Substrate processing system and substrate processing system installation method

Abstract

This invention relates to a substrate processing system and a method for setting up a substrate processing system, and more specifically, to a substrate processing system and a method for setting up a substrate processing system having a combination of a substrate processing apparatus and a substrate transport apparatus. The invention discloses a substrate processing system comprising: a processing module forming an opening for introducing and discharging a substrate and performing substrate processing; a transport module disposed adjacent to the processing module for transporting the substrate between the processing module and the transport module; and a gate valve disposed in at least one of the processing module and the transport module to open and close the opening, and engaging with the other one by magnetic force.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing system and a method for setting up a substrate processing system, and more specifically, to a substrate processing system and a method for setting up a substrate processing system having a combination of a substrate processing apparatus and a substrate transport apparatus. [Previous Technology]

[0002] Typically, a substrate processing system includes: a loading locking module for introducing a substrate and converting the pressure between the outside and the inside of the substrate processing system; a substrate transport device for transporting the substrate introduced by the loading locking module; and a substrate processing device disposed adjacent to the substrate transport device for processing the introduced substrate.

[0003] At this time, the existing substrate processing system connects the processing module of the substrate processing device and the transport module of the substrate transport device through a gate valve. The gate valve is usually connected to the processing module and the transport module by means of a clamp or the like.

[0004] As described above, the existing substrate processing system is typically structured with a single substrate transport device as the center and multiple substrate processing devices arranged in a limited space. Due to the narrow operating space, it is difficult to set up and replace the processing modules and gate valves, and the operation time is long.

[0005] In particular, in the case of a substrate processing system in which a plurality of processing modules are stacked in the vertical direction and a plurality of transport modules are stacked therecorrespondingly, not only is the space between the transport modules and the processing modules very small, but the vertical space of the gate valve is also very small, so access is restricted, and there is a problem of difficulty in setting up and removing the processing modules. [Summary of the Invention]

[0006] Technical Problems to be Solved

[0007] The object of the present invention is to provide a substrate processing system and a method for setting up the substrate processing system that allows for easy connection and separation between the processing module and the gate valve, in order to solve the problems described above. (Means for Solving the Problem)

[0008] This invention is proposed to achieve the objectives of the invention as described above. The invention discloses a substrate processing system, comprising: a processing module forming an opening for introducing and discharging a substrate and performing substrate processing; a transport module disposed adjacent to the processing module for transporting the substrate between the processing module and the processing module; and a gate valve disposed in at least one of the processing module and the transport module to open and close the opening, and being magnetically coupled to the other one.

[0009] The processing module may include: a process chamber, into which the substrate is introduced and forming an internal space for performing substrate processing; and a magnetic body disposed in the process chamber to be coupled to the gate valve by magnetic force.

[0010] The magnetic body may be disposed in the opposite face of the transport module in the process chamber at a position adjacent to the opening.

[0011] The gate valve may include: a valve housing disposed between the processing module and the transport module; and a magnetic force generating unit disposed on the valve housing and generating the magnetic force.

[0012] The magnetic force generating unit is combined with the processing module by the magnetic force; the gate valve may include a connecting plate, which is disposed on the valve housing and combined with the transport module.

[0013] The magnetic force generating part can be configured as a pair on both sides of the valve housing.

[0014] The magnetic force generating unit can eliminate the magnetic force when power is supplied, and maintain the magnetic force when power is not supplied.

[0015] The processing module is provided with either a groove or a protrusion on the side facing the gate valve for alignment with the gate valve; the gate valve may be provided with the other one at a position corresponding to either the groove or the protrusion on the side facing the processing module.

[0016] The processing module may be configured in multiple ways in the up and down direction.

[0017] The substrate processing system may include a frame portion, which forms a plurality of configuration spaces in the vertical direction to respectively place and set the processing module.

[0018] The frame portion may include: a plurality of vertical frames having a vertical length; and a support frame arranged horizontally on the vertical frames, and distinguishing the arrangement space in the vertical direction, and supporting the processing module.

[0019] The frame portion may include: a movable track portion disposed on the support frame to allow the processing module supported by the support frame to slide toward the transport module side; and a movable portion coupled to the processing module and movably disposed on the movable track portion.

[0020] The transport module corresponds to a plurality of the processing modules, and a plurality of them can be configured in the vertical direction.

[0021] This invention discloses a method for setting up a substrate processing system, used for setting up and replacing a processing module of a substrate processing system, including: a processing module transfer step, moving the processing module to align with a gate valve; a magnetic coupling step, generating a magnetic force in the gate valve to magnetically couple the processing module with the gate valve; and a processing module fixing step, fixing the position of the processing module after the magnetic coupling step.

[0022] The substrate processing system setting method may further include a vacuum pressure setting step, wherein the vacuum pressure setting step draws air from the inside of the processing module between the magnetic bonding step and the processing module fixing step to set it to a vacuum.

[0023] The magnetic coupling step may shut off the power supply to the gate valve to generate the magnetic force.

[0024] The substrate processing system includes a frame portion, which forms a configuration space for placing and setting the processing module; the processing module fixing step combines and fixes the processing module, which is fixed to the gate valve by the magnetic bonding step, to the frame portion.

[0025] In addition, the present invention discloses a substrate processing system setting method for setting and replacing processing modules of a substrate processing system, comprising: a coupling release step, wherein the magnetic force of a gate valve is eliminated to release the magnetic coupling between the processing module and the gate valve; a processing module fixation release step, wherein the fixation of the processing module is released after the coupling release step; and a processing module removal step, wherein the processing module that has been released from fixation by the processing module fixation release step is removed.

[0026] The substrate processing system setting method may include an atmospheric pressure setting step, wherein the atmospheric pressure setting step sets the internal pressure of the processing module to atmospheric pressure before the bonding and unbinding step.

[0027] The aforementioned disengagement step prevents the generation of magnetic force by supplying power to the gate valve.

[0028] The substrate processing system includes a frame portion that forms a configuration space for placing and setting the processing module; the processing module fixing release step can release the processing module, which has been separated from the gate valve by the coupling release step, from the frame portion. (Effects of the Invention)

[0029] According to the substrate processing system and substrate processing system setting method of the present invention, the processing module is set by magnetic connection that is relatively easy to connect and separate from the gate valve, thereby having the advantage of easy connection and separation during the setting and replacement process.

[0030] In addition, according to the substrate processing system and substrate processing system setting method of the present invention, the setting and separation can also be achieved by magnetic coupling in the relatively small space between the transport module and the processing module where the gate valve is set, thus having the advantage of improving the operating efficiency and accuracy of the processing module.

[0031] In particular, the substrate processing system and substrate processing system setting method according to the present invention, having a substrate processing system having a plurality of processing modules and transport modules arranged in the vertical direction, can achieve setting and separation by magnetic coupling even when the space at the setting position of the processing module is small and access is restricted, thus having the advantage that the processing modules can be easily set and replaced.

[0032] In addition, the substrate processing system according to the present invention uses a planar motor with magnetic levitation in the transport module and the upper and lower transport module, which has the advantages of eliminating particle problems caused by friction and being able to transport the substrate quickly.

Implementation Method

[0034] The substrate processing system according to the present invention will be described in detail below with reference to the drawings.

[0035] As shown in Figures 1 to 3, the substrate processing system according to the present invention includes: a substrate processing apparatus 10, wherein a plurality of processing modules 100 are arranged in a vertical direction; a substrate transport apparatus 20, wherein a plurality of transport modules 200 are arranged in a vertical direction corresponding to the processing modules 100; and a vertical transport module 300, configured to communicate with the plurality of transport modules 200 simultaneously and to transport substrate 1 in a vertical direction so as to transfer substrate 1 between transport modules 200.

[0036] Here, the substrate 1 that is the object of processing can be understood to include all substrates such as substrates used in display devices such as LED, LCD, and OLED, semiconductor substrates, solar cell substrates, and glass substrates.

[0037] Furthermore, as long as the process performed in the substrate processing system according to the present invention is a process for processing a substrate, any process disclosed previously can be applied. For example, processes such as deposition, etching, and heat treatment can be performed.

[0038] In addition, as shown in FIG1, the substrate processing system according to the present invention may further include a plurality of loading locking modules 30, which are respectively arranged in the vertical direction corresponding to the transport module 200, and perform at least one of importing the substrate 1 from the outside and exporting the substrate 1 to the outside.

[0039] In addition, the substrate processing system according to the present invention may also include a front-end module 40, which is in an atmospheric pressure environment and is disposed in front of the loading and locking module 30 for exchanging substrates 1 with the loading and locking module 30.

[0040] The loading locking module 30 is provided on the side of the substrate transport device 20 described later for transporting the substrate 1 to the outside, and various structures are possible.

[0041] In particular, the loading locking module 30 is configured as a structure that is respectively arranged in the vertical direction corresponding to the transport module 200 and performs at least one of importing the substrate 1 from the outside and exporting the substrate 1 to the outside, and a plurality of loading locking modules 30 can be configured.

[0042] More specifically, the function and purpose of the multiple loading locking modules 30 configured in the up and down direction are specified, and the substrate 1 is introduced into the upper or lower layer and the substrate 1 is exported from the lower or upper layer, so as to guide the continuous transport process of the substrate 1.

[0043] Therefore, among the plurality of loading locking modules 30, one part may be a loading locking module for importing substrate 1 from the outside, while another part may be a loading locking module for exporting substrate 1 to the outside.

[0044] That is, a portion of the plurality of loading locking modules 30 may be loading locking modules for importing substrate 1 from the outside, while at least one of the remaining portions may be loading locking modules for exporting substrate 1 to the outside.

[0045] On the other hand, unlike the above, each loading lock module 30 can of course be both imported and exported.

[0046] In addition, the loading locking module 30 is configured as a single unit, adjacent to the single transport module 200, so that the substrate 1 can be transferred between the vacuum transport module 200 and the device front-end module 40 arranged in front under atmospheric pressure while maintaining vacuum pressure.

[0047] In addition, as shown in FIG4, when multiple transport modules 200 are configured in the vertical direction, multiple loading locking modules 30 can be configured in the vertical direction for each multiple transport module 200. As another example, the loading locking module 30 that forms a single loading locking space can also be configured to be connected together by multiple transport modules 200.

[0048] The front-end module 40 of the equipment can have various structures as it forms an atmospheric pressure environment and is configured in front of the loading and locking module 30 for exchanging substrate 1 with the loading and locking module 30.

[0049] For example, the device front-end module 40 serves as a means of transporting the substrate 1 between the outside of the EFEM (device front-end module) and the transport module 200. For example, the device front-end module 40 may include a port and a robot, the port being used to place a carrier for transporting the substrate 1, and the robot being used to transfer the substrate 1 between the port and the loading locking module 30.

[0050] The substrate processing apparatus 10 can have various structures as a structure for performing substrate processing such as deposition, etching, and heat treatment on the substrate 1.

[0051] The substrate processing apparatus 10 can be configured with a plurality of processing modules 100 in the vertical direction. For this purpose, it can include a frame portion 400 and a plurality of processing modules 100. The frame portion 400 forms a plurality of configuration spaces S3 in the vertical direction, and the plurality of processing modules 100 are respectively placed and disposed in the configuration spaces S3.

[0052] The processing module 100 is a structure that performs processing on the substrate 1. It can be a structure that imports the substrate 1 into the module to perform substrate processing and then exports the processed substrate 1 to the transport module 200.

[0053] At this time, the processing module 100 is a module, and a plurality of processing modules 100 can be configured in the vertical direction above the frame part 400 described later. More specifically, they can be placed and set in the vertical configuration space S3 respectively.

[0054] In addition, the processing module 100 can be installed in the frame section 400 as a module itself for easy installation and replacement. More specifically, when placed in the frame section 400 and supported, it can move linearly by sliding, thereby being installed adjacent to the transport module 200 and can be separated from the transport module 200 and released.

[0055] For this purpose, the moving part 440 of the processing module 100 placed in the frame part 400 described later can be supported and fastened to the moving part 440 by fastening bolts 450, so that it can move linearly together with the moving part 440 that moves linearly on the moving track part 430.

[0056] In addition, when the processing module 100 is moving to a preset position via the moving part 440, that is, when it is moving to a setting position adjacent to the transport module 200, the moving part 440 is fastened to the support frame 420 by fastening bolts 450, thereby indirectly connecting to and fixing to the support frame 420.

[0057] On the other hand, as another example, the processing module 100 can also be fixed directly to the support frame 420 by means of a separate bolt (not shown).

[0058] As shown in Figures 6A and 6B, the frame part 400, as a structure for setting and supporting the processing module 100, can have various structures.

[0059] That is, the frame part 400, as a structure with a predetermined height, can be a structure that forms a plurality of configuration spaces S3 for setting up the processing module 100 in the vertical direction.

[0060] For example, the frame portion 400 may include: a plurality of vertical frames 410 configured to have a vertical length; and a support frame 420 configured horizontally on the vertical frames 410, and having a vertical configuration space S3 and supporting the processing module 100.

[0061] Additionally, as shown in FIG7, the frame portion 400 may include: a movable track portion 430, which is disposed on the support frame 420 so that the processing module 100 supported by the support frame 420 slides toward the transport module 200; and a movable portion 440, which is coupled to the processing module 100 and is movably disposed on the movable track portion 430.

[0062] The vertical frame 410 may be a structure configured to have a length in the vertical direction to form a configuration space S3 with a predetermined area distinguished on the plane.

[0063] The support frame 420 can have various structures as it is configured horizontally on the vertical frame 410 and in a configuration space S3 that distinguishes the vertical direction and supports the processing module 100.

[0064] For example, the support frame 420 is arranged horizontally at each predetermined height of the vertical frame 410, and can be arranged to connect at least two mutually facing sides in a quadrilateral formed by the four vertical frames 410.

[0065] At this time, the support frame 420 can form a support surface 421, which protrudes in a stepped shape toward the configuration space S3 side, so as to provide a moving track part 430 on the support frame 420 to support the processing module 100.

[0066] The moving track section 430 is a structure provided on the support frame 420 so that the processing module 100 supported by the support frame 420 can slide towards the transport module 200. It can have various structures.

[0067] For example, the moving track section 430 may be a track structure of an LM guide rail in which the moving section 440 can move along the moving track section 430 when the processing module 100 is supported by the moving section 440, and the support frames 420 facing each other may be configured as a pair, thereby forming a linear motion path in the direction of setting and releasing the processing module 100.

[0068] The moving part 440 can have various structures as it is integrated with the processing module 100 and movably disposed on the moving track part 430.

[0069] For example, the moving part 440 may be a bracket and moving block structure that can move along the moving track part 430 and be fastened to the processing module 100 and the support frame 420.

[0070] For this purpose, the moving part 440 may include: a moving block 441, which is movably disposed on the moving track part 430; and a fastening part 442, which extends outward from the moving block 441 and has a fastening hole 442a, so that it can be connected to the processing module 100 and the support frame 420 respectively through fastening bolts 450.

[0071] On the other hand, unlike the above, the moving part 440 may of course be a moving roller structure that can move along the moving track part 430 and support the processing module 100.

[0072] The substrate transport device 20 can have various structures, as it is a structure in which a plurality of transport modules 200 are arranged in the vertical direction respectively corresponding to the processing module 100.

[0073] That is, the substrate transport device 20 may have a structure having a plurality of transport modules 200 and a mounting frame (not shown in the figure). The plurality of transport modules 200 are respectively arranged in the vertical direction corresponding to a plurality of processing modules 100 arranged in the vertical direction. The mounting frame is used to mount the plurality of transport modules 200.

[0074] The transport module 200 may be configured to communicate with the loading locking module 30 and the processing module 100 respectively, and receive the processing target substrate 1 from the loading locking module 30 or the up-and-down transport module 300 described later to transfer it to the processing module 100, and receive the processed substrate 1 from the processing module 100 to transfer it to the loading locking module 30 or the up-and-down transport module 300.

[0075] At this time, the transport module 200 can transport the substrate 1 horizontally by means of magnetic levitation achieved by a planar motor.

[0076] For example, the transport module 200 may include: a transport chamber 210, which forms a first transport space S1 inside; a stator 220 disposed in the transport chamber 210, which generates an electromagnetic force for magnetic levitation; and a transport unit 230, which moves by achieving magnetic levitation through the electromagnetic force generated by the stator 220, thereby transporting the substrate 1.

[0077] The transport chamber 210, as a structure that forms the first transport space S1 inside, can have various structures.

[0078] For example, the transport chamber 210 is configured to correspond to the processing module 100 described above, and a first transport space S1 can be formed inside it, wherein the first transport space S1 is used to transport the substrate 1 in a vacuum state.

[0079] The stator section 220, which is provided in the transport chamber 210 and generates an electromagnetic force for magnetic levitation, can have various structures.

[0080] For example, the stator section 220 may include a coil section and a circuit section. The coil section is used to apply electromagnetic force to the transport unit 230, and the circuit section controls the coil section and receives power from the outside.

[0081] Thus, the stator section 220 receives power from the outside through the circuit section to control the coil section, thereby applying and controlling electromagnetic force. Based on this, electromagnetic force is generated in the transport unit 230 through electromagnetic interaction with the permanent magnet, and the transport unit 230 can be moved in a magnetically levitated state.

[0082] At this time, the stator 220 may be configured in the transport chamber 210 to form the travel path of the transport unit 230. For example, it may be configured to form the bottom surface of the transport chamber 210. By the magnetic force formed from the bottom surface, the transport unit 230 moves horizontally in a magnetically levitated state, thereby guiding the substrate 1 to be transported.

[0083] The transport unit 230 can have various structures, which move by using the electromagnetic force generated by the stator 220 to achieve magnetic levitation and transport the substrate 1.

[0084] For example, the transport unit 230 may include a transport moving part and a support member. The transport moving part includes a permanent magnet for interacting with the magnetic field generated through the stator 220 to achieve magnetic levitation. The support member is combined with and disposed on the transport moving part to support the substrate 1.

[0085] At this time, the support member is combined with the transport moving member and can move integrally with the transport moving member. It can be formed as a pair to stably support the substrate 1 while minimizing the contact area with the substrate 1.

[0086] At this time, the support member serves as a structure for supporting and transporting the substrate 1. In particular, it can transfer the substrate 1 to the end effector 332 of the vertical transport unit 330 described later. It can also be configured not to overlap with the end effector 332 in the vertical direction, so as to prevent interference with the end effector 332 during the process while stably transmitting and receiving the substrate 1.

[0087] As an example, a pair of support members may be configured to be disposed on the outside of the end effector 332. As another example, they may also be disposed on the inside of the end effector 332 having a pair of support members or disposed offset from each other.

[0088] The vertical transport module 300 can have various structures as it is configured to communicate with a plurality of transport modules 200 at the same time and to transport the substrate 1 in the vertical direction to transfer the substrate 1 between the transport modules 200.

[0089] That is, as shown in FIG5, the vertical transport module 300 is configured to transport the substrate 1 in the vertical direction to transfer the substrate 1 between a plurality of processing modules 100 arranged in the vertical direction, and can be configured to be connected to both the plurality of processing modules 100 and the plurality of transport modules 200 arranged in the vertical direction.

[0090] At this time, the vertical transport module 300 can transport the substrate 1 vertically by magnetic levitation achieved by a planar motor. For this purpose, the vertical transport module 300 may include: a vertical transport chamber 310, which forms a second transport space S2 inside; a vertical stator portion 320, which is disposed on at least one side wall of the vertical transport chamber 310 to generate an electromagnetic force for magnetic levitation; and a vertical transport unit 330, which moves vertically by magnetic levitation achieved by the electromagnetic force generated by the vertical stator portion 320, thereby transporting the substrate 1.

[0091] The upper and lower transport chambers 310 may be structured to form a second transport space S2 inside and have a height that allows them to be connected together by a plurality of transport modules 200.

[0092] At this time, the upper and lower transport chambers 310 can form transport openings 311 at the height corresponding to the transport module 200 for communicating with the transport module 200 respectively.

[0093] The upper and lower stator portions 320 are structures provided on at least one side wall of the upper and lower transport chambers 310 to generate electromagnetic forces for magnetic levitation, and can have various structures.

[0094] The specific structure of the upper and lower stator parts 320 is the same as that of the stator part 220 described above, so the repeated description is omitted.

[0095] The upper and lower stator portions 320 may be disposed on at least one side wall of the upper and lower transport chamber 310 to form an upper and lower travel path for the upper and lower transport unit 330 to move up and down.

[0096] That is, the upper and lower stator portions 320 may be provided on the inner side wall of the upper and lower transport chamber 310. As another example, they may also be configured to form one side wall of the upper and lower transport chamber 310.

[0097] The vertical transport unit 330 can have various structures, which can achieve magnetic levitation by electromagnetic force generated by the upper and lower stators 320 to move vertically and transport the substrate 1.

[0098] At this time, the specific structure of the upper and lower transport unit 330 is the same as that of the transport unit 230 described above, so the repeated description is omitted.

[0099] The vertical transport unit 330 can be configured such that one side of the moving member 331, which includes a permanent magnet that moves vertically through the upper and lower stator portions 320, has an opposing surface parallel to the magnetic levitation surface of the upper and lower stator portions 320, and an end effector 332 is provided on the other side to support and transport the substrate 1.

[0100] At this time, the end effector 332 is horizontally protruding on the other side of the moving member, and can directly or indirectly support the substrate 1 that moves horizontally from the transport module 200 and is transported, and can transport the substrate 1 in the up and down direction as the moving member 331 moves up and down.

[0101] On the other hand, at this time, the end effector 332 is formed by a pair of support parts to smoothly perform the loading and unloading of the substrate 1, and is formed so as not to overlap with the support members of the transport unit 230 in the transport module 200, thereby being able to send and receive the substrate 1.

[0102] On the other hand, the above-mentioned processing module 100, transport module 200 and vertical transport module 300 can be kept in a vacuum state and can be closed and interconnected by opening and closing doors respectively.

[0103] Hereinafter, the configuration of the substrate processing system according to the present invention will be described.

[0104] As shown in FIG1, the substrate processing system according to the present invention provides a vertical transport module 300 on one side for a single substrate transport device 20, and a substrate processing device 10 may be provided on at least one of the other sides.

[0105] More specifically, a single substrate transport device 20 that forms a quadrilateral on a plane is centered on one side, and a vertical transport module 300 is provided on one side, while substrate processing devices 10 can be provided on the other three sides respectively.

[0106] On the other hand, in this case, the loading locking module 30 may be located on the same side as the substrate transport device 20 where the side of the loading locking module 300 is located adjacent to the loading locking module 300, and the device front end module 40 may be connected to and provided on the front side of the loading locking module 30.

[0107] That is, the loading locking module 30 is provided on one side of the substrate transport device 20, which is the same side as the side on which the upper and lower transport module 300 is provided. Thus, the substrate processing device 10 can be provided on the other side of the substrate transport device 20, thereby increasing the installation space of the substrate processing device 10 and the number of substrate processing devices 10.

[0108] At this time, at least a portion of the plurality of processing modules 100 may perform different processes. For example, among the processing modules 100 included in the plurality of substrate processing devices 10 provided on each side of the substrate transport device 20, processing modules 100 arranged at the same height may perform the same process, while processing modules 100 arranged at different heights may perform different processes.

[0109] In this case, for the processes that need to be executed sequentially, the first process is executed by the processing module 100 located on the lower side. The substrate 1 is transferred to the upper side by the corresponding transport module 200 and the upper and lower transport module 300, and then the substrate is transferred to the processing module 100 by the transport module 200, so that the subsequent second process can be executed.

[0110] After that, the processed substrate 1 can be transported to the outside via the transport module 200, the loading and locking module 30 and the equipment front-end module 40.

[0111] Thus, according to the substrate processing system of the present invention, for composite processes that need to be executed sequentially, the substrate 1 is transferred between substrate processing systems, and the substrate 1 is transferred sequentially to processing modules 100 that are different from each other in the vertical direction to perform substrate processing without the need to perform the process and maintain a vacuum. This has the advantages of improving the efficiency of substrate processing and reducing the footprint of the equipment used for substrate processing.

[0112] Hereinafter, another embodiment of the substrate processing system according to the present invention will be described in detail with reference to the drawings.

[0113] In the substrate processing system described below, for structures that are the same as those described above, the same element symbols are used as described above, so repeated descriptions are omitted.

[0114] As shown in Figures 1 and 11, the substrate processing system according to the present invention includes: a processing module 100, which forms an opening for introducing and discharging a substrate 1 and performs substrate processing; a transport module 200, which is disposed adjacent to the processing module 100 and transports the substrate 1 between the processing module 100 and the processing module 100; and a gate valve 500, which is disposed in at least one of the processing module 100 and the transport module 200 to open and close the opening and is magnetically connected to the other one.

[0115] On the other hand, as described above, the substrate processing system according to this embodiment includes a substrate processing apparatus 10 and a substrate transport apparatus 20, and is applicable to a structure in which a plurality of processing modules 100 and a corresponding plurality of transport modules 200 and a loading locking module 30 are arranged in the vertical direction.

[0116] In addition, unlike the above, the substrate processing apparatus 10 and the substrate transport apparatus 20 can also be adapted to structures having a single processing module 100 and a corresponding transport module 200 and loading locking module 30, respectively.

[0117] Therefore, the substrate processing system according to this embodiment is not limited to the substrate processing apparatus 10 with a plurality of processing modules 100 arranged in the vertical direction and the substrate transport apparatus 20 with a plurality of transport modules 200 arranged, but can also be applied to a structure with a single processing module 100 and a transport module 200 arranged.

[0118] The processing module 100 forms an opening to import and export the substrate 1. As needed, it connects with the transport module 200 through the opening to import the substrate 1 to be processed and to export the substrate 1 that has been processed.

[0119] On the other hand, the processing module 100 can be connected to the transport module 200 through the gate valve 500 described later. At this time, the processing module 100 can be aligned and the opening can be opened through the gate valve 500.

[0120] At this time, the processing module 100 can be combined with the gate valve 500 by magnetic force. For this purpose, a magnetic body 120 may be included, which generates magnetic force for magnetic combination with the gate valve 500.

[0121] For example, the processing module 100 may include: a process chamber 110, into which the substrate 1 is introduced and forms an internal space for performing substrate processing; and a magnetic body 120 disposed in the process chamber 110 to be coupled to the gate valve 500 by magnetic force.

[0122] The process chamber 110 is a structure that forms a sealed internal space for processing the substrate 1, and forms an opening that can be opened and closed by the gate valve 500 described later, so that the substrate 1 can be introduced and discharged.

[0123] The process chamber 110, as a structure having a quadrilateral base on a plane, can be configured to be adjacent to the transport chamber 210 of the transport module 200 and communicate with each other, separated by the gate valve 500.

[0124] The magnetic body 120 can have various structures as it is disposed in the process chamber 110 to be combined with the gate valve 500 by magnetic force.

[0125] For example, the magnetic body 120 is a previously disclosed magnetic material. As long as it is a structure that exerts magnetic force, any structure can be used, such as a permanent magnet or a magnetic metal body.

[0126] At this time, the magnetic body 120 is positioned opposite to the magnetic force generating part 520 of the gate valve 500 described later. It can magnetically combine with each other by generating attraction through magnetic interaction with the magnetic force generating part 520. A pair of magnetic bodies 120 can be arranged corresponding to a pair of magnetic force generating parts 520.

[0127] That is, the magnetic body 120 is disposed in the opposite face of the transport module 200 of the process chamber 110 at a position adjacent to the opening, for example, the two sides can be disposed as a pair.

[0128] On the other hand, the magnetic body 120 may be formed in a shape corresponding to the magnetic force generating part 520 described later. For example, it may be formed in a right-angled quadrilateral shape with a quadrilateral front.

[0129] In addition, the magnetic body 120 may form a step that corresponds to and matches the gate valve 500 to perform alignment when the magnetic body 120 and the gate valve 500 are magnetically coupled, thereby aligning the processing module 100 and the gate valve 500.

[0130] As another example, the processing module 100 may form a groove or protrusion for setting the original position so as to perform magnetic engagement after being aligned with the gate valve 500 in the original position. The protrusion or groove may be formed at the corresponding position of the gate valve 500.

[0131] Thus, as shown in Figures 8A and 8B, when the processing module 100 is installed in the frame part 400 and slides, it can be aligned with the gate valve 500 in its original position. The magnetic force generated by the magnetic force generating part 520 is magnetically combined with the magnetic body 120, and thus it can be guided to combine in the state of being aligned with the gate valve 500 in its original position.

[0132] On the other hand, the magnetic body 120 mentioned above can be omitted, and the process chamber 110 itself is configured as a magnetic body to magnetically combine and separate from the gate valve 500.

[0133] The transport module 200 can have various structures as it is positioned adjacent to the processing module 100 to transport the substrate 1 between the two modules.

[0134] The transport module 200 can be magnetically coupled to the gate valve 500 described later. As another example, as the processing module 100 is magnetically coupled to the gate valve 500, it can be fastened to the gate valve 500 by physical structures such as bolts and shafts.

[0135] More specifically, the transport module 200 can be fixed and connected to the gate valve 500 by bolts through the fastening port 531 of the connecting plate 530 configured in the valve housing 510 described later.

[0136] The gate valve 500, as a structure provided in at least one of the processing module 100 and the transport module 200 to open and close the opening and to be connected to the other one by magnetic force, can have various structures.

[0137] For example, as shown in FIG9, the gate valve 500 may include: a valve housing 510 disposed between the processing module 100 and the transport module 200; and a magnetic force generating unit 520 disposed in the valve housing 510 and generating magnetic force.

[0138] Additionally, the gate valve 500 may include a coupling plate 530, which is disposed on the valve housing 510 and coupled to the transport module 200.

[0139] The valve housing 510, as a structure disposed between the processing module 100 and the transport module 200, can have various structures.

[0140] That is, the valve housing 510 is configured to form a sealed valve space inside, so that the internal space of the processing module 100 is interconnected with the first transport space S1 of the transport module 200, and has an opening and closing door 540 driven in the valve space, thereby opening or closing the opening of the processing module 100.

[0141] On the other hand, the valve housing 510 is disposed between the processing module 100 and the transport module 200, and a sealing component is applied therebetween to maintain the seal of the interior and the space between the processing module 100 and the transport module 200.

[0142] The magnetic force generating unit 520, which is provided in the valve housing 510 and generates magnetic force, can have various structures.

[0143] At this time, the magnetic force generating part 520 can be provided on the outside of the valve housing 510, or, as another example, it can be provided on the inside or inside of the valve housing 510.

[0144] For example, the magnetic force generating unit 520 is disposed in the valve housing 510 at a position corresponding to the magnetic body 120 of the processing module 100, so that the connection between the processing module 100 and the gate valve 500 can be performed by magnetically engaging with the magnetic body 120, and a pair of magnetic force generating units 520 can be disposed on both sides of the valve housing 510 corresponding to a pair of magnetic bodies 120.

[0145] Therefore, according to the user's intention, the magnetic force generating unit 520 generates magnetic force and magnetically combines with the magnetic body 120, and the generation of magnetic force is prevented to release the magnetic combination with the magnetic body 120, so that the processing module 100 can be separated from the gate valve 500.

[0146] At this time, the magnetic force generating unit 520 is a structure that changes whether magnetic force is generated or not depending on whether power is supplied. When power is supplied, the magnetic force is released, and when power is not supplied, the magnetic force can be maintained.

[0147] On the other hand, it is also possible to maintain the magnetic force when the power is supplied and to release the magnetic force when the power is not supplied.

[0148] Therefore, as shown in Figures 10A and 10B, the magnetic force generating unit 520 includes a first magnetic body 521 and a second magnetic body 522. The first magnetic body 521 maintains the same magnetic field direction, and the second magnetic body 522 changes the magnetic field direction as a power supply is provided. When no power supply is provided, the magnetic field direction of the second magnetic body 522 is strengthened by arranging it in the same way as the first magnetic body 521, which can generate a magnetic force that pulls the magnetic body 120.

[0149] On the other hand, by applying current when supplying power, the magnetic field direction of the second magnetic body 522 is reversed by 180 degrees, and guided to be opposite to the magnetic field direction of the first magnetic body 521. Accordingly, the magnetic effect is limited between the first magnetic body 521 and the second magnetic body 522, and the magnetic effect with the magnetic body 120 can be guided and suppressed.

[0150] In this case, the magnetic force generating unit 520 can be adapted to use the current generated by the power supply to change the direction of the magnetic field induced by the second magnetic body 522. As another example, it can also be adapted to use a rotating body such as a motor to change the physical position of the second magnetic body 522 as the power supply changes to change the direction of the magnetic field.

[0151] On the other hand, the first magnetic body 521 and the second magnetic body 522 described above can be used as permanent magnets.

[0152] The connecting plate 530, as a structure configured on the valve housing 510 and connected to the transport module 200, can have various structures.

[0153] For example, the connecting plate 530 is a plate disposed on the valve housing 510, forming fastening holes to physically connect with the transport module 200, and can be connected to the transport module 200 by bolt fastening.

[0154] Thus, the gate valve 500 can be kept in a connected state with the transport module 200.

[0155] On the other hand, as described above, the gate valve 500 may have a protrusion or a groove formed on the surface facing the processing module 100, corresponding to the groove or protrusion formed on the surface of the processing module 100 facing the gate valve 500, so as to be aligned with the processing module 100.

[0156] The above-described substrate processing system may be configured with a gate valve 500 in a single processing module 100 and transport module 200. In particular, it may also be adapted to a structure in which a plurality of processing modules 100 and transport modules 200 are configured in the vertical direction by configuring a plurality of gate valves 500.

[0157] At this time, when multiple processing modules 100 are arranged in the vertical direction above and below the frame 400, the operating space is narrow and the access area is limited due to the stacked form of the processing modules 100 which are applicable in a limited space. Therefore, the magnetic connection and release between the gate valve 500 and the processing module 100 has the advantage of being able to easily install and replace the processing module 100.

[0158] Hereinafter, the substrate processing system setting method for setting and replacing the substrate processing system processing module according to the present invention will be described in detail with reference to the following drawings.

[0159] As shown in FIG12, the substrate processing system setting method according to the present invention includes: a processing module transfer step S100, moving the processing module 100 to align with the gate valve 500; a magnetic bonding step S200, generating a magnetic force in the gate valve 500 to magnetically bond the processing module 100 and the gate valve 500; and a processing module fixing step S400, fixing the position of the processing module 100 after the magnetic bonding step S200.

[0160] In addition, the substrate processing system setting method according to the present invention may also include a vacuum pressure setting step S300, which sets the interior of the processing module 100 to a vacuum by drawing it between the magnetic bonding step S200 and the processing module fixing step S400.

[0161] The processing module transfer step S100 may be the step of moving the processing module 100 to align with the gate valve 500.

[0162] For example, in the processing module transfer step S100, when the processing module 100 is placed on the moving part 440 on the frame part 400, the moving part 440 and the processing module 100 can be fastened and connected by the fastening bolt 450.

[0163] In addition, in the processing module transfer step S100, with the moving part 440 and the processing module 100 combined, the moving part 440 is moved along the moving track part 430, so that the processing module 100 can be positioned adjacent to the transport module 200, that is, aligned with the gate valve 500.

[0164] On the other hand, in the processing module transfer step S100, when the processing module 100 and the gate valve 500 are adjacent by the movement of the moving part 440, the above-mentioned protruding part is inserted into the position of the groove part, so that the position between the processing module 100 and the gate valve 500 can be aligned in the original position.

[0165] Then, in the processing module transfer step S100, various connecting cables for connecting to the processing module 100 are connected while the processing module 100 is in a position adjacent to the gate valve 500, thereby completing the pre-preparation for connection with the gate valve 500.

[0166] The magnetic bonding step S200 may be a step in which the gate valve 500 generates a magnetic force to magnetically bond the processing module 100 and the gate valve 500.

[0167] That is, in the magnetic bonding step S200, the power supply to the magnetic force generating part 520 of the gate valve 500 is turned off to generate magnetic force, thereby magnetically bonding the magnetic body 120 of the processing module 100 and the magnetic force generating part 520 to each other, thereby initially bonding the processing module 100 and the gate valve 500.

[0168] At this time, as described above, the magnetic coupling step S200 can be a step that generates magnetic force by shutting off the power supply to the gate valve 500.

[0169] The vacuum pressure setting step S300 can be a step of drawing the inside of the processing module 100 to set it to a vacuum between the magnetic bonding step S200 and the processing module fixing step S400.

[0170] That is, the vacuum pressure setting step S300 can be a step of forming a vacuum pressure by drawing in the internal space inside the processing module 100, strengthening the adhesion force by forming a vacuum pressure between the processing module 100 and the gate valve 500, and forming a vacuum pressure inside the processing module 100 similar to the process environment.

[0171] On the other hand, the vacuum pressure setting step S300 can be performed after the magnetic bonding step S200 described above, or, depending on the requirements, before the magnetic bonding step S200.

[0172] The processing module fixing step S400 can be a step that fixes the position of the processing module 100 after the magnetic bonding step S200.

[0173] At this time, the processing module fixing step S400 is a step of combining and fixing the processing module 100, which is fixed to the gate valve 500 through the magnetic bonding step S200, to the frame part 400. The moving part 440 is fastened to the support frame 420 in the frame part 400 by fastening bolts 450, thereby fixing the processing module 100 in the fixed position of the frame part 400.

[0174] Additionally, as shown in FIG13, the substrate processing system setting method according to the present invention includes: a combination release step S600, in which the magnetic force of the gate valve 500 is eliminated to release the magnetic combination between the processing module 100 and the gate valve 500; a processing module fixation release step S700, in which the fixation of the processing module 100 is released after the combination release step S600; and a processing module removal step S800, in which the processing module 100, which was released from fixation through the processing module fixation release step S700, is removed.

[0175] Additionally, as shown in FIG13, the substrate processing system setting method according to the present invention may include an atmospheric pressure setting step S500, which sets the internal pressure of the processing module 100 to atmospheric pressure before the bonding release step S600.

[0176] The atmospheric pressure setting step S500 may be a step of setting the internal space of the processing module 100, which is the object to be removed, to atmospheric pressure in order to reduce the tightness between the processing module 100 and the gate valve 500.

[0177] In addition, in the atmospheric pressure setting step S500, before the connection release step S600 described later, various connecting cables connected to the processing module 100 of the object to be removed are separated and removed, thereby completing the pre-preparation step.

[0178] The coupling release step S600 may be a step in which the magnetic force of the gate valve 500 is eliminated to release the magnetic coupling between the processing module 100 and the gate valve 500.

[0179] That is, the release step S600 can be a step in which the gate valve 500 eliminates the magnetic force to separate the processing module 100 from the gate valve 500. For example, it can be performed by supplying power to the gate valve 500 to prevent the generation of magnetic force.

[0180] Accordingly, during the subsequent processing module fixing release step S700, the continuous supply of power to the gate valve 500 can prevent the generation of magnetic force.

[0181] The module fixing release step S700 can be a step that releases the fixing of the processing module 100 after the release step S600.

[0182] That is, the processing module fixing release step S700 can release the connection between the processing module 100 and the frame part 400, which was separated from the gate valve 500 by the combination release step S600.

[0183] More specifically, in the module fixing release step S700, the fastening bolts 450 fastened between the moving part 440 and the support frame 420 are removed, the connection between the moving part 440 and the support frame 420 is released, and the position fixation of the processing module 100 can be released.

[0184] The processing module removal step S800 is a step to remove the processing module 100 that has been released from the processing module fixing release step S700. The moving part 440 moves along the moving track part 430 in the opposite direction to the transport module 200 to transport the processing module 100 outward, and removes the fastening bolts 450 fastened between the moving part 440 and the processing module 100, thereby removing the processing module 100.

[0185] Place a new processing module 100 as the replacement object in the position of the processing module 100 that was removed as described above, and the processing module 100 can be replaced according to the setting method described above.

[0186] The above description is only a part of the preferred embodiments that can be implemented by the present invention. As is well known, the scope of the present invention should not be limited to the above embodiments. The technical ideas and fundamental technical ideas of the present invention described above are all included within the scope of the present invention. [Simplified Explanation of the Diagram]

[0033] FIG1 is a perspective view showing the substrate processing system according to the present invention; FIG2 is a schematic plan view showing the substrate processing system of FIG1; FIG3 is a side sectional view showing the cross-sectional shape of the substrate processing system of FIG2 along the III-III' direction; FIG4 is a side sectional view showing the cross-sectional shape of the substrate processing system of FIG2 along the IV-IV' direction; FIG5 is a sectional view showing the shape of the upper and lower transport module in the substrate processing system of FIG1; FIG6A and FIG6B are perspective views showing the installation shape of the frame portion of the processing module in the substrate processing system of FIG1; FIG7 is a sectional view showing the connection between the processing module and the frame portion in the substrate processing system of FIG1; FIG8A and FIG8B are side views showing the magnetic connection between the processing module and the gate valve in the substrate processing system of FIG1 before and after; FIG9 is a perspective view showing the shape of the gate valve in the substrate processing system of FIG1; FIG10A and FIG10B are conceptual diagrams showing the shape of the magnetic force generating portion in the gate valve of FIG9 before and after generating magnetic force; FIG11 is a plan view showing another embodiment of the substrate processing system according to the present invention. Figure 12 is a flowchart showing one embodiment of the substrate processing system setup method according to the present invention; and Figure 13 is a flowchart showing another embodiment of the substrate processing system setup method according to the present invention.

Claims

1. A substrate processing system, comprising: A processing module (100) forms an opening to introduce and discharge a substrate (1) and performs substrate processing; A transport module (200) is disposed adjacent to the processing module (100) for transporting the substrate (1) between the processing module (100) and the processing module (100); and a gate valve (500) is disposed in at least one of the processing module (100) and the transport module (200), and is magnetically engaged with and disengaged from the other to open and close the opening.

2. The substrate processing system as claimed in claim 1, wherein, The processing module (100) includes: a process chamber (110) into which the substrate (1) is introduced and forms an internal space for performing substrate processing; and a magnetic body (120) disposed in the process chamber (110) to be coupled to the gate valve (500) by magnetic force.

3. The substrate processing system as described in claim 2, wherein, The magnetic body (120) is positioned adjacent to the opening in the opposing surface of the transport module (200) in the process chamber (110).

4. The substrate processing system as claimed in claim 1, wherein, The gate valve (500) includes: a valve housing (510) disposed between the processing module (100) and the transport module (200); and a magnetic force generating unit (520) disposed in the valve housing (510) and generating the magnetic force.

5. The substrate processing system as described in claim 4, wherein, The magnetic force generating unit (520) is connected to the processing module (100) by the magnetic force; the gate valve (500) includes a connecting plate (530), which is disposed on the valve housing (510) and connected to the transport module (200).

6. The substrate processing system as claimed in claim 4, wherein, The magnetic force generating units (520) are arranged in pairs on both sides of the valve housing (510).

7. The substrate processing system as claimed in claim 4, wherein, The magnetic force generating unit (520) eliminates the magnetic force when power is supplied and maintains the magnetic force when power is not supplied.

8. The substrate processing system as claimed in claim 1, wherein, The processing module (100) has one of a recess and a protrusion on its face facing the gate valve (500) for alignment with the gate valve (500); and the gate valve (500) has the other one positioned on its face facing the processing module (100) corresponding to either the recess or the protrusion.

9. The substrate processing system as claimed in claim 1, wherein, The processing module (100) is configured in multiple ways in the vertical direction.

10. The substrate processing system as claimed in claim 9, further comprising: A frame section (400) forms a plurality of configuration spaces (S3) in the vertical direction to place and set the processing module (100) respectively.

11. The substrate processing system as claimed in claim 10, wherein, The frame (400) includes: a plurality of vertical frames (410) configured to have a vertical length; and a support frame (420) arranged horizontally in the vertical frames (410) and separating the configuration space (S3) in the vertical direction, and supporting the processing module (100).

12. The substrate processing system as claimed in claim 11, wherein, The frame portion (400) includes: a moving track portion (430) disposed on the support frame (420) to allow the processing module (100) supported by the support frame (420) to slide toward the transport module (200); and a moving portion (440) coupled to the processing module (100) and movably disposed on the moving track portion (430).

13. The substrate processing system as claimed in claim 9, wherein, The transport module (200) corresponds to a plurality of the processing modules (100) arranged in the vertical direction.

14. A method for setting up a substrate processing system, used for setting up and replacing the processing module (100) of the substrate processing system as described in claim 1, the method comprising: The processing module transfer step (S100) moves the processing module (100) to align with the gate valve (500); the magnetic coupling step (S200) generates the magnetic force in the gate valve (500) to magnetically couple the processing module (100) with the gate valve (500); and the processing module fixing step (S400) fixes the position of the processing module (100) after the magnetic coupling step (S200).

15. The substrate processing system setup method as described in claim 14, further comprising: In the vacuum pressure setting step (S300), a vacuum is set by drawing air into the interior of the processing module (100) between the magnetic bonding step (S200) and the processing module fixing step (S400).

16. The substrate processing system setup method as described in claim 14, wherein, The magnetic coupling step (S200) shuts off the power supply to the gate valve (500) to generate the magnetic force.

17. The substrate processing system setup method as described in claim 14, wherein, The substrate processing system includes a frame portion (400) forming a configuration space (S3) for placing and setting the processing module (100); the processing module fixing step (S400) combines and fixes the processing module (100) fixed to the gate valve (500) by the magnetic bonding step (S200) to the frame portion (400).

18. A method for setting up a substrate processing system, used for setting up and replacing the processing module (100) of the substrate processing system as described in claim 1, the method comprising: In the combined release step (S600), the magnetic force is eliminated in the gate valve (500) to release the magnetic connection between the processing module (100) and the gate valve (500); in the processing module fixation release step (S700), the fixation of the processing module (100) is released after the combined release step (S600); and in the processing module removal step (S800), the processing module (100) that has been released from fixation by the processing module fixation release step (S700) is removed.

19. The substrate processing system setup method as described in claim 18, further comprising: Atmospheric pressure setting step (S500): Before the combination release step (S600), the internal pressure of the processing module (100) is set to atmospheric pressure.

20. The substrate processing system setup method as described in claim 18, wherein, The coupling release step (S600) prevents the generation of magnetic force by supplying power to the gate valve (500).

21. The substrate processing system setup method as described in claim 18, wherein, The substrate processing system includes a frame portion (400) forming a configuration space (S3) for placing and setting the processing module (100); and wherein the processing module fixing release step (S700) releases the processing module (100) from the frame portion (400) after it has been separated from the gate valve (500) by the binding release step (S600).

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