Exposure method, exposure apparatus and method of manufacturing article

Abstract

This disclosure relates to an exposure method, an exposure apparatus, and a method for manufacturing an article. An exposure method includes: a first layer exposure step, in which a pattern of a master image is exposed onto a first layer on the substrate while scanning the relative positions of a master image and a substrate in a scanning direction; and a second layer exposure step, in which the pattern of the master image is exposed onto a second layer on the first layer while scanning the aforementioned relative positions in the aforementioned scanning direction. The first layer exposure step includes: a first step, transferring a first effective area in the master image, comprising a pattern forming area, a light-shielding area disposed at a position away from the pattern forming area in the scanning direction, and an alignment mark, to a first imaging area in the substrate; and a second step, transferring a second effective area, comprising a portion of the pattern forming area and a portion of the alignment mark, to a second imaging area in the substrate in a manner that overlaps with the area in the first imaging area corresponding to the light-shielding area.

Description

Exposure method, exposure device, and method for manufacturing article The present invention relates to an exposure method, an exposure device, and a method for manufacturing an article. In the manufacture of flat panel displays (FPDs) such as liquid crystal displays and organic EL displays, as well as semiconductor devices, exposure devices are used to transfer the pattern of a mask or other original plate onto a substrate such as a glass plate or wafer coated with a photosensitive material. Such exposure devices require high-precision alignment of the original plate pattern to the patterned area on the substrate. Generally, by forming alignment marks on the lower layer for alignment and measuring the alignment marks formed on the lower layer during exposure of the upper layer, the pattern formed on the lower layer can be accurately superimposed and transferred to the upper layer. Furthermore, during the exposure step using the exposure device, it is also required to reduce production costs by optimizing the panel layout and utilizing the substrate without waste. To optimize the panel layout, the size of the original plate may become a constraint. For example, when pattern 16 of original plate 3, as shown in FIG18(a), is transferred to substrate 6, as shown in FIG18(b), the resulting panel layout is as shown in FIG18(b). In FIG18(b), wasted space is generated in area 52 where panels cannot be produced. Patent Document 1 discloses a method of combining full-shot exposure (also referred to as first exposure) to transfer the entire pattern of the original plate, and half-shot exposure (also referred to as second exposure) to transfer a portion (e.g., half) of the pattern of the original plate while shielding it from light. By combining full-shot exposure and half-shot exposure, panels can be produced in a panel layout such as that shown in FIG. 18(c), and the panel layout can be optimized to prevent wasted space. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-85793 [Problems to be solved by the invention] Patent Document 1 optimizes the panel layout by performing full-area exposure and half-area exposure in a direction orthogonal to the exposure scanning direction (X direction). Similarly, there is the possibility of wasted space in the exposure scanning direction (Y direction), requiring optimization of the panel layout in the same manner as in the X direction. When a pattern is formed by simply blocking a portion of the original plate 3, alignment marks cannot be formed at the desired locations, which can be disadvantageous in terms of pattern formation accuracy and throughput. Therefore, an object of the present invention is to provide an exposure method that is conducive to optimizing the panel layout. [Technical Means for Solving the Problem] In order to achieve the above-mentioned purpose, an exposure method as an aspect of the present invention includes: a first layer exposure step of exposing the pattern of the original plate to the first layer on the substrate while scanning the relative position of the original plate and the substrate in a scanning direction; and a second layer exposure step of exposing the pattern of the original plate to the second layer on the first layer while scanning the relative position in the scanning direction. The exposure method is characterized in that the first layer exposure step includes: a first step of transferring a first effective area of ​​the original plate including a pattern forming area, a light-shielding area set at a position away from the pattern forming area in the scanning direction, and an alignment mark to a first shooting area in the substrate; and a second step of transferring a second effective area including a part of the pattern forming area and a part of the alignment mark to a second shooting area in the substrate in a manner that overlaps with the area corresponding to the light-shielding area in the first shooting area. Other features of the present invention will become clear from the following description of preferred embodiments (with reference to the accompanying drawings). Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. <First Embodiment> (Structure of Exposure Apparatus) FIG. 5 is a schematic diagram illustrating the structure of an exposure apparatus 100. The exposure apparatus in this embodiment is used in the photolithography step when manufacturing devices such as semiconductor devices and flat panel displays (FPDs). The exposure apparatus forms a latent image pattern in the patterned area of ​​the substrate by transferring the pattern of an original plate (mask) to a substrate coated with a resist. The exposure apparatus in this embodiment is a so-called step-and-scan scanning exposure apparatus that transfers the pattern of the original plate to multiple patterned areas on the substrate via a projection optical system. In this embodiment, the XYZ coordinate system is used, with the plane parallel to the substrate holding surface of the substrate stage 7 being the XY plane. The substrate scanning direction is the Y direction, the direction parallel to the substrate holding surface and perpendicular to the Y direction is the X direction, and the direction perpendicular to the X and Y directions is the Z direction. Furthermore, the rotation about the center in the Z direction is θ, the rotation about the center in the X direction is Pitch, and the rotation about the center in the Y direction is Roll. In FIG5 , the exposure apparatus is represented by the YZ plane as viewed from the X direction. FIG6 is a schematic diagram of the exposure apparatus represented by the XZ plane as viewed from the Y direction. The exposure device 100 includes an original plate mounting stage 4 on which an original plate 3 is mounted, a substrate mounting stage 7 on which a substrate 6 is mounted, an illumination optical system 1 for illuminating the original plate 3, and a projection optical system 5 for projecting a pattern on the original plate 3 onto the substrate 6. The original plate 3 and the substrate 6 are arranged at positions (the object plane and image plane of the projection optical system 5) that are substantially optically conjugate with each other across the projection optical system 5. The alignment measurement unit 2 (first measurement unit) measures the mark group 22 on the original plate and the mark group 23 on the substrate. The off-axis measurement unit 9 (second measurement unit) measures the mark group 23 on the substrate. The control unit 12 determines and controls the drive amount of each drive mechanism of the exposure device 100. The illumination optical system 1 is composed of a light source unit such as an ultra-high pressure mercury lamp (not shown), a wavelength selection filter, a lens group, a shutter, etc. The illumination optical system 1 irradiates the original plate 3 with light of a wavelength suitable for exposure. Under the control of the control unit 12, the original plate stage 4 carrying the original plate 3 is scanned in the Y direction using a drive mechanism (not shown). A reflective mirror (not shown) is arranged on the original plate stage 4 to reflect the measurement light from a laser interferometer (not shown) arranged outside the original plate stage 4. The laser interferometer receives the reflected measurement light and constantly monitors and measures the position of the original plate stage 4. The control unit 12 controls the position and speed of the original plate stage 4 based on the measurement results using the laser interferometer. The projection optical system 5 includes mirrors and lenses (not shown) that reflect and refract exposure light to project the pattern formed on the original plate 3 onto the substrate 6. Furthermore, under the control of the control unit 12, a drive mechanism (not shown) drives the mirrors and lenses in the Z, Pitch, and Roll directions to achieve arbitrary magnification, shift, and focus adjustments. The projection optical system 5 has a predetermined projection magnification (e.g., 1 / 2, 2, etc.) and projects the pattern formed on the original plate 3 onto the substrate 6. Under the control of the control unit 12, the substrate stage 7, carrying the substrate 6, is driven in the X, Y, Z, θ, Pitch, and Roll directions by a drive mechanism (not shown). Multiple mirrors (not shown) are arranged on the substrate stage 7 to reflect measurement light from a laser interferometer (not shown) located outside the substrate stage 7. The laser interferometer receives the reflected measurement light and continuously monitors and measures the position of the substrate stage 7. The control unit 12 controls the position and speed of the substrate stage 7 based on the measurement results of the laser interferometer. The light shielding plates 8a and 8b shield the exposure light so that only a specific effective area of ​​the original plate 3 is exposed on the substrate 6. The light shielding plate 8a has a driving mechanism (not shown) and is driven in the Y direction to limit the effective area in the Y direction on the original plate 3. The light shielding plate 8b has a driving mechanism (not shown) and is driven in the X direction to limit the effective area in the X direction on the original plate 3. The alignment measurement unit 2 has a drive mechanism (not shown) that drives in the XY directions. It also has a focus adjustment mechanism that measures the mark group 22 on the original plate and the mark group 23 on the substrate. When measuring the mark group 23 on the substrate, the measurement is performed via the projection optical system 5. The off-axis measurement unit 9 has a drive mechanism (not shown) that drives in the X direction and measures the mark group 23 on the substrate. The exposure device 100 can simultaneously measure multiple marks by aligning the positions of the alignment measurement unit 2 and the off-axis measurement unit 9 with the mark group formed on the substrate 6. A light source (non-exposure light) having a wavelength different from that of the exposure light can be used in the alignment measurement unit 2 and the off-axis measurement unit 9. The control unit 12 functions as a processing unit that determines the drive amount of each drive mechanism during exposure based on the mark position information measured by the alignment measurement unit 2 and the eccentricity measurement unit 9. The control unit 12 is composed of a data storage unit 13, a drive amount calculation unit 14, and a drive instruction unit 15. The data storage unit 13 stores layout information, mark position information measured by the alignment measurement unit 2 and the eccentricity measurement unit 9, drive parameters such as drive offset and sensitivity for various drive axes, and various measurement data acquired by the exposure apparatus. The drive amount calculation unit 14 calculates various correction components such as X- and Y-direction shift, rotation, and magnification based on the data stored in the data storage unit 13 using conventional statistical methods. Furthermore, the drive amount calculation unit 14 determines the drive instruction amount for each drive axis based on the drive parameters and the calculated correction components. The drive instruction unit 15 uses the drive instruction amount for each drive mechanism determined by the drive amount calculation unit 14 to output a drive instruction for each drive mechanism. The control unit 12 is composed of a computer device including a CPU (Central Processing Unit) and a memory as its hardware structure. In this case, the data storage unit 13 is realized by the memory, and the drive amount calculation unit 14 and the drive instruction unit 15 are realized by the CPU. 1 , 3 , 4 , 7 , and 12 described below, (a) is a diagram showing a panel layout of the original plate 3 , and (b) is a diagram showing a layout of a pattern formed on the substrate 6 . (Comparative Example 1) As Comparative Example 1 of the present embodiment, a situation as shown in FIG1 is assumed. Compared to the situation in which 4 rows of panel units 16 can be arranged in the Y direction of the original plate 3 as shown in FIG1(a), there is space for producing 7 rows of panels in the Y direction of the substrate 6 as shown in FIG1(b). Therefore, from the perspective of productivity, it is preferable to optimize the panel layout by exposing the imaging area 19 of the panel unit 16 for 4 rows in the Y direction (first exposure) and exposing the imaging area 20 of the panel unit 16 for 3 rows in the Y direction (second exposure). In addition, in the second exposure, the above-mentioned exposure can be performed by shielding the panel for 1 row using a shading mechanism or the like. Here, as shown in Figure 2(a), the following situation is assumed: the alignment measurement unit 2 is driven on the arc-shaped dotted line portion r1, and the off-axis measurement units 9a and 9b are driven on area r2 and on the straight dotted line portion r3 by a combination of linear drive in the X direction and linear drive in the Y direction. As shown in Figure 2(b), in order to measure the shape of the exposure area with high precision, the alignment marks 10 are arranged outside the area of ​​the panel unit 16. The positions of the alignment marks 10a to 10f can be determined by being arranged near the outer periphery of the exposure exposure area 21. If the position X of the alignment marks 10a to 10f is determined, the drive position X of the alignment measurement unit 2 and the off-axis measurement units 9a to 9d is determined. Moreover, in the alignment measurement unit 2, if the drive position X is determined, the corresponding drive position Y is also determined, and the position Y of the alignment marks 10c and 10d is also determined. Furthermore, the drive position Y of the eccentricity measuring parts 9a and 9b is determined so that the distance between the alignment marks 10a and 10e (or 10b and 10f) and the distance between the eccentricity measuring parts 9a and 9c (or 9b and 9d) become equal. When performing the first and second exposures using the panel layout shown in FIG1(b), exposure is performed as shown in FIG3(b). Furthermore, as shown in FIG3(a), in addition to alignment marks 10a to 10f, other alignment marks 10g and 10h are provided on the original plate 3. In order to simultaneously measure the alignment marks in the imaging area 20 using the alignment measurement unit 2 and the off-axis measurement unit 9, the off-axis measurement unit 9 must be driven to a predetermined position where simultaneous measurement is possible. In this embodiment, "simultaneous measurement" means measuring multiple alignment marks using the alignment measurement unit 2 and the off-axis measurement unit 9 without driving the alignment measurement unit 2, the off-axis measurement unit 9, the substrate 6, etc. In other words, even if the measurement timing and measurement period of each measurement unit are not exactly the same, measuring multiple alignment marks without driving each unit is considered to be within the scope of simultaneous measurement. In the measurement of the off-axis measurement unit 9, it is necessary to use the relative distance (baseline) to the alignment measurement unit 2 to calculate the mark position, but the baseline changes every time the off-axis measurement unit 9 is driven. Therefore, it is necessary to obtain the baseline every time the off-axis measurement unit 9 is driven, which becomes a major factor that deteriorates the throughput. In addition, the drive of the off-axis measurement unit 9 is lower than the drive of the substrate stage 7, which also becomes a major factor that deteriorates the throughput. Therefore, with respect to the alignment of the imaging area 20, after measuring the alignment marks 10c, 10d, 10e, and 10f using the alignment measurement unit 2 and the off-axis measurement unit 9, the substrate stage is driven to measure the alignment marks 10g and 10h using the alignment measurement unit 2. With this method, simultaneous measurement is not possible during the alignment measurement in the imaging area 20, resulting in a decrease in throughput. (Comparative Example 2) Comparative Example 2 for the present embodiment is described. FIG4 is a diagram for illustrating Comparative Example 2. In Comparative Example 2, a pattern of an original plate and an alignment mark are formed as shown in FIG4(a). In addition, the result of forming a pattern on the substrate 6 using the original plate 3 shown in FIG4(a) is shown in FIG4(b). In FIG4(b), when alignment in the shooting area 20 is implemented only with the alignment marks 10c, 10d, 10e, and 10f, the overlap accuracy deteriorates compared to the case where there are alignment marks at the outer end of the shooting area. The reason for this is that although correction components such as displacement, rotation, and magnification of the shooting area are calculated based on the alignment results, when calculating components such as rotation and magnification that are proportional to the distance, the farther the alignment mark is from the outer end of the shooting area, the more it is affected by the measurement reproducibility. (Exposure Processing in This Embodiment) The following describes an exposure method for a layout having different sizes of imaging zones in the Y direction (scanning direction) as shown in FIG1 , with reference to the flowchart of FIG8 . In this embodiment, the description is given using layouts having four and three panels in the Y direction per imaging zone as examples. However, even if the number of panels in the Y direction is changed to another number, as in the layouts having three and two panels, the same process can be used. First, the exposure method of the layer (first layer) of the substrate is described (steps S101 to S103 of Figure 8, also referred to as the first layer exposure step). The original plate 3 used to expose the layer of the substrate has a structure as shown in (a) of Figure 7. In the original plate 3, the panel portion 16 (pattern forming area) is arranged in 4 columns in the X direction and 4 rows in the Y direction, and has a shading area 11a provided at a position away from the panel portion 16 in the Y direction (scanning direction). A shading film such as chromium can be used for the shading area 11a. The alignment marks 22a to 22f on the original plate 3 are arranged at the outer end and outer periphery of the original plate 3. In addition, the alignment marks 23c, 23d, 23g, and 23h measured by the alignment measurement unit 2 are also referred to as the first marks, and the alignment marks 23a, 23b, 23e, 23f, 23i, and 23j measured by the off-axis measurement unit 9 are also referred to as the second marks. Furthermore, as shown in FIG7(a), a light shielding region 11b (second light shielding region) is also provided at a position away from the alignment marks 22a and 22b in the Y direction (scanning direction) on the original plate 3. The light shielding region 11b is required in order to form a layout such as that shown in FIG7(b) on the substrate 6 using the original plate 3 and to expose the substrate 6 so that a portion of the shot area overlaps. In step S101, as shown in FIG9(a), the light shielding plate 8 is driven to expose the entire area (first effective area) of the original plate 3 and transfer it to the shot area 19 (first shot area) of the substrate 6. Step S101 is also referred to as the first step. In step S102, as shown in FIG9(b), the light shielding plate 8 is driven to expose the area (second effective area) including the three rows and four columns of the panel portion 16 and the alignment marks 22a to 22d on the original plate, and transfer the exposure light to the shot area 20 (second shot area) of the substrate 6. At this time, the exposure is performed so that the upper end of the light shielding region 11a of the shot area 19 is aligned with the upper end of the shot area 20. Since the alignment marks 22e and 22f on the original plate formed in the shot area 19 are within the exposure area of ​​the shot area 20, it is necessary to provide a light shielding region 11b on the original plate 3 to shield the exposure light in the shot area 20. Step S102 is also referred to as the second step. In step S103, substrate 6 is conveyed and developed, making the alignment marks 23a-23j on substrate 6 visible. After the exposure of the base layer is completed, panel portion 16 is formed in 7 rows and 4 columns on substrate 6, as shown in FIG9(c). Alignment marks 23a-23f on substrate 6 are marks exposed in shot area 19, and alignment marks 23g-23j on substrate 6 are marks exposed in shot area 20. Next, the exposure method of the surface layer (second layer) is described (steps S104 to S107, also referred to as the second layer exposure step). The structure of the original plate 3 is substantially the same as that of the original plate used in the exposure of the base layer, but the shading areas 11a and 11b are no longer necessary. In step S104, as shown in (a) of Figure 10, alignment of the shooting area 19 is performed. The alignment marks 22a to 22f on the original plate 3 and the alignment marks 23a to 23f on the substrate 6 are corresponding marks, respectively. In this embodiment, the alignment marks 23c and 23d are measured by the alignment measurement unit 2, and the alignment marks 23a, 23b, 23e, and 23f are measured by the off-axis measurement unit 9. In addition, using the measurement results of the aforementioned alignment marks, the control unit 12 calculates various correction amounts when exposing the shooting area 19 and the drive indication amounts of various drive axes calculated based on the aforementioned correction amounts. In step S105, as shown in (b) of Figure 10, alignment of the photographing area 20 is performed. The alignment marks 22a~22d on the original plate 3 and the alignment marks 23g~23j on the substrate 6 are corresponding marks. In this embodiment, the alignment marks 23g and 23h are measured by the alignment measurement unit 2, and the alignment marks 23i and 23j are measured by the off-axis measurement unit 9. In addition, using the measurement results of the aforementioned alignment marks, the control unit 12 calculates various correction amounts when exposing the photographing area 20 and the drive indication amounts of various drive axes calculated based on the aforementioned correction amounts. That is, in steps S104 and S105, the correction amount of the position and shape of the photographing area to be exposed in the next step is calculated. In step S106, as shown in FIG10(c), the shading plate 8 is driven, and the driving instruction amount calculated in step 104 is used to expose the area of ​​the panel portion 16 including 4 rows and 4 columns, and the imaging area 19 is transferred to the substrate 6. At this time, whether or not the alignment marks 22a to 22d on the original plate 3 are exposed is optional. In step S107, as shown in FIG10(d), the shading plate 8 is driven, and the driving instruction amount calculated in step 105 is used to expose the area of ​​the panel portion 16 including 3 rows and 4 columns, and the imaging area 20 is transferred to the substrate 6. At this time, whether or not the alignment marks 22a to 22d on the original plate 3 are exposed is optional. In addition, the order of steps S106 and S107 can be reversed, and the order of steps S105 and S106 can be reversed. While the above description describes the case of exposing two shot areas on substrate 6 in the Y direction, the same process can also be used to expose n shot areas (n is an integer greater than or equal to 3) in the Y direction. If four rows of panel units 16 can be arranged on master plate 3 and (4×n-1) rows of panel units 16 can be arranged on substrate 6, shot area 19 is exposed for (n-1) shot areas, and shot area 20 is exposed for one shot area. Master plate 3 can be configured as shown in FIG7(a), and the same structure can be used. When exposing the base layer, the area shown in (a) of FIG. 9 is exposed in the imaging area 19, and the area shown in (b) of FIG. 9 is exposed in the imaging area 20. At this time, exposure is repeated in a manner directed to the light-shielding area 11a of the imaging area 19, and the repeated exposure areas become (n-1) locations. When exposing the surface layer, alignment of the imaging area 19 and the imaging area 20 is performed as shown in FIG. 11. The alignment method is implemented by the same process as FIG. 8. The area shown in (c) of FIG. 10 is exposed in the imaging area 19, and the area shown in (d) of FIG. 10 is exposed in the imaging area 20. When the number of columns of the panel on the substrate is (4×nm) (m is an integer greater than 1 and less than n-1), the shooting area 19 is exposed to (nm) shooting areas, and the shooting area 20 is exposed to m shooting areas, and repeated exposure areas occur in the exposure of the base layer at (nm) locations. As described above, in this embodiment, it is possible to optimize the panel layout in the Y direction of the substrate 6. This improves substrate utilization efficiency even when the number of panels arranged in the Y direction is, for example, an odd number. <Second Embodiment> In the first embodiment, an example of an exposure method in a layout with different imaging field sizes in the Y direction was described. In this embodiment, with reference to FIG13 , an example of an exposure method in a layout with different imaging field sizes not only in the Y direction but also in the X direction is described. The structure of the exposure apparatus 100 is the same as in the first embodiment, so its description is omitted. Matters not discussed in this embodiment are consistent with those in the first embodiment. In this embodiment, an example of producing a panel layout in which 4 columns and 4 rows are arranged on the original plate 3 and 7 columns and 10 rows are arranged on the substrate 6 as shown in FIG12 will be described. In this case, exposure is performed using four types of shot area sizes: shot area 27 of 4 columns and 4 rows, shot area 28 of 4 columns and 2 rows, shot area 29 of 3 columns and 4 rows, and shot area 30 of 3 columns and 2 rows as shown in FIG14 . The original plate 3 for exposing the layer of the base has a structure as shown in (a) of Figure 12, and the layout shown in (b) of Figure 12 is formed on the substrate 6 using the original plate 3. Here, the original plate 3 is provided with relative position offset mark main scales 24a~24c and relative position offset mark sub-scales 25a~25c, which is different from the first embodiment. The panel unit 16 is arranged in 4 rows in the X direction and 4 columns in the Y direction, and the alignment marks 22a~22i on the original plate 3 are arranged in a grid pattern in the area that does not overlap with the panel unit 16. As shown in (a) of Figure 12, the light-shielding area 11a is provided between the alignment marks 22e-22i and 22i-22f on the original plate, away from the panel unit 16 in the Y direction. In addition, as shown in (a) of Figure 12, the light-shielding area 11b (second light-shielding area) is provided at a position away from the alignment marks 22a and 22b on the original plate in the Y direction. The relative position shift mark main scales 24a to 24c are respectively arranged near the registration marks 22g to 22i on the original plate 3, and the relative position shift mark sub-scales 25a to 25c are respectively arranged near the registration marks 22b, 25d, and 25f on the original plate 3. Here, the relative distances between the marks (between 24a to 22g, between 24b to 22h, between 24c to 22i, between 25a to 22b, between 25b to 22d, and between 25c to 22f) are exactly the same. First, the exposure method of the base layer (first layer) is described (steps S201 to S202, also referred to as the first layer exposure step). In step S201, the shot areas 27 to 30 of Figure 14 are exposed to form a base layer. In the shot areas 27 to 30, the area shown in Figure 14 is transferred to the substrate 6 using the light-shielding plate 8. In addition, the positional relationship of the shot areas during exposure is described using Figures 15 and 16. As shown in Figure 15 (a), the upper end of the shot area 29 and the upper end of the light-shielding area 11a of the shot area 27 are exposed so as to overlap, and are transferred to the substrate 6 as shown in Figure 15 (b). In order to overlap exposure with other shot areas, light-shielding areas 11a and 11b are required. The shot area 30 and the shot area 28 are also exposed in the same positional relationship. Furthermore, as shown in FIG16(a), exposure is performed so that the relative position offset mark secondary scale 25 in imaging area 27 and the relative position offset mark main scale 24 in imaging area 28 overlap, forming relative position offset marks 26a-26c on substrate 6 as shown in FIG16(b). In imaging area 28, the alignment marks 22g-i on the original plate are shielded from light to prevent double exposure of the alignment marks on the substrate. The exposure order of imaging areas 27-30 is arbitrary. In step S202, substrate 6 is transported and developed, making the alignment marks 23 on the substrate observable. Next, the exposure method of the surface layer (the second layer on the first layer) is described (steps S203 to S205, also referred to as the second layer exposure step). The structure of the original plate 3 is roughly the same as that of the original plate used in the exposure of the base layer, but the light-shielding area 11 becomes unnecessary. In step S203, alignment of the shooting areas 27 to 30 is performed. As in Example 1, alignment of the shooting area 27 and the shooting area 29 is performed for the alignment mark 23 on the substrate shown in (b) of Figure 15 formed in step S201. The alignment of the shooting area 28 is a mark corresponding to the alignment marks 22a to f on the original plate shown in (a) of Figure 12 and the alignment marks 23a to 23f on the substrate shown in (b) of Figure 16, respectively. The alignment marks 23a, 23c, and 23e on the substrate are marks formed by transferring the alignment marks 22g to i (refer to Figure 12) on the original plate when the shooting area 27 is exposed in step S201. Specifically, the alignment of shot area 28 uses marks formed by exposing different shot areas. Consequently, the relative positional offset between shot areas 27 and 28 is mistakenly detected as magnification or rotation during the alignment of shot area 28. Therefore, in step S204, the processing unit 12 measures the relative positional offset marks 26 and subtracts the relative positional offset between the shot areas. The relative positional offset between shot areas 27 and 28 is detected by simultaneously measuring the relative positional offset marks 26a-c using the off-axis measurement unit 9, the alignment measurement unit 2, and the off-axis measurement unit 9. Furthermore, the relative positional offset between shot areas 29 and 30 is detected by simultaneously measuring the relative positional offset marks 26d and e using the off-axis measurement unit 9 and the alignment measurement unit 2. However, when the alignment measurement unit 2 measures the relative positional offset marks 26, it is necessary to move the plate stage 4 to a position in an area without a pattern on the plate 3. In step S205, the correction amount for each imaging area detected in steps S203 and S204 is applied to expose imaging areas 27 to 30. At this time, the exposure order of the imaging areas is arbitrary. As described above, this embodiment can optimize the panel layout in the Y and X directions of the substrate 6. This improves substrate utilization efficiency even when the number of panels in the Y and X directions is an odd number. <Embodiment of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. Figure 17 is a flow chart of the method for manufacturing an article. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the above-mentioned exposure device 100 to obtain an exposed substrate (exposure step, step S11). In addition, it includes a step of developing the substrate conveyed in the above-mentioned step to obtain a developed substrate (development step, step S12). After the development step, it is determined whether the next layer is to be formed. If it is necessary to form it, the process returns to step S11. If it is not necessary to form it (formation of all layers is completed), the process proceeds to step S14. Furthermore, the above-mentioned manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist stripping, cutting, bonding, packaging, etc.) (processing step, step S14). The method for manufacturing an article according to this embodiment is more advantageous than conventional methods in at least one of the performance, quality, productivity, and production cost of the article. As mentioned above, although the preferred embodiment of the present invention was described, it is needless to say that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist of the invention. 3: Original plate 6: Substrate 11a: Light-shielding area 19: Shooting area (first shooting area) 20: Shooting area (second shooting area) 23a-23j: Alignment marks 100: Exposure device FIG1 is a diagram illustrating a layout with different numbers of panels in the Y direction. FIG2 is a diagram illustrating the positional relationship between alignment marks and a measuring unit. FIG3 is a diagram illustrating Comparative Example 1. FIG4 is a diagram illustrating Comparative Example 2. FIG5 is a diagram illustrating the structure of the exposure apparatus as viewed from the X direction. FIG6 is a diagram illustrating the structure of the exposure apparatus as viewed from the Y direction. FIG7 is a diagram illustrating the original plate and substrate in the first embodiment. FIG8 is a flowchart illustrating the exposure process in the first embodiment. FIG9 is a diagram illustrating the exposure method for the base layer in the first embodiment. FIG10 is a diagram illustrating the exposure method for the surface layer in the first embodiment. FIG11 is a diagram illustrating the exposure method when the number of imaging zones in the first embodiment is increased. FIG12 is a diagram illustrating the original plate and substrate in the second embodiment. FIG13 is a flowchart illustrating the exposure process in the second embodiment. FIG14 is a diagram illustrating the exposure area in the second embodiment. FIG15 is a diagram illustrating the positional relationship between the left and right imaging zones in the second embodiment. [Figure 16] is a diagram showing the positional relationship between the upper and lower imaging areas in the second embodiment. [Figure 17] is a flow chart of the method for manufacturing an article. [Figure 18] is a diagram showing a layout with different numbers of panels in the X direction. 3: Original 8: Shade 11a, 11b: shading area 16: Pattern 19: Shooting Area 22a, 22b, 22c, 22d, 22e, 22f: Alignment marks

Claims

1. An exposure method, comprising: The first layer exposure step involves exposing the pattern of the original to the first layer on the substrate while scanning the relative position of the original and the substrate in the scanning direction; and the second layer exposure step involves exposing the pattern of the original to the second layer on the first layer while scanning the relative position in the scanning direction. The exposure method is characterized in that the first layer exposure step includes: a first step of transferring a first effective area in the original, including a pattern forming area, a light-shielding area disposed at a position away from the pattern forming area in the scanning direction, and an alignment mark, to a first imaging area in the substrate; and a second step of transferring a second effective area, including a portion of the pattern forming area and a portion of the alignment mark, to a second imaging area in the substrate in a manner that repeats the area corresponding to the light-shielding area in the first imaging area.

2. The exposure method as described in Request 1, wherein, In the aforementioned second layer exposure step, the position and shape of the photographing area transferred to the aforementioned second layer are corrected in a manner that overlaps with the aforementioned first photographing area and the aforementioned second photographing area, based on the alignment marks formed on the aforementioned substrate in the aforementioned first step and the aforementioned second step.

3. The exposure method as described in claim 1, wherein, The aforementioned alignment marks include a first mark and a second mark. The first mark is a mark measured by the projection optical system of the exposure apparatus that performs the exposure by the aforementioned exposure method, and the second mark is a mark that is not measured by the projection optical system of the aforementioned exposure apparatus.

4. The exposure method as described in claim 3, wherein, The first mark and the second mark are formed in a manner that allows for simultaneous measurement without driving the first measuring unit that measures the first mark and the second measuring unit that measures the second mark.

5. The exposure method as described in claim 1, wherein, Exposure of the first and second shooting areas is performed in such a way that the size of the shooting area is different in the aforementioned scanning direction.

6. The exposure method as described in claim 5, wherein, Exposure of the first and second shooting areas is performed in a manner that makes the size of the shooting area different in a direction orthogonal to the aforementioned scanning direction.

7. The exposure method as described in claim 3, wherein, A second light-shielding area is set at a position away from the aforementioned second mark in the scanning direction.

8. An exposure apparatus, characterized in that it exposes a substrate using an exposure method as described in any one of claims 1 to 7.

9. A method for manufacturing an article, characterized in that it includes: The exposure step involves exposing the substrate using the exposure method described in any one of claims 1 to 7 to obtain an exposed substrate; The process includes a development step to develop the aforementioned exposure substrate, thereby obtaining a developed substrate, and then manufacturing an article based on the developed substrate.

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