Resin supply apparatus, resin molding article manufacturing apparatus, resin molding article manufacturing method and resin supply method

Abstract

A resin supply device is available that can supply resin material as evenly as possible to the spray surface in a short time. In the resin supply device, the resin material (13) in the receiving section is expelled from the dispensing section (12a). The resin material (13) lands at the dispensing start point (A1) within 60s on the spray surface. The control unit (70) is configured to control the moving mechanism (20) in a first mode and a second mode. In the first mode, after the resin material (13) lands at the dispensing start point (A1), the dispensing section (12a) moves relative to the spray surface (60s) at a first speed (V1). In the second mode, the dispensing section moves relative to the spray surface (60s) at a first speed (V1). The dispensing part (12a) moves relative to the spraying surface (60s) at a second speed (V2) that is faster than the first speed (V1). The control unit (70) switches from the first mode to the second mode at the following time points: the time point when the straight-line distance between the pre-defined reference position (A0) and the dispensing part (12a) exceeds a predetermined value (L1), or the time point when a predetermined time has elapsed since the time point when the pressing part (32) starts moving to expel the resin material (13) from the dispensing part (12a).

Description

Technical Field

[0001] This specification relates to a resin supply device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supply method. Prior Art

[0002] As disclosed in Japanese Patent Application Laid-Open No. 2018-134846 (Patent Document 1), a resin supply device for supplying a resin material to an object is known. Patent Document 1 states that if the resin material supplied to the object contains gas, the presence of gas may cause bubbles. Patent Document 1 states that by increasing the movement speed of the discharge portion (nozzle), the amount of resin material supplied at that location can be reduced compared to other locations, making it easier to expel gas from the resin material during the compression process. [Prior art literature] [Patent Document]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-134846 Summary of the Invention

[0004] [Problems to be solved by the invention] To distribute resin material widely across the spray surface of an object, a discharge unit (nozzle) is positioned above the spray surface and moved relative to the spray surface. By continuously discharging resin material from the discharge unit while scanning it across the spray surface, the resin material can be distributed widely across the spray surface. Here, we will focus on the situation immediately after the resin material is discharged from the discharge unit.

[0005] Figure 9 shows the resin material 73 stored in the storage section 71 being discharged from the discharge section 72a onto the spray surface 75 and the moment the discharge section 72a begins to move. After being discharged from the discharge section 72a, the resin material 73 moves downward as if hanging from the discharge section 72a. Thereafter, the resin material 73 lands on the spray surface 75, which is the object being supplied. The resin material 73 is continuously discharged from the discharge section 72a. In this state, the movement of the discharge section 72a begins (arrow AR). Starting from the point on the spray surface 75 where the resin material 73 lands, the resin material 73 begins to trace a predetermined trajectory on the spray surface 75.

[0006] Immediately after the resin material 73 lands on the spray surface 75 of the object being supplied, the resin material 73 is not yet fully fixed to the spray surface 75. If the discharge unit 72a begins moving in this state, the resin material 73 may be dragged along with the movement of the discharge unit 72a, causing the resin material 73 to shift from the position where it initially landed on the spray surface 75. In this case, it becomes difficult to uniformly supply the resin material 73 to the spray surface 75.

[0007] This phenomenon is more likely to occur when a high-viscosity liquid resin material is discharged from a dispensing unit with a small nozzle diameter. As shown in Figure 10, when the highly viscous resin material 73 lands on the spraying surface 75, the contact angle θ increases. As the contact angle θ increases, the contact area AA between the resin material 73 and the spraying surface 75 decreases. Because the adhesion between the resin material 73 and the spraying surface 75 also weakens, the resin material 73 is more likely to shift from its initial landing position on the spraying surface 75 as the dispensing unit moves.

[0008] As a measure to prevent the resin material 73 from being offset, it is possible to consider reducing the moving speed of the discharge portion 72a. However, if the discharge portion 72a moves at a low speed while supplying the resin material 73, it may take a long time to supply the resin material 73 over a wide range of the spraying surface 75, or before the resin material 73 is supplied to the entire specified range, the resin material 73 (in the storage box provided in the receiving portion 71) is insufficient, and the resin material 73 may not be supplied evenly to the spraying surface 75.

[0009] The purpose of this specification is to disclose a resin supply device, a resin molded product manufacturing device, a resin molded product manufacturing method and a resin supply method, which can supply resin material to a spraying surface as evenly as possible in the shortest possible supply time.

[0010] [Methods to solve the problem] The resin supply device disclosed herein supplies resin material onto a spraying surface of a supply object, comprising: A receiving portion for receiving the resin material and having a discharge portion for discharging the resin material; A pressing mechanism having a pressing portion inserted into the receiving portion; a moving mechanism for moving the discharge portion relative to the spraying surface so as to scan the discharge portion over the spraying surface; and A control unit, controlling the moving mechanism; The pressing portion moves within the receiving portion, so that the resin material in the receiving portion is pushed out from the discharging portion, and the resin material lands at the discharging starting point within the spraying surface. The control unit is configured to control the moving mechanism in a first mode and a second mode. In the first mode, after the resin material lands on the discharge starting point, the discharge portion moves relative to the spraying surface at a first speed. In the second mode, the discharge portion moves relative to the spraying surface at a second speed faster than the first speed. The control unit switches from the first mode to the second mode at the following time points: When the linear distance between the predetermined reference position and the discharge portion exceeds a predetermined value, or, A time point at which a predetermined time has elapsed since the pressing portion started moving to push out the resin material from the discharge portion.

[0011] The resin molded product manufacturing apparatus disclosed herein includes the above-mentioned resin supply apparatus. The resin molded product manufacturing method disclosed herein is a method using the above-mentioned resin molded product manufacturing apparatus, comprising: The resin supply device supplies the resin material to the supply object; and A process of performing resin molding on the supply object using the resin material.

[0012] The resin supply method disclosed herein supplies resin material onto a spraying surface of a supply object, comprising: The pressing portion moves within the receiving portion so that the resin material extruded from the discharging portion lands at a discharging starting point within the spraying surface; Implementing a first mode in which, after the resin material lands on the discharge starting point, the discharge portion supplies the resin material to the spraying surface while moving relative to the spraying surface at a first speed; and Implementing a second mode, in which the ejection portion supplies the resin material to the spraying surface while moving relative to the spraying surface at a second speed faster than the first speed; wherein, Switching from the first mode to the second mode is performed at the following time points: When the linear distance between the predetermined reference position and the discharge portion exceeds a predetermined value, or, A time point at which a predetermined time has elapsed since the pressing portion started moving to push out the resin material from the discharge portion.

[0013] [Effects of the Invention] According to the technical ideas disclosed in this specification, a resin supply device, a manufacturing device for resin molded products, a manufacturing method for resin molded products, and a resin supply method can be obtained, which can supply resin material as evenly as possible to the spraying surface in the shortest possible supply time. Simple diagram description

[0014] FIG. 1 is a diagram showing functional blocks of a resin molded product manufacturing apparatus 1000 . FIG2 is a cross-sectional view showing a state of the molding unit 80 included in the resin molded product manufacturing apparatus 1000 before mold clamping. FIG3 is a cross-sectional view showing a state where the molding unit 80 included in the resin molded product manufacturing apparatus 1000 is clamped. FIG. 4 is a flowchart showing a method for manufacturing a resin molded product using the resin molded product manufacturing apparatus 1000 . FIG. 5 is a cross-sectional view showing the resin supply device 100 included in the resin molded product manufacturing apparatus 1000 . FIG6 is a perspective view showing a state in which the discharge portion 12a of the resin supply device 100 supplies the resin material 13 onto the spraying surface 60s. FIG. 7 is a plan view showing a state of the resin material 13 formed when the discharge portion 12 a operates along a spiral trajectory on the spraying surface 60 s . FIG. 8 is a flowchart showing a resin supply method using the resin supply device 100 . FIG. 9 is a diagram showing a state immediately after the resin material 73 contained in the containing portion 71 is discharged from the discharging portion 72 a onto the spraying surface 75 and the discharging portion 72 a starts to move. FIG. 10 is a diagram for explaining how the contact angle θ increases when the resin material 73 having high viscosity falls on the spraying surface 75 . Implementation Method

[0015] The following describes embodiments of the present disclosure. In the embodiments described below, references to numbers, quantities, etc. are not necessarily limited to the stated numbers, quantities, etc., unless otherwise specified. Individual components are not necessarily essential to the present disclosure unless otherwise specified. Identical and equivalent components are designated by the same reference numbers, and overlapping descriptions may not be repeated.

[0016] [Resin Molded Product Manufacturing Apparatus 1000] FIG1 is a diagram showing the functional blocks of a resin molded product manufacturing apparatus 1000. FIG2 is a cross-sectional view showing a molding unit 80 of the resin molded product manufacturing apparatus 1000 before mold clamping. FIG3 is a cross-sectional view showing a molding unit 80 of the resin molded product manufacturing apparatus 1000 after mold clamping.

[0017] As shown in Figure 1, a resin molded product manufacturing apparatus 1000 includes a substrate module 101, a pressing module 102, a dispensing module 103, and a film module 104. A substrate 90 (Figure 2) is unloaded from the substrate module 101, and a film 60 (Figure 2) is unloaded from the film module 104. The dispensing module 103 supplies a thermosetting resin material 13 onto the film 60. The pressing module 102 uses the liquid resin material 13 supplied to the film 60 to perform resin molding on the substrate 90 (Figure 3).

[0018] In the resin molded product manufacturing apparatus 1000, the substrate module 101, pressing module 102, discharge module 103, and film module 104 are depicted as separate modules. Each module can be detachable from the others, or the number of modules can be increased or decreased. For example, two or three discharge modules 103 can be positioned between the pressing module 102 and the film module 104.

[0019] The resin molded product manufacturing apparatus 1000 further includes conveying mechanisms 91 and 92. The conveying mechanism 91 transports the substrate 90 removed from the substrate module 101 to the upper mold 81 (Figure 2) of the molding die in the molding section 80 (Figure 2) of the press module 102. The molding die, comprising the upper mold 81 and the lower mold 87, uses the resin material 13 supplied to the film 60 (the supply object) to resin-mold the silicon wafer (substrate 90) on which the die is mounted. Specifically, the molded object is, for example, a so-called thin wafer-level package.

[0020] The conveying mechanism 92 conveys the film 60 from which the resin material 13 is discharged from the discharge module 103 to the lower mold 87 ( FIG. 2 ) of the forming mold of the forming section 80 of the press module 102. The conveying mechanism 92 also conveys the film 60, which is discharged from the film module 104 and does not carry the resin material 13, to the discharge module 103.

[0021] [Method for manufacturing resin molded product] FIG4 is a flow chart illustrating a method for manufacturing a resin molded product using the resin molded product manufacturing apparatus 1000. FIG5 is a cross-sectional view illustrating the resin supply apparatus 100 included in the resin molded product manufacturing apparatus 1000. The method for manufacturing a resin molded product will be described here, and the detailed structure and operation of the resin supply apparatus 100 will be described later.

[0022] 1 to 5 , in the method for manufacturing a resin molded article, first, a resin supply device 100 ( FIG. 5 ) supplies resin material 13 onto a film 60 (step S101 ). For example, a conveying mechanism 92 conveys the film 60 and a frame-shaped tray cover 54 ( FIG. 5 ) disposed on the film 60 from a film module 104 to a discharge module 103 .

[0023] Next, the resin supply device 100 of the discharge module 103 supplies the resin material 13 onto the film 60 within the tray cover 54. The details of this operation will be described later. The transport mechanism 91 then transports the substrate 90 from the substrate module 101 to the press module 102 and places it on the lower surface of the upper mold 81 of the press module 102's molding die (step S102).

[0024] The transport mechanism 91 places the film 60 supplied with the resin material 13 on the upper surface of the lower mold 87 (step S103). The transport mechanism 92 transports the film 60 supplied with the resin material 13 from the discharge module 103 together with the tray cover 54 to the press module 102, and places the film 60 carrying the resin material 13 on the upper surface of the lower mold 87 of the press module 102 molding die. The transport mechanism 92 does not place the tray cover 54 in the press module 102, but instead transports the tray cover 54 to the film module 104.

[0025] As shown in Figure 2, in the forming section 80, a block-shaped fixed platen 88 is supported by tie rods or a support frame. An upper mold 81 is located below the fixed platen 88. A movable platen 86 is located below the fixed platen 88. A lower mold 87 is located above the movable platen 86.

[0026] Lower mold 87 includes a bottom member 82, side members 83, multiple elastic members 84, and a bottom plate 85. Lower mold 87 is formed with a downwardly recessed portion. A conveying mechanism 92 positions film 60 on the upper surface of lower mold 87, such that the resin material 13 on film 60 is positioned at the bottom of the recessed portion. As shown in FIG2 , conveying mechanism 91 positions substrate 90 on the lower surface of upper mold 81.

[0027] By moving the lower mold 87 upward toward the upper mold 81, the upper mold 81 and the lower mold 87 are clamped (step S104). For example, a clamping mechanism (not shown) moves the movable platen 86 upward. This causes the lower mold 87 to move upward toward the upper mold 81. As the movable platen 86 moves upward, the frame-shaped side member 83 first contacts the substrate 90 through the film 60.

[0028] Afterward, movable platen 86 continues to move upward. While side members 83 stop moving upward, bottom member 82 moves upward, and multiple elastic members 84 contract. When the top surface of side members 83 reaches a predetermined position, movable platen 86 stops moving upward, and mold clamping in step S104 is completed.

[0029] After lower mold 87 stops moving and the mold is locked, the temperature of the molding die is increased (step S105). Resin material 13 is thermosetting. Therefore, as the temperature of resin material 13 rises, it hardens into hardened resin 18 (Figure 3) (step S106). After resin material 13 has hardened, bottom plate 85 is moved downward, causing lower mold 87 to move downward. This opens the mold, producing a resin molded product with the lower surface of substrate 90 encapsulated in resin (step S107).

[0030] In the above content, as shown in Figures 2 and 3, the case where the ejection module 103 of the resin molded product manufacturing device 1000 shown in Figure 1, which has a pressing module 102 for setting the substrate 90 on the upper mold 81 to manufacture the resin molded product, is equipped with the resin supply device 100 of the above embodiment is described, but, for example, the ejection module 103 of the resin molded product manufacturing device 1000 shown in Figure 1, which has a pressing module 102 for setting the substrate 90 on the lower mold 87 to manufacture the resin molded product, can also be equipped with the resin supply device 100 of the above embodiment.

[0031] [Resin supply device 100] 5 , a resin supply device 100 supplies liquid resin material 13 onto a spraying surface 60s of a supply target object such as a film 60. Specifically, the resin supply device 100 includes, for example, a magazine 10, a moving mechanism 20, a pressing mechanism 30, an opening and closing mechanism 40, a detection unit 50, a mounting table 52, and a control unit 70.

[0032] (Storage Box 10) The storage cassette 10 includes a cover 11, a container 12, and a resin material 13. The container 12 contains the resin material 13, and the cover 11 is disposed on the surface of the resin material 13. The cover 11 seals the resin material 13 to prevent it from leaking out of the container 12. The container 12 of the storage cassette 10 is disposed inside the cylindrical portion 23 of the moving mechanism 20, described later. A discharge portion 12a is provided at the end of the container 12. The storage cassette 10 discharges the resin material 13 through the discharge portion 12a.

[0033] (Detection Unit 50) A loading platform 52 is located below the discharge unit 12a. A film 60 conveyed from the film module 104 is placed on the loading platform 52. A frame-shaped tray cover 54 is placed on the film 60. The top surface of the film 60 serves as a spray surface 60s to which the resin material 13 is supplied. The resin material 13 is supplied inside the tray cover 54 on the spray surface 60s. A detection unit 50 is connected to the loading platform 52 to detect the weight of the resin material 13 extruded from the discharge unit 12a and supplied onto the film 60.

[0034] (Moving mechanism 20) The moving mechanism 20 includes a peripheral wall 21, a locking member 22, and a cylindrical portion 23, and holds the storage cassette 10. Multiple locking members 22 are provided on the inner periphery of the peripheral wall 21, and the cylindrical portion 23 is locked to the multiple locking members 22. The storage cassette 10 is detachably mounted inside the cylindrical portion 23.

[0035] The moving mechanism 20 supports the position of the discharge portion 12a via a drive system (not shown) in a variable manner. For example, the discharge portion 12a can be moved in the horizontal and vertical directions within the paper of Figure 5, as well as in a direction perpendicular to the paper of Figure 5. By moving the discharge portion 12a relative to the spraying surface 60s of the film 60, the discharge portion 12a can be scanned across the spraying surface 60s.

[0036] (Pressing mechanism 30) The pressing mechanism 30 includes a servo motor 31 and a pressing portion 32. The pressing portion 32 is inserted into the receiving portion 12 of the magazine 10 and is positioned so as to contact the cover 11. As the pressing portion 32 moves, it presses the resin material 13 through the cover 11, forcing the resin material 13 out of the discharge portion 12a of the magazine 10.

[0037] (Opening and closing mechanism 40) The opening and closing mechanism 40 includes a drive unit 41 and a pair of chucks 42 and 43. The chucks 42 and 43 are configured to open and close the discharge portion 12a. The chucks 42 and 43 are configured to be able to form an open state and a closed state, and these states can be switched by driving the drive unit 41.

[0038] The discharge portion 12a comprises, for example, a flexible tubular structure that allows the resin material 13 to pass through. By pressing the tubular structure with the chucks 42 and 43, the opening and closing mechanism 40 can be switched from a state in which the resin material 13 can pass through the tubular structure (open state) to a state in which the resin material 13 cannot pass through the tubular structure (closed state). When the chucks 42 and 43 are open, the opening and closing mechanism 40 allows the resin material 13 extruded from the discharge portion 12a to reach the film 60. When the chucks 42 and 43 are closed, the opening and closing mechanism 40 prevents the resin material 13 extruded from the discharge portion 12a from reaching the film 60.

[0039] The control unit 70 is connected to the moving mechanism 20, the pressing mechanism 30 (servo motor 31), the opening and closing mechanism 40 (drive unit 41) and the detection unit 50, and can control the operating state of the mechanisms by sending instruction signals to these devices. In addition, it can also perform sensing and servo control by receiving signals from these devices.

[0040] FIG6 is a perspective view showing the discharging portion 12a of the resin supply device 100 supplying the resin material 13 onto the spraying surface 60s. The moving mechanism 20 causes the discharging portion 12a to scan the spraying surface 60s along a spiral trajectory, for example. FIG6 shows the discharging portion 12a scanning from the center of the spiral toward the outside.

[0041] Figure 7 is a plan view showing the state of the resin material 13 formed when the discharge unit 12a operates along the spiral trajectory TR on the spraying surface 60s. The trajectory TR is formed to spirally extend at a predetermined spiral pitch, centered at the center point A0. Details will be described later, but within the inner region of the spiral trajectory TR (from the discharge start point A1 to the mode switching point A2), the trajectory TR spirally extends at a spiral pitch P1, while within the outer region of the spiral trajectory TR (from the mode switching point A2 to the supply end point A3), the trajectory TR spirally extends at a spiral pitch P2.

[0042] As described above, as the pressing portion 32 ( FIG. 5 ) moves within the container 12, the resin material 13 within the container 12 is pushed out from the discharge portion 12a. The resin material 13 lands at the discharge start point A1 ( FIG. 7 ) within the spray surface 60s. In other words, the control unit 70 controls the moving mechanism 20 and the pressing mechanism 30 so that the resin material 13 discharged from the discharge portion 12a lands at the discharge start point A1.

[0043] Here, the control unit 70 is configured to control the moving mechanism 20 in a first mode and a second mode, wherein in the first mode, after the resin material 13 lands at the discharging start point A1, the discharging unit 12a moves at a first speed V1 relative to the spraying surface 60s, and in the second mode, the discharging unit 12a moves at a second speed V2 relative to the spraying surface 60s that is faster than the first speed V1.

[0044] In the example shown in FIG7 , the resin material 13 forms a spiral trajectory TR. The spiral trajectory TR begins at the discharge start point A1 and continues spirally to the mode switching point A2, and then further to the supply end point A3. In other words, the control unit 70 controls the movement mechanism 20 and the pressing mechanism 30, etc., so that the resin material 13 discharged from the discharge unit 12a forms a spiral from the discharge start point A1 to the mode switching point A2, and further from the mode switching point A2 to the supply end point A3, as shown in FIG7 .

[0045] After the resin material 13 lands at the discharge start point A1, the control unit 70 drives the moving mechanism 20 in the first mode until the resin material 13 discharged from the discharge unit 12a reaches the mode switching point A2 from the discharge start point A1. In the first mode, the discharge unit 12a moves at a first velocity V1 relative to the spraying surface 60s. The first velocity V1 is, for example, a value calculated as the tangential velocity of the spiral trajectory TR.

[0046] The control unit 70 further drives the moving mechanism 20 in the second mode until the resin material 13 discharged from the discharge unit 12a reaches the supply end point A3 from the mode switching point A2. In the second mode, the discharge unit 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1. The second speed V2 is also a value calculated as the tangential speed of the spiral trajectory TR, for example.

[0047] Here, the control unit 70 switches from the first mode to the second mode when the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge portion 12a exceeds a predetermined value L1 (Figure 7). The mode switching point A2 is set at this position. This configuration is not limiting; the control unit 70 may also switch from the first mode to the second mode when a predetermined time has passed since the pressing portion 32 begins moving to extrude the resin material 13 from the discharge portion 12a.

[0048] (Example) The various parameters applicable to the above embodiment are exemplified below. The silicon wafer package to be molded has a diameter of 290 mm and a thickness of 0.05 mm.

[0049] The nozzle diameter of the discharge portion 12a is 4 mm. The amount of resin material 13 capable of forming the spiral trajectory TR is 6 g to 10 g. As the liquid resin material 13, for example, a high-viscosity material (a material having a linear expansion coefficient close to that of a silicon wafer) can be used. High viscosity refers to, for example, a material having a viscosity exceeding 500 Pa·s (Pascal seconds). The weight of the resin material 13 discharged from the discharge portion 12a per unit time (discharge speed) is 0.1 g / second. The discharge speed can be set to a fixed value from the start to the end of discharge. The time required to form the spiral trajectory TR (resin amount / discharge speed) is 100 seconds.

[0050] The time (T0) from the moment the pressing unit 32 begins moving to extrude the resin material 13 from the discharge unit 12a to the moment the discharge unit 12a begins moving in the first mode (first speed V1) is 10 seconds. The execution time of the first mode, that is, the time from the moment the discharge unit 12a begins moving in the first mode (first speed V1) to the moment it switches to the second mode (second speed V2), is 57.5 seconds. The time from the moment the discharge unit 12a begins moving in the second mode (second speed V2) to the moment the discharge unit 12a reaches the supply end point A3 is 32.5 seconds.

[0051] The distance between the center point A0 of the spiral trajectory TR and the discharge start point A1 is 10 mm. Alternatively, a spiral trajectory TR represented by an Archimedean spiral, for example, can be used. The distance (predetermined value L1) between the center point A0 and the mode switching point A2 is 30 mm (60 mm in diameter). The distance L2 between the center point A0 and the supply end point A3 is 130 mm (260 mm in diameter).

[0052] Furthermore, the first speed V1 is 4.3 mm / s, and the second speed V2 is 309.5 mm / s. The screw pitch P1 is 10 mm, and the screw pitch P2 is 5 mm. In other words, when the control unit 70 controls the moving mechanism 20 in the first mode, the screw pitch P1 is larger than the screw pitch P2 when the control unit 70 controls the moving mechanism 20 in the second mode. The larger the screw pitch, the smaller the amount of resin supplied per unit area. The faster the movement speed of the discharge unit 12a, the smaller the amount of resin supplied per unit area.

[0053] For example, if the amount of resin is small, the length of resin that can be discharged will be shorter. Furthermore, if the nozzle diameter of the discharge unit 12a is large, the length of resin that can be discharged will be shorter. If the length of resin that can be discharged is shorter than the spiral length, the discharge may end midway through the spiral, making it difficult to supply the resin outside the required range. If the resin distribution in the center and outer parts of the resin supply area is uneven, the margin for package thickness and flatness will be reduced, and there is a possibility of product defects such as wire flow caused by resin flow, appearance defects (flow marks), and component segregation. Therefore, in order to evenly distribute the resin material 13 within the spraying surface 60s, various parameters are optimized. For example, when the discharge unit 12a moves at high speed, it is best to reduce the spiral pitch.

[0054] (Resin supply method) Fig. 8 is a diagram showing a flow chart of a resin supply method using the resin supply device 100. The resin supply device 100 (Fig. 5) first reads a set value from a reference table prepared in advance (step t101 in Fig. 8).

[0055] For example, the various parameters described above may differ when using a resin material 13 having a first viscosity compared to when using a resin material having a second viscosity that is higher than the first. Alternatively, the various parameters described above may vary not only depending on the type of resin material 13 but also on the nozzle diameter of the discharge unit 12a, the distance between the discharge unit 12a and the spraying surface 60s, the area of ​​the spraying surface 60s, and other factors. These various parameters are optimized based on past resin supply practices and stored in a reference table format.

[0056] For example, when a resin material 13 having a first viscosity is supplied to the spray surface 60s, the time from the time the resin material 13 lands at the dispensing start point A1 to the time the first mode switches to the second mode is defined as the first time interval. When a resin material 13 having a second viscosity higher than the first viscosity is supplied to the spray surface 60s, the time from the time the resin material 13 lands at the dispensing start point A1 to the time the first mode switches to the second mode is defined as the second time interval. In this case, various parameters can be set to make the second time interval shorter than the first time interval. In the above embodiment, the first time interval (the duration of time the first mode is implemented) is 57.5 seconds, and the second time interval (the duration of time the second mode is implemented) is 32.5 seconds.

[0057] After the required set values ​​are read, the pressing unit 32 begins moving (step t102 in Figure 8 ). As the pressing unit 32 moves further, the resin material 13 is extruded from the discharge unit 12a. Until the resin material 13 reaches the spraying surface 60s of the film 60, the value detected by the detection unit 50 ( Figure 5 ) remains unchanged.

[0058] The detection result (increase in detected weight) from the detection unit 50 indicates that the resin material 13 has landed on the spraying surface 60s (discharge start point A1) of the film 60 (step t103 in FIG8 ). Alternatively, the resin material 13 may be considered to have landed on the spraying surface 60s of the film 60 after a predetermined time has passed since the pressing unit 32 began moving to push the resin material 13 from the discharge unit 12a. Alternatively, optical or other methods may be used to detect whether the resin material 13 has landed on the spraying surface 60s of the film 60.

[0059] Then, the discharge unit 12a is driven to operate in the first mode and starts moving at the first speed V1 (step t104 in FIG8 ). The resin material 13 starts drawing a spiral trajectory TR starting from the discharge start point A1.

[0060] When the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined radius (predetermined value L1 shown in FIG7 ), the first mode is switched to the second mode (step t105 in FIG8 ). This switching can be performed based on a value output from an encoder, for example. Consequently, the discharge unit 12a is driven to operate in the second mode and begins moving at the second velocity V2 (step t106 in FIG8 ).

[0061] When the discharge unit 12a reaches the outermost edge of the spiral trajectory TR (supply endpoint A3) (step t107 in Figure 8 is "Yes"), the movement of the pressing unit 32 is stopped (step t108). Even after the pressing unit 32 stops moving, the resin material 13 continues to be discharged from the discharge unit 12a in the form of droplets, so a predetermined de-liquidation operation is performed (step t109). During the de-liquidation operation, the discharge unit 12a is moved vertically, for example, to stop further droplets from falling. If necessary, the weight is detected using the detection unit 50, etc., and the weight deficiency is corrected (step t110). The above steps complete the resin supply. If necessary, the next resin supply is performed on another film 60.

[0062] (Function and Effect) As previously mentioned, immediately after the resin material 13 lands on the spray surface 60s of the object being supplied, the resin material 13 is not yet fully fixed to the spray surface 60s. If the discharge unit 12a begins moving in this state, the resin material 13 may be dragged along with the movement of the discharge unit 12a, causing the resin material 13 to shift from the point where it first landed on the spray surface 60s (discharge start point A1). In this case, it becomes difficult to uniformly supply the resin material 13 to the spray surface 60s.

[0063] As a countermeasure to the deviation of the resin material 13, it is possible to consider reducing the moving speed of the discharge portion 12a. However, if the discharge portion 12a continues to supply the resin material 13 while moving at a low speed, it may take a long time to supply the resin material 13 to a wide range of the spraying surface 60s, or the resin material 13 (in the storage box provided in the storage portion 12) may be used up before the resin material 13 is supplied to the entire specified range, and the resin material 13 may not be evenly supplied to the spraying surface 60s.

[0064] In contrast, in this embodiment, the control unit 70 drives the moving mechanism 20 in the first mode after the resin material 13 lands at the discharge start point A1 until the resin material 13 discharged from the discharge unit 12a reaches the mode switching point A2 from the discharge start point A1. In the first mode, the discharge unit 12a moves at a first speed V1 relative to the spraying surface 60s.

[0065] The control unit 70 then switches from the first mode to the second mode when the linear distance between the predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined value L1 (Figure 7). The movement mechanism 20 is driven in the second mode from the mode switching point A2 until the resin material 13 discharged from the discharge unit 12a reaches the supply end point A3. In the second mode, the discharge unit 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1.

[0066] In other words, by moving the discharging unit 12a at a low speed immediately after discharging, the resin material 13 is fully fixed on the spraying surface 60s. After fixing, the discharging unit 12a is then moved at a high speed. This allows the resin material 13 to be supplied to the spraying surface 60s as evenly as possible within the shortest possible supply time. In addition to the first and second modes, the control unit 70 can also be configured to control the moving mechanism 20 in a third mode, in which the discharging unit 12a moves relative to the spraying surface 60s at a third speed different from the second speed V2. Resin supply can also be performed in three or more modes.

[0067] While the embodiments of the present disclosure have been described above, they should be considered in all respects to be illustrative and non-restrictive. The scope of the present disclosure is indicated by the appended claims, and all modifications within the meaning and scope of the appended claims and their equivalents are intended to be encompassed.

[0068] 10: Storage Box 11: Cover 12, 71: Containment Department 12a, 72a: discharge portion 13, 73: Resin material 18: Hardened resin 20: Mobile mechanism 21: surrounding wall 22: Locking member 23:Tubular part 30: Pressing mechanism 31:Servo motor 32: Pressing part 40: Opening and closing mechanism 41: Drive unit 42, 43: chuck 50: Detection Department 52: loading platform 54: Tray cover 60:Film 60s, 75s: spray surface 70: Control Department 80: forming section 81: Upper mold 82: Bottom member 83: Side member 84: Elastic member 85: Base plate 86: Movable platen 87: Lower mold 88:Fixed platen 90:Substrate 91, 92: Transport agency 100: Resin supply device 101: Substrate module 102: Pressing module 103: spit module 104:Thin film module 1000: Manufacturing device A0: Center point A1: Dispensing starting point A2: Mode switching point A3: Supply end point AA: contact area AR:Arrow L1: Specified value L2: Distance (the distance between the center point and the supply end point) P1, P2: spiral pitch S104~S107, t101~t110: Engineering TR:Trajectory V1: First speed V2: Second speed θ: contact angle

Claims

1. A resin supply device for supplying resin material to a sprayed surface of an object, comprising: A receiving section that receives the resin material and has a dispensing section for dispensing the resin material. A pressing mechanism includes a pressing part inserted into the receiving part; a moving mechanism that causes the dispensing part to scan the spray surface along a spiral trajectory by moving the dispensing part relative to the spray surface; and a control unit that controls the moving mechanism; wherein the resin material is a high-viscosity resin having a viscosity exceeding 500 Pa·s, the pressing part, by moving within the receiving part, causes the resin material within the receiving part to be expelled from the dispensing part, causing the resin material to land at a dispensing start point within the spray surface, and the control unit is configured to control the moving mechanism in a first mode and a second mode. In the first mode, after the resin material lands at the dispensing start point, the dispensing part moves relative to the spray surface at a first speed; in the second mode, the dispensing part moves relative to the spray surface at a second speed faster than the first speed. The control unit switches from the first mode to the second mode at the following time points: a time point when the linear distance between a predetermined reference position and the dispensing part exceeds a predetermined value, or... A predetermined time has elapsed since the point at which the pressing part begins to move to expel the resin material from the dispensing part.

2. The resin supply device as claimed in claim 1, wherein, When the resin material having a first viscosity is supplied to the spray surface, the time from when the resin material lands at the discharge start point to when the switching from the first mode to the second mode is performed is defined as a first time interval. When the resin material having a second viscosity having a higher viscosity than the first viscosity is supplied to the spray surface, the time from when the resin material lands at the discharge start point to when the switching from the first mode to the second mode is performed is defined as a second time interval, the second time interval being shorter than the first time interval.

3. The resin supply device as claimed in claim 1, wherein, The control unit switches from the first mode to the second mode at the time point when the straight-line distance between the pre-defined reference position and the ejection part exceeds a predetermined value, wherein the pre-defined reference position is the center point of the spiral trajectory.

4. The resin supply device as claimed in claim 1, wherein, The pitch of the helical mechanism controlled by the control unit in the first mode is larger than the pitch of the helical mechanism controlled by the control unit in the second mode.

5. The resin supply device as claimed in claim 4, wherein: The control unit is configured to control the moving mechanism in a third mode, wherein the dispensing part moves relative to the spraying surface at a third speed different from the second speed.

6. The resin supply device as described in any one of claims 1 to 5, wherein, It further includes: a detection unit connected to a platform disposed below the dispensing unit, which detects the weight of the resin material supplied to the spraying surface; and a control unit that, after the pressing unit begins to move, does not initiate relative movement of the dispensing unit during the period when the detection value of the detection unit does not change; and, after determining that the resin material has landed at the dispensing start point based on the increase in the detected weight by the detection unit, causes the dispensing unit to move relative to the other unit at the first speed as the first mode.

7. An apparatus for manufacturing resin molded articles, comprising a resin supply device as described in any one of claims 1 to 6.

8. The apparatus for manufacturing a resin molded article as claimed in claim 7, comprising: a molding die for resin molding a silicon wafer on which a wafer is mounted using the resin material supplied to the object to be supplied.

9. A method for manufacturing a resin molded article, using the resin molded article manufacturing apparatus as described in claim 7 or 8, comprising: The process of supplying the resin material to the object by the resin supply device; And the process of resin molding the supplied object using the resin material.

10. A resin supply method, comprising supplying resin material onto a sprayed surface of an object to be supplied, comprising: By moving within the receiving section, the pressing part causes the resin material extruded from the dispensing part to land at the dispensing start point within the spraying surface; The first mode is implemented, in which, after the resin material lands at the ejection start point, the ejection part moves relative to the spraying surface at a first speed while supplying the resin material to the spraying surface. The second mode is implemented, wherein the resin material is supplied to the spray surface while the dispensing part moves relative to the spray surface at a second speed faster than the first speed; wherein, by moving the dispensing part relative to the spray surface, the dispensing part scans the spray surface along a spiral trajectory, and the resin material is a high-viscosity resin with a viscosity exceeding 500 Pa·s. The switching from the first mode to the second mode is performed at the following time points: the time point at which the linear distance between a predetermined reference position and the dispensing part exceeds a predetermined value, or the time point at which a predetermined time has elapsed since the time point at which the pressing part begins to move to expel the resin material from the dispensing part.

11. The resin supply method as described in claim 10, wherein, The control unit controls the moving mechanism, which moves the dispensing part relative to the spray surface to scan the spray surface. The detection unit is connected to a platform disposed below the dispensing part and detects the weight of the resin material supplied to the spray surface. The control unit: after the pressing part starts moving, does not start the relative movement of the dispensing part during the period when the detection value of the detection unit does not change; after determining that the resin material has landed at the dispensing start point based on the increase in the detected weight of the detection unit, it moves the dispensing part relative to the spray surface at the first speed as the first mode.

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