Charging system and method of controlling charging system

Abstract

This charging system includes: a particle adsorption aid that is charged with static electricity and adsorbs particles by the static electricity; a charging device that charges the particle removal aid with static electricity; and a charging device receiving container that is used to receive the charging device and is located in a front-opening wafer transfer box for storing a substrate, and includes an opening that opens into the substrate transfer device.

Description

Live systems and control methods for live systems This invention relates to an electrified system and a control method for an electrified system. Previous reports have disclosed jigs (also known as fixtures) for adsorbing dust and other particles within semiconductor manufacturing equipment. Japanese Patent Application Publication No. 11-224895 discloses a disc-shaped particle removal jig that is charged by static electricity. This jig, which is disc-shaped like the wafer, is mounted on the hand of a robotic arm in a substrate transport device. When the jig contacts the hand, particles adhering to the hand are adsorbed by the charged jig. As a result, particles adhering to the hand can be removed. In the case of the method disclosed in Japanese Patent Application Publication No. 11-224895, when removing particles using a particle removal aid that is charged due to static electricity, the particle removal aid must be pre-charged. Furthermore, in the case of the method disclosed in Japanese Patent Application Publication No. 11-224895, when the robotic arm's hand and the particle removal aid are positioned in a substrate transport device, it is necessary to temporarily open the interior of the substrate transport device and manually charge the particle removal aid. However, once the interior of the substrate transport device is temporarily opened, dust and other particles will enter the interior. Therefore, it is desirable to charge the particle removal aid without opening the interior of the semiconductor manufacturing apparatus, such as the substrate transport device. The present invention was made in order to solve the above-mentioned problems. One object of the present invention is to provide a charging system and a control method for the charging system that can charge the particle adsorption auxiliary device without the need for an open substrate conveying device. According to a first aspect of the present invention, the charged system comprises: a particle adsorption aid that is charged with static electricity and adsorbs particles by means of the charged static electricity; a charging device that charges the particle adsorption aid with static electricity; and a charging device receiving container that is for receiving the charging device and is disposed at a position for disposing of a front-opening wafer transfer cassette (FOUP) for receiving a substrate, and includes an opening that opens into the substrate transport device. According to the first aspect of the present invention, the charging system, as described above, includes: a charging device for charging a particle adsorption aid with static electricity; and a charging device receiving container for housing the charging device and disposed in a front-opening wafer transport cassette for housing a substrate, and including an opening that opens into the substrate transport apparatus. Because the charging device receiving container includes an opening that opens into the substrate transport apparatus, the internal space of the charging device receiving container is connected to the internal space of the substrate transport apparatus. Therefore, the particle adsorption aid can be charged within the internal space of the charging device receiving container by the charging device. As a result, the particle adsorption aid can be charged without opening the substrate transport apparatus. According to the second aspect of the present invention, the control method of the charged system includes: electrifying a particle adsorption aid for adsorbing particles by means of an electrified device housed in an electrified device housing container, the electrified device housing container being disposed at a position of a front-opening wafer transport box for arranging a substrate, and the electrified device housing container including an opening that opens into a substrate transport device; and adsorbing particles by means of the electrostatically charged particle adsorption aid. According to the second aspect of the present invention, the control method for a charged system, as described above, includes: electrostatically charging a particle adsorption aid for adsorbing particles using a charging device housed in a charging device housing container. The charging device housing container is disposed at a position of a front-opening wafer transport cassette for housing a substrate and includes an opening that opens into a substrate transport apparatus. Therefore, since the charging device housing container includes an opening into the substrate transport apparatus, the internal space of the charging device housing container is connected to the internal space of the substrate transport apparatus. Thus, the particle adsorption aid can be charged within the charging device housing container using the charging device. As a result, a control method for a charged system that can charge a particle adsorption aid without opening the substrate transport apparatus can be provided. According to the substrate conveying system and control method of the substrate conveying system of the present invention, the particle adsorption aid can be charged without opening the substrate conveying device. [Description of Preferred Embodiments] [First Embodiment] The first embodiment of the present invention, embodied in the drawings, will be described below. Furthermore, in this application specification, the vertical direction is defined as the Z direction. The upper side is defined as the Z1 side, and the lower side as the Z2 side. The direction orthogonal to the Z direction is defined as the X direction. One side of the X direction is defined as the X1 side, and the other side as the X2 side. The direction orthogonal to both the Z and X directions is defined as the Y direction. One side of the Y direction is defined as the Y1 side, and the other side as the Y2 side. (Semiconductor Manufacturing Apparatus) First, the semiconductor manufacturing apparatus 500 will be described. As shown in FIG1, the semiconductor manufacturing apparatus 500 is an apparatus for processing a substrate 1 made of semiconductors such as wafers. The semiconductor manufacturing apparatus 500 includes a substrate transport apparatus 200 and a substrate processing apparatus 300. Furthermore, the semiconductor manufacturing apparatus 500 is, for example, disposed in a cleanroom. (Substrate transport apparatus) The substrate transport apparatus 200 will be described in the following description. The substrate transport apparatus 200 is, for example, an EFEM (Equipment Front End Module). The substrate transport apparatus 200 includes a front-opening wafer transfer box 110, a housing 120, a front-opening wafer transfer box opener 130, an alignment device 140, a robot 150, and a control unit 160 shown in FIG2. (Front-opening wafer transfer box) The front-opening wafer transfer box 110 is used to house a plurality of substrates 1 before and after processing. The interior of the front-opening wafer transfer box 110 is maintained in a cleanroom-free state. Furthermore, the front-opening wafer transfer box 110 includes a housing 111 and an opening / closing part 112. The housing 111 has a box shape including an opening 111a that opens into the substrate transport device 200. Moreover, the opening / closing part 112 covers the opening 111a of the housing 111. In addition, for example, four front-opening wafer transfer boxes 110 are arranged. (Housing) Housing 120 includes an internal space 121. The internal space 121 is filled with a highly clean ambient gas. Robot 150 is disposed within the internal space 121 of housing 120. Housing 120 has, for example, a cuboid shape. The wall 122 on the Y1 side of housing 120 has an opening 122a that connects to the internal space 113 of the front-opening wafer transfer cassette 110. The substrate 1 can move between the front-opening wafer transfer cassette 110 and the substrate transport device 200 via the opening 122a. The wall 123 on the Y2 side of housing 120 has an opening 123a that connects to the internal space 311 of the substrate processing device 300. The substrate 1 can move between the substrate processing device 300 and the substrate transport device 200 via the opening 123a. The front-opening wafer transfer cassette opener 130 will be described. The front-opening wafer transfer cassette opener 130 is disposed on the Y1 side of the substrate transport apparatus 200. The front-opening wafer transfer cassette opener 130 includes an opening / closing portion 131 and a front-opening wafer transfer cassette support portion 132. The opening / closing portion 131 is disposed in the opening 122a of the wall portion 122 on the Y1 side of the housing 120. An opening / closing mechanism (not shown) is used to open the opening / closing portion 131 of the front-opening wafer transfer cassette opener 130 and the opening / closing portion 112 of the front-opening wafer transfer cassette 110, thereby connecting the internal space 113 of the front-opening wafer transfer cassette 110 with the internal space 121 of the housing 120. The alignment device 140 will be described below. The alignment device 140 is used to hold the substrate 1. The alignment device 140 rotates the substrate 1 so that the notch or orientation plane formed on the substrate 1 is oriented in a predetermined direction to adjust the orientation of the substrate 1. The alignment device 140 is disposed in the internal space 121 of the housing 120 of the substrate transport device 200. The robot 150 will be described below. The robot 150 is disposed within the internal space 121 of the housing 120 of the substrate conveying device 200. The robot 150 is, for example, a horizontal multi-joint type. The robot 150 includes a hand 151 and a robot arm 152. The hand 151 holds the substrate 1. For example, the hand 151 has a Y-shape with its front end forked into two branches. Furthermore, the hand 151 is disposed at the front end of the robot arm 152. The robot arm 152 includes a plurality of linkages. The configuration of the control unit 160 will be described below. The control unit 160 is a robot controller. As shown in FIG2, the control unit 160 includes a main control unit 161, a servo control unit 162, a drive circuit unit 163, and a memory unit 164. The main control unit 161 and the servo control unit 162 include, for example, a CPU (Central Processing Unit). The main control unit 161 controls the drive unit 152a of the robot arm 152. The servo control unit 162 controls the power to be supplied to the drive unit 152a of the robot arm 152 according to the instructions from the main control unit 161. The drive circuit unit 163 supplies drive power to the drive unit 152a of the robot arm 152. There are multiple drive units 152a of the robot arm 152, and the drive circuit unit 163 is configured for each drive unit 152a of the robot arm 152. Alternatively, one drive circuit unit 163 may be configured for each drive unit 152a. Each drive unit 152a includes a servo motor, an encoder, and a reducer. The memory unit 164 stores the program executed by the control unit 160. (Substrate Processing Apparatus) The substrate processing apparatus 300 will be described below. As shown in FIG1, the substrate processing apparatus 300 performs processing on the substrate 1. For example, the substrate processing apparatus 300 performs heat treatment, impurity implantation, thin film formation, photolithography, cleaning, and planarization on the substrate 1. The substrate processing apparatus 300 is arranged adjacent to the substrate transport apparatus 200. The substrate processing apparatus 300 includes a housing 310 having an internal space 311. Furthermore, the wall 312 on the Y1 side of the housing 310 of the substrate processing apparatus 300 is a shared wall with the wall 123 on the Y2 side of the housing 120 of the substrate transport apparatus 200. Moreover, the internal space 311 of the substrate processing apparatus 300 has a substrate mounting section 313 for mounting the substrate 1. (Electrified System) The electrified system 100 is a system for electrifying the particulate adsorption aid 10. As shown in FIG2, the electrified system 100 includes a robot 150, a particulate adsorption aid 10, an electrified device 20, an electrified device receiving container 30, a charging unit 40, a particulate detection unit 50, a cleaning device 60, and a control unit 160. (Particulate Adsorption Aid) The particulate adsorption aid 10 will be described. The particulate adsorption aid 10 is held by the hand 151. Furthermore, the particulate adsorption aid 10 is electrostatically charged and adsorbs particles by means of the electrostatic charge. Furthermore, as shown in FIG3, the particulate adsorption aid 10 has, for example, a disk shape and has the same diameter as the substrate 1. Furthermore, as shown in FIG4, the particulate adsorption aid 10 includes, for example, a semiconductor substrate 11, a positive electrode 12, a negative electrode 13, a bias electrode 14, and an interface 15. The positive electrode 12 and the negative electrode 13 are formed by impurity implantation. The positive electrode 12, the bias electrode 14, and the negative electrode 13 are arranged sequentially on one surface 11a of the semiconductor substrate 11. The interface 15 is arranged on the other surface 11b of the semiconductor substrate 11. The interface 15 connects the positive electrode 12 and the negative electrode 13. Furthermore, a voltage is applied to the interface 15 from the voltage application part 22 of the charging device 20 shown in FIG5. In this way, a voltage is applied to the positive electrode 12 and the negative electrode 13, thereby charging one surface 11a of the semiconductor substrate 11. (Electrified Device) The electrified device 20 will be described below. The electrified device 20 is a device that causes the particle adsorption aid 10 to become electrostatically charged. As shown in FIG5, the electrified device 20 includes a housing 21, a voltage application unit 22, a contact detection unit 23, a power storage unit 24 shown in FIG6, and a wireless power supply coil 25 shown in FIG6. The housing 21 has a box shape. The housing 21 is sized to be housed in the electrified device housing container 30. The voltage application section 22 contacts the interface 15 of the particle adsorption aid 10 to apply a voltage to the particle adsorption aid 10. For example, the voltage application section 22 includes a plurality of probes 22a. The plurality of probes 22a protrude from the hole 21a of the housing 21 to the outside of the housing 21. By contacting the interface 15 of the particle adsorption aid 10 with the plurality of probes 22a, a voltage is applied to the positive electrode 12 and the negative electrode 13. In the first embodiment, the contact detection unit 23 detects information regarding the contact of the voltage application unit 22 with the particulate adsorption aid 10. Based on the information detected by the contact detection unit 23 concerning the contact of the voltage application unit 22 with the particulate adsorption aid 10, the charged device 20 begins to apply voltage to the particulate adsorption aid 10 from the voltage application unit 22. For example, the contact detection unit 23 is a contact sensor. Furthermore, the contact detection unit 23 is arranged adjacent to the voltage application unit 22. Furthermore, the contact detection unit 23 and the voltage application unit 22 protrude from the housing 21 at equal heights. For example, the particulate adsorption aid 10 held by the hand 151 contacts the voltage application unit 22, and the particulate adsorption aid 10 also contacts the contact detection unit 23. In this case, the information regarding the contact of the particulate adsorption aid 10 with the contact detection unit 23 relates to the contact of the voltage application unit 22 with the particulate adsorption aid 10. When the contact detection unit 23 detects that the particle adsorption aid 10 has come into contact with the voltage application unit 22, the energized device 20 begins to apply voltage to the particle adsorption aid 10 from the voltage application unit 22. For example, a switch is provided between the battery storage unit 24 and the voltage application unit 22, and the switch is turned on when the contact detection unit 23 detects that the particle adsorption aid 10 has come into contact with the voltage application unit 22. In this way, voltage is applied to the particle adsorption aid 10 from the battery storage unit 24 via the voltage application unit 22. The energy storage unit 24 stores the electricity supplied to the voltage application unit 22. As shown in FIG6, the energy storage unit 24 is disposed, for example, on the outside of the housing 21. The wireless power supply coil 25 is a coil used to charge the energy storage unit 24. The wireless power supply coil 25 is disposed, for example, above the energy storage unit 24 and inside the top surface 31 of the charged device housing 30. Furthermore, the energy storage unit 24 is connected to the wireless power supply coil 25. (Electrically Charged Device Container) The electrically charged device container 30 will be described. In the first embodiment, the electrically charged device 20 is housed in the electrically charged device container 30. Furthermore, as shown in FIG8, the electrically charged device container 30 is disposed in the substrate transport apparatus 200 at a position where the front-opening wafer transfer cassette 110 for housing the substrate 1 is disposed. Furthermore, the electrically charged device container 30 includes an opening 32 that opens toward the substrate transport apparatus 200. Specifically, the electrically charged device 20 is disposed in the internal space 33 of the electrically charged device container 30. For example, the electrically charged device 20 is disposed at a relatively upper position in the internal space 33. Furthermore, in the first embodiment, the voltage application portion 22 of the electrically charged device 20 is disposed downward inside the electrically charged device container 30. Furthermore, the interior of the electrically charged device container 30, like the front-opening wafer transfer cassette 110, is maintained in a clean state similar to that of a cleanroom. Furthermore, the electrically charged device container 30 includes a housing 34 and an opening / closing portion 35 shown in FIG7. The housing 34 has a box shape including an opening 32 that opens into the substrate transport apparatus 200. A closing portion 35 covers the opening 32 of the housing 34. Furthermore, as shown in FIG8, the charged device receiving container 30 is disposed in the substrate transport apparatus 200 within a front-opening wafer transfer cassette opener 130 for housing the front-opening wafer transfer cassette 110. Then, by opening the front-opening wafer transfer cassette opener 130 and the opening 35 of the charged device receiving container 30, the internal space 33 of the charged device receiving container 30 is connected to the internal space 121 of the housing 120. Herein, the particle adsorption aid 10 can move between the charged device receiving container 30 and the substrate transport apparatus 200 via the opening 122a of the housing 120. Furthermore, the particle adsorption aid 10 can move between the substrate transport apparatus 200 and the substrate processing apparatus 300 via the opening 123a of the housing 120. Furthermore, as shown in FIG8, in the first embodiment, the external shape of the charged device receiving container 30 is the same as that of the front-opening wafer transfer box 110, and the charged device receiving container 30 can accommodate the particle adsorption aid 10. Specifically, the housing 34 of the charged device receiving container 30 shown in FIG6 has the same size as the housing 111 of the front-opening wafer transfer box 110 shown in FIG1. ​​Therefore, the charged device receiving container 30 can be disposed in the front-opening wafer transfer box opener 130 to replace the front-opening wafer transfer box 110. Furthermore, the diameter of the particle adsorption aid 10 is the same as the diameter of the substrate 1. Thus, similar to the case where the substrate 1 is housed in the front-opening wafer transfer box 110, the particle adsorption aid 10 is housed in the charged device receiving container 30. In addition, as shown in FIG6, in the first embodiment, the charged device receiving container 30 houses the particle adsorption aid 10. For example, the particle adsorption aid 10 is supported by the support portion 30a of the charged device receiving container 30. With the electrical device containment container 30 containing the particulate adsorption aid 10, the interior of the electrical device containment container 30 remains clean. (Charging Unit) As shown in FIG9, in the first embodiment, the charging unit 40 is disposed outside the charged device housing 30 and charges the battery storage unit 24 wirelessly. Specifically, the charging unit 40 includes a wireless power supply coil 41. The wireless power supply coil 41 is supplied with power from the outside. Furthermore, the wireless power supply coil 41 is disposed on the upper surface of the top surface 31 of the charged device housing 30. The power supplied to the wireless power supply coil 41 charges the battery storage unit 24 via the wireless power supply coil 25 of the battery storage unit 24. (Particle Detection Unit) In the first embodiment, the particle detection unit 50 detects the degree of adsorption of particles by the particle adsorption aid 10 during a series of actions of the robotic arm 152. The series of actions of the robotic arm 152 will be described later. The particle detection unit 50 includes at least one of a charge detection unit 51 that detects the charge of the particle adsorption aid 10, and an imaging unit 52 that captures images of the particles adsorbed on the particle adsorption aid 10. The charge detection unit 51 is, for example, a surface potentiometer. The surface potentiometer measures the amount of static electricity by utilizing the electrostatic induction phenomenon where charged bodies attract each other when they approach a conductor. The surface potentiometer measures the amount of static electricity in a non-contact state with the particle adsorption aid 10. Furthermore, the particle detection unit 50 is disposed in the charged device receiving container 30. That is, the charged device receiving container 30 can receive both the particle adsorption aid 10 and the particle detection unit 50. Furthermore, the imaging unit 52 is, for example, a high-resolution camera capable of capturing images of particles. In the first embodiment, the cleaning device 60 cleans the particulate adsorption aid 10. As shown in FIG1, the cleaning device 60 is disposed, for example, in the internal space 311 of the substrate processing apparatus 300. The substrate processing apparatus 300 is, for example, a rotary dryer. The rotary dryer rotates the particulate adsorption aid 10 and removes the particles adsorbed on the particulate adsorption aid 10 by centrifugal force. (Operation of the substrate transport system) Next, the particulate removal operation inside the semiconductor manufacturing apparatus 500, which is composed of the substrate transport device 200, will be described. Furthermore, the operation of the substrate transport device 200 is controlled by the control unit 160. Furthermore, as shown in FIG9, the charge storage unit 24 of the charged device 20 is pre-charged wirelessly by the charging unit 40. Specifically, the particulate adsorption aid 10 is manually housed in the charged device housing container 30 beforehand. Then, the charge storage unit 24 is charged via the wireless power supply coil 41 of the charging unit 40 located outside the charged device housing container 30, through the wireless power supply coil 25 located inside the charged device housing container 30. That is, the particulate adsorption aid 10 is housed in the charged device housing container 30, and the charge storage unit 24 is charged while the inside of the charged device housing container 30 is clean. When performing the particulate removal operation, the substrate 1 processing performed by the semiconductor manufacturing apparatus 500 is not performed. Furthermore, as shown in Figure 8, a charged device receiving container 30 is provided in the front-opening wafer transfer box opener 130 to replace the front-opening wafer transfer box 110. Moreover, either one charged device receiving container 30 or multiple charged device receiving containers 30 may be provided in the front-opening wafer transfer box opener 130. The following description focuses on an example where the front-opening wafer transfer box opener 130 is equipped with one charged device receiving container 30. As shown in Figure 10, in step S1, the control unit 160 activates the opening and closing part 131 of the front-opening wafer transfer box opener 130 and the opening and closing part 35 of the charged device receiving container 30 by activating the opening and closing mechanism (not shown). The internal space 33 of the charged device receiving container 30 is connected to the internal space 121 of the housing 120 of the substrate transport device 200. In step S2, as shown in FIG8, in the first embodiment, the control unit 160 performs the process of holding the particle adsorption aid 10 pre-reserved in the charged device receiving container 30 by means of the hand 151 of the robot arm 152. Specifically, the control unit 160 causes the hand 151 to enter the internal space 33 of the charged device receiving container 30 through the opening 122a of the housing 120 of the substrate conveying device 200. In step S3, as shown in FIG11, in the first embodiment, the control unit 160 performs a process of moving the robot arm 152 to bring the particle adsorption aid 10 held by the hand 151 into contact with the voltage application unit 22, thereby energizing the particle adsorption aid 10. Specifically, the control unit 160 performs a process of moving the robot arm 152 to move the particle adsorption aid 10 held by the hand 151 upward and bring it into contact with the voltage application unit 22, thereby energizing the particle adsorption aid 10. At this time, the particle adsorption aid 10 not only contacts the voltage application unit 22 but also contacts the contact detection unit 23. Thereby, the energizing device 20 begins to apply voltage to the particle adsorption aid 10 from the voltage application unit 22. Furthermore, the control of applying voltage from the voltage application unit 22 is performed by the energizing device 20, rather than by the control unit 160. In step S4, in the first embodiment, after the control unit 160 performs the process of electrifying the particle adsorption aid 10, it moves the robot arm 152 and uses the particle adsorption aid 10 held by the hand 151 to adsorb particles from at least one of the interior of the substrate transport device 200 and the interior of the substrate processing device 300. Specifically, the particle adsorption aid 10, housed in the electrified device housing 30, moves to the substrate transport device 200 or the substrate processing device 300 through the opening 122a or opening 123a of the housing 120 of the substrate transport device 200. As a result, as shown in FIG12, particles attached to the portion of the alignment 140 for placing the substrate 1 in the internal space 121 of the substrate transport device 200, or particles attached to the substrate placement portion 313 in the internal space 311 of the substrate processing device 300 for placing the substrate 1, are adsorbed onto the particle adsorption aid 10. In step S5, in the first embodiment, the control unit 160 uses the particle detection unit 50 to detect the degree of particle adsorption by the particle adsorption aid 10. Specifically, the control unit 160 temporarily moves the particle adsorption aid 10 into the interior of the charged device containment container 30. Then, the control unit 160 uses the particle detection unit 50 to detect the amount of particles adsorbed by the particle adsorption aid 10. Furthermore, in step S6, the control unit 160 determines whether the particle adsorption aid 10 can further adsorb particles. When the particle detection unit 50 is an imaging unit 52, the control unit 160 uses image processing and other technologies to detect the amount of adsorbed particles from the image of the particle adsorption aid 10 captured by the imaging unit 52. Next, when the amount of adsorbed particles is less than a predetermined particle amount threshold, the control unit 160 determines that the particle adsorption aid 10 can further adsorb particles and returns to step S4. Furthermore, when the amount of adsorbed particles is greater than the predetermined particle amount threshold, the control unit 160 determines that the particle adsorption aid 10 cannot further adsorb particles and proceeds to step S7. Furthermore, when the particle detection unit 50 is a charge detection unit 51, the charge of the particle adsorption aid 10 is detected by the charge detection unit 51. When the particle adsorption aid 10 detected by the charge detection unit 51 is greater than a predetermined charge threshold, the control unit 160 determines that particles can be further adsorbed by the particle adsorption aid 10 and returns to step S4. Conversely, when the particle adsorption aid 10 detected by the charge detection unit 51 is less than the predetermined charge threshold, the control unit 160 determines that particles cannot be further adsorbed by the particle adsorption aid 10 and proceeds to step S7. In this way, the degree of particle adsorption is detected by the particle detection unit 50 during a series of repeated particle adsorption operations in step S4. In step S7, as shown in FIG13, in the first embodiment, after the control unit 160 performs the process of adsorbing particles by the particle adsorption aid 10, it performs the process of moving the particle adsorption aid 10 to the cleaning device 60 by means of the robotic arm 152. The cleaning device 60 performs the process of cleaning the moved particle adsorption aid 10. Furthermore, in step S8, the control unit 160, similar to step S3, charges the particle adsorption aid 10 with static electricity using the charging device 20. Next, in step S9, to confirm whether particle adsorption has been completed in at least one of the target areas for particle adsorption within the substrate transport apparatus 200 and the substrate processing apparatus 300, the control unit 160 performs a process of adsorbing particles in the same target area as in step S4. In step S9, the control unit 160 also performs an adsorption operation in step S9, similar to step S4, moving the particle adsorption aid 10 within the target area during particle adsorption. For example, similar to step S4, the control unit 160 transports the particle adsorption aid 10 held by the hand 151 to the substrate placement section 313 of the substrate processing apparatus 300, which is the target area for particle adsorption, and performs the adsorption operation by placing the particle adsorption aid 10 on the substrate placement section 313. Furthermore, in step S10, the control unit 160, similar to step 5S, uses the particle detection unit 50 to detect the degree of particle adsorption by the particle adsorption aid 10. Next, in step S11, it is determined whether particle adsorption in the target area is sufficient. For example, when the particle detection unit 50 is the imaging unit 52, similar to step S6, the control unit 160 detects the amount of particles from the image of the particle adsorption aid 10 captured by the imaging unit 52. Then, if the amount of adsorbed particles exceeds a predetermined particle amount threshold, the control unit 160 determines that particle adsorption is insufficient and returns to step S4. Furthermore, if the amount of adsorbed particles is less than the predetermined particle amount threshold, the control unit 160 determines that particle adsorption is sufficient. When it is determined that particle adsorption is sufficient, the particle removal operation inside the semiconductor manufacturing apparatus 500 performed by the substrate transport device 200 ends. Furthermore, the predetermined particle quantity threshold in step S11 may be a different value than that in step S6. Furthermore, in step S11, the determination of whether sufficient particle adsorption in the target area is achieved can be made based on the detection results of the charge detection unit 51. In this case, the charge of the particle adsorption aid 10 is detected by the charge detection unit 51. When the charge of the particle adsorption aid 10 detected by the charge detection unit 51 is less than a predetermined charge threshold, the control unit 160 determines that the charge has decreased due to particle adsorption in the same target area, and determines that particles have been detected. In this case, it is determined that particle adsorption is insufficient and returns to step S4. Furthermore, when the charge of the particle adsorption aid 10 detected by the charge detection unit 51 is greater than the predetermined charge threshold, the control unit 160 determines that no further particle adsorption has been performed, particle adsorption is sufficient, and the control process ends. Furthermore, when there are multiple target areas for adsorbing particles, the adsorption of particles can be confirmed for each of the multiple target areas by performing the processing from step S8 to step S11. [Effects of the First Embodiment] The charging system 100 includes: a charging device 20 for charging the particle adsorption aid 10 with static electricity; and a charging device receiving container 30 for receiving the charging device 20 and disposed in a front-opening wafer transfer box 110 for housing the substrate 1, and includes an opening 32 that opens into the substrate transport device 200. Since the charging device receiving container 30 includes the opening 32 opening into the substrate transport device 200, the internal space 33 of the charging device receiving container 30 is connected to the internal space 121 of the substrate transport device 200. Therefore, the particle adsorption aid 10 can be charged within the internal space 33 of the charging device receiving container 30 by means of the charging device 20. As a result, the particle adsorption aid 10 can be charged without opening the substrate transport device 200. The external shape of the charged device receiving container 30 is the same as that of the front-opening wafer transfer box 110, and the charged device receiving container 30 can accommodate the particle adsorption aid 10. Therefore, since the external shape of the charged device receiving container 30 is the same as that of the front-opening wafer transfer box 110, the charged device receiving container 30 containing the particle adsorption aid 10 can be easily positioned in the substrate transport device 200 at the position where the front-opening wafer transfer box 110 is positioned. The charged device 20 includes a power storage unit 24 for storing electricity, which is disposed outside the charged device housing 30. The charged system 100 has a charging unit 40 that charges the power storage unit 24 wirelessly. Therefore, since the power storage unit 24 can be charged wirelessly from the outside of the charged device housing 30 without opening it, it is possible to prevent dust and other contaminants from entering the interior of the charged device housing 30. The electrification device 20 includes a voltage application unit 22 that contacts the particulate adsorption aid 10 and applies voltage to the particulate adsorption aid 10. The electrification system 100 includes: a robotic arm 152; a hand 151 attached to the robotic arm 152 and holding the particulate adsorption aid 10; and a control unit 160 that performs the following processes: holding the particulate adsorption aid 10 by the hand 151 of the robotic arm 152; and moving the robotic arm 152 to bring the particulate adsorption aid 10 held by the hand 151 into contact with the voltage application unit 22 to electrify the particulate adsorption aid 10. Therefore, since the particulate adsorption aid 10 can be charged by the movement of the robotic arm 152 without relying on a human hand, the workload of the operator can be reduced. The charged device 20 includes a contact detection unit 23 that detects information regarding the contact of the voltage application unit 22 with the particulate adsorption aid 10. Based on the information detected by the contact detection unit 23 regarding the contact of the voltage application unit 22 with the particulate adsorption aid 10, the charged device 20 begins to apply voltage to the particulate adsorption aid 10 from the voltage application unit 22. Therefore, since the control unit 160 does not need to control the application of voltage from the voltage application unit 22 to the particulate adsorption aid 10, the control burden of the control unit 160 can be reduced. The voltage application unit 22 is disposed downward inside the charged device housing container 30. The control unit 160 performs a process that moves the robot arm 152 and moves the particle adsorption aid 10 held by the hand 151 upward to contact the voltage application unit 22, thereby electrifying the particle adsorption aid 10. In this way, the particle adsorption aid 10 can be easily electrified simply by moving the particle adsorption aid 10 upward by the robot arm 152. The control unit 160 performs a process in which the robot arm 152 moves and holds the particle adsorption aid 10 pre-contained in the electric device container 30 by means of the hand 151, and then brings the particle adsorption aid 10 held by the hand 151 into contact with the voltage application unit 22. In this way, since it is not necessary to move the particle adsorption aid 10 into the electric device container 30 containing the electric device 20, the operation of the robot arm 152 can be simplified. After the control unit 160 performs a process of bringing the particle adsorption aid 10 held by the hand 151 into contact with the voltage application unit 22 to electrify the particle adsorption aid 10, the robot arm 152 moves and adsorbs particles from at least one of the interiors of the substrate transport device 200 and the substrate processing device 300 by using the particle adsorption aid 10 held by the hand 151. This allows for the adsorption of particles using the fully electrified particle adsorption aid 10. The electrified system 100 includes a particle detection unit 50 that detects the degree to which particles are adsorbed by the particle adsorption aid 10 during a series of movements of the robotic arm 152. The control unit 160 then determines, based on the detection results of the particle detection unit 50, whether the particle adsorption aid 10 can further adsorb particles, thereby suppressing the continued adsorption of particles when the particle adsorption aid 10 is unable to adsorb them. The particle detection unit 50 includes at least one of a charge detection unit 51 for detecting the charge of the particle adsorption aid 10 and an imaging unit 52 for capturing images of the particles adsorbed on the particle adsorption aid 10. Thus, when the charge detection unit 51 detects that the charge of the particle adsorption aid 10 is relatively large, the control unit 160 determines that the particle adsorption aid 10 can further adsorb particles. Furthermore, by detecting a relatively small number of particles attached to the particle adsorption aid 10 based on the image of the particle adsorption aid 10 captured by the imaging unit 52, the control unit 160 can determine that the particle adsorption aid 10 can further adsorb particles. The particulate detection unit 50 is disposed in the charged device receiving container 30. In this way, compared with the detection of the degree of particulate adsorption in individual locations and the charging of the particulate adsorption aid 10, the present invention can suppress the large-scale of the charged system 100. The electrified system 100 includes a cleaning device 60 for cleaning the particulate adsorption aid 10. After the control unit 160 performs the process of adsorbing particles using the particulate adsorption aid 10, it performs the process of moving the particulate adsorption aid 10 to the cleaning device 60 using a robotic arm 152, and the cleaning device 60 performs the process of cleaning the moved particulate adsorption aid 10. In this way, since the particulate adsorption aid 10 with attached particles can be cleaned, the cleaned particulate adsorption aid 10 can be used electrifiedly in the next particulate adsorption. Therefore, it is not necessary to configure multiple particulate adsorption aids 10. [Second Embodiment] A second embodiment of the present invention, namely the live device housing container 630, will be described. In the second embodiment, as shown in FIG14, a plurality of particle adsorption aids 10 are pre-contained in the charged device housing container 630. Furthermore, the control unit 160 performs a process of sequentially replacing the plurality of particle adsorption aids 10 while adsorbing particles from at least one of the interiors of the substrate transport device 200 and the substrate processing device 300. Specifically, the interior of the charged device housing container 630 is provided with a plurality of support portions 631 for supporting the particle adsorption aids 10. The plurality of particle adsorption aids 10 are disposed on the support portions 631. Furthermore, as shown in FIG15, in step S6, if the control unit 160 determines that particles cannot be further adsorbed by the particle adsorption aids 10, in step S20, it determines whether to continue adsorbing particles. If adsorbing particles continues, the process proceeds to step S21, where the control unit 160 performs a process of replacing the held particle adsorption aid 10 with a new particle adsorption aid 10. Subsequently, the operations from steps S3 to S6 shown in Figure 15 are repeated. When step S20 is no, the control unit 160 ends the particle removal operation. [Effects of the Second Embodiment] A plurality of particle adsorption aids 10 are pre-installed in the charged device housing container 630. The control unit 160 performs processing to adsorb particles from at least one of the interiors of the substrate transport device 200 and the substrate processing device 300 while sequentially replacing the plurality of particle adsorption aids 10. Therefore, even without cleaning the cleaning device 60 to clean the particle adsorption aids 10, particles can be adsorbed while sequentially replacing the plurality of particle adsorption aids 10. [Modifications] Furthermore, it should be understood that all the embodiments disclosed herein are illustrative and not restrictive. The scope of this invention is as indicated by the claims, and not the description of the embodiments above, and includes all modifications (variations) within the same meaning and scope as the claims. The first and second embodiments described above illustrate that the external shape of the charged device receiving container 30 is the same as that of the front-opening wafer transfer box 110; however, the present invention is not limited thereto. For example, as long as the charged device receiving container 30 can be disposed in the substrate transport device 200, the external shape of the charged device receiving container 30 may be different from that of the front-opening wafer transfer box 110. The first and second embodiments described above illustrate that the particulate adsorption aid 10 is housed in the charged device housing container 30; however, the present invention is not limited thereto. For example, the particulate adsorption aid 10 may not be housed in the charged device housing container 30 but may be disposed in the substrate transport device 200 or the substrate processing device 300. The first and second embodiments described above illustrate wireless charging of the charged device 20; however, the present invention is not limited thereto. For example, the charged device 20 can also be charged by manually connecting it to a commercial power source. Furthermore, the charged device 20 can be stored in the charged device storage container 30 after charging. The first and second embodiments described above illustrate that the particulate adsorption aid 10 is moved to the electrified device 20 by the robotic arm 152 and becomes electrified; however, the present invention is not limited thereto. For example, an elevator for lifting the particulate adsorption aid 10 may be disposed in the electrified device housing container 30, and the particulate adsorption aid 10 lifted by the elevator may be electrified by the electrified device 20. In the first and second embodiments described above, the voltage application portion 22 of the energized device 20 is arranged facing downwards; however, the present invention is not limited thereto. For example, the voltage application portion 22 of the energized device 20 may also be arranged facing upwards. The first and second embodiments described above illustrate that the charged system 100 includes a particle detection unit 50; however, the present invention is not limited thereto. For example, the charged system 100 may not include a particle detection unit 50. In this case, for example, if one of the series of actions performed by the particle adsorption aid 10 to adsorb one of the particles ends once, the particle adsorption operation ends. The first and second embodiments described above illustrate that the particle detection unit 50 is disposed in the charged device receiving container 30; however, the present invention is not limited thereto. For example, the particle detection unit 50 may also be disposed in a substrate transport device 200 or a substrate processing device 300 other than the charged device receiving container 30. The first and second embodiments described above illustrate a cleaning device 60 disposed in a substrate processing apparatus 300; however, the present invention is not limited thereto. For example, the cleaning device 60 may also be disposed in a substrate conveying apparatus 200. The first and second embodiments described above illustrate that, based on information detected by the contact detection unit 23 related to the contact of the voltage application unit 22 with the particulate adsorption aid 10, the energized device 20 begins to apply voltage from the voltage application unit 22 to the particulate adsorption aid 10. However, the present invention is not limited thereto. For example, the control unit 160 may also control the application of voltage from the voltage application unit 22 to the particulate adsorption aid 10 based on information detected by the contact detection unit 23 related to the contact of the particulate adsorption aid 10 with the voltage application unit 22. The first embodiment described above illustrates that the particle removal operation ends after the particle adsorption aid 10 is cleaned by the cleaning device 60; however, the present invention is not limited thereto. For example, after the particle adsorption aid 10 is cleaned by the cleaning device 60, the particle adsorption aid 10 can be re-energized by the energizing device 20 to restart the particle removal operation. The second embodiment described above illustrates a configuration where a plurality of particle adsorption aids 10 and a voltage application unit 22 for energizing one particle adsorption aid 10 are arranged inside the energized device housing 630; however, the present invention is not limited thereto. As shown in FIG16, the present invention may also include a voltage application unit 632 that simultaneously applies voltage to a plurality of particle adsorption aids 10, arranged inside the energized device housing 630. For example, a voltage application unit 632 may be arranged in each of a plurality of support portions 631. The particle adsorption aids 10 are disposed between the voltage application units 632 and energized by the voltage application units 632. Therefore, since the plurality of particle adsorption aids 10 are energized simultaneously, the time required to energize the plurality of particle adsorption aids 10 can be shortened. The functions of the components disclosed in this specification can be executed using a circuit or processing circuit that includes a general-purpose processor, a special-purpose processor, integrated circuit, ASIC (Application Specific Integrated Circuits), conventional circuits, and / or combinations of such components configured or programmed to perform the disclosed functions. Since a processor includes transistors and other circuitry, it can be considered a processing circuit or circuit. In this invention, a circuit, unit, or means is hardware that performs the listed functions, or hardware programmed to perform the listed functions. The hardware may be the hardware disclosed in this specification, or other known hardware programmed or configured to perform the listed functions. When the hardware is conceived as a processor, a circuit, means, or unit is a combination of hardware and software, with the software used in the configuration of the hardware and / or the program. [Example] Those skilled in the art to which this invention pertains should understand that the exemplary embodiments described above are specific examples of the following examples. (Sample 1) An electrified system comprising: a particle adsorption aid that is charged with static electricity and adsorbs particles by means of the charged static electricity; an electrified device that charges the particle adsorption aid with static electricity; and an electrified device receiving container that is for receiving the electrified device and is disposed in a front-opening wafer transfer box for disposing of a substrate, and includes an opening that opens into the substrate transfer device. (Sample 2) The charged system as described in Sample 1, wherein the external shape of the aforementioned charged device receiving container is the same as the external shape of the aforementioned front-opening wafer transfer box, and the aforementioned charged device receiving container can contain the aforementioned particle adsorption aid. (Sample 3) The electrified system as described in Sample 1 or Sample 2, wherein the aforementioned electrified device includes an energy storage unit for storing electricity, and the aforementioned electrified system has a charging unit disposed outside the aforementioned electrified device housing container and charging the aforementioned energy storage unit wirelessly. (Sample 4) A charged system as described in any one of Samples 1 to 3, wherein the charged device includes a voltage applying part that contacts the particulate adsorption aid to apply a voltage to the particulate adsorption aid, and the charged system comprises: a robot arm; a hand attached to the robot arm and holding the particulate adsorption aid; and a control part that performs the following actions: holding the particulate adsorption aid by the hand of the robot arm; and moving the robot arm and bringing the particulate adsorption aid held by the hand into contact with the voltage applying part to charge the particulate adsorption aid. (Version 5) The electrified system as described in Version 4, wherein the electrified device includes a contact detection unit that detects information about the voltage application unit contacting the particle adsorption aid. Based on the information detected by the contact detection unit about the voltage application unit contacting the particle adsorption aid, the electrified device begins to apply voltage from the voltage application unit to the particle adsorption aid. (Version 6) The electrified system as described in Version 4 or Version 5, wherein the voltage application unit is disposed downward inside the electrified device housing container, and the control unit performs a process of moving the robot arm and moving the particle adsorption aid held by the hand upward to contact the voltage application unit to electrify the particle adsorption aid. (State 7) The electrified system described in any one of States 4 to 6, wherein the aforementioned electrified device receiving container pre-receives the aforementioned particulate adsorption aid, and the aforementioned control unit performs a process of moving the aforementioned robot arm and holding the aforementioned particulate adsorption aid pre-received in the aforementioned electrified device receiving container by the aforementioned hand, and then bringing the aforementioned particulate adsorption aid held by the aforementioned hand into contact with the aforementioned voltage application unit. (Version 8) The electrified system as described in Version 7, wherein after the control unit performs the process of bringing the aforementioned particle adsorption aid held by the aforementioned hand into contact with the aforementioned voltage application unit to electrify the aforementioned particle adsorption aid, it performs the process of moving the aforementioned robot arm and adsorbing particles from at least one of the interior of the aforementioned substrate conveying device and the interior of the aforementioned substrate processing device by means of the aforementioned particle adsorption aid held by the aforementioned hand. (State 9) The charged system as described in State 8 has a particle detection unit that detects the degree of particle adsorption by the aforementioned particle adsorption aid during a series of movements of one of the aforementioned robotic arms. (Sample 10) The charged system as described in Sample 9, wherein the aforementioned particle detection unit includes at least one of a charge detection unit for detecting the charge of the aforementioned particle adsorption aid and an imaging unit for photographing the particles adsorbed on the aforementioned particle adsorption aid. (Sample 11) The charged system as described in Sample 9 or Sample 10, wherein the aforementioned particulate detection unit is disposed in the aforementioned charged device containment container. (State 12) The charged system described in any one of States 8 to 11 includes a cleaning device that cleans the aforementioned particulate adsorption aid. After the aforementioned control unit performs a process of adsorbing particulates by the aforementioned particulate adsorption aid, it performs a process of moving the aforementioned particulate adsorption aid to the aforementioned cleaning device by the aforementioned robotic arm. The aforementioned cleaning device performs a process of cleaning the moved aforementioned particulate adsorption aid. (State 13) The charged system described in any one of States 4 to States 12, wherein a plurality of the aforementioned particle adsorption aids are pre-contained in the aforementioned charged device receiving container, and the aforementioned control unit performs processing to adsorb particles from at least one of the interior of the aforementioned substrate conveying device and the interior of the aforementioned substrate processing device while sequentially replacing the aforementioned plurality of particle adsorption aids. (Sample 14) The electrified system described in any one of Samples 1 to 3, wherein the electrified device includes a voltage applying part that contacts the particle adsorption aid to apply a voltage to the particle adsorption aid, and a plurality of the particle adsorption aids are pre-contained in the electrified device housing container, and the voltage applying part applies a voltage to the plurality of particle adsorption aids simultaneously. (Sample 15) A method for controlling a charged system includes: electrifying a particle adsorption aid for adsorbing particles by means of an electrified device housed in an electrified device housing container, the electrified device housing container being disposed at a position of a front-opening wafer transfer box for arranging a substrate, and the electrified device housing container including an opening that opens into a substrate transfer device; and adsorbing particles by means of the aforementioned electrostatically charged particle adsorption aid. 1,11: Substrate; 10: Particle adsorption aid; 11a,11b: Surface; 12: Positive electrode; 13: Negative electrode; 14: Bias electrode; 15: Interface; 20: Charged device; 21: Housing; 21a: Hole; 22: Voltage application part; 22a: Probe; 23: Contact detection part; 24: Energy storage part; 25: Wireless power supply coil; 30: Charged device container; 30a: Support part; 31: Top surface; 32: Opening; 33: Internal space; 34: Housing; 35: Opening and closing part; 40: Charging part; 41: Wireless power supply coil; 50: Particle detection part; 51: Charge detection part; 52: Imaging part; 60: Cleaning device; 100: Charged system; 110: Front-opening wafer transfer box; 111: Housing; 111a: Opening; 112: Opening and closing part; 113: Interior. Space 120: Housing 121: Internal Space 122: Wall 123: Wall 123a: Opening 122a: Opening 130: Front-opening wafer transfer box opener 131: Opening and closing part 132: Front-opening wafer transfer box support part 140: Aligner 150: Robot 151: Hand 152: Robot arm 152a: Drive part 160: Control part 161: Main control part 162: Servo control part 163: Drive circuit part 164: Memory part 200: Substrate transport device 300: Substrate processing device 310: Housing 311: Internal Space 312: Wall 313: Substrate mounting part 500: Semiconductor manufacturing apparatus 630: Electrical device receiving container 631: Support part 632: Voltage application part Figure 1 is a diagram showing a semiconductor manufacturing apparatus according to a first embodiment. Figure 2 is a block diagram showing a charged system according to a first embodiment. Figure 3 is a diagram showing a particle adsorption aid according to a first embodiment. Figure 4 is a cross-sectional view along line 1000–1000 of Figure 3. Figure 5 is a diagram showing a charged device according to a first embodiment. Figure 6 is a diagram showing a charged device housed in a charged device housing container according to a first embodiment. Figure 7 is a cross-sectional view viewed from the side of the charged device housing container according to a first embodiment. Figure 8 shows a state in which the particle adsorption aid is held by hand. Figure 9 shows a charged device during charging. Figure 10 is a flowchart of a control method for a charged system according to a first embodiment. Figure 11 shows a state in which a robot arm is moved to bring the particle adsorption aid into contact with the voltage application part of the battery storage unit. Figure 12 shows a state in which particles are removed from the alignment device by the particle adsorption aid. Figure 13 shows a state in which the particle adsorption aid is cleaned by a cleaning device. Figure 14 is a diagram showing the live device housed in the live device housing container according to the second embodiment. Figure 15 is a flowchart of the control method of the live system according to the second embodiment. Figure 16 is a diagram showing the live device housed in the live device housing container according to a modified example. 10: Particulate adsorption aid 20: Live equipment 21: Shell 22: Voltage application section 23: Contact Detection Department 24: Battery Storage Department 25: Coil for wireless power supply 30: Container for containing live electrical equipment 30a: Support section 31: Top surface 32: Opening 33: Interior Space 34: Shell 50: Particulate Detection Department 51: Charge Detection Department 52: Filming Department

Claims

1. A charged system comprising: a particle adsorption aid that is charged with static electricity and adsorbs particles by means of the charged static electricity; a charged device that includes a voltage application portion and charges the particle adsorption aid with static electricity, the voltage application portion contacting the particle adsorption aid to apply a voltage to the particle adsorption aid; a charged device receiving container for receiving the charged device and disposed at a position for disposing of a front-opening wafer transfer box for receiving a substrate, and including an opening that opens into a substrate transfer device; a robotic arm; a hand attached to the robotic arm and holding the particle adsorption aid; and a control unit that performs the following processes: holding the particle adsorption aid by the hand of the robotic arm; and moving the robotic arm and bringing the particle adsorption aid held by the hand into contact with the voltage application portion to charge the particle adsorption aid.

2. The energized system as described in claim 1, wherein, The aforementioned charged device containment container has the same external shape as the aforementioned front-opening wafer transfer box, and the aforementioned charged device containment container can contain the aforementioned particulate adsorption aid.

3. The energized system as described in claim 1, wherein, The aforementioned charged device includes a power storage unit for storing electricity, and the aforementioned charged system has a charging unit disposed outside the aforementioned charged device housing container and charges the aforementioned power storage unit wirelessly.

4. The energized system as described in claim 1, wherein, The aforementioned charged device includes a contact detection unit that detects information about the aforementioned voltage application unit contacting the aforementioned particulate adsorption aid. Based on the information detected by the aforementioned contact detection unit about the aforementioned voltage application unit contacting the aforementioned particulate adsorption aid, the aforementioned charged device begins to apply voltage to the aforementioned particulate adsorption aid from the aforementioned voltage application unit.

5. The energized system as described in claim 1, wherein, The aforementioned voltage application unit is disposed downward inside the aforementioned charged device container. The aforementioned control unit performs a process to move the aforementioned robot arm and move the aforementioned particle adsorption aid held by the aforementioned hand upward so that it contacts the aforementioned voltage application unit to charge the aforementioned particle adsorption aid.

6. The energized system as described in claim 1, wherein, The aforementioned charged device containment container pre-contains the aforementioned particulate adsorption aid. After the aforementioned control unit performs the process of moving the aforementioned robot arm and holding the aforementioned particulate adsorption aid pre-contained in the aforementioned charged device containment container by the aforementioned hand, the aforementioned particulate adsorption aid held by the aforementioned hand is brought into contact with the aforementioned voltage application unit.

7. The energized system as described in claim 6, wherein, After the aforementioned control unit performs the process of bringing the aforementioned particle adsorption aid held by the aforementioned hand into contact with the aforementioned voltage application unit to electrify the aforementioned particle adsorption aid, it performs the process of moving the aforementioned robot arm and adsorbing particles from at least one of the interior of the aforementioned substrate conveying device and the interior of the substrate processing device by means of the aforementioned particle adsorption aid held by the aforementioned hand.

8. The charged system as described in claim 7, comprising a particle detection unit that detects the degree of particle adsorption by the aforementioned particle adsorption aid during a series of movements of one of the aforementioned robotic arms.

9. The energized system as described in claim 8, wherein, The aforementioned particle detection unit includes at least one of a charge detection unit for detecting the charge of the aforementioned particle adsorption aid and an imaging unit for photographing the particles adsorbed on the aforementioned particle adsorption aid.

10. The energized system as described in claim 8, wherein, The aforementioned particulate detection unit is disposed in the aforementioned charged device containment container.

11. The charged system as described in claim 7, comprising a cleaning device for cleaning the aforementioned particulate adsorption aid, wherein the aforementioned control unit performs a process of adsorbing particulates by the aforementioned particulate adsorption aid, and then performs a process of moving the aforementioned particulate adsorption aid to the aforementioned cleaning device by the aforementioned robotic arm, and the aforementioned cleaning device performs a process of cleaning the moved aforementioned particulate adsorption aid.

12. The energized system as described in claim 1, wherein, The aforementioned charged device containment container pre-contains a plurality of the aforementioned particulate adsorption aids, and the aforementioned control unit performs processing to adsorb particles from at least one of the interior of the aforementioned substrate conveying device and the interior of the substrate processing device while sequentially replacing the aforementioned plurality of particulate adsorption aids.

13. The energized system as described in claim 1, wherein, The aforementioned charged device containment container pre-contains a plurality of the aforementioned particulate adsorption aids, and the aforementioned voltage application unit simultaneously applies voltage to the aforementioned plurality of particulate adsorption aids.

14. A method for controlling a charged system, the charged system comprising: a particle adsorption aid; a charging device including a voltage application portion, the voltage application portion contacting the particle adsorption aid to apply a voltage to the particle adsorption aid; a charging device housing container; a robotic arm; a hand attached to the robotic arm and holding the particle adsorption aid; and a control unit, the method comprising: electrifying the particle adsorption aid for adsorbing particles by means of the charging device housed in the charging device housing container, the charging device housing container being disposed at a position of a front-opening wafer transfer box for placing a substrate, and the charging device housing container including an opening opening into a substrate transfer device; and adsorbing particles by means of the electrified particle adsorption aid; furthermore, the control unit performing the following processes: holding the particle adsorption aid by means of the hand of the robotic arm; and moving the robotic arm and bringing the particle adsorption aid held by the hand into contact with the voltage application portion to electrify the particle adsorption aid.

Images