Low dielectric resin composition and its use

Abstract

A low-dielectric resin composition and its use, wherein the low-dielectric resin composition includes an epoxy resin, an active ester compound, a maleic anhydride compound, an inorganic filler, and an accelerator. The amount of the maleic anhydride compound added is at least 20 parts by weight relative to 100 parts by weight of the low-dielectric resin composition.

Description

Technical Field

[0001] This invention relates to a resin composition, and more particularly to a low-dielectric resin composition and its uses. Prior Technology

[0002] In recent years, with the rapid development of integrated circuit (IC) technology, the requirements for wiring density and transmission rate of high-speed computing chips have increased, and add-on materials need to have better electrical specifications, such as low dielectric properties. However, the dielectric loss (dissipation factor, Df) of current resin compositions is approximately between 0.003 and 0.005, which may be detrimental to future high-frequency, high-speed transmission applications. Summary of the Invention

[0003] The present invention provides a low-dielectric resin composition and a low-dielectric layer formed therefrom, which has a dielectric loss of less than or equal to 0.002 at 10 GHz signals and can be applied to the addition layer of high-performance chips.

[0004] The low-dielectric resin composition of the present invention includes an epoxy resin, an active ester compound, a maleimide compound, an inorganic filler, and an accelerator. The amount of maleimide compound added is at least 20 parts by weight relative to 100 parts by weight of the low-dielectric resin composition.

[0005] In one embodiment of the present invention, relative to 100 parts by weight of the low dielectric resin composition, the amount of epoxy resin added is 1 to 5 parts by weight, the amount of active ester compound added is 1 to 5 parts by weight, the amount of maleimide compound added is 20 to 25 parts by weight, the amount of inorganic filler added is 60 parts by weight or more, and the amount of accelerator added is 0.1 to 0.5 parts by weight.

[0006] In one embodiment of the present invention, the epoxy equivalent of the epoxy resin is from 150 g / eq. to 250 g / eq.

[0007] In one embodiment of the present invention, the epoxy resin is selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and naphthalene ring-containing epoxy resin.

[0008] In one embodiment of the present invention, the above-mentioned active ester compound includes a naphthalene-containing polyester resin, and the active ester equivalent is 200 g / equivalent to 300 g / equivalent.

[0009] In one embodiment of the present invention, the above-mentioned maleimide compound has at least two active ends that are maleimides.

[0010] In one embodiment of the present invention, the inorganic filler material includes spherical silicon dioxide and contains surface modification with epoxy or acrylic groups.

[0011] In one embodiment of the present invention, the median particle size (D50) of the above-mentioned spherical silicon dioxide is less than 1 micrometer (μm), and the specific surface area is from 4 square meters / gram (m2 / g) to 6 square meters / gram.

[0012] In one embodiment of the present invention, the above-mentioned promoter includes 4-dimethylaminopyridine, 2-ethyl-4-methylimidazole, 1-benzyl-2-phenylimidazole or a combination thereof.

[0013] The low-dielectric resin composition of the present invention is suitable for forming dielectric materials for electronic components related to high-frequency, high-speed transmission, wherein the low-dielectric composition has a dielectric loss of less than or equal to 0.002 and a dielectric constant of 3.0 to 3.3 at a signal of 10 GHz.

[0014] Based on the above, the low-dielectric resin composition of the present invention includes epoxy resin, reactive ester compound, maleimide compound, inorganic filler, and accelerator, wherein the amount of maleimide compound added is at least 20 parts by mass relative to 100 parts by mass of the low-dielectric resin composition. By adding sufficient amount of maleimide compound to the resin composition, the dielectric loss of the resin composition at a 10 GHz signal is less than or equal to 0.002 (the dielectric constant is maintained at 3.0 to 3.3). In this way, the dielectric properties can be effectively reduced, the overall electrical specifications can be improved, and it can be applied to electronic components related to high-frequency high-speed transmission.

[0015] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described in detail below. Simple Explanation of the Diagram

[0016] none Implementation

[0017] In the following detailed description, exemplary embodiments disclosing specific details are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the various principles of the invention. However, it will be apparent to those skilled in the art that, thanks to this disclosure, the invention can be practiced in other embodiments that depart from the specific details disclosed herein.

[0018] Unless otherwise stated, the term "first value to second value" used in this specification to define a range of values ​​is intended to cover the range equal to the endpoint value and the range between the endpoint values. For example, a size range between the first value and the second value means that the size range can cover the first value, the second value, and any value between the first value and the second value.

[0019] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. [<] [Low-dielectric resin composition] [>]

[0020] This invention provides a low-dielectric resin composition comprising an epoxy resin, an active ester compound, a maleic anhydride compound, an inorganic filler, and an accelerator. Furthermore, the low-dielectric resin composition of this invention may further include other suitable additives as needed. The various components described above will be described in detail below. [Epoxy Resin] []

[0021] There are no particular limitations on the epoxy resin used; a suitable epoxy resin can be selected according to requirements. In this embodiment, the epoxy resin has at least two or more epoxy groups, and its epoxy equivalent is from 150 g / eq to 250 g / eq. In some embodiments, the epoxy resin includes bisphenol A type epoxy resin, bisphenol F type epoxy resin (such as bisphenol F diglycidyl ether, NPEL-170), naphthyl ring-containing epoxy resin (such as naphthylene ether type epoxy resin), or any combination thereof. In some embodiments, the epoxy resin may be, for example, NPEL-170 purchased from Nan Ya Plastics, HP6000 purchased from DIC, or other suitable epoxy resins. Epoxy resins can be used alone or in combination. Where n is an integer from 0 to 5. [NPEL-170] n is an integer from 0 to 5 [HP-6000]

[0022] In some embodiments, the amount of epoxy resin added is 1 to 5 parts by weight relative to 100 parts by weight of the low-dielectric resin composition. When the amount of epoxy resin added is greater than 5 parts by weight, the dielectric loss of the resin composition will increase, thereby affecting the low-dielectric properties. [Active ester compounds] []

[0023] There are no particular limitations on the active ester compound; an appropriate active ester compound can be selected according to requirements. In this embodiment, the active ester compound has an ester group and a naphthalene ring structure, wherein the active ester equivalent is 200 g / equivalent to 300 g / equivalent. In some embodiments, the active ester compound may be, for example, a naphthalene-containing polyester resin, such as HPC-8150 purchased from DIC, but is not limited thereto. An active ester compound may be used alone or in combination.

[0024] Reactive ester compounds can be used as curing agents for epoxy resins. In some embodiments, the amount of the active ester compound added is 1 to 5 parts by weight relative to 100 parts by weight of the low-dielectric resin composition. When the amount of the active ester compound added is greater than 5 parts by weight, the resin composition will not cure completely during subsequent film formation, resulting in a fragile insulating film that is difficult to form. [Maliimines] []

[0025] There are no particular limitations on the maleimide compound; a suitable maleimide compound can be selected according to requirements. In this embodiment, the maleimide compound has at least two active ends that are maleimides. In some embodiments, the maleimide compound may be, for example, a bismaleimide oligomer, but is not limited thereto. In some embodiments, the maleimide compound may be, for example, X9470 purchased from DIC, U3000 purchased from ABC Nanotech, BMI-3000J purchased from Designer Molecules Inc., or other suitable maleimide compounds. A single maleimide compound may be used, or multiple compounds may be used in combination. [X9470] n is an integer from 1 to 10. [BMI-3000] nh is an integer from 1 to 8.

[0026] Maleimide compounds can reduce the dielectric loss of resin compositions. In this invention, the amount of maleimide compound added is at least 20 parts by mass relative to 100 parts by mass of the low-dielectric resin composition, thereby making the dielectric loss of the low-dielectric resin composition less than or equal to 0.002 at a 10 GHz signal. In some embodiments, the amount of maleimide compound added is less than or equal to 25 parts by mass relative to 100 parts by mass of the low-dielectric resin composition. When the amount of maleimide compound added is greater than 25 parts by mass, the coefficient of thermal expansion (CTE) of the low-dielectric resin composition will increase. [Inorganic filler materials] []

[0027] Inorganic filler materials can be, for example, spherical silica. Spherical silica is preferred as the inorganic filler material. In some embodiments, the inorganic filler material is spherical silica prepared by synthesis, which contains epoxy or acrylic group surface modifications to improve performance. In some embodiments, the median particle size (D50) of the spherical silica can be less than 1 micrometer (μm), and the specific surface area can be from 4 m² / g to 6 m² / g, but the invention is not limited thereto and can be determined according to actual needs. In some embodiments, the purity of the spherical silica is greater than or equal to 99%, but the invention is not limited thereto. Inorganic filler materials can be used alone or in combination.

[0028] Inorganic fillers can enhance the physical properties of low-dielectric resin compositions, such as increasing rigidity and preventing warping. In this invention, the amount of inorganic filler added is 60 parts by weight or more relative to 100 parts by weight of the low-dielectric resin composition. When the amount of inorganic filler added is equal to or less than 60 parts by weight, the resin composition will be prone to warping. [Accelerator] []

[0029] In some embodiments, the accelerator may be, for example, 4-dimethylaminopyridine (DMAP), 2-ethyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, or a combination thereof. An accelerator may be used alone or in combination.

[0030] Accelerators can be used to lower the polymerization temperature between resins. In some embodiments, the amount of accelerator added is 0.1 to 0.5 parts by weight relative to 100 parts by weight of the low-dielectric resin composition. When the amount of accelerator added is greater than 0.5 parts by weight, the dielectric loss (Df) of the resin composition will increase, thereby affecting the low dielectric properties.

[0031] It should be noted that the above-mentioned resin composition can be considered as a non-volatile component of a resin composition (varnish-like) dissolved in a solvent, but the present invention is not limited thereto. Furthermore, the resin composition of the present invention can be processed into prepreg and copper foil substrate (CCL) according to actual design requirements, and the specific embodiments listed above are not limitations of the present invention. [<] [Experimental Example] [>]

[0032] The following embodiments and comparative examples are provided to illustrate the effects of the present invention, but the scope of the invention application is not limited to the scope of the embodiments.

[0033] The products of each embodiment and comparative example were evaluated according to the following method.

[0034] Glass transition temperature (Tg) (°C): The glass transition temperature Tg (°C) of the material was determined using a thermomechanical analyzer (TMA) according to the standard test method of ASTM E1545.

[0035] Coefficient of thermal expansion (CTE) (xy plane): The coefficient of thermal expansion of the material in the XY plane, i.e., XY CTE (ppm / °C), was determined using a thermomechanical analyzer (TMA) according to the standard test method of IPC-TM-650 2.4.24. The test temperature range was 25°C to 150°C.

[0036] Dielectric constant Dk / Dielectric loss Df: A resin film made using the resin composition in Table 1 was heated to 200°C for 90 minutes to form a cured film. The cured film was cut into pieces with a length of 10 mm and a width of 7 mm. The dielectric constant (Dk, εr) and dielectric loss (Df, Tanδ) of the material under a 10 GHz signal were determined according to the standard test method of IPC-TM-650 (Method 2.5.5.3). [。] [Example] [1-5] [Comparative Example] [1] [Preparation] []

[0037] The resin composition shown in Table 1 was dissolved in solvents (toluene, methyl ethyl ketone, cyclohexanone) and coated onto a support (PET film) using a die coater. After drying to form a film layer, the properties such as glass transfer temperature, coefficient of thermal expansion, dielectric constant, and dielectric loss were evaluated. The results are shown in Table 1.

[0038] Table 1 resin composition (parts by weight) Comparative example Example 1 1 2 3 4 5 Epoxy resin NPEL-170 6.25 1.07 1.07 1.07 1.07 1.07 HP6000 6.25 1.78 1.78 1.78 1.78 1.78 Active ester compounds HPC-8150 18.85 2.98 2.98 2.98 2.98 2.98 Maleimide compound X9470 33 twenty two U3000 11 11 33 BMI-3000J twenty two 33 Inorganic filler materials EQK0610-SMS 100 100 100 100 100 100 Accelerator DMAP 0.2 0.2 0.2 0.2 0.2 0.2 Glass transfer temperature (°C) 170 165 166 165 164 162 Coefficient of thermal expansion XY (25℃~150℃) (ppm / ℃) 18 25 25 twenty three 25 twenty three Dielectric constant (10 GHz) 3.3 3.2 3.2 3.2 3.2 3.2 Dielectric loss (10GHz) 0.0045 0.002 0.0018 0.0013 0.0015 0.0015

[0039] Information on each of the above components is as follows: NPEL-170: Bisphenol F type epoxy resin, purchased from Nan Ya Plastics. HP6000: Naphthalene-containing epoxy resin, purchased from DIC. HPC-8150: Naphthalene-containing polyester, purchased from DIC. X9470: A bismaleimide compound, purchased from DIC. U3000: Bismaleimide compound, purchased from ABC Nanotech BMI-3000J: Bismaleimide oligomer, purchased from Designer Molecules Inc. EQK0610-SMS: Spherical silicon dioxide, purchased from San Shi Ji. DMAP: 4-Dimethylaminopyridine, purchased from Sigma Aldrich

[0040] As shown in Table 1, compared to the resin composition without maleimide compound (Comparative Example 1), the resin compositions containing maleimide compound (Examples 1-5) exhibit lower dielectric loss while maintaining good dielectric constant, glass transition temperature, and coefficient of thermal expansion. Overall, the low-dielectric resin compositions of the present invention have a dielectric constant of approximately 3.0-3.3, a dielectric loss of approximately equal to or less than 0.002, a glass transition temperature of 150°C or higher, and a coefficient of thermal expansion of less than 25 ppm / °C.

[0041] In summary, the low-dielectric resin composition of the present invention includes epoxy resin, reactive ester compound, maleimide compound, inorganic filler, and accelerator, wherein the amount of maleimide compound added is at least 20 parts by mass relative to 100 parts by mass of the low-dielectric resin composition. By adding sufficient maleimide compound to the resin composition, its dielectric loss at 10 GHz signals is less than or equal to 0.002, effectively improving electrical specifications and making it applicable to electronic components related to high-frequency, high-speed transmission.

[0042] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0043] none

Claims

1. A low-dielectric resin composition, comprising: Epoxy resin; Active ester compounds; Maleimine compounds; Inorganic filler materials; And an accelerator, wherein the maleimide compound has at least two active ends that are maleimide, and the amount of the maleimide compound added is at least 20 parts by weight relative to 100 parts by weight of the low dielectric resin composition, and the amount of the epoxy resin added is from 1 part by weight to 5 parts by weight.

2. The low-dielectric resin composition as claimed in claim 1, wherein, relative to 100 parts by weight of the low-dielectric resin composition, the amount of the active ester compound added is 1 to 5 parts by weight, the amount of the maleimide compound added is 20 to 25 parts by weight, the amount of the inorganic filler added is 60 parts by weight or more, and the amount of the accelerator added is 0.1 to 0.5 parts by weight.

3. The low dielectric resin composition as claimed in claim 1, wherein the epoxy resin has an epoxy equivalent of 150 g / equivalent to 250 g / equivalent.

4. The low dielectric resin composition as claimed in claim 1, wherein the epoxy resin is selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and naphthalene ring-containing epoxy resin.

5. The low dielectric resin composition as claimed in claim 1, wherein the active ester compound comprises a naphthalene-containing polyester resin and the active ester equivalent is 200 g / equivalent to 300 g / equivalent.

6. The low-dielectric resin composition as claimed in claim 1, wherein the inorganic filler material comprises spherical silicon dioxide and contains surface modifications of epoxy or acrylic groups.

7. The low-dielectric resin composition as claimed in claim 6, wherein the median particle size of the spherical silicon dioxide is less than 1 micrometer and the specific surface area is from 4 square meters / gram to 6 square meters / gram.

8. The low dielectric resin composition as claimed in claim 1, wherein the accelerator comprises 4-dimethylaminopyridine, 2-ethyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, or a combination thereof.

9. Use of a low-dielectric resin composition as claimed in claim 1, suitable for forming dielectric materials for electronic components related to high-frequency, high-speed transmission, wherein the low-dielectric composition has a dielectric loss of less than or equal to 0.002 and a dielectric constant of 3.0 to 3.3 at a 10 GHz signal.