Light-emitting devices and display devices

Abstract

[Problem] To provide an optical device that is lighter while still exhibiting good light-emitting performance. [Solution] The light source device has a plurality of light source units and a relay member. Each of the plurality of light source units has a light source substrate extending in a first direction and a plurality of light sources arranged along the first direction on the light source substrate. The relay member is electrically connected to each of the plurality of light source units.

Description

Technical Field

[0001] This disclosure relates to a light-emitting device suitable for a surface light source, and a display device for displaying images using the illumination light generated by the use of the light-emitting device. Prior Technology

[0002] Until now, for example, as backlights for liquid crystal display devices, light source devices that use LEDs (Light Emitting Diodes) as light sources have been used (see, for example, Patent Documents 1 and 2). [Previous Technical Documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2012-203997 [Patent Document 2] International Publication No. 2020-039721 Summary of the Invention

[0004] [The problem the invention aims to solve]

[0005] Furthermore, recently, there has been a demand for light-emitting devices that can achieve a more refined luminous intensity distribution by integrating multiple light sources.

[0006] Therefore, there is a need for light-emitting devices that can perform well in terms of light emission performance, and for display devices that possess such performance. [Problem-solving methods]

[0007] As one embodiment of the light-emitting device disclosed herein, it includes a plurality of light source units and a relay member. Each of the plurality of light source units has a light source substrate extending in a first direction and a plurality of light sources arranged along the first direction on the light source substrate. The relay member is electrically connected to each of the plurality of light source units.

[0008] As one embodiment of the light-emitting device disclosed herein, the arrangement positions of the plurality of light source units can be finely adjusted, making it easy to optimize the arrangement positions of each light source. Furthermore, it also facilitates weight reduction. Simple Explanation of the Diagram

[0009] [Fig. 1A] shows a first oblique view of the light-emitting device of the first embodiment disclosed herein, viewed from the first direction. [Fig. 1B] shows a second oblique view of the light-emitting device shown in Fig. 1A as viewed from a second direction. [Figure 2] shows a plan view of the planar structure of the light-emitting device shown in Figure 1. [Figure 3] is a cross-sectional view showing a portion of the light-emitting device shown in Figure 1. [Figure 4] shows an enlarged cross-sectional view of a construction example of the light source shown in Figure 1. [Figure 5] shows an enlarged cross-sectional view of a construction example of the wavelength conversion plate shown in Figure 1. [Figure 6] is a plan view showing a structural example of the light source device of the first modification of the first embodiment. [Figure 7] is a perspective view showing the appearance of the display device according to the second embodiment of this disclosure. [Figure 8] A perspective view showing the partial decomposition of the body shown in Figure 7. [Figure 9] An oblique view showing the exploded panel module shown in Figure 8. [Figure 10] shows a planar schematic diagram of a planar structure example of the panel module shown in Figure 8. [Fig. 11] is a plan view showing a planar structure example of the panel module of the first modified example of the second embodiment. [Fig. 12] is a plan view showing a planar structure example of the panel module of the second modified example of the second embodiment. [Fig. 13] is a plan view showing a planar structure example of the panel module of the third modified example of the second embodiment. [Fig. 14] shows a cross-sectional view of a construction example of a light source device of another first variation of this disclosure. [Fig. 15] shows a cross-sectional view of a construction example of a light source device of another second variation of this disclosure. [Fig. 16] shows a cross-sectional view of a construction example of a light source device of another third variation of this disclosure. [Fig. 17] shows a cross-sectional view of a construction example of a light source device of another fourth variation of this disclosure. [Fig. 18] shows a cross-sectional view of a construction example of a light source device of another fifth variation of this disclosure. [Fig. 19] shows a cross-sectional view of a construction example of a light source device of another sixth variation of this disclosure. [Fig. 20] shows a cross-sectional view of a construction example of a light source device of another seventh variation of this disclosure. [Figure 21] is a cross-sectional view showing the detailed structure of the conductive material layer of the light-emitting device shown in Figure 20. [Figure 22A] shows the first cross-sectional view of the formation process of the conductive material layer shown in Figure 21. [Figure 22B] shows a second cross-sectional view of the formation process of the conductive material layer shown in Figure 21. [Figure 22C] shows the third cross-sectional view of the formation process of the conductive material layer shown in Figure 21. [Fig. 23] is a cross-sectional view showing the detailed structure of the conductive material layer as a first modified example of the light-emitting device shown in Fig. 20. [Figure 24A] shows the first cross-sectional view of the formation process of the conductive material layer shown in Figure 23. [Figure 24B] shows the second cross-sectional view of the formation process of the conductive material layer shown in Figure 23. [Figure 24C] is a third cross-sectional view showing the formation process of the conductive material layer shown in Figure 23. [Fig. 25] is a cross-sectional view showing the detailed structure of the conductive material layer as a second variation of the light-emitting device shown in Fig. 20. [Fig. 26] is a schematic plan view showing an example of the positional relationship between the protrusions and the exposed portions of the wiring of each light-emitting device shown in Fig. 23 and Fig. 25. [Fig. 27] shows a cross-sectional view of a construction example of the light source device of another eighth variation of this disclosure. [Fig. 28] shows a cross-sectional view of a construction example of a display device according to another ninth variation of this disclosure. Implementation

[0010] The embodiments of this disclosure will now be described in detail with reference to the drawings. Furthermore, the description will proceed in the following order. 1. First Embodiment (Light-emitting Device) 2. Second embodiment (liquid crystal display device) 3. Other variations

[0011] <1. First Implementation Form> [1.1 Construction] Figures 1A and 1B are perspective views showing a structural example of the light-emitting device 100 according to the first embodiment of this disclosure. Figures 1A and 1B show the light-emitting device 100 viewed from opposite directions. Figure 2 is a plan view showing a planar structural example of the light-emitting device 100 shown in Figure 1. Furthermore, Figure 3 is an enlarged cross-sectional view showing a portion of the planar structural example of the light-emitting device 100 shown in Figure 1. Figure 3 also shows a cross-section along the arrow direction of the cut line III-III shown in Figure 2. The light-emitting device 100 is suitable as a surface light source, for example, as a direct-lit backlight user mounted on a liquid crystal display device.

[0012] The light-emitting device 100 includes, for example, a plurality of light source units 10, a relay substrate 20, and a flexible thin film 30. The plurality of light source units 10 extend in the X-axis direction and are arranged in the Y-axis direction. Correspondingly, the relay substrate 20 extends in the Y-axis direction and is mechanically connected to each of the plurality of light source units 10. The relay substrate 20 is also electrically connected to each of the plurality of light source units 10 via a plurality of connecting portions 50.

[0013] Furthermore, in this embodiment, the long side direction of the light source unit 10 is taken as the X-axis direction, the short side direction of the light source unit 10 is taken as the Y-axis direction, and the thickness direction of the light source unit 10 is taken as the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other.

[0014] As shown in Figure 1A, each light source unit 10 has a light source substrate 1 and a plurality of light sources 2. As shown in Figure 3, the light source substrate 1 has a surface 1FS and an inner surface 1BS located on the opposite side of the surface 1FS in the thickness direction (Z-axis direction). The plurality of light sources 2 are disposed on the surface 1FS of the light source substrate 1 (Figure 3). The plurality of light sources 2 are arranged in a row along the long side direction of the light source substrate 1, i.e., the X-axis direction, at predetermined intervals, for example. Furthermore, a flexible film 30 extends along the XY plane and is disposed on the surface 1FS side of the light source substrate 1 in a manner that covers the entire plurality of light source units 10. The plurality of light source units 10 can be fixed to the flexible film 30, for example, by adhesive bonding. A relay substrate 20 is disposed on the inner surface 1BS side of the light source substrate 1.

[0015] As shown in FIG2, the light-emitting device 100 has a driving element 40. The driving element 40 may be provided, for example, on the light source substrate 1 of each light source unit 10, or on the relay substrate 20. As shown in FIG3, the light-emitting device 100 may also have a spacer 6, a diffuser 7, a wavelength conversion plate 8, and an optical plate group 9.

[0016] (Light source unit 10) As shown in Figures 1A, 1B, and 2, the plurality of light source units 10 can be arranged separately from each other along the Y-axis direction, for example. In particular, as shown in Figure 2, the dimension in the Y-axis direction of each light source unit 10, i.e., the width W1, can be narrower than the spacing W2 between adjacent light source units 10. This allows for the reduction of the constituent materials of the light source substrate 1, etc., achieving weight reduction. Furthermore, in the examples shown in Figures 1A, 1B, and 2, eight light source units 10 are connected to one relay substrate 20, but this disclosure is not limited to this. It is also possible to connect seven or fewer light source units 10 to one relay substrate 20, or to connect nine or more light source units 10.

[0017] As shown in FIG3, the light source unit 10 includes a light source substrate 1, a plurality of light sources 2, wiring 4, an insulating layer 4Z, and a resin layer 5. The light source substrate 1 is, for example, a thin film-like member made of resin with electrical insulation properties, and can be flexible. As the light source substrate 1, for example, a resin film formed from PI (polyimide), PET (polyterephthalic acid), PC (polycarbonate), PEN (polynaphthalenedicarboxylic acid), PEI (polyetherimide), LCP (liquid crystal polymer), or fluororesin can be used. Alternatively, as the light source substrate 1, an insulating resin layer such as polyimide or epoxy can be formed on the surface of a metal substrate such as aluminum (Al). Furthermore, as the light source substrate 1, a thin film substrate formed of glass containing resin, such as glass epoxy resin represented by FR4 or glass composite resin represented by CEM3, can also be used. On the surface 1FS of the light source substrate 1, a plurality of wiring 4 and a plurality of light sources 2 are mounted on the insulating layer 4Z. Furthermore, a plurality of wirings 51 are formed on the inner 1BS of the light source substrate 1. The plurality of wirings 51 are connected to the wiring 4, for example, via vias 10V. In addition, vias 10V can be formed by selectively drilling a predetermined area of ​​the inner 1BS of the light source substrate 1 to form a through hole, for example, by laser processing, and then filling the through hole with a conductive material. At this time, the wiring 4 formed on the surface 1FS becomes an etching stopper.

[0018] (Light source 2 and wiring 4) A plurality of light sources 2 are disposed on the surface 1FS of the light source substrate 1. As described above, the plurality of light sources 2 are arranged in a row at predetermined intervals along the extension direction of the light source substrate 1, i.e., the X-axis direction, as shown in FIG2, etc. Furthermore, the interval of the plurality of light sources 2 is not limited to a fixed case and can be arbitrarily set according to requirements. Also, in one light source substrate 1, the rows of the plurality of light sources 2 arranged in the X-axis direction are arranged in a plurality of rows adjacent to each other in the Y-axis direction. On the surface 1FS of the light source substrate 1, a plurality of wirings 4 with a predetermined pattern shape are formed such that one or more light sources 2 can be independently controlled for light emission. The plurality of wirings 4 enable localized light emission control (area dimming) of the plurality of light sources 2. In the light emission device 100, the light emission intensity and lighting timing are controlled in unit areas A (AL, AC, AR) shown by, for example, the dashed lines in FIG2, by means of a driving element 40. The driving element 40 is a driving IC that drives (i.e., lights up and turns off) each light source 2. The driving element 40 can be disposed in at least one of the relay substrate 20 and the light source substrate 1. In the construction example of FIG2, one driving element 40L and one driving element 40R are respectively disposed in the light source substrate 1, and a driving element 40C is disposed in the relay substrate 20. In the construction example of FIG2, the light source 2 disposed in the unit area AL is connected to the driving element 40L via wiring 4, the light source 2 disposed in the unit area AC is connected to the driving element 40C via wiring 4, and the light source 2 disposed in the unit area AR is connected to the driving element 40R via wiring 4. The driving element 40L drives, for example, three light sources 2 disposed in the unit area AL among the plurality of light sources 2 disposed in the light source substrate 1. The driving element 40C drives, for example, three light sources 2 disposed in the unit area AC among the plurality of light sources 2 disposed in the light source substrate 1. The driving element 40R drives, for example, three light sources 2 disposed in the unit area AR among the plurality of light sources 2 disposed in the light source substrate 1. Furthermore, in the example shown in Figure 2, three light sources 2 are configured in one unit area A, but this disclosure is not limited to this. The number of light sources 2 contained in one unit area A can be one, two, or more than four.

[0019] The wiring 4 is patterned using photolithography after copper foil is attached to the light source substrate 1, for example. Alternatively, the wiring 4 can be patterned using photolithography after a metal film is formed on the light source substrate 1 using deposition or vacuum deposition techniques. Furthermore, the wiring 4 can also be formed using printing methods such as screen printing or inkjet printing. The constituent materials of the wiring 4 are, for example, copper (Cu), aluminum (Al), or silver (Ag), or alloys thereof.

[0020] (Resin layer 5) The resin layer 5 is, for example, a white photoresist layer. The resin layer 5 has a high reflectivity relative to light from the light source 2 and light whose wavelength is converted by the wavelength conversion plate 8. The white photoresist can be, for example, an inorganic material such as titanium dioxide (TiO₂) microparticles or barium sulfate (BaSO₄) microparticles, or an organic material such as porous acrylic resin microparticles or polycarbonate resin microparticles with numerous pores for light scattering. Epoxy-based resins can also be used as the constituent material of the resin layer 5. Furthermore, the resin layer 5 can also be composed of a resin containing inorganic material microparticles such as titanium dioxide (TiO₂) microparticles or barium sulfate (BaSO₄) microparticles. In addition, a flexible film 30 is adhered to the surface of the resin layer 5 in areas other than the area where the light source 2 is located.

[0021] (Details of Light Source 2) Figure 4 is an enlarged cross-sectional view showing a construction example of the light source 2 shown in Figure 1. However, the flexible thin film 30 is also shown in Figure 4. As shown in Figure 4, the light source 2 is a so-called direct-encapsulated light source, having a light-emitting element 21 and an encapsulated lens 22. The light-emitting element 21, for example, has a semiconductor layer 23 containing a light-emitting body, and a reflective layer 25 in which the dielectric semiconductor layer 23 and the transparent layer 24 are arranged opposite each other in the Z-axis direction.

[0022] The transparent layer 24 is made of, for example, sapphire or silicon carbide (SiC). The semiconductor layer 23 is, for example, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer sequentially deposited from the transparent layer 24 side. The n-type semiconductor layer is, for example, made of an n-type nitride semiconductor (e.g., n-type GaN). The active layer is, for example, made of a nitride semiconductor with a quantum well structure (e.g., n-type GaN). The p-type semiconductor layer is, for example, made of a p-type nitride semiconductor (e.g., p-type GaN). The semiconductor layer 23 is, for example, made of a blue LED (Light Emitting Diode) that emits blue light (e.g., wavelength 440 nm to 460 nm). A reflective layer 25 is disposed on the side of the transparent layer 24 opposite to the semiconductor layer 23. The reflective layer 25 is made of a material with high reflectivity. Specifically, the reflective layer 25 is made of a silver vapor-deposited film, an aluminum vapor-deposited film, or a multilayer reflective film. Multilayer reflective films include, for example, DBR (Distributed Bragg Reflector).

[0023] As shown in Figure 4, in the light-emitting element 21, the light LB emitted from the active layer of the semiconductor layer 23 is reflected by the reflective layer 25 and enters the encapsulation lens 22 from the end face 24T of the transparent layer 24. The light LB entering the encapsulation lens 22 is emitted to the surrounding area through the encapsulation lens 22. In addition, the light LB is subjected to optical effects when passing through the encapsulation lens 22.

[0024] The encapsulation lens 22 is, for example, an optical component made of a transparent resin such as silicone or acrylic. The encapsulation lens 22 covers the entire light-emitting element 21, encapsulating the light-emitting element 21. The encapsulation lens 22 has a refractive index between the refractive index of the semiconductor layer 23 of the light-emitting element 21 and the refractive index of air. The encapsulation lens 22 is used to protect the light-emitting element 21 and improve the extraction efficiency of light emitted from the light-emitting element 21. The shape of the encapsulation lens 22 is not particularly limited as long as it serves as an optical lens for extracting light LB emitted from the light-emitting element 21. For example, the shape of the encapsulation lens 22 is not limited to a spherical shape; an aspherical shape is also possible. Furthermore, the encapsulation lens 22 can be used to control the light distribution direction of light LB emitted from the light-emitting element 21.

[0025] In light source 2, because it is a direct-encapsulation type, it is easy to set the shape of the encapsulated lens 22 to a dome shape with an aspect ratio of 0.2 to 1. Regarding the shape of the encapsulated lens 22, especially when it is set to a dome shape within the range of 0.4 to 0.6, the brightness uniformity characteristics of uneven brightness become good. Here, the aspect ratio is the ratio of the height h to the radius r of the dome-shaped lens (h / r). A aspect ratio of 1 results in a hemispherical shape.

[0026] (Wavelength converter 8) The wavelength conversion sheet 8 is arranged facing the complex light source 2. Figure 5 is an enlarged cross-sectional view showing a portion of the wavelength conversion sheet 8 shown in Figure 3. As shown in Figure 5, the wavelength conversion sheet 8 includes, for example, a particle-shaped wavelength conversion material 81. The wavelength conversion material 81, for example, a phosphor (fluorescent material) containing fluorescent pigments or dyes, or quantum dots, is excited by light from the light source 2 and, based on principles such as fluorescence, converts the wavelength of the light from the light source 2 into light of a different wavelength than the original wavelength, and emits it. Furthermore, in Figure 5, for simplicity, the wavelength conversion material 81 is depicted as a particle, but this disclosure is not limited to wavelength conversion materials 81 being in a particle shape.

[0027] The wavelength-converting material 81 contained in the wavelength-converting plate 8 absorbs blue light emitted from the light source 2 and converts a portion of it into red light (e.g., wavelength 620nm~750nm) or green light (e.g., wavelength 495nm~570nm). In this case, the light from the light source 2 passes through the wavelength-converting plate 8, and the red, green, and blue light are combined to generate white light. Alternatively, the wavelength-converting material 81 contained in the wavelength-converting plate 8 can also absorb blue light and convert a portion of it into yellow light. In this case, the light from the light source 2 passes through the wavelength-converting plate 8, and the yellow and blue light are combined to generate white light.

[0028] The wavelength conversion material 81 included in the wavelength conversion sheet 8 preferably contains quantum dots. Quantum dots are particles with a major diameter of approximately 1 nm to 100 nm and have discrete energy levels. Because the energy state of a quantum dot depends on its size, the emission wavelength can be freely selected by changing its size. Furthermore, the emitted light from quantum dots has a narrow spectral width. By combining light with such steep peaks, the color gamut can be expanded. Therefore, using quantum dots as a wavelength conversion material can easily expand the color gamut. Moreover, quantum dots have high responsiveness, enabling efficient utilization of the light from the light source 2. In addition, quantum dots also have high stability. Quantum dots can be, for example, compounds of group 12 and group 16 elements, compounds of group 13 and group 16 elements, or compounds of group 14 and group 16 elements, such as CdSe, CdTe, ZnS, CdS, PbS, PbSe, or CdHgTe. Furthermore, due to environmental restrictions such as RoHS, Cd-free quantum dots are required. The core materials include InP series, perovskite CsPbBr3 series, Zn (Te, Se) or a ternary system of group I-III-VI, namely silver indium sulfide.

[0029] (Diffusion sheet 7) The diffuser 7 is an optical component disposed between the wavelength conversion plate 8 and the complex light source 2. The diffuser 7 is used to homogenize the angular distribution of the incident light. The diffuser 7 can be a single diffuser plate or a single diffuser sheet, or it can be two or more diffuser plates or diffuser sheets. Furthermore, the diffuser 7 can also be a plate-shaped optical component with a certain thickness and a certain rigidity.

[0030] (Interstitial material 6) The spacer 6 is a component used to maintain the optical distance between the light source 2 and the diffuser 7.

[0031] (Optical Film Group 9) Optical element group 9 is an optical component positioned on the opposite side of diffuser 7 when viewed from the light-emitting surface side of wavelength converter 8 (i.e., wavelength converter 8). Optical element group 9 may include, for example, sheets or thin films used to enhance brightness. In the example shown in Figure 1, optical element group 9 consists of optical sheets 91 and 92 sequentially laminated on wavelength converter 8. Optical sheets 91 and 92 may also be integrally bonded together. Optical sheet 91 is, for example, a prism. Optical sheet 92 is, for example, a reflective polarizing film such as DBEF (Dual Brightness Enhancement Film). Furthermore, the number of optical sheets constituting optical element group 9, the types of the plurality of optical sheets constituting optical element group 9, and the lamination order can be arbitrarily selected.

[0032] (Flexible film 30) A flexible film 30 is selectively disposed on the resin layer 5. More specifically, the flexible film 30 is disposed in the area outside the region where the plurality of light sources 2 are disposed in the surface 1FS. An opening 30K is provided in the flexible film 30 in the Z-axis direction, in the region coinciding with the plurality of light sources 2. The opening 30K is a through-hole for arranging the light source 2, and the resin layer 5 is exposed in the area where the opening 30K is formed, so that the exposed resin layer 5 is covered by the encapsulation lens 22 of the light source 2. The flexible film 30 is bonded to the surface of the resin layer 5 extending in the XY plane. Specifically, it is fixed by an adhesive or the like. The flexible film 30 is, for example, a reflective sheet, having high reflectivity for light LB from the light source 2 and light LY whose wavelength is converted by the wavelength conversion sheet 8. The flexible film 30, as a material with high reflectivity, may include titanium oxide or Ag (silver). Specifically, the flexible film 30 is, for example, a white photoresist layer. As a white photoresist, it can be an inorganic material such as titanium dioxide (TiO2) microparticles or barium sulfate (BaSO4) microparticles, or an organic material such as porous acrylic resin microparticles or polycarbonate resin microparticles with numerous pores for light scattering. Epoxy-based resins can also be used as the constituent material of the flexible film 30. Furthermore, the flexible film 30 can also be composed of a resin containing inorganic material microparticles such as titanium dioxide (TiO2) microparticles or barium sulfate (BaSO4) microparticles.

[0033] Therefore, since the flexible film 30 is a reflective sheet, the reflected light from the wavelength conversion sheet 8 or the optical sheet group 9 in the light LB and LY is used as circulating light to generate white light by being reflected by the flexible film 30. Therefore, the overall brightness of the light-emitting device 100 can be improved.

[0034] (Relay substrate 20) The relay substrate 20 is a component that electrically and mechanically connects a plurality of light source units 10, relaying the plurality of light source units 10 to power supply circuits or drive circuits, etc. The relay substrate 20 can, for example, be constructed from a flexible thin-film component similar to the light source substrate 1. The same materials used for the relay substrate 20 as those used for the light source substrate 1 can be used. That is, the relay substrate 20 can be made from resin films formed from PI (polyimide), PET (polyterephthalic acid), PC (polycarbonate), PEN (polynaphthaleneacetic acid), PEI (polyetherimide), LCP (liquid crystal polymer), or fluororesins, for example. Alternatively, the relay substrate 20 can be made by forming an insulating resin layer such as polyimide or epoxy on the surface of a metal substrate such as aluminum (Al). Furthermore, the relay substrate 20 can also be made from a glass-containing resin-based thin-film substrate such as glass epoxy resin represented by FR4 or glass composite resin represented by CEM3. A plurality of wirings 52 are formed on the surface of the relay substrate 20 (i.e., the surface facing the light source substrate 1). A plurality of wirings 53 are also formed on the inside of the relay substrate 20 (i.e., the surface opposite to the light source substrate 1). The wirings 52 and 53 are interconnected, for example, via a via 20V.

[0035] Furthermore, the relay substrate 20 is bonded to a plurality of light source units 10 via a conductive material layer 54. Specifically, for example, opposing wirings 51 and 52 are bonded by sandwiching the conductive material layer 54. In addition, the plurality of light source units 10 and the relay substrate 20 can be bonded to each other at a plurality of locations via the conductive material layer 54. Because each light source unit 10 and the relay substrate 20 is interconnected at multiple points, each light source unit can be held more stably relative to the relay substrate 20. Furthermore, because the signal transmission paths and power supply paths of the plurality of light source units 10 and the relay substrate 20 can be ensured, more functions can be provided. Also, as a constituent material of the conductive material layer 54, conductive paste and solder, or anisotropic conductive adhesive (ACA), are suitable for use.

[0036] [1.2 Function] In this embodiment of the light-emitting device 100, as shown in FIG3, a portion of the blue light LB emitted from the light source 2 becomes light LY, which undergoes wavelength conversion (emission) by a wavelength-converting material contained in the wavelength conversion plate 8. The wavelength-converted light LY is, for example, red light, green light, or yellow light. The wavelength-converted light LY is reflected and emitted evenly and uniformly from the wavelength conversion plate 8. Blue light LB emitted from the light source 2 that is not absorbed by the wavelength conversion material 81 is also emitted evenly and uniformly from the wavelength conversion plate 8. Blue light LB emitted from the light source 2 that is not absorbed by the wavelength conversion material 81 (FIG. 5) is also emitted from the wavelength conversion plate 8 in its original state. The forward-facing light from these unconverted blue light LB and the forward-facing light from the wavelength-converted light LY combine to generate white light, which is emitted forward (outside the light source device).

[0037] In the light-emitting device 100 of this embodiment, multiple light source units, each with a plurality of light sources, are connected to a single relay substrate 20. Therefore, since the arrangement positions of each of the multiple light source units 10 can be finely adjusted, the arrangement positions of each light source 2 can be easily optimized. Furthermore, this also contributes to the weight reduction of the light-emitting device 100. That is, by connecting multiple light source units 10 via a single relay substrate 20, compared to a structure where multiple light sources are arranged on a single plate-shaped substrate, multiple light sources 2 are achieved while reducing the material usage of the light source substrate 1, resulting in weight reduction and cost reduction. Therefore, according to the light-emitting device 100, weight reduction and cost reduction can be achieved, and a highly precise luminous intensity distribution can be realized.

[0038] In the light-emitting device 100 of this embodiment, a plurality of light source units 10 are arranged separately from each other along the Y-axis. Therefore, compared with the structure in which a plurality of light sources 2 are arranged on a single plate-shaped substrate, a plurality of light sources 2 are achieved while reducing the amount of material used in the light source substrate 1, and achieving weight reduction and cost reduction.

[0039] Furthermore, in the light-emitting device 100 of this embodiment, if the width W1 of the light source unit 10 in the Y-axis direction is narrower than the distance W2 between the plurality of adjacent light source units 10 in the Y-axis direction, then when a predetermined number of light sources 2 are arranged as the entire light-emitting device 100, compared with the case where, for example, the width W1 is equal to or greater than the distance W2, the amount of material used in the light source substrate 1 can be further reduced, resulting in lighter weight and lower cost.

[0040] Furthermore, in the light-emitting device 100 of this embodiment, a plurality of light sources 2 are arranged in a row along the X-axis direction on the light source substrate 1. Therefore, when a predetermined number of light sources 2 are arranged as the entire light-emitting device 100, compared with, for example, arranging a plurality of rows of light sources 2, the amount of material used in the light source substrate 1 can be further reduced, resulting in lighter weight and lower cost.

[0041] Furthermore, in the light-emitting device 100, a plurality of light source units 10 are bonded to the relay substrate 20 via a conductive material layer 54. Therefore, compared to, for example, bonding via a connector, the connection portions of the plurality of light source units 10 and the relay substrate 20 can be simplified, miniaturized, thinned, and lightened. Thus, compared to using a connector, miniaturization of each light source unit 10 becomes possible, and the number of light sources 2 per unit area can be increased. That is, high integration of the plurality of light sources 2 can be achieved. Furthermore, compared to using a connector, manufacturing ease is also improved. In particular, in the light-emitting device 100, the plurality of light source units 10 and the relay substrate 20 are bonded at a plurality of locations via the conductive material layer 54. Thus, because the plurality of light source units 10 and the relay substrate 20 are connected at multiple points, the plurality of light source units 10 are held more stably relative to the relay substrate 20. Furthermore, because it can ensure the signal transmission path and power supply path of each of the multiple light source units 10 and the relay substrate 20, the light-emitting device 100 can have more functions.

[0042] Furthermore, in the light-emitting device 100, because the light source substrate 1 is flexible, or both the light source substrate 1 and the relay substrate 20 are flexible, it can be adapted to curved screens, for example.

[0043] Furthermore, in the light-emitting device 100, multiple light source units 10 can be fixed by a flexible thin film 30, and can be integrated into one unit. Therefore, for example, the handling of semi-finished products in the manufacturing process becomes easier, and for example, the operation of bonding multiple light source units 10 on the relay substrate 20 can be carried out in a general manner, thereby improving manufacturing ease.

[0044] Furthermore, in the light-emitting device 100, the flexible film 30 is bonded to the surface of the resin layer 5 on the XY plane of the light source unit 10. Therefore, the plurality of light source units 10 are held more stably relative to the flexible film 30.

[0045] Furthermore, in the light-emitting device 100, the flexible film 30 has an opening 30K in the Z-axis direction in the region coinciding with the light source 2. Therefore, even when the flexible film 30 is disposed on the light-emitting side of the light source 2, it is possible to bypass the area where the light source 2 is located and perform bonding with the plurality of light source units 10. Thus, it is possible to avoid the flexible film 30 from obstructing the emission of light.

[0046] Furthermore, in the light-emitting device 100, a driving element for driving a plurality of light sources 2 is provided in at least one of the relay substrate 20 and the light source substrate 1. Therefore, compared to the case where the driving element 40 is provided outside the light-emitting device 100, the driving of the plurality of light sources 2 can be performed at a faster speed. In particular, by providing the driving element 40 on the light source substrate 1, the responsiveness of the light sources 2 can be further improved because driving a portion of the light sources 2 located near the driving element 40 among the plurality of light sources 2 provided on the light source substrate 1 can be performed.

[0047] [1.3 Effect] As described above, the light-emitting device 100 according to this embodiment can arrange multiple light sources at a higher density while maintaining good light-emitting performance. Furthermore, it also achieves a lightweight design.

[0048] [1.4 Variations of the first embodiment] (First variation) Figure 6 is a plan view showing a structural example of the light-emitting device 100-1 of the first embodiment. In this first embodiment of the light-emitting device 100-1, all driving elements 40 are disposed on the relay substrate 20. In the light-emitting device 100-1, a plurality of light sources 2 disposed on both sides of two adjacent light source units 10 in the Y-axis direction are driven by driving elements 40 disposed between the two light source units 10. Specifically, as shown in Figure 6, unit regions AL, AC, and AR are set across both light source units 10A and 10B. For example, the plurality of light sources 2 disposed in unit region AL are connected to driving element 40L via wiring 4, and are driven and controlled by driving element 40L. Similarly, the light sources 2 disposed in unit region AC are connected to driving element 40C via wiring 4, and are driven and controlled by driving element 40C. Furthermore, the light sources 2 disposed in unit region AR are connected to driving element 40R via wiring 4, and are driven and controlled by driving element 40R. Therefore, in this disclosure, the unit for driving and controlling the complex light sources 2 can be arbitrarily set.

[0049] Furthermore, in the example shown in Figure 6, six light sources 2 are configured in one unit area AL, AC, AR, but this disclosure is not limited to this. The number of light sources 2 contained in one unit area AL, AC, AR may be 1 or 2, or more than 4.

[0050] <2. Second Implementation Form> [2.1 Construction] Figure 7 shows the appearance of the display device 101 according to the second embodiment of the present technology. The display device 101 includes a light-emitting device 100 and is used, for example, as a thin-film television device. It has a flat body 102 for image display supported by a bracket 103. Furthermore, the display device 101 can be used as a placement type when the bracket 103 is mounted on the body 102 and placed on a horizontal surface such as a floor, shelf, or platform. However, it can also be used as a wall-mounted type when the bracket 103 is removed from the body 102.

[0051] Figure 8 is an exploded view of the main body 102 shown in Figure 7. The main body 102, for example, sequentially comprises a front outer frame (frame) 111, a panel module 112, and a rear outer frame (rear cover) 113 from the front side (audiovisor side). The front outer frame 111 is a frame-like member covering the front periphery of the panel module 112, and a pair of speakers 114 are positioned below it. The panel module 112 is fixed to the front outer frame 111, and a power board 115 and a signal board 116 are mounted on its back side, along with a mounting accessory 117. The mounting accessory 117 is used for mounting wall mount brackets, boards, etc., and for mounting the bracket 103. The rear outer frame 113 covers the back and sides of the panel module 112.

[0052] Figure 9 is an exploded view of the panel module 112 shown in Figure 8. The panel module 112, for example, includes, from the front side (viewer side), a front frame (top frame) 121, a liquid crystal panel 122, a frame-shaped member (middle frame) 123, a light-emitting device 100, a rear frame (rear frame) 124, and a timing controller substrate 127.

[0053] The front frame 121 is a frame-shaped metal component that covers the front periphery of the liquid crystal panel 122. The liquid crystal panel 122 includes, for example, liquid crystal cells 122A, a source substrate 122B, and a flexible substrate 122C such as a COF (Chip On Film) connecting them. The frame-shaped member 123 is a frame-shaped resin component that holds the liquid crystal panel 122. The rear frame 124 is a metal component made of iron (Fe) or the like that that houses the liquid crystal panel 122, the frame-shaped member 123, and the light-emitting device 100. A timing controller substrate 127 is also mounted on the back side of the rear frame 124.

[0054] Figure 10 is a plan view showing a more specific structural example of the panel module 112. In the example of the light-emitting device 100 shown in Figure 10, a total of 12 light source units 10 are arranged in the display area of ​​the liquid crystal panel 122, which expands in the H direction (horizontal direction) and V direction (vertical direction). Specifically, 6 rows of light source units 10 are arranged in the H direction, and 2 rows of light source units 10 are arranged in the V direction. In each light source unit 10, for example, the long side direction of the plurality of light source substrates 1 is the H direction, and the long side direction of the relay substrate 20 is the V direction. In addition, the description of the flexible film 30 is omitted in Figure 10. As shown in Figure 10, in the panel module 112, the timing controller substrate 127 is provided, for example, in the central area of ​​the light-emitting device 100. The timing controller substrate 127 and the plurality of light source units 10 (10-1 to 10-12) are connected, for example, by cables CB (CB1 to CB12) and connectors CN (CN1 to CN12).

[0055] [2.2 Effects] In the display device 101, light from the light-emitting device 100 is selectively transmitted through the liquid crystal panel 122 for image display. As described in the first embodiment, because the light-emitting device 100 has good light emission control and improved light emission efficiency, the display quality of the display device 101 can be expected to be improved.

[0056] [2.3 Variations of the second embodiment] (First variation) Figure 11 is a plan view of panel module 112A, which is a first modification of the second embodiment. In panel module 112 shown in Figure 10, timing controller board 127 is individually and directly connected to all light source units 10 via cables CB and connectors CN. In contrast, in panel module 112A, for example, relay boards 20 of two adjacent light source units 10 in the V direction are electrically connected to each other to form six light source unit pairs 10P. Specifically, light source units 10-1 to 10-6 and light source units 10-7 to 10-12 are connected respectively to form light source unit pairs 10P1 to 10P6. The relay boards 20 can be connected to each other, for example, via board-to-board connectors, or flexible printed circuit boards (FPCs) and anisotropic conductive adhesives (ACA). The timing controller board 127 and the six light source units 10P1~10P6 are respectively connected by cables CB1~CB6 and connectors CN1~CN6.

[0057] According to the panel module 112A in FIG11, compared with the panel module 112 of the second embodiment described above (FIG10), the number of cables CB and connectors CN can be reduced when using the same number of light source units 10.

[0058] (Second variation) Figure 12 is a plan view showing the light-emitting device 100B of the panel module 112B as a second modification of the second embodiment. In the light-emitting device 100B of the panel module 112B in this modification, four rows of light source units 10 are arranged in the H direction and two rows of light source units 10 are arranged in the V direction. Furthermore, in each light source unit 10-1 to 10-8, for example, the long side direction of the plurality of light source substrates 1 is the V direction, and the long side direction of the relay substrate 20 is the H direction. In the panel module 112B, for example, the relay substrates 20 of two adjacent light source units 10 in the H direction are electrically connected to each other to form a total of four light source unit pairs 10P1 to 10P4. Specifically, the light source unit pairs 10P1 formed by connecting the relay substrates 20 of light source units 10-1 to 10-2, 10P2 formed by connecting the relay substrates 20 of light source units 10-3 to 10-4, 10P3 formed by connecting the relay substrates 20 of light source units 10-5 to 10-6, and 10P4 formed by connecting the relay substrates 20 of light source units 10-7 to 10-8 can also be used. The connection between the relay substrates 20 is as described above. In the light-emitting device 100B, the timing controller board 127 is connected to the light source unit pairs 10P1 to 10P4 via connectors CN1 to CN4. Furthermore, in the light-emitting device 100B, for example, the relay substrates 20 of the four light source units 10-1 to 10-4 arranged in the H direction can be electrically connected, and the relay substrates 20 of the four light source units 10-5 to 10-8 can also be electrically connected. Furthermore, in the light-emitting device 100B, the timing controller board 127 and all the light source units 10 can be connected individually and directly via cable CB and connector CN.

[0059] (3rd variation) Figure 13 is a plan view showing the light-emitting device 100C of the panel module 112C as a third modification of the second embodiment. In the light-emitting device 100C of this modification of the panel module 112C, similar to the light-emitting device 100 of the panel module 112 in Figure 10, six rows of light source units 10 are arranged in the H direction, and two rows of light source units 10 are arranged in the V direction. In each light source unit 10, for example, the long side direction of the plurality of light source substrates 1 is in the H direction, and the long side direction of the relay substrate 20 is in the V direction. However, the relay substrate 20 is provided across the boundary of two adjacent light source units 10 in the H direction. The relay substrate 20 provided at the boundary of two adjacent light source units 10 is shared by the two light source units 10.

[0060] According to the panel module 11C in FIG13, compared with the panel module 112 of the second embodiment described above (FIG10), the number of relay substrates 20 can be reduced when using the same number of light source units 10.

[0061] <3. Other variations> The present disclosure has been illustrated with embodiments and variations, but it is not limited to the embodiments described above and various variations are possible. For example, the materials or types, placement positions, and shapes of the constituent elements of the light-emitting device described in the above embodiments are not limited to those described above.

[0062] [3.1 Variation 3-1] Figure 14 is an enlarged cross-sectional view showing a portion of the light-emitting device 100D, which is a variation of Example 3-1 of this disclosure. Although the light-emitting element 21 is encapsulated by the encapsulating lens 22 in the first embodiment described above, this disclosure is not limited thereto. The light-emitting device 100A has a light source 2A replacing the light source 2. The light source 2A has a light-emitting element 21A replacing the light-emitting element 21, and a cover lens 22A replacing the encapsulating lens 22.

[0063] The light-emitting element 21A is, for example, a packaged blue LED. Specifically, the light-emitting element 21A has a light-emitting layer 26, a base 27, and a package material 28. The base 27 has a concave receiving portion. The light-emitting layer 26 is disposed on the bottom surface of the receiving portion of the base 27. The receiving portion of the base 27 is filled with the package material 28. The light-emitting layer 26 is, for example, a point light source, specifically composed of a blue LED. The base 27 is mounted on the light source substrate 1 via external electrodes formed, for example, a wire frame, by soldering or the like. The surface of the receiving portion of the base 27 preferably has high reflectivity to light from the light-emitting layer 26. The surface of the receiving portion of the base 27 may be made of a material with high reflectivity, such as Ag. The package material 28 is, for example, made of a transparent resin such as silicone or acrylic. The cover lens 22A is separately disposed above the light-emitting element 21A. At the center of the cover lens 22A, an incident surface 22A1, which is concave in shape and faces the light-emitting element 21A in the Z-axis direction, is provided. The cover lens 22A also has an exit surface 22A2, which is convex in shape and faces the diffuser 7. The incident surface 22A1 and the exit surface 22A2 diffuse the blue light LB from the light-emitting element 21A.

[0064] In the light-emitting device 100A configured in this way, the blue light emitted from the light-emitting element 21A is diffused by the cover lens 22A and the diffuser 7, and then converted into white light when passing through the wavelength conversion sheet 8. The white light converted from blue light is then enhanced and homogenized by the optical sheet group 9 before illuminating the liquid crystal display panel, etc.

[0065] [3.2 Variation 3-2] In the light-emitting device 100D of the above-described variation 3-1, a packaged blue LED is used as the light-emitting element 21A, but this disclosure is not limited to this. For example, as in the light-emitting element 21B of the light-emitting device 100E of the present disclosure shown in FIG. 15, a packaged white LED may be used instead of a packaged blue LED. The light-emitting element 21B has, for example, a light-emitting layer 26 made of a blue LED, a base 27, and a package material 29 made of a transparent resin containing a wavelength-changing material. Furthermore, in the light-emitting device 100E, the wavelength-changing sheet 8 is not required. Therefore, compared with the light-emitting device 100D of FIG. 14, it is advantageous for the overall thinning of the structure.

[0066] [3.3 Variation 3-3] Furthermore, the light-emitting device disclosed herein is not limited to those with lenses disposed on the emission side of the light-emitting element. For example, as shown in FIG. 16 as a variation 3-3 of the light-emitting device 100F of this disclosure, various lenses are not provided, and for example, a plurality of packaged blue LEDs, i.e., light-emitting elements 21C, may be disposed. The light-emitting element 21C has a structure substantially the same as that of the light-emitting element 21A shown in FIG. 10, having a light-emitting layer 26, a base 27, and a package material 28, made of, for example, blue LEDs. In the light-emitting device 100F configured in this way, the blue light emitted from the light-emitting element 21C is diffused by the diffuser 7 and then converted from blue light to white light by the wavelength conversion sheet 8. The white light converted from blue light is then subjected to brightness enhancement and homogenization by the optical sheet group 9 and then illuminates a liquid crystal display panel, etc.

[0067] [3.4 Variations 3-4] In the light-emitting device 100F of the above-described variation 3-3, a packaged blue LED is used as the light-emitting element 21C, but this disclosure is not limited to this. For example, as in the light-emitting element 21D of the light-emitting device 100G of the present disclosure shown in FIG. 17, a packaged white LED may be used instead of a packaged blue LED. The light-emitting element 21D has a structure substantially the same as that of the light-emitting element 21B shown in FIG. 11, having a light-emitting layer 26 made of, for example, a blue LED, a base 27, and a package material 29 made of a transparent resin containing a wavelength-changing material. In the light-emitting device 100G, the wavelength-changing sheet 8 is not required. Therefore, compared with the light-emitting device 100F of FIG. 16, it is advantageous for the overall thinning of the structure.

[0068] [3.5 Variations 3-5] As shown in FIG18, the light-emitting device 100H of the modified examples 3-5 of this disclosure may also include a light-emitting element 21E having a dome-shaped encapsulation material 28. The structure of the light-emitting element 21E is substantially the same as that of the light-emitting element 21C, except for the shape of the encapsulation material 28. In the light-emitting element 21E, because the encapsulation material 28 has a dome shape, the encapsulation material 28 can function as a lens. Therefore, the desired alignment properties can be easily obtained.

[0069] [3.6 Variations 3-6] As shown in FIG19, the light-emitting device 100I of the modified examples 3-6 of this disclosure includes a light-emitting element 21F having a dome-shaped encapsulation material 29. The structure of the light-emitting element 21F is substantially the same as that of the light-emitting element 21D, except for the shape of the encapsulation material 28. Specifically, the light-emitting element 21F has, for example, a light-emitting layer 26 made of a blue LED, a base 27, and an encapsulation material 29 made of a transparent resin containing a wavelength-changing material. In the light-emitting element 21F, because the encapsulation material 29 has a dome shape, the encapsulation material 29 can act as a lens. Therefore, the desired alignment performance can be easily obtained.

[0070] [3.7 Variations 3-7] Figure 20 shows a cross-sectional structure of the light-emitting device 100J, which is a variation of Examples 3-7 of this disclosure, corresponding to Figure 3 of the light-emitting device 100 of the first embodiment described above. In the light-emitting device 100J, an insulating layer 1Z is formed on the inner side 1BS of the light source substrate 1, and an insulating layer 20Z is also formed on the surface of the relay substrate 20. In the light-emitting device 100H, the inner side 1BS of the light source substrate 1 and the surface of the relay substrate 20 are directly or indirectly bonded by an adhesive layer AD. In the light-emitting device 100H, an anisotropic conductive adhesive is used as a constituent material of the conductive material layer 54, for example. Furthermore, the adhesive layer AD can also be formed by an anisotropic conductive adhesive, just like the conductive material layer 54. In this case, an anisotropic conductive adhesive can be formed simultaneously with the adhesive layer AD and the conductive material layer 54. In addition, the anisotropic conductive adhesive is a plurality of conductive particles dispersed in an insulating adhesive. Therefore, the anisotropic conductive adhesive sandwiched between wirings 51 and 52 under pressure forms a conductive material layer 54 by allowing multiple conductive particles to conduct to each other. On the other hand, the anisotropic conductive adhesive in the area outside the area sandwiched between wirings 51 and 52 forms an insulating adhesive layer AD. Furthermore, it is also possible that insulating layers 1Z and 20Z are not provided in the light-emitting device 100H.

[0071] Figure 21 is a cross-sectional view showing the detailed structure of the conductive material layer 54 of the light-emitting device 100J. As shown in Figure 21, the conductive material layer 54 has bumps 61, bumps 62, and conductive material 63. Bumps 61 are disposed on wiring 51. Bumps 62 are disposed on wiring 52. The conductive material 63 is sandwiched between bumps 61 and bumps 62. As the constituent materials of bumps 61, bumps 62, and conductive material 63, conductive pastes and solders containing at least one of Ag or Cu, Ni, and Sn, and anisotropic conductive adhesives are used, for example.

[0072] Figures 22A and 22C are cross-sectional views showing the formation process of the conductive material layer 54 in the light-emitting device 100H. First, as shown in Figure 22A, the wiring 51 of the light source unit 10 and the wiring 52 of the relay substrate 20 are aligned. Next, as shown in Figure 22B, bumps 61 are formed to cover the wiring 51, and bumps 62 are formed to cover the wiring 52. Next, as shown in Figure 22C, anisotropic conductive adhesive 63Z is formed to cover the bumps 61. Alternatively, anisotropic conductive adhesive 63Z can be formed to cover the bumps 62. Finally, conductive material 63 is formed by pressing with anisotropic conductive adhesive 63Z sandwiched between bumps 61 and bumps 62, thus bonding the light source unit 10 and the relay substrate 20. Through the above, the conductive material layer 54 is formed, completing the connection portion 50.

[0073] Furthermore, in Figure 21, bumps 61 and 62 are formed on both the light source unit 10 and the relay substrate 20. However, in this disclosure, as shown in the light-emitting device 100JA in Figure 23, bumps may be provided only on either the light source unit 10 or the relay substrate 20. In the light-emitting device 100JA of Figure 23, bumps 61 are provided only on the wiring 51 of the light source unit 10, and the wiring 52 of the relay substrate 20 directly contacts the conductive material layer 54. However, bumps 62 may be provided only on the wiring 52 of the relay substrate 20, and the wiring 51 of the light source unit 10 may directly contact the conductive material layer 54. In Figure 23, depth D20Z is the difference in the Z-axis direction between the top surface of the insulating layer 20Z and the top surface of the wiring 52. The top surface of the insulating layer 20Z is the surface of the insulating layer 20Z facing the insulating layer 1Z. The top surface of the wiring 52 is the surface of the wiring 52 facing the bump 61. Furthermore, in Figure 23, height H61 is the difference in the Z-axis direction between the position closest to the top of wiring 52 (front end) on the bottom of bump 61 and the bottom of insulating layer 1Z. The bottom of bump 61 is the surface of bump 61 facing wiring 52. The bottom of insulating layer 1Z is the surface of insulating layer 1Z facing insulating layer 20Z. Next, height H63 is the thickness of the portion of conductive material 63 sandwiched between the front end of bump 61 and the top of wiring 52. The sum of heights H61 and H63 is set as height H54. In the light-emitting device 100JA of Figure 23, height H54 is preferably greater than depth D20Z (H54>D20Z). This is to obtain sufficient conductivity in conductive material 63.

[0074] Thus, in the light-emitting device 100JA, which has a bump on only one of the light source unit 10 and the relay substrate 20, compared with the light-emitting device 100J, which has bumps on both the light source unit 10 and the relay substrate 20, the distance in the thickness direction (Z-axis direction) between the light source substrate 1 of the light source unit 10 and the relay substrate 20 is closer. Therefore, the thickness of the light-emitting device 100JA is thinner than that of the light-emitting device 100J. Furthermore, in the light-emitting device 100JA, because the process of forming the bump 62 can be omitted, the manufacturing process is simpler compared with the light-emitting device 100H.

[0075] Figures 24A and 24C are cross-sectional views showing the formation process of the connection portion 50 in the light-emitting device 100JA. First, as shown in Figure 24A, the wiring 51 of the light source unit 10 and the wiring 52 of the relay substrate 20 are aligned. Next, as shown in Figure 24B, a bump 61 is formed to cover the wiring 51. Next, as shown in Figure 24C, an anisotropic conductive adhesive 63Z is formed to cover the bump 61. Finally, the light source unit 10 and the relay substrate 20 are joined by pressure while the anisotropic conductive adhesive 63Z is sandwiched between the bumps 61 and 62. Through the above, a conductive material layer 54 is formed, and the connection portion 50 is completed.

[0076] A comparison between the light-emitting device 100J shown in FIG. 21 and the light-emitting device 100JA shown in FIG. 23 reveals that when the dimensions of the bumps 61 in the X-axis direction are the same, the dimension of the conductive material 63 in the X-axis direction can be larger in the light-emitting device 100JA than in the light-emitting device 100J. In the light-emitting device 100J shown in FIG. 21, the surfaces of both bumps 61 and bumps 62 are convex. Therefore, when the conductive material 63 is formed, the conductive particles contained in the anisotropic conductive adhesive 63Z pressed between bumps 61 and bumps 62 easily flow outward from the area between bumps 61 and bumps 62. In contrast, in the light-emitting device 100JA shown in FIG. 23, although the surface of bump 61 is convex, the top surface of the wiring 52 facing bump 61 is flat. Therefore, the conductive particles contained in the anisotropic conductive adhesive 63Z, which is pressurized between the top of the bump 61 and the wiring 52, are less likely to flow outward from the region between the top of the bump 61 and the wiring 52. Furthermore, the same applies to the Y-axis direction.

[0077] Furthermore, although wiring 51 is provided in the light-emitting device 100JA of Figure 23, it is possible to omit wiring 51 and insulating layer 1Z, as in the light-emitting device 100JB of Figure 25, and instead form bump 64 to replace bump 61. Moreover, bump 64 fills the through-hole 10VH of the light source substrate 1 and protrudes from the inside 1BS of the light source substrate 1 towards the relay substrate 20. Therefore, compared with light-emitting device 100JA, the structure of light-emitting device 100JB is simpler and thinner.

[0078] Furthermore, as shown in Figure 26, in both the light-emitting device 100JA and the light-emitting device 100JB, it is preferable that the dimensions 61X in the X-axis direction and 61Y in the Y-axis direction of the bump 61 are smaller than the dimensions 52X in the X-axis direction and 52Y in the Y-axis direction of the exposed portion of the opposing wiring 52. Figure 26 is a schematic plan view illustrating an example of the positional relationship between the bump 61 and the exposed portion of the wiring 52 in the XY plane. In the light-emitting devices 100JA and 100JB, it is preferable, for example, that the dimension 52X is 1.5 to 3 times the dimension 61X, and the dimension 52Y is 1.5 to 3 times the dimension 61Y. In this way, making the dimensions of the bump 61 in the XY plane smaller than the dimensions of the exposed portion of the wiring 52 in the XY plane ensures the boundary of the alignment between the light source unit 10 and the relay substrate 20 in the XY plane. Furthermore, although Figure 26 illustrates a case where dimensions 52X and 52Y are nearly equal, and dimensions 61X and 61Y are nearly equal, this disclosure is not limited to this. That is, the planar shape of the bump 61 and the planar shape of the exposed portion of the wiring 52 are not limited to being slightly square; they can also be slightly rectangular. Alternatively, these planar shapes can be rounded rectangles, slightly rounded shapes, or slightly oval shapes.

[0079] Furthermore, in the light-emitting devices 100JA and 100JB, the ratio of dimension 52X to dimension 61X and the ratio of dimension 52Y to dimension 61Y can be changed according to the arrangement density (number of connection portions 50 per unit area) or the arrangement position of the connection portions 50 in the XY plane. For example, in the light-emitting area along the XY plane of the light-emitting devices 100JA and 100JB, in areas with a lower arrangement density of connection portions 50, the ratio of dimension 52X to dimension 61X and the ratio of dimension 52Y to dimension 61Y can be increased compared to areas with a higher arrangement density of connection portions 50. Alternatively, in the connection portions 50 located near the center position in the Y-axis direction of the relay substrate 20, the ratio of dimension 52X to dimension 61X and the ratio of dimension 52Y to dimension 61Y can be made smaller, while in the connection portions 50 located near both ends in the Y-axis direction of the relay substrate 20, the ratio of dimension 52X to dimension 61X and the ratio of dimension 52Y to dimension 61Y can be made larger.

[0080] [3.8 Variations 3-8] Figure 27 shows a cross-sectional structure of the light-emitting device 100K as a variation of 3-8 of this disclosure, corresponding to Figure 3 of the light-emitting device 100 of the first embodiment described above. In the light-emitting device 100K, an insulating layer 1Z is formed on the inner side 1BS of the light source substrate 1, and an insulating layer 20Z is also formed on the surface of the relay substrate 20. In the light-emitting device 100K, conductive paste and solder containing Ag or Cu are used as constituent materials for the conductive material layer 54, for example.

[0081] [3.9 Variations 3-9] Although the second embodiment described above illustrates a display device 101 equipped with a liquid crystal panel 122, this disclosure is not limited thereto. That is, in the display device 101, a light-emitting device 100 is used as the backlight for the liquid crystal panel 122, but the light-emitting device 100 can also be used as the display panel.

[0082] Figure 28 schematically illustrates a display device 201 equipped with a display panel 200. The display device 201 includes a display panel 210 and a control circuit 220 that drives and controls the display panel 210. The display device 201 is referred to as an LED display, using LEDs as display pixels. That is, the light source 2 of the light-emitting device 100 is used as the display pixel. The display panel 210 consists of a mounting substrate 210A and a counter substrate 210B that overlap each other. The surface of the counter substrate 210B (the side opposite to the mounting substrate 210A) becomes the image display surface, having a display area in the center and a non-display area, i.e., a frame area, around it. The counter substrate 210B is positioned opposite the mounting substrate 210A, for example, with a predetermined gap. Alternatively, the counter substrate 210B may contact the top surface of the mounting substrate 210A. The counter substrate 210B may be, for example, a substrate with light transmittance that allows visible light to pass through, such as a glass substrate, a transparent resin substrate, or a transparent resin film.

[0083] Furthermore, the effects described in this specification are merely illustrative and not limited to those described; other effects are also possible. For example, the light source is not limited to either white or blue light; light sources emitting red or green light, or other colors, may also be used. Also, in the aforementioned light-emitting device 100, a flexible film 30 is attached to the light-emitting surface side of each light source unit 10, and a plurality of light source units 10 are fixed to the flexible film 30. However, the flexible film 30 may also be attached to the inside of the side opposite to the light-emitting surface of each light source unit 10. Furthermore, this technology can achieve the following structures. (1) A light-emitting device comprising: a plurality of light source units having a light source substrate extending in a first direction and a plurality of light sources arranged on the light source substrate along the first direction; A relay component electrically connected to each of the aforementioned multiple light source units. (2) The light-emitting device as described in (1) above, wherein the aforementioned plurality of light source units and the aforementioned relay member are joined via a conductive material. (3) The light-emitting device as described in (1) or (2) above, wherein the aforementioned plurality of light source units are arranged separately from each other along a second direction perpendicular to the aforementioned first direction. (4) The light-emitting device as described in (3) above, wherein the width of the aforementioned second direction of the aforementioned light source unit is narrower than the spacing between the aforementioned plurality of light source units adjacent to each other in the aforementioned second direction. (5) The light-emitting device as described in (4) above, wherein the aforementioned plurality of light sources are arranged in a row on the light source substrate along the aforementioned first direction. (6) The light-emitting device as described in any one of (1) to (5) above, wherein the aforementioned light source substrate has flexibility, or Both the aforementioned light source substrate and the aforementioned relay component are flexible. (7) The light-emitting device described in any one of (1) to (6) above further comprises: a flexible sheet member for fixing the aforementioned plurality of light source units. (8) The light-emitting device as described in (7) above, wherein the aforementioned sheet member is engaged with the surface of the aforementioned light source unit along the aforementioned first direction. (9) The light-emitting device as described in (7) or (8) above, wherein the aforementioned sheet member has an opening in a region coinciding with the aforementioned light source in a third direction perpendicular to the aforementioned first direction. (10) The light-emitting device described in any one of (1) to (9) above further comprises: a driving element for driving the aforementioned plurality of light sources. (11) The light-emitting device as described in (10) above, wherein the aforementioned driving element is disposed in at least one of the aforementioned relay member and the aforementioned light source substrate. (12) The light-emitting device as described in (10) above, wherein the aforementioned driving element is disposed on the aforementioned light source substrate, and drives a portion of the aforementioned plurality of light sources disposed on the aforementioned light source substrate. (13) The light-emitting device as described in (10) above, wherein the aforementioned driving element is provided on the aforementioned relay member to drive both the first light source in the first light source unit among the aforementioned plurality of light source units and the second light source in the second light source unit among the aforementioned plurality of light source units. (14) The light-emitting device described in any one of (1) to (13) above, wherein the aforementioned plurality of light source units and the aforementioned relay member are respectively engaged at a plurality of positions. (15) The light-emitting device described in any one of (1) to (14) above, wherein the aforementioned plurality of light sources are all white light sources, or include red light sources, green light sources and blue light sources. (16) The light-emitting device described in any one of (1) to (14) above further comprises: a wavelength conversion member; The aforementioned light source is a blue light source; The aforementioned wavelength conversion component converts the blue light from the aforementioned blue light source into white light. (17) The light-emitting device as described in (16) above, wherein the aforementioned wavelength conversion component comprises quantum dots. (18) A display device comprising: a light-emitting device; A display panel that uses light from the aforementioned light-emitting device to display images; in, The aforementioned light-emitting device includes: Each has a light source substrate extending in a first direction and a plurality of light sources arranged on the light source substrate along the first direction; A relay component electrically connected to each of the aforementioned multiple light source units. (19) A light-emitting device comprising: a plurality of light source units having a light source substrate extending in a first direction and a plurality of light sources arranged on the light source substrate along the first direction; The aforementioned multiple light source units are fixed, and a flexible sheet component is formed. (20) The light-emitting device described in any one of (1) to (18) above further comprises: a plurality of connecting portions that electrically connect the plurality of light source units to the plurality of relay members respectively; The aforementioned plurality of light source units and the aforementioned relay components overlap in the thickness direction of the aforementioned plurality of connection portions of the aforementioned light source substrate; The aforementioned connecting portion has a first protrusion formed in the aforementioned light source unit, a second protrusion formed in the aforementioned relay member facing the aforementioned first protrusion in the aforementioned thickness direction, and a conductive material between the aforementioned first protrusion and the aforementioned second protrusion. (21) The light-emitting device described in any one of (1) to (18) above further comprises: a plurality of connecting portions that electrically connect the plurality of light source units to the plurality of relay members respectively; The aforementioned plurality of light source units and the aforementioned relay components overlap in the thickness direction of the aforementioned plurality of connection portions of the aforementioned light source substrate; The aforementioned connecting portion has a protrusion formed on either the aforementioned light source unit or the aforementioned relay member, a gasket formed on the other of the aforementioned light source unit and the aforementioned relay member and facing the aforementioned protrusion in the aforementioned thickness direction, and a conductive material between the aforementioned protrusion and the gasket. (22) The light-emitting device as described in (21) above, wherein each of the aforementioned plurality of light source units further has a conductive hole that is connected to the aforementioned plurality of light sources and penetrates the aforementioned light source substrate in the thickness direction of the aforementioned light source substrate. (23) The light-emitting device as described in (22) above, wherein the aforementioned protrusion covers the aforementioned conductive hole. (24) The light-emitting device as described in (21) above, wherein the dimension of the aforementioned protrusion in the aforementioned first direction is smaller than the dimension of the aforementioned gasket in the aforementioned first direction; The dimension of the aforementioned protrusion in the second direction, which is perpendicular to the aforementioned first direction, is smaller than the dimension of the aforementioned gasket in the second direction. (25) The display device as described in (18) above further comprises: a plurality of connecting portions that electrically connect the aforementioned plurality of light source units and the aforementioned relay member respectively; The aforementioned plurality of light source units and the aforementioned relay components overlap in the thickness direction of the aforementioned plurality of connection portions of the aforementioned light source substrate; The aforementioned connecting portion has a protrusion formed on either the aforementioned light source unit or the aforementioned relay member, a gasket formed on the other of the aforementioned light source unit and the aforementioned relay member and facing the aforementioned protrusion in the aforementioned thickness direction, and a conductive material between the aforementioned protrusion and the gasket.

[0084] 100: Light-emitting device 10: Light source unit 20: Relay substrate 30: Flexible film 40 (40C, 40L, 40R): Drive element 50: Connecting part 51~53: Wiring 54: Conductive material layer 61, 62, 64: Bumps 63: Conductive materials 1:Light source substrate 1BS: Inside 1FS: Surface 2: Light source 21, 21A~21D: Light-emitting elements 22: Encapsulated Lens 22A: Cover lens 23: Semiconductor layer 24: Transparent layer 25: Reflective layer 26: Emissive layer 27: Base 28, 29: Encapsulation materials 4: Wiring 5: Resin layer 7: Diffusion sheet 8: Wavelength conversion plate 9: Optical Panels 91, 92: Optical plates AR: Unit Area FFC: Flexible Flat Cable 101: Display device

Claims

1. A light-emitting device comprising: a plurality of light source units, each having a light source substrate extending in a first direction and a plurality of light sources arranged on the light source substrate along the first direction; and a relay member electrically connected to each of the plurality of light source units, wherein, The aforementioned plurality of light source units are arranged separately from each other along a second direction perpendicular to the aforementioned first direction, wherein the width of the aforementioned plurality of light source units in the aforementioned second direction is narrower than the spacing between adjacent aforementioned plurality of light source units in the aforementioned second direction.

2. The light-emitting device as described in claim 1, wherein, The aforementioned multiple light source units and the aforementioned relay components are joined via a conductive material.

3. The light-emitting device as described in claim 1, wherein, The aforementioned plurality of light sources are arranged in a row on the aforementioned light source substrate along the aforementioned first direction.

4. The light-emitting device as described in claim 1, wherein, The aforementioned light source substrate is flexible, or both the aforementioned light source substrate and the aforementioned relay component are flexible.

5. The light-emitting device as described in claim 1 further comprises: a flexible sheet member for fixing the aforementioned plurality of light source units.

6. The light-emitting device as described in claim 5, wherein, The aforementioned sheet component is joined to the surface of the aforementioned plurality of light source units along the aforementioned first direction.

7. The light-emitting device as described in claim 5, wherein, The aforementioned sheet member has an opening in a third direction perpendicular to the aforementioned first direction, in a region that coincides with the aforementioned plurality of light sources.

8. The light-emitting device as described in claim 1 further comprises: a driving element for driving the aforementioned plurality of light sources.

9. The light-emitting device as described in claim 8, wherein, The aforementioned driving element is disposed in at least one of the aforementioned relay component and the aforementioned light source substrate.

10. The light-emitting device as described in claim 8, wherein, The aforementioned driving element is disposed on the aforementioned light source substrate, and drives a portion of the aforementioned plurality of light sources disposed on the aforementioned light source substrate.

11. The light-emitting device as described in claim 8, wherein, The aforementioned driving element is disposed on the aforementioned relay component to drive both the first light source in the first light source unit and the second light source in the second light source unit among the aforementioned plurality of light source units.

12. The light-emitting device as described in claim 1, wherein, The aforementioned multiple light source units and the aforementioned relay components are connected at multiple positions respectively.

13. The light-emitting device as described in claim 1, wherein, The aforementioned multiple light sources are all white light sources, or include red light sources, green light sources, and blue light sources.

14. The light-emitting device as described in claim 1 further comprises: a wavelength conversion member; the aforementioned plurality of light sources being blue light sources; and the aforementioned wavelength conversion member converting blue light from the aforementioned blue light source into white light.

15. The light-emitting device as described in claim 14, wherein, The aforementioned wavelength conversion component contains quantum dots.

16. A display device comprising: a light-emitting device; and a display panel having a display area for displaying images using light from the aforementioned light-emitting device; wherein, The aforementioned light-emitting device comprises: a plurality of light source units, each having a light source substrate extending in a first direction and a plurality of light sources arranged on the aforementioned light source substrate along the aforementioned first direction; and a relay member electrically connected to each of the aforementioned plurality of light source units, wherein the aforementioned plurality of light source units are arranged separately from each other along a second direction perpendicular to the aforementioned first direction, and wherein the width of the aforementioned plurality of light source units in the aforementioned second direction is narrower than the spacing between adjacent aforementioned plurality of light source units in the aforementioned second direction.

17. A light-emitting device comprising: a plurality of light source units, each having a light source substrate extending in a first direction and a plurality of light sources arranged on the light source substrate along the first direction; and a flexible sheet member for fixing the plurality of light source units, wherein... The aforementioned sheet member has an opening in a third direction perpendicular to the aforementioned first direction, in a region that coincides with the aforementioned plurality of light sources.

18. The light-emitting device as described in claim 1 further comprises: a plurality of connecting portions that electrically connect the plurality of light source units and the plurality of relay members respectively; the plurality of light source units and the plurality of relay members are respectively coincident in the thickness direction of the plurality of connecting portions of the light source substrate; the plurality of connecting portions have a first protrusion formed in the plurality of light source units, a second protrusion formed in the relay members facing the first protrusion in the thickness direction, and a conductive material between the first protrusion and the second protrusion.

19. The light-emitting device as described in claim 1 further comprises: a plurality of connecting portions that electrically connect the plurality of light source units and the plurality of relay members respectively; the plurality of light source units and the plurality of relay members overlap in the thickness direction of the plurality of connecting portions respectively; the plurality of connecting portions have a protrusion formed in any one of the plurality of light source units and the plurality of relay members, a gasket formed in the other of the plurality of light source units and the plurality of relay members and facing the protrusion in the thickness direction, and a conductive material between the protrusion and the gasket.

20. The light-emitting device as described in claim 19, wherein, Each of the aforementioned multiple light source units further has a conductive hole that is connected to the aforementioned multiple light sources and penetrates the aforementioned light source substrate in the thickness direction of the aforementioned light source substrate.

21. The light-emitting device as described in claim 20, wherein, The aforementioned bumps cover the aforementioned conductive holes.

22. The light-emitting device as described in claim 19, wherein, The dimension of the aforementioned protrusion in the aforementioned first direction is smaller than the dimension of the aforementioned gasket in the aforementioned first direction; the dimension of the aforementioned protrusion in the aforementioned second direction, which is perpendicular to the aforementioned first direction, is smaller than the dimension of the aforementioned gasket in the aforementioned second direction.

23. The display device as described in claim 16 further comprises: a plurality of connecting portions that electrically connect the plurality of light source units and the plurality of relay members respectively; the plurality of light source units and the plurality of relay members overlap in the thickness direction of the plurality of connecting portions respectively; the plurality of connecting portions have a protrusion formed in any one of the plurality of light source units and the plurality of relay members, a gasket formed in the other of the plurality of light source units and the plurality of relay members and facing the protrusion in the thickness direction, and a conductive material between the protrusion and the gasket.

24. A light-emitting device comprising: a plurality of light source units, each having a light source substrate extending in a first direction and a plurality of light sources arranged on the light source substrate along the first direction; a relay member electrically connected to each of the plurality of light source units; and a flexible sheet member for fixing the plurality of light source units, wherein, The aforementioned sheet member has an opening in a third direction perpendicular to the aforementioned first direction, in a region that coincides with the aforementioned plurality of light sources.

25. A display device comprising: a light-emitting device; and a display panel having a display area for displaying images using light from the aforementioned light-emitting device; wherein, The aforementioned light-emitting device comprises: a plurality of light source units, each having a light source substrate extending in a first direction and a plurality of light sources arranged on the aforementioned light source substrate along the aforementioned first direction; a relay member electrically connected to each of the aforementioned plurality of light source units; and a flexible sheet member for fixing the aforementioned plurality of light source units, wherein the aforementioned sheet member has an opening in a third direction perpendicular to the aforementioned first direction in a region overlapping with the aforementioned plurality of light sources.

Images