High-frequency telecommunications probe testing device with signal interference shielding function

Abstract

A high-frequency telecommunications probe testing device with signal interference shielding function includes a first testing unit, a pressing unit, a plurality of shielding components, and a second testing unit, which are fixed on a substrate. One side of the substrate is provided with a plurality of pin electrodes and a central electrode. The first testing unit includes a test socket and a plurality of conductive components, which are arranged according to the arrangement of each pin electrode. At least one blocking groove is provided between adjacent conductive components to install a shielding component. In addition to increasing the distance between the extension lines of each conductive component, the shielding components can also discharge unwanted stray signals of high-frequency signals to eliminate signal crosstalk. Furthermore, the special shape and structure design of the conductive components is not easily damaged, thus extending their service life and improving the accuracy of high-frequency detection.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor testing equipment, and in particular to a high-frequency telecommunications probe testing device with signal interference shielding function. It utilizes multiple conductive components and shielding components to increase the distance between the extension lines of each probe, and uses these shielding components to discharge unwanted stray electrical signals of high-frequency signals to eliminate signal crosstalk and improve the accuracy of electrical condition detection. Furthermore, the structural design of these conductive components can also significantly extend their service life. Prior Technology

[0002] Note that a semiconductor chip contains an integrated circuit, which extends outwards with a plurality of electrical pins. Electrical tests are typically performed on these pins to closely approximate real-world usage conditions. Therefore, a test socket is often used to simulate this state. During testing, pressure is applied to press the semiconductor chip into the corresponding position within the test socket, causing the electrical pins to electrically connect with designated electrodes within the socket. To facilitate easy removal after testing, the test socket usually has a plurality of electrical connection elements corresponding to the semiconductor chip. These elements possess electrical and elastic properties, allowing the semiconductor chip to be held upright for easy removal after testing.

[0003] During testing, the semiconductor chip is pressed downwards with even pressure, causing the electrical pins to contact each electrical connection element and form an electrical connection. This indicates that the electrical characteristics of the semiconductor chip are normal. If the electrodes cannot evenly press the device under test, resulting in poor contact, normal signal values ​​cannot be obtained from the electrical connection elements, indicating that the integrated circuit or the electrical pins of the semiconductor chip may be faulty. For example, U.S. Patent No. 7,753,693 B2, "Contacts and electrical connecting apparatus using the same", and No. 7,255,576 B2, "Kelvin contact module for a microcircuit test system", disclose the structures of two different shapes of electrical connection elements. In Case No. 7,753,693 B2, the test element is a curved support member with an elastic body (such as rubber or urethane) inside. When the test element is compressed, the support member rotates along its curved surface, compressing the elastic body. Therefore, after the test, the test element returns to its original position due to the restoring force of the elastic body. In Case No. 7,255,576 B2, the support member is also curved and is positioned within a curved groove. An elastic body (also made of rubber or urethane) is located within the curved groove. When the test element is compressed, the support member moves along the curved groove, compressing the elastic body. Therefore, after the test, the test element also returns to its original position due to the restoring force of the elastic body. However, in the aforementioned patent cases, the resilience of these elastomers is directly related to their elastic modulus. To balance resilience and service life during use, they must be specially customized, increasing usage costs. Furthermore, the tendency of these elastomers to undergo permanent deformation after compression is also a significant problem. Moreover, the accuracy of the tests is closely related to the design of these electrical connection components. As transmission speeds increase, higher bandwidths are used. If the test socket is not designed to handle high-frequency signal interference, it may be unable to provide higher bandwidth testing, or even obtain accurate detection results. Therefore, improvements are necessary.

[0004] In view of this, the creator has meticulously researched and developed a high-frequency telecommunications probe testing device with signal interference shielding function. It has specially designed multiple pins of a special shape and a shielding metal rod corresponding to the pins. In addition to effectively extending the lifespan, it can also shield high-frequency signal interference to improve the accuracy of electrical condition detection, and its design can greatly extend the service life. Summary of the Invention

[0005] One objective of this invention is to provide a high-frequency telecommunications probe testing device with signal interference shielding function, comprising a first testing unit, a pressing unit, a plurality of shielding components, and a second testing unit. The first testing unit includes a test socket and a plurality of conductive components, which are arranged according to the arrangement of each pin electrode. At least one blocking groove is provided between adjacent conductive components to install the shielding component. In addition to increasing the distance between the extension lines of each conductive component, the shielding components are used to discharge unwanted stray electrical signals of the high-frequency signal to eliminate signal crosstalk and improve the accuracy of high-frequency detection. Furthermore, the special shape and structure design of the conductive components not only makes them less susceptible to damage, thus extending their service life and improving the accuracy of detection, but also enhances their effectiveness.

[0006] To achieve the above objectives, the present invention provides a high-frequency telecommunications probe testing device with signal interference shielding function, which is fixed on a substrate. One side of the substrate has a plurality of lead electrodes and a central electrode for testing the electrical state of a plurality of telecommunications probes disposed on a device under test. The device includes: a first testing unit fixed on the side of the substrate corresponding to the lead electrodes; the first testing unit includes a test socket and a plurality of conductive elements; a fixing groove is provided in the center of the test socket; a plurality of first slots are provided in the fixing groove corresponding to the arrangement of each lead electrode; a mounting hole is provided in the center of the fixing groove; and at least one barrier groove is provided between adjacent first slots to increase the shielding capability. The distance between the extension lines of each conductive element is specified. Each conductive element is movably disposed within each first slot and contacts each pin electrode. Each conductive element forms a positioning recess. A pressing unit is disposed within the fixing slot. The pressing unit includes an upper cover, a lower cover, a plurality of first elastic elements, and a plurality of pressing elements. The lower cover also has a plurality of second slots corresponding to the arrangement of each pin electrode, such that the first slots and the second slots are opposite to each other. During installation, each first elastic element and each pressing element is respectively installed in each second slot. The upper cover then closes the top surface of the lower cover, clamping the first elastic elements and the pressing elements within the slot. Between the upper cover and the lower cover, one end of the pressing member protrudes from the bottom surface of the lower cover. When the pressing unit is installed in the first test unit, each pressing member is used to press one end of each conductive element, so that the bottom surface of each conductive element contacts the pin electrode to form electrical conductivity. The other end of each conductive element is tilted upward toward the mounting hole to contact the electrical probes around the device under test for electrical state testing. A plurality of shielding members are disposed in the barrier grooves to shield the conductive elements from high-frequency signal interference, allowing the conductive elements to be tested smoothly. A second test unit is disposed in the mounting hole, and the second test unit includes a central electrode holder, a central cover plate, and a plurality of shielding members. A second elastic element is used to fix the central electrode holder to the central electrode. A groove is formed in the center of the central electrode holder. A plurality of first through holes are provided in the groove corresponding to the device under test. A plurality of second through holes are provided on the central cover plate corresponding to the first through holes. When the central cover plate is installed on the central electrode holder, a test space is formed. Each first through hole corresponds to each second through hole to form an accommodating space, so that the second elastic elements are respectively placed into the accommodating spaces. Their two ends pass through each first through hole and each second through hole to form an electrical connection with the central electrode, so as to contact the electrical probes in the center of the device under test for testing the electrical state.

[0007] In one embodiment, the conductive component of this invention is a V-shaped metal sheet structure, and the three ends of the conductive component respectively form a pressing portion, a first contact portion, and a second contact portion. The pressing portion and the second contact portion are opposite to each other and a positioning recess is formed between them. A positioning protrusion is provided on one side of the lower cover corresponding to each pressing component. When the pressing unit is installed in the first test unit, the positioning protrusion tightly abuts against the positioning recess, and the pressing component presses down on the pressing portion. The first contact portion passes through the bottom surface of the first slot and contacts a pin electrode to form electrical conductivity, causing the second contact portion to tilt upwards towards the mounting hole. When the device under test is placed in the... During testing in the test space, the component under test is pressed down so that the surrounding telecommunication probes make contact with each of the second contact portions. Furthermore, the surface of the first contact portion has a curved structure to maintain smooth swing when the pressing portion and the second contact portion are pressed against each other. In addition, one end of the pressing member is provided with a positioning portion corresponding to the first elastic element so that one end of the first elastic element is positioned and sleeved on the positioning portion, and the other end of the pressing member is provided with a hemispherical structure corresponding to the surface of the pressing portion to ensure contact when the first elastic element is pressed. In addition, a limiting portion is provided on one side of the positioning portion of this invention, and a limiting ring edge is provided in the second slot corresponding to the limiting portion.

[0008] In another embodiment, each of the present invention's barrier grooves is arranged horizontally, and each shielding member is a metal cylindrical structure placed within each barrier groove; or each barrier groove is arranged vertically and arranged in a plurality at intervals, and each shielding member is a metal cylindrical structure placed within each barrier groove. Furthermore, each shielding member is made of beryllium copper alloy, possessing characteristics such as high efficiency in eliminating telecommunication noise, high heat dissipation, high hardness, corrosion resistance, wear resistance, and non-magnetic properties that do not interfere with high-frequency telecommunication transmission. Additionally, for stability after assembly and during use, the first and second perforations of the present invention are stepped holes, with the diameter at the outlet being smaller than the diameter inside. The second elastic elements are designed with diameters at both ends smaller than the central diameter, ensuring that the second elastic elements, after being installed in the accommodating space, can maintain their position and control their deformation under compression. Simple Explanation of the Diagram

[0009] Figure 1 is a three-dimensional exploded view of a preferred embodiment of this invention. Figure 2 is a partially enlarged structural schematic diagram of a preferred embodiment of this invention (I). Figure 3 is a partially enlarged structural schematic diagram (II) of a preferred embodiment of this invention. Figure 4 is a partially enlarged structural schematic diagram of a preferred embodiment of this invention (III). Figure 5 is a cross-sectional view of the preferred embodiment of this invention. Figure 6 is a schematic diagram of the state when the preferred embodiment of this invention is used (I). Figure 7 is a schematic diagram (II) of the state when the preferred embodiment of this invention is used. Figure 8 is a structural schematic diagram of another preferred embodiment of this invention. Implementation

[0010] To ensure that your review committee can clearly understand the content of this work, please refer to the following explanations and illustrations.

[0011] Please refer to Figures 1-4, 5, 6-7, and 8, which are exploded perspective views of a preferred embodiment of the invention, enlarged structural schematic diagrams of various parts, combined sectional views, schematic diagrams of various states when the preferred embodiment of the invention is in use, and structural schematic diagrams of another preferred embodiment. As shown in the above figures, the high-frequency telecommunications probe testing device 1 with signal interference shielding function of the present invention includes a first testing unit 11, a pressing unit 12, a plurality of shielding components 13, and a second testing unit 14, which are used to be fixed on a substrate 2. One side of the substrate 2 is provided with a plurality of pin electrodes 21 and a central electrode 22 for testing the electrical state of a plurality of telecommunications probes 31 disposed on a device under test 3.

[0012] The first test unit 11 is fixed on one side of the substrate 3 corresponding to the pin electrodes 21. The first test unit 11 includes a test base 111 and a plurality of conductive elements 112. The test base 111 has a fixing groove 1111 in the center. The fixing groove 1111 has a plurality of first slots 11111 corresponding to the arrangement of each pin electrode 21. A mounting hole 11112 is provided in the center of the fixing groove 1111. At least one barrier groove 11113 is provided between two adjacent first slots 11111 to increase the distance between the extension lines of each conductive element 112. Each conductive element 112 is movably disposed in each first slot 11111 and contacts each pin electrode 21. Each conductive element 112 forms a positioning recess 1121. It should be noted that each conductive element 112 is a V-shaped metal sheet structure, and the three ends of each conductive element 112 respectively form a pressing part 1122, a first contact part 1123 and a second contact part 1124. The pressing part 1122 and the second contact part 1124 are opposite to each other and the positioning recess 1121 is formed therebetween. The surface of the first contact part 1123 is a curved structure so as to maintain smooth swing when the pressing part 1122 and the second contact part 1124 are pressed against each other.

[0013] The pressing unit 12 is disposed within the fixing slot 1111, and the pressing unit 12 includes an upper cover 121, a lower cover 122, a plurality of first elastic elements 123, and a plurality of pressing members 124. The lower cover 122 is also provided with a plurality of second slots 1221 corresponding to the arrangement of each pin electrode 21, so that the first insertion slots 11111 and the second slots 1221 are opposite to each other. During installation, each first elastic element 123 and each pressing member 124 are respectively installed in each second slot 1221, and then the upper cover 121 closes and covers the top surface of the lower cover 122. The first elastic element 123 and the pressing element 124 are sandwiched between the upper cover 121 and the lower cover 122, and one end of the pressing element 124 extends through the bottom surface of the lower cover 122. When the pressing unit 12 is installed on the first test unit 11, each pressing element 124 is used to press one end of each conductive element 112, so that the bottom surface of each conductive element 112 contacts the pin electrode 21 to form electrical conduction, and the other end of each conductive element 112 is tilted upward toward the mounting hole 11112 to contact the electrical probes 31 around the device under test 3 for testing the electrical state. Furthermore, a positioning protrusion 1222 is provided on one side of the lower cover 122 corresponding to each pressing member 124. When the pressing unit 12 is installed on the first test unit 11, the positioning protrusion 1222 closely abuts against the positioning recess 1121, and the pressing member 124 presses down on the pressing part 1122. The first contact part 1123 passes through the bottom surface of the first slot 11111 and contacts the pin electrode 21 to form electrical conduction, so that the second contact part 1124 tilts upward toward the mounting hole 11112. When the device under test is placed into the test space for testing, the device under test 3 is pressed down so that the surrounding electrical probes 31 contact each of the second contact parts 1124 respectively. In addition, one end of the pressing member 124 is provided with a positioning part 1241 corresponding to the first elastic element 123, so that one end of the first elastic element 123 is positioned and sleeved on the positioning part 1241, and the other end of the pressing member 124 is provided with a hemispherical structure corresponding to the surface of the pressing part 1122, so as to ensure contact when the first elastic element 123 is pressed; and a limiting part 1242 is provided on one side of the positioning part 1241, and a limiting ring edge 12211 is provided in the second slot 1221 corresponding to the limiting part 1242.

[0014] Each shielding element 13 is disposed within each blocking groove 11113 to shield the conductive components 112 from interference by high-frequency signals, enabling the conductive components 112 to undergo electrical testing smoothly. As shown in Figure 1, each blocking groove 11113 is arranged horizontally, and each shielding element 13 is a metal cylindrical structure placed within each blocking groove 11113. As shown in Figure 7, each blocking groove 11113 is arranged vertically and is arranged in a plurality at intervals, and each shielding element 13 is a metal cylindrical structure placed within each blocking groove 11113. Furthermore, each shielding element 13 is made of beryllium copper alloy, possessing characteristics such as high efficiency in eliminating telecommunication noise, high heat dissipation, high hardness, corrosion resistance, wear resistance, and non-magnetic properties that do not interfere with high-frequency telecommunication transmission.

[0015] The second test unit 14 is disposed within the mounting hole 11112, and the second test unit 14 includes a central electrode holder 141, a central cover plate 142, and a plurality of second elastic elements 143, so that the central electrode holder 141 is fixed on the central electrode 22. A groove 1411 is formed in the central part of the central electrode holder 141, and a plurality of first through holes 1412 are provided in the groove 1411 corresponding to the test element 3. A plurality of second through holes 1421 are provided on the central cover plate 142 corresponding to the first through holes 1412. When the central cover plate 142 is installed on the central electrode holder 141, a test space 144 is formed. Each first through hole 1412 corresponds to each second through hole 1421 to form a receiving space 145, so that the second elastic elements 143 are respectively placed into the receiving spaces 145. Their two ends protrude from each first through hole 1412 and each second through hole 1421 to form electrical conductivity with the central electrode 22, so as to contact the electrical probes 31 in the center of the device under test 3 for electrical state testing. It should be noted that the first through holes 1412 and the second through holes 1421 are all stepped holes, and the diameter of the outlet is smaller than the diameter of the interior. The second elastic elements 143 are designed with a diameter at both ends smaller than the diameter at the center.

[0016] In summary, the conductive components 112 of the high-frequency telecommunications probe testing device 1 of this invention are arranged according to the arrangement of each pin electrode 21. A shield 13 is provided between adjacent conductive components 112. In addition to increasing the distance between the extension lines of each conductive component 112, the shield 13 is used to discharge unwanted stray electrical signals of high-frequency signals to eliminate signal crosstalk and improve the accuracy of electrical state detection. Furthermore, the special shape and structure design of the conductive components not only makes them less susceptible to damage, but also achieves the purpose of extending service life and improving detection accuracy.

[0017] However, the above description is merely a preferred embodiment of this invention and is not intended to limit the scope of this invention. Therefore, any equivalent or easy changes made by those skilled in the art without departing from the spirit and scope of this invention should be covered within the patent scope of this invention.

[0018] 1: High-frequency telecommunications probe testing device 11: First Test Unit 111: Test socket 1111: Fixing slot 11111: First Slot 11112: Mounting hole 11113: Barrier groove 112: Conductive components 1121: Positioning recess 1122: Pressing Department 1123: First Contact Section 1124: Second Contact Section 12: Suppression Unit 121: Top Cover 122: Bottom Cover 1221: Second slot 12211: Limiting ring edge 1222: Positioning convex part 123: First elastic element 124: Pressed parts 1241: Positioning Department 1242: Limiting part 13: Shielding components 14: Second Test Unit 141: Central electrode holder 1411: Groove 1412: First perforation 142: Central cover plate 1421: Second perforation 143: Second elastic element 2:Substrate 21: Pin Electrode 22: Central Electrode 3: Component under test 31: Telecommunications pin

Claims

1. A high-frequency telecommunications probe testing device with signal interference shielding function, fixed on a substrate, wherein one side of the substrate is provided with a plurality of pin electrodes and a central electrode for testing the electrical state of a plurality of telecommunications probes disposed on a device under test, comprising: A first test unit is fixed on one side of the substrate corresponding to the pin electrodes. The first test unit includes a test base and a plurality of conductive elements. A fixing groove is provided in the center of the test base. A plurality of first slots are provided in the fixing groove in accordance with the arrangement of each pin electrode. A mounting hole is provided in the center of the fixing groove. At least one barrier groove is provided between two adjacent first slots to increase the distance between the extension lines of each conductive element. Each conductive element is movably disposed in each first slot and contacts each pin electrode. Each conductive element forms a positioning recess. A pressing unit is disposed in the fixed slot, and the pressing unit includes an upper cover, a lower cover, a plurality of first elastic elements and a plurality of pressing parts. The lower cover is also provided with a plurality of second slots corresponding to the arrangement of each pin electrode, so that the first slots and the second slots are opposite to each other. During installation, each first elastic element and each pressing part are respectively installed in each second slot. The upper cover is then closed and closed to the top surface of the lower cover, so that the first elastic elements and the pressing parts are sandwiched between the upper cover and the lower cover. One end of the pressing part protrudes from the bottom surface of the lower cover. When the pressing unit is installed in the first test unit, each pressing part is used to press one end of each conductive element, so that the bottom surface of each conductive element contacts the pin electrode to form electrical conduction. The other end of each conductive element is tilted upward toward the mounting hole to contact the electrical probes around the device under test for testing the electrical state. A plurality of shielding elements are disposed within the barrier grooves to shield the conductive components from interference by high-frequency signals, enabling the conductive components to undergo electrical testing smoothly; and a second test unit is disposed within the mounting hole, the second test unit comprising a central electrode holder, a central cover plate, and a plurality of second elastic elements, such that the central electrode holder is fixed to the central electrode, and a groove is formed in the center of the central electrode holder, with a plurality of first through holes corresponding to the component under test in the groove, and a plurality of second through holes corresponding to the first through holes on the central cover plate. When the central cover plate is installed on the central electrode holder, a test space is formed, with each first through hole corresponding to each second through hole forming an accommodating space, so that the second elastic elements are respectively placed into the accommodating spaces, with their two ends passing through each first through hole and each second through hole respectively to form electrical conductivity with the central electrode, for contact with the electrical probes in the center of the component under test to test the electrical state.

2. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 1, wherein, The conductive component is a V-shaped metal sheet structure, and its three ends form a pressing part, a first contact part, and a second contact part, respectively. The pressing part and the second contact part are opposite to each other and a positioning recess is formed between them. A positioning protrusion is provided on one side of the lower cover corresponding to each pressing part. When the pressing unit is installed in the first test unit, the positioning protrusion tightly abuts the positioning recess, and the pressing part presses down on the pressing part. The first contact part passes through the bottom surface of the first slot and contacts the pin electrode to form electrical conduction, causing the second contact part to tilt upward toward the mounting hole. When the device under test is placed in the test space for testing, the device under test is pressed down so that the surrounding electrical probes contact each of the second contact parts.

3. The high-frequency telecommunications probe testing device with signal interference shielding function as described in claim 2, wherein, The surface of the first contact portion has a curved structure so that it can maintain smooth swing when the pressing portion and the second contact portion are pressed against each other.

4. A high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 1 or 2, wherein, One end of the pressing member is provided with a positioning part corresponding to the first elastic element, so that one end of the first elastic element is positioned and sleeved on the positioning part, and the other end of the pressing member is provided with a hemispherical structure corresponding to the surface of the pressing part, so as to ensure contact when the first elastic element is pressed.

5. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 4, wherein, One side of the positioning part is provided with a limiting part, and the second slot is provided with a limiting ring edge corresponding to the limiting part.

6. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 1, wherein, Each barrier groove is arranged horizontally, and each shielding element is a metal cylindrical structure placed into each barrier groove.

7. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 6, wherein, Each of these shielding components is made of beryllium copper alloy.

8. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 1, wherein, Each of the barrier grooves is arranged longitudinally and in multiples at intervals, and each shielding member is a metal cylindrical structure placed in each barrier groove.

9. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 8, wherein, Each of these shielding components is made of beryllium copper alloy.

10. The high-frequency telecommunications probe testing apparatus with signal interference shielding function as described in claim 1, wherein, Both the first and second perforations are stepped holes, and the diameter of the outlet is smaller than the diameter of the interior. The second elastic element is designed with a diameter at both ends smaller than the diameter at the center.

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