Resin composition, film, and display device

Abstract

This invention provides a resin composition capable of forming novel films with superior properties. The resin composition comprises a resin (A), inorganic particles (B), and a solvent (E), wherein the resin (A) has a structural unit (Ab), and the structural unit (Ab) contains a carbazole ring that may have substituents.

Description

Technical Field

[0001] This invention relates to a resin composition, a film, and a display device. Prior Technology

[0002] In recent years, resin compositions have been used in liquid crystal display devices to form films such as outer coatings. Among such resin compositions, there are known resin compositions that contain a copolymer formed by polymerizing methacrylic acid and decyl 3,4-epoxytricyclic [5.2.1.0 2,6]acrylate (Patent Document 1). [Existing technical documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2006-171160 Summary of the Invention

[0004] [The problem that the invention aims to solve] The object of the present invention is to provide a resin composition capable of forming a novel film with excellent properties, a film formed from the resin composition, and a display device including the film. [Methods for solving problems]

[0005] This invention includes the following inventions. [1] A resin composition comprising resin (A), inorganic particles (B) and solvent (E), The resin (A) has a structural unit (Ab) containing a carbazole ring that may have substituents. [2] The resin composition as described in [1], wherein the resin (A) has: a structural unit (Ab) and a structural unit (Aa) derived from an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms. [3] The resin composition as described in [2], wherein the structural unit (Aa) has an epoxidized structure of an unsaturated alicyclic hydrocarbon. [4] The resin composition as described in [2] or [3], wherein the resin (A) has: a structural unit (Aa), a structural unit (Ab), and a structural unit (Ac1) derived from a compound belonging to the group comprising unsaturated carboxylic acids and unsaturated carboxylic anhydrides. [5] A membrane is formed from a resin composition as described in any one of [1] to [4]. [6] A display device comprising a film as described in [5]. [The effects of the invention]

[0006] The resin composition of the present invention provides a resin composition with excellent developability, a film formed from the resin composition, and a display device containing the film. Implementation

[0007] Unless otherwise specified, the compounds exemplified as components in this specification may be used alone or in combination.

[0008] [Resin Composition] The resin composition of the present invention comprises a resin (hereinafter referred to as resin (A)), inorganic particles (B) and a solvent (hereinafter referred to as solvent (E)). Resin (A) comprises a structural unit (Ab) containing a carbazole ring that may have substituents (hereinafter referred to as "structural unit (Ab)"). By giving resin (A) the structural unit (Ab), the resin composition of the present invention can increase the refractive index of the film obtained from the resin composition. By increasing the refractive index of the film, the extraction efficiency of light extracted through the film or the focusing efficiency of light through the film can be improved. The resin composition of the present invention further increases the refractive index of the film obtained from the resin composition by including inorganic particles (B). Furthermore, by simultaneously including resin (A) having structural units (Ab) and inorganic particles (B), the resin composition of the present invention can improve the developability during film formation, thereby also improving the resolution. Moreover, the resolution is only required to be 50 μm or less, preferably 40 μm or less, and more preferably 30 μm or less.

[0009] The resin composition of the present invention may also contain a polymerizable compound (hereinafter referred to as polymerizable compound (C)). When polymerizable compound (C) is included, it is preferable that a polymerization initiator (hereinafter referred to as polymerization initiator (D)) is also included. Furthermore, the resin composition of the present invention may also contain other components, such as polymerization initiation aids (hereinafter referred to as polymerization initiation aids (H)), leveling agents (hereinafter referred to as leveling agents (L)), antioxidants (hereinafter referred to as antioxidants (F)), curing agents (hereinafter referred to as curing agents (G)), etc. Examples of curing agents (G) include polycarboxylic acids (hereinafter referred to as polycarboxylic acids (G1)) and imidazole compounds (hereinafter referred to as imidazole compounds (G2)).

[0010] <Resin (A)> Resin (A) has a structural unit (Ab), and may further contain a structural unit (Aa) having a cyclic ether structure having 2 to 4 carbon atoms (hereinafter referred to as "structural unit (Aa)"). Resin (A) may further contain structural units other than structural units (Aa) and structural units (Ab) that can copolymerize with structural units (Ab) or structural units (Aa) (hereinafter referred to as structural units (Ac)). Furthermore, in this specification, "(meth)acrylic acid" means at least one compound selected from the group consisting of acrylic acid and methacrylic acid. The expressions "(meth)acrylyl" and "(meth)acrylate" have the same meaning. Resin (A) may contain two or more structural units (Ab) and structural units (Aa).

[0011] [1] Structural Unit (Ab) The structural unit (Ab) can be derived from an unsaturated compound containing a carbazole ring that may have substituents. The structural unit derived from the unsaturated compound can be obtained by manufacturing a resin using the unsaturated compound as a monomer. Alternatively, it can be obtained by reacting a compound (Ab'') containing a carbazole ring that may have substituents with another structural unit (Ab').

[0012] The unsaturated compounds that derive the structural unit (Ab) are preferably those represented by formula (III).

[0013]

[0014] In formula (III), R1 represents a hydrogen atom, a methyl group, or a hydroxymethyl group; R2 to R9 independently represent hydrogen atoms, halogen atoms, saturated hydrocarbon groups with 1 to 20 carbon atoms, or aryl groups with 6 to 20 carbon atoms, wherein the hydrogen atoms in the saturated hydrocarbon group may be substituted by alkoxy or aryl groups; X represents a single bond, an alkyl diyl group having one or more carbon atoms, or a group represented by the following formula (V) in a straight-chain or branched-chain form;

[0015] (In formula (V), l represents an integer greater than or equal to 0; m represents an integer greater than or equal to 1)

[0016] Examples of compounds represented by formula (III) include: N-vinylcarbazole, N-allylcarbazole, N-(meth)acrylylcarbazole, 2-(9-carbazolyl)ethyl methacrylate, 2-(9-carbazolyl)ethoxyethyl methacrylate, 2-(9-carbazolyl)-2-methylethyl methacrylate, and 2-(9-carbazolyl)-1-methylethyl methacrylate. Among these, N-vinylcarbazole, N-allylcarbazole, and 2-(9-carbazolyl)ethyl methacrylate are preferred.

[0017] [2] Structural unit (Aa) The structural unit (Aa) can be derived from an unsaturated compound having a cyclic ether structure with 2 to 4 carbon atoms (e.g., selected from at least one group consisting of ethylene oxide rings, oxetane rings, and tetrahydrofuran rings). The structural unit derived from the unsaturated compound having a cyclic ether structure with 2 to 4 carbon atoms can be obtained by manufacturing a copolymer using the unsaturated compound as a monomer. Alternatively, it can be obtained by reacting a compound having a cyclic ether structure with 2 to 4 carbon atoms with another structural unit (hereinafter referred to as structural unit (Aa')).

[0018] Unsaturated compounds with a cyclic ether structure having 2 to 4 carbon atoms and derived structural unit (Aa) can be exemplified by: monomers having ethylene oxide and vinyl unsaturated bonds (hereinafter referred to as monomers (Aa1)), monomers having oxocyclobutyl and vinyl unsaturated bonds (hereinafter referred to as monomers (Aa2)), and monomers having tetrahydrofuran and vinyl unsaturated bonds (hereinafter referred to as monomers (Aa3)).

[0019] Monomer (Aa1) can be exemplified by, for example, a monomer having a structure of epoxidized unsaturated aliphatic hydrocarbons in the form of straight or branched chains (hereinafter referred to as monomer (Aa1-1)), and a monomer having a structure of epoxidized unsaturated alicyclic hydrocarbons (hereinafter referred to as monomer (Aa1-2)). As the derived structural unit (Aa), monomer (Aa1) is preferred in terms of further improving the reliability of the obtained membrane, such as its heat resistance and chemical resistance. Furthermore, monomer (Aa1-2) is more preferred in terms of excellent storage stability of the resin composition.

[0020] As monounsaturates (Aa1-1), examples include: glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, β-ethylglycidyl (meth)acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxymethyl) Styrene, 2,4-bis(glycidoxymethyl)styrene, 2,5-bis(glycidoxymethyl)styrene, 2,6-bis(glycidoxymethyl)styrene, 2,3,4-tris(glycidoxymethyl)styrene, 2,3,5-tris(glycidoxymethyl)styrene, 2,3,6-tris(glycidoxymethyl)styrene, 3,4,5-tris(glycidoxymethyl)styrene, 2,4,6-tris(glycidoxymethyl)styrene, etc.

[0021] Examples of monodimers (Aa1-2) include: vinylcyclohexene monooxide, 1,2-epoxy-4-vinylcyclohexane (e.g., Celloxide 2000; manufactured by Daicel (stock)), 3,4-epoxycyclohexyl methyl methacrylate (e.g., Cyclomer A400; manufactured by Daicel (stock)), 3,4-epoxycyclohexyl methyl methacrylate (e.g., Cyclomer M100; manufactured by Daicel (stock)), compounds represented by formula (I), and compounds represented by formula (II), etc.

[0022]

[0023] In formulas (I) and (II), Rb1 and Rb2 represent hydrogen atoms or alkyl groups having 1 to 4 carbon atoms, wherein the hydrogen atoms in the alkyl group may be substituted with hydroxyl groups; Xb1 and Xb2 represent single bonds, *-Rb3-, *-Rb3-O-, *-Rb3-S-, or *-Rb3-NH-; Rb3 indicates an alkyldiyl group with 1 to 6 carbon atoms; * indicates a bond with O.

[0024] Examples of alkyl groups having 1 to 4 carbon atoms include: methyl, ethyl, n-propyl, isopropyl, n-butyl, dibutyl, and tributyl. Examples of alkyl groups formed by replacing hydrogen atoms with hydroxyl groups include: hydroxymethyl, 1-hydroxyethyl, 2-hydroxyethyl, 1-hydroxypropyl, 2-hydroxypropyl, 3-hydroxypropyl, 1-hydroxy-1-methylethyl, 2-hydroxy-1-methylethyl, 1-hydroxybutyl, 2-hydroxybutyl, 3-hydroxybutyl, 4-hydroxybutyl, etc.

[0025] Rb1 and Rb2 are preferably composed of hydrogen atoms, methyl groups, hydroxymethyl groups, 1-hydroxyethyl groups and 2-hydroxyethyl groups, and more preferably composed of hydrogen atoms and methyl groups.

[0026] Examples of alkyldiyl groups include: methylene, ethyl, propane-1,2-diyl, propane-1,3-diyl, butane-1,4-diyl, pentane-1,5-diyl, hexane-1,6-diyl, etc.

[0027] Xb1 and Xb2 are preferably enumerable single bonds, methylene, ethyl groups, *-CH 2-O-, *-CH 2CH 2-O-, and more preferably enumerable single bonds, *-CH 2CH 2-O-. * indicates a bond with O.

[0028] The compounds represented by formula (I) may be any of the compounds represented by formulas (I-1) to (I-15), preferably compounds represented by formulas (I-1), (I-3), (I-5), (I-7), (I-9) or (I-11) to (I-15), and even more preferably compounds represented by formulas (I-1), (I-7), (I-9) or (I-15).

[0029]

[0030]

[0031] As the compound represented by formula (II), compounds represented by any one of formulas (II-1) to (II-15) may be listed, preferably compounds represented by formulas (II-1), (II-3), (II-5), (II-7), (II-9) or (II-11) to (II-15) may be listed, and even more preferably compounds represented by formulas (II-1), (II-7), (II-9) or (II-15) may be listed.

[0032]

[0033]

[0034] The compounds represented by formula (I) and formula (II) may be used alone or in combination of two or more. When used in combination, the ratio of the compounds [compound represented by formula (I): compound represented by formula (II)] on a mole basis is preferably 5:95 to 95:5, more preferably 20:80 to 80:20. For example, a mixture containing the compounds represented by formula (I-1) and formula (II-1) in a 50:50 ratio may be used (commercially available under the trade name "E-DCPA" (manufactured by Daicel Co., Ltd.)).

[0035] The monomer (Aa2) is preferably a monomer having an oxetyl group and a (meth)propenyloxy group. Examples of monomers (Aa2) include: 3-methyl-3-methpropenyloxymethyloxetane, 3-methyl-3-propenyloxymethyloxetane, 3-ethyl-3-methpropenyloxymethyloxetane, 3-ethyl-3-propenyloxymethyloxetane, 3-methyl-3-methpropenyloxyethyloxetane, 3-methyl-3-propenyloxyethyloxetane, 3-ethyl-3-methpropenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, etc.

[0036] As a monomer (Aa3), it is preferably a monomer having a tetrahydrofuran group and a (meth)acrylic acid group. Examples of monomers (Aa3) include tetrahydrofurfuryl acrylate (e.g., Biscoat V#150, manufactured by Osaka Organic Chemicals Co., Ltd.) and tetrahydrofurfuryl methacrylate.

[0037] As the structural unit (Aa), in terms of superior storage stability of the resin composition, chemical resistance, heat resistance, and mechanical strength of the obtained film, it is preferably a structural unit derived from the monomer (Aa1-2), and more preferably a structural unit represented by formula (Aa-1) or formula (Aa-2). The structural unit represented by formula (Aa-1) is derived from the compound represented by formula (I), and the structural unit represented by formula (Aa-2) is derived from the compound represented by formula (II).

[0038] In formulas (Aa-1) and (Aa-2), Rb1 and Rb2 represent hydrogen atoms or alkyl groups having 1 to 4 carbon atoms, wherein the hydrogen atoms in the alkyl group may be substituted with hydroxyl groups; Xb1 and Xb2 represent single bonds, *-Rb3-, *-Rb3-O-, *-Rb3-S-, or *-Rb3-NH-; Rb3 indicates an alkyldiyl group with 1 to 6 carbon atoms; * indicates a bond with O.

[0039] [3] Structural unit (Ac) As a structural unit (Ac), examples of structural units derived from compounds belonging to the group comprising unsaturated carboxylic acids and unsaturated carboxylic anhydrides can be listed (hereinafter referred to as "structural unit (Ac1)"). Examples of compounds belonging to the group comprising unsaturated carboxylic acids and unsaturated carboxylic anhydrides include: acrylic acid, methacrylic acid, crotonic acid, o-vinylbenzoic acid, m-vinylbenzoic acid, p-vinylbenzoic acid, and other unsaturated monocarboxylic acids; Maleic acid, fumaric acid, citraconic acid, zeaxanthin, itaconic acid, 3-vinyl phthalic acid, 4-vinyl phthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, 1,4-cyclohexene dicarboxylic acid, and other unsaturated dicarboxylic acids; Methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, and other bicyclic unsaturated compounds containing carboxyl groups; Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic acid bicyclic [2.2.1]hept-2-ene anhydride and other unsaturated dicarboxylic acid anhydrides; succinic acid mono[2-(meth)acryloxyethyl] ester, phthalic acid mono[2-(meth)acryloxyethyl] ester and other unsaturated mono[(meth)acryloxyalkyl] esters of di- or higher polycarboxylic acids; Unsaturated acrylates such as α-(hydroxymethyl)acrylates, which contain both hydroxyl and carboxyl groups in the same molecule.

[0040] As structural units (Ac) other than structural unit (Ac1) (hereinafter referred to as "structural unit (Ac2)"), for example, structural units derived from the following compounds can be listed: Methyl methacrylate, dibutyl methacrylate, tributyl methacrylate, 2-ethylhexyl methacrylate, stearyl methacrylate, cyclopentyl methacrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo[5.2.1.0 2,6]decane-8-yl ester (commonly referred to as "dicyclopentyl methacrylate" in this technical field; also referred to as "tricyclodecyl methacrylate"), tricyclo[5.2.1.0 [2,6] Decen-8-yl ester (commonly referred to as "(meth)acrylate dicyclopentenyl ester"), (meth)acrylate dicyclopentyloxyethyl ester, (meth)acrylate isobornyl ester, (meth)acrylate adamantyl ester, (meth)acrylate allyl ester, (meth)acrylate propargyl ester, (meth)acrylate phenyl ester, (meth)acrylate naphthyl ester, (meth)acrylate benzyl ester, and other (meth)acrylates; Hydroxyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, and other hydroxyl-containing methacrylates; Diethyl maleate, diethyl fumarate, diethyl itaconic acid, and other dicarboxylic acid diesters; Bicyclic unsaturated compounds such as bicyclic[2.2.1]hept-2-ene, 5-methylbicyclic[2.2.1]hept-2-ene, 5-ethylbicyclic[2.2.1]hept-2-ene, 5-hydroxybicyclic[2.2.1]hept-2-ene, 5-hydroxymethylbicyclic[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclic[2.2.1]hept-2-ene, 5-methoxybicyclic[2.2.1]hept-2-ene, 5-ethoxybicyclic[2.2.1]hept-2-ene, and 5,6-dihydroxybicyclic[2.2.1]hept-2-ene; N-Phenylacetinimide, N-Cyclohexylmaleimide, N-Benzylmaleimide, N-Succinimido-3-maleimide benzoate, N-Succinimido-4-maleimide butyrate, and other dicarbonyl acetimine derivatives; Styrene, α-methylstyrene, o-vinyltoluene, m-vinyltoluene, p-vinyltoluene, p-methoxystyrene, (meth)acrylonitrile, vinyl chloride, vinylidene chloride, (meth)acrylamide, vinyl acetate, 1,3-butadiene, isoprene, and 2,3-dimethyl-1,3-butadiene, etc. Resin (A) preferably has a structural unit (Ac1).

[0041] [4] Ratio of each structural unit Resin (A) is, for example, resin [K1] or resin [K2]. Resin [K1]: A copolymer composed of structural units (Aa) and structural units (Ab); Resin [K2]: A copolymer composed of structural units (Aa), (Ab) and (Ac). Resin (A) is preferably resin [K2]. Furthermore, in resin [K2], it is preferably a resin that includes structural unit (Ac1) as structural unit (Ac), and more preferably a resin that includes structural unit (Aa), structural unit (Ab) and structural unit (Ac1). When resin (A) contains structural unit (Ac1), the content of structural unit (Ac1) is preferably 1 mol% to 50 mol% and more preferably 5 mol% to 40 mol% relative to all structural units constituting resin (A).

[0042] In resin [K1], the ratio of each structural unit relative to all structural units constituting resin [K1] is preferably as follows: Structural unit (Aa): 5 mol%~95 mol% Structural unit (Ab): 5 mol%~95 mol% Better to be: Structural unit (Aa): 10 mol%~70 mol% Structural unit (Ab): 30 mol%~90 mol.

[0043] When the ratio of the structural units constituting the resin [K1] is within the specified range, the resin composition exhibits excellent and superior preservation stability, chemical resistance, heat resistance, and mechanical strength of the obtained film.

[0044] The resin [K1] can be manufactured, for example, by referring to the method described in the literature "Experimental Method for Polymer Synthesis" (by Takayuki Otsu, published by Kagaku Doujin (Group) Co., Ltd., 1st edition, 1st printing, March 1, 1972) and the references cited in that literature. Specifically, methods include placing specified amounts of structural units (Aa) and (Ab), polymerization initiators, and solvents into a reaction vessel, creating a deoxygenated environment by replacing oxygen with nitrogen, and simultaneously heating and maintaining the temperature while stirring. Furthermore, there are no particular limitations on the polymerization initiators and solvents; those commonly used in the field can be used. Examples of polymerization initiators include azo compounds (2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylpentanonitrile) etc.) or organic peroxides (benzoyl peroxide, etc.). For solvents, any solvent that dissolves the monomers is acceptable; examples include solvents used in resin compositions, as described later.

[0045] In preparing the resin composition of the present invention, a resin solution obtained by reaction can be used directly, or a concentrated or diluted solution can be used, or a solution extracted in solid (powder) form by methods such as reprecipitation can be used. In particular, as a polymerization solvent, by using the solvent contained in the resin composition of the present invention, the reaction solution can be directly used in the manufacture of the resin composition, thus simplifying the manufacturing steps of the resin composition.

[0046] In resin [K2], the preferred ratio of each structural unit among all structural units constituting resin [K2] is: Structural unit (Aa): 1 mol% ~ 90 mol% Structural unit (Ab): 5 mol%~98 mol% Structural unit (Ac): 1 mole%~50 mole% Better to be: Structural unit (Aa): 3 mol%~80 mol% Structural unit (Ab): 17 mol%~90 mol% Structural unit (Ac): 3 moles ~ 40 moles Furthermore, it is better to be: Structural unit (Aa): 3 mol%~80 mol% Structural unit (Ab): 50 mol%~90 mol% Structural unit (Ac): 3 mol%~40 mol.

[0047] In resin [K2], when only structural unit (Ac1) is included as structural unit (Ac), it is preferable to have the following configuration: Structural unit (Aa): 1 mol% ~ 70 mol% Structural unit (Ab): 5 mol%~90 mol% Structural unit (Ac1): 1 mol% ~ 50 mol% Better to be: Structural unit (Aa): 3 mol%~50 mol% Structural unit (Ab): 20 mol%~90 mol% Structural unit (Ac1): 5 mol%~40 mol% Furthermore, it is better to be: Structural unit (Aa): 3 mol%~50 mol% Structural unit (Ab): 50 mol%~90 mol% Structural unit (Ac1): 5 mol%~40 mol.

[0048] In resin [K2], when only structural unit (Ac2) is included as structural unit (Ac), it is preferable to have the following configuration: Structural unit (Aa): 1 mol% ~ 90 mol% Structural unit (Ab): 5 mol%~98 mol% Structural unit (Ac2): 1 mol% ~ 50 mol% Better to be: Structural unit (Aa): 3 mol%~70 mol% Structural unit (Ab): 20 mol%~90 mol% Structural unit (Ac2): 3 mol%~40 mol% Furthermore, it is better to be: Structural unit (Aa): 3 mol%~70 mol% Structural unit (Ab): 50 mol%~90 mol% Structural unit (Ac2): 3 mol%~40 mol.

[0049] In resin [K2], when both structural unit (Ac1) and structural unit (Ac2) are included as structural unit (Ac), the following is preferred: Structural unit (Aa): 1 mol% ~ 70 mol% Structural unit (Ab): 5 mol%~90 mol% Structural unit (Ac1): 1 mol% ~ 50 mol% Structural unit (Ac2): 1 mol% ~ 40 mol% Better to be: Structural unit (Aa): 3 mol%~50 mol% Structural unit (Ab): 10 mol%~90 mol% Structural unit (Ac1): 5 mol%~35 mol% Structural unit (Ac2): 1 mol% ~ 30 mol% Furthermore, it is better to be: Structural unit (Aa): 3 mol%~50 mol% Structural unit (Ab): 50 mol%~90 mol% Structural unit (Ac1): 5 mol%~35 mol% Structural unit (Ac2): 1 mol%~30 mol.

[0050] When the ratio of the structural units of resin [K2] is within the specified range, the resin composition exhibits excellent storage stability, chemical resistance, heat resistance, and mechanical strength of the obtained film, and is superior in these respects. Resin [K2] can be manufactured by the same method as resin [K1].

[0051] The polystyrene-converted weight-average molecular weight (Mw) of resin (A) is preferably 3,000 to 100,000, more preferably 5,000 to 50,000, further preferably 5,000 to 20,000, and particularly preferably 5,000 to 10,000. When the weight-average molecular weight (Mw) of resin (A) is within the aforementioned range, the coatability of the resin composition tends to improve.

[0052] The dispersion of resin (A) [weight average molecular weight (Mw) / number average molecular weight (Mn)] is preferably 1.1 to 6.0, more preferably 1.2 to 4.0. When the dispersion is within the above range, the obtained film tends to have excellent chemical resistance.

[0053] When resin (A) contains structural unit (Ac1), its acid value is preferably 30 mg-KOH / g or higher and 180 mg-KOH / g or lower, more preferably 40 mg-KOH / g or higher and 150 mg-KOH / g or lower, and even more preferably 50 mg-KOH / g or higher and 135 mg-KOH / g or lower. Here, the acid value is a value determined as the amount (mg) of potassium hydroxide required to neutralize 1 g of resin, and can be determined by titration using an aqueous potassium hydroxide solution. When the acid value of resin (A) is within the above range, the obtained film tends to have excellent adhesion to the substrate.

[0054] When the resin composition of the present invention comprises components other than resin (A), inorganic particles (B), and solvent (E), the content of resin (A) is preferably 30% to 99% by mass, more preferably 35% to 80% by mass, and even more preferably 40% to 70% by mass, relative to the solid content of the resin composition of the present invention. When the content of resin (A) is within the above range, the obtained film tends to have excellent heat resistance, excellent adhesion to the substrate, and excellent chemical resistance. Here, the solid content of the resin composition refers to the amount obtained by removing the content of solvent (E) from the total amount of the resin composition of the present invention.

[0055] <Inorganic Particles (B)> Examples of inorganic particles (B) used in this invention include: metal salts such as calcium carbonate and barium sulfate; metal hydroxides such as aluminum hydroxide; and metal oxides such as silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide, glass, magnesium oxide, and zinc oxide. Metal oxides are preferred. Surface treatment can be applied to the inorganic particles. In this invention, one type of inorganic particle or two or more types of inorganic particles can be used. The shape of the inorganic particles is not limited, but spherical inorganic particles are preferred from the viewpoint of easily controlling light extraction efficiency or light focusing efficiency.

[0056] The average particle size of the inorganic particles is preferably 20 nm or more and 1600 nm or less. For example, in the case of zirconium oxide, it is preferably 20 nm or more and 50 nm or less; in the case of titanium oxide, it is preferably 120 nm or more and 200 nm or less; and in the case of silicon dioxide, it is preferably 80 nm or more and 1600 nm or less. When the average particle size of the inorganic particles is large, they may sometimes settle in the composition, and it is preferable to keep them within the aforementioned range. By keeping the average particle size of the inorganic particles within the aforementioned range, the developability when forming a film using the resin composition can be further improved, and the resolution can be further improved. If the average particle size of the inorganic particles is less than 5 μm, it can be measured using dynamic light scattering; if it is 5 μm or more, it can be measured using laser diffraction. The average particle size of the inorganic particles in this specification refers to the primary particle size.

[0057] Compared to the solid content of the resin composition, the content of inorganic particles contained in the resin composition of the present invention is preferably 10% by mass or more and 90% by mass or less, more preferably 30% by mass or more and 90% by mass or less, further preferably 35% by mass or more and 85% by mass or less, further preferably 35% by mass or more and 80% by mass or less, and even more preferably 45% by mass or more and 75% by mass or less. By keeping the content of inorganic particles within the aforementioned range, it is easier to obtain the effects of increased refractive index, improved developability, and improved resolution resulting from the addition of inorganic particles.

[0058] <Polymerizing Compounds (C)> The polymerizable compound (C) is a monomer that reacts under the action of heat or a polymerization initiator (D). Examples of such monomers include compounds having vinyl unsaturated bonds, preferably (meth)acrylic acid compounds, and more preferably compounds having at least one group selected from the group consisting of acrylonitrile and methacrylonitrile.

[0059] As a (meth)acrylic acid compound having a (meth)acrylic group, compounds that are identical to the monotonyms of the structural units (Aa), (Ab), and (Ac) of the derived resin (A) can be listed.

[0060] Examples of (meth)acrylic acid compounds having two (meth)acrylic groups include: 1,3-butanediol di(meth)acrylate, 1,3-butanediol (meth)acrylate, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol diacrylate, bisphenol A bis(acryloyloxyethyl) ether, ethylene oxide modified bisphenol A di(meth)acrylate, propylene oxide modified neopentyl glycol di(meth)acrylate, ethylene oxide modified neopentyl glycol di(meth)acrylate, 3-methylpentyl glycol di(meth)acrylate, etc.

[0061] Examples of (meth)acrylic acid compounds having three or more (meth)acrylic groups include: trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tri(2-hydroxyethyl)isocyanurate tri(meth)acrylate, ethylene oxide-modified trimethylolpropane tri(meth)acrylate, propylene oxide-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol tetra(meth)acrylate, tripentaerythritol penta(meth)acrylate, tripentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tripentaerythritol octa(meth)acrylate, reaction products of pentaerythritol tri(meth)acrylate with acid anhydrides, reaction products of dipentaerythritol penta(meth)acrylate with acid anhydrides, and reaction products of tripentaerythritol hepta(meth)acrylate with acid anhydrides. The following products were mentioned: caprolactone-modified trihydroxymethylpropane tri(meth)acrylate, caprolactone-modified pentaerythritol tri(meth)acrylate, caprolactone-modified tri(2-hydroxyethyl)isocyanurate tri(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol penta(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified tripentaerythritol tetra(meth)acrylate, and caprolactone-modified... Tripentaerythritol penta(meth)acrylate, caprolactone-modified tripentaerythritol hexa(meth)acrylate, caprolactone-modified tripentaerythritol hepta(meth)acrylate, caprolactone-modified tripentaerythritol octa(meth)acrylate, reaction products of caprolactone-modified pentaerythritol tri(meth)acrylate and acid anhydride, reaction products of caprolactone-modified dipentaerythritol penta(meth)acrylate and acid anhydride, reaction products of caprolactone-modified tripentaerythritol hepta(meth)acrylate and acid anhydride, etc.

[0062] As a (meth)acrylic acid compound, it is preferred to be a (meth)acrylic acid compound having three or more (meth)acrylic acid groups, and more preferably to be dipentaerythritol hexa(meth)acrylate.

[0063] When the resin composition of the present invention contains a polymerizable compound (C), its content is preferably 20 to 200 parts by weight, and more preferably 30 to 150 parts by weight, relative to 100 parts by weight of resin (A). When the content of polymerizable compound (C) is within the stated range, the obtained film exhibits good chemical resistance and mechanical strength.

[0064] <Polymerization Initiator (D)> The polymerization initiator (D) is not particularly limited to any compound that can generate active free radicals, acids, etc., under the action of light or heat, thereby initiating the polymerization of the polymerizable compound (C). Known polymerization initiators can be used. Preferably, the polymerization initiator (D) is a polymerization initiator comprising at least one compound selected from the group consisting of O-acyloxime compounds, benzyl ketone compounds, triazine compounds, acylphosphine oxide compounds, and biimidazole compounds; more preferably, it is a polymerization initiator comprising an O-acyloxime compound. When using these polymerization initiators, there is a tendency for high sensitivity and increased transmittance in the visible light region.

[0065] O-acetylated oxime compounds are compounds having the structure represented by formula (D1). Hereinafter, * indicates a bond.

[0066]

[0067] Examples of O-acetylated oxime compounds include, for instance: N-benzoyloxy-1-(4-phenylmercaptophenyl)butan-1-one-2-imine, N-benzoyloxy-1-(4-phenylmercaptophenyl)octane-1-one-2-imine, N-benzoyloxy-1-(4-phenylmercaptophenyl)-3-cyclopentylpropan-1-one-2-imine, N-acetylated-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethane-1-imine, N-acetylated- 1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxacyclopentylmethyloxy)benzoyl}-9H-carbazole-3-yl]ethane-1-imine, N-acetyoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-3-cyclopentylpropane-1-imine, N-benzoyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-3-cyclopentylpropane-1-one-2-imine. Commercially available products such as Irgacure (registered trademark) OXE01, OXE02 (manufactured by BASF), and N-1919 (manufactured by ADEKA) may also be used.

[0068] Benzyl ketone compounds are compounds having the structure represented by formula (D2-1) or formula (D2-2). In these structures, the benzene ring may have substituents.

[0069]

[0070] Examples of compounds having the structure represented by formula (D2-1) include 2-methyl-2-morpholino-1-(4-methylmercaptophenyl)propane-1-one, 2-dimethylamino-1-(4-morpholinophenyl)-2-benzylbutane-1-one, and 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholino)phenyl]butane-1-one. Commercially available products such as Irgacure (registered trademark) 369, 907, and 379 (all manufactured by BASF) can also be used. Additionally, polymerization initiators having groups capable of inducing chain transfer, as described in Japanese Patent Publication No. 2002-544205, can also be used. Examples of compounds having the structure represented by formula (D2-2) include: 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propane-1-one, 1-hydroxycyclohexylphenyl ketone, oligomers of 2-hydroxy-2-methyl-1-(4-isopropenylphenyl)propane-1-one, α,α-diethoxyacetophenone, and benzyl dimethyl ketal. In terms of sensitivity, compounds having the structure represented by formula (D2-1) are preferred as benzyl ketone compounds.

[0071] Examples of triazine compounds include, for instance: 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6- [2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine.

[0072] Examples of phosphine oxide compounds include 2,4,6-trimethylbenzyldiphenylphosphine oxide. Commercially available products such as Irgacure 819 (manufactured by BASF, Inc., Japan) can also be used.

[0073] Examples of biimidazole compounds include, for example, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (e.g., see Japanese Patent Application Publication No. 6-75372, Japanese Patent Application Publication No. 6-75373, etc.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkyl) Biimidazole compounds with 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(dialkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole (e.g., see Japanese Patent Publication No. 48-38403, Japanese Patent Publication No. 62-174204, etc.), and biimidazole compounds with 4,4',5,5'-phenyl groups substituted with alkoxycarbonyl groups (e.g., see Japanese Patent Publication No. 7-10913, etc.).

[0074] Furthermore, examples of polymerization initiators (D) include: benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as methyl benzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, and 2,4,6-trimethylbenzophenone; quinone compounds such as 9,10-phenanthroquinone, 2-ethylanthraquinone, and camphorquinone; and compounds such as 10-butyl-2-chloroacridone, benzoin, methyl phenylglyoxylate, and titanium dioxide compounds. These can be used in combination with polymerization initiators (H) (especially amine compounds) described later.

[0075] Acid-generating agents can also be used as polymerization initiators (D). Examples of acid-generating agents include: 4-hydroxyphenyl dimethyl strontium p-toluenesulfonate, 4-hydroxyphenyl dimethyl strontium hexafluoroantimonate, 4-acetoxyphenyl dimethyl strontium p-toluenesulfonate, 4-acetoxyphenyl-methyl-benzyl strontium hexafluoroantimonate, triphenyl strontium p-toluenesulfonate, triphenyl strontium hexafluoroantimonate, diphenyl strontium p-toluenesulfonate, diphenyl strontium hexafluoroantimonate, etc., or nitrobenzyl toluenesulfonate, benzoin toluenesulfonate, etc.

[0076] When the resin composition of the present invention includes a polymerizable compound (C) and a polymerization initiator (D), the content of the polymerization initiator (D) is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 15 parts by mass, and even more preferably 1 to 8 parts by mass, relative to 100 parts by mass of the total content of resin (A) and polymerizable compound (C). When the content of the polymerization initiator (D) is within the above range, there is a tendency for the obtained pattern to have high visible light transmittance.

[0077] <Polymerization Initiator (H)> A polymerization initiator (H) is a compound or sensitizer used together with a polymerization initiator (D) to promote the polymerization of a polymerizable compound (C) that has begun to polymerize by means of the polymerization initiator (D).

[0078] Examples of polymerization initiators (H) include: thiazoline compounds, amine compounds, alkoxyanthracene compounds, thioxanthone compounds, carboxylic acid compounds, etc.

[0079] Examples of thiazoline compounds include compounds represented by formulas (H1-1) to (H1-3) and compounds described in Japanese Patent Application Publication No. 2008-65319.

[0080]

[0081] Examples of amine compounds include: triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, ethyl 2-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N,N-dimethyl-p-toluidine, 4,4'-bis(dimethylamino)benzophenone (commonly known as Michler's ketone), 4,4'-bis(diethylamino)benzophenone, and 4,4'-bis(ethylmethylamino)benzophenone, among which 4,4'-bis(diethylamino)benzophenone is preferred. Commercially available products such as EAB-F (manufactured by Hodogaya Chemical Industry Co., Ltd.) can also be used.

[0082] Examples of alkoxyanthracene compounds include: 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, 2-ethyl-9,10-dibutoxyanthracene, etc.

[0083] Examples of thioxanthone compounds include: 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, and 1-chloro-4-propoxythioxanthone.

[0084] Examples of carboxylic acid compounds include: phenyl mercaptoacetic acid, methyl phenyl mercaptoacetic acid, ethyl phenyl mercaptoacetic acid, methyl ethyl phenyl mercaptoacetic acid, dimethyl phenyl mercaptoacetic acid, methoxyphenyl mercaptoacetic acid, dimethoxyphenyl mercaptoacetic acid, chlorophenyl mercaptoacetic acid, dichlorophenyl mercaptoacetic acid, N-phenylglycine, phenoxyacetic acid, naphthioacetic acid, N-naphthylglycine, naphthoxyacetic acid, etc.

[0085] When the resin composition of the present invention comprises a polymerizable compound (C), a polymerization initiator (D), and a polymerization initiation aid (H), the content of the polymerization initiation aid (H) is preferably 0.1 to 30 parts by mass, and more preferably 0.2 to 10 parts by mass, relative to 100 parts by mass of the total content of the resin (A) and the polymerizable compound (C). When the amount of polymerization initiation aid (H) is within the above range, there is a tendency for the sensitivity to be further increased when forming a pattern.

[0086] <Leveling agent (L)> Examples of leveling agents (L) include silicone-based surfactants, fluorinated surfactants, and silicone-based surfactants containing fluorine atoms. These may also have polymerizable groups on their side chains.

[0087] As silicone-based surfactants, examples include surfactants with intramolecular siloxane bonds. Specifically, examples include: Toray silicone DC3PA, Toray silicone SH7PA, Toray silicone DC11PA, Toray silicone SH21PA, Toray silicone SH28PA, Toray silicone SH29PA, Toray silicone SH30PA, and Toray silicone SH8400 (trade name: Toray Dow Corning). Products manufactured by Corning (stock), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Industry (stock), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452 and TSF4460 (manufactured by Momentive Performance Materials Japan Co., Ltd.), etc.

[0088] Examples of fluorinated surfactants include surfactants with intramolecular fluorocarbon chains. Specifically, examples include: Fluorad (registered trademark) FC430, Fluorad FC431 (manufactured by Sumitomo 3M), Megafac (registered trademark) F142D, Megafac F171, Megafac F172, Megafac F173, Megafac F177, Megafac F183, Megafac F554, Megafac R30, and Megafac... RS-718-K (manufactured by DIC), Eftop (registered trademark) EF301, Eftop EF303, Eftop EF351, Eftop EF352 (manufactured by Mitsubishi Materials Electronics & Chemicals), Surflon (registered trademark) S381, Surflon S382, Surflon SC101, Surflon SC105 (manufactured by Asahi Glass), and E5844 (manufactured by Daikin Fine Chemicals Research Institute), etc.

[0089] As silicone-based surfactants containing fluorine atoms, examples include surfactants with intramolecular siloxane bonds and fluorocarbon chains. Specifically, examples include Megafac (registered trademark) R08, Megafac BL20, Megafac F475, Megafac F477, and Megafac F443 (manufactured by DIC).

[0090] When the leveling agent (L) is present, its content relative to the total amount of the resin composition is preferably 0.001% by mass or more and 0.2% by mass or less, more preferably 0.002% by mass or more and 0.1% by mass or less, and even more preferably 0.005% by mass or more and 0.07% by mass or less.

[0091] <Antioxidant (F)> Examples of antioxidants (F) include phenolic antioxidants, sulfur-based antioxidants, phosphorus-based antioxidants, and amine-based antioxidants. Among these, phenolic antioxidants are preferred in terms of minimizing the staining of the resulting film.

[0092] Examples of phenolic antioxidants include: 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, 3,9-bis[2-{3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy}-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 2,2'-methylenebis(6-tert-butyl-4-methylphenol), 4,4'-butylenebis(6-tert-butyl-3-methylphenol), 4,4'-thiobis(2-tert-butyl-5-methylphenol), 2,2 '-Thiobis(6-tert-butyl-4-methylphenol), 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 3,3',3'',5,5'',5''-hexa-tert-butyl-a,a',a''-(trimethylbenzene-2,4,6-triyl)tri-p-cresol, pentaerythritol tetratetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,6-di-tert-butyl-4-methylphenol, and 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphazenecycloheptane. Commercially available products can also be used as the phenolic antioxidants described above. Commercially available phenolic antioxidants include, for example: Sumilizer (registered trademark) BHT, GM, GS, GP (all manufactured by Sumitomo Chemical Co., Ltd.), and Irganox (registered trademark) 1010, 1076, 1330, 3114 (all manufactured by BASF Co., Ltd.).

[0093] Examples of sulfur-based antioxidants include, for example, dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearatel 3,3'-thiodipropionate, and pentaerythritol tetra(3-lauryl thiopropionate). Commercially available sulfur-based antioxidants may also be used. Examples of commercially available sulfur-based antioxidants include, for example, Sumilizer (registered trademark) TPL-R and TP-D (both manufactured by Sumitomo Chemical Co., Ltd.).

[0094] Examples of phosphorus-based antioxidants include, for example, trioctyl phosphite, trilauryl phosphite, tridecyl phosphite, tri(nonylphenyl) phosphite, distearate pentaerythritol diphosphite, and tetra(tetrazyl)-1,1,3-tris(2-methyl-5-tert-butyl-4-hydroxyphenyl)butane diphosphite. Commercially available phosphorus-based antioxidants may also be used. Examples of commercially available phosphorus-based antioxidants include, for example, Irgafos (registered trademark) 168, 12, 38 (all manufactured by BASF), Adekastab 329K, and Adekastab PEP36 (all manufactured by ADEKA).

[0095] Examples of amine-based antioxidants include, for example, N,N'-di-di-butyl-p-phenylenediamine, N,N'-di-isopropyl-p-phenylenediamine, N,N'-dicyclohexyl-p-phenylenediamine, N,N'-diphenyl-p-phenylenediamine, and N,N'-bis(2-naphthyl)-p-phenylenediamine. Commercially available products can also be used as these amine-based antioxidants. Examples of commercially available amine-based antioxidants include, for example, Sumilizer (registered trademark) BPA, BPA-M1, and 4ML (all manufactured by Sumitomo Chemical Co., Ltd.).

[0096] When the resin composition of the present invention includes an antioxidant (F), the content of the antioxidant (F) is preferably 0.1 parts by mass or more and 5 parts by mass or less, more preferably 0.5 parts by mass or more and 3 parts by mass or less, relative to 100 parts by mass of the total content of resin (A) and polymeric compound (C). When the content of antioxidant (F) is within the above range, the obtained film tends to have excellent heat resistance and pencil hardness.

[0097] <Hardener (G)> <Polycarboxylic Acids (G1)> A polycarboxylic acid (G1) is a compound selected from at least one of the group consisting of polycarboxylic acid anhydrides and polycarboxylic acids. A polycarboxylic acid is a compound having two or more carboxyl groups, and a polycarboxylic acid anhydride is an anhydride of a polycarboxylic acid. The molecular weight of a polycarboxylic acid (G1) is preferably below 3000, and more preferably below 1000.

[0098] Examples of such polycarboxylic anhydrides include, for instance: maleic anhydride, succinic anhydride, glutaric anhydride, citraconic anhydride, itaconic anhydride, 2-dodecyl succinic anhydride, 2-(2-oct-3-enyl)succinic anhydride, 2-(2,4,6-trimethylnon-3-enyl)succinic anhydride, propanetricarboxylic anhydride, 1,2,3,4-butanetetracarboxylic anhydride, and other chain-like polycarboxylic anhydrides; 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, norbornene dicarboxylic anhydride, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride, bicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride, bicyclo[ [2.2.1] Hept-5-ene-2,3-dicarboxylic anhydride, methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, cyclopentanetetracarboxylic anhydride and other alicyclic polycarboxylic anhydrides; phthalic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, pyromellitic anhydride, trimellitic anhydride, benzophenone tetracarboxylic anhydride, 3,3'4,4'-diphenyltrimethyltetracarboxylic anhydride, ethylene glycol bis(dehydrated trimellitic acid ester), glyceryl tri(dehydrated trimellitic acid ester), glyceryl bis(dehydrated trimellitic acid ester) monoacetate, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)naphtho[1,2-c]furan-1,3-dione and other aromatic polycarboxylic anhydrides. Commercially available products such as ADEKA HARDENER (registered trademark)-EH-700 (trade name (same below), manufactured by ADEKA (stock),) RICACID (registered trademark)-HH, RICACID-TH, RICACID-MH, RICACID MH-700 (manufactured by Shin Nippon Rika (stock),) Epikinia 126, Epikinia YH-306, and Epikinia DX-126 (manufactured by Shell Epoxy (stock)) can also be used.

[0099] Examples of such polycarboxylic acids include: oxalic acid, malonic acid, adipic acid, sebacic acid, fumaric acid, tartaric acid, citric acid, and polycarboxylic acids deriving chain polycarboxylic anhydrides; alicyclic polycarboxylic acids such as cyclohexanedicarboxylic acid and polycarboxylic acids deriving alicyclic polycarboxylic anhydrides; aromatic polycarboxylic acids such as isophthalic acid, terephthalic acid, 1,4,5,8-naphthalenetetracarboxylic acid, and polycarboxylic acids deriving aromatic polycarboxylic anhydrides; etc.

[0100] In terms of the excellent heat resistance of the obtained film, especially the fact that the transparency in the visible light region is not easily reduced, chain carboxylic anhydrides and alicyclic polycarboxylic anhydrides are preferred, and alicyclic polycarboxylic anhydrides are even more preferred.

[0101] When the resin composition of the present invention contains a polycarboxylic acid (G1), its content is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, and even more preferably 2 to 15 parts by mass, relative to 100 parts by mass of the total content of resin (A) and polymeric compound (C). When the content of polycarboxylic acid (G1) is within the above range, the obtained film exhibits excellent heat resistance and adhesion.

[0102] <Imidazole compound (G2)> The imidazole compound (G2) is not particularly limited as long as it has an imidazole skeleton; for example, compounds known as epoxy curing agents can be listed. Among them, compounds represented by formula (G2-1) are preferred.

[0103]

[0104] In formula (G2-1), R 31 represents an alkyl, phenyl, benzyl, or cyanoalkyl group having 1 to 20 carbon atoms; R 32 to R 34 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms, a phenyl group, a nitro group, or an amide group having 1 to 20 carbon atoms, wherein the hydrogen atom contained in the alkyl group or the phenyl group may be substituted with a hydroxyl group.

[0105] Examples of alkyl groups having 1 to 20 carbon atoms include: methyl, ethyl, propyl, isobutyl, butyl, tributyl, hexyl, heptyl, octyl, nonyl, decyl, heptadecanyl, and undecyl. Examples of cyanoalkyl groups having 2 to 5 carbon atoms include: cyanomethyl, cyanoethyl, cyanopropyl, cyanobutyl, and cyanopentyl.

[0106] Examples of halogen atoms include, for example, fluorine, chlorine, and bromine. Examples of acetylated compounds with 1 to 20 carbon atoms include: methylacetylated, acetylated, propionic, isobutylacetylated, pentylated, isopentylacetylated, pivaloylacetylated, laurylacetylated, myristylacetylated, and stearylacetylated.

[0107] Examples of imidazole compounds (G2) include, for example: 1-methylimidazolium, 2-methylimidazolium, 2-hydroxymethylimidazolium, 2-methyl-4-hydroxymethylimidazolium, 5-hydroxymethyl-4-methylimidazolium, 2-ethylimidazolium, 2-undecylimidazolium, 2-heptadecanylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 4-hydroxymethyl-2-phenylimidazolium, 2-phenylimidazolium, 2-phenyl-2-hydroxymethylimidazolium, 1-benzyl-4- Methylimidazole, 1-benzyl-4-phenylimidazole, 1-benzyl-5-hydroxymethylimidazole, 2-(p-hydroxyphenyl)imidazole, 1-cyanomethyl-2-methylimidazole, 1-(2-cyanoethyl)-2-hydroxymethylimidazole, 2,4-diphenylimidazole, 1-cyanomethyl-2-undecylimidazole, 1-cyanomethyl-2-ethyl-4-methylimidazole, 1-cyanomethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole. Preferably, 1-benzyl-4-phenylimidazole, 2-ethyl-4-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole are preferred.

[0108] When the resin composition of the present invention contains an imidazole compound (G2), the content of the imidazole compound (G2) relative to 100 parts by mass is preferably 0.1 parts by mass or more and 25 parts by mass or less, more preferably 0.2 parts by mass or more and 15 parts by mass or less, and even more preferably 0.5 parts by mass or more and 5 parts by mass or less. When the content of the imidazole compound (G2) is within the above range, the obtained film tends to have excellent transparency in the visible light region.

[0109] Solvent (E) The resin composition of the present invention contains a solvent (E). The solvent (E) is not particularly limited, and examples of solvents commonly used in the art can be listed. Examples include: ester solvents (solvents containing -COO- but not -O- in the molecule), ether solvents (solvents containing -O- but not -COO- in the molecule), ether ester solvents (solvents containing both -COO- and -O- in the molecule), ketone solvents (solvents containing -CO- but not -COO- in the molecule), alcohol solvents (solvents containing OH in the molecule but not -O-, -CO-, and -COO-), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide, etc.

[0110] Examples of ester solvents include: methyl lactate, ethyl lactate, butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate, and γ-butyrolactone, etc.

[0111] Examples of ether solvents include: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenethyl ether, and methyl anisole, etc.

[0112] Examples of ether ester solvents include: methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, ethyl 2-methoxy-2-methylpropionate, ethyl 2-methoxy-2-methylpropionate, 3-methoxy-butylacetate, 3-methyl-3-methoxy-butylacetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, and diethylene glycol monobutyl ether acetate, etc.

[0113] Examples of ketone solvents include: 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, and isophorone.

[0114] Examples of alcohol solvents include: methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerol.

[0115] Examples of solvents that can be used to process aromatic hydrocarbons include benzene, toluene, xylene, and mesitylene. Examples of solvents that can be used to process amides include N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0116] Of the solvents, those with good coatability and drying properties are preferably organic solvents with a boiling point of 100°C or higher and 200°C or lower at 1 atm. Preferred solvents are propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, ethylene glycol ethyl methyl ether, cyclohexanone, methoxybutanol, and methoxybutyl acetate; more preferably, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethylene glycol ethyl methyl ether, methoxybutanol, and methoxybutyl acetate.

[0117] Relative to the total amount of the resin composition, the solvent (E) content in the resin composition of the present invention is preferably 60% to 95% by mass, more preferably 70% to 95% by mass. In other words, the solid content of the resin composition of the present invention is preferably 5% to 40% by mass, more preferably 5% to 30% by mass. When the solvent (E) content is within the said range, there is a tendency to improve the mechanical strength of the film obtained by coating the resin composition.

[0118] <Other Ingredients> The resin composition of the present invention may also contain fillers, other polymer compounds, ultraviolet absorbers, chain transfer agents, adhesion promoters and other additives known in the art, as needed.

[0119] <Method for manufacturing resin composition> The resin composition of the present invention can be manufactured by mixing resin (A), inorganic particles (B) and solvent (E) and polymerizable compound (C), polymerization initiator (D), polymerization initiation aid (H), leveling agent (L), antioxidant (F), curing agent (G) and other components as needed using known methods.

[0120] <Membrane Manufacturing Methods> The membrane can be manufactured by coating the resin composition of the present invention onto a substrate, drying it, and then heating it. More specifically, the method for manufacturing the membrane of the present invention includes the following steps (1) to (5). Step (1): The step of coating the resin composition of the present invention onto the substrate; Step (2): Drying the coated resin composition under reduced pressure and / or heating to form a composition layer; Step (3): The step of exposing the constituent layer via a photomask; Step (4): The step of developing the exposed constituent layer; Step (5): Heating the developed composition layer.

[0121] Step (1) is the step of coating the resin composition of the present invention onto a substrate (substrate). Examples of substrates include glass, metal, and plastic, and color filters, insulating films, conductive films, and / or driving circuits can be formed on the substrate. Coating onto the substrate is preferably performed using a coating apparatus such as a spin coater, slot coater, slot coating machine, inkjet printer, roller coater, or dip coater.

[0122] Step (2) involves subjecting the coated resin composition to vacuum drying and / or heat drying to form a composition layer. This step removes volatile components such as solvents from the resin composition. Vacuum drying is preferably performed at a pressure of 50 Pa to 150 Pa and a temperature range of 20°C to 25°C. Heat drying (pre-baking) can be performed before or after vacuum drying. Heat drying is typically performed using heating devices such as ovens or heating plates. The preferred temperature for heat drying is 30°C to 120°C, more preferably 50°C to 110°C. The preferred heating time is 10 seconds to 60 minutes, more preferably 30 seconds to 30 minutes.

[0123] Step (3) is a step of exposing the constituent layer formed in step (2) to a photomask. The photomask is formed with a light-shielding portion corresponding to the portion of the constituent layer to be removed. The shape of the light-shielding portion is not particularly limited and can be selected according to the intended use. As the light source used for exposure, a light source that generates light with wavelengths from 250 nm to 450 nm is preferred. For example, a filter that cuts off the wavelength range can be used to cut off light less than 350 nm, or a bandpass filter that selectively extracts light near 436 nm, 408 nm, and 365 nm can be used. Examples of light sources include mercury lamps, light-emitting diodes, metal halide lamps, and halogen lamps. In order to uniformly illuminate the entire exposed surface with parallel light or to ensure proper alignment of the photomask and the constituent layer, an exposure device such as a mask aligner or a stepper is preferred.

[0124] Step (4) is a step of developing the exposed composition layer. Development is performed by bringing the exposed composition layer into contact with a developing solution. The unexposed portions of the composition layer dissolve in the developing solution and are removed, forming a patterned composition layer on the substrate. The developing solution is preferably an aqueous solution of an alkaline compound such as potassium hydroxide, sodium bicarbonate, sodium carbonate, or tetramethylammonium hydroxide. The concentration of these alkaline compounds in the aqueous solution is preferably 0.01% to 10% by mass, more preferably 0.03% to 5% by mass. Furthermore, the developing solution may also contain a surfactant. The developing method can be any of the following: immersion, dipping, or spraying. The substrate can also be tilted at any angle during development. It is preferable to wash with water after development.

[0125] Step (5) is a heating step (post-baking) of the developed composition layer. Heating is usually performed using heating devices such as ovens or heating plates. The preferred heating temperature is 130°C to 270°C, more preferably 150°C to 260°C, and even more preferably 200°C to 250°C. A heating temperature of 200°C to 250°C can prevent unwanted solvents from remaining in the film. The preferred heating time is 1 minute to 120 minutes, more preferably 10 minutes to 60 minutes. Through step (5), the patterned composition layer hardens, forming a patterned film on the substrate.

[0126] <Applications of Membranes> The film thus obtained has a high refractive index and excellent developability, making it useful, for example, as a color filter substrate used in liquid crystal display devices, organic electroluminescence (EL) display devices, or electronic paper. This enables the manufacture of display devices including high-quality films. The film thus obtained also has a high refractive index and excellent developability, making it useful, for example, as a microlens array. The microlens array can be used for the same purposes as previous microlens arrays. For example, it can be configured for use in display devices and solid-state imaging devices. In display devices, by configuring microlenses in a manner corresponding to each pixel, light is emitted from each pixel through the microlenses, improving the light extraction efficiency of each pixel. In solid-state imaging devices, by constructing a structure in which a photoelectric conversion element layer containing multiple photoelectric conversion elements, a color filter, and a microlens array are sequentially stacked, and then configuring microlenses in a manner corresponding to each photoelectric conversion element, light is incident on the photoelectric conversion element through the microlenses, improving the light focusing efficiency for each photoelectric conversion element.

[0127] The thickness of the membrane varies depending on its application, preferably 0.5 μm or more and 5 μm or less, and more preferably 0.5 μm or more and 3 μm or less.

[0128] The preferred refractive index of the film varies depending on its application, but the refractive index at 550 nm is, for example, 1.2 or higher and 2.0 or lower, preferably 1.5 or higher and 1.9 or lower, and more preferably 1.6 or higher and 1.8 or lower. The refractive index of the film is determined by the method described in the examples below. [Example]

[0129] The present invention will now be described in more detail through examples. Unless otherwise specified, "%" and "parts" in the examples refer to mass percentage and mass parts, respectively.

[0130] [Synthesis Example 1: Resin (a1)] A nitrogen atmosphere was created by purging an appropriate amount of nitrogen gas into a 1 L flask containing a reflux cooler, a dropping funnel, and a stirrer. 297 parts by weight of propylene glycol monomethyl ether acetate and 9 parts by weight of cyclopentanone were added, and the mixture was heated to 85°C while stirring. Then, over a period of 5 hours, 28.5 parts by weight of a mixture of 3,4-epoxytricyclo[5.2.1.0 2,6]decane-8-yl acrylate and / or 3,4-epoxytricyclo[5.2.1.0 2,6]decane-9-yl acrylate, 38.5 parts by weight of acrylic acid, 233 parts by weight of 9-vinylcarbazole, and 200 parts by weight of cyclopentanone were added dropwise. Simultaneously, over a period of 5 hours, a mixed solution prepared by dissolving 4 parts by weight of 2,2-azobis(2,4-dimethylpentanonitrile) in 190 parts by weight of propylene glycol monomethyl ether acetate was added dropwise. After the addition was complete, the mixture was kept at 85°C for 3 hours and then cooled to room temperature to obtain a type B copolymer with a viscosity (23°C) of 100 mPas and a solid content of 33.7% by weight. The weight average molecular weight (Mw) of the resulting copolymer was 15,000, and the dispersion was 2.76.

[0131]

[0132] [Synthesis Example 2: Resin (a2)] In a flask containing a stirring blade, reflux condenser, thermometer, and dropping funnel, 100 parts by weight of propylene glycol monomethyl ether acetate were added and heated to 90°C. Using the dropping funnel, a solution consisting of 52.6 parts by weight of vinylcarbazole, 6.6 parts by weight of 2-(acetylethoxy)ethyl methacrylate, 23.1 parts by weight of methacrylic acid, 5.0 parts by weight of azobis(isobutyronitrile), and 150 parts by weight of propylene glycol monomethyl ether acetate was continuously added dropwise to the flask. The temperature inside the flask was maintained at 90±1°C during the dropwise addition process, which lasted for 3 hours. After the addition was completed, the temperature inside the flask was set to 90±1℃, and the reaction was carried out for 6 hours. After the reaction, the reaction solution was cooled to below 40°C, and 0.12 parts by weight of polymerization inhibitor, 12.4 parts by weight of 4-hydroxybutylacrylate glycidyl ether, 4.5 parts by weight of triphenylphosphine, and 50 parts by weight of propylene glycol monomethyl ether acetate were added. The temperature inside the flask was raised to 110°C, and an addition reaction was carried out at a temperature of 110±1°C inside the flask to obtain an adhesive resin solution.

[0133]

[0134] The weight-average molecular weight (Mw) and number-average molecular weight (Mn) of the obtained resin were determined using gel permeation chromatography (GPC) under the following conditions. Device: HLC-8120GPC (manufactured by Tosoh Corporation) Column: TSK-GELG2000HXL Column temperature: 40℃ Solvent: tetrahydrofuran (THF) Flow rate: 1.0 mL / min Solid content concentration of the tested liquid: 0.001% by mass to 0.01% by mass Injection volume: 50 μL Detector: Refractive index (RI) Calibration standard materials: TSK Standard Polystyrene F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation) The ratio of the weight-average molecular weight to the number-average molecular weight (Mw / Mn) of the obtained polystyrene is defined as the dispersity.

[0135] [Dispersion Example 1: Inorganic Particle Dispersion (b1)] 14 parts of a dispersant (50% solids, acid value of 100 mg KOH / g converted from solids, weight average molecular weight 3,000), 35 parts of zirconia particles, 51 parts of propylene glycol monomethyl ether acetate as solvent, and 150 parts of zirconia beads with an average particle size of 50 μm as the dispersion medium were placed in a 300 mL bottle and dispersed at 60 Hz for 10 hours using a disperser (Seiwa Giken RS-05W rocking shaker). The zirconia beads were then removed by filtration to obtain an inorganic particle dispersion (b1) containing zirconia particles as inorganic particles. The obtained inorganic particle dispersion (b1) contained 42% non-volatile components by mass, and the average particle size of the zirconia particles was 30 nm.

[0136] [Dispersion Example 2: Inorganic Particle Dispersion (b3)] 15.0 parts of mixed titanium dioxide particles (average particle size 300 nm), 2.0 parts of acidic resin-type pigment dispersant, and 83 parts of propylene glycol monomethyl ether acetate were added, along with 300 parts of zirconia beads with an average particle size of 0.4 mm. The mixture was shaken for 1 hour using a paint conditioner (manufactured by LAU Corporation). The zirconia beads were then removed by filtration to obtain an inorganic particle dispersion (b3) containing titanium dioxide particles as inorganic particles.

[0137] [Examples 1-7, Comparative Example 1] <Preparation of Resin Composition> The resin composition was obtained by mixing the resin (A), polymerizable compound (C), polymerization initiator (D), inorganic particles (B), balancing agent (L), and solvent (E) shown in Table 1 in the proportions shown in Table 1. In Table 1, the parts of each component represent the mass parts converted from solid components.

[0138] [Table 1] Example Comparative example 1 2 3 4 5 6 7 8 1 Resin (A) (parts) (a1) 30 30 30 30 30 30 30 30 (a2) 30 Polymerizable compound (C) (parts) (cl) 20 20 20 20 20 20 20 20 20 Polymerization initiator (D) (parts) (d1) 4 2.5 5 4 4 4 4 4 4 Inorganic particles (B) and dispersant (parts) (b1) 200 50 50 400 400 400 (b2) 400 (b3) 400 Leveling agent (L) (parts) (l1) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Solvent (E) (parts) (el) 1600 (e2) 18 18 18 18 18 18 18 18 (e3) 50 12.5 12.5 100 100 (e4) 313 123 127 563 3212 1712 3312 3329 63

[0139] The components in Table 1 are as follows. Resin (A): (a1): The resin obtained by synthesis example 1 (converted to solid content) Polymer compound (C): (c1): Dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA; manufactured by Nippon Kayaku Co., Ltd.) Polymerization initiator (D): (d1): N-Benzyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine (manufactured by Irgacure (registered trademark) OXE01; BASF (s.)) Inorganic particles (B): (b1): The inorganic particle dispersion obtained by Dispersion Example 1 (converted to solid components (total amount of inorganic particles and dispersant)). (b2): KE-E-150 (SEAHOSTER (registered trademark); manufactured by Nippon Shokubai Co., Ltd.) (20% ethylene glycol liquid, converted to solids, average particle size 1500 nm) (b3): ​​Inorganic particle dispersion obtained by dispersion example 2 (converted to solid components (total amount of inorganic particles and dispersant)) Leveling agent (L): (l1): Polyether-modified silicone oil: Trade name Toray silicone SH8400: Manufactured by Toray Dow Corning (Toray Dow Corning) Co., Ltd. Solvent (E): (e1): Ethylene glycol (e2): Cyclopentanone (e3): Propylene glycol monomethyl ether (e4): Propylene glycol monomethyl ether acetate

[0140] <Pattern (Membrane) Creation> HMDS (manufactured by Tokyo Chemical Industry Co., Ltd.; hexamethyldisilazane) was vapor-deposited onto the surface of a 4-inch silicon substrate. A resin composition was then spin-coated onto the substrate, followed by pre-baking at 100°C for 1 minute using a hot plate to obtain the resin composition layer. After cooling, the substrate with the resin composition layer was irradiated using an exposure machine (NSR-2205i11D; manufactured by Nikon Co., Ltd.) with exposure levels varying from 600 J / m² to 4200 J / m² in increments of 200 J / m². A photomask with dot patterns of 30 μm, 10 μm, 5 μm, 4 μm, 3 μm, 2 μm, and 1.5 μm square was used as the photomask. The resin composition layer after light exposure is immersed and developed in an aqueous developer containing 0.3% tetramethylammonium hydroxide at 23°C for 30 seconds. The washed resin composition layer is then baked at 230°C for 5 minutes using a hot plate to obtain the pattern.

[0141] <Recognizability Evaluation> The patterned substrates were observed using a contact film thickness measuring device (DEKTAK 6M; manufactured by ULVAC). If no residual film was observed in the unexposed areas, it was designated as A; if insufficient development resulted in residual film, it was designated as B. The results are shown in Table 2.

[0142] [Table 2] Example Comparative example 1 2 3 4 5 6 7 8 1 radioactivity A A A A A A A A B

[0143] <Resolution Evaluation> The patterned substrates obtained were observed using a microscope (500x magnification; VF-7510; manufactured by Keyence). The smallest pattern size formed on the substrate was used as the resolution performance. The results are shown in Table 3. The resolution of Examples 1 to 8 was below 50 μm, which is considered good. The developability of Comparative Example 1 was insufficient, so the resolution could not be evaluated.

[0144] [Table 3] Example 1 2 3 4 5 6 7 8 Resolution 2 μm 10 μm 10 μm 1.5 μm 1.5 μm >30 μm 30 μm 1.5 μm

[0145] <Refractive Index Measurement> HMDS (manufactured by Tokyo Chemical Industry Co., Ltd.; hexamethyldisilazane) was vapor-deposited onto the surface of a 4-inch silicon substrate. A resin composition was then spin-coated onto the substrate, followed by pre-baking at 100°C for 1 minute using a hot plate to obtain the resin composition layer. After cooling, the resin composition layer was irradiated with an exposure dose of 500 mJ / cm² (365 nm reference) under atmospheric conditions using an exposure machine (TME-150RSK; manufactured by Topcon Co., Ltd.; light source: ultra-high pressure mercury lamp), and heated at 230°C for 5 minutes. The refractive index of the obtained film at 550 nm was measured using a spectrophotometer (M-220; manufactured by Nippon Spectrophotometer Co., Ltd.). A higher refractive index indicates better performance as a lens material. The results are shown in Table 4.

[0146] [Table 4] Example 1 2 3 4 5 Refractive index 1.75 1.69 1.68 1.77 1.78

Claims

1. A resin composition comprising a resin (A), inorganic particles (B), and a solvent (E), wherein the resin (A) has a structural unit (Aa) and a structural unit (Ab), the structural unit (Aa) being derived from an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms, the structural unit (Ab) containing a carbazole ring which may have substituents, the structural unit (Aa) having an epoxidized structure of an unsaturated alicyclic hydrocarbon, and the content of the inorganic particles (B) relative to the solid content of the resin composition being 30% by mass or more and 90% by mass or less.

2. The resin composition as claimed in claim 1, wherein, The resin (A) has: structural unit (Aa), structural unit (Ab), and structural unit (Ac1) derived from compounds belonging to the group containing unsaturated carboxylic acids and unsaturated carboxylic anhydrides.

3. A membrane formed from a resin composition as described in claim 1.

4. A display device comprising the film as described in claim 3.