Packaging element and manufacturing method thereof

Abstract

A packaged element and a method for manufacturing the same are provided. The packaged element includes a wafer, a color conversion layer, a protective layer, and a microlens structure. The wafer has a side surface and a top surface. The color conversion layer is disposed on the side surface and the top surface of the wafer. The color conversion layer has a side surface and a top surface. The protective layer is disposed on the side surface and the top surface of the color conversion layer. The microlens structure is disposed on the protective layer. The microlens structure includes a body and a plurality of microlenses. The body of the microlens structure is in contact with the protective layer. The body has a bottom surface. The plurality of microlenses are disposed on the bottom surface of the body. The area of ​​the top surface of one of the plurality of microlenses is larger than the area of ​​the bottom surface of that microlens.

Description

Technical Field

[0001] The present invention relates to a packaged component and a manufacturing method thereof, and more particularly to a packaged component including a microlens structure and a manufacturing method thereof. Prior Art

[0002] Existing packaged components are often arranged in an array. However, when the packaged components are arranged in an array and the pitch between the packaged components is large, problems such as poor brightness uniformity may occur.

[0003] Therefore, although existing packaged components and their manufacturing methods have gradually met their intended uses, they still do not fully meet the requirements in all aspects. Therefore, there are still some problems to be overcome regarding packaged components and their manufacturing methods. Summary of the Invention

[0004] In some embodiments, a packaged component is provided. The packaged component includes a wafer, a color conversion layer, a protective layer, and a microlens structure. The wafer has a side surface and a top surface. The color conversion layer is disposed on the side surface and the top surface of the wafer, and the color conversion layer has a side surface and a top surface. The protective layer is disposed on the side surface and the top surface of the color conversion layer. The microlens structure is disposed on the protective layer. The microlens structure includes a main body and a plurality of microlenses. The main body of the microlens structure is in contact with the protective layer. The main body has a bottom surface, and a plurality of microlenses are disposed on the bottom surface of the main body. Among them, the area of the top surface of one of the plurality of microlenses is larger than the area of the bottom surface of that one of the plurality of microlenses.

[0005] In some embodiments, a manufacturing method of a packaged component is provided. The manufacturing method includes providing a plurality of wafers on a first substrate. Forming a color conversion layer on the plurality of wafers. Forming a protective layer on the color conversion layer. Bonding a microlens structure on the protective layer. Cutting the microlens structure and the protective layer to form a plurality of packaged components on the first substrate.

[0006] The packaged component and the manufacturing method thereof disclosed herein can be applied to various types of electronic devices. To make the features and advantages of the present disclosure more obvious and understandable, various embodiments are specifically described below in conjunction with the accompanying drawings. Brief Description of the Drawings

[0007] The viewpoints of the embodiments of the present disclosure can be better understood with the following detailed description in conjunction with the accompanying drawings. It should be noted that, according to industrial standard practices, some features may not be drawn to scale. In fact, for the sake of clear description, the dimensions of different components may be increased or decreased. Figures 1 to 5 respectively show cross-sectional schematic views of different stages of a method for manufacturing a packaged component of the present disclosure according to some embodiments. Figure 6 shows a cross-sectional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 7 shows a three-dimensional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 8 shows an optical path schematic view of a packaged component of the present disclosure according to some embodiments. Figure 9 shows a three-dimensional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 10 shows a cross-sectional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 11 shows a three-dimensional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 12 shows a cross-sectional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 13 shows a cross-sectional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 14 shows a cross-sectional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 15 shows a cross-sectional schematic view of a packaged component of the present disclosure according to some embodiments. Figure 16 shows a three-dimensional schematic view of a packaging device of the present disclosure according to some embodiments. Figure 17 shows a cross-sectional schematic view of a packaging device of the present disclosure according to some embodiments. Figure 18 shows a three-dimensional schematic view of a packaging device of the present disclosure according to some embodiments. Figures 19A to 19C respectively show illuminance analysis diagrams of a packaged component of the present disclosure according to some embodiments. Figures 20A to 20C respectively show illuminance screenshot analysis diagrams of a packaged component of the present disclosure according to some embodiments. Figures 21A and 21B respectively show illuminance analysis diagrams of a packaged component of the present disclosure according to some embodiments. Embodiments

[0008] The following provides a detailed description of the packaging components of the embodiments in the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific components and arrangements described below are only for a simple and clear description of some embodiments of the present disclosure. Of course, these are only for illustration and not for limiting the present disclosure. In addition, similar and / or corresponding component symbols may be used in different embodiments to denote similar and / or corresponding components to clearly describe the present disclosure. However, the use of these similar and / or corresponding component symbols is only for a simple and clear description of some embodiments of the present disclosure, and does not represent any correlation between the different embodiments and / or structures discussed.

[0009] It should be understood that in each embodiment, relative terms may be used, for example, "lower" or "bottom" or "higher" or "top", to describe the relative relationship of one component of the figure to another component. It can be understood that if the device in the figure is flipped so that it is upside down, the component described on the "lower" side will become the component on the "higher" side. The embodiments of the present disclosure can be understood in conjunction with the figures, and the figures of the present disclosure are also regarded as part of the disclosure description.

[0010] Furthermore, when it is mentioned that a first material layer is on or over a second material layer, it may include the case where the first material layer is in direct contact with the second material layer, or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, when the first material layer is directly on the second material layer, it means that the first material layer is in direct contact with the second material layer.

[0011] In addition, it should be understood that the ordinal numbers such as "first", "second", etc. used in the specification and the claims are used to modify components, and do not themselves intend to imply or represent that the component (or components) has any previous ordinal number, nor does it represent the order of one component and another component, or the order in the manufacturing method. The use of these ordinal numbers is only to clearly distinguish a component with a certain name from another component with the same name. The claims and the specification may not use the same terms. For example, the first component in the specification may be the second component in the claims.

[0012] In some embodiments of the present disclosure, terms related to joining and connecting, such as "connect", "interconnect", "bond", etc., unless otherwise specifically defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact, with other structures disposed between these two structures. And these terms related to connection and joining may also include the situation where both structures can move, or both structures are fixed. In addition, the term "electrically connected" or "electrically coupled" includes any direct and indirect electrical connection means.

[0013] In the text, terms such as "approximate", "about", and "substantially" generally mean within 10%, or 5%, or 3%, or 2%, or 1%, or 0.5% of a given value or range. The given quantity is an approximate quantity, that is, the meaning of "approximate", "about", and "substantially" can still be implied even without specifically stating "approximate", "about", or "substantially". The term "the range is between the first value and the second value" means that the range includes the first value, the second value, and other values therebetween. Furthermore, there may be a certain error between any two numerical values or directions used for comparison. If the first numerical value is equal to the second numerical value, it implies that there may be an error of about 10%, or 5%, or 3%, or 2%, or 1%, or 0.5% between the first numerical value and the second numerical value. If the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees. If the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0014] Throughout the specification and claims of the present disclosure, certain terms are used to refer to specific components. Those of ordinary skill in the art should understand that electronic equipment manufacturers may use different names to refer to the same component. This document is not intended to distinguish components with the same function but different names. In the following specification and claims, words such as "comprising", "including", and "having" are open-ended terms, and thus should be interpreted as meaning "including but not limited to...". Therefore, when the description of the present disclosure uses the terms "comprising", "including", and / or "having", it specifies the existence of the corresponding components, regions, steps, operations, and / or elements, but does not exclude the existence of one or more corresponding components, regions, steps, operations, and / or elements.

[0015] It should be understood that, without departing from the spirit of the present disclosure, components in multiple different embodiments can be replaced, recombined, and combined to complete other embodiments. As long as the components between the embodiments do not violate the spirit of the invention or conflict with each other, they can be arbitrarily combined and used.

[0016] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure pertains. It can be understood that these terms, for example, when defining terms in a commonly used dictionary, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the present disclosure.

[0017] In the present disclosure, each direction is not limited to the three axes such as the X-axis, Y-axis, and Z-axis in a rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other, but are not limited thereto. For the convenience of description, hereinafter, the X-axis direction is the first direction D1 (width direction), the Y-axis direction is the second direction D2 (length direction), and the Z-axis direction is the third direction D3 (thickness or height direction). In some embodiments, the cross-sectional schematic diagram described herein is a cross-sectional schematic diagram of observing the XZ plane. In some embodiments, the third direction D3 may be the normal direction of the wafer.

[0018] In some embodiments, additional components can be added to the packaging components of the present disclosure. In some embodiments, some components of the packaging components of the present disclosure can be replaced or omitted. In some embodiments, additional operation steps can be provided before, during, and / or after the manufacturing method of the packaging components. In some embodiments, some of the described operation steps may be replaced or omitted, and the order of some of the described operation steps is interchangeable. In addition, it should be understood that some of the described steps may be replaced or deleted for other embodiments of the method. Furthermore, in the present disclosure, the quantity and size of each component in the drawings are only for illustration and are not used to limit the scope of the present disclosure.

[0019] Referring to FIG. 1, it shows a cross-sectional schematic diagram of different stages of a method for manufacturing a packaging element U1 of a packaging device 1 according to some embodiments of the present disclosure. As shown in FIG. 1, in some embodiments, a first substrate 12 is provided. In some embodiments, the first substrate 12 may include a silicon substrate, a glass substrate, a sapphire substrate, a ceramic substrate, a polyimide (PI) substrate, a polycarbonate (PC) substrate, a polyethylene terephthalate (PET) substrate, a polypropylene (PP) substrate, other suitable substrates, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, since the first substrate 12 can be removed subsequently, the first substrate 12 may be referred to as a temporary substrate or a sacrificial substrate.

[0020] As shown in FIG. 1, in some embodiments, a plurality of wafers 10 are provided on the first substrate 12. In some embodiments, the plurality of wafers 10 may be arranged in an array on the first substrate 12. In some embodiments, each of the plurality of wafers 10 is spaced apart from each other. In some embodiments, each of the plurality of wafers 10 may include a light-emitting diode (LED) wafer, a mini light-emitting diode (mini LED) wafer, a micro light-emitting diode (micro LED) wafer, an analogue thereof, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, each of the plurality of wafers 10 may emit blue light, ultraviolet light (UV light), or light of other suitable wavelengths.

[0021] In some embodiments, a color conversion layer 20 is formed on the plurality of wafers 10. In some embodiments, the color conversion layer 20 may be conformally formed on the plurality of wafers 10. In some embodiments, the color conversion layer 20 may cover the top surface and the side surface of each of the plurality of wafers 10. In some embodiments, the color conversion layer 20 may be formed by a dispensing process, a deposition process, other suitable processes, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the color conversion layer 20 is used to convert the light having a first wavelength emitted by the wafer 10 into light having a second wavelength, where the first wavelength is different from the second wavelength.

[0022] In some embodiments, the color conversion layer 20 may include a color conversion matrix and wavelength conversion materials dispersed in the color conversion matrix. In some embodiments, the color conversion matrix may include a transparent resin. For example, the color conversion matrix may include an acrylate-based resin, an organosiloxane-based resin, an acrylate-modified polyurethane, an acrylate-modified organosilicon-based resin, an epoxy resin, analogs thereof, or combinations thereof, but the present disclosure is not limited thereto.

[0023] In some embodiments, the wavelength conversion material may include a red light conversion material, a blue light conversion material, a green light conversion material, a yellow light conversion material, other suitable light conversion materials, or a combination thereof. In some embodiments, the red light conversion material may include red quantum dots or red phosphors, but the present disclosure is not limited thereto. For example, the red light conversion material may include (Sr,Ca)AlSiN3:Eu2+, Ca2Si5N8:Eu2+, Sr(LiAl3N4):Eu2+, manganese-doped red fluoride phosphors, analogs thereof, or a combination thereof, but the present disclosure is not limited thereto. The manganese-doped red fluoride phosphors may include K2GeF6:Mn4+, K2SiF6:Mn4+, K2TiF6:Mn4+, analogs thereof, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the blue light conversion material may include blue quantum dots or blue phosphors, but the present disclosure is not limited thereto. In some embodiments, the green light conversion material may include green quantum dots or green phosphors, but the present disclosure is not limited thereto. For example, the green light conversion material may include lutetium aluminum garnet (LuAG) phosphors, yttrium aluminum garnet (YAG) phosphors, sialon (β-SiAlON) phosphors, silicate phosphors, analogs thereof, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the yellow light conversion material may include yellow quantum dots or yellow phosphors. For example, the yellow light conversion material may include yttrium aluminum garnet (YAG) phosphors. In some embodiments, the wafer 10 may be a blue LED die, and the color conversion layer 20 may include a yellow light conversion material. For example, the yellow light conversion material may be yttrium aluminum garnet (YAG) phosphors. Or the color conversion layer 20 may include a combination of a green light conversion material and a red light conversion material. For example, the color conversion layer 20 may include green sialon phosphors and red K2SiF6:Mn4+, so that the light emitted by the wafer 10 becomes white light after passing through the color conversion layer 20. In some embodiments, the color conversion layer 20 may include a combination of a green phosphor and two red phosphors. For example, the color conversion layer 20 may include green sialon phosphors, red K2SiF6:Mn4+ and red (Sr,Ca)AlSiN3:Eu2+. In some embodiments, the color conversion layer 20 may include red quantum dots and green quantum dots. In some embodiments, the color conversion layer 20 may be a red and green quantum dot film.

[0024] In some embodiments, the color conversion layer 20 may further include diffusing particles dispersed in the encapsulation matrix. In some embodiments, the diffusing particles may include inorganic particles, organic polymer particles, or a combination thereof. For example, the inorganic particles may include silicon oxide, titanium oxide, aluminum oxide, calcium carbonate, barium sulfate, or any combination thereof, but the present disclosure is not limited thereto. For example, the organic polymer particles may include polymethyl methacrylate (PMMA), polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), polyurethane (PU), or any combination thereof, but the present disclosure is not limited thereto.

[0025] In some embodiments, a protective layer 30 is formed on the color conversion layer 20. In some embodiments, the protective layer 30 may be formed in a blanket manner on the color conversion layer 20 and the first substrate 12. In some embodiments, the protective layer 30 may cover the top surface and the side surface of the color conversion layer 20 and the top surface of the first substrate 12. In some embodiments, the protective layer 30 may include a transparent resin. For example, the protective layer 30 may include an acrylate resin, a silicone resin, an acrylate-modified polyurethane, an acrylate-modified silicone resin, an epoxy resin, a similar substance, or a combination thereof, but the present disclosure is not limited thereto.

[0026] Referring to FIG. 2, which shows a cross-sectional schematic diagram of different stages of a method for manufacturing an encapsulation element U1 of the encapsulation device 1 of the present disclosure according to some embodiments. As shown in FIG. 2, in some embodiments, a microlens structure 40 is provided. In some embodiments, the microlens structure 40 may include a main body 42 and a plurality of microlenses 44. In some embodiments, the plurality of microlenses 44 may be arranged in an array on the bottom surface of the main body 42. In some embodiments, the area of the top surface of one of the plurality of microlenses 44 may be larger than the area of the bottom surface to increase the emission angle of the light emitted by the wafer 10.

[0027] In some embodiments, the microlens structure 40 may be formed by an injection molding process, a deposition process, a cutting process, other suitable processes, or a combination thereof. In some embodiments, the microlens structure 40 may be formed by an injection molding process using a metal mold. In some embodiments, a shaped metal mold having a shape corresponding to the desired shape of the microlens structure may be first formed, and then the material of the microlens structure 40 is injection molded to integrally form the microlens structure 40. Among them, by adjusting the shape of the metal mold, the microlens structure 40 may have openings such as heat dissipation holes (as shown in FIG. 9 below). For example, since the metal mold may have protrusions corresponding to the openings, the microlens structure 40 having heat dissipation holes may be directly formed by the metal mold. In some other embodiments, after the injection molding process, a cutting process may be further performed to form openings such as heat dissipation holes in the microlens structure 40. In some other embodiments, a mold may be fabricated by a chemical etching process to accurately adjust the shape of the microlens structure 40 formed by the mold by accurately fabricating the mold. For example, the mold may include a silicon-based material (e.g., silicon (100)), and a V-shaped, inverted platform-shaped, or other shape corresponding to the microlens structure 40 may be formed by performing a chemical etching process on the silicon-based material.

[0028] In some embodiments, the microlens structure 40 may include a substrate, and the substrate may include glass or a polymer. In some embodiments, the substrate may include silicone, polyethylene terephthalate (PET), or a combination thereof. In some embodiments, the glass transition temperature (Tg) of the substrate of the microlens structure 40 may be greater than the temperature increase of the microlens structure 40 due to the heat emitted by the chip 10. In other words, the microlens structure 40 will not deteriorate or be damaged due to the heat emitted by the chip 10. For example, the glass transition temperature of the substrate of the microlens structure 40 may be greater than 100 °C, 110 °C, 120 °C, 130 °C, 140 °C, 150 °C, 200 °C, 250 °C, or greater. In some embodiments, the substrate of the microlens structure 40 may be heat-resistant silicone or heat-resistant PET.

[0029] In some embodiments, the microlens structure 40 may further include a plurality of nanoparticles, and the plurality of nanoparticles may be dispersed in a matrix. In some embodiments, the plurality of nanoparticles may include zirconium oxide (ZrO₂), titanium oxide (TiO₂), or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the nanoparticles may be used to increase the refractive index of the microlens structure 40. In some embodiments, the refractive index of the microlens structure 40 may be greater than or equal to 1.4 for refracting the light rays emitted from the wafer 10. For example, the refractive index of the microlens structure 40 may be 1.4, 1.41, 1.42, 1.43, 1.44, 1.45, 1.47, 1.49, 1.5, 1.53, 1.55, or any value between the foregoing values or any range of values composed of any values, but the present disclosure is not limited thereto. In other embodiments, the microlens structure 40 may substantially not include nanoparticles.

[0030] Referring to FIG. 3, it shows a cross-sectional schematic view of different stages of a manufacturing method of a packaging element U1 of a packaging device 1 according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 3, the microlens structure 40 shown in FIG. 2 is bonded to the structure shown in FIG. 1. In some embodiments, the microlens structure 40 is bonded to the protective layer 30 so that the microlens structure 40 contacts the protective layer 30. For example, the microlens structure 40 may be disposed on the protective layer 30, and the main body 42 of the microlens structure 40 may contact the protective layer 30. In some embodiments, the microlens structure 40 and the protective layer 30 may be bonded by an adhesive layer (not shown). For example, the adhesive layer may include an optically transparent adhesive or other suitable adhesive material. Furthermore, since the microlens structure 40 of the present disclosure may include a periodically arranged structure, even if the wafer 10 and the microlens structure 40 are not completely aligned, the optical path of the light rays emitted from the wafer 10 passing through the microlens structure 40 remains the same, so the margin of the bonding process for bonding the microlens structure 40 and the protective layer 30 can be increased.

[0031] Referring to FIG. 4, it shows a cross-sectional schematic diagram of different stages of a method for manufacturing a packaging element U1 of a packaging device 1 according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 4, a cutting process is performed along a cutting line CL to cut a microlens structure 40 and a protective layer 30, thereby forming a plurality of packaging elements U1 on a first substrate 12. The cutting process can separate the microlens structure 40 and the protective layer 30 from each other to obtain a plurality of packaging elements U1. In some embodiments, the cutting process may not cut the first substrate 12 to facilitate subsequent transfer of the packaging element U1. For example, since the first substrate 12 may not be substantially cut, the cut structure (i.e., the packaging element U1) located on the first substrate 12 can be transferred to a subsequent other substrate (e.g., the second substrate 14 shown in FIG. 5) at one time. Thus, the process time and process cost of manufacturing the packaging device 1 can be reduced. In some embodiments, the cutting process may include a diamond knife cutting process, a laser cutting process, a similar process, or a combination thereof, but the present disclosure is not limited thereto. Since the microlens structure 40 and the protective layer 30 are cut in the same process, the microlens structure 40 and the protective layer 30 may have continuously side surfaces. In some embodiments, the microlens structure 40 and the protective layer 30 have substantially coplanar side surfaces.

[0032] In some embodiments, the cutting line CL extends along the normal direction of the first substrate 12 (i.e., the third direction D3), so that the microlens structure 40 and the protective layer 30 may have continuously vertical side surfaces. In some embodiments, along the first direction D1, the upper width 40T of the microlens structure 40 may be equal to the lower width 40B of the microlens structure 40. In some embodiments, the side wall of the microlens structure 40 (e.g., the side wall 42S shown in FIG. 6) is aligned with the side wall of the protective layer 30 and has a vertical side surface.

[0033] In other embodiments, the cutting line CL has an angle (not shown) with the normal direction of the first substrate 12 (i.e., the third direction D3), so that the microlens structure 40 and the protective layer 30 may have continuously inclined side surfaces. In some embodiments, the upper width 40T of the microlens structure 40 may be smaller than the lower width 40B of the microlens structure 40 to increase the light emission angle of the packaging element U1 by providing inclined side surfaces. In some embodiments, the side wall of the microlens structure 40 (e.g., the side wall 42S shown in FIG. 6) and the side wall of the protective layer 30 may have inclined side surfaces. For example, the packaging element U1 may have a cross-sectional profile that is narrower at the top and wider at the bottom, so that the light rays emitted from the chip 10 can pass through the inclined side surface of the microlens structure 40 and be refracted, thereby achieving the effect of diffusing the light rays.

[0034] Referring to FIG. 5, it shows a cross-sectional schematic diagram of different stages of a manufacturing method of a packaging element U1 of a packaging device 1 of the present disclosure according to some embodiments. In some embodiments, as shown in FIG. 5, a plurality of packaging elements U1 are transferred onto a second substrate 14 to obtain the packaging device 1. In some embodiments, a surface-mount technology (SMT) process can be used to transfer the plurality of packaging elements U1. In some embodiments, the pitch between the plurality of packaging elements U1 on the first substrate 12 as shown in FIG. 4 can be smaller than the pitch between the plurality of packaging elements U1 on the second substrate 14 as shown in FIG. 5. In some embodiments, the second substrate 14 can be a sapphire substrate, a silicon substrate, a glass substrate, a printed circuit board (PCB), a metal substrate, a ceramic substrate, the like or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the second substrate 14 can be a rigid substrate or a flexible substrate. In some embodiments, the second substrate 14 can be a transparent substrate or an opaque substrate. Accordingly, since the microlens structure 40 of the present disclosure can increase the light-emitting angle of the wafer 10, the brightness uniformity between adjacent packaging elements U1 can be correspondingly increased.

[0035] Referring to FIG. 6, it shows a cross-sectional schematic diagram of a packaging element U1 of the present disclosure according to some embodiments. In some embodiments, the side surface 30SS of the protective layer 30 is aligned with the side surface 42SS of the main body 42. In some embodiments, the main body 42 can have a sidewall 42S and a lid 42T. In some embodiments, the sidewall 42S of the main body 42 contacts the protective layer 30, and the lid 42T is disposed on the sidewall 42S. In some embodiments, the main body 42 can have a convex shape, an inverted U shape or other suitable shapes, but the present disclosure is not limited thereto. In some embodiments, there is an accommodation space SP between the microlens structure 40 and the top surface of the protective layer 30. In some embodiments, the accommodation space SP can be filled with air, an inert gas such as helium, argon or other gases, but the present disclosure is not limited thereto. Since the gas in the accommodation space SP is heated by the heat emitted by the wafer 10, the microlens structure 40 including a matrix having a specific glass transition temperature can be prevented from deteriorating or being damaged.

[0036] In some embodiments, a plurality of microlenses 44 may be arranged in an array on the bottom surface of the cover body 42T. In some embodiments, when observed in a cross-sectional view, the area of the top surface 44TS of at least one of the plurality of microlenses 44 is larger than the area of the bottom surface 44BS, thereby increasing the emission angle of the light rays emitted from the wafer 10 passing through the microlenses 44. For example, the area of the light spot of the light rays emitted from the wafer 10 is increased, thereby achieving the effect of diffusing the light rays. In some embodiments, when observed in a cross-sectional view, at least one of the plurality of microlenses 44 may have a trapezoidal shape (as shown in FIG. 6), a triangular shape (as shown in FIG. 12), a platform shape, other shapes that are wider at the top and narrower at the bottom, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, when observed in a cross-sectional view, the shape of one of the plurality of microlenses 44 may be the same as or different from the shape of another one of the plurality of microlenses 44. In some embodiments, the shape of each of the plurality of microlenses 44 may be the same or different.

[0037] In some embodiments, when observed in a cross-sectional view, the area of the microlens structure 40 may be greater than or equal to the area of the color conversion layer 20. Therefore, the light rays emitted from the wafer 10 can pass through the color conversion layer 20, the protective layer 30, and the microlens structure 40. Thus, the light rays emitted from the wafer 10 can completely pass through the microlens structure 40, thereby increasing the emission angle of the light rays emitted from the wafer 10. In some embodiments, in the third direction D3, the side surface of the color conversion layer 20 may be substantially aligned with the inner surface of the side wall 42S of the microlens structure 40. In some other embodiments, in the first direction D1, compared with the side surface of the color conversion layer 20, the inner surface of the side wall 42S of the microlens structure 40 may be farther away from the side surface of the wafer 10. In other words, referring to FIG. 5, when observed in a cross-sectional view, the projected area of the microlens structure 40 on the second substrate 14 may be greater than or equal to the projected area of the color conversion layer 20 on the second substrate 14. Accordingly, the microlens structure 40 can completely change the optical path of the light rays emitted from the wafer 10. In some embodiments, additional microlenses may be provided on the inner surface of the side wall 42S of the microlens structure 40. In some embodiments, additional microlenses may be provided on the top surface of the cover body 42T of the main body 42 of the microlens structure 40 (as shown in FIG. 13). The material and shape of the additional microlenses may be the same as or different from the material or shape of the microlenses 44 described in the present disclosure.

[0038] Referring to FIG. 7, it shows a perspective schematic view of the packaged component U1 of the present disclosure according to some embodiments. In some embodiments, as shown in FIG. 7, a plurality of microlenses 44 are shown arranged in an array on the bottom surface of the cover body 42T. In some embodiments, when observed in a perspective view, at least one of the plurality of microlenses 44 can be a pyramid, a cone, a similar shape thereto, or a combination thereof, but the present disclosure is not limited thereto. For example, the pyramid can include an inverted triangular pyramid, an inverted quadrangular pyramid, an inverted pentagonal pyramid, other similar shapes, or a combination thereof, but the present disclosure is not limited thereto.

[0039] Referring to FIG. 8, it shows a schematic optical path diagram of the packaged component of the present disclosure according to some embodiments. In some embodiments, when observed in a sectional view, the top surface 44TS of the microlens 44 has a first width w1. In some embodiments, the first width w1 can be greater than or equal to 0.05 mm and less than or equal to 1.2 mm. Since each microlens 44 has the function of deflecting light, when the size of the horizontal width w5 of the wafer 10 is fixed, setting a larger number of microlenses 44 can improve the uniformity of light. When the first width w1 of the microlens 44 is less than 0.05 mm, even if more microlenses 44 are set, the influence of the microlenses 44 on improving the light uniformity and the emission angle is less significant, and at the same time, the accuracy requirements for manufacturing the microlenses 44 are greatly increased, resulting in a decrease in the yield rate of the microlenses 44 and an increase in cost. When the first width w1 of the microlens 44 is greater than 1.2 mm, when the size of the horizontal width w5 of the wafer 10 is fixed, the number of microlenses 44 is insufficient, and it is difficult to effectively improve the light uniformity and the emission angle. For example, the first width w1 can be 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, or any value between the foregoing values or a value range composed of any values, but the present disclosure is not limited thereto.

[0040] In some embodiments, when observed in a cross-sectional view, the bottom surface 44BS of the microlens 44 has a second width w2. In some embodiments, the second width w2 can be greater than or substantially equal to 0 and less than or equal to 1.2 mm. For example, the second width w2 can be 0, 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, or any value between the foregoing values or a range of values composed of any values, but the present disclosure is not limited thereto. In some embodiments, when the second width w2 of the microlens 44 is substantially equal to 0 and observed in a cross-sectional view, the microlens 44 can have an inverted triangular shape. In some embodiments, when the second width w2 is greater than 1.2 mm, since the first width w1 must be greater than the second width w2, the number of microlenses 44 is insufficient, making it difficult to effectively improve the light uniformity and the emission angle.

[0041] In some embodiments, when observed in a cross-sectional view, the left end point of the bottom surface 44BS of the microlens 44 and the left end point of the top surface 44TS of the adjacent microlens 44 have a third width w3. In some embodiments, the third width w3 can be greater than or equal to 0.05 mm and less than or equal to 1.2 mm. For example, the third width w3 can be 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, or any value between the foregoing values or a range of values composed of any values, but the present disclosure is not limited thereto. In some embodiments, the third width w3 is less than the first width w1 and greater than the second width w2. When the third width w3 is less than 0.05 mm, the size of the microlens 44 is too small, which increases the accuracy requirements for manufacturing the microlens 44 and reduces the yield. When the sizes of the second width w2 and the third width w3 are too close, the inclined surface of the microlens 44 deviates, thereby reducing the light diffusing ability of the microlens 44. For example, the slope of the side surface of the microlens 44 becomes too large. In some embodiments, because the third width w3 is less than the first width w1 and greater than the second width w2, when the third width w3 is greater than 1.2 mm, the number of microlenses 44 is insufficient, making it difficult to effectively improve the light uniformity and the emission angle.

[0042] In some embodiments, along the first direction D1, one of the plurality of microlenses 44 is spaced from another of the plurality of microlenses 44 by a fourth width w4. In other words, along the first direction D1, adjacent microlenses 44 among the plurality of microlenses 44 are spaced from each other by a fourth width w4. In some embodiments, the fourth width w4 may be greater than or equal to 0 and less than or equal to 1.2 mm. For example, the fourth width w4 may be 0, 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, or any value between the foregoing values or any range of values composed of any values, but the present disclosure is not limited thereto. In some embodiments, when the fourth width w4 is 0, each of the plurality of microlenses 44 is in contact with each other. In some embodiments, when the fourth width w4 is greater than 1.2 mm, since the gap between adjacent microlenses 44 is too large, the number of microlenses 44 is insufficient, making it difficult to effectively improve the light uniformity and the emission angle.

[0043] In some embodiments, as shown in FIG. 8, the first width w1, the second width w2, and the fourth width w4 may affect the luminous flux of the light passing through the microlens 44 along the third direction D3. Therefore, while maintaining a certain forward light (light along the third direction D3) flux, when the fourth width w4 is larger, the second width w2 may be smaller, and conversely, when the second width w2 is larger, the fourth width w4 may be smaller. In some embodiments, the spot shape and the emission angle of the light emitted by the chip 10 may be adjusted by adjusting the ratio of the sum of the second width w2 and the fourth width w4 to the third width w3 ((second width w2 + fourth width w4) / third width w3). For example, when the ratio of the sum of the second width w2 and the fourth width w4 to the third width w3 is too large, the forward light flux of the packaged component U1 is insufficient. When the ratio of the sum of the second width w2 and the fourth width w4 to the third width w3 is too large, the forward light flux of the packaged component U1 is too high. Similarly, as shown in FIG. 8, the slope of the side surface 44SS of the microlens 44 affects the luminous flux of the light passing through the microlens 44 along a direction having an angle with the third direction D3. In some embodiments, the ratio range of the sum of the second width w2 and the fourth width w4 to the third width w3 is between 0.2 and 0.6.

[0044] In some embodiments, along the third direction D3, the bottom surface 44BS of the plurality of microlenses 44 is spaced apart from the wafer 10 (or the color conversion layer 20) by a distance d. In some embodiments, the range of the spacing distance d is between 0 and 10 times the horizontal width w5. When the spacing distance d is greater than 10 times the horizontal width w5, the light source of the wafer 10 is approximately a point source at this time, and the light diffusion effect of the microlens structure 40 is less significant. When the size of the microlens structure 40 of the present disclosure and the horizontal width w5 size of the wafer 10 are within the same order of magnitude, that is, the ratio of the sizes of the two can be equal to or less than 10, so the microlens 44 can expand the angle of the light emitted from the wafer 10 and make the light more uniform. In some embodiments, along the first direction D1, the wafer 10 (or the color conversion layer 20) has a horizontal width w5. In some embodiments, the range of the horizontal width w5 is between 0.05 mm and 90 mm. In some embodiments, the ratio of the distance d to the horizontal width w5 (distance d / horizontal width w5) can be greater than or equal to 0.3 and less than or equal to 3. For example, the ratio of the distance d to the horizontal width w5 can be 0.3, 0.5, 0.8, 1, 1.5, 2, 2.5, 3 or any value between the foregoing values or any range of values composed of any values, but the present disclosure is not limited thereto. When the ratio of the distance d to the horizontal width w5 is less than 0.3, the microlens 44 still has the effect of diffusing light, but it may cause the heat energy generated by the wafer 10 to be unable to be effectively discharged, resulting in deterioration or damage of the microlens structure 40. In addition, when the microlens structure 40 is too close to the wafer 10 (the ratio of the distance d / horizontal width w5 is relatively small), the number of microlenses 44 corresponding within the horizontal width w5 also decreases. When the ratio of the distance d to the horizontal width w5 is greater than 3, the microlens 44 still has the effect of diffusing light, but in order to achieve the same effect of diffusing light and uniform light, the size of the microlens structure 40 also needs to be increased at the same time, resulting in a significant increase in the material usage of the microlens structure 40 and an increase in cost. When the distance d is larger, the spot area of the light emitted from the wafer 10 can be increased.

[0045] In some embodiments, when the distance d between the chip 10 (or the color conversion layer 20) and the bottom surface 44BS of the microlens 44 is greater than 10 times the horizontal width w5, the chip 10 can be regarded as a point light source, and the light diffusion effect of the microlens structure 40 is less significant. When the distance d is less than 10 times the horizontal width w5, the chip 10 is not regarded as a point light source. In other words, the chip 10 acts as a light source that substantially occupies a specific volume, and thus effectively changes the light emission behavior of the chip 10 (such as light uniformity, emission angle) by means of the microlens 44. To illustrate in detail the optical path of the light emitted by the chip 10, the chip 10 can emit a light source P1 and a light source P2, but the present disclosure is not limited thereto. In some embodiments, the light L1 emitted by the light source P1 can pass through the microlens structure 40 along the third direction D3. In some embodiments, the light L2 emitted by the light source P2 passes through the microlens 44 and is refracted. Accordingly, the optical path of the light L2 emitted from the light source P2 can be equivalent to the optical path of the light emitted from a light source P3 at a distance (beyond the light emission range of the chip 10), thereby achieving the effect of diffusing the light. Thus, the microlens structure 40 can increase the emission angle of the light emitted by the chip 10.

[0046] Referring to FIGS. 9 and 10, a perspective schematic view and a cross-sectional schematic view of the packaging element U2 of the packaging device 2 according to some embodiments of the present disclosure are shown. Among them, FIG. 10 shows a cross-sectional schematic view taken along the section A-A shown in FIG. 9. In some embodiments, as shown in FIG. 9, the microlens structure 40 may further include heat dissipation holes 52 and 54. In some embodiments, the heat dissipation holes 52 and 54 may be disposed on the main body 42 of the microlens structure 40, and the heat dissipation holes 52 and 54 may penetrate through the main body 42 of the microlens structure 40. In other words, the accommodation space SP can be fluidly connected to the external environment through the heat dissipation holes 52 and 54. Accordingly, the heat dissipation holes 52 and 54 can dissipate the heat generated by the chip 10 to the external environment, thereby avoiding deterioration or damage of the microlens structure 40 and / or reducing the operating environment temperature of the chip 10. Therefore, the reliability and optical characteristics of the packaging element U2 can be improved.

[0047] FIG. 11 shows a perspective schematic view of the packaged component U2 of the present disclosure according to some embodiments. In some embodiments, a packaged component U2 may include at least one heat dissipation hole, but the present disclosure is not limited thereto. In some embodiments, a packaged component U2 may include any positive integer number of heat dissipation holes. For example, a packaged component U2 may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or more heat dissipation holes. In some embodiments, the heat dissipation hole 52 and the heat dissipation hole 54 may be disposed on the first sidewall of the main body 42 of the microlens structure 40, and the heat dissipation hole 54 and the heat dissipation hole 56 may be disposed on the second sidewall adjacent to the first sidewall of the main body 42 of the microlens structure 40. In some embodiments, the heat dissipation hole 52 and the heat dissipation hole 54 may be arranged along the first direction D1, the heat dissipation hole 52 and the heat dissipation hole 56 may be arranged along the second direction D2, and the first direction D1 intersects the second direction D2.

[0048] FIG. 12 shows a cross-sectional schematic view of the packaged component U3 of the present disclosure according to some embodiments. In some embodiments, the microlens 44 of the microlens structure 40 of the packaged component U3 may be an inverted triangle.

[0049] FIG. 13 shows a cross-sectional schematic view of the packaged component U4 of the present disclosure according to some embodiments. In some embodiments, the microlens structure 40 of the packaged component U4 may further include an additional microlens 46, and the microlens 46 and the microlens 44 may be respectively disposed on opposite surfaces of the main body 42. In other words, the main body 42 may be between the microlens 46 and the microlens 44.

[0050] FIG. 14 shows a cross-sectional schematic view of the packaged component U5 of the present disclosure according to some embodiments. Among them, FIG. 14 continues FIG. 3, and FIG. 14 shows the packaged component U5 after being cut along different cutting lines. In some embodiments, as shown in FIG. 14, the packaged component U5 may include two wafers 10. Accordingly, the number of executions of the SMT process can be reduced.

[0051] FIG. 15 shows a cross-sectional schematic view of the packaged component U6 of the present disclosure according to some embodiments. Among them, FIG. 15 continues FIG. 2, and FIG. 15 shows the packaged component U6 after the microlens structures 40 of different sizes are bonded to the protective layer 30 and then cut. In some embodiments, as shown in FIG. 15, the packaged component U6 may include two wafers 10, and the two wafers 10 share the same microlens structure 40. In some embodiments, the microlens structure 40 corresponding to the interface between two adjacent wafers 10 may substantially not have a partition wall. Accordingly, the packaged component U6 can increase the density of the wafers 10, which is beneficial to miniaturization applications. For example, it is beneficial to be applied to automotive lighting modules.

[0052] FIG. 16 shows a perspective schematic view of the packaging device 3 of the present disclosure according to some embodiments. In some embodiments, the packaging device 3 may include a second substrate 14 and a plurality of packaging elements U, and the plurality of packaging elements U may be arranged in an array on the second substrate 14. In some embodiments, at least one of the plurality of packaging elements U may be any one of the packaging elements U1 to U6. In some embodiments, the plurality of packaging elements U may include the packaging elements U1, U2, U3, U4, U5, U6, or a combination thereof, or may further include other suitable packaging elements.

[0053] FIG. 17 shows a cross-sectional schematic view of the packaging device 4 of the present disclosure according to some embodiments, and FIG. 18 shows a perspective schematic view of the packaging device 4 of the present disclosure according to some embodiments. In some embodiments, the packaging device 4 may further include an optical layer 60, and the optical layer 60 may be disposed on the plurality of packaging elements U. In some embodiments, there is an optical distance (OD) between the bottom surface of the optical layer 60 and the top surface of the second substrate 14. In some embodiments, the optical distance may be greater than or equal to 4 mm and less than or equal to 12 mm. For example, the optical distance may be 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, or any value or range of values between the foregoing values, but the present disclosure is not limited thereto. In some embodiments, the optical layer 60 may include a diffuser film, a brightness enhancement film (BEF), a dual brightness enhancement film (DBEF), analogs thereof, other suitable film layers, or combinations thereof, but is not limited thereto. In some embodiments, the optical layer 60 may include a diffuser plate 62, a diffuser film 64, a brightness enhancement film 66, and a dual brightness enhancement film 68. In some embodiments, the diffuser plate 62 may be disposed on the plurality of packaging elements U, the diffuser film 64 may be disposed on the diffuser plate 62, the brightness enhancement film 66 may be disposed on the diffuser film 64, and the dual brightness enhancement film 68 may be disposed on the brightness enhancement film 66. In some embodiments, the packaging device 4 may be used as a mini LED backlight module.

[0054] In some embodiments, the packaging components U1 to U6 and the packaging devices 1 to 4 described in this disclosure can be used in any combination. For example, any one of the packaging devices 1 to 4 can include any one of the packaging components U1 to U6 or any combination thereof. In some embodiments, any one of the packaging components U1 to U6 and the packaging devices 1 to 4 described in this disclosure can be applied to a backlight module (e.g., the backlight module of a liquid crystal display), an illumination light-emitting module (e.g., a vehicle light-emitting module), or other modules, but this disclosure is not limited thereto.

[0055] The following analyzes Example 1, Comparative Example 1, and Comparative Example 2. Example 1 is the packaging device 1 including the packaging component U1. Among them, the horizontal width w5 is 1.2 mm, the first width w1 is 0.3 mm, the sum of the second width w2 and the fourth width w4 is 0.1 mm, and the third width w3 is 0.2 mm, and the optical distance is 10 mm. Comparative Example 1 is a packaging device with the same other conditions but without the micro-lens structure 40. Comparative Example 2 is a packaging device with the same other conditions, but the top surface of the micro-lens structure 40 has a concave surface recessed in the direction of the wafer 10, or the micro-lens structure 40 is a Fresnel lens with a concave surface.

[0056] Figures 19A to 19C respectively show the illuminance analysis diagrams of the packaging components of this disclosure according to some embodiments. Among them, Figure 19A shows Example 1, Figure 19B shows Comparative Example 1, and Figure 19C shows Comparative Example 2. As shown in Figures 19A to 19C, the spot size of Example 1 is significantly larger than that of Comparative Example 1 and Comparative Example 2. Thus, this disclosure can significantly increase the illuminance radius and is applicable to the backlight module.

[0057] Figures 20A to 20C respectively show the cross-sectional illuminance analysis diagrams of the packaging components of this disclosure according to some embodiments. Among them, Figure 20A shows Example 1, Figure 20B shows Comparative Example 1, and Figure 20C shows Comparative Example 2. Generally speaking, when the wafers 10 are arranged periodically, different light patterns will be emitted according to the types of the wafers 10, such as the shapes of different light waves, and the superimposed light pattern can be calculated based on the wave equation of light, thereby calculating the degree of light uniformity. As shown in Figure 20A, the wave equation of the light in Example 1 is substantially about I(x) = cos 2x, where I is the illuminance and x is the distance. Therefore, the light pattern of Example 1 is complete and uniform. However, as shown in Figure 20B, the light pattern of Comparative Example 1 is too concentrated, and as shown in Figure 20C, the edge of the light pattern of Comparative Example 2 is not smooth. Thus, the light patterns of Comparative Example 1 and Comparative Example 2 are incomplete and non-uniform.

[0058] Figures 21A and 21B respectively show the illuminance analysis diagrams of the packaging components of the present disclosure according to some embodiments. Among them, Figure 21A shows Example 1, and Figure 21B shows Comparative Example 1. Furthermore, Table 1 can be further paired, which shows the spot size values of Example 1 and Comparative Example 1. Table 1 Example 1 Comparative Example 1 Spot size 90% 15.3 8.2 80% 20.3 12 70% 25.5 16.1 60% 29.3 20.4 50% 31.8 24.1 40% 36.8 29.8 30% 42 34.6 20% 51.5 40.9 10% 68 56.2 Illuminance peak (cd / m2) 1508.616 818.326 Among them, for example, the simulation results of Example 1 show that when the optical distance (OD) is 10 mm and the spot size is 90%, the illumination radius reaches 15.3 mm, thus significantly improving the illumination radius and being applicable to the backlight module. Compared with the simulation results of Comparative Example 1, when the optical distance (OD) is 10 mm and the spot size is 90%, the intensity radius is only 8.2 mm. In Example 1 of this case, the illumination radius is significantly improved. For example, the simulation results of Example 1 show that when the optical distance (OD) is 10 mm and the spot size is 50%, the illumination radius reaches 31.8 mm, thus significantly improving the illumination radius and being applicable to the backlight module. Compared with the simulation results of Comparative Example 1, when the optical distance (OD) is 10 mm and the spot size is 50%, the intensity radius is only 24.1 mm. In Example 1 of this case, the illumination radius is significantly improved.

[0059] In summary, since the packaging component can include a microlens structure, the optical characteristics of the packaging component can be improved by means of the microlens structure. For example, the brightness uniformity and / or the emission angle can be increased. For example, the present disclosure can adjust the size of the microlens structure (for example, the area of the top surface, the area of the bottom surface), the material of the microlens structure (for example, the substrate, the nanoparticles), the relative relationship between adjacent microlens structures (for example, the spacing width), and the relative relationship between the microlens structure and other components (for example, the distance). Furthermore, the packaging component can include heat dissipation holes to reduce the influence of the heat generated by the chip on the microlens structure, thereby improving the light emission efficiency of the chip. In addition, since the packaging device can include a plurality of packaging components, the optical characteristics of the packaging device can also be correspondingly improved.

[0060] The scope of protection described in the present disclosure is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person having ordinary skill in the art can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosure of the present disclosure. As long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the foregoing processes, machines, manufactures, compositions of matter, devices, methods, and steps. Any embodiment or claim of the present disclosure does not have to achieve all the purposes, advantages, and / or features disclosed in the present disclosure.

[0061] The above outlines several embodiments so that those with ordinary knowledge in the technical field to which this disclosure pertains can better understand the viewpoints of the embodiments of this disclosure. Those with ordinary knowledge in the technical field to which this disclosure pertains should understand that they can design or modify other processes and structures based on the embodiments of this disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. Those with ordinary knowledge in the technical field to which this disclosure pertains should also understand that such equivalent processes and structures do not deviate from the spirit and scope of this disclosure, and they can make various changes, substitutions, and replacements without departing from the spirit and scope of this disclosure.

[0062] 1, 2: Encapsulation device 10: Chip 12: First substrate 14: Second substrate 20: Color conversion layer 30: Protection layer 30SS, 42SS, 44SS: Side surface 40: Microlens structure 40T: Upper width 40B: Lower width 42: Main body 42T: Cover body 42S: Side wall 44, 46: Microlens 44BS: Bottom surface 44TS: Top surface 52, 54, 56: Heat dissipation holes 60: Optical layer 62: Diffusion plate 64: Diffusion film 66: Brightness enhancement film 68: Double brightness enhancement film A - A: Cross-section CL: Cutting line d: Distance D1: First direction D2: Second direction D3: Third direction L1, L2: Light rays OD: Optical distance P1, P2, P3: Light sources SP: Accommodation space U, U1, U2, U3, U4, U5, U6: Encapsulation components w1: First width w2: Second width w3: The third width w4: The fourth width w5: The horizontal width

Claims

1. A packaged element, comprising: A wafer having a side surface and a top surface; a color conversion layer disposed on the side surface and the top surface of the wafer, the color conversion layer having a side surface and a top surface; a protective layer disposed on the side surface and the top surface of the color conversion layer; and a microlens structure disposed on the protective layer, comprising: a body in contact with the protective layer, the body having a bottom surface; and a plurality of microlenses disposed on the bottom surface of the body; wherein the area of ​​a top surface of one of the plurality of microlenses is larger than the area of ​​a bottom surface of that one of the plurality of microlenses, wherein a sidewall of the microlens structure is aligned with a sidewall of the protective layer, and the sidewall of the microlens structure has a vertical side surface.

2. The package element of claim 1, wherein the bottom surface of the plurality of microlenses is spaced apart from the wafer by a distance, and the wafer has a horizontal width, and the ratio of the distance to the horizontal width is greater than or equal to 0.3 and less than or equal to 3.

3. The package element as claimed in claim 1, wherein each of the plurality of microlenses is in contact with each other.

4. The package element of claim 1, wherein one of the plurality of microlenses is spaced apart from another of the plurality of microlenses by a width.

5. The packaging element of claim 1, wherein the microlens structure includes a substrate, and the substrate includes glass or a polymer.

6. The encapsulation element of claim 5, wherein the polymer comprises silicone, polyethylene terephthalate (PET), or a combination thereof.

7. The packaging element of claim 5, wherein the microlens structure further comprises a plurality of nanoparticles, and the plurality of nanoparticles are dispersed in the matrix.

8. The package element as claimed in claim 7, wherein the plurality of nanoparticles comprises zirconium oxide, titanium oxide, or a combination thereof.

9. The package element as claimed in claim 1, wherein the microlens structure further comprises: A heat dissipation hole is provided on the main body and penetrates through the main body.

10. A method for manufacturing a packaged component, comprising: Provide a plurality of chips on a first substrate; A single-color conversion layer is formed on the plurality of wafers; A protective layer is formed on the color conversion layer; A microlens structure is bonded to the protective layer; the microlens structure and the protective layer are cut to form a plurality of package elements on the first substrate, wherein one sidewall of the microlens structure is aligned with one sidewall of the protective layer, and the sidewall of the microlens structure has a vertical side surface.

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