Polymers, compositions, cured products, molded bodies, laminates, and electronic components

Abstract

One embodiment of the present invention relates to a polymer, composition, hardened material, laminate, or electronic component, the composition comprising a polymer containing repeating units represented by the following formula (1). [In formula (1), -N(R')-R3-N(R')- is a structure derived from an unsubstituted or substituent-substituted dimer diamine, R', R1 and R2 are respectively a hydrogen atom, a halogen atom, an unsubstituted or substituent-substituted hydrocarbon group with 1 to 20 carbon atoms, an unsubstituted or substituent-substituted heterocyclic aliphatic group with 3 to 20 carbon atoms, or an unsubstituted or substituent-substituted heterocyclic aromatic group with 3 to 20 carbon atoms, and -NR1R2 can be a nitrogen-containing heterocyclic group with 5 to 20 atoms formed by the mutual bonding of R1 and R2.]

Description

Polymers, components, cured materials, laminates and electronic components One embodiment of the present invention relates to a polymer, composition, hardened material, laminate, or electronic component. With the pursuit of miniaturization, multifunctionality, and high-speed communication in electronic devices, there has been a growing demand for thinner and more flexible flexible printed circuit boards (PCBs) in recent years. Therefore, the technology of constructing multilayer printed circuit boards by laminating resin films has attracted attention as a manufacturing method for multilayer PCBs. Compared to the use of prepregs made from materials such as glass cloth, multilayer PCBs formed by laminating resin films are known to have weaknesses in terms of mechanical strength, heat resistance, flame retardancy, and thermal conductivity. Techniques to improve these weaknesses have been reported in recent years (for example, see Patent Documents 1 to 3). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Publication No. 11-129399 [Patent Document 2] International Publication No. 2001 / 097582 [Patent Document 3] International Publication No. 2005 / 025857 To improve the mechanical strength, heat resistance, flame retardancy, and thermal conductivity, hardeners such as epoxy compounds, cyanate ester compounds, and acrylic compounds, or inorganic fillers such as silicon dioxide and alumina, have been added. However, even with these additions, the improvement effect is insufficient. Furthermore, in the manufacturing process of multilayer printed circuit boards, it is sometimes required to use polymers (including their components) to bond various electronic component materials. In such cases, it is also required that the polymer or its components be uniformly coated onto the substrate (with excellent coatability), or that the layer obtained from the polymer or its components has high adhesion to the substrate. However, the polymers described in the patent documents and other prior polymers have insufficient solubility in common solvents, or cannot be homogeneously coated onto the substrate (poor coatability), or the layer obtained from the polymer or the composition containing the polymer has insufficient adhesion to the substrate (hereinafter also referred to as "adhesion to the substrate"). One embodiment of the present invention provides a polymer with excellent heat resistance, solubility in common solvents, and excellent coatability and adhesion to substrates. It also provides a composition capable of forming a hardened material (hardened layer) with excellent heat resistance and excellent coatability and adhesion to substrates. [Means for Solving the Problem] The inventors have discovered that the aforementioned problem can be solved by the following structural example. The structure of the present invention is as follows. [1] A composition comprising a polymer containing repeating units represented by the following formula (1). [Chemistry 1] In equation (1), -N(R')-R 3 -N(R')- is the structure derived from unsubstituted or substituent-substituted dimer diamines, where R', R... 1 and R 2 Each of the following can be independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1 to 20 carbon atoms, an unsubstituted or substituted heterocyclic aliphatic group having 3 to 20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3 to 20 carbon atoms, -NR 1 R 2 It can be R 1 With R 2 The rings formed by mutual bonding constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms. [2] The composition as described in [1], wherein the polymer further contains repeating units represented by the following formula (2). [Chemistry 2] In formula (2), R' and R 1 and R 2 R is independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1 to 20 carbon atoms, an unsubstituted or substituted heterocyclic aliphatic group having 3 to 20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3 to 20 carbon atoms. 4 It can be a divalent aromatic hydrocarbon group with 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group with 5 to 20 carbon atoms, a divalent chain hydrocarbon group with 1 to 20 carbon atoms, or -(R 41 -O) m - The divalent group, divalent silicon-containing group, group composed of two or more of these groups, group in which at least a portion of these groups is substituted by at least one of oxygen, nitrogen, and sulfur atoms, or group in which a portion of these groups is substituted by a substituent, R 41 Independently a alkyl group having 2 to 4 carbon atoms, m being an integer from 1 to 70, -NR 1 R 2 It can be R 1 With R 2The inter-bonded rings constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms, -N(R')-R 4 - Can be R' and R 4 The interbonded rings constitute a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms, -N(R')-R 4 -N(R')- can be a ring formed by two R' atoms bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms. [3] The composition as described in [1] or [2] further contains a curing compound (C). [4] The composition as described in any one of [1] to [3] further contains a curing aid (D). [5] The composition as described in any one of [1] to [4] further contains a solvent. [6] The composition as described in [3], wherein the curing compound (C) is at least one selected from the group consisting of epoxy compounds, cyanate ester compounds, vinyl compounds, silicone compounds, oxazine compounds, maleimide compounds, allyl compounds, oxadiene compounds, hydroxymethyl compounds, (meth)acrylic acid compounds, oxazoline compounds and propargyl compounds. [7] A hardener formed by hardening a composition as described in any one of [1] to [6]. [8] A laminate having a substrate and a hardener layer formed using a composition as described in any one of [1] to [6]. [9] An electronic component having a laminate as described in [8].

[10] A polymer comprising repeating units represented by formula (1) and repeating units represented by formula (2). [Chemistry 3] [Chemistry 4] In equations (1) and (2), -N(R')-R 3 -N(R')- is the structure derived from unsubstituted or substituent-substituted dimer diamines, where R', R... 1 and R 2 R is independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1 to 20 carbon atoms, an unsubstituted or substituted heterocyclic aliphatic group having 3 to 20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3 to 20 carbon atoms. 4 It can be a divalent aromatic hydrocarbon group with 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group with 5 to 20 carbon atoms, a divalent chain hydrocarbon group with 1 to 20 carbon atoms, or -(R 41 -O) m - The divalent group, divalent silicon-containing group, group composed of two or more of these groups, group in which at least a portion of these groups is substituted by at least one of oxygen, nitrogen, and sulfur atoms, or group in which a portion of these groups is substituted by a substituent, R 41 Independently a alkyl group having 2 to 4 carbon atoms, m being an integer from 1 to 70, -NR 1 R 2 It can be R 1 With R 2 The inter-bonded rings constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms, -N(R')-R 4 - Can be R' and R 4 The interbonded rings constitute a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms, -N(R')-R 4 -N(R')- can be a ring formed by two R' atoms bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms.

[11] A molded body formed from the polymer as described in

[10] .

[12] A laminate having a substrate and layers formed using the polymer as described in

[10] .

[13] An electronic component having the laminate as described in

[12] .

[14] A polymer containing a repeating unit represented by formula (1) below, or containing a repeating unit represented by formula (1) below and a repeating unit represented by formula (2) below, and having at the end at at least one group selected from phenolic hydroxyl, allyl, vinyl, (meth)acrylyl, maleimino, propargyl, ethynyl, aromatic hydrocarbon, aliphatic hydrocarbon, or heterocyclic group. [Chemistry 5] [Chemistry 6] In equations (1) and (2), -N(R')-R 3 -N(R')- is the structure derived from unsubstituted or substituent-substituted dimer diamines, where R', R... 1 and R 2R is independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1 to 20 carbon atoms, an unsubstituted or substituted heterocyclic aliphatic group having 3 to 20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3 to 20 carbon atoms. 4 It can be a divalent aromatic hydrocarbon group with 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group with 5 to 20 carbon atoms, a divalent chain hydrocarbon group with 1 to 20 carbon atoms, or -(R 41 -O) m - The divalent group, divalent silicon-containing group, group composed of two or more of these groups, group in which at least a portion of these groups is substituted by at least one of oxygen, nitrogen, and sulfur atoms, or group in which a portion of these groups is substituted by a substituent, R 41 Independently a alkyl group having 2 to 4 carbon atoms, m being an integer from 1 to 70, -NR 1 R 2 It can be R 1 With R 2 The inter-bonded rings constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms, -N(R')-R 4 - Can be R' and R 4 The interbonded rings constitute a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms, -N(R')-R 4 -N(R')- can be a ring formed by two R' atoms bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms. [Effects of the invention] According to one embodiment of the present invention, a polymer with excellent heat resistance, solubility in common solvents, and excellent coatability and adhesion to substrates such as copper or gold substrates can be provided. Furthermore, according to another embodiment of the present invention, a composition capable of forming a hardened material (hardened layer) with excellent heat resistance and excellent coatability and adhesion to substrates such as copper or gold substrates can be provided. The preferred embodiments of the present invention will now be described in detail. Furthermore, the present invention is not limited to the embodiments described below, but should be understood to include various modifications implemented without altering the spirit of the invention. In this specification, the numerical ranges indicated by "~" refer to the values ​​described before and after "~" as the lower and upper limits. 1. Polymer and Composition A composition according to one embodiment of the present invention (hereinafter also referred to as "the composition") contains a polymer (hereinafter also referred to as "polymer (1)") having repeating units represented by the following formula (1). The polymer (1) contained in the composition may be one or more. The polymer (hereinafter also referred to as "polymer (2)") of one embodiment of the present invention contains repeating units represented by formula (1) and repeating units represented by formula (2). The polymer (2) may have other structural units besides the repeating units represented by formula (1) and the repeating units represented by formula (2). The polymer of one embodiment of the present invention (hereinafter also referred to as "polymer (3)") is a polymer having at least one group selected from phenolic hydroxyl, allyl, vinyl, (meth)acrylyl, maleimino, propargyl, ethynyl, aromatic hydrocarbon, aliphatic hydrocarbon, or heterocyclic group (hereinafter also referred to as "terminal group") at the end of polymer (1) or polymer (2). Polymer (3) may have repeating units represented by formula (1), repeating units represented by formula (2) below, and other structural units other than terminal groups. Furthermore, in the present invention, "terminal" refers to the end of at least one of the main chains (longest chains) of the polymer, such as -NR in formula (1) below. 1 R 2 Not referred to as the end. Hereinafter, polymers (1) to (3) will also be collectively referred to as "this polymer". The repeating unit represented by formula (1) below is bonded, for example, to other structural units or terminal structures. Examples of such terminal structures include structures derived from the raw material constituting the repeating unit represented by formula (1) below (e.g., compounds represented by formula (A) or (B) below) or structures derived from the capping agent below, preferably the terminal group. The repeating unit represented by formula (2) below is bonded, for example, to the repeating unit represented by formula (1) below or terminal structures. Examples of such terminal structures include structures derived from the raw material constituting the repeating unit represented by formula (2) below (e.g., compounds represented by formula (A) or (C) below) or structures derived from the capping agent below, preferably the terminal group. This polymer is a polymer having repeating units represented by the following formula (1). By having repeating units represented by the following formula (1), this polymer can be obtained with excellent solubility in solvents, and its coatability to substrates can be improved. This polymer can be used in two or more forms for the purpose of adjusting its solubility in the following solvents or its solubility with other components, and various physical properties of the composition. [Chemistry 7] In equation (1), -N(R')-R 3 -N(R')- is the structure derived from unsubstituted or substituent-substituted dimer diamines, where R', R... 1 and R 2 Each of the following can be independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1 to 20 carbon atoms, an unsubstituted or substituted heterocyclic aliphatic group having 3 to 20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3 to 20 carbon atoms, -NR 1 R 2 It can be R 1 With R 2 The rings formed by mutual bonding constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms. Structures that are sources of unsubstituted or substituted dimeric diamines include, for example, divalent dimeric acid diamine residues derived from dimeric acid diamines or at least a portion of such divalent dimeric acid diamine residues that are substituted with substituents. The so-called dimeric acid type diamine refers to a dimeric acid (obtained as a dimer of unsaturated fatty acids (18 carbons) in cyclic and acyclic forms (mainly composed of 36 carbons)) whose two terminal carboxylic acid groups (-COOH) are separated by a primary amino methyl group (-CH). 2-NH 2) or amino group (-NH 2) Diamines derived by substitution. The dimeric acid type diamine is a compound derived from dimeric acids, which are dimers of unsaturated fatty acids such as oleic acid (see Japanese Patent Application Publication No. 9-12712, etc.), and various known dimeric diamines can be used without particular restriction. Dimeric acids are known dicarboxylic acids obtained through intermolecular polymerization of unsaturated fatty acids. Their industrial manufacturing process is largely standardized, typically using clay catalysts or similar methods to dimerize unsaturated fatty acids with 11 to 22 carbon atoms. Industrially obtained dimer acids usually have a 36-carbon dicarboxylic acid as the main component, obtained by dimerizing 18-carbon unsaturated fatty acids such as oleic acid or linoleic acid. However, depending on the degree of refining, they may contain arbitrary amounts of monomeric acids (18 carbon atoms), trimeric acids (54 carbon atoms), and other polymeric fatty acids with 20 to 54 carbon atoms. In one embodiment of the present invention, the dimer acid is preferably one whose content has been increased to 90% by mass or more through molecular distillation. Furthermore, in one embodiment of the present invention, if double bonds remain after the dimerization reaction, hydrogenation is further performed to reduce the degree of unsaturation, and this is also included in the dimer acid. By possessing a structure derived from dimeric acid-type diamines, this polymer can be endowed with properties derived from the dimeric acid backbone. Specifically, the following properties can be imparted: Since dimeric acid-type diamines are aliphatic compounds containing multiple isomers of a large molecule with a molecular weight of approximately 500-620, the molar volume of this polymer can be increased, relatively reducing the amount of polar groups in the polymer. This characteristic of dimeric acid-type diamines is believed to help suppress the decrease in the polymer's heat resistance while improving its dielectric properties. Furthermore, when the dimeric acid-type diamine contains two freely moving hydrophobic chains with 4-9 carbon atoms and two chain-like aliphatic amine groups with a length close to 8-10 carbon atoms, the structure derived from this dimeric acid-type diamine not only imparts flexibility to the polymer but also allows the polymer to be configured with a non-target chemical structure or a non-planar chemical structure. Therefore, it is believed that the solubility of this polymer can be improved. The following are non-limiting structural formulas of dimer diamines. In the following formulas, m+n=6~17, p+q=8~19, and the wavy part refers to carbon-carbon single bonds or carbon-carbon double bonds. [Chemistry 8] [Chemistry 9] [Chemistry 10] [Chemistry 11] [Chemistry 12] [Chemistry 13] [Chemistry 14] [Chemistry 15] The preferred diamine dimer is a compound with an active hydrogen equivalent of 130-140 and an amine valence of 180-220. Commercially available products of dimer acidic diamines include, for example: versamine 551 (manufactured by BASF Japan), versamine 552 (manufactured by Cognis Japan; a hydride of versamine 551), Priamine 1075, and Priamine 1074 (all manufactured by Croda Japan). As R', R 1 and R 2 Halogen atoms in the atom can be, for example, fluorine, chlorine, bromine, and iodine. As R', R 1 and R 2 Hydrocarbon groups with 1 to 20 carbon atoms, such as monovalent chain hydrocarbon groups, monovalent alicyclic hydrocarbon groups, monovalent aromatic hydrocarbon groups, or groups formed by combining these groups. As R', R 1 and R 2 Heterocyclic aliphatic groups with 3 to 20 carbon atoms, including monovalent heterocyclic aliphatic groups. As R', R... 1 and R 2 Heterocyclic aromatic groups with 3 to 20 carbon atoms can be categorized as monovalent heterocyclic aromatic groups. These hydrocarbon groups, heterocyclic aliphatic groups, and heterocyclic aromatic groups can also be substituted by substituents. Examples of monovalent chain hydrocarbon groups include: alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, dibutyl, tributyl, and n-pentyl; alkenyl groups such as vinyl, propenyl, butenyl, and pentenyl; and alkynyl groups such as ethynyl, propynyl, butynyl, and pentynyl. Examples of monovalent alicyclic hydrocarbon groups include: monocyclic cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl; polycyclic cycloalkyl groups such as norbornyl and adamantyl; monocyclic cycloalkenyl groups such as cyclopropenyl, cyclobutenyl, cyclopentenyl, and cyclohexenyl; and polycyclic cycloalkenyl groups such as norbornyl. Examples of monovalent aromatic hydrocarbon groups include aryl groups such as phenyl, tolyl, xylyl, naphthyl, and anthracene. Examples of aryl groups that can be formed by combining these groups include: benzyl, phenethyl, phenylpropyl, naphthylmethyl, and other aryl groups. Examples of monovalent heterocyclic aliphatic groups include those derived from heterocycles such as aziridine, oxadiazine, thiirane, azetidine, oxadiazine, thietane, pyrrolidine, pyrrololine, piperidine, piperideine, pyrazolidine, imidazoline, tetrahydrofuran, dioxadiazine, tetrahydrothiophene, piperazine, tetrahydropyran, dioxane, and morpholine. Examples of monovalent heterocyclic aromatic groups include those derived from heterocycles such as thiophene, benzothiophene, pyrrole, imidazole, pyrazole, pyridine, pyrazine, pyrimidine, pyridazine, triazine, indole, isoindole, benzimidazole, purine, indazole, quinoline, isoquinoline, quinoxoline, quinazoline, clopyralid, furan, benzofuran (1-benzofuran), isobenzofuran (2-benzofuran), oxazole, isoxazole, thiazole, benzoxazole, benzoisoxazole, benzothiazole, etc. As substituents derived from the structure of the dimer diamine, and R', R 1 and R 2 There are no particular restrictions on the substituents in hydrocarbon groups with 1 to 20 carbon atoms and heterocyclic aromatic groups with 3 to 20 carbon atoms. Examples include: allyl, halogen atom, monovalent hydrocarbon group with 1 to 20 carbon atoms, monovalent haloalkyl hydrocarbon group with 1 to 20 carbon atoms, alkoxy group with 1 to 20 carbon atoms, alkoxycarbonyl group with 1 to 20 carbon atoms, alkylthio group with 1 to 20 carbon atoms, nitro group, cyano group, carboxyl group, sulfonic acid group, phosphonic acid group, phosphoric acid group, hydroxyl group, primary amino group to tertiary amino group, salt of carboxyl group, salt of sulfonic acid group, salt of phosphonic acid group, salt of phosphoric acid group, salt of hydroxyl group, and salt of primary amino group to tertiary amino group. R' is preferably a hydrogen atom. At R 1 or R 2 In the case of hydrogen atoms, the interaction caused by hydrogen bonding between the hydrogen atom and the heteroatom site other than the nitrogen atom or the triazine ring site bonded to the hydrogen atom is more likely to result in a polymer with relatively excellent adhesion to the substrate, and is therefore preferred. The number of repeating units represented by the formula (1) is not particularly limited, for example, 2 to 10,000, preferably 3 to 8,000, and even more preferably 3 to 5,000. The lower limit of the content ratio of the repeating unit represented by formula (1) in this polymer is preferably 5 mol%, more preferably 15 mol%, further preferably 25 mol%, and especially preferably 40 mol%. The upper limit of the content ratio is preferably 95 mol%, more preferably 90 mol%, further preferably 85 mol%, and especially preferably 80 mol%. The polymer containing the repeating unit represented by formula (1) within the above range exhibits excellent solubility in solvents and excellent coatability to substrates. Polymer (1) may also contain structural units other than the repeating unit represented by formula (1). Such other structural units are not particularly limited as long as they do not impair the effects of the invention, but are preferably those containing the repeating unit represented by formula (2) below. Additionally, polymer (2) contains both the repeating unit represented by formula (1) and the repeating unit represented by formula (2) below. [Chemistry 16] In formula (2), R' and R 1 and R 2 R is independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1 to 20 carbon atoms, an unsubstituted or substituted heterocyclic aliphatic group having 3 to 20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3 to 20 carbon atoms. 4 It can be a divalent aromatic hydrocarbon group with 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group with 5 to 20 carbon atoms, a divalent chain hydrocarbon group with 1 to 20 carbon atoms, or -(R 41 -O) m - The divalent group, divalent silicon-containing group, group composed of two or more of these groups, group in which at least a portion of these groups is substituted by at least one of oxygen, nitrogen, and sulfur atoms, or group in which a portion of these groups is substituted by a substituent, R 41 Independently a alkyl group having 2 to 4 carbon atoms, m being an integer from 1 to 70, -NR 1 R 2 It can be R 1 With R 2 The inter-bonded rings constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms, -N(R')-R 4 - Can be R' and R 4The interbonded rings constitute a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms, -N(R')-R 4 -N(R')- can be a ring formed by two R' atoms bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms. As R' and R in equation (2) 1 and R 2 Specific examples are related to R' and R in equation (1). 1 and R 2 The specific examples are the same. At R 4 In the case of a divalent aromatic hydrocarbon group having 6 to 30 carbon atoms, a group formed by combining the aromatic hydrocarbon group with one or more other groups, a group in which at least a portion of the groups are substituted by at least one group selected from oxygen, nitrogen and sulfur atoms, or a group in which a portion of the groups are substituted by a substituent, -NR'-R in formula (2) 4 The structure of the -NR'- part, for example, can be derived from the structures of the compounds shown below. [Chemistry 17] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 18] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 19] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 20] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 21] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 22] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 23] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] At R 4In the case of a divalent alicyclic hydrocarbon group having 5 to 20 carbon atoms, a group formed by combining the alicyclic hydrocarbon group with one or more other groups, a group in which at least a portion of the groups are substituted by at least one group selected from oxygen, nitrogen and sulfur atoms, or a group in which a portion of the groups are substituted by a substituent, -NR'-R in formula (2) 4 The structure of the -NR'- part can be exemplified by the following structures. Furthermore, the dashed lines in the following structures refer to the nitrogen atom in -NR' of formula (2) and R... 4 And the bonding of different base bonds R'. [Chemistry 24] As R 4 The divalent chain hydrocarbon group having 1 to 20 carbon atoms, for example, can be a divalent group formed by removing one hydrogen atom from the monovalent chain hydrocarbon group. At R 4 In the case of a divalent chain hydrocarbon group having 1 to 20 carbon atoms, a group formed by combining the chain hydrocarbon group with one or more other groups, a group in which at least a portion of the groups are substituted by at least one selected from oxygen, nitrogen and sulfur atoms, or a group in which a portion of the groups are substituted by a substituent, -NR'-R in formula (2) 4 The structure of the -NR'- part can be exemplified by the following structures. Furthermore, the dashed lines in the following structures refer to the nitrogen atom in -NR' of formula (2) and R... 4 And the bonding of different base bonds R'. [Chemistry 25] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 26] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 27] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] [Chemistry 28] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] -(R 41 -O) m - R in the divalent base represented 41 Independently, it is an alkyl group having 2 to 4 carbon atoms, and m is an integer from 1 to 70, preferably an integer from 1 to 40. At R 4 In the case of a divalent silicon-containing compound, -NR'-R in equation (2) 4 The structure of the -NR'- part can be listed as follows: the structure of KF-8010, X-22-161A, X-22-161B, KF-8012, KF-8008, X-22-1660B-3, and X-22-9409 manufactured by Shin-Etsu Chemical Industries, Ltd. At R 4 In the case of a divalent silicon-containing compound, -NR'-R in equation (2) 4 The structure of the -NR'- part is preferably as shown below. Furthermore, the dashed lines in the following structure refer to the nitrogen atom in -NR' of formula (2) and R... 4 And the bonding of different base bonds R'. [Chemistry 29] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] Commercially available products that can be obtained as silicon-based monoliths as represented by the formula include: X-22-161A, X-22-161B, KF-8010, X-22-1660B-3 and KF-8012 (all manufactured by Shin-Etsu Chemical Industries, Ltd.). As divalent aromatic hydrocarbon groups with 6 to 30 carbon atoms, divalent alicyclic hydrocarbon groups with 5 to 20 carbon atoms, divalent chain hydrocarbon groups with 1 to 20 carbon atoms, -(R 41 -O) m - The divalent group, divalent silicon-containing group, or group composed of two or more of these groups, at least a portion of which is substituted by at least one of oxygen, nitrogen, and sulfur atoms, specifically, examples include: aromatic hydrocarbon groups, alicyclic hydrocarbon groups, chain hydrocarbon groups, oxoalkyl groups, and silicon-containing groups partially substituted by -O-, -OO-, -C(=O)-, -C(=O)-O-, -S-, -SS-, -SO-. Substituents such as 2-, =N-, -NC(=O)-, and tertiary amino groups. At R 4 The case where a part of a divalent chain hydrocarbon group having 1 to 20 carbon atoms is substituted with -O- or -(R 41 -O) mIn the case of the divalent base represented by -, it is -NR'-R in equation (2). 4 The structure of the -NR'- part can be exemplified by, for example, the structures derived from polyoxyalkylamines such as the JEFFAMINE-D series, JEFFAMINE-ED series, JEFFAMINE-EDR series, and JEFFAMINE-RT series manufactured by Huntsman Corporation. At R 4 The case where a part of a divalent chain hydrocarbon group having 1 to 20 carbon atoms is substituted with -O- or -(R 41 -O) m In the case of the divalent base represented by -, it is -NR'-R in equation (2). 4 The structure of the -NR'- part is preferably as shown below. Furthermore, the dashed lines in the following structure refer to the nitrogen atom in -NR' of formula (2) and R... 4 And the bonding of different base bonds R'. [Chemistry 30] [The "-" at the unspecified bond terminus in the formula represents a methyl group.] The group or group represented by the formula that is -O-substituted as part of a divalent chain hydrocarbon group having 1 to 20 carbon atoms, or a -(R) group. 41 -O) m- Examples of monotypic divalent bases include: Jeffamine D-230 (n=~2.5, Mw=230), Jeffamine D-400 (n=~6.1, Mw=430), Jeffamine D-2000 (n=~33, Mw=2000), Jeffamine D-4000 (n=~68, Mw=4000), Jeffamine ED-600 (y=~9.0, x+z=~3.6, Mw=600), and Jeffamine ED-9, all manufactured by Huntsman. 00 (y=~12.5, x+z=~6.0, Mw=900), Jeffmin ED-2003 (y=~39, x+z=~6.0, Mw=2000), Jeffmin EDR-148 (x=~2.0, Mw=148), Jeffmin RT-1000 (Mw=1000), etc., among which Jeffmin D-230, Jeffmin D-400, Jeffmin D-2000, and Jeffmin D-4000 represented by the above formula (D) are preferred. As the divalent aromatic hydrocarbon group with 6 to 30 carbon atoms, the divalent alicyclic hydrocarbon group with 5 to 20 carbon atoms, the divalent chain hydrocarbon group with 1 to 20 carbon atoms, -(R 41 -O) m The substituents represented by the divalent group, divalent silicon-containing group, group composed of two or more of these groups, or group in which at least a portion of these groups is substituted by a substituent, are not particularly limited, but can be listed as: allyl, halogen atom, monovalent hydrocarbon group having 1 to 20 carbon atoms, monovalent haloalkyl hydrocarbon group having 1 to 20 carbon atoms, alkoxy group having 1 to 20 carbon atoms, alkoxycarbonyl group having 1 to 20 carbon atoms, alkylthio group having 1 to 20 carbon atoms, nitro group, cyano group, carboxyl group, sulfonic acid group, phosphonic acid group, phosphate group, hydroxyl group, side oxygen group, primary amino group to tertiary amino group, salt of carboxyl group, salt of sulfonic acid group, salt of phosphonic acid group, salt of phosphate group, salt of hydroxyl group, salt of primary amino group to tertiary amino group, etc. In equation (2), -N(R')-R 4 - Can be R' and R 4 The interbonded rings constitute a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 8 atoms, located at -N(R')-R 4 -In the case of this monocyclic nitrogen-containing heterocyclic group, -NR'-R in equation (2) 4 The structure of the -NR'- part can be exemplified by the following structures. Furthermore, the dashed lines in the following structures refer to the nitrogen atom in -NR' of formula (2) and R... 4 And the bonding of different base bonds R'. [Chemistry 31] In equation (2), -N(R')-R 4 -N(R')- can be a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms formed by two R's bonded together. In this case, it is represented by -NR'-R in formula (2). 4 The structure of the -NR'- part can be exemplified by the following structures. Furthermore, the dashed lines in the following structures refer to the nitrogen atom in -NR' of formula (2) and R... 4 And the bonding of different base bonds R'. [Chemistry 32] [Chemistry 33] The number of repeating units represented by the repeating unit in the formula (2) is not particularly limited, for example, it is 2 to 10,000, more preferably 3 to 8,000, and even more preferably 3 to 5,000. The lower limit of the content of the repeating unit represented by formula (2) in this polymer is preferably 5 mol%, more preferably 15 mol%, further preferably 25 mol%, and especially preferably 40 mol%. The upper limit of the content is preferably 95 mol%, more preferably 85 mol%, further preferably 80 mol%, and especially preferably 75 mol%. When the content of the repeating unit represented by formula (2) is within the above range, the polymer can control its solubility in various solvents and its compatibility with other components such as curing compounds described later. Polymer (1) and polymer (2) may contain repeating units other than those represented by formula (1) and repeating units other than those represented by formula (2). These other structural units are not particularly limited as long as they do not impair the effects of the invention; for example, the terminal groups may be listed. Additionally, polymer (3) has the terminal groups at the ends of polymer (1) or polymer (2). Examples of terminal groups include reactive groups selected from phenolic hydroxyl, allyl, vinyl, (meth)acryl, maleimino, propargyl, and ethynyl, as well as aromatic hydrocarbon groups, aliphatic hydrocarbon groups, and heterocyclic groups. The two terminal groups of the main chain in this polymer may be the same or different. Examples of end groups derived from the capping agents include: 4-(2-aminoethyl)phenol, aminophenol, and other aminophenol compounds; allylamine, diallylamine, 4-allylphenol, and other allyl compounds; chloromethylstyrene, 4-aminostyrene, 4-vinylphenol, 4-isopropenylphenol, and other vinyl compounds; (meth)acrylic acid compounds such as (meth)acrylic chloride and (meth)acrylic anhydride; maleimide compounds such as 4-hydroxyphenylmaleimide; and propargyl groups. Prolyl compounds such as amines; ethynyl compounds such as 4-ethynylaniline; compounds containing aromatic hydrocarbon groups (e.g., monophenols such as 2-phenylphenol, aniline, 4-tert-butylaniline, etc.); compounds containing aliphatic hydrocarbon groups (e.g., aliphatic monoamines such as 2-ethylhexylamine, di(2-ethylhexyl)amine, etc.); compounds containing heterocyclic groups (e.g., cyclic amines such as 4-methylpiperidine, 1-methylpiperazine, morpholine, etc.). As the terminal group, in terms of readily obtaining thermosetting compositions that can react with epoxy resins, etc., a reactive group derived from end-capping agents selected from aminophenol compounds, allyl compounds, vinyl compounds, and (meth)acrylic acid compounds is preferred. Furthermore, as the terminal group, in terms of use in thermoplastic materials, a group derived from end-capping agents selected from monophenol compounds, aromatic monoamine compounds, aliphatic monoamine compounds, and cyclic amine compounds is preferred. <Physical Properties of the Polymer, etc.> Regarding its suitability as a polymer with excellent heat resistance, the weight-average molecular weight (Mw) of the polystyrene in the polymer is preferably 1,000 to 400,000, more preferably 3,000 to 200,000, and the molecular weight distribution (Mw / Mn) is preferably 1.5 to 12.0, more preferably 1.7 to 9.0. Specifically, this Mw can be determined by the method described in the examples below. The glass transition temperature (Tg) of this polymer, as determined by differential scanning calorimetry (DSC), is preferably -50°C to 200°C, and more preferably -50°C to 150°C. Specifically, this Tg can be determined by the method described in the following examples. The 5% temperature of mass reduction (Td5) of this polymer, determined by thermogravimetric analysis (TGA), is preferably 200°C to 600°C, more preferably 250°C to 600°C. Polymers with a Td5 within this range are considered to have excellent heat resistance. Specifically, the Td5 can be determined by the method described in the examples below. This polymer is soluble in general-purpose solvents, exhibiting excellent solubility in such solvents. Examples of such general-purpose solvents include those with a boiling point below 180°C at atmospheric pressure, such as cyclohexanone and cyclopentanone. Furthermore, if at 25°C, more than 1 g of this polymer dissolves relative to 100 g of a general-purpose solvent, then this polymer can be considered soluble in the general-purpose solvent. Dissolution can be determined by the presence or absence of precipitate. If this polymer is soluble in a general-purpose solvent, a solution in which the polymer is dissolved can be prepared, exhibiting excellent coatability and drying properties, thus being preferable. In terms of reducing transmission losses when manufacturing compositions containing this polymer, the dielectric loss tangent (tanδ) of this polymer is preferably 0.0060 or less, more preferably 0.0050 or less, and there is no particular limitation on the lower limit, but it is preferably 0.0005 or more. Specifically, the dielectric loss tangent can be measured by the method described in the following examples. <Synthetic Method of This Polymer> This polymer can be produced, for example, by the condensation reaction of previously known triazine dihalides with compounds having nucleophilic functional groups, such as diamine compounds. Specifically, as described in the examples, but one example is shown below. Polymer (1) can be synthesized, for example, by heating and polymerizing the compound represented by formula (A) and the dimer diamine represented by formula (B) in a suitable organic solvent such as cyclohexanone, N-methyl-2-pyrrolidone (NMP) or N,N-dimethylacetamide (DMAc) in the presence of an alkali metal compound such as potassium carbonate. Polymer (2) can be synthesized, for example, by heating and polymerizing the compound represented by formula (A), the compound represented by formula (B), and the compound represented by formula (C) in a suitable organic solvent such as cyclohexanone, N-methyl-2-pyrrolidone (NMP) or N,N-dimethylacetamide (DMAc) in the presence of an alkali metal compound such as potassium carbonate. In addition, the end-capping agent can also be present during the synthesis of these polymers, and polymer (3) can be synthesized by using the end-capping agent. [Chemistry 34] In formula (A), R 1 and R 2 Independently with R in equation (1) 1 and R 2 For the same meaning, X represents a halogen atom. -NR 1 R 2 It can be R 1 With R 2 The rings formed by mutual bonding constitute nitrogen-containing heterocyclic groups with 5 to 20 atoms. [Chemistry 35] In formula (B), -N(R')-R 3 -N(R')- is the structure derived from unsubstituted or substituent-substituted dimer diamines, where R' independently has the same meaning as R' in formula (1). [Chemistry 36] In formula (C), R 4 and R' are independently related to R in equation (2) 4 R' and -N(R')-R have the same meaning. 4 - Can be R' and R 4 The interbonded rings constitute a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms, -N(R')-R 4 -N(R')- can be a ring formed by two R' atoms bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group with 5 to 20 atoms. As for the heating conditions, there are no particular limitations as long as the polymerization reaction is carried out, but in terms of suppressing side reactions, the heating temperature is preferably 0°C to 150°C, more preferably 10°C to 130°C, and the heating time is preferably 0.5 hours to 100 hours, more preferably 1 hour to 24 hours. In particular, for obtaining polymers with less coloring, the heating temperature is preferably about 40°C to 110°C and the heating time is 4 hours to 24 hours. Furthermore, for obtaining polymers with less low molecular weight components and high molecular weight components, the heating temperature is more preferably 50°C to 100°C. Regarding the usage ratio of the compound represented by formula (A) to the total of the compounds represented by formulas (B) and (C), when the total of the compounds represented by formula (A), formula (B), and formula (C) is set to 100 mol%, the compound represented by formula (A) is preferably 30 mol% or more and 70 mol% or less, more preferably 35 mol% or more and 60 mol% or less, and even more preferably 35 mol% or more and 55 mol% or less; the compounds represented by formulas (B) and (C) are preferably 30 mol% or more and 70 mol% or less, more preferably 40 mol% or more and 65 mol% or less, and even more preferably 40 mol% or more and less than 65 mol%. One or more compounds represented by formula (A) may be used. In addition, one or more compounds represented by formula (B) may be used, and one or more compounds represented by formula (C) may be used. Examples of alkali metal compounds include: alkali metals such as lithium, potassium, and sodium; alkali metal hydrides such as lithium hydride, potassium hydride, and sodium hydride; alkali metal hydroxides such as lithium hydroxide, potassium hydroxide, and sodium hydroxide; alkali metal carbonates such as lithium carbonate, potassium carbonate, and sodium carbonate; alkali metal bicarbonates such as lithium bicarbonate, potassium bicarbonate, and sodium bicarbonate; alkali metal alkoxides such as sodium ethoxide; alkali metal acetates such as sodium acetate and potassium acetate; alkali metal oxides such as lithium oxide; alkali metal phosphates such as trilithium phosphate, trisodium phosphate, and tripotassium phosphate; and alkali metal fluorides such as cesium fluoride. Among these, potassium carbonate, potassium hydroxide, sodium carbonate, sodium hydroxide, sodium bicarbonate, sodium ethoxide, sodium acetate, lithium carbonate, lithium hydroxide, lithium oxide, potassium acetate, trilithium phosphate, trisodium phosphate, tripotassium phosphate, and cesium fluoride are preferred. One or more of the alkali metal compounds may be used. In addition, organic bases may also be used in the aforementioned reaction. Specifically, examples include: ammonia, trimethylamine, triethylamine, diisopropylmethylamine, diisopropylethylamine, N-methylpiperidine, 2,2,6,6-tetramethyl-N-methylpiperidine, pyridine, 4-dimethylaminopyridine, N-methylmorpholine, etc. One or more organic bases may be used. The amount of alkali metal compound used is typically 1 to 3 equivalents, more preferably 1 to 2.5 equivalents, and even more preferably 1.1 to 2.0 equivalents, relative to one -NH-R' in the compound represented by formulas (B) and (C). Other Ingredients This composition may contain other ingredients besides polymer (1) without impairing the effects of the invention. Examples of such other ingredients include: curing compound (C), curing aid (D), reactive diluent, solvent, filler, antioxidant, reinforcing agent, lubricant, flame retardant, antibacterial agent, colorant, release agent, foaming agent, and other polymers besides polymer (1) and curing compound (C) (e.g., known polymers such as polyimide, polyaromatics, ester resins, phenoxy resins, phenolic resins, (meth)acrylate resins, polystyrene resins, hydrogenated styrene-butadiene-styrene copolymers, hydrogenated styrene-isoprene-styrene copolymers, etc., rubber-like resins). These other ingredients may be used individually or in combination. <Curing Compound (C)> This composition may include a curing compound (C) (hereinafter also referred to as "compound (C)"). It is preferable to include compound (C) in order to readily form a cured product with excellent chemical resistance. Furthermore, compound (C) is a compound other than this polymer. Because this polymer has excellent compatibility with compound (C), this composition can be readily obtained without precipitation or phase separation. When this composition includes compound (C), the compound (C) included in this composition may be one or more compounds. The curing compound (C) is a compound that is cured by irradiation with heat or light (e.g., visible light, ultraviolet light, near-infrared light, far-infrared light, electron beam), and may also require the curing aid (D) described later. Examples of such compounds (C) include: epoxy compounds, cyanate ester compounds, vinyl compounds, silicone compounds, oxazine compounds, maleimide compounds, allyl compounds, oxetane compounds, hydroxymethyl compounds, (meth)acrylic acid compounds, oxazoline compounds, carbamate compounds, and propargyl compounds. Among these, from the viewpoint of compatibility with polymer (1), heat resistance, and other properties, it is particularly preferred to be at least one selected from the group consisting of epoxy compounds, cyanate ester compounds, vinyl compounds, silicone compounds, oxazine compounds, maleimide compounds, allyl compounds, oxetane compounds, hydroxymethyl compounds, (meth)acrylic acid compounds, oxazoline compounds, and propargyl compounds. Furthermore, (meth)acrylic acid compounds refer to acrylic acid compounds and / or methacrylic acid compounds. Examples of such epoxy compounds include difunctional or multifunctional epoxy compounds having two or more epoxy groups, or having a total of two or more epoxy groups and other reactive groups. Specific examples include epoxy compounds represented by formulas (c1-1) to (c1-9). Other reactive groups include, for example, alkoxysilyl, propargyl, and (meth)acrylate. Furthermore, examples of compounds represented by formulas (c1-6) include, for example, the epoxy-containing NBR particles "XER-81" manufactured by JSR Corporation. Further examples of such epoxy compounds include: polyglycidyl ethers of dicyclopentadiene-phenol complexes, phenolic varnish-type liquid epoxy compounds, cresol varnish-type epoxy compounds, epoxides of styrene-butadiene block copolymers, and 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate esters. [Chemistry 37] [In formula (c1-5), n is 0 to 5000, and m is independently 0 to 5000. In formula (c1-9), R' is an alkyl group having 2 to 10 carbon atoms.] Examples of the cyanate ester compounds include those represented by formulas (c2-1) to (c2-7). [Chemistry 38] [In equations (c2-6) and (c2-7), n independently ranges from 0 to 30] Examples of vinyl compounds include those represented by formulas (b-1-1) to (b-1-5). Further examples of vinyl compounds include styrene-butadiene-styrene copolymer (SBS), styrene-isoprene-styrene copolymer (SIS), styrene-butadiene elastomer (SBR), tert-butylstyrene, 2-vinyl-4,6-diamino-1,3,5-triazine, TA100 (manufactured by Mitsubishi Gas Chemical Co., Ltd.), and ULL-950S (manufactured by Lonza Corporation). [Chemistry 39] [In equations (b-1-2) and (b-1-4), n independently ranges from 1 to 5000. In equation (b-1-5), l, m, and n each independently range from 1 to 5000.] Examples of silicone compounds include those represented by formulas (c4-1) to (c4-16). Furthermore, R in formula (c4-1) can be any of the following: if an acrylonitrile group is selected, it can be used as an acrylic compound; if a methacrylic group is selected, it can be used as a methacrylic compound; if an oxetane group is selected, it can be used as an oxetane compound. Additionally, in formulas (c4-2) to (c4-16), R is independently selected from alkyl, alicyclic saturated hydrocarbon, aryl, and alkenyl groups, and n is an integer from 0 to 1000 (preferably an integer from 0 to 100). Examples of alkyl, alicyclic saturated hydrocarbon, aryl, and alkenyl groups include R', R', and R' from formula (1), respectively. 1 and R 2 The basis is the same as the basis illustrated in the description. [Chemistry 40] Examples of the oxazine compounds include compounds represented by formulas (c5-1) to (c5-5) and 2,2-bis(3,4-dihydro-3-methyl-2H-1,3-benzoxazine)propane. [Chemistry 41] Examples of the maleimine compounds include those represented by formulas (c6-1) to (c6-5). [Chemistry 42] [In formula (c6-2), Et is ethyl; in formula (c6-3), n is 0 to 30] Examples of allyl compounds include those represented by formulas (c7-1) to (c7-6). In particular, compounds having two or more allyl groups (especially two to six, and further two to three) are preferred. [Chemistry 43] Examples of the oxetane compounds include compounds represented by formulas (c8-1) to (c8-3) below, such as methyl methacrylate (3-ethyloxetane-3-yl). [Chemistry 44] [In equations (c8-1) and (c8-2), the number of repeating units enclosed in parentheses is independently 0 to 30.] Examples of hydroxymethyl compounds include those described in Japanese Patent Application Publication No. 2006-178059 and Japanese Patent Application Publication No. 2012-226297. Specifically, examples include: melamine-based hydroxymethyl compounds such as polyhydroxymethylated melamine, 2,4,6-tris[bis(methoxymethyl)amino]-1,3,5-triazine, hexaethoxymethyl melamine, hexapropoxymethyl melamine, and hexabutoxymethyl melamine; glycourea-based hydroxymethyl compounds such as polyhydroxymethylated glycourea, tetramethoxymethylglycourea, and tetrabutoxymethylglycourea; guanidine compounds such as 3,9-bis[2-(3,5-diamino-2,4,6-triazaphenyl)ethyl]-2,4,8,10-tetraoxospiro[5.5]undecane and 3,9-bis[2-(3,5-diamino-2,4,6-triazaphenyl)propyl]-2,4,8,10-tetraoxospiro[5.5]undecane that have been hydroxymethylated with guanidine, and compounds in which all or part of the active hydroxymethyl group has been alkylated with ethers, etc. Examples of the (meth)acrylic acid compounds include, for example: trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide (PO) modified tri(meth)acrylate, tetramethylolpropane tetra(meth)acrylate, ethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, tri(2-hydroxyethyl)isocyanurate di(meth)acrylate, tri(2-hydroxyethyl)isocyanurate tri(meth)acrylate, Tricyclodecanediethanol di(meth)acrylate, epoxy(meth)acrylate formed by the addition of (meth)acrylate to diglycidyl ether of bisphenol A, bisphenol A di(meth)acrylate, bisphenol A di(meth)acrylate, bisphenol A di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,9-bis((meth)acrylate)nonane, polyester(meth)acrylate (trifunctional or higher). Examples of the oxazoline compounds include: 2,2'-bis(2-oxazoline), 1,4-bis(4,5-dihydro-2-oxazolyl)benzene, and 1,3-bis(4,5-dihydro-2-oxazolyl)benzene. Examples of propargyl compounds include those represented by formulas (c9-1) to (c9-2). [Chemistry 45] When this composition contains compound (C), the content of compound (C) is preferably 1% by mass or more, more preferably 5% by mass or more, and even more preferably 10% by mass or more, and preferably 99% by mass or less, more preferably 95% by mass or less, and even more preferably 90% by mass or less, relative to 100% by mass of the total of compound (C) and the polymer. If the content of compound (C) is within the above range, it is preferable to further improve the toughness, heat resistance, chemical resistance, etc. of the hardened product of this composition. <Curing Aid (D)> This composition may contain a curing aid (D) as needed. Examples of curing aids (D) include: curing agents, thermal reaction initiators (e.g., thermal free radical generators, thermal acid generators, thermal alkali generators), photoreaction initiators (e.g., photo free radical generators, photoacid generators, photoalkali generators), and other polymerization initiators. One curing aid (D) may be used alone, or two or more may be used. Examples of curing aids (D) that use epoxy compounds as compounds (C) include: amine curing agents, acid or anhydride curing agents, basic active hydrogen compounds, imidazoles, polythiol curing agents, phenolic resins, urea resins, melamine resins, isocyanate curing agents, Lewis acids, and other curing agents. Examples of amine-based curing agents include: ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, iminodipropylamine, bis(hexamethylene)triamine, 1,3,6-triaminomethylhexane, and other polyamines; menthene diamine (MDA), isophorone diamine (IPDA), bis(4-amino-3-methylcyclohexyl)methane, diaminodicyclohexylmethane, diaminomethylcyclohexane, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecane, and diamines with a norbornane skeleton, such as norbornane diamine (NBDA) manufactured by Mitsui Chemicals (stock). Aliphatic polyamines containing aromatic rings, such as diamine (MXDA); aromatic polyamines such as m-phenylenediamine, diaminodiphenylmethane, diaminodiphenylamine, diaminodiethyldiphenylmethane, and their derivatives. Furthermore, other amine-based curing agents include, for example: Mannich-modified amines obtained by reacting aldehydes and / or phenols with polyamines; amine adducts (polyamine epoxy resin adducts), polyamine-ethylene oxide adducts, polyamine-propylene oxide adducts, cyanoethylated polyamines, ketimines as reaction products of aliphatic polyamines and ketones; tetramethylguanidine, triethanolamine, piperidine, pyridine, 4-dimethylaminopyridine, benzyldimethylamine, methylpyridine, 2-(dimethylaminopyridine) Secondary or tertiary amines such as methylaminomethyl)phenol, dimethylcyclohexylamine, dimethylbenzylamine, dimethylhexylamine, dimethylaminophenol, dimethylamino-p-cresol, N,N'-dimethylpiperazine, 1,4-diazabicyclo[2.2.2]octane, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo[5.4.0]-7-undecene; liquid polyamides formed by reacting dimer acids with polyamines such as diethylenetriamine and triethylenetetramine. Examples of acid-based or anhydride-based curing agents include: adipic acid, azelaic acid, decanedicarboxylic acid, and other polycarboxylic acids; phthalic anhydride, trimellitic anhydride, ethylene glycol bis(triptyl phthalate), glyceryl tri(triptyl phthalate), pyromellitic anhydride, 3,3',4,4'-benzophenone tetracarboxylic anhydride, and other aromatic anhydrides; maleic anhydride, succinic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl terephthalic anhydride, alkenyl succinic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylcyclohexene tetracarboxylic anhydride, and methyl-5-norbornene-2,3-dicarboxylic anhydride. Cyclic aliphatic anhydrides such as poly(phenylhexadecanoic acid) anhydride, trialkyltetrahydrophthalic anhydride, and poly(phenylhexadecanoic acid) anhydride; aliphatic anhydrides such as poly(adipic anhydride), poly(azelanoic acid anhydride), poly(sepiatic anhydride), dodecenylsuccinic anhydride, and poly(ethyloctadecanoic acid) anhydride; and halogenated anhydrides such as chlorendic anhydride and tetrabromophthalic anhydride. Examples of such basic active hydrogen compounds include dicyandiamine and the organic acid diacetylhydrazine. Examples of the imidazole class include: 2-methylimidazolium, 2-ethyl-4-methylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 2-phenylimidazolium, 1-benzyl-2-methylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 2-methylimidazolium isocyanurate, 2,4-diamino-6-[2-methylimidazoline-(1)]-ethyl-S-triazine, and 2,4-diamino-6-[2-ethyl-4-methylimidazoline-(1)]-ethyl-S-triazine. Examples of polythiol-based curing agents include: partial epoxy adducts of 2,2'-dimercaptoethyl ether; esters of mercaptoacetic acids such as pentaerythritol tetramercaptoacetate, dipentaerythritol hexamercaptoacetate, and trimethylolpropane trimercaptoacetate; and compounds containing mercapto groups such as polysulfide rubber with a mercapto group at the end. Examples of isocyanate-based curing agents include: toluene diisocyanate, hexamethylene diisocyanate, xylene diisocyanate, and other isocyanate compounds; and block isocyanate compounds formed by reacting isocyanate groups with blocking agents such as phenols, alcohols, and caprolactam and then masking them. Examples of Lewis acids include diaryl strontium salts and triaryl strontium salts. In addition, as a curing aid (D) when an epoxy compound is used as compound (C), in addition to onium salt compounds, sulfonium compounds, sulfonate compounds, sulfonylimine compounds, disulfonyldiazomethane compounds, disulfonylmethane compounds, oxime sulfonate compounds, hydrazine sulfonate compounds, triazine compounds, and nitrobenzyl compounds, organohalides and photoacid generating agents such as disulfonium can also be used. Furthermore, as a curing aid (D) when an epoxy compound is used as compound (C), the following photoalkali generating agents may also be used: (Z)-{[bis(dimethylamino)methylene]amino}-N-cyclohexyl(cyclohexylamino)methaneimine=tetra(3-fluorophenyl)boronic acid ester, 1,2-dicyclohexyl-4,4,5,5-tetramethylbiguanidine=n-butyltriphenylboronic acid ester, 9-anthraylmethyl=N,N-diethylaminocarbamate, (E)-1-[3-(2-hydroxyphenyl)-2-propenyl]piperidine, 1-(anthraquinone-2-yl)ethyl=imidazolium carboxylate, 2-nitrophenylmethyl-4-methylpropenyloxypiperidine-1-carboxylate, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidine=2-(3-benzoylphenyl)propionate, etc. As a curing aid (D) when a cyanate ester compound is used as compound (C), for example, organometallic salts such as zinc octanoate, zinc naphthenate, cobalt naphthenate, copper naphthenate, iron acetone, nickel octanoate, and manganese octanoate, phenols such as xylenol, cresol, resorcinol, catechol, octylphenol, and nonylphenol, alcohols such as 1-butanol and 2-ethylhexanol, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 1- Imidazole derivatives such as benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole, as well as their carboxylic acid or anhydride adducts, amines such as benzyldimethylamine and 4-methyl-N,N-dimethylbenzylamine, phosphorus compounds, and phosphorus oxide compounds, etc. Furthermore, photoacid generators or photoalkali generators described as curing aids (D) when using the aforementioned epoxy compounds may also be used. As a curing aid (D) when a vinyl compound is used as compound (C), examples include compounds (polymerizing agents) that generate cationic or free radical active species by heat or light. Examples of cationic polymerizing agents include diaryl succinate and triaryl succinate. Examples of free radical polymerizing agents include benzoin-based compounds such as benzoin acetophenone, acetophenone-based compounds such as 2,2-dimethoxy-2-phenylacetophenone, sulfide-based compounds such as 2,4-diethylthioxanthone, azo compounds such as azobisisobutyronitrile, organic peroxides such as 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane and dicumyl peroxide. Additionally, as a curing aid (D) when a vinyl compound is used as compound (C), for example, the following can also be used: acetophenone, phenylacetone, benzophenone, xanthol, benzaldehyde, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, 4-methylacetophenone, 3-pentylacetophenone, 4-methoxyacetophenone, 3-bromoacetophenone, 4-allylacetophenone, p-diacetylbenzene, 3-methylacetophenone, etc. Photoradical generators include benzoyl ketone, 4-methylbenzoyl ketone, 4-chlorobenzoyl ketone, 4,4'-dimethoxybenzoyl ketone, 4-chloro-4'-benzylbenzoyl ketone, 3-chlorooxanthone, 3,9-dichlorooxanthone, 3-chloro-8-nonyloxanthone, benzoin, benzoin methyl ether, benzoin butyl ether, bis(4-dimethylaminophenyl) ketone, benzoin methoxy ketal, and 2-chlorothionthanthone. As a curing aid (D) when silicone compounds are used as compound (C), for example, platinum black, platinum tetrachloride, chloroplatinic acid, reaction products of chloroplatinic acid and monohydric alcohols, complexes of chloroplatinic acid and alkenes, platinum group metal catalysts such as diacetyl acetate platinum; palladium group metal catalysts such as palladium group metal catalysts; zinc benzoate, zinc octoate. Additionally, as a curing aid (D) when using silicone compounds as compound (C), the following can also be used: acetophenone, phenylacetone, benzophenone, xanthanol, benzaldehyde, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, 4-methylacetophenone, 3-pentylacetophenone, 4-methoxyacetophenone, 3-bromoacetophenone, 4-allylacetophenone, p-diacetophenone, 3-methoxybenzophenone, 4-methylbenzophenone, 4-chlorobenzophenone, 4,4'-dimethoxybenzophenone, 2,2'-diethoxyacetophenone, 4-chloro-4'-benzylbenzophenone, 3-chlorooxanthanone, 3,9-dichlorooxanthanone, 3-chloro-8- Nonyloxanthone, benzoin, benzoin methyl ether, benzoin butyl ether, bis(4-dimethylaminophenyl) ketone, benzoin methoxy ketal, 2-chlorothionone, diethyl acetophenone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-{4-(methylthio)phenyl}-2-morpholino-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1-one, 1-{4-(2-hydroxyethoxy)-phenyl}-2-methyl-1-propane-1-one, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, cyclohexylphenyl ketone, and other photoreaction initiators. As a curing aid (D) when an oxazine compound is used as compound (C), for example, the following can be used: phenols and their derivatives, cyanate esters, brønsted acids such as p-toluenesulfonic acid, adipic acid, p-toluenesulfonic acid esters, aromatic amine compounds such as 4,4'-diaminodiphenyl sulfonate, bases such as melamine, boron trifluoride, Lewis acids, and other curing agents. Furthermore, photoacid generators or photobase generators described as curing aids (D) when using the epoxy compound can also be used. As a curing aid (D) when maleimide compounds are used as compound (C), for example, the following can be used: bases such as imidazole, 1-methylimidazole, 1-benzyl-2-methylimidazole, 2-methylimidazoline, N,N-diisopropylethylamine, 1,4-dimethylpiperazine, quinoline, triazole, benzotriazole, 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), phosphorus compounds such as triphenylphosphine, curing agents such as azobisisobutyronitrile, organic peroxides such as 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, and dicumyl peroxide. Furthermore, photoacid generators or photobase generators described as curing aids (D) when using the epoxy compound can also be used. As a curing aid (D) when an allyl or propargyl compound is used as compound (C), for example, the following can be used: azo initiators such as azobisisobutyronitrile and dimethyl 2,2'-azobisisobutyrate; ketone peroxides, peroxy ketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxydicarbonates, peroxide esters, peroxides such as 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane and dicumyl peroxide; acetophenone-based compounds such as 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropane-1,1'-hydroxycyclohexylphenyl ketone; benzoin-based compounds such as benzoin ether; benzophenone-based compounds such as benzophenone; phosphorus-based compounds such as acetophosphorus oxide; sulfur-based compounds such as thioxanthone; benzoin-based compounds such as benzoin and 9,10-phenanthroquinone; and peroxycarbonate-based curing agents. Furthermore, photoacid generators or photoalkali generators described as curing aids (D) when using the epoxy compound can also be used. As a hardening aid (D) when oxetane compounds or hydroxymethyl compounds are used as compound (C), a light or thermal cation generator can be used, for example. Examples of photocation generators include: onium salt compounds, halogen-containing compounds, sulfonium compounds, sulfonic acid compounds, sulfonylimine compounds, and diazomethane compounds. Specific examples of the onium salt compounds, halogen-containing compounds, sulfonium compounds, sulfonic acid compounds, sulfonylimine compounds, and diazomethane compounds include compounds described in paragraphs

[0074] to

[0079] of Japanese Patent Application Publication No. 2014-186300. If specific examples of halogen-containing compounds are to be listed, such as hydrocarbon compounds containing alkyl halides and heterocyclic compounds containing alkyl halides, examples may be listed. Preferred specific examples of halogen-containing compounds include: 1,10-dibromo-n-decane, 1,1-bis(4-chlorophenyl)-2,2,2-trichloroethane; phenyl-bis(trichloromethyl)-triazine, 4-methoxyphenyl-bis(trichloromethyl)-triazine, styryl-bis(trichloromethyl)-triazine, naphthyl-bis(trichloromethyl)-triazine, 2-[2-(5-methylfuran-2-yl)vinyl]-4,6-bis-(trichloromethyl)-1,3,5-triazine and other triazine derivatives. Examples of thermal cation generators include: benzyl(4-hydroxyphenyl)(methyl)smurfium tetra(pentafluorophenyl)borate, (4-hydroxyphenyl)(dimethyl)smurfium tetra(pentafluorophenyl)borate, 4-acetoxyphenyl(dimethyl)smurfium tetra(pentafluorophenyl)borate, (4-hydroxyphenyl)methyl(4-methylbenzyl)smurfium tetra(pentafluorophenyl)borate, and benzyl(4-hydroxyphenyl)(methyl)smurfium hexafluorophosphate. When the composition contains a curing aid (D), the proportion of the curing aid (D) is preferably within the range that allows the composition to cure well and obtain a cured product. Specifically, relative to 100 parts by mass of the polymer and compound (C), the proportion of the curing aid (D) is generally 0.1 parts by mass or more and 30 parts by mass or less, preferably 0.1 parts by mass or more and 20 parts by mass or less, and more preferably 0.1 parts by mass or more and 15 parts by mass or less. <Solvent> This composition may also contain a solvent if necessary. Examples of solvents include: amine solvents such as N,N-dimethylacetamide, N,N-dimethylmethamide, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, and 1,3-dimethyl-2-imidazolidineone; ester solvents such as γ-butyrolactone and butyl acetate; ketone solvents such as cyclopentanone, cyclohexanone, methyl ethyl ketone, and benzophenone; and solvents such as 1,2-methoxyethane, diphenyl ether, and tetrahydrofuran. Ether solvents such as 4-methyltetrahydropyran and dioxane; multifunctional solvents such as 1-methoxy-2-propanol and propylene glycol methyl ether acetate; ion solvents such as cyclobutane, dimethyl ionoxide, diethyl ionoxide, dimethyl ionoxide, diethyl ionoxide, diisopropyl ionoxide, and diphenyl ionoxide; dichloromethane, benzene, toluene, xylene, dialkoxybenzene (alkoxy group with 1-4 carbon atoms), and trialkoxybenzene (alkoxy group with 1-4 carbon atoms). These solvents can be used individually or in combination. The proportion of solvent in this composition is not particularly limited. For example, it is preferably 0 parts by mass and less than 2000 parts by mass relative to 100 parts by mass of the polymer and compound (C), and more preferably 0 parts by mass and less than 1000 parts by mass. <Filler> This composition may contain fillers as needed. Since the polymer contained in this composition has a triazine ring structure, it possesses a planar structure with strong π-electron interactions. Therefore, this polymer is considered to have high coordination ability for fillers, etc. Furthermore, a portion of the main chain has a structure derived from a dimerized diamine; the flexible, long main chain is believed to be able to follow the surface or interparticle spaces of filler particles, etc. Therefore, when this composition contains fillers, it is believed that a composition with excellent dispersibility of the filler can be easily obtained. Thus, this polymer is considered to have excellent coordination ability and dispersibility, as well as excellent dispersion stability, and is therefore considered to function as a good dispersant. As the packing material, previously known packing materials can be used, provided that a suitable packing material is selected from the previously known packing materials according to the intended use of this composition. One type of packing material can be used alone, or two or more types can be used. As fillers, examples include at least one selected from the group consisting of metals, carbon, metal carbides, metal oxides, and metal nitrides, with metal oxides and metal nitrides being preferred. Examples of metal oxides include: magnesium oxide, aluminum oxide (alumina), silicon oxide (solid silicon dioxide, hollow silicon dioxide), calcium oxide, zinc oxide, yttrium oxide, zirconium oxide, cerium oxide, ytterbium oxide, and sialon (a ceramic containing silicon, aluminum, oxygen, and nitrogen). Examples of metal nitrides include: boron nitride, aluminum nitride, and silicon nitride. There are no particular restrictions on the shape of the filler; it can be granular, whisker-like, fibrous, plate-like, or aggregates of these. Commercially available fillers include: Admafine SC2500-SQ, manufactured by Admatechs (stock), which contains silicon dioxide with silanol groups (-SiOH) at the end; Admafine SC2500-SXJ, manufactured by Admatechs, which contains aminophenyl groups; Admafine SC2500-SPJ, manufactured by Admatechs, which contains phenyl groups; and Denka, a company specializing in fillers. Among the boron nitride powders such as XGP, SGP, and MGP manufactured by (stock), boron nitride powders such as UHP-1K and UHP-2K manufactured by Showa Denko (stock), spherical alumina powders such as DAW-01, DAW-01DC, DAW-03, and DAW-05 manufactured by Denka (stock), and spherical alumina powders such as CB-P02, CB-P05, and CB-P07 manufactured by Showa Denko (stock), Admafine SC2500-SQ and Admafine SC2500-SPJ are preferred. When the composition contains filler, the proportion of the filler can be selected according to the appropriate use of the composition. It is preferably 0.1 parts by mass to 10,000 parts by mass relative to 100 parts by mass of the polymer, and more preferably 10 parts by mass to 9,000 parts by mass. <Reactive Diluent> This composition may also contain a reactive diluent if necessary. Preferably, the reactive diluent is a liquid compound that reacts with the curing compound (C), a compound that dissolves other components during the preparation of the composition, or a compound that is uniformly mixed. Such a reactive diluent can be appropriately selected from previously known reactive diluents, depending on the type of curing compound (C) in this composition. A single reactive diluent may be used, or two or more may be used. As the reactive diluent, for example, if the curing compound (C) is an epoxy compound, a monofunctional liquid epoxy compound that can readily react with epoxy groups, a liquid acid anhydride, etc., can be used. When the composition contains a reactive diluent, the proportion of the reactive diluent can be selected appropriately according to the intended use of the composition, preferably 20 to 150 parts by mass relative to 100 parts by mass of the curing compound (C), and more preferably 50 to 120 parts by mass. <Antioxidant> Examples of antioxidants include hindered phenolic compounds, phosphorus compounds, sulfur compounds, metal compounds, and hindered amine compounds. Among these, hindered phenolic compounds are preferred. An antioxidant may be used alone or in combination with two or more. As hindered phenolic compounds, compounds with a molecular weight of 500 or more are preferred. Examples of hindered phenolic compounds with a molecular weight of 500 or more include: triethylene glycol-bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-tert-butylaniline)-3,5-triazine, pentaerythritol tetra[3-(3,5-tert-butyl-4-hydroxyphenyl)propionate], 1,1,3-tris[2-methyl-4-[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propoxy]-5-tert-butylphenyl]butane, 2,2-thio-di Ethyl bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, N,N-hexamethylene bis(3,5-di-tert-butyl-4-hydroxy-hydrogenated cinnamylamine), 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tris-(3,5-di-tert-butyl-4-hydroxybenzyl)isocyanate, 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane. When the composition contains an antioxidant, the proportion of the antioxidant relative to 100 parts by mass of the polymer and compound (C) is preferably 0.01 parts by mass or more and 10 parts by mass or less. Preparation Method of This Composition There are no particular limitations on the preparation method of this composition. For example, it can be prepared by uniformly mixing the polymer (1) and other components as needed. Furthermore, the composition can be in the form of a liquid, paste, etc. In particular, the polymer has excellent compatibility with compound (C), therefore, a solvent-free composition can be prepared by dissolving it in a liquid compound (C). 2. Hardened Material In one embodiment of the present invention, the hardened material is a hardened form of the composition, obtained by hardening the composition. The shape of the hardened material is not particularly limited, as long as it is made into a suitable shape according to its intended use or purpose. The curing method for this composition is not particularly limited; thermosetting by heating or photosetting by light irradiation are commonly used. Furthermore, these methods can be combined. In the case of thermosetting, the heating temperature is preferably 50°C to 350°C, more preferably 100°C to 300°C, and even more preferably 100°C to 280°C. The heating time is preferably 0.5 hours to 36 hours, more preferably 0.5 hours to 24 hours. In the case of photosetting, the irradiated light can be, for example, visible light, ultraviolet light, near-infrared light, far-infrared light, or an electron beam. As one embodiment of the hardened material, a film can be cited as an example. This film can be obtained, for example, by melt-forming or casting the composition into a film-shaped hardened material. The application of the film is not particularly limited, but it can be preferably used as an optical film. Specifically, it can be preferably used as a liquid crystal display element substrate, light guide plate, polarizing film, phase difference film, etc. The thickness of the membrane is not particularly limited, and can be appropriately selected according to the desired application, for example, 0.5 μm to 3 mm, preferably 1 μm to 1 mm. 3. Molded Body One embodiment of the present invention is a molded body formed from the polymer (2). As an embodiment of this molded body, a film can be cited as an example. This film can be obtained, for example, by melt-molding or casting the polymer (2) to form a film-shaped molded body. The use or thickness of this film is the same as in the section on hardened materials. 4. Laminated Body One embodiment of the laminate of the present invention has a substrate and a hardened layer formed using the present composition, or a substrate and a layer formed using the polymer (2) (hereinafter also referred to as a "polymer layer"). The laminate may have two or more substrate layers, two or more hardened layers or polymer layers, or other previously known layers besides the substrate and hardened or polymer layers. In the case where the laminate has two or more substrate layers, hardened or polymer layers, and other layers, these may be the same layer (plate) or different layers (plates). From the viewpoint of adhesion or practicality, examples of substrates include: metal substrates, inorganic substrates (substrates other than metal substrates), and resin substrates. Examples of metal substrates include those containing copper, aluminum, gold, silver, nickel, palladium, etc. Examples of inorganic substrates include those containing silicon, silicon carbide, silicon nitride, alumina, glass, gallium nitride, etc. Examples of resin substrates include those containing liquid crystal polymers, polyimide, polyphenylene sulfide, polyamide (nylon), polyethylene terephthalate, polyethylene naphthalate, polyolefins, etc. The hardened layer can be formed, for example, by applying the composition onto a substrate and then thermally curing and / or photocuring the composition. The polymer layer can be formed, for example, by depositing polymer (2) onto a substrate and then melting the polymer (2). The thickness of the hardened layer or polymer layer is not particularly limited, for example, it is 1 μm to 3 mm. <Applications> This polymer, this composition, the cured material, the molded body, and the laminate are preferably used in structural materials for transport aircraft industries such as the aircraft or automotive industries, and in electrical and electronic materials for the electrical and electronic industries. Specifically, they are preferably used, for example, as: sealing materials for electrical and electronic components, interlayer insulating films, various primers for stress relief / bonding / adhesion / insulation, etc.; laminates (e.g., printed wiring boards, interlayer adhesives, solder resists, solder paste); adhesives (e.g., thermally conductive adhesives, adhesive sheets); bonding agents (e.g., insulating tapes, conductive tapes); structural adhesives and prepregs used in various structural materials; various coatings; optical components (e.g., optical films such as wavelength plates, phase refraction plates, conical lenses, spherical lenses, cylindrical lenses, and various special lenses and lens arrays); insulating films for printed wiring boards, etc. 5. Electronic Component An electronic component according to one embodiment of the present invention has the aforementioned laminate. The electronic component may have two or more laminates. In the case of having two or more laminates, these laminates may be identical or different. Examples of such electronic components include circuit boards, semiconductor packages, and display substrates. The hardened or polymeric layer in the multilayer can serve as a surface protective film, rewiring layer, or planarization film for these electronic components. Because the hardened or polymeric layer maintains its insulation even under high temperature and humidity conditions, the electronic components can protect circuit patterns from the influence of external environments such as dust, heat, and moisture. Furthermore, the insulation between circuit patterns is highly reliable, allowing for stable operation year-round. For example, metal can be filled between the patterns of the hardened or polymeric layers by plating, and if necessary, more hardened or polymeric layers can be deposited and filled with metal. This process can be repeated to form a rewiring layer, thereby manufacturing electronic components having a substrate and a rewiring layer containing metal wiring and an insulating film. [Example] Hereinafter, an embodiment of the present invention will be specifically described based on an example, but the present invention is not limited to the following example. [1] Synthesis of the polymer (Example 1) 2-phenylamino-4,6-dichloro-triazine (AnDCT) (19.0 g), dimer diamine (Priamine 1075 (manufactured by Croda Japan)) (21.1 g), 1,3-diaminomethylcyclohexane (5.6 g), and potassium carbonate (12.0 g) were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (74.7 g) and water (32.0 g) were added to the flask, and the reaction was carried out under nitrogen at 100°C for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (10) represented by the following formula (10) with a solid content of 30% by mass. Furthermore, as described above, the dimer diamine is not a single substance; therefore, the structure of the dimer diamine source shown in the following formula represents its representative structure. The formulas described in the following examples are also the same. [Chemistry 46] (Example 2) The components used in Example 1 were modified as follows, except that a solution of the target polymer (11) with a solid content of 30% by mass was obtained by the same method as in Example 1. 2-Phenylamino-4,6-dichloro-triazine (24.8 g), Priamine 1075 (11.0 g), 1,3-diaminomethylcyclohexane (11.7 g), potassium carbonate (15.6 g), cyclohexanone (88.7 g), water (22.1 g) The obtained polymer (11) 1 The H-NMR spectrum is shown in Figure 1. According to this... 1 The peaks near 1.5 ppm and 0.5 ppm in the H-NMR spectrum confirmed that the obtained polymer (11) is a polymer having the structure represented by formula (10). Furthermore, 1 H-NMR is determined as follows. For the following polymers... 1 H-NMR was also used for the determination. < 1 H-NMR determination > polymer 1 H-NMR measurements were performed using a nuclear magnetic resonance apparatus (ECX400P manufactured by NEC Corporation) with deuterated chloroform as the measurement solvent. (Example 3) The components used in Example 1 were modified as follows, except that a solution of the target polymer (12) represented by the following formula (12) with a solid content of 30% by mass was obtained by the same method as in Example 1. 2-Phenylamino-4,6-dichloro-triazine (17.4 g), Priamine 1075 (19.3 g), 4,4'-methylenebis(2-methylcyclohexylamine) (mixture of isomers) (8.6 g), potassium carbonate (11.0 g), cyclohexanone (73.9 g), water (31.7 g) [Chemistry 47] according to 1 H-NMR spectroscopy confirmed that the obtained polymer (12) is a polymer having the structure represented by the formula (12). (Example 4) The components used in Example 1 were modified as follows, except that a solution of the target polymer (13) represented by the following formula (13) with a solid content of 30% by mass was obtained by the same method as in Example 1. 2-Phenylamino-4,6-dichloro-triazine (15.0 g), Priamine 1075 (16.7 g), 2,2-bis[4-(4-aminophenoxy)phenyl]propane (12.8 g), potassium carbonate (17.3 g), cyclohexanone (117.6 g), water (60.6 g) [Chemistry 48] according to 1 H-NMR spectroscopy confirmed that the obtained polymer (13) is a polymer having the structure represented by the formula (13). (Example 5) The components used in Example 1 were modified as follows, except that a solution of the target polymer (14) represented by the following formula (14) with a solid content of 30% by mass was obtained by the same method as in Example 1. 2-Phenylamino-4,6-dichloro-triazine (8.4 g), Priamine 1075 (13.1 g), poly(propylene glycol) diamine (JEFFAMINE-D2000 [manufactured by Huntsman Corporation]) (21.0 g), potassium carbonate (5.3 g), cyclohexanone (69.5 g), water (29.8 g) [Chemistry 49] The obtained polymer (14) 1 The H-NMR spectrum is shown in Figure 2. According to this... 1 H-NMR spectroscopy confirmed that the obtained polymer (14) is a polymer having the structure represented by the formula (14). (Example 6) The components used in Example 5 were modified as follows, except that a solution of the target polymer (15) with a solid content of 30% by mass was obtained by the same method as in Example 5. 2-Phenylamino-4,6-dichloro-triazine (6.6 g), Priamine 1075 (7.5 g), poly(propylene glycol) diamine (JEFFAMINE-D2000) (27.9 g), potassium carbonate (4.2 g), cyclohexanone (68.6 g), water (29.4 g) The obtained polymer (15) 1 The H-NMR spectrum is shown in Figure 3. According to this... 1 H-NMR spectroscopy confirmed that the obtained polymer (15) is a polymer having the structure represented by the formula (14). (Example 7) The components used in Example 1 were changed as follows, except that a solution of the target polymer (16) represented by the following formula (16) with a solid content of 30% by mass was obtained by the same method as in Example 1. 2-Phenylamino-4,6-dichloro-triazine (10.2 g), Priamine 1075 (20.3 g), bi-terminated amino-modified silicone oil (X-22-161B [Shin-Etsu Chemical Industry Co., Ltd.]) (12.6 g), potassium carbonate (6.4 g), cyclohexanone (70.4 g), water (30.2 g) [Transformation 50] (Example 8) The components used in Example 7 were modified as follows, except that a solution of the target polymer (17) with a solid content of 30% by mass was obtained by the same method as in Example 7. 2-Phenylamino-4,6-dichloro-triazine (8.1 g), Priamine 1075 (14.3 g), bi-terminated amino-modified silicone oil (X-22-161B) (20.1 g), potassium carbonate (5.1 g), cyclohexanone (69.3 g), water (29.7 g) The obtained polymer (17) 1The H-NMR spectrum is shown in Figure 4. According to this... 1 The H-NMR spectrum near 0 ppm (-Si-CH) 3, 0.13 ppm, referring to the peak value of the National Research and Development Institute of Advanced Industrial Science and Technology (NIST: Spectral Database of Organic Compounds), confirms that the obtained polymer (17) is a polymer having the structure represented by the formula (16). (Example 9) The components used in Example 7 were modified as follows, except that a solution of the target polymer (18) with a solid content of 30% by mass was obtained by the same method as in Example 7. 2-Phenylamino-4,6-dichloro-triazine (10.0 g), Priamine 1075 (16.5 g), bi-terminated amino-modified silicone oil (X-22-161A [Shin-Etsu Chemical Industry Co., Ltd.]) (16.5 g), potassium carbonate (6.3 g), cyclohexanone (70.3 g), water (30.1 g) The obtained polymer (18) 1 The H-NMR spectrum is shown in Figure 5. According to this... 1 The H-NMR spectrum near 0 ppm (-Si-CH) The structure of the obtained polymer (18) was confirmed by referring to the peak value of 3,0.13 ppm (National Research and Development Institute of Advanced Industrial Science and Technology: Spectral Database of Organic Compounds). (Example 10) The components used in Example 7 were modified as follows, except that a solution of the target polymer (19) with a solid content of 30% by mass was obtained by the same method as in Example 7. 2-Phenylamino-4,6-dichloro-triazine (11.6 g), Priamine 1075 (15.4 g), bi-terminated amino-modified silicone oil (KF-8010 [Shin-Etsu Chemical Industry Co., Ltd.]) (16.5 g), potassium carbonate (7.3 g), cyclohexanone (71.1 g), water (30.4 g) The obtained polymer (19) 1 The H-NMR spectrum is shown in Figure 6. According to this... 1 The H-NMR spectrum near 0 ppm (-Si-CH) The structure of the obtained polymer (19) was confirmed by referring to the peak value of 3,0.13 ppm (National Research and Development Institute of Advanced Industrial Science and Technology: Spectral Database of Organic Compounds). (Example 11) The components used in Example 5 were modified as follows, except that a solution of the target polymer (22) represented by the following formula (22) with a solid content of 30% by mass was obtained by the same method as in Example 5. 4,6-Dichloro-N,N-diphenyl-1,3,5-triazine-2-amine (PDCT) (10.4 g), Priamine 1075 (12.3 g), poly(propylene glycol) diamine (JEFFAMINE-D2000) (19.7 g), potassium carbonate (5.0 g), cyclohexanone (69.2 g), water (29.7 g) [Chemistry 51] (Example 12) The components used in Example 5 were modified as follows, except that a solution of the target polymer (23) represented by the following formula (23) with a solid content of 30% by mass was obtained by the same method as in Example 5. 4,6-Dichloro-N,N-dimethyl-1,3,5-triazine-2-amine (MDCT) (7.1 g), Priamine 1075 (13.7 g), poly(propylene glycol) diamine (JEFFAMINE-D2000) (21.9 g), potassium carbonate (5.6 g), cyclohexanone (69.7 g), water (29.9 g) [Chemistry 52] (Example 13) The components used in Example 5 were modified as follows, except that a solution of the target polymer (24) represented by the following formula (24) with a solid content of 30% by mass was obtained by the same method as in Example 5. 4,6-Dichloro-1,3,5-triazine-2-amine (ADCT) (6.2 g), Priamine 1075 (14.0 g), poly(propylene glycol) diamine (JEFFAMINE-D2000) (22.5 g), potassium carbonate (5.7 g), cyclohexanone (69.8 g), water (29.9 g) [Chemistry 53] (Example 80) 17.8 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 19.8 g of diamine (Priamine 1075), 7.8 g of 1,3-bis(4-piperidinyl)propane, and 10.4 g of potassium carbonate were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (25) represented by the following formula (25) with a solid content of 30% by mass. [Chemistry 54] (Example 81) 2-phenylamino-4,6-dichlorotriazine (AnDCT) (20.1 g), dimer diamine (Priamine 1075) (22.4 g), piperazine (3.6 g), and potassium carbonate (11.8 g) were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the reaction was carried out under nitrogen at 100°C for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (26) represented by the following formula (26) with a solid content of 30% by mass. [Chemistry 55] (Example 82) 19.9 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 22.0 g of dimer diamine (Priamine 1075), 4.1 g of piperazine, and 11.6 g of potassium carbonate were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (27) represented by the following formula (27) with a solid content of 30% by mass. [Chemistry 56] (Example 83) 19.6 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 21.7 g of dimer diamine (Priamine 1075), 4.6 g of 4-(aminomethyl)piperidine, and 11.4 g of potassium carbonate were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the reaction was carried out at 100°C under nitrogen for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (28) represented by the following formula (28) with a solid content of 30% by mass. [Chemistry 57] (Example 84) 18.5 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 20.5 g of dimer diamine (Priamine 1075), 6.6 g of N,N'-diethyl-1,6-diaminohexane, and 10.8 g of potassium carbonate were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the reaction was carried out at 100°C under nitrogen for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (29) represented by the following formula (29) with a solid content of 30% by mass. [Chem.58] (Example 85) 19.0 g of 2-methyl-2-phenylamino-4,6-dichloro-triazine (AMDCT), 20.0 g of dimer diamine (Priamine 1075), 6.4 g of N,N'-diethyl-1,6-diaminohexane, and 10.5 g of potassium carbonate were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the reaction was carried out under nitrogen at 100°C for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (50) represented by the following formula (50) with a solid content of 30% by mass. [Chemistry 59] (Example 86) 19.0 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 21.1 g of dimer diamine (Priamine 1075), 5.9 g of N,N'-dimethyl-1,6-diaminohexane, and 11.1 g of potassium carbonate were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the reaction was carried out under nitrogen at 100°C for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (51) represented by the following formula (51) with a solid content of 30% by mass. [Transformation 60] (Example 87) 2-phenylamino-4,6-dichlorotriazine (AnDCT) (8.8 g), 2-methyl-2-phenylamino-4,6-dichlorotriazine (AMDCT) (9.3 g), dimer diamine (Priamine 1075) (19.5 g), 1,3-bis(4-piperidinyl)propane (7.7 g), and potassium carbonate (11.1 g) were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the reaction was carried out under nitrogen at 100°C for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (52) having each structural unit represented by the following formula (52) with a solid content of 30% by mass. [Chemistry 61] [In equation (52), * indicates a bond with **] (Example 88) 4,6-dichloro-N,N-diphenyl-1,3,5-triazine-2-amine (PDCT) (11.2 g), 2-methyl-2-phenylamino-4,6-dichloro-triazine (AMDCT) (9.0 g), dimer diamine (Priamine 1075) (18.9 g), N,N'-diethyl-1,6-diaminohexane (6.1 g), and potassium carbonate (10.7 g) were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction is complete, the aqueous phase is separated using a separatory funnel, and the organic phase is washed with deionized water until neutral. The solvent is then concentrated to obtain a solution of polymer (53) with a solid content of 30% by mass and each of the structural units represented by the following formula (53). [Chemistry 62] [In formula (53), * indicates a bond with **] (Example A1) 13.6 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 30.1 g of dimer diamine (Priamine 1075), 0.44 g of diallylamine, and 7.9 g of potassium carbonate were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (39) represented by the following formula (39) with a solid content of 30% by mass. [Chemistry 63] (Example A2) The components used in Example A1 were modified as follows, except that a solution of the target polymer (40) represented by the following formula (40) with a solid content of 30% by mass was obtained by the same method as in Example A1. 2-Phenylamino-4,6-dichlorotriazine (AnDCT) (13.5 g), dimer diamine (Priamine 1075) (29.9 g), methacrylic anhydride (0.69 g), potassium carbonate (7.9 g) [Chemistry 64] (Example A3) The components used in Example A1 were modified as follows, except that a solution of the target polymer (41) represented by the following formula (41) with a solid content of 30% by mass was obtained by the same method as in Example A1. 2-Phenylamino-4,6-dichlorotriazine (AnDCT) (13.6 g), dimer diamine (Priamine 1075) (30.1 g), acrylamide chloride (0.41 g), potassium carbonate (7.9 g) [Chemistry 65] (Example A4) The components used in Example A1 were modified as follows, except that a solution of the target polymer (42) represented by the following formula (42) with a solid content of 30% by mass was obtained by the same method as in Example A1. 2-Phenylamino-4,6-dichlorotriazine (AnDCT) (13.6 g), dimer diamine (Priamine 1075) (30.1 g), chloromethylstyrene (meta- and para-position mixture) (0.43 g), potassium carbonate (7.9 g) [Chemistry 66] (Example A5) The components used in Example A1 were modified as follows, except that a solution of the target polymer (43) represented by the following formula (43) with a solid content of 30% by mass was obtained by the same method as in Example A1. 2-Phenylamino-4,6-dichlorotriazine (AnDCT) (13.9 g), dimer diamine (Priamine 1075) (30.2 g), 4-(2-aminoethyl)phenol (0.16 g), potassium carbonate (8.1 g) [Chemistry 67] (Example A6) Trichlorotriazine (11.0 g), diamine dimer (Priamine 1075) (30.1 g), and potassium carbonate (7.9 g) were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added, and the mixture was reacted at 60°C under nitrogen for 2 hours. After the reaction was completed, diallylamine (9.0 g) and a 1% by mass cyclohexane solution (5.2 g) of 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxy were added, and the mixture was reacted at 100°C for 13 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (44) represented by the following formula (44) with a solid content of 30% by mass. [Chemistry 68] (Example A7) Trichlorotriazine (10.0 g), diamine dimer (Priamine 1075) (24.8 g), and potassium carbonate (11.5 g) were measured into a four-necked separable flask including a stirrer. Cyclohexanone (60.0 g) and water (25.7 g) were added, and the mixture was reacted at 60°C under nitrogen for 2 hours. After the reaction was completed, 4-(2-aminoethyl)phenol (11.7 g) and a 1% by mass solution of cyclohexane (5.2 g) of 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxy were added, and the mixture was reacted at 100°C for 13 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (45) represented by the following formula (45) with a solid content of 30% by mass. [Chemistry 69] (Example A8) 13.4 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 29.8 g of dimer diamine (Priamine 1075), 0.84 g of 4-hydroxyphenylmaleimide, and 8.5 g of potassium carbonate were weighed into a four-necked separable flask including a stirrer. Cyclohexanone (40.0 g) and water (25.7 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the aqueous phase was separated using a separatory funnel, and the organic phase was washed with deionized water until neutral. The solvent was then concentrated to obtain a solution of polymer (46) represented by the following formula (46) with a solid content of 30% by mass. [Chemistry 70] (Comparative Example 1) A flexible bismaleimide oligomer, namely the commercially available ULTIMID3000A (manufactured by ABC Nanotech., LTD.), was designated as Comparative Example 1 (polymer (30)). (Comparative Example 2) A flexible bisphenol A type epoxy resin, namely commercially available jER872 (manufactured by Mitsubishi Chemical Co., Ltd.), was designated as Comparative Example 2 (polymer (31)). (Comparative Example 3) 2,4-Dichloro-6-phenoxy-1,3,5-triazine (24.3 g), 2,2-bis(4-hydroxyphenyl)propane (23.0 g), and potassium carbonate (15.3 g) were measured into a four-necked separable flask including a stirrer. N-methyl-2-pyrrolidone (77.3 g) and water (33.1 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the mixture was solidified with methanol, filtered, and washed with methanol to obtain 31 g (78% yield) of the target polymer (32) containing repeating units represented by the following formula (32). [Chemistry 71] (Comparative Example 4) 2,4-Dichloro-6-phenoxy-1,3,5-triazine (26.1 g), bis(4-hydroxyphenyl) ether (21.8 g), and potassium carbonate (16.4 g) were measured into a four-necked separable flask including a stirrer. N-methyl-2-pyrrolidone (78.1 g) and water (33.5 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the mixture was solidified with methanol, filtered, and washed with methanol to obtain 30 g (75% yield) of the target polymer (33) containing repeating units represented by the following formula (33). [Chemistry 72] (Comparative Example 5) 2-phenylamino-4,6-dichloro-triazine (AnDCT) (24.4 g), 4,4'-diaminobenzylaniline (23.0 g), and potassium carbonate (15.4 g) were weighed into a four-necked separable flask including a stirrer. N-methyl-2-pyrrolidone (77.4 g) and water (33.2 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the mixture was solidified with methanol, filtered, and washed with methanol to obtain 30 g (75% yield) of the target polymer (34) containing repeating units represented by the following formula (34). [Chemistry 73] (Comparative Example 6) 2-phenylamino-4,6-dichloro-triazine (AnDCT) (29.9 g), bis(aminomethyl)norbornene (19.1 g), and potassium carbonate (18.9 g) were weighed into a four-necked separable flask including a stirrer. N-methyl-2-pyrrolidone (80.1 g) and water (34.3 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the mixture was solidified with methanol, filtered, and washed with methanol to obtain 29 g (73% yield) of the target polymer (35) containing repeating units represented by the following formula (35). [Chemistry 74] (Comparative Example 7) 2-Phenylamino-4,6-dichloro-triazine (26.2 g), 1,12-diaminododecane (21.7 g), and potassium carbonate (16.5 g) were measured into a four-necked separable flask including a stirrer. N-methyl-2-pyrrolidone (78.3 g) and water (33.5 g) were added to the flask, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the mixture was solidified with methanol, filtered, and washed with methanol to obtain 31 g (78% yield) of the target polymer (36) containing repeating units represented by the following formula (36). [Chemistry 75] (Comparative Example 8) 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane (15.5 g), 4,4'-dichlorodiphenyl sulfonate (14.4 g), and potassium carbonate (9.3 g) were measured into a four-necked separable flask including a stirrer. N-methylpyrrolidone (128 g) and toluene (50 g) were then added and stirred. After refluxing the toluene under nitrogen for several hours, the toluene was removed by distillation, and the reaction was carried out at 190°C for 6 hours. After the reaction was completed, N-methylpyrrolidone (398 g) was added and diluted. The salt was filtered through filter paper, and the filtrate was solidified with 10.5 kg of methanol. The solidified powder was filtered and separated. The powder was then washed again with a small amount of methanol and filtered again. The filtered material was dried for 12 hours under reduced pressure using a vacuum dryer at 120°C to obtain 23 g of the target polymer (37) containing repeating units represented by the following formula (37) (yield 89%). [Chemistry 76] (Comparative Example 9) The target polymer (38) containing repeating units represented by the following formula (38) was obtained by means of the method described in "Macromolecules", 3, 533-535 (1970). [Chemistry 77] [2] The physical properties of the polymers were evaluated using the polymers obtained as described above, and the weight-average molecular weight (Mw), glass transition temperature (Tg) or softening point, 5% mass reduction temperature (Td5), dielectric loss tangent (Df), solubility in cyclohexanone, coatability, adhesion to substrates (copper foil adhesion and gold substrate adhesion), and room temperature viscosity were evaluated according to the following methods. Furthermore, regarding the Mw, Tg, softening point, and Td5 of each polymer obtained in solution (Examples 1 to 13, Examples 80 to 88, and Examples A1 to A8), the following evaluations were performed after obtaining individual films according to the following methods. The evaluation results are shown in Table 1. Furthermore, "-" in the table indicates that the corresponding evaluation item was not measured. <Preparation of Individual Polymer Films> Solutions of various polymers were coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]), pre-dried at 70°C for 3 minutes, then pre-dried at 130°C for 3 minutes, followed by solvent evaporation at 150°C for 30 minutes, and finally solvent evaporation at 250°C under nitrogen for 3 hours to form a coating film. The formed copper foil-coated film was then immersed in a 40% ferric chloride (III) solution to remove the copper foil, rinsed with pure water, and dried at 80°C to produce individual polymer films. <Weight Average Molecular Weight (Mw)> Regarding the weight average molecular weight (Mw) of each polymer, it was determined using a GPC apparatus (Tosoh Corporation's "HLC-8320 type, 8420 type") under the following THF conditions when the obtained polymers were dissolved in tetrahydrofuran (THF) (Examples 1-13, Examples 80-88, and Examples A1-A8), and under the following N-methyl-2-pyrrolidone conditions when the obtained polymers were insoluble in THF (Comparative Examples 3-9). Furthermore, regarding Comparative Example 7, although a portion was insoluble in N-methyl-2-pyrrolidone, the soluble portion was used for Mw determination. • THF Conditioning Column: A combination of "TSKgel α-M" and "TSKgel guard column α" manufactured by Tosoh Corporation. Development Solvent: THF. Column Temperature: 40℃. Flow Rate: 1.0 mL / min. Sample Concentration: 0.75% by mass. Sample Injection Volume: 50 μL. Detector: Differential refractometer. Standard Material: Monodisperse polystyrene. • N-Methyl-2-pyrrolidone development conditions: Solvent: N-methyl-2-pyrrolidone (with 10 mM LiBr added); Column temperature: 40℃; Flow rate: 1.0 mL / min; Sample concentration: 0.75% by mass; Sample injection volume: 50 μL; Detector: Differential refractometer; Standard material: Monodisperse polystyrene. <Glass Transition Temperature (Tg)> The glass transition temperature (Tg) of each polymer is defined as the temperature corresponding to the intersection of the baseline and the tangent at the inflection point of the DSC heating curve obtained using a differential scanning calorimetry (DSC device "Thermo Plus DSC8230" manufactured by Rigaku Corporation) under nitrogen atmosphere at a heating rate of 20°C / min. The inflection point is defined as the temperature corresponding to the peak value in the DDSC curve, which is the differential curve of the DSC heating curve. Furthermore, the DDSC curve is appropriately referenced in confirming the baseline of the DSC. <Softening Point: TMA Inflection Point> For polymers where the glass transition temperature (Tg) is difficult to determine or is unclear, the softening point is determined based on the TMA inflection point. The softening point is defined as the temperature at which the tangent to the neutral baseline of the thermal displacement curve obtained using a thermomechanical analysis apparatus (TMA7100 manufactured by Hitachi High-Tech Science, Inc.) at a heating rate of 5°C / min intersects with the tangent to the line shown in the graph after the polymer has undergone significant deformation at a certain temperature (the line after the inflection point). <5% Mass Reduction Temperature (Td5)> The 5% mass reduction temperature (Td5) for each polymer is set as follows: The temperature at which the polymer's mass cumulatively decreases by 5% is obtained using a differential thermal balance (NETZSCH G209 F1 Libra) under a nitrogen environment and a self-heating rate of 10°C / min. Furthermore, Td5 is one of the indicators of heat resistance; a higher value indicates better heat resistance. <Dielectric Loss Tangent (Df)> A test piece (width: 6 cm × length: 6 cm) was cut from the fabricated polymer film and the dielectric loss tangent (Df) of the test piece at 10 GHz was measured using the cavity resonator method (manufactured by Aet (stock), dielectric constant measurement system TE mode resonator). <Solubility> The cyclohexanone solutions of the polymers obtained in Examples 1-13, Examples 80-88, and Examples A1-A8 were visually confirmed. Cases where no precipitate could be observed were rated as "A", and cases where precipitate could be observed visually were rated as "B". Regarding the solubility of each polymer in cyclohexanone in Comparative Examples 1-9, each polymer was added to cyclohexanone at a concentration of 1% by mass and stirred. Cases where no precipitate could be observed visually were rated as "A", and cases where precipitate could be observed visually were rated as "B". <Coating Properties> With the obtained coating thickness being 20 μm to 30 μm, a cyclohexanone solution of the polymers obtained in Examples 1 to 13, Examples 80 to 88 and Examples A1 to A8 was applied to copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a coater. The coating was pre-dried at 70°C for 3 minutes and then pre-dried at 130°C for 3 minutes. Uneven coating was visually checked and evaluated accordingly. For each polymer in Comparative Examples 1 to 9, a solution prepared by dissolving it in N-methylpyrrolidone at the concentration shown in Table 1 ("Polymer Solution Concentration") was applied to copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a coater to obtain a coating film thickness of 20 μm to 30 μm. The coating was pre-dried at 70°C for 3 minutes, followed by pre-drying at 130°C for 3 minutes. Uneven coating was visually inspected, and evaluated according to the following criteria: "A": A uniform film without repulsion or thickness unevenness is formed on the copper foil; a coating film that does not peel off from the copper foil is formed. "B": An uneven coating film is formed on the copper foil, exhibiting repulsion, peeling off from the copper foil, and / or uneven thickness. <Copper Foil Adhesion> With the thickness of the obtained polymer layer being 20 μm to 30 μm, a cyclohexanone solution of the polymer obtained in Examples 1 to 13, Examples 80 to 88 and Examples A1 to A8 was coated onto a copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]), pre-dried at 70°C for 3 minutes, then pre-dried at 130°C for 3 minutes, then evaporated the solvent at 150°C for 30 minutes, and then evaporated the solvent at 250°C in a nitrogen environment for 3 hours, thereby obtaining a laminate containing a polymer layer and a copper foil. For solutions prepared by dissolving 2 g of each polymer from Comparative Examples 1 to 9 in 8 g of N-methylpyrrolidone, a polymer layer of 20 μm to 30 μm thickness was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Co., Ltd.]). The solution was pre-dried at 70°C for 3 minutes, then pre-dried at 130°C for 3 minutes, followed by solvent evaporation at 150°C for 30 minutes, and then solvent evaporation at 250°C under nitrogen for 3 hours, thereby obtaining a laminate containing a polymer layer and copper foil. The obtained laminate was cut into pieces 5 mm wide and 10 cm long, and stretched at 500 mm / min in a 90-degree direction using an Instron 5567 stretcher. The adhesion strength between the polymer layer and the copper foil was evaluated according to IPC-TM-650 2.4.9. Cases with a tightness of 0.2 N / mm or higher are rated as "A", and cases with a tightness of less than 0.2 N / mm are rated as "B". <Adhesion to Gold Substrate> A cyclohexanone solution of the polymers obtained in Examples 1-13, 80-88, and A1-A8 was spin-coated onto a gold sputtering wafer with a coating thickness of 10 μm to 20 μm. The solution was pre-dried at 70°C for 5 minutes, then pre-dried at 150°C for 5 minutes, and then the solvent was evaporated at 250°C under a nitrogen atmosphere for 1 hour to form a coating. A solution prepared by dissolving 2 g of each polymer from Comparative Examples 1-9 in 8 g of N-methyl-2-pyrrolidone was spin-coated onto a gold sputtering wafer with a coating thickness of 10 μm to 20 μm. The solution was pre-dried at 70°C for 5 minutes, then pre-dried at 150°C for 5 minutes, and then the solvent was evaporated at 250°C under a nitrogen atmosphere for 1 hour to form a coating. A bolt pin coated with epoxy resin was fixed to the surface of the coating by bonding the coating to the epoxy resin. The coating was cured at 160°C for 1 hour. The adhesion between the gold sputtered wafer and the coating was evaluated using a film adhesion strength tester (manufactured by QuadGroup) under a test condition of 20 N / s. Deterioration of the epoxy resin on the bolt pin was rated as "A", and peeling of the coating at the interface with the gold sputtered wafer was rated as "B". <Room temperature viscosity> With the obtained coating thickness being 10 μm to 20 μm, a cyclohexanone solution of the polymers obtained in Examples 5, 6, 11, 12, A6 and A7 was coated onto a polyimide film, pre-dried at 70°C for 5 minutes, then pre-dried at 150°C for 5 minutes, and then the solvent was evaporated at 250°C in a nitrogen environment for 1 hour, thereby forming a polyimide film laminate with a coating. A solution prepared by dissolving 2 g of each polymer from Comparative Examples 1 to 9 in 8 g of N-methyl-2-pyrrolidone was applied to a polyimide film using a coating applicator to achieve a coating thickness of 10 μm to 20 μm. The film was pre-dried at 70°C for 5 minutes, then pre-dried at 150°C for 5 minutes, and finally the solvent was evaporated at 250°C under nitrogen for 1 hour to form a polyimide film laminate with a coating. Samples were prepared by manually rolling the laminates together with the coated surface of each polyimide film laminate to an SUS plate. The adhesion of the polyimide film to the SUS plate was visually assessed; a condition of adhesion was rated as "A," and a condition of non-adhesion was rated as "B." [Table 1] (Synthesis Example 1) 13.2 g of 2-phenylamino-4,6-dichlorotriazine (AnDCT), 30.8 g of dimer diamine (Priamine 1075), and 8.7 g of potassium carbonate were weighed into a four-necked separable flask including a stirrer. 71.9 g of N-methyl-2-pyrrolidone and 30.8 g of water were added, and the mixture was reacted at 100°C under nitrogen for 20 hours. After the reaction was completed, the mixture was solidified with methanol, filtered, and washed with methanol to obtain 31 g (76% yield) of the target polymer (21) containing repeating units represented by the following formula (21). [Chemistry 78] [2] Composition (I) (Example 20) Polymer (21) and cyclohexanone were added to a glass bottle to dissolve the polymer (21) at a solid content concentration of 30% by mass. 16.7 g of the obtained polymer solution (amount of polymer (21): 5 g), 5 g of 2,2-bis(4-cyanophenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) as a curing compound, 0.5 g of zinc octanoate (manufactured by Fuji Film and Kogyo Pure Chemicals Co., Ltd.) as a curing aid, and cyclohexanone as an additional solvent to achieve a solid content concentration of 35% by mass were added. The mixture was stirred thoroughly using a mixing rotor to prepare a homogeneous composition without phase separation. The prepared composition was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Co., Ltd.]) using a bar coater and heated in an oven at 250°C under nitrogen for 3 hours to obtain a copper foil with a cured product. The obtained hardened copper foil was immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The obtained hardened material was then washed four times with ion-exchanged water to prepare an evaluation membrane sample with a thickness of 30 μm ± 5 μm. (Examples 21-33, Examples 40-43, and Comparative Examples 20-23) The components shown in Table 2 were used in the mass ratios (mass ratio of polymer to curing compound) shown in Table 2, except that the compositions were prepared using the same method as in Example 20, thereby producing evaluation membrane samples. Furthermore, in Examples 25 and 23, cyanate ester compound A and epoxy compound D were used as curing compounds in a mass ratio of 50:50. (Example 34) 16.7 g of a polymer solution of polymer (10) obtained in Example 1 (amount of polymer (10): 5 g), 5 g of 2,2-bis(4-cyanophenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) as a curing compound, 0.5 g of zinc octoate (manufactured by Fuji Film and Kohden Pure Chemical Co., Ltd.) as a curing aid, and cyclohexanone as an additional solvent to achieve a solid component concentration of 35% by mass were added. The mixture was thoroughly stirred using a mixing rotor to prepare a homogeneous mixture without phase separation. The prepared mixture was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Co., Ltd.]) using a bar coater and heated in an oven at 250°C under nitrogen for 3 hours to obtain a copper foil with a cured product. The obtained hardened copper foil was immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The obtained hardened material was then washed four times with ion-exchanged water to prepare an evaluation membrane sample with a thickness of 30 μm ± 5 μm. (Examples 35-39, Examples 44-49 and Examples 90-109) The components shown in Table 2 were used in the same manner as in Example 34 to prepare the composition, except that the components were prepared in the same way as in Example 34, according to the mass ratio (mass ratio of polymer to curing compound) shown in Table 2. [3] Composition (II) (Example 50) Polymer (21) and cyclohexanone were added to a glass bottle to dissolve the polymer (21) at a solid content concentration of 30% by mass. 9.3 g of the obtained polymer solution (amount of polymer (21): 2.79 g), 1.2 g of Admafine SC2500-SQ (manufactured by Admatechs) as filler, and cyclohexanone as an additional solvent to a solid content concentration of 35% by mass were added. The mixture was stirred thoroughly using a mixing rotor to prepare a homogeneous composition without phase separation. The prepared composition was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a bar coater and heated in an oven at 250°C under nitrogen for 3 hours to obtain a hardened copper foil. The obtained hardened copper foil was immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The obtained hardened material was then washed four times with ion-exchanged water to prepare an evaluation membrane sample with a thickness of 30 μm ± 5 μm. (Examples 51 to 59 and Comparative Examples 30 to 34) The components shown in Table 4 were used in the mass ratios shown in Table 4, and the composition was prepared using the same method as in Example 50, thereby producing an evaluation membrane sample. (Example 60) 9.3 g of a solution of polymer (14) obtained in Example 5 (amount of polymer (14): 2.79 g), 1.2 g of Admafine SC2500-SQ (manufactured by Admatechs, Inc.) as filler, and cyclohexanone as an additional solvent to achieve a solids concentration of 35% by mass were added to a glass bottle. The mixture was thoroughly stirred using a mixing rotor to prepare a homogeneous composition without phase separation. The prepared composition was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry, Inc.]) using a rod coater and heated in an oven at 250°C under nitrogen for 3 hours to obtain a hardened copper foil. The hardened copper foil was immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The hardened material was washed four times with deionized water to prepare an evaluation membrane sample with a thickness of 30 μm ± 5 μm. (Examples 61 to 72) Using the components shown in Table 4 at the mass ratio (mass ratio of polymer to filler) shown in Table 4, the composition was prepared using the same method as in Example 60, thereby producing an evaluation membrane sample. [4] Composition (III) (Example B1) Polymer (21) and cyclohexanone were added to a glass bottle to dissolve polymer (21) at a solid content concentration of 30% by mass, thereby obtaining a solution of polymer (21). The solution of polymer (21) (0.63 g, polymer (21) 0.19 g) and 2,2-bis(4-glycidoxyphenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) (10.1 g) as a curing compound were thoroughly stirred in the glass bottle using a mixing rotor, thereby obtaining solution X. In addition, 4-methylcyclohexane-1,2-dicarboxylic anhydride (cis- and trans-mixture) (8.9 g) as a reactive diluent and 1-benzyl-2-methylimidazolium (manufactured by Tokyo Chemical Industry Co., Ltd.) (0.10 g) as a curing aid were thoroughly stirred in the glass bottle using a mixing rotor, thereby obtaining solution Y. The obtained solution X and solution Y were mixed using a mixing rotor to prepare composition Z. The prepared composition Z was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a rod coater. The foil was then heated in an oven at 200°C under nitrogen for 3 hours to obtain a copper foil with a hardened film. The obtained copper foil with the hardened film was then immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The obtained hardened film was then washed four times with deionized water to prepare an evaluation film sample with a thickness of 30 μm ± 5 μm. (Examples B2 to B3) Each component was used in the same manner as in Example B1, except that the composition was prepared using the same method as in Example B1, according to the types and mass ratios shown in Table 5 (mass ratio of polymer / curing compound / reactive diluent / curing aid). (Example B4) Solution X was obtained by thoroughly stirring a solution (0.63 g) of polymer (39) and 10.1 g of 2,2-bis(4-glycidoxyphenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) as a curing compound in a glass bottle using a mixing rotor. Solution Y was obtained by thoroughly stirring 8.9 g of 4-methylcyclohexane-1,2-dicarboxylic anhydride (cis- and trans-mixture) as a reactive diluent and 0.10 g of 1-benzyl-2-methylimidazolium (manufactured by Tokyo Chemical Industry Co., Ltd.) as a curing aid in a glass bottle using a mixing rotor. Composition Z was prepared by mixing solution X and solution Y using a mixing rotor. Composition Z was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Co., Ltd.]) using a bar coater and heated in an oven at 200°C under nitrogen for 3 hours. The obtained copper foil with hardened film was immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The obtained hardened film was then washed four times with deionized water to prepare an evaluation film sample with a thickness of 30 μm ± 5 μm. (Examples B5 to B8) Each component was used in the same manner as in Example B4, except that the composition was prepared using the same method as in Example B4, according to the types and mass ratios shown in Table 5 (mass ratio of polymer / curing compound / reactive diluent / curing aid). (Example B9) Solution X was obtained by thoroughly stirring polymer (43) (0.26 g), 2,2-bis(4-glycidoxyphenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) (4.18 g), and DAW-01DC (manufactured by Denka Co., Ltd.) (12.0 g) in a glass bottle using a mixing rotor. Solution Y was obtained by thoroughly stirring 4-methylcyclohexane-1,2-dicarboxylic anhydride (cis- and trans-mixture) (3.7 g), which served as a reactive diluent, and 1-benzyl-2-methylimidazolium (manufactured by Tokyo Chemical Industry Co., Ltd.) (0.042 g), which served as a curing aid, in a glass bottle using a mixing rotor. Composition Z was prepared by mixing the obtained solution X and solution Y using a mixing rotor. The prepared composition Z was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a rod coater. The foil was then heated in an oven at 200°C under nitrogen for 3 hours to obtain a copper foil with a hardened film. The obtained copper foil with the hardened film was then immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The obtained hardened film was then washed four times with deionized water to prepare an evaluation film sample with a thickness of 30 μm ± 5 μm. (Example B10) Each component was used in the same manner as in Example B9, except that the composition was prepared using the same method as in Example B9, according to the types and mass ratios shown in Table 5 (mass ratio of polymer / curing compound / reactive diluent / curing aid / filler). [5] Composition (IV) (Example D1) Polymer (21), curing compound, filler, curing aid, and other polymers were placed in a glass bottle in the mass ratios described in Table 5. Toluene / methyl ethyl ketone = 1 / 1 (mass ratio) was added as an additional solvent to make the solid content concentration 65% by mass. The mixture was thoroughly stirred using a mixing rotor to prepare the composition. The prepared composition was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a bar coater and heated in an oven at 200°C under nitrogen for 3 hours to obtain a copper foil with a cured film. The copper foil with the cured film was immersed in a 40% aqueous solution of ferric chloride (III) to remove the copper foil. The cured film was washed four times with deionized water to prepare an evaluation film sample with a thickness of 30 μm ± 5 μm. (Examples D2 to D20 and Comparative Examples 35 to 36) The components shown in Table 5 were used in the same manner as in Example D1, except that the composition was prepared using the same method as in Example D1, thereby producing membrane samples for evaluation. <Appearance of the Composition> The appearance of the composition prepared in composition (I) was observed visually. The compatibility of the components used to prepare the composition, with no precipitation or phase separation observed, was rated as "A", and the observation of precipitation or phase separation was rated as "B". The results are shown in Table 2. <Reactivity> Using a Baker-type applicator (gap: 125 μm), the compositions prepared in components (I) and (III) were applied to copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) with a thickness of 20 μm to 30 μm. The coating was then pre-dried at 70°C for 3 minutes, followed by pre-drying at 130°C for 3 minutes, then evaporating the solvent at 150°C for 30 minutes, and finally evaporating the solvent at 250°C under nitrogen for 3 hours to obtain a copper foil-coated hardened film. The obtained copper foil-coated hardened film was immersed in 1.5 L of methyl ethyl ketone (MEK) at room temperature for 10 minutes, and then vacuum-dried at 120°C for 3 hours. The mass change rate was calculated using the following formula. Cases with a mass change rate of 80% or more were designated as "A", and cases with a mass change rate of less than 80% were designated as "B". The more the reaction between the polymer and the curing compound proceeds, the greater the mass change rate becomes. The results are shown in Tables 2 and 6. Mass change rate (%) = (Mass of the copper foil-coated cured film after vacuum drying / Mass of the copper foil-coated cured film before impregnation in MEK) × 100 <5% mass reduction temperature (Td5)> The 5% mass reduction temperature (Td5) of each evaluation membrane sample prepared in composition (I) and composition (III) was set as follows: the temperature at which the cumulative mass of the evaluation membrane sample decreased by 5% using a differential thermometer (NETZSCH TG209 F1 Libra) under nitrogen conditions and a self-heating rate of 10°C / min. The results are shown in Tables 2 and 4. <Tensive Elongation> Regarding tensile elongation, the evaluation membrane samples prepared in composition (I) and composition (II) were cut into dumbbell-shaped No. 7 shapes as described in JIS K 6251:2017, and tensile tests were conducted at room temperature and 5.0 mm / min using a small benchtop testing machine (manufactured by Shimadzu Corporation, "EZ-LX"). The results are shown in Tables 2 and 4. Furthermore, when using the evaluation membrane samples obtained in Comparative Examples 30 and 31, membrane breakage occurred during the tensile elongation measurement, making it impossible to measure the tensile elongation. <Adhesion to Gold Substrate> For the composition prepared in composition (I), a coating was formed on a gold sputtering wafer by spin coating to obtain a coating thickness of 10 μm to 20 μm. The coating was pre-dried at 70°C for 5 minutes, then pre-dried at 150°C for 5 minutes, and then the solvent was evaporated at 250°C in a nitrogen environment for 1 hour to form a coating film. A post bolt pin with epoxy resin attached was fixed to the surface of the coating film in a manner that the formed coating film was bonded to epoxy resin. The coating was cured at 160°C for 1 hour. The adhesion between the gold sputtering wafer and the formed coating film was evaluated using a film adhesion strength tester (manufactured by QuadGroup) under a test condition of 20 N / s. Deterioration of the epoxy resin on the post bolt pin was evaluated as "A", and peeling of the coating film at the interface with the gold sputtering wafer was evaluated as "B". The results are shown in Table 2. <Adhesion> With the thickness of the obtained coating film being 20 μm to 30 μm, the compositions obtained in Examples 38 to 39, 44 to 45, 104 to 106 and Comparative Examples 21 to 22 of the compositions prepared in Composition (I) were applied to copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]) using a coating applicator, pre-dried at 70°C for 5 minutes, then pre-dried at 150°C for 5 minutes, and then the solvent was evaporated at 220°C in a nitrogen environment for 1 hour to form a coating film. Samples were prepared by laminating a 50 μm thick polyimide film (manufactured by Toray DuPont, Inc., "Kapton 200H") onto the coated side of a coated copper foil using a resin-made manual roller at room temperature (Examples 38-39, 44-45, 104-105) or 80°C (Example 106, Comparative Example 21, Comparative Example 22). Adhesion was then evaluated by peeling the polyimide film off the prepared sample. The case where adhesion was achieved through lamination, i.e., it had adhesive properties and could be temporarily bonded like adhesive tape, was evaluated as "A," while the case where there was no adhesiveness and it could not be temporarily bonded and could be peeled off was evaluated as "B." The results are shown in Table 3. <Dispersibility> For compositions (II) to (IV), after preparation, the compositions were allowed to stand for 3 hours. Dispersibility was evaluated by defining "A" as the absence of visible filler precipitation and "B" as the presence of visible filler precipitation. The results are shown in Tables 4 and 6. Furthermore, in Comparative Examples 33 and 34, the polymer was insoluble in cyclohexanone during composition preparation, indicating insolubility (polymer insoluble). <Self-supporting membrane> When preparing evaluation membrane samples from the hardened copper foil obtained using composition (II), the case where the evaluation membrane sample obtained by removing the copper foil from the self-hardened copper foil is a processable membrane is evaluated as "A", the case where the evaluation membrane sample is a brittle and easily collapsed membrane is evaluated as "B", and the case where the evaluation membrane sample disintegrates and a membrane cannot be obtained is evaluated as "membrane collapse". The results are shown in Table 4. Furthermore, when using the compositions prepared in Comparative Examples 33 and 34, a membrane could not be formed (membrane could not be formed), and the hardened copper foil itself could not be obtained. <Copper Foil Adhesion> The prepared composition (II) was coated onto copper foil (CF-T9DA-SV [manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.]), pre-dried at 70°C for 3 minutes, then pre-dried at 130°C for 3 minutes, followed by solvent evaporation at 150°C for 30 minutes, and then solvent evaporation at 250°C under nitrogen for 3 hours, thereby obtaining a laminate containing a polymer layer (thickness: 30 μm ± 5 μm) and copper foil. The obtained laminate was cut into pieces with a width of 5 mm and a length of 10 cm, and stretched at 500 mm / min in a 90-degree direction using an Instron 5567 extruder. The adhesion strength between the polymer layer and the copper foil was evaluated according to IPC-TM-650 2.4.9. Cases with a tightness of 0.2 N / mm or higher are rated as "A", and cases with a tightness of less than 0.2 N / mm are rated as "B". <Dispersion Stability> The components prepared in Examples B9 and B10, and component (IV) were left to stand for 3 days. The condition in which no filler precipitation was visible and the solution was fluid was designated as "A", and the condition in which filler precipitation was visible and the solution was not fluid was designated as "B" to evaluate the dispersion stability. [Table 2] [Table 3] [Table 4] [Table 5] [Table 6] Furthermore, the abbreviations for hardening compounds, hardening aids, reaction diluents, fillers, other polymers, and solvents in Tables 2 to 5 are as follows. <Curing Compounds> • Cyanate Ester Compound A: 2,2-bis(4-cyanophenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) • Cyanate Ester Compound B: 1,3-bis[2-(4-cyanophenyl)propane-2-yl]benzene • Epoxy Compound A: 2,2-bis(4-glycidoxyphenyl)propane (manufactured by Tokyo Chemical Industry Co., Ltd.) • Epoxy Compound B: jER872 (manufactured by Mitsubishi Chemical Co., Ltd.) • Epoxy Compound C: XD-1000 (manufactured by Nippon Kayaku Co., Ltd.) • Epoxy Compound D: Denacol EX-991L (manufactured by Nagase ChemteX Co., Ltd.) • Epoxy Compound E: jER604 (manufactured by Mitsubishi Chemical Co., Ltd.) • Epoxy Compound F: Teisan resin SG-P3 (manufactured by Nagase ChemteX Co., Ltd.) • Epoxy Compound G: Teisan resin SG-80H (manufactured by Nagase ChemteX Co., Ltd.) • Maleimide Compound A: bis(3-ethyl-5-methyl-4-maleimidephenyl)methane (manufactured by Tokyo Chemical Industry Co., Ltd.) • Maleimide Compound B: ULTIMID3000A (manufactured by ABC Nanotech Co., Ltd.) • Acrylic Compound: 1,9-bis(acryloxy)nonane (manufactured by Tokyo Chemical Industry Co., Ltd.) • Allyl Compound: Triallyl isocyanurate (manufactured by Tokyo Chemical Industry Co., Ltd.) • Vinyl Compound A: Divinylbenzene (manufactured by Tokyo Chemical Industry Co., Ltd., meta- and para-position mixture) • Vinyl Compound B: RICON100 (manufactured by CRAY VALLY Co., Ltd.) • Hydroxymethyl compound: 2,4,6-tris[bis(methoxymethyl)amino]-1,3,5-triazine (manufactured by Tokyo Chemical Industry Co., Ltd.) • Oxazoline compound: 1,3-bis(4,5-dihydro-2-oxazolyl)benzene (manufactured by Tokyo Chemical Industry Co., Ltd.) • Oxazine compound: 2,2-bis(3,4-dihydro-3-methyl-2H-1,3-benzoxazine)propane (a compound synthesized according to "Macromolecules" 2003, 36, 8320-8329) • Oxycyclic butane compound: (3-ethyloxecyclic butane-3-yl)methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) <Curing Agents> • Zinc Octanoate: Zinc octanoate (manufactured by Nippon Chemical Industries, Ltd.) • Imidazole: 1-Benzyl-2-methylimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.) • Organic Peroxide: Dicumyl Peroxide (manufactured by Nippon Oil Co., Ltd.) • Borate Salt: 4-acetoxyphenyl(dimethyl)silane-tetra(pentafluorophenyl)borate (manufactured by Sanshin Chemical Industry Co., Ltd.) • DMAP: 4-dimethylaminopyridine (manufactured by Tokyo Chemical Industry Co., Ltd.) <Reactive Diluents> • Reactive Diluent A: 4-Methylcyclohexane-1,2-dicarboxylic anhydride (cis- and trans-mixture) (manufactured by Tokyo Chemical Industry Co., Ltd.) • Reactive Diluent B: o-Tolyl glycidyl ether (manufactured by Yokkaichi Synthetic Co., Ltd.) <Fillers> • Silicon Dioxide A: Admafine SC2500-SQ (manufactured by Admatechs, Inc.) • Silicon Dioxide B: Admafine SC2500-SXJ (manufactured by Admatechs, Inc.) • Silicon Dioxide C: Admafine SC2500-SQ-SPJ (manufactured by Admatechs, Inc.) • Boron Nitride: Boron Nitride UHP-1K (manufactured by Showa Denko, Inc.) • Alumina A: DAW-01DC (manufactured by Denka, Inc.) • Alumina B: CB-PO2 (manufactured by Showa Denko, Inc.) <Other Polymers> • Ester Resin: HPC-8000-65T (manufactured by DIC Corporation) • Phenolic Resin: PHENOLITE TD-2090 (manufactured by DIC Corporation) • Rubber A: Tuftec M1913 (manufactured by Asahi Kasei Corporation) • Rubber B: Tuftec MP10 (manufactured by Asahi Kasei Corporation) <Solvent> S1: Toluene / Methyl Ethyl Ketone = 1 / 1 (mass ratio) This polymer exhibits excellent heat resistance, is soluble in common solvents, and demonstrates excellent coatability and adhesion to substrates such as copper or gold. Furthermore, by appropriately combining this polymer with various curing compounds or fillers, a cured material (cured layer) with excellent heat resistance and excellent coatability and adhesion to substrates such as copper or gold can be formed. Therefore, this polymer or composition is preferably suitable for a wide range of applications, including structural materials used in the aircraft and automotive industries, and electrical and electronic materials used in the electrical and electronic industries. none Figure 1 shows the polymer obtained in Example 2. 1¹H-NMR spectra. Figure 2 shows the ¹H-NMR spectra of the polymer obtained in Example 5. 1 ¹H-NMR spectra. Figure 3 shows the ¹H-NMR spectra of the polymer obtained in Example 6. 1 ¹H-NMR spectra. Figure 4 shows the ¹H-NMR spectra of the polymer obtained in Example 8. 1 ¹H-NMR spectra. Figure 5 shows the ¹H-NMR spectra of the polymer obtained in Example 9. 1 ¹H-NMR spectra. Figure 6 shows the ¹H-NMR spectra of the polymer obtained in Example 10. 1 H-NMR spectrum.

Claims

1. A composition comprising a polymer containing repeating units represented by the following formula (1): In formula (1), -N(R')-R3-N(R')- is a structure derived from a dimer diamine, either unsubstituted or substituted, wherein R', R1, and R2 are independently hydrogen atoms, halogen atoms, unsubstituted or substituted hydrocarbon groups having 1 to 20 carbon atoms, unsubstituted or substituted heterocyclic aliphatic groups having 3 to 20 carbon atoms, or unsubstituted or substituted heterocyclic aromatic groups having 3 to 20 carbon atoms, and -NR1R2 may be a nitrogen-containing heterocyclic group having 5 to 20 atoms forming a ring formed by the mutual bonding of R1 and R2; wherein the structure derived from the dimer diamine includes the following structures: .

2. The composition as claimed in claim 1, wherein the polymer further comprises a repeating unit represented by the following formula (2): In formula (2), R', R1 and R2 are independently hydrogen atoms, halogen atoms, unsubstituted or substituted hydrocarbon groups having 1 to 20 carbon atoms, unsubstituted or substituted heterocyclic aliphatic groups having 3 to 20 carbon atoms, or unsubstituted or substituted heterocyclic aromatic groups having 3 to 20 carbon atoms; R4 is a divalent aromatic hydrocarbon group having 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group having 5 to 20 carbon atoms, a divalent chain hydrocarbon group having 1 to 20 carbon atoms, a divalent group represented by -(R41-O)m-, a divalent silicon-containing group, a group selected from two or more combinations of such groups, or at least a portion of such groups. The group is a substituent selected from at least one of oxygen, nitrogen and sulfur atoms, or a group in which some of these groups are substituted by a substituent. R41 is independently an alkyl group having 2 to 4 carbon atoms, m is an integer from 1 to 70, -NR1R2 can be a ring formed by R1 and R2 bonded together, constituting a nitrogen-containing heterocyclic group having 5 to 20 atoms, -N(R')-R4- can be a ring formed by R' and R4 bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group having 5 to 20 atoms, and -N(R')-R4-N(R')- can be a ring formed by two R's bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group having 5 to 20 atoms.

3. The composition as described in claim 1 or 2 further contains a curing compound (C).

4. The composition as described in claim 1 or 2 further contains a hardening aid (D).

5. The composition as described in claim 1 or 2 further contains a solvent.

6. The composition as claimed in claim 3, wherein the curing compound (C) is at least one selected from the group consisting of epoxy compounds, cyanate ester compounds, vinyl compounds, silicone compounds, oxazine compounds, maleimide compounds, allyl compounds, oxadiene compounds, hydroxymethyl compounds, (meth)acrylic acid compounds, oxazoline compounds, and propargyl compounds.

7. The composition as described in claim 1 or 2 further contains filler.

8. A hardened material formed by hardening the composition as described in claim 1 or 2.

9. A laminate having a substrate and a hardened layer formed using the composition as described in claim 1.

10. An electronic component having a laminate as described in claim 9.

11. A polymer comprising repeating units represented by formula (1) and repeating units represented by formula (2): In formulas (1) and (2), -N(R')-R3-N(R')- is a structure derived from an unsubstituted or substituent-substituted dimer diamine, R', R1 and R2 are respectively independently hydrogen atoms, halogen atoms, unsubstituted or substituent-substituted hydrocarbon groups having 1 to 20 carbon atoms, unsubstituted or substituent-substituted heterocyclic aliphatic groups having 3 to 20 carbon atoms, or unsubstituted or substituent-substituted heterocyclic aromatic groups having 3 to 20 carbon atoms, R4 is a divalent aromatic hydrocarbon group having 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group having 5 to 20 carbon atoms, a divalent chain hydrocarbon group having 1 to 20 carbon atoms, a divalent group represented by -(R41-O)m-, a divalent silicon-containing group, selected from these The diamine-derived group comprises two or more groups, at least a portion of which are substituted by at least one group selected from oxygen, nitrogen, and sulfur atoms, or a portion of which are substituted by a substituent, wherein R41 is independently an alkyl group having 2 to 4 carbon atoms, m is an integer from 1 to 70, -NR1R2 can be a ring formed by R1 and R2 bonded together, constituting a nitrogen-containing heterocyclic group having 5 to 20 atoms, -N(R')-R4- can be a ring formed by R' and R4 bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group having 5 to 20 atoms, and -N(R')-R4-N(R')- can be a ring formed by two R's bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group having 5 to 20 atoms; wherein the structure of the diamine-derived dimer includes the following structures: .

12. A molded article formed from the polymer as described in claim 11.

13. A laminate having a substrate and a layer formed using a polymer as described in claim 11.

14. An electronic component having a laminate as described in claim 13.

15. A polymer comprising a repeating unit represented by formula (1) below, or comprising a repeating unit represented by formula (1) below and a repeating unit represented by formula (2) below, and having at its terminal at least one group selected from phenolic hydroxyl, allyl, vinyl, (meth)acrylyl, maleimino, propargyl, ethynyl, aromatic hydrocarbon, aliphatic hydrocarbon, or heterocyclic group: In formulas (1) and (2), -N(R')-R3-N(R')- is a structure derived from an unsubstituted or substituent-substituted dimer diamine. R', R1, and R2 are, respectively, a hydrogen atom, a halogen atom, an unsubstituted or substituent-substituted hydrocarbon group with 1 to 20 carbon atoms, an unsubstituted or substituent-substituted heterocyclic aliphatic group with 3 to 20 carbon atoms, or an unsubstituted or substituent-substituted heterocyclic aromatic group with 3 to 20 carbon atoms. R4 is a divalent aromatic hydrocarbon group with 6 to 30 carbon atoms, a divalent alicyclic hydrocarbon group with 5 to 20 carbon atoms, a divalent chain hydrocarbon group with 1 to 20 carbon atoms, a divalent group represented by -(R41-O)m-, a divalent silicon-containing group, or a group selected from these. The diamine-derived group comprises two or more groups, at least a portion of which are substituted by at least one group selected from oxygen, nitrogen, and sulfur atoms, or a portion of which are substituted by a substituent, wherein R41 is independently an alkyl group having 2 to 4 carbon atoms, m is an integer from 1 to 70, -NR1R2 can be a ring formed by R1 and R2 bonded together, constituting a nitrogen-containing heterocyclic group having 5 to 20 atoms, -N(R')-R4- can be a ring formed by R' and R4 bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group having 5 to 20 atoms, and -N(R')-R4-N(R')- can be a ring formed by two R's bonded together, constituting a divalent monocyclic nitrogen-containing heterocyclic group having 5 to 20 atoms; wherein the structure of the diamine-derived dimer includes the following structures: .

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