Apparatus having an inductor and a high thermal conductivity frame and manufacturing method thereof

Abstract

This invention provides a device having an inductor and a high thermal conductivity frame, and a method for manufacturing the same. The device comprises: an inductor having at least two internal conductors embedded in a magnetic powder material; and a frame made of a high thermal conductivity material, the frame including a top plate above the at least two internal conductors, a bottom plate below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate, the frame being embedded in the magnetic powder material; wherein the device is disposed above electronic components and contacts the electronic components through the bottom plate of the frame.

Description

[Technical Field]

[0001] This invention relates to a device having an inductor and a high thermal conductivity frame and a method for manufacturing the same, particularly a device having an inductor and a high thermal conductivity frame and a method for manufacturing the same, which enhances thermal conductivity by embedding the frame in a magnetic powder material to contact electronic components. [Previous Technology]

[0002] As shown in Figure 1, US Patent 11770916 discloses an inductor structure 1, in which a metal strip 3 made of a high thermal conductivity material is wrapped around the outer portion of the inductor. This metal strip 3 is designed to enhance thermal conductivity between the inductor and the integrated circuit chip, thereby improving heat dissipation efficiency. The metal strip 3 can be made of high thermal conductivity materials such as copper, silver, or aluminum, and its width can be adjusted as needed to ensure effective thermal connection with the underlying integrated circuit chip.

[0003] However, this prior art has some obvious drawbacks. First, the metal strip 3 is installed by wrapping after the inductor is manufactured. Since the metal strip 3 needs to be precisely bent to fit the shape of the inductor, it is difficult to ensure a perfect fit between the metal strip 3 and the inductor surface during manufacturing. Especially at the bends, it is difficult to achieve a precise 90-degree bend, which leads to uneven or excessive gaps between the metal strip 3 and the inductor, thus affecting the heat conduction efficiency.

[0004] Secondly, a thermal interface material (TIM) is needed to connect the metal strip 3 to the inductor. Since the thermal conductivity of TIM is relatively low (typically 1 to 2 W / mK), and there is a gap between the start and end points of the metal strip 3, this further increases the thermal resistance and weakens the overall heat transfer efficiency. Furthermore, because the metal strip 3 mainly wraps around the side of the inductor, heat needs to be transferred along a longer path. This lengthens the heat transfer path from the integrated circuit chip to the heat sink, increasing the thermal resistance and thus affecting the heat dissipation effect.

[0005] Finally, heat in the middle part of the inductor is difficult to transfer to the metal strip 3 in a timely and effective manner, mainly relying on vertical heat conduction. However, the presence of multiple layers of materials and interfaces in the vertical direction, such as TIM and magnetic powder materials, increases thermal resistance and limits the overall heat dissipation performance. These drawbacks limit the performance of this prior art in terms of efficient heat dissipation and urgently require improvement.

[0006] In view of the shortcomings of the prior art, the present invention provides a design of a device with an inductor and a high heat transfer frame, which can greatly improve the heat dissipation effect through a simple manufacturing process. [Summary of the Invention]

[0007] In one viewpoint, the present invention provides an apparatus having an inductor and a high thermal conductivity frame, comprising: an inductor having at least two internal conductors embedded in a first magnetic powder material; and a frame made of a high thermal conductivity material, the frame including a top plate above the at least two internal conductors, a bottom plate below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate, the frame being embedded in the first magnetic powder material; wherein the apparatus is disposed on an electronic component and contacts the electronic component through the bottom plate of the frame.

[0008] In one embodiment, one of the at least one vertical frame includes one of the following forms: the vertical frame is connected between the top plate and the bottom plate, and the vertical frame, the top plate, and the bottom plate are integrally formed; the vertical frame includes a connecting rod, and the connecting rod is connected between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are directly connected, or the upper vertical frame and the lower vertical frame have a gap and are not directly connected, wherein the gap is less than one-quarter of a vertical distance between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are connected by a connecting rod; wherein the connecting rod is made of a high thermal conductivity material.

[0009] In one embodiment, the high thermal conductivity material is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc or stainless steel.

[0010] In one embodiment, the high thermal conductivity material is a non-metallic material, including aluminum nitride, silicon carbide or graphite.

[0011] In one embodiment, the frame is coplanar with the first magnetic powder material of the inductor or the frame does not extend beyond the surface of the first magnetic powder material.

[0012] In one embodiment, the frame extends beyond the surface of the first magnetic powder material of the inductor.

[0013] In one embodiment, the surface of the top plate can be connected to a high thermal conductivity object through a thermal interface material to enhance the heat dissipation effect.

[0014] In one embodiment, the electronic component includes an integrated circuit chip, an inductor, a capacitor, or a resistor.

[0015] In one embodiment, at least one object with high thermal conductivity may be connected to the side of the frame for heat dissipation.

[0016] In one embodiment, the at least one high thermal conductivity object is directly connected to the top plate or the bottom plate.

[0017] In one embodiment, the frame is embedded in the magnetic powder material, and the top plate, the bottom plate and the vertical frame of the frame are in direct contact with the first magnetic powder material without using a thermal interface material for bonding.

[0018] In one embodiment, the frame is manufactured by a one-time molding process, so that the top plate, bottom plate and vertical frame are directly bonded to the first magnetic powder material under high temperature and high pressure.

[0019] In one embodiment, the frame is composed of multiple vertical frames connecting the top plate and the bottom plate to improve structural strength.

[0020] In one embodiment, the internal conductor of the inductor has a clip-on structure to reduce DC resistance.

[0021] In one embodiment, the top plate and the bottom plate of the frame have different lengths or widths to optimize heat dissipation performance.

[0022] In one embodiment, the vertical frame is located in the middle portion of the inductor, in contact with the top plate and the bottom plate, providing a heat conduction path to transfer heat from the middle portion of the inductor to the top plate and the bottom plate.

[0023] In one embodiment, the frame is directly embedded in the first magnetic powder material during the manufacturing process of the inductor, instead of using a metal sheet to cover it after the inductor is made, so as to avoid uneven or excessive gaps caused by the metal sheet covering process, thereby improving heat dissipation performance.

[0024] In one embodiment, the inductor and high thermal conductivity frame device further includes: a second magnetic powder material that covers the exterior of a structure consisting of the first magnetic powder material, the internal conductor and the frame.

[0025] In one embodiment, the first magnetic powder material and the second magnetic powder material are two different magnetic powders. The first magnetic powder material is used to determine the inductance value of the inductor, and the second magnetic powder material is used for outer layer protection and heat dissipation.

[0026] In another viewpoint, the present invention provides a method for manufacturing an apparatus having an inductor and a high thermal conductivity frame. The apparatus includes an inductor having at least two internal conductors and a frame made of a high thermal conductivity material. The frame includes a top plate above the at least two internal conductors, a bottom plate below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate. The frame is embedded in and in direct contact with a magnetic powder material. The method for manufacturing the apparatus includes: (a) providing the at least two internal conductors and the frame; (b) placing the at least two internal conductors and the frame in a first mold, positioning the at least two internal conductors and the top plate, bottom plate, and vertical frame of the frame at predetermined positions; (c) adding a first magnetic powder material to the first mold, filling the space between the frame and the internal conductors with the first magnetic powder material; (d) ... The first mold is subjected to high temperature and high pressure treatment to integrally form the first magnetic powder material, the internal conductor and the frame, forming a structure of an inductor and a frame embedded in the first magnetic powder material; and (e) the formed structure is removed from the first mold to produce the device having an inductor and a high heat transfer frame.

[0027] In one embodiment, in step (a), the internal conductor has a clip-on structure to reduce DC resistance.

[0028] In one embodiment, the manufacturing method of the aforementioned device having an inductor and a high heat transfer frame further includes: (f) placing the structure in a second mold to position the structure at a predetermined position; (g) adding a second magnetic powder material to the second mold to fill the outside of the structure; and (h) subjecting the second mold to high temperature and high pressure treatment to integrally form the second magnetic powder material and the structure to produce the device having an inductor and a high heat transfer frame.

[0029] In one embodiment, in step (d), the frame is directly bonded to the first magnetic powder material without using a thermal interface material.

[0030] In one embodiment, after step (e), the top surface of the inductor can be connected to a high thermal conductivity object via a thermal interface material.

[0031] In another viewpoint, the present invention provides a method for manufacturing an apparatus having an inductor and a high thermal conductivity frame. The apparatus having an inductor and a high thermal conductivity frame includes an inductor having at least two internal conductors and a frame made of a high thermal conductivity material. The frame includes a top plate located above the at least two internal conductors, a bottom plate located below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate. The frame is embedded in and in direct contact with the magnetic powder material. The method for manufacturing the apparatus having an inductor and a high thermal conductivity frame includes: (a) manufacturing at least two separate sub-inductors, each sub-inductor having at least one internal conductor and embedded in a first magnetic powder material; (b) providing the frame; and (c) assembling the at least two sub-inductors into the frame such that the top plate and the bottom plate are located on the upper and lower sides of the at least two sub-inductors, respectively, forming a structure to produce the apparatus having an inductor and a high thermal conductivity frame.

[0032] In one embodiment, the manufacturing method of the aforementioned device having an inductor and a high heat transfer frame further includes: (d) placing the structure in a mold to position the structure at a predetermined position; (e) adding a second magnetic powder material to the mold and filling the outside of the structure with the second magnetic powder material; and (f) subjecting the mold to high temperature and high pressure treatment to integrally form the second magnetic powder material and the structure to produce the device having an inductor and a high heat transfer frame.

[0033] In one embodiment, in step (c), the frame is connected to at least two sub-inductors by an adhesive or thermal interface material.

[0034] Compared with the prior art, the present invention has significant advantages. First, during the manufacturing process, the present invention directly embeds a frame made of a high thermal conductivity material into the magnetic powder material of the inductor, forming a tightly bonded structure. This method avoids the manufacturing difficulties caused by wrapping the metal strip after the inductor is manufactured in the prior art, especially the problem of accurately controlling the bend angle and gap during the bending process of the metal strip. Through the direct embedding design, the uneven or excessive gap that may exist between the metal and the inductor is eliminated, thereby greatly improving the thermal conductivity efficiency.

[0035] Secondly, the frame structure of the present invention includes a top plate located above the internal conductor of the inductor and a bottom plate located below, connected by at least one vertical frame located in the middle section. This design provides a direct heat conduction path, enabling efficient transfer of heat generated between the inductor and the electronic components to the top and bottom plates, and then dissipation to the external environment. Compared to the prior art where heat needs to be transferred to the heat sink along a long and tortuous path via the side metal strip, the present invention significantly shortens the heat conduction path, reduces thermal resistance, and improves heat dissipation performance.

[0036] Furthermore, because the frame is directly bonded to the magnetic powder material during manufacturing, there is no need to use a thermal interface material (TIM) to connect the metal and the inductor. This not only simplifies the manufacturing process but also avoids the problem of increased thermal resistance caused by the low thermal conductivity of TIM (typically 1 to 2 W / mK). In the prior art, the heat conduction efficiency was limited because a TIM was required to connect the metal strip and the inductor, and gaps were unavoidable during manufacturing. This invention achieves more efficient heat conduction by directly bonding the frame and the magnetic powder material under high temperature and pressure through a one-time molding process.

[0037] In summary, the present invention overcomes the shortcomings of prior art in terms of manufacturing difficulty, heat conduction path, thermal resistance, and heat dissipation efficiency. Through innovative structural design and manufacturing methods, the present invention provides a more effective heat dissipation solution, particularly suitable for high power density and high heat electronic components, thereby improving the reliability and performance of the device.

[0038] The following detailed description of specific embodiments will make it easier to understand the purpose, technical content, features and effects achieved by the present invention.

Implementation Method

[0064] The drawings in this invention are all schematic and are mainly intended to show the interrelationship between the components of the electronic components. The shapes and sizes are not drawn to scale.

[0065] Figures 2A, 2B, and 2C respectively show cross-sectional schematic diagrams of an embodiment of a device having an inductor and a high thermal conductivity frame according to the present invention. As shown in Figure 2A, the device 10 having an inductor and a high thermal conductivity frame includes an inductor 11 and a frame 12 made of a high thermal conductivity material. The inductor 11 includes at least two internal conductors 101 and a first magnetic powder material 102, the internal conductors 101 being embedded in the first magnetic powder material 102. The frame 12 includes a top plate 103, a bottom plate 104, and at least one vertical frame 105. The top plate 103 is located above the internal conductors 101, the bottom plate 104 is located below the internal conductors 101, and the vertical frame 105 is located between the top plate 103 and the bottom plate 104. The frame 12 is directly embedded in the first magnetic powder material 102.

[0066] Furthermore, the device 10 is positioned above the electronic component 20 and contacts the electronic component 20 via the bottom plate 104 of the frame 12. This effectively conducts the heat generated by the electronic component 20 through the frame 12 to the top plate 103 and the bottom plate 104, further improving heat dissipation performance. In this embodiment, the vertical frame 105 of the frame 12 is located in the middle portion of the inductor 11. This structure provides an effective heat conduction path, transferring heat from the middle portion between the electronic component 20 and the inductor 11 to the top plate 103 and the bottom plate 104 of the frame 12. This design significantly improves heat exchange efficiency and contributes to the overall heat dissipation effect of the device.

[0067] In one embodiment, the top plate 103 and the bottom plate 104 in this frame 12 may optionally have the same or different lengths or widths to optimize heat dissipation.

[0068] In one embodiment, the internal conductor 101 within the frame 12 uses a clip-on structure design, which further reduces the DC resistance of the inductor compared to a coil inductor and improves the efficiency of the inductor in high-current applications, as illustrated in subsequent embodiments.

[0069] In one embodiment, the device 10 can be manufactured through a one-time molding process. The top plate 103, bottom plate 104 and vertical frame 105 of the frame 12 are directly bonded to the first magnetic powder material 102 under high temperature and high pressure, without using a thermal interface material for bonding, thereby eliminating the thermal resistance problem that may occur in the process and achieving the optimal heat dissipation effect.

[0070] It should be noted that thermal interface material (TIM) is a common material in electronic devices, primarily used to fill the gaps between heat-generating components and heat sinks. Because the contact surfaces between heat-generating components (such as integrated circuits, power semiconductor devices, etc.) and heat sinks are usually not perfectly flat, air gaps are created between these irregular surfaces, leading to reduced heat conduction efficiency. Thermal interface materials are used to fill these gaps, reduce thermal resistance, and allow heat to be transferred more effectively from the heat-generating components to the heat dissipation device, such as heat sinks or radiators. There are various types of thermal interface materials, including common ones such as thermally conductive adhesives, thermally conductive pads, thermally conductive tapes, thermally conductive gels, thermally conductive phase change materials, and metal-based thermal interface materials. The thermal conductivity of thermal interface materials is approximately 1 to 2 W / m·K.

[0071] It should be noted that high thermal conductivity materials refer to materials with high thermal conductivity, which can effectively and rapidly transfer heat from one area to another, thereby aiding in thermal management and heat dissipation. Thermal conductivity is usually measured as the amount of heat that can be transferred per unit temperature difference per unit time, and the unit is watts per meter (W / m·K). In the engineering field, the thermal conductivity of high thermal conductivity materials is usually defined as at least greater than 10 W / m·K. In many electronic devices or power module applications, high thermal conductivity materials can also refer to materials with a thermal conductivity greater than 100 W / m·K to meet heat dissipation requirements. Common high thermal conductivity materials include: metallic materials, such as aluminum (~240 W / m·K), copper (~400 W / m·K), silver (~430 W / m·K), etc.; non-metallic materials, such as aluminum nitride (AlN), silicon carbide (SiC), and graphite, which also have high thermal conductivity and good electrical insulation properties, making them very suitable for some applications requiring electrical insulation; composite materials: due to the limitations of single materials, high thermal conductivity fillers (such as boron nitride or carbon nanotubes) are sometimes added to polymer or ceramic matrices to form composite materials with enhanced thermal conductivity properties.

[0072] In this embodiment, the top plate 103 and the bottom plate 104 are connected by a vertical frame 105. In one embodiment, the vertical frame 105 is connected between the top plate 103 and the bottom plate 104, and the vertical frame 105, the top plate 103 and the bottom plate 104 are integrally formed.

[0073] In one embodiment, the frame 12 may be in direct contact with the first magnetic powder material 102, for example, without the need to use a thermal interface material.

[0074] In one embodiment, the top plate 103 and the bottom plate 104 are parallel to each other.

[0075] In one embodiment, the high thermal conductivity material is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc or stainless steel.

[0076] In one embodiment, the high thermal conductivity material is a non-metallic material, including aluminum nitride, silicon carbide or graphite.

[0077] In one embodiment, as shown in FIG2A, the frame 12 and the first magnetic powder material 102 of the inductor 11 are coplanar. That is, the top surface 103a of the top plate 103 and the surface 1021 of the first magnetic powder material 102 are aligned on the same vertical height plane, and the bottom surface 104a of the bottom plate 104 and the surface 1022 of the first magnetic powder material 102 are aligned on the same vertical height plane.

[0078] In one embodiment, as shown in FIG2B, the frame 12 does not extend beyond the surface 1021 or 1022 of the first magnetic powder material 102. That is, the top surface 103a of the top plate 103 does not extend beyond the surface 1021 of the first magnetic powder material 102 in vertical height, and the bottom surface 104a of the bottom plate 104 does not extend beyond the surface 1022 of the first magnetic powder material 102 in vertical height.

[0079] In one embodiment, as shown in FIG2C, the frame 12 extends beyond the surfaces 1021 and 1022 of the first magnetic powder material 102 of the inductor 11. That is, the top surface 103a of the top plate 103 extends beyond the surface 1021 of the first magnetic powder material 102 in vertical height, and the bottom surface 104a of the bottom plate 104 extends beyond the surface 1022 of the first magnetic powder material 102 in vertical height.

[0080] In one embodiment, electronic component 20 includes an integrated circuit chip, an inductor, a capacitor, or a resistor.

[0081] In one embodiment, the frame 12 may be connected to the top plate 103 and the bottom plate 104 by a plurality of vertical frames 105 to improve structural strength.

[0082] In one embodiment, the frame 12 is directly embedded in the first magnetic powder material 102 during the manufacturing process of the inductor 11, instead of using a metal sheet to cover it after the inductor 11 is made, so as to avoid the heat dissipation performance being reduced due to uneven or excessive gaps between the metal sheet and the first magnetic powder material 102 (especially at the turning point of the metal sheet) generated during the metal sheet covering process.

[0083] Figure 3 shows a three-dimensional schematic diagram of the internal conductor 101 and the frame 12 in Figure 2, further demonstrating the three-dimensional structure of the device 10 with an inductor and a high heat transfer frame.

[0084] In this embodiment, the device 10 with an inductor and a high thermal conductivity frame includes an inductor 11 and a frame 12. An internal conductor 101 is embedded in a first magnetic powder material 102 (the first magnetic powder material 102 is not shown; please refer to FIG. 2). A frame is disposed around the first magnetic powder material 102, which is composed of a top plate 103, a bottom plate 104, and at least one vertical frame 105. FIG. 3 clearly shows that the internal conductor 101 uses a clip-on structure design, with the top plate 103 located above the internal conductor 101, the bottom plate 104 located below the internal conductor 101, and the vertical frame 105 located between the top plate 103 and the bottom plate 104, forming a stable support structure.

[0085] In this embodiment, the top plate 103 is a flat structure used to contact other heat dissipation components (such as heat sinks) to conduct the heat generated by the electronic components 20 and the inductor 11 to the external environment. The vertical frame 105 directly penetrates and is fixed between the top plate 103 and the bottom plate 104. The vertical frame is located in the middle part of the inductor, providing a path for heat conduction, effectively transferring heat from the inside of the inductor 11 to the top plate 103 and the bottom plate 104, further improving heat dissipation performance.

[0086] Figure 4 shows a device 30 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. In this embodiment, the frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 located between the top plate and the bottom plate. The frame 12 is in direct contact with or connected to a first magnetic powder material 102 via a thermal interface material, and covers the upper and lower surfaces of the internal conductor 101 to provide structural support and a heat conduction path.

[0087] As shown in Figure 4, the surface of the top plate 103 is connected to a high thermal conductivity object 106, for example, through a layer of thermal interface material 41. The high thermal conductivity object 106 is, for example, but not limited to, a heat sink. The thermal interface material 41 fills the space between the top plate 103 and the high thermal conductivity object 106 to reduce the contact thermal resistance between them and more effectively conduct the heat generated during the operation of the electronic components 20 and the inductor 11 to the high thermal conductivity object 106. Through this structural design, the high thermal conductivity object 106 can help quickly dissipate the heat generated by the inductor 11 and the electronic components 20, further improving the heat dissipation efficiency of the entire device.

[0088] The high thermal conductivity object 106 is made of a high thermal conductivity material. A high thermal conductivity object refers to a material or structure with high thermal conductivity, capable of rapidly and effectively transferring heat from a heat source to other parts or a heat dissipation system. Such objects are crucial in thermal management applications, especially in electronic devices or high-power components requiring rapid heat dissipation. High thermal conductivity materials typically refer to metallic materials, ceramic materials, or graphite and thermally conductive composite materials. Metals generally have good thermal conductivity, such as copper, aluminum, silver, and gold. Certain ceramic materials, such as aluminum nitride (AlN) and silicon carbide (SiC), also have high thermal conductivity and electrical insulation properties, thus they are often used in packaging materials for electronic components or heat dissipation substrates. Graphite is a material with a unique structure and high thermal conductivity, suitable for use in ultra-thin heat sinks. Some composite materials are made by mixing metals with ceramics or carbon materials, possessing both thermal conductivity and structural strength, achieving optimal results in specific applications. The high thermal conductivity object 106 is, for example, but not limited to, a heat sink or heat fin. Heat sinks are used to handle the heat from electronic components such as processors and power modules, and dissipate heat through convection or radiation. Heat sinks are usually made of metals with high thermal conductivity, which increases the surface area so that heat can be transferred from the components to the environment more quickly.

[0089] FIG5 shows one embodiment of the present invention. As shown in FIG5, in the device 50 having an inductor and a high thermal conductivity frame, the top plate 103 and the bottom plate 104 have different lengths. This embodiment is intended to illustrate that the dimensions of the top plate 103 and the bottom plate 104 can be different, specifically that the length and width can be different, and the length-to-width ratio of each can also be different.

[0090] FIG6 shows an embodiment of the present invention. As shown in FIG6, in the device 70 having an inductor and a high thermal transfer frame, except that the top plate 103 and the bottom plate 104 have different lengths, the vertical frame includes a connecting rod 107, and the connecting rod 107 is connected between the top plate 103 and the bottom plate 104, and the position of the connecting rod 107 can be provided on the side of the inductor 11, rather than necessarily in the middle part of the inductor 11.

[0091] Figures 7, 8, 9 and 10 show several embodiments of the present invention. As shown in Figures 7, 8, 9 and 10, in devices 90, 110, 130 and 150 having an inductor and a high thermal conductivity frame, a connecting rod 107 is connected between a top plate 103 and a bottom plate 104, and in these embodiments, the number of connecting rods 107 may be different, and the positions of the connecting rods 107 may be arranged in different ways.

[0092] FIG11 shows an embodiment of the present invention. As shown in FIG11, in the device 170 having an inductor and a high thermal transfer frame, the lengths of the top plate 103 and the bottom plate 104 may optionally not exceed the vertical frame, the vertical frame including a connecting rod 107, and the connecting rod 107 connecting between the top plate 103 and the bottom plate 104, and the position of the connecting rod 107 may be set in the middle part of the inductor 11.

[0093] Figure 12 shows a device 190 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. In this embodiment, the frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 connecting the top plate 103 and the bottom plate 104. The frame 12 may be in direct contact with or connected to a first magnetic powder material 102 via a thermal interface material, and covers the upper and lower surfaces of the internal conductor 101 to provide structural support and a heat conduction path. The top plate 103, the bottom plate 104, and the vertical frame 105 are, for example, integrally formed.

[0094] As shown in Figure 12, a high thermal conductivity object 106 can be connected to the side of the frame 12 for heat dissipation. In this embodiment, a high thermal conductivity object 106 is connected to the side of the top plate 103 of the frame 12 and the side of the bottom plate 104 of the frame 12, thereby more effectively conducting the heat generated by the electronic components 20 and the inductor 11 during operation to the high thermal conductivity object 106. Furthermore, the side of the top plate 103 and the side of the bottom plate 104 are connected to the heat sink 106, for example, through a layer of thermal interface material (thermal interface material 41 as shown in Figure 47). Through this structural design, the high thermal conductivity object 106 can help quickly dissipate the heat generated by the inductor 11 and the electronic components 20, further improving the heat dissipation efficiency of the entire device.

[0095] Figure 13 shows a device 210 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. In this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103 and a lower vertical frame 1052 integrally formed with the bottom plate 104, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are separated by a gap g and are not directly connected, wherein the gap g is less than one-quarter of the vertical distance d between the top plate 103 and the bottom plate 104.

[0096] FIG14 shows a device 230 having an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. Similar to the embodiment shown in FIG13, in this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103 and a lower vertical frame 1052 integrally formed with the bottom plate 104, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are separated by a gap g and are not directly connected; the difference between this embodiment and the embodiment shown in FIG13 is that in this embodiment, the surface of the top plate 103 is connected to a high thermal conductivity object 106, wherein the high thermal conductivity object 106 is, for example, but not limited to, a heat sink.

[0097] Figure 15 shows a device 250 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. Similar to the embodiment shown in Figure 13, in this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103 and a lower vertical frame 1052 integrally formed with the bottom plate 104, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are separated by a gap g and are not directly connected; the difference between this embodiment and the embodiment shown in Figure 13 is that in this embodiment, the top plate 103 and the bottom plate 104 have different lengths.

[0098] FIG16 shows an apparatus 270 having an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. In this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103 and a lower vertical frame 1052 integrally formed with the bottom plate 104, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are separated by a gap g and are not directly connected; this embodiment differs from the embodiment shown in FIG13 in that, in this embodiment, the upper vertical frame 1051 and the lower vertical frame 1052 are not in the middle portion of the inductor 11 but on the right side of the inductor 11; furthermore, the bottom plate 104 includes a first bottom plate 1041 and a second bottom plate 1042 that are not connected.

[0099] Figure 17 shows a device 290 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. Unlike the embodiment shown in Figure 13, in this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103, a lower vertical frame 1052 integrally formed with the bottom plate 104, and a connecting rod 17, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are connected by the connecting rod 17; wherein the connecting rod 17 is made of a high thermal conductivity material. The high thermal conductivity material used to make the connecting rod 17 may be the same as or different from the high thermal conductivity material used to make the upper vertical frame 1051 and the lower vertical frame 1052 of the top plate 103 and the bottom plate 104.

[0100] Figure 18 shows a device 310 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. In this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103, a lower vertical frame 1052 integrally formed with the bottom plate 104, and a connecting rod 17, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are connected by the connecting rod 17; wherein the connecting rod 17 is made of a high thermal conductivity material. The high thermal conductivity material used to make the connecting rod 17 may be the same as or different from the high thermal conductivity material used to make the upper vertical frame 1051 and the lower vertical frame 1052 of the top plate 103 and the bottom plate 104. The difference from the embodiment shown in FIG17 is that in this embodiment, the upper vertical frame 1051, the lower vertical frame 1052 and the connecting rod 17 are not in the middle part of the inductor 12, while the vertical frame 105 in the embodiment shown in FIG17 is located in the middle part of the inductor 12.

[0101] FIG19 shows a device 330 having an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. In this embodiment, the top plate 103 includes a first top plate 1031 and a second top plate 1032 that are not connected; the vertical frame 105 includes a first upper vertical frame 10511, a first lower vertical frame 10521, a second upper vertical frame 10512, a second lower vertical frame 10522, a first connecting rod 1071, and a second connecting rod 1072. The first upper vertical frame 10511 is integrally formed with the first top plate 1031; the first lower vertical frame 10521 is integrally formed with the bottom plate 104; the second upper vertical frame 10512 is integrally formed with the second top plate 1032; and the second lower vertical frame 10522 is integrally formed with the bottom plate 104. The first upper vertical frame 10511 and the first lower vertical frame 10521, which are located in the middle part of the inductor 11, are connected by the first connecting rod 1071; while the second upper vertical frame 10512 and the second lower vertical frame 10522, which are not located in the middle part of the inductor 11, are connected by the second connecting rod 1072.

[0102] FIG20 shows a device 350 having an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 located between the top plate 103 and the bottom plate 104. In this embodiment, the configuration of the top plate 103 and the vertical frame 105 has improved features to further enhance heat dissipation and structural strength. The vertical frame 105 includes an upper vertical frame 1051 located on the side portion of the inductor 11 and integrally formed with the top plate 103, a first connecting rod 1071, a lower vertical frame 1052 located in the middle portion of the inductor 11 and integrally formed with the bottom plate 104, a second connecting rod 1072, a first upper vertical frame 10511 located on the other side portion of the inductor and integrally formed with the top plate 103, a first lower vertical frame 10521 integrally formed with the bottom plate 104, and a third connecting rod 1073. The first upper vertical frame 10511 and the first lower vertical frame 10521 are connected by a third connecting rod 1073. The upper vertical frame 1051 is connected to the base plate 104 via the first connecting rod 1071, providing an additional heat conduction path. The lower vertical frame 1052 is connected to the top plate 103 via the second connecting rod 1072. Furthermore, the configuration of the vertical frames 105 makes the structure more robust, helping to maintain the thermal management efficiency and structural integrity of the device under various operating conditions.

[0103] FIG21 shows an apparatus 370 having an inductor and a high thermal conductivity frame according to one embodiment of the present invention. The frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame 105 between the top plate 103 and the bottom plate 104. In this embodiment, the vertical frame 105 includes an upper vertical frame 1051 integrally formed with the top plate 103, a lower vertical frame 1052 integrally formed with the bottom plate 104, and a connecting rod 17, wherein the upper vertical frame 1051 and the lower vertical frame 1052 are connected by the connecting rod 17. Unlike the embodiment shown in FIG17, in this embodiment, the top plate 103 is located on the left side of the inductor 11, while the bottom plate 104 is located on the right side of the inductor 11.

[0104] FIG22 shows an apparatus 390 having an inductor and a high thermal conductivity frame according to one embodiment of the present invention. In this embodiment, the frame 12 includes a top plate 103, a bottom plate 104, and a vertical frame connecting the top plate 103 and the bottom plate 104, wherein the vertical frame includes a connecting rod 107. As shown in FIG12, a high thermal conductivity object 106 can be connected to the side of the frame 12 for heat dissipation. In this embodiment, a high thermal conductivity object 106 is connected to the side of the top plate 103 of the frame 12 and the side of the bottom plate 104 of the frame 12, thereby more effectively conducting the heat generated during the operation of the electronic components 20 and the inductor 11 to the high thermal conductivity object 106. The connecting rod 107 is made of a high thermal conductivity material, and the high thermal conductivity material used to make the connecting rod 107 is different from the high thermal conductivity material used to make the top plate 103 and the bottom plate 104.

[0105] Figure 23 shows a device 410 with an inductor and a high thermal conductivity frame according to one embodiment of the present invention. This embodiment differs from the embodiment shown in Figure 2 in that, in this embodiment, the device 410 with the inductor and high thermal conductivity frame further includes a second magnetic powder material 108, wherein the second magnetic powder material 108 covers the lateral (indicated by arrows in Figure 23) exterior of the first magnetic powder material 102. In one embodiment, the first magnetic powder material 102 and the second magnetic powder material 108 are two different magnetic powders. The first magnetic powder material 102 is used to determine the inductance value of the inductor 11, and the second magnetic powder material 108 is used for outer layer protection and heat dissipation of the structure. In one embodiment, the structure consisting of the second magnetic powder material 108, the first magnetic powder material 102, the internal conductor 101, and the frame 12 is integrally formed.

[0106] Figures 24A to 24D show schematic diagrams of the manufacturing steps of a device 10 having an inductor and a high thermal conductivity frame according to an embodiment of the present invention. First, as shown in Figure 24A, at least two internal conductors 101 and a frame 12 are provided. Next, as shown in Figure 24B, at least two internal conductors 101 and the frame 12 are placed in a first mold 13, such that the at least two internal conductors 101 and the top plate 103, bottom plate 104 and vertical frame 105 of the frame 12 are positioned at predetermined positions. Next, as shown in Figure 24C, a first magnetic powder material 10 is added to the first mold 13, and the first magnetic powder material 10 is filled between the frame 12 and the internal conductors 101. Next, the first mold 13 is subjected to high temperature and high pressure treatment, so that the first magnetic powder material 102, the internal conductors 101 and the frame 12 are integrally formed, forming one of an inductor 11 and a frame 12 embedded in the first magnetic powder material 102. Next, as shown in FIG24D, the formed structure is removed from the first mold 13 to produce a device 10 having an inductor 11 and a high thermal conductivity frame 12.

[0107] In one embodiment, in the step shown in FIG24A, the internal conductor 101 is a clip-on structure to reduce DC resistance.

[0108] In one embodiment, in the steps shown in FIG24C, the frame 12 is directly bonded to the first magnetic powder material 102 without using a thermal interface material.

[0109] Figures 25A to 25C show schematic diagrams of the manufacturing steps of a device 410 having an inductor and a high heat transfer frame according to an embodiment of the present invention. The manufacturing steps of the method for forming a structure of an inductor 11 and a frame 12 embedded in a first magnetic powder material 102 are shown in Figures 24A to 24D. Continuing from Figure 24D, as shown in Figure 25A, the structure is placed in a second mold 14, positioning it at a predetermined position. Next, as shown in Figure 25B, a second magnetic powder material 108 is added to the second mold 14, filling the lateral exterior of the first magnetic powder material 102. Then, the second mold 14 is subjected to high temperature and high pressure treatment, fixing the second magnetic powder material 108 and the first magnetic powder material 102 laterally, thereby producing a device 410 having an inductor and a high heat transfer frame, as shown in Figure 25C.

[0110] Figures 26A to 26C show schematic diagrams of the steps of a method for manufacturing a device 430 having an inductor and a high thermal conductivity frame according to an embodiment of the present invention. First, as shown in Figure 26A, at least two individual sub-inductors 11' are manufactured, each sub-inductor 11' having at least one internal conductor 101', each internal conductor 101' being embedded in a corresponding first magnetic powder material 102'. Next, as shown in Figure 26B, a frame 12 is provided, the frame 12 including a top plate 103, a bottom plate 104, and at least one vertical frame 105. Next, as shown in Figure 26C, at least two sub-inductors 11' are assembled into the frame 12, such that the top plate and the bottom plate are respectively located on the upper and lower sides of the at least two sub-inductors, forming a structure to produce the device having an inductor and a high thermal conductivity frame.

[0111] In one embodiment, the device 430 having an inductor and a high thermal conductivity frame may also be, as shown in the embodiments of FIG25A to 25C, have a second magnetic powder material wrapped around the outside of the structure, please refer to FIG25A to 25C.

[0112] The present invention has been described above with reference to embodiments. However, the above description is only for the purpose of enabling those skilled in the art to easily understand the content of the present invention, and is not intended to limit the scope of the present invention. Under the same spirit of the present invention, those skilled in the art can conceive of various equivalent changes. For example, the frame may be arranged on a different number of electronic components than in the drawing, or the frame and sub-inductors may be placed in a different order, or the shape of the frame may be different from that in the drawing, etc. The scope of the present invention should cover the above and all other equivalent changes. [Simplified Explanation of the Diagram]

[0039] Figure 1 shows a schematic diagram of an inductor structure according to prior art US Patent US11770916.

[0040] Figures 2A, 2B and 2C show schematic diagrams of devices having an inductor and a high heat transfer frame according to various embodiments of the present invention.

[0041] Figure 3 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0042] Figure 4 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0043] Figure 5 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0044] Figure 6 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0045] Figure 7 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention. Figure 8 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0046] Figure 9 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0047] Figure 10 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0048] Figure 11 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0049] Figure 12 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0050] Figure 13 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0051] Figure 14 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0052] Figure 15 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0053] Figure 16 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0054] Figure 17 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0055] Figure 18 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0056] Figure 19 shows a schematic diagram of an apparatus having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0057] Figure 20 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0058] Figure 21 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0059] Figure 22 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0060] Figure 23 shows a schematic diagram of a device having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0061] Figures 24A to 24D show schematic diagrams of the manufacturing steps of a device 10 having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0062] Figures 25A to 25C show schematic diagrams of the steps of a method for manufacturing a device 410 having an inductor and a high heat transfer frame according to an embodiment of the present invention.

[0063] Figures 26A to 26C show schematic diagrams of the manufacturing steps of a device 430 having an inductor and a high heat transfer frame according to an embodiment of the present invention.

Claims

1. An apparatus having an inductor and a high thermal conductivity frame, comprising: an inductor having at least two internal conductors, the inductor being embedded in a first magnetic powder material; and a frame made of a high thermal conductivity material, the frame including a top plate above the at least two internal conductors, a bottom plate below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate, the frame being embedded in the first magnetic powder material; wherein, The device is mounted on an electronic component and contacts the electronic component through the base plate of the frame.

2. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein one of the at least one vertical frame comprises one of the following forms: the vertical frame is connected between the top plate and the bottom plate, and the vertical frame, the top plate, and the bottom plate are integrally formed; the vertical frame includes a connecting rod, and the connecting rod is connected between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are directly connected, or the upper vertical frame and the lower vertical frame have a gap and are not directly connected, wherein the gap is less than one-quarter of a vertical distance between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are connected by a connecting rod; wherein the connecting rod is made of a high thermal conductivity material.

3. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the high thermal conductivity material is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc or stainless steel.

4. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the high thermal conductivity material is a non-metallic material, including aluminum nitride, silicon carbide, or graphite.

5. The apparatus having an inductor and a high thermal conductivity frame as described in claim 1, wherein the frame is coplanar with the first magnetic powder material of the inductor or the frame does not extend beyond the surface of the first magnetic powder material.

6. The apparatus having an inductor and a high thermal conductivity frame as described in claim 1, wherein the frame extends beyond the surface of the first magnetic powder material of the inductor.

7. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the surface of the top plate can be connected to a high thermal conductivity object through a thermal interface material to enhance heat dissipation.

8. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the electronic component includes an integrated circuit chip, an inductor, a capacitor, or a resistor.

9. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein at least one high thermal conductivity object can be connected to the side of the frame for heat dissipation.

10. The device having an inductor and a high thermal conductivity frame as described in claim 9, wherein the at least one high thermal conductivity object is connected to the top plate or the bottom plate.

11. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the frame is embedded in the first magnetic powder material, and the top plate, the bottom plate and the vertical frame of the frame are in direct contact with the first magnetic powder material without using a thermal interface material for bonding.

12. The device having an inductor and a high thermal conductivity frame as described in claim 11, wherein the frame is manufactured by a one-piece molding process, and the top plate, the bottom plate and the vertical frame are directly bonded to the first magnetic powder material under high temperature and high pressure.

13. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the frame is composed of a plurality of vertical frames connecting the top plate and the bottom plate to improve structural strength.

14. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the internal conductor of the inductor has a clip-on structure to reduce DC resistance.

15. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the length or width of the top plate and the bottom plate of the frame may be selected to be the same or different to optimize heat dissipation performance.

16. The device having an inductor and a high thermal conductivity frame as claimed in claim 1, wherein the vertical frame is located in the middle portion of the inductor, contacts the top plate and the bottom plate, and provides a thermal conduction path to transfer heat from the middle portion of the inductor to the top plate and the bottom plate.

17. The device having an inductor and a high thermal conductivity frame as described in claim 1, wherein the frame is directly embedded in the first magnetic powder material during the manufacturing process of the inductor, rather than being covered with a metal sheet after the inductor is manufactured, so as to avoid uneven or excessive gaps caused by the metal sheet covering process, thereby improving heat dissipation performance.

18. The device having an inductor and a high thermal conductivity frame as claimed in claim 1, further comprising: a second magnetic powder material covering the exterior of a structure consisting of the first magnetic powder material, the internal conductor, and the frame.

19. The device having an inductor and a high thermal conductivity frame as described in claim 18, wherein the first magnetic powder material and the second magnetic powder material are two different magnetic powders, the first magnetic powder material being used to determine the inductance value of the inductor, and the second magnetic powder material being used for outer layer protection and heat dissipation.

20. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame, the apparatus comprising an inductor having at least two internal conductors, and a frame made of a high thermal conductivity material, the frame including a top plate above the at least two internal conductors, a bottom plate below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate, the frame being embedded in and in direct contact with a magnetic powder material; the method of manufacturing the apparatus comprising: (a) providing the at least two internal conductors and the frame; (b) placing the at least two internal conductors and the frame in a first mold, such that the at least two internal conductors and the top plate, the bottom plate and the vertical frame of the frame are positioned at predetermined positions; (c) adding a first magnetic powder material into the first mold, filling the space between the frame and the internal conductors with the first magnetic powder material; (d) The first mold is subjected to high temperature and high pressure treatment to integrally form the first magnetic powder material, the internal conductor and the frame to form a structure of an inductor and a frame embedded in the first magnetic powder material; and (e) the formed structure is removed from the first mold to produce the device having an inductor and a high heat transfer frame.

21. A method of manufacturing a device having an inductor and a high thermal conductivity frame as described in claim 20, wherein in step (a), the internal conductor has a clip-on structure to reduce DC resistance.

22. The method of manufacturing the device having an inductor and a high thermal conductivity frame as described in claim 20, further comprising: (f) placing the structure in a second mold to position the structure at a predetermined position; (g) adding a second magnetic powder material to the second mold to fill the exterior of the structure; and (h) subjecting the second mold to high temperature and high pressure treatment to integrally form the second magnetic powder material and the structure to produce the device having an inductor and a high thermal conductivity frame.

23. A method for manufacturing a device having an inductor and a high thermal conductivity frame as described in claim 22, wherein the first magnetic powder material and the second magnetic powder material are two different magnetic powders, the first magnetic powder material is used to determine the inductance value of the inductor, and the second magnetic powder material is used for outer layer protection and heat dissipation.

24. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as claimed in claim 20, wherein one of the at least one vertical frame comprises one of the following forms: the vertical frame is connected between the top plate and the bottom plate, and the vertical frame, the top plate, and the bottom plate are integrally formed; the vertical frame includes a connecting rod, and the connecting rod is connected between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are directly connected, or the upper vertical frame and the lower vertical frame have a gap and are not directly connected, wherein the gap is less than one-quarter of a vertical distance between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are connected by a connecting rod; wherein the connecting rod is made of a high thermal conductivity material.

25. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 20, wherein the high thermal conductivity material is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

26. A method for manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 20, wherein the high thermal conductivity material is a non-metallic material, including aluminum nitride, silicon carbide, or graphite.

27. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 20, wherein in step (d), the frame is directly bonded to the first magnetic powder material without using a thermal interface material.

28. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 20, wherein the length or width of the top plate and the bottom plate of the frame may be selected to be the same or different to optimize heat dissipation performance.

29. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 20, wherein in step (b), the frame is composed of a plurality of the vertical frames connecting a top plate and a bottom plate to improve structural strength.

30. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 20, wherein after step (e), the top surface of the inductor is connected to a high thermal conductivity object by means of a thermal interface material.

31. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame, the apparatus comprising an inductor having at least two internal conductors, and a frame made of a high thermal conductivity material, the frame comprising a top plate above the at least two internal conductors, a bottom plate below the at least two internal conductors, and at least one vertical frame between the top plate and the bottom plate, the frame being embedded in and in direct contact with a magnetic powder material; the method of manufacturing the apparatus comprising: (a) manufacturing at least two separate sub-inductors, each sub-inductor having at least one internal conductor and being embedded in a first magnetic powder material; (b) providing the frame; and (c) assembling the at least two sub-inductors into the frame such that the top plate and the bottom plate are respectively located on the upper and lower sides of the at least two sub-inductors, forming a structure to produce the apparatus having an inductor and a high thermal conductivity frame.

32. The method of manufacturing the device having an inductor and a high thermal conductivity frame as described in claim 31 further comprises: (d) placing the structure in a mold to position the structure at a predetermined position; (e) adding a second magnetic powder material to the mold to fill the exterior of the structure; and (f) subjecting the mold to high temperature and high pressure treatment to integrally form the second magnetic powder material and the structure to produce the device having an inductor and a high thermal conductivity frame.

33. A method of manufacturing an apparatus having an inductor and a high thermal transfer frame as claimed in claim 31, wherein in step (c), the frame is connected to at least two sub-inductors by an adhesive or a thermal interface material.

34. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as described in claim 32, wherein the first magnetic powder material and the second magnetic powder material are two different magnetic powders, the first magnetic powder material is used to determine the inductance value of the inductor, and the second magnetic powder material is used for outer layer protection and heat dissipation.

35. A method of manufacturing an apparatus having an inductor and a high thermal conductivity frame as claimed in claim 31, wherein one of the at least one vertical frame comprises one of the following: the vertical frame is connected between the top plate and the bottom plate, and the vertical frame, the top plate, and the bottom plate are integrally formed; the vertical frame includes a connecting rod, and the connecting rod is connected between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are directly connected, or the upper vertical frame and the lower vertical frame have a gap and are not directly connected, wherein the gap is less than one-quarter of a vertical distance between the top plate and the bottom plate; the vertical frame includes an upper vertical frame integrally formed with the top plate and a lower vertical frame integrally formed with the bottom plate, wherein the upper vertical frame and the lower vertical frame are connected by a connecting rod; wherein the connecting rod is made of a high thermal conductivity material.

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