactor body support 211, and the fluid element 216 may define one or more portions of the inner surface of the water treatment chamber 245.

[0115] The reactor body 201 may include first and second openings respectively adjacent to the first and second ends 291, 292 of the water treatment chamber 245. For example, the reactor body 201 may be provided in the form of a hollow cylinder, wherein the first and second ends correspond to the bottom and top of the reactor body 201 shown in Figures 12 to 14. However, the reactor body 201 may be any kind of cylinder and is not limited to the cylindrical structure depicted in the illustrated embodiments. For example, the cross-sectional shape of the reactor body 201 may vary depending on the application, such as a hexagonal prism or an octagonal prism. As another example, the reactor body 201 may include more than one longitudinal axis, such that the reactor body 201 includes multiple segments having non-collinear longitudinal axes.

[0116] Depending on the application, the reactor body 201 may be constructed of one or more materials. For example, the reactor body 201 may include a first and a second material arranged concentrically, such as the first material forming a sheath around the second material, the surface of the second material being in contact with water as it flows through the water treatment chamber 245. As another example, the reactor body 201 may be entirely formed of a UV-reflective material, such as PTFE or ePTFE. The reflection of UV light within the water treatment chamber 245 of the reactor body 201 can help maintain the intensity of the UV light therein and can substantially prevent UV light leakage to the outside of the water treatment chamber 245.

[0117] In the illustrated embodiment, the UV source assembly 400 may be located near the second end 292 of the water treatment chamber 245. The UV source assembly 400 may include a printed circuit board (PCB) assembly 480 and may be configured to guide UV light through the UV transmission window 205 into the water treatment chamber 245. The UV source assembly 400, as described herein, may include the PCB assembly 480 and a UV source configuration including a plurality of UV sources 402, which may be UV LEDs. The UV source assembly 400 may include a connector 223 configured to supply power to the circuitry of the UV source assembly 400.

[0118] In use, within the water treatment chamber 245, with the UV reactor 200 vertically positioned as shown in Figures 7 to 15, water flows upward toward the UV source 402 of the PCB assembly 480 of the UV source assembly 400, and then flows out of the water treatment chamber 245 via at least one outlet path at least partially defined by the end cap 202. This at least one outlet path may be fluidly coupled to the UV reactor outlet 230 to discharge treated water from the UV reactor 200. This at least one outlet path may include a plurality of chamber outlets 246, shown in more detail in the illustrated embodiments of Figures 10 and 11. The plurality of chamber outlets 246 may be fluidly coupled to a heat exchange zone 236, described herein as a tank or cooling chamber, in which water conducts heat away from the surface water heat coupler 406 and then exits from the UV reactor outlet 230, as shown in Figures 12 and 14, indicated by dashed arrows.

[0119] The plurality of chamber outlets 246 may be defined at least partially by a plurality of individual openings in the inner surface 290 of the water treatment chamber 245, allowing water to be discharged radially relative to the longitudinal axis 240 of the water treatment chamber 245. More specifically, the plurality of chamber outlets 246 may be defined by individual channels provided in the end cap 202 and a portion of a surface of the UV transmission window 205 facing the chamber. The plurality of chamber outlets 246 may be configured differently from those described above.

[0120] In the illustrated embodiment of the UV reactor 200, a fluid path defined by a plurality of chamber outlets 246 may be formed beside a second end 292 of the end cap 202. The plurality of chamber outlets 246 may lead to a collection tank or heat exchange zone 236, which is in fluid communication with the UV reactor outlet 230 provided by the end cap 202. As shown in the illustrated embodiments of Figures 10 and 11, the collection tank or heat exchange zone 236 may extend around a portion or all of the inner circumference of the end cap 202.

[0121] In the embodiments shown in Figures 1 and 7-15, the UV source assembly 400 is thermally coupled to a surface-to-water thermal coupler 406, which may be made of metal, such as steel, aluminum, or copper. The surface-to-water thermal coupler 406 can operate as a heat sink, drawing heat energy from the UV source assembly 400 and facilitating the transfer of that heat energy to one or more other media, such as ultimately to water crossing the UV reactor outlet 230. The UV source assembly 400 may include a thermal contact area 440 that is thermally coupled to or in direct thermal contact with the surface-to-water thermal coupler 406. In one embodiment, a thermally conductive intermediate material (e.g., thermal paste, hot grease, or thermal compound) may be disposed between the thermal contact area 440 and the surface-to-water thermal coupler 406.

[0122] The UV source assembly 400 may include an integrated source-based thermal coupler that can be coupled to a surface water thermal coupler 406. For example, the source-based thermal coupler and the surface water thermal coupler 406 may be in contact with each other, such that water flowing through the heat exchange zone 236 can absorb heat from the UV source assembly 400. This may allow water to flow through a collection tank or heat exchange zone 236 to cool the surface water thermal coupler 406, thereby cooling the source-based thermal coupler and one or more UV sources 402 of the UV source assembly 400.

[0123] In the illustrated embodiment, the UV reactor 200 may include a fluid element 216 disposed to form a first end of a water treatment chamber 245. In one embodiment, the fluid element 216 may be fitted with a baffle to facilitate laminar flow from the first end 291 to the second end 292. The fluid element 216 may include a plurality of fluid paths that transport fluid received from the UV reactor inlet 232 to the water treatment chamber 245. The UV reactor 200 may include a flow deflector or baffle 266, optionally integrated with the fluid element 216, to facilitate turbulent flow near the plurality of fluid paths of the fluid element 216 on opposite sides of the water treatment chamber 245.

[0124] In the illustrated embodiment, the UV source assembly 400 is spaced apart from the UV transmission window 205. As described herein, the second seal 203 may be configured as a spacer operable to fill at least a portion or a large portion of the space between the UV source assembly 400 and the UV transmission window 205. By filling this space, which might otherwise contain air or another gas, the second seal 203 reduces the amount of air or other gas in the space.

[0125] As described herein, the second seal 203 may include a plurality of openings 213 corresponding to each of a plurality of UV sources (such as UV LEDs) of the UV source assembly 400, allowing light from the UV sources to enter the water treatment chamber 245 via UV transmission windows 205. The second seal 203 may include alignment features that can be used to angularly align the second seal 203 with respect to the UV source assembly 400 and the UV sources 402 disposed on the UV source assembly 400, so that light can be guided from the UV source assembly 400 to the UV transmission windows 205 and into the water treatment chamber 245.

[0126] In the illustrated embodiment, the second seal 203 is made of a silicon-based material. However, it should be understood that this disclosure is not so limited. The second seal 203 can be made of any kind of material or combination of materials. For example, the second seal 203 can be formed of a first material and a second material different from the first material.

[0127] UV reactor 200, including water treatment chamber 245, can be constructed in various ways described herein. Additional exemplary constructions can be found in U.S. Publication No. 2021 / 0032127 entitled "Water Treatment Systems" by Wu et al., published on February 4, 2021 – the entire contents of which are incorporated herein by reference. III. [Water treatment room material tilt]

[0128] The water treatment chamber 245 in the embodiments shown in Figures 7 to 15 can be constructed using various materials and in various ways. The material forming the water treatment chamber 245 can provide a UV-reflective surface. The entire interior surface of the water treatment chamber 245 can be reflective of UV light, or a portion of the interior surface can be reflective of UV light.

[0129] A UV-reflective surface can be provided to reflect UV radiation back towards the water to be purified, thereby increasing the level of UV radiation in the water or using the UV radiation generated by the source of the UV radiation more efficiently. A composition providing a target UV reflectance level for a water treatment system can be used. In the illustrated embodiment, a composition suitable for direct contact with the water to be purified can be provided.

[0130] For example, as illustrated in the embodiment of Figure 10, the water treatment chamber 245 may include a reactor body 201 and fluid elements 216 constructed of a diffuse reflective material, such as PTFE, which provides at least 80% to 90% reflectivity. Diffuse reflective materials promote the reflection of light or other waves or particles from a surface, causing rays incident on this surface to be scattered at many angles (rather than at only one angle as in the case of specular reflection).

[0131] As another example, the water treatment chamber 245 may be partially constructed of quartz tubing, potentially of pure quartz and a stainless steel portion forming a sleeve around the quartz tubing. Alternatively, the stainless steel sleeve may be replaced by a PTFE sleeve surrounding the quartz tubing.

[0132] In an alternative embodiment, one or both of the components defining the inner surface of the water treatment chamber 245 may be coated to promote the reflection of UV light within the water treatment chamber 245. For example, in the illustrated embodiment of FIG9, the reactor body 201 may be metal-coated quartz (e.g., alumina-coated quartz). Coatings may be applied to one or more of the components to define the inner surface of the water treatment chamber 245. Additionally, or alternatively, the coatings on one or more of the components may be applied to the surface of one of the components opposite to a surface of the component defining a portion of the inner surface of 245. For example, in the illustrated embodiment, the metal-coated quartz for the reactor body 201 may be coated on its outer surface, so that the inner surface of the quartz tube is in direct contact with the water supplied in the water treatment chamber 245. Coatings applied to components defining at least a portion of the inner surface of the water treatment chamber 245 may be applied to the interior of the components, for example, in the case where the components are formed of two or more laminated materials, one or more of these materials may be coated on one or both sides.

[0133] In one embodiment, the fluid element 216 may be formed with or have a reflective material. For example, the reflective material may be disposed on or coated on a substrate assembly of the fluid element 216.

[0134] A UV transmission window 205 forming at least a portion of the inner surface of the water treatment chamber 245, in one embodiment, may be configured to allow UV light to enter the water treatment chamber 245 but reflect the light inside the water treatment chamber 245.

[0135] With a reflective component installed in the assembly of the water treatment chamber 245, the UV light intensity inside the water treatment chamber 245 can be effectively maintained at a significant level. IV. [Water flow path and UV light path]

[0136] As discussed herein, the UV reactor 200 can be configured to use water flowing through the UV reactor 200 as a medium for cooling the UV source 402 of the actual disinfecting water. In the illustrated embodiments of Figures 7 to 16, a water flow path 238 from the UV reactor inlet 232 to the UV reactor outlet 230 and a UV light path 239 within the water treatment chamber 245 are shown.

[0137] Fluid element 216 is disposed in the water flow path within the UV reactor 200 to guide the flow of water downstream of fluid element 216 and in a UV light path 239 within the water treatment chamber 245. The UV light path 239 and its intensity can vary depending on the number and arrangement of the UV reactor 402 relative to the UV transmission window 205 and the UV source assembly 400.

[0138] For example, the UV source 402 can be placed near the middle of the radius of the reactor body 201 (or within 20% of the middle). In other words, the UV source 402 can be substantially located at a radius of 405, which is 0.5 times the radius of the reactor body 201.

[0139] In one embodiment, the UV source 402 may be uniformly arranged around a radius 405 (e.g., in a uniformly distributed pattern). This configuration, in one embodiment, may provide an optimized disinfection configuration. In one embodiment, changing the position of the UV source 402 relative to the radius 405 may affect performance. For example, the UV source 402 may be placed directly at the center of the UV source assembly 400.

[0140] In the illustrated embodiment, the UV reactor 200 includes baffles 266A and 266B disposed in a water flow path 238 upstream of the water treatment chamber 245 to generate turbulence within the turbulent zone 296 before flowing through the fluid element 216. In one embodiment discussed herein, baffles 266A and 266B may include a protrusion 263 operable to be directly disposed within the water flow path through the UV reactor inlet 232 to facilitate turbulently changing the direction of water flow, and may include one or more orifices arranged around the periphery of the protrusion 263 to facilitate turbulently guiding water flow into the turbulent zone 296. The turbulent zone 296 may be at least partially defined by an arcuate wall 294 to further enhance turbulence within the turbulent zone 296.

[0141] By providing turbulent flow of water in the turbulent zone 296 directly upstream of the fluid element 216, the water is more evenly distributed in the flow path of the fluid element 216. Therefore, the flow velocity of the water flowing in the water treatment chamber 245 can be more evenly distributed.

[0142] In one embodiment, the fluid element 216 may be constructed to substantially prevent high-velocity zones within the water treatment chamber 245, particularly near the UV transmission window 205. Such high-velocity zones may reduce the exposure time of any microorganisms present in the water flowing through this zone.

[0143] Referring to the illustrated embodiment in Figures 7 to 15, the water flow path 238 includes water flowing through a plurality of chamber outlets 246 to a heat exchange zone 236 and then to the UV reactor outlet 230. The heat exchange zone 236 may be annular and surround a second end 292 of the water treatment chamber 245, as discussed herein.

[0144] The heat exchange zone 236 provides a water flow path 238 that directly contacts the surface water thermal coupler 406, which is then thermally coupled to the heat contact zone 440 of the UV source assembly 400. The UV source assembly 400 is configured as discussed herein to facilitate heat flow from the UV source 402 to the surface water thermal coupler 406 and ultimately to the water flowing through the heat exchange zone 236. This heat flow path is indicated by a dashed arrow in the illustrated embodiments of Figures 12 and 14, which leads from the UV source 402 to the heat exchange zone 236 and exits from the UV reactor outlet 230.

[0145] In the illustrated embodiment, the heat flow path generally proceeds as follows: the rear or back side of a plurality of UV sources 402; the thermal components (e.g., metal cladding) of the UV source assembly 400; the surface-to-water heat coupler 406, such as the support ring of the UV transmission window 205, which may be made of stainless steel or "lead-free" brass for direct water contact without substantially allowing toxic substances to seep into the water; and the heat exchange zone 236, which is also described as a water outlet collection tank.

[0146] In one embodiment, the heat flow path proceeds as follows: the rear or back side of a plurality of UV sources 402; thermal components (e.g., metal cladding) of the UV source assembly 400; thermal paste (or pad or adhesive); source-side thermal couplers (e.g., PCB assembly back support [such as, aluminum or copper or thermoplastic]); surface-to-water thermal couplers 406, such as a support ring for the UV transmission window 205, which may be stainless steel or "lead-free" brass for direct water contact without substantially allowing toxic substances to leach into the water; and heat exchange zone 236, which is also described as a water outlet collection tank.

[0147] Optionally, heat can be dissipated from the plurality of UV sources 402 via a convection cooling path. According to one embodiment, the heat convection cooling path generally includes: the rear or back side of each of the plurality of UV sources 402; thermal components (e.g., metal cladding) of the UV source assembly 400; thermal paste (or thermal pad or thermal adhesive); a source-side thermal coupler; and air or the environment via the heat path.

[0148] In one embodiment, the UV source assembly 400 is configured such that a source-based thermal coupler is integrally disposed within the UV source assembly 400. The source-based thermal coupler may include a copper layer, which may be a thermally conductive layer for conducting heat from the plurality of UV sources 402 to the surface-to-water thermal coupler 406. It should be understood that the copper layer can be formed from any type of material or a plurality of materials operable to provide a thermally conductive layer to facilitate heat conduction from the plurality of UV sources 402 to the surface-to-water thermal coupler 406. V. [UV Source Assembly]

[0149] A UV source assembly 400 according to one embodiment of the present disclosure is illustrated in Figures 1 and 16. The UV source assembly 400 is depicted as having a surface water-thermal coupler 406, which in the illustrated embodiment is a heat sink in thermal contact with the thermal contact area 440 of the UV source assembly 400. The surface water-thermal coupler 406 includes a water contact area 407 configured to contact water flowing through the heat exchange area 236 of the UV reactor 200. The surface water-thermal coupler 406 can conduct heat energy to the water via the water contact area 407, which in the illustrated embodiment can form at least a portion of the water flow path through the UV reactor 200.

[0150] The UV source assembly 400 and the illustrated embodiment of FIG1 are depicted as having a single UV source 402 disposed on a printed circuit board assembly 480; however, it should be understood that the UV source assembly 400 may include a plurality of UV sources 402, as shown in the illustrated embodiment of FIG16. The UV source 402 includes electrical terminals 403 that can be soldered to a circuit area 435 of the UV source assembly 400. The UV source 402 may include thermal contacts that can be thermally coupled to a conductive layer 414 or a core layer 410, or any other conductive layer of the UV source assembly 400. The thermal contacts may be shared with the electrical contacts of the UV source 402, for example, such that the electrical terminals 403 can provide electrical connections to the circuit area 435 of the printed circuit board assembly 480 and thermal connections to the conductive layer 414.

[0151] Although UV source 402 is depicted as electrically and thermally coupled to conductive layer 414 in the illustrated embodiment of FIG1, it should be understood that UV source 402 may be electrically and / or thermally coupled to any conductive layer of UV source assembly 400, including core layer 410. For example, UV source 402 may have one pad directly soldered to core layer 410 for heat conduction of heat flux, and another pad of UV source 402 may be coupled to conductive layer 414 to receive electrical signals (such as power). UV source 402 may be connected to UV source assembly 400 in various ways described herein.

[0152] The printed circuit board assembly 480 may include multiple layers, some of which may be conductive or electrically insulating, and may be thermally conductive or thermally insulating, or any combination thereof. The printed circuit board assembly 480 may include circuit regions 435 containing conductive material, which electrically connect components such as the UV source 402 to other circuits or components, including external components such as control circuitry or power supply circuitry, or combinations thereof.

[0153] The circuit area 435 of the UV source assembly 400 may include a conductive layer 414, such as a copper layer, which may be covered by a solder mask layer 416. Some portions of the solder mask layer 416 may be absent to expose portions of the conductive layer 414, for example, to allow components to be electrically connected to the conductive layer 414, or to allow components to be thermally coupled to the conductive layer 414, or both. Although not illustrated, the UV source assembly 400 may include a silkscreen 417 disposed on the solder mask layer 416 to provide information related to the UV source assembly 400.

[0154] The printed circuit board assembly 480 may include a dielectric layer 412 and a thermally conductive layer 410, wherein the dielectric layer 412 is disposed between the thermally conductive layer 410 and the conductive layer 414. The dielectric layer 412 may be configured as a thermally conductive layer and can be used to conduct heat energy from the conductive layer 414 to the thermally conductive layer 410. In the illustrated embodiment, the thermally conductive layer 410 may be a core layer formed of copper or aluminum and has a thickness substantially greater than that of the conductive layer 414. The thermally conductive layer 410, together with the dielectric layer 412 and the conductive layer 414, defines a metal-clad printed circuit board assembly.

[0155] The thermally conductive layer 410 may include a thermal contact area 440, which may be defined by the upper surface 436 of the thermally conductive layer 410, which may be exposed or lack the dielectric layer 412 and the conductive layer 414. When the surface hydrothermal coupler 406 is in thermal contact with the thermal contact area 440, the heat generated by the UV source 402 can cross the conductive layer 414 and the dielectric layer 412 to reach the thermally conductive layer 410, and then through the thermal contact area 440 to the surface hydrothermal coupler 406.

[0156] In the illustrated embodiment, the thermally conductive layer 410 includes an upper surface 436 and a lower surface 438 opposite to the upper surface 436.

[0157] The printed circuit board assembly 480 may include a lower dielectric layer 422, a lower conductive layer 424, and a lower solder mask layer 426. The lower dielectric layer 422 may contact at least a portion of the lower surface 438 of the thermally conductive layer 410, and the lower dielectric layer 422 is disposed on the lower conductive layer 424 opposite to the thermally conductive layer 410. The lower solder mask layer 426 may be disposed on the lower conductive layer 424 opposite to the lower dielectric layer 422. It should be understood that this disclosure is not limited to this configuration; more or fewer layers may be provided in conjunction with the stacking or construction of the printed circuit board assembly 480. For example, the lower dielectric layer 422 and the lower conductive layer 424 may be absent.

[0158] The circuit region 435 of the printed circuit board assembly 480 is primarily described in conjunction with the conductive layer 414. However, the circuit region 435 may include one or more additional layers of the printed circuit board assembly 480, such as the lower conductive layer 424. Although not shown in the illustrated embodiment of FIG1, the printed circuit board assembly 480 may include one or more vias electrically connecting one conductive layer of the printed circuit board assembly 480 to another conductive layer.

[0159] In the illustrated embodiment, the conductive layer 414 or dielectric layer 412, or both, may define an edge 430 adjacent to the upper surface 436 of the thermally conductive layer 410. The thermally conductive layer 410 may extend below the edge 430 in two directions away from the edge 430. A thermal contact area 440 may be disposed near one side of the edge 430, while a portion of the thermally conductive layer 410 on the other side of the edge 430 may be bonded to the dielectric layer 412. With this configuration, at least a portion of the thermally conductive layer 410, including the thermal contact area 440, may be exposed or lack at least one of the dielectric layer 412, the conductive layer 414, and the solder mask layer 416 disposed on the conductive layer 414.

[0160] The thickness of the thermally conductive layer 410, corresponding to its thermal mass, helps to provide high thermal conductivity between the UV source 402 and the surface-mount thermal coupler 406. The thermal conductivity of this configuration (e.g., increased thermal mass compared to the conductive layer 414) can be substantially greater than an alternative configuration where the heat sink is thermally coupled directly (or via thermal paste) to the conductive layer 414 through a thermal contact area lacking the solder mask layer 416. The dielectric layer 412 can be electrically insulating while possessing high thermal conductivity to facilitate efficient heat transfer from the conductive layer 414 to the thermally conductive layer 410.

[0161] In the illustrated embodiment, the conductive layer 414 may define a plane 432. This plane 432 may intersect with the surface hydrothermal coupler 406, which is thermally coupled to the thermal contact area 440. The plane 432 may intersect with the surface hydrothermal coupler 406 in this configuration simply because both the surface hydrothermal coupler 406 and the conductive layer 414 are disposed above the upper surface 436 of the thermally conductive layer 410 (as shown in the orientation of the illustrated embodiment in FIG1).

[0162] An alternative embodiment of the UV source assembly is illustrated in FIG2 and generally designated as 500. The UV source assembly 500 is similar to the UV source assembly 400 in many respects, but with a few exceptions. The UV source assembly 500 includes a printed circuit board assembly 580, which is similar to the printed circuit board assembly 480, and includes solder mask 516, conductive layer 514, dielectric layer 412, thermally conductive layer 410, lower dielectric layer 422, lower conductive layer 424, and lower solder mask 526, which are similar in many respects to solder mask 416, conductive layer 514, dielectric layer 512, thermally conductive layer 510, lower dielectric layer 522, lower conductive layer 524, and lower solder mask 526.

[0163] For example, conductive layer 514 includes a circuit region 535 similar to circuit region 435, but is shown without a UV source for disclosure purposes. In the illustrated embodiment, conductive layer 514 may further define a plane 532 similar to the plane 432 described herein.

[0164] Similar to thermally conductive layer 410, thermally conductive layer 510 includes an upper surface 536 and a lower surface 538, as well as a thermal contact area 540. However, in the illustrated embodiment and unlike thermally conductive layer 410, thermally conductive layer 510 includes an extension 550 extending from a plane defined by the upper surface 536. Extension 550 may include an upper surface defining the thermal contact area 540 and may extend from the upper surface 536 of thermally conductive layer 510 such that the extension intersects with the plane 532 defined by conductive layer 514. In one embodiment, extension 550 may be considered as a column extending from thermally conductive layer 510.

[0165] The extension 550 also has a thermal contact area 540 that may be exposed or lack the conductive layer 514 and dielectric layer 512, allowing the surface water thermal coupler 506 to be thermally coupled to the thermal contact area 540. The surface water thermal coupler 506 may be similar to the surface water thermal coupler 406, for example, including a water contact area 507 similar to the water contact area 407.

[0166] In the illustrated embodiment, the printed circuit board assembly 580 defines an edge 530 adjacent to the upper surface 536 of the thermally conductive layer 510. The thermally conductive layer 510 may extend laterally below the edge 530 in two directions away from the edge 530.

[0167] An extension 550 may be disposed on one side of an edge 530, and a portion of the thermally conductive layer 510 on the other side of the edge 530 may be bonded to the dielectric layer 512. With this configuration, at least a portion of the thermally conductive layer 510, including the extension 550 and the thermal contact area 540, may expose or lack at least one of the dielectric layer 512, the conductive layer 514, and the solder resist layer 516 disposed on the conductive layer 514.

[0168] The printed circuit board assembly 580 may include one or more layers disposed on opposite sides of the extension 550. For example, in the illustrated embodiment, a conductive layer 514 and a dielectric layer 512 are disposed on opposite sides of the extension 550. The extension 550 may optionally be surrounded or partially surrounded by the conductive layer 514 and the dielectric layer 512.

[0169] Another alternative embodiment of the UV source assembly is depicted in FIG3 and generally designated as 600. The UV source assembly 600 is similar to the UV source assembly 500 in many respects, but with a few exceptions. The UV source assembly 600 includes a printed circuit board assembly 680, which is similar to the printed circuit board assembly 580, and includes solder mask 616, conductive layer 614, dielectric layer 512, thermally conductive layer 510, lower dielectric layer 522, lower conductive layer 524, and lower solder mask 626, which are similar in many respects to solder mask 516, conductive layer 614, dielectric layer 612, thermally conductive layer 610, lower dielectric layer 622, lower conductive layer 624, and lower solder mask 626.

[0170] For example, conductive layer 614 includes a circuit region 635 similar to circuit region 535, and in the illustrated embodiment, conductive layer 614 may further define a plane 632 similar to plane 532 described herein.

[0171] Similar to thermally conductive layer 510, thermally conductive layer 610 includes an upper surface 636 and a lower surface 638. However, in the illustrated embodiment and unlike thermally conductive layer 510, thermally conductive layer 610 includes a plurality of extensions 650-1, 650-2, 650-3 extending from a plane defined by the upper surface 636. Each extension 650-1, 650-2, 650-3 may each include an upper surface. These upper surfaces may define thermal contact areas 640-1, 640-2, 640-3. The plurality of extensions 650-1, 650-2, 650-3 may extend from the upper surface 636 of thermally conductive layer 610 such that the extensions intersect with the plane 632 defined by conductive layer 614. Each of extensions 650-1, 650-2, 650-3 can be considered as a column extending from the upper surface 636 of thermally conductive layer 610.

[0172] These plurality of extensions 650-1, 650-2, 650-3 and thermal contact areas 640-1, 640-2, 640-3 may have the conductive layer 614 and dielectric layer 612 exposed or absent, enabling the surface water-thermal coupler 606 to be thermally coupled to the thermal contact areas 640-1, 640-2, 640-3. The surface water-thermal coupler 606 may be similar to the surface water-thermal coupler 506, for example, including a water contact area 607 similar to the water contact area 507.

[0173] The printed circuit board assembly 680 in the illustrated embodiment defines at least one edge 630 adjacent to the upper surface 636 of the thermally conductive layer 610. The thermally conductive layer 610 may extend laterally below the edge 630 in two directions away from the edge 630. One or more extensions 650-1, 650-2, 650-3 may be disposed near an edge defined by the conductive layer 614 and the dielectric layer 612, such as the edge 630 in the illustrated embodiment. A portion of the thermally conductive layer 610 on the other side of such an edge may be bonded to the dielectric layer 612. With this configuration, at least a portion of the thermally conductive layer 610, including the plurality of extensions 650-1, 650-2, 650-3 and thermal contact areas 640-1, 640-2, 640-3, may be exposed or absent from at least one of the dielectric layer 612, the conductive layer 614, and the solder mask layer 616 disposed on the conductive layer 614.

[0174] The printed circuit board assembly 680 may include one or more layers disposed on opposite sides of the extensions 650-1, 650-2, and 650-3. For example, in the illustrated embodiment, the conductive layer 614 and the dielectric layer 612 are disposed on opposite sides of the extensions 650-1, 650-2, and 650-3. The extensions 650-1, 650-2, and 650-3 may optionally be surrounded or partially surrounded by the conductive layer 614 and the dielectric layer 612. VI. [Room exit and heat exchange area]

[0175] According to one embodiment, a UV reactor 200 includes a plurality of chamber outlets 246 arranged according to a chamber outlet configuration 235, which may vary depending on the application. Each chamber outlet 246 may be at least partially defined by an opening in the inner surface of a water treatment chamber 245. In one embodiment, the opening may be directly adjacent to a second end 292 of the water treatment chamber 245, wherein no portion of the inner surface 290 is located between the opening and the second end 292, corresponding to the water-side of the UV transmission window 205 in the embodiments shown in Figures 7 to 15. In this manner, a water flow path 238 is provided, allowing water to flow radially through the opening to the chamber outlets 246 in a path perpendicular to the longitudinal axis 240 of the UV reactor 200. This flow path is seen in the embodiment shown in Figure 15, where water flows through the water treatment chamber 245, through one of the plurality of chamber outlets 246 to the heat exchange zone 236, and through the UV reactor outlet 230.

[0176] The number and configuration of the chamber outlets 246 can vary depending on the application. For example, in the illustrated embodiment of Figures 60-61, the chamber outlets 246 may be evenly spaced around the second end 292 of the water treatment chamber 245 adjacent to the chamber outlet configuration 235. In one embodiment, the plurality of chamber outlets 246 may be evenly radially distributed around the longitudinal axis 240. However, this disclosure is not so limited. The plurality of chamber outlets 246 can be arranged in any manner, including non-uniformly spaced patterns, and cut-off zones or avoidance zones as described herein.

[0177] In one embodiment, the total cross-sectional area of ​​the plurality of chamber outlets 246 may be greater than the cross-sectional area of ​​the UV reactor inlet 232 to avoid significant pressure drop and to minimize pressure drop as much as possible.

[0178] In one embodiment, as shown in FIG10, a first avoidance zone 249 of the chamber outlet 246 may be located near the UV reactor outlet 230. In one embodiment, the first avoidance zone 249 may help control the water flow through the heat exchange zone 236, thereby affecting the heat transfer performance of the UV reactor 200.

[0179] In one embodiment, as shown in FIG10, a second avoidance zone 248 at the chamber outlet may be located away from the UV reactor outlet 230. Similar to the first avoidance zone 249, the second avoidance zone 248 may help control the water flow through the heat exchange zone 236, thereby affecting the heat transfer performance of the UV reactor 200.

[0180] It should be noted that the second avoidance zone 248, relative to the UV reactor outlet 230, may also be provided with a heat exchange zone 236 associated with one or more chamber outlets 246. For example, in the illustrated embodiment of the second avoidance zone 248, there is no chamber outlet in the second avoidance zone 248, and no flow path for the second avoidance zone 248 within the heat exchange zone 236. In other words, the collection tank or heat exchange zone 236 may not completely surround the water treatment chamber 245, as shown in the illustrated embodiment of Figure 10. The second avoidance zone 248 can close the heat exchange zone 236 to improve performance.

[0181] It should be noted that, in place of the second avoidance zone 248 relating to the heat exchange zone 236, a partial avoidance zone can be defined, wherein the flow path of the heat exchange zone 236 is more restricted than that of the portion of the heat exchange zone 236 outside the partial avoidance zone.

[0182] In the illustrated embodiments of Figures 7 to 15, as discussed herein, the plurality of chamber outlets 246 are at least partially formed by an opening on an inner surface of the water treatment chamber 245. The opening may be defined by a channel in the end cap 202 and a surface of the UV transmission window 205. The channel in the end cap 202 is depicted in the illustrated embodiments of Figures 10, 11, and 15. Alternatively, one or more of the plurality of chamber outlets 246 may be at least partially defined by an opening provided in a first end 291 of the water treatment chamber 245.

[0183] As illustrated in the embodiments of Figures 12 to 15, a heat exchange zone 236 is defined by a groove in the end cap 202, a UV transmission window 205, and a surface water heat coupler 406. The heat exchange zone 236 itself can be considered a collection tank through which water leaving the plurality of chamber outlets 246 can be collected and flow toward the UV reactor outlet 230. The heat exchange zone 236 can be configured to allow direct contact between the water and the surface water heat coupler 406 for heat transfer. This heat can leave with the water as it exits the UV reactor 200 via the UV reactor outlet 230.

[0184] In one embodiment, a plurality of chamber outlets 246 surrounding the entire UV transmission window 205 guide fluid to a heat exchange zone 236 (e.g., a collection tank) and uniformly disperse the fluid for uniform UV light exposure. The water contact surface of the UV transmission window 205 may act as a wall for each chamber outlet 246, such that the chamber outlet 246 is defined by the channel in the end cap 202 and the UV transmission window 205. Alternatively or additionally, a surface water heat coupler 406 may define at least a portion (e.g., a wall) of the chamber outlet 246.

[0185] In the illustrated embodiment, the surface water heat coupler 406 (e.g., a stainless steel cooling ring) functions as a wall of the heat exchange zone 236 (e.g., the reactor outlet trough) of the UV reactor 200.

[0186] In the illustrated embodiment of Figure 15, the water flow path 238 from the water supply into the chamber outlet 246 to the heat exchange zone 236 is shown in more detail. The chamber outlet 246 in the illustrated embodiment includes a lower surface 252 that defines a plane that does not intersect with the heat exchange zone 236—although it should be understood that the chamber outlet 246 may be configured differently. The heat exchange zone 236 in the illustrated embodiment includes a lower surface 251 that defines a plane that is not coplanar with the lower surface 252 of the chamber outlet 246 and is positioned upstream of the lower surface 252 in the direction of the water flow path 238. The end cap 202 in the illustrated embodiment includes a plurality of steps defining the wall of the chamber outlet 246 and has an upper surface 253 with a recessed area suitable for receiving the UV transmission window 205. The steps, together with the upper surface 253, help maintain the position of the UV transmission window 205.

[0187] Directional terms such as "vertical," "horizontal," "top," "bottom," "upper," "lower," "inner," "inward," "outer," and "outward" are used to aid in describing the invention based on the orientation of the embodiments shown in the illustrations. The use of directional terms should not be construed as limiting the invention to any particular orientation.

[0188] The above description is a description of the current embodiments of the present invention. Various modifications and changes may be made without departing from the spirit and broader scope of the invention as defined in the appended claims, and these will be interpreted in accordance with the principles of patent law, including the doctrine of equivalents. This disclosure is presented for illustrative purposes and should not be construed as an exhaustive description of all embodiments of the invention, or as limiting the scope of the claims to the specific elements shown or described in connection with these embodiments. For example, but not in a limiting sense, any individual element of the described invention may be replaced by alternative elements that provide substantially similar functionality or otherwise provide adequate operation. This includes, for example, currently known alternative elements, such as those that a person skilled in the art may currently know, and alternative elements that may be developed in the future, such as those that a person skilled in the art might recognize as alternatives during development. Furthermore, the disclosed embodiments include multiple features described together and that may collaboratively provide a range of benefits. The invention is not limited to those embodiments that include all of these features or provide all of the stated benefits, unless otherwise expressly stated in the stated claims. Any reference to a claimed element in the singular form, for example, using the article "a" or "the," should not be construed as limiting the element to the singular. Referring to a claimed element as "at least one of X, Y, and Z" is intended to include any single one of X, Y, or Z, as well as any combination of X, Y, and Z, such as X, Y, and Z; X, Y; X, Z; and Y, Z.

[0189] 100: Water Treatment System 102: Upper part 103: Rear 104: Side 105: Base or base bottom 110: Base assembly 112: Water inlet pipe 114: Water outlet pipe 130: Processing Assembly 132: Closed assembly 134: Handling Containers 136: Handle Assembly 200: UV reactor 201: Reactor body 202: End Cap 203: Second seal 204: Sealed 205: UV Transmission Window 209: Support Cover 210: First seal 211: Reactor body support components 213: Opening 214: Fasteners 216: Fluid Components 223: Connector 232: UV reactor inlet 230: UV reactor outlet 233: Hose barb connector 235: Room Exit Configuration 236: Heat exchange area 237: Hose barb connector 238: Water Flow Path 239: UV light path 240: Vertical axis 245: Water Treatment Room 246: Exit of the room 248: Second Avoidance Zone 249: First Avoidance Zone 251: Lower surface 252: Lower surface 253: Upper surface 263: Protrusion 266: Flow deflector or baffle 266A, 266B: Deflector 290: Inner surface 291: First End 292: Second End 294: Curved Wall 296: Turbulent Region 310: Cover 312: Internal Components 313: Housing Assembly 314: Display Unit 315: Monitor 316: Sensor Unit 318: Control System 360: Treated water outlet 385: Water Inlet 390: Wireless communication circuit 400: UV source assembly 402: UV source 403: Electrical Terminals 405: Radius 406: Surface hydrothermal coupler 407: Water Contact Area 410: Core Layer 410: Thermal conductive layer 412: Dielectric layer 414: Conductive layer 416: Solder mask layer 417: Silk screen 422: Lower Dielectric Layer 424: Lower conduction layer 426: Lower solder mask layer 430: Edge 432: Plane 435: Circuit Area 436: Upper surface 438: Lower surface 440: Thermal contact area 480: Printed Circuit Board Assembly 500: UV source assembly 506: Surface hydrothermal coupler 507: Water Contact Area 510: Thermal conductive layer 512: Dielectric layer 514: Conductive layer 516: Solder mask layer 522: Lower dielectric layer 524: Lower conduction layer 526: Lower solder mask layer 530: Edge 532: Plane 535: Circuit Area 536: Upper surface 538: Lower surface 540: Thermal contact area 550: Extension 580: Printed Circuit Board Assembly 600: UV source assembly 606: Surface hydrothermal coupler 607: Water Contact Area 680: Printed Circuit Board Assembly 610: Thermal conductive layer 612: Dielectric layer 614: Conductive layer 616: Solder mask layer 622: Lower dielectric layer 624: Lower conduction layer 626: Lower solder mask layer 632: Plane 635: Circuit Area 636: Surface 638: Lower surface 640-1, 640-2, 640-3: Thermal contact area 650-1, 650-2, 650-3: Extension section

Claims

1. A UV reactor for irradiating a stream of water with ultraviolet (UV) radiation, the UV reactor comprising: a processing assembly including a water inlet and a water outlet, the processing assembly being operable to direct water received via the water inlet to a point-of-use downstream of the water outlet; a printed circuit board (PCB) including a solder resist layer, a first substrate, a thermally conductive substrate, and a dielectric disposed between the first substrate and the thermally conductive substrate, the first substrate including a first surface having a circuit area, the solder resist layer being disposed on the first surface of the first substrate; a UV light-emitting diode (UV-LED) operably connected to the PCB, the UV-LED being oriented to direct UV energy into the processing assembly; and wherein a thermal contact area of ​​the thermally conductive substrate is exposed such that the thermal contact area is free of the dielectric, the solder resist layer, and the first substrate, wherein the thermal contact area is in thermal communication with water flowing through the UV reactor, and wherein at least a portion of the UV-LED is disposed on the first surface of the first substrate.

2. The UV reactor of claim 1, comprising a thermally conductive material including a fluid contact surface arranged to define at least a portion of a fluid path of water flowing through the UV reactor, the thermally conductive material being thermally coupled to the thermal contact area of ​​the thermally conductive substrate to promote thermal communication between the water flowing through the UV reactor and the thermal contact area.

3. The UV reactor of claim 2, wherein the thermal contact zone is thermally coupled to the water flowing through the UV reactor via the thermally conductive material.

4. The UV reactor of claim 2, wherein a thermally conductive medium is disposed between the thermal contact area and the thermally conductive material to promote thermal communication between the water flowing through the UV reactor and the thermal contact area.

5. The UV reactor of claim 2, wherein the fluid contact surface of the thermally conductive material is located downstream of the processing assembly.

6. The UV reactor of claim 1, wherein the PCB is a metal-clad printed circuit board.

7. The UV reactor of claim 1, wherein the upper and lower surfaces of the thermally conductive substrate are completely free of a solder resist layer.

8. The UV reactor of claim 1, wherein the thermally conductive substrate includes an upper surface defining the thermal contact area.

9. The UV reactor as requested in item 8, wherein: An extension of the thermally conductive substrate extends from a main surface of the thermally conductive substrate on which the dielectric is disposed; the extension includes the upper surface; and a plane of the first substrate intersects the extension.

10. The UV reactor as requested in item 1, wherein: The first substrate and the dielectric define a first edge; The thermally conductive substrate is disposed adjacent to the first edge and extends from both sides of the first edge, such that the thermal contact area is located near one side of the first edge, and the thermally conductive substrate is bonded to the dielectric near the other side of the first edge.

11. The UV reactor of claim 1, wherein the portion of the UV-LED disposed on the first surface of the first substrate corresponds to a terminal of the UV-LED, and wherein at least a portion of the solder resist layer is provided between the UV-LED and the first surface of the first substrate.

12. A water treatment system for treating water, the water treatment system comprising: a treatment assembly inlet and a treatment assembly outlet, the treatment assembly inlet being operable to receive water and the treatment assembly outlet being operable to discharge water from the water treatment system; a printed circuit board (PCB) including a solder resist layer, a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate, the first substrate including a first surface having a circuit area, the solder resist layer being disposed on the first surface of the first substrate, a thermal contact area of ​​the thermally conductive substrate being exposed such that the thermal contact area is free of the dielectric material, the solder resist layer, and the first substrate; a UV source adapted to be connected to the circuit area of ​​the printed circuit board, at least a portion of the UV source being disposed on the first surface of the first substrate. The assembly includes: a UV source configured to provide UV energy for disinfecting water; a UV reactor configured to promote water disinfection by applying UV energy to water flowing through the UV reactor, the UV reactor comprising: a water inlet operably coupled to the inlet of the treatment assembly to receive water; a water outlet for discharging water from the UV reactor; a water treatment chamber having a first end and a second end, the water treatment chamber having a chamber inlet in fluid communication with the water inlet to receive water to be decontaminated, the water treatment chamber having a chamber outlet operably configured to direct water to the water outlet, wherein the UV source is arranged to provide UV energy to the water treatment chamber; and a cooling chamber in fluid communication with water, the cooling chamber being thermally connected to the thermal contact area of ​​the thermally conductive substrate to promote heat energy transfer from the UV source to the water.

13. The water treatment system of claim 12, comprising a thermally conductive material including a fluid contact surface arranged to define at least a portion of a fluid path of water flowing through the water treatment system, the thermally conductive material being thermally coupled to the thermal contact area of ​​the thermally conductive substrate to promote thermal communication between the water flowing through the UV reactor of the water treatment system and the thermal contact area.

14. The water treatment system of claim 13, wherein the thermal contact area is thermally coupled to the water flowing through the water treatment system via the thermally conductive material.

15. The water treatment system of claim 13, wherein a thermally conductive medium is disposed between the thermal contact area and the thermally conductive material to promote thermal communication between the water flowing through the UV reactor and the thermal contact area.

16. The water treatment system of claim 13, wherein the fluid contact surface of the thermally conductive material is located downstream of the water treatment chamber.

17. The water treatment system of claim 12, wherein the PCB is a metal-clad printed circuit board.

18. The water treatment system of claim 12, wherein the upper and lower surfaces of the thermally conductive substrate are completely free of a solder resist layer.

19. The water treatment system of claim 12, wherein the thermally conductive substrate includes an upper surface defining the thermal contact area.

20. The water treatment system as described in request item 19, wherein: An extension of the thermally conductive substrate extends from a main surface of the thermally conductive substrate on which the dielectric is disposed; the extension includes the upper surface; and a plane of the first substrate intersects the extension.

21. The water treatment system as described in request item 12, wherein: The first substrate and the dielectric define a first edge; and the thermally conductive substrate is disposed adjacent to the first edge and extends from both sides of the first edge, such that the thermal contact area is located near one side of the first edge, and the thermally conductive substrate is bonded to the dielectric near the other side of the first edge.

22. The water treatment system of claim 12, wherein the portion of the UV source disposed on the first surface of the first substrate corresponds to a terminal of the UV source, and wherein at least a portion of the solder resist layer is provided between the UV source and the first surface of the first substrate.

23. A method for disinfecting water, the method comprising: providing a treatment assembly including a water inlet and a water outlet; directing water from the water inlet through the treatment assembly to the water outlet to a point of use downstream of the water outlet; providing a UV source connected to a circuit area of ​​a printed circuit board (PCB), wherein the PCB includes a solder resist layer, a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate, wherein the first substrate includes a first surface having a circuit area, the solder resist layer being disposed on the first surface of the first substrate, wherein a thermal contact area of ​​the thermally conductive substrate is exposed such that the thermal contact area is free of the dielectric material, the solder resist layer, and the first substrate, wherein at least a portion of the UV source is disposed on the first surface of the first substrate; conducting heat from the UV source to the thermal contact area of ​​the PCB; and further conducting heat from the thermal contact area of ​​the PCB to water flowing to the water outlet.

24. The method of claim 23, wherein the PCB is a metal-clad printed circuit board.

25. The method of claim 24, comprising supplying UV energy from the UV source to water flowing through the treatment assembly.

26. The method of claim 23, wherein the portion of the UV source disposed on the first surface of the first substrate corresponds to a terminal of the UV source, and wherein at least a portion of the solder resist layer is provided between the UV source and the first surface of the first substrate.

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