Wafer Frame Cleaning Device and Cleaning Method

Abstract

This invention relates to a wafer frame cleaning device, comprising a machine body and at least one water injection mechanism, at least one brush mechanism, and a flipping mechanism mounted on the machine body. The machine body includes a material inlet / outlet area, a cleaning chamber, and a flipping area arranged sequentially, and a moving stage capable of reciprocating between the material inlet / outlet area and the flipping area. The brushes of the water injection mechanism and the brush mechanism are located in the cleaning chamber, and the flipping mechanism is located in the flipping area. The cleaning method of this invention is applied to the cleaning device, allowing a wafer frame to be input into the machine body from the material inlet / outlet area and carried on the moving stage. Through the reciprocating movement of the moving stage, the wafer frame is cleaned by the water injection mechanism and the brushes in the cleaning chamber, and then flipped over by the flipping mechanism. Therefore, both sides of the wafer frame can be cleaned using only one cleaning device, reducing the required overall space and cost.

Description

Technical Field

[0001] This invention relates to a wafer frame cleaning device and a wafer frame cleaning method, particularly the device and method for cleaning wafer frames. Prior Technology

[0002] In the wafer fabrication process, the wafer is supported by a wafer frame to fix the wafer in place during grinding and dicing.

[0003] The wafer is attached to the wafer frame with adhesive. Therefore, when the wafer is removed from the wafer frame, adhesive residue often remains on the wafer frame, which needs to be cleaned and removed.

[0004] Current cleaning equipment for cleaning wafer frames includes a pre-removal unit, multiple cleaning devices, and an inspection device arranged sequentially along a cleaning route. After the wafer frame is input into the cleaning equipment, it first passes through the pre-removal unit to remove labels and some stains. Then, one side of the wafer frame is cleaned by one of the cleaning devices. It is then transported along the cleaning route to another cleaning device to clean the other side of the wafer frame. Finally, the cleaning status of the wafer frame is checked by the inspection device.

[0005] However, since the wafer frame moves and is cleaned in a single direction in the cleaning equipment, multiple cleaning devices need to be installed in the cleaning equipment. This results in the cleaning operation requiring more space and the cost of installing multiple cleaning devices being higher, and there is still room for improvement. Summary of the Invention

[0006] The main purpose of this invention is to provide a wafer frame cleaning device and a wafer frame cleaning method, thereby improving the current problem that the current wafer frame cleaning equipment moves and cleans in a single direction, resulting in cleaning operations requiring more space and incurring higher costs.

[0007] To achieve the aforementioned objectives, the wafer frame cleaning device of this invention includes: A machine body includes a feeding / discharging area, a cleaning chamber, a tilting area, and a moving platform. The feeding / discharging area, the cleaning chamber, and the tilting area are arranged adjacent to each other in sequence. The moving platform can reciprocate between the feeding / discharging area and the tilting area and pass through a cleaning area of ​​the cleaning chamber. At least one water injection mechanism is provided in the cleaning chamber of the machine body, the water injection mechanism is connected to an external water source and can inject water toward the cleaning area; At least one brush mechanism is provided on the machine body and includes a brush assembly and a brush drive assembly. The brush assembly is located in the cleaning chamber and adjacent to the cleaning area. The brush drive assembly is connected to the brush assembly and can drive the brush assembly to rotate axially. A flipping mechanism is located in the flipping area and includes a flipping drive mechanism and a flipping fixing tool. The flipping drive mechanism is disposed on the machine body and connected to the flipping fixing tool, and can drive the flipping fixing tool to rise and fall and flip the flipping fixing tool. When the moving platform is located in the flipping area, the moving platform is adjacent to the flipping mechanism.

[0008] This invention relates to a wafer frame cleaning device for cleaning a wafer frame. During the cleaning process, the wafer frame is input into the infeed / outfeed area of ​​the machine body and placed on the moving stage. The moving stage drives the wafer frame into the cleaning chamber. At least one water injection mechanism injects water toward the moving stage located in the cleaning area to clean the wafer frame. At the same time, the brushes of at least one brush mechanism abut against the wafer frame. The brush drive assembly rotates the brushes to brush one side of the wafer frame. Then, the wafer frame is moved to the flipping area, and the flipping mechanism flips the wafer frame over. The wafer frame is then moved back into the cleaning chamber, so that the other side of the wafer frame is cleaned and brushed with water. Finally, the wafer frame is output from the infeed / outfeed area of ​​the machine body.

[0009] By incorporating the flipping mechanism and the reciprocating design of the wafer frame cleaning device, after one side of the wafer frame is cleaned, the flipping mechanism flips the wafer frame over, and the reciprocating stage sends the wafer frame back into the cleaning chamber, allowing the other side of the wafer frame to be cleaned. Therefore, when cleaning the same wafer frame, it is not necessary to set up multiple cleaning devices, which can reduce the overall space required for cleaning operations and reduce costs.

[0010] To achieve the aforementioned objective, this invention also provides a wafer frame cleaning method applicable to a wafer frame cleaning device for cleaning wafer frames. The wafer frame cleaning device has a feed / discharge area, a cleaning chamber, and a flipping area arranged sequentially. The cleaning chamber is equipped with at least one water injection mechanism and at least one brush assembly. The flipping area is equipped with a flipping mechanism. The wafer frame cleaning method includes the following steps: A wafer frame is input into the inlet / outlet area of ​​the wafer frame cleaning device; The wafer frame is moved forward along a cleaning path into the cleaning chamber, with the first surface of the wafer frame facing the at least one brush assembly; Water is injected into the wafer frame through at least one water injection mechanism, and the first surface of the wafer frame is cleaned through at least one brush assembly; The wafer frame moves forward along the cleaning path, leaving the cleaning chamber and entering the flipping area; The wafer frame is flipped using the flipping mechanism; The wafer frame is moved in the opposite direction along the cleaning path into the cleaning chamber, with the second surface of the wafer frame facing the at least one brush assembly; Water is injected into the wafer frame through at least one water injection mechanism, and the second surface of the wafer frame is cleaned through at least one brush assembly; and The wafer frame is moved in the reverse direction along the cleaning path to the inlet / outlet area, and the wafer frame is output from the wafer frame cleaning device.

[0011] The present invention provides a wafer frame cleaning method in which the wafer frame is flipped by a flipping mechanism during the cleaning process, and the wafer frame is moved back and forth between the inlet / outlet area, the cleaning chamber, and the flipping area of ​​the wafer frame cleaning device. Therefore, the wafer frame can be cleaned in the cleaning chamber of the same wafer frame cleaning device without the need to build multiple wafer frame cleaning devices, thereby reducing the overall space required for cleaning operations and reducing costs. Simple Explanation of the Diagram

[0012] Figure 1: A perspective view of a preferred embodiment of the wafer frame cleaning device of this invention. Figure 2: A three-dimensional schematic diagram of the wafer frame cleaning device of this invention from another perspective. Figure 3: A three-dimensional schematic diagram of the material inlet and outlet areas of the wafer frame cleaning device of this invention. Figure 4: A three-dimensional schematic diagram of the cleaning chamber and brush mechanism of the wafer frame cleaning device of this invention. Figure 5: A three-dimensional schematic diagram of the brush mechanism of the wafer frame cleaning device of this invention. Figure 6: An enlarged three-dimensional schematic diagram of the brush mechanism of the wafer frame cleaning device of this invention. Figure 7: A three-dimensional schematic diagram of the brush mechanism of the wafer frame cleaning device of this invention from another perspective. Figure 8: A front view of the brush mechanism of the wafer frame cleaning device of this invention. Figure 9: A schematic diagram of the AA section of Figure 8. Figure 10: A partial rear view of the brush mechanism of the wafer frame cleaning device of this invention. Figure 11: A side view of the wafer frame cleaning device of this invention. Figure 12: A top view of the wafer frame cleaning device of this invention. Figure 13: A plan view of the wafer frame cleaning device of this invention, showing the BB cross-section of Figure 12. Figure 14: A planar schematic diagram of a moving stage supporting and moving a wafer frame. Figure 15: A schematic diagram of the first surface of the wafer frame being cleaned in the cleaning chamber by the water injection mechanism and the brush wheel mechanism. Figure 16: A three-dimensional schematic diagram of the flipping mechanism of the wafer frame cleaning device of this invention, which fixes and flips the wafer frame. Figure 17: A plan view of the lifting mechanism of the wafer frame cleaning device of this invention, which places the wafer frame on the moving stage. Figure 18: A schematic diagram of the second surface of the wafer frame being cleaned in the cleaning chamber by the water injection mechanism and the brush wheel mechanism. Implementation

[0013] Please refer to Figures 1 to 4, 11 and 12 for a preferred embodiment of the wafer frame cleaning device of this invention, which includes a machine body 10, at least one water injection mechanism 20, at least one brush mechanism 30 and a flipping mechanism 40.

[0014] As shown in Figures 1, 2, 5, 11 and 12, the machine body 10 includes a feeding / discharging area 11, a cleaning chamber 12, a tilting area 13 and a moving platform 14. The feeding / discharging area 11, the cleaning chamber 12 and the tilting area 13 are arranged adjacent to each other in sequence. The moving platform 14 can move back and forth between the feeding / discharging area 11 and the tilting area 13 and pass through a cleaning area of ​​the cleaning chamber 12.

[0015] In this embodiment, the mobile platform 14 is driven by a chain, while in other embodiments, the mobile platform 14 can be a conveyor belt.

[0016] As shown in Figures 1, 4, 12 and 13, at least one water injection mechanism 20 is disposed in the cleaning chamber 12 of the machine body 10. The at least one water injection mechanism 20 is connected to an external water source and can inject water toward the cleaning area.

[0017] As shown in Figures 1, 2, 4 and 5, the at least one brush mechanism 30 is disposed on the machine body 10 and includes a brush component 31 and a brush drive assembly 32. The brush component 31 is located in the cleaning chamber 12 and is adjacent to the cleaning area. The brush drive assembly 32 is connected to the brush component 31 and can drive the brush component 31 to rotate axially.

[0018] As shown in Figure 2, the flipping mechanism 40 is located in the flipping area 13 and includes a flipping drive mechanism 41 and a flipping fixing tool 42. The flipping drive mechanism 41 is disposed on the machine body 10 and connected to the flipping fixing tool 42, and can drive the flipping fixing tool 42 to rise and fall, and flip the flipping fixing tool 42. When the moving platform 14 is located in the flipping area 13, the moving platform 14 is adjacent to the flipping mechanism 40.

[0019] As shown in Figure 13, the wafer frame cleaning device of this invention is used to clean a wafer frame 70. During the cleaning process, the wafer frame 70 is input into the feed area 11 of the machine body 10 and placed on the moving table 14.

[0020] As shown in Figures 3 and 13, the wafer frame cleaning device includes an infeed / outfeed mechanism 50, which is located in the infeed / outfeed area 11 and includes an infeed / outfeed drive mechanism 51 and an infeed / outfeed fixing tool 52. The infeed / outfeed drive mechanism 51 is disposed on the machine body 10 and connected to the infeed / outfeed fixing tool 52, and can drive the infeed / outfeed fixing tool 52 to move up and down. When the moving stage 14 is located in the infeed / outfeed area 11, the moving stage 14 is adjacent to the infeed / outfeed mechanism 50. In this embodiment, the wafer frame 70 is fixed by the infeed / outfeed fixing tool 52, and the infeed / outfeed drive mechanism 51 drives the infeed / outfeed fixing tool 52 to move to position or detach from the moving stage 14.

[0021] Furthermore, as shown in Figures 11, 13, 14, and 16, the machine body 10 includes two lifting mechanisms 60. These two lifting mechanisms 60 are disposed on the machine body 10 and located respectively in the infeed / outfeed area 11 and the flipping area 13. Each lifting mechanism 60 includes a lifting drive member 61 and a plurality of lifting rods 62. The lifting drive member 61 is connected to the plurality of lifting rods 62. When the moving stage 14 is located in the infeed / outfeed area 11 or the flipping area 13, the lifting drive member 61 can drive the plurality of lifting rods 62 to rise and pass through the moving stage 14. When the infeed / outfeed fixing tool 52 places the wafer frame 70 on the moving stage 14, the wafer frame 70 first contacts the plurality of lifting rods 62 that are driven upward by the lifting drive member 61, and then is placed on the moving stage 14 by the descent of the plurality of lifting rods 62, thereby improving alignment accuracy.

[0022] Preferably, as shown in Figures 3 and 16, the top of the moving stage 14 has a pair of alignment recesses 141, the outline of which corresponds to the outline of the wafer frame 70. When the wafer frame 70 is placed on the moving stage 14, it is located in the alignment recesses 141. Only the top surface of the wafer frame 70 protrudes from the moving stage 14, thereby improving the stability of the wafer frame 70 when placed on the moving stage 14.

[0023] As shown in Figures 14 and 15, the moving stage 14 drives the wafer frame 70 into the cleaning chamber 12. The at least one water injection mechanism 20 injects water toward the moving stage 14 located in the cleaning area to clean the wafer frame 70. At the same time, the brush 31 of the at least one brush mechanism 30 abuts against the wafer frame 70. The brush drive assembly 32 causes the brush 31 to rotate to brush one side of the wafer frame 70.

[0024] In this embodiment, as shown in Figures 12 and 15, the wafer frame cleaning device includes two spaced-apart brush mechanisms 30 and four water injection mechanisms 20. A water injection mechanism 20 is provided on both sides of the brush component 31 of each brush mechanism 30, thereby improving the cleanliness of the wafer frame 70. In addition, according to the cleaning requirements of the wafer frame 70, the brush component 31 can be replaced with a brush component 31 of different materials.

[0025] Furthermore, the at least one water injection mechanism 20 includes a heating unit and can output water heated by the heating unit. Corresponding to different types of residual colloids on the wafer frame 70, the heating unit can heat the water to a preset temperature of the wafer frame cleaning device, thereby softening the colloids and improving cleanliness.

[0026] Additionally, as shown in Figures 6 to 8 and Figure 15, the at least one brush mechanism 30 includes a lifting drive assembly 33. The lifting drive assembly 33 includes a lifting drive member 331, a brush holder 332, and a pressure-sensitive unit. The lifting drive member 331 is disposed on the machine body 10 and connected to the brush holder 332. The brush member 31 is pivotally mounted on the brush holder 332. The pressure-sensitive unit is disposed in the brush member 31 and electrically connected to the lifting drive member 331. By sensing the pressure generated when the brush member 31 contacts the wafer frame 70 through the pressure-sensitive unit, the lifting drive member 331 automatically drives the brush holder 332 to rise and fall, thereby adjusting the height of the brush member 31 and controlling the force with which the brush member 31 cleans the wafer frame 70.

[0027] Additionally, as shown in Figures 6 to 10, the at least one brush mechanism 30 includes a reciprocating drive assembly 34. This reciprocating drive assembly 34 is disposed on the brush holder 332 and includes a moving component 343, a crank component 341, and a reciprocating drive component 342. The moving component 343 is connected to the brush component 31 and is movably disposed on the brush holder 332. The crank component 341 is connected to the moving component 343. The reciprocating drive component 342 is connected to and can drive the crank component 341 to move, causing the moving component 343 and the brush component 31 to reciprocate axially. During the brushing process of the brush component 31 on the wafer frame 70, the brush component 31 can be driven to rotate axially by the brush drive assembly 32 and simultaneously moved axially reciprocally by the reciprocating drive assembly 34. Therefore, the brush component 31 can brush in two directions, effectively improving the cleanliness of the wafer frame 70.

[0028] Furthermore, as shown in Figures 13 to 15, the machine body 10 has at least one pressure roller 15, which is pivotally mounted in the cleaning chamber 12. When the moving stage 14 is located in the cleaning area, the at least one pressure roller 15 is adjacent to the moving stage 14 and abuts against the wafer frame 70, thereby improving stability during cleaning.

[0029] As shown in Figures 15 to 17, after the first side of the wafer frame 70 is cleaned, the wafer frame 70 is moved to the flipping area 13 and flipped over by the flipping mechanism 40. Preferably, the flipping and fixing tool 42 can fix the wafer frame 70 by clamping, magnetic attraction or vacuum suction.

[0030] For example, the flipping and fixing tool 42 of the flipping mechanism 40 includes two fixing plates 421, which can move closer to each other and further apart. The lifting mechanism 60 located in the flipping area 13 can lift the wafer frame 70 from the moving stage 14, so that the two fixing plates 421 of the flipping and fixing tool 42 move closer to each other to clamp the wafer frame 70; or a vacuum nozzle can be provided on the two fixing plates 421 to fix the wafer frame 70 by vacuum suction; or an electromagnet can be provided on the two fixing plates 421 to fix the wafer frame 70 by magnetic attraction.

[0031] Next, the flipping drive mechanism 41 drives the flipping fixing tool 42 to rise and flip the flipping fixing tool 42 so that the second side of the wafer frame 70 faces upward. Then, the wafer frame 70 is put back into the lifting mechanism 60 and the two fixing pieces 421 are moved away from each other. Then, the lifting mechanism 60 puts the wafer frame 70 back into the moving stage 14.

[0032] In addition, the feeding and discharging fixing tool 52 of the feeding and discharging mechanism 50 can adopt the same mechanism design as the flipping fixing tool 42, thereby reducing design and maintenance costs.

[0033] As shown in Figure 18, the wafer frame 70 is moved back into the cleaning chamber 12, so that the second surface of the wafer frame 70 is cleaned and washed with water. Finally, the wafer frame 70 is output from the wafer frame cleaning device through the infeed and outfeed mechanism 50 in the infeed and outfeed area 11 of the machine body 10, thus completing the cleaning operation of the wafer frame 70.

[0034] The wafer frame cleaning device is equipped with a flipping mechanism 40 and a reciprocating stage 14. After one side of the wafer frame 70 is cleaned, the flipping mechanism 40 flips the wafer frame 70 over, and the stage 14 returns the wafer frame 70 to the cleaning chamber 12, so that the other side of the wafer frame 70 can be cleaned. Therefore, when cleaning the same wafer frame 70, it is not necessary to set up multiple cleaning devices, which can reduce the overall space required for cleaning operations and reduce costs.

[0035] Furthermore, depending on the cleaning requirements of the wafer frame 70, multiple sets of wafer frame cleaning devices can be installed simultaneously in the wafer frame cleaning equipment. Each wafer frame cleaning device can operate independently to clean one wafer frame 70, thus achieving the function of reducing the overall space required for cleaning operations.

[0036] As shown in Figures 11 and 12, this invention also provides a method for cleaning a wafer frame, applicable to a wafer frame cleaning device and used to clean a wafer frame 70. The wafer frame cleaning device has a material inlet / outlet area 11, a cleaning chamber 12, and a flipping area 13 arranged sequentially. The cleaning chamber 12 is provided with at least a water injection mechanism 20 and at least one brush 31. The flipping area 13 is provided with a flipping mechanism 40. As shown in Figures 13 to 18, the wafer frame cleaning method includes the following steps:

[0037] A wafer frame 70 is input into the feed / discharge area 11 of the wafer frame cleaning device.

[0038] The wafer frame 70 is moved forward along a cleaning path into the cleaning chamber 12, with the first surface of the wafer frame 70 facing the at least one brush 31.

[0039] Water is injected into the wafer frame 70 through the at least one water injection mechanism 20, and the first surface of the wafer frame 70 is cleaned through the at least one brush 31.

[0040] The wafer frame 70 is moved forward along the cleaning path, leaving the cleaning chamber 12 and entering the flipping area 13.

[0041] The wafer frame 70 is flipped by the flipping mechanism 40.

[0042] The wafer frame 70 is moved in the opposite direction along the cleaning path into the cleaning chamber 12, with the second surface of the wafer frame 70 facing the at least one brush 31.

[0043] Water is injected into the wafer frame 70 through the at least one water injection mechanism 20, and the second side of the wafer frame 70 is cleaned through the at least one brush 31.

[0044] The wafer frame 70 is moved in the reverse direction along the cleaning path to the inlet / outlet area 11, and the wafer frame 70 is output from the wafer frame cleaning device.

[0045] As shown in Figures 11 to 18, the cleaning method is applied to the wafer frame cleaning device to clean the wafer frame 70. The wafer frame 70 is cleaned along the cleaning path with its first side facing forward. The wafer frame 70 is then flipped by the flipping mechanism 40 and cleaned along the cleaning path with its second side facing backward. The wafer frame 70 moves back and forth between the inlet / outlet area 11, the cleaning chamber 12, and the flipping area 13 of the wafer frame cleaning device. Therefore, it can be cleaned in the cleaning chamber 12 of the same wafer frame cleaning device without the need to build multiple wafer frame cleaning devices, thereby reducing the overall space required for cleaning operations and reducing costs.

[0046] In summary, the wafer frame cleaning device and the cleaning method described herein are used to clean the wafer frame 70. The wafer frame 70 is reciprocated and flipped within the wafer frame cleaning device. Therefore, both sides of the wafer frame 70 can be cleaned using only the same wafer frame cleaning device, effectively reducing the overall space required for the cleaning operation and reducing costs.

[0047] 10: Machine body 11: Material Inlet / Outlet Area 12: Cleaning chamber 13: Flip Zone 14: Mobile station 141: Alignment recess 15: Pressure Roller 20: Water injection mechanism 30: Brush mechanism 31: Brush assembly 32: Brush drive component 33: Lifting drive assembly 331: Lifting drive component 332: Brush holder 34: Reciprocating drive component 341: Crank assembly 342: Reciprocating drive component 343: Moving parts 40: Tilting Mechanism 41: Tilting drive mechanism 42: Flip and fix tool 421: Fixing plate 50: Feeding / Discharging Mechanism 51: Feeding / Discharging Drive Mechanism 52: Feeding and discharging fixing tools 60: Lifting Mechanism 61: Lifting drive component 62: Lifting rod 70: Wafer Frame

Claims

1. A wafer frame cleaning apparatus, comprising: a machine body, the machine body including an infeed / outfeed area, a cleaning chamber, a flipping area and a moving stage, the infeed / outfeed area, the cleaning chamber and the flipping area being arranged adjacent to each other in sequence, the moving stage being capable of reciprocating between the infeed / outfeed area and the flipping area and passing through a cleaning area of ​​the cleaning chamber; at least one water injection mechanism, the at least one water injection mechanism being disposed in the cleaning chamber of the machine body, the at least one water injection mechanism being connected to an external water source and capable of injecting water toward the cleaning area; At least one brush mechanism is provided on the machine body and includes a brush assembly, a brush drive assembly, a lifting drive assembly, and a reciprocating drive assembly. The brush assembly is located in the cleaning chamber and adjacent to the cleaning area. The brush drive assembly is connected to the brush assembly and can drive the brush assembly to rotate axially. The lifting drive assembly includes a lifting drive member, a brush holder, and a pressure-sensitive unit. The lifting drive member is provided on the machine body and connected to the brush holder. The brush assembly is pivotally mounted on the brush holder. The pressure-sensitive unit is provided in the brush assembly and electrically connected to the lifting drive member. The reciprocating drive assembly is provided on the brush holder and includes... A movable component, a crank component, and a reciprocating drive component are provided. The movable component is connected to the brush component and movably disposed on the brush holder. The crank component is connected to the movable component. The reciprocating drive component is connected to and can drive the crank component to move, so that the movable component and the brush component reciprocate axially. A flipping mechanism is provided. The flipping mechanism is located in the flipping area and includes a flipping drive mechanism and a flipping fixing tool. The flipping drive mechanism is disposed on the machine body and connected to the flipping fixing tool, and can drive the flipping fixing tool to rise and fall and flip the flipping fixing tool. When the movable table is located in the flipping area, the movable table is adjacent to the flipping mechanism.

2. The wafer frame cleaning apparatus as claimed in claim 1, wherein the machine body has at least one pressure roller pivotally disposed in the cleaning chamber, and the at least one pressure roller is adjacent to the moving stage when the moving stage is located in the cleaning area.

3. The wafer frame cleaning apparatus as described in claim 1, wherein the wafer frame cleaning apparatus includes an infeed / outfeed mechanism, the infeed / outfeed mechanism is located in the infeed / outfeed area and includes an infeed / outfeed drive mechanism and an infeed / outfeed fixing tool, the infeed / outfeed drive mechanism is disposed on the machine body and connected to the infeed / outfeed fixing tool, and is capable of driving the infeed / outfeed fixing tool to rise and fall, and when the moving stage is located in the infeed / outfeed area, the moving stage is adjacent to the infeed / outfeed mechanism.

4. The wafer frame cleaning apparatus as described in claim 1, wherein the machine body includes two lifting mechanisms, the two lifting mechanisms are disposed on the machine body and respectively located in the infeed / outfeed area and the flipping area, each lifting mechanism includes a lifting drive and a plurality of lifting rods, the lifting drive is connected to the plurality of lifting rods, and when the moving stage is located in the infeed / outfeed area or the flipping area, the lifting drive can drive the plurality of lifting rods to rise and pass through the moving stage.

5. The wafer frame cleaning apparatus as claimed in claim 1, wherein the top of the moving stage has a pair of matching recesses.

6. The wafer frame cleaning apparatus as claimed in claim 1, wherein the flipping mechanism includes two fixing plates that can move closer to and further away from each other, and the flipping mechanism can fix a wafer frame by clamping, magnetic attraction or vacuum suction.

7. The wafer frame cleaning apparatus as claimed in claim 1, wherein the at least one water injection mechanism includes a heating unit and is capable of outputting water heated by the heating unit.

8. A method for cleaning a wafer frame, applicable to a wafer frame cleaning device and used for cleaning wafer frames, the wafer frame cleaning device having a feeding / discharging area, a cleaning chamber, and a flipping area arranged sequentially, the cleaning chamber being provided with at least one water injection mechanism and at least one brush wheel, and the flipping area being provided with a flipping mechanism, the method for cleaning the wafer frame comprising the following steps: inputting a wafer frame into the feeding / discharging area of ​​the wafer frame cleaning device; moving the wafer frame forward along a cleaning path into the cleaning chamber, with the first surface of the wafer frame facing the at least one brush wheel; injecting water into the wafer frame through the at least one water injection mechanism, and cleaning the first surface of the wafer frame by rotating and reciprocating along the axial direction through the at least one brush wheel; moving the wafer frame forward along the cleaning path out of the cleaning chamber and into the flipping area; flipping the wafer frame through the flipping mechanism; moving the wafer frame backward along the cleaning path into the cleaning chamber, with the second surface of the wafer frame facing the at least one brush wheel. The wafer frame is injected with water through at least one water injection mechanism, and the second surface of the wafer frame is cleaned by rotating and reciprocating along the axial direction through at least one brush; and the wafer frame is moved in the opposite direction along the cleaning path to the inlet / outlet area, and the wafer frame is output from the wafer frame cleaning device.

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