Copper raw material with improved dissolution rate and copper sulfate solution, copper foil, anode plate, lithium secondary battery manufactured using the same

Abstract

A copper raw material is provided. The copper raw material has a porosity of 60% to 90%: said porosity is measured by loading the copper raw material into a container and calculated by the following Equation 1. [Equation 1] Porosity = (Total pore volume / Container volume) × 100

Description

Copper raw material with improved dissolution rate, copper sulfate solution, copper foil, anode plate, and lithium secondary battery manufactured using the same The present invention relates to a copper raw material used for manufacturing copper foils for manufacturing various products such as anodes for secondary batteries and flexible printed circuit boards. Copper foils are used to manufacture various products such as cathodes for secondary batteries and flexible printed circuit boards (FPCBs). These copper foils are manufactured by an electroplating method in which an electrolytic solution is supplied between an anode and a cathode, and then an electric current is passed. When manufacturing copper foils in this way through an electroplating method, copper foil manufacturing equipment is used. The copper foil manufacturing equipment manufactures copper foils by electroplating using an electroplating solution formed by dissolving a copper raw material. Here, if the dissolution rate of the copper raw material dissolved by the copper foil manufacturing equipment is slower than the manufacturing rate (electroplating rate) of the copper foil manufacturing equipment for producing copper foils, the productivity of the copper foils will decrease. Therefore, in order to increase the productivity of copper foils, it is necessary to develop a copper raw material that can improve the dissolution rate. The present invention is designed to solve the above needs and provides a copper raw material that can prevent the productivity of copper foils from decreasing due to the dissolution rate. In addition to the object of the present invention mentioned above, those of ordinary skill in the art will clearly understand additional objects and features of the present invention from the following description of the present invention. An embodiment of the present invention provides a copper raw material having a porosity of 60 to 90%. The porosity is measured by loading the copper raw material into a container and obtained by calculation using the following Equation 1. [Equation 1] Porosity = (Volume of total pores / Volume of the container) × 100 An embodiment of the present invention provides a copper sulfate solution prepared using the copper raw material. An embodiment of the present invention provides a copper foil manufactured using the copper raw material. An embodiment of the present invention provides an anode plate for a lithium secondary battery produced using the above copper raw material. An embodiment of the present invention provides a lithium secondary battery produced using the copper raw material. Multiple embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described below are for illustrative purposes only to help clearly understand the present invention and do not limit the scope of the present invention. Since the shapes, sizes, ratios, angles, and quantities disclosed for describing multiple embodiments of the present invention in the drawings are examples, the present invention is not limited to the details shown in the drawings. Throughout the specification, the same elements may be denoted by the same symbols. When a detailed description of related known technologies is determined to possibly obscure the gist of the present invention unnecessarily, the detailed description of the related known technologies will be omitted. When using the expressions "comprising", "having", and "made of" mentioned in this text, other parts may be added unless the expression "only" is used. When an element is expressed in the singular, it may include the plural unless otherwise specified. In addition, when interpreting an element, even if there is no separate and explicit description, it is still interpreted as including an error range. When describing positional relationships, for example, if the positional relationship between two parts is described as "on", "under", "beside", one or more other parts may be located between the two parts unless "immediately" or "directly" is used. For the convenience of describing the relationship between an element or component shown in a schematic diagram and another element or component, spatial-related terms such as "below", "lower part", "above", "upper part", etc. may be used. Spatial-related terms should be understood to include different directions of the element during use or operation in addition to the directions shown in the schematic diagram. For example, when the element shown in the schematic diagram is flipped, the element described as "under" or "below" another element may be placed "above" that another element. Therefore, the exemplary term "under" may include both upward and downward directions. Similarly, the exemplary terms "on" or "upper part" may include both upward and downward directions. When describing temporal relationships, for example, if the temporal precedence relationship is described as "after", "before", it may be non - continuous unless the expression "immediately" or "directly" is used. Although terms such as first, second, etc. are used to describe various components, these components are not limited to these terms. These terms are only used to distinguish one component from another. Therefore, within the technical concept of the present invention, the first component mentioned below may be the second component. The term "at least one" should be understood to include all possible combinations of one or more related items. For example, the meaning of "at least one of the first item, the second item, and the third item" may represent all possible combinations of two or more of the first item, the second item, and the third item, as well as each of the first item, the second item, and the third element. The various features of the various embodiments of the present invention may be combined with each other partially or wholly, can be interlocked and driven technically in various ways, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship. The copper raw material 10 according to the present invention is used to manufacture copper foil, and the copper foil is used to manufacture various products such as cathodes for secondary batteries and flexible printed circuit boards (FPCBs). The copper raw material 10 according to the present invention can be manufactured into an electroplating solution through dissolution and supplied to a copper foil manufacturing device, and then is manufactured into copper foil by the copper foil manufacturing device through an electroplating method. According to the present invention, while a plurality of copper raw materials 10 are loaded into a dissolution tank (not shown), the copper raw materials 10 can be produced into an electroplating solution by being dissolved by a high-temperature dissolution solution supplied to the dissolution tank. An electrolytic solution can be used as the dissolution solution. For example, the dissolution solution can be a sulfuric acid solution. In this case, if the solution does not flow smoothly through the copper raw material (10) according to the present invention, since the copper raw material (10) according to the present invention disposed at the lower part of the dissolution tank cannot be dissolved smoothly, the dissolution rate may become slow. For example, if the porosity of the copper raw material (10) according to the present invention loaded into the dissolution tank is too small, since the copper raw material (10) according to the present invention disposed at the lower part of the dissolution tank cannot be dissolved smoothly, the dissolution rate may become slow. On the other hand, if the solution flows through the copper raw material (10) according to the present invention too fast, the contact time and reaction area between the solution and the copper raw material (10) according to the present invention will decrease, and thus the dissolution rate may become slow. For example, if the porosity of the copper raw material (10) according to the present invention loaded into the dissolution tank is too large, since the contact time and reaction area between the solution and the copper raw material (10) according to the present invention decrease, the dissolution rate may become slow. In consideration of this, the copper raw material (10) according to the present invention can be implemented to ensure the fluidity of the solution, the contact time with the solution, and the reaction area with the solution. Referring to FIGS. 1 to 3, according to an embodiment of the present invention, the copper raw material 10 may have a plurality of particles 20, and the major axis 11 of each particle 20 may be 10 to 120 mm. Therefore, the copper raw material 10 according to the present invention can increase the dissolution rate, thereby helping to increase the productivity of copper foil. If the major axis 11 of the particles 20 of the copper raw material 10 is less than 10 mm, the porosity of the copper raw material 10 will be very small, and since the copper raw material 10 according to the present invention placed under the dissolution tank cannot be dissolved smoothly, the dissolution rate may be very slow. On the other hand, if the major axis (11) of the particles (20) of the copper raw material (10) exceeds 120 mm, the porosity of the copper raw material 10 will become very large, and by reducing the contact time and reaction area between the copper raw material (10) and the solution, the dissolution rate may become slow. According to an embodiment of the present invention, the copper raw material 10 has a plurality of particles 20, and the minor axis 12 of each particle 20 may be 4 to 50 mm. Therefore, the copper raw material 10 according to the present invention can increase the dissolution rate, thereby helping to increase the productivity of copper foil. If the minor axis (12) of the particles (20) of the copper raw material (10) is less than 4 mm, the porosity of the copper raw material (10) will be very small, and since the copper raw material (10) according to the present invention placed under the dissolution tank cannot be dissolved smoothly, the dissolution rate may be very slow. On the other hand, if the minor axis (12) of the particles (20) of the copper raw material (10) exceeds 50 mm, the porosity of the copper raw material (10) will become very large, and by reducing the contact time and reaction area between the copper raw material (10) and the solution, the dissolution rate may slow down. According to an embodiment of the present invention, the copper raw material 10 has a plurality of particles 20, and the thickness 13 of each particle 20 can be 2 to 8 mm. Therefore, since the copper raw material 10 according to the present invention can improve the dissolution rate, it can contribute to increasing the productivity of copper foil. If the thickness 13 of the particles 20 of the copper raw material 10 is less than 2 mm, the porosity of the copper raw material 10 will be very small, and because the copper raw material 10 according to the present invention placed under the dissolution tank cannot be smoothly dissolved, the dissolution rate may be very slow. On the other hand, if the thickness (13) of the particles (20) of the copper raw material (10) exceeds 8 mm, the porosity of the copper raw material (10) will become very large, and by reducing the contact time and reaction area between the copper raw material (10) and the solution, the dissolution rate may slow down. Herein, the major axis 11, the minor axis 12, and the thickness 13 can be measured according to the following measurement criteria. The major axis 11, the minor axis 12, and the thickness 13 can be measured using the CD-APX of Mitutoyo Vernier Calipers. The method for measuring the major axis 11, the minor axis 12, and the thickness 13 will be described in detail below. Referring to FIGS. 2 and 3, the major axis 11 can be the length at which two points based on the measurement plane MP are separated from each other by the maximum linear distance. After selecting a candidate plane perpendicular to the widest orthogonal direction, the measurement plane MP can be determined as one of the candidate plane and the plane falling within the ±20° angular range. When the major axis 11 is determined, a dotted line connecting the two points serving as the reference of the major axis 11 can be determined in the major axis direction (LD axis direction). Referring to FIGS. 2 and 3, the minor axis 12 can be the length at which two points based on the minor axis direction (SD axis direction) are separated from each other by the minimum linear distance. The minor axis direction (SD axis direction) can be the axis direction perpendicular to the major axis direction (LD axis direction). When the length of the major axis 11 is N (N is a real number greater than 0), the minor axis 12 can be the length at which two points based on the minor axis direction (SD axis direction) within the effective portion 11a belonging to 0.3N to 0.7N with respect to the major axis direction (LD axis direction) are separated from each other by the minimum linear distance. Therefore, the portions of the long axis direction (LD axis direction) that are less than 0.3N and greater than 0.7N can be excluded from the measurement object of the short axis 12. Considering the fact that the two ends are usually formed too short or too long, and through this fact, even if a sufficient dissolution rate can be ensured, the amount excluded due to the two ends can still be reduced. Therefore, according to the present invention, even if a sufficient dissolution rate can be ensured, the copper raw material 10 can contribute to reducing the manufacturing cost of the copper foil by reducing the waste amount. Referring to FIGS. 2 and 3, the thickness 13 can be the length in the thickness direction (TD axis direction). The thickness direction (TD axis direction) can be the axis direction perpendicular to each of the long axis direction (LD axis direction) and the short axis direction (SD axis direction). The thickness 13 can be the average value of the thickness values measured M times (M is a natural number) in the thickness direction (TD axis direction). This is partly considering that there are many variations in the thickness, and through this, although a sufficient dissolution rate can be ensured, the amount excluded due to partial thickness variations can be reduced. Therefore, even if a sufficient dissolution rate can be ensured, the copper raw material 10 according to the present invention can contribute to reducing the manufacturing cost of the copper foil by reducing the waste amount. For example, M can be 5, and in this case, the thickness 13 can be the average value of the thickness values obtained by measuring five different parts. According to an embodiment of the present invention, the charging density of the copper raw material 10 can be 800 to 3800 kg / m 3 . Therefore, the copper raw material 10 according to the present invention can increase the dissolution rate, thereby contributing to increasing the productivity of the copper foil. According to an embodiment of the present invention, the charging density is measured by loading the copper raw material into a container and obtained by calculation using the following Equation 2. [Equation 2] Charging density = Weight of the raw material loaded in the container (kg) / Volume of the container (V) Specifically, the charging density is measured by loading the copper raw material into a container with a volume of 20 L. The container for measuring the charging density is not limited to this, and containers of various volumes can be used to measure the charging density. When the charging density of the copper raw material (10) is less than 800 kg / m 3 When this occurs, since the contact time and reaction area between the copper raw material (10) and the dissolution solution are reduced, the dissolution rate may slow down. On the other hand, when the charging density of the copper raw material 10 is greater than 3800 kg / m 3At this time, the copper raw material 10 placed at the bottom of the dissolution tank cannot be smoothly dissolved, and due to the limitation of the flow rate that the raw material 10 can supply, the dissolution rate may be very slow. According to an embodiment of the present invention, the porosity of the copper raw material 10 can be 60 to 90%. Thereby, the copper raw material 10 according to the present invention can improve the dissolution rate, which helps to increase the productivity of copper foil. According to an embodiment of the present invention, the porosity is measured by loading the copper raw material into a container and obtained by calculation using the following Equation 1. [Equation 1] Porosity = (Volume of total pores / Volume of the container) × 100 The volume of the container for measuring the porosity should be such that the copper raw material can be loaded, and containers of various volumes can be used to measure the porosity. On the other hand, if the porosity of the copper raw material (10) is less than 60%, the copper raw material (10) according to the present invention placed under the melting tank cannot be smoothly dissolved, and the possible flow rate that the copper raw material (10) can supply may be restricted, which may slow down the dissolution rate. When the porosity of the copper raw material (10) exceeds 90%, the dissolution rate may slow down because the contact time and reaction area between the copper raw material (10) and the dissolution solution decrease. According to an embodiment of the present invention, the static angle of the copper raw material 10 can be 37° or less. Thereby, the copper raw material 10 according to the present invention can improve the dissolution rate, which helps to increase the productivity of copper foil. The static angle of the copper raw material 10 is measured by putting the copper raw material 10 into a cylindrical container with a diameter of 1000 mm. At this time, the static angle represents the inclination angle when the copper raw material 10 accumulates in the cylindrical container and the inclination angle remains unchanged and starts to flow downward. In addition, the container for measuring the static angle is not restricted, and containers of various volumes can be used to measure the static angle. When the static angle of the copper raw material (10) exceeds 37°, the loading height of the copper raw material (10) near the entrance in the cylindrical melting tank for wet dissolution may increase, thereby restricting the input amount of the raw material (10). In addition, when the static angle of the copper raw material (10) exceeds 37°, this may cause an uneven flow path and may slow down the dissolution rate. According to an embodiment of the present invention, the copper raw material 10 may contain 5 to 200 ppm of lead (Pb) element. When the concentration of the lead (Pb) element in the copper raw material (10) exceeds 200 ppm, the lead (Pb) element will form lead sulfate (PbSO 4) is deposited in the form and deposited in the stripping tank. In the stripping tank, the part as the anode is located below, and the part as the cathode is located above. A copper sulfate solution is supplied to the stripping tank between the anode and the cathode, and lead sulfate (PbSO 4 ) affects the flow of the copper sulfate solution, and at the same time causes current non-uniformity, making the weight of the copper foil electroplated on the cathode non-uniform in the width direction. On the other hand, when the concentration of lead (Pb) element in the copper raw material (10) is less than 5 ppm, the lead (Pb) element will electro-deposit unevenly on the cathode in the form of lead sulfate (PbSO 4 ) and current non-uniformity will occur due to the uneven electro-deposition layer. Therefore, the weight of the copper foil electroplated on the anode is non-uniform in the width direction. At the same time, the copper raw material 10 according to the present invention can have a copper purity of more than 99% and can be formed without oil. The copper raw material 10 according to the present invention can be implemented as a closed wire or can be implemented by cutting a closed wire according to standard conditions. According to an embodiment of the present invention, the raw material 10 is a single crystal and can have an anisotropic structure. That is, the copper raw material 10 according to the present invention can be implemented as an anisotropic raw material. In this case, among the raw materials manufactured by the manufacturing equipment, the anisotropic raw materials that meet the above standard conditions rather than being manufactured with a specific shape can correspond to the copper raw material 10 according to the present invention, and the dissolution rate can be improved through an anisotropic form. For example, the copper raw material 10 according to the present invention can be implemented by melting low-purity copper containing impurities and a high-purity copper melt through a dry refining process and then cooling the high-purity copper melt using a granulation device. In this case, among the anisotropic raw materials formed by the granulation device, the raw materials that meet the above standard conditions can correspond to the copper raw material 10 according to the present invention. At the same time, the granulation cosmetic device can be implemented to form anisotropic raw materials using water. Therefore, the copper raw material 10 according to the present invention can be formed without oil and does not require separate pretreatment. At the same time, as described above, the copper raw material 10 according to the present invention can be used to prepare the copper sulfate solution of the present invention. The copper sulfate solution according to the present invention can be used as an electroplating solution in the preparation of copper foil. At the same time, as described above, the copper raw material 10 according to the present invention can be used to manufacture the copper foil according to the present invention. Meanwhile, as described above, the copper raw material (10) according to the present invention can be used to manufacture the anode plate for a lithium secondary battery according to the present invention. Meanwhile, as described above, the copper raw material (10) according to the present invention can be used to manufacture the lithium secondary battery according to the present invention. Hereinafter, a method for manufacturing the copper raw material 10 of the present invention will be described in detail. The copper raw material 10 can be prepared by a manufacturing method including a melting step and a cooling step. Specifically, the copper that has undergone the melting step comes out from a perforated plate having a certain diameter of a manufacturing apparatus (not shown), and the molten liquid that has left the perforated plate is subjected to the cooling step to form the copper raw material. At this time, the perforated plate reciprocates left and right in the inlet and repeatedly blocks and opens the perforated surface. Specifically, as soon as the perforated plate opens, the copper melt will freely drop, and the opening time of the perforated plate can be appropriately adjusted by adjusting the reciprocating speed of the perforated plate. In the melting step, copper melted at 1130 °C or higher, preferably at 1130 to 1200 °C, is sprayed through a nozzle and a solution is supplied. Here, when the temperature during copper melting is less than 1130 °C, there will be problems that the copper melting cannot be fully carried out and the solution cannot be sufficiently sprayed and supplied through the nozzle. On the other hand, when the temperature during copper melting exceeds 1200 °C, there will be a problem that the melted copper forms copper raw materials with an overly thick shape. In the cooling step, cooling water can be used to cool the melted copper. The inlet temperature of the cooling water is 18 to 20 °C, and the temperature difference between the outlet temperature of the cooling water and the inlet temperature of the cooling water is 2 °C or less. In this case, the inlet temperature of the cooling water represents the temperature of the cooling water inlet pipe, and the outlet temperature of the cooling water represents the temperature of the cooling water outlet pipe. Here, when the inlet temperature of the cooling water is less than 18 °C, the inlet temperature of the cooling water will be very low, and there will be a problem that the melted copper forms copper raw materials with an overly fine shape. On the other hand, when the inlet temperature of the cooling water exceeds 20 °C, the inlet temperature of the cooling water will be very high, and there will be a problem that the melted copper forms copper raw materials with an overly thick shape. In addition, when the temperature difference between the inlet and outlet of the cooling water exceeds 2 °C, the difference between the inlet temperature and the outlet temperature of the cooling water will be very large, and the size difference between the copper raw materials produced at a relatively high temperature and those produced at a relatively low temperature will be very large. Therefore, the porosity of the raw materials may become too low. The size of the copper raw material can be adjusted by adjusting the opening time of the perforated plate, and the opening time of the perforated plate is 0.1 to 0.4 seconds. When the opening time of the perforated plate is less than 0.1 second, the opening time of the perforated plate is very short, such that the molten copper cannot sufficiently come out from the perforated plate. Therefore, the molten copper is formed from overly fine copper raw materials. On the other hand, if the opening time of the perforated plate exceeds 0.4 second, then the opening time of the perforated plate is very long, and there is a problem of excessive release of molten copper from the perforated plate, resulting in the formation of overly thick copper raw materials, which may cause the porosity of the copper raw materials to increase excessively and deteriorate the surface characteristics per unit weight. The copper raw materials of the present invention can be prepared by the above method. Hereinafter, the present invention will be described in detail with reference to examples and comparative examples. However, the following examples are only used to help understand the present invention, and the scope of the present invention is not limited to these examples. Examples 1 to 3 and Comparative Examples 1 to 5 By using a manufacturing apparatus (not shown), the temperature during copper melting, the cooling water inlet temperature, the cooling water outlet temperature, the cooling water inlet / outlet temperature difference, the opening time of the perforated plate, and the perforation diameter of the perforated plate are adjusted to prepare copper raw materials corresponding to Examples 1 to 3 and Comparative Examples 1 to 5 having the characteristics described in Table 1. The control of the temperature during copper melting, the cooling water inlet temperature, the cooling water outlet temperature, the cooling water inlet / outlet temperature difference, the opening time of the perforated plate, and the perforation diameter of the perforated plate for preparing Examples 1 to 3 and Comparative Examples 1 to 5 having the characteristics described in Table 1 is shown in Table 2 below. [Table 1] [Table 2] For the copper raw materials of Examples 1 to 3 and Comparative Examples 1 to 5 thus prepared, i) the specifications of the major axis, minor axis, and thickness, ii) the packing density, iii) the porosity, iv) the permissible maximum flow rate, and v) the dissolution rate were confirmed. i) Specifications of the major axis, minor axis, and thickness The copper raw materials have a plurality of particles, and the major axis, minor axis, and thickness represent the major axis, minor axis, and thickness of the particles. The major axis is the length separated by the maximum linear distance between two points based on the measurement plane (MP) of the copper raw material. The minor axis is the length separated by the minimum linear distance between two points based on the minor axis direction (SD axis direction). The thickness corresponds to the average value of the thickness of the copper raw materials corresponding to the major axis range and minor axis range in each of the examples and comparative examples. Measure the major axis, minor axis, and thickness using the CD-APX of Mitutoyo Vernier Calipers. ii) Measurement of packing density The packing density is measured by loading the copper raw material into a container and obtained by calculation using Equation 2 below. [Equation 2] Packing density = Weight of the raw material loaded in the container (kg) / Volume of the container (V) Specifically, the packing density is measured by loading the copper raw material into a container with a volume of 20 L. iii) Measurement of porosity The porosity can be measured by loading the copper raw material into a container and obtained by calculation using Equation 1 below. [Equation 1] Porosity = (Volume of total pores / Volume of the container) × 100 iv) Measurement of the static angle The static angle represents the angle of inclination when the copper raw material accumulates in a cylindrical container and the angle of inclination remains unchanged and starts to flow downward. Specifically, it represents the angle of inclination when the copper raw material accumulates in a cylindrical container with a diameter of 1000 mm and the angle of inclination remains unchanged and starts to flow downward. iv) Measurement of the maximum allowable flow rate When a container with a volume of 20 L and a mesh bottom is filled with the raw material and water is supplied using a pump that can control the supply flow rate, the supply flow rate is gradually increased, and the flow rate when the water supplied to the container no longer flows downward in the container and overflows, divided by the cross-sectional area of the container, is the maximum allowable flow rate. v) Measurement of the dissolution rate The dissolution rate in Table 1 corresponds to the average value of the dissolution rates of the copper raw material 10 corresponding to the standard conditions of each example and comparative example. Use a measuring device with a melting tank, a storage tank, a circulation pump, a cooling pipeline, and a blower to measure the dissolution rate in Table 1. In the measuring device, the dissolution tank is used to accommodate the copper raw material, and can be implemented such that the solution is sprayed through the upper nozzle and supplied to the dissolution tank of the measuring device. In the measuring device, the storage tank can be implemented such that the solution in contact with the copper raw material in the dissolution tank is collected in the lower tank, and the collected solution can be supplied back to the dissolution tank through the circulation pump. In the measuring device, the cooling pipeline is used to re-condense the water vapor evaporated from the solution, and can be implemented such that the cooling water flows countercurrently in the discharge pipe of the storage tank. In the measuring device, the blower can be implemented to assist the oxidation reaction of copper by supplying air to the melting tank. Using the measuring device implemented as described above, a sulfuric acid solution was prepared by introducing 12 kg of sulfuric acid (95%) into 40 L of pure water (deionized water), maintaining the liquid temperature at 50°C, the circulation flow rate of the circulation pump at 25 L / min, the air supply volume of the blower at 50 to 90 L / min, the temperature of the cooling water in the cooling pipe at 4°C, the flow rate of the cooling water in the cooling pipe at 5 L / min, and inputting 13 kg of copper raw material to prepare a copper sulfate solution. In this case, the sulfuric acid solution can correspond to the dissolution solution, and the copper sulfate solution can correspond to the electroplating solution. By measuring the concentration of the copper sulfate solution generated when the measuring device operates for 24 hours under the relevant experimental conditions, the dissolution rate in Table 1 was obtained, with the unit of g / L / hr. As can be seen from Table 2, when the temperature difference between the inlet and outlet of the cooling water exceeds 2°C (Comparative Example 1), the thickness of the manufactured copper raw material will increase excessively, the porosity will be too low, and the dissolution rate cannot proceed smoothly. When the inlet temperature of the cooling water is too high (Comparative Example 2), the minor axis and thickness of the manufactured copper raw material will be too large, the porosity will be too low, and the dissolution rate cannot proceed smoothly. When the temperature during the melting of copper is too low (Comparative Example 3), the major axis of the manufactured copper raw material will be too small, the porosity will be too low, and the dissolution rate cannot be achieved smoothly. When the inlet temperature of the cooling water is too low (Comparative Example 4), the major axis of the manufactured copper raw material will be too small, the porosity will be too low, and the dissolution rate cannot be achieved smoothly. When the opening time of the perforated plate is too long (Comparative Example 5), the major axis, minor axis, and thickness of the manufactured copper raw material will all increase excessively, the porosity will be too low, and the dissolution rate cannot proceed smoothly. According to the present invention, the following advantageous effects can be obtained. According to the present invention, the dissolution rate can be improved by ensuring the fluidity of the dissolution solution, the contact time with the dissolution solution, the reaction area with the dissolution solution, etc. Therefore, the present invention can contribute to increasing the productivity of copper foil. It is obvious to those of ordinary skill in the art to which the present invention pertains that the above-described present invention is not limited to the above embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made to the present invention without departing from the spirit or scope of the present invention. Therefore, the scope of the present invention is defined by the claims, and all changes and modifications derived from the meaning, scope, and equivalent concepts of the claims are intended to fall within the scope of the present invention. 10: Copper raw material 11: Major axis 11a: Effective part 12: Minor axis 13: Thickness LD: Axis MP: Measuring plane SD: Axis TD: Axis The above and other objects, features, and other advantages of the present invention will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a schematic diagram of a copper raw material according to the present invention. Figure 2 is a plane sectional view for explaining the major axis and minor axis of the copper raw material according to the present invention. Figure 3 is a plane sectional view for explaining the thickness of the copper raw material according to the present invention. 10: Copper raw material

Claims

1. A copper raw material having a porosity of 60 to 90%: the porosity is measured by loading the copper raw material into a container and calculated by the following Equation 1: [Equation 1] Porosity = (Total pore volume / Container volume) × 100, wherein the copper raw material has a plurality of particles, and the major axis of the particles is 10 mm to 120 mm, the minor axis of the particles is 4 mm to 50 mm, the thickness of the particles is 2 mm to 8 mm, and the copper raw material comprises 5 to 200 The lead (Pb) element in ppm, wherein the major axis is the length of two points separated from each other by the maximum straight-line distance based on a measuring plane, the minor axis is the length of two points separated from each other by the minimum straight-line distance based on a minor axis direction perpendicular to a major axis direction connecting two points that serve as a reference for the major axis, and when the length of the major axis is N, and N is a real number greater than 0, the minor axis is the length of two points separated from each other by the minimum straight-line distance based on the minor axis direction within the effective portion of the minor axis direction relative to the major axis direction of 0.3N to 0.7N, wherein the resting angle of the copper material is 37° or less, and the resting angle represents the angle of inclination when the copper material is accumulated in a cylindrical container with a diameter of 1000 mm and the angle of inclination remains unchanged and begins to flow downward.

2. The copper raw material as claimed in claim 1, wherein the charging density of the copper raw material is 800 to 3800 kg / m3: the charging density is measured by loading the copper raw material into a container and calculated by the following Equation 2: [Equation 2] Charging density = weight of raw material loaded in the container (kg) / volume of the container (V).

3. The copper raw material as described in claim 1, wherein the copper raw material is a single crystal and has an anisotropic structure.

4. The copper raw material as claimed in claim 1, wherein the thickness is based on the length of a thickness direction perpendicular to each of the major axis direction and the minor axis direction.

5. The copper raw material as described in claim 4, wherein the thickness is the average of the thickness values ​​measured M times in the thickness direction, and M is a natural number.

6. The copper raw material as described in claim 1, wherein the copper purity of the copper raw material is 99% or higher and it is free of oil.

7. A copper sulfate solution manufactured using a copper raw material as described in any one of claims 1 to 6.

8. A copper foil manufactured using a copper raw material as described in any one of claims 1 to 6.

9. An anode plate for a lithium secondary battery manufactured using a copper raw material as described in any one of claims 1 to 6.

10. A lithium secondary battery manufactured using a copper raw material as described in any one of claims 1 to 6.

11. A copper raw material having a plurality of particles, wherein the major axis of the particles is 10 mm to 120 mm, the minor axis of the particles is 4 mm to 50 mm, the thickness of the particles is 2 mm to 8 mm, and the copper raw material contains 5 to 200 ppm of lead (Pb), wherein the major axis is the length of two points separated from each other by the maximum straight-line distance based on a measuring plane, the minor axis is the length of two points separated from each other by the minimum straight-line distance based on a minor axis direction perpendicular to a major axis direction connecting two points serving as a reference for the major axis, wherein when the length of the major axis is N, and N is a real number greater than 0, the minor axis is the length of two points separated from each other by the minimum straight-line distance based on the minor axis direction within an effective portion of 0.3N to 0.7N relative to the major axis direction, wherein the resting angle of the copper raw material is 37° or less, and the resting angle represents the angle of inclination when the copper raw material is accumulated in a cylindrical container with a diameter of 1000 mm and the angle of inclination remains unchanged and begins to flow downward.

12. The copper raw material as claimed in claim 11, wherein the thickness is based on the length of a thickness direction perpendicular to each of the major axis direction and the minor axis direction.

13. The copper raw material as claimed in claim 12, wherein the thickness is the average of the thickness values ​​measured M times in the thickness direction, and M is a natural number.

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